SPBT2932DM
Contents
1. A TOP VIEW 0 76 BOTTOM VIEW 13 5 1 65 co pitch 1 5mm amp 1 4mm Tolerances 0 025mm a 1 Ja RECOMMENDED LAND PATTERN TOP VIEW 1 3 12 DoclD026716 Rev 2 11 25 Mechanical dimensions SPBT2932DM Figure 4 Recommended land pattern ORE 14 i I 9 N ER del 7 16 4 I EH HA 2 HI ijd EE L le 12 RECOMMENDED LAND PATTERN TOP VIEW 12 25 DoclD026716 Rev 2 ky SPBT2932DM Hardware block diagram 4 Hardware block diagram Figure 5 SPBT2932DM module block diagram Supply Voltage Antenna So TO DO O DET Ly DoclD026716 Rev 2 13 25 Hardware design SPBT2932DM 5 Hardware design The SPBT2932DM module supports UART and GPIO hardware interfaces Please note that e All unused pins should be left floating do not ground e All GND pins must be well grounded e The area around the module should be free of any ground planes power planes trace routings or metal for 6 mm from the antenna in all directions e Traces should not be routed underneath th2. k SA life augmented SPBT2932DM Bluetooth v4 0 smart ready module 11 6mm x 13 5 mm Features e Bluetooth radio Fully embedded Bluetooth v4 0 with profiles Class 1 radio 128 bit encryption security Integrated antenna Dual mode Bluetooth classic and low energy supported e ST Micro Cortex M4 microprocessor up to 84 MHz 256 kb Flash 48 kb RAM e Serial interface UART e General VO 8 general purpose VO 1 LPO input e User interface AT command set abSerial Firmware upgrade over UART e CE FCC and BOE qualification pending e Single voltage supply 2 5 V typ e Micro sized form factor 11 6 x 13 5 x 2 9 mm e RoHS compliance September 2014 Datasheet preliminary data Application e Serial cable replacement e MM industrial control e Service diagnostic e Data acquisition equipment e Machine control e Sensor monitoring e Security system Description The SPBT2932DM micro sized Bluetooth smart ready module with integrated antenna boasts the smallest form factor available for a complete RF platform The SPBT2932DM is a surface mount PCB module that provides fully embedded ready to use Bluetooth wireless technology The SPBT2932DM supports both Bluetooth classic and low energy LE version v4 0 Our standard AT command set and Bluetooth stack are pre Flashed into the integrated Flash memory supporting Bluetooth 3 0 profiles and Bluetooth 4 0 serv
3. Electromagnetic compatibility and radio spectrum Matters ERM Electromagnetic compatibility EMC standard for radio equipment and services part 1 Common technical requirements EN60950 1 2006 A11 2009 A1 2010 Information technology equipment safety DoclD026716 Rev 2 21 25 Traceability SPBT2932DM 7 Traceability Each module is uniquely identified by a serial number stored in a 2D data matrix laser marked on the bottom side of the module The serial number has the following format WWYYDFFNNN Where WW week YY z year D product ID family FF production panel coordinate identification NNN progressive serial number Each module bulk is identified by a bulk ID Bulk ID and module 2D data matrix are linked by a reciprocal traceability link The module 2D data matrix traces the lot number of any raw material used 22 25 DoclD026716 Rev 2 ky SPBT2932DM Ordering information 8 Ordering information Table 9 Ordering information Order code Description Packing MOQ SPBT2932DM Bluetooth V4 0 data module JEDEC tray 2448 pcs DocID026716 Rev 2 23 25 Revision history SPBT2932DM 9 24 25 Revision history Table 10 Document revision history Date Revision Changes 05 Sep 2014 1 Initial release Table 1 has been modified 23 Sep 2014 2 Document status promoted from product preview to preliminary data DoclD026716
