MK71050 Evaluation Kit Hardware Manual
Contents
1. MK71050 03 Evaluation Kit Hardware Manual 1 MK71050 03 Evaluation Kit overview 1 MK71050 03 Evaluation Kit overview Once the MK71050 03 Evaluation Kit delivered please confirm that the following composition article contents are all packed in this kit If you find any damage leakage of the package article in the kit please contact to your distributor or the ROHM s responsible sales The composition article contents Composition article Quantity MK71050 03 USB dongle Central MK71050 03 wireless module Central USB conversion board MK71050 03 USB dongle Peripheral MK71050 03 wireless module Peripheral USB conversion board u EASE Conversion Board MK71050 03 Evaluation Kit USB dongle USB dongle ee KC SS MK71050 03 wireless module d e bent ch 44 11 e Peripheral i ES ION a i 7 PPP L 93993933533 Berria teeceececcee USB conversionboard USB conversion board to u EASE Conversion Board k Figure 1 1 MK71050 03 Evaluation Kit PEXK71050 03 EvalKit HardManual 01 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual 2 General Description 2 General Description 2 1 Svstem structure MK71050 03 USB dongle can be master role of Bluetooth LE connection or slave role of Bluetooth LE connection Central USB Dongle Terminal Software USB MK71050 Conversion Wireless Boa2. Kit Hardware Manual Preface This hardware manual describes hardware overview of the MK71050 03 Evaluation Kit which enables Bluetooth LE compliant 2 4GHz band radio communication capability to Windows PC via USB The following related manual is available and should be referenced as needed MK71050 03 Data Sheet ML7105 Data Sheet ML7105 User s Manual Bluetooth Application Controller Interface BACI Command Manual Bluetooth Low Energy VSSPP Software User s Guide PEXK71050 03 EvalKit HardManual 01 IV LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual Table of Contents NS ame a A maa d ken alaz ae sk odan a Ba Sall EE ak ea Dane elle TS 1 St e AR e KR ERE A EE A ee IV Male ee 2 ay a A e a V ile MIR 1050 03 EValtia Oi ge EE 1 2 General erip arel mete re Vener iet at dan the get klin eda la ta ia Alia lira ts let jatu at dan kie ta 2 Se O Sim SUE az e yi e e E e DA Yi EM 2 2 2 Gomposition of MK71050 03 USB Eeleren dm alada E 3 3 EENEG EEN 4 Sel WSU SE EE 4 lee 5 fal Gone e ii 5 di E e WE Se e ee a See ate ene eee sees 6 Bel IS EE ees 6 e EE E Ee DO A iii AA RA 8 REVISION i SOU a A aaa Pen ate enacts Sn sata ts aces cg teats a nme at a eae 9 Bluetooth amp is a registered trademark of Bluetooth SIG Inc All other company and product names are the trademarks or registered trademarks of the respective companies PEXK71050 03 EvalKit HardManual 01 v LAPIS Semiconductor Co Ltd
3. pertaining to the usage of appropriate products is not permitted Further the Specification in part or in whole may not be reprinted or reproduced and disclosed to third parties without prior consent of LAPIS Semiconductor Precautions for the Products e Precautions for Safety 1 The Products are designed and produced for application in ordinary electronic equipment AV equipment OA equipment telecommunication equipment home appliances amusement equipment etc 2 For use of our Products in applications requiring a high degree of reliability as exemplified below please contact and consult with a LAPIS Semiconductor representative transportation equipment i e cars ships trains primary communication equipment traffic lights fire crime prevention safety equipment medical systems servers solar cells and power transmission systems 3 Do not use our Products in applications requiring extremely high reliability such as aerospace equipment nuclear power control systems and submarine repeaters 4 The Products are designed for use in a standard environment and not in any special environments Application of the Products in a special environment can deteriorate product performance Accordingly verification and confirmation of product performance prior to use 1s recommended if used under the following conditions a Use in various types of liquid including water oils chemicals and organic solvents b Use outdoors wher
4. to the next page PEXK71050 03 EvalKit HardManual 01 6 MK71050 03 Evaluation Kit Hardware Manual LAPIS Semiconductor Co ltd User Interface 4 55 l 4m CES ei Du FF Cal hd i 9 318 Hd 031 di e dle El TE mods 318 mas n yt EES emm mem pen Six mal 2 dE trOMem zn ddA L 2 Ci RE A ei e ri 1 Ai r Oe fajl dota gt ABU NOW en ampon 318 EEE a ii dda m jn A 63 E e KE EE ii ii SUD M Fal Sl 300ML Ise ZEHR LE al Mg 391 813534 i ES Oe SAL 21 dd BL EO XAL 0d a gt alf 001939 Old LO go R vii DREI da ido 118 LCE Ee O Me LE Edi 318 5 EC Uma PIU BIT BIT 23 a3 inddids 718 NIQIHS 113 Loy 44 0409 8091 nal L3 33 1141 1114 HIN d SIN Ddi BOS d M5 LD ED OSDLLAHM 20831 ngl aJ l MS 813534 i LKA lk ees 300ML 118 a DS 318 IA 135 JE Hilda 8 NIJIHS 318 pm Di F vds 318 ID OS Del 1000145 Ep 8 1M6dlds 318 ee Ende a a MIST 27 1101457118 Wa LAO ing Wl Ke En LULU 3S yan Joo EC il ddA p gt Mid il LILMH b ar Figure 5 1 MK71050 03 wireless module 0192 02 08MA PEXK71050 03 EvalKit HardManual 01 MK71050 03 Evaluation Kit Hardware Manual LAPIS Semiconductor Co Ltd 4 User Interface 5 2 USB conversion board PJEH Sld 1 2 J NN ON INIMWAC OT xd Maa DANSA 20 Q34JIHI O44 0ddd B 08 31N OM Bd K
