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Insight SiP BLE Catalog

1. June 1 2015 Page 5 25 Document Ref isp_ble_Catalog_R2 3 docx z Mina Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i 9 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice ra ae L Ds Qo a ey hia Lael Mer A gee N z ens gt i gt ian J A N D O gt BD 5 4 Aaw yp O aT TA gt gt i ae Be TE fo A N i E kt g CER N r y an k AO A d A t _ ft Ele a meklCUD n ews I m a gt F 4 g TA i f It s all in the package T i g 3 a i i a el Se Se Go See 13 Click Back and LED A prompt will invite you to pair the Sensors Board with the iPhone Click Pair The LED lights up Bluetooth Pairing Request InsightSIP_ lt would like to pair with your iPhone 14 To switch off ISP131001 Sensors Board disconnect battery holder as seen in the figure below C AL June 1 2015 Page 5 26 Document Ref isp_ble_Catalog_R2 3 docx amp Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 The information contained in this document is the property of Insight S
2. Recommended PCB Land Pattern and Solder Mask layout Complete information is available on request gS J 1875 mm T v 3 marrir A Fd P m e r b ae m b ee 0 45 ems re a S 7 5 Jg r na gt b O 5 1 JP e i bal a 4 so Ss amp u Oost a i i j June 1 2015 Page 3 11 Document Ref isp_ble_Catalog_R2 3 docx p az Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fs without written permission Specification subject to change without notice June 1 2015 Insight SiP BLE MODULE It s all in the package ISP 41 30301 Antenna Keep Out Zone Recommended metal keep out areas for optimal antenna performance no metal no traces and no components on any layer except mechanical LGA pads 18 0 mm min Metal sad G3 YY zone to eage of board no metal on any A layer except mechanical LGA pads TTILLLLE El F board E E wu GGL6 GS TOP VIEW Page 3 12 ble_ i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party with
3. Driver Provider NORDICSEMI Driver Date 3 18 2011 Driver Yersion 2 6 14 0 hE eh F Digital Signer Not digitally signed Driver Details To view details about the driver files Update Driver To update the driver for this device Bes Casta iis If the device fails after updating the driver roll back to the previously installed driver Uninstall To uninstall the driver Advanced ee a i June 1 2015 Page 16 3 Document Ref isp ble Catalog R2 3 docx a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com rei without written permission Specification subject to change without notice Insisht SP APPLICATION NOTE SSA a4 ISP120901 It s all in the package Connect Battery to ISP120901 Accelerometer as shown below Battery CR1632 POS Terminal UP Battery CR1632 Fully Installed Run Software Navigate to the Accelero Demo_EXE folder C users BTLE Sensors Sele File and Folder Tasks gt Make a new Folder a Publish this Folder to the Web E3 Share this folder Other Places BILE O My Documents i Shared Documents i My Computer J My Network Places Details Sensors File Folder Name Y accelero _pile_photos zip El xnafx40_redist msi Snrf8001_sdk_v1_7_install exe fA dotNetFx40_Full_setup exe YS accelero_Demo_EXE zip 4 4N130402R0 docx 130402R0 docx
4. Accelero_Demo_EXE File Folder Date Modified Today April 16 2013 4 21 PM 18 objects Content File Folder 11 9 MB 4 16 2013 4 21 PM p My Computer Two screens should open ro pa EP w4 Accelero X Proximity Accelero Demo Device name Proximity Accelero App Immediate alert level Off Low High Link loss level gt Off Low High Set InteryalMs TimeoutMs Latency 7 5 4000 ms 0 500 Range g_X g_Y g_Z mh la Rot_X Rot_Y Rot Z mi i Accelero r Desktop zip Internet status I FE Explorer Starting up J ra P June 1 2015 Page 16 5 Document Ref isp_ble_ Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice m Insight SiP APPLICATION NOTE It s all in the package i S P 14 209 O 14 On the Right hand screen click on Open a Proximity Accelero Demo Sele Proximity Accelero App gt OOGZ WON Open Immediate alert level Off Low High Set Link loss level Off Low High set IntervalMs TimeoutMs Latency 6000 ee 7 5 4000 ms S000 32000 ms 0 500 Range g x gr g_4 ee Rot Y Rot Z Petfom device discovery fs Connect Starting up Con
5. France www insightsip com ie eg a i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party i Lee without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package AN 4 30501 Temperature sensor node Connection Phase 1 Phase 2 Average Total Autonomy Interval ms uC uC Consumption uC year Table11 Temperature sensor node measurements results 3 2 Light sensor node Table 12 presents total current consumption measurements of the light sensor node which integrates BLE module designed by Insight SiP LPC1114FHI33 3802 microprocessor and light sensing device APDS 9300 The battery used in this sensor node is 3V coin cell battery CR1632 Measurement specifications for different measurement times Connection Intervals are described in Table 12 Light sensor node Connection Phase 1 Phase 2 Average Total Autonomy Interval ms uC uC Consumption uC year Table 12 Light sensor node measurements results 3 3 Orientation Motion sensor node Table 13 presents total current consumption measurements of the orientation motion sensor node which integrates BLE module designed by Insight SiP LPC1114FHI33 302 microprocessor and orientation motion sensing device MMA7660FC The battery used in this sensor node is 3V coin cell battery CR1632 Measurement specifications for different m
6. 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ra e i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party 5 gt F without written permission Specification subject to change without notice rec Insight SP APPLICATION NOTE It s all in the package i S P 4 303 O 4 Master Control Panel File Help Master emulator COME 480103054 se 450705054 connected Device info Device address DSZBDS5C26824 Bonded True Actions Service discovery Bond Disconnect Disable services Service Discovery 5 Primarys ervice Generic Attribute 0x1 801 ae CharacteristicD eclaration Properties Indicate Characteristic UUID 02405 ServiceChanged No values read ClentCharactensticConfiguration CharactensticConfigurationBits Indication 0002 5 Primarys ervice TxPower 027804 CharacteristicDeclaration Properties Read Characteristic UUID Ox2407 TaPowerLevel Value F8 a Primary ervice Immediate Alert 011802 Characteristic Declaration Properties WritewithoutAesponse Characteristic UUID 02406 AlertLevel No values read I Primary ermvice Link Loss 0 1803 CharacteristicDeclaration Properties Read Write Characteristic UUID Ox2406 AlertLevel Value 00 g FrimanSerice BatterpSerice 0180F CharacteristicD eclaration Properties Read Notify Characteristic UUID 04
7. Ramp up rate Tx to Tp Ramp down rate Tp to TL 6 Cisec max 6 Cisec max max Peak package body temperature Tp Liquidous temperature TL 217 C Time tL maintained above TL 60 150 sec MSE E O Peaklam porate nme June 1 2015 Page 3 15 Document Ref isp_ble_Catalog_R2 3 docx amp Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com pE The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Fs without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 1 303071 7 Quality amp User information Certifications FCC Identifier 2AAQS ISP130301 Certificate N 142180643 AA 00 CE Complies with 1999 5 EC EN300328 V1 8 1 Statement N 142140199 AA 00 IC Certification N 11306A ISP130301 Telefication N 142170180 AA 00 TELEC certification N 001 A03467 Bluetooth SIG certified N D024444 ROHS compliant USA User information This intends to inform how to specify the FCC ID of our module ISP130301 on the product Based on the Public Notice from FCC the host device should have a label which indicates that it contains our module The label should use wording such as Contains FCC ID 2AAQS ISP130301 Any similar wording that expresses the same meaning may be used Th
8. It s ai in Vee Ty PRODUCT CATALOG Bluetooth Smart Modules Revision 2 3 June 2015 sight Sip INTRODUCTION HOME lt lt INTRODUCTION QUALITY COMENS ane ee nee eee eee ne renee een eee ee eee ee eee eee eee eee eee Page 1 2 MISSION Statement oe soccer chet eee eee eee E A O ere uieres Page 1 3 Company Profile ee ae ee e aa Page 1 4 Certifications aa a eee ee Page 2 1 Product Discontinuity amp Disclaimer cccccccceccceeeeeeeeneeeseeeeaeeeneeeeaes Sales Offices amp Contacts 0 0 cece cccccccccccceccccccacacccececcacacacsceseueauanaees SMART MODULES ISP130301 Fully Integrated BLE Module aeaee ae e a Page 3 1 Development kit for ISP130301 ce ceeeeeceeeeseeeeeneees Page 4 1 Application note for ISP130301 DK1 eeceeeeeeeeeeeees Page 5 1 ISP130301ANT Dual ANT BLE Module with Integrated Antenna Page 6 1 ISP091201 External MCU BLE Module with Integrated Antenna Page 7 1 Development kit for ISPO91201 0 eceeeseeeeneneeeeneneeees Page 8 1 Application note for ISPO91201 DRK I aaa iain SMART BEACONS ISP140501 BLE Beacon Detection enea seer r ee e E a E Page 10 1 Development kit for ISP140501 00 ceeeeeeeeeeeeeneaees Page 11 1 Application note for ISP140501 DK1 cceeeeeeeeeeeee SMART SENSORS ISP131001 BLE Accelero Temp and Barometer Detection Sensor
9. Page 13 1 Application note ton Siz S100 cect carer a earners Page 14 1 ISP120901 BLE Orientation Motion Detection Sensot 006 Page 15 1 Applicalon note TOR ISP V2O OO reer eee eee ree eeeeereee ee Page 16 1 ISP120909 BLE Temperature Detection Sensor cccsceeeeeeeeeeees Page 17 1 Temperature Sensor Demonstration ccccssseeeseeeees Page 18 1 ISP120911 BEE Light Detection Sensor sume merc a usencar tect Page 19 1 Light Sensor Demonstration esineen eenn Page 20 1 AN130501 Application note Power optimization BLE sensors DESIGN SERVICE BLE Custom Design June 1 2015 Page 1 2 Document Ref isp_ble_Catalog_R2 3 docx ri T Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com r E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party of without written permission Specification subject to change without notice Lr p Insight SiP INTRODUCTION It s all in the package MISSION STATEMENT The increased demand for wireless connectivity in portable electronic devices has driven manufacturers to deliver ever smaller more cost effective solutions This makes the integration of RF into a single product more and more complex and increases technical risk while in the mean time the product development cycle has to be reduced At Insight
10. Stop discovery Discovered devices InsightSIP_COO010 0x06 9F51144D 7E 4dBm Select device Delete bond info Log 17 26 19 6 Loading 07 26 20 1 Device address OxF 1FACDFF6S48 07 26 20 1 Master emulator firmware version metw nrt 822_0 9 0 1 0022 7 26 23 0 Ready 7 26 23 2 SERVER Server has started 17 26 25 7 Device discovery started ee a Fo ae oe June 1 2015 Page 5 20 Document Ref isp_ble_ Catalog _R2 3 docx 7 Fi E Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com y The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice ae 4 Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 6 Click Select Device 7 On the following display click successively on Bond Service Discovery and Enable Services Master Control Panel Master Control Panel Master emulator Master emulator COME 480103054 480103054 connected COM6 480103054 480103054 connected Device info Device info Device address DESF51144D7E Bonded True Device address DESF51144D7E Bonded True Actions Actions Service Discovery Service Discovery PrimaryService Generic Access 021800 E PrimaryService Generic Access 01800
11. TX carrier wave output RX constant carrier LO leakage TXIRX channel sweep nRF51822 aa CEAADAO 0x0047 uetoo adie Configuration Region 1 Program SoftDevice Program Application Program Bootloader Dispatcher Trace Translator Programming of SoftDevice on nRF51 device Direct Test Mode nRFsoo2 i Size 176 kB File to program 51822_6 0 0_softdevice hex C Lock SoftDevice From readback SoftDevice size kB s0 Addr Ox14000 Device Manager Motherboards Region 0 nRFS1 development dongles Size 80 kB Segger 480103054 nRF51 Programming FW nRF51 Bootloader nRF24LU14 Bootloaders 110_nRF51822_6 0 0 0x0049 Log c Nordic Semiconductor 454 2008 2013 Erase completed Softdevice D Pascal projets Nordic Semi documentation nRFS1822 nRF51822 DK s110 nrf51822 6 0 0 s110 nrf51822 6 0 0 softdevice hex programmed successfully June 1 2015 Page 5 10 Document Ref isp_ble_Catalog_R2 3 docx sats Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com TE i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f aati without written permission Specification subject to change without notice og Insight SiP APPLICATION NOTE It s all in the package ISP 41 30301 Proximity Application loading
12. The information contained in this document is the property of Insight SiP and should not be disclosed to any third party tare ee without written permission Specification subject to change without notice ona Insight SiP APPLICATION NOTE It s all in the package i S P 4 209 O 4 Accelerometer_x should appear If this fails reset accelerometer to put into advertising mode and perform device discovery again Press on Connect ES Proximity Accelero Demo OU6ZWXON m Open Proximity Accelero App Accelerometer Immediate alert level Off Low High Set Link loss level Off Low High Set InteryalMs aT Latency 5 4000 ms zs 32000 ms Git Range g_ x g_Y g_4 me Eee Accelero Rot_X Rot_Y Rot_7 nn ln a Setup add char def 0x2406 Setup assigned pipenumber 4 type TRANSMIT WITH_ACE Setup add service 021802 store LOCAL STORE Setup add char def 0 2406 Setup assigned pipenumber 5 type RECEMWE Run Device discovery Device discovery Connected O a ae r m June 1 2015 Page 16 8 Document Ref isp_ble_Catalog_R2 3 docx jm Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ae ah t The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ea as without written permission Specification subject to change without notice ees Insight SiP APPLICATI
13. Yj LGA pads Vda board ww GZl6 S TOP VIEW Package marking ISP130301 Product number ANT Two digit year number Two digit week number Insight SiP Model ISP130301C YYWW ANT R 001 A03467 5 mm max for IC 11306A ISP130301 FCC ID 2AAQS ISP130301 laser marking KE IC C 0560 m June 1 2015 Page 6 12 Document Ref isp_ble_Catalog_R2 3 docx fe Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com set an srci hy The information contained in this document is the property of Insight SiP and should not be disclosed to any third party pe di i without written permission Specification subject to change without notice mLAN ae Insight Si SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT 5 Storage amp Soldering information Moisture Sensitivity All plastic packages absorb moisture During typical solder reflow operations when SMDs are mounted onto a PCB the entire PCB and device population are exposed to a rapid change in ambient temperature Any absorbed moisture is quickly turned into superheated steam This sudden change in vapor pressure can cause the package to swell If the pressure exerted exceeds the flexural strength of the plastic mold compound then it is possible to crack the package Even if the package does not crack interfacial delamination can occur Since the device package is sensiti
14. foci zSGN9 g do GBM 1353 U Now wuOy 00L H mut ss 9E0N9 gt 1102048 3809 sequin peg a Ga dd 0l 9 _ s9 1 40z09 OdT DOA LOND 09 GND SLOND ON9 ELONS 09 GND 109 GND OND ONS 1a zeg yo 3n 0l 29 an 0l 9 i o Wo 8 s0809 8 0809 day DOA YOSNES IDA WYO 6 H LiH iL LOz0OY WUO G E Y rn ziy ZLLANL iozoy 8 SPOND 09 GND E ZMS TALOLAN aw w i ozo F 90N9 dol OND aNd e ms RER a Lono doy ON doy oN amp OND OND rode doors 1 Zoro ano ano 08799A Pee GNO JUNOW ION OG D 4 w409 666 4 140209 _ I8 1 10z0u ozo HU St 9 alist on 1 10207 MEOD EQUNN Weg HN O1 1 a f 170907 sk 1sO ON NOJ iz ALOZL6OdSI osn N tono OSI aNd 4 cz fa g0N9 YY dor ONS dol GNSOND EZ gow LNO E NAG Fe 13s t ON eee OED PION OCON Gory AEON PEN ao UONIBULOD LYYN APON IS dl GND ww yujod isa ef0N9 doy QN di bdl wtwg zuiod jsey wu yuiod yea axl Ox Page 17 3 Document Ref isp_ble_Catalog_R2 3 docx June 1 2015 without written permission Specification subject to change without notice Insight SiP BLE SENSOR It s all in the package ISP 41 20909 2 RF Performances RF Specifications according to standards The performance of the Bluetooth Low Energy Radio link is that obtained by the ISP091201 module Temperature range 40 C to 85 C BT V4 n Parameter Value Std limit Unit Condition Output Power 09 20 to 10 d
15. year year 1000 0 25 2000 0 44 3000 4000 9272 8904 069 0 72 Table 19 Orientation Motion sensor node Model measurements comparison From these three tables we can find that the calculating model of current consumption is quite reliable and provides good estimations of consumption and autonomy close enough to the real operation case in the range of measurement time Connection Interval 7 5 ms to 4000 ms announced in the specifications of temperature light and orientation motion sensor nodes cf Table 1 Or June 1 2015 Page 21 29 Document Ref isp_ble_ Catalog R2 3 docx a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com at The information contained in this document is the property of Insight SiP and should not be disclosed to any third party eae without written permission Specification subject to change without notice m E a eS sight SiP Insight SiP APPLICATION NOTE It s all in the package AN 4 305041 ee a June 1 2015 Page 21 30 Document Ref isp ble Catalog R2 3 docx ne m Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com nsight SiP The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Speci
16. 0 7 26 20 1 Master emulator firmware version metw nfole2e 0 9 0 10022 1 7 26 23 0 Ready 17 26 23 2 SERVER Server has started 17 26 25 7 Device discovery started fel Insight SP APPLICATION NOTE It s all in the package ISP 41 31 O01 6 Click Select Device 7 On the following display click successively on Bond Service Discovery and Enable Services Master Control Panel Master Control Panel Master emulator Master emulator COME 480103054 480103054 connected COM6 480103054 480103054 connected Device info Device info Device address DESF51144D7E Bonded True Device address DESF51144D7E Bonded True Actions Actions Service Discovery Service Discovery PrimaryService Generic Access 021800 E PrimaryService Generic Access 01800 CharacteristicD eclaration Properties Read Write Characteristic UUID 0 2400 CharacteristicD eclaration Properties Read Write Characteristic UUID 0 2400 DeviceName DeviceN ame InsightSIP_CO010 DeviceName DeviceName InsightSIP_CO010 CharacteristicDeclaration Properties Read Characteristic UUID 042401 CharacteristicDeclaration Properties Read Characteristic UUID 0 2401 Appearance Appearance 1234 Appearance Appearance 1234 CharacteristicDeclaration Properties Read Characteristic UUID 02404 S CharacteristicDeclaration Properties Read Characteristic UUID 0 2404 SlavePreferredConnectionParameters MinConninterval 0400
17. 1 Start Keil uVision 2 Select Project then Open Project in order to open ble_app_proximity Make sure it is the right file project Ex C Keil_v5 ARM Device Nordic nrf51822 Board nrf6310 s110 ble_app_proximity arm Z D Nordic Semiconductor nRF51 SDK_v5 0 0 34603 Nordic nrf51 822 Board nrf6310 ble ble_app_proximity arm ble_app_proximity uvproj pVision4 Sele File Edit View Project Flash Debug Peripherals Tools SVCS Window Help lee a Bel C P RRR FEE a definer Pnu g a w Q 00 H X i Ey e l g nr51822 waa s110 2567 X B amp B e e Project Ea ATE E nrf51822_xxaa_s110 256K lt q Startup Code Copyright c 2012 Nordic Semiconductor All Rights Reserved 2 arm_startup_nrf51 s The information contained herein is property of Nordic Semiconductor ASA E system_nrf51 c Terms and conditions of usage are described in detail in NORDIC lt q Source Code SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT H Services Licensees are granted free non transferable use of the information NO H 8 Libraries WARRANTY of ANY KIND is provided This heading must NOT be removed from the file file defgroup ble sdk_app proximity main main c Bi A ingroup ble sdk_app proximity brief Proximity Sample Application main file This file contains is the source code for a sample proximity application using the Immediate Alert Link Loss and Tx Power services This application would ac
18. 18 40 78 5 Loading 18 40 19 1 Device address OxF 1FACDFF 6348 08 40 19 1 Master emulator firmware version metw raffles 0 9 0 10022 18 40 22 0 Ready 18 40 22 2 SERVER Server has started 18 40 23 2 Device discovery started es a June 1 2015 Page 5 13 Document Ref isp_ble_Catalog_R2 3 docx Fah Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com si The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Bor rah without written permission Specification subject to change without notice ol fake 4 Insight SP APPLICATION NOTE It s all in the package i S P 4 303 O 4 4 After starting discovery if no device appearing disconnect and connect again the interface board power supply 5 If you have an error message as indicated in the photo lt means that the nRF51822 Development Dongle PCA10000 is not programmed For your information please refer to the nRF51822 Development Kit User Guide document as indicated in our application note 1SP130301 DK1 part 4 5 on page 14 7 You can find this user guide on the Nordicsemi website The procedure to program the dongle PCA10000 is described on page 13 enclose a copy of the user guide for your convenience 1 Open the Master Control Panel from the Start menu Start gt All Programs gt Nordic Semiconductor gt M
19. 3 ProximityDemo vshost exe manifest 1ko Fichier MANIFEST Proximity Temp Lumino S pylibs al 1 425 Ko Application Extens Demo exe 35 Seqger dll 12 Ko Application Extens opeNcadon a Signalyzer dll 31ko Application Extens DAL de modifie ariami April 16 Ulpbt dl 200 Ko Application Extens 2015 11 01 AM Taille 232 Ko 25 UlpbeLtils dl 26 Ko Application Extens el Autres emplacements m E d CACAI v lt gt Description ProximityDemo Soci t Nordic Semiconductor 454 Version du fichier 1 0 0 0 Date de cr ation 04 232 Ko F My Computer June 1 2015 Page 20 5 Document Ref isp_ble_Catalog_R2 3 docx 28ers Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 1 20907 1 One screen should open On this screen click on Open E a Proximity Temp Lumino Demo A m Ed ee Proximity App Immediate alert level Off Low High Set Link loss level OTT Low High Set InteryalMs TimeoutMs Latency a 6 4000 ms S000 32000 ms DES Luminosity Ferfom device discovery Connect Starting up Connected Reset Luminosity Sensor with small
20. CharacteristicD eclaration Properties Read Write Characteristic UUID 0 2400 CharacteristicD eclaration Properties Read Write Characteristic UUID 0 2400 DeviceName DeviceN ame InsightSIP_CO010 DeviceName DeviceName InsightSIP_CO010 CharacteristicDeclaration Properties Read Characteristic UUID 042401 CharacteristicDeclaration Properties Read Characteristic UUID 0 2401 Appearance Appearance 1234 Appearance Appearance 1234 CharacteristicDeclaration Properties Read Characteristic UUID 02404 S CharacteristicDeclaration Properties Read Characteristic UUID 0 2404 SlavePreferredConnectionParameters MinConninterval 040008 MaxConninterval 0x0104 SlaveLatency 0x0C SlavePreferredConnectionParameters MinConninterval 040008 MaxConnInterval 020104 SlaveLatency 0x0C PrimaryService Generic Attribute 0 1801 PrimaryService Generic Attribute 01801 CharacteristicDeclaration Properties Indicate Characteristic UUID 022405 CharacteristicDeclaration Properties Indicate Characteristic UUID 042405 ServiceChanged No values read ServiceChanged No values read ClientCharacteristicConfiguration CharacteristicConfigurationBits Indication 0002 ClientCharacteristicConfiguration CharacteristicConfigurationBits Indication 0002 PrimaryService 01888 PrimaryService 041888 CharacteristicDeclaration Properties Read Notify Characteristic UUID 02444 CharacteristicD eclaration Properties Read
21. France www insightsip com Page 13 4 without written permission Specification subject to change without notice 3mm _ gt Document Ref isp_ble_ Catalog R2 3 docx Level for BER lt 0 1 ideal Tx Insight SP APPLICATION NOTE It s all in the package ISP 41 371 O01 AN140802 Accelero Magnetometer Temperature and Barometer Sensor Demonstration Introduction This application note describes how to set up a Sensor application with ISP131001 Sensors Board that will send data via the Bluetooth link to the Master Emulator or to an Apple Device Two types of demonstration are presented The first one is directly executable with hardware and software provided in the Development Kit using Master Control Panel application The second demonstration requires the use of an iPhone or an iPad The iOS application is available on demand only as an App that can be installed for develooment purposes via the Apple developer program The procedure to obtain the App from Insight SiP and demonstration of the Sensor application with Apple Device is described hereafter Contents 1 Demonstration with Master Control Panel cccccccccsecesseeeeeeteseeseeeseceseeeeseeeteneeseeetaeess Page 14 1 2 Demonstration with iPhone or iPad De VICE ccccccceccsececeeeeeeeseeeaueeseeeeueesueesueeaueesueeaeeeaaes Page 14 4 June 1 2015 Page 14 1 Document Ref isp_ble_Catalog_R2 3 docx ji aye
22. Received a HandleValueNotification on handle 000E with value F8FF2SFBFC2Z0E 201 7401EE 00 17 30 44 5 Received a HandleValueNotification on handle 000E with value 000024FBE 420F0019701FCO0 17 29 51 1 Received a HandleValueNotification on handle 000E with value FOFF1 4FBEC20DB017701D600 17 30 44 5 Received a HandleValueNotification on handle 000E with value F8FF24FBEC20EC018501FB00 17 29 51 1 Received a HandleValueNotification on handle OOOE with value 00001 4FBDC20ED017301EE 00 17 30 44 6 Received a HandleValueNotification on handle OO0E with value 08001 8FB0021F3018701DF00 17 29 51 1 Received a HandleValueNoatification on handle 0012 with value DEESEDO1BBE93D00 17 30 44 6 Received a HandleValueNotification on handle 0012 with value 44E 8F301 48E 93D00 17 23 51 1 Received a HandleValueNotification on handle OOOE with value 04001CFB0821D1018E01F 300 17 30 44 6 Received a HandleValueNotification on handle OODE with value 00001 0FBF820EC018401F100 8 You can note data that transit between the 1SP131001 Sensors Board and the Master Emulator via the Bluetooth link Data of the accelerometer magnetometer on the above left figure Data of the temperature pressure on the above right figure 9 To switch off 1SP131001 Sensors Board disconnect battery holder as seen in the figure below June 1 2015 Page 14 3 Document Ref isp ble Catalog R2 3 docx Insig
23. Rx sensitivity BLE mode 93 Level for BER lt 0 1 ideal Tx A Rx sensitivity ANT mode Level for BER lt 0 1 ideal Tx Max range gt 200 Antenna Gain Rx sensitivity 51 4 Typical Antenna Return Loss Module mounted on a USB dongle ground plane 0 5 6 co O 42 20 21 22 23 24 25 26 27 28 29 3 0 freq GHz June 1 2015 Page 6 6 Document Ref isp_ble_Catalog_R2 3 docx F Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com A s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party pe mi without written permission Specification subject to change without notice m k a 5 sight SiP Insight Si ANT BLE MODULE It s all in the package ISP 1 303071 ANT Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane gain dBi 2 45GHz gain dBi 2 45GHz Ground Plane Effect Simulation e yo a USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane size 18 x 30 mm size 40 x 100 mm size 40 x 100 mm ee a June 1 2015 Page 6 7 Document Ref isp_ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this
