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Datasheet - Dialog Semiconductor

1. Note 1 NC means leave unconnected GND means internally connected to the module ground plane Every GND pin should be connected to the main PCB ground plane Note 2 All digital inputs have Schmitt trigger inputs After reset all I Os are set to input and all pull up or pull down resistors are enabled unless oth erwise specified PU Pull up resistor enabled PD Pull down resistor enabled input O output Hi Z high impedance 1 logic HIGH level 0 logic LOW level Refer also to Px_DIR_REGs for INPUT OUTPUT and Pull up Pull down configurations All ULP pins use snap back devices as ESD protection which when triggered have a holding voltage below the typical battery voltage This means that the snap back device of a ULP pin may remain conductive when triggered while the pin is directly connected to the battery voltage If any of the ULP pins are directly or indirectly electrically accessible on the outside of the application system level ESD precau tions must be taken to ensure that the snap back device is not triggered while in active mode to prevent the chip from being damaged BINPOW 23210A SS JP109 2012 Dialog Semiconductor B V 7 Aug 29 2014 v1 6 2 0 2 1 SCOPE The SC14CVMDECT SF is a programmable DECT module for voice and data services The internal soft ware stack receives commands and data from the application for instance to set up a link to other mod ules The applicat
2. 1 frame 1st frame 2 frame 2d frame PCM out Channel 0 Channel 1 Channel 0 Channel 1 Figure 23 PCM bus with linear PCM 16 kHz sample rate BINPOW 23210A SSa p10yD 2012 Dialog Semiconductor B V 25 Aug 29 2014 v1 6 dialog O wb AP DATA FORMAT G711A AP DATA FORMAT _G711U with 8 kHz frame sync PCM CLK o m 8 KHz FSC 0 15 frame 1 frame 2 frame 2 4 frame 4 Pomin V 13t frame 13t frame 2 frame 2 frame AP_DATA FORMAT _G711A AP DATA FORMAT G711U with 16 kHz frame sync PCM CLK 16 KHz FSC 1st frame 13t frame 1 frame 1 frame 1s frame 15 frame 15t frame 1st frame Figure 24 PCM bus with G 711 A law p law 8 kHz sample rate AP DATA FORMAT CWB ALAW AP DATA FORMAT CWB _ULAW with 8 kHz frame sync G 722 used on air PCM CLK 8 KHz FSC 2 frame 1 frame 2 frame 1 frame 4 frame 3 frame 4 frame 3 f PCMin lt Channel OK Channel OK Channel 1X Channel 1 Channel OK Channel OK Channel 1X Channel 1 2 frame 1 frame 2 frame 1 frame 4 frame 3 frame 4 frame 3 frame PCM out lt Channe 0 x Channel 0X Channel 1X Channel 1 Channel 0X Channel OK Channel 1X Channel 1 AP _ DATA FORMAT CWB _ALAW AP DATA FORMAT CWB ULAW with 16 kHz frame sync G 722 used on air PCM CLK 16 KHz FSC 1 frame 2 4 frame 2 frame O PCMin lt Channel 0 Channel 0 Channel 1 o Channel
3. Figure 17 Clock synchronization 4 9 BATTERY MANAGEMENT Vsupply CHARGE_CTRL Figure 18 Handset PP application with 2x NiMH Figure 18 shows a handset application with NiMH SOC State Of Charge is used to measure the amount of charge in the rechargeable batteries Figure 19 shows an FP application The FP uses an external LDO so the SOC pins are not used and can be connected to GND The PP API supports battery management to calculate the battery capacity and to indicate charge status Refer to API document 2 The SOC circuit is used to very accurately determine the amount of charge in rechargeable batteries as well as the discharge state of Alkaline batteries This infor mation is essential for the battery charging algorithm and necessary for battery status indication to the user Battery status information is supported by the API Detailed information can be found in AN D 174 Bat tery Management 2012 Dialog Semiconductor B V 21 Vsupply VBAT IN MI Ley 4 CHARGE CHARGE_CTRL Figure 19 Base station FP application Pin CHARGE_CTRL is driven high when either the sensed voltage on the VBAT pin is lower than the voltage setting or sensed current via SOCp is lower than the current setting Pin CHARGE_CTRL can drive up to 500 pA as source current see Table 20 Detailed setting
4. N A GD GD GD 8 DP3 P2 4 SCL1 PCM_DO VDDPA SF P2 5 PCM_FSC CP_VOUT1 N JTAG D D DP0 PAOUTn P3 0 N RSTn 34 35 29 31 32 36 37 39 40 41 4 4 48 PON P1 6 ULP XTAL ULP PORT BXTAL INT7 P2 7 VDDE RDI INT5 P1 5 TDOD INT4 P1 4 SIO INT3 P1 3 SK INT2 P1 2 LE INT1 P1 1 WTF_IN P2 6 Po 7 PWMI1SPLDI PO 6 SPI_DO PO 5 SPLCLK PO 4 SPLEN PO 3 SCL2 URX2 PO 2 SDA2 UTX2 Po 1 PWM0 URX Po 0 UTX Figure 1 Connection diagram top view leads face down Order numbers SC14CVMDECT SFO1T tray MPQ 600 pcs up to 6 PPs can be registered SC14CVMDECT SFO02T tray MPQ 600 pcs up to 64 PPs can be registered BINPOW 23210A SSe p10yD 2012 Dialog Semiconductor B V 4 Aug 29 2014 v1 6 1 1 PIN DESCRIPTION Table 1 Pin description ldialo SEMICONDUCTOR Pin Module Pin name Note 1 Description GND Ground PO Control port for FAD See 4 13 RFPO Control port for FAD See 4 13 POn Control port for FAD See 4 13 RFPOn Control port for FAD See 4 13 GND Ground VREFp Positive microphone supply voltage CO NIOO a AJ OJ Nj MICp Positive microphone input MICn Negative handset microphone input MICh Headset microphone input with fixed input protection VREFm Negative microphone reference star point connect to GND L
5. A full duplex UART for communication with an embedded user software optional host processor A 4 KB VES Virtual EEPROM Storage used by the 3 2 SOFTWARE CONTROL protocol stack and for user variables The application software is written by the customer and A DSP for the audio signal processing like ADPCM has to manage the call control and also the MMI func voice compression towards the CODEC tions The supported API software includes the Net work layer that is defined in figure 1 of the EN300 175 3 document which describes the DECT protocol stack Detailed functions and data flows including some Input Output ports which can be toggled high low as example sequences can be found in document refer an output or a high low digital level can be read as ence 1 for FP and 2 for PP an input A 20 736 MHz XTAL This crystal is automatically tuned by the PP module software for optimal radio performance A CODEC converts the analog signals to digital sig nals and vise versa 3 3 DECT PROTOCOL STACK The SC14CVMDECT SF internal protocol stack is based on the ETSI DECT specifications and is compli ant with ETSI 300 444 GAP Voltage regulators convert the external supply volt age VBAT to stable supply voltages for the core The product supports up to 6 DECT GAP compliant PP and the I Os units to one FP station BINPOW 2210A SSa p10yD 2012 Dialog Semiconductor B V 10 Aug 29 2014 v1 6 dialog 3 4 PORTABLE PA
6. S S S 3 je 0 1000 mA m l 1 100 mA 1000 mA input current l l l l B SoC_sym_err A B Figure 34 State of charge SOC counter accuracy 6 7 BASEBAND PART Table 22 Baseband specifications PARAMETER DESCRIPTION CONDITIONS Fbit_uart Serial interface bit rate UART Interface for external microprocessor or PC Fbit_flash Flash download bit rate Via UART 0 Ibat_stdby_fp Standby supply current FP application 3 3 V Q Ibat_act_fp Active supply current FP application 3 3 V Ibat_stdby_pp Standby supply current PP application 3 3 V m lbat act pp Active supply current PP application 3 3 V 2 0 0 p O a p 2012 Dialog Semiconductor B V 36 Aug 29 2014 v1 6 6 8 RADIO RF PART Standards compliancy ETS 301 406 former TBR6 Table 23 Radio specifications dialo SEMICONDUCTOR PARAMETER DESCRIPTION CONDITIONS P_Rx Receiver sensitivity BER 0 001 TA 25 C P_Rx_T Receiver sensitivity full temperature range BER 0 001 40 C lt TA lt 85 C IPL Intermodulation perfor section 4 5 7 6 mance level EN 301 406 TA 25 C Pw 80 dBm Af 2 channels Normal transmitted power DECT and J DECT DECT6 0 temperature range RFPA power variation full 40 C lt TA lt 85 C Bit rate GFSK modulation Transmitter bandwidth DECT GFSK NTP 20 dB Table 2
7. handset location AS LOAGWADVLOS 5 2 CAT IQ PROFILE OVERVIEW The CAT iq profiles are split between voice and data services with CAT ig 1 0 and CAT iq 2 0 providing fea tures to support key voice enhancements and CAT iq 3 0 and CAT ig 4 0 providing features to support data 5 2 1 Supported main features e Narrowband G 726 and wideband G 722 audio and switching between these two codecs is sup ported CLIP CNIP CLIR Calling Line Identification Pres entation Calling Name Identification Calling Line Identity Restriction for internal and external calls Synchronization of call lists and telephone books missed calls list incoming accepted calls list inter nal names list unique identifier of each handset base telephone book Synchronization of system settings PPs are enabled to change partly the configuration of the system con sisting of FP and PPs these system settings are handled using the list access method Using this method the FP and the PPs support e Synchronization of time and date for FP and PPs that FP is enabled to transmit time and date to the PPs Reset to factory settings means that PP is ena bled to reset the FP configuration to its factory setting Obtaining FP versions means that a PP can obtain the software release of the FP Multiple lines handling The behaviour of DECT sys tems connected to multiple network lines These lines may be of different types VoIP and PSTN for exam
8. see Figure 32 Rs_PAOUT Snubber resistor to Required when Class D is used reduce ringing at to prevent EMI and guaranteed PAOUTp n life time see Figure 32 AS LOAGWADVLOS PAOUTp Rs_PAOUT VDDPA VSS GND PAOUTn fa Rs_PAOUT Figure 32 Class D external components Efficiency 75 at 300 mW 2 V 500 mW 25 V into a 4 Q transducer 2 5 V VBAT dummy load models typical speaker AP system2 settings VDDPA influence from filter A weighting GND 2s DUT input high ohmic DUT PAOUTp 1 uF ceramic PAOUTn AP AUX 0025 passive switching ampli fier measurement filter Figure 33 CLASS D amplifier measurement setup BINPOW 23210A SSa p10yD 2012 Dialog Semiconductor B V 35 Aug 29 2014 v1 6 dialog SEMICONDUCTOR 00 6 6 BATTERY MANAGEMENT O Pani Table 20 CHARGE_CTRL pin 2 PARAMETER DESCRIPTION CONDITIONS Voh_charge_cirl Drive capability of pin sourcing 500 uA m Vol_charge_ctrl CHARGE_CTRL sinking 100 pA S Table 21 State of charge circuit SoC Operating condition 0 PARAMETER DESCRIPTION CONDITIONS Vsocp_socn Input voltage With the prescribed 0 1 Q sense between SOCp and resistor this results in the usable cur SOCn rent range A A SoC_asym_er 9
