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IE-703107-MC-EM1 In-Circuit Emulator Option Board UM

1. Bottom View 020 8 54 User s Manual U14481EJ3VOUM APPENDIX A DIMENSIONS 8 HQPACK144SD Unit mm Top View Side View Bottom View Users Manual U14481EJ3VOUM 55 APPENDIX DIMENSIONS 9 NQPACK100SD Unit mm 120 2 Top View 3 S 0 5 x 24 12 0 lt 1 5 D 05 58 _03 57 Slit width Ez TUTO r o xd 4 61 0 Y 0 1 2 5 14 0 0 2 5 Side View l4 o E Nii OOO OOO O dd Y a s 0 18 a 0 5 15 0 0 5 Bottom View 017 0 Lopes 19 0 E 88 BE lt 2 AE 5 E E Ss 5115 y A 0 4 92 0 Projection height 1 8 56 User s Manual U14481EJ3VOUM APPENDIX A DIMENSIONS 10 YQPACK100SD Unit mm
2. 14 1 5 Contents Carton A re 17 1 6 Connection Between IE V850E MC A and IE 703107 MC EM1 18 CHAPTER 2 NAMES AND FUNCTIONS OF 0 0 15 20 2 1 Names and Functions of IE 703107 MC EM1 Components 21 2 2 5 5 A 23 2 2 1 Outline of ClOCk settirigs ott eo metere eat nea et 23 2 22 Clock setting methods teen A e 24 2 3 Operation Mode 5 28 2 4 Power Supply Settings U 29 2 4 1 JP2 setting when emulator operates as stand alone unit 29 25 Emulation Memory 30 2 5 1 Wait setting for emulation memory 30 2 5 2 Cautions related to emulation memory 31 CHAPTER 3 FACTORY SETTINGS ooo 32 CHAPTER 4 CAUTIONS dada 33 4 1 Cautions on Terminating Pins 33 4 2 Notes on Internal RAM 34 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS
3. 00000000000000 00000000000000 User s Manual U14481EJ3VOUM 65 APPENDIX A DIMENSIONS A 2 Conditions for Connecting of In Circuit Emulator Option Board and Conversion Connector The following shows a diagram of the conditions for connecting the in circuit emulator option board and conversion connector Design your system making allowances for conditions such as the form of parts mounted on the target system as shown below 1 V850E MA1 144 pin plastic LQFP fine pitch 20 x 20 Side View In circuit emulator IE V850E MC A In circuit emulator option board IE 703107 MC EM1 Conversion connector 206 26 mm YQGUIDE 7499 YQPACK144SD Target NQPACK144SD Note The YQSOCKET144SDN sold separately can be inserted here to adjust the height height 3 2 mm IE V850E MC A Target system 1E 703107 MC EM1 YQPACK144SD NQPACK144SD YQGUIDE Connection condition diagram 703107 to IE V850E MC A lt 58mm Target system 27 205 mm Remark The connector for the 161 pin plastic FBGA package is under development 66 User s Manual U14481EJ3VOUM APPENDIX A DIMENSIONS 2 V850E MA1 161 pin plastic FBGA 13 13 Side View In circuit emulator IE V850E MC A In ci rcuit emulator option board 703107 Conversion connector 206 26 mm
4. gt CSICE161A1413N02 LSPACK161A1413N01 Target system CSSOCKET161A1413N01N ote2 Notes 1 The CSSOCKET161A1413N01S1 sold separately be inserted here to adjust the height height 3 2 mm 2 This is a target socket without guides Remove suffix N from the part number when a target socket with guides is needed IE V850E MC A Target system 1E 703107 MC EM1 LSPACK161A1413N01 CSSOCKET161A1413N01N YQGUIDE Connection condition diagram 1E 703107 MC EM1 to IE V850E MC A Pin 1 position 5 CSICE161A1413N02 LSPACK161A1413N01 CSSOCKET161A1413N01N LA A 15 7 mm gt 7 LH 4 2 mm c I 1 pt mm Target system 27 205 mm Users Manual U14481EJ3VOUM 67 APPENDIX A DIMENSIONS 3 850 2 100 pin plastic LQFP fine pitch 14 x 14 Side View In circuit emulator IE V850E MC A In ci rcuit emulator option board IE 703107 MC EM1 Conversion connector YP VESUEIMAT MA a YQGUIDE YQPACK100SD Target e mm NQPACK100SD gt Note YQSOCKET100SDN sold separately be inserted here to adjust the height height 3 2 mm IE V850E MC A Target system 36 0 mm 11 5 mm 13 5 mm Y 1E 703107 MC EM1 YQPACK100SD NQPACK100SD YQGUIDE Connection condition diagram
5. Top View 0 5 El E E Jrs BI Side View 27 7 Bottom View 013 4 User s Manual U14481EJ3VOUM APPENDIX DIMENSIONS 11 HQPACK100SD Unit mm Top View 0116 6 00 5 x 24 12 0 Side View Bottom View ma j 013 4 58 User s Manual U14481EJ3VOUM APPENDIX A DIMENSIONS 12 VP V850E MA1 MA2 Unit mm Top View 47 21 1PIN VP V850E MA1 MA2 LIAL Side View 6 1 lo 10 LO DIM s 12 5 User s Manual U14481EJ3V0UM 59 APPENDIX DIMENSIONS 13 CSSOCKET161A1413NO01N Unit mm Top View Side View User s Manual U14481EJ3VOUM 60 APPENDIX A DIMENSIONS 14 CSSOCKET161A1413N01 Unit mm Top View 0000000000 0000 701 1 lt 8 0 Side View 61 User s Manual U14481EJ3VOUM APPENDIX A DIMENSIONS 15 CSSOCKET161A1413N01S1 Unit mm Top View Side View User s Manual U14481EJ3VOUM 62 16 CSICE161A1413N02 Unit mm APPENDIX
6. 35 APPENDIX DIMENSIONS a 48 Corresponding Package Dimensions 48 A 2 Conditions for Connecting of In Circuit Emulator Option Board and Conversion Connector uuu At pa 66 APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION 69 APPENDIX CONNECTORS FOR TARGET 0 1 0 70 Usage LQFP Package UI 70 C 2 Cautions on Handling Connectors LQFP Package 72 Notes on Board Design FBGA Package 73 C 4 Soldering CSSOCKET Main Enclosure Connector to Target Board FBGA Package 74 C 5 Using LSPACK to Mount IC FBGA Package 76 C 6 Connecting In Circuit Emulator FBGA Package 77 8 User s Manual U14481EJ3VOUM Notes on Handling LSPACK CSSOCKET FBGA APPENDIX D INSERTING PLASTIC 5 APPENDIX E REVISION HISTORY User s Manual U14481EJ3VOUM CHAPTER 1 OVERVIEW The 703107 is an option board for the emulator I
7. V850E MA2 100 pin LQFP V850E MA2 100 pin LQFP 020 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP INTOO11 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP 020 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP INTPO21 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP INTP110 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP INTP111 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP User s Manual U14481EJ3VOUM 43 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 6 Corresponding Pin List Pin Equivalent Circuit 6 3 4 Pin Name 1 Pin Name 2 Pin Name 3 Target Device V850E MA1 144 pin LQFP INTP112 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP113 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA
8. o o FR seconds at more E than 183 C Peak 195 C 200 300 400 700 180 pins 0 8 mm pitch e 15 grids 4 peripheral array type a NS Time sec Equipment Air Solder Reflow ARS 301 of Eighteck Tektron Caution e Because the construction of CSSOCKET allows flux and cleaning solvent to remain in the connector do not dip CSSOCKET into flux or clean it to remove flux The same applies when using CSSOCKET with other DIP components as the flux of the DIP component may get into CSSOCKET e To solder the type of CSSOCKET without guide pins correctly position it on the pad of the board e After soldering the CSSOCKET connector it is recommended to solder the guide pins from the bottom side of the board or to secure the connector peripheral parts with resin for reinforcement Use of two component type epoxy resin or a cure type adhesive agent and an adhesive agent for securing the surface mount components is recommended User s Manual U14481EJ3VOUM 75 APPENDIX CONNECTORS FOR TARGET CONNECTION C 5 Using LSPACK to Mount IC FBGA Package 1 2 76 Attach LSPACK to CSSOCKET which has already been soldered using the guide plate spacer and top cover Align the guides of CSSOCKET and LSPACK and attach LSPACK to CSSOCKET Place the guide plate included with models released after November 2000 and spacer in that order on
9. KO 20 20 x 20 20 x 20 x 20 e e 9 9 e 9 e 9 e e e e O 20 x 20 x 20 x KO 20 9 9 0 e e one 20 e 9 e e KO 20 xe 20 O O OOO O 9 9 9 9 9 o9 9 20 x 20 xs xe B O O e e 0 0 o 0 0 OO OCO OPP 09099 0 0 0 0 0 0 0 0 0 0 0 00 0 0 0 e 202020202020202020200020202 OOO CMON e e 0 0000 0 000 0 00 o o o o o o o o o 0 0 000000000 00000000000 000000000 00000000000 0000000000 0000000000 CO O 0 QOO 910 0 QC O g e KA 00000000000000 0 0 0 0 0 O 2222522880 Oo O OO Oo 0 0 0 Oo O OO 0 0 0 0 Oo O OO ma
10. CLKOUT User s Manual U14481EJ3VOUM 25 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 Changing the crystal oscillator OSC mounted on the IE 703107 MC EM1 and using it as the internal clock 1 Remove the crystal oscillator OSC that is mounted on the IE 703107 MC EM1 and mount the oscillator to be used 2 Set as shown in Table 2 3 with the default settings 8 Set the SW1 and CKSEL pins according to the clock mode to be used as shown in Table 2 3 4 Select Internal in the clock source selection area in the configuration dialog box on the integrated debugger ID850 Table 2 3 Settings When Changing Mounted Internal Clock Type of Clock Used Clock Source OSC Crystal JP1 CKSEL Selection Oscillator Setting Pin Change the crystal oscillator Internal Change to other Low level mounted on IE 703107 MC EM1 than 5 000 MHz nono input and use it as the internal clock PP Direct Direct pi High level input Direct Note The input setting to the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a stand alone basis The emulator operates according to the setting of SW1 Figure 2 4 Outline When Changing Mounted Crystal Oscillator and Using It as Internal Clock IE 703107 MC EM1 1 2 shorted 3 4 shorted select 5 6 open Internal hange
11. Direct High level input Direct 2 Change crystal oscillator Internal Change to other PLL Low level OSC mounted on IE 703107 than 5 000 MHz input MC EM1 and use it as the internal clock In irect Direct High level input 3 Use the crystal oscillator on External Crystal oscillator Low level the target system as an can be either PAP input external clock mounted or not mounted Direct High level input Direct Notes 1 Select the clock source in the clock source selection area in the configuration dialog box on the debugger 2 The input setting to the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a stand alone basis The emulator operates according to the setting of Swi 3 When replacing the crystal oscillator on the emulator use an oscillator with the following specifications Power supply voltage 5V Output level CMOS Shape 8 pin type Pin layout Pin 1 NC Pin 4 Pin 5 OUT Pin 8 Caution Settings other than those described above are prohibited 24 User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 1 Using the crystal oscillator OSC mounted on the IE 703107 MC EM1 as the internal clock lt 1 gt Mount