24. the NXP LPC1114FHI33 302 integrating 56kB flash memory and 8kB SRAM The Freescale MMA7660FC a 3 axis orientation motion detection sensor is used to detect acceleration and orientation transmitted via the I2C bus The MMA7660FC has an auto Wake Sleep feature for low power consumption Data sampling rate is configurable from 1 to 120 samples second The MMA7660FC has orientation detection and gesture detection capabilities An interface board ISP120907 is available from Insight SIP and allows for easy flash programming the LPC1114FHI33 302 application processor via the 14 pin FPC connector During firmware modification and debug the ISP120901 device may be supplied via the DC voltage from the ISP120907 interface board An optional UART interface TP1 TP2 with direct connection to the nRF8001 uBlue is available for Bluetooth Low Energy radio testing as specified by the Bluetooth standard June 1 2015 Page 15 1 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ie i without written permission Specification subject to change without notice Ose een Insight SiP BLE SENSOR It s all in the package ISP 41 20901 Contents 1 EI CIICAl Specta ONS eenia E a ara aaa i raii inate Page 15 2 f
25. without written permission Specification subject to change without notice Insight SP ANT BLE MODULE It s all in the package ISP 1 303071 ANT Contents 1 EIOCINICAll 5 DCCINICANIONS aceteen cece ieee cece bean secsdawteedebaatendsieatsudedaceseetiectsadedregeeettanteadeinenieathextiaceioeteed Page 6 2 2 Ar PEONATI Page 6 6 Sit FOGUCE DEVEIODIMGIIL TOO orp Page 6 9 4 Mechanical Outlines cccccccceececeeeeeeeteneeceeceeeeteneeseeeeaeeeteueesseeeeueeteueesseeteneeteeeseeetaneensees Page 6 10 5 Storage amp Soldering Information cccceeccecseeeeeceeeeeeeeeeeceeseeeseeeeeseeeeeseaeeesseueeesageeesseneeesaees Page 6 13 6 Quality amp User INfOrmation cccccccsseeeeccceeeeeeeceeeeceeeseeeeeeeseeseeesseaeeeeeeeaeeeesseeseeessaaeeeessaeaes Page 6 14 1 Electrical Specifications Electrical Performance The specifications of the module follow those of the nRF51822 The following high level parameters are given for the module The operating temperature range is 25 to 75 C with the following performances Parameter VEU Supply voltage Supply Voltage Current consumption Static levels Peak current receiver active supply at 2 1V Peak current transmitter active 4 dBm Output Power 16 Peak c t TE 10 5 mA transmitter active 0 dBm Output Power Current drain between connection events Pin Assignment The module uses an LGA format with a double row of pads on a 0 65 mm pitch
26. 1 2015 Page 5 9 Document Ref isp_ble_Catalog_R2 3 docx age rd fs Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com we The information contained in this document is the property of Insight SiP and should not be disclosed to any third party foes without written permission Specification subject to change without notice ml ete Insight SP APPLICATION NOTE It s all in the package i S P 4 303 O 4 8 Browse to SoftDevice hex file and click Program s5110_nrf51822_6 0 0 Fichier Edition Affichage Favoris utils 7 CS Pr c dente wa JO Rechercher Dossiers Ey Adresse D Pascalprojets Mordic Sernidocumentation nRFS1822 nRFS1822 DkK s110_nrf51822_6 0 0 S Mom Taille Type Gestion des fichiers mr 2 s110_nrf51822_6 0 0_A4P1 File Folder cil emer r ent ay 2 6110_nrf51822_6 0 0_license txt 7Ko Document texte i a 6110_nrf51822_6 0 0_migration document pdf 109 Ko PDF Change View oy D placer ce fichier 2 6110_nrf5182 _6 0 0_readme txt 1Ko Document texte A Copier ce fichier Yaa 5110_nrf51822_6 0 0_releasenotes pdf 49 Ko POF kChange View g Publier ce Fichier sur le Web M5110 nrf51622 _ 6 0 0 softdevice hex 213 ko Fichier HEY G3 Envoyer ce fichier par courrier lectronique Supprimer ce fichier nRFgo Studio File View Help Features ees m SEGGER to use 518004330 ront cnd tests
27. 12 1 2 Demonstration with Android Device 4 3 or Higher ccscccseeceeeeeeeeeeeneeeseeeseeeneeeneeeneeenees Page 12 4 3 Demonstration with iPhone Device 4S Or Higher ccccceeccceeeeeeeeceeeeseeeaeeeseeeeseeesaeeeseees Page 12 6 1 Demonstration with Master Control Panel 1 Place the CR2450 lithium battery into the battery holder Battery CR2450 POS Terminal UP Battery CR2450 Fully Installed SSS E Pea June 1 2015 Page 12 1 Document Ref isp ble Catalog R2 3 docx free aw Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com oe sian srai The information contained in this document is the property of Insight SiP and should not be disclosed to any third party 5 without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S p 4 4050 4 Connect Development Dongle PCA10000 Master Emulator into a USB port on your computer Start Master Control Panel Click Start Discovery On the beacon push the switch SW2 to pair with the master the led become orange a a 6 Click Select Device File Help Master emulator COM4 480106451 480106451 connected Beacon Config amp kCB1DFD2C8C2A 34dBm Delete bond info 15 32 06 9 Loading 15 32 07 4 Device address 0x8613808A8776 15 32 07 4 Master emulator fimware ve
28. 3 2 Light sensor node Figure 18 shows the measurements of total current consumption of light sensor node for the two functioning phases Phase 1 Phase 2 carried out by the capacitor method for measurement time Connection Interval of 1 second Tek AN Acq Complete M Pos 4600s CURSOR I 7 Type Source Phase 1 Phase 2 Cursor 2 5 105 i 1 31 CH2 100m M 500ms CH2 281V 16 May 13 23 093 10Hz Figure18 Light sensor node total current consumption measurements as measured by capacitor method The total charge consumption of the light sensor node for Connection Interval Tperioa 1s as presented in Figure 18 is of the order of Qphase 1 Phase2 C X AV 5304F x 0 128V 67 84 uC Figure 19 and Figure 20 show the total consumption in Phase 1 and Phase 2 respectively thea June 1 2015 Page 21 19 Document Ref isp_ble_Catalog_R2 3 docx ras I Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party j ae without written permission Specification subject to change without notice reyes bras Insight SP APPLICATION NOTE It s all in the package AN 4 305041 Tek A Acq Complete M Pos 396 0ms CURSOR fr Type aU Gms zy E aT CH2 100m Mi 10 0ms CH2 2 78 16 May 13 231
29. 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com without written permission Specification subject to change without notice Insight SiP BLE SENSOR It s all in the package ISP 41 31 007 Electrical Schematic Olt Sa F000 ORFEOS g Fee atearerre rer RE ow 22 H TE z3 gi zi H R i a 2 g 2 Ei o astani Ps nrnna 3 T y afefe feer as 5 p roe pV A Da pesevos os wy a Ls 5 Heroa ERAS E r a i x 34 ET Fas g Reed peeve cake 2 a ote L ife T I amp 4 8 i i el al eg 3 s P FER Y3 WEE ARI D PG S PR EL FARA C A A E E 3 3 PESERERGRE z 3o E ase June 1 2015 Page 13 3 Document Ref isp_ble_ Catalog R2 3 docx without written permission Specification subject to change without notice Insight SiP It s all in the package BLE SENSOR ISP131001 2 RF Performances RF Specifications according to standards The performance of the Bluetooth Low Energy Radio link is that obtained by the ISP130301 module Temperature range 25 C to 75 BT V4 Parameter VELLI Std limit Output Power 20 to 4 20 to 10 Better than ww e 4 of Rx sensitivity 5 93 mm 3 Mechanical Outlines i i 12 5mm Dimensional drawing 25mm oo June 1 2015 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex
30. 3 docx lipi Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice 7 a z Ir ON9S pall LSGND 1 Oltl Dds OOFL OBPEOS doy GND 8 Oltl Oda OOFL OBPEOS 0g OND gt ano iy vd Oll dd 00t 08 0S on oo t D i u O O BLE SENSOR ISP120911 WYO 6 S y WyO 6 S 4 6Y oly YOSNIS JDA N and Y 9LON9 OSaNd doy GND wq GND YOSN3S DOA 0S dzi Id TIA vas ozi 90N9 1383 wyo 00t Y Fe 8H Ber 1 10Z0u Pn 107 wos NAGE zn 7 YLTYOSNg ZOESEIHSPLEL Od aa min MSX wequinu ped doy doy an 1 9 ZON9 aN9 TONS aT doj ONS oU sipi eyzy roy E zoron DouvuvUUG aia ss 08 DOA ano 1unow JON OG EONS ESON9 ad Gi 0 dd S4 9 a i 7 doy ANY GND 6 zo dSX mzaqQunu Yed 409 666 4 1 10z00 1140209 JN i9 t E ozo amp 1 10z0u ano an9 F H 8 won 029 au 0b 9 4u 00b 0 brGNd os aj doy GND 08 DOA gie Koa 5 E aN9 a 1740207 a coo AYEINOD JEqUINN Ped ost TT OLY O89119 00SIN 8 0Old OdWD 0891L9 013SS 2 00 d E om s449 HN OL 7 ison pr tLYW 089LLO0ISOW 6 00ld OdVD LE9LI B bOI S 9 E 2 wIOMS 6l ZLVW OB9LLO ONDS OL OOld WIOMS in F 1 0901 s207 Oz E 7 i soav SE leivwoszesvoav ii ooy ZOEEEIHJHLLLOdT Z
31. 80ms TRIGGER Sensor Type N Conversion Time gt 8 5ms OUICE IENEN pth S mahh mt Hy ot I a mede j H eh Sag slope Rising Mode CH2 200m M 5 00ms CH2 64 0rm Current screen display saved to 4 4 TEROO0S JPG Figure 11 Orientation Motion sensor node current consumption measurements of BLE module and microprocessor as measured by oscilloscope method As for light sensor node we have two consumption segments 2 4 ms and 1 ms as presented in Figure 11 for the microprocessor current consumption measurements in orientation motion sensor node The corresponding current and charge consumption values in these two segments are presented in Table 9 The third segment Isieep IS not used in orientation motion sensor node Isiecep_time 0 as the case of light sensor node to minimize the current consumption of the orientation motion sensing device The minimum conversion time for orientation motion sensing device is 8 333 120 Samples second June 1 2015 Page 21 13 Document Ref isp_ble_Catalog_R2 3 docx tre Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Teron without written permission Specification subject to change without notice ope Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 Orie
32. AM Ulpbt dll z200 ko Application Extens Ulpbttils dll 4oplication Extens Taille 232 Ko a Description ProximityDemo Soci t Nordic Semiconductor 454 Version du fichier 1 0 0 0 Date de cr ation 04 232 Ko 4 My Computer June 1 2015 Page 18 5 Document Ref isp_ble_Catalog_R2 3 docx fait Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com IEG The information contained in this document is the property of Insight SiP and should not be disclosed to any third party eh without written permission Specification subject to change without notice a Insight SP APPLICATION NOTE It s all in the package i S P 4 209 o9 One screen should open On this screen click on Open E a Proximity Temp Lumino Demo A m Ed T el Proximity App Immediate alert level Off Low High Set Link loss level OTT Low High InteryalMs TimeoutMs Latency 6o00 o 6 4000 ms S000 32000 ms DES Luminosity Ferfom device discovery Connect Starting up Connected Reset Temperature Sensor with small reset button June 1 2015 Page 18 6 Document Ref isp_ble_Catalog_R2 3 docx 4 bree Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com TEG The information contained in this document is the property of Insight SiP and should not be disclos
33. Detection Ultra Low Power Application Processor 16 MHz Crystal Clock for Application Processor 32 768 kHz Crystal for BLE Protocol Sync Overall Size 18 x 29 x 6 mm Temperature 40 to 85 C Configurable I O system Custom Low Power Micro controller RF powa Matching Antenna Network 2 4 GHz Transceiver Ultra low RE 32 kHz XO Flash Memory Advanced Power Power Supply Management d li 16 MHz XO ETEEN 32 kHz Xtal CR1632 Accelerometer or CR1620 MMA7660FC Button Battery Low Power Micro Controller LPC1114FHI33 302 Programming Interface and external power ISP120901 gt p y 7 A J e agi 55 SD S ad Wo L iN o nl gt gt Applications Sport and fitness sensors Health care sensors Out of Range OOR sensors 4 Gaming sensors Motion detection and transmission General Description ISP120901 is an autonomous low power device for wireless orientation motion detection and transmission The complete device makes use of Insight SiP ISP091201 BLE module together with low power host processor 3 axis orientation motion sensor and small primary button cell battery CR1632 or lower capacity CR1620 Overall size of the device is 18x29x6 mm The host processor that handles the autonomous sensor application the high level portion of the BLE protocol stack and communication with the 3 axis sensor is a low power 32 bit MCU ARM Cortex M0O based
34. Driver Details of rs USB Seral Converter 4 wD Sound video and game controllers ap Storage volumes Driver Provider NOARDICSEMI System devices Driver Date 3 18 2011 4 Universal Serial Bus controllers Behan 39140 BS Generic USB Hub Intel R 628016 ICH Family USB Universal Host Controller 2728 Digital Signer Not digitally signed InteR 828016 ICH Family USB Universal Host Controller 2729 gt Intel R 828016 ICH Family USB Universal Host Controller 272A z Intel R 828016 ICH Family USE Universal Host Controller 27CB To view details about the driver files Intel R 626016 ICH Family USB2 Enhanced Host Controller 2720 USB Composite Device USE Mass Storage Device USB Root Hub USB Root Hub eet If the device fails after updating the driwer roll gt USE Foot Hub 7 back to the previously installed driver USB Root Hub USB Root Hub Uninstall USB Serial Converter 4 USB Serial Converter B Tag a ial x Update Driver To update the driver for this device To uninstall the diver Advanced Device Manager Sel USB Serial Converter B Properties x File Action view Hel pe 5 General i Advanced Driver Details e gt mM E8 e m zag fa USB Serial Converter B SB Processors amp SCSI and RAID controllers Sound video and game controllers S Storage volumes System devices Universal Serial Bus controllers Generic USB Hub Intel R 82801G
35. Emulator Connect the nRF2739 Master Emulator to the PC and check to ensure that the USB drivers are correctly installed This can be checked on the Control Panel Device Manager under USB Controllers USB Serial Converter A USB Serial Converter B June 1 2015 Page 16 2 Document Ref isp ble Catalog R2 3 docx an ogi Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Pat ih without written permission Specification subject to change without notice m eaat Insight SiP APPLICATION NOTE It s all in the package a S P 14 209 O 4 Should both be installed see below for details Device Manager USB Serial Converter A Properties PI File Action View Help e M f8 f m ae Processors SCSI and RAID controllers General Advanced Driver Details of i USB Seral Converter 4 Sound video and game controllers aia Storage volumes Driver Provider NOARDICSEMI System devices Driver Date 3 18 2011 ig Universal Serial Bus controllers ne eeeee 39140 e Generic USB Hub Intel R 628016 ICH Family USB Universal Host Controller 2728 Digital Signer Not digitally signed Intel R 828016 ICH Family USB Universal Host Controller 2729 gt Intel R 826016 ICH Family USB Universal Host Controller 27
36. F8 p C9lp c9 beo Gorn VCC_nRF VCC_nRF C12 L5 AVDD 021 L6 c7 June 1 2015 Page 3 5 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 41 303071 2 RF Performances RF Specifications according to standards BT V4 a Parameter Value Std limit Condition Channels Output Power 20 to 4 20 to 10 Dod RF Frequency tolerance Better than 50 Channels 20 Rx sensitivit Level for BER i lt 0 1 ideal Tx s a Typical Antenna Return Loss Module mounted on a USB dongle ground plane dB S 1 1 20 21 22 23 24 25 26 27 28 29 3 0 freq GHz June 1 2015 Page 3 6 Document Ref isp_ble_Catalog_R2 3 docx bat Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Sp
37. ICH Family USB Universal Host Controller 27C8 Intel R 828016 ICH Family USB Universal Host Controller 27C9 Intel R 828016 ICH Family USB Universal Host Controller 27C4 Intel R 828016 ICH Family USB Universal Host Controller 27CB Intel R 82801G ICH Family USB2 Enhanced Host Controller 27CC USB Composite Device USB Mass Storage Device USB Root Hub USB Root Hub USB Root Hub USB Root Hub USB Root Hub USB Serial Converter 4 USB Serial Converter B Driver Provider NORDICSEMI Driver Date 3 18 2011 Driver Version 2 8 14 0 Digital Signer Not digitally signed Driver Details To view details about the driver files Update Driver To update the driver for this device ARSENA If the device fails after updating the driver roll back to the previously installed driver Uninstall To uninstall the driver Advanced ee a June 1 2015 Page 20 3 Document Ref isp ble Catalog R2 3 docx Fe Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 1 20971 4 Connect Battery to ISP120911 Luminosity Sensor as shown below Run
38. Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i ap OD i i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party d without written permission Specification subject to change without notice feat Hu Insight SiP It s all in the package APPLICATION NOTE ISP131001 1 Demonstration with Master Control Panel he Page 14 2 Document Ref isp_ble_ Catalog R2 3 docx a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third pay without written permission Specification subject to change without notice June 1 2015 Place the CR2032 lithium battery into the battery holder Connect the battery holder to the Sensors Board ISP131001 Connect Development Dongle PCA10000 Master Emulator into a USB port on your computer Start Master Control Panel Click Start Discovery Master Control Panel File Help Master emulator COME 480103054 480103054 connected Scan for devices Stop discovery Discovered devices InsightSIP_COO10 020E 9F 511440 7E 43dEm Select device Delete bond info Log 17 26 19 6 Loading 0 7 26 20 1 Device address OxFTFACDFFBS48
39. Lumino Demo yshost exe manifest 1 Ko Fichier MANIFEST 03 17 2010 10 39 PM ProximityDema shost exe manifest 1ko Fichier MANIFEST 03 17 2010 10 39 PM pylibs dll 1 425 Ko Application Extension O9 8 2012 2 31 PM 3 Segger dll lz Ko Application Extension 09 26 2012 2 51 PM Signalyzer cll 31 Ko Application Extension O9f 8 2012 2 31 PM Ulpbt all 200 Ko Application Extension O9ff8 2012 2 51 PM UlpbtUtils ll z6 ko Application Extension 09jzajz0lz 2 31 PM Hardware Setup Master Emulator Connect the nRF2739 Master Emulator to the PC and check to ensure that the USB drivers are correctly installed This can be checked on the Control Panel Device Manager under USB Controllers USB Serial Converter A USB Serial Converter B SSS E Oo June 1 2015 Page 20 2 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice tT Insight SiP APPLICATION NOTE It s all in the package ISP 41 20971 4 Should both be installed see below for details Device Manager USB Serial Converter A Properties File Action View Help e amp 4 f mm ae Processors SCSI and RAID controllers General Advanced
40. Notify Characteristic UUID 0x24 44 UUID 2444 Value 00 00 10 FB F8 20 EC 01 84 01 F1 00 ClientCharacteristicConfiguration CharacteristicConfigurationBits Notification 0001 ClientCharacteristicConfiguration CharacteristicContigurationBits Notification 0001 PrimaryService 0x1889 PrimaryService 01889 S CharacteristicDeclaration Properties Read Notify Characteristic UUID 0x244B CharacteristicD eclaration Properties Read Notify Characteristic UUID 0x244B UUID 2448 Value DE E6 ED 01 BB E9 3D 00 ClientCharacteristicConfiguration CharacteristicConfigurationBits Notification 0001 ClientCharacteristicConfiguration CharacteristicConfigurationBits Notification 0001 PrimaryService 041887 PrimaryService 01887 CharacteristicDeclaration Properties Write Characteristic UUID 0x244C CharacteristicD eclaration Properties Write Characteristic UUID 0x244C UUID 244C No values read UUID 244C No values read y gt s Attribute value Attribute value UUID 0 Handle Ox Pie Sete UUID Ox Handle 0s Breyer ULES Value hex text Value hex text Log Log 17 23 50 9 Received a HandleValueNotification on handle 0012 with value E4E6F10151EA3D00 17 30 44 4 Received a HandleValueNotification on handle 0012 with value 55 8F60197EB3D00 17 29 50 9 Received a HandleValueNotification on handle OO0E with value 04001 8FBFO20E 0019201E 700 17 30 44 4 Received a HandleValueNotificatio
41. Press on Connect Ea Proximity Temp Lumino Demo Temperature _3 Immediate alert level Off Link loss level OTT InteryalMs TimeoutMs Dog Le 75 4000 ms S000 32000 ms Ferom device discovery Log Setup add service 021803 store REMOTE STORE Setup add char def 0x2406 Setup assigned pipenumber 4 type TRANSMIT WITH ACE Setup add service 0217802 store LOCSL_ STORE Setup add char def s2406 Setup assigned pipenumber 5 type RECEIVE Run Device discovery Connected O June 1 2015 Page 18 8 Document Ref isp_ble_Catalog_R2 3 docx E He ra Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com TEG The information contained in this document is the property of Insight SiP and should not be disclosed to any third party EEA without written permission Specification subject to change without notice eed l 1 Insight SiP APPLICATION NOTE It s all in the package K S P 14 2 09 09 Display should change and be updated every Interval Connection IntervalMs Interval Connection is adjustable between 7 5 to 4000 ms Hereunder Interval Connection is configured to 1000 ms Ea Proximity Temp Lumino Demo 1 O06OKeY4 m Open Device name g Proximity App Temperature_3 Ferom device discovery 29 3125 Log c Receiwed AtH andie alue otification on pipe number 2 with value 1050 Receved Temperature Sen
42. R 315 0 4 PLACES VACUUM PICKUP CELLS SEE DETAIL D ii PLACES spe bes 9 CENTER CELLS 2 SIDE CELLS r gt Y 10 PLACES SEE DETAIL E SEE SHT 2 135 9 Ea ro Ea E Ex Fa L Y 10 45 SEE DETAIL G SEE DETAIL F SEE DETAIL B SEE DETAIL C CSEE SHT 2 CHAMFER SEE SHT 2 L6 R 3 0X45 3 PLACES 290 040 25 E0761 SEE DETAIL H 8XR2 54 MAX rae Pa SEE DETAIL I 255 3 25 4 34 3 T 2 94 Tape and Reel ISP130301 are also available in Tape amp Reel They are delivered in sealed pack with desiccant pack and humidity sensors Reels are proposed in standard quantities of 500 units 180mm 7 reel or 2000 units 330mm 15 reel only Please refer to tape size below Complete information is available on request Po Pa 2 0 0 1 I 4 040 1 II E 0 300 05 1 55 0 05 gt 1 75 0 1 z 91 6 0 1 R O39 Typical Bo 11 60 01 l Ca 12 Ww 11 50 0 1 12 00 DA 24 00 0 3 June 1 2015 Page 3 14 Document Ref isp_ble_Catalog_R2 3 docx p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party rs without written permission Specification subject to change without notice m Insight SiP BLE MODULE It s
43. Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ie sigh a i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party i Lee without written permission Specification subject to change without notice abt Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 IMCU_LL Istan dby lidle Tperiod on lice M M M b lon I standby oo Tconversi on c Figure 3 Current consumption over time for a typical module ISP091201 a microprocessor LPC1114FHI133 302 b and for sensing device c The values of static current consumption of BLE module ISP091201 for its different states and operations in each connection event are defined in Table 2 Symbol Parameter condition Nom Unit Peak current receiver active Peak current transmitter active Peak current when switching between Receive and transmit OO 7 mA Peak current for host processing Pp 5 M _ Peak current for LL processing 35 mM _ Standby current t6 mM Current drain between connection advertising events uA ACl active mode 32kHz Osc active Table 2 Current consumption static values of BLE module June 1 2015 Page 21 5 Document Ref isp_ble_Catalog_R2 3 docx fe Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The infor
44. SiP we rapidly solve these challenges Based on a system in package approach we make complex RF systems easy to integrate in any existing or future portable application We contribute to reduce our customer s product development cycle and accelerate their products release to market Insight SiP it s all in the package i Nick Wood Chris Barratt Michel Beghin President Chief Technical Officer Chief Executive Officer June 1 2015 Page 1 3 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP INTRODUCTION It s all in the package COMPANY PROFILE Insight SiP provides turn key design services and creative packaging solutions to customers who need highly integrated systems to meet wireless and portable devices space requirements Insight SiP expertise in RF circuit miniaturization and system in package SiP technology enables product development to reach the goals of smaller size and ever increasing functionality requested by the market today It s all in the package In shorter time Founded in 2005 with headquarter in the hearth of Sophia Antipolis France Insight Sip has a global presenc
45. Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice OF gD Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 1 Recommended Documentation The following Nordic Semiconductor documents and Dev Kits software portion are required to understand the complete setup and programming methods Documents nRF51822 Development kit User Guide hardware section should be partially ignored ISP development kit hardware replaces Nordic Semiconductor hardware 4 nRF51 Series Reference Manual nRF51822 PS data sheet 110 nRF51822 SoftDevice Specification nRF51 SDK Dev kits software portion nRFgo Studio nRF51 Software Development Kit SDK Precompiled HEX files Source code Keil ARM project files S110 nRF51822 SoftDevice Master Control Panel To access these files go to www nordicsemi com and log in to your Nordic My Page account enter your product key and download the files Instructions can be found in Chapter 3 ISP documents that complement the above AN140101 App Note this document DS130301 module data sheet ISP130601 Test Board schematic SC130602 ISP131001 Sensors Board schematic SC13100
46. Software Navigate to the Temp _Lum_Demo_ EXE folder Sensors Fichier Edition Affichage Favoris utils 7 ages ih i i Q Pr c dente dl wa pa Rechercher l Dossiers Adresse Mom Taille Type Gestion des fichiers Accelero Demo EXE File Folder me Temp Lum Deno EXE File Folder mi Renommer ce dossier iy D placer ce dossier i Copier ce dossier ee Publier ce dossier sur le Web Partager ce dossier Envoyer les fichiers de ce dossier par courrier lectronique 4 Supprimer ce dossier Autres emplacements i BLE 3 Mes documents Cy Documents partag s 4 Foste de travail a Favoris r seau D tails Temp_Lum_Demo_ExXE File Folder Date de modification April 25 2013 2 47 PM June 1 2015 Page 20 4 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 1 209017 1 Launch Proximity Temp Lumino Demo exe on some systems you may need to launch using run as administrator Temp_Lum_Demo_EXE A o Fichier Edition Affichage Favoris Outils 7 ae E3 Pr c dente J Pi P Rechercher i Dossi
