Kodak KAI-2093
Contents
1. idiei 4 Clock Capacitan nera 5 Operation IC ann ana na desa aaa na aa a a a aa ia 6 Progressive and Interlaced Timing seed a aan ega A aa 16 Single OutpuEMode 5 ren ete Men NEETA OEE NN anna 16 Dua VOUT Sid ere ase E aa aa e o Ona Bea KO eine 16 Exposure Controla EE 7 Dark References ete Su an Sere est in um an ita vr ater 7 Connections to the Image Sensor an D a aE det iii 17 Leclerc 18 Reguirements and Character Stes oo a 8 Bea RS GER RD RO DR Gee eee ec A 9 Frame Timing Progressive SEA a ii an ann ga ete te be aan se A AR ARA td 9 Vertical Clock Edge AlGOMENE ss usang usus asah 20 Frame Timing Field Integration Mode cion asus ena ana a e aea 21 Frame Timing Frame Integration Mode ooooooocooo oWooWo Woo WWW WWW Wo Woman 22 ER a RR a eee er ee ee Ra 23 Electronic Shutter Ag E E E E 24 Storage and HANGUAG E ena ae N a E EN E E E E E AEE 25 140 E ET 25 o h A an aan amat e a al 25 OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p2 Cover Glass Care and Cleanliness lata ad dd dd dd 25 Environmental Exposure 25 Soldering Recommendations ooooocoooo oo oo o0oWoWo 0 Wo Wo Wen 25 Mechanical Drawings p 26 Completed Assembly nn turo a urhe aee NE etel en BN Nae Na adha 26 Cover LAS Si aa A Na ee SN 28 Clear Cove M 28 QuartziCoveriblass with AR CoalingS sz kana a a i 29 Glass2. o n E o S oo N 4 empty pixels Video L 1920 x 1080 imaging pixels 2 buffer rows 4 light shielded rows 2 buffer rows 4 buffer columns 28 light shielded columns 4 empty pixels Video R dO TS 4 28 4 Single Output 1920 4 28 o 4 28 4 960 960 4 28 4 Dual Output O nrrrfccckd _ _ _ gt Figure 1 Sensor Architecture There are 4 light shielded rows followed by 1084 photoactive rows and finally 4 more light shielded rows The first and last 2 photoactive rows are buffer rows giving a total of 1080 lines of image data In the single output mode all pixels are clocked out of the Video L output in the lower left corner of the sensor The first four empty pixels of each line do not receive charge from the vertical shift register The next 28 pixels receive charge from the left light shielded edge followed by 1928 photoactive pixels and finally 28 more light shielded pixels from the right edge of the sensor The first and last 4 photoactive pixels are buffer pixels giving a total of 1920 pixels of image data Eastman Kodak Company 2007 www kodak com go imagers n the dual output mode the clocking of the right half of the horizontal CCD is reversed The left half of the image is clocked out Video L and the right half of the image is clocked out Video R Each row consists of 4 empty pixels followed by 28 light shielded pixels followed by 964 photoactive pixels When reconstructing
3. alternative is to have two extra clock drivers for pH1BR and H2BR and invert the signals in the timing logic generator If two extra clock drivers are used care must be taken to ensure the rising and falling edges of the 4H1BR and 4H2BR clocks occur at the same time within 3 ns as the other HCCD clocks Revision 3 0 MTD PS 0307 p16 Exposure Control If the sensor is operated at 20 MHz horizontal CCD frequency then the frame rate will be 9 fps and the integration time will be 1 9 s or 111 ms To achieve shorter integration times the electronic shutter option may be used by applying a pulse to the substrate pins 22 and 27 The time between the falling edge of the substrate pulse and the falling edge of the transition of the V2 clock from V2H to V2M is defined as the integration time The substrate pulse and integration time are shown in Figure 14 Integration times longer than one frame time 111 ms in this example do not reguire use of the electronic shutter Without the electronic shutter the integration time is defined as the time between when the 4V2 clock is at the 4V2H level of 9 5 V when the 4V2 clock is at the oV2H level charge collected in the photodiodes is transferred to the vertical shift register To extend the integration time increase the time between each oV2H level of the V2 clock While the photodiodes are integrating photoelectrons the vertical and horizontal shift registers should be continuously clocked
