COLOR MONITOR SERVICE MANUAL
Contents
1. DI Jo Se 207 R5 Z05 R3 R6 208 CHASSIS CL xx R4 Z06 gt Blen 0 St HS EAX3908160110 DS i ee F Zog SWS O Sw ans ONSI KELM Q SN 20 2022 SWS EAX39081601 101 Ble S m fe X DS 070515 J K LIM i x HT k J32 AUTO SER UP SOURCE DOWN F ENGINE MENU AUTO RESOLUTION a CRI 3 o 2D4 DI POWER ON OF CONTROL BOTTOM Pb Free Soldering Copyright 672007 LG Electronics Inc All right reserved Only for training and service purposes 28 LGE Internal Use Only 1 SCALER2. t E 1 II T b E E s or es or ya z Ei RE eas E i y x K a t E Z EEZ Rg E Ge la le z ja E AMES ii S aama ma ASIAA AA E ln elo la JS T a P scx F bib i fe lA ula H JE IRE E ri mwa ink NE mm mm mtr amon X K KX KKK KK AW n iuit BIET FO NC wv d N XWW Bn Om Gb OS RA Od ues ay iue es XGA S uu d De AO e pa ae IN lt 8 E He deed SE ea me a AO V a eran IL TE COUNASA ERE es EUA F4 E DONAdu Le SES e Fam aL sE au Las DEE h ag vo SST RL PS wa l e pum F Er E Taar UM ES ra TAT EA rM GE ra e n d bet RT EL E sen Sa Am ares NE T oo Mis 4S m K lt be E vo EVATT Ze poa endis n ME WRC EH Vr gt mg E Stee WEVAT EL HEN Tr seg as RT rere m Cu UE Eu afenn var BL ve Laag i NE x CB peo E Ei V AUTE ue zm NH lb T Baa TNA ral Nike T mr HEN o A Se 4805 cas cal easy aa e hr MN p bird Aa ES be T EE DUAV S a Kaa WEVAT 78 BF NZD ps cal K BO s er Y me ui s Um SE E iR T zn SOCIO I 2H D a HH Eb me mes Ara UE LAT KST pp Y 1 PHMEBSaOnNTMTS L Er NEXI dd cal ase ARA es zp E mu ral BABA WEBAT SB tan FF lt e Ke ELEC aneh ES gt TNS 1 e o ER enm RABEAT 75 B Lane que gg i pre E RN HD reena Es BAEK RoN T ss P 3 e MEE a FISH o jeg 5 ex Maia JAAT 45 a rng aen T m a sat Se y ee WARS gea IDS cel D Anke SEET e tk ya EHE I1 PERE TA NET cal GD AT ERE N EIE opp as aen WOSAT Ane E Greig Es Laa ne DEE a e BEIC S nu oe Ln ede pd usen ES o IN
3. ZUINOyL ZH0909 050 X 0891 PHMI8SONNSL sdue1p eueAu 19113 E ed INOud33 Local lu aiaa INOHd33 a 9 8 1 Bojeuy LGE Internal Use Only 19 Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is 146MHz In L207WT This part consists of the Scaler ADC converter TMDS receiver and LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1680X1050 resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V and one 1 8V regulators to convert power which is provided 5V in Power board 15V is provided for inverter in L207WT Also 5V is converted 3 3V and 1 8V by regulator Converted power is provided for IC in the main board The inverter converts from DC 15V to AC 700Vrms and operates back light lamps of module in L207WT 3 MICOM Part This part is include video controller part And this part consists of EEPROM IC control data Reset IC and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable
4. Cover MOLD ABS HF 350U L1972 Lx7W ABS L1972 LX7W PIECE DECO RING_VACUUM PLATING 330 MEY38582301 Knob MOLD ABS HF 350U SUB TACK KNOB FOR LX7W L1972 GLOBAL TACK KNOB CONTROL A 400 ACQ33735602 Cover Assembly Rear L207W 20 Back Cover Ass y 01 CKD 410 MGJ39028601 Plate Metal PRESS SPTE 0 3 SHIELD SPC L207W LAMP SHIELD 420 ADV33707206 Frame Assembly L207W AUO L227W CMO LM57B 20 Rear Frame Assy 430 MCK38597501 Cover MOLD PC ABS L1972 ABS L1972 L1954 Lx7W VESA BRACKET 440 MGJ38583701 Plate Metal PRESS SBHG 1 2 METAL EGI L207W PRESS SBHG 1 2 GUIDE Metal stand bracket 450 MCK38597701 Cover MOLD PC ABS L1972 ABS L1972 L1954 Lx7W LIPS BRACKET 500 EBR38466401 PCB Assembly Sub CONTROL T T LM74B L197WT BFS AEUQOQPX A 510 EAY38106001 Power Supply Assembly AIP 0165 FREE L1954SM L207W L227W LCD Lienchang High Version LIEN CHANG ELECTRONIC CO LTD 520 EBU38495201 Main Total Assembly L207WH BFS BRAND LM74B 900 ACQ33707107 Cover Assembly L1954T L207W LM57B 20 Cover Hinge Assy Normal Stand 01 CKD A 910 MCK38601903 Cover MOLD ABS L1954 L207W ABS COVER STAND BODY 01 CKD AN 920 AAN33707002 Base Assembly BASE L1954T LM57B Normal Stand Base Assy with swivel ring 930 MCK38602601 Cover MOLD ABS L1954 ABS L1954 COVER CABLE Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Onl 23 d REPLACEMENT PARTS LIST DATE 2007 08
5. D714 0DSON00138A Diode SchottkyMMBD301LT1G 600MV R509 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO D715 0DD184009AA Diode AssemblyKDS184 KDS184 TP R510 0RJ4701D677 _ Resistor ChipMCRO3EZPJ472 4 7KO ZD1 ODZ560009GB Diode ZenerBZT52C5V6S F 5 6V R511 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO ZD2 ODZ560009GB Diode ZenerBZT52C5V6S F 5 6V R512 0RJ4700D677 Resistor ChipMCRO3EZPJ471 4700H ZD3 ODZ560009GB Diode ZenerBZT52C5V6S F 5 6V R513 0RJ4700D677 Resistor ChipMCROSEZPJ471 4700H ZD4 ODZ560009GB Diode ZenerBZT52C5V6S F 5 6V R516 ORJ3900D677 Resistor ChipMCRO3EZPJ391 3900H ZD701 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R517 0RJ1002D677 Resistor ChipMCRO3EZPJ103 10KOH ZD702 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R518 ORJO000D677 Resistor ChipMCRO3EZPJ000 0OHM ZD703 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R519 0RJ1502D677 Resistor ChipMCRO3EZPJ153 15KOH ZD704 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R522 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO ZD705 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R523 ORJ1000D677 Resistor ChipMCRO3EZPJ101 1000H ZD708 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R524 0RJ1002D677 _ Resistor ChipMCRO3EZPJ103 10KOH ZD709 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R525 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO ZD710 0DZ560009GB Diode ZenerBZT52C5V6S F 5 6V R526 0RJ0332D677 Resistor ChipMCRO3EZPJ330