12. O O OO O e e 2 So So Ko So So So So So 55 So So So So So Mo So So Insertion guide a O IE V850E MC A insertion area 19 User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS This chapter describes the names functions and switch settings of components comprising the IE 703107 MC EM1 For the details of the pod jumper and switch positions etc refer to the IE V850E MC IE V850E MC A User s Manual U14487E 20 User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 1 Names and Functions of IE 703107 MC EM1 Components Figure 2 1 IE 703107 MC EM1 Direction of pin 1 of the connector for target connection for target connection Connector for target connection D70F3107 Connector for connecting IE V850E MC A Emulation memory User s Manual U14481EJ3VOUM 21 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 1 Test pins TP1 to TP7 To leave the DMA cycle or refresh cycle in the tracer or cause a break connect these pins to the external logic probe e TP1 GND TP2 REFRQ e TP3 DMAAKO e DMAAK1 e TP5 DMAAK2 e TP6 DMAAK3 e Test pin for product s
13. V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5 7 Pin Equivalent Circuit 7 When external clock is selected 74HC157 gt 7053107 When internal clock is selected x1 Table 5 7 Correspondin
14. V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 2 Corresponding Pin List Pin Equivalent Circuit 2 3 5 Pin Name 1 Pin Name 3 Pin Name 4 Target Device V850E MA1 144 LQFP V850E MA1 161
15. Con D to IE V850E MC A IE 703107 MC EM1 Pin 1 position VP V850E MA1 MA2 lt lt 6 5mm INT E N J Target system YQPACK100SD NQPACK100SD 68 User s Manual U14481EJ3VOUM APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION 1 When directly connecting device to target system connector for target connection is not used Device Target system 2 When connecting device using connector for target connection a LQFP package Fastening screws HQPACK144SD V850E MA1 144 pin LQFP Y HQPACK100SD V850E MA2 100 pin LQFP Device NQPACK144SD V850E MA1 144 pin LQFP NQPACK100SD V850E MA2 100 pin LQFP Target system b FBGA package 29040 4 _____ Device _ LSPACK161A1413N01 174777117777 gt CSSOCKET161A1413N01N User s Manual U14481EJ3VOUM 69 APPENDIX C CONNECTORS FOR TARGET CONNECTION C 1 Usage LQFP Package 1 When mounting NQPACK144SD on target syste
16. LSPACK Align the guide of the spacer with the component hole of LSPACK and the guide plate Noting the position of pin 1 of the IC BGA gently place the IC from the top in the opening at the center of the spacer aligning it with the connector pin position Place the top cover on the spacer The holes at the four corners of the guide plate spacer and top cover must match Secure LSPACK and the top cover using the attached screws Use a dedicated screwdriver to tighten the screws Hold LSPACK on the sides with your fingers so that no stress is applied to the soldered parts of LSPACK and CSSOCKET and sequentially tighten the screws at the four corners The tightening torque should be 0 55 kg f cm 0 054 Nm maximum To remove the top cover from LSPACK loosen and remove the screws of the top cover while holding the cover on sides so that no stress is applied to the soldered parts of LSPACK and CSSOCKET Figure C 7 Mounting of IC Four round head screws 2 cover 4 Guide plate LSPACK CSSOCKET 2 5 0 5 21 Target board Users Manual U14481EJ3VOUM APPENDIX C CONNECTORS FOR TARGET CONNECTION C 6 Connecting In Circuit Emulator FBGA Package CSICE connector Conversion adapter to connect an existing tool supporting QFP and LSPACK Conversion from BGA to QFP Also for conversion to differen
17. gt the target system is used to operate the circuits in the emulator When pins 1 and 2 of JP2 are shorted and 3 and 4 are left open the emulator detects of the target system and automatically selects whether of the target system or the internal power supply of the emulator is to be used 2 When pins 1 and 2 of JP2 are left open and 3 and 4 are shorted the emulator always uses Vpp from the target system With this setting of JP2 the emulator does not operate if the target system is not connected However sneaking of power can be avoided Figure 4 1 Schematic Diagram of Power Supply Flow Target system 703107 1 IE V850E MC HPD70F3107 Emulation CPU Power supply circuit Automatically selected 4 2 Notes on Internal RAM The emulator maps the internal RAM to a 12 KB space of 00 to OxFFFEFFF V850E MA1 internal RAM 4 KB OxFFFCOO0 to OXFFFCFFF V850E MA1 internal RAM 10 KB OxFFFCOO00 to OxFFFE7FF V850E MA2 internal RAM 4 KB OxFFFCOO00 to OXFFFCFFF The target device is mapped as shown above Consequently the higher 8 KB space 0xFFFD000 to OxFFFEFFF or higher 2 KB space OxFFFE800 to OxFFFEFFF of the emulator s 12 KB internal RAM area does not exist in the target device If the higher 8 KB or 2 KB space is accessed the emulator cannot issue a fail safe break It is t
18. torque Excessive tightening may diminish conductivity At this time each pin is fixed inside the plastic wall dividers by the contact pin of the NQPACK144SD or NQPACK100SD and the hold pin of the HQPACK144SD or HQPACK100SD refer to Figure C 3 Thus pins cannot cause a short with pins of neighboring devices Figure C 2 Mounting of Device L V Fastening screws V HQPACK144SD or HQPACK100SD Device NQPACK144SD or NQPACK100SD Target system Figure C 3 NQPACK144SD or NQPACK100SD and Device Pin Hold pin of HQPACK144SD or HQPACK100SD RAE ivider Device Pin Contact pin of NQPACK144SD or NQPACK100SD User s Manual U14481EJ3VOUM 71 APPENDIX CONNECTORS FOR TARGET CONNECTION C 2 Cautions on Handling Connectors LQFP Package 1 2 72 When taking connectors out of the case remove the sponge while holding the main unit When soldering the NQPACK144SD or NQPACK100SD to the target system cover with the HQPACK144SD or HQPACK100SD to protect it against splashing flux Recommended soldering conditions Reflow 240 C 20 seconds max Partial heating 240 C 10 seconds max per pin row Check for abnormal conditions such as resin burr or bent pins before mounting a device on the NQPACK144SD or NQPACK100SD Moreover check that
19. 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 2 Corresponding Pin List Pin Equivalent Circuit 2 2 5 Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device V850E MA1 144 pin LQFP
20. A DIMENSIONS Top View O29 122 65 0 5 x 35 17 5 0 5 C2 Pin 1 direction i D Y 4 2 2 Component hole Side View e Bottom View 0 8 13 10 4 161 Soldering 161 Land diameter 00 5 Resist diameter 00 5 TH not possible 0 8 x 13 10 4 User s Manual U14481EJ3VOUM 63 APPENDIX DIMENSIONS 17 LSPACK161A1413N01 CSICE without device mounting cover Unit mm Top View 00000 1 2 0000000000000 Side View 0000000000 Bottom View O29 zx 22 65 0 8x 13 10 4 Y e li o M 9999 e T 9999 e 0000 8888 0000 e 0 ss 888888 8888 600020 TET MADE IN JAPAN 64 User s Manual U14481EJ3VOUM APPENDIX A DIMENSIONS 18 LSPACK161A1413N01 with device mounting cover Unit mm Top View 129 Side View Bottom View ba
21. Caution Connect carefully so as not to break or bend connector pins lt 1 gt Remove the POD cover lower of the IE V850E MC A lt 2 gt Set the PGA socket lever of the IE 703107 MC EM1 to the OPEN position as shown in Figure 1 5 b lt 3 gt Connect the IE 703107 MC EM1 to the PGA socket at the rear of the POD refer to Figure 1 5 c When connecting position the IE V850E MC A and IE 703107 MC EM1 so that they are horizontal Spacers can be connected to fix the POD refer to APPENDIX D MOUNTING OF PLASTIC SPACER lt 4 gt Set the PGA socket lever of the 703107 to the CLOSE position as shown in Figure 1 5 b lt 5 gt Fix the POD cover lower to the soldered side of the IE 703107 MC EM1 using the nylon rivets supplied with the IE V850E MC A Figure 1 5 Connection Between IE V850E MC A and IE 703107 MC EM1 1 2 a Connection overview Nylon rivets mod cm j o POD cover upper Nylon rivets 703107 IE V850E Pd a C A POD cover Nylon rivets 18 Users Manual U14481EJ3VOUM CHAPTER 1 OVERVIEW Figure 1 5 Connection Between IE V850E MC A and IE 703107 MC EM1 2 2 b PGA socket lever of IE 703107 MC EM1 c Connecting part IE 703107 MC EM1 Pin 1 location
22. MC PS B lt 16 gt AC220 V power cable sold separately included with IE 70000 MC PS B The encircled portions show enlarged figures of the connectors for target connection Users Manual U14481EJ3VOUM CHAPTER 1 OVERVIEW 1 5 Contents in Carton The carton of the IE 703107 MC EM1 contains the main unit a guarantee card a packing list and an accessory bag Make sure that the accessory bag contains this manual and connector accessories In the case of missing or damaged items contact an NEC Electronics sales representative or distributor Figure 1 4 Contents in Carton lt 5 gt IC socket NQPACK144SD lt 4 gt Packing list lt 6 gt IC socket YQPACK144SD lt 3 gt card lt 7 gt IC socket HQPACK144SD lt 8 gt Guide screws YQGUIDE 703107 1 socket NQPACK144SD 1 Accessory bag x 1 IC socket YQPACK144SD 1 Guarantee card x 1 IC socket HQPACK144SD x 1 Packing list x 1 Guide screws YQGUIDE x 4 Check that the accessory bag contains this manual a packing list an external logic probe and a restriction document User s Manual U14481EJ3VOUM 17 CHAPTER 1 OVERVIEW 1 6 Connection Between IE V850E MC A and IE 703107 MC EM1 The procedure for connecting the IE V850E MC A 703107 is described below