4. 51 0 25 LA ZZ AO I UU UU 4X R0 020 MAX RO 51 EPOXY SESS AG A Z1 D 0 424 0 010 10 77 0 25 0 510 0 003 12 95 0 08 0 030 0 002 0 76 0 05 J Figure 18 Quartz Cover Glass with AR Coating Drawing Notes 1 Cover Glass Material SK1300 or equivalent 2 Dust Scratch 10 microns maximum 3 MAR Coat Each Side 340nm 360nm Reflectance lt 0 5 520nm 550nm Reflectance lt 4 Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p29 GLASS TRANSMISSION 100 Transmission al o 40 30 20 10 0 200 300 400 500 600 700 Wavelength nm Clear Glass Quartz Glass with AR Coatings Figure 19 Cover Glass Transmission Eastman Kodak Company 2007 www kodak com go imagers 800 900 Revision 3 0 MTD PS 0307 p30 QUALITY ASSURANCE AND RELIABILITY QUALITY STRATEGY All image sensors will conform to the specifications stated in this document This will be accomplished through a combination of statistical process control and inspection at key points of the production process Typical specification limits are not guaranteed but provided as a design target For further information refer to ISS Application Note MTD PS 0292 Quality and Reliability REPLACEMENT All devices are warranted against failure in accordance with the terms of Terms of Sale This does not include failure due to mec
5. AR Coating 2 sides Parameters above are specified at T www kodak com go imagers 40 C unless otherwise noted Revision 3 0 MTD PS 0307 p4 ORDERING INFORMATION Catalog Number Product Name Description Marking Code T a bs onochrome No Microlens CERDIP Package sidebrazed Bi Pa E Taped Clear Cover Glass no coatings Engineering Sample KAI 2093 i UB onochrome No Microlens CERDIP Package sidebrazed Serial Number HABET IE AAA Taped Clear Cover Glass no coatings Standard Grade 24728 KAI 2093 ABA CB AE onochrome Telecentric Microlens CERDIP Package sidebrazed Clear Cover Glass no coa ings Engineering Sample onochrome Telecentric Microlens CERDIP Package sidebrazed 40174 KAH ban Clear Cover Glass no coatings Grade 1 2H4725 KAI 2093 ABA CB B2 onochrome Telecentric Microlens CERDIP Package sidebrazed Clear Cover Glass no coatings Grade 2 Y onochrome Telecentric Microlens CERDIP Package sidebrazed KAI 2093M 2714723 Ba Ae RE AE Quartz Cover Glass with AR coating both sides Engineering Sample Serial Number 7 onochrome Telecentric Microlens CERDIP Package Isidebrazed ia SA AA Quartz Cover Glass with AR coating both sides Standard Grade 244618 KAI 2093 ABA CP AE onochrome Telecentric Microlens CERDIP Package sidebrazed Taped Clear Cover Glass no coa
6. Transmission o is ia ola AA 30 Quality Assurance and Reliability o ooococoooooWo oom 31 Qa by SUA CO GY A 31 Re pla comidos 3 Hiabilitysot the SUPP roo telas 3 El 3 FRG Wel DILLY aaa A AE AA LAA aan na Na EN a AT A 31 Test Data R tt A 31 Mechanical san en ng ana em na aa UR a a a 31 Warning Life S pport Applications Policy san Speen dd ee D eO Hle ett aa as ka 31 Revision Change Sta A Aa NE RN NN anna 32 TABLE OF FIGURES Figure 1 Sensor FENGU ie aa aa 6 Figure 2 Package Pin Designations Top View nene nene erre rer er erre ene eene 7 Figure 4 Quantum Efficiency Spectrum for Monochrome Sensors eene 10 Figure 5 Angular Dependence of Quantum Efficiency ooooooooWoooWoWooWo Wo oom Wo Wo W malas 10 Figure 6 Quantum Efficiency Spectrum for Color Filter Array Sensors eene 11 Figure Color Filter Array Pattern a as DO EE ERN er YR aa 1 Figure 3 Progressive Frame Rate vs HCCD Clock Freguency ooooooWo oo Woo enne nere nr 2 Figures Defect Zames ee one bt o BERE O 13 Figure 9 Progressive Frame MAIN ge Aa a A a a a aa 19 Figure 10 Ideal Vertical Clock Edge POoSIOTI aceti a a e o ai 20 Figure 11 Interlaced Frame Timing Field Integration Mode arnar 21 Figure 12 Interlaced Frame Timing Frame Integration Mode o oooooooo Wo eee nennen 22 Figure Salime Ag aa an aa UR en 23 Figure 14 Electronic Shutter Tim
7. to GND 0 4 V Voltage QV1 to V2 20 20 V between pins 4H1 to 9H2 15 5 V oR to GND 15 5 V oH1 6H2 to OG 15 5 V H1 HH2 to V1 4V2 15 5 V Current Video Output Bias Current 0 0 mA 2 Notes 1 For electronic shuttering VSUB may be pulsed to 50 V for up to 10 us 2 Total for both outputs Current is 5 mA for each output Note that the current bias effects the ampli DC BIAS OPERATING CONDITIONS ier bandwidth Symbol Description Min Nom Max Unit Notes OG Output Gate 3 0 72 5 2 0 V VRD Reset Drain 10 0 10 5 11 0 V VSS Output Amplifier Return 0 0 0 7 1 0 V VDD Output Amplifier Supply 14 5 15 0 15 5 V GND Ground P well 0 0 V VSUB Substrate 8 0 TBD 17 0 V VESD ESD Protection 8 0 7 0 6 0 V 1 Notes 1 VESD must be at least 1 V more negative than 4H1L and H2L during sensor operation AND during camera power turn on AC OPERATING CONDITIONS Symbol Description 9 V2H Vertical CCD Clock High QV1M dV2M Vertical CCD Clocks Midlevel VIL dV2L Vertical CCD Clocks Low 4H1H 6H2H Horizontal CCD Clocks High 4H1L 4H2L Horizontal CCD Clocks Low QR Reset Clock Amplitude RL Reset Clock Low VShutter Electronic Shutter Voltage Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p14 CLOCK CAPACITANCE 1 o GN 1 Gate capacitance to GND is voltage dependent Value is for nominal VCCD clock volt