47. he Porras eee te Torero a thes tees Ne ot Nees fees Ne taa Eee Sea Eee ea aes SAS LaNa Ses KEPE A FANN cae Snag canes Senos aes OERA LaNa ERA LaNa Ses ee Sea l pao tooo EEzudoed Paetae Pobecncdsde d fb cleyect desc ne a Boge al ems yee i eae bord ETE eas ge ao EErEE Panpa ae EE Seer PETA see wee ETE een wae voor aes ae sca TRT AN eet TOR VIEW June 1 2015 Page 7 10 Document Ref isp ble Catalog R2 3 docx a Bh i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPO941 2071 Antenna Keep Out Zone Recommended metal keep out areas for optimal antenna performance no metal no traces and no components on any layer except mechanical LGA pads 18 0 mm min Metal exclusion zone to edge of board no metal on any layer except mechanical LGA pads N SE RENE gOS a SLES ESSN wE ESH EEEH EEH HE board 5 4 mm TOP VIEW June 1 2015 Page 7 11 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and shou
48. is described hereafter 1 Contact Insight SiP at contact insightsip com and communicate the kit number and the product key notified on the dev kit 2 We will send you by email an invitation 24h 48h after Accept it using your iOS device you want to use for the demo lt Toutes De TestFlight Masquer A noreply n testflightapp com Chris Barratt has invited you to join the InsightSiP team on testflightapp com 8 octobre 2014 09 39 Chris Barratt has invited you to InsightSiP as a Tester Chris also had a message for vou P oE tv a A 3 Sign up in order to register to TestFlight app Join with a new account a testflightapp com Create a new TestFlight account and get access to beta apps for InsightSiP You are now a tester for the InsightSiP team In order to install applications via TestFlight on your iOS device you need to connect your device to TestFlight Thanks for using TestFlight Connect your Device By clicking Sign Up you agree to TestFlight s Terms of Use amp Privacy Policy Sign Up Pare June 1 2015 Page 5 22 Document Ref isp_ble_Catalog_R2 3 docx sats Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i a The information contained in this document is the property of Insight SiP and should not be disclosed to any third party pet without written permission Specification subject to chan
49. nRF51 SDK installer Make sure to choose the Keil MDK ARM installer option Make sure to download the last version updated 12 Download the 110 S120 nRF51822 SoftDevice Make sure to download the last version updated Brij June 1 2015 Page 5 4 Document Ref isp_ble Catalog R2 3 docx ae Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 pi sight s i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S gt 4 3030 4 4 Hardware Description 4 1 ISP130301 Module ISP130301 is a Bluetooth Low Energy module with integrated antenna This module is based on Nordic Semiconductor nRF51822 2 4 GHz wireless SoC nRF51822 integrates nNRF51 series 2 4 GHz transceiver a 32 bit ARM Cortex M0O CPU flash memory and analogue and digital peripherals nRF51822 can support Bluetooth low energy and a range of proprietary 2 4 GHz protocols The ISP130301 module measures 8 x 11 x 1 2 mm3 The module integrates all the decoupling capacitors the 16 MHz and 32 kHz crystals their load capacitors the DC DC converter component the RF matching circuit and the antenna in addition to the wireless SoC For more details see Insight SiP module data sheet document DS1
50. of the device Le present appareil est conforme aux CNR d industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement June 1 2015 Page 3 16 Document Ref isp_ble_Catalog_R2 3 docx pas chars Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com pE 33 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party BeTa without written permission Specification subject to change without notice im ate Insight SiP BLE MODULE It s all in the package ISP 1 303071 Discontinuity Normally a product will continue to be manufactured as long as all of the following are true The manufacturing method is still available There are no replacement products There is demand for it in the market In case of obsolescence Insight SiP will follow Jedec Standard JSD 48 A Product Discontinuation Notice PDN will be sent to all distributors and made available on our website After this the procedure goes as follows Last Order Date will be 6 months after the PDN was published Last Shipment Date wi
51. property of Insight SiP and should not be disclosed to any third party f3 without written permission Specification subject to change without notice m Insight SiP It s all in the package ISP120909 Bluetooth Low Energy Wireless Temperature Detection Sensor Key Features Single Mode BLE v4 0 Slave Module 4 Based on Nordic Semiconductor uBlue family Includes transceiver baseband software stack Fully integrated RF matching and Antenna Integrated 16 MHz Crystal Clock Ultra Low Power Consumption Coin cell battery CR1632 or CR1620 Low Power Digital Temperature Sensor Ultra Low Power Application Processor 16 MHz Crystal Clock for Application Processor 32 768 kHz Crystal for BLE Protocol Sync Overall Size 18 x 29 x 6 mm Temperature 40 to 85 C Ultra low power 2 4 GHz Transceiver Configurable system Custom Low Power Micro controller 32 kHz XO Flash Memory Advanced Power Supply 16MHz Management decoupling Xtal 16 MHz XO caps 32 kHz Xtal CR1632 Temperature or CR1620 TMP112 Button Battery Programming Low Power Interface and Micro Controller external Caps LPC1114FHI33 302 power ISP120909 BLE SENSOR ISP 120909 d j o ss m Wo A o WD o 3 gt 6 Applications 4 Temperature monitoring sensors Thermostat controls sensors Health care sensors Out of Range OOR sensors General Description IS
52. reset button June 1 2015 Page 20 6 Document Ref isp_ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 1 20901 1 On Panel click on Perform Device Discovery Ea Proximity Temp Lumino Demo i OO6OKaY4 m Open Proximity App Immediate alert level Off Low High Set Link loss level OT Low High Set IntervalMs TimeoutMs Latency 10 eoo o r5 4000 ms 3000 32000 ms 0 500 Ferom device discovery Setup assigned pipenumber 3 type TRANSMIT Setup add service 0217803 store REMOTE STORE Setup add char def 042406 Setup assigned pipenumber 4 type TRANSMIT WITH_ACE Setup add service Ox1802 store LOUCAL_STORE Setup add char def O 2406 Setup assigned pipenumber 5 type RECEIVE Furi Log Connected O June 1 2015 Page 20 7 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permis
53. see Nordic Semiconductor user guide document R1 see 1 nRFGo Starter Hardware Components 2 nRFgo Motherboards mRF6310 Getting Started Guide 2 USB cables if i r gore A BE Getting Started Guide a Starter Kit EEFI ANoRDpIC 8 2 lead patch cables ANoroic New nAF module socket connectors for nRF geo Starter Kit PePTerirr terre tt ertTe wm dils FERE RN 5 SP is 35 23 3 sa PE 25 i 32 on ee ae 5 58 ri 36 7 33 EREE TIE 1 Display Module Information leaflet on nRF module socket connectors compatibility 4 10 ribbon flat cables Software and Documentation Components Access to software and documentation at www nordicsemi com Then download and install latest version of nRFGo Studio ee a June 1 2015 Page 9 2 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S POS 4 2 O 4 3 NRF amp 8OO1 Development Kit NRF amp 8001 DK The nRF8001 Development Kit consists of hardware and software components For more details see Nordic Semiconductor user guide document R2 see 1 nRF8001 DK Hardware Components N 5nRF8200 sa
54. sensing device is lower than that of light sensing device and equal to that of temperature sensing device cf Table 4 The total average current consumption of the of light sensor node for the period Tperioa 15 is of the order of ie aie lt phase 7 prase 55 12 8 48 A 63 6 uA As we have already seen the differences in total current consumption of the three sensor nodes are related to characteristics of the used sensing device In the next paragraph we present the total consumption measurements results of the three sensor nodes for different measurements times Connection Intervals 3 Measurement Results 3 1 Temperature sensor node Table 11 presents total current consumption measurements of the temperature sensor node which integrates BLE module designed by Insight SiP LPC1114FHI33 302 microprocessor and temperature sensing device TMP112 The battery used in this sensor node is 3V coin cell battery CR1632 has a capacity of 140 mAh so a charge capacity of 504 C The autonomy of this sensor node is given by the following equation 504 C l Autonomy sz X Connection Interval Total average charge consumption of sensor node C Measurement specifications for different measurement times Connection Intervals are described in Table 11 ors June 1 2015 Page 21 23 Document Ref isp_ble_Catalog_R2 3 docx tie ah i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex
55. the package ISP 41 303071 7 The InsightSiPDemo application is downloaded and installed You should see the following screen on your iOS device eeeeo Bouygues 4G 18 40 InsightSIP a er T l phone Mail Safari Musique Then you will be able to set up the application demonstration as follows 8 Place the CR2082 lithium battery into the battery holder 9 Connect the battery holder to the Sensors Board ISP131001 10 Start InsightSiPDemo application on your iOS click Connect and select your Sensors Board name is InsightSiP_xxxxx eeeeo Bouygues 4G 18 40 eeeeo Bouygues 4G 18 52 _ Insight SIP Demo Connect lt Back Connect Accelerometer InsightSIP_wi Temperature LED June 1 2015 Page 5 24 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fF without written permission Specification subject to change without notice m Insight SiP APPLICATION NOTE It s all in the package ISP 41 30301 1 Click Accelerometer A Calibration phase invites you to rotate the ISP131001 Sensors Board Then a starship on your iPhone screen follows the Sensors board movement lt Back Accelerometer Calibration Please rotate your sensors Rotation X Rotation Y Rotation Z
56. the shield ISPO91205 UU pis 2 05 mm 2 0 mm 2 0 mm 9 8 mm 0 1 0 A A 9 8 mm 0 1 0 1 8 mm 0 1 0 R 0 2 mm 0 0 1 SSS a S A a June 1 2015 Page 7 16 Document Ref isp_ble_Catalog_R2 3 docx F ae Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPOO 1T 207 USA User information This intends to inform how to specify the FCC ID of our module ISP091201 on the product Based on the Public Notice from FCC the host device should have a label which indicates that it contains our module The label should use wording such as Contains FCC ID 2AAQS ISP091201 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below FCC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation Caution Any Change
57. ultra low power wireless applications conforming to the Bluetooth Low Energy Specification contained within v4 0 of the overall Bluetooth specification The nRF8001 used in the current revision of ISP091201 is a production product using a RoM for the baseband protocol engine The uBlue transceiver is specifically designed for both PC peripherals and ultra low power applications such as sports and wellness sensors For sensor applications the ultra low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery The ISP091201 module size measures 8 x 12 x 1 5 mm The module integrates all the decoupling capacitors the 16 MHz crystal and load capacitors plus the RF matching circuit and antenna in addi tion to the transceiver As the module has several end applications the antenna was designed to be compatible with several ground plane sizes including that of a USB dongle and a cell phone The module can operate as a standalone Bluetooth sensor node with the addition of a transducer a small external microprocessor to run application software a 32 kHz crystal and a DC power source za m June 1 2015 Page 7 1 Document Ref isp ble Catalog R2 3 docx z sE Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not
58. via the DC voltage from the ISP120907 interface board An optional UART interface TP1 TP2 with direct connection to the nRF8001 uBlue is available for BLE radio testing as specified by the Bluetooth standard mem June 1 2015 Page 19 1 Document Ref isp_ble_Catalog_R2 3 docx ok Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fF without written permission Specification subject to change without notice Insight SiP BLE SENSOR It s all in the package ISP 41 20971 4 Contents 1 Electical SOCCINICAN ONG earraun Ea E a a raaa i rai inn inate Page 19 2 2 Rr PMO MM ANG SS serer R Page 19 4 MECANIC OUES a aR E stueesam ee tneanceasascantec onesie santas ese aes Page 19 4 1 Electrical Specifications Current Consumption The measured total average current consumption and autonomy of the ISP120911 light sensor node supplied by a CR1632 battery for several connection intervals is shown below Connection Interval Average Current Consumption Autonomy CLE HA year Sensor Performance The performance of the light sensor is that obtained by the Avago APDS 9300 Key characteristics are shown below Parameter Value Unit Light range Dark to bright sun a June 1 2015 Page 19 2 Document Ref isp ble Catalog R2
59. your application ACI is a bidirectional serial interface that enables generic application controllers to set up and operate nRF8001 integrated in ISP091201 Hardware The following development kits are recommended for using and testing ISP091201 module Nordic Semiconductor nRFgo Starter Kit nNRF6700 need to be purchased separately Nordic Semiconductor nRF80001 Development Kit nRF8001 DK need to be purchased separately Insight SiP Development Kit ISP091201 DK1 need to be purchased separately Development Tools and Software The following development tools and software are recommended for using and testing ISP091201 module 4 ACI commands and events are defined in nRF8001 Data Sheet downloadable for free from www nordicsemi com Nordic Semiconductor Software Development Kit for nRF8001 nRF8001 SDK downloadable from www nordicsemi com after purchasing nRF8001 DkK give access to software source code examples Nordic Semiconductor nRFgo Studio downloadable from www nordicsemi com after purchasing nRFgo Starter Kit nNRF6700 Nordic Semiconductor Master Control Panel downloadable from www nordicsemi com after purchasing nRF8001 Dk IDE compatible with your chosen microprocessor As ISP091201 is designed for operation in the peripheral role it offers you an easy way to add Bluetooth low energy connectivity to your application ISP091201 integrates a serial interface ACI for configuration and control from your microcontr
60. 012 2 31 PM hei_coder_net dll 27 Ko Application Extension O9 8 2012 2 31 PM IronPython dll 1750 Ko Application Extension O9 28 2012 2 29 PM TronPython Modules dll 637 Ko Application Extension 09 26 2012 2 29 PM IronPython xml 399 ko Document ML pgjzgi20l2 2 29 PM ILINKARM dll 4 422 Ko Application Extension 09 28 2012 2 30 PM 2 log bk 1 Ko Document texte O2 072015 1 36 AM MasterEmulator all 30 Ko Application Extension O9f28 2012 2 31 PM MasterEmulator xml 77ko Document XML pgizalz0ilz 2 51 PM Microsoft Dynamic dll L020 Ko Application Extension D9jz26j2012 2 29 PM Microsoft Dynamic ml 360 ko Document ML pgjzgi20l2 2 29 PM Microsoft Scripting dll idi ko Application Extension O09 26 2012 2 29 PM Microsoft Scripting Metadata dll 91 Ko Application Extension O9ff8 2012 2 29 PM Microsoft Scripting Metadata xml iF Ko Document XML Oozef2012 2 29 PM Microsoft Scripting xml 201 Ko Document ML ooffefeole 2 29 PM Proximity Temp Lumino Demo exe 253 Ko Application 04 16 2015 11 01 AM Proximity Temp Lumino Demo pdb 56 ko Fichier PDB 04 16 2015 11 01 AM P Proximity Temp Lumino Demo yshost exe izko Application 04 16 2015 11 07 AM Proximity Temp Lumino Demo yshost exe manifest 1 Ko Fichier MANIFEST 03 17 2010 10 39 PM ProximityDema shost exe manifest 1ko Fichier MANIFEST 03 17 2010 10 39 PM pylibs dll 1 425 Ko Application Extension O9 8 2012 2 31 PM 3 Segger dll lz Ko Application Extension 09 26 2012 2 51 PM
61. 08 MaxConninterval 0x0104 SlaveLatency 0x0C SlavePreferredConnectionParameters MinConninterval 040008 MaxConnInterval 020104 SlaveLatency 0x0C PrimaryService Generic Attribute 0 1801 PrimaryService Generic Attribute 01801 CharacteristicDeclaration Properties Indicate Characteristic UUID 022405 CharacteristicDeclaration Properties Indicate Characteristic UUID 042405 ServiceChanged No values read ServiceChanged No values read ClientCharacteristicConfiguration CharacteristicConfigurationBits Indication 0002 ClientCharacteristicConfiguration CharacteristicConfigurationBits Indication 0002 PrimaryService 01888 PrimaryService 041888 CharacteristicDeclaration Properties Read Notify Characteristic UUID 02444 CharacteristicD eclaration Properties Read Notify Characteristic UUID 0x24 44 UUID 2444 Value 00 00 10 FB F8 20 EC 01 84 01 F1 00 ClientCharacteristicConfiguration CharacteristicConfigurationBits Notification 0001 ClientCharacteristicConfiguration CharacteristicContigurationBits Notification 0001 PrimaryService 0x1889 PrimaryService 01889 S CharacteristicDeclaration Properties Read Notify Characteristic UUID 0x244B CharacteristicD eclaration Properties Read Notify Characteristic UUID 0x244B UUID 2448 Value DE E6 ED 01 BB E9 3D 00 ClientCharacteristicConfiguration CharacteristicConfigurationBits Notification 0001 ClientCharacteristicConfiguration CharacteristicConfigur
62. 0Hz Figure 16 Temperature sensor node total current consumption measurements during Phase 1 as measured by capacitor method Figure 17 presents the measurements of total consumption of temperature sensor node during the Standby sleep Phase 2 We observe a voltage drop of 16 mV during this phase so the total charge consumption in the Standby sleep phase is of the order of Qphase2 C X AV 530uF x 0 016V 8 48 uC Tek A Acq Complete M Pos 2 4905 CURSOR 4 Type Source 4 930 0ms sq 1 010Hz ew 16 0mm NS BS 24n Csr 2 995 i 2 44 CH2 100m M 250ms CH2 x 2 39 16 May 13 23 393 10Hz Figure17 Temperature sensor node total current consumption measurements during Phase 2 as measured by capacitor method mia aa m June 1 2015 Page 21 18 Document Ref isp_ble_Catalog_R2 3 docx tr He Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s Ly The information contained in this document is the property of Insight SiP and should not be disclosed to any third party iene oe without written permission Specification subject to change without notice i tes ae Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 So the total average current consumption of the temperature sensor node for the period Tperioa 15 is of the order of ee Spnase T prase 46 64 8 48 uA 55 12 uA 2
63. 1114FHI33 302 from NXP The resulting sensor node with 3V coin cell battery CR1632 has overall PCB dimensions of 18 x 29 x 6 mm that make it ideally suited to highly space constrained applications Different sensor nodes can be implemented using the same PCB with minor modifications related to the sensor The first sensor device is ISP120909A Bluetooth Low Energy BLE Wireless Temperature Detection Sensor using TMP112 from Texas Instruments The second one is ISP120911A Bluetooth Low Energy Wireless Light Detection Sensor using APDS 9300 from Avago Technologies The last one is ISP120901A Bluetooth Low Energy Wireless Orientation Motion Detection Sensor using MMA7660FC from Freescale Semiconductor The Bluetooth Smart sensor nodes described herein are slave devices may be used in a wireless sensor network to capture environmental information and send it back to a base station Master 1 2 Bluetooth Low Energy Wireless sensor nodes The design of Bluetooth Smart sensor nodes contain low power System in Package SiP module ISP091201 the low power host microprocessor LPC1114FHI33 302 NXP and low power sensing device as presented in Figure 1 Low Power Low Power Sensor uProcessor Coin cell battery Heeei Module Sensor BLE Autonomous Figure 1 Schema Block of Bluetooth Smart sensor modules June 1 2015 Page 71 2 Document Ref isp ble Catalog R2 3 docx HE a Insight SiP Green Side 400 avenue Rouman
64. 142170180 AA 00 z TEST SITE No 395A D i 240 2 24810MHz No DE LABORATOIRE gt ik w k wu 2 MH ziti 4 OW 0 0025W BR Hy Grant 07 22 2014 Application Dated 077162014 ISSUED TO insight SP DELIVREA gt Ty Emi A TYPE OF EQUIPMENT ype of Emission soa p gt BLUETOOTH DEVICE Frequency and Antenna Power TRADE NAME AND MOOEL ISP1 1C1MT P ISP130301C134 CERTIFIED TO CERTWIE SELON LE gt CAHIER DES ARGES EDMON mx RX ik AM ISPI130301 Model Name of Equipment Comtcanon of equaprmert means only that he equpmert hn met me La cemticamon Gu maene sigrehe seviernent que le matene a satstat aux Manufacturer Name Sg NN enema A penus we by incusry Caraca thie satstasse et cornue de satrstere aus emgences et ma w E amp S it mere gt lectincal spectcators biures ot ma ECC Rule Parts Certification Number imss spioficatons JO BY TELEFICATION BV RECOGNIZED CERTPICATION BODY BY INDUSTRY CANADA E 4 r at D PAR TELEACATION BY ORGANISME DE CERTIFICATION RECONNY PAR INDUSTRIE CANADA a ak E Lk AA PERZSE 6A23A hereby attest that the subject equipment was tested and found in compliance with the above noted specification Date of Certification Jafteste par la pr sente que le mat nel a fart l objet d essai et a t jug conforme a la sp cification ci dessus i Certificate No WIM Joag DATE 22 July 2044 BY WJM Jong 142180643 AA 00 Manager Product Certification LROLBD BREPBWAOUB 1 HOMEICIMI lt THROWER DOT
65. 2 ISP130603 Interface Board schematic SC 130604 a S ALE ai OP et June 1 2015 Page 5 2 Document Ref isp ble Catalog R2 3 docx ae Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1p j5 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Pag 7 without written permission Specification subject to change without notice Ins igh Insight Sif iP SiP APPLICATION N s r It s all in the package Ty m 1 x ISP130603 1 x ISP130601 1 x ISP131001 Interface Board Test Board Sensors Board 5 x ISP130301 module samples 1 x J Link Lite CortexM 9 JTAG SWD Emulator wn 1 x nRF51822 Development Dongle PCA10000 sa NORDIC 1x Battery Holder CR2032 1 x FPC jumper cable 22 pin 1x Lithium Battery cr2032 1 x FPC jumper cable 14 pin 1 x FPC jumper cable 10 pin 1 x 10 pin connector 1 x 2 lead patch cable 1 x USB cable 1 x 5V power supply a June 1 one Page 5 3 Document Ref isp_ble_ Catalog_R2 3 docx nsic IP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip con Qs The intonation contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insi
66. 2 8 bits received es 0 002 Tperiod otal charge per cycle of 1second Po w gt jos ion lt x gt Z 3 lt n 4 1 Measurements second O E aa __ 33 48 uA lt SS BLE stimated Average Current ensor TEMP112 ooajizc TO alTimetosendtouPvialac S otal Charge per measurement T wda S otal charge per cycle of 1second 2990 28 ama yO stimated Average Current d a 299A SE Sensor LL al et w ok oO lt 3 4 2380 2C Time to communicante to Sensor read time 3400 Time before Host Needed to transmit bits S es O _5978 4 1 Measurements second po 5838 8A DP o es cf 52 30 uA due to standby alone Re T otal ed re po tts Ida TE oaea Autonomy SSSA Table 14 Temperature sensor node Consumption calculating model 4 2 Consumption Calculating model of Light sensor node Table 15 presents calculating model of total current consumption of light sensor node The specifications of each subset for one measurement per second are described below Module BLE nRF8001 1 connection per second 4 bytes data size Average consumption 40 10 uA Microprocessor LPC1114FHI33 302 1 connection per second 4 bytes data size Average consumption 17 68 UA June 1 2015 Page 21 26 Document Ref isp ble Catalog _R2 3 docx tre Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophi
67. 2015 Page 5 6 Document Ref isp_ble_ Catalog _R2 3 docx ae Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 ae sen a The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 303 O 4 4 4 ISP130603 Interface Board ISP130603 is the application type interface board that has dimensions of 86 x 80 mm RS232 port header 22 pin FPC 10pinFPC 14 pin FPC RXD and TXD connector connector connector Equivalent to PORTO Current ISP130603B measurement Motherboard ill ER voc sens MP V C SENS2 VCC _nRF Al 2 VCC_App gt Wee Voltage Equivalent A VCG App RE T measurement to PORTI a VDD_PA a aine aatia Reset button RS232 port header Supply connector RTS and CTS 5V DC Equivalent to PORT2 Omnia de Not used Motherboard Equivalent Ppp s to PORT3 enable jumper on nRFgo Motherboard JTAG RS232 serial port connector Set App Vcc connector Vcc in mV 500 Jumpers The ISP130603 electrical schematic is presented in document SC130604 4 5 nRF51822 Development Dongle PCA10000 The reader should refer to the corresponding paragraph in nRF51822 Development Kit User Guide document en a June 1 2015 Page 5 7 Document Ref isp_
68. 2419 AE J ClientCharacteristicConfiauration CharactensticContiqurationBits Notification 00011 il Attribute value UUID Ox Handle Ont Display as UTF8 Log 08 43 42 2 Received a HandleValueN otification on handle 0017 with value 63 16 43 44 2 Recerved a HandleValueN otification on handle 0077 with value b2 8 43 45 5 Received Connection Parameter Update Request 18 43 45 5 ConmectonParameterL pdateResponse sent with ACCEPTED response 18 43 45 5 Connection Parameters Update sent Conninterval 500 Ome SlaveLatency 0 Supervision Timeout 4000 0me 8 43 46 2 Received a HandlevalueN otification on handle 001 with value 61 16 43 46 2 Recerved a HandlevalueN otification on handle 00177 with value 60 8 You can note Battery voltage is sent by the ISP130601 Test Board to the Master Emulator via the Bluetooth link The application is written to send a value that changes cyclically Important notification The nrf51 sdk _v6 0 0 examples are only compatible with SoftDevice 110 nrf51822 7 0 0 due to some API changes in the release You can use nrf51_sdk_v5 2 0 instead if you need to use SoftDevice s110_nrf51822 6 0 0 June 1 2015 Page 5 15 Document Ref isp_ble_Catalog_R2 3 docx Ta Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 The information contained in this document is the property of Insight SiP and should not be disc
69. 2A Intel R 82801G ICH Family USE Universal Host Controller 27CB Driver Details To view details about the driver files Intel R 82801G ICH Family USB2 Enhanced Host Controller 2720 USB Composite Device USE Mass Storage Device USB Root Hub USB Root Hub e If the device fails after updating the driwer roll gt USE Foot Hub back to the previously installed driver USB Root Hub USE Root Hub USB Serial Converter 4 USB Serial Converter B zag Update Driver To update the driver for this device Uninstall To uninstall the driver Advanced Device Manager olx USB Serial Converter B Properties x Fie Action view Hel meee 2 General Advanced Driver Details e M E amp emn zaa fae USB Serial Converter B 9 Processors SCSI and RAID controllers Sound video and game controllers S Storage volumes J System devices Universal Serial Bus controllers Generic USB Hub Intel R 82801G ICH Family USB Universal Host Controller 27C8 Intel R 828016 ICH Family USB Universal Host Controller 27C9 Intel R 82801G ICH Family USB Universal Host Controller 27C4 Intel R 82801G ICH Family USB Universal Host Controller 27CB Intel R 82801G ICH Family USB2 Enhanced Host Controller 27CC USB Composite Device USB Mass Storage Device USB Root Hub USB Root Hub USB Root Hub USB Root Hub USB Root Hub USB Serial Converter 4 USB Serial Converter B
