Polos serie brochure - SPS
Contents
1. 200 240 VAC 50 60 Hz auto select Peak 1800 W 10A 8A 80 kPa 24 inchHg 2 80 Ipm Tube OD 8mm 20 50 kPa 2 5 l min Tube OD 6mm 1 M NPT Unlimited Unlimited 1 12 000 rom 1rpm steps 0 1 rpm Clockwise Counter clockwise and Puddle 30 000 rpm sec 3 dry relays as standard Up to 16 digital input 16 digital output 4 analog input 4 analog output with optional IO modules Natural Polypropylene NPP Natural Polypropylene NPP or High Chemical Resistant PTFE TFM Detachable full size touchscreen glove friendly IP52 chemical resistant 1 USB Port in the controller 360mm round or 8 x 8 square 402 mm 430 w x 310 h x 650 d mm 32 kgs 780 w x 620 h x 580 d mm 100 120 VAC 200 240 VAC 50 60 Hz auto select Peak 1800 W 10A 8A 80 kPa 24 inchHg 2 80 lpm Tube OD 8mm 20 50 kPa 2 5 l min Tube OD 6mm 1 M NPT Specifications Available number of programs Steps per program Spin speed RPM Spin speed accuracy Spin rotational direction Max acceleration Free programmable outputs System data Housing material Process chamber material Interface External connection Max substrate diameter Max process chamber diameter Dimension desktop version Shipping weight Shipping dimension Requirements Voltage Power consumption Max current Vacuum Motor purge gas Drain connection POLOS 452. jA 4c mA The SPIN150i 200i are very small footprint systems with capacity for up to 60 wafers SPIN150i or up to 8 wafers SPIN200i and pre configured with a nitrogen purge nozzle syringe holder The SPIN150i comes with a chuck and fragment adapter which will hold a wide range of substrates from small pieces minimum 10mm area up to 6 The SPIN200i comes with a chuck that will hold from 4 to 8 wafers or can alternatively be specified with the same chuck and adapter as the SPIN150i model Chucks for 6 wafers and below can be used on either model The SPIN150i 200i offer exceptional value and capability precise speed range of 0 12 000rpm 0 1rpom accuracy 1rom resolution with fully programmable CW amp CCW rotation ideal for puddle develop and per step acceleration to cover any process requirement Easy entry colour touchscreen self explanatory icons for ease of operation for new users A quality choice for the long term the SPIN150i amp SPIN200i are designed and manufactured in Germany Specifications SPIN150i E Specifications SPIN150i SPIN200i SPIN200i Available number of programs Steps per program Spin speed Spin speed accuracy Spin rotational direction Max acceleration Spin time Free programmable outputs System data Housing material Process chamber material Interface External connection Max substrate diameter Max
3. chamber is auto matically opened and the chuck is raised pre senting the substrate for easier and safer un loading This eliminates any possible contact between the operator and possibly chemically contaminated surfaces Both manual and au tomatic chamber rinse flush sequences can be programmed allowing all contaminated surfac es to easily be neutralized even after a power failure The automatic chemical supply system and the drain extract exhaust are integrated into the system to ensure fail safe operation Purged labyrinth seals monitored safety in terlocks alarm sensors vacuum monitoring spin motor overload protection and emergency switch ensure the highest safety standards Main options In situ Z axis chuck movement Linear dispense arm servo controlled Multiple dispense lines amp nozzles Several chucks designs available Highly responsive closed loop flow control system In situ chemical mixing Heated chemical supply Megasonic cleaning High pressure jet Teflon process tanks or dispense vessels Chemical reclaim filtered chemical recirculation Multiple drain outputs E Other products Portable Thin Film Measurement System FR pOrtable is a unique turn key solution for accurate amp precise optical characterization of transparent and semi transparent single films or stack of films With FR pOrtable the user can perform reflectance measurements for films in the 350 1 0
