MATERIALS MANAGEMENT DIVISION
Contents
1. and opened on the next working day The timing will remain the same G K Bhorkade Asst Registrar MM MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in General stipulation regarding Tender No SUBH 09 EQP 003 09 001 L EE SC supply of Flip Chip Bonder We shall be obliged if you kindly send your detailed quotation for item the specifications of which are given in the enclosed sheet Your quotation may please be sent in a sealed cover superscribed with our inquiry No amp Due Date addressing to the undersigned so as to reach the same by 03 12 2009 The following suggestion and general conditions may please also be noted while submitting the quotation 1 Your quotation should be given on FOB international Airport basis Duty exclusive 2 The leaflets catalogue etc should be sent invariably so that a proper evaluation of the equipment offered is possible 3 Separate prices should be shown for a basic equipment b essential accessories c optional accessories d normal spares particularly of the items which are must likely sustain damage or failure in use 4 Installation charges if extra should be quoted separately otherwise it will be assumed that the installation will be done free of charge 5 Performance Guarantee of at least one year from the2. capabilities Temperature range Ambient to 450 C resolution 1 C Heating rate Cooling rate Able to stand bonding force up to 200 kgf Heat must be confined to the top plate and not propagate to machine mechanism Chuck surface must be flat and optical polished within 1um 2 9 Bonding processes 0 2 Thermo Compression Force range 50 grams to 200kgf Programmable with up to 10 different force steps Temperature range Ambient to 450 C Post bond accuracy 3um or better Reflow Temperature range Ambient to 450 C Z Control within Lum Programmable with up to 10 Z steps Post Bond Accuracy 1pm or better Programmable Scrubbing function X or Y vibration to break oxide Neutral gas i e Nitrogen environment capability during Process recording system record the actual parameters of each bond in a txt or xls file for further analysis on independent computer not to be supplied Force Z control Temperature for chip and substrate Level of the Vacuum securing for chip and substrate on chucks Under filling after bonding Time pressure dispensing system compatible with underfill material Programmable dispense pattern to optimize underfill material flow Possibility to heat up the substrate chuck at elevated temperature lt 60 C during underfill to reduce material viscosit Components loading 2 10 1 Pick up tools must ensure no damage to the bump array present on
3. date of installation will be given 6 Please also mention specifically whether after Sales Service facility on service contract basis or otherwise is available Period of delivery should be mentioned specifically Your quotation must be valid for at least six months from the date i e 03 12 2009 9 Please also mention whether any facilities are expected from this Institute for installation and operation of the equipment like ambient temperature humidity weather specifications power specifications etc When items are provided full performance satisfactions should be demonstrated 11 12 13 14 15 16 17 20 MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in It is stipulated that insurance will be through LIC as per Govt of India regulation A special safety measure you would like to suggest Training facility if available and the Terms and conditions for the same Actual user import licence may be provided by us The price should be on CIF Bombay basis Illustration Literature or Pamphlet should be attached with the quotation The rates of exchange should be mentioned For supply of items against short shipments intimation is to be given before despatching the same Please quote your price as per enclosed tender format only viz Annexure
4. for indigenous item Annexure II for imported item Excise Duty As per Govt Notification No 10 97 CE dt 1 3 97 IIT is exempted from payment of whole of Excise Duty and we shall provide all the documents under notification to enable you to clear the goods without payment of Excise Duty Please quote your price in US also Enclosure As Stated Asst Registrar MM MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in To be returned alongwith the Tender From Tender No SUBH 09 EQP 003 09 001 L EE SC Due on 03 12 09 To Asst Registrar MM Indian Institute of Technology Powai Mumbai 400 076 Dear Sir I We hereby offer to supply to the Asst Registrar MM the Stores detailed in the schedule I We having understood the condition of the above tender shall abide by the same in the course of execution of orders placed on us Yours faithfully MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 EPABX 491 22 2572 2545 Indian Institute of Technology Bombay Fax 491 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in Technical Specification for Purchase of Automated Flip Chip Bonder SPECIFICATIONS A B Specifications are basic essence of the product It m