6. Only for training and service purposes 10 Disassemble back cover LGE Internal Use Only ADJUSTMENT INSTRUCTION 1 Coverage Apply to 20 Wide monitor made in Monitor Factory Kumi Korea or made in accordance with the standard of Kumi Factory process 2 Appointment 2 1 Adjustment must be done as fixed sequence and adjustment sequence can be modified after agreement with the responsible R amp D engineer considering mass production condition 2 2 Power AC100 240 Voltage Free 2 3 Input signal As Product Standard Signal ROM L204WT Ver1 1 2 4 Warm up Time Over than 30 minutes 2 5 Adjustment equipment White balance equipment CA 110 210 Display adjust equipment VG 819 or VG828 Oscilloscope PC More than 486 computer amp White balance adjust program HDCP Adjusting Jig equipment 3 Adjustment 3 1 Overview Use factory automation equipment and adjust automatic movement But do via passivity adjust in error occurrence 3 2 Adjustment order refer to the Adjustment standard and adjustment command table 3 2 1 Board Assembly Line m Connect input signal to 15pin D sub m Ready for adjustment check whether adjustment command works normally or not and the operating state of each mode m Check the display state of gray color when 256 gray scale pattern is embodied m Read by EEPROM Read Command to check whether initial value is correct or not 3 2 2 Total Assembly Line m Input analog signal
7. PIN 127 128 14 3MHZ YES CHECK U501 PIN32 H SYNC AND NO 1 CHECK PIN 127 128 SOLDERING CONDITION 2 CHECK X501 3 TROUBLE IN U501 PIN33 V SYNC IS PULSE APPEARED AT SIGNAL PINS YES TROUBLE IN CABLE OR LCD MODULE Waveforms 1 U501 127 TOR RIE 4 00057 K i 1 H cv NTR TT EWV s apr 2008 24 00 08 CHECK CONNECTION LINE FROM D SUB TO U501 Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 27 LGE Internal Use Only 4 TROUBLE IN DPM TROUBLE IN DPM CHECK U501 PIN 32 33 SYNC PULSE YES CHECK R718 AND NO R719 SYNC APPEARED YES NO CHECK PC PC IS GOING INTO DPM MODE TROUBLE IN U501 Waveforms 1 H SYNC er gR OOE D m er ALLE EE DG 2 v SYNC Tek BE 25 0455 L am r6v 7 aos Ni GUTI T TY Y s Apr 2006 09 11 14 CHECK H V SYNC LINE Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes DR CR LGE Internal Use Only BLOCK DIAGRAM INOH Up ZHIN8LE T L Joje nbay wajs s INOHd33 Joje1euet 390 AS euiBu3 eoepelu eng eoepelu san juawaoueyug eui esuodseu euiBu3 Buisseoold ejdsig
8. R912 0RJ3900D677 Resistor ChipMCRO3EZPJ391 3900H CONNECTORs C1 6631900109A Harness Single FOOSUNG DCE153B C2 6631V12031A Harness Single4 P CONNECTOR ASSY C3 6631T20023J Harness Single11P 2 0MM SMH200 C4 EAD30368603 Harness Singleconnector assy L2 J1 6602T12005E Connector Wafer12505WR 06A00 6P J2 6602T12005C Connector Wafer12505WR 04A00 4P J3 6602T12004C Connector Wafer12505WS 04A00 4P J901 6630TGAO005B Connector DSUBQH11121 DNO D DVI J902 6630TGA004F Connector DSUBKCN DS 3 0062 D S J905 6602T20008K Connector WaferSMW200 11P 11P 2 J906 6630V90219A Connector WaferSMW200 28C 28P 2 J907 6602T12004E Connector Wafer12505WS 06A00 6P SWITCHs Swi 6600R00004C Switch TactJTP1127WEM 1C1P 15VD swe2 6600R00004C Switch TactJTP1127WEM 1C1P 15VD sw3 6600R00004C Switch TactJTP1127WEM 1C1P 15VD Sw4 6600R00004C Switch TactJTP1127WEM 1C1P 15VD SW5 6600R00004C Switch TactJTP1127WEM 1C1P 15VD SW6 6600R00004C Switch TactJTP1127WEM 1C1P 15VD OTHERs B1 3890TKDO002P BoxLB500J PCB BRAND 542 397 44 B2 3890TKDO02P BoxLB500J PCB BRAND 542 397 44 B3 MAY39104501 BoxBOX SW 523 140 397 2 COLOR L D1 ODLBEO048AA LED ChipBL HKBB533B TRB SUPER Y P1 3918TKK038Z Packing 1140 1054 CARTON PLATE P10 3918TKKO40A Packing542 70 MAIN PCB B P11 3918TKK040B Packing397 70 LB500J MAIN PCB S P2 407 Q31U PackingL 1084 0 SYNTHETIC PAPER P3 MFZ38956601 PackingMOLD EPS L207WT EPS L207 P4 3918TKKO38J Packi
9. 1680x1050 9 60Hz m Write HDCP Key to EEPROM 24C16 by using DDC2AB protocol amp HDCP Adjusting Jig equipment Address OxAC 80 289 bytes If error is occurred write and check again Ready Heat run during 30 minutes in the state with signal Connect input signal to D sub Default value before adjustment Contrast 70 Brightness 100 Max 3 2 3 Adjustment of Horizontal Verticality screen position Clock and Clock Phase at each Mode m There is no special factory mode adjustment Writing initial value of EEPROM in Board Assembly line is adjusting Preset Mode and Reset mode EEPROM is initialized when AC Power is ON first m If the change of FOS data is needed after M P it is possible by writing Mode Data with EEPROM write command or modifying the Mode Data in MICOM itself Caution Must keep power on more than 3 seconds after AC Power on first time Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes 11 3 2 4 Color coordinates adjustment and Luminance adjustment 3 2 4 1 Color coordinates adjustment m Monitor Contrast Brightness Contrast 70 Brightness 100 Max m CA 110 CA 210 Set Channel 13 gt CA 210 for WCG panel m Signal Generator At cut off and drive gt 16 step pattern for ADC Output Voltage 700 mVp p Output Mode Mode 12 WSXGA 60 Hz mode Setting 3 2 4 2 Adjustment Board Assembly Line m Input 16 step pattern for ADC M