4. Rev 2 SPBT2932DM IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections enhancements modifications and improvements to ST products and or to this document at any time without notice Purchasers should obtain the latest relevant information on ST products before placing orders ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement Purchasers are solely responsible for the choice selection and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products No license express or implied to any intellectual property right is granted by ST herein Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product ST and the ST logo are trademarks of ST All other product or service names are the property of their respective owners Information in this document supersedes and replaces information previously supplied in any prior versions of this document 2014 STMicroelectronics All rights reserved d DoclD026716 Rev 2 25 25
5. F I Cl PT 3 A Z pi id Note Rpy ranges from 30 kW to 50 kW internally DoclD026716 Rev 2 17 25 Hardware design SPBT2932DM 5 6 2 Note 5 7 18 25 Internal reset circuit Figure 11 Internal reset circuit REST PIN Rpy ranges from 30 kW to 50 kW internally Rrsr should be from 1 kW to 10 kW External LPO input circuit An optional low power oscillator input may be added to allow deep sleep and sniff modes e LPO parameters Frequency 32 768 kHz Tolerance 150 ppm typical 250 maximum Absolute maximum supplied voltage at LPO pin 1 8 V VIL min max 0 V 0 5 V VIH min max 1 47 V 1 8 V Input capacitance 2 5 pF maximum e Configurations Use two configuration variables UseExtLPO and AllowSniff Table 8 System configuration variables Variable Name Default Description True when a 32 768 kHz low power oscillator is present Var UseExtLPO auto x and false if not present Enables sniff mode Must be false when no 32 768 kHz Var AllowSniff false LPO is present DoclD026716 Rev 2 ky SPBT2932DM Hardware design Figure 12 External LPO circuit S PB T2932DM DoclD026716 Rev 2 19 25 Regulatory compliance SPBT2932DM 6 6 1 6 2 20 25 Regulatory compliance FCC and IC certification This module has been tested and found to comply with the FCC part 15 and IC RSS 210 rules Thes
6. Table 3 Current consumption continued Modes typical power consumption Avg Unit Connection 375 ms sniff external LPO required 590 HA Standby without deep sleep 4 9 mA Standby with deep sleep no external LPO 1 2 mA Standby with deep sleep with external LPO 140 HA Page inguiry scan with deep sleep no external LPO 2 6 mA Page inquiry scan with deep sleep with external LPO 720 HA BLE advertising 1 28sec non connectable with external LPO 195 HA BLE advertising 1 28sec discoverable with external LPO 215 HA Bluetooth power down CPU standby 11 HA 2 4 VO operating characteristics Table 4 VO operating characteristics Symbol Parameter Min Max Unit Conditions Vil Low level input voltage 0 6 V Vin 2 1 V VIH High level input voltage 1 4 V Vin 2 1 V VOL Low level output _ 0 4 V Vin 2 1 V voltage VOH High level output 1 8 _ V Vin 2 1 V voltage IOL ow ve output E 4 0 mA VOL 0 4 V current IOH High level output i 4 0 mA VOH 1 8 V current RPU Pull up resistor 80 120 kQ Resistor turned on RPD Pull down resistor 80 120 kQ Resistor turned on 2 5 Selected RF characteristics Table 5 Selected RF characteristics Parameters Conditions Typical Unit Antenna load 50 ohm Radio receiver Sensitivity level BER lt 001 with DH5 92 dBm Maximum usable level BER lt 001 with DH1 0 dBm ky DoclD026716 Rev 2 7 25 Hard
