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1. 23 0 MEM ADDR 31 2 x TX_FAIL G MEM IS WRITE eneric a gt BUS TX_RESP ACK MEM_REQ l Layer Controller MEM_ACK MEM_WR_DATA 31 0 MEM_RD_DATA 31 0 TX_SUCC o k RX_ADDR 31 0 RX_DATA 31 0 RX_REQ g INT N FU ID 3 0 S INT N CMD 63 0 _ External Lf Interruptl Figure 5 MBus block diagram Green blocks Sleep Wire Interrupt are always on and power gate the red domain Bus Controller which power gates the blue domain rest RX_PEND RX_FAIL B MBus Module Design In an MBus system each node has three power domains a minimalist set of always on logics power gate the MBus Controller that in turn power gates the rest of the node Fig 5 shows MBus design integration The Layer Controller can be replaced with any node specific interface layer C MBus Protocol Design The MBus protocol provides event driven automatic power management in line arbitration and a robust bus interrupt MBus Wakeup In standby mode all MBus components except the frontend are power gated In this state our system PMU 7 is in its lowest power mode supplying a maximum of only 10 s of nW total to minimize standby power The PMU must switch to a high power mode Fig 6 before the MBus power gates are released and a full message can be transmitted To transmit a wakeup request without exceeding the PMU supply current Dy Dour are left in a high state in standby mode Wakeup is
2. JO pad count n node 3 2n 4 4 2n is required to support slave interrupts and feature parity with MBus CONCLUSION Today s emerging sensing platform needs a bus interconnect that addresses area and energy constraints rather than focusing on increasing performance or bandwidth We present MBus a new serial interconnect that addresses inter chip communication requirements for next generation of ultra low power millimeter scale wireless sensor nodes We present a complete miullimeter scale modular system composed of sensors a processor and a radio connected with MBus MBus offers a low standby power 8 nW low energy communication as low as 17 55 pJ bit chip low wire count four wires per node is fully synthesizable and supports multi master operation all with robust timing These features open the door to modular pervasive computing systems ACKNOWLEDGEMENTS This work was supported by STARnet a Semiconductor Research Corporation program sponsored by MARCO and DARPA an NDSEG Graduate Fellowship NSF Grants 0964120 1111541 and 1350967 and ARM Intel and Texas Instruments The authors acknowledge CubeWorks Inc for system level testing and integration REFERENCES 1 B Warneke B Atwood and K Pister forerunners in MEMS 2001 pp 357 360 2 G Chen et al Millimeter Scale Nearly Perpetual Sensor System with Stacked Battery and Solar Cells in ISSCC 2010 3 T Nakagawa et
3. al l cc computer using UWB IR for wireless sensor network in ASPDAC 2008 pp 392 397 4 D Gonzales SPI bus eases multiple MCU hook up Design News pp 89 95 May 1984 5 NXP I C bus specification and user manual Oct 2012 6 Y Lee et al A Modular 1mm Die Stacked Sensing Platform with Optical Communication and Multi Modal Energy Harvesting in ISSCC 2012 7 G Kim et al A Muiullimeter Scale Wireless Imaging System with Continuous Motion Detection and Energy Harvesting Symp on VLSI Circuits 2014 Smart dust mote
4. being addressed Hence if a node is not receiving a message it directly forwards Di CLKw to Dout CLKour and any internal flip flops used to store process incoming data do not toggle reducing power consumption by 23 Robust timing In a modular system the loading and driving strength of different Dour CLKour drivers is unpredictable creating uncertainty in the relative arrival time of Din CLK in This requires insertion of a large number of hold time buffers which would increase power and lower performance Instead we separate driving and latching edges to balance setup and hold time margins Fig 4 Dw is sampled on positive CLKin edge and Dour is driven on negative CLKw edge While this also reduces maximum performance it ensures that hold time scales with frequency ensuring robust operation via sufficient frequency scaling CLK CLK out out Dout Dout thoi A 7 teetup thoid a ime teetup e SetUPmargin n SetUPmargi holda mag n hold margin Pmarg n Figure 4 Setup hold time diagram Conventional positive edge trigger left and MBus clocking right POWER ON I50 j RELEASE CLK _ H gt RELEASE RST H RELEASE ISO H9 RELEASE ISO IS RELEASE ISO __ RELEASE CLK RELEASE RST i Clock Generator LAYER CLOCK REG WR_DATA 23 0 REG WR URES POWER_ON POWER ON TX_ADDR 7 0 TX_DATA 31 0 TX REQ TX_PRIORITY TX_ACK REG RD DATA O 255
