Compact Reach Xtend
Contents
1. fractus Optimised Antennas for Wireless Devices Fractus Compact Reach Xtend Bluetooth Zigbee 802 11 b g n WLAN Chip Antenna Antenna Part Number FRO5 Si1 N 0 102 This product is protected by at least the following patents PAT US 7 148 850 US 7 202 822 and other domestic and international patents pending Any update on new patents linked to this product will appear in http www fractus com index php fractus patents All information contained within this document is property of Fractus and is subject to change without prior notice Information is provided as is and without warranties It is prohibited to copy or reproduce this information without prior approval Fractus is an ISO 9001 2008 certified company All our antennas are lead free and ROHS compliant BUREAU VERITAS Certification RoHS ISO 9001 LCOO0L 9SS EC da July 2015 Page 1 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices TABLE OF CONTENTS 1 ANTENNA DESCRIPTION 2 QUICK REFERENCE GUIDE 3 ELECTRICAL PERFORMANCE 3 1 FRACTUS EVALUATION BOARD 3 2 VSWR AND EFFICIENCY 3 3 RADIATION PATTERNS at 2 45 GHz GAIN AND EFFICIENCY 3 4 CAPABILITIES AND MEASUREMENT SYSTEMS 4 MECHANICAL CHARACTERISTICS 4 1 DIMENSIONS TOLERANCES AND RoHS 4 2 COLOUR RANGE FOR THE INK 4 3 ANTENNA FOOTPRINT AS USED IN THE EVALUATION BOARD 5 MATCHING NETWORK 6 ASSEMBLY PROCESS 72. PACKAGING User Manual 3 3 4 4 4 5 6 7 7 7 8 8 9 July 2015 Page 2 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices 1 ANTENNA DESCRIPTION q Fractus Compact Reach Xtend chip antenna is engineered specifically for Bluetooth WLAN 802 11 b g n and other wireless devices operating at the ISM 2 4 GHz band Compact Reach Xtend combines small form factor size and high performance to improve the functionality of your wireless devices The Compact Reach Xtend is a low cost antenna solution that combines small form factor and high performance with integration flexibility making it ideal for small consumer electronics devices such as wireless headsets and USB dongles 7 0 mm TOP BOTTOM APPLICATIONS BENEFITS e Headsets Headphones e High efficiency and gain e Medical devices e Cost effective e Modules WiFi Bluetooth Zigbee e Small footprint e USB Dongles e Easy to use pick and place e Sensors bike speed telemetry e Military e Digital cameras 2 QUICK REFERENCE GUIDE Please contact info fractus com if you require additional information on antenna integration or optimisation on your PCB Sia en Tel 34 935442690 Fax 34 935442691 Table 1 Technical Features Measures from the evaluation board 47 0 mm x 23 0 mm x 1 0 mm PCB See picture in page 5 July 2015 Page 3 1999 2015 FRACTUS S A fractus Optimised A
3. tape thickness 0 10mm max ETAPE WIDTH W 16003 Wmax 163 m m Ee a seo rss F 75 wo zs k 28 st ateor p soro o gt 1552005 Po 40 01 Embossed Carrier Component Cavity wod EMAX 330 1 13 0 mm 20 7 mm 0 5127 40 008 A Reel Capacity 2500 pcs lt c Figure 8 Reel Dimensions and Capacity FULL RADIUS July 2015 Page 11 1999 2015 FRACTUS S A
4. able colour range Blue INK White INK ij July 2015 Page 7 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices 4 3 ANTENNA FOOTPRINT as used in the evaluation board This antenna footprint applies for the reference evaluation board described in page 4 of this User Manual Feeding line dimensions over the clearance zone described in figure 3 applies for a 1 mm thickness FR4 PCB Ah T DES NR EZ Zone occupied by the antenna WA Soldering pads and feed point Clearance PCB area without ground plane Tolerance 0 2 mm Figure 3 Antenna Footprint Details Other PCB form factors and configurations may require a different feeding configuration feeding line dimensions and clearance areas If you require support for the integration of the antenna in your design please contact info fractus com 5 MATCHING NETWORK The specs of a Fractus standard antenna are measured in their evaluation board which is an ideal case In a real design components nearby the antenna LCD s batteries covers connectors etc affect the antenna performance This is the reason why it is highly recommended to place 0402 pads for a PI matching network as close as possible to the antenna feeding point Do it in the ground plane area not in the clearance area This is a degree of freedom to tune the antenna once the design is finished and taking into account all elements of the system batteries displays c