8. to prevent the collection of dark current in the vertical shift register This is most easily done by increasing the number of lines read out of the image sensor For example to double the integration time read out 2184 lines instead of 1092 lines but remember only the first 1092 lines will contain image data Depending on the image quality desired and temperature of the sensor integration times longer than one second may require the sensor to be cooled to control dark current The output amplifiers will also generate a non uniform dark current pattern near the bottom corners of the sensor This can be reduced at long integration times by only turning on VDD to each amplifier during image readout If the vertical and horizontal shift registers are also stopped during integration time the dark current in the shift registers should be flushed out completely before transferring charge from the photodiodes to the vertical shift register Eastman Kodak Company 2007 www kodak com go imagers Dark References There are 28 light shielded columns at the Left and right side of the image sensor The first and last two light shielded columns should not be used as a dark reference due to some light leakage under the edges of the light shielding Only the center 24 columns should be used for dark reference line clamping There are 4 light shielded rows at the top and bottom of the image sensor Only the center two light shielded rows should be
9. 1SL H1BL H SR H2BR and the H2 timing should be applied to H2SL H2BL H2SR HIBR In other words the clock driver generating the H1 timing should be connected to pins 4 3 13 and 15 The clock driver generating the H2 timing should be connected to pins 2 5 12 and 14 The horizontal CCD should be clocked for 4 empty pixels plus 28 light shielded pixels plus 1928 photoactive pixels plus 28 light shielded pixels for a total of 1988 pixels Eastman Kodak Company 2007 www kodak com go imagers Dual Output Mode In dual output mode the connections to the 4H1BR and 4H2BR pins are swapped from the single output mode to change the direction of charge transfer of the right side horizontal shift register In dual output mode both VDDL and VDDR pins 25 24 should be connected to 15 V The H1 timing from the timing diagrams should be applied to H1SL H1BL H1SR H1BR and the 6H2 timing should be applied to H2SL H2BL H2SR 6H2BR The clock driver generating the H1 timing should be connected to pins 4 3 13 and 14 The clock driver generating the H2 timing should be connected to pins 2 5 12 and 15 The horizontal CCD should be clocked for 4 empty pixels plus 28 light shielded pixels plus 964 photoactive pixels for a total of 996 pixels If the camera is to have the option of dual or single output mode the clock driver signals sent to H1BR and 6H2BR may be swapped by using a relay Another
10. 5V HCCD clocking e Single or dual video output operation e 28 light shielded reference columns per output e Only 2 vertical CCD clocks and 2 horizontal CCD clocks e Electronic shutter e Low Dark Current e Antiblooming protection APPLICATIONS e Industrial Imaging e Scientific Imaging Eastman Kodak Company 2007 Parameter Typical Value Architecture Interline CCD Progressive Scan or Interlaced Readout Total Number of Pixels 984 H x 1092 V Number of Effective Pixels 928 H x 1084 V Number of Active Pixels 920 H x 1080 V Pixel Size 7 4 um H x 7 4 pm V Active Image Size 4 208 mm H x 7 992 mm IV 6 3 mm diagonal Aspect Ratio 6 9 Number of Outputs or 2 Saturation Signal 40 000 electrons Output Sensitivity 4 uV electron Quantum Efficiency KAI 2093 ABA 490 nm 40 Quantum Efficiency KAI 2093 CBA R 620 nm 6 540nm B 460nm 7 34 30 Total Noise 3 40 electrons rms lt 6 1 Dark Current Typical 0 5 nA cm Dynamic Range 0 dB Blooming Suppression 00 X Smear lt 0 03 mage Lag lt 10 electrons Frame Rate Single Output 20 MHz 9 fps Single Output 35 MHz 15 fps Dual Outputs 20 MHz 17 fps Dual Outputs 37 MHz 30 fps Maximum Data Rate 40 MHz Channel 2 channels Package 32 pin cerDIP Cover Glass Clear Glass or Quartz Glass with