9. 2014 v1 6 g AS LOAGWADVLOS BINPOW 23210A SSe p10g dialo SEMICONDUCTOR Nominal value adjusted during production at the RLR and SLR test Steps are eeprom configurable 6 Volume steps Figure 13 Handset volume configuration 4 5 PP AUDIO MODES The PP audio handling consists of four audio states see Figure 14 In these states the audio subsystem is configured for a certain audio mode 1 Idle mode not relevant for microphone configu ration Earpiece mode Handset speaker Handsfree or Speakerphone mode 4 Headset mode Selection between the modes is done via API calls see document reference 2 The Alert state is for tone playing and is entered auto matically when tones are played using the API calls The Alert state can originate from idle earpiece handsfree or headset mode API_PP_AUDIO SET_ MODE REQ API_AUDIO_MODE_ EARPIECE API_PP_AUDI API_AUDIO_MODE_ HANDSFREE A Earpiece Audio API_AUDIO_ API_PP_AUDIO_SET_MODE_REQ APL AUDIO MODE_ EARPIECE API_PP_AUDIO_SET_MODE_REQ API_AUDIO_MODE_ HEADSET gt API_PP_AUDIO SET_MODE REQ Headset Audio a J O SET_MODE_REQ MODE _ EARPIECE API_PP_AUDIO_SET_MODE_REQ APL AUDIO MODE_ EARPIECE API_PP_AUDIO_SET_MODE_REQ API_AUDIO_MODE_ HEADSET I Figure 14 PP audio modes 4 5 1 Power management To minimize the current consumption the PP will shut down all code
10. lage est susceptible d en compromettre le fonctionne ment CAN ICES 3 B NMB 3 B Aug 29 2014 v1 6 dialo SEMICONDUCTOR g AS LOAGWADVLOS BINPOW 3210A SSa pP10D dialog 9 3 PRECAUTIONS REGARDING UNINTENDED COUPLING Integration on the main board precautions shall be taken in order to avoid any kind of coupling from the main board to the RF part of the module If there is any doubt about this a radio short test should be performed 9 4 END APPLICATION APPROVAL The module is intended to be used in an end applica tion Type approval concerning the end product except for the module should off cause be done Please con tact a test house in order to clarify what is needed AS LOAGWNAOVLOS 9 5 SAFETY REQUIREMENTS This section provides of an overview of the safety requirements you must adhere to when working with the Cordless Voice Module SC14CVMDECT SF e The specific external power supply for the Cordless Voice Module SC14CVMDECT SF has to fulfil the requirements according to clause 2 5 Limited power source of this standard EN 60950 1 2006 Interconnection circuits shall be selected to provide continued conformance to the requirements of clause 2 2 for SELV Safety Extra Low Voltage cir cuits according to EN 60950 1 2006 after making connections Interface type not subjected to over voltages i e does not leave the building Requirements additional to those specified in this standard may b
11. 0 Channel 0 Channel D e 1 frame fi 2 frame 2 frame Q PCMout Channel 0 Channel 0 0 0 Figure 25 PCM bus with compressed wideband using A law u law G722 used on air interface e 0 D e Q c D 2012 Dialog Semiconductor B V 26 Aug 29 2014 v1 6 SEMICONDUCTOR PCM CLK 8 KHz FSC 15t frame Channel 1 1st frame Channel 1 1tframe 1 frame Channel OK Channel 0 PCM in 15t frame Channel 1 13t frame Channel 1 1 frame 1 frame Channel OK Channel 0 PCM out PCM CLK 16 KHz FSC 13t frame 13t frame 1st frame PCMin lt Channel 0 1st frame PCM out lt Channel 0 AP_DATA FORMAT CWB_ALAW AP_DATA FORMAT CWB_ULAW with 8 kHz frame sync G 726 on air AP_DATA_FORMAT_CWB_ALAW AP_DATA_FORMAT_CWB_ULAW with 16 kHz frame sync G 726 on air 2 frame Channel 1 2 frame Channel 1 2 4 frame Channel 0 2 frame Channel 0 2 4 frame Channel 1 2 frame Channel 1 2 frame Channel 0 2 frame Channel 0 15 frame 1 frame 1t frame Figure 26 PCM bus with compressed wideband using A law p law G726 used on air interface 4 12 7 PCM Interface for PP The SC14CVMDECT SF supports PCM interface func tionality to connect to an external audio source destina tion Refer to document 2 for detailed information e PCM interface mode supports only master mode PCM_FSC frequency supp
12. 1890 432 1892 160 1893 888 1895 616 1897 344 1899 072 1900 800 1902 528 1921 536 1923 264 1924 992 1926 720 1928 448 AS LOAGWNAOVLOS Oo N wo BR GT MI NI o RF setting values must be followed according to AN D 204 when DECT country mode was changed BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 39 Aug 29 2014 v1 6 7 0 Design guidelines This section describes the software and hardware con siderations to be taken into account when designing the target application The SC14CVMDECT SF can be used standalone or next to an MCU that controls the module In case the module is used standalone the application will be stored in its on board Flash In total 324 kB of Flash is available for this purpose Applications can be developed with the Athena soft ware development environment see reference 3 7 1 APPLICATION SOFTWARE FOR PP In a PP application the following software tasks must be handled by the MCU or within the module itself UART communication external microprocessor only PP MMI Display interface optional Keyboard interface optional Battery Charge interface optional Audio handling Tone Melodies handling For control commands see document reference 2 UART communication The UART communication is the main control interface of the SC14CVMDECT SF PP MMI The MMI state machine must handle th
13. ADPCM and G 722 64 kbit s ADPCM See Figure 5 3 7 LIGHT DATA APPLICATION The SC14CVMDECT SF supports Low Data Rate 2012 Dialog Semiconductor B V 3 8 LU10 DATA APPLICATION The SC14CVMDECT SF supports CAT iq LU10 data transmission up to 54 kbit s Since LU10 data commu nication uses the B Field it cannot be used in combina tion with voice communication See Figure 6 Aug 29 2014 v1 6 BINPOW 2210A SS JP109 dialog SEMICONDUCTOR 00 0 wk Aa O lt U m G 726 1 6 kbit s O j 00 Tl G 722 1 6 kbit s Figure 5 Voice and LDR data communication G 722 1 6kbit s 54 kbit s SC14CVMDECT PP Figure 6 LU10 data application 0 Oo D 0 0 lt 2 0 p O a p 2012 Dialog Semiconductor B V 13 Aug 29 2014 v1 6 3 9 GENERAL FEATURES Standard FP audio control feature Table 4 Supported general features ldialo SEMICONDUCTOR Functionality Note 6 PP support FP support Call handling Conferencing Yes Call between FP and 4x PP Intercom Yes Call between FP and 4x PP Walkie Talkie mode Call between PP and PP without FP Baby monitor Voice Activated PP See document reference 2 Voice over PCM interface u law 64 kbit s A law 64 kbit s G 726 ADPCM 32 kbit s G 722 ADPCM 64 kbit s Linear 128 kbit s Call transfer Transfer call between PPs on FP Page call FP pages a
14. Note 2 Description 28 GND Ground 29 PON 270k fixed pull down Power on Switches on the device if Voltage gt 1 5 V May be directly connected to VBAT also with Li lon batteries After startup the software takes over then PON pin to keep the device on after which the PON pin may be released ULP_XTAL 32 768 kHz XTAL clock input Connect to GND if not used Note 3 ULP_PORT Ultra Low Power Port Pin Connect to GND if not used Note 3 P2 7 I O port P1 5 I O Port P1 4 I O port P1 3 I O Port P1 2 I O Port P1 1 I O Port GND Ground P2 6 I O port PO 7 SPI_DI I O Port SPI Data Input PO 6 SPI_DO I O Port SPI Data Out PO 5 SPI_CLK I O Port SPI Clock PO 4 SPI_LEN I O port SPI_EN Active low PO 3 SCL2 URX2 I O port Access bus clock UART Serial In GND Ground PO 2 SDA2 UTX2 I O port Access bus data UART Serial Out PO 1 URX I O port UART Serial In PO 0 UTX I O Port UART Serial Out GND Ground GND Ground GND Ground RSTn Active low Reset input with Schmitt trigger input open drain output Input may not exceed 2 0 V An internal capacitor of 47 nF is mounted on this pin JTAG JTAG SDI one wire Debug interface with open drain P2 5 PCM_FSC I O Port PCM_FSC PCM Frame Syn
15. Regulator Figure4 FP configuration Table 3 provides the overview of required and availa ble interfaces for a basic or a feature rich cordless FP with the SC14CVMDECT SF Table 3 FP support overview Remark Use external 3 3 V LDO On external MCU On external MCU All digital IO port pins can be controlled via API 4x 16 bits serial I O PCM_FSC 8 kHz 16 kHz 115 2 kbit s used for API commands Not supported by API Connected to LSRp and or LSRn supports single end and differential Note 5 Connected to MICp and or MICn and or MICh supports single end and differential Note 5 Connected to PAOUTp n Note 5 Not supported by API Item Supported No No No Yes Supply Regulator Keypad Display IO Ports PCM interface UART Headset detection LSR Earpiece headset Yes Yes No Yes MIC Earpiece headset Yes handsfree Yes No Yes Handsfree speaker PSTN Line interface Radio Integrated single antenna and support for external antenna s Note 5 AFE setting is configurable refer to document 1 3 6 VOICE COMMUNICATION An FP supports up to 64 registered PPs where 4 of these PPs can be in a call at the same time Multiple simultaneous calls are supported Supported voice LDR transmission up to 1 6 kbit s with IWU to IWU messaging The LDR can be used in combination with voice communication See Figure 5 codec is G 726 32 kbit s
16. of PCM_FSC pulse is equal to 32 data bits 4 12 4 Start position of FSC The PCM interface supports the following options e The FSC pulse starts 1 data bit before the MSB bit of the PCM channel 0 data e The FSC pulse starts at the same time as the MSB bit of the PCM channel 0 data 4 12 5 PCM clock frequency The PCM interface supports the following options in master mode e 1 152 MHz 2 304 MHz Aug 29 2014 v1 6 dialo SEMICONDUCTOR g AS LOAGWADVLOS BINPOW 23210A SSe p10yD dialog e G 711 u law 8 kHz sample rate Used for narrowband calls G 726 Compressed wideband using A law 16 kHz sample rate The 16 bit PCM data is encoded as two 8 bit audio samples if 8 kHz frame sync is used Used for wideband calls G 722 Compressed wideband using p law 16 kHz sample rate The 16 bit PCM data is encoded as two 8 bit audio samples if 8 kHz frame sync is used Used for wideband calls G 722 4 608 MHz e 1 536 MHz 4 12 6 PCM data mode The PCM interface supports the following PCM data formats e Linear PCM 8 kHz sample rate Used for narrowband calls G 726 e Linear PCM 16 kHz sample rate AS LOAGWADVLOS Used for wideband calls G 722 e G 711 A law 8 kHz sample rate Used for narrowband calls G 726 PCM_CLK PCM_DIPCM_DO PCM_FSG input DSP_PCM_CTRL_REGIs 0 PCM_FSC input DSP_PCM_CTRL_REGISI 1 PCM_FSC osp_po
17. sensors and or actuators System diagram Host t SC14CVMDECT Only end products can be CAT iq certified US EU JP DECT Voice data 32 kbit s 1 6 kbit s Host SC14CVMDECT gt Data 54 kbit s bia Voice data Fixed Part Host SC14CVMDECT lt gt Voice data Data Portable Part 0 Data Portable Part 1 T Voice data Host SC14CVMDECT apo Data Portable Part 5 2012 Dialog Semiconductor B V www dialog semiconductor com g AS LOAGWNADVLOS BINPOW 23210A SS JP109 1 0 Connection diagram 1 1 PINDESCRIPTION 2 0 Introduction 2 1 SCOPE 2 2 REFERENCES 2 3 GLOSSARY AND DEFINITIONS Cordless Voice Module functionality 3 1 MODULE HARDWARE 3 2 SOFTWARE CONTROL 3 3 DECT PROTOCOL STACK 3 4 PORTABLE PART CONFIGURATION 3 5 FIXED PART CONFIGURATION 3 6 VOICE COMMUNICATION 3 7 LIGHT DATA APPLICATION 3 8 LU10 DATA APPLICATION 3 9 GENERAL FEATURES Functional description 4 1 UART INTERFACE 4 2 VES VIRTUAL EEPROM STORAGE 4 2 1 VES layout 4 2 2 VES access by MCU AUDIO CONFIGURATIONS 4 3 1 Audio connection AUDIO ROUTING 4 4 1 FP AUDIO ROUTING 4 4 2 FP audio level adjustment 4 4 3 PP audio routing 4 4 4 PP audio codec adjustment 4 4 5 General audio adjustment 4 4 6 PP volume 4 4 7 PP audio equalization PP AUDIO MODES 4 5 1 Power m