10. 330HM R527 0RJ0332D677 _ Resistor Chip MCRO3EZPJ330 330HM ICs R530 0RJ1002D677 _ Resistor ChipMCRO3EZPJ103 10KOH R6 0RJ1801D677 Resistor ChipMCRO3EZPJ182 1 8KO IC1 OIPMGAO010A IC LDO Voltage RegulatorAZ1117H R701 0RJ4701D677 _ Resistor ChipMCRO3EZPJ472 4 7KO U501 OIPRPOO784C IC Video ProcessorsFE253MOH LF R702 0RJ4701D677 Resistor ChipMCROSEZPJ472 4 7KO U502 EAN38496701 IC AssemblyL207WH BFS Micom Ass R703 0RJ0332D677 _ Resistor ChipMCRO3EZPJ330 330HM U503 OIMMRSGO36B IC EEPROMM 24C16 WMNGTP 16KBIT 2 R704 ORJO102D677 _ Resistor ChipMCROSEZPJ100 100HM U701 OIMMRO0014A IC EEPROMM24C02 RMN6TP 2KBIT 25 R705 ORJO102D677 _ Resistor ChipMCROSEZPJ100 100HM U702 OIMMRO0014A IC EEPROMM24C02 RMNGTP 2KBIT 25 R706 ORJO102D677 _ Resistor ChipMCROSEZPJ100 100HM U902 OIPMG78403A IC LDO Voltage RegulatorAZ1086S R707 ORJO102D677 Resistor ChipMCRO3EZPJ100 100HM R708 ORJO102D677 Resistor ChipMCRO3EZPJ100 100HM FILTERs R709 ORJO102D677 _ Resistor ChipMCROSEZPJ100 100HM R710 0RJ0332D677 _ Resistor Chip MCRO3EZPJ330 330HM L901 OLCMLOOO03B Filter BeadMLB 201209 0120P N2 R711 ORJO000D677 _ Resistor ChipMCRO3EZPJ000 0OHM L902 OLCMLOOO03B Filter BeadMLB 201209 0120P N2 R712 ORJO102D677 _ Resistor ChipMCROSEZPJ100 100HM L903 OLCMLOOO03B Filter BeadMLB 201209 0120P N2 R713 ORJO102D677 _ Resistor ChipMCROSEZPJ100 100HM R714 0RJ1001D677 _ Resistor ChipMCRO3EZPJ102 1KOHM TRANSISTOR
11. H Pixels 40 0 37 879 1056 800 40 128 88 800 x 600 V Lines 60 317 628 600 1 4 23 5 H Pixels 49 5 46 875 1056 800 16 80 160 800 x 600 V Lines 75 0 625 600 1 3 21 6 H Pixels 65 0 48 363 1344 1024 24 136 160 1024 x 768 V Lines 60 0 806 768 3 6 29 7 H Pixels 78 75 60 123 1312 1024 16 96 176 1024 x 768 V Lines 75 029 800 768 1 3 28 8 H Pixels 108 0 67 500 1600 1152 64 128 256 1152 x 864 V Lines 75 000 900 864 1 3 32 9 H Pixels 108 0 63 981 1688 1280 48 112 248 1280 x 1024 V Lines 60 02 1066 1024 1 3 38 10 H Pixels 135 0 79 976 1688 1280 16 144 248 1280 x 1024 V Lines 75 035 1066 1024 1 3 38 11 H Pixels 119 64 674 1840 1680 48 32 80 1680x1050 V Lines 59 883 1080 1050 3 6 21 12 H Pixels 146 25 65 290 2240 1680 104 176 280 1680x1050 V Lines 59 954 1089 1050 3 6 30 Copyright 2007 LG Electronics Inc All right reserved 8 LGE Internal Use Only Only for training and service purposes DISASSEMBLY 1 2 1 Disassemble Cable cover Pushing Latch inside Take the stand base from stand body 2 1 2 2 2 Disassemble Stand Body 4 5 DEA pr Remove the screws Remove the screws LGE Internal Use Only Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 1 Pull the front cover upward 2 Then let the latches are separated 3 Put the front face down Copyright 2007 LG Electronics Inc All right reserved
12. Need to Port Setup This program is available to LCD Monitor only S WinEDID 1 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe Remove 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button c Click Write button c Remove all default number d Add 300 3FF e Click Start button f Click Exit button Copyright c 2007 LG Electronics Inc All right reserved 13 LGE Internal Use Only Only for training and service purposes R SERVICE OSD 1 Turn off the power switch at the front side of the display 2 Wait for about 5 seconds and press MENU POWER switch with 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a Auto Color W B balance and Automatically sets the gain and offset value b NVRAM INIT EEPROM initialize 24C08 c CLEAR ETI To initialize using time d AGING Select Aging mode on off e R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually g R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B G
13. Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package unt
14. The controlled data of each modes is stored in EEPROM Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Onl 20 d LIPS Board Block Diagram 15V EMI INPUT RECTIFIER H c SWITCHING KHz OyTPUTRECTIFIER gt COMPONENTS AND FILTER TRANSFORMER AND FILTER LINE GND 100 240V i SIGNAL BM MICONTECE PHOTO COUPLER COLLENT CIRCUIT ISOLATION i ION Operation description Power 1 EMI components This part contains of EMI components to comply with global marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor and of course the primary protection fuse 2 Input rectifier and filter This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized and also the over power protection is also monitor by this part 5 Photo Coupler isolation This part function is to feed back the DC out
