SEED-DIM3517 Hardware User Manual
Contents
1. TI Third Party Network Wh SEED Internationa e DSP Seed Today Succeed Tomorro TRAS INSTRUMENTS SEED DIM3517 Hardware User Manual Documents Version and serial number SEED DIM3517 hardware user s manual Documents History Version History Author Updated date REVA Initial HEM 2010 7 30 Software Edition Version History Author Updated date SEED DIM3517 Initial 2010 10 22 2011 7 AM3517 Solutions SEED DIM3517 Hardware Users Manual SEED DIM3517 Hardware Users Manual Version A 2011 77 http www seeddsp com IMPORTANT NOTICE SEED Electronic Technology Ltd reserves the right to make changes to its products or to discontinue any product or service without notice Customers are advised to obtain the latest version of relevant information to verify that the data being relied on is current before placing orders SEED DIM3517 Hardware Users Manual Preface Read This First Introduction This manual is the users guide for the SEED DIM3517 hardware which based on AM3517 embedded multi media system solutions It described the hardware feature principle and usage of SEED DIM3517 in detail Warranty The warranty period for all hardware and software products manufactured by SEED International is one year after shipment SEED International guarantees free of charge repair or replacement for the manufacturer caused damaged products during warranty period Software updates will be sent free o2. 1 UARTpin definitions Descriptions UART Universal Asynchronous Receiver Transmitter this BUS support bi directional communication realize Duplex Transmissions and data receiving In the embedded design UART is used to communicate with PC including Monitoring debugger and other components such as EEPROM Note The Initialization serial is UART3 in this core Q MCBSP interface definitions Signal Pin Pin MCBSP4_CLKX 136 135 MCBSP3_CLKX Table 2 MCBSP Pin Definitions Signal Description McBSP is Multichannel Buffered Serial Port of Digital Signal Processors produced by Texas Instruments McBSP expands the function ofthe standard serial interface so it has the same basic function with standard serial interface It can communicate with other serial devices such as DSP encoder Note MCBSP doesn t support A LAW and U LAW MCBSP2 can used as Audio data Audio buffer and sidetone MCBSP3 can be used as Bluetooth speech data and sidestone MCBSP4 can be used as DBB speech data U VIDEO IN interface definition Signal Pin Pin Signal 49 51 53 60 5 Table 1 VIDEO IN pin definition E 8 CCDC_D3 0 CCDC_D2 2 2 Note This interface is used to connect the camera U MMC SD interface definition Chapter 3 physical description Signal i i Signal MMC2_D6 MMC2_D7 MMC2_D4 MMC2_D5 MMC2_D2 MMC2_D3 MMC2_DO MMC2_D1 MMC2_CLK MMC2_CMD MMC1_D2 MMC1_D3 MMC1_DO MMC1_D1 MMC1_CLK MMC1_CMD Table 2 MMC SD PIN De
3. components on SEED DIM3517 board The hardware includes Professor Interface and power 2 1 AM3517 Processor 2 1 1 AM3517 AM3517 05 is a high performance ARM Cortex A8 microprocessor The device offers 3D graphics acceleration while also supporting numerous peripherals including DDR2 CAN EMAC and USB OTG PHY that are well suited for industrial applications The CPU of SEED DIM3517 is AM3517 it is a high performance ARM Cortex A8 microprocessor with speeds up to 600 MHz with package of 491 pin BGA 17x17 0 65mm pitch for Non_invasive Debug ZCN suffix AM3517 integrates various of peripherals such as High End CAN Controller and 10 100 Mbit Ethernet MAC EMAC etc making it be of a help for designers to reduce the system development cost The abundant interfaces facilitates the designers to do network and Serial Communication suitable for Home and Industrial automation Single Board Computers and it is available for graphic and high end calculator functions when the power less than 1W The processor 3 3V I O reduce the system cost by canceling the requirement of level translator AM3517 is the combiner of AM3505 with the PowerVR SGX Graphic engine that enables the device to offer 3D graphics acceleration while also supporting numerous peripherals including DDR2 CAN The processing speed of graphic engine can reach 10Mpolygon per second and support OpenGL ES 2 0 Image rotation image enlarges or shrinks even all in mouser ac