7. chitecture o EE Eed Upper layer stack BT RFCOMM amp SPD Am vote __ p HCI e Lower layer LMP lt gt NN DocID026716 Rev 2 5 25 Hardware specifications SPBT2932DM 2 Hardware specifications General conditions Viy 2 5 V and 25 C 2 1 Recommended operating conditions Table 1 Recommended operating conditions Rating Min Typ Max Unit Operating temperature range 20 60 C Supply voltage Vin 2 0 2 5 3 6 V Signal pin voltage 2 1 V RF frequency 2402 2483 5 MHz 1 T value will be published at the end of module qualification test 2 2 Absolute maximum ratings Table 2 Absolute maximum ratings Rating Min Typ Max Unit Storage temperature range 55 105 C Supply voltage Vin 0 3 2 5 5 0 V VO pin voltage Vio five volt tolerant pin 0 3 2 1 5 5 V RF input power 5 dBm 2 3 CPU current consumption e Standard CPU mode 8 MHz e UART supports up to 115 Kbps e Data throughput up to 200 Kb o FW version 1 5 e Shallow sleep enabled Table 3 Current consumption Modes typical power consumption Avg Unit ACL data 115 K baud UART at max throughput master 16 5 mA ACL data 115 K baud UART at max throughput slave 18 5 mA Connection no data traffic master 5 2 mA Connection no data traffic slave 7 4 mA 6 25 DoclD026716 Rev 2 SPBT2932DM Hardware specifications
8. e limits are designed to provide reasonable protection against harmful interference in approved installations This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference may not occur in a particular installation This device complies with part 15 ofthe FCC rules Operation is subject to the following two conditions 1 this device may not cause harmful interference 2 this device must accept any interference received including interference that may cause undesired operation Modifications or changes to this equipment not expressly approved by the part responsible for compliance may render void the user s authority to operate this equipment Modular approval FCC and IC FCC ID X3ZBTMOD7 IC 8828A MOD7 In accordance with FCC part 15 the SPBT2932DM is listed above as a modular transmitter device Label instructions When integrating the SPBT2932DM into the final product it must be ensured that the FCC labeling requirements as specified below are satisfied Based on the public notice from FCC the product into which the ST transmitter module is installed must display a label referring to the enclosed module The label should use wording such as the following Contains transmitter module FCC ID X3ZBTMOD7 IC 8828A MOD7 Any similar wording that expre
9. e module 5 1 Module reflow installation The SPB2932DM is a surface mount Bluetooth module supplied on an 18 pin 6 layer PCB The final assembly recommended reflow profiles are indicated below The soldering phase must be executed with care In order to avoid the undesired melting particular attention must be taken during the setup of the peak temperature The following provides some suggestions for the temperature profile based on IPC JEDEC J STD 020C July 2004 recommendations Table 7 Soldering Profile feature PB free assembly Average ramp up rate Tsmax to Tp 3 C sec max Preheat Temperature min Ts min 150 C Temperature max Ts max 200 C Time tg min to tg max ts 60 100 sec Time maintained above Temperature TL 217 C Time tL 60 70 sec Peak temperature Tp 240 0 C Time within 5 C of actual peak temperature tp 10 20 sec Ramp down rate 6 C sec Time from 25 C to peak temperature 8 minutes max 14 25 DoclD026716 Rev 2 Ly SPBT2932DM Hardware design 5 2 5 3 5 4 Figure 6 Soldering profile p Critical Zone T tol Temperature gt lt M__ 25 C to Peak lt Time gt GPIO interface All GPIOs are capable of sinking and sourcing 6 mA of VO current GPIO 1 to GPIO 8 are internally pulled down with 100 kQ nominal resistors except GPIO 2 which is floating GPIO configuration Module GPIO configuration depends o