4. etc Mechanical and Centering pins Other Substrates Thin Fragile Substrates Labatory Glass etc Foils etc Note Other materials available on request please contact us for details E Typical Applications Our full range spin processors cover a wide range of proces applications In combination with our megasonic MegPie and special Lift Off Fluid can be used for photoresist strip or even metal lift off Our POLOS Advanced series can be used with ozone in DIW DiO providing an effective replace ment for Piranha H SO H O cleans Suitable for all typical spin processes Systems are available in all PTFE constructions for special applications Cleaning Etching Coating Developing The next pages will provide you with some typical applications that emphasize the wide range of process capabilities 13 E Coating 14 Spincoating is one of the most common techniques that is used for the fabrication of nanometric polymer thin films PDMS blockcopolymers etc The acceleration within the programmable spin speed is important as it defines the range of thicknesses that can be achieved from a given solution In general spin coating can produce uniform films relatively easily from about 1 000 rom upwards The advantages of the Polos range spin coaters with high speed up to 12 000rpm and in ramp up of 0 3 sec are its ability to quickly and easily produce very uniform films from a few nanomet
5. process chamber diameter Dimension desktop version Shipping weight Shipping dimension Requirements Voltage Power consumption Max current Vacuum Motor purge gas Drain connection Unlimited Unlimited 0 12 000 rpm 1rpm steps 0 1 rpm Clockwise Counter clockwise Puddle 30 000 rpm sec Unlimited 0 1 seconds steps 3 pcs relays nominal switching capacity 0 5A 125 VAC 0 3A 60DC kkk Natural Polypropylene NPP Natural Polypropylene NPP or High Chemical Resistant PTFE TFM Detachable full size touchscreen glove friendly IP52 chemical resistant 1 USB Port in the controller 160mm round or 4 x 4 square 202 mm 274 w x 250 h x 451 d mm 14 kgs 600 x 380 x 360 mm 100 120 VAC 200 240 VAC 50 60 Hz auto select Max 500 W 5A 2 5A 65 kPa 19 inchHg 2 80 Ipm Tube OD 8mm 20 50 kPa 2 5 I min Tube OD 6mm 1 M NPT Unlimited Unlimited 0 12 000 rom 1rpm steps 0 1 rpm Clockwise Counter clockwise Puddle 30 000 rpm sec Unlimited 0 1 seconds steps 3 pcs relays nominal switching capacity 0 5 A 125 VAC 0 3A 60VDC Natural Polypropylene NPP Natural Polypropylene NPP or High Chem ical Resistant PTFE TFM Detachable full size touchscreen glove friendly IP52 chemical resistant 1 USB Port in the controller 260 mm round or 6 x 6 square 302 mm 380 w x 307 h x 559 d mm 20 kgs 680 x
6. the authors show that the combination of DiO and a uniform Megasonic energy field in a conventional single 200 a a _ 110KPM LLORPM HRPM 1LS0RPM No Meg aw em 2Owiem2 2 0w eme Spin Speed Figure 5 Comparison of spin speeds AZMIR701 PR 80ppm 20c 1 4lpm Source References 1 US Patent 6 791 242 2004 wafer spinner significantly increases the strip rate of various positive PR coatings compared with DiO alone They measure improvements in strip rate of over 65 figure 5 Variations in spin speed rom flow rate lpm and megasonic dosage W cm2 resulted in large effects on the measured strip rate The POLOS Advanced 200 series allow for 0 1rpm spin speed accuracy and the user can easily program speed up to 12 000 rpm in 1 rom steps Up to 6 dispense lines can be automatically controlled Measured without substrate limitations may apply depending on chuck used and substrate specification Don Dussault ProSys Inc Jens Fittkau2 and Christiane Gottschalk ASTeX GmbH E Example Etching Spin Etching as post treatment after Wafer Thinning Wafer thinning back side grinding is used in IC and MEMS fabrication in order to Achieve a desired device thickness ICs MEMS Ensure a specific thickness based on device functionality MEMS Reduce substrate series resistance in vertical devices Power devices As a study by Dr K Gottfried of Fraunhofer ENAS by spin etching with H
7. 0 Advanced Unlimited Unlimited 0 1 500 rom 1rpm steps 0 1 rpm Clockwise Counter clockwise and Puddle lt 1500 rpm s depends on the load 3 dry relays nominal switching capacity 0 5A 125 VAC 0 3A 60DC Natural Polypropylene NPP Natural Polypropylene NPP or High Chemical Resistant PTFE TFM Detachable full size touchscreen glove friendly IP52 chemical resistant 1 USB Port in the controller 460 round and 350x350mm square substrates 502 mm 795 w x 638 h x 922 d mm 75 kgs 800 x 790 x 1180 mm 200 240 VAC 50 60 Hz Peak 1000W 10A 80 kPa 24 inchHg 2 80 lpm Tube OD 8mm 20 50 kPa Tube OD 6mm 500lph 1 5 M NPT Considering additional capability of standard unit such as USB backup recipe cycling PC software etc Measured without substrate limitations may apply depending on chuck used and substrate specification 09 10 Options POLOS 200 300 450 Advanced EBR Edge Bead Removal Auto Dispense Lines Full PTFE Dispense Vessel Automated injector line MegPie BSR Back Side Rinse The Sapphire MegPie is a single wafer Megasonic transducer for cleaning and sonochemical processing as Corrugated Drainhose Drain tank and Vacuum Pump connector In NPP including connection to The vacuum pump is very quite and reliable connect to the drainport E POLOS 600 1000 POLOS 1000 NPP POLOS 600 NPP Vacuum or Mechanical chuck O642mm Pr