4. 7 1 1 Feature SEED DIM3517 is an evaluation module based on AM3517 from Texas Instruments AM3517 is a high performance ARM Cortex A8 microprocessor with speeds up to 600 MHz The device offers 3D graphics acceleration while also supporting numerous peripherals including DDR2 CAN EMAC and USB OTG PHY that are well suited for industrial applications SEED DIM3517 adopts DIMM design of card Plug in suitable for various of industrial applications On board resources AM3517 NAND FLASH DDR2 Power EMAC PHY JTAG etc DIMM Interface 1 8V DIMM contactor Peripherals USB VPFE network port 2D 3D graphics acceleration HDQY1 Wire UART I2C SPI MMCASDASDIO McBSP HECC DSS GPIO etc 5 a Gi u 3 po R N cu cn cr R9 iwl cu dem wa CIS u 23 gt EZ El el a E E RIO da F wat L Chapter 1 Function Introduction Figure 1 SEED DIM3517 Front View germ S Y Mn Figure 2 SEED DIM3517 Back SEED DIM3517 Hardware Resources Processor AM3517 NAND FLASH K9F4G08U0A 4Gb DDR2 K4T1G164QE HCE7 1Gb X 2 Ethernet port PHY On board RTC DIMM Connector interface refer table 1 Power OoOOOvovodDO 1 2 Function Introduction System Block Diagram 5 DDR2 power CLOCK MM re AM3517 ETH PHY DIMM CONNECTOR SEED DIM3517 Hardware Users Manual Figure 1 SEED DIM3517 Block Diagram SEED DIM3517 MEA FH Chapter 2 Board components This article mainly introduces the feature of the
5. M link speed the MIT is 2 5M RMII is 5M for 100M link speed MII is 25M RMII is 50M MII RMII is used to transmit Ethernet package the interface of MII RMII is 4 2bit codec will be available on UTP and optical fiber after serial parallel conversation in the PHY of Ethernet frame format IEEE 802 3 10M IEEE 802 3u 100M IEEE 802 1q VLAN The frame format of Ethernet Preamble Start of frame delimiter MAC destination MAC source Ethertvpe or length data padding optional 32bitCRC If there exists vlan you need to add vlan tag with 2 byte after Ethertype or length in which 12bit means vlan id 4bit meant the priority of the data A DSS interface definitions m E an Signal zZ N N a zZ DSS_D14 DSS_D12 N N N DSS_D15 DSS_D13 m co N pa co m oO ejeje ee Je o oj nmn ejeje N Ne m oO DSS_D10 DSS_D8 DSS_D6 DSS_D4 DSS_D2 DSS_DO DSS_D16 DSS_D18 DSS_D11 DSS_D9 DSS_D7 DSS_D5 DSS_D3 DSS_D1 DSS_D17 DSS_D19 ej ej eje e jele ND oO0o o op oJ poJjo OJ AINI SJ Rhiriaja w DSS_D20 DSS_D22 DSS_VSYNC DSS_ACBIAS 4 Ko oe DSS_D21 DSS_D23 DSS_PCLK DSS_HSYNC 0 RES HLN NTN IO D a o Table 1 DSS PIN definitions Note Support LCD and TV display U UART interface definitions Signal i i Signal UART1_TXD UART3_TXD SEED DIM3517 Hardware Users Manual UART1_RXD 66 65 UART3_RXD UART2_TX 82 85 UART2_CTS UART2_RX 84 87 UART2_RTS Table
6. SP2_FSX GND 156 157 NC NC 158 159 MCBSP2_CLKX NC 160 161 NC NC 162 163 MCBSP2_DR NC 164 165 GND GND GND 166 167 NC NC 168 169 NC NC 170 DSS 171 GND GND 172 173 DSS PCLK DSS_VSYNC 174 175 DSS_HSYNC DSS_ACBIAS 176 177 DSS D15 DSS D14 178 179 DSS D13 DSS D12 180 181 DSS D11 DSS D10 182 183 DSS_D9 DSS_D8 184 185 DSS_D7 DSS_D6 186 187 DSS D5 DSS_D4 188 189 DSS_D3 DSS_D2 190 ISA DSS_D1 DSS_DO 192 193 DSS_D17 DSS_D16 194 195 DSS_D19 DSS_D18 196 197 DSS_D21 DSS_D20 198 199 DSS_D23 DSS_D22 200 EI fas DR fas ER Table 1 DIMM connector definition SEED DIM3517 FAP FH 2 3 Power Module The power on SEED DIM3517 is TPS65023 It provides the board 1 2V 3 3V 1 8V and RTC power A From DIM pin input power 5V Q Onboard Power 3 3V 1 8V 3 3VA 1 2VRTC DDR VREF VBAT EMAC_1 8VA EMAC_1 8VPLL Main functions of these power 3 3V Work voltage for NAND ENTHNET_PHY and IO voltage of AM3517 1 8V IO voltage of AM3517 and the work voltage of DDR2 1 2VRTC RTC voltage for AM3517 DDR_VREF 0 9V Reference voltage of DDR2 VBAT 3 3V spare work voltage EMAC_1 8VA work voltage of ENTHNET_PHY EMAC_1 8VPLL work voltage of ENTHNET_PHY OoOoOcvoovodo SEED DIM3517 Hardware Users Manual Chapter 3 Physical description 3 1 PCB layout SEED DIM3517 front view cs 5 D gt Po ener RB cu R9 Wie Bici m wa Cl Tim El CA A ti l Epe E RIO Rn EB IU UU UU U F