11. DEVICE PERFORMANCE SPECIFICATION Revision 3 0 MTD PS 0307 March 19 2007 INNOVATIONS IN SIGHT KODAK KAI 2093 IMAGE SENSOR 1920 H X 1080 V INTERLINE CCD IMAGE SENSOR Kodak Image Sensor Solutions TABLE OF CONTENTS Summary PEC CO ii a aaa ka A a aan 4 Bae Ra a DE a eee ee 4 FEU a an kemanan emban ea ta naa RA Na 4 Ap PN CAT o pj JRR RR at RR Kala cl ah a a dd 4 Ordering Information a a A aa id 5 Device Descrip ioi A ai ia O a Lana E at E AA dto pd a sas 6 ATOM OL T ERUDITUM 6 Pin Description and Physical Orientation a aan 7 Imaging Periormante M 8 TypicaltOperational ConditloRis s nte br e NN ee prete eg eit Pep ate etat tie petala des 8 Optical II Te c 8 S ARES A a c MEDIUM 8 Output Ampu pece TO ea AD DI ee ee E O 9 Generals pecificationisA ee o asa ad 9 I7 arius i e MP 10 Monochrome Quant Et Glen Cy tas 10 Monochrome with Microlens Angular Quantum Efficiency Woo mna 10 Color with Lenslet Quantum Efficiency oooooooWoo Wo Wo Wo ern inn nnn naa er enne erre rn nennen 1 Frame Rate ia ja A a DR A A ER UR A BER ee an 2 A PA rt EL d 13 Operational COM NS i ce ca erat R dui d t ede e de E et s 13 ST AOA 13 BT lm UTEM 3 Defect Classes ss EU 3 UD STAM EE 14 Absolute Max MUnnRat NG Ss ads a gl O al eo 14 DC Bias a II aaa AS 14 P980 DDR IU E
12. SS 1 300 013 32 33 02 33 Pj d FI Y Ya rl TE ql TE Dl ea 3954015 10 03 38 j A 790 010 20 07 25 EN BY A 650 015 16 51 38 SHOWN WITH SEALED COVER GLASS 048 010 Top of imager to top of glass 1 22 25 076 010 Top of imager to bottom of package 1 93 25 Figure 16 Completed Assembly 2 of 2 Notes 1 Center of image is nominally coincident with the center of the package 2 Die is aligned within 2 degree of any package cavity edge Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p27 COVER GLASS Clear Cover Glass 0 899 0 003 22 83 0 08 0 768 0 010 19 5140 25 IL E E A Y e A 3 7 7 4 H AS 4 LA ZU TK m 10 77 0 25 0 510 0 003 12 95 0 08 4X R0 020 MAX RO 51 4X C 0 020 TYP C 0 51 EPOXY Jt 8X C 0 008 TYP C 0 20 Figure 17 Clear Cover Glass Drawing Notes 1 Cover Glass Material Schott D263 or equivalent 2 Dust Scratch 5 microns maximum Eastman Kodak Company 2007 www kodak com go imagers 0 030 0 002 0 76 0 05 Revision 3 0 MTD PS 0307 p28 Quartz Cover Glass with AR Coatings 0 899 0 003 2X 0 010 0 25 TYP 4X C 0 020 TYP C 0 51 Z 8X C 0 008 TYP C 0 20 22 83 0 08 0 768 0 010 19
13. ages 2 For nominal HCCD clock voltages total capacitance for one half H1SR only or H1SL only OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p15 OPERATION NOTES Progressive and Interlaced Timing Progressive and interlaced output modes are achieved by the applying the proper waveforms to the vertical clock input pins oV1 QV2E and V20 For progressive output 4V2 QV2E 4V20 with each of the 1092 lines read out individually using the timing in Figure 9 For interlaced output there are two modes field integration mode and frame integration mode In both modes 1092 2 546 lines are read in each frame readout with one even frame readout and one odd frame readout necessary for a complete frame Field integration mode bins together alternate lines and the timing is shown in Figure 11 As with progressive readout oV2 9V2E 4V20 Frame integration mode reads out the photodiodes of the even and odd lines separately and the timing is shown in Figure 12 In this case 9V2E and 4V20 are clocked individually Single Output Mode When operating the sensor in single output mode all pixels of the image sensor will be shifted out the Video L output pin 31 To conserve power and lower heat generation the output amplifier for Video R may be turned off by connecting VDDR pin 24 and VOUTR Ipin 18 to GND zero volts The H1 timing from the timing diagrams should be applied to H
14. and will not turn off until all voltages are powered down Operating the sensor with the ESD protection circuit active may damage the sensor Revision 3 0 MTD PS 0307 p17 TIMING REQUIREMENTS AND CHARACTERISTICS OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p18 FRAME TIMING Frame Timing Progressive Scan Progressive Frame Timing mp do o dl T Tus T V2 4V2E 4V20 Ts Line 1091 Line 1092 4H1 Frame Timing for Vertical Binning by 2 T Tara lt T V2 4V2E 4V20 Tap Tao Line 545 Line 546 Line 1 4H1 Figure 9 Progressive Frame Timing OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p19 Vertical Clock Edge Alignment KAI 2093 Vertical Clock Timing Edge Position LU uU M See Detail B V2 V1 This falling edge of V2 should be the same as the rising edge of V1 or slightly after it V2 This rising edge of V2 should be the same as the falling edge of V1 or slightly before it E Detail B 4 This rising edge of V2 should be the same as the falling edge of V1 or slightly before it Figure 10 Ideal Vertical Clock Edge Position OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p20 Frame Timing Field Integration Mode Interlaced Frame Timing Field Integration Mode Even Fiel