15. ir cr inland m ea pE her 2008 NE v vg ag OO CRT S Apr 2006 CSS WEN OT LY s apr 2008 Copyright c 2007 LG Electronics Inc All right reserved 15 LGE Internal Use Only Only for training and service purposes 2 NO RASTER OSD IS NOT DISPLAYED LIPS NO RASTER OSD IS NOT DISPLAYED CHECK J905 NO CHECK POWER BOARD VOLTAGE PIN5 6 gt LIPS 5V YES eG Ne CHECK U501 INVERTER or ON OFF PORT YES P 1 CONFIRM BRIGHTNESS CHECK J905 gt _ OSD CONTRL STATUS PIN10 2 CHECK SCALER DIM ADJ PORT 3 CHECK SCALER LAMP ADJ PORT CHECK PULSE AS NE CONTACTING PROBE TO THE LAMP gt POWER BOARD LIPS WIRE OF THE LCD MODUL Waveforms YES 1 J905 5 6 2 J905 9 REPLACE LCD MODULE m geng L EH a J Wy 31 mi mr mme RLY WU 26 may 2006 ey 08 05 07 3 J905 9 Brightness 100 Tex amg 29 0805 H NIME Rex D i WW toi e waer Wem 16 may 2008 B Stary dea 4 LAMP CURRENT r DELEN ETE acs t 1 Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes 16 LGE Internal Use Only 3 NO RASTER OSD IS NOT DISPLAYED MAIN NO RASTER OSD IS NOT DISPLAYED CHECK U501 NO PIN114 3 3V PIN21 1 8V YES U501 NO CHECK U901 3 3V U902 1 8V
16. t ir am BEXSBERRZEEZEBBRSESERERERSBREER TELE bane lt zs un lt wk lz Z lt Q lt lzlz zlzlo uz la tm un lt 24 MEE LBI no5zxz5mmuniaBzsgmnitsmsuusuuuudm zR TE ha ld EEA SE E AA E Ty yea R E SS In S 3 E 3 H uh T ki 5 LE CUENTE T Se e EDERE lae maand aud Sp Ls FERRE ma nena est EL aan gep S EE ep E ey o ae E e F e nn er pum Ema nat Tase SP F ENEE E ETE R ett ias e T aT R are Els E E EI S i Elt Le je js 2 IFI e HE iE d mm m Em ET Ed ae l gee Ele le k KIK le E ele le eee uuu oe LGE Internal Use Only 29 Copyright 672007 LG Electronics Inc All right reserved Only for training and service purposes POWER 8 WAFER 2 emp p di TT EFI Meer Tar tail HH e parc ES 11 aaen Ho as en s000 anpe na ha B pre 1 ist ES Vel ed ER 928 LES LRR res H L gg Mir IMEI y I Ip inl II LI LZ IHD nnn m IT VATE in 5388 c3 Ir venus ei LH w
17. to D sub wafer m Write EDID DATA to EEPROM 24C02 by using DDC2B protocol 8NOVATEK dual and ode model O m Write EDID DATA to EEPROM 24C02 by using DDC2AB protocol amp Mstar dual model O m Check whether written EDID data is correct or not refer to Product spec m Connect analog Signal Cable to D sub wafer m Write EDID DATA to EEPROM 24C02 by using DDC2B protocol m Check whether written EDID data is correct or not refer to Product spec After writing EDID send Elapsed Time Clear command Elapsed time should not be displayed after EDID writing Confirm periodically in the first set of new lot process change whether module name and aging time disappeared on the self diagnostics OSD with signal cable disconnected gt If Elapsed Time Clear command isn t executed module name aging time and TCO word appear on the self diagnostics OSD Module name and aging time should not appear after writing EDID Make sure to do FACTORY RESET at the final process 3 2 5 9 Shipping condition m Contrast 70 m Power Switch Off m Brightness 100 Max m Color Select Preset 6500K m Language Select Refer to product spec m OSD Position Center m Power indicator ON m Flatron F engine Normal LGE Internal Use Only Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP Port Setup Windows 98 gt Don t need setup Windows 2000 XP gt
18. 02 707004108 0702 C111 0708712 D 2ER737 css2 2g 0701 C706 0703 C708 0705 C11 00710 C713 AERISA leg D 3 T 3 a136 0520 Ba 0535 zm E ER EE LE ys S Et Wl oms R312 9 pet E Jj es csos E Wei l p901 m R905 esos S R503 cete zh E van C503 8 R502 Sl lI E csoz 3 R50 e oz Banz 9020 c 1907 S E 3808 a Fe C125 R533 0793 EE T C722 R732 C121 R733 1 C902 t E c T IS cata 8 57405290 Sd C914 C533 esa amp eee lt C523 GIZ L Jd C515 vez Bag BU 9 C825 a Sil CSE es 3 m5 1302 1301 2 E sa En S R509 R527 E it amp S R526 gi E c526 O a ii 3 BG Kong z Hro OE Pel E WEE 3S yf DEE 5381 20 Eas Ei i amp Sod sq E 3 lt SIE ize D T 350 TOS Eee e 2 ENTE 2 v O B 2 8 SOIE E csse era aro GE HS en BS L o S ue SHE C909 R516 ve C537 ECK 711 a507 See CHT CH6 R8 33 L D709 0706 CLA CS 8 Em um AT Sr lk Wall 4 n 4 EE Ca E LE St all n hr NNN aal Son ozone aep ate BIS H DT TU wl Il press a SS EECH K E EE uge G G 1 8 R722 R124 R717 20709 20708 E 18 5 z E O A O O am Pb Free Soldering 0904 Creos 2 a o Cam ZE 610522 3 k UN TY j oo e 310 TD T gt y O u oss O 3F HORE ON cate pate O o 2 O 3E sys JP Cor 3F JP eC 4903 se 3901 Copyright 232007 LG Electronics Inc All right reserved 27 Only for training and service purposes LGE Internal Use Only CONTROL TOP
19. 30 LOC NO PART NO DESCRIPTION SPECIFICATION LOC NO PART NO DESCRIPTION SPECIFICATION ACCESSORY C540 OCCO80CK11A Capacitor Ceramic ChipC 1608C0G1 Al SAB31087001 S W PackageL197WH EUROPE C541 OCCO80CK11A Capacitor Ceramic ChipC1608C0G1 A3 EAD37992102 Power CordEAD37992102 LP 34A LS C701 OCC101CK41A Capacitor Ceramic ChipC1608C0G1 A4 3171TZ1099T S W PackageALL MODEL FORTE MANA C702 0CC101CK41A Capacitor Ceramic ChipC1608C0G1 A5 68509F0003A Cable AssemblyD SUB TO D SUB UL C703 OCC680CK41A Capacitor Ceramic ChipC1608C0G1 A6 68509J0004A Cable AssemblyDVI D TO DVI D UL C704 OCK104CK56A Capacitor Ceramic Chip0603B104K A7 3840TWL027A CardPRINTING LCD CRT ALL BRAND C705 OCC680CK41A Capacitor Ceramic ChipC1608C0G1 C706 OCK104CF56A Capacitor Ceramic Chip0603B104K CAPACITORs C707 OCK104CF56A Capacitor Ceramic Chip0603B104K C708 OCK104CF56A Capacitor Ceramic Chip0603B104K C501 OCK104CF56A Capacitor Ceramic Chip0603B104K C709 OCK104CF56A Capacitor Ceramic Chip0603B104K C502 OCK473CH56A Capacitor Ceramic ChipC1608X7R1 C710 OCK104CF56A Capacitor Ceramic Chip0603B104K C503 0CK473CH56A Capacitor Ceramic ChipC1608X7R1 C711 OCK104CF56A Capacitor Ceramic Chip0603B104K C504 0CK473CH56A Capacitor Ceramic ChipC1608X7R1 C712 OCK104CF56A Capacitor Ceramic Chip0603B104K C505 0CK473CH56A Capacitor Ceramic ChipC1608X7R1 C713 O