5. ing and manufacturing optimised antennas for wireless applications and providing our clients with RF expertise We offer turn key antenna products and antenna integration support to minimise your time requirement and maximize your return on investment during your product development efforts We also provide our clients with the opportunity to leverage our in house testing and measurement facilities to obtain accurate results quickly and efficiently VSWR RAAKA TTT S Parameters cous Agilent E5071B A in y Radiation Pattern amp Efficiency SATIMO STARGATE 32 Anechoic and semi anechoic chambers and full equipped in house lab July 2015 Page 6 1999 2015 FRACTUS S A fractus User Manual Optimised Antennas for Wireless Devices 4 MECHANICAL CHARACTERISTICS 4 1 DIMENSIONS TOLERANCES AND RoHS TOP BOTTOM Figure 2 Antenna Dimensions and Tolerances The white square located on the top side of the antenna indicates the feed pad 7oso2 E isor 3002 F 22201 20202 6 a002 waso ooo Fractus Compact Reach Xtend chip antenna is compliant with the restriction of the use of hazardous substances ROHS The RoHS certificate can be downloaded from http www fractus com index php fractus documentation 4 2 COLOUR RANGE FOR THE INK The next figure shows the range of the colours in the antenna Accept
6. ntennas for Wireless Devices 3 ELECTRICAL PERFORMANCE 3 1 FRACTUS EVALUATION BOARD The Fractus configuration used in testing the Compact Reach Xtend chip antenna is displayed in Figure 1 A Compact Reach Xtend Antenna Tolerance 0 2 mm Material The evaluation board is built SMA on FR4 substrate Thickness is 1 0 mm Antenna Clearance Figure 1 Compact Reach Xtend Evaluation Board See picture in page 5 3 2 VSWR AND EFFICIENCY 6 0 100 VSWR 5 5 E 90 Total efficiency 5 0 4 80 4 5 70 ss 4 0 60 Ss 3 5 50 z D D 3 0 40 2 5 30 2 0 20 1 5 10 1 0 0 2 0 2 1 2 2 2 3 2 4 2 5 2 6 2 7 2 8 2 9 3 0 Frequency GHz Graph 1 VSWR Voltage Standing Wave Ratio and Efficiency vs Frequency GHz July 2015 Page 4 1999 2015 FRACTUS S A fractus IRAV ERIE Optimised Antennas for Wireless Devices 3 3 RADIATION PATTERNS at 2 45 GHz GAIN AND EFFICIENCY Gain dB Theta 90 cut 0 Gain dB Phi 0 cut E 0 Table 2 Antenna Gain and Efficiency within the 2 4 2 5 GHz band Measures made in the evaluation board and in the Satimo STARGATE 32 anechoic chamber July 2015 Page 5 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices 3 4 CAPABILITIES AND MEASUREMENT SYSTEMS Fractus specialises in design
7. overs etc July 2015 Page 8 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices 6 ASSEMBLY PROCESS Figure 4 shows the back and front view of the Compact Reach Xtend chip antenna which indicates the location of the feeding point and the mounting pad Mounting Pad 2 solder the antenna mounting pad to the soldering pad on the PCB This pad must NOT be grounded Feed Pad 1 the white square on the top of the antenna indicates the position of the feed pad in the bottom Align the feed point with the feeding line on the PCB See Figure 1 Figure 4 Pads of the Compact Reach Xtend Chip Antenna As a surface mount device SMD this antenna is compatible with industry standard soldering processes The basic assembly procedure for this antenna is as follows 1 Apply a solder paste on the pads of the PCB Place the antenna on the board Perform a reflow process according to the temperature profile detailed in table 3 figure 6 of page 10 3 After soldering the antenna to the circuit board perform a cleaning process to remove any residual flux Fractus recommends conducting a visual inspection after the cleaning process to verify that all reflux has been removed The drawing below shows the soldering details obtained after a correct assembly process Antenna Antenna Solder Paste 0 1 mm Figure 5 Soldering Details NOTE Solder paste thickness after the assembl
8. y process will depend on the thickness of the soldering stencil mask A stencil thickness equal or larger than 127 microns 5 mils is required July 2015 Page 9 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices Fractus Compact Reach Xtend chip antenna can be assembled following the Pb free assembly process According to the Standard IPC JEDEC J STD 020C the temperature profile suggested is as follows Avg Ramp up Rate TSmax to Tp 3 C second max Temperature Min TSmin 150 C Temperature Max TSmax 200 C Time tsmin to tsmax 60 180 seconds REFLOW Temperature TL 217 C PEAK Temperature Tp 260 C Rate 6 C second max Time from 25 C to Peak Temperature Table 3 Recommended soldering temperatures Next graphic shows temperature profile grey zone for the antenna assembly process in reflow ovens tp gt ie Tp eR Se Critical Zone T to Tp Temperature gt Preheat 25 lt t 25 C to Peak Time gt Figure 6 Temperature profile July 2015 Page 10 1999 2015 FRACTUS S A fractus Optimised Antennas for Wireless Devices 7 PACKAGING The Compact Reach Xtend chip antenna is delivered in tape and reel packaging 10 PITCHES CUMULATIVE TOLERANCE ON TAPE 40 7 fmm P EMBOSSMENT CENTER LINES OF CAVITY Figure 7 Tape dimensions amp real image including antennas Top cover
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