15. d Readout T Me LO HL o3 MLM Tyard T Interlaced Frame Timing Field Integration Mode Odd Field Readout V1 T 6V2 vs Tyara T Figure 11 Interlaced Frame Timing Field Integration Mode OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p21 Frame Timing Frame Integration Mode Interlaced Frame Timing Frame Integration Mode Even Field Readout a 6V2E Lp Ls V20 Tura gt T Interlaced Frame Timing Frame Integration Mode Odd Field Readout Tap Tan V20 F pa Tos T gt Figure 12 Interlaced Frame Timing Frame Integration Mode Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p22 LINE TIMING Progressive Line Timing Pixel Count e e o Single Output XXXI E LLL T EX Dual Output XXX BI TL 1L 13 IIT LIT Pixel Count e e o Interlaced Line Timing and Line Timing for Vertical Binning by Two E TA Single Output XDD fo Pixel Count SAN TOS Dual Output XIII A 1 CY c0 t So C co t ouo Pixel Count LUCI e ES ARE Figure 13 Line Timing Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p23 ELECTRONIC SHUTTER TIMING Electronic Shutter Line Timing Vshutter VSUB HI H2 Integration Time Definition v2 ELEM Time V
16. furlessthan Ieoconde durat Br 3 Improper cleaning of the cover glass may damage these devices Refer to Application Note MTD PS 0237 Cover Glass Cleaning for Image Sensors OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p25 MECHANICAL DRAWINGS COMPLETED ASSEMBLY 7902010 SHOWN WITH SEALED COVER GLASS 20 07 25 Package Ref Dimensions 200 005 100 008 5 08 13 2 54 20 a 13004013 33 02 33 et 17 q At Standoff 050 a O 2E 2 1 27 8 q amp apog O 2 3 3 5 E 59 Bupe See note 1 Y i 1 1 1 16 16 626 15 91 339 JJ Die Ref Dimensions 8 61 010 305 008 a 1 100 25 Typ 10 03 20 27 94 1851010 q tea 1004008 4 70 25 2 54 20 050 025 1241014 64 ERA 3 15 36 a 090 009 2 29 23 EN TT PTI a 425 Ref 018Typ 3 17 46 Typical Hole Details 045 005 1 142 13 qeu pa OUS 222228 2 54 025 005 63 13 D 100 902 065 00 18 007 pe 1 65 05 4 05 2548 Figure 15 Completed Assembly 1 of 2 Notes 1 See Ordering Information for marking code 2 Cover glass is manually placed and visually aligned over die location accuracy is not guaranteed Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p26 SHOWN WITHOUT COVER GLA
17. ge intentionally left blank OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p35 Eastman Kodak Company 2007 Kodak and Pixelux are trademarks
18. hanical and electrical causes defined as the liability of the customer below LIABILITY OF THE SUPPLIER A reject is defined as an image sensor that does not meet all of the specifications in this document upon receipt by the customer LIABILITY OF THE CUSTOMER Damage from mechanical scratches or breakage electrostatic discharge ESD damage or other electrical misuse of the device beyond the stated absolute maximum ratings which occurred after receipt of the sensor by the customer shall be the responsibility of the customer RELIABILITY Information concerning the quality assurance and reliability testing procedures and results are available from the Image Sensor Solutions and can be supplied upon request For further information refer to ISS Application Note MTD PS 0292 Quality and Reliability TEST DATA RETENTION Image sensors shall have an identifying number traceable to a test data file Test data shall be kept for a period of 2 years after date of delivery MECHANICAL The device assembly drawing is provided as a reference The device will conform to the published package tolerances Kodak reserves the right to change any information contained herein without notice All information furnished by Kodak is believed to be accurate WARNING LIFE SUPPORT APPLICATIONS POLICY Kodak image sensors are not authorized for and should not be used within Life Support Systems without the specific written consent of the Eas
19. inearity 3 4 aximum Gain Difference Between Outputs 3 4 ANL aximum Signal Error caused by Nonlinearity 34 Differences Notes 1 For monochrome sensors 2 Value is the angular range of incident light for which the quantum efficiency is at least 50 of QE max at a wavelength of AQE Angles are measured with respect to the sensor surface normal in a plane parallel to the horizontal axis 0QE4 or in a plane parallel to the vertical axis 0QE M 3 Value is over the range of 10 to 90 of photodiode saturation 4 Value is for the sensor operated without binning CCD SPECIFICATIONS Description Min Vertical CCD Charge Capacity 45 Horizontal CCD Charge Capacity Photodiode Charge Capacity 35 Id Dark Current Image Lag Antiblooming factor 100 Vertical Smear Notes This value depends on the substrate voltage setting Higher photodiode saturation charge capacities will lower the antiblooming specification Substrate voltage will be specified with each part for nominal photodiode charge capacity This is the first field decay lag at 70 saturation Measured by strobe illumination of the device at 70 of photodiode saturation and then measuring the subseguent frame s average pixel output in the dark Measured with a spot size of 100 vertical pixels Measured with F 4 imaging optics and continuous green illumination centered at 550 nm A blooming condition is defined as when the spot size doubles in size Antibloom