8. 00nm spectral range In just one click we characterize thin amp thick transparent and semi transparent films by analysing light reflection Get rid of power cables and large lab space f AN amp nis requirements Thanks to its unique design E TN z a FR pOrtable draws power from the USB cable ee oe that is used for its control from the computer oe TEF E Polos Precision Bake Plate The Modular setup of this new Table Top Hotplate enables easy plate chuck exchange and upgradeable options making this a versatile and affordable tool for R amp D and Pilot Lines The POLOS Hotplate is available for processing single or double substrates A precision digital temperature controller enables adjustable temperature steps of 1 C up to 230 C It is suitable for soft bake as well as hard bake processes and curing of photo resist or epoxy or any other work requiring precise temperature control Standard models for substrate sizes 150mm 200mm and 500mm 23 With gt 2 000 systems installed worldwide up and running for over many years our Polos Spin Coater have proven themselves as the 1 single wafer spin proces sor For over 25 years now SPS Europe offers versatile high quality all plastic POLOS single substrate spin processors Various models have proven themselves over the years for processing a wide range of substrates from small fragments up to 450mm substrates We offer even units for flat panels
9. 580 x 480 mm 100 120 VAC 200 240 VAC 50 60 Hz auto select Max 500 W DSA 2 5A 65 kPa 19 inchHg 2 80 lpm Tube OD 8mm 20 50 kPa 2 5 l min Tube OD 6mm 1 M NPT Considering additional capability of standard unit such as USB backup recipe cycling PC software etc Measured without substrate limitations may apply depending on chuck used and substrate specification For our spin processors and chucks we use NPP H with a crystalline properties 05 E Options SPIN150i SPIN200i 06 Liner Set Liners are available in PET Polyethylentere phthalat 0 5mm thick transparent antistatic 108 10 Q to prevent possible build up of static charge in the chamber Dispense Unit Can be mounted in syringe holder and be connected to one of the 3 programmable dry contacts Syringe Holder Starter Kit Consisting of several 30cc dispense barrels nee dles and plungers Foot Switch For hand free usage controlling start stop function and vacuum Corrugated Drainhose and connector In NPP including connection to connect to the drainport Central Dispensing Syringe Holder For single or triple syringes with integrated N diffuser Centering Tool Easy to use centering tool readjustable for different sizes Vacuum Pump The vacuum pump is very quite and reliable E POLOS Advanced 200 300 450 The Polos Advanced series allow the user to either dispense manually throug
10. E Spin Process Station Examples for a wide range of substrates and applications E Laboratory Glass e g 76x26mm I Pieces amp Fragments NM Wafers from 1 up to 12 Application Exampl SC1 SC2 DHF Clean Rinse HF HNO Etch Photo Resist Coat Edge Bead Removal EBR Puddle and or Spray Developing Post CMP High Pressure and or Megasonic Cleaning 70 C KOH Etch with recirculation Diced Wafer Clean on Film Frame lM Mask FPD Glass Substrates Application Examples Coat Develop up to 20 Piranha Etch Clean up to 16 M Solar Cells 103 125 156 and 210mm square Application Examples Texturing Alkaline or Acidic Porous Si Etch Oxide Etch PSG Removal Cleaning Protective Layer Coating HM Film Frames 4 up to 12 E Optical Media Spin Process Stations are available in an 85cm 1m40 1m70 or 2m wide welded polypropylene enclosure with built in integrated spin processor containing separate pneumatic electrical and chemical compartments Chemical tanks heaters chillers etc are safely stored and easily accessible in a slide out drawer At the heart of each Spin Process Station is the POLOS Spin Processor proven technology These rugged reliable units deliver repeatable performance Spin Process Stations offer a wide process window for your current and future requirements and are surprisingly affordable 21 E Spin Process Station 22 Safety To protect users the process