23. Manual U14481EJ3VOUM 29 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 5 Emulation Memory This is a substitute memory used to emulate the memory or memory mapped I O on the target system capacity 4 MB The emulation memory is mounted on the IE 703107 MC EM1 2 5 1 Wait setting for emulation memory The data wait address wait and idle state for the emulation memory are set as follows 1 ID850 Select from the following three types on the configuration screen Selection WAIT MASK Wait Type Data wait Emulation Memory Access Fixed to 0 waits External Memory Access Depends DWC0 1 register setting WAIT signal masked Address wait Fixed to 0 waits Depends on ASC register setting Idle state Fixed to 0 cycles Depends on BCC register setting 1 WAIT ACCESS Data wait Fixed to 1 wait Depends DWCO 1 register setting and WAIT signal status Address wait Fixed to 0 waits Depends on ASC register setting Idle state Fixed to 0 cycles Depends on BCC register setting TARGET WAIT 2 MULTI Data wait Depends on DWC0 register setting However 1 wait when set to O waits Depends on DWCO 1 register setting and WAIT signal status Address wait Fixed to O waits Depends on ASC register setting Idle state Depends on BCC register setting Depends on BCC register setting Select mask or unmask for WAIT and EMWAIT using the
24. NEC Electronics products are classified into the following three quality grades Standard Special and Specific The Specific quality grade applies only to NEC Electronics products developed based on a customer designated quality assurance program for a specific application The recommended applications of an NEC Electronics product depend on its quality grade as indicated below Customers must check the quality grade of each NEC Electronics product before using it in a particular application Standard Computers office equipment communications equipment test and measurement equipment audio and visual equipment home electronic appliances machine tools personal electronic equipment and industrial robots Special Transportation equipment automobiles trains ships etc traffic control systems anti disaster Systems anti crime systems safety equipment and medical equipment not specifically designed for life support Specific Aircraft aerospace equipment submersible repeaters nuclear reactor control systems life support systems and medical equipment for life support etc The quality grade of NEC Electronics products is Standard unless otherwise expressly specified in NEC Electronics data sheets or data books etc If customers wish to use NEC Electronics products in applications not intended by NEC Electronics they must contact an NEC Electronics sales representative in advance to determine NEC Electronics will
25. Pinmask command Selection WAIT Mask EMWAIT Mask Wait Type Data wait Emulation Memory Access Fixed to O waits External Memory Access Depends on DWCO 1 register setting WAIT signal masked Address wait Fixed to O waits Depends on ASC register setting Idle state Fixed to 0 cycles Depends on BCC register setting WAIT Unmask EMWAIT Mask Data wait Fixed to 1 wait Depends on DWCO 1 register setting and WAIT signal status Address wait Fixed to O waits Depends on ASC register setting Idle state Fixed to 0 cycles Depends on BCC register setting WAIT Unmask EMWAIT Unmask 30 Data wait Depends DWCO 1 register setting However 1 wait when set to O waits Depends on DWCO register setting and WAIT signal status Address wait Fixed to O waits Depends on ASC register setting Idle state Depends on BCC register setting User s Manual U14481EJ3VOUM Depends on BCC register setting CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 5 2 Cautions related to emulation memory 1 Number of data waits required for emulation memory access The number of data waits required to be inserted for emulation memory access varies depending on the operating frequency of the emulator 4 MHz lt Operating frequency lt 25 MHz 0 waits 25 MHz lt Operating frequency lt 40 MHz 1 wait 40 MHz lt Operating frequency 2 waits 2 Bus sizing
26. V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP130 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP131 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP132 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP133 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP120 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP121 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP122 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP INTP123 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 6 Corresponding Pin List Pin Equivalent Circuit 6 4 4 Pin Name 1 Pin Name 2 Pin Name 3 Target Device V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP
27. but Renesas Electronics does not warrant that such information is error free Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein Renesas Electronics products are classified according to the following three quality grades Standard High Quality and Specific The recommended applications for each Renesas Electronics product depends on the product s quality grade as indicated below You must check the quality grade of each Renesas Electronics product before using it in a particular application You may not use any Renesas Electronics product for any application categorized as Specific without the prior written consent of Renesas Electronics Further you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as Specific or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics The quality grade of each Renesas Electronics product is Standard unless otherwise expressly specified in a Renesas Electronics data sheets or data books etc Standard Computers of
28. pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 2 Corresponding Pin List Pin Equivalent Circuit 2 4 5 Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device V85
29. pin LQFP AE Figure 5 6 Pin Equivalent Circuit 6 to 07 P10 to 13 P20 to 27 P30 to 37 P40 to 45 P50 to 52 2909107 P70 to 77 AVDD Table 5 6 Corresponding Pin List Pin Equivalent Circuit 6 1 4 Pin Name 1 Pin Name 2 Pin Name 3 Target Device Pin No V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP 00 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP 001 V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP 42 Users Manual U14481EJ3VOUM Table 5 6 Corresponding Pin List Pin Equivalent Circuit 6 2 4 Pin Name 1 Pin Name 2 Pin Name 3 DMARQO INTP100 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Target Device V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP DMARQ1 INTP101 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP DMARQ2 INTP102 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA INTP103 V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA
30. the 5 000 MHz crystal oscillator mounted at factory shipment in the OSC socket of the IE 703107 MC EM1 with the default settings lt 2 gt Change JP1 as indicated in Table 2 2 with the default settings lt 3 gt Set the SW1 and CKSEL pins according to the clock mode to be used as shown in Table 2 2 4 To start up the integrated debugger ID850 select Internal in the clock source selection area in the configuration dialog box clock selection in emulator Table 2 2 Settings When Using Mounted Internal Clock Type of Clock Used Clock Source OSC Crystal JP1 CKSEL Selection Oscillator Setting Pintos Use crystal oscillator OSC Internal Factory setting Low level mounted on IE 703107 MC EM1 5 000 MHz ono input as internal clock yar in Direct IM High level input Direct Note The input setting to the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a stand alone basis The emulator operates according to the setting of SW1 Figure 2 3 Outline When Using Mounted Internal Clock IE 703107 MC EM1 1 2 shorted 3 4 shorted select 5 6 open Internal Mounted 7 8 open on ID850 crystal oscillator T P1 OSC 5 MHz Target system Crystal oscillator IE V850E MC A SW1 PLL direct mode switching Emulation
31. to LSPACK protective tape polyimide tape is attached for protection from flux splashing during reflow soldering Do not remove this tape until reflow soldering is completed 3 Place CSSOCKET on the target board with its guide pins inserted into the holes for the guides on the target board as shown in Figure C 5 Confirm that the pad on the board and CSSOCKET are correctly positioned 4 Mounting CSSOCKET lt 1 gt The dimensions of CSSOCKET are the same as the actual IC package lt 2 gt Solder CSSOCKET at a temperature of 210 C or more and for 30 to 60 seconds as indicated in the table below lt 3 gt Table C 1 shows the recommended reflow conditions Figure C 6 shows an example of the mounting profile of CSSOCKET Table C 1 Recommended Reflow Conditions Surface Temperature of CSSOCKET Connector Preheating 150 to 180 C 180 seconds Heating 210 C or more 30 to 60 seconds b Remove the protective tape from the surface Figure C 5 Mounting of CSSOCKET on Target Board CSSOCKET Target board z Caution Do not clean CSSOCKET to remove flux 74 User s Manual U14481EJ3VOUM APPENDIX C CONNECTORS FOR TARGET CONNECTION Figure C 6 Example of Mounting Profile of CSSOCKET CSSOCKET180A Dimensions 13 x 13 mm 1 KET bottom side soldering side Any point on board CSSOCKET top side o m o
32. 0E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 2 Corresponding Pin List Pin Equivalent Circuit 2 5 5 Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device V850E MA1 1