18. 0 F lt 2 0 p O a Figure 43 Package outline drawing p 2012 Dialog Semiconductor B V 49 Aug 29 2014 v1 6 dialog SEMICONDUCTOR 11 0 Revision history Aug 29 2014 v1 6 e Changed RF output power spec e Added SF02 description Apr16 2014 v1 5 e Added an explanation for RF1 on 4 13 Feb 11 2014 v1 4 e Correct 10 3Copper pad solder openinG and STENCIL47 Jan 31 2014 v1 3 AS LOAGWNAOVLOS e Update 10 3Copper pad solder openinG and STENCIL47 Nov 8 2013 v1 2 e Added section 9 2 INDUSTRY CANADA REQUIREMENTS REGARDING THE END PROD UCT AND THE END USER Sept 12 2013 v1 1 e Ordering code for tray version corrected e Ordering code for tape on reel version removed July 9 2013 v1 0 Initial version BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 50 Aug 29 2014 v1 6 dialog Product Status Definitions Datasheet Status Product Status Definition Advance Information Formative or in Design This data sheet contains the design specifications for prod uct development Specifications may change in any manner without notice Preliminary First Production This data sheet contains preliminary data Supplementary data will be published at a later date Dialog Semiconductor reserves the right to make changes at any time without notice in order to improve design and supply the best possi ble product AS LOAGWNADVLOS No Identification Noted Full producti
19. 4 RFPA preferred settings for various power modes PP application Address VES Register Parameter HPM U USA HPM Europe HPM J Japan Note 22 0x39 RF_PA_CTRL1_REG 0x09A0 Ox0CFO 0x2CE0 0x3B RF_TEST_MODE2_REG 0x0056 0x0062 0x0068 0x3D RF_BBADC_CTRL_REG 0x0380 0x03A0 0x0398 0x05 RF_PLL_CTRL2_REG MODINDEX 0x25 0x25 0x23 0x23 Upper RSSI threshold 0x2C N A 0x28 0x24 Lower RSSI threshold 0x22 N A Ox1E Note 22 This power setting is available only for full slot 2012 Dialog Semiconductor B V 37 Aug 29 2014 v1 6 g AS LOAGWAOVLOS BINPOW 2210A SSa pP10yD 6 9 RF POWER SUPPLY Table 25 Requirements for linear supply regulator dialog SEMICONDUCTOR PARAMETER DESCRIPTION CONDITIONS VBAT IN Voltage at VBAT SW Unloaded Vg Loaded Vpe V1 Vo V3 Settling time I 50 mA Receive period I 130 mA AS LOAGWADVLOS Transmit period I 550 mA Drop during transmit Settling time Receive Transmit period Figure 35 RF power supply 2012 Dialog Semiconductor B V 38 BINPOW 2210A SS JP109 Aug 29 2014 v1 6 dialog 6 10 RF CHANNEL FREQUENCIES Table 26 RF frequencies and channel numbers Frequency DECT J DECT DECT6 0 MHz CH CH CH 1881 792 1883 520 1885 248 1886 976 1888 704
20. 43 2012 Dialog Semiconductor B V 9 0 Notices to OEM The end product has to be certified again if it has been programmed with other software than Dialog standard software stack for portable part and or uses one or two external antenna s 9 1 FCC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER The end product that the module is integrated into must be marked as follows Contains Transmitter Module FCC ID Y82 SC14S IC 9576A SC 14S The literature provided to the end user must include the following wording FCC compliance statement This device complies with Part 15 of the FCC Rules for only portable part Operation is subject to the following two conditions 1 this device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired opera tion of the device Module transmetteur ID IC 9576A SC14S Son fonctionnement est soumis aux deux conditions suivantes 1 cet appareil ne doit pas causer d interf rences nuisibles et 2 appareil doit accepter toute interf rence re ue y compris les interf rences qui peuvent perturber le fonctionnement Changes or modifications to the equipment not expressly approved by the Party responsible for com pliance could void the user s authority to operate the equipment NOTE This equipment has been tested and found to comply with the limits for a Class B digital device
21. 8 mA Note 15 0 2 VDD Voh_dig Logic 1 output level VDD 1 8 V lout 2 4 8 mA Note 15 0 8 VDD Note 15 For output drive capability see section Pin Description on page 5 2012 Dialog Semiconductor B V 31 BINPOW 22104A ssajp103 Aug 29 2014 v1 6 6 5 ANALOG FRONT END Table 11 Microphone amplifier dialog SEMICONDUCTOR PARAMETER DESCRIPTION CONDITIONS Vmic_OdB_unt Untrimmed differen tial RMS input volt age between MICp and MICn 0 dBmo reference level Note 9 0 dBm0 on COUT Note 17 MIC_GAIN 3 0 0 1020 Hz Tolerance e 13 when untrimmed BANDGAP_REG 8 Note 16 6 when trimmed Note 18 AS LOAGNWADVLOS Rin_mic Resistance of acti vated microphone amplifier inputs MICp MICn and MICh to internal GND Note 9 Vmic_offset Input referred DC off set Note 9 MIC_GAIN 3 0 1111 3 sigma deviation limits Note 16 BANDGAP_REG will be tuned at the factory Note 17 0 dBm0 on COUT 3 14 dB of max PCM value COUT is CODEC output in test mode Note 18 Trimming possibility is foreseen At system production the bandgap reference voltage can be controlled within 2 accuracy and data can be stored in Flash Either AVD or VREF can be trimmed within 2 accuracy If AVD is trimmed VREF will be within 2 accuracy related to either AVD Or vice versa VREF can be trimmed For Vref t
22. ART is normally used for API commands but can also be used for software upgrades and debug ging The UART is a full duplex UART with frame type 1 start bit 8 data bits LSB first 1 stop bit no parity up to 115 2 kBd dialo SEMICONDUCTOR The UART hardware interface uses only TX RX see Figure 7 TX serial out module pin 48 SC14CVMDECT RX serial in module pin 47 Figure 7 UART hardware configuration Caution All signals are 1 8 V see Table 8 Table 9 and Table 10 An external V 24 line driver must be provided if the UART port of the module is connected to a standard V 24 device Connecting the module without a driver may damage the module 4 2 VES VIRTUAL EEPROM Storage 4 2 1 VES layout The SC14CVMDECT SF PP and FP include a 4 kB VES which is divided into two areas see Table 5 Table 5 VES map execution The VES parameters are divided into 2 types e Factory type e Normal type The factory type is specific for the SC14CVMDECT SF and should only be set by production The factory type parameters are either adjustments used by the base band or the radio interface or are used to set up the SC14CVMDECT SF into special modes The factory type parameters will only be modified by changing the factory programmed default value See document ref erence 4 VES space Usage The normal VES parameters can be reset to their SC14CVM
23. DATASHEET SC14CVMDECT SF Cordless Voice Module General description The SC14CVMDECT SF is a member of the Cordless Module family with integrated radio transceiver and baseband processor in a single package It is designed for hosted and embedded cordless voice and data applications in the DECT frequency band Its simple to use API commands allow easy setup of a wireless link between two or more nodes Features m Supports EU DECT CAT iq V2 0 v3 0 partly DECT6 0 for North America and Japan DECT ETSI EU DECT and FCC DECT 6 0 certified J DECT pre certified ETSI 300 444 DECT GAP compliant Up to 64 Portable Parts or ULE devices registered per fixed part UART interface to external host Controllable via API command set Supports voice and data RF range 1870 MHz to 1930 MHz Receiver sensitivity lt 93 dBm dialo SEMICONDUCTOR AUG 29 2014 V1 6 Transmit power e EU 23 dBm 1881MHz 1897MHz e USA 20 dBm 1921MH 1928MHz e JP 23 dBm 1895MHz 1903MHz Antenna embedded supports external antennas Power supply voltage 2 1 V to 3 45 V Small form factor 19 6 mm x 18 0 mm x 2 7 mm Contains both PP and FP functionality Program memory available for custom software Supports both internal and external hosted applica tions Operating temperature range 40 C to 85 C Application examples Cordless intercom Cordless baby monitor Wireless data applications up to 54 kbit s FP supports ULE related
24. DECT Used for RF audio SF battery tone setup data base etc default values via software 4 2 2 VES access by MCU User Can be used for MMI applications such as User infor mation The host is able to read or modify the VES parameters or limited free VES areas via API command 4 3 AUDIO CONFIGURATIONS VES is supported as virtual EEPROM with the internal FLASH A detailed overview of the VES parameters can be found in document reference 4 Some parts of the VES parameters are read into the SC14CVMDECT SF during the start up and other parts are used by the SC14CVMDECT SF software during 2012 Dialog Semiconductor B V The SC14CVMDECT SF audio supports standard DECT audio qualities The audio gain and volume parameters are placed in the VES The DECT gains can be adjusted to meet the TBR38 and TBR10 audio level requirements by using the SC14CVMDECT SF application reference design For other line and acous tic designs it is required to adjust and tune the audio setup 15 Aug 29 2014 v1 6 g AS LOAGWADVLOS BINPOW 2210A SSa p10yD dialog 4 3 1 Audio connection plane From this VREFm star point one connection is The SC14CVMDECT SF PP audio connections are made to thecommon ground plane shown in Figure 8 Refer to Example Application Dia Loudspeaker connection gram on page 43 for detailed component values For the handsfree operation a 4 Q loudspeaker must be connected to the
25. DITIONS Vpa_4v Vpa_6v Differential rms output voltage between PAOUTp and PAOUTn Trimmed bandgap input 0 dBm0 1 kHz Note 17 Output low pass filtered CLASSD_VOUT 0 As above CLASSD_VOUT 1 Zload_pa_4v Zload_pa_6v Speaker impedance connected between PAOUTp and PAOUTn With these values the peak cur rents stays within the operating range Table 18 PAOUTp PAOUTn outputs Note 21 PARAMETER DESCRIPTION CONDITIONS Rout_pa Differential output resistance between PAOUTp and PAOUTn See Note 21 Note 21 Clipping o the outputs occurs when the VDDPA drops and the following conditions becomes true If CLASSD_CTRL_REG CLASSD_CLIP is not equal to zero then upon a programmable number of clipping occurrences a CLASSD_INT is generated The software can stop clipping by reducing the gain via the GENDSP peak LowPassFiltered PAOUTp PAOUTm s Zload Clipping occurs if VDDPA VSSPA Zload Rout_pa BINPOW 2210A SS JP109 2012 Dialog Semiconductor B V 34 Aug 29 2014 v1 6 dialog SEMICONDUCTOR Table 19 PAOUTp PAOUTn external components PARAMETER DESCRIPTION CONDITIONS C_VDDPA Decoupling capacitor on Required when Class D is used VDDPA and guaranteed life time see Figure 32 Cs_PAOUT Snubber capacitor to Required when Class D is used reduce ringing at to prevent EMI and guaranteed PAOUTp n life time