70. 30301 4 2 ISP130601 Test Board ISP130601 is the basic application test board that has dimensions of 18 x 30 mm ISP130601AZ 2013 51 C0004 Wii ania Wiii eeii June 1 2015 Page 5 5 et Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i csi ay The information contained in this document is the property of Insight SIP and should not be disclosed to any third party 53 without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 It encloses ISP130301 BLE module 3 x FPC connectors in order to access the nRF51822 GPIOs 1x10 pin FPC connector on top side of the board 1x14 pin FPC connector on top side of the board 1x22 pin FPC connector on bottom side of the board The ISP130601 electrical schematic is presented in document SC130602 4 3 ISP131001 Sensors Board ISP131001 is the sensor application board that has dimensions of 12 5 x 25 mm It encloses ISP130301 BLE module ST Micro LPS331AP temperature and barometer sensor Freescale FXKOS8700CQ 6 axis linear accelerometer and magnetometer sensor Rohm SML P11MTT86 mini LED Software to read drive the sensors Removable 10 pin FPC connector for software loading The 1SP131001 electrical schematic is presented in document SC 131002 June 1
71. 4 30501 Similarly according to Figure 20 the total charge consumption of the light sensor node in the Standby sleep phase Phase 2 is about Opnase 2 530uF x 0 024V 12 72uC So the total average current consumption of the of light sensor node for the period Tperioa 15 is of the order of Qphase 1 Qphase 2 period 1S Ls I 55 12 12 72 WA 67 84 uA As we have already seen the current consumption of the light sensor node is higher than the temperature sensor node in the two phases of operation For the communication phase Phase 1 this increase in current consumption of the light sensor node is related to the larger number of bytes to measure and to send For the Standby sleep Phase 2 this increase is due to a higher current consumption of light sensing device compared to temperature sensing device cf Table 4 2 3 3 Orientation Motion sensor node Figure 21 shows the measurements of total current consumption of orientation motion sensor node for the two functioning phases Phase 1 Phase 2 carried out by the capacitor method for measurement time Connection Interval of 1 second Tek Agi Acq Complete M Pos 5 7005 7 CURSOR i Type w Source Blissey pth gap Cursor 1 7 ae Phase 1 i zai i sh ee ae i Ay Phase 2 Cursor 2 a ay i 1 34 CH2 100m M 500ms CH2 2 85V CH2 vertical position 20 52 divs 2 059 Figure 21 Orientation Motion sensor node total current consump
72. 5 808 Time between measurements 1 Measurements second otal charge per cycle of 1 second Po 7950 208 stimated Average Current ee 7 95 UA E Sensor ime to send to uP via I2C a lalele a 33 jos oO lt O N BaS l 2 Waitingtime besfore Host O O Time before Host o O Toa charge pern O OOOO SS O oo 0 006 Total charge percycle ofisecond erste A O Estimated Average Current vew mmr p o Total estimated current CSN 65 72 Ae cf 65 72 WA die ta standby alone pa Total lifetimeforcriesx2 m 21ihor L oS O Table 15 Light sensor node Consumption calculating model 4 3 Consumption Calculating model of Orientation Motion sensor node Table 16 presents calculating model of total current consumption of orientation motion sensor node The specifications of each subset for one measurement per second are described below June 1 2015 Page 21 27 Document Ref isp_ble_Catalog_R2 3 docx H fs Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party jitez f i without written permission Specification subject to change without notice Dp j Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 s Module BLE nRF8001 1 conne
73. 8K 18 c ht c 2014 Nordic 5 d All Rights R d Eq Source Code t a c main c 3 Thie information anes herein is property of Morais Semiconductor ASA EES Libraries 4 eS eee ee ee eee _ ARDIC a P ble_advdata c gt JLink Cortex Error CAKeil VSARNAPACK NordicSemiconducto nRF DeviceFa i 2 app_timer c 7 ormation NO 2 app_button c g n removed from softdevice_handler c 9 Cannot Load Flash Programming Algorithm H ble_debug_assert_handler c 10 fj ser_codecs 11 H 3 ser_codecs_mw 12 H ser_utils 13E H ser_hal a i P ES H ser_hal_serial 16 CMSIS 17 H Q Device 18 file 19 20 activation example 21 iled Cortex M0 22 23 24 25 26 27 E 28 include ble advdata h 29 include ble_dtm_app h 30 include boards h 31 include nordic_common h 32 include softdevice_handler h 33 34 define DIM_INIT_BUITON_PIN NO BUITON_0O lt Button to initializing DIM mode on co 35 36 define READY LED PIN NO LED 0 lt LED indicating that the example is re 37 define DTM_READY LED PIN NO LED 1 lt LED indicating that the connectivity 38 define ASSERT _ LED PIN No LED 7 lt Is on when application has asserted 39 E Project 00x Functions Op Templates lt i n Build Output q Watchpoints 2 a JTAG speed 2000 kHz Insufficient RAM for Flash Algorithms 2I E Errors annas Download failed Cortex M0 4 mt i r JLink Info FPUnit 4 code BP slots and 0
74. 9 10Hz Figure19 Light sensor node total current consumption measurements during Phase 1 as measured by capacitor method Tek AN Acq Complete M Pos 6 5305 CURSOR Type a E AREE EREA aq KOLON eW 240m aaea Cursor 1 LUSOT Z EE 1 601 CH2 100m M 250ms CH2 2 59 16 May 13 23 15 lt 10Hz Figure 20 Light sensor node total current consumption measurements during Phase 2 as measured by capacitor method According to Figure 19 the total charge consumption of the light sensor node in the communication phase Phase 1 is about Opnase 1 530uF x 0 104V 55 12 uC This is also consistent with measurements made for the BLE module and the microprocessor by the oscilloscope method Table 7 and Table 8 where Qp 41 25 uC andQ p 11 7 uC The difference between the two measurements Is the consumption of the sensing device during the communication phase Phase 1 SOQsensor 55 12 41 25 11 7 2 17 uC June 1 2015 Page 21 20 Document Ref isp ble Catalog R2 3 docx tr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party j without written permission Specification subject to change without notice of apt Insight SP APPLICATION NOTE It s all in the package AN
75. A 29 0 mm June 1 2015 Page 15 4 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f eee without written permission Specification subject to change without notice ops Insight Si iP APPLICATION NOTE It s all in the package ISP 1 209071 AN130402 Orientation Motion Sensor Demonstration Introduction This application note describes the PC software setup to use the ISP120901 accelerometer demonstration program The demonstration requires a ISP120901 accelerometer with a 1632 battery a Windows PC running XP Vista or Windows 7 a Nordic Semiconductor Master Emulator nRF2739 delivered with uBlue SDK and appropriate software from Insight SiP The note describes the software installation procedure and the operating mode Software Installation In order for the demonstration to operate the following software packages need to be installed on the PC Microsoft NET framework 4 Microsoft XNA Framework Redistribuable 4 0 Nordic Semiconductor nRF8001 SDK v1 7 for Master Emulator USB drivers Accelerometer Demo folder from Insight SIP with executable file and dil files Microsoft NET framework 4 Re distribuable package This can be downloaded from Microsoft at the foll
76. A E Ff gt N C p i It s all in the package i _ l L day a eS a we a gt CSS a 7 d SS j 1 Tai D i y i N q f E a y I y ON d k wT we 13 Click Back and LED A prompt will invite you to pair the Sensors Board with the iPhone Click Pair The LED lights up 3 Bluetooth Pairing Request InsightSIP_ lt would like to pair with your iPhone 14 To switch off ISP131001 Sensors Board disconnect battery holder as seen in the figure below E ee r June 1 2015 Page 14 8 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fF without written permission Specification subject to change without notice Insight SiP It s all in the package BLE SENSOR ISP120901 ISP120901 Bluetooth Low Energy Wireless Orientation Motion Detection Sensor Key Features Single Mode BLE v4 0 Slave Module Based on Nordic Semiconductor uBlue family Includes transceiver baseband software stack Fully integrated RF matching and Antenna Integrated 16 MHz Crystal Clock Ultra Low Power Consumption Coin cell battery CR1632 or CR1620 Low Power 3 Axis Orientation Motion
77. Bm Channels 0 to 39 RF Frequency tolerance A Channel 0 to 39 as Level for BER Rx sensitivity 87 70 dBm lt 0 1 ideal Tx WMeaevande Open field at 1m g height EIRP Rx sensitivity 3 Mechanical Outlines 18 0 nm 6 0 nm Dimensional drawing 29 0 mm June 1 2015 Page 17 4 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 209 o9 AN130404 Temperature Sensor Demonstration Introduction This application note describes the PC software setup to use the ISP120909 temperature demonstration program The demonstration requires a ISP120909 Temperature Sensor with a CR1632 battery a Windows PC running XP Vista or Windows 7 a Nordic Semiconductor Master Emulator nRF2739 delivered with uBlue SDK and appropriate software from Insight SiP The note describes the software installation procedure and the operating mode Software Installation In order for the demonstration to operate the following software packages need to be installed on the PC Microsoft NET framework 4 Nordic Semiconductor nRF8001 SDK v1 7 for Master Emula
78. Coupling By Limit 200MHz volts 0iy Prasei ej 200m M 25 0ms CH1 J 462m CH4 200m 25 Apr 13 23 36 20 0002Hz Figure 8 Light sensor node 2 functioning phases of BLE module and microprocessor as measured by oscilloscope method To measure the current consumption of BLE module and microprocessor during phase 1 simply measure the voltage and duration of each segment of consumption displayed on the oscilloscope as presented in Figure 9 Tek JM Trig d M Pos 11 30ms CHI Coupling Sensor u Conversion Time B Limit 200MHz volts Diy Probe 10 Voltage Invert CH2 200m MM 5 00ms CH2 J 60 Sm CH4 200m 25 Apr 13 23 31 3 939533Hz Figure 9 Light sensor node current consumption measurements of BLE module and microprocessor as measured by oscilloscope method June 1 2015 Page 21 11 Document Ref isp_ble_Catalog_R2 3 docx tr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party j without written permission Specification subject to change without notice m k at j Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 For the microprocessor current consumption measurements in light sensor node we have two consumption segments 2 52 ms and 0 92 ms as presented in Figure 9 The cor
79. DEV AIT ISPO91201 Applications Possible applications include Sports accessories movement etc Healthcare accessories heart rate Alarms temperature excess Pressure detection The miniature size of the Insight solution means it could be comfortably worn or is able to fit into a small space Please refer to the application note AN120102 for more information on kit implementation Specific Skills If a product developer lacks skills in any of the crucial areas to develop a working solution then Insight SIP can offer custom design services to cover all of the following areas Custom hardware development Addition replacement of different sensors Software development Custom SIP development Document Ref isp_ble_Catalog_R2 3 docx i Insight SiP It s all in the package BLE DEV AIT ISPO91201 June 1 2015 Page 8 2 Document Ref isp ble Catalog R2 3 docx if Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S PO9 4 2 O 4 AN120102 Use of ISP091201 DK1 Introduction Scope This document gives details on hardware and software for using and testin
80. Date will be 6 months after Last Order Date i e 12 months after PDN DISCLAIMER Insight SiP s products are designed and manufactured for general consumer applications so testing and use of the product shall be conducted at customer s own risk and responsibility Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment Please also pay attention i to apply soldering method that don t deteriorate reliability ii to minimize any mechanical vibration shock exposure to any static electricity ili not to overstress the product during and after the soldering process The products are not designed for use in any application which requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party s life body or property including and not limited to i aircraft equipment ii aerospace equipment ili undersea equipment iv power plant control equipment v medical equipment vi transportation equipment vii traffic signal equipment viii disaster prevention crime prevention equipment The only warranty that Insight SiP provides regarding the products is its conformance to specifications provided in datasheets Insight SiP hereby disclaims all other warranties regarding the products express or implied
81. During firmware modification and debug the ISP140501 device may be supplied via the DC voltage from the ISP130603 interface board eee GS Oba ore4c June 1 2015 Page 10 1 Document Ref isp_ble_Catalog_R2 3 docx fice ee Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com PE esight SP The information contained in this document is the property of Insight SiP and should not be disclosed to any third party epee LE 4 without written permission Specification subject to change without notice OF ay Insight SiP BLE BEACON It s all in the package ISP 41 405071 Contents 1 Elecrical Specta ONS eenia E a ara aaa ai rai inn inate Page 10 2 2 Rr PETOM O ee a casera osenteue a cnsesenceneeus acne nseaeeue aetna neuaeeanctaeeapeuaeenctueaneue Page 10 4 IVE Canal QUITS S araen aantedeuesitesesan saa iossn casascantac eins stueesameetweanceesascantecoseectas santas ee ces Page 10 4 1 Electrical Specifications Current Consumption The measured total average current consumption and autonomy of the ISP140501 sensor node supplied by CR2450 or AAA battery for several connection intervals is shown below 2 x AAA Autonomy Connection Interval Peak Current ETE OEN CR2450 Autonomy Consumption U mA ua aad w p o er a a Example with one battery CR2450 600 mAh two batteries type AAA 1 5V 2400 mAh for 2 batteries Limited by the battery
82. EE ERER EErEE EREE JU 001 9 _ 629 140209 o i A TI p O a O es amp amp isp_bl dU 00L 9 8z9 9LQN9 0SGNO E 1 40z09 doy aN9 109 GND ISP120901 19S OZ OdT 30A vas Z 8H NOY 17 LOZON 90N9 BAILOV aa doy aN9 zn MOIS NAGY Pano SaN9 ZOSEEIHAPLLLOdT la YLI YOSNIS doy GND doy AN9 Document Ref ano ZONO doy GNO BLE SENSOR USX Jequinu yeg 4M 1 9 ano AAAAAAAA g9 gt pEGNO ESON9 12 zo ope wSX s9quNU ed ante Sam doy ONS ANS 1 40z09 1 10z09 08 99A an be idee iS gt e ZOPr0 Loz QNS OND k lH 4u 0l 9 AU 001 9 traN9 08790A zzo 40 doy AN9 1 10z09 1 10z09 JUNON JON OQ 0402 gbe xo3 JALOV aN9 Ox 1 40201 WRs01109 J8qWNN Hed osin 77 JOLVW0891 L9 00SIN 8 00Id OdWO 089L19 013SS 2 001d ison er tLVW0891 19 01ISOW 6 001d Od O 1891L9 8 LOld omg ay TeLVWN 089119 0M0S 0F 001d TOMS SIT ASK i oa LLYW 189119 90V 01LOld nut 6r 9 oz 2 2 cock LYW 082 10 00 11 001d 4 COLEEIHAVLLLOd 3S axed Loa OdVO LEZELO Ldv 0 LOld Y ZLYW 08ZELO LNOW1O 1 0Old NOY LZ 6 LONS 200 ez OLY LEZELO ZAV V LOldY 0 00ld Lasay TE EINEN osi eano 7 zz ISSA SANS V7 dor ano E90 LLYW LEZELO QY Z7LOld Y YLa 07ZOla jX o doy GNOND WYO 001 Y NAGY vz 9 0N9 ein oy CONS Z L 1070Y 4 509 12qwnu yed dd 01 9 _ _ gto n 1 40209 ace 3 Page 15 3 Green Side 400 avenue Roumanille BP 309 06906 Sophia Anti
83. Flight app Join with a new account a testflightapp com Create a new TestFlight account and get access to beta apps for lnsignise You are now a tester for the InsightSiP team In order to install applications via TestFlight on your iOS device you need to connect your device to TestFlight Thanks for using TestFlight Connect your Device By clicking Sign Up you agree to TestFlight s Terms of Use amp Privacy Policy Sign Up a Pen June 1 2015 Page 14 4 Document Ref isp ble Catalog R2 3 docx iia ere Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com p The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice feat j Insight SiP APPLICATION NOTE It s all in the package ISP 41 31 007 4 Connect your device It will create a TestFlight icon on your device a testflightapp com a testflightapp com o Reconnect Device TestFlight Reconnect this device by installing profile Connect Device TestFlight Access _ Device successfully connected jm testflightapp c i e n j You will receive an install email w yo when a build is available Verified QOO HeloTenfight 1 3 243 is now avaliable Le Sis CEF Lelle Reconnect Device reeralpy te
84. Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com tE a SP The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ar 7 without written permission Specification subject to change without notice ole June 1 2015 x k Insight SiP BLE SENSOR It s all in the package ISP 41 20909 Contents 1 Elecrical Specta ONS eenia E a ara aaa ai rai inn inate Page 17 2 Z RPP MAC SS ser E E Page 17 4 NECA NC a OUNO S aa E A E siete nenanc ocean aatenennencoreno Page 17 4 1 Electrical Specifications Current Consumption The measured total average current consumption and autonomy of the ISP120909 temperature sensor node supplied by a CR1632 battery for several connection intervals is shown below Connection Interval Average Current Consumption Autonomy CLE HA year LA Sensor Performance The performance of the temperature sensor is that obtained by the Texas Instruments TMP112 Key characteristics are shown below Parameter Value Unit Temperature range 40 to 125 June 1 2015 Page 17 2 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 r The information contained in this document is the property of Insight SiP and should not be disclosed to any th
85. It s all in the package ISP 1 303071 ANT 6 Quality amp User information Certifications FCC Identifier 2AAQS ISP130301 Certificate N 142180643 AA 00 CE Complies with 1999 5 EC EN300328 V1 8 1 Statement N 142140199 AA 00 IC Certification N 11306A ISP130301 Telefication N 142170180 AA 00 TELEC certification N 001 A03467 Bluetooth SIG certified N D024444 RoHS compliant USA User information This intends to inform how to specify the FCC ID of our module ISP130301 on the product Based on the Public Notice from FCC the host device should have a label which indicates that it contains our module The label should use wording such as Contains FCC ID 2AAQS ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below FCC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation Caution Any Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment CANADA User information This intends
86. LES OFFICES amp CONTACTS HEADQUARTER INSIGHT SIP Green Side 400 Avenue de Roumanille BP309 06906 Sophia Antipolis Cedex France Phone 33 0 4 93 00 88 80 Email contact insightsip com Web www insightsip com ISRAEL CIDEV ELECTRONICS Habanai 3 St Hod Hasharon P O Box 1552 Zip 45115 Israel Phone 972 73 70 01 212 Email site cidev co il Web www cidev co il JAPAN INSIGHT SIP J 1405 Cl Heights 1380 Yamazaki cho Machida shi 195 0074 Tokyo Japan Phone 81 42705 5170 Email aki tsukagoshi insightsip com Web www insightsip com KOREA ESUPPLY Room 408 Yu Sung Bldg 43 1 yeoido dong yeongdeungpo gu Seoul Zip 150 889 Korea Phone 82 2 782 7744 Email sales esupply co kr Web www esupply co kr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France Visit us at www insightsip com
87. Manager Product oN This certificate has one annex HATERETS RY This is to certify that above type certification has been granted in accordance WwW with the provisions set out in Article 38 24 Paragraph of the Radio Law 2 PRODUCTS AvA C 224 FR 6238 RURA FLAALY VIF VY Fuses Telecom Engineering Center June 1 2015 Page 2 1 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com r The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP QUALITY It s all in the package ISP091201 certifications iets gt tetet ication cy E Statement of Opinion No 13214144 AA 00 declares that to our opinion the listed product complies with the essential requirements in accordance with Article 3 of the Directive 1999 S EC as indicated under Annex 1 of this statement E S L Bluetooth End Product Listing With respect to Chapter 10 of the Telecommunications Act of The Netherlands Telefication The B uetooth S j G Hereby Recog n izes Product e res Low Energy Module with antenna radem sight SiP ee Type og 1sP091201 Member Company Serial No Hard Software release No DjRev D ISPO91 201 Gnietied Desk Hane Manufacturer Insight SiP Address 13 Chemin d
88. Minor 245 New Beacon is successfully added OK Event At beacon Action Show Mona Lisa Enable Wireless by Nordic Wireless by Nordic i A Beacons Update 8 Go to Beacons windows and see the notification about the Beacon detection on your device To switch off ISP140501 Beacon remove battery June 1 2015 Page 12 8 Document Ref isp_ble_Catalog_R2 3 docx pF Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Sa without written permission Specification subject to change without notice ale at Insight SiP It s all in the package BLE SENSOR ISP131001 ISP131001 Bluetooth Low Energy Wireless Accelero Magnetometer Temperature and Barometer Detection Sensor Key Features Single Mode BLE v4 0 Slave or Master Proprietary 2 4 GHz protocols 4 Based on Nordic Semiconductor nRF51 family 2 4GHz low energy RF Transceiver 32bit ARM Cortex MO CPU with 256kB Flash 4 Analog and Digital peripherals Ultra Low Power Consumption Single 2 1 to 3 6 V supply Overall Size 12 5 x 25 x 3 mm Temperature 25 to 75 C Fully integrated RF matching and Antenna Integrated 16 MHz and 32 768 kHz Clocks Coin cell battery CR2032 Low Power 3 Axis Accelerometer Det
89. ON NOTE It s all in the package i S P 4 2 o9 O 4 Both Displays should change and be updated every 100ms ra Vv ww nen x a Accelero 4 EG Proximity Accelero Demo i O06ZWXON g Open Device name Proximity Accelero App 0 14062 0 1 03125 Perfom device di lt 0 0475 0 1882 1 81577 i Received Accelero g_x Value update notification 0 1875 ra Received Accelero g_y Value update notification 0 ED Received Accelero g_z Value update notification 1 078125 DRC ISPO90401_ Tech SELECT Received Accelero g_x Value update notification 0 1875 Report_Insi 5 0 Received Accelero g_y Value update notification 0 Received Accelero g_z Value update notification 1 078125 a Received AttHandle alueNotification on pipe number 2 with value 043F15 Received AttHandleValueNotification on pipe number 2 with value 030016 asseport_ Top_Pour dsn A me r Desktop zip Internet status IXFE x g ga Log Explorer y As the orientation of the module changes so will the position of the aircraft on the Left Hand Screen tJ Accelero a x E J Proximity Accelero Demo f alx OO6ZWXON Open Device name Proximity Accelero App Accelerometer_1 0 14062 0 5156 0 89062 SME 0 4636 0 2709 2 63449 Received Accelero g_x Value update notification 0 140625 r Desktop zip Internet status XFE r w Log Explorer i NS a _ Received Acceler
90. P Demo Connect lt Back Connect Accelerometer InsightSIP_wi Temperature LED June 1 2015 Page 14 6 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice a eae Insight SiP APPLICATION NOTE It s all in the package ISP 41 31 O01 11 Click Accelerometer A Calibration phase invites you to rotate the 1SP131001 Sensors Board Then a starship on your iPhone screen follows the Sensors board movement lt Back Accelerometer Calibration Please rotate your sensors Rotation X Rotation Y Rotation Z m e e June 1 2015 Page 14 7 Document Ref isp_ble_Catalog_R2 3 docx ark Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i n ssn The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ay without written permission Specification subject to change without notice ope e _ i Hi ba lt r TD ee E U Wa E Ma H Can EN lt 4 Lz ay A N d n q d A L SE l ba T _ zz ea i
91. P120909 is an autonomous low power device for wireless temperature detection and transmission The complete device makes use of Insight SiP ISP091201 BLE module together with low power host processor digital temperature sensor and small primary button cell battery CR1632 or lower capacity CR1620 Overall size of the device is 18x29x6 mm The host processor that handles the autonomous sensor application the high level portion of the BLE protocol stack and communication with the temperature sensor is a low power 32 bit MCU ARM Cortex M0 based the NXP LPC1114FHI33 302 integrating 56kB flash memory and 8kB SRAM The Texas Instruments TMP112 a digital temperature detection sensor is used to detect room temperature transmitted via the I2C bus The TMP112 TMP112 is capable of reading temperatures to a resolution of 0 0625 C It is specified for operation over a temperature range of 40 C to 125 C An interface board ISP120907 is available from Insight SIP and allows for easy flash programming the LPC1114FHI33 302 application processor via the 14 pin FPC connector During firmware modification and debug the ISP120901 device may be supplied via the DC voltage from the ISP120907 interface board An optional UART interface TP1 TP2 with direct connection to the nRF8001 uBlue is available for BLE radio testing as specified by the Bluetooth standard m k mbi m Page 17 1 Document Ref isp_ble_Catalog_R2 3 docx mp Ap
92. RANTY of ANY KIND is provided This heading must NOT be removed from the file fw defgroup dtm standalone main c Bi ingroup ble sdk_app dtm serial brief Stand alone DTM application for UART interface include lt stdint h gt include lt stdbool h gt include nrf51i h include nrf 51 bitfields h include ble dtm h include boards h include nrf gpio h Beo Fu Op Te nm Build Output J LINK J Trace Cortex 3 Click Build Target and Load 4 If you have the next error message it means that you have not enough RAM to flash algorithm Pretec June 1 2015 Page 5 17 Document Ref isp ble Catalog R2 3 docx ee l Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 EN sin sP The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ha without written permission Specification subject to change without notice ol T ae Insight SiP APPLICATION NOTE It s all in the package ISP 41 303071 File Edit View Project Flash Debug Peripherals Tools SVCS Window Help Cena 2 2 c H S ERA B E R v Haralo o semma SHS e S sy nrf51822_xxab_s110 aie oh E amp Project a E an _xxab_s110_spi Copyright c 2 ordic Semiconductor ights Reserved E nrf51822_xcab_s110_spi 12
93. Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 ne sa i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party at ot without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package ISP 41 303071 Direct Test Mode Loading 1 Start Keil uVision Version 4 or 5 2 Select Project then Open Project in order to open ble_app_dtm located in the S110 folder as in 5 1_Proximity Application Loading Z D Nordic Semiconductor nRF51 SDK_v5 0 0 34603 Wordic nrf51 822 Board nrf6310 ble ble_app_dtm arm ble_app_dtm uvproj pVision4 File Edit View Project Flash Debug Peripherals Tools SVCS Window Help 43 PR A E defineR PN NuME S ae Q eod H a Pe nf51822 xaa 2560 YN Aae amp Project GEI A E maine 9 nrf51822_xxaa 256K lt q Startup Code system_nrf51 c arm_startup_nrf51 s Sy Source Code main c lt 4 Libraries E ble_dtm c Copyright ic 2012 Nordic Semiconductor All Rights Reserved The information contained herein is property of Nordic Semiconductor ASA Terms and conditions of usage are described in detail in NORDIC SEMICONDUCTOR STANDARD SOFTWARE LICENSE AGREEMENT OTInoOhWONeH Licensees are granted free non transferable use of the information NO WAR