33. 0E MC A to a personal computer These boards are inserted in the expansion slot of the personal computer IE 70000 PCI IF A For PCI bus IE 70000 CD IF A For PCMCIA socket AC adapter dedicated to NEC Electronics in circuit emulators Socket for conversion into foot pattern of FBGA when the 161 pin FBGA package is used Socket for conversion into foot pattern of 100 pin LQFP when the V850E MA2 is used For further information contact Daimaru Kogyo Co Ltd Tokyo Electronics Department TEL 81 3 3820 7112 Osaka Electronics Department TEL 81 6 6244 6672 For further information contact Naito Densei Machida Mfg Co Ltd TEL 81 45 475 4191 Users Manual U14481EJ3VOUM 11 CHAPTER 1 OVERVIEW 1 2 Hardware Specifications When Connected to IE V850E MC A Table 1 1 Hardware Specifications Parameter Target device V850E MA1 HPD703103AGJ UEN HPD703105AGJ xxx UEN 4PD703106AGJ xxx UEN 4PD703107AGJ oo UEN HPD70F3107AGJ UEN HPD7031 06AF 1 xxx EN4 HPD703107AF 1 xxx EN4 HPD70F3107AF1 EN4 4PD703106AGJ A xxx UEN 4PD703107AGJ A xxx UEN HPD70F3107AGUJ A xxx UEN V850E MA2 4uPD703108GC 8EU Target board interface voltage Voo AVpp AVner 3 3 50 3 V Vss AVss CVss 0 Maximum operation frequency 50 MHz 40 MHz when the in circuit emulator is used for the V850E MA2 External dimensions Height 15mm refer to APPENDIX A DIMENSIONS Length 206 mm
34. 3107 MC EM1 does not operate Figure 2 5 Outline When Using Crystal Oscillator on Target System as External Clock 703107 1 2 shorted 3 4 shorted select 5 6 open External 7 8 open on ID850 Target system 1 Pr v Crystal oscillator IE V850E MC A Swi PLL direct mode switching Emulation CPU HPD70F3107 CKSEL CLKOUT User s Manual U14481EJ3VOUM 27 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 3 Operation Mode Settings The IE 703107 MC EM1 supports the following operation modes equivalent to those of the actual device These operation modes are selected on the debugger Target Device Operation Mode Selection ID850 V850E MA1 Single chip mode 0 MODE02 Single chip mode 1 MODE03 ROMless mode 0 MODEOO ROMless mode 1 MODE01 V850E MA2 ROMless mode 0 MODEOO ROMless mode 1 MODE01 Note Make settings in accordance with the operation mode to be used in the mask setting area of the configuration dialog box that opens when the debugger ID850 is started Caution To operate the emulator in the ROMless mode be sure to map the emulation memory or the memory on the target system from address OH Note that the IE 703107 MC EM1 cannot emulate the MODE pin because the level input to the MODE pin is realized by the pin mask function of the debugger For
35. 4 a It is also recommended to apply the resist on the through hole pad In addition be sure to apply resist between pads as shown in Figure C 5 b Figure C 4 Application of Resist a Through hole b Between pads Pad Via through hole ar es Pad Ee N Resist fh Slanted lines indicate a A Resist When connecting pads to each other in a pattern for a power supply or GND the solder may be hard to melt if the pattern is too wide because heat diffuses To use CSSOCKET with guides a component hole or through hole is necessary For the position and dimensions of the hole refer to the attached drawing The guide pin may be of stainless steel which cannot be soldered or may be gold plated which can be soldered A stainless steel guide pin only serves as a guide but a gold plated guide pin can be soldered from the rear side of the target board if the guide hole is a through hole This securely attaches the connector and board and mitigates the stress applied on the connector User s Manual U14481EJ3VOUM 73 APPENDIX CONNECTORS FOR TARGET CONNECTION C 4 Soldering CSSOCKET Main Enclosure Connector to Target Board FBGA Package 1 Apply cream solder to the BGA pad of the target board The thickness of the cream solder on the pad should be 100 to 150 wm Too thick cream solder may cause short circuiting 2 On the part of CSSOCKET to be connected
36. 44 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP DMAAKO V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP DMAAK1 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP DMAAK2 V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP DMAAK3 V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP CLKOUT BUSCLK V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP User s Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5 3 Pin Equivalent Circuit 3 Em
37. 44SD or NQPACK100SD Target system Remark NQPACK144SD or NQPACK100SD Connector for target connection HQPACK144SD or HQPACK100SD Cover for device mounting User s Manual U14481EJ3VOUM APPENDIX C CONNECTORS FOR TARGET CONNECTION 2 When mounting device Caution Check for abnormal conditions such as resin burr or bent pins before mounting a device on the 1 2 NQPACK144SD NQPACK100SD Moreover check that the hold pins of the HQPACK144SD or HQPACK100SD are not broken or bent before mounting the HQPACK144SD or HQPACK100SD on top of the device If there are broken or bent pins fix them with a thin flat plate such as a blade Make sure that the NQPACK144SD or NQPACK100SD is clean and the device pins are parallel flat before mounting a device on the NQPACK144SD or NQPACK100SD Then after mounting the NQPACK144SD or NQPACK100SD to the target board fix the device and the HQPACK144SD or HQPACK100SD refer to Figure C 2 Using the screws provided with the HQPACK144SD or HQPACK100SD four locations M2 x 6 mm secure the HQPACK144SD HQPACK100SD device and NQPACK144SD NQPACK100SD Tighten the screws in a crisscross pattern with the screwdriver provided or a driver with a torque gauge avoid tightening only one screw strongly Tighten the screws with 0 55 kg f cm 0 054 Nm max
38. 8 Users Manual U14481EJ3VOUM APPENDIX DIMENSIONS 2 SC 144SDN Unit mm To 90000000 00000090 EO o e Oo User s Manual U14481EJ3VOUM 49 APPENDIX DIMENSIONS 3 SC 100SDN Unit mm Oo 000000 90000000 O Y 50 User s Manual U14481EJ3VOUM 4 SWEX 100SD 1 Unit mm 48 APPENDIX A DIMENSIONS 29548 mem Red Black He e 45 Ground Wire User s Manual U14481EJ3VOUM 51 5 SWEX 144SD 1 Unit mm 52 APPENDIX A DIMENSIONS 29548 144SD 1 Ground Wire User s Manual U14481EJ3VOUM ASP L X3M ea IN JAPAN APPENDIX A DIMENSIONS 6 NQPACK144SD Unit mm Top View Side View Bottom View 4 2 0 Height of projection1 8 Users Manual U14481EJ3VOUM 53 APPENDIX A DIMENSIONS 7 YQPACK144SD Unit mm Top View 1110001122 22 0 7 0 i 4 M Aaa 5 Y x R R Side View
39. E V850E MC A By connecting the lE 703107 MC EM1 to IE V850E MC A hardware and software can be debugged efficiently in system development using the V850E MA1 and V850E MA2 In this manual the basic setup sequences and switch settings of the IE 703107 MC EM1 when connecting it to the IE V850E MC A are described For the names and functions of the parts of the IE V850E MC A and for the connection of elements refer to the IE V850E MC IE V850E MC A User s Manual U14487E which is a separate volume 10 Users Manual U14481EJ3VOUM CHAPTER 1 OVERVIEW 1 4 Hardware Configuration 1 hardware In circuit emulator IE V850E MC A Notes 1 Option board IE 703107 MC EM1 IE V850E MC A can be used as in circuit emulator for V850E MA1 and V850E MA2 by adding this board Separately sold hardware Extension probes SC xxxSDN Note 1 SWEX xxxSD 1Nete PC interface boards 70000 A IE 70000 CD IF A Power adapter IE 70000 MC PS B Conversion socket for V850E MA1 161 pin FBGA CSSOCKET161A1413N01NMote 1 55 16141413 0151 LSPACK161A1413N01Note 1 CSICE161A1413N02 ote 1 YQGUIDEN ete 1 Conversion socket for V850E MA2 100 pin LQFP VP V850E MA1 MA2Note 2 NQPACK100SD te 1 YQPACK100SD ete 1 HQPACK100SD te 1 YQGUIDE 1 General purpose extension probes made by TOKYO ELETECH CORPORATION SC Flexible probe SWEX Coaxial probe These boards are used to connect the IE V85
40. IE 703107 MC EM 1 this product 7 External logic probe included with IE 703107 MC EM1 8 Extension probe SC 144SDN SWEX 144SD 1 sold separately 9 Guide screws YQGUIDE included 10 IE connector for 144 pin LQFP YQPACK144SD included 11 Target connection socket for 144 pin LQFP NQPACK144SD included 12 Cover for mounting device in 144 pin LOFP HQPACK144SD included 13 Power adapter IE 70000 MC PS B sold separately 14 AC100 V power cable sold separately included with IE 70000 MC PS B 15 AC220 V power cable sold separately included with IE 70000 MC PS B 2 The encircled portions show enlarged figures of the connectors for target connection 14 Users Manual U14481EJ3VOUM CHAPTER 1 OVERVIEW Figure 1 2 System Configuration V850E MA1 161 Pin FBGA i 1 14 a lt 15 gt 2 V850E MA1 161 pin FBGA lt gt lt 16 gt 17 lt 14 gt lt 15 gt 1 Target system lt 11 gt lt 16 gt lt 17 gt lt 10 gt lt 11 gt Target lt 9 gt LA 13 acie system Target system Remarks 1 lt 1 gt Personal computer PC 9800 series PC AT or compatible lt 2 gt Debugger sold separately device file lt 3 gt PC interface board IE 70000 PCI IF A IE 70000 CD IF A sold separately 4 interface cable i
41. MC A to 1 2 Hardware Specifications When Connected to IE V850E MC A Change of 1 3 Function Specifications When Connected to IE V850E MC A to 1 3 System Specifications of IE 703107 MC EM1 When Connected to IE V850E MC A Change of Figure 1 1 System Configuration to Figure 1 1 System Configuration V850E MA1 144 Pin LQFP Addition of Figure 1 2 System Configuration V850E MA1 161 Pin FBGA Addition of Figure 1 3 System Configuration V850E MA2 100 Pin LQFP 1 5 Contents in Carton Addition and modification of description Modification of Figure 1 4 Contents in Carton Modification of Figure 1 5 Connection Between IE V850E MC A and IE 703107 MC EM1 1 2 Applied to CHAPTER 1 OVERVIEW Modification of Figure 2 1 IE 703107 MC EM1 Addition and modification of description in 2 1 6 to 10 2 2 Clock Settings Addition and modification of description Addition of Figure 2 2 Outline of Clock Settings Change of Table 2 1 Clock Setting When the Emulator is Used as a Stand Alone Unit to Table 2 1 List of Hardware Settings for Each Clock Setting Change of Table 2 2 Clock Setting When the Emulator is Used in Target System Connection to Table 2 2 Settings When Using Mounted Internal Clock Addition of Figure 2 3 Outline When Using Mounted Internal Clock Addition of Table 2 3 Settings When Changing Mounted Internal Clock Addition of Figure 2 4 Outline When Changing Mount