20. CK104CF56A Capacitor Ceramic Chip0603B104K C506 0CC102CK41A Capacitor Ceramic ChipC1608C0G1 C714 OCC680CK41A Capacitor Ceramic ChipC1608C0G1 C507 0CK473CH56A Capacitor Ceramic ChipC1608X7R1 C715 OCC680CK41A Capacitor Ceramic ChipC1608C0G1 C508 0CK473CH56A Capacitor Ceramic ChipC1608X7R1 C716 OCK104CF56A Capacitor Ceramic Chip0603B 104K C509 0CC270CK41A Capacitor Ceramic ChipC1608C0G1 C717 OCK104CF56A Capacitor Ceramic Chip0603B 104K C510 0CC270CK41A Capacitor Ceramic ChipC1608C0G1 C718 OCK104CF56A __ Capacitor Ceramic Chip0603B104k C511 OCK103CK51A Capacitor Ceramic Chip0603B103K C719 OCK104CF56A Capacitor Ceramic Chip0603B104K C512 OCK103CK51A Capacitor Ceramic Chip0603B103K C720 OCK104CF56A Capacitor Ceramic Chip0603B104K C513 OCK104CF56A Capacitor Ceramic Chip0603B104K C723 OCK104CF56A Capacitor Ceramic Chip0603B104K C514 OCK224CF56A Capacitor Ceramic Chip0603B224K C724 OCK105CD56A Capacitor Ceramic ChipC1608X7R1 C515 OCE106CF638 Capacitor AL RadialSHL5 0TP16VB C725 0CC101CK41A Capacitor Ceramic ChipC1608C0G1 C516 OCK104CF56A Capacitor Ceramic Chip0603B104K C901 OCK103CK51A Capacitor Ceramic Chip0603B103K C517 OCK104CF56A Capacitor Ceramic Chip0603B104K C902 OCE107EF610 Capacitor AL RadialKMG16VB100M C518 OCK104CF56A Capacitor Ceramic Chip0603B104K C905 OCE107EF610 Capacitor AL RadialKMG16VB100M C519 OCK104CF56A Capacitor Cera
21. D by Menu Powerkey on from Power off gt Confirm first set of new lot by periods and confirm periodically when there is Process change or Adjustment setting change 3 2 5 5 OSD amp Adjustment device Confirmation Confirm operation mentioned as product spec m Vary Brightness and Contrast and confirm the variation of Luminance and display status m Operate the F engine function and confirm variation of Luminance m Make sure to do FACTORY RESET after confirmation of OSD function 3 2 5 6 Confirm the display state by inputting 8 color Bar Pattern amp 256 Gray Scale pattern Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes 24D 2 3 2 5 7 DPM operation confirmation Check if Power LED Color and Power Consumption operates as standard m Measurement Condition 280V 9 50Hz Analog m Confirm DPM operation at the state of screen without Video Signal refer to Spec at Page 11 3 2 5 8 DDC EDID Write Set as Aging mode ON by commanding AGING ON OFF command code Digital part EDID data m Confirm whether module selection is correct or not on the self diagnostics OSD with signal cable disconnected m Connect Digital Signal Cable to DVI D wafer m Write EDID DATA to EEPROM 24C02 by using DDC2B protocol m Check whether written EDID data is correct or not refer to Product spec Analog part EDID data Analog part EDID data m Connect analog Signal Cable
22. LG Website http biz LGservice com COLOR MONITOR CHASSIS NO LM74B MODEL FLATRONL207WT L207WT PFS A HAP Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL 9 a gt To apply the MSTAR Chip CONTENTS CONTENTS E E oi 2 PRECAUTION amc 3 SPECIFICATION cuina 7 DISASSEMBLY e 9 9 ADJUSTMENT Socia aiii 11 SERVICE OSD scniari 14 TROUBLE SHOOTING isis a nion od s eR ines ciel 15 BLOCK DIAGRAM sscsgeassczat iets iaaeaie 19 EXPLODED VIEW sigais li 22 REPLACEMENT PARTS LIST usina ca 24 SV T A E 27 Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are important for safety These parts are marked on the schematic diagram and the replacement parts list It is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do
23. _MODE_CHANGE Command code m Adjust to meet Y 180 10 and confirm LGE Internal Use Only 3 2 4 5 Confirm User color coordinates m Confirm Whether User color is saved same as 6500K m After confirming Color coordinates Must return to 6500K m Confirm whether user color is 50 If the value of user color R G B is 30 do adjust again by 3 2 4 2 3 2 5 Confirm Operation state 3 2 5 1 Operation mode Confirm whether each appointed mode operate correctly or not 3 2 5 2 Confirmation of Adjustment condition and operation Confirm whether it meet Auto Manual equipement Adjustment standard or not m Confirm Analog screen state Confirm screen state at below mode Appointment mode 640 480 60Hz Mode 2 800 600 75Hz Mode 5 1024 768 60Hz Mode6 1280 1024 60Hz Mode 9 1680 1024 60Hz Mode 12 SMPTE pattern Check 0 5 95 100 Mode can be added m Check HDCP signal screen by using Video generator that generate HDCP signal 3 2 5 3 Confirm Auto adjustment operation m Input Analog 1 Dot on off amp Rectangle Pattern at Mode 12 1680 1050 60Hz m Confirm adjustment operation by changing Clock Phase HIV Position m Check Clock Phase by pressing AUTO Key m Confirm first set of new lot by periods 3 2 5 4 Other quality m Confirm that each items satisfy under standard condition that was written product spec m Confirm Applying Module amp MICOM Setting gt Confirm with Service OSD gt Confirm at Service OS