7. V although systems with other voltages are permitted Q SPI Interface Definition Signal i i Signal MCSPI1_SOMI MCSPI1_CLK MCSPI1_SIMO MCSPI1_CS1 GPIO_176 GPIO_174 Table 4 SPI pin definition Description SPI The Serial Peripheral Interface Bus or SPI pronounced li ke SP L or spy bus is a synchronous serial data link standard named by Motorola that operates in full duplex mode Devices communicate in master sla ve mode where the master device initiates the data frame Multiple slave devic es are allowed with individual slave select chip select lines Sometimes SPI is called a four wire serial bus contrasting with three two and one wire seri al buses The SPI bus specifies four logic signals e SCLK Serial Clock output from master e MOSI SIMO Master Output Slave Input output from master e MISO SOMI Master Input Slave Output output from slave e SS Slave Select active low output from master Alternative naming conventions are also widelv used Chapter 3 physical description e SCK CLK Serial Clock output from master e SDI DI DIN SI Serial Data In Data In Serial In e SDO DO DOUT SO Serial Data Out Data Out Serial Out nCS CS CSB CSN nSS STE Chip Select Slave Transmit Enable active low output from master The SDI SDO DI DO SI SO convention requires that SDO on the master be connected to SDI on the slave and vice versa Chip select polarity is rarely act
8. _D4 CCDC_D5 52 53 CCDC_D6 CCDC_D7 54 55 NC NC 56 57 NC NC 58 59 NC CCDC_FIELD 60 61 CCDC_HD CCDC_VD 62 63 UART3_TXD UART1_TXD 64 UART1 amp UART3 65 UART3_RXD UART1_RXD 66 67 12C1_SDA 12C1 12C1_SCL 68 69 MCSPI1_CLK MCSPI1_SOMI 70 HA MCSPI1_CS1 SPI1 MCSPI1_SIMO 72 73 GPIO_174 GPIO_176 74 75 GND GND GND 76 77 GPMC_CSO NC 78 79 GPMC_CS1 NC 80 81 GPMC_CS2 UART2_TX 82 83 GPMC_CS4 EMAF amp SD_0 UART2_RX 84 85 UART2_CTS NC 86 87 UART2_RTS NC 88 89 NC GPIO 3 90 91 GPIO 6 GPIO 56 92 93 GPIO 128 GPIO_186 94 95 MMC2_D7 MMC2_D6 96 97 MMC2_D5 MMC2_D4 98 99 MMC2_D3 MMC2_D2 100 101 MMC2_D1 MMC2_DO 102 103 MMC2_CMD MMC2_CLK 104 105 MMC1_D3 MMC1_D2 106 107 MMC1_D1 MMC1 DO 108 109 MMC1 CMD MMC1_CLK 110 111 NC NC 112 wS NC NC 114 115 NC NC 116 117 NC NC 118 119 TV_OUT1 32K_CLKOUT 120 121 SYS BOOT5 SYS BOOT2 122 123 SYS BOOT3 SYS_BOOTO 124 125 GPIO 177 GPIO 170 126 Chapter 2 On board components 127 GPIO 182 VOUT_RST 128 129 GPIO_178 NC 130 131 GPIO_179 NC 132 133 GND NC 134 135 MCBSP3_CLKX MCBSP4_CLKX 136 137 MCBSP3_FSX MCBSP4_FSX 138 MCBSP3 4 139 MCBSP3_DX MCBSP4_DX 140 141 MCBSP3_DR MCBSP4_DR 142 143 GND GND GND 144 145 NC NC 146 147 MCBSP2_DX NC 148 149 GND GND 150 151 NC NC 152 153 NC NC 154 MCBSP2 155 MCB
9. bandwidth of 480 Mbit s 60 MB s now called Hi Speed compatible with USB 1 0 1 1 interface O Generation 3 USB 3 0 USB 3 0 has transmission speeds of up to 5 Gbit s which is 10 times faster than USB2 0 480 Mbit s USB 3 0 significantly reduces the time required for data transmission reduces power consumption and is downward compatible with USB 2 0 The USB 3 0 Promoter Group announced on 17 November 2008 that the specification of version 3 0 had been completed and had made the transition to the USB Implementers Forum USB IF the managing body of USB specifications This move effectively opened the specification to hardware developers for implementation in future products USB On The Go often abbreviated USB OTG is a specification that allows for USB devices which would normally act as slaves e g digital audio players or mobile phones to switch roles and become the host themselves Description USBO connect USB OTG this interface PHY is provided by AM3517 USB1 signal act as USB HOST interface it offers PGY through chip USB3320QFN32 OU EMAC Interface definitions Chapter 3 physical description TX 30 40 GND Table 1 EMAC pin definitions Descriptions network use RMII Details RMII Reduced Media Independent Interface itis one of the standard Ethernet interfaces less I O transportation than MIL RMII uses two lines to transmit data MII uses 4 lines to transmit data MII RMII is a kind of interface for 10