42. Make the bus sizing 16 bits set 5 0 of BSC register to 1 An 8 bit bus cannot be used 3 WAIT pin The number of data waits for the emulation memory is not affected by the WAIT pin 4 Address wait Address waits cannot be inserted in the emulation memory When address waits need to be inserted set as follows Number of address waits Number of data waits Number of data waits for CS for external memory or for external memory or space of emulation memory externa external I O This setting is effective to make the access speed to the emulation memory equal to that of the external memory or external I O to measure the performance etc For how to insert waits in the emulation memory refer to 2 5 1 Wait setting for emulation memory User s Manual U14481EJ3VOUM 31 Item CHAPTER 3 FACTORY SETTINGS Setting Remark All settings other than those set in the factory are prohibited Detects the power of the target system and automatically selects whether is supplied from the internal power supply of the emulator or from the target system m IRECT Set to PLL mode 32 5 000 MHz crystal oscillator is mounted The frequency can be varied by replacing the crystal oscillator User s Manual U14481EJ3VOUMOO CHAPTER 4 CAUTIONS 4 1 Cautions on Terminating Pins The pins that perform special processing in the emulator are expla
43. To our customers Old Company Name in Catalogs and Other Documents On April 1 2010 NEC Electronics Corporation merged with Renesas Technology Corporation and Renesas Electronics Corporation took over all the business of both companies Therefore although the old company name remains in this document it is a valid Renesas Electronics document We appreciate your understanding Renesas Electronics website http www renesas com April 1 2010 Renesas Electronics Corporation Issued by Renesas Electronics Corporation http www renesas com Send any inquiries to http www renesas com inquiry 5 5 10 11 12 Notice All information included in this document is current as of the date this document is issued Such information however is subject to change without any prior notice Before purchasing or using any Renesas Electronics products listed herein please confirm the latest product information with a Renesas Electronics sales office Also please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website Renesas Electronics does not assume any liability for infringement of patents copyrights or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document No license express implied or otherwise is
44. Width 96 mm Power consumption 9 1 W Max Weight Remark indicates ROM code suffix Extremely lightweight and compact O OOO The following pins can be masked RESET NMI WAIT HLDRQ STOP 190 g Higher equivalence with target device can be achieved by omitting buffer between signal cables External data of 8 bits can be traced by connecting an external logic probe included 12 User s Manual U14481EJ3V0UM CHAPTER 1 OVERVIEW 1 3 System Specifications of IE 703107 MC EM1 When Connected to IE V850E MC A Table 1 2 System Specifications of IE 703107 MC EM1 When Connected to IE V850E MC A Emulation memory capacity Parameter Internal ROM Specification 1 MB Max External memory 4 MB Max Execution pass detection coverage Internal ROM 1 MB Max Program execution function Real time execution function Go execution from cursor position automatic go execution up to cursor position restart return out Non real time execution function Step in next over slow motion Break function Event detection break software break forced break break via come function break on condition met during step execution failsafe break Trace function Trace condition All trace section trace qualify trace Memory capacity 168 bits x 32 K frames Other functions Mapping function event function snapshot function stu
45. b function register manipulation function memory manipulation function time measurement function real time RAM sampling function Caution Some of the functions may not be supported depending on the debugger used User s Manual U14481EJ3VOUM 13 CHAPTER 1 OVERVIEW 1 4 System Configuration The system configuration when connecting the IE 703107 MC EM1 to the IE V850E MC A which is then connected to a personal computer PC 9800 series PC AT or compatible is shown below e V850E MA1 144 LQFP Refer to Figure 1 1 e V850E MA1 161 FBGA Refer to Figure 1 2 e V850E MA2 100 pin LQFP Refer to Figure 1 3 Figure 1 1 System Configuration V850E MA1 144 Pin LQFP i Target system lt 10 gt lt 11 gt Cua 01 lt 12 gt 2 12 V850E MA1 lt 1 gt lt 2 gt 144 pin LQFP a 12 emm Target lt 11 gt system Target system Remarks 1 1 Personal computer PC 9800 series PC AT or compatible lt 2 gt Debugger sold separately device file lt 3 gt PC interface board IE 70000 PCI IF A IE 70000 CD IF A sold separately lt 4 gt PC interface cable included with IE V850E MC A 5 In circuit emulator IE V850E MC A sold separately lt 6 gt In circuit emulator option board
46. crystal 7 8 open on ID850 oscillator OSC other than 5 MHz Target system T P1 C Crystal oscillator IE V850E MC A SW1 PLL direct mode switching Emulation CPU HPD70F3107 26 User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 3 Using the target system crystal oscillator as an external clock lt gt Set JP1 as shown in Table 2 5 with the default setting lt 2 gt Set the SW1 and CKSEL pins according to the clock mode to be used as shown in Table 2 5 3 Select External in the clock source selection area in the configuration dialog box on the integrated debugger ID850 Table 2 4 Settings When Using External Clock Type of Clock Used Clock Source OSC Crystal JP1 CKSEL Selection Oscillator Setting Pin Use crystal oscillator on target External Crystal oscillator Low level System as external clock can be either input mounted or not rr IM mounted Direct E High level input Direct Note The input setting to the CKSEL pin is made only when a target system is connected Leave this pin open when operating the emulator on a stand alone basis The emulator operates according to the setting of SW1 Caution Be sure to input a square wave to the X1 pin When a clock generated by a crystal ceramic resonator is used the IE 70
47. ctions and the connection of parts refer to the IE V850E MC IE V850E MC A User s Manual U14487E which is a separate volume To understand the basic specifications and operation methods broadly Read this manual in the order listed in CONTENTS To know the operation methods and command functions of the IE V850E MC A and IE 703107 MC EM1 Read the user s manual of the debugger Separate volume that is used The mark shows major revised points Note Footnote for item marked with Note in the text Caution Information requiring particular attention Remark Supplementary information Numeral representations Binary gt gt or xxxxB Decimal Hexadecimal gt Prefixes representing the power of 2 address space memory capacity K kilo 2 1024 M mega 2 1024 User s Manual U14481EJ3VOUM Terminology Target device This is the device to be emulated Target system The system user built system to be debugged This includes the target program and hardware configured by the user The meanings of terms used in this manual are listed below Related Documents When using this manual refer to the following manuals The related documents indicated in this publication may include preliminary versions However preliminary versions are not marked as such O Documents related to development tools user s manuals Product Name IE V850E MC IE V850E MC A In C
48. e it in a location where it is not subject to direct sunlight and the temperature is 40 C or below Protective tape is attached to CSSOCKET for protection from flux splashing during reflow soldering Do not remove this tape until reflow soldering is completed Recommended reflow conditions Surface temperature of CSSOCKET Preheating 150 to 180 C 180 seconds Heating 210 C or more 30 to 60 seconds Because the construction of CSSOCKET allows flux and cleaning solvent to remain in the connector do not dip CSSOCKET into flux or clean it to remove flux The same applies when using CSSOCKET with other DIP components as the flux of the DIP component may get into CSSOCKET To secure LSPACK with screws use a dedicated screwdriver or torque driver to tighten the screws at four places The tightening torque should be 0 55 kg f cm 0 054 Nm maximum Do not tighten one screw too much as it may cause a faulty contact After soldering the CSSOCKET it is recommended to solder the guide pins from the bottom side of the board or to secure the connector peripheral parts with resin for reinforcement To use CSSOCKET between CSSOCKET LSPACK for stacking exercise care that the pins of CSSOCKET for stacking are not bent Use LSPACK CSSOCKET as connector of evaluation 10 LSPACK CSSOCKET must not be used in an environment subject to constant shock or vibration 11 is assumed that this product is used for development and evaluati