24. ain value manually Analog Only i MODULE To select applied module Video Signal Generator ass ho ip ee PARALLEL PORT e oolooooooo ada O elo o OFF o O ON BV H Control Line Power inlet required Power Select Switch Si ale ON 110V 220V KEES cj F Power LED eoee ord lt E V Sync On Off Switch Switch must be ON Figure 1 Cable Connection Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 14 LGE Internal Use Only TROUBLESHOOTING GUIDE 1 NO POWER NO POWER POWER INDICATOR OFF CHECK POWER BOARD 1 CHECK J905 VOLTAGE NO S AND FIND OUT A SHORT PIN5 6 5V POINT AS OPENING EACH POWER LINE 2 IS IC1 PIN2 3 3V NO CHECK IC1 3 3V 3 U902 PIN2 1 8V U902 1 8V LINE ves NO 4 CHECK X501 PIN127 CHECK CRYSTAL X501 PULSE ye CHECK U501 Waveforms 1 2905 456 2 101 42 3 u902 2 4 U501 127 Sampie S 1 Gen rra rosie sangre f l TEK rn 14 eo Sample llini 16 x vd 1 j vida l l L H i D M MM QUt s ga 4 m wo m i
25. arp edges LGE Internal Use Only SPECIFICATIONS 1 LCD CHARACTERISTICS Type TFT Color LCD Module Active Display Area 20 1 inch Pixel Pitch 0 258 H x 0 258 V Color Depth 16 7M colors 6bit FRC data Size 459 4 H x 296 4 V x 16 6 D Electrical Interface LVDS Surface Treatment Hard coating 3H Anti Glare Operating Mode Normally White Backlight Unit 4 CCFL 2 OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio 2 10 Left 80 min 85 Typ Right 80 min 85 Typ Top 80 min 85 Typ Bottom 80 min 85 Typ 2 2 Luminance 180 Typ Typ 30 SRGB 220 min 300 Typ Full White pattern 0 70V 6500K 150 min Full White pattern 0 70V 9300K 7596 min 80 typ 2 3 Contrast Ratio 500 min 1000 Typ DFC gt 5000 1 TYP gt 4250 1 MIN 3 SIGNAL Refer to the Timing Chart 3 1 Sync Signal Type Separate Sync Digital SOG 3 2 Video Input Signal 1 Type R G B Analog 2 Voltage Level 0 0 71 V a Color 0 O 0 Vp p b Color 7 O 0 467Vp p C Color 15 0 0 714Vp p 3 Input Impedance 75Q 3 3 Operating Frequency Horizontal Analog 30 83kHz Horizontal Digital 30 83kHz Vertical 56 75Hz Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes 4 Max Resolution D sub Analog Digital 1680 x 10500 60Hz 1680 x 10500 60Hz 5 POWER SUPPLY 5 1 Pow
26. chingENKMC2837 T112 1 C535 OCK104CF56A Capacitor Ceramic Chip0603B104K D703 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 C536 OCK104CF56A Capacitor Ceramic Chip0603B104K D704 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 C537 OCK104CF56A Capacitor Ceramic Chip0603B104K D705 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 C538 OCK104CF56A Capacitor Ceramic Chip0603B104K D706 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 C539 OCCO80CK11A Capacitor Ceramic ChipC1608C0G1 D707 ODSIHO0018A Diode SwitchingENKMC2837 T112 1 Copyright 2 2007 LG Electronics Inc All right reserved LGE Internal Use Only 24 Only for training and service purposes LOC NO PART NO DESCRIPTION SPECIFICATION LOC NO PART NO DESCRIPTION SPECIFICATION D708 ODSIH00018A Diode SwitchingENKMC2837 T112 1 R503 ORJ1000D677 Resistor ChipMCRO3EZPJ101 1000H D709 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 R504 0RJ0562D677 _ Resistor ChipMCROSEZPJ560 560HM D710 ODSIHO0018A Diode SwitchingENKMC2837 T112 1 R505 0RJ4700D677 _ Resistor ChipMCROSEZPJ471 4700H D711 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 R506 ORJ1000D677 Resistor ChipMCRO3EZPJ101 1000H D712 ODSONO0138A Diode SchottkyMMBD301LT1G 600MV R507 ORJO562D677 Resistor ChipMCRO3EZPJ560 560HM D713 0DD184009AA Diode AssemblyKDS184 KDS184 TP R508 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO
27. end the two remaining leads perpendicular y to the circuit board 3 Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board 4 Securely crimp each connection and solder it 5 Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake 2 Securely crimp the leads of replacement component around notch at stake top 3 Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures LGE Internal Use Only Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much coppe
28. er AC 100 240V 50 60Hz 0 8A 5 2 Power Consumption MODE HN SYNC VIDEO POWER CONSUMPTION LED COLOR less than 45W max POWER ON NORMAL ON ON ACTIVE BLUE less than 40W typ STAND BY OFF ON OFF less than 1W AMBER SUSPEND ON OFF OFF less than 1W AMBER DPMS OFF OFF OFF OFF less than 1W AMBER POWER S W OFF less than 1W OFF 6 ENVIRONMENT 6 1 Operating Temperature 10 C 35 C 50 F 95 F Ambient 1026 8096 Non condensing 50 000 HRS with 9096 Confidence 50 000 Hours Min 6 2 Relative Humidity 6 3 MTBF Lamp Life 7 DIMENSIONS with TILT SWIVEL Width 471 8 mm 18 57 Depth 230 mm 9 06 Height 999 7 mm 15 74 8 WEIGHT with TILT SWIVEL Net Weight Gross Weight 3 9 kg 8 60 Ibs 5 0 kg 11 02 lbs LGE Internal Use Only TIMING CHART VIDEO A E __4 E si pee SYNC E d Sync Dot Total Video Sync Front Blanking ODE H V Polarity Clock Frequency fs Beau ED oy By Resolution 1 H Pixels 28 321 31 468 900 720 18 108 54 720 X 400 V Lines 70 08 449 400 12 2 35 2 H Pixels 25 175 31 469 800 640 16 96 48 640 x 480 V Lines 59 94 525 480 10 2 33 3 H Pixels 31 5 37 5 840 640 16 64 120 640 x 480 V Lines 75 500 480 1 3 16 4