11. NO HF CH COOH on a POLOS Advanced Spin Station proved that wet etch executed as spin etch offered removal of 10 um silicon and is suitable to remove grinding induced substrate damages almost completely omo oe a CH COOH HF HNO DI water The platform offers a comparatively simple reasonably priced process setup The process being much faster than CMP offered a high and tunable etch rate much faster than CMP and the ability to process grinded wafers direct without additional cleaning Standard features NM Process applicable to 100mm 150mm and 200mm wafers with minimum conversion time less than 15 minutes Chemicals KOH HNO HF CH COOH HNA Wafer rotation Continuous wafer rotation Puddle mode Subpoints of Dispense position and mode Fix position Oscillating movement over a specific distance wafer diameter Spray dispense a M Flush dispense Depending on the chemicals used Source Fraunhofer ENAS Dr Knut Gottfried Precise Bulk Silicon Wet Etching 2013 49 E Spin Process Station 20 Based on the proven high quality POLOS Single Substrate Spin Processor the modular design Spin Process Station provides excellent value for money full plastic construction with high end components compatible with any chemical environment in a modular set up suitable for your specific requirement An extremely versatile platform for a wide range of processes Multi Process Chamber The compact circular p
12. POLOS Series single wafer spin processor POLWUESS www spincoating com 2015 09 E Are you ready for the future When it comes to spin process applications l a The versatile high quality all plastic the possibilities are endless Where today s l l POLOS single substrate spin processors requirement stopped at a simple clean rinse pi are specifically designed for R amp D and low program on a 4 substrate tomorrow s process ae l volume production in the MEMS Semi may require mask cleaning or a coating step E conductor PV Microfluidics field etc for fragments The POLOS Single wafer l l Saas Suitable for all typical spin processes processor offer a solution to most applications i i i cleaning rinse dry coating developing and etching Various models have proven Each Fab each R amp D or even each student in themselves over the years for processing university employs different processes There o a a wide range of substrates from small fore we offer unlimited processes intuitive fragments up to 300mm substrates programing on the touchscreen controller even l We offer even units for flat panels up to USB up or download from your own pc if so 1000mm square ay e preferred with unlimited programs steps and graphical representation The digital motor speed controller enables accurate acceleration and stable rotations critical factors for coating uniformity For our spin processors and c
13. al contamination CE depending on substrate size and chuck type CE Certified desagred u Your safety E Clear view of your process System Benefits a High speed acceleration up to 0 12 000rpm in 0 3 sec between speed and acceleration Without line break Max acceleration 30 000rpm sec A detachable touch screen control panel for use outside a glove box a Programmable CW amp CCW rotation enables specialist processes such as puddle develop and or etch C Full Engineering Plastics only high quality seamless fabrication Rugged lid hinge holds at Optimum angle for Easy Access and for your safety locks electromagnetically until the end of process until fully reached O rpm or in case of power failure Vee Lid ensures residual chemicals on the lid run Safely to system drain Syringe Holder amp Diffuser forN purge enables uniform purge with reduced air turbulence in the chamber 03 E SPIN150i SPIN200 04 SPIN2001 The SPIN1501 amp SPIN200i spin processors are advanced systems offering precise repeatable process control An aerodynamically efficient chamber enhances uniformity while natural polypropylene or PTFE construction ensures a no metals contamination free process area easy to clean E Programmable CW amp CCW Rotation E Uniformly Accurate E O rom 12 000 rpm accuracy 0 1 rom SPIN150i E Acceleration 0 30 000 rpm sec accuracy 0 1 wrpm
