Burn-in Sockets
Contents
1. HONG KONG Tel 852 2687 1968 Fax 852 2601 9681 http www yamaichi com cn Shanghai Office Room 3209 Hai Tong Securities Tower No 689 Guang Dong Road Shanghai 200001 P R CHINA Tel 86 21 6361 1231 Fax 86 21 6341 0711 ASIA YAMAICHI ELECTRONICS INC 405 Kyungin Bldg 166 3 Samseong Dong Gangnam Gu Seoul 135 090 KOREA Tel 82 2 557 0522 Fax 82 2 557 0622 YAMAICHI ELECTRONICS SINGAPORE PTE LTD 51 Cuppage Road 04 01 02 Starhub Centre 229469 SINGAPORE Tel 65 6734 0060 Fax 65 6735 5567 YAMAICHI ELECTRONICS TAIWAN CO LTD Rm 1021 No 144 Min Chuan E Road Sec 3 Taipei 105 TAIWAN Tel 886 2 2546 0507 Fax 886 2 2546 0509 For further information please contact A PRINTED WITH 2005 12 AT Ver 3 2 xxxx e 1 20 2 2 5 10096 92 5 f 50 8 PURI SLU ART YF EEH detailed outline drawings before placing a purchase order GLOBAL NETWORK Py Japan IL ERRAR tE Aft T 143 8515 RILAR AKH X rH H5 33 28 7 Tel 03 3778 6111 KKK Fax 03 3778 6171 http www yamaichi co jp KBE RPT T 532 0003 X BUR X Bri E JI FF 3 5 36 PT Tel 06 6396 6191 Fax 06 6396 6192 2 AE 461 0045 22112 rh rh Pu LX 44 BN2 23 14 1714141 E 13235 Tel 052 581 8011 Fax 052 569 1560 KN AEP T 879 0314 KDR FAE KEES HK 11120 24 Tel 0978 34 9851 Fax 0978 34 9853 HE wen T 860 0844 HEA HEATH AK EMT 5 212. E EV FF Tel 096 323 5800 Fax 096 323 5803 LLI 221261722 YAMAICHI ELECTRONICS Co Ltd T 143 8515 RRBABKARIAS 28 7 3 28 7 Nakamagome Ohta ku Tokyo 143 8515 Japan Phone 03 3778 6122 Fax 03 3778 6177 http www yamaichi co jp
3. 27 TRS SIRE U shape contact minimizes contact mark on solder ball Also available in SMT contact Also available for low height solder ball C398 0151 001 max grid 22X22 C398 0289 054 max grid 30X30 YAMAICHI ELECTRONICS 8741 815 K 1 1g 1 v tS Features 232P IDRC 22 T LY TILDE K JD 81 0213 372 8 1 7 2272 RAMEE 1 70 2 227 DY 8 8 1 2 227 2 Socket with clam shell lid suitable for manual test U shape contact minimizes contact mark on solder ball Also available in SMT contact Also available for low height solder ball Cele 1C409 400 001 max grid 22 xX 22 LINE UP NP404 series v 3 Features BYTIVIFKAX Contact to the LGA bottom Setanta c NP404 84101 max grid 29x29 LINE UP 87418 2M 1 Td v 43 Features V A37WBIEICISUIEZ T AZrJUE 722727 Socket with clam shell lid suitable for manual test Contact to the LGA bottom SOCKET BASE NP404 84101 max grid 29x29 LINE UP YAMAICHI ELECTRONICS v 3 Features KIDS X ZZEKUSo749 23752r 29 123018151 ko 512501181 WK ILIE OE 28 HBL Yy Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Prevents contact from ball sticking Handles various thicknes
4. 76 110522 max grid 35x35 YAMAICHI ELECTRONICS A CHARLO Poona CHARO 2 2 2 EOD 1100100425 SS Care CS 1 gt 450090 IEU gt BELY RAL 2 7 2 12 25039 1 1 CHONAlFRmONRSOCO FERC 225 5106 2 1239 Rone CA 19 SS BUC RIDER EAD Note Specifications in this document are reference values for representative products of each series Since product improvement entails changes to electrical material and mechanical properties the purchasing party is strongly encouraged to inquire about the latest specifications and Am Outside Japan YAMAICHI ELECTRONICS U S A INC 2235 Zanker Rd San Jose CA 95131 U S A Tel 1 408 456 0797 Fax 1 408 456 0799 http www yamaichi us East Coast Regional Office 829 N Saint Mary s Lane Marietta GA 30064 U S A Tel 1 770 428 1003 Fax 1 770 428 2929 YAMAICHI ELECTRONICS DEUTSCHLAND GmbH Karl Schmid Strasse 9 D 81829 Munich GERMANY Tel 49 89 45109 0 Fax 49 89 45109 110 http www yamaichi de Yamaichi Electronics Great Britain Ltd 9 Station Hill Farnham Surrey GU9 8AA GREAT BRITAIN Tel 44 1252 714 151 Fax 44 1252 719 75 Yamaichi Electronics Italia s r l Centro Colleoni Palazzo Taurus 3 I 20041 Agrate Brianza Milano ITALY Tel 39 039 6881 185 Fax 39 039 6892 150 YAMAICHI ELECTRONICS HONG KONG LTD Unit 713 Tower 2 Grand Central Plaza 138 Shatin Rural Committee Road Shatin N T