5. then initiated by a node pulling Dour low which consumes negligible power This falling edge is propagated along the daisy chain till it is detected by the mediator which switches the PMU to high power mode After the PMU completes the state transition the mediator starts to propagate clock edges through the daisy chain The first four edges are used by the regular nodes to sequentially Bus Clk D o t uaa nae rt Data In Data Out ins Arbitration b c D ATAyy 1 gt uest Loses Arbitration b c DATAyy 0 gt Data In Data Out Does Not Forward Med 22 iJ iBegin Forwarding S F i ae 0 lt Mediator Wakeup 1 2 3 4 Figure 8 Arbitration and data timing Shoot through delay is exaggerated i Data In T i Forward I eer e mee w eee c eee occ wccce sce c cc cccccoccccocccccs t Mbus Control t t State transitions in Mediator node CLKour idle Din PMU mode Active PMU Low Power PMU mete Y send clock Requestin Wait for Figure 6 Wake up request with DATA pull down allows PMU mode switch without significant power consumption e axe ee Bus Ctl gt Layer Ctl G Xt x x ob eon eX oreo x T Sleep Ctl Bus Ctl ME Je ser 02 yer 02 00 r e R R R R RRA ock i lata Req Bus Resume Forwarding 7s 0 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 2 Mediator Wakeup Arbit
6. Figure 1 1cc computer 3 left and a 2 2x1 1x0 8 mm stacked miniature wireless sensor node 6 right To address the unique constraints of millimeter scale sensor nodes we propose a new chip to chip bus interconnect referred to as MBus that is as conservative with resources as the modules it connects MBus nodes are arranged in a ring topology support multi master communication and use highly robust fully synthesizable signaling MBus uses only 4 IO pads provides predictable latency and features a novel robust reset mechanism To address the extreme low power constraints member nodes in MBus are clockless Also all but 53 gates are power gated in standby mode while still enabling any node to wake up the entire system and switch the Power Management Unit PMU to active power mode We present silicon measurements of a 3 layer sensor system implemented in 180 nm technology and achieve gt 10Mb s data rate with 17 55 pJ bit chip and 8 nW standby power SYSTEM INTERCONNECT DESIGN REQUIREMENTS In this section we introduce the key design requirements for supporting ultra space constrained systems and why this poses a unique challenge requiring a new bus interface Low fixed wire count per node The target systems are highly space constrained and even state of the art wire bonding techniques require at least 35 65 um pad When accounting for several power supply voltages and a few module specific IOs only a handful of pads rem
7. MBus A 17 5 pJ bit chip Portable Interconnect Bus for Millimeter Scale Sensor Systems with 8 nW Standby Power Ye sheng Kuo Pat Pannuto Gyouho Kim Zhiyoong Foo Inhee Lee Ben Kempke Prabal Dutta David Blaauw and Yoonmyung Lee University of Michigan Ann Arbor MI USA Abstract We propose an ultra low power interconnect bus for millimeter scale wireless sensor nodes Using only 4 IO pads the bus minimizes the required chip real estate enabling ultra small form factors in modular sensor node designs Low power is achieved using a clockless design of member nodes while aggressive power gating allows an ultra low power standby mode with only 53 gates powered on An integrated wakeup scheme is compatible with PMUs that have a special low power standby mode The MBus is fully synthesizable and uses robust timing Implemented in a 3 module system in 180nm technology Mbus achieves 8nW of standby power and 17 5 pJ bit chip Index Terms Wireless sensor nodes sensor systems data buses interconnections INTRODUCTION Continued advances in ultra low power circuit techniques have steadily moved the next generation of computer systems towards the vision of smart dust a miniature integrated sensing computing storage and communication platform 1 These systems are highly optimized in volume and power draw targeting a mm form factor and running on single digit uW in active mode and nW in standby mode 2 Early e