14. h the syringe or by using the optional manifold with selectable valve for dispensing one 1 chemical from the Dispense Vessel DV DI Water or N Automatic Sequential or Parallel Chemical Dispense Up to 6 spray nozzles Each programmable independently 07 Specifications POLOS 200 Advanced E Specifications POLOS Advanced POLOS 300 Advanced Available number of programs Steps per program Spin speed Spin speed accuracy Spin rotational direction Max acceleration Free programmable outputs System data Housing material Process chamber material Interface External connection Max substrate diameter Max process chamber diameter Dimension desktop version Shipping weight Shipping dimension Requirements Voltage Power consumption Max current Vacuum Motor purge gas Drain connection 08 Unlimited Unlimited 1 12 000 rom 1rpm steps 0 1 rpm Clockwise Counter clockwise and Puddle 30 000 rpm sec 3 dry relays as standard Up to 16 digital input 16 digital output 4 analog input 4 analog output with optional IO modules Natural Polypropylene NPP Natural Polypropylene NPP or High Chemical Resistant PTFE TFM Detachable full size touchscreen glove friendly IP52 chemical resistant 1 USB Port in the controller 260mm round or 6 x 6 square 302 mm 380 w x 307 h x 599 d mm 20 kgs 680 x 580 x 480 mm 100 120 VAC
15. hucks we use NPP H with a crystalline properties This NPP offers users considerably improved rigidity in addition to increased toughness In fact the level of rigidity measured at 100 C is twice as high as that of B nucleated PP At low temperatures in particular it displays higher impact resistance than standard NPP H thus combining greater functionality with improved safety Benefits I Finer and more stable alpha crystalline structure Superior notched impact strength and enhanced rigidity E Longer service life E Improved chemical resistance and superior stress crack resistance Where the application requires PTFE we use TFM1600 material superior for use with chemicals above standard PTFE with a much higher material surface density than standard PTFE thus significantly lower Memory Capability for absorbing contamination from Chemicals ia Liners are available in PET Polyethylenterephthalat 0 5mm thick transparent antistatic 10 10 to prevent possible build up of static charge in the chamber 2 v g A ae a PE LE i di HE Wy i SEARCH SETTING ABOUT 2 oS ue sep T e 100 1000 A LO 0 4 Ti Fa Fo P j aT A AVE A ERT APPEND BACKE u t e i s TF ae Ear v amp w amp oO E eel mr F J g P _ LOG END Tempered Glass lid does not haze or scratch remaining Clear and easy to see your process Labyrinth Seal protects the motor and control electronics from chemic
16. l Stripping times vary from few seconds to few minutes depending on resits thickness and crosslinking Agitation or ultrasonic can reduce the process time or support the performance Due to the pH neutral fluid and the new working principle the surface properties of the substrates stays uneffected Final rinse leaves wafer surface uneffected and free from residues STEP 1 STEP 2 SIEP 3 STEP 4 lisoPUR stripper starts to Creeping fragmenting Rinse off DI water IPA etc Wafer drying at high velocity penetrate and diffuse the reduces adhesion forces removes fragmented resist spinning photoresist layer of layer and substrate from wafer B Removal of Resist Process time ATi fete 7 17 E Example Megasonic Enhanced Photoresist Strip with DiO Dissolved ozone in DIW DiO provides an effective replacement for Piranha H SO H O cleans 18 The fundamental chemistry of ozone based cleaning is due to direct and indirect reactions of ozone and oxygen radicals the so called radical pathway Due to its high oxidation rate the radical path way can accelerate the reaction Megasonic energy can act as an initiator for the radical pathway At the same time due to the creation of turbulence inside the boundary layer the available ozone close to the surface is increased In a study by D Dussault of ProSys and Jens Fittkau and Christiane Gottschalk of ASTeX GmbH
17. ocess Chamber 106mm 106mm Operator has 106mm each side for loading and unloading of 430x430mm substrate O1040mm Process Chamber 11 E Vacuum or Mechanical Chucks 12 We offer several chucks for use in our Spin Coaters One vacuum chuck is always included standard with the system We stock a range of precision machined polypropylene or PTFE solvent safe chucks compatible with our Spin Coaters up to 300mm Our chucks are machined to close tolerances and provide an exceptionally flat rigid surface for mounting substrates of different sizes weights and shapes All units come standard including vacuum chuck Smaller sizes include an interchangeable small fragment adapter with push fit base that fits firmly onto the standard included chuck for ease of use SPS Europe can also provide custom chucks depending on your application including porous PTFE for thin substrates For square and rectangular substrates we offer a recessed design which holds the substrate securely in place both with or without vacuum reducing substrate warpage for better film uniformity during coating Chucks are available in following materials PP NPP with EPDM o ring FP PTFE TFM1600 with FKM o ring SS Stainless Steel AL Aluminium Round Substrates Vacuum for 2 up to 300mm Wafer Round Substrates Low Contact MEMS Vacuum and Centering pins Glass Substrates ee Round Substrates Mask Solar Cells