20. ing Diagram nn kn ede rete recle an mn Bm aa 24 Figure 15 Completed Assembly 1 of 2 a aaa 26 Figure 16 Completed Assembly 2 02 pautas steve sunga nois sa ata anne ana Nan maan 27 Figure 1 Cl ear Cover Glass Drawn ars e E eee OG nee eet es 28 Figure 18 Quartz Cover Glass with AR Coating Draw ng san ana nd an tetas eo ice reb tub Eee cote 29 Figure 12 Cover Glass ras MISSI ea ad a NA HN NE ANA 30 OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p3 SUMMARY SPECIFICATION KODAK KAI 2093 IMAGE SENSOR 1920 H X 1080 V PROGRESSIVE SCAN INTERLINE CCD IMAGE SENSOR DESCRIPTION The KODAK KAI 2093 Image Sensor is a high performance multi megapixel image sensor designed for a wide range of medical imaging and machine vision applications The 7 4 ym sguare pixels with microlenses provide high sensitivity and the large full well capacity results in high dynamic range The split horizontal register offers a choice of single or dual output allowing either 15 or 30 frame per second fps The architecture allows for either progressive scan or interlaced readout The imager features 5V clocking to facilitate camera design The vertical overflow drain structure provides antiblooming protection and enables electronic shuttering for precise exposure control FEATURES e Progressive scan non interlaced e HCCD and output amplifier capable of 40 MHz operation e
21. ing factor is the light intensity which causes blooming divided by the light intensity which first saturates the photodiodes ID o O1 P Ww OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p8 Eastman Kodak Company 2007 OUTPUT AMPLIFIER SPECIFICATIONS Unit Pa Power Dissipation 120 mw MHz pF Ne Notes 1 Fora 5 MA output load on each amplifier Per amplifier 2 With total output load capacitance of C 10 pF between the outputs and AC ground GENERAL SPECIFICATIONS DynamicRange 6 dB Notes 1 Includes system electronics noise dark pattern noise and dark current shot noise at 20 MHz 2 Uses 20LOGIPNe n www kodak com go imagers Revision 3 0 MTD PS 0307 p9 TYPICAL PERFORMANCE CURVES MONOCHROME QUANTUM EFFICIENCY SG EN E ids FAST mae o MEC LION ISS Ea Cover Glass without mE AA AAA PP AA a E 300 400 500 600 700 800 900 1000 Wavelength nm Figure 3 Quantum Efficiency Spectrum for Monochrome Sensors MONOCHROME WITH MICROLENS ANGULAR QUANTUM EFFICIENCY 100 90 80 Relative 70 60 Quantum NI Efficieney aa Horizontal o w end RATES cs 20 10 Angle degrees Figure 4 Angular Dependence of Quantum Efficiency For the curve marked Horizontal the incident light angle is varied in a plane parallel to the HCCD For the curve marked Vertical the incident light angle is va
22. oup of 2 to 10 contiguous major defective pixels with a width no wider than 2 defective pixels Column Defect A group of more than 10 contiguous major defective pixels along a single column No 1 There will be at least two non defective pixels separating any two major defective pixels 2 Buffer and dark reference pixels are not used for defect tests es DEFECT ZONES 2 buffer rows 380 rows Zone A 640 x 380 4 buffer columns 640 columns 640 columns 4 buffer columns 2 E 2 3 a 380 rows 3 E gt E 2 buffer rows E o 1 Pane VideoL Video R 4 28 4 1920 4 28 Single Output an ooo OF 4 28 4 960 960 4 28 4 Dual Output Ao gt Figure 8 Defect Zones DEFECT CLASSES KAI 2093 ABA CB B1 Maximum Number of Defects Major Point Minor Point Cluster Column With Zone A Zone A Zone A Zone A Zone A Zone A Zone A Zone A in Outside Within Outside Within Outside Within Outside 3 10 20 100 0 4 0 0 All Other Part Numbers Zone Ais not used Maximum Number of Defects Major Point Minor Point Cluster Column 10 100 4 0 OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p13 OPERATION ABSOLUTE MAXIMUM RATINGS Min Max Unit Notes Temperature Operation without damage 50 70 SL VSUB to GND 8 20 V 1 VDD 0G to GND 0 7 V VRD