94. Signalyzer cll 31 Ko Application Extension O9f 8 2012 2 31 PM Ulpbt all 200 Ko Application Extension O9ff8 2012 2 51 PM UlpbtUtils ll z6 ko Application Extension 09jzajz0lz 2 31 PM Hardware Setup Master Emulator Connect the nRF2739 Master Emulator to the PC and check to ensure that the USB drivers are correctly installed This can be checked on the Control Panel Device Manager under USB Controllers USB Serial Converter A USB Serial Converter B June 1 2015 Page 18 2 Document Ref isp_ble_Catalog_R2 3 docx a bert Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com TEG s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Epa without written permission Specification subject to change without notice ola ir Insight SiP APPLICATION NOTE It s all in the package i S P 14 2 o9 o9 Should both be installed see below for details Device Manager USB Serial Converter A Properties File Action View Help gt amp ae Processors SCSI and RAID controllers General Advanced Driver Details of rs USB Seral Converter 4 w Sound video and game controllers aie Storage volumes Driver Provider NOARDICSEMI System devices Driver Date 3 18 2011 z Universal Serial Bus controllers Behan 39140 BS Generic USB Hub Intel R 628016 ICH Family USB U
95. Sophia Antipolis Cedex France www insightsip com G on The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ieee without written permission Specification subject to change without notice mje Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 RO201_ RO201_T Figure 4 Electric Schema of current measurement for oscilloscope measurement method On the measurement board an INA195 amplifier Texas Instruments with gain 100 is used to amplify the differential voltage across the ends of each resistor So by measuring the voltage at the output of each INA195 we measure the current consumption J V 0 5 of each subset then the total current consumption The high gain of the INA195 allows us to measure relatively low currents 2 2 1 Temperature sensor node Figure 5 illustrates the two functioning phases of BLE module and microprocessor measured by oscilloscope method for temperature sensor node Tek lL Trig d M Pos 2 3560rms CH1 ka Coupling Bi Limit L Ott nel AE SSS naiita i Volts Div Probe 10 Voltage Invert Phase 1 fav 00my M 25 0rms CH1 462m CH4 200m 25 Apr 13 23 52 10 0001Hz Figure 5 Temperature sensor node two functioning phases of BLE module and microprocessor as measured by oscilloscope method To measure the current consumption of BLE module and microprocessor during phase 1 simply measu
96. TION NOTE It s all in the package AN 4 3050741 Temperature sensor node BLE module Consumption Time Voltage Current Charge A ms mV mA uC de HD 18 20 res TO 480 OS Total 6 5 34 36 Table 6 Temperature sensor node current and charge consumption measurements of BLE module as measured by oscilloscope method For Temperature sensor node for example if we define just one service with data size of 2 bytes and for connection interval of one second the estimated current consumption is about 35 04 uA as presented in Figure 7 This is consistent with our measurements presented in Table 6 where the measured charge is 34 36 uC thus _ Qmeasured _ 34 36 uC _ 34 36 uC leneasived B The measurement time Connection Interval of one second corresponds to parameter Tperioa iN Figure 3 which is the sum of Phase 1 time and Phase 2 time If we consider that the current consumption of BLE module in Phase 2 is negligible 2 uA cf Table 2 so our measurements using oscilloscope method during Phase 2 are consistent with the data sheet and specifications given by the constructor 34 36 uA Device nRF8001DX D v Setup ID 0 Security Hardware Settings Current Consumption Input Average current consumoton 0418 Connection inteval 1000 00 ms From RF 70 pA 4 gt 4 gt PTEE From link layer 5 63 pA ver interv a nt From host processing 15 73 pA Master clock accuracy pp
97. The pad layout follows the QFN Jedec standard for 2 row LGA parts Pads 1 thru 56 are signal pins 0 4 x 0 4 mm Pad 57 is an exposed metal pad that is connected to ground The NC pads are 0 8 x 0 8 or 0 4 x 0 4 mm and are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability drop test E oje June 1 2015 Page 6 2 Document Ref isp_ble_Catalog_R2 3 docx oH ac Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com res The information contained in this document is the property of Insight SiP and should not be disclosed to any third party h without written permission Specification subject to change without notice m k Insight SP ANT BLE MODULE It s all in the package ISP 1 303071 ANT Pin Name Pin function Description 6 NC NotConnected Isolated pad on application PCB for mechanical stability 8 NC NotConnected Isolated pad on application PCB for mechanical stability 9 PO17 Digitali O General purpose I O pin S O This pin is the RF I O pin of the BLE module It should be connected to Pin 26 OUT_ANT for normal operation During certification the pin may be connected via to an RF connector for module measurement using a Bluetooth test setup This pin is connected to the internal antenna It should be connected to Pin 24 OUT MOD for normal operation During certification the pin
98. Time Voltage Current Charge EP mV a T e e E A E E Y A S es 480 y geo 096 Total 1 89 41 25 Table 8 Light sensor node current and charge consumption measurements of BLE module as measured by oscilloscope method 2 2 3 Orientation Motion sensor node Figure 10 illustrates the two functioning phases of BLE module and microprocessor measured by oscilloscope method for orientation motion sensor node a June 1 2015 Page 21 12 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party jd without written permission Specification subject to change without notice F Insight SP APPLICATION NOTE It s all in the package AN 4 30501 Tek aot bon Trig d Mi Pos 3 000rns TRIGGER Type Source i a 4 Oma eee Be ama slope Rising Mode Coupling Phase 1 fi 200m MM 25 0ms CH2 2 d 0m CH4 200m 24 May 13 16 00 10Hz Figure 10 Orientation Motion sensor node 2 functioning phases of BLE module and microprocessor as measured by oscilloscope method To measure the current consumption of BLE module and microprocessor during phase 1 simply measure the voltage and duration of each segment of consumption displayed on the oscilloscope as presented in Figure 11 Tek A Trig d M Pos 13
99. XC So by measuring the time constant on the oscilloscope we can calibrate the capacitance that we will use to accurately measure the current consumption Figure 13 shows the discharge curve of the measured RC circuit June 1 2015 Page 21 15 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package AN 4 305041 Tek Iyi Acq Complete M Pos 780 0ms CURSOR Type Source t 530 0ms aq 1 88rH 3 064 Cursor 2 460rms 14 1 124 CH1 200m CH2 500m M 250ms CH2 279V Use multipurpose knob to mowe Cursor 1 Figure 13 Discharging curve of RC circuit to calibrate the measurement capacitance as measured From Figure 13 the time constant is 530 ms so the precise value of the capacitance is E 530 ms ikom VW Once the capacitance is calibrated we applied the capacitor measurement method to measure total current consumption Figure 14 shows the electric schema for measuring the total current consumption of sensor nodes using capacitor measurement method Switch Module under test Figure 14 Electric schema to measure the total current consumption of sensor nodes using capac
100. _Demo_E E File Folder m emp Lum Cenc EXE File Folder mi Renommer ce dossier iy D placer ce dossier E Copier ce dossier ee Publier ce dossier sur le Web Ea Fartager ce dossier A Envoyer les fichiers de ce dossier par courrier lectronique x Supprimer ce dossier Autres emplacements BLE Mes documents Cy Documents partag s 4 Foste de travail t Favoris r seau D tails Temp_Lum_Demo_ExXE File Folder Date de modification April 25 2013 2 47 PM ee June 1 2015 Page 18 4 Document Ref isp_ble_Catalog_R2 3 docx pi pe Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 209 o9 Launch Proximity Temp Lumino Demo exe on some systems you may need to launch using run as administrator Temp_Lum_Demo_EXE Seles Fichier Edition Affichage Favoris Outils 7 ae Pr c dente 7 j pi pa Rechercher i Dossiers Adresse C users BLE Sensors Temp_Lum_ Demo EXE ka OK A Wom Taille Type Gestion des fichiers d S Acid i ko Application Extens a 35 ermulatorlibs dll 2 179 Ko Application Extens mi Renommer ce Fichier a z a a hci
101. _coder dll 45ko Application Extens iy D placer ce fichier 8 hci_coder_net dll 27 Ko Application Extens Copier ce fichier TronPython dll 1 750 Ko Application Extens Ee Publier ce Fichier sur le web TronPython Modules dil 637 Ko Application Extens Envoyer ce fichier par IronPython xml 399 ko Document AML courrier lectronique ILINKARM dll 4 427 Ko Application Extens 4 Supprimer ce Fichier log txt lko Document texte MasterEmulator dll 35ko Application Extens z MasterEmulator xml 77 Ko Document mL Autres emplacements Microsoft Dynamic dll 1 020 Ko Application Extens GS Sensors Microsoft Dynamic xml 360 ko Document MIL a Microsoft Scripting dil 141 Ko Application Extens D Mes documents Microsoft Scripting Metadata dl 91 ko Application Extens i Documents partag s Microsoft Scripting Metadata xml 17 Ko Document XML q Poste de travail Microsoft Scripting xml 201 Ko Document MIL J Favoris r seau Proximity Temp Lumino Demo ex 1 lt u 233 Ko Application E Proximity Temp Lumino EE 56ko Fichier PDB P Prozimity Temp Lumino Demo wshost exe 12 Ko Application Details x Proximity Temp Luming Dema vshosk exe manifest lko Fichier MANIFEST ProximityDemo vshost exe manifest 1ko Fichier MANIFEST Proximity Temp Lumino pylibs dll 1 425 Ko Application Extens Demo exe Segger dll 12Ko Application Extens Application ae a e eee Signalyzer dll 31 Ko Application Extens ate de modification April 16 2013 11 01
102. a Antipolis Cedex France www insightsip com lt ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Die r i without written permission Specification subject to change without notice m apt Insight SP APPLICATION NOTE It s all in the package AN 14 3050171 s Light sensing device APDS 9300 Measurement time 20 ms 2 13 7 ms Average consumption 7 95 uA The total average consumption is around 65 72 uA which makes an autonomy of 0 24 year using a coin cell battery CR1632 that has a capacity of 140 mAh nRF8001 BLE urrent mcu_ll Charge nC Notes Needed for Xtal Startup Tpost processing Radio Tpre processingRadio __ 1200 _1920 Tpre processing Radio 3504 Assumes 1 packet with payload of 4 bytes 8 4 bytes 700 100 us interframe space 3200 4 Assumes 1 packet with payload of 4 bytes mcu_host 24800 Needed to transmit bits to Host processor house keeping otal Charge for 4 8 bits received a 38114 1984 21 otal charge per cycle of 1 second Po 4098 66 a ee ee eee eee M er 3 Plelw E alallala lu oje J O 1 1 N Slelezlsailalsj oO x a x lt os n w ok o lt oO de 1 Measurements second stimated Average Current WW _ m ensor APDS 9300 D 0 2 20000 4800 26 ms measurement time conversion time 2ajiac otal Charge per measurement Po 4 4 0 0032 Shutdown 9799 40 313
103. ae ole eg 101000121 O ee ee ee ee eee Te Page 15 4 Si WE Cai UTES E nese a E AE tonsa casascantac E A A santa ee aes Page 15 4 1 Electrical Specifications Current Consumption The measured total average current consumption and autonomy of the 1SP120901 orientation motion sensor node supplied by a CR1632 battery for several connection intervals is shown below Connection Interval Average Current Consumption Autonomy ms HA year Sensor Performance The performance of the motion sensor is that obtained by the Freescale MMA7660FC Key characteristics are shown below Parameter Value Unit Acceleration range g 9 81m s Number of bits for full range for each axis PB Data sampling rate each sample is 3 axis acceleration data June 1 2015 Page 15 2 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice ir LLON9S zr 1 Olti Odd 00t Osreos doy aN9 g Olti Odd OOP 08p 0S ee YOSN3S 990A WYO 6 Y ey 1 Loz0w WU 6 E u or en m 17 10z04 343099LYWN YLI YOSNSS OS099ZVINW g_R2 3 docx p gt HONS SYOND yoq GND p gt OLGND 7 ZMS 8 MLOrzdDAS e_Catalo Olvl dd 00t 08p 0S EE
104. all in the package ISP 1 30301 6 Storage amp Soldering information Moisture Sensitivity All plastic packages absorb moisture During typical solder reflow operations when SMDs are mounted onto a PCB the entire PCB and device population are exposed to a rapid change in ambient temperature Any absorbed moisture is quickly turned into superheated steam This sudden change in vapor pressure can cause the package to swell If the pressure exerted exceeds the flexural strength of the plastic mold compound then it is possible to crack the package Even if the package does not crack interfacial delamination can occur Since the device package is sensitive to moisture absorption it is recommended to bake the product before assembly The baking process for dry packing is 24 hours at 125 C ISP130301 has been tested MSL 5 according to standards After baking modules can be exposed to ambient room conditions approximately 30 C 60 RH during 48 hours before assembly on the PCB Soldering information Recommendation for ROHS reflow process is according to Jedec J STD 020 and 033 standard profiles T DA l tare 2 Max Ramp Up Rate 3 C s Max Ramp Down Rate 6 C s N Temperature gt Time gt gt Preheat Soak 260 C Temperature Min Tsmin 150 C 0 5 C Temperature Max Tsmax 200 C Classification Temperature To 260 C Time ts from Tsmin tO Tsmax 60 120 sec Time tp maintained above Tc 5 C 30 sec
105. all in the package ISPOO 1 2071 322 6 LACES SEE DETAIL D VACUUM PICKUP CELLS 315 0 8 PLACES are BUMPS 6 CENTER CELLS 2 SIDE CELL 11 PLACES SEE DETAIL E a SEE SHT 2 X 4 ix Loo e OC O ss S BEN i rn a PEF hes nates 135 9 aha hada E 15 30 e Pp T Na ee SOENS SEESE P a 14 40 SEE DETAIL B Oe ee DETAIL C SEE DETAIL F 11 90 SEE SHT 2 gt Ly SEE SHT 2 CHAMFER 3 0X45 14 70 L6 R es 285 6 0 25 ITEM NO EI 0 76 SEE DETAIL H BXR2 54MAX al ee SEE DETAIL G 2 54 239 3 Tape and Reel ISP091201 modules are also available in Tape amp Reel They are delivered in sealed pack with desiccant pack and humidity sensors Reels are proposed in standard quantities of 500 units 180mm 7 reel or 2000 units 330mm 15 reel only Please refer to tape size below Complete information is available on request vi T Po a 0 30 0 05 4 00 201 dD Pe Ao 830 01 Saas Bo 1330 01 ECTIN Y 60 O 50 0d Pr 1200 o 240 47 03 June 1 2015 Page 7 13 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notic
106. alue 04001CFB0821D1018E01F300 17 30 44 6 Received a HandleValueNotification on handle OO0E with value 00001 0FBF820EC018401F100 8 You can note data that transit between the 1SP131001 Sensors Board and the Master Emulator via the Bluetooth link Data of the accelerometer magnetometer on the above left figure Data of the temperature pressure on the above right figure 9 To switch off 1SP131001 Sensors Board disconnect battery holder as seen in the figure below June 1 2015 Page 5 21 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 6 2 On iPhone or iPad Device The Sensor application is available on demand from Insight SiP The iOS App is a demonstration App that is provided as is in order to demonstrate the Smart Bluetooth sensor node Only one iPhone or iPad is allowed per development kit Make sure you iOS device is compatible with Bluetooth 4 0 iPhone 4S or higher iPad Air Mini 3 generation and above The installation procedure for the Sensor application
107. aster Control Panel 2 Make sure the Development Dongle is detected The Master Emulator item list should show COMnn xxxxxxxxx nn gives the COM port number xxxxxxxxx is the SEGGER serial number printed on the dongle Restart the application if it doesnt appear in the item list Before continuing make sure you have selected the correct device by verifying the serial number in the item list with the serial number printed on the Development Dongle 3 When you use the Development Dongle for the first time you must first program it with the Master Emulator Firmware a Inthe Master Control Panel menu click File and select Flash Programming b Click Browse This opens a browser that automatically points to the location of the c mefw_nrf51822 lt version gt _firmware hex lt version gt will be replaced by a number d giving the version of the actual firmware e The Master Control Panel Firmware file is located in f C Program Files x86 Nordic Semiconductor Master Control Panel l lt version gt firmware g pcal0000 MEFW_nRF51822_ lt version gt _firmware hex h Select the Master Emulator Firmware file and click Open i Click Program to start programming the selected device j When the programming is finished click Exit to go back to the main window 6 Click Select Device 7 On the following display click successively on Bond Service Discovery and Enable Services June 1 2015 Page 5 14 Insight SiP Green Side
108. ationBits Notification 0001 PrimaryService 041887 PrimaryService 01887 CharacteristicDeclaration Properties Write Characteristic UUID 0x244C CharacteristicD eclaration Properties Write Characteristic UUID 0x244C UUID 244C No values read UUID 244C No values read y gt s Attribute value Attribute value UUID 0 Handle Ox Pie Sete UUID Ox Handle 0s Breyer ULES Value hex text Value hex text Log Log 17 23 50 9 Received a HandleValueNotification on handle 0012 with value E4E6F10151EA3D00 17 30 44 4 Received a HandleValueNotification on handle 0012 with value 55 8F60197EB3D00 17 29 50 9 Received a HandleValueNotification on handle OO0E with value 04001 8FBFO20E 0019201E 700 17 30 44 4 Received a HandleValueNotification on handle OOOE with value F4FFICFBFO20E8018C01F500 17 29 51 0 Received a HandleValueNotification on handle OOOE with value E4FF1CFBFC20E 4018001FD00 17 30 44 4 Received a HandleValueNotification on handle OOOE with value F9FF1SFBF420EE019201F800 17 29 51 0 Received a HandleValueNotification on handle ODDE with value ESFFO4FBF420E 301 7401D800 17 30 44 5 Received a HandleValueNotification on handle DODE with value 04001 4FB0821ED017D01EF00 17 23 51 0 Received a HandleValueNotification on handle 0012 with value E2E6E 301B3E93D00 17 30 44 5 Received a HandleValueNotification on handle 0012 with value 45E8ED0124E43D00 17 29 51 1
109. aunch Accelero exe on some systems you may need to launch using run as administrator C users BILE Sensors Accelero_Demo_EXE Eek Name Size Type Date Modified File and Folder Tasks a Accelero pdb 62KB PDB File 4 16 2013 4 10 PM 3 Moke a new Folder accelero exe 4 236 KB Application 4 16 2013 4 10 PM l 9 pylibs dl 1425KB Application Extension 9 28 2012 2 31 PM va ora this Folder to the 23 emulatorlibs dl 2179KB Application Extension 9 28 2012 2 31 PM g Shara this folder hci_coder all 45KB Application Extension 9 28 2012 2 31 PM 8 MasterEmulator dll 38 KB Application Extension 9 28 2012 2 31 PM 3 Ulpbt ail 200 KB ApplicationExtension 9 28 2012 2 31 PM Other Places 9 Signalyzer dll 31 KB Application Extension 9 28 2012 2 31 PM 9 Segger all 12KB Application Extension 9 28 2012 2 31 PM Sensors hci _coder_net dll 27KB Application Extension 9 28 2012 2 31 PM B My Documents 2S Ulpbtutils dl 26KB Application Extension 9 28 2012 2 31 PM Shared Documents S Aci dll 12KB Application Extension 9 28 2012 2 31 PM F fy Compete 2 JLinkARM dll 4422KB Application Extension 9 28 2012 2 30 PM 3 Microsoft Scripting dll 141 KB Application Extension 9 28 2012 2 29 PM My Network Places Microsoft Dynamic dl 1020KB Application Extension 9 28 2012 2 29 PM 3 IronPython Modules dll 637 KB Application Extension 9 28 2012 2 29 PM S IronPython dll 1750KB Application Extension 9 28 2012 2 29 PM Details 2
110. be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPOO 1 2071 Contents 1 Elecmical SP OCIICAl ONS eesriie a ie aiaa En aaa ia ra anainn binanan binnan Page 7 2 2 RPFP IC SS se EEE E Page 7 5 Sir FOGUCE IDEVEIOOMMCIL TOOS osipe neces secascaidaceutnstiesaanscenoseasteaasenidasametenossesendoetence Page 7 8 4 Mechanical Outlines cccccccccseececeeeeeeeeeeceeeeeeeeeseeeeseeeeeseseseeeeeseeeseaeesseeeeseaeessaeeeseeeesaneeesees Page 7 9 IPAKO vatsukescadsutiansadhicsdacgiteadsc acdsands sSesaatsaddsdadsubisantiadesandaulesantiadesanesnbasaat addoandsulesantiacdoaacaite Page 7 12 6 Storage amp Soldering Information cccccecccsescccseccceseceseeeeseeeeeseeeesseeeeseeeesseeeeseeeesseeesseeeesenees Page 7 14 TOUV ee WI SEF MALO OP e settee eee ett E E dence eeteaeNeleetends Page 7 15 1 Electrical Specifications Electrical Performance Temperature range 40 to 85 C Parameter Min Supply Voltage Static levels Peak current receiver active Peak current transmitter active Current drain connection less state Current drain between connection events Pin Assignment Pin Name Pin function Description Not Connected Isolated pad on application PCB for mechanical stability OUT_ANT Antenna In Out This pin is connected to the internal antenna It should be connected to Pin 7 OUT _MOD for normal op
111. ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice oe Insight SiP APPLICATION NOTE It s all in the package ISP 41 303071 5 Basic Application using ISP130601 Test Board 5 1 Basic BLE Proximity Application This paragraph shows you how to set up and program a BLE proximity application on top of a SoftDevice that will send data on a Bluetooth link from the ISP130601 Test Board to the Master Emulator In order to use Bluetooth Low Energy radio the software is loaded in 2 parts S110 SoftDevice using nRFgo Studio hex file no source Proximity Application using Keil uVision4 Then Master Emulator is connected and Proximity Application is launched 110 SoftDevice loading 1 Connect the SEGGER J Link board to the ISP130603 Interface Board with the 10 pin flat cable 1 27 mm pitch provided in the Development Kit 2 Connect the provided USB cable from the J link board to your computer 3 Connect the ISP130602 Test Board to the ISP130603 Interface Board with the 10 pin 14 pin and 22 pin FPC jumper cables 0 5 mm pitch provided in the Development Kit 4 To ensure that power supply starts correctly disconnect Enable ju
112. capability via software partner Applications Space constrained BLE Slave Devices Sport and fitness sensors Health care sensors Out of Range OOR sensors Personal User Interface Devices PUID Remote controls Case Study A leading watch manufacturer required a Bluetooth Low Energy solution in a metal cased watch The product requirement was to integrate the BLE elements onto the main circuit board of the watch Insight SIP designed the BLE RF elements including a matched PCB antenna The antenna was specifically designed to meet the constraints of the metal housing The RF matching elements were placed optimally in the tiny Space reserved on the watch board For more information visit us at www insightsip com or email us at sales insightsip com June 1 2015 Page 22 1 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party y Document Ref isp_ble_ Catalog _R2 3 docx eT sight SiP I s P Las without written permission Specification subject to change without notice mE r Insight SiP BLE MODULE It s all in the package CUSTO M DESIGN June 1 2015 Page 22 2 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 So
113. ce Insight SiP It s all in the package APPLICATION NOTE ISP140501 4 Select your Beacon name Beacon Config FR 28 A 3 05 N Beacons UPDATE You have 0 beacons active Add beacon Wireless by Nordic 5 Click to add Beacon 6 Wait until Beacon led turns back to purple X AP 44 A 3 53 Y Beacons BEACONS UPDATE DFU MODIFY BEACON PROPERTIES UUID MAJOR MINOR CALIBRATED RSSI dBm CONNECT Wireless by Nordic X FTR 44 B 3 54 Select device AVAILABLE DEVICES Beacon Config FD F8 C1 93 B6 DC 7 Your beacon is successfully added you can modify the parameters of the beacon in the configuration option change the name the major and minor values the notification X FTA 45 3 54 f Scanning June 1 2015 Page 12 5 DX BP 45 Hl 3 55 lt me N Beacon config H nRF Beacon IDENTITY 01122334 4556 6778 899a UUID abbccddeeff0 MAJOR 1 MINOR 1 61 EVENT Near 4 ACTION Show Mona Lisa jal ENABLED Wireless by Nordic gt Beacons Document Ref isp_ble Catalog R2 3 docx Heke Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com PE s X FTE 45 A 3 55 BEACONS UPDATE DFU nRF Beacon E ren Far Near At beacon Wireless by Nordic The information contained in this document is the property
114. cept pairing requests from any peer device HF It demonstrates the use of fast and slow advertising intervals include lt stdint h gt dh owe m Lee ln te ee ee Te Birr po 0 Fu O te xi i Build Output _J LINK J Trace Cortex Ll June 1 2015 Page 5 11 Document Ref isp_ble_Catalog_R2 3 docx es 4 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 hs Ae The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ha without written permission Specification subject to change without notice cae i Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 3 Click Build Target and Load If you have this message after click Load it means that the power is not enough and you have to increase the voltage by adding jumpers on the interface board JLink Cortex M Error You can also load the hex file generated after building target with keil uVision by nRFgo studio in the program application File View nRF8001 Setup Help Features x SEGGER to use 4 24 GHz 4 Front End Te TX carrie RX const TX RX c RX sensit 4 Bluetooth nRF8001 Co Dispatcher Trace Transl Direct Test nRF8002 nRF51822 CEAADOO 0x004d Region 1 Application Program Application Programming of A
115. cification subject to change without notice g Insight SIP BLE MODULE It s all in the package ISPOO 1 2071 Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane size 40 x 100 mm size 40 x 100 mm Cell phone config 1 with side ground plane Return loss dB Cell phone config 1 ground plane Cell phone config 2 with side ground plane Cell phone config 3 with side ground plane USB dongle ground plane 2 9 freq GHz SSS ays 7 June 1 2015 Page 7 7 Document Ref isp_ble_ Catalog R2 3 docx a n Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPOO T 207 3 Product Development Tools Interface As ISP091201 is designed for operation in the peripheral role it offers you an easy way to add Bluetooth low energy connectivity to your application ISP091201 integrates a serial interface ACI for configuration and control from your microcontroller In the following the microcontroller is referred to as the application controller The Application Controller Interface ACI is the logical interface between ISP091201 and