5. CP htm 2 Insert USB dongle into USB connector on your PC 3 Run the terminal software and set the below serial port setting e Baud rate 38400 Data bit 8 bit e Parity None Stop bit 1 bit Flow control None 4 Push on the reset switch of MK71050 03 wireless module Please refer to the Bluetooth Low Energy VSSPP Software User s Guide for more detail procedure PEXK71050 03 EvalKit HardManual 01 4 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual 4 User Mmterface 4 User Interface 4 1 Connecting uEASE uEASE is In Circuit Emulator ICE module for U8 microcontroller ML610Q482 mounted on MK71050 03 wireless module Connection between MK71050 03 wireless module and uEASE module will be done as shown below picture As pin pitches between uEASE connector and cable for uEASE are different uEASE pitch conversion board has to be used pin mark Connector N pin mark orientation mark Figure 4 1 MK71050 03 wireless module with uEASE Using uEASE following function can be achieve Write application code into Flash memory embedded in ML610Q482 On chip debugging Reset step execution stop trigger etc For more detail about debugging feature please refer to uEASE PEXK71050 03 EvalKit HardManual 01 5 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual 4 User Interface 5 PCB Schematics 5 1 MK71050 03 wireless module Please refer
6. ROHM GROUP PEXK71050 03 EvalKit HardManual 02 LAPIS SEMICONDUCTOR MK 71050 03 Evaluation Kit Hardware Manual Issue Date Mar 10 2015 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual Notes Precautions for the Specification 1 Contents of the Specification are the information at the time of their issuance The information contained herein is subject to change without notice 2 LAPIS Semiconductor has used reasonable care in preparing the information included in the Specification but LAPIS Semiconductor does not warrant that such information is error free LAPIS Semiconductor assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein 3 The technical information specified herein 1s intended only to show the typical functions of the Products and examples of application circuits for the Products No license expressly or implied is granted hereby under any intellectual property rights or other rights of LAPIS Semiconductor or any third party with respect to the information contained in this document therefore LAPIS Semiconductor shall have no responsibility whatsoever for any dispute concerning such rights owned by third parties arising out of the use of such technical information 4 The Specification contains information related to the LAPIS Semiconductor s copyright and technical know how Any use of them other than
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8. asures must be taken including the following a Installation of protection circuits or other protective devices to improve system safety b Installation of redundant circuits in the case of single circuit failure 10 Failure induced under deviant condition from what defined in the Specification can not be guaranteed 11 This product is a specification to radiate the radio wave It is necessary to acquire the attestation of decided Radio Law of each region used to use the equipment that radiates the radio wave Please inquire about the attestation of Radio Law that this product acquires 12 When product safety related problems arises please immediately inform to LAPIS Semiconductor and consider technical counter measure e Precautions for Reference Circuits 1 If change is made to the constant of an external circuit allow a sufficient margin due to variations of the characteristics of the Products and external components including transient characteristics as well as static characteristics 2 The reference circuit examples their constants and other types of information contained herein are applicable only when the Products are used in accordance with standard methods Therefore if mass production is intended sufficient consideration to external conditions must be made e Precaution for Electrostatic This product is Electrostatic sensitive product which may be damaged due to Electrostatic discharge Please take proper caution d