49. ed Crystal Oscillator and Using It as Internal Clock Addition of Table 2 4 Settings When Using External Clock Addition of Figure 2 5 Outline When Using Crystal Oscillator on Target System as External Clock Modification of 2 3 MODE Pin Setting to 2 3 Operation Mode Settings Addition and modification of description in 2 4 Power Supply Settings Addition of 2 5 Emulation Memory CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS Addition and modification of description in CHAPTER 3 FACTORY SETTINGS CHAPTER 3 FACTORY SETTINGS Addition and modification of description in CHAPTER 4 CAUTIONS User s Manual U14481EJ3VOUM CHAPTER 4 CAUTIONS APPENDIX E REVISION HISTORY Edition 2nd edition Major Revision from Previous Edition Addition of CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS 2 2 Applied to CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS A 1 Corresponding Package Dimensions e Modification of 1 e Addition of 3 to 5 and 9 to 18 A 2 Conditions for Connecting of In Circuit Emulator Option Board and Conversion Connector e Addition of 1 to 3 APPENDIX A DIMENSIONS Change of 3 Connection between emulator and target system to 2 When connecting device using connector for target connection b FBGA package APPENDIX B EXAMPLE OF USE OF CONNECTOR FOR TARGET CONNECTION Addition and modificat
50. f clock settings The following three clock setting methods are available For details refer to 2 2 2 Clock setting methods 1 Use the crystal oscillator mounted on the IE 703107 MC EM1 as the internal clock 2 Change the crystal oscillator mounted on the IE 703107 MC EM1 and use it as the internal clock 3 Use the crystal oscillator on the target system as an external clock Caution When using an external clock input a square wave to the X1 pin When a clock generated by a crystal ceramic resonator is used the IE 703107 MC EM1 does operate Figure 2 2 Outline of Clock Settings 1E 703107 MC EM1 Crystal oscillator can be changed Switching internal external clock OSC Target system E O Crystal oscillator IE V850E MC A SW1 PLL direct mode Emulation CPU switching 70 107 CKSEL CLKOUT User s Manual U14481EJ3VOUM 23 CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 2 2 Clock setting methods A list of the hardware settings for each clock setting is shown below Table 2 1 List of Hardware Settings for Each Clock Setting Type of Clock Used Clock Source OSC Crystal JP1 Setting Selection Oscillator Pin 1 Use crystal oscillator OSC Internal Factory setting Low level mounted on IE 703107 MC 5 000 MHz Pala input EM1 as internal clock ik irect
51. fice equipment communications equipment test and measurement equipment audio and visual equipment home electronic appliances machine tools personal electronic equipment and industrial robots High Quality Transportation equipment automobiles trains ships etc traffic control systems anti disaster systems anti crime systems safety equipment and medical equipment not specifically designed for life support Specific Aircraft aerospace equipment submersible repeaters nuclear reactor control systems medical equipment or systems for life support e g artificial life support devices or systems surgical implantations or healthcare intervention e g excision etc and any other applications or purposes that pose a direct threat to human life You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics especially with respect to the maximum rating operating supply voltage range movement power voltage range heat radiation characteristics installation and other product characteristics Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges Although Renesas Electronics endeavors to improve the quality and reliability of its products semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions unde
52. g Pin List Pin Equivalent Circuit 7 Pin Name 1 Package Pin No V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP Figure 5 8 Pin Equivalent Circuit 8 When SW1 PLL is selected CKSEL 4 PD70F3107 33 kO When SW1 DIRECT is selected 33V 33 CKSEL PD70F3107 Table 5 8 Corresponding Pin List Pin Equivalent Circuit 8 Pin Name 1 Package Pin No V850E MA1 144 pin LQFP CKSEL V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP 46 Users Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5 9 Pin Equivalent Circuit 9 MODEO 3 kQ Table 5 9 Corresponding Pin List Pin Equivalent Circuit 9 Pin Name 1 Package V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP Figure 5 10 Pin Equivalent Circuit 10 3 3 BEES MODE1 Table 5 10 Corresponding Pin List Pin Equivalent Circuit 10 Pin Name 1 Package Pin No V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 LQFP User s Manual U14481EJ3VOUM 47 APPENDIX A DIMENSIONS A 1 Corresponding Package Dimensions 1 IE V850E MC A IE 703107 MC EM1 Unit mm Top view E Pin 1 direction Side view IE V850E MC A 1E 703107 MC EM1 Bottom view 4
53. granted hereby under any patents copyrights or other intellectual property rights of Renesas Electronics or others You should not alter modify copy or otherwise misappropriate any Renesas Electronics product whether in whole or in part Descriptions of circuits software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples You are fully responsible for the incorporation of these circuits software and information in the design of your equipment Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits software or information When exporting the products or technology described in this document you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military including but not limited to the development of weapons of mass destruction Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture use or sale is prohibited under any applicable domestic or foreign laws or regulations Renesas Electronics has used reasonable care in preparing the information included in this document
54. herefore necessary to set an access break in advance 34 Users Manual U14481EJ3VOUM CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS This chapter shows the internal equivalent circuits of the emulator signals to be connected to the target system Some pins cannot be emulated because of the internal processing of the emulator refer to CHAPTER 4 CAUTIONS The equivalent circuits are shown in Figures 5 1 to 5 10 Tables 5 1 to 5 10 show lists of the pins corresponding to the respective equivalent circuits Figure 5 1 Pin Equivalent Circuit 1 5V 5V ES PC358 IE V850E MC A LED Target MA1_VDD5 Emulation CPU LL PD70F3107 Table 5 1 Corresponding Pin List Pin Equivalent Circuit 1 Pin Name 1 Target Device Pin No V850E MA1 144 LQFP 8 27 37 47 81 98 112 124 134 V850E MA1 161 FBGA A12 C6 C8 F4 L6 F12 93 K14 V850E MA2 100 pin LQFP 11 33 55 83 93 Figure 5 2 Pin Equivalent Circuit 2 PDLO to 15 PAHO to 9 PCTO and 1 PCT4 to 7 PCDO to 3 PALO to 15 50 to 7 PBDO to 3 PCMO to 5 User s Manual U14481EJ3VOUM 35 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Table 5 2 Corresponding Pin List Pin Equivalent Circuit 2 1 5 Pin Name 1 Pin Name 2 Pin Name 3 Pin Name 4 Target Device V850E MA1 144 LQFP V850E MA1 161 pin FBGA V850E MA2
55. hipment inspection 2 SW1 This is a switch for clock mode switching for details refer to 2 2 Clock Settings 3 JP1 This is a jumper for switching the clock supply source for details refer to 2 2 Clock Settings 4 JP2 This is a jumper for switching the power supply for details refer to 2 4 Power Supply Settings 5 CN1 Connects the external logic probe included 6 LD1 CKSEL Green This LED indicates the level input to the CKSEL pin If the target system is not connected whether this LED lights or not is determined by the setting of SW1 LED Status When Used as Stand Alone Unit When Used Connected to Target System Lit SW1 DIRECT The CKSEL signal from the target system is high Extinguished SW1 PLL The CKSEL signal from the target system is low 7 LD2 RUN Yellow This LED indicates whether the program is under execution LED Status Meaning Lit User program is being executed Extinguished User program is halted 8 Connector for IE V850E MC A connection This is a connector for connecting the IE V850E MC A 9 Connector for target connection This is a connector for connecting the target system or the extension probe 10 Emulation memory This is a memory that replaces the memory memory mapped I O on the target system for details refer to 2 5 Emulation Memory 22 User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 2 Clock Settings 2 2 1 Outline o
56. how to set the pins on the target system refer to the V850E MA1 Hardware User s Manual U14359E or V850E MA2 Hardware User s Manual U14980E 28 User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 2 4 Power Supply Settings The power supply is set by using JP2 2 4 4 JP2 setting when emulator operates as stand alone unit When JP2 is set as shown in Figure 2 6 the IE 703107 MC EM1 detects the power on the target system side and automatically selects whether Voo is supplied from the internal power supply of the emulator or from the target system with the default settings Caution If the JP2 setting is incorrect the emulator may be damaged Figure 2 6 Setting of JP2 for Automatic Selection of Power JP2 Note 2 gs 4 1 De Set to 1 2 shorted 3 4 open Note A relay is used for power selection Depending on the combination with the target system the relay repeatedly turns ON OFF when the power to the target system is turned OFF issuing a sound continuously In this case make the setting shown in Figure 2 7 Caution If the JP2 setting is incorrect the emulator may be damaged Figure 2 7 Setting of JP2 to Use Power from Target System JP2 sb Set to 1 2 open 3 4 shorted Figure 2 7 shows the setting of JP2 to supply power from the target system to With this setting however note that the emulator does not operate when the target system is not connected Users