5. Better Connection La o Por s 3 e YAMAICHI ELECTRONICS e EE EE ee Open Top Type NP437 series OC CERERI NP437 series v Features FAO A AYRE ELUEA h ExExEs470374547Hb 038Rn 8E 2 2 bh eo U shape contact minimizes contact mark on solder ball Also available in SMT contact Also available for low height solder ball eye NP437 484 001 max grid 2 LINE UP YAMAICHI ELECTRONICS Product Line up PKG Size mm Grid 7 89 1011 12 43 1415 1617 18 9 2021 2223 2425 2627 28 29 Open Top Type NPS383 series IC398 series Open Top Type Clam Shell Type IC409 series Open Top Type NP404 series Clam Shell Type 6405 series v 43 Features NP383 series RIL EERI 2 1 71 2272 2512 81112 d e ARAHAN M IDIF OTE RLS EAW 3 Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Prevents contact from ball sticking Handles various thickness of packages NP383 06038 max grid 10X18 NP383 28804 max grid 18X 18 NP383 84107 max grid 29X29 NP383 60057 max grid 25X25 v Features ICS98 series NID 502 377 5 7 2 24272 RAFI 1 701 27272 SBR 1855 lt lt 2
6. X26 NP351 841 450 max grid 9 v Features 7122727 3211 2 227 2 2 amp amp it Contact to the LGA BGA bottom Also available for low height solder ball SOCKET NP364 12007 max grid 10X 12 LINE UP NP364 44140 max grid 21X21 v HM Features V 2 DERG LEDS LY I h JID FENO 4 372 5 1 235 4272 LGARI 27272 322 Socket with clam shell lid suitable for manual test V shape contact minimizes contact mark on solder ball Also available in contact for LGA package ONENE 10C280 32427 max grid 18x18 10280 72919 max grid 27X27 Product Line up PKG Size mm Open Top Type Open Top Type 7 BGA LGA Clam Shell Type BGA LGA NPS351 series r 45 Om YAMAICHI ELECTRONICS 2 12 28 29 3 456 67 6 EO 112 ANE MONA 640516 17 de 1920271 2122 2229 0 14 15 16 0 80mm amp 0 80 1 00 mm Pitch Product Line up 0 80mm PKG Size mm Open Top Type BGA v it Features NP470 series KF 7 Y gt 7 62272 h ID 81 023 5 3727 7 248 227 h 7122273 KSSH U Ny 7 3 05 Also available for low height solder ball U shape contact minimizes contact mark on solder ball Wiping effect enhances contact to Pb free packages were NP470 01 max grid 14X22 LINE UP P
7. duct Line up PKG Size mm k 0 0 0 dd is s ul Da Open Top Type Clam Shell Type BGA NP291 series v Features NLP XTERM 21 71 2272 212 3 e Th JLIF DATE BLES EAK Y 27 35 Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Prevents contact from ball sticking Handles various thickness of packages NP291 04808 204820 max grid 6 8 NP291 07210 max grid 9 NP291 04805 max grid 10x10 NP291 11222 max grid 7X16 NP291 12831 max grid 8 16 SOCKET BAS LINE U IC280 series y N Features P IRIEL IS LY VE FENDI X IERE LEVERET 2 h Socket with clam shell lid suitable for manual test V shape contact minimizes contact mark on solder ball ele aH Md 10280 22594 max grid 15 LINE UP YAMAICHI ELECTRONICS 0727310 series v HM Features MIDS X Ve as 1222 212 d ifie RE M ILDIF OTTERS WU v JY lO Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Prevents contact from ball sticking Handles various thickness of packages fele 8 533 NP351 140 100 max grid 10x 14 NP351 17607 max grid 15x15 LINE UP NP351 16914 max grid 13X13 NP351 28508 max grid 17X17 NP351 16803 max grid 14x14 NP351 65113 max grid 26