26. PAOUTp and PAOUTn pins as shown in Figure 9 The VDDPA is the supply pin VREFP q AS LOAGWADVLOS PAOUTp ee Rs_PAOUT g VDDPA VSS GND f Micia PAOUTn g Rs_PAOUT MICh q Cs_PAOUT Vv LSRe q LSRn qg Figure 9 Loudspeaker connection Refer to Table 19 for a detailed specification of the external components around the loudspeaker These components are necessary to guarantee the lifetime of the module Figure 8 Audio connections Earpiece or small loudspeaker connection The earpiece loudspeaker can be connected either dif ferentially or single ended Dynamic loudspeakers with an impedance of 30 Q can be connected as well as ceramic loudspeakers equivalent to 600 and 30 nF Refer to Table 16 for a detailed specification or the ear piece loudspeakers The earpiece is connected to the LSRp and LSRn pins Microphone connection The microphone can be connected either single ended via MICp or differentially to MICp and MICn Headset connection The headset microphone must be connected to the MICh pin The headset earpiece is connected to the LSRp Microphone supply connection For active microphones a voltage source with high sup ply voltage rejection ratio is provided on supply pins VREFp VREFm Filtering of inte
27. RT CONFIGURATION A Portable Part configuration with SC14CVMDECT SF requires additional external parts as shown in Figure 3 AS LOAGWNADVLOS Figure 3 PP configuration Table 2 provides an overview of the supported inter faces for a portable part Table 2 PP support overview Item Supported Remark Battery management Yes Supported by API Keypad No On external MCU Display No On external MCU IO Ports Yes All digital IO port pins can be controlled by API PCM interface Yes 1x 16 bits serial I O PCM_FSC 8 kHz 16 kHz UART Yes 115 2 kbit s used for API commands Headset detection Yes Supported by API LSR Earpiece headset Yes Connected to LSRp and or LSRn supports single end and differential Note 4 MIC Earpiece headset Yes Connected to MICp and or MICn and or MICh handsfree supports single ended and differential Note 4 Handsfree speaker Yes Connected to PAOUTp n Note 4 Radio Yes Integrated single antenna and support for external antenna s Note 4 AFE setting is configurable refer to document 2 3 5 FIXED PART CONFIGURATION A Fixed Part configuration with SC14CVMDECT SF requires additional external parts as shown in Figure 4 BINPOW 2210A SS JP109 2012 Dialog Semiconductor B V 11 Aug 29 2014 v1 6 dialog SEMICONDUCTOR Loudspeaker AS LOAGWADVLOS SC14CVMDECT E Earpiece handset MIC handset Headset Supply 9
28. SRp Positive loudspeaker output LSRn Negative loudspeaker output GND Ground P3 3 I O Port P1 0 I O Port SOCp Battery state of charge positive input Connect to GND if not used See 4 9 SOCn Battery state of charge negative input Star point connected to the SOC resistor Connect to GND if not used See 4 9 DC_SENSE Voltage sense input Connect to GND if not used DC 1 Current sense input of DC DC converter Connect to GND if not used DC_CTRL Switching clock for the DC DC converter CHARGE_CTRL Charge control pin Leave unconnected if not used See 4 9 CHARGE Charger connected indication Switches on the device if voltage gt 1 5 V Must be connected to charger via resistor R gt Vcharger_max 3 V 10 mA round to next largest value in range See 4 9 PAOUTp CLASSD loudspeaker positive outputs VDDPA CLASSD Audio Amplifier supply voltage up to 3 45 V GND or leave unconnected if CLASSD Audio Amplifier is not used CP_VOUT1 Charge Pump Output 1 A capacitor of 1 uF to GND is internally connected to this pin PAOUTn CLASSD loudspeaker positive output 2012 Dialog Semiconductor B V 5 Aug 29 2014 v1 6 g AS LOAGWADVLOS BINPOW 2210A SSa p10yD Table 1 Pin description Continued dialo SEMICONDUCTOR Pin Module Pin name Note 1 In Out lout Drive mA Reset State
29. WADVLOS PARAMETER DESCRIPTION CONDITIONS Visr_OdB_unt Untrimmed differen tial RMS output volt age between LSRp and LSRn in audio mode 0 dBm0 refer ence level 0 dBm0 on CIN Note 20 LSRATT 2 0 001 1020 Hz Load circuit A see Figure 30 Table 16 with RL1 Q Cp1 or load circuit B see Figure 31 with RL2 Cp2 and Cs2 Tolerance e 13 when untrimmed BANDGAP_REG 8 e 6 when trimmed Note 18 Rout_Isr Resistance of acti vated loudspeaker amplifier outputs LSRp and LSRn Visr_dce DC offset between LSRp and LSRn Note 9 LSRATT 2 0 3 R4 282 3 sigma deviation limits Note 20 0 dBm0 on CIN 3 14 dB of max PCM value 2012 Dialog Semiconductor B V 33 BINPOW 22104A SSa p10yD Aug 29 2014 v1 6 Table 16 LSRp LSRn load circuits dialog PARAMETER DESCRIPTION CONDITIONS Cp1_RI1_inf Load capacitance see Figure 30 Rj 4 Cp1_Rl1_1k Load capacitance see Figure 30 R 1 lt 1 KQ RI1 Load resistance Cp2 Parallel load capacitance see Figure 31 Cs2 Serial load capacitance RI2 Load resistance AS LOAGWADVLOS LSRn Figure 30 Load circuit A Dynamic loudspeaker Table 17 PAOUTp PAOUTn outputs Figure 31 Load circuit B Piezo loudspeaker PARAMETER DESCRIPTION CON
30. a maximum relative humidity of 60 RH before the solder reflow process The SC14CVMDECT SF is qualified to MSL 3 MSL Level Floor Life Time MSL 4 72 hours MSL 3 168 hours MSL 2A 4 weeks MSL 2 1 year MSL 1 Unlimited at 30 C 85 RH BINPOW 2210A SSe p10yD 2012 Dialog Semiconductor B V 46 Aug 29 2014 v1 6 dialog 10 3 COPPER PAD SOLDER OPENING AND STEN opening and stencil are shown below CIL For the stencil a thickness of 0 122 mm is recom mended Recommended copper pad solder mask AS LOAGWNADVLOS 10 50 Figure 40 Pad dimensions BINPOW 23210A SSe p10gD 2012 Dialog Semiconductor B V 47 Aug 29 2014 v1 6 dialog 00 0 as ASS O lt U m O j 00 Tl T JE ami ao T eTa Figure 41 Copper pad Solder mask opening and Stencil O Oo 2 D 0 lt 0 0 D ie Q Figure 42 Solder stencil D 2012 Dialog Semiconductor B V 48 Aug 29 2014 v1 6 dialog SEMICONDUCTOR 00 10 4 MECHANICAL DIMENSIONS O A 0 lt U m 0 j 00 Tl VO 5 O g E O tQ o Ea 5 A 0 2
31. anagement 4 5 2 Earpiece mode 4 5 3 Alert mode CALL HANDLING 4 6 1 FP to PP call 4 6 2 PP to FP call 4 6 3 Intercom 4 6 4 Conference 4 6 5 Page call 4 7 TONE MELODY HANDLING 4 8 DATE AND REAL TIME CLOCK 2012 Dialog Semiconductor B V dialog 4 9 BATTERY MANAGEMENT 4 10 PROTOCOL STACK 4 10 1 DECT TBR22 4 10 2 Out of Range handling 4 10 3 Preamble antenna diversity Table of Contents 4 10 4 Broadcasting messages 4 10 5 IWU to IWU messaging 4 11 REGISTRATION 4 11 1 Handling product identities AS LOAGWADVLOS 4 11 2 Deregistration 4 12 PCM INTERFACE 4 12 1 PCM Interface for FP 4 12 2 PCM_FSC frequency 4 12 3 Length of PCM_FSC 4 12 4 Start position of FSC 4 12 5 PCM clock frequency 4 12 6 PCM data mode 4 12 7 PCM Interface for PP 4 13 ANTENNA OPERATION 4 13 1 Internal antenna only 4 13 2 Internal and external antenna with FAD 28 5 1 INTRODUCTION 5 2 CAT IQ PROFILE OVERVIEW 5 2 1 Supported main features Specifications 6 1 GENERAL 6 2 ABSOLUTE MAXIMUM RATINGS 6 3 OPERATING CONDITIONS 6 4 DIGITAL INPUT OUTPUT PINS 6 5 ANALOG FRONT END 6 6 BATTERY MANAGEMENT 6 7 BASEBAND PART 6 8 RADIO RF PART 6 9 RF POWER SUPPLY 6 10 RF CHANNEL FREQUENCIES Design guidelines 7 1 APPLICATION SOFTWARE FOR PP 7 2 APPLICATION SOFTWARE FOR FP 7 3 HARDWARE DESIGN GUIDELINES 7 3 1 Circuit design guidelines 7 3 2 PCB Design Guidelines 7 4 MODULE PLACEMENT ON THE MAIN BOARD BINPOW 23210A SS JP109 2 Aug 29 2014
32. c P2 4 SCL1 PCM_DO I O port SCL1 I2C clock PCM_DO PCM Data output 2012 Dialog Semiconductor B V 6 Aug 29 2014 v1 6 g AS LOAGWADVLOS BINPOW 23210A SSa pP10yD dialog Table 1 Pin description Continued Module lout Reset Pin Pin name Drive State Description Note 1 mA Note 2 56 P2 3 SDA1 IO 8 l PU I O Port PCM_DI SDA1 12C Data PCM_DI PCM Data input P2 2 PCM_CLK I O Port PCM_CLK PCM clock input output P2 1 PWM1 I O Port LED4 PWM1 Pulse Width Modulation output LED4 2 5 mA 5 mA LED current sink P2 0 PWMO I O Port LED3 PWMO LED3 2 5 mA 5 mA LED current sink 60 GND Ground 61 VDDOUT Test purpose only Must be left unconnected In Out AS LOAGWADVLOS 62 VBATSW Test purpose only Must be left unconnected 63 VBATIN Main supply voltage lt 3 45 V 64 VBATIN Main supply voltage lt 3 45 V 65 P3 2 I O Port 66 P3 7 I O Port 67 P3 6 I O Port 68 P3 5 I O Port 69 P3 4 I O Port 70 GND Ground 71 GND Ground 72 GND Ground 73 RF1 RF signal for external antenna See 4 13 74 GND Ground 75 RFO RF signal for external antenna See 4 13 76 GND Ground 77 GND Ground 78 GND Ground 79 TP1 Tuning point for internal antenna Follow instructions of Section 7 5 80 GND Ground 81 88 TP2 to TP9 NC Must be left unconnected See section 7 3 2 and Figure 36
33. c amplifiers in Idle mode This means that all reference voltages in the analog front end will 2012 Dialog Semiconductor B V be disabled This feature can be disabled in the VES if the reference voltages for some reasons are needed in Idle mode Aug 29 2014 v1 6 g AS LOAGWADVLOS BINPOW 2210A SSa p10yD 4 5 2 Earpiece mode In Earpiece mode Handset speaker an artificial sid etone is generated The level of the sidetone can be adjusted and setup in the VES through parameter fields Audio Earp Vol Elementx SideToneGain and Audio Heads Elementx SideToneGain In Earpiece mode it is possible to adjust the volume in the Earpiece via API calls In Earpiece mode the PP audio is routed as shown in Figure 11 4 5 3 Alert mode The Alert mode is for generating tones and melodies on the Speakerphone loudspeaker In Alert mode it is possible to adjust the volume in the speaker via API calls Inband tones will be affected by the volume adjustments since the volume control takes place after tones are added to the signal Figure 11 shows the Audio flow 4 6 CALL HANDLING 4 6 1 FP to PP call When the FP initializes a call to a PP a radio connec tion is set up to all PP applications to make it possible for the PP application software to indicate that there is an incoming call It is possible to configure the ringing indication using broadcast to make all 64 PPs ringing 4 6 2 PP to FP call When the MMI software signal
