Philips TDA8542 User's Manual
Contents
1. 4 Vcc 12 V Ri 16 1 Gy 24 cB 5 Voc 5 V RL 32Q 2 Gy 20 cB 3 Gy 0 dB Fig 17 Channel separation as a function of frequency Fig 18 SVRR as a function of frequency 5 MGD903 A MGD904 Po W P 1 6 w af f 1 2 3 2 1 2 0 8 1 0 4 0 0 0 4 8 12 16 Vec V 0 4 8 12 Voc V 16 THD 10 in E A 1 R 4Q Raae 2 R 8Q 3 R 3 RL 162 Fig 20 Worst case power dissipation as a function Fig 19 P as a function of Vcc of Vcc 1998 Apr 01 13 Philips Semiconductors Product specification 2 x1 W BTL audio amplifier TDA8542 MGD905 0 8 Sine wave of 1 kHz 1 Veco 12 V R 16 Q 2 Voc 7 5V RL 4Q 3 Vec 9V RL 8Q Fig 21 Power dissipation as a function of Po 1998 Apr 01 14 Product specification Philips Semiconductors TDA8542 2 x1 W BTL audio amplifier a Top view GND Vcoc 1 169_lo 9 f MODE P3 jean T uF ah TDA8542 47 WF yd 11 kQ Ka B S am 1 uF 8 9 56kQ IN2 OUT2 OUT2 MBH921 b Component side Fig 22 Printed circuit board layout BTL and SE 1998 Apr 01 15 Philips Semiconductors Product specification 2 x1 W BTL audio amplifier TDA8542 PACKAGE OUTLINES S016 plastic small outline package 16 leads body width 7 5 mm SOT162 12. f Q Ji a A ty pin 1 index 5 Re ee Z AH ai l i detail X b 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions A UNIT max Ar A2 As bp c DM EM e He 10 5 7 6 10 1 7 4 0 41 0 30 0 40 0 29 2 65 inches 0 10 Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE REFERENCES EUROPEAN VERSION IEC JEDEC EIAJ PROJECTION SOT162 1 075E03 MS 013AA E es ISSUE DATE 1998 Apr 01 16 Philips Semiconductors 2 x1 W BTL audio amplifier DIP16 plastic dual in line package 16 leads 300 mil long body j seating plane 0 ES a a Ce SEEN LS ee a ee 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions Product specification TDA8542 SOT38 1 A UNIT max Ai min A2 max b by c p 1 4 7 0 51 3 7 21 8 6 48 21 4 6 20 inches 0 19 0 15 0 86 0 26 0 84 0 24 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSU
3. Fig 9 P as a function of Vcc 1998 Apr 01 10 Philips Semiconductors 2 x1 W BTL audio amplifier MGD896 Vcc V 1 RL 8Q 2 RL 16Q Fig 10 Worst case power dissipation as a function Product specification TDA8542 MGD897 3 P 1 W 2 2 1 0 0 0 5 1 1 5 2 2 5 Po W Sine wave of 1 kHz 1 Voc 9V RL 162 2 Voc 5V RL 8Q of Vcc Fig 11 Pyis as a function of Po MGLO070 10 MGD898 16 fe V Vms 1 v 12 40 1 standby 1072 OMD j 1073 mute 4 10 4 1075 ige t operating 1071 1 10 102 0 4 8 12 16 Vms V Vp V Band pass 22 Hz to 22 kHz 1 Vcc 3 V 2 Vec 5 V 3 Veco 12V Fig 12 V asa function of Ving Fig 13 Vms as a function of Vp 1998 Apr 01 11 Philips Semiconductors 2 x1 W BTL audio amplifier SE APPLICATION Product specification TDA8542 Gain right gt R2 Gain left RI R2 100 kQ JH 10 kQ Vit C3 47 uF L OUTR R4 100 kQ 1 uF R3 10 kQ BTL SE R ols 100 nF
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7. SCA59 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 545102 00 05 pp20 Philips Semiconductors Date of release 1998 Apr 01 Document order number 9397 750 03353 Let make things better S PHILIPS
8. amplifier using two coupling capacitors for each channel The common GND pin of the headphone is connected to the ground of the amplifier see Fig 13 In this case the BTL SE pin must be either on a logic HIGH level or not connected at all The two coupling capacitors can be omitted if it is allowed to connect the common GND pin of the headphone jack not to ground but to a voltage level of 2Vcc see Fig 13 In this case the BTL SE pin must be either on a logic LOW level or connected to ground If the BTL SE pin is ona LOW level the power amplifier for the positive loudspeaker terminal is always in mute condition Philips Semiconductors Product specification 2 x1 W BTL audio amplifier TDA8542 LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 134 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT Vec supply voltage operating 0 3 18 V ORM repetitive peak output current 1 A Tamb operating ambient temperature 40 85 C Vpsc AC and DC short circuit safe voltage Piot total power dissipation SO16L 1 2 WwW DIP16 2 2 W QUALITY SPECIFICATION In accordance with SNW FQ 611 E The number of the quality specification can be found in the Quality Reference Handbook The handbook can be ordered using the code 9397 750 00192 THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rtn j a thermal resistance from junction to ambient in free air TDA8542T SO16L 100 K W TD