29. il immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device LGE Internal Use Only General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F 2 Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead Keep the soldering iron tip clean and well tinned Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners 5 Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F b Heat the comp
30. mic Chip0603B104K C906 OCE107EF610 Capacitor AL RadialKMG16VB100M C520 OCK104CF56A Capacitor Ceramic Chip0603B104K C907 OCE107EF610 Capacitor AL RadialKMG16VB100M C521 OCK104CF56A Capacitor Ceramic Chip0603B104K C908 OCK104CK56A Capacitor Ceramic Chip0603B104K C522 OCK104CF56A Capacitor Ceramic Chip0603B104K C909 OCK104CK56A Capacitor Ceramic Chip0603B104K C523 OCK104CF56A Capacitor Ceramic Chip0603B104K C910 OCK104CK56A Capacitor Ceramic Chip0603B104K C524 OCK104CF56A Capacitor Ceramic Chip0603B104K C911 OCK102CK56A Capacitor Ceramic Chip0603B102K C525 OCK104CF56A Capacitor Ceramic Chip0603B104K C912 OCK102CK56A Capacitor Ceramic Chip0603B102K C526 OCK104CF56A Capacitor Ceramic Chip0603B104K C913 OCK102CK56A Capacitor Ceramic Chip0603B102K C527 OCK104CF56A Capacitor Ceramic Chip0603B104K C914 OCE227EF610 Capacitor AL RadialKMG16VB220M C528 OCK104CF56A Capacitor Ceramic Chip0603B104K C915 OCK105CD56A Capacitor Ceramic ChipC1608X7R1 C529 OCK104CF56A Capacitor Ceramic Chip0603B104K C915 OCK475CC94A Capacitor Ceramic ChipC1608Y5VO0 C530 OCK104CF56A Capacitor Ceramic Chip0603B104K C531 OCK104CF56A Capacitor Ceramic Chip0603B104K DIODEs C532 OCK104CF56A Capacitor Ceramic Chip0603B104K C533 OCK104CF56A Capacitor Ceramic Chip0603B104K D701 ODSIHOO018A Diode SwitchingENKMC2837 T112 1 C534 OCK104CF56A Capacitor Ceramic Chip0603B104K D702 ODSIHOO018A Diode Swit
31. ng538 390 LB500J PCB Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 96 LGE Internal Use Only PRINTED CIRCUIT BOARD MAIN TOP C fee els RT05R704 R707 R706 R709 R708 RT12R713 33 aras cs30 z2 07
32. not press on the panel edge of the frame strongly or electric shock as this will result in damage to the Screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel Protect the module from the ESD as it may damage the electronic circuit C MOS Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time The module not be exposed to the direct sunlight Avoid contact with water as it may a short circuit within the module If the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes WARNING BE CAREFUL ELECTRIC SHOCK f you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE CONDUIT etc i To Instrument s expo
33. ode 12 Pattern 11 Video level 700mVp p m Adjust by commanding AUTO COLOR ADJUST m Confirm Success message in Screen or Check the data of OxFE OxFF address of EEPROM 0xA6 is OxAA after waiting 5 seconds m l there is FAULT message or the data of OxFE OxFF address of EEPROM 0xA6 is not OxAA do adjust again m f all Adjustment is completed the values of 6500K User Color and 9300K are saved automatically Do not Adjust 6500K for L207WT 3 2 4 3 Confirm at Total Assembly Line adjustment m Check the data of OxFE OxFF address of EEPROM 0xA6 is OxAA m f the data of OxFE OxFF address of EEPROM 0xA6 is not OxAA do adjust again by 3 2 4 2 3 2 4 4 Confirm PRESET 6500K Color coordinates and Adjust PRESET 9300K Color coordinates m Set as Aging mode ON by commanding AGING ON OFF command code m Select Module that is being used in present production by commanding MODULE SELECT m Send SYSTEM RESET command to set Module data m Input Full White Pattern Video level 700 mVp p m Set as 9300K by commanding COLOR MODE CHANGE Command code m Adjust to meet x 0 283 0 004 y 0 298 0 004 and confirm m Save 9300K Color by commanding COLOR SAVE Command code m Input Full White Pattern Video level 700 mVp p m Set as 6500K by commanding COLOR MODE CHANGE Command code m 6500K color adjustment Do not adjust for L207WT model It is adjust to meet x20 313 0 03 y 0 329 0 03 m Set as sRGB by commanding COLOR
34. onent lead until the solder melts c Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil 6 Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F b First hold the soldering iron tip and solder the strand against the component lead until the solder melts ABO c Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil d Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts 2 Draw away the melted solder with an anti static suction type
35. put changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage 6 Signal collection This part function is to collect the any change from the DC output and feed back to the primary through photo transistor Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Onl 21 d EXPLODED VIEW Copyright c 2007 LG Electronics Inc All right reserved LGE Internal Use Only Only for training and service purposes 22 Note Safety mark A EXPLODED VIEW PARTS LIST No Part No Description A 200 EAJ39826101 LCD Module TFT M201EW02 VC WSXGA 20 1INCH 1680X1050 300CD COLOR 92 16 10 1000 1 AUO 20 W WCG 92 Non Glare ZBD 16 7M Normally White mode response time Sms View A 300 ACQ33735402 Cover Assembly L207W 20 Cabinet Ass y_XG569 01 CKD 310 MFB38581401 Lens MOLD PMMA SAMSUNG TECHWIN LENS Lx72 Lx7w lens power LED Knob Double injection Power LED for L1972 Lxx7W 320 MCK38584101