10. ices Commands will be listed in the FW user manual UM1801 DoclD026716 Rev 2 1 25 This is preliminary information on a new product now in development or undergoing evaluation Details are subject to change without notice www st com Contents SPBT2932DM Contents 1 Software architecture ccc 4 1 1 Lower layer stack pannen nei raakten BAGAY 4 1 2 Upper layer stack Data FW c c cc ee 4 1 3 AT Command SE ss ANAK HH riet 4 1 4 Bluetooth firmware implementation 5 2 Hardware specifications nennen nenne 6 2 1 Recommended operating conditions 6 2 2 Absolute maximum ratings 4 6 23 CPU current consumption IE AA DEE AKING 6 2 4 VO operating characteristics 7 2 5 Selected RF characteristics neee 7 2 6 Pin ASSIQNiNGM valas ave RE AT aid 8 3 Mechanical dimensions RR RR RR RR RR RR RR RR ae 11 4 Hardware block diagram nennen nun 13 5 Hardware design cut aa So RR NAN edn ae 14 5 1 Module reflow installation ie essen een nn 14 52 lt GPIO internace une erben ie BEGEER 15 53 GPIO configuration ser neen rde HE RO EE e Ara 15 5 4 UART INSAS lt cc si Na kaa by BAK RR VER RES KOERS heek 15 5 5 PCB layout guideline ses paaa KGG DEE BEDE SO RE OE RE es 17 5 6 R SETCIFCUIN 12 AE BAR elsa dee LE OOR en 17 5 6 1 Ex
11. n the FW embedded GPIO can be reconfigured using the following commands e Atrab gpioconfig GPIO pin I O e Atrab gpioRead GPIO pin e Atrab gpioWrite GPIO pin 1 0 For additional details refer to user manual UM1801 UART interface The UART is compatible with the 16550 industry standard Four signals are provided with the UART interface The TXD and RXD pins are used for data while the CTS and RTS pins are used for flow control DoclD026716 Rev 2 15 25 Hardware design SPBT2932DM 16 25 Figure 7 Connection to host device RS 232 TRANSCEIVER Bluetooth module AM12028v1 DoclD026716 Rev 2 ky SPBT2932DM Hardware design 5 5 PCB layout guideline Figure 9 PCB layout guideline Application PCB NA Floaded ground plane required traces allowed Eu Zr minimum traces to these pins 2 6mm clear zone surrounding antenna NO ground plane amp traces 5 6 Reset circuit Two types of system reset circuits are detailed below The maximum voltage that can be supplied to the RESET pin is 2 5 V As shown in Figure 10 and Figure 11 the RESET is active low In the absence of a reset circuit the pin is internally pulled up and therefore inactive 5 6 1 External reset circuit Figure 10 External reset circuit External reset circuit go ne Rey RESTPIN YA 1 ir h 0 1p
12. sses the same meaning may be used Bluetooth certification The module with embedded stack and profile has been qualified according to SIG qualification rules e Bluetooth SIG Qualified Design QD ID 58674 e Product type End Product e TGP version Core 4 0 e Core spec version 4 0 e _ Product descriptions Bluetooth module spec v4 0 DoclD026716 Rev 2 ky SPBT2932DM Regulatory compliance 6 3 d CE certification Module has been certified according to following certification rules CE Expert Opinion TBD Measurements have been performed in accordance with report available on request EN 300 328 V 1 8 1 2012 06 2 EN 301 489 17 V 2 2 1 2012 09 EN 301 489 1 V 1 9 2 2011 09 EN60950 1 2006 A11 2009 A1 2010 d CE certified C 0051 EN 300 328 V 1 8 1 2012 06 Electromagnetic compatibility and radio spectrum matters ERM Wideband transmission systems data transmission equipment operating in the 2 4 GHz ISM band and using wideband modulation techniques harmonized EN covering essential requirements under article 3 2 of the R amp TTE directive EN 301 489 17 V 2 2 1 2012 09 Electromagnetic compatibility and radio spectrum matters ERM Electromagnetic compatibility EMC standard for radio equipment and services part 17 specific condition for 2 4 GHz wideband transmission systems and 5 GHz high performance RLAN equipment EN301 489 1 V 1 9 2 2011 09