23. ried in a plane parallel to the VCCD OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p10 COLOR WITH LENSLET QUANTUM EFFICIENCY 0 40 With clear cover glass Absolute Quantum Efficiency Eastman Kodak Company 2007 500 600 700 800 900 Wavelength nm 4 Red m Green A Blue Figure 5 Quantum Efficiency Spectrum for Color Filter Array Sensors Vertical Register Horizontal First Imaging Pixel Register Figure 6 Color Filter Array Pattern www kodak com go imagers Revision 3 0 MTD PS 0307 p11 FRAME RATES Frame Rate frames s HCCD Clock Frequency MHz Figure 7 Progressive Frame Rate vs HCCD Clock Frequency OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p12 DEF OPE ECT DEFINITIONS RATIONAL CONDITIONS 33 ms 40 MHz HCCD freguency no binning 30 fps frame rate Continuous green illumination centered at 550 nm Nominal voltages and timing SPE i CIFICATIONS ajor Defective A pixel whose signal deviates by more than 25 mV from the mean value of all active pixels under dark field condition or by more Pixel than 15 from the mean value of all active pixels under uniform illumination of 80 of saturation Biel Mena A pixel whose signal deviates by more than 8 mV from the mean value of all active pixels under dark field conditions uster Defect A gr
24. ristics and should be avoided Failure to do Machine Model test devices so may alter device performance and reliability Devices are shipped in static safe containers and 5 Avoid storage of the product in the presence of dust should only be handled at static safe workstations or corrosive agents or gases 3 See Application Note MTD PS 0224 Electrostatic Long term storage should be avoided Deterioration Discharge Control for Image Sensors for proper of lead solderability may occur It is advised that the handling and grounding procedures This application solderability of the device leads be re inspected after note also contains recommendations for workplace an extended period of storage over one year modifications for the minimization of electrostatic discharge SOLDERING RECOMMENDATIONS Store devices ini containers made ar electro 1 The soldering iron tip temperature is not to exceed conductive materials 370 C Failure to do so may alter device performance and reliability COVER GLASS CARE AND CLEANLINESS 2 Flow soldering method is not recommended Solder 1 The cover glass is highly susceptible to particles and dipping salka damage to the glass and harm the other contamination Perform all assembly imaging capability of the device Recommended operations in a clean environment method is by partial heating Kodak recommends the use of a grounded 30W soldering iron Heat each pin 2 Touching the cover glass must be avoided
25. shutter VSUB SS II UI Figure 14 Electronic Shutter Timing Diagram OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p24 STORAGE AND HANDLING STORAGE CONDITIONS ENVIRONMENTAL EXPOSURE Description Symbol Minimum Maximum Units Notes 1 Do not expose to strong sun light for long periods of Temperature an T T x gt time The color filters and or microlenses may TA ty become discolored Long time exposures to a static 1 Long term exposure toward the maximum temperature will high contrast scene should be avoided The image accelerate color filter degradation sensor may become discolored and localized 2 T 25 C Excessive humidity will degrade MTTF changes in response may occur from color filter microlens aging ESD 2 Exposure to temperatures exceeding the absolute 1 This device contains limited protection against Electrostatic Discharge ESD CCD image sensors can be damaged by electrostatic discharge Failure to do so may alter device performance and reliability maximum levels should be avoided for storage and operation Failure to do so may alter device performance and reliability 3 Avoid sudden temperature changes 2 Devices should be handled in accordance with strict ESD procedures for Class 0 x250V per JESD22 4 Exposure to excessive humidity will affect device Human Body Model test or Class A 200V JESD22 characte
26. the image data from Video R will have to be reversed in a line buffer and appended to the Video L data Revision 3 0 MTD PS 0307 p PIN DESCRIPTION AND PHYSICAL ORIENTATION Pin Label Pin Label 1 oR 17 VSS 2 4H2BL 18 VOUTR 3 H1BL 19 GND 4 oH1SL 20 4V20 5 oH2SL 21 V1 6 GND 22 VSUB 7 06 23 GND 8 RD 24 VDDR 9 RD 25 VDDL 10 OG 26 GND 11 GND 27 VSUB 12 oH2SR 28 V 13 oH1SR 29 V2E 14 oH1BR 30 ESD 15 6H2BR 31 VOUTL 16 oR 32 VSS The horizontal shift register is on the side o Eastman Kodak Company 2007 g the sensor parallel to the row of pins 1 through 16 In single output mode the pixel closest to pin 1 will be read out first through Video L the pixel closest to pin 17 will be read out last In dual output mode the pixel closest to pin 16 will be read out first through Video R www kodak com go imagers Revision 3 0 MTD PS 0307 p7 IMAGING PERFORMANCE TYPICAL OPERATIONAL CONDITIONS 33 ms 40 MHz HCCD frequency 30 fps frame rate Nominal voltages and timing Image defects are excluded from performance tests OPTICAL SPECIFICATIONS Description Notes Peak Quantum Efficiency 1 AGE Peak Guantum Efficiency Wavelength 1 Quantum Efficiency at 540nm 1 0QE icrolens Acceptance Angle horizontal 2 0QE icrolens Acceptance Angle vertical 2 aximum Photoresponse Nonl