18. ose between 150 and 200mm active area and is available in a Sapphire or Stainless Steel ZTop MegPie Seen oe The Polos ZTop MegPie control is integrated into the software of the Polos Advanced allowing servocontrolled positioning of the MegPie forward power as well as monitor the reflected noe ESTE ean power and control the temperature alarms The distance to the sy CS PEA substrate is monitored with an ultrasonic sensor YY amp gt a a er 1 CONTI ttaar ion Poe Upon Megasonic cleaning using diluted NH OH excellent results are obtained Test report available at request E Example Non Hazardous Cleaning Photoresist Stripping and Metall Lift Off a i ET as mE E J Si sample with phase fluid Si sample with phase fluid and DI water rinse Si reference _ FTIR characterisation of Si reference and sample after fluid and water rinse off shows total surface recovery and absence of any residues Physical Data Overview Parameter lisoPUR fluid pH 5 7 undiluted Flash point DIN EN 22719 gt 60 C n definable Flow time DIN 53211 54 sec 22 C Boiling point 90 98 C Freezing point 5 4 C Gravitiy 22 C 0 996 g cm3 Viscosity 20 C t b d The fluids are compatible with all silicon silicon diox ide silicon nitride titanium metals and metal oxides and many other substrates The working principle of the fluids is a pure physical lif
19. parameters like time temperature energy consumption and or bath life Ecological Advantages for Safe Use E Intelligent fluids consist only of gentle ingredients without hazardous potential The waterbased formulations are non flammable pH neutral biodegradable and can easily deactivated by adding water Advantages of lisoPUR Enables future semiconductor technology trends Reduced total costs of ownership Reduction of process steps er time E Extraordinary stripping performance E Sustainable process fluids incl recycling E Dermatologically tested very good E Neutral pH range non corrisive non etching No substrate stress corrosion or oxidation E Smart but powerful formulations Process Data for lisoPUR waterbased Photoresist Stripper Batch Bath Process example Adjust required bath temperature 20 to 50 C Immerse wafer lot into bath Leave wafers in bath for requested time Use ultrasonic agitation for faster process Bring wafers into rinse cascade Rinse with DI water IPA or intelligent rinse Dry wafers with nitrogen or compressed flow Single Wafer Process example pre treatment in soak bath if requested Wet transfer on single wafer chuck Spray lisoPUR 90psi 250rpm 50 C 60sec DI water spray 90psi 250rpm 50 C 30sec IPA rinse no pressure 250rom RTemp 30sec Dry spin no pressure 2000rpm RTemp 60sec All steps under nitrogen atmosphere optiona
20. res to a few microns in thickness mode rotation The control of the motor clockwise counterclockwise in combination with the up to 6 automatic dispensers allows to obtain an uniform deposition of multilayer thin films and to perform photoresist development These features enable a quick work optimization with fully automatic processes and high reproducibility Connect N top purge to fill the chamber with N blanket met close up The physical and chemical cleanliness of a substrate is critical for high quality films regardless of the application method Our units can be incorporated with Megasonic allowing one system for a wide range of processes depending on substrate size and chuck type E Example Post CMP Cleaning After CMP often the surface is highly contaminated by slurry residues Tests on 3 polished silicon wafer pressure a slurry containing 50nm colloidal silica particules showed that by using the POLOS Advanced with Z lop MegPie Megasonic Transducer operating around 1MHz and using diluted NH OH excellent results were obtained Highly diluted 2 NH OH is used to enhance electrostatic repulsion between particules and surface control of Zeta potential to avoid re deposition and re attachment After CMP After megasonic cleaning In our test case the Polos ZTop MegPie integration kit for Polos Advanced 200mm was implemented This MegPie kit allows you wo to cho