116. continuous plane under the module in the host The ISP091201 is labeled with its own FCC identification number FCC ID xxx ISP091201 when installed into host the outside of the host must display a label with the wording Contains FCC ID xxx ISP091201 as specified by the CFR47 part15 212 a VI In order to respect FCC regulation additional metal shield ISP091205 must be implemented following the recommendation below Note that shield installation is only related to FCC compliance It has absolutely no influence on the module performance and the ISP091201 can operate according to the present specification with or without the shield Shield installation as used for Antenna zone FCC part 15 212 certification tests Shielding of RF circuit a June 1 2015 Page 7 15 Document Ref isp_ble_Catalog_R2 3 docx p gt Fenn Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 ah ey The information contained in this document is the property of Insight SiP and should not be disclosed to any third party r ee E without written permission Specification subject to change without notice ale ad i Insight SiP BLE MODULE It s all in the package ISPOO 1 201 Shield installation land pattern a Shield SM aperture 750 KER width b 2 ES Module A edge to shield trace edge Co C O d2 Mechanical drawing of
117. ction per second 3 bytes data size Average consumption 38 79 uA Microprocessor LPC1114FHI33 302 1 connection per second 3 bytes data size Average consumption 17 54 uA Orientation motion sensing device MMA7660FC Measurement time 15 ms 2 8 5 ms Average consumption 6 40 uA The total average consumption is around 62 72 uA which makes an autonomy of 0 25 year using a coin cell battery CR1632 that has a capacity of 140 mAh current mA ime ios Imul 8 5 Tstart 3504 Assumes 1 packet with payload of 3bytes 8 3bytes 4700 Total Charge for 3 8 bits received 88 lidle 0 002 Tperiod 992369 _1984 738 1 Measurements second O oO oS O Total charge per cycle of 1second o o 3878638 oo O Eoo M eo A ee o oo a T o T T ee Estimated Average curet e pe LSS L Ll C oo jon lon 0 294 12c SO _1764fTimetosendto uP vial2C o Total Charge per measurement T ana o O Total charge per cycle of 1second O Z o Z L 6397 52 ee so A sensor Oooo OU A Estimated Average Current Ooo 4 Waiting time besfore Host Of O Timebefore Host S y O Total Charge per Tx Rx J TP Total charge per cycle of tsecond 7539 6 7 Estimated Average Current 7 Sau SP iii Total estimated current 62 72 ee cf 62 72 uA due to standby alone e a O l O E Lifetime for cR1632 233zo hou S O A ic A Table 16 Orientation Motion sensor node Consump
118. cx ai Petr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ah ey i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f F without written permission Specification subject to change without notice er Insight SiP BLE MODULE It s all in the package ISPOO 1T 207 Discontinuity Normally a product will continue to be manufactured as long as all of the following are true The manufacturing method is still available There are no replacement products There is demand for it in the market In case of obsolescence Insight SiP will follow Jedec Standard JSD 48 A Product Discontinuation Notice PDN will be sent to all distributors and made available on our website After this the procedure goes as follows Last Order Date will be 6 months after the PDN was published Last Shipment Date will be 6 months after Last Order Date i e 12 months after PDN Disclaimer Insight SiP s products are designed and manufactured for general consumer applications so testing and use of the product shall be conducted at customer s own risk and responsibility Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment Please also pay attent
119. d from www nordicsemi com after purchasing ISP130301 DK1 nRF51 Software Development Kit SDK nRF51 SDK can be downloaded from www nordicsemi com after purchasing ISP130301 DK1 It contains example of source codes applications C language Precompiled HEX files Source code Keil ARM project files IAR project files GCC project files a June 1 2015 Page 3 9 Document Ref isp_ble_ Catalog _R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Te without written permission Specification subject to change without notice 1 zl adi m F Insight SiP BLE MODULE It s all in the package ISP 41 303071 4 Mechanical Outlines Mechanical Dimensions Dimensional drawing for 8 x 11 x 1 2 mm 57 Pad LGA Package A PAN 1 INDICATOR CO3mn June 1 2015 Page 3 10 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 41 30301 SMT Assembly Guidelines
120. des We present next the current consumption of the three subsets of Bluetooth Smart sensor node module BLE microprocessor and sensing device temperature light and orientation motion according to their data sheets Then we present two measurement methods of current consumption to each subset and or total current consumption 2 1 1 BLE module Microprocessor and Sensing device current consumption Figure 3 illustrates the principle of current drain profile for a typical Bluetooth low energy BLE module ISP091201 that is connected Figure 3 a It illustrates also the principle of current drain profile for the microprocessor LPC1114FHI33 302 Figure 3 b and for the sensing device Figure 3 c For the BLE module each connection event consists of the following states and operations different periods related to each connection event as presented in Figure 3 a The current consumption profile is related to each state and operation The numbers and related currents below correspond to that displayed in Figure 3 Radio pre processing period Imcu_tt and Istandby Active radio receive time lrx Radio Inter frame Space ltrs Active transmit time lrx Link layer post processing period Imcu 11 Data post processing period enabled only if data has been received Imcu_Host OoorWDND ors June 1 2015 Page 21 4 Document Ref isp_ble_Catalog_R2 3 docx tie ah i Insight SiP Green Side 400 avenue
121. document is the property of Insight SiP and should not be disclosed to any third party S without written permission Specification subject to change without notice Insight Si ANT BLE MODULE It s all in the package ISP 1 303071 ANT Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane size 40 x 100 mm size 40 x 100 mm Cell phone config 1 with side ground plane Return loss dB Cell phone config 1 ground plane Cell phone config 2 with side ground plane Cell phone config 3 with side ground plane USB dongle ground plane freq GHz June 1 2015 Page 6 8 Document Ref isp_ble_Catalog_R2 3 docx F Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com atl The information contained in this document is the property of Insight SiP and should not be disclosed to any third party pe Sha without written permission Specification subject to change without notice m a 5 Insight Si SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT 3 Product Development Tools Interface ISP130301 ANT integrates a full microprocessor interface with up to 32 General Purpose I O pins GPIO and several functions 2 x SPI 2 x 12C UART 8 x ADC SWDIO interface Development Tools and Software The following development tools and software are recommended for us
122. e Insight SiP BLE MODULE It s all in the package ISPOO 71 2071 6 Storage amp Soldering information Moisture Sensitivity All plastic packages absorb moisture During typical solder reflow operations when SMDs are mounted onto a PCB the entire PCB and device population are exposed to a rapid change in ambient temperature Any absorbed moisture is quickly turned into superheated steam This sudden change in vapor pressure can cause the package to swell If the pressure exerted exceeds the flexural strength of the plastic mold compound then it is possible to crack the package Even if the package does not crack interfacial delamination can occur Since the device package is sensitive to moisture absorption it is recommended to bake the product before assembly The baking process for dry packing is 24 hours at 125 C ISP091201 has been tested MSL 5 according to standards After baking modules can be exposed to ambient room conditions approximately 30 C 60 RH during 48 hours before assembly on the PCB Soldering information Recommendation for RoHS reflow process is according to Jedec JN STD 020 and 033 standard profiles Temperature gt k Time 25 C to Peak Time gt gt Preheat Soak Peak package body temperature T 260 C Temperature Min Tsmin 150 C ial To 0 5 C Temperature Max Tsmax 200 C Classification Temperature Tc 260 C Time ts from Tsmin to Tsmax 60 120 sec Ti
123. e BLE node for which only the addition of a suitable DC power source is necessary for proximity or Out of Range applications Sensor applications require only the further addition of the appropriate sensors As the module has several end applications the antenna was designed to be compatible with several ground plane sizes such as USB dongle or cell phone ofato June 1 2015 Page 3 1 Document Ref isp_ble_Catalog_R2 3 docx p ch a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com tae EA s y The information contained in this document is the property of Insight SiP and should not be disclosed to any third party BETA without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 1 303071 Contents 1 EIOCINICAll 5 DCCINICANIONS aceteen cece ieee cece bean secsdawteedebaatendsieatsudedaceseetiectsadedregeeettanteadeinenieathextiaceioeteed Page 3 2 2 Ar PEONATI Page 3 6 Sit FOGUCE DEVEIODIMGIL TOGIS a ricccoscedacacatnsasansdeioeanctanacconiesassousetosamncgdesssaledascnatnsosmesintosanntaiacsentes Page 3 9 4 Mechanical Outlines ccccccccssceceeceseeeteneeceeeeseeeteeeseeeeeaeeteueesseeesueeteueeseeteneeteeeseeetsneenaees Page 3 10 Os CK AGING danacccatendieaddtnsnentateacencenttamud A cane alddesd teucamedsehesanidandcusdebeatentsnndaanteke Page 3 13 6 Storage amp Solderin
124. e la halte Qualified Design ID s BO17595 City 06130 Grasse Country France Contact Paraon Chakib EL HASSAN Sar This statement is granted to Searing Publish Data 12 September 2013 Name Insight SiP Address 13 Chemin de la halte City 06130 Grasse Country France EPL Type Other Ths Certificate acknowledges the Bivetootn Specticatons declared by the member were achieved 9 accordance wth ihe Bluetooth Qualification Process as specified within the Bluetooth Specifications anc s8 required within the current PRD This statement has THREE Annexes Bluetooth n piuetooth y N W J_M Jong PRODUCTS Manager Product Certification RvA C 274 telefication Prorat telefication on i Chamber of Commerce 1565536 m www telefication com G Industry Canada Industrie Canada p TCB A mon TECHNICAL ACCEPTANCE CERTIFICAT D ACCEPTABILITE CERTIFICATE TECHNIQUE SEOANE a p 11306A ISP091201 E i p 13217179 AA 00 TEST SITE No No DE LABORATOIRE p gt 3699A 1 ro P INSIGHT SIP Bluetooth Device TYPE OF EQUIPMENT ge GENRE DE reper p Limited Modular Approval erie p gt Insight SiP 1SP091201 CERTIFIED TO SPECIFICATION CERTIFIE SELON LE gt CAHIER DES CHARGES Saas NOT TRANSFERABLE EQUIPMENT AUTHORIZATION is hereby issued to the named GRANTEE and is VALID ONLY for the equipment idenfified hereon for use under the Gasiontion of exripennat meaass caly al the eqpipeneet ies mel La certification du mat riel signifie seul
125. e label of the host device should also include the below FCC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation Caution Any Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment CANADA User information This intends to inform how to specify the IC ID of our module ISP130301 on the product According to Canadian standards RSS 210 and RSS Gen the host device should have a label which indicates that it contains our module The label should use wording such as Contains IC 11306A ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below IC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation
126. e modules can be personalized to meet customer specific requirements and technical constraints Design Successes Insight SiP has designed a series of ultra miniature wireless modules for various applications such as 3G 4G LTE 60Ghz ANT Antenna Tuning BLE Bluetooth GSM W CDMA GPS Glonass ISM NFC RFID Wireless Sensor Modules Software Define Radio Transfer Jet Ultra miniature Antennas UMTS UWB WHDI Wifi WLAN Zigbee Customers Insight SiP has a diverse client base which includes tier one OEM s leading chipset vendors and hi tech innovative startup companies June 1 2015 Page 1 4 Document Ref isp ble Catalog _R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP QUALITY It s all in the package CERTIFICATIONS ISP130301 certifications lacie Statement of Opinion No 142140199 AA 00 Q D L Bluetooth Qualified Design Listing Wah respect to Chapter 10 of the Telacommunications Act of The Netheriande Telescation declares that to our opinion the listed product complies with the essential requirements in accordance with Article 3 of the Directive 1999 S EC as indicated under Annex 1 of
127. e of both microprocessor and sensing device greater the level of current consumption by consequence In the next paragraph we present two complementary methods for current consumption measurements The first one using oscilloscope to measure the current consumption of BLE module and microprocessor during the connection phase Phase 1 where the consumption is maximum The sensing device consumption is very weak of the order of a few uA we will see that this measurement method using just the oscilloscope is not suitable for measuring low currents Thus we have developed another method based on the principle of charging and discharging a capacitor to measure the total current consumption including low consumption sensing device In addition this method can measure the total consumption during the Standby sleep phase Phase 2 where current consumption of each subset is very weak 2 2 Oscilloscope measurement method Oscilloscope measurement method is a simple one based on fact to connect a low value resistor 0 5 Ohm to the power feed of each subset BLE microprocessor and sensing device as presented in Figure 4 These resistors have been integrated into the wireless miniature nodes Voltages at each end of the resistance are returned to a measurement board by means of FPC cable for this purpose June 1 2015 Page 21 7 Document Ref isp ble Catalog _R2 3 docx HE oa Insight SiP Green Side 400 avenue Roumanille BP 309 06906
128. e or on your android device click Update and Connect 3 Onthe beacon push the switch SW2 to pair with the device the led become orange 4 Select your Beacon name Beacon Config About Beacons Update Cancel Beacon Config Configure Beacon Device UUID Please touch on Navigation bar to add new Beacon Major For Nordic Semiconductor Beacon touch Update tab at the bottom and there connect to your Beacon and then add Minor Calibrated RSSI it from there CONNECT Wireless by Nordic ES n T T A Jndate A oO Wireless by Nordic 5 Click to add Beacon 6 Wait until Beacon led turns back to purple June 1 2015 Page 12 7 Document Ref isp ble Catalog R2 3 docx Z Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ine Sri without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package K S P 4 405 O 14 7 Your beacon is successfully added you can modify the parameters of the beacon in the configuration option change the name the major and minor values the notification lt Beacons Configuration ill About Beacons nRF Beacon nRF Beacon IDENTITY Near UUID 01122334 4556 6778 899A ABBCCDDEEFFO Major 1 RRO Aaa
129. e with offices Asia and North America Design Service We make complex RF systems easy to integrate in any existing or future portable application We contribute to reduce our customer s product development cycle and accelerate their product release to market The RF design methodologies we have developed help solve the issue of portability while allowing for greater integration This novel design methodology is aimed at allowing easy transfer of integrated passive circuit design from one supplier to another and even from one technology to another The turn key design services for highly integrated solutions we propose is based on a unique design methodology that ensures close to first pass design success We deliver timely high performance and cost effective solutions Antenna in Package AiP solutions Insight SiP is leading system miniaturization where the antenna is no longer a separate component within the wireless device but is integrated in the package thus the concept of antenna in package or AiP Today in each mobile device there are numerous Communication modules and it is understandable that the integration of the antenna into the module brings a huge advantage in terms of cost and performance Modules Insight SiP proposes ready to use RF modules to module manufacturers and ODMs They are the optimal solutions for designers looking to add wireless connectivity to a product without a complex and time consuming development cycle Thes
130. easurement times Connection Interval are described in Table 13 Orientation Motion sensor node Connection Phase 1 Phase 2 Average Total Autonomy Interval ms uC uC Consumption uC year Table 13 Orientation Motion sensor node measurements results June 1 2015 Page 21 24 Document Ref isp ble Catalog R2 3 docx HE Liri Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party iene r without written permission Specification subject to change without notice O ea ee Insight SP APPLICATION NOTE It s all in the package AN 4 30501 4 Model Measurement Comparison In this section we present a model for calculating current consumption of temperature light and orientation motion sensor nodes This model is based on the data sheets of the components that is to say the current consumption values of each subset BLE module microprocessor and sensing device as they are given in their data sheets This model can calculate the average consumption of each subset the total consumption and the autonomy of sensor nodes for different Connection Intervals and for different types of batteries 4 1 Consumption calculating model of temperature sensor node Table 14 presents the calculating model of total current consu
131. eccccseccceeeeeceeeseeeeseeeeceeeeeseeeeseesesseeeeseeeesseeeees Page 21 7 2 2 1 Temperature sensor node se siccetcciekedeencnds Cacierade tect rads lececukedestendececuandtiectinds Cwecededeouecits Page 21 8 2 2 2 UGA ONGO OOO nie deans end caen sees easencedaneedanaceanseadosansnsesc oseee esa edeneseanscnines Page 21 11 2 2 3 Orientation MOtion sensor NOCE ccceececeeeceeeeceeeeeeeseeeeceeeeeueeseeeeseeeseeeeseeesaeeees Page 21 12 2 3 Capacitor measurement method cccccccseeccceeeeceeeeeceeeeeeeeeeeeeeeseeeesseeeeseueesseeeeseeessaees Page 21 15 2 3 1 Temperature sensor node ccceccceeeccseecceeeceuceceeeceuceceueesaeecsueeseeessueeseueeneeessneens Page 21 17 2 3 2 LONCS OM NOUE eects rset erect ee ene cre densest tte Page 21 19 2 3 3 Orientation MOtion sensor NOE ccceeceeeeceeeeceeeeaeeeseeeeseeeeeeeeseueeseeeseeeeseeeseeeees Page 21 21 3 Measurement Results tes imcccsssnannmacindomtnenencminaienaiinenenremnemnan Page 21 23 3 1 Temperature sensor node ccccccecccsececeeecceeeceueecseecaucessueccueessuseseessusessueeaueessueeseeesags Page 21 23 2e g EO NOE eee i EE on ee eee eee ee nee eee eee Page 21 24 3 3 Ofrlentation MOtION sensor NOCE cccccccseccceecceeeceeeceuceceueccueecsueesseeceueessueeaeeesueenseesaas Page 21 24 4 Model Measurement Comparison cccccccccccccessseeeeeeeeeeesssssseeeeeeeeeeees Page 21 25 4 1 Consumption calculating model of temperature sensor n
132. ecification subject to change without notice Insight SIP BLE MODULE It s all in the package ISP 1 303071 Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane gain dBi 2 45GHz gain dBi 2 45GHz Ground Plane Effect Simulation e yo A USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane size 18 x 30 mm size 40 x 100 mm size 40 x 100 mm rae June 1 2015 Page 3 7 Document Ref isp_ble_Catalog_R2 3 docx A Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com pE The information contained in this document is the property of Insight SiP and should not be disclosed to any third party es Pai without written permission Specification subject to change without notice mee a Insight SIP BLE MODULE It s all in the package ISP 1 303071 Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane size 40 x 100 mm size 40 x 100 mm Cell phone config 1 with side ground plane Return loss dB Cell phone config 1 ground plane Cell phone config 2 with side ground plane Cell phone config 3 with side ground plane USB dongle ground plane es a June 1 2015 Page 3 8 Document Ref isp_ble_Catalog_R2 3 docx p es Insight SiP Green Side 400 avenue R
133. ection Low Power Temperature Barometer Detection Programmable controlled mini LED Certified CE FCC IC and TELEC 10 pin ERG J1 Flash UART Programming and external SWD Interface power Cimi 0 Accelerometer Magnetometer DORE FXOS8700CQ ARM M Clocks Cortex Temperature Barometer LPS331AP nRF51xxx LED ISP131001 Applications Sport and fitness sensors Health care sensors Industrial sensors Gaming sensors Motion detection and transmission General Description ISP131001 is an autonomous low power device for wireless acceleration temperature and barometer detection and transmission The complete device makes use of Insight SiP ISP130301 BLE module together with low power 3 axis accelerometer and temperature barometer sensors connected to a primary button cell battery CR2032 Overall size of the device is 12 5 x 25x 3mm The host processor that handles the autonomous sensor application the high level portion of the BLE protocol stack and communication with the sensors is a low power 32 bit MCU ARM Cortex MO based integrating 256 kB flash memory The Freescale FXOS8700CQ_ 3 axis linear accelerometer and 3 axis magnetometer is used to detect acceleration and is combined with ST Micro LPS331AP temperature and barometer sensor A Rohm SML P11MTT86 mini LED is also part of the board and is available to be controlled by software Data are transmitted via GPIO processor por
134. ed in Nordic Semiconductor user guide document R2 with nRF2740 board can be carried out with ISP110701 instead Two set up examples are shown in the following paragraphs ISP110701 Test Board Set Up for Testing with Direct Test Mode ISP110701 Carrier board nRF2735 nRFGo Motherboard nRF6310 Patch RS232 USB cable cable serial cable BLE Master Emulator Set Up nRF2739 BLE USB cable Master Emulator Of r June 1 2015 Page 9 6 Document Ref isp_ble_Catalog_R2 3 docx ra Pe ek l without written permission Specification subject to change without notice Insight SiP BLE BEACON It s all in the package i S P 4 405 O 4 ISP140501 Bluetooth Low Energy Wireless Beacon Detection Key Features Applications ee Sng ede eee ee ee Location sensitive information Based on Nordic Semiconductor nRF51 family ee Viakeiina or retailannolicaicns A E eee ove 4 Beacon ia es i Healthcare 4 32bit ARM Cortex MO CPU with 256kB Flash me etn Slide Sine Fully integrated RF matching and Antenna a Integrated 16 MHz and 32 768 kHz Clocks Ultra Low Power Consumption Coin cell battery CR2450 General Description Mini RGB LED 10 pins FPC connector for software loading ISP140501 is an autonomous low power device for Overall Size 33 x 33 x 8 7 mm wireless detection and transmission The complete Temperature 25 to 75 C device makes use of Insight SIP ISP130301 BLE module together with low power host processor a
135. ed to any third party te e without written permission Specification subject to change without notice oats Insight SP APPLICATION NOTE It s all in the package i S P 4 2 09 o9 On Panel click on Perform Device Discovery Ea Proximity Temp Lumino Demo i OO6OKaY4 m Open Proximity App Immediate alert level Off Low High Set Link loss level OT Low High Set IntervalMs TimeoutMs Latency 10 eoo o r5 4000 ms 3000 32000 ms 0 500 Ferom device discovery Setup assigned pipenumber 3 type TRANSMIT Setup add service 0217803 store REMOTE STORE Setup add char def 042406 Setup assigned pipenumber 4 type TRANSMIT WITH_ACE Setup add service Ox1802 store LOUCAL_STORE Setup add char def O 2406 Setup assigned pipenumber 5 type RECEIVE Furi Log Connected O a Le June 1 2015 Page 18 7 Document Ref isp_ble_Catalog_R2 3 docx 8 bei i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com TEG The information contained in this document is the property of Insight SiP and should not be disclosed to any third party TA T without written permission Specification subject to change without notice mjr Insight SP APPLICATION NOTE It s all in the package i S P 4 209 o9 Temperature_x should appear If this fails reset Temperature Sensor to put into advertising mode and perform device discovery again
136. een Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ah ey i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party r at L without written permission Specification subject to change without notice ale Lath ae Insight SiP It s all in the package ISP091201 DK1 Bluetooth Low Energy Wireless Development Kit for ISP091201 General Description In order to assist clients in developing their Bluetooth Smart solutions based on the ISP091201 Insight SIP offers a Development Kit This consists of the following 4 One Test board 5 sample units ISP091201 This development kit must be implemented together with Nordic Semiconductor kits nRFGo Strater Kit and nRF8001 Development Kit Using this development kit product developers can use a working solution as starting point to develop their own products Time to market is saved by avoiding starting from a blank sheet of paper In addition there may be some applications that use the hardware as is June 1 2015 Page 8 1 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice BLE
137. ement que le mat riel a satisfait aux Commussion s Rules and Ested below requirements above noted where s demandes de licences a onani Fenced lap ubactey Cantata ISSUED BY TELEFICATION BV RECOGNIZED CERTIFICATION BODY BY INDUSTRY CANADA DELIVRE PAR TELEFICATION BV ORGANISME DE CERTIFICATION RECONNU PAR INDUSTRIE CANADA k k n z Pop e nii Tie gai EN un Ee ON a parr perch set Sappen gi jies oad yer og pee poh ai y above o SECESIE instafed by the CEM or OEM integrators End users may not be provided with the module installation mstrucsons atteste par la pr sente que le materiel a fait l objet d essai et a ete jug conforme a la specification ci dessus OEM integrators and end users must be provided with transmitter operating conditions for satisfying RF exposure DATE 27 August 2013 BY W J M Jong Manager Product Certification i Sy This certificate has one annex June 1 2015 Page 2 2 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP QUALITY It s all in the package Manufacturer Process Certifications Insight SiP is highly focused on product quality In order to provide its custom
138. ensional drawing for 8 x 11 x 1 2 mm 57 Pad LGA Package T PIN 1 INDICATOR lt M CO 3mn June 1 2015 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice Insight Si ANT BLE MODULE It s all in the package ISP 1 303071 ANT SMT Assembly Guidelines Recommended PCB Land Pattern and Solder Mask layout alata l 9 1575 mm tU uU i oe fe lt 7 13 m lt TTTITTT i June 1 2015 Page 6 11 Document Ref SE aero E Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si SP ANT BLE MODULE It s all in the package ISP 1 303071 ANT Antenna Keep Out Zone Recommended metal keep out areas for optimal antenna performance no metal no traces and no components on any layer except mechanical LGA pads 18 0 mm min o a A poma Yy of board no metal on any layer except mechanical