57. ined below For detailed circuit configuration refer to CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS 1 Pins that cannot be emulated The following pins cannot be emulated because they are left open inside the emulator or connected to 3 3 V or GND via resistor Evaluate these pins by using the target device Table 4 1 Pins That Cannot Be Emulated Pin Name 1 Target Device V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP 2 X1 pin The X1 pin is pulled down using 33 kQ when an external clock is selected Because the external clock is input to the clock generator via 74HC157 a delay time of up to 13 2 ns is generated This pin is pulled down using 33 kQ and is left open when the internal clock is selected 3 CKSEL pin The CKSEL pin can be pulled up or down depending on the setting of SW1 It is pulled down using 33 when PLL is selected by SW1 This pin is pulled up using 33 when DIRECT is selected Users Manual U14481EJ3VOUM 33 CHAPTER 4 CAUTIONS 4 Voo pin lt
58. ingness to support a given application Note 1 NEC Electronics as used in this statement means NEC Electronics Corporation and also includes its majority owned subsidiaries 2 NEC Electronics products means any product developed or manufactured by or for NEC Electronics as defined above M8E 02 11 1 Users Manual U14481EJ3VOUM Regional Information Some information contained in this document may vary from country to country Before using any NEC Electronics product in your application please contact the NEC Electronics office in your country to obtain a list of authorized representatives and distributors They will verify Device availability Ordering information Product release schedule Availability of related technical literature Development environment specifications for example specifications for third party tools and components host computers power plugs AC supply voltages and so forth Network requirements In addition trademarks registered trademarks export restrictions and other legal issues may also vary from country to country GLOBAL SUPPORT http www necel com en support support html NEC Electronics America Inc U S NEC Electronics Europe GmbH Electronics Hong Kong Ltd Santa Clara California Duesseldorf Germany Hong Kong Tel 408 588 6000 Tel 0211 65030 Tel 2886 9318 800 366 9782 Sucursal en Espana NEC Electronics Hong Kong Ltd Madrid S
59. ion of description in C 1 Usage LQFP Package Addition and modification of description in C 2 Cautions on Handling Connectors LQFP Package Addition of C 3 Notes on Board Design FBGA Package Addition of C 4 Soldering CSSOCKET Main Enclosure Connector to Target Board FGBA Package Addition of C 5 Using LSPACK to Mount IC FBGA Package Addition of C 6 Connecting In Circuit Emulator FBGA Package Addition of C 7 Notes on Handling LSPACK CSSOCKET FBGA Package APPENDIX C CONNECTORS FOR TARGET CONNECTION Modification of Figure D 1 Method of Inserting Plastic Spacer APPENDIX D INSERTING PLASTIC SPACER 3rd edition Modification of 2 3 Operation Mode Settings User s Manual U14481EJ3VOUM CHAPTER 2 NAMES AND FUNCTIONS OF COMPONENTS 81
60. ircuit Emulator Document Number U14487E IE 703107 MC EM1 In Circuit Emulator Option Board This manual V850E MA1 Hardware U14359E V850E MA2 Hardware U14980E V850 Series Development Tools Supporting 32 Bit OS Windows Based Application Note Tutorial Guide U16544E CA850 Ver 2 70 C Compiler Package Operation U16932E C Language U16930E Assembly Language U16931E Link Directives U16933E PM plus Ver 5 20 U16934E 10850 Ver 2 50 or later Integrated Debugger Operation U16217E 5 850 Ver 2 50 or later System Simulator Operation U16218E RX850 Real Time OS Basics U13430E Installation U13410E RX850 Pro Real Time OS Basics U13773E Installation U13774E RD850 Ver 3 01 Task Debugger U13737E RD850 Pro Ver 3 01 Task Debugger U13916E AZ850 System Performance Analyzer U14410E PG FP4 Flash Memory Programmer User s Manual U14481EJ3VOUM U15260E CONTENTS CHAPTER 1 OVERVIEW lll i hee eee dese eee 10 1 1 Hardware Configuration 11 1 2 Hardware Specifications When Connected to IE V850E MC A 12 1 3 System Specifications of IE 703107 MC EM1 When Connected to IE V850E MC A 13 1 44 System Configuration
61. lity for any errors that may appear in this document NEC Electronics does not assume any liability for infringement of patents copyrights or other intellectual property rights of third parties by or arising from the use of NEC Electronics products listed in this document or any other liability arising from the use of such products No license express implied or otherwise is granted under any patents copyrights or other intellectual property rights of NEC Electronics or others e Descriptions of circuits software and other related information in this document are provided for illustrative purposes in semiconductor product operation and application examples The incorporation of these circuits software and information in the design of a customer s equipment shall be done under the full responsibility of the customer NEC Electronics assumes no responsibility for any losses incurred by customers or third parties arising from the use of these circuits software and information While NEC Electronics endeavors to enhance the quality reliability and safety of NEC Electronics products customers agree and acknowledge that the possibility of defects thereof cannot be eliminated entirely To minimize risks of damage to property or injury including death to persons arising from defects in NEC Electronics products customers must incorporate sufficient safety measures in their design such as redundancy fire containment and anti failure features e
62. m 70 1 0 3 4 Coat the tip of the four projections points at the bottom of the NQPACK144SD NQPACK100SD with two component type epoxy adhesive cure time longer than 30 minutes and bond the NQPACK144SD or NQPACK100SD to the target system If not bonded properly the pad of the printed circuit board may peel off when the emulator is removed from the target system If the lead of the NQPACK144SD or NQPACK100SD is not aligned with the pad of the target system easily perform step 2 to adjust the position To adjust the position insert the guide pins for position adjustment NQGUIDE provided with the NQPACK144SD or NQPACK100SD into the pin holes at the upper side of NQPACK144SD or NQPACK100SD refer to Figure C 1 The diameter of a hole is 1 0 mm There are three non through holes refer to APPENDIX A DIMENSIONS After setting the HQPACK144SD or HQPACK100SD solder the NQPACK144SD NQPACK100SD to the target system By following this sequence adherence of flux or solder sputtering to contact pins of the NQPACK144SD or NQPACK100SD can be avoided Recommended soldering conditions Reflow 240 C 20 seconds max Partial heating 240 C 10 seconds max per pin row Remove the guide pins Figure C 1 Mounting of NOPACK144SD or NQPACK100SD HQPACK144SD or HQPACK100SD Guide pins Pa _ NQGUIDE NQPACK1
63. ncluded with IE V850E MC A 5 In circuit emulator IE V850E MC A sold separately lt 6 gt In circuit emulator option board IE 703107 MC EM1 this product lt 7 gt External logic probe included with IE 703107 MC EM1 lt 8 gt Extension probe SC 144SDN SWEX 144SD 1 sold separately lt 9 gt Guide screws YQGUIDE included 10 IE connector for 161 pin FBGA CSICE161A1413N02 sold separately 11 Pogo pin connector for 161 pin FBGA LSPACK161A1413N01 sold separately 12 Stacking socket for 161 pin FBGA option CSSOCKET161A1413N01S1 sold separately 13 Target connection socket for 161 pin FBGA CSSOCKET161A1413N01N sold separately This is a type of target connection socket without guide pins The type of target connection socket with guide pins is the CSSOCKET161A1413N01 lt 14 gt Screw for mounting device included with LSPACK161A1413N01 lt 15 gt Cover for mounting device included with LSAPCK161A1413N01 lt 16 gt Spacer for mounting device included with LSPACK161A1413N01 17 Guide plate for mounting device included with LSPACK161A1413N01 18 Power adapter IE 70000 MC PS B sold separately 19 AC100 V power cable sold separately included with IE 70000 MC PS B 20 AC220 V power cable sold separately included with IE 70000 MC PS B The encircled portions show enlarged figures of the connectors for target connection Users Manual U14481EJ3VOUM 15 CHAPTER 1 OVERVIEW Figu
64. on a system When using this product 78 domestically it is not subject to The Electric Appliance and Material Control Law and protection from electromagnetic interference User s Manual U14481EJ3VOUM APPENDIX D INSERTING PLASTIC SPACER This chapter describes the method for inserting the plastic spacer supplied with the IE V850E MC A When using the emulator connected to the target system insert the plastic spacer in the IE V850E MC A as shown in Figure D 1 to fix the pod horizontally e Inserting plastic spacer in IE V850E MC A lt 1 gt Remove the nylon rivet from the rear part of the pod lt 2 gt Fix the plastic spacer with the plastic screw supplied lt 3 gt To adjust the height use your own spacer or a stand Figure D 1 Method of Inserting Plastic Spacer NA Plastic spacer _ system User s Manual U14481EJ3V0UM 79 APPENDIX E REVISION HISTORY The following table shows the revision history up to this edition The Applied to column indicates the chapter of each edition in which the revision was applied Edition 2nd edition 80 Major Revision from Previous Edition 1 1 Hardware Configuration Addition of SWEX xxxSD 1 to extension probes Addition of conversion socket for V850E MA1 161 pin FBGA Addition of conversion socket for V850E MA2 100 pin LQFP Change of 1 2 Features When Connected to IE V850E