10. es Note This core initializes SD as MMC SD1 U I2Cinterface definition Signal i i Signal 12C1_SCL 12C1_SDA Table 3 I2C pin definition SEED DIM3517 Hardware Users Manual Description I2C Inter Integrated Circuit Inter Integrated Circuit generically referred to as two wire interface is a multi master serial single ended computer bus invented by Philips that is used to attach low speed peripherals to a motherboard embedded system or cellphone or other electronics Since the mid 1990s several competitors e g Siemens AG later Infineon Technologies AG NEC Texas Instruments STMicroelectronics formerly SGS Thomson Motorola later Freescale Intersil etc brought I C products on the market which are fully compatible with the NXP formerly Philips semiconductor division I C system As of October 10 2006 no licensing fees are required to implement the I C protocol However fees are still required to obtain I C slave addresses allocated by NXP SMBus defined by Intel in 1995 is a subset of EC that defines the protocols more strictly One purpose of SMBus is to promote robustness and interoperability Accordingly modern I C systems incorporate policies and rules from SMBus sometimes supporting both I C and SMBus with minimal re configuration required FC uses only two bidirectional open drain lines Serial Data Line SDA and Serial Clock SCL pulled up with resistors Typical voltages used are 5 V or 3 3
11. f charge to the customer during warranty period Trademarks SEED is trademark of SEED International TI is trademark of Texas Instruments If You Need Assistance Web http www seeddsp com en Beijing Headquarter Address Unit 1201 Pan Pacific Plaza No 12A South Street Zhongguancun Haidian District Beijing P R China Zip 100081 Tel 86 010 62109765 Fax 86 010 62109678 E mail info seeddsp com To help us Improve Our Documentation If you would like to make suggestions or report errors in documentation please email us Be sure to include the following information that is on the title page the full title of the book the publication data and the literature number Email tech support seeddsp com SEED DIM3517 Hardware Users Manual Contents Read This First Warranty Trademarks If You Need Assistance To help us Improve Our Documentation Chapter 1 1 1 Feature 1 2 Function Introduction Chapter 2 Board components 2 1 AM3517 Processor 2 1 1 AM3517 2 1 2 External Memory 2 2 SEED DIM3517 Perpheral and Interface module 2 3 Power Module Chapter 3 Physical description 3 1 PCB layout 3 2 Connector 3 2 1 J4 emulation interface 3 2 2 J3 DIMM connector interface Appendix Appendix A Board Size Appendix B reference material SEED DIM3517 Hardware Users Manual Chapter 1 Function Introduction This article mainly introduce the feature and system block diagram of SEED DIM351
12. finition Description SDcard Secure Digital Memory Card isanon volatile memory card format developed by the SD Card Association for use in portable devices The SD technology is used by more than 400 brands across dozens of product categories and more than 8 000 models and is considered the de facto industry standard MultiMediaCard MMC is a flash memory memory card standard Unveiled in 1997 by Siemens AG and SanDisk it is based on Toshiba s NAND based flash memory and is therefore much smaller than earlier systems based on Intel NOR based memory such as CompactFlash MMC is about the size of a postage stamp 