34. cGain and LsrGain The MicGain range is 0 to 30 dB in steps of 2 dB anda value of 128 will mute the input signal default is 0 dB The LsrGain range is 2 dB to 12 dB in steps of 2 dB default is 2 dB See document reference 1 4 4 3 PP audio routing Figure 11 and Figure 12 show the different audio rout ing modes of a PP Figure 11 shows an overall audio routing and Figure 12 shows the detailed audio routing for the speakerphone of PP FP does not support speakerphone 4 4 4 PP audio codec adjustment The audio codec settings for the loudspeaker and microphone must be pre configured in the VES for each mode The VES parameter fields for Audio Earp xxx 2012 Dialog Semiconductor B V Audio Heads xxx Audio SpkPh xxx have a default value and maybe fine tuned for the application See document reference 4 4 4 5 General audio adjustment For each audio mode the receive RLR and transmit SLR audio paths must be adjusted RLR and SLR are adjusted in the registers in the VES for each audio state see document reference 4 Figure 13 shows this image 4 4 6 PP volume The PP supports 6 volume steps which are VES con figurable through parameter fields Audio Earp Vol xxx the Audio Heads Vol xxx and Audio SpkPh Vol xxx The volume steps must be set initially in the VES dur ing production see document reference 4 4 4 7 PP audio equalization To enable adjustments of the frequency response the PP contains
35. d time via the PP The clock supports hours minutes and date The date supports leap years Daylight saving time is not sup ported and must be handled by the MMI application The PP clock is synchronized with the FP every time a broadcast is received If the PP goes out of lock the PP itself calculates the clock time until the PP is again within the range of the FP The updated clock time can be read locally via the MMI software To adjust the clock in the FP a service connection can be set up via commands from the PP The clock can also be read and set directly from an external microprocessor or through the MMI software on the FP The real time clock accuracy depends directly on the Aug 29 2014 v1 6 g AS LOAGWNADVLOS BINPOW 2210A SSa p10yD SC14CVMDECT SF crystal When the SC14CVMDECT SF is configured as a PP the clock has the same accuracy as the FP clock When the PP synchronises with a FP the PP crystal is synchronized with the FP crystal and the PP clock will dialo SEMICONDUCTOR change accordingly The accuracy is expected to be within 1 minute for up to 6 weeks without being locked to a FP Fixed part SC14CVMDECT Real Time Clock Module Set Read Time MMI Application lt gt Broadcast DECT ee ae IWU Connection DECT TN an Portable part 1 SC14CVMDECT Real Time Clock Module Set Read MMI p a pp pier Application Time Set Time
36. e SC14CVMDECT SF with separate nets in the layout It is advised to provide the following audio circuits with separate ground nets connected to the VREFM pin 2012 Dialog Semiconductor B V 41 dialo SEMICONDUCTOR e Microphone s e Headset microphone and speaker e Speakerphone signal grounds Depending on the layout it may also be necessary to bypass a number of the audio signals listed above to avoid humming noise from RF radiation and TDD noise with It is also important to choose a microphone of appropriate quality with a high RF immunity with built in capacitor e ESD performance Besides TDD noise the ESD performance is impor tant for the end application In order to achieve a high ESD performance supply lines should be placed with a large distance from charging terminals display headset connector and other electrical ter minals with direct contact to the ESD source On a two layer PCB application it is important to keep a simulated one layer ground With a stable ground ESD and TDD noise performance will always improve Clearance around test patterns Pin number 81 to 88 are used for production test purposes In order to avoid any interference or dis turbance the area around these signal pins must be kept clear of any signal and or GND The recom mended clearance is at least 1 mm as shown in Fig ure 36 Test pattern 1 0mm GND Pattern Figure 36 Clearance around
37. e Tone Melodies handling For control commands see document reference 1 UART communication The UART communication forms the basic of the FP operation because via this interface the SC14CVMDECT SF is controlled FP MMI The MMI state machine must handle the call setup and call termination on the FP Display interface The MCU FP handles the display interface including the display driver Keyboard interface The MCU FP handles the keyboard interface including the keyboard driver Audio handling The Application Software state machine must control when to open and close the audio The FP MMI must handle the volume control Tone handling The Application Software state machine must control when to play tones and the volume setting Custom melodies can be defined in VES 7 3 HARDWARE DESIGN GUIDELINES Within this section general design guidelines for SC14CVMDECT SF FP and PP applications are given 7 3 1 Circuit design guidelines For a reference schematic refer to the SC14CVMDECT SF reference kit With the reference kit package a non cost optimised reference design is presented Aug 29 2014 v1 6 dialo SEMICONDUCTOR g AS LOAGNWADVLOS BINPOW 2210A SS JP109 Fora FP hardware design the following hardware paris will be needed besides the SC14CVMDECT SF e Supply voltage e Battery charge e LED and buttons e Audio e Headset e External PCM device For a PP hardware design the following hardwa
38. e call setup and call termination on the PP Display Interface The MCU PP handles the display interface including the display driver Keyboard Interface The MCU PP handles the keyboard interface including the keyboard driver Audio handling The Application Software state machine must control when to open and close the audio The headset plug in detection must handled by the host and a status is send to the PP MMI from the PP stack software The PP MMI must handle the volume control Headset detection boundaries can be adjusted in VES When headset indication is received from the PP Headset detection logic the Application Software can decide if audio should be switched to the headset and sends a request to the PP stack software The PP audio handling basically consists of 4 audio modes see Figure 14 1 Idle Alert mode 2012 Dialog Semiconductor B V 40 3 Handsfree mode Speakerphone 2 Earpiece mode 4 Headset mode Shifting between modes is done through the API Tone handling The Application Software state machine must control when to play tones and the volume setting Custom melodies can be defined in the VES 7 2 APPLICATION SOFTWARE FOR FP In an FP application the following software tasks must be handled by the MCU or within the module itself e UART communication external microprocessor only FP MMI Display interface optional Keyboard interface optional e Audio handling
39. e necessary for e Equipment intended for operation in special envi ronments for example extremes of temperature excessive dust moisture or vibration flammable gases and corrosive or explosive atmospheres Equipment intended to be used in vehicles on Board ships or aircraft in tropical countries or at altitudes greater than 2000 m Equipment intended for use where ingress of water is possible Installation by qualified personnel only The product is a component intended for installation and use in complete equipment The final accept ance of the component is dependent upon its instal lation and use in complete equipment BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 45 Aug 29 2014 v1 6 dialog SEMICONDUCTOR 10 0 Package information 10 1 SOLDERING PROFILE The SC14CVMDECT SF should be soldered using a standard reflow soldering profile and lead free solder paste as shown below Adjustments to the profile may be necessary depending on process requirements AS LOAGWNADVLOS Reflow profile leadfree n96 5 Ag3 0 Cu0 5 Temperature Pre heating Soldering 90 120 sec 60 90 sec Figure 39 Reflow profile 10 2 MOISTURE SENSITIVITY LEVEL MSL The MSL is an indicator for the maximum allowable time period floor life time in which a moisture sensi tive plastic device once removed from the dry bag can be exposed to an environment with a maximum tem perature of 30 C and
40. ecUnit gt Pass Through Rx Filters PFILT 1 3 or uRsos 1 3 4 EqUnit_1 gt K RfiSuppUnit p Analog AGC gt MicLevel AnAge Tx Filters RFI Canceller IRS PFILT 1 3 or OS 1 3 NC100Hz VolSideToneUnit we Noise Gate only used together with PAEC gt le_NoiseGateunit p SumuUnit Echo Canceller B1_OUT A1LIN AEC PAEC Handsfree VolSideTone Noise Gate Mix_Ain_Tone Digital Gain amp Limiter summ2 summ1 A Pivi t Comfort Noise Generator B2_IN A2_OUT ToneGen onyuebeuo i i t CodecUnit EqUnit_1 gt KE RfiSuppUnit gt Comfort Noise Generator only used together with PAEC M Figure 11 PP audio routing Filters 3 x biquad PAEC UNIT VolSideTone Digital Filters 3 x biquad gt PAEC engine Microphone Pre gain Hfree switch a Gain Rx Noise Gate Post gain Comfort Air Interface Noise 2012 Dialog Semiconductor B V Figure 12 Extended speakerphone for PP 18 Aug 29
41. emoving all registrations at once from the FP e g in case the original PPs are lost 4 12 PCM INTERFACE The PCM supports the following modes e SLAVE mode clock sync In this mode the clock of the module will be adjusted to follow the PCM pro vided by the external PCM master clock All audio samples are kept if the provided PCM clock accu racy is 5 ppm which is a DECT radio require ment SLAVE no clock sync In this mode the clock of the module is not synchronized This means audio sam ple will be discarded in case the master PCM clock is faster than the clock of the module or samples will be repeated in case the master PCM clock is slower MASTER mode The FP is master on PCM interface and therefore provides PCM clock and PCM_FSC to an external device 4 12 1 PCM Interface for FP The SC14CVMDECT SF supports PCM interface func tionality to connect to an external audio source destina tion 2012 Dialog Semiconductor B V 23 The different PCM interface modes and timings are shown in Figure 21 to 26 Refer to document 1 for detailed information 4 12 2 PCM_FSC frequency The PCM interface supports the following options 8 kHz e 16 kHz 4 12 3 Length of PCM_FSC The PCM interface supports the following options e 1 The length of PCM_FSC pulse is equal to 1 data bit e 8 The length of PCM_FSC pulse is equal to 8 data bits 16 The length of PCM_FSC pulse is equal to 16 data bits 32 The length
42. four programmable filters 2 in RX direc tion and 2 in TX direction see Figure 11 By default these filters are loaded with bypass coeffi cients These can be modified by loading new coeffi cients via API commands Equalizer filters are part of the audio routes for all audio modes and are placed as shown in Figure 11 For a detailed description of the filter functionality refer to the API documentation see document reference 2 Aug 29 2014 v1 6 g AS LOAGWNAOVLOS BINPOW 2210A SSa pP10yD dialo SEMICONDUCTOR Idle Mode VolSideToneUnit 4 Sumunit gt Rx Filters VolSide digit Tone taloutgain Mix_Ain_Tone PFILT 1 3 or IRSOS 1 3 Earpiece VOLCTRL Limiter summ2 summi RMSdetector I EqUnit_0 Earpiece Headset Mode EqUnit 0 gt VolSideToneUnit SumUnit gt Pass Through Rx Filters Earpiece PFILT 1 3 or IRS0S 1 3 4 Analog AGC O Tx Filters RFI Car inceller PFILT 1 3 or IRSOS 1 3 NC 100Hz Echo Canceller B1_OUT A1LIN VolSideTone Digital Gain amp summ2 Limiter Mix_Ain_Tone misii k Boul 0nyuel l B2IN A2_OUT v Handsfree Mode Cod