9. e the Products are exposed to direct sunlight or in dusty places c Use in places where the Products are exposed to sea winds or corrosive gases including CL H S NH SO and NO d Use in places where the rPoducts are exposed to static electricity or electromagnetic waves e Use in environment subject to strong vibration and impact f Use in proximity to heat producing components plastic cords or other flammable items g Use involving sealing or coating the Products with resin or other coating materials h Use of the Products in places subject to dew condensation 5 The Products might receive the radio wave interference from electronic devices such as Wireless LAN devices Bluetooth devices digital cordless telephone microwave oven and so on that radiate electromagnetic wave 6 The Products are not radiation resistant 7 Verification and confirmation of performance characteristics of Products after on board mounting 1s advised 8 Confirm that operation temperature 1s within the specified range described in the Specification PEXK71050 03 EvalKit HardManual 01 1 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual 9 Although LAPIS Semiconductor is continuously working to improve product reliability and quality semiconductors can break down and malfunction due to various factors Therefore if product malfunctions may result in serious damage including that to human life sufficient fail safe me
10. rd Module gt AA emmer e e mm mm e me mm mm mm mi Bluetooth Low Energy Master Peripheral a a USB Dongle MK71050 USB Wireless Conversion Module Board Terminal Software Bluetooth Low Energv Slave Figure 2 1 System overview using MK71050 03 Evaluation Kit PEXK71050 03 EvalKit HardManual 01 gt LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual 2 General Description 2 2 Composition of MK71050 03 USB dongle Figure 2 2 shows a external view of MK71050 03 USB dongle and Table 2 1 explains the compositions Bottom Fa Te OS PTO Figure 2 2 External view of MK71050 03 USB dongle Table 2 1 Composition of MK71050 03 USB dongle Number Name Symbol Description MK71050 03 wireless module USB conversion board Bluetooth LE wireless module Reset switch of MK71050 03 U8 MCU Connector port for UEASE port conversion board Molex 0 5mm pitch BtoB connector plug IST Molex 0 5mm pitch BtoB connector receptacle Reset switch of USB conversion board FTDI USB UART USB serial IC USB plug A PCB pattern ONO PEXK71050 03 EvalKit HardManual 01 3 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual 3 Operation procedure 3 Operation procedure 3 1 First setup amp Install driver software for USB serial IC Virtual Com Port driver can be downloaded from following link http www ftdichip com Drivers V
11. them properly with a industry waste company e Prohibition Regarding Intellectual Property LAPIS Semiconductor prohibits the purchaser of the Products to exercise or use the intellectual property rights industrial property rights or any other rights that either belong to or are controlled by LAPIS Semiconductor other than the right to use sell or dispose of the Products PEXK71050 03 EvalKit HardManual 01 li LAPIS Semiconductor Co Ltd MK71050 03 Evaluation Kit Hardware Manual e The other precautions 1 Please use the Products in accordance with any applicable environmental laws and regulations such as the RoHS Directive For more details including RoHS compatibility please contact a ROHM sales office LAPIS Semiconductor shall have no responsibility for any damages or losses resulting non compliance with any applicable laws or regulations 2 When providing our Products and technologies contained in the Specification to other countries you must abide by the procedures and provisions stipulated in all applicable export laws and regulations including without limitation the US Export Administration Regulations and the Foreign Exchange and Foreign Trade Act Copyright 2014 2015 LAPIS Semiconductor Co Ltd LAPIS Semiconductor Co Ltd 2 4 8 Shinyokohama Kouhoku ku Yokohama 222 8575 Japan http www lapis semi com en PEXK71050 03 EvalKit HardManual 01 111 LAPIS Semiconductor Co Ltd MK71050 03 Evaluation
12. uring manufacturing and storing so that voltage exceeding Product maximum rating won t be applied to the Products Please take special care under dry condition Grounding of human body equipment solder iron isolation from charged objects setting of Ionizer friction prevention and temperature humidity control etc e Precautions for Storage Transportation 1 Product performance and connector mating may deteriorate if the Products are stored in the following places a Where the Products are exposed to sea winds or corrosive gases including CL H2S NH3 SO and NO b Where the temperature or humidity exceeds those recommended by LAPIS Semiconductor Temperature 5 C to 40 C Humidity 40 to 60 c Storage in direct sunshine or condensation d Storage in high Electrostatic 2 Even under LAPIS Semiconductor recommended storage condition connector mating mountability and heat resistance of products over year old may be degraded 3 Store transport cartons in the correct direction which is indicated on a carton as a symbol otherwise bent leads may occur due to excessive stress applied when dropping of a carton e Precaution for Product Label QR code printed on LAPIS Semiconductor product label is only for internal use and please do not use at customer site It might contain internal products information that is inconsistent with product information e Precaution for Disposition When disposing Products please dispose
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