5. 200 250V 50 Hz 3 Phase etc MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in TENDER FORMAT for Indigenous Supplies ANNEXURE 1 Reference No SUBH 09 EQP 003 09 001 L EE SC Due Date 03 12 09 Description of Item Quantity Unit Unit Price Sale Total amp Specification Price Excise Tax Price Duty Delivery Mode F O R Bombay Free Delivery at IIT Bombay Scroll whatever is not applicable Total bid price should be inclusive of Excise duty amp Sale Tax F O R Bombay free delivery at IIT Bombay for the above quoted items is Rs Delivery Period Validity Date Minimum 60 days from the date of opening of tender Terms of payment Full payment within 30 days from the date of safe receipt and acceptance of the material Place Signature Date Name Business Address Affix Rubber Stamp MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in TENDER FORMAT for Foreign Supplies ANNEXURE II Reference No SUBH 09 EQP 003 09 001 L EE SC Due Date 03 12 09 Description Quantity Unit Price on Total Indian Agent of Item amp O B Price Commis
6. Ability to level parts with low reflectivity and non perfectly flat with Laser levelling Parallelism correction mechanism motorized tip tilt system Resolution 2 radian or better Travel 0 5 degrees or better XY Stage Travel large enough to cover large chip mini 50x50mm Resolution 1um or better Maintain optical axis verticality during displacements within 10uradian or better Vision system with following feature is required Possibility to display independently chip and substrate image Search function Synthetic pattern generation Distance measurement capabilit MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay ian Oe eee f f Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www iitb ac in 2 6 1 Vision system must be able to perform automatic levelling using the autocollimator image and the levelling mechanism 2 7 Substrate Chuck 9 1 2 7 Dimension 50 x 50 mm or larger 2 7 2 Heating capabilities Temperature range Ambient to 450 C resolution 1 C Heating rate Cooling rate Able to stand bonding force up to 200 kgf Heat must be confined to the top plate and not propagate to machine mechanism Chuck surface must be flat and optical polished within 1um 2 8 Chip Chuck Dimension up to 50 x 50 mm 2 8 2 item Indian Institute of Technology Requirements Answers Heating
7. MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in TENDER NOTICE Sealed Tenders are invited by the Asst Registrar MM Indian Institute of Technology Powai Mumbai 400 076 for the supply of following item The Tender No amp brief description of the item is given below Sr No Brief Description Qty Due Date 1 Tender No SUBH 09 EQP 003 09 001 L EE SC No 1 03 12 09 Flip Chip Bonder Detailed description of the item and instructions for submitting your offer can be downloaded from our website www iitb ac in stores tender However a Crossed Demand Draft of Rs 500 00 Non refundable in favour of the Registrar IIT Bombay should be submitted alongwith your quotation The Tender form can be purchased from the Materials Management Division with a request letter against the payment of Rs 500 00 Non refundable per tender by Crossed Demand Draft in favour of the Registrar Indian Institute of Technology Powai Mumbai 400 076 on any working day between 1400 hrs to 1630 hrs as per the schedule Tender will be accepted upto 1300 hrs on due date mentioned above and will be opened as per attached schedule in the presence of the authorised representative of the tenderers who wish to be present In case due date happens to be holiday the Tender will be accepted
8. OMPLIANCE STATEMENTS Bidders must furnish a Compliance Statement of each and every required Specification of our tender in the format given below The deviations if any from the tendered specifications should be clearly brought out in the statement Technical literature leaflet showing the compliance of the specification MUST also be attached with the quotation MATERIALS MANAGEMENT DIVISION Direct 491 22 2576 8800 2576 8805 EPABX 91 22 2572 2545 Indian Institute of Technology Bombay f f Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www iitb ac in Indian Institute of Technology Requirements Answers Po Parameters Cd ESSN The machine must be able to handle align and bond using Flip Chip Technology Silicon chip to sensitive chips made of compound semiconductor such as GaAs InP GaSb Therefore the machine must include Component size Chip size up to 50mm square or rectangular Substrate size up to 50mm square or rectangular Note Presence of bumps array on the chip and substrate 2 Machine specifications N N N N c o1 5 N H N H e XY movement Air bearing technology Resolution of 0 1 um or better Travel sufficient to bond on Square 50mm substrate Theta movement Resolution of 10 radian or better Travel 5 degrees or better Alignment Optics Parallelism adjustment Autocollimator for levelling parts Sensitivity 25 radian
9. chip and substrate MATERIALS MANAGEMENT DIVISION Direct 491 22 2576 8800 2576 8805 EPABX 91 22 2572 2545 Indian Institute of Technology Bombay f f Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www iitb ac in item Indian Institute of Technology Requirements Answers 2 9 2 Chip storage Waffle pack or Gel pack compatible Minimum 6 trays 2 Inch or 2 trays 4 Inch 2 10 2 Substrate storage Waffle pack or Gel pack compatible _ Minimum 6 trays 2 Inch or 2 trays 4 Inch Machine control amp miscellaneous 2 11 1 Machine must be controlled by PC Windows user interface Limited access by password for operators process engineers or service engineers Trouble shooting menu Remote control capability for remote maintenance or software update 2 12 Provide list of users for SAME system compatible with bonding die with high density fine pitch 10um containing at least 1kx1k bumping array 6 7um bump size Provide Brochure Technical details of SAME system along with model number 31 Installation and training in Indian Institute of Technology Start up and user training by vendor User manual Acceptance test Immediately after machine installation with presence of the vendor engineer Standard Acceptance document to be provided by the vendor Additional 1 Include for Calibration Reports of all Stages 2 Include the Electrical Input requirements like
