Manuel pour RC8 - CMI
Contents
1. 02 20 14 47 chore career T Hole diameter jo mm Filename CM_S Tet SSSOSOSC S MW Save Scan MV AutoScan Files of type Process Files PRC 7 Cancel CS Units MPa Wafer Flat Laser selection Automatic V Automatic Stress Calculations Automatic save graph data EPFL CMi1 PhL Page 1 sur 3 FLX 2320 S CMi User manual created February 27 2013 last update June 17 2013 4 3 First measurement no film Measure First no film Enter File name for example ID number of the wafer Enter ID for the first measurement for example 1 0 2 90 Thickness of the substrate can be adjusted if need be Mi Lis bs P a a 5 i 7 Ly i Dittsasce mm 4 4 Perform your thin film deposition on upper side of your wafer 4 5 Stress measurement 4 5 1 Select Single from the Measure tab on the main screen S x D La K Ciatance A Da File File name for example ID number of the wafer ID of the first measurement for example 1 0 2 90 Film thickness in A EPFL CM1 PhL Page 2 sur 3 FLX 2320 S CMi User manual created February 27 2013 last update June 17 2013 4 5 2 Press the Measure button The instrument will perform a scan 4 5 3 Results are then displayed Intensity graph Deflection graph with stress calculation 5 Unloading 5 1 Open the door Get back your substrate on the substrate2. FLX 2320 S CMi User manual created February 27 2013 last update June 17 2013 EPFL CMi FLX 2320 S WARNING Only the CMi Staff is qualified to do a service or to do maintenance User manual 1 Login 1 1 Logon on the ACCESS CONTROL SYSTEM on the zone computer to unlock the keyboard of the FLX 2320 S 2 Starting up 2 1 SOURCE light must be already ON tool powered up KOZERA 2 2 MAIN POWER Breaker ON gt GRESINTETT 2 3 LASER Turn the key to ON gt Gitta 3 Loading 3 1 Open the door 3 2 Place the Locator Ring for 4 wafer positioning at a given angle 3 3 Put your substrate on the substrate holder 3 4 Close the door 4 Recipe Selection and Start Measurement 4 1 Start WINFLX enter your login and password FLX TOHO TECHNOLOGY Measure Utilities Edit Analysis Auto Export View Help E sla Sle Edit Analysis View Help bY Data files Measure Utilities E ol Process programs Look in i PROCESS e ex Ev Maximum scan points 50 Materials data base Users Name Date modified oS Low intensity alarm 0 2 100 PRC 2012 02 15 8 48 1805 s100 gt Password Change 4 Elastic modulus 1 805 SI 100 v MPa 1200 PRC 2012 12 13 5 42 User Account _ CMi_Si DSP PRC 2013 02 22 13 50 Substrate thickness 380 um _ cmi_si dsp_CHi PRC 2013 01 25 7 14 100 EMi Si Test PRC 2013
3. holder Close the door 6 Shutting down 6 1 LASER Turn the key to OFF 6 2 MAIN POWER OFF 6 3 SOURCE light stays always ON tool powered up KOENI 7 Logout 7 1 Logout from the FLX 2320 S 7 2 Logout from the ACCESS CONTROL SYSTEM EPFL CMi PhL Page 3 sur 3
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