36. r as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sh
37. s R715 0RJ0000D677 __ Resistor ChipMCRO3EZPJ000 OOHM R716 0RJ0332D677 _ Resistor ChipMCROSEZPJ330 330HM Q501 OTR390409AE TR BipolarkST3904 NPN 6V 60V 40 R717 0RJO752D677 Resistor ChipMCRO3EZPJ750 750HM Q701 OTR390609FA TR BipolarKST3906 MTF PNP 5V R718 ORJO682D677 Resistor ChipMCRO3EZPJ680 680HM Q702 OTR390609FA TR BipolarKST3906 MTF PNP 5V R719 0RJ0682D677 _ Resistor Chip MCROS3EZPJ680 680HM Q901 EBK39150701 TR BipolarKTA1241 PNP 8V 35V R720 0RJ0332D677 Resistor ChipMCRO3EZPJ330 330HM Q902 OTR390409AE TR BipolarKST3904 NPN 6V 60V 40 R721 0RJO752D677 _ Resistor ChipMCROSEZPJ750 750HM R722 0RJO752D677 _ Resistor ChipMCROSEZPJ750 750HM RESISTORs R723 0RJ0000D677 _ Resistor ChipMCRO3EZPJ000 OOHM R724 0RJ4701D677 _ Resistor ChipMCRO3EZPJ472 4 7KO R1 0RJ7501D677 Resistor ChipMCRO3EZPJ752 7 5KO R725 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO R2 0RJ7501D677 Resistor ChipMCRO3EZPJ752 7 5KO R726 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO R3 0RJ1201D677 Resistor ChipMCRO3EZPJ122 1 2KO R727 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO R4 0RJ1801D677 Resistor ChipMCRO3EZPU182 1 8KO R728 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO R5 0RJ1201D677 Resistor ChipMCRO3EZPJ122 1 2KO R729 0RJ4701D677 _ Resistor ChipMCRO3EZPJ472 4 7KO R501 ORJ1000D677 Resistor ChipMCRO3EZPJ101 1000H R730 ORJ2200D677 _ Resistor Chip MCROSEZPJ221 2200H R502 0RJ0562D677 Resi
38. sed METALLIC PARTS CRURA 1 5 Kohm 10W LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE lf unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the pic
39. solder removal device or with solder braid before removing the IC Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it 3 Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body 2 Bend into a U shape the end of each of three leads remaining on the circuit board 3 Bend into a U shape the replacement transistor leads 4 Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads 2 Remove the heat sink mounting screw if so equipped 3 Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body 2 B
40. stor ChipMCRO3EZPJ560 560HM R731 ORJ2200D677 _ Resistor ChipMCROSEZPJ221 2200H Copyright 2 2007 LG Electronics Inc All right reserved 25 LGE Internal Use Only Only for training and service purposes LOC NO PART NO DESCRIPTION SPECIFICATION LOC NO PART NO DESCRIPTION SPECIFICATION R732 0RJ1000D677 Resistor ChipMCRO3EZPJ101 1000H P5 3918TKK040A Packing542 70 MAIN PCB B R733 0RJ1000D677 Resistor ChipMCRO3EZPJ101 1000H P6 3918TKK040B Packing397 70 LB500J MAIN PCB S R735 0RJ2001D677 Resistor ChipMCRO3EZPJ202 2KOHM P7 3918TKK007H PackingBOX DW 1184 984 1100 1 C R736 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO P8 3918TKK038J Packing538 390 LB500J PCB R737 0RJ4701D677 _ Resistor ChipMCRO3EZPJ472 4 7KO P9 3918TKK038N Packing 1200 940 OX93 FOR SONY R738 0RJ4701D677 Resistor ChipMCRO3EZPJ472 4 7KO X501 6212AA2004F CrystalHC 49 U 14 31818MHZ 30PP R739 0RJ4701D677 _ Resistor ChipMCRO3EZPJ472 4 7KO R903 0RJ1002D677 1 Resistor ChipMCRO3EZPJ103 10KOH R904 0RJ2001D677 1 Resistor ChipMCRO3EZPJ202 2KOHM R904 0RJ3601D677 Resistor ChipMCRO3EZPJ362 3 6KO R905 0RJ3900D677 _ Resistor ChipMCRO3EZPJ391 3900H R906 0RH1002D622 Resistor ChipMCR10EZHJ103 10KOH R907 ORX0331K668 Resistor Metal Oxide FilmRSDO2F R909 0RJ0000D677 Resistor ChipMCROS3EZPJ000 0OHM R910 0RJ0000D677 Resistor ChipMCROS3EZPJ000 0OHM R911 0RJ1002D677 Resistor ChipMCRO3EZPJ103 10KOH
41. ture tube socket ground lead is connected and then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage 4 Do not spray chemicals on or near this receiver or any of its assemblies 5 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 90 99 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 6 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 7 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 8 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically
42. w TI in ovans 112 1909 Ex cnn We EE Af zu bm HEH SOIG E NOx zb e re LGE Internal Use Only 90 Copyright 672007 LG Electronics Inc All right reserved Only for training and service purposes 3 CONTROL A INI EMOS h nE Ua3 NY OF Bod KL AB DN NS I Eos DNS EN E ol z R ya S 7 DEIER B LO a D p i h re ma Nea yy y 2 Es LBrinrussH Die sugneB un D AL jum gt H T YM ILTI p E We 1 a TAIX 9 SCH KEE KSC 2 EM DD WN 091 AM DNE nd L HAG ANS ANY ege va LGE Internal Use Only 233 Copyright 672007 LG Electronics Inc All right reserved Only for training and service purposes LG Jul 2007 P NO MFL38456784 Printed in Korea
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