43. from FP to all registered PPs Broadcasting does not require an active connection Broadcasting does not use retransmission therefore broadcasting is not secured If the real time clock is enabled this data is also broadcasted to all PPs 4 10 5 IWU to IWU messaging The protocol in the SC14CVMDECT SF module is made according to the DECT GAP standard as defined in EN 300 175 and EN 300 444 The DECT standard defines an EMC code see EN 300 175 5 chapter 7 7 23 This code is unique for a DECT product and must be programmed by the DECT manufacturer to the correct manufacturer code The EMC code must be the same for SC14CVMDECT SF based product families when using the IWU to IWU messaging If the Dialog default EMC VES value is changed the IWU to IWU messaging may not operate correctly IWU data is transferred in a FA format frame see chapter 6 1 in EN 300 175 4 This frame has an infor mation field of maximum 63 bytes of which maximum 52 bytes can be used for IWU data With the SC14CVMDECT SF it is only possible to send 5 frames in a row without pause The following frame must be an acknowledge frame to secure that the internal buffers within the SC14CVMDECT SF are emptied The FA frame is segmented in 5 byte fragments and transferred over the air interface in the A field The 2 bytes CRC is used to determine if the data is received correctly If the data is not received correctly this is sig nalled back to the transmitter by
44. he RFPI is stored in the PP In this way the two parts are known to each other and are allowed to make connections The registration data are automatically stored in VES of the FP and PP while making the regis tration It is possible to register the same PP to 2 FPs but it can only be used in one FP at the same time Aug 29 2014 v1 6 dialo SEMICONDUCTOR g AS LOAGWADVLOS BINPOW 23210A SSa p10yD RF Link 2 4GHz DECT a Subscription areas in eeprom Stores the IPEI of the registered PP s Subscription data PP 1 Subscription data PP 2 Subscription data PP 3 Subscription data PP 4 Subscription data PP 5 Subscription data PP 6 a Handset PP 1 Subscription areas in eeprom Stores the RFPI s of the registered FP s Subscri ption data FP 1 Subscription data FP 2 PP_MCU 1 Figure 20 Handling product identities 4 11 2 Deregistration There are two ways of deregistering a PP from an FP e Remote FP and PP deregistration The correct way to deregister a PP from an FP is to deregister it remotely in the FP If this is done over a service connection from the PP to the FP the FP actually performs the deregistration and then it is automatically signalled to the PP which in turn will drop out of lock Using this method it is also possible to deregister other PPs registered to the FP from one PP R
45. information can be found in document 4 under Battery settings 4 10 PROTOCOL STACK The protocol stack handles the RF interface the MAC DLC NWk layer and encryption according to the DECT standard EN300 175 1 9 4 10 1 DECT TBR22 The SC14CVMDECT SF supports the DECT GAP standard according to EN300 444 For TBR22 type approval optional switching off the authentication and encryption is required which can be done with the VES parameter Tbr_22 Aug 29 2014 v1 6 g AS LOAGWAOVLOS BINPOW 23210A SS JP109 4 10 2 Out of Range handling When the PP goes in range or out of range a signal is sent from the PP to the MMI software indicating whether the PP is in lock or is out of lock with the FP 4 10 3 Preamble antenna diversity To optimise the audio quality caused by rapidly chang ing radio paths fading the SC14CVMDECT SF sup ports preamble antenna diversity The preamble diversity algorithm uses RSSI measurements to judge the radio signal strength on both antennas and as a result the choice of the best performing antenna is determined This antenna will then be used for the receive slot and the next transmit slot The preamble antenna diversity is supported with two antennas The preamble diversity can be controlled by VES See document reference 4 and Section 4 13 for more information about antenna diversity 4 10 4 Broadcasting messages Messages consisting of up to 19 bytes can be broad casted
46. ion software can be implemented on the module itself or on an external host processor The internal FLASH provides user space where custom applications can be located Introduction The module converts analog signals to a digital stream compresses decompresses them according to the DECT standards and transmits receives them over the air interface The DECT protocol stack in each module supports both PP and FP functionality The embedded software running on the internal micro controller CR16 supports all protocol layers up to the network layer The module can be controlled by soft ware running on the internal controller as well as from an external controller via the UART 2 2 REFERENCES 1 CVM FP API Documentation package 2 CVM PP API Documentation package 3 Athena Eclipse User Manual v1 02 Dialog Semiconductor Cordless Software Tools 4 SC14CVMDECT EEPROM VES MAP 5 AN D 174 SC14480 Battery Management using the State of Charge function Dialog Sem iconductor Application Note AN D 204 RF settings in Natalie Dialog Semi conductor Application note AN D 211 SC14CVMDECT External antenna design guidelines Dialog Semiconductor Appli cation note 8 AN D 223 SC14CVMDECT production pairing 2 3 GLOSSARY AND DEFINITIONS AFE Analog Front End API Application Programming Interface software between the MCU and SC14CVMDECT SF Baby monitor Same as intercom but optionally voice activated CAT iq Co
47. ity please refer to ETSI EN 300 175 6 Receive Loudness Rating Radio Signal Strength Indication please refer to ETSI EN 300 175 1 Feedback of microphone signal to earpiece Sending Loudness Rating Serial Peripheral Interface Bus Universal Asynchronous Receiver and Transmitter Ultra Low Energy Aug 29 2014 v1 6 g AS LOAGWAOVLOS BINPOW 2210A SSa pP10yD dialog SEMICONDUCTOR VAD Voice Activity Detection VES Virtual EEPROM Storage Walkie Talkie Call between two PPs without an FP AS LOAGWNAOVLOS BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 9 Aug 29 2014 v1 6 dialog 3 0 Cordless Voice Module function ality This section describes the key functions and features supported by the SC14CVMDECT SF as shown in Fig ure 2 UART interface to host AS LOAGWADVLOS API commands FLASH User SW fo Phoenix Host API panan Protocol Stack Radio CODEC PCM DECT RF Head Set PCM Port Port Pins Figure 2 SC14CVMDECT SF functional overview 3 1 MODULE HARDWARE e A DECT radio transceiver with a built in antenna cir The SC14CVMDECT SF internal hardware consists of cuit The antenna itself is integrated into the module relieving the product designer from RF expertise e An internal microprocessor is running from FLASH and handles the API call coming from UART or
48. l pins VDD 1 8 V Vana Voltage on analog pins AVD 1 8V Icharge Current through pin CHARGE Rseries gt Vcharge 3 V 10 mA Ipa Current through pin PAOUTp PAOUTn Note 13 lout_vrefp Output current through pin VREFp TA Ambient temperature Note 14 40 Note 12 Within the specified limits a life time of 10 years is guaranteed Note 13 A life time of 10 years of the CLASS D amplifier is guaranteed if switched on for 10 of the time Note 14 Within this temperature range full operation is guaranteed 6 4 DIGITAL INPUT OUTPUT PINS Table 9 Digital input levels PARAMETER DESCRIPTION CONDITIONS MAX Vil_dig Logic 0 input level all digital input pins except PON CHARGE and RSTn VDD 1 8 V 0 3 VDD Vil_pon Logic 0 input level pin PON 0 9 Vil_charge Logic 0 input level pin CHARGE 0 9 Vil_rst Logic 0 input level pin RSTn VDD 1 8 V 0 2 VDD Vih_dig Logic 1 input level all digital input pins except PON CHARGE and RSTn VDD 1 8 V 0 7 VDD Vih_pon Logic 1 input level pin PON 1 5 Vih_charge Logic 1 input level pin CHARGE 1 5 Vih_rst Logic 1 input level pin RSTn VDD 1 8 V 0 8 VDD Table 10 Digital output levels PARAMETER DESCRIPTION CONDITIONS MAX Vol_dig Logic 0 output level VDD 1 8 V lout 2 4
49. ll PPs PP locator Protocol Manual registration Wire registration See document reference 8 Number of registered ULE PPs per FP 1 to 6 for SFO1 1 to 64 for SFO2 Note 7 Audio and tone Microphone mute Tone generation Melody generator with 7 polyphonic tones Audio Volume control Tone Volume control Headset support Handsfree Speakerphone General Real time clock Accuracy depending directly on crystal Real time clock synchronization All PP clocks are kept in synchronization with the FP SW EEPROM VES Storage Internal on module Battery Charge Management PSTN line interface support PSTN software on request I O port support Port Interrupt support Automatic headset detection Low speed data 1 6 kbit s LU10 data channel 54 kbit s Note 8 CAT ig up to version 2 0 3 0 ULE applications Number of ULE subscriptions up to 180 for SFO1 Number of ULE subscriptions up to 64for SF02 Note 7 Note 6 These features can be supported by combined API commands in user software Note 7 The Number of registration PPs is including CVMDECT PP and ULE device Note 8 SF02 supports one channel LU10 simultaneously 2012 Dialog Semiconductor B V 14 Aug 29 2014 v1 6 g AS LOAGWAODVLOS BINPOW 3210A SSa p10yD 4 0 Functional description 4 1 UART INTERFACE The U
50. m_cTat_REbis 4 9 000 PCM_FSC DSP_PCM_CTAL REGIS 4 3 001 PCM_FSC T DSP_PCM_CTRL_REQ 5 4 3 010 POMLFSC PCM_FSC 1 DSP_PCM_CTRL_REGI5 4 3 011 DSP_POM_CTAL_RECIS 4 3 100 POM_FSC 1 1 DSP_PCM_CTRL_REQ 5 4 3 101 PCM_FSC i DSP_PCM_CTRL REGISA 110 PCM_FSC PCM Master DSP_PCM_CTAL REGISA d 111 2012 Dialog Semiconductor B V Figure 21 PCM interface formats 24 BINPOW 2210A SSa pP10yD Aug 29 2014 v1 6 dialog AP DATA FORMAT LINEAR 8kHz with 8 kHz frame sync PCM CLK 8 kHz FSC 15t frame 15t frame 2 frame 2 4 frame PCM in Channel 0 Channel 1 Channel 0 Channel 1 15t frame 15t frame 2 frame 2 frame PCM out Channel 0 Channel 1 Channel 0 Channel 1 AS LOAGWADVLOS AP DATA FORMAT LINEAR 8kHz with 16 kHz frame sync pcm ot MUUL 16 KHz FSC 18 frame 1st frame 15t frame 15t frame PCM in Channel 0 Channel 1 Channel 0 Channel 1 1st frame 18 frame 15t frame 15t frame PCM out Channel 0 Channel 1 Channel 0 Channel 1 Figure 22 PCM bus with linear PCM 8 kHz sample rate AP_DATA_FORMAT_LINEAR_16kHz with 16 kHz frame sync PCM CLK 16 KHz FSC 13t frame 13t frame 2nd frame 2nd frame PCM in Channel 0 Channel 1 Channel 0 Channel 1