27. tings Engineering Sample T onochrome Telecentric Microlens CERDIP Package sidebrazed 2H4616 KAI 2073 ABA CP BA Taped Clear Cover Glass no coatings Standard Grade Color Bayer RGB Telecentric Microlens CERDIP Package sidebrazed ues Nee CR DB re Clear Cover Glass no coatings Engineering Sample KAI 2093CM 4H0136 KAI 2093 CBA CB BA Color Bayer RGB Telecentric Microlens CERDIP Package sidebrazed Serial Number Clear Cover Glass no coatings Standard Grade 4H0705 KEK 4H0705 KAI 2093 10 40 Evaluation Board 10 Bit 40 MHz Complete Kit n a 4H0706 KEK 4H0706 KAI 2093 12 20 Evaluation Board 12 Bit 20 MHz Complete Kit n a Please see the User s Manual MT Please see ISS Application Note used for KODAK image sensors D PS 0715 for information on the Evaluation Kit for this part Address all inquiries and purchase orders to Kodak reserves the right to change any information contained herein without notice All information furnished by Kodak is mage Sensor Solutions Eastman Kodak Company Rochester New York 14650 2010 Phone 585 722 4385 Fax 585 477 4947 E mail imagersfdkodak com believed to be accurate Eastman Kodak Company 2007 www kodak com go imagers Product Naming Convention MTD PS 0892 for a full description of naming convention Revision 3 0 MTD PS 0307 p5 DEVICE DESCRIPTION ARCHITECTURE 4 light shielded rows 4 buffer columns g E o o o MS
28. tman Kodak Company Product warranty is limited to replacement of defective components and does not cover injury or property or other consequential damages Eastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p31 REVISION CHANGES Revision Number Description of Changes 0 0 nitial Formal Version 1 0 Page 8 section 3 5 AC Timing Conditions table Added Tve Vertical Clock Edge Alignment Page 10 Added Figure 5 Vertical Clock Timing Edge Position Page 15 Updated Figure 9 Frame Rate to show dual mode out to 40MHz Previous plot cut off dual mode at 35 MHz Page 22 Added that a cluster defect will be no wider that two defective pixels Page 22 Added a note that there will be at least two good pixels between any two major defects pixels or clusters Removed appendix 1 Added revision changes Section 4 2 new color guantum efficiency Updated format Updated defect definitions section Added Storage and Handling section Updated completed assembly drawing Added cover glass drawings Added cover glass transmission curves OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p32 This page intentionally left blank OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p33 This page intentionally left blank OEastman Kodak Company 2007 www kodak com go imagers Revision 3 0 MTD PS 0307 p34 This pa
29. used as a dark reference Connections to the Image Sensor The reset clock signal operates at the pixel frequency The traces on the circuit board to the reset clock pins should be kept short and of equal length to ensure that the reset pulse arrives at each pin simultaneously The circuit board traces to the horizontal clock pins should also be placed to ensure that the clock edges arrive at each pin simultaneously If reset pulses and the horizontal clock edges are misaligned the noise performance of the sensor will be degraded and balancing the offset and gain of the two output amplifiers will be difficult The bias voltages on OG RD VSS and VDD should be well filtered with capacitors placed as close to the pins as possible Noise on the video outputs will be most strongly effected by noise on VSS VDD GND and VSUB If the electronic shutter is not used then a filtering capacitor should also be placed on VSUB If the electronic shutter is used the VSUB voltage should be kept as clean and noise free as possible The voltage on VSS may be set by using the 0 6 to 0 7 volt drop across a diode Place the diode from VSS to GND To disable one of the output amplifiers connect VDD to GND do not let VDD float The ESD voltage must reach its operating point before any of the horizontal clocks reach their low level If any pin on the sensor comes within 1 V of the ESD pin the electrostatic damage protection circuit will become active
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