24 mm x 32 mm x 1 4 mm MMC originally used a 1 bit serial interface but newer versions ofthe specification allow transfers of 4 or 8 bits at a time It has been more or less superseded by SD Secure Digital card but still sees significant use because MMCs can be used in most devices that support SD cards A SDIO Secure Digital Input Output card is a combination of an SD card and an I O device This kind of combination is increasingly found in portable electronics devices Hosts that support SDIO typically PDAs like the Palm Treo but occasionally laptops or mobile phones can use small hosts designed for the SD form factor like GPS receivers Wi Fi or Bluetooth adapters modems Ethernet adapters barcode readers IrDA adapters FM radio tuners TV tuners RFID readers digital cameras or other mass storage media such as hard driv
13. igure 1 SEED DIM3517 front view SEED DIM3517 rear view sou rues e DID 7777777777 l Figure 2 SEED DIM3517 rear view Chapter 3 physical description 3 2 Connector Type i location function button top layer system reset Connector top layer AM3517 JTAG Connector top layer DIMM connector interface Table 1 Connector 3 2 1 J4 emulation interface JTAG emulator interface image Figure 3 JTAG emulation interface J4 pin definition for JTAG emulation interface Table 2 JTAG pin definitions 3 2 2 J3 DIMM connector interface Q USB interface definition SEED DIM3517 Hardware Users Manual Signal i i Signal USBO_DP USBO_ID USBO_DM USBO_DRVBUS GND USBO_VBUS USB1 DM USB1 DP GND GND Table USB pin definitions Description USB USB Universal Serial Bus is an industry standard which defines the cables connectors and protocols used for connection communication and power supply between computers and electronic devices USB was designed to standardize the connection of computer peripherals such as mice keyboards digital cameras printers portable media players disk drives and network adapters to personal computers both to communicate and to supply electric power Up to now there are three technology generations for USB Generation 1 USB 1 0 1 1 Released in January 1996 Specified data rates of 12 Mbit s O Generation 2 USB 2 0 Released in April 2000 Added higher maximum
14. ive high although some notations such as SS or CS instead of nSS or nCS suggest otherwise Note GPIO 176 and MCSPI1_CS2 multiplexing GPIO 174 and MCSPI1_CSO multiplexing SEED DIM3517 Hardware Users Manual Appendix Appendix A Board Size DIM3517 board size DES AppendixB reference material TI website http focus ti com docs prod folders print am3517 html Thanks This document is provided by the Research and Development department we appreciate your comments and suggestions during your reading This document will be updated on the website of SEED International Ltd please check it at regular time www seeddsp com eng
15. tions can be implemented on the hardware without consuming the basic frequency of ARM core Chapter 2 On board components 2 1 2 External Memory SEED DIM3517 external memory 4Gb NAND FLASH and 1Gb X 2 DDR2 NAND FLASH connects GPMC NCSO DDR2 connects SDRC_NCSO 2 2 SEED DIM3517 Peripheral and Interface module SEED DIM3517 CPU board resources RTC JTAG Ethernet PHY and standard DIMM connector All the peripherals connections are expanded through DIMM connector The detailed DIMM connector defined as following Pin Signal Function Signal Pin il 5V 5V 2 3 5V POWER 5V 4 5 5V 5V 6 7 GND GND 8 9 GND GND GND 10 11 GND GND 12 13 VBAT POWER VBAT 14 15 NC RST 16 RESET amp NMI 1y NC GND 18 19 GND GND GND 20 21 USBO_DP RX 22 23 USBO_DM RX 24 25 GND GND 26 27 USB1_DP TX 28 29 USB1_DM USB EMAC TX 30 31 GND GND 32 33 USBO_ID LEDL 34 35 USBO_DRVBUS LEDR 36 37 USBO_VBUS GND 38 39 GND GND GND 40 NC 41 CCDC_PCLK VIDEO IN amp HECC MMC1_D4 42 SEED DIM3517 EFF FH 43 MMC1_D5 CAN_TXD 44 45 CAN_RXD NC 46 47 CCDC_DO CCDC_D1 48 49 CCDC_D2 CCDC_D3 50 51 CCDC
Download Pdf Manuals
Related Search