9. 3 o Zi differential input impedance 100 kQ 200 supply voltage ripple rejection ross o E iB O d uV note 4 40 dB output voltage in mute condition note 5 uV 40 dB Ocs channel separation Notes 1 Gain of the amplifier is 2 x R2 R1 in test circuit of Fig 3 2 The noise output voltage is measured at the output in a frequency range from 20 Hz to 20 kHz unweighted with a source impedance of Rs 0 at the input 3 Supply voltage ripple rejection is measured at the output with a source impedance of Rs 0 at the input The ripple voltage is a sine wave with a frequency of 1 kHz and an amplitude of 100 mV RMS which is applied to the positive supply rail 4 Supply voltage ripple rejection is measured at the output with a source impedance of Rs 0 at the input The ripple voltage is a sine wave with a frequency between 100 Hz and 20 kHz and an amplitude of 100 mV RMS which is applied to the positive supply rail 5 Output voltage in mute position is measured with a 1 V RMS input voltage in a bandwidth of 20 kHz so including noise 1998 Apr 01 7 Philips Semiconductors 2 x 1 W BTL audio amplifier TEST AND APPLICATION INFORMATION Test conditions Because the application can be either Bridge Tied Load BTL or Single Ended SE the curves of each application are shown separately The thermal resistance 55 K W for the DIP16 the maximum sine wave power dissip
10. 71 f 1 kHz Gy 20 dB 1 Veo 5 V Ry 8 2 Veco 9V RL 162 Fig 5 THD as a function of Po 1998 Apr 01 Philips Semiconductors 2 x1 W BTL audio amplifier MGD892 10 THD 10 1 Sal 10 102 108 104 105 Po 0 5 W Gy 20 dB 1 Voc 5V RL 8Q 2 Voc 9V RL 16Q Product specification TDA8542 MGD893 60 Ocs dB 1 N Zz 70 VW 2 80 90 100 2 3 4 5 10 10 10 10 Hz 10 Vcc 5 V Vo 2V Ry 8Q 1 Gv 30 dB 2 Gy 20 dB 3 Gv 6 0B Fig 7 Channel separation as a function of Fig 6 THD as a function of frequency frequency MGD894 MGD895 20 2 5 Po SVRR N w dB W 2 40 N yi 6 af 2 1 NST OLA N 2 1 60 5 0 5 80 0 10 10 108 104 10 f Hz 0 4 Veo V 12 Voc 5V R 0Q Vr 100 mV 1 G 30 dB 2 Gy 20 dB 3 Gy 6 dB Fig 8 SVRR as a function of frequency 1 THD 10 RL 82 2 THD 10 RL 16 Q
11. A8542 DIP16 55 K W 1998 Apr 01 5 Philips Semiconductors 2x1 W BTL audio amplifier DC CHARACTERISTICS Product specification TDA8542 Voc 5 V Tamb 25 C Rt 8 Q Vuope 0 V measured in test circuit Fig 3 unless otherwise specified SYMBOL PARAMETER supply voltage CONDITIONS operating MAX 18 Voc lq Istb quiescent current standby current R note 1 Vvone Vcc 22 10 Vo Vouts Vout DC output voltage differential output voltage offset note 2 50 lines liN input bias current input voltage mode select input current mode select operating 500 Vee 1 5 Voc 20 input voltage BTL SE pin 0 6 Voc Notes input current BTL SE pin 2 2 mute 1 5 CEE fo single ended BTL 2 MIN TYP 5 15 2 2 100 1 With a load connected at the outputs the quiescent current will increase the maximum of this increase being equal to the DC output offset voltage divided by RL 2 The DC output voltage with respect to ground is approximately 0 5 x Vcc 1998 Apr 01 Philips Semiconductors Product specification 2x1 W BTL audio amplifier TDA8542 AC CHARACTERISTICS Voc 5 V Tamb 25 C Rt 8 Q f 1 KHZ Viope 0 V measured in test circuit Fig 3 unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Po output power THD 10 1 2 WwW THD total harmonic distortion Po 0 5 W 0 15 0
12. E DATE SOT38 1 050G09 MO 001AE ay 92 40 62 95 01 19 1998 Apr 01 17 Philips Semiconductors 2 x 1 W BTL audio amplifier SOLDERING Introduction There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mounted components are mixed on one printed circuit board However wave soldering is not always suitable for surface mounted ICs or for printed circuits with high population densities In these situations reflow soldering is often used This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our IC Package Databook order code 9398 652 90011 DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C solder at this temperature must not be in contact with the joint for more than 5 seconds The total contact time of successive solder waves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature Tstg max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron less than 24 V to the lead s of the package belo