13. ternal reset circuit ee 17 5 6 2 Internal reset circuit LL 18 5 7 External LPO inputcircUlt c c c 18 2 25 DoclD026716 Rev 2 Ly SPBT2932DM Contents 6 Regulatory compliance ss sms aen ee AA KA 20 6 1 FCC and IC certification 2 06 55 vun E eke eee ee eee ER EE 20 6 2 Bluetooth certification 0 cee ee 20 6 3 GE certification eu 21 7 Traceability is mi os Lue al ie ah ee od OE GE ic Dr e 22 8 Ordering information iis au saneren BKA daw en AM OE WE 23 9 Revision NISIOTY sasie es aa RR aa aan 24 Ly DoclD026716 Rev 2 3 25 Software architecture SPBT2932DM 1 1 1 2 1 3 4 25 Software architecture Lower layer stack Bluetooth v4 0 classic and low energy Device power modes active sleep and deep sleep Wake on Bluetooth feature for optimized power consumption of host CPU Authentication and encryption Encryption key length from 8 bits to 128 bits Persistent Flash memory for BD address and user parameter storage All ACL asynchronous connection less packet types Upper layer stack Data FW SPP and iAP Classic profiles battery and private low energy services Protocols classic RFCOMM SDP L2CAP Low energy ATT GATT AT Command Set The complete command list including the Bluetooth classic and low energy commands is included in user manual UM1801 DoclD026716 Rev 2 ky SPBT2932DM Software architecture 1 4 Bluetooth firmware implementation Figure 1 FW ar
14. ve low for 5 ms LPO LPCLK 15 LPO input 1 8 V 0 3 V max GPIO general purpose input output en Input pull GPIO 1 VO 1 purpose Y A p 4 own input output General GPIO 2 VO 2 purpose 12S_SD Y Floating input output General Input pull GPIO 3 VO 3 purpose 12S_CLCK Y i p own input output General GPIO 4 VO 4 purpose 12S_WS Y input output Input pull down General Input pull GPIO 5 VO 5 purpose I2C data Y p r own input output ky DoclD026716 Rev 2 9 25 Hardware specifications SPBT2932DM 10 25 Table 6 Pin assignment continued Are ALT su Name Type Pin Description function 5 V tolerant Initial state General facut all GPIO 6 VO 6 purpose 12C clock i p r own input output General Input pull GPIO 7 VO 17 purpose ADC 0 i p own input output General input pall GPIO 8 VO 16 purpose ADC 1 j p i own input output Lys DoclD026716 Rev 2 SPBT2932DM Mechanical dimensions 3 Mechanical dimensions In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade definitions and product status are available at www st com ECOPACK is an ST trademark Figure 3 Mechanical dimensions
15. ware specifications SPBT2932DM 2 6 8 25 Table 5 Selected RF characteristics continued Parameters Conditions Typical Unit Input VSWR 2 5 1 Radio transmitter Maximum output power 50 Q load 12 dBm Initial carrier frequency 0 kHz tolerance 20 dBm bandwidth for 935 kHz modulated carrier RF characteristics can be influenced by physical characteristics of final application Pin assignment Figure 2 Pin connection diagram 531 5 mil gt 13 5 mm 471 5 mil I 12 mm i I 55 mil 3 1 40 mm 296 5 mil I 31 2 mil M 77 5 MF 0 8 mm I TEE MANE UIE III 9 117 3101 ka u IG L sc road 2691 9 1 IC J A aa a grs 12 C 40 mil lt J LS 1 mm L 456 7 mil D PI 11 T LZ 2 G 11 6 mm S GPI RESET 1 r i G semi 1 BOOTO 9 1 5 mm IN u D VINE Pi C se KA ANG L DoclD026716 Rev 2 d SPBT2932DM Hardware specifications Table 6 Pin assignment a ALT pa Name Type Pin Description function 5 V tolerant Initial state UART interface RXD 13 Receive Y data o Transmit TD data Clear to RTS O 12 send active 12C data Y low Request to CTS 11 send active 12C clock Y low Boot loader Boot 0 9 Boot 0 Power and ground Vin 8 Vin GND 7 GND LDO output 2 1 V LDout 18 Reset Reset input RESETN 10 acti
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