21. rocess chamber is constructed of solid polypropylene or ultra pure PTFE while the movable dispense arm pro cess tanks and chemical supply lines are all made of ultra pure seamless Teflon PFA or PTFE This entirely metal free environment is suitable for a variety of aggressive media and a multitude of processes The sideway integrated dispense arm fully withdraws from the process chamber to avoid negative influence on process uniformity Modular Setup for a Wide Process Window in a Compact Footprint General Features Single Substrate Spin Processor Wide Process Window Manual Loading Flexible Processing Accurate amp Repeatable Compact Footprint Value for money Fully automatic accurate and repeatable processing Movable linear dispense arm Freely programmable static dynamic or oscillating chemical dispense High pressure and or megasonic cleaning directly to any point on the substrate Static chemical dispense through a range of adjust adjustable nozzles in the domed lid Adjustable back side spray arm Heavy duty motor programmable for 0 12 000 rpm CW amp CCW Rotation allowing puddle mode Freely programmable processes Sequentially programmable multiple dispense line Stepless programming of various flows within a process step from 150 up to 2 500 ml min For optional integrated mixing systems the mixing rates of the various chemicals can be programmed per step
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23. ting off instead of a chemical dissolving SPS Europe offer water based intelligent fluids that use a non disruptive unique technology based on smart gentle ingredients to enable new possibilities for innovative stripping and lift off applications in microelectronics The lisoPUR product family are liquid liquid based fluids which form dynamic inner structures The fluids are built up from dynamic and flexible plasmicells The globular shapes of the fluid interact with each oth er and tend to change their forms within millisec onds 1 000 to 8 000 times per second Particle Free Application Post processing 112 defects 38 adder 0 12 1 00um Pre processing 74 defects 0 12 1 00um Particle measurement KLA Tencor SP2 indi cates almost neutral particle behaviour after cleaning with phase fluid and diluted SC1 short rinse Use of the MegPie can reduce the process time or support the performance Due to the pH neutral fluid and the new working principle the surface properties of the substrates stays unef fected Final rinse leaves wafer surface uneffect ed and free from residues Intelligent fluids are Enabler for Technology Advantages on Substrates I The character of the fluids reduces critical impacts of the stripping process such as surface roughness pattern collapse insufficient wetability and reduces process complexity TCO amp Performance Advantages I The smart mode of action optimises process
24. up to 1000mm square SPS Europe operate as a full service distributor to the front end semiconductor manufacturers and related industry From our 6 offices in Europe 1 office in Singapore and a world wide distributor network we Offer full time service engineer support for the systems we supply in almost a every country Dedication towards our customers and flexibility in finding the right solution combined with solid application knowledge and fast supply logistics are the keywords of our service www SPS Europe com www SPS Asia com www Spincoating com EUROPE SPS Europe B V SPS Europe GmbH S P S Ltd S P S bvba S P S bvba S P S bvba Midden Engweg 41 Weisbergerstrasse 3 Aghmhor Annex Steenweg op Withof 5 9 Rue du Pont a Lunettes Via G Verdi 18b NL 3882 TS Putten D 85053 Ingolstadt Whitmuir Selkirk B 2960 St Job in t Goor F 69390 Vourles 27021 Bereguardo The Netherlands Germany TD7 4PZ United Kingdom Belgium France Italy Tel 31 341 360 590 Tel 49 841 370 530 Tel 44 1750 725 712 Tel 32 3 440 0895 Tel 33 4 72 31 78 35 Tel 39 0 382 920 739 Fax 31 341 360 589 Fax 49 841 370 5322 Fax 44 1750 214 01 Fax 32 3 440 5181 Fax 33 4 78 05 13 45 Fax 39 0 382 920 738 e mail info sps europe com e mail info de sps europe com info uk sps europe com e mail info be sps europe com e mail info fr sps europe com e mail info it sps europe com ASIA SPS Asia Technology Pte Ltd 10 Ubi Crescen
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