51. n the main board was used during module certification 7 6 PRECAUTIONS REGARDING UNINTENDED COUPLING The SC14CVMDECT SF includes the internal antenna so by integration on the main board precautions shall be taken in order to avoid any kind of coupling from the main board to the RF part of the module If there is any doubt about this a brief radio test should be performed 2012 Dialog Semiconductor B V 42 Aug 29 2014 v1 6 dialo SEMICONDUCTOR g AS LOAGWADVLOS BINPOW 2210A ssajp102 SC14CVMDECT SF di SEMICONDUCTOR 8 0 Example Application Diagram Cordless Voice Module ut SC14WSMDATA_SFO1 Q 18 17 1 H 19 2 20 64 63 61 CHARGE_CTRL PO 6 SPLDO PO 7 SPILDVPWMA P2 6 WTF_IN P2 7V BXTAL P3 0 PAOUTn DPO ULP_PORT ULP_XTAL A 3 internal f CP_VOUTI SOCn GND Dc VBATIN VBATIN DC_CTRL DC_SENSE SC14CVMDECT SF01 VBATSW VDDOUT LSRn LSRp VREFp MICn CIDOUT MICp CIDINn MICh dialo SEMICONDUCTOR 5215 MV s Hertogenbosch tel 31 73 6408822 fax 31 73 6408823 Title SC14CVMDECT_SF01_RD lt OrgName gt Doc Nr Designer F v D Date Wednesday November 28 2012 Sheet 1 Figure 38 Reference diagram example Aug 29 2014 v1 6
52. on This data sheet contains final specifications Dialog Semi conductor reserves the right to make changes at any time without notice in order to improve design and supply the best possible product Obsolete Not in Production This data sheet contains specifications on a product that has been discontinued by Dialog Semiconductor The data sheet is printed for reference information only Dialog Semiconductor reserves the right to make changes without notice to any products herein to improve reliabil ity function or design Dialog Semiconductor does not assume any liability arising out of the application or use of any product or circuit described herein neither does it convey any license under its patent rights nor the right of oth ers Life Support Policy DIALOG S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT AND GENERAL COUNCIL OF DIALOG SEMICONDUCTOR As used herein 1 Life support devices or systems are devices or systems which a are intended for surgical implant into the body or b support or sustain life and whose failure to perform when properly used in accord ance with instructions for use provided in the labelling can be reasonably expected to result in a significant injury to the user A critical component is any component of a life support device or system whose failure to per form can be reas
53. onably expected to cause the failure of the life support device or system or to affect its safety or effectiveness Dialog Semiconductor does not assume any responsibility for use of any circuit described no circuit patent licenses are implied and Dialog reserves the right at any time without notice to change said circuitry or specifications RoHS Compliance Dialog Semiconductor complies to European Directive 2001 95 EC and from 2 January 2013 onwards to European Directive 2011 65 EU concerning Restriction of Hazardous Substances ROHS RoHS2 Dialog Semiconductor s statement on RoHS can be found on the customer portal http portal dialog semiconduc tor com RoHS certificates from our suppliers are available on request Contacting Dialog Semiconductor Germany Headquarters North America Singapore Dialog Semiconductor GmbH Phone 49 7021 805 0 United Kingdom Dialog Semiconductor UK Ltd Phone 44 1793 757700 The Netherlands Dialog Semiconductor B V Phone 31 73 640 88 22 2012 Dialog Semiconductor B V Dialog Semiconductor Inc Phone 1 408 727 3200 Japan Dialog Semiconductor K K Phone 81 3 5425 4567 Taiwan Dialog Semiconductor Taiwan Phone 886 226 580 388 51 Dialog Semiconductor Singapore Phone 65 64845419 China Dialog Semiconductor China Phone 852 2607 4271 Korea Dialog Semiconductor Korea Phone 82 2 569 2301 Aug 29 2014 v1 6 BINPOW 2210A SSa p10yD
54. orts 8 kHz and 16 kHz LENGTH of PCM_FSC The PCM interface supports the following options e 1 The length of PCM_FSC pulse is equal to 1 data bit 8 The length of PCM_FSC pulse is equal to 8 data bits 16 The length of PCM_FSC pulse is equal to 16 data bits 32 The length of PCM_FSC pulse is equal to 32 data bits Start position of FSC The PCM interface supports the following options e The FSC pulse starts 1 data bit before MSB bit of the PCM channel 0 data e The FSC pulse starts at the same time as the MSB bit of the PCM channel 0 data PCM clock PCM clock is delivered to an external slave PCM 2012 Dialog Semiconductor B V 27 device from SC14CVMDECT SF e PCM Data mode Supports only linear 16 bit PCM 4 13 ANTENNA OPERATION Internal antenna J Figure 27 Internal circuit of the SC14CVMDECT SF Figure 27 shows the internal circuit of the SC14CVMDECT SF Pin RFO is used for two external antennas and can also be used for RF test purposes so it is recommended to add a 10 pF capacitor as reserve pattern even when the two external antennas are not used dialo g AS LOAGWADVLOS BINPOW 23210A SSa p10yD Aug 29 2014 v1 6 dialog Re certification of the SC14CVMDECT SF is required if at least one external antenna is added On request Dialog Semiconductor can provide a pre certified PCB layout for an external antenna circuit RF1 is al
55. ple This feature details how calls are placed in a multiple lines context This feature also impacts the behaviour of other services in order to ensure attachment of PPs to a line line settings and several lists properly Parallel calls initiating a second call in parallel to the first call toggling between calls putting a call on hold resuming calls from on hold call transfer 3 party conference with established external and or internal calls BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 29 Aug 29 2014 v1 6 dialog All MIN MAX specification limits are guaranteed by design or production test or statistical methods unless note 9 is added to the parameter description Typical values are informative 6 0 Specifications Note 9 This parameter will not be tested in production The MIN MAX values are guaranteed by design and verified by characterization 6 1 GENERAL Table 6 SC14CVMDECT SF module AS LOAGWAOVLOS ITEM CONDITIONS VALUE Dimensions Ixwxh 18 0 x 19 6 x 2 7 Weight 1 5 Temperature range 40 to 85 Frequency range According to DECT standard 1870 to 1930 Antenna range According to DECT standard Note 10 typical outdoor 350 typical indoor 75 Standards compliancy ETS 300 444 DECT GAP former TBR2214 FCC part 15 Power supply 2 cell NiCd NiMH 2 10 to 3 45 Note for 1 Li lon battery an external LDO is required Maximum PCB warpage For entire reflo
56. pur suant to Part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generate uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a par ticular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures e Reorient or relocate the receiving antenna 2012 Dialog Semiconductor B V 44 Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit dif ferent from that to which the receiver is connected Consult the dealer or an experienced radio TV tech nician for help Privacy of communications may not be ensured when using this phone 9 2 INDUSTRY CANADA REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER The host device shall be properly labelled to identify the modules within the host device The Industry Can ada certification label of a module shall be clearly visi ble at all times when installed in the host device otherwise the host device must be labelled to display the Indust
57. rdless Advanced Technology Internet and Quality Codec Coder and Decoder converts analog signals to digital signals and vice versa Conference Same as intercom but including an external party CRC CVM Cyclic Redundancy Check Cordless Voice Module 2012 Dialog Semiconductor B V DECT DSP EMC ESD FAD FP GAP GFSK Inband tones Intercom IPEI IWU LCD LDO LDR MCU MMI PP PSTN POTS RF RFPI RLR RSSI Sidetone SLR SPI UART ULE ldialo SEMICONDUCTOR Digital Enhanced Cordless Telephone Digital Signal Processor Equipment Manufacturers Code ElectroStatic Discharge Fast Antenna Diversity Fixed Part General Access Profile DECT Gaussian Frequency Shift Keying Tones played by the application itself and not from external e g line Internal call between FP and one or more PPs International Portable Equipment Identity please refer to ETSI EN 300 175 6 InterWorking Unit please refer to ETSI EN 300 175 1 Liquid Crystal Display Low Drop Out regulator Low Data Rate Micro Controller Unit Man Machine Interface keypad LCD buzzer microphone earpiece speaker headset Non Solder Mask Defined pad Normal Transmitted Power Perceptual Acoustic Echo Canceller Personal Computer IBM compatible Printed Circuit Board without components Portable Part Public Switched Telephone Network Plain Old Telephone System Radio Frequency Radio Fixed Part Ident
58. re parts will be needed besides the SC14CVMDECT SF e Power Battery Charger e Audio e Microphone e Earpiece e Speaker e Headset 7 3 2 PCB Design Guidelines e Because of the presence of the digital radio fre quency burst with 100 Hz time division periods TDD noise supply ripple and RF radiation special atten tion is needed for the power supply and ground PCB layout Power supply considerations Both high and low frequency bypassing of the supply line connections should be provided and placed as close as possible to the SC14CVMDECT SF In order to get the best overall performance for both FP and PP applications a number of considerations for the PCB has to be taken into account e Make angle breaks on long supply lines to avoid resonance frequencies in respect to DECT fre quencies Maximum 8 cm before an angle break is recommended Supply lines should be placed as far as possible away from sensitive audio circuits If it is neces sary to cross supply lines and audio lines it should be done with right angles between supply and audio lines circuits microphone ear speaker speakerphone etc Ground plane considerations In order to achieve the best audio performance and to avoid the influence of power supply noise RF radiation TDD noise and other noise sources it is important that the audio circuits on both FP and PP applications boards are connected to the VREFM pin analog ground AGND see Figure 38 on th