65. pain Seoul Branch Tel 091 504 27 87 Seoul Korea Tel 02 558 3737 Succursale Francaise V lizy Villacoublay France NEC Electronics Shanghai Ltd Tel 01 30 67 5800 Shanghai P R China Tel 021 5888 5400 Filiale Italiana 21 2 41 NEC Electronics Taiwan Ltd Nie Taipei Taiwan Branch The Netherlands dad Eindhoven The Netherlands Tel 040 244 5845 NEC Electronics Singapore Pte Ltd Novena Square Singapore Tyskland Filial Tel 6253 8311 Taeby Sweden Tel 08 63 80 820 United Kingdom Branch Milton Keynes UK Tel 01908 691 133 J04 1 Users Manual U14481EJ3VOUM General Precautions on Handling This Product Cases in which NEC Electronics warranty does not apply When the product is disassembled reconstructed or modified by the user When the product receives a heavy shock such as being dropped or falling down When the product is used with excessive voltage or is stored outside the guaranteed temperature range or guaranteed humidity range When power is applied while the AC adapter interface cable or target system is not connected securely When the AC adapter cable PC interface cable or extension probe is excessively twisted or stretched When an AC adapter other than the one supplied with the product is used When water is spilled on the product When the product and target system are connected in a system in which the voltage potential between the GND of the product and the ta
66. r certain use conditions Further Renesas Electronics products are not subject to radiation resistance design Please be sure to implement safety measures to guard them against the possibility of physical injury and injury or damage caused by fire in the event of the failure of a Renesas Electronics product such as safety design for hardware and software including but not limited to redundancy fire control and malfunction prevention appropriate treatment for aging degradation or any other appropriate measures Because the evaluation of microcomputer software alone is very difficult please evaluate the safety of the final products or system manufactured by you Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances including without limitation the EU RoHS Directive Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations This document may not be reproduced or duplicated in any form in whole or in part without prior written consent of Renesas Electronics Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Elec
67. re 1 3 System Configuration V850E MA2 100 Pin LQFP f f lt 11 gt 0 8 Target system 12 om x lt 1 gt lt 2 gt V850E MA2 100 pin LQFP e lt 13 gt Target system Target system 16 Remarks 1 lt 1 gt Personal computer PC 9800 series PC AT or compatible lt 2 gt Debugger sold separately device file lt 3 gt interface board IE 70000 PCI IF A IE 70000 CD IF A sold separately lt 4 gt interface cable included with IE V850E MC A 5 In circuit emulator IE V850E MC A sold separately lt 6 gt In circuit emulator option board IE 703107 MC EM1 this product lt 7 gt External logic probe included with IE 703107 MC EM1 8 144 to 100 pin conversion adapter VP V850E MA1 MA2 sold separately lt 9 gt Extension probe SC 100SDN SWEX 100SD 1 sold separately lt 10 gt Guide screws YQGUIDE included lt 11 gt IE connector for 100 pin LQFP YQPACK100SD included with VP V850E MA1 MA2 lt 12 gt Target connection socket for 100 pin LQFP NQPACK100SD included with VP V850E MA1 MA2 lt 13 gt Cover for mounting device in 100 pin LQFP HQPACK100SD included with VP V850E MA1 MA2 lt 14 gt Power adapter IE 70000 MC PS B sold separately lt 15 gt AC100 V power cable sold separately included with IE 70000
68. rget system GND differ When the connector or cable is connected or disconnected while the power is being applied to the product When an excessive load is applied to the connector or socket Cautions on safe use The product heats up to approx 50 to 60 C when it operates for a long time Take care not to receive injuries such as burns from a rise in the temperature Be very careful to avoid electric shocks There is a danger of electrical shock if the product is used as described above in 1 Cases in which NEC Electronics warranty does not apply Users Manual U14481EJ3VOUM Target Readers Purpose Organization How to Read This Manual Conventions INTRODUCTION This manual is intended for users who design and develop application systems using the V850E MA1 and V850E MA2 The purpose of this manual is to describe the proper operation of the IE 703107 MC EM1 and its basic specifications This manual is broadly divided into the following parts Overview Names and functions of components Factory settings Cautions Differences between target devices and target interface circuits It is assumed that the reader of this manual has general knowledge of electrical engineering logic circuits and microcontrollers The IE 703107 MC EM1 is used connected to the IE V850E MC A in circuit emulator This manual explains the basic setup procedure and switch settings of the IE 703107 MC EM1 For the names and fun
69. t pitches of BGA Attach LSPACK to CSSOCKET which has already been soldered using the guide plate spacer and top cover 1 Place the pad side of the CSICE connector on LSPACK Make sure that the positions of the holes at the four corners match 2 Using the attached guide screws CSGUIDE for CSICE secure LSPACK and the CSICE connector Hold LSPACK the sides with your fingers so that no stress is applied to the soldered parts of LSPACK and CSSOCKET and sequentially tighten CSGUIDE at the four corners The tightening torque of CSGUIDE should be 0 55 kg f cm 0 054 Nm maximum To remove the CSICE connector hold LSPACK so that no stress is applied to the soldered parts of LSPACK and CSSOCKET and remove the screws Figure C 8 CSICE Connection CSGUIDE LE SICE connector 00000000000000 User s Manual U14481EJ3VOUM 77 APPENDIX CONNECTORS FOR TARGET CONNECTION C 7 Notes on Handling LSPACK CSSOCKET FBGA Package 1 9 Caution When mounting CSSOCKET for the first time refer to C 3 Notes on Board Design FBGA Package and C 4 Soldering CSSOCKET Main Enclosure Connector to Target Board FBGA Package When taking out LSPACK from the case hold LSPACK and take out the sponge first The case may be deformed if it is left for a long time in a location where temperature is 50 C or higher Stor
70. the hold pins of the HQPACK144SD or HQPACK100SD are not broken or bent before mounting the 1445 HQPACK100SD If there are broken or bent pins fix them with a thin flat plate such as a blade When securing the YQPACK144SD or YQPACK100SD connector for emulator connection HQPACK144SD or HQPACK100SD to the NQPACK144SD NQPACK100SD with screws tighten the four screws temporarily with the screwdriver provided or a driver with a torque gauge then tighten the screws in a crisscross pattern with 0 054 Nm max torque Excessive tightening of only one screw may diminish conductivity If the conductivity is diminished after screw tightening stop tightening remove the screws and check that the NQPACK144SD NQPACK100SD is not dirty and make sure the device pins are parallel Device pins do not have high strength Repeatedly connecting to the NQPACK144SD or NQPACK100SD may cause pins to bend When mounting a device on NQPACK144SD or NQPACK100SD check and adjust bent pins Users Manual U14481EJ3VOUM APPENDIX C CONNECTORS FOR TARGET CONNECTION C 3 Notes on Board Design FBGA Package 1 4 5 If a through hole is made an IC pad or nearby the cream solder melts and flows into the hole causing open pins When making a through hole in an IC pad fill the hole If it is necessary to make a through hole near an IC pad be sure to apply resist between the pad and through hole as shown in Figure C
71. tronics products or if you have any other inquiries Note 1 Renesas Electronics as used in this document means Renesas Electronics Corporation and also includes its majority owned subsidiaries Note 2 Renesas Electronics product s means any product developed or manufactured by or for Renesas Electronics 5 5 User s Manual IE 703107 MC EM1 In Circuit Emulator Option Board Target Devices V850E MA1 V850E MA2 Document No U14481EJ3VOUMOO 3rd edition Date Published August 2004 NS CP K NEC Electronics Corporation 2000 Printed in Japan MEMO 2 User s Manual U14481EJ3VOUM Windows is either a registered trademark or a trademark of Microsoft Corporation in the United States and or other countries PC AT is a trademark of International Business Machines Corporation The information in this document is current as of August 2004 The information is subject to change without notice For actual design in refer to the latest publications of NEC Electronics data sheets or data books etc for the most up to date specifications of NEC Electronics products Not all products and or types are available in every country Please check with an NEC Electronics sales representative for availability and additional information No part of this document may be copied or reproduced in any form or by any means without the prior written consent of NEC Electronics NEC Electronics assumes no responsibi
72. ulation CPU Table 5 3 Corresponding Pin List Pin Equivalent Circuit 3 Pin Name 1 Target Device Pin No V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP Figure 5 4 Pin Equivalent Circuit 4 Vss AVss CVss Table 5 4 Corresponding Pin List Pin Equivalent Circuit 4 Pin Name 1 Target Device V850E MA1 144 pin LQFP 9 28 113 125 135 48 38 99 82 V850E MA1 161 pin FBGA 85 88 C11 D1 E14 K2 K13 M6 P2 V850E MA2 100 pin LQFP 12 34 56 84 94 V850E MA1 144 pin LQFP 72 V850E MA1 161 FBGA V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP V850E MA1 161 pin FBGA V850E MA2 100 pin LQFP User s Manual U14481EJ3VOUM 41 CHAPTER 5 DIFFERENCES BETWEEN TARGET DEVICES AND TARGET INTERFACE CIRCUITS Figure 5 5 Pin Equivalent Circuit 5 MODE2 X2 NC Table 5 5 Corresponding Pin List Pin Equivalent Circuit 5 Pin Name 1 Pin Name 2 Package V850E MA1 144 pin LQFP 61 V850E MA1 161 pin FBGA Do P V850E MA2 100 pin LQFP 39 V850E MA1 144 LQFP 18 V850E MA1 161 pin FBGA G1 V850E MA2 100 pin LQFP V850E MA1 144 pin LQFP 62 V850E MA1 161 pin FBGA N9 V850E MA2 100 pin LQFP 40 V850E MA1 144 pin LQFP DESERT ERI V850E MA1 161 pin FBGA A1 A5 A10 B1 B14 C1 C14 D14 E5 L1 M1 M14 N1 N14 P5 P11 P14 V850E MA2 100

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