13. G INFORMATION TYPE PACKAGE NUMBER DESCRIPTION VERSION TDA8542T SO16L plastic small outline package 16 leads body width 7 5 mm SOT162 1 TDA8542 DIP16 plastic dual in line package 16 leads 300 mil long body SOT38 1 1998 Apr 01 2 Philips Semiconductors 2 x1 W BTL audio amplifier BLOCK DIAGRAM Product specification TDA8542 VccL Voor OUTL OUTL INR INR SVR MODE OUTR R OUTR BTL SE STANDBY MUTE LOGIC MGB975 LGND RGND Fig 1 Block diagram 1998 Apr 01 Philips Semiconductors 2 x1 W BTL audio amplifier PINNING SYMBOL DESCRIPTION ground left channel positive loudspeaker terminal left channel operating mode select standby mute operating half supply voltage decoupling ripple rejection BTL loudspeaker or SE headphone operation SVR BTL SE not connected positive loudspeaker terminal right channel ground right channel supply voltage right channel negative loudspeaker terminal right channel negative input right channel positive input right channel positive input left channel negative input left channel negative loudspeaker terminal left channel Voc 16 supply voltage left channel VocL OUTL INL INL TDA8542 INR
14. INR OUTR VCCR MGB974 Fig 2 Pin configuration 1998 Apr 01 Product specification TDA8542 FUNCTIONAL DESCRIPTION The TDA8542 T is a 2 x 1 W BTL audio power amplifier capable of delivering 2 x 1 W output power to an 8 Q load at THD 10 using a 5 V power supply Using the MODE pin the device can be switched to standby and mute condition The device is protected by an internal thermal shutdown protection mechanism The gain can be set within a range from 6 dB to 30 dB by external feedback resistors Power amplifier The power amplifier is a Bridge Tied Load BTL amplifier with a complementary PNP NPN output stage The voltage loss on the positive supply line is the saturation voltage of a PNP power transistor on the negative side the saturation voltage of a NPN power transistor The total voltage loss is lt 1 V and with a 5 V supply voltage and an 8 Q loudspeaker an output power of 1 W can be delivered Mode select pin The device is in the standby mode with a very low current consumption if the voltage at the MODE pin is gt Vcc 0 5 V or if this pin is floating Ata MODE voltage level of less than 0 5 V the amplifier is fully operational In the range between 1 5 V and Vcc 1 5 V the amplifier is in mute condition The mute condition is useful to suppress plop noise at the output caused by charging of the input capacitor Headphone connection A headphone can be connected to the
15. INTEGRATED CIRCUITS DATA SHEET TDA8542 2 x 1WBITL audio amplifier Product specification 1998 Apr 01 Supersedes data of 1997 Feb 19 File under Integrated Circuits IC01 Philips PHILIP sS Semiconductors DH LI p Philips Semiconductors Product specification 2 x1 W BTL audio amplifier TDA8542 FEATURES APPLICATIONS e Flexibility in use e Portable consumer products e Few external components e Personal computers e Low saturation voltage of output stage e Motor driver servo Gain can be fixed with external resistors Standby mode controlled by CMOS compatible levels GENERAL DESCRIPTION Low standby current The TDA8542 T is a two channel audio power amplifier No switch on switch off plops for an output power of 2 x 1 W with an 8 Q load ata 5 V supply The circuit contains two BTL amplifiers with a complementary PNP NPN output stage and standby mute Protected against electrostatic discharge logic The TDA8542T comes in a 16 pin SO package and Outputs short circuit safe to ground Vcc andacrossthe the TDA8542 in a 16 pin DIP package load High supply voltage ripple rejection Thermally protected QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN TYP supply voltage 2 2 5 quiescent current Voc 5V 15 1 1 2 50 MAX UNIT 18 V 10 uA standby current output power THD 10 R 8 Q Voc 5 V FS total harmonic distortion P 0 5 W 0 15 supply voltage ripple rejection se ORDERIN
16. L a 470 ga RL 7 RL MBH799 Fig 14 Single ended application 10 THD 10 2 1072 1 3 MGD899 f 1 kHz Gy 20 dB 1 Voc 7 5V RL 4Q 2 Veco 9V RL 82 3 Vcc 12V R 16 Q Fig 15 THD as a function of Po 10 MGD900 THD Po 1 1071 1 3 2 4 3 0 2 3 4 5 10 10 10 10 f Hz 10 Po 0 5 W Gy 20 dB 1 Voc 7 5V RL 4Q 2 Veo 9V RL 82 3 Veco 12 V R 16 Fig 16 THD as a function of frequency 1998 Apr 01 Philips Semiconductors Product specification 2 x1 W BTL audio amplifier TDA8542 MGD901 20 MGD902 Ocs 20 dB SVRR 40 a 4 40 60 2 i 3 g izari ye Cet 80 4 E 5 60 3 100 2 3 4 10 10 10 10 10 iHz 0 va Vo 1 V Gy 20 dB 10 102 108 104 ve 105 1 Veco 5 V R 32 Q to buffer Hz 2 Veo 7 5V RL 429 3 Voc 9V RL 8 Q Vcc 7 5 V Rr 4 Q Re 0 Q V 100 mV 4 5