59. rimming measure A VREFp VREFm and update BANDGAP_REG 3 0 Table 12 Microphone amplifier Operating Condition PARAMETER DESCRIPTION CONDITIONS TYP Vmic_cm_level MICp and MICn com mon mode voltage MICp and MICn are set to GND with internal resistors Rin_mic If DC coupled the input voltage must be equal to this voltage 0 9 V 1 5 VREFp Table 13 Microphone supply voltages PARAMETER DESCRIPTION CONDITIONS Vref_unt VREFp VREFm untrimmed Note 19 lLloap 0 mA BANDGAP_REG 8 Note 18 Rout_vrefp VREFp output resistance Figure 29 Nvrefp_idle Peak noise on VREFp VREFm Note 9 CCITT weighted PSRRvrefp Power supply rejec See Figure 29 AVD to tion Vref output Note 9 VREFp m f 100 Hz to 4 kHz BANDGAP_REG 5 4 3 Note 19 Vrefm is a clean ground input and is the 0 V reference 2012 Dialog Semiconductor B V 32 BINPOW 23210A SSa p10yD Aug 29 2014 v1 6 Table 14 VREFp load circuit dialog SEMICONDUCTOR PARAMETER DESCRIPTION CONDITIONS Cload_vrefp VREFp parasitic load capacitance lout_vrefp VREFp output current Rout_vrefp VREFp Cload_vretp lout_vrefp gt F Figure 29 VREFp load circuit Table 15 LSRp LSRn outputs AS LOAG
60. rnal and external refer ence voltages is provided by an internal capacitor No external capacitor shall be connected to pin VREFp To avoid audible switching noise it is important that the ground supply signals are directly star point con nected to the VREFm and not via a common ground BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 16 Aug 29 2014 v1 6 4 4 AUDIO ROUTING ldialo SEMICONDUCTOR G726 Encoder TT G726 Decoder CWB Unpack G711 Decoder TJ G722 Encoder TT loCtrl 1 i G711 Encoder kN G722 Decoder Ti Soft Mute bit errors on air interface Figure 10 FP audio routing 4 4 1 FP AUDIO ROUTING Figure 10 shows the audio routing for a FP Input and output signals are supported both for the internal codec and the PCM and the Air interface supports G 726 32 kbit s ADPCM and G 722 64 kbit s ADPCM The internal software supports up to 4 audio channels simultaneously Supported sample rates are 8 kHz and 16 kHz FP does not support acoustic or line echo cancellation 4 4 2 FP audio level adjustment The internal codec audio levels can be controlled with the parameters Mi
61. ry Canada certification number of the mod ule preceded by the words Contains transmitter mod ule or the word Contains or similar wording expressing the same meaning as follows Contains transmitter module IC 9576A SC14S L appareil h te doit tre tiquet comme il faut pour permettre l identification des modules qui s y trouvent L tiquette de certification d Industrie Canada d un module donn doit tre pos e sur l appareil h te un endroit bien en vue en tout temps En l absence d ti quette l appareil h te doit porter une etiquette donnant le num ro de certification du module d Industrie Can ada pr c d des mots Contient un module d mis sion du mot Contient ou d une formulation similaire exprimant le m me sens comme suit Contient le module d mission IC 9576A SC14S This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any inter ference including interference that may cause unde sired operation of the device Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux condi tions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouil
62. s the PP to establish a call the PP opens the radio connection to the FP 4 6 3 Intercom Figure 15 shows the audio routing of an internal call between PP1 and PP2 In the FP no transcoding takes place CVMDECT PPI VMDECT FP CVMDECT PP2 Figure 15 Intercom connection 4 6 4 Conference Figure 16 shows the audio routing of a 9 party confer ence call 2012 Dialog Semiconductor B V 20 dialo SEMICONDUCTOR CVMDECT PPI CVMDECT FP N 4CH PCM E Analog CVMDECT PP4 Figure 16 Conference connection 4 6 5 Page call The Page call is a FP functionality used to locate the registered PPs FP paging does not establish a normal audio connection and is terminated when answered by the PP 4 7 TONE MELODY HANDLING The tone component handles the generation of various tones in the device Both tones melodies in a PP con figuration are supported The main features of the tone component are e Ringer tones and melodies 7 tone polyphonic e Alert tones key sound error tones confirmation tones etc Inband tones dial tone net congestion tone busy tone etc e Single tone generation 4 8 DATE AND REAL TIME CLOCK The FP has a real time clock feature which when acti vated broadcasts the date and time of day to the PPs Activation of the date and real time clock is done by setting the date an
63. so recommended to use and can be con nected to the RF cable to be able to do the JPN DECT type approval test 4 13 1 Internal antenna only AS LOAGWNAOVLOS The FAD function is not enabled if only the internal antenna is used In this case pins RFPO RFPOn PO and POn must be left unconnected 4 13 2 Internal and external antenna with FAD Figure 28 shows one external antenna that is con nected to RF1 of the SC14CVMDECT SF This config uration supports the FAD function In this case pins RFPO RFPOn PO and POn must be left unconnected The software patch code is not needed if the SC14CVMDECT SF is operated as FP External Antenna Figure 28 One external antenna BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 28 Aug 29 2014 v1 6 dialog 5 0 CAT iq DTMF and tones 5 1 INTRODUCTION Headset support CAT iq stands for Cordless Advanced Technology Internet and Quality It is the new global technology ini Easy pairing tiative from the DECT Forum designed for IP voice services in the next generation networks CAT iq is based on the regulatory framework of the mature and Supports SUOTA Software Update Over The Air reliable DECT technology It is fully backward compati and LU10 max 54 kbit s ble to DECT GAP and as the new cordless phone standard focuses on high definition VoIP HD voice as well as data applications as the next generation Cordless Phone standard Easy PIN code registration
64. test patterns Aug 29 2014 v1 6 g AS LOAGWADVLOS BINPOW 2210A SS JP109 7 4 MODULE PLACEMENT ON THE MAIN BOARD In order to ensure FCC compliance proper coverage and to avoid detuning of the antennas it is required to place the module free on the main board in relation to other surrounding materials Keep a distance of at least 10 mm from the antenna elements to conducting objects and at least 5 mm to non conducting objects Keep in mind that electrical shielding objects even partly surrounding the antennas will normally cause a significant degradation of the coverage Place the module at the edge of the main board as shown in Figure 37 If the module has to be placed away from the edge of the main board then avoid conducting areas in front of the antennas and make a cut out in the main board underneath the antennas as shown in the figure Keep solid ground on layer 2 out to the edges of the main board as shown in the figure No PCB area Z Z gt 10 a antenna extension GND Module Main board GND Figure 37 Module placement on the main board top view 7 5 PATTERN FOR PIN 79 ON THE MAIN BOARD The copper pattern for pin 79 on the main board is very important because it is part of the internal antenna of the module It is used to extend the internal antenna for optimum RF performance The PCB pattern shown in Figure 41 under pads C for pin 79 o
65. the Q2 bit and the data is retransmitted The FA frame has a 2 bytes checksum used to deter mine if the complete packet is received correctly If A 2012 Dialog Semiconductor B V 22 checksum error is signalled back to the transmitter and the complete packet is retransmitted The packet will be retransmitted until it is received correctly or until the link is closed More transmitted packets will be received in the same order as they were transmitted The application must handle flow control if needed 4 11 REGISTRATION The PP and the FP must be paired using a procedure called Registration Without Registration the PP will be out of lock and will not be able to establish a link to a FP and therefore not be able to make a call The regis tration uses the unique product identities and secures the PP and FP to allow no cross communication The PP can be de registered from a FP either via the FP or PP MMI Software using the command interface It is also possible to deregister a PP from another reg istered PP It is possible to pair a PP and FP during the production 4 11 1 Handling product identities To secure that the FP and PPs do not make cross communications a unique ID must be entered into the VES of an FP or PP For the DECT version the ID for the FP is named RFPI and for the PP the ID is named IPEI These numbers are factory settings After a successful registration the IPEI is stored in the FP and t
66. v1 6 dialog Table of Contents 42 7 5 PATTERN FOR PIN 79 ON THE MAIN BOARD 42 7 6 PRECAUTIONS REGARDING UNINTENDED COUPLING AS LOAGWNAOVLOS Example Application Diagram Notices to OEM 9 1 FCC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER 9 2 IC REQUIREMENTS REGARDING THE END PRODUCT AND THE END USER 9 3 PRECAUTIONS REGARDING UNINTENDED COUPLING 9 4 END APPLICATION APPROVAL 9 5 SAFETY REQUIREMENTS 10 0 Package information 10 1 SOLDERING PROFILE 10 2 MOISTURE SENSITIVITY LEVEL MSL 46 10 3 COPPER PAD SOLDER OPENING AND STENCIL 10 4 MECHANICAL DIMENSIONS 11 0 Revision history BINPOW 2210A ssajp102 2012 Dialog Semiconductor B V 3 Aug 29 2014 v1 6 dialog 1 0 Connection diagram AS LOAGWAOVLOS POn RFPOn GND VREFp MICp CIDINn RFI GND GND Oo e ulo a v N MICn CIDOUT GND MICh LINEIN o PARADET P3 4 VREFm RINGOUT RINGING P3 5 LSRp LINEOUT AGND N RINGn P3 6 LSRn LINEOUT AGND z RINGp P3 7 GND T CIDINp P3 2 ADC0 P3 3 a VBATIN ADC1 INTO P1 0 VBATIN SOCp VBATSW SOCn VDDOUT DC_SENSE o GND DCI N P2 0 ECZ1 PWM0 LED3 DC_CTRL N P2 1 ECZ2 PWM1 LED4 CHARGE_CTRL N N CLK100 P2 2 PCM_CLK CHARGE P1 7 N x DP2 P2 3 SDA1 PCM_DI DP1 PAOUTp P3 1
67. w range 0 1 mm Note 10 The resulting range is very dependent of the mechanical design Dialog Semiconductor is not responsible for this design and as such Dialog Semiconductor is not responsible for the resulting performance range of the final product 6 2 ABSOLUTE MAXIMUM RATINGS Table 7 Absolute Maximum Ratings Note 11 PARAMETER DESCRIPTION CONDITIONS Vbat_max Max voltage on pin VBATIN VDDPA Vpon_max Max voltage on pin PON Vled_max Max voltage on pin LED4 LED3 Vdig_bp_max Max voltage on digital pins with back drive protection ports PO and P2 except P2 6 Vdig_max Max voltage on other digital pins Vana_max Max voltage on analog pins Vesd_hbm ESD voltage according to human body model all pins Vesd_mm ESD voltage according to machine model all pins Note 11 Absolute maximum ratings are those values that may be applied for maximum 50 hours Beyond these values damage to the device may occur BINPOW 23210A SSa p10yD 2012 Dialog Semiconductor B V 30 Aug 29 2014 v1 6 6 3 OPERATING CONDITIONS Table 8 Operating Conditions Note 12 dialog PARAMETER DESCRIPTION CONDITIONS Vbat Supply voltage on pin VBATIN Vdd_pa CLASSD supply voltage on pin VDDPA Vpon Voltage on pin PON Vdig_bp Voltage on digital pins with back drive protection ports PO and P2 except P2 6 AS LOAGWADVLOS Vdig Voltage on other digita

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