8. ain for the bus interface in a 1 mm form factor This makes the use of serial buses such as SPI 4 difficult since they require a dedicated chip select line for each component in the system Hence the maximum number of components needs to be anticipated ahead of time often resulting in over provisioning and a large total pad area For instance in a moderate 10 node system the SPI controller would require at least 14 bus pads which is impossible to realize in a millimeter scale system Low active power A viable interface cannot dominate the uW power budget of millimeter sensors This eliminates any pad efficient open drain based designs that allow bi gt Previous MBus node Activity Detector Mediator Self Start Fig 6 ET i ez Generator Cu TIS Figure 2 MBus topology Each node has Dour Dy CLKour and CLKyy and they form a ring directional wires due to high active power For instance PC 5 requires only 4 pads per module but uses a kQ range pull up resistor resulting in 100 s of uW of power draw which is 100x the typical power budget of a millimeter scale sensor node Standby power management In standby mode power consumption must be reduced to the nW range to enable long lifetimes with millimeter batteries and perpetual operation with harvesting This requires aggressive power gating and a PMU that can switch to an ultra low nW power mode To avoid additional wires for communicating wakeup e
9. fforts 1 3 to realize such systems have resulted in monolithic and tightly integrated designs with little capability for reuse This design approach is in contrast to the modularity that has characterized embedded systems design and enabled it to address a highly diverse application space The miniature sensor node application space is similarly diverse ranging from implantable medical monitors to nearly invisible surveillance to infrastructure monitoring Hence a modular design approach that enables extensive reuse of chip modules is key to fully address its application space A critical component in a modular platform is the bus through which the different modules communicate with each other However existing bus standards do not address the unique constraints of millimeter scale sensor systems We will show that the number of wires required in SPI 4 make it difficult to meet the millimeter size constraint while the power consumption of I C 5 is orders of magnitude higher than the allowed power budget Recently a low power variant of I 7C 6 was proposed for a modular millimeter sensor node shown in Fig 1 right The system consists of several stacked chip layers each performing a key function e g processor memory sensor interface radio etc However the proposed bus requires careful matching of timing between nodes reducing robustness as well as requiring custom design limiting portability Bent motherboard iam YA
10. lock One node must be a MBus mediator module The mediator is responsible for generating the bus clock and mediating arbitration While the bus is idle regular nodes forward both DATA and CLK The mediator breaks the loop by fixing both CLKour and Dour Mediator Controller N Next MBus node Controller a ed E _ lt _ MBus Interrupt E Bus Controller Detector External Interrupt Controller External Interrupt Figure 3 MBus ecosystem The red shaded areas are power gated domains which are the core of MBus The rest of the components are always powered on and optimized for low leakage to reduce standby power Only one node has a mediator block high in idle standby mode To provide a robust reliable in band data independent reset MBus nodes feature a separate Interrupt Detector block that identifies an MBus Interrupt At least three edges on DATA with no CLK edges Fig 3 shows the functional diagram of a single MBus node A Circuit Design Low active power Only the MBus mediator node has a clock while all regular MBus node are clock less Flip flops in MBus nodes are purely triggered by CLKw Hence if the MBus is idle regular nodes draw only static leakage power This is key since addition of a simple clock generator to each regular node will quickly dominate total power consumption Second only a small address detector is permanently clocked by CLKw and observes the Dm signal to determine if the node is
11. nted MBus based sensor system with control processor temperature sensor and wireless radio and individual layer die micrograph TABLE 2 AREA ULTILIZATION OF MBUS Technology CMOS 180 nm Sequential cells 227 Combinational cells 2 900 37 200 We compare MBus with the two most widely adopted inter chip communication protocols I C 5 and SPI 4 Consider a traditional I C configuration running under 1 2 V supply at 400 kHz with 10 kQ pull up resistors The pull up resistor consumes at minimum 1 8 nJ for every 0 bit sent Although the resistor could be sized to mitigate energy consumption it increases the RC time constant and reduces bus speed The low power C variant demonstrated in 6 achieved a two order of magnitude improvement 88 pJ bit Area 1m for 3 layers but required custom ratio logic MBus however provides additional energy savings 67 7 pJ bit for 3 layers with no custom logic required SPI has little to no protocol overhead and is all single ended connections yielding low power performance However SPI is centralized requiring all slave to slave transactions go through a central control a 2x energy cost SPI requires a dedicated I O line to each slave limiting scalability of the master node SPI provides no in band slave interrupt mechanism requiring additional I O to support interrupts TABLE 3 COMPARISON OF MBUS AND OTHER SERIAL PROTOCOLS po CCS sS SP 4 PC 5 MBus