17. ation for Tamp 25 C is 150 25 _ m 2 3 W For Tamb 60 C the maximum total power dissipation is 150 60 _ oo 1 7W BTL application Tamb 25 C if not specially mentioned Vcc 5 V f 1 kHz R 8 Q Gy 20 dB audio band pass 22 Hz to 22 kHz The BTL application diagram is illustrated in Fig 3 The quiescent current has been measured without any load impedance The total harmonic distortion as a function of frequency was measured with a low pass filter of 80 kHz The value of capacitor C3 influences the behaviour of the SVRR at low frequencies increasing the value of C3 increases the performance of the SVRR The figure of the mode select voltage Vms as a function of the supply voltage shows three areas operating mute and standby It shows that the DC switching levels of the mute and standby respectively depends on the supply voltage level 1998 Apr 01 Product specification TDA8542 SE application Tamb 25 C if not specially mentioned Vcc 7 5 V f 1 kHz R 4 Q Gy 20 dB audio band pass 22 Hz to 22 kHz The SE application diagram is illustrated in Fig 14 If the BTL SE pin pin 5 is connected to ground the positive outputs pins 2 and 7 will be in mute condition with a DC level of Vcc When a headphone is used R1 25 Q the SE headphone application can be used without output coupling capacitors load between negative output and one of the positive outputs e g pin 2 as co
18. dhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Maximum permissible solder temperature is 260 C and maximum duration of package immersion in solder is 10 seconds if cooled to less than 150 C within 6 seconds Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally opposite end leads Use only a low voltage soldering iron less than 24 V applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification 2 x1 W BTL audio amplifier TDA8542 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the d
19. evice These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale 1998 Apr 01 19 Philips Semiconductors Argentina see South America Australia 34 Waterloo Road NORTH RYDE NSW 2113 Tel 61 2 9805 4455 Fax 61 2 9805 4466 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 160 1010 Fax 43 160 101 1210 Belarus Hotel Minsk Business Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 200 733 Fax 375 172 200 773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 689 211 Fax 359 2 689 102 Canada PHILIPS SEMICONDUCTORS COMPONENTS Tel 1 800 234 7381
20. mmon pin Increasing the value of electrolytic capacitor C3 will result in a better channel separation Because the positive output is not designed for high output current 2 x lo at low load impedance lt 16 Q the SE application with output capacitors connected to ground is advised The capacitor value of C4 C5 in combination with the load impedance determines the low frequency behaviour The THD as a function of frequency was measured using a low pass filter of 80 kHz The value of capacitor C3 influences the behaviour of the SVRR at low frequencies increasing the value of C3 increases the performance of the SVRR General remark The frequency characteristic can be adapted by connecting a small capacitor across the feedback resistor To improve the immunity of HF radiation in radio circuit applications a small capacitor can be connected in parallel with the feedback resistor 56 kQ this creates a low pass filter Philips Semiconductors 2x1 W BTL audio amplifier BTL APPLICATION Product specification TDA8542 R2 50 kQ m gt OUTR R4 50 kQ 1 uF R3 Hor 10 kQ R2 Gain left 2x57 Gain right 2 x i Fig 3 TDA8542 Voc uF MBH798 BTL application MGD890 Voc V RI Fig 4 lq as a function of Vcc MGD891 10 THD 10
21. w the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds so REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement 1998 Apr 01 Product specification TDA8542 Several techniques exist for reflowing for example thermal conduction by heated belt Dwell times vary between 50 and 300 seconds depending on heating method Typical reflow temperatures range from 215 to 250 C Preheating is necessary to dry the paste and evaporate the binding agent Preheating duration 45 minutes at 45 C WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed e A double wave a turbulent wave with high upward pressure followed by a smooth laminar wave soldering technique should be used e The longitudinal axis of the package footprint must be parallel to the solder flow e The package footprint must incorporate solder thieves at the downstream end During placement and before soldering the package must be fixed with a droplet of a
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