139. enue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Se without written permission Specification subject to change without notice ale Insight SP APPLICATION NOTE It s all in the package i S p 4 4050 4 2 Demonstration with Android Device 4 3 amp higher The free beacon application developed by Nordic Semiconductor is available on the Play Store Make sure the Bluetooth is activated on your device go to wireless device settings Download and install the nRF Beacon app on the Play Store You should see the following screen on your device Then you will be able to set up the application demonstration as follows Place the CR2450 battery into the Beacon ISP140501 2 Start nRF Beacon application on your iPhone or on your android device click Update and Connect 3 Onthe beacon push the switch SW2 to pair with the device the led become orange i ofp ia a a June 1 2015 Page 12 4 Document Ref isp_ble_Catalog_R2 3 docx Hie ere Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com PE The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without noti
140. er with the best reliability Insight SiP has qualified global asian CEMs which are offering a huge level of manufacturing certification to produce its Smart Modules range of products We can therefore ensure the following quality standards in production ISO9000 standards and several other certifications OHSAS18001 Health and Safety management 15013485 Medical requirements AS9100 Aerospace requirements QS9000 Automotive requirements June 1 2015 Page 2 3 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP QUALITY It s all in the package PRODUCT DISCONTINUITY Normally a product will continue to be manufactured as long as all of the following are true The manufacturing method is still available There are no replacement products There is demand for it in the market In case of obsolescence Insight SiP will follow Jedec Standard JSD 48 A Product Discontinuation Notice PDN will be sent to all distributors and made available on our website After this the procedure goes as follows Last Order Date will be 6 months after the PDN was published Last Shipment
141. eration During certification the pin may be connected to an RF connector for antenna measurement 7 OUT MOD Module In Out This pin is the RF I O pin of the BLE module It should be connected to Pin 6 OUT_ANT for normal operation During certification the pin may be connected to an RF connector for module measurement using a Bluetooth test setup 8 GND Ground Should be connected to ground plane on application PCB 9 NC Not Connected Isolated pad on application PCB for mechanical stability MOSI Digital input ACI Master Out Slave In OC June 1 2015 Page 7 2 Document Ref isp_ble_ Catalog R2 3 docx my Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com AQ sit i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f ie without written permission Specification subject to change without notice ope Insight SiP BLE MODULE It s all in the package ISPOO 71 207 Pin Name Pin function Description 11 DCC PWM driver PWM driver for the external LC filter if the DC DC converter is enabled If the DC DC converter is disabled this pin shall be not connected AVDD Analog power supply 1 9 3 6V DC Power supply 1 9 3 6V Supplies the DC DC converter and GPIOs VDD in nRF8001 doc Connect to external 32 768kHz crystal oscillator if internal RC oscillator is enab
142. erformances RF Specifications according to standards The performance of the Bluetooth Low Energy Radio link is that obtained by the ISP091201 module Temperature range 40 C to 85 Value BT V4 Condition Parameter Std limit Output Power 09 20 to 10 m Channels 0 to 39 Z Channel 0 to 39 d RF Frequency tolerance pene tel 50 H 20 Level for BER B Rx sensitivity 70 Bm lt 0 1 ideal Tx m m 8 Open field at 1m ne height EIRP 0 3 ee Antenna Gain 12 _ 3 Mechanical Outlines ee ee 18 0 nm 6 0 mm Dimensional drawing E lt 29 0 mm June 1 2015 Page 19 4 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 1 20971 4 AN130405 Luminosity Sensor Demonstration Introduction This application note describes the PC software setup to use the ISP120911 luminosity demonstration program The demonstration requires a ISP120911 Luminosity Sensor with a CR1632 battery a Windows PC running XP Vista or Windows 7 a Nordic Semiconductor Master Emulator nRF2739 delivered with uBlue SDK and appropriate software
143. ers i Adresse C users BLE Sensors Temp_Lurm_ Demo _EXE od OK P Mom gt Taille Type Gestion des fichiers il S Acid i Ko Application Extens 28 emulatorlibs dll 2 179 Ko Application Extens hei_ coder dll 45ko Application Extens hei coder net dll 27ko Application Extens IronPython dll 1 750 Ko Application Extens IronPython Modules dll 637 Ko Application Extens IronPython xml 399 Ko Document Mb JLinkARM dll 4 422 Ko Application Extens log bck iko Document texte MasterEmulator dll 38 Ko Application Extens mi Renommer ce Fichier iy D placer ce Fichier Copier ce fichier ES Publier ce fichier sur le Web G3 Envoyer ce fichier par courrier lectronique Supprimer ce fichier CACA CACA m ca d Awr A a by MasterEmulator xr 77ko Document XML Microsoft Dynamic dil 1 020 Ko pplication Extens GS Sensors Microsoft Dynamic xml 360 ko Document SMIL Microsoft Scripting dil 141 Ko Application Extens Mes documents S Microsoft Scripting Metadata all 91 ko Application Extens B Documents partag s Microsoft Scripting Metadata xml 17 Ko Document XML of Poste de travail Microsoft Scripting xml 201 Ko Document MIL a Favoris r seau Proximity Temp Lumino Demo exe lt a 233 Ko Application Proximity Temp Lumino Demo pdb 56ko Fichier PDB P Proximity Temp Lumino Demo vshosk exe 12 Ko Application Details 28 Proximity Temp Luming Demo shost ee manifest lko Fichier MANIFEST
144. es because of the greater data size 4 bytes for the light sensor node and 3 bytes for orientation motion sensor node relative to the 2 bytes in the case of temperature sensor node The greater number of bytes data size also increases the consumption of the microprocessor because it also requires a longer consumption time of lon for reading measurements made by the sensing device and for sending them to BLE module Regarding the current consumption of the sensing device it is very low in the order of a few uA Because of an intrinsic offset of INA195 component used in the oscilloscope measurement method we cannot characterize this low current with this method This is confirmed by Figure 6 where we cannot measure the consumption of the temperature sensing device ee a ps June 1 2015 Page 21 14 Document Ref isp ble Catalog R2 3 docx HE L a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party j without written permission Specification subject to change without notice jat 4 Insight SP APPLICATION NOTE It s all in the package AN 4 30501 2 3 Capacitor measurement method To overcome low currents limitation of oscilloscope measurement method and to obtain more accurate measurements we developed anot
145. fication subject to change without notice BLE MODULE insight Sip CUSTOM DESIGN It s all in the package BLE custom design service based on nRF8001 from Nordic Semiconductor Insight SIP has designed a ready to use module based on Nordic Semiconductor s Bluetooth Low Energy nRF8001 chip For many applications this module represents the ideal solution as it is ready to use and minimizes design risk and time to market Insight SIP offers its world class design expertise and Intellectual Property blocks used in designing the BLE module to rapidly make miniature designs to meet specific customer requirements As an existing partner of Nordic Semiconductor Insight SIP is ideally placed to deliver high quality designs based on Nordic Semiconductor s chipset Key Features Antenna in Package technology Smallest package size on market 8x 12x 1 45mm High performance up to 40m range Pre certified Minimal RF experience required All RF elements inside Specific form factors and metal housings Very high volume low margin applications Integration of other technologies Specific Skills Direct experience with nRF8001 BLE and NRF51822 chip Class leading miniaturisation and integration of RF elements based on unique design methodology Advanced miniature PCB antenna design capability based on years of research and extensive Electromagnetic Simulation experience Application Software
146. fications according to standards Parameter Value BT V4 Std limit ome O e e ee e ow women sey e Typical Antenna Return Loss Module mounted on a USB dongle ground plane Level for BER lt 0 1 ideal Tx dB S 1 1 20 21 22 23 24 25 26 27 28 29 30 freq GHz June 1 2015 Page 7 5 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice Insight SIP BLE MODULE It s all in the package ISPOO 71 201 Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane gain dBi 2 45GHz gain dBi 2 45GHz gain dBi 2 45GHz Ground Plane Effect Simulation gt E A USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane size 18 x 30 mm size 40 x 100 mm size 40 x 100 mm June 1 2015 Page 7 6 Document Ref isp_ble_Catalog_R2 3 docx Ma 5 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com x D sans The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f r5 Fa without written permission Spe
147. fl Business_Document_Revision_Table xlsx TED5120901R0 pdf f D5120901R0 docx f D5120905R0 docx f D5120909R0 docx f D5120911R0 docx Accelero_pile_photos Accelero_Demo_EXE Size 5 674 KB 6 889 KB 16 732 KB 869 KB 3 182 KB 838 KB 1KB 74 KB 808 KB 838 KB 724 KB 729 KB 719 KB Type Archive WinRAR ZIP Windows Installer P Application Application Archive WinRAR ZIP Document Microsoft Document Microsoft Feuille Microsoft Off Adobe Acrobat Doc Document Microsoft Document Microsoft Document Microsoft Document Microsoft File Folder File Folder Date Modified 4 16 2013 4 05 PM 4 16 2013 3 27 PM 4 16 2013 3 21 PM 4 16 2013 3 21 PM 4 16 2013 3 14 PM 4 16 2013 2 42 PM 4 16 2013 2 42 PM 4 16 2013 2 41 PM 4 16 2013 2 31 PM 4 16 2013 2 31 PM 4 16 2013 2 27 PM 4 16 2013 2 27 PM 4 16 2013 2 27 PM 4 16 2013 4 28 PM 4 16 2013 4 21 PM Date Modified Today April 16 2013 4 21 PM 15 objects P My Computer June 1 2015 Page 16 4 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice m APPLICATION NOTE ISP120901 Insight SiP It s all in the package L
148. formation contained in this document is the property of Insight SiP and should not be disclosed to any third party BET without written permission Specification subject to change without notice Op Re Beye Insight SiP BLE MODULE It s all in the package ISP 1 303071 Pin Name Pin function Description 6 NC Not Connected _ _ Isolated pad on application PCB for mechanical stability 8 NC NotConnected Isolated pad on application PCB for mechanical stability 9 PO17 Digitali O General purpose I O pin S O This pin is the RF I O pin of the BLE module It should be connected to Pin 26 OUT_ANT for normal operation During certification the pin may be connected via to an RF connector for module measurement using a Bluetooth test setup This pin is connected to the internal antenna It should be connected to Pin 24 OUT MOD for normal operation During certification the pin may be connected to an RF connector for antenna measurement VCC_nRF System reset active low Also HW debug and flash nRESET programming I O PO_05 AIN6 Digital I O General purpose I O pin Analog input ADC input 6 June 1 2015 Page 3 3 Document Ref isp_ble_Catalog_R2 3 docx 4 Ep Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ae ER j5 The information contained in this document is the property of Insight SiP and should not be disclosed to any third
149. from Insight SiP The note describes the software installation procedure and the operating mode Software Installation In order for the demonstration to operate the following software packages need to be installed on the PC Microsoft NET framework 4 Nordic Semiconductor nRF8001 SDK v1 7 for Master Emulator USB drivers Luminosity Demo folder from Insight SIP with executable file and dil files Microsoft NET framework 4 Re distribuable package This can be downloaded from Microsoft at the following address http www microsoft com en us download details aspx id 17718 To install this package follow the instructions on the Microsoft website Nordic Semiconductor nRF8001 SDK v1 7 Run the nRF8001 SDK so as to be able to use the Master Emulator USB drivers Luminosity Demo Folder The Temp _Lum_Demo_EXE zip file should be unzipped at any suitable location on the PC This contains the executable file and all the dll files necessary for the demonstration to run E E Oo June 1 2015 Page 20 1 Document Ref isp_ble_Catalog_R2 3 docx j i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE ISP1209011 It s all in the packa
150. g Information ccccseeeeecseeeeeseeeeeeseeeeeseeueeeseeeeesseeeeeseaeeesseeeeesaeeeessneeeeas Page 3 15 fem UE S OTe a lal fe dios e eee eee eee een eee ee ee ee eee Page 3 16 1 Electrical Specifications Electrical Performance The specifications of the module follow those of the nRF51822 The following high level parameters are given for the module The operating temperature range is 40 to 75 C with the following performances Parameter Value Unit Peak current receiver active supply at 2 1V Peak current transmitter active 4 dBm Output Power Peak current l 10 5 mA transmitter active 0 dBm Output Power Current drain connection less state no RAM retention a ye en Current drain between connection events Crystal stability 32 768 kHz 20 ppm re Pin Assignment The module uses an LGA format with a double row of pads on a 0 65 mm pitch The pad layout follows the QFN Jedec standard for 2 row LGA parts Pads 1 thru 56 are signal pins 0 4 x 0 4 mm Pad 57 is an exposed metal pad that is connected to ground The NC pads are 0 8 x 0 8 or 0 4 x 0 4 mm and are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability drop test June 1 2015 Page 3 2 Document Ref isp_ble_Catalog_R2 3 docx E be z Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com pE s t ja The in
151. g Insight SiP Bluetooth Low Energy module ISP091201 The next paragraphs describe hardware and software of three different kits two from Nordic Semiconductor and one from Insight SiP The last paragraph presents a simple link test set up Contents 1 Recommended Documentation aj 00c66 25eaheriorate ndvaberidesabisndeabeideatestdabeidnabesndmebeionatessdes Page 9 1 2 ir AO Slaner KIHIRFO ZOO emisias EE E aeiaesseanepenaiaesneeeeanenene ia Page 9 2 3 nRF8001 Development Kit NRF8001 DK cc ececeeceeeeeeeeeeeeeeeeeeeeseeeseeeeseeeseeeseeeeneeeeaeeees Page 9 3 4 1SP091201 Development Kit ISP091201 DK1 ce eceececeeeeeseeeeeeeeeeseeeeseaeessaeeeseneessaeeesees Page 9 4 5 Simple Link Test Seb UP esprai Page 9 6 1 Recommended Documentation The following documents are recommended reading Document Name Remark Downloaded at This pdf file will be located in folder C Nordic Semiconductor nRF8001 SDK v1 7 Documentation after installing nRF8001 SDK installer See 3 Ro DS091201Rxx pdf ISP091201D module data sheet nRF8001 DK User Guide v1 1 pdf pares ane 1 a Page 9 a Document Ref isp_ble_ Catalog_R2 3 docx is i Arer without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S POS 4 2 O 4 2 NRFGo Starter Kit NRF6E7 OO The nRGo Starter Kit consists of hardware and software components For more details
152. g sensors Out of Range OOR sensors General Description ISP120911 is an autonomous low power device for wireless light detection and transmission The complete device makes use of Insight SiP ISP091201 BLE module together with low power host processor digital temperature sensor and small primary button cell battery CR1632 or lower capacity CR1620 Overall size of the device is 18x29x6 mm The host processor that handles the autonomous sensor application the high level portion of the BLE protocol stack and communication with the light sensor is a low power 32 bit MCU ARM Cortex M0O based the NXP LPC1114FHI33 302 integrating 56kB flash memory and 8kB SRAM The Avago APDS 9300 a digital light detection sensor is used to detect ambient light transmitted via the I2C bus Each APDS 9300 consists of one broadband photodiode visible plus infrared and one infrared photodiode Two integrated ADSs convert the photodiode currents to a digital output that represents the irradiance measured on each channel This digital output is addressed to the NXP application processor where illuminance ambient light level in lux is derived using an empirical formula to approximate the human eye response An interface board ISP120907 is available from Insight SIP and allows for easy flash programming the LPC1114FHI33 302 application processor via the 14 pin FPC connector During firmware modification and debug the ISP120901 device may be supplied
153. ge The directory should be as shown below Mom Taille Type Date de modification Aci dll lizko Application Extension O9 26jz2012 2 31 PM emulatorlibs dll 2 179Ko Application Extension O9 8 2012 2 31 PM hei_ coder dll 45 ko Application Extension O9f 8 2012 2 31 PM hei_coder_net dll 27 Ko Application Extension O9 8 2012 2 31 PM IronPython dll 1750 Ko Application Extension O9 28 2012 2 29 PM E IronPython Modules dll 637 Ko Application Extension 09 26 2012 2 29 PM ana ei xml 399 ko Document ML pgjzgi20l2 2 29 PM S JLinkARM dll 4 422 Ko Application Extension 09 28 2012 2 30 PM 2 log bk 1 Ko Document texte O2 072015 1 36 AM MasterEmulator all 30 Ko Application Extension O9f28 2012 2 31 PM MasterEmulator xml 77ko Document XML pgizalz0ilz 2 51 PM S Microsoft Dynamic dll L020 Ko Application Extension D9jz26j2012 2 29 PM Microsoft Dynamic ml 360 ko Document ML pgjzgi20l2 2 29 PM A Microsoft Scripting dll idi ko Application Extension O09 26 2012 2 29 PM E Microsoft Scripting Metadata dll 91 Ko Application Extension O9ff8 2012 2 29 PM Microsoft Scripting Metadata xml iF Ko Document XML Oozef2012 2 29 PM Microsoft Scripting xml 201 Ko Document ML ooffefeole 2 29 PM rroximity Temp Lumino Demo exe 253 Ko Application 04 16 2015 11 01 AM Proximity Temp Lumino Demo pdb 56 ko Fichier PDB 04 16 2015 11 01 AM P Proximity Temp Lumino Demo yshost exe izko Application 04 16 2015 11 07 AM Proximity Temp
154. ge without notice ols i Insight SiP APPLICATION NOTE It s all in the package ISP 41 303071 4 Connect your device It will create a TestFlight icon on your device a testflightapp com a testflightapp com o Reconnect Device TestFlight E asieeid Reconnect this device by installing profile Join Connect Device TestFlight Access _ fa testflightapp cc j w y Device successfully connected You will receive an install email when a build is available f Verified QOO HeloTenfight 1 3 243 is now avaliable Le Sis CEF Leie We Reconnect Device reeralpy ty estat at s Lie Lae 5 Once you receive an install email of available build open again your TestFlight app from your device lt can take additional 24 48 hours to receive this email 6 Click on View All Apps and then click on Install Apps Compatible Apps InsightSIPDemo A Version 1 0 1 0 me September 3 2014 Missing Apps al ea June 1 2015 Page 5 23 Document Ref isp_ble_Catalog_R2 3 docx pF a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 cig SP The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice m Insight SiP APPLICATION NOTE It s all in
155. ght Si iP APPLICATION NOTE It s all in the package ISP 1 30301 3 Software Installation This paragraph shows you the steps to follow for software installation 1 Download and install Keil MDK ARM Lite from https www keil com demo eval arm htm to your hard drive 2 Download and run the J Link Software and documentation pack for Windows from http www segger com jlink software html The serial number from your SEGGER J Link hardware is needed to identify your device and can be found printed on the chip on the J Link Lite emulator board 3 Goto www nordicsemi com and log in to your Nordic My Page account 4 Select MY KEYS from the left menu This takes you to the My Keys page 5 Enter the product key included in this kit into the Product Key field and click Add 6 Click MY PRODUCTS in the left menu 7 From the Add product dropdown select the product name and click Add The chosen product is now listed in the below Overview My Products table 8 Inthe Overview My Products table click the Downloads link next to the product name to go directly to the relevant product page download section 9 Download install and run nRFgo Studio Make sure to download the last version updated 10 Download install and run Master Control Panel The software is on the CD and if you want the last version you can find it on the Nordicsemi website x86 is for 32 bits windows and x64 is for 64 bits windows 11 Download and run the
156. ghtsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third any P without written permission Specification subject to change without notice ss if i Insight SP APPLICATION NOTE It s all in the package i S P 4 303 O 4 6 Basic Sensor Application with ISP131001 This paragraph shows you how to set up a Sensor application with 1SP131001 Sensors Board that will send data via the Bluetooth link to the Master Emulator or to an Apple Device Two types of demonstration are presented The first one is directly executable with hardware and software provided in the Development Kit using Master Control Panel application The second demonstration requires the use of an iPhone or an iPad The iOS application is available on demand only as an App that can be installed for development purposes via the Apple developer program The procedure to obtain the App from Insight SiP and demonstration of the Sensor application with Apple Device is described hereafter 6 1 On Master Control Panel 1 Place the CR2032 lithium battery into the battery holder 2 Connect the battery holder to the Sensors Board ISP131001 3 Connect Development Dongle PCA10000 Master Emulator into a USB port on your computer 4 Start Master Control Panel 5 Click Start Discovery a Master Control Panel EIB File Help Master emulator COME 480703054 480103054 connected Scan for devices
157. gured to 1000 ms Ea Proximity Temp Lumino Demo o06okeY4 m open Device name ll f Luminosity 3 Perform device discovery Disconnect Log Received AtH andie alueN otification on pipe number 2 with value EBOD1 S04 Receiwed Luminosity Sensor Yalue update notification 1793 232 Received AHH andle alue otfication on pipe number 2 with value EBOD1 904 Receiwed Luminosity Sensor Yalue update notification 1793 232 Received AHH andle alue otfication on pipe number 2 with value ES0D1 904 Receiwed Luminosity Sensor Yalue update notification 1794 24 Received AHH andle alue otfication on pipe number 2 with value E9001904 Receiwed Luminosity Sensor Yalue update notification 1794 744 Connmecked O June 1 2015 Page 20 9 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insisht SP APPLICATION NOTE insight ai ISP120911 To change Interval Connection to 4000 ms for example write 4000 in tab IntervalMs step 1 then click on Set step 2 Then click successively on Disconnect and Connect step 3 Ea Proximity Temp Lumino Demo OO6OKEY4 m Open Device name Luminosity 3 Fe
158. hanced Host Controller 27CC USB Composite Device USB Mass Storage Device USB Root Hub USB Root Hub USB Root Hub USB Root Hub USB Root Hub USB Serial Converter 4 USB Serial Converter B Driver Provider NORDICSEMI Driver Date 3 18 2011 Driver Version 2 8 14 0 Digital Signer Not digitally signed To view details about the driver files Update Driver To update the driver for this device Biel Back Dinar If the device fails after updating the driver roll back to the previously installed driver Uninstall To uninstall the driver Advanced June 1 2015 Page 18 3 Document Ref isp ble Catalog R2 3 docx ratte Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Qe The information contained in this document is the property of Insight SiP and should not be disclosed to any third party 2 without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 209 o9 Connect Battery to ISP120909 Temperature Sensor as shown below Battery CR1632 POS Terminal UP Battery CR1632 Fully Installed Run Software Navigate to the Temp_Lum_Demo_ EXE folder Sensors Fichier Edition Affichage Favoris utils 7 Pr cedente DO Rechercher Dossiers k Adresse Mom Taille Type Gestion des fichiers O Accelero
159. her measurement method the Capacitor Approach This method is based on the principle of charging calibrated capacitor then turns off the power supply and feed the sensor node by this charged capacitor Total current consumption of sensor node will discharge this capacitor and decrease its voltage By measuring the voltage drop across the capacitor as a function of time we can determine the total current consumption and or the total charge consumption as presented in the two following equations Q I olQ CxAV At g This method allows the measurement of low currents in the order of a few uA particularly to characterize the current consumption of sensing device during the connection phase Phase 1 but also to characterize the total current consumption during the Standby sleep Phase 2 where the current consumption of BLE module microprocessor and sensing device is very low The capacitor used in this method is a ceramic capacitor of about 600 uF To know the precise value of this capacitance we have used an RC circuit to calibrate the capacitance value For this we have connected the capacitor to resistor with an accurate value of 1 KQ as shown in Figure 12 Capacitor Charging Current 0 5i Switch R 0 371 Capacitor Current q 0 1T 2T 3T 4T 5T 6T Time t 0 7T Time Constant T Figure 12 Electric Schema of RC circuit and its discharging curve versus time The time constant of this circuit is given as T R
160. ht SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 41 371 O01 2 Demonstration with iPhone or iPad Device The Sensor application is available on demand from Insight SiP The iOS App is a demonstration App that is provided as is in order to demonstrate the Smart Bluetooth sensor node Only one iPhone or iPad is allowed per development kit Make sure you iOS device is compatible with Bluetooth 4 0 iPhone 4S or higher iPad Air Mini 3 generation and above The installation procedure for the Sensor application is described hereafter 1 Contact Insight SiP at contact insightsip com and communicate the kit number and the product key notified on the dev kit We will send you by email an invitation 24h 48h after Accept it using your iOS device you want to use for the demo N lt Toutes De TestFlight Masquer noreply n testflightapp com Chris Barratt has invited you to join the InsightSiP team on testflightapp com 8 octobre 2014 09 39 Chris Barratt has invited you to InsightSiP as a Tester Chris also had a message for vou P 6 E a AM 3 Sign up in order to register to Test