10. d the price calculated at the rate set out in schedule If any of the stores mentioned above are already covered by D G S amp D Rate Contract you are requested to give us the advantages of contract rates as this is an Educational Institute sponsored by Govt of India Asst Registrar M M reserves the right to accept or reject any tender without assigning any reason Terms of payment Within 30 days from the date of supply and satisfactory demonstration Asst Registrar MM MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay EPABX 91 22 2572 2545 Fax 91 22 2576 8808 Powai Mumbai 400 076 Schedule for Last date for purchase of tender forms Late date for submission of quotation Opening of Tender For Technical clarification contact For other inquires contact Email armm iitb ac in Website www titb ac in SCHEDULE File No SUBH 09 EQP 003 09 001 L EE SC 01 12 09 upto 1630 Hrs 03 12 09 by 1300 Hrs 03 12 09 at 1500 Hrs Prof Subhananda Chakrabarti Dept of Electrical Engg Ph No 2576 7421 e mail subho AT ee iitb ac in Asst Registrar MM Materials Management Division Ph 2576 8800 Fax No 2576 8808 e mail armm iitb ac in
11. er must reach to the Asst Registrar MM Indian Institute of Technology Bombay 400 076 on or before 03 12 2009 upto 1300 hrs 3 Tender will be opened at 1500 hrs on 03 12 2009 in the presence of representatives of the firms whoever desires to be present 4 Tender received after the closing date will not be considered 5 Tender should be valid for six months from the closing date of the Tender 6 The delivery period should be specifically mentioned 7 Tender should be for Free delivery at Institute s Premises Powai Mumbai 400 076 8 Tender will be taken as inclusive of Taxes if nothing is stated by the firm MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 EPABX 491 22 2572 2545 Indian Institute of Technology Bombay Fax 91 22 2576 8808 Powai Mumbai 400 076 ae Email armm iitb ac in Website www titb ac in If you fail to supply any stores in accordance with the terms and conditions or fail to replace any stores rejected by the Asst Registrar MM or any person on his behalf within such time as may be stipulated the Asst Registrar MM shall be entitled to purchase such stores from any other source and at such price as the Asst Registrar MM shall be his sole discretion think fit and if such prices shall excess the rate set out in the schedule you shall be responsible to pay the differences between the price at which such stores have been purchased by the Asst Registrar MM an
12. sion Specification Note FOB price from international airport Indian Agent s commission if not included in th F O B Price will be paid in Indian Rupees separately In case no agent is involved please clearly in writing Delivery Period Total bid price for the above quoted items is Rs Terms of payment a 90 payment through Letter of Credit amp balance 10 by Demand Draft Wire Transfer after satisfactory installation and commissioning b For Agency Charges Full payment for agency charges to Indian Agent will be made after receipt satisfactory installation testing amp commissioning of equipment These charges will be paid in Indian Rupees Validity of the bid 180 days from the date of opening of the tender Place Signature Date Name Business Address Affix Rubber Stamp MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in Tender No SUBH 09 EQP 003 09 001 L EE SC Date 1 Tender should be submitted on the schedule to tender and returned with your covering letter in the enclosed form duly signed Tender should be sent in the sealed cover superscribed with Tender Number Description and Due Date and should be addressed to the Asst Registrar MM Indian Institute of Technology P O IIT Powai Bombay 400 076 2 Tend
13. ust be ensured that the offers must be strictly as per our specifications At the same time it must be kept in mind that merely copying our specifications in the quotation OR merely stating compliance to technical specifications shall not make the parties eligible for consideration of the quotation A quotation has to be supported with the printed technical leaflet literature of the quoted model of the item by the quoting manufacturer and the specifications mentioned in the quotation must be reflected supported by the printed technical leaflet literature Therefore the model quoted invariably should be highlighted in the leaflet literature enclosed with the quotation Non compliance of the above shall be treated as incomplete ambiguous and the offer can be ignored without giving an opportunity for clarification negotiation etc to the quoting party The technical bid shall be evaluated for acceptability by the technical committee and may call the tenderers for discussion If necessary the committee may modify the technical specification to suit the IIT Bombay requirement In such case the opportunity shall be given to the participating bidders for submitting the revised bid as per modified specifications if any MATERIALS MANAGEMENT DIVISION Ditect 491 22 2576 8800 2576 8805 Indian Institute of Technology Bombay PE ees Ghee ea i Fax 91 22 2576 8808 Powai Mumbai 400 076 Email armm iitb ac in Website www titb ac in C
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