12. ration Figure 7 Event driven wakeup timing External events generate a glitch to initiate a null transaction for wakeup General Error Mediator Initiated Interjection Control Idle release power gates clock isolation gates and reset at which point the member node MBus logic is fully active Fig 7 MBus Arbitration Arbitration requires only one CLK edge to resolve the bus owner Fig 8 shows an example nodes 1 and 3 request the bus by pulling Dour low node 2 simply forwards while the mediator holds Dour high node 1 initially wins To ensure stable resolution nodes can only pull Dour low if CLKx is high At the first rising edge of CLK each node samples its Dw If a node requested the bus and Dw High it wins the arbitration As an in line protocol MBus arbitration requires no additional I O or area cost Since MBus arbitration priority is topologically dependent we add an additional arbitration cycle for high priority messages Interrupt MBus requires a robust data independent in band means to end a transaction The interrupt of MBus is based on a key insight that DATA can never meaningfully transition faster than CLK Hence the MBus interrupt is defined as three or more rising edges on DATA without corresponding CLK edges We require three edges so that an erroneous glitch on DATA is insufficient to cause a false interrupt signal Interrupt detection is performed by three flip flops connected in series with D por
13. t tied high The reset ports of first two flops are connected to CLK and clock port of all flops are connected to Dw It is essentially a counter incremented by Dw and reset by CLK Fig 9 shows our interrupt detector and an interrupt waveform Interrupt Detector e Interrupt Remains High nen Figure 9 Interrupt timing and detector MEASUREMENTS AND RESULTS We implement MBus in six chips three shown in Fig 10 in three different technologies and two FPGA fabrics and find that all interoperate without error and no need for tuning MBus can achieve higher than 10 Mb s communication performance limited by test configuration We measure energy consumption of MBus when sending receiving and forwarding messages at 617kHz 180nm The MBus mediator and local layer controller consume 27 45 pJ bit when sending messages MBus consumes 22 71 pJ bit when a member node is receiving messages and 17 55 pJ bit when forwarding messages MBus achieves 22 7 energy saving from minimizing flop switching We can only measure the total standby power of the entire stack processor radio and temperature sensor In standby the system draws 8 nW a value that is mainly dominated by other components TABLE 1 ENERGY CONSUMPTION OF MBUS Energy per bit pJ bit 27 45 22 S Mediator sending Member receiving Member forwarding ARM Coher SKB SRAM MO Core RF Transmitter 1670 um 1820 um Figure 10 Photo of impleme
14. vents the bus interface must support a wakeup request originating from any node This poses two challenges 1 The logic that monitors transmits such an event must be minimized since it remains always active and directly contributes to the standby power 2 When the wakeup request is transmitted in the bus the PMU is still in standby mode meaning that active current draw used for this transmission cannot exceed the nA range Fully synthesizable Use of custom designed components significantly increases time and effort to migrate between technologies and impedes adoption For example the I C variant in 6 used custom drivers ratioed logic and delay chains that require post silicon tuning A synthesizable bus interface not only allows fast design by dropping in fully verified Verilog it also ensures robust timing which is automatically checked by tools However disallowing more complex circuit structures increases the challenges to meet the low wire count and power draw requirements Systems Constraints Finally to be a viable system bus MBus must provide multi master operation a robust reset mechanism and data and device independent behavior DESIGN amp IMPLEMENTATION Each MBus node has four signals Dour Din CLKour and CLKw MBus nodes are arranged in ring topology as shown in Fig 2 connecting Dour CLKour to the next node s Diw CLKiw and eventually looping back Signals shoot through and nodes have no local c

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