8. ies v 434 Features 5 122 27 11 2 2 2 03671001757 5 5 12 5 71 V LASS YY ITIVE KY hse SEIR BAMBARA TY 32 27 Tweezer style contact with wiping function ensures high contact reliability Low profile coverless structure enhances heat dissipation during Burn in Simple structure realizes low price Easy to mount optional heat sink NP440 1849 001 max grid 43 x 43 SOCKET BASE LINE UP v Si Features V 37 DER EICMLIETS LY I 81 013 X ZT X BUIcVEHERITZAZHF LGARI 27272 bh SBR Socket with clam shell lid suitable for manual test V shape contact minimizes contact mark on solder ball Also available in contact for LGA package CTO C280 72918 max grid 27x27 LINE UP 06280625 YAMAICHI ELECTRONICS ee A a WINES GRE UNE CARO Open Top Type NP276 series NP276 series v Features WLF XTERM 2 122 72 2591531918151 Ko 512111 BU 2 TEM Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Handles various thickness of packages SOCKET BASE NP276 11904 max grid 7X17 25 NP276 15316 max grid 7 NP276 25626 max grid 16X16 NP276 40009 max grid 20X20 NP276 62525 max grid 25X25 NP276 59608 max grid 26X26 NP276 87318 max grid 31X31 NP2
9. roduct Line up 0 80x1 00mm PKG Size mm 0 0 0 0 0 0 0 0 3 d ee Br Open Top Type 0 NP367 5 B v 3 Features NPS367 series RLF XTERM 2 1 2272 2 512 8412 d e 52521 M IJLIF OATES ABU 32 Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Prevents contact from ball sticking Handles various thickness of packages NP367 10810 amp 10819 max grid 9X12 NP367 12603 amp 12615 max grid 9x14 YAMAICHI ELECTRONICS Product Line up 7299595405115 0 15 14 15 17 O 2 23 2 2 29 3i 33 35 33 40 453 45 148 56 167 178 189 940 40 1 111 12 12 13 43 14 15 16 117 18 11920 121 22 123 24 25 26 127 28 129 30 131 32 33 34 136 37 13839 141 42 143 44 146 47 NP352 series NP440 series 16280 series v 3 Features N IDIX VReERS 2 7 2272 251289184 d HEB 27 35 Tweezer style contact minimizes contact mark on solder ball Dual contact points ensure high contact reliability Handles various thickness of packages Cerys NP352 165 49 max grid 11X 15 QDR amp NP352 900 87 max grid 30 LINE UP NP352 209 67 max grid 11 X19 2 RAMA NP352 152109 max grid 39X39 NP352 25681 max grid 16x 16 NP352 220918 max grid 7 352 72946 max grid 27 X27 PKG Size mm Open Top Type Open Top Type Clam Shell Type BGA LGA NP440 ser
10. s of packages NP378 29903 max grid 18x18 NP378 09001 max grid 6 X15 NP378 62537 max grid 25x25 NP378 10009 max grid 0 NP378 26914 max grid 17 X17 SOCKET BASE LINE UP v 43 Features V 37 WV IEIOGSUIEZTAZIJ98S 2272 71 2 5 72 2 RIBI0O 68 833 27272 bE SRR Socket with clam shell lid suitable for manual test V shape contact minimizes contact mark on solder ball Also available in contact for LGA package max grid 17X17 max grid 2 max grid 32X32 10280 28974 C280 484 206 C280 960 276 LINE UP YAMAICHI ELECTRONICS Product Line up PKG Size mm Grid Open Top Type Clam Shell Type BGA LGA Open Top Type Open Top Type BGA LGA t i l i NP416 series v H Features 1885 22 Z KBER 7 2248 8 3727 81 023 227 h 7122273 2650 U Ny 7 3005 Also available for low height solder ball U shape contact minimizes contact mark on solder ball Wiping effect enhances contact to Pb free packages SOCKET BASE 8 NP416 005 max grid 0 LINE UP yA v H Features 2 6 52 PAR BEAR 2 22 7 25 8 57 62 OD Te AR SD S S E Contact to the LGA BGA bottom Also available in contact for BGA package Precise positioning mechanism ayes NP471 001 max grid 15 LINE UP YAMAICHI ELECTRONICS Pro
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