161. iP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight Si SP ANT BLE MODULE It s all in the package ISP 1 30301 ANT ISP130301 ANT Dual ANT BLE Module with Integrated Antenna Key Features Applications ANT ANT protocols Space constrained ANT BLE Devices Single Mode BLE v4 1 Sport and fitness sensors Proprietary 2 4 GHz protocols Health care sensors 4 Based on Nordic Semiconductor nRF51 family Out of Range OOR sensors 2 4GHz low energy RF Transceiver Personal User Interface Devices PUID 32bit ARM Cortex MO CPU with 256kB Flash Remote controls Analog and Digital peripherals Ultra Low Power Consumption General Description Single 2 1 to 3 6 V supply P Very small size 8 0 x 11 0 x 1 2 mm This module is based on nRF51422 Nordic Temperature 25 to 75 C Semiconductor 2 4GHz wireless System on Chip Fully integrated RF matching and Antenna SoC integrating a 2 4 GHz transceiver a 32 bit Integrated 16 MHz and 32 768 kHz Clocks ARM Cortex MO CPU a flash memory and analog and digital peripherals It can support Certifications ANT ANT Bluetooth Low Energy and 2 4GHz proprietary ultra low power wireless protocols Complies with FCC CE IC and TELEC f Fully qualified BLE stacks for nRF51422 are p Sc peli oy nee implemented in the S100 series of SoftDevice
162. ication 416 2013 11 05 AM Accelero pdb S4 KE POG File lizziz013 4 22 PM py libs dll 1425 KB Application Extension 9 78 2012 2 51 PM ermulatorlibs dll 2179KB Application Extension 28 2012 2 31 PM Aci_ coder ll 45 KB Application Extension 9 28 2012 2 31 PM MasterEmulator xml 77KB XML Document gizalz0lz 2 31 PM MasterEmulator dll 38 KE Application Extension 9 26 2012 2 31 PM E Ulpbt dll 200 K6 Application Extension 9jz8j2012 2 31 PM Signalyzer dll 31 KE Application Extension 9 28 2012 2 31 PM Segger dll 12 KB Application Extension 26 2012 2 31 PM a hci _coder_net dll z7 KB Application Extension 9 26 2012 2 31 PM UlpbtUtils all z6 K6 Application Extension 9 28 2012 2 31 PM Aci dll 12 KB Application Extension 9 26 2012 2 31 PM Microsoft Scripting xml 201 KB amp ML Document gizajz0lz 2 29 PM Microsoft Scripting Metadata xml 17 KB XML Document giz jz0lz 2 29 PM a Microsoft Scripting Metadata dll 91 KB Application Extension 9 28 2012 2 29 PM Microsoft Scripting dll 141 KB Application Extension 9 26 2012 2 29 PM Microsoft Dynamic xml S60 K6 ML Document gizajz0lz 2 29 PM Microsoft Dynamic dll 1020 KB Application Extension 9 26 2012 2 29 PM IronPython xml 399 KB XML Document gizjz012 2 29 PM a IronPython Modules dll 637 KE Application Extension S 28fe012 2 29 PM E IronPython dil 1 750 KB Application Extension 3 78 2012 2 29 PM C Content File Folder 4 5 2013 12 41 PM Hardware Setup Master
163. ille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party jc Sere without written permission Specification subject to change without notice of apt Insight SP APPLICATION NOTE It s all in the package AN 4 305011 The microprocessor uses the SPI interface to communicate with the BLE and the 12C interface to communicate with the used sensing device The specifications of these nodes depend on the used sensing device as presented in Table 1 Module Parameter Value Unit Power supply a es U y Coin cell Battery CR1632 A Connection Interval 7 5 to 4000 Oooo moo o o PCB dimensions 18x29x6 0 0625 Temperature Detection Temperature range 40 to 125 a Resolution its Light range Darktobrightsun Lux Light Detection Light range Dark to bright sun Lux Besoltion j 16 bs Orientation Motion Detection Acceleration range g 9 81m s Table 1 specifications of the three Bluetooth Smart sensor modules 2 Current Consumption Methods 2 1 Generalities In this paragraph we present the current drain over time for the three subsets of Bluetooth Smart sensor node module ISP091201 microprocessor LPC1114FHI33 302 and sensing device temperature light and orientation motion The functioning of these Bluetooth Smart sensor nodes ca
164. in this document is the property of Insight SiP and should not be disclosed to any third party Fs without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 41 30301 June 1 2015 a E m Page 3 18 Document Ref isp_ble_Catalog_R2 3 docx S pseh enna Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP It s all in the package BLE DEV AIT ISP130301 ISP130301 DK1 Bluetooth Low Energy Wireless sensor Development Kit for ISP130301 General Description In order to assist clients in developing their Bluetooth Smart solutions based on the ISP130301 Insight SIP offers a Sensor Development Kit This consists of the following Sensor Board containing One Interface Board J Link Lite CortexM 9 JTAG SWD Emulator One Test Board 4 One Sensors Board A Development Dongle 51SP130301 module samples 4 Cables power supply and coin battery holder Smartphone is NOT included Using this development kit product developers can use a working solution as starting point to develop their own products Time to market is saved by avoiding starting fro
165. including without limitation any warranty of fitness for a particular purpose that they are defect free or against infringement of intellectual property rights Insight SiP customers agree to indemnify and defend Insight SiP against all claims damages costs and expenses that may be incurred including without any limitation attorney fees and costs due to the use of products June 1 2015 Page 2 4 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party 535 without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 1 30301 ISP130301 Bluetooth Low Energy Module with Integrated Antenna Key Features Applications Single Mode BLE v4 1 Slave or Master Space constrained BLE Slave Devices 4 Based on Nordic Semiconductor nRF51 family Sport and fitness sensors 2 4GHz low energy RF Transceiver Health care sensors 32bit ARM Cortex MO CPU Out of Range OOR sensors 256kB Flash and 16 kB SRAM Personal User Interface Devices PUID Analog and Digital peripherals Remote controls Ultra Low Power Consumption Single 1 8 to 3 6 V supply General Description Very small size 8 0 x 11 0 x 1 2 mm Temperatu
166. ing and testing 1SP130301 ANT module Nordic Semiconductor nRFgo Studio downloadable from www nordicsemi com Nordic Semiconductor Master Control Panel downloadable from www nordicsemi com Keil MDK ARM Lite downloadable from https www keil com demo eval arm htm Segger J Link Lite downloadable from http www segger com jlink software html S100 series BLE nRF51 SoftDevice S210 ANT nRF51 SoftDevice and S310 ANT BLE nRF51 SoftDevice fully qualified Bluetooth low energy stacks for nRF51422 integrated in ISP130301 ANT module All SoftDevices object code no source can be downloaded from www nordicsemi com nRF51 Software Development Kit SDK nRF51 SDK can be downloaded from www nordicsemi com It contains example of source codes applications C language Precompiled HEX files Source code Keil ARM project files IAR project files GCC project files es a June 1 2015 Page 6 9 Document Ref isp_ble_Catalog_R2 3 docx ae Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ae i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party her oa without written permission Specification subject to change without notice oles Insight Si ANT BLE MODULE It s all in the package ISsSP 1 303071 ANT 4 Mechanical Outlines Mechanical Dimensions Dim
167. ion i to apply soldering method that don t deteriorate reliability ii to minimize any mechanical vibration shock exposure to any static electricity ili not to overstress the product during and after the soldering process The products are not designed for use in any application which requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party s life body or property including and not limited to i aircraft equipment ii aerospace equipment ili undersea equipment iv power plant control equipment v medical equipment vi transportation equipment vii traffic signal equipment vill disaster prevention crime prevention equipment The only warranty that Insight SiP provides regarding the products is its conformance to specifications provided in datasheets Insight SiP hereby disclaims all other warranties regarding the products express or implied including without limitation any warranty of fitness for a particular purpose that they are defect free or against infringement of intellectual property rights Insight SiP customers agree to indemnify and defend Insight SiP against all claims damages costs and expenses that may be incurred including without any limitation attorney fees and costs due to the use of products June 1 2015 Page 7 18 Document Ref isp_ble_Catalog_R2 3 docx E gt nis Insight SiP Gr
168. ions V V _ Oe ae _ waren E Vosc Q IxT R 0 5 50 Temperature sensor node Microprocessor LPC1114 Consumption Time Voltage Current Charge ms mV mA uC lon Read Symbol lon Read P Wait lon Data send Total Table 5 Temperature sensor node current and charge consumption measurements of microprocessor as measured by oscilloscope method Similarly to measure the BLE module current consumption in temperature sensor node we have 6 consumption segments These 6 segments correspond to events presented in Table 2 Table 6 presents the corresponding current and charge consumption values of BLE module as measured by oscilloscope method using the two precedent equations BLE module current consumption measurements are consistent with the values given by the software provided by Nordic Semiconductor nRFgo Studio In this software depending on the type and the number of defined services and depending on the measurement time Connection Interval we can estimate the current consumption of BLE module June 1 2015 Page 21 9 Document Ref isp_ble_Catalog_R2 3 docx Ree Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party e without written permission Specification subject to change without notice Insight SP APPLICA
169. ird party pa i without written permission Specification subject to change without notice ale BLE SENSOR ISP120909 WY ehed Wn A It s all in the package Electrical Schematic a L ON9 1 Olvl 3d4 OOFL OFPEOS doy OND WHO S 0 4 _ 98 1 0 0u 1 40z0u wn 3 ro a rs p p oO 0 08 SDA 9L0N9 doy GND Tos 02 OdT DOA vas oz 13834 WYO OOL 4 NO _ 8 1 10z0u SAILO l XOS NAG ite ZEEE WL YOSNS ZOSESIHSPEL LO os a OLY 0891 19 00SIN 8 00ld ison gr tLYW 089LLO 0ISOW 6 00ld moms gr LYN 0891L9 0X9S 01 0Old AIIMS gnaw oz LV 19119 9001 LOld ona yz ELYW 08Z 19 00Y L1 0Old H Loa zz PAYO FAZELO LdW 0 Olda zoow ez JOLY FAZELO ZaW L Oley coav pe LV FAZELO EdvZ LOld y Od D 089LLI0T3SS Z 00d COEEEIHdY LLLI ZLYNTOBZELI LNONIO L 001d 0 00ld 13S3Y Y1G 0 ZOld rm 28 SE gag 06 ogo s ba l Yg Py 52 223 ere a5 999 SS s SES 23 FE Z SFE gt m J5 FEF z pz zez zbe re k SIND X ww rom doi IND oiams oxi n sod OXY Now zoay 4U 0L 9 o ez i OZ0O SEON 3 GID LSQNO or GBND du 01 9 oO zo Od TODA E A aON9 N9 3u 0l 9 au 00l 9 zzo IZo 1 10Z09 zr Olvl Od4t 00t oBPeos SONO oq OND S ano V 904 Zz 990V S90Y 00V 6 ZO0N 9 t9QY 090 9 YOSNIS HYOSNJS ZI YOSNJS L YOSNIS 0 z YOSN3S JJA ONS gt osano yq GND ON ron w 4 PEONS ESGNO doy gN ONS rONS doy aNS 1 10z09 F Z aN9 Sl 9 Sd7 JDA
170. itor measurement method June 1 2015 Page 21 16 Document Ref isp ble Catalog R2 3 docx tr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party j without written permission Specification subject to change without notice of apt Insight SP APPLICATION NOTE It s all in the package AN 4 30501 2 3 1 Temperature sensor node Figure 15 shows the measurements of total current consumption of temperature sensor node for the two functioning phases Phase 1 Phase 2 carried out by the capacitor method for measurement time Connection Interval of 1 second Tek ape Acq Complete M Pos 4480s CURSOR gt Type Phase 1 Phase 2 CH i00m M 250ms EHAS aga 16 May 13 2329 lt 10hz Figure 15 Temperature sensor node total current consumption measurements as measured by capacitor method In these measurements that look like a staircase the voltage drop is related to the total current consumption of the sensor node during the communication phase Phase 1 where there is a high consumption for a short time 6 10 ms However the low slope of consumption is related to the total consumption of the sensor node for the Standby sleep phase Phase 2 The total charge consumption of the temperature node sensor fo
171. lator 21SP140501 BLE beacon samples A Development Dongle Cables power supply and coin battery holder Smartphone is NOT included Applications Using this development kit product developers can Possible applications include use a working solution as starting point to develop their own products Time to market is saved by avoiding starting from a blank sheet of paper In addition there may be some applications that use the hardware as is Location sensitive information Marketing or retail applications Beacon technologies in Healthcare Beacon technologies in Education The miniature size of the Insight solution means it could be comfortably worn or is able to fit into a small space Please refer to the application note AN140801 for more information on kit implementation Specific Skills lf a product developer lacks skills in any of the crucial areas to develop a working solution then Insight SIP can offer custom design services to cover all of the following areas Custom hardware development Addition replacement of different sensors Software development Custom SIP development June 1 2015 Page 11 1 Document Ref isp ble Catalog R2 3 docx ge Siam oE oo pi ORE peer m Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com T The information contained in this document is the property of Insight SiP and should
172. ld not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPOO 1 207 5 Packaging Marking C 0560 Model ISP091201D SPO pPeopfp aan vy wwii litt FCC ID 2AAQS ISP091201 IC 11306A ISP091201 D Hardware version Prototype Packaging For engineering samples and prototype quantities up to 99 units deliveries are provided in thermoformed trays Trays For higher quantities and volume production ISP091201 modules are available in Jedec trays They are delivered in sealed pack with desiccant pack and humidity sensors These Jedec trays are also suitable for further baking Please see section 6 for more information on moisture sensitivity Jedec trays are proposed in standard quantities of 100 units 200 units and multiples of 200 units only Please refer to tray sizes and module positioning below Complete information on Jedec trays is available on request SD a June 1 2015 Page 7 12 Document Ref isp ble Catalog R2 3 docx a hee Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 3 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice Insight SiP BLE MODULE It s
173. le_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice mags insight SiP Insight SiP It s all in the package ISP120911 Bluetooth Low Energy Wireless Light Detection Sensor Key Features Single Mode BLE v4 0 Slave Module Based on Nordic Semiconductor uBlue family Includes transceiver baseband software stack Fully integrated RF matching and Antenna Integrated 16 MHz Crystal Clock Ultra Low Power Consumption Coin cell battery CR1632 or CR1620 Low Power Digital Light Sensor Ultra Low Power Application Processor 16 MHz Crystal Clock for Application Processor 32 768 kHz Crystal for BLE Protocol Sync Overall Size 18 x 29 x6 mm Temperature 40 to 85 C Ultra low Configurable 1 0 system Custom Low Power Micro Transceiver controller 32 kHz XO Flash Memory Advanced Power Management 16 MHz XO CR1632 or CR1620 APDS 9300 Button Battery Programming 16 MHz Interface and Xtal external caps power Low Power Light Micro Controller LPC1114FH133 302 ISP120911 BLE SENSOR ISP120911 Applications Home light monitoring sensors Small business light monitorin
174. led then leave not connected Connect to external 32 768kHz crystal oscillator if internal RC oscillator is enabled then leave not connected UART transmit for Bluetooth low energy Direct Test Mode ACI clock input UART receive for Bluetooth low energy Direct Test Mode ACI request pin handshaking active low ISP091201 pin assignment for the LGA QFN package TOP VIEW See EAN VCC_nRF GND KL AL ACTIVE June 1 2015 Page 7 3 Document Ref isp_ble_Catalog_R2 3 docx Gis i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 4 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPOO 1 201 Electrical Schematic Electrical schematic showing ISP091201 module connections nRF8001 June 1 2015 Page 7 4 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISPO941 2071 2 RF Performances RF Speci
175. lifetime June 1 2015 Page 10 2 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com t amp The information contained in this document is the property of Insight SiP and should not be disclosed to any third party x without written permission Specification subject to change without notice m Insight SiP BLE BEACON It s all in the package ISP 41 40501 Electrical Schematic VCC_ISP fm te Se uy A u oo Ne KZ k 99 amoo rah a Ea Gh x 2w 2N S 5 Ne 3 tis EN aja 0 Od 3 on rs L 0d x bs iL x h 2 oq amp t AY ae ee Fie as ie OX oe N oN oN fo IN ZN 800d P eal ay EES gt a 79 ary A a TS o 09S suid 01 yord Wwu o p n a J09 uu09 DAA 2 i S ae 5 a e 2 gt 2 ies GND PO 09 s f a Z 2 Pot WHIM ul 12 vee EEE Pp yroe VSS 2 a iss amon L P07 P0 19 P0 17 S 3 amp S 8255 oz moe Suse a SOT az ra Z a g mB ra AE We 2 UJ ez 6b 0d O z gt o KZ 3 9 00d 6 IZ gt o 3 8 Snos D02 oog o sES8 Laon June 1 2015 Page 10 3 Document Ref isp_ble_ Catalog R2 3 docx h Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information con
176. literal s J LINK J TRACE Cortex L1 C1 5 You can modify the size of the RAM Algorithm in Flash gt Configure Flash Tools and on the windows click on Debug gt Settings Click on Flash Download and modify the size put 0x02000 Options for Target nrf51822_xxab_si10_spi 128K gt oa Device Target Output Listing User C C Asm Linker iliti Debug Trace Fash Download C Use Simulator Settings Use J i Download Function RAM for Algorithm ca z Erase Full v e a T ret Sie cae E Start 020000000 02000 V Load Application at Statup V Run to main I Load Application at Startup JV Run to main Donot Erase V Reset and Run Initialization File Initialization File Programming Algorithm EE BEA Despen T Devoe Sze Deve ipe ge Restore Debug Session Settings Restore Debug Session Settings On chip Flash 00000000H 001FFFFFH IV Breakpoints Toolbox IV Breakpoints MV Toolbox V Watch Windows amp Performance Analyzer MV Watch Windows M Memory Display IV System Viewer MV Memory Display V System Viewer CPU DLL Parameter Driver DLL Paramet SARMCM3 DLL SARMCM3 DLL Dialog DLL Parameter Dialog DLL Parameter DARMCM DLL pcmo TARMCM1 DLL fecmo Appliquer 6 Click OK and load again the project ane A evi Page 5 18 The aiarmiation contained in this document is he property i Insight SiP ant should not be disclosed to any third pa
177. ll be 6 months after Last Order Date i e 12 months after PDN Disclaimer Insight SiP s products are designed and manufactured for general consumer applications so testing and use of the product shall be conducted at customer s own risk and responsibility Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment Please also pay attention i to apply soldering method that don t deteriorate reliability ii to minimize any mechanical vibration shock exposure to any static electricity ili not to overstress the product during and after the soldering process The products are not designed for use in any application which requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party s life body or property including and not limited to i aircraft equipment ii aerospace equipment ili undersea equipment iv power plant control equipment v medical equipment vi transportation equipment vii traffic signal equipment viii disaster prevention crime prevention equipment June 1 2015 Page 3 17 Document Ref isp_ble_Catalog_R2 3 docx amp Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com pE The information contained
178. losed to any third party oe without written permission Specification subject to change without notice m Bia j Insight SP APPLICATION NOTE It s all in the package i S P 4 303 O 4 5 2 Direct Test Mode UART This paragraph shows you how to set up and program the Direct Test Mode through the UART on ISP130601 Test Board Direct Test Mode Set up 1 Connect the SEGGER J Link board to the ISP130603 Interface Board with the 10 pin flat cable 1 27 mm pitch provided in the Development Kit 2 Connect the USB cable from the J link board to your computer 3 Connect the ISP130601 Test Board to the ISP130603 Interface Board with the 10 pin 14 pin and 22 pin FPC jumper cables 0 5 mm pitch provided in the Development Kit 4 On the ISP130603 Interface Board connect the 2 lead patch cable in order to connect RXD to PO_16 and TXD to PO_17 Make sure the RXD TXD labels match for each wire This matches the default setting in the SDK project ble_app_ dtm be careful depending on the ble_app_dtm version the ports used could be different 5 Connect a USB to serial cable converter from RS232 port connector of the ISP130603 Interface Board to a USB port on your computer 6 Connect the 5V DC power supply to the ISP130603 Interface Board S Oe Ood AREN JJA axe lt gt ov ov v gt ts mt bas ofie June 1 2015 Page 5 16 Document Ref isp_ble_Catalog_R2 3 docx ae Insight SiP Green Side 400 avenue
179. luetooth Low Energy module with integrated antenna This module is based on Nordic Semiconductor nRF8001 uBlue Bluetooth Low Energy Platform The nRF8001 is a single chip transceiver with an embedded baseband protocol engine The ISP091201 module size measures 8 x 12 x 1 5 mm The module integrates all the decoupling capacitors the 16 MHz crystal and load Capacitors plus the RF matching circuit and antenna in addition to the transceiver For more details see Insight SiP module data sheet document R3 see 1 ISP110701 is the application type test board It encloses ISP091201 Bluetooth Low Energy module and has size of 18 x 35 mm ISP110701 has the same function as Nordic Semiconductor nRF2740 board June 1 2015 Page 9 4 Document Ref isp_ble_Catalog_R2 3 docx XF 4 Tay without written permission Specification subject to change without notice Insight SiP APPLICAT It s all in the package K ION NOTE SP091201 ISP110701 Electrical Schematic eau Lawn LP B d l roc soproy Jossoood uogesydde oy oepa 7 er i dz GZ epee 5 ly 2 T ot YLL APOO June 1 2015 Page 9 5 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S PO9 4 2 O 4 5 Simple Link Test Set Up All tests perform
180. m 10 From idle 1 99 vA AppicationLatency 0 From sleeping 0 00 pA Batter Lifetime Configuration settings Slave dock accuracy ppm 250 Battery capacity mAh 140 DC DC enabled No Battery lifetime hours 3995 14 Slave Latency Battery lifetime years 0 46 Advertising payload 18 Device security No security Tx power 0 Window limiting Enabeled 20 ppm Display Plots Time distribution H i Advertising 0 Connection 100 Sleeping 0 Local attributes Remote attributes Attribute Gatt procedure Period Enabled Gatt procedure Period Enabled S Temp 4 Te Rea 1000 ms 1 TX Notify 1000 ms Figure 7 Temperature sensor node BLE module current consumption as estimated by nRFgo Studio software Oph Ho June 1 2015 Page 21 10 Document Ref isp_ble_Catalog_R2 3 docx Ead Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party iene without written permission Specification subject to change without notice i tes ae Sip Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 2 2 2 Light sensor node Figure 8 illustrates the two functioning phases of BLE module and microprocessor measured by oscilloscope method for light sensor node Tek ie Trig d M Pos 2 3560ms CH1
181. m a blank sheet of paper In addition there may be some applications that use the hardware as is June 1 2015 Page 4 1 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Applications Possible applications include Sports accessories movement etc Healthcare accessories heart rate Alarms temperature excess Pressure detection The miniature size of the Insight solution means it could be comfortably worn or is able to fit into a small space Please refer to the application note AN140101 for more information on kit implementation Specific Skills If a product developer lacks skills in any of the crucial areas to develop a working solution then Insight SIP can offer custom design services to cover all of the following areas Custom hardware development Addition replacement of different sensors Software development Custom SIP development Document Ref isp_ble_Catalog_R2 3 docx Pay has m ate it ea The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Fa Ti without written permission Specification subject to change without notice Insight SiP It s all in the package BLE DEV AIT ISP130301 June 1 2015 Page 4 2 Document Ref isp_ble_ Catalog R2 3 docx Insight SiP Green Side 400 aven
182. mation contained in this document is the property of Insight SiP and should not be disclosed to any third party jd without written permission Specification subject to change without notice of Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 For the microprocessor LPC1114FHI33 302 each connection event consists of three states and periods as presented in Figure 3 b 1_M Read period l2C communication with sensing device to read measurements J 2 M Waiting time related to post processing period 3_M Send period SPI communication with the BLE to send the measurements For certain sensing devices and depending to the application the order of these three states can changed or the 2_M state can be not used to reduce the microprocessor current consumption The values of current consumption of microprocessor LPC1114FHI33 302 for its different states and operations in each connection event are defined in Table 3 Parameter condition Nom Unit Current of active mode ieee All the clocks are active ee e a All the clocks are turned off Table 3 Current consumption values of microprocessor LPC1114FHI33 302 Finaly for the sensing device each connection event consists of two states and periods as presented in Figure 3 c Istandby Standby period current lon Active period current 12C communication with microprocessor conversion time The used sensing devices are temperatu
183. may be connected to an RF connector for antenna measurement VCC_nRF System reset active low Also HW debug and flash nRESET programming I O PO_05 AIN6 Digital I O General purpose I O pin Analog input ADC input 6 ofa June 1 2015 Page 6 3 Document Ref isp_ble_Catalog_R2 3 docx T F Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com mo Disens The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f al oF without written permission Specification subject to change without notice LEA Insight SP ANT BLE MODULE It s all in the package ISP 1 303071 ANT Pin NETS Pin function Description 41 PO_06 AIN7 Digital I O General purpose I O pin Planer Analog input ADC input 7 Analog input ADC Reference voltage Analog input ADC input 4 Analog input ADC input 5 Analog input ADC input 2 PO 31 Digital I O General purpose I O pin Analog input ADC input 3 AREFO Analog input ADC Reference voltage GND_EP Exposed metal pad Should be connected to ground plane on application PCB ISP130301 ANT pad placement and pin assignment for the LGA QFN package TOP VIEW June 1 2015 Page 6 4 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The informatio
184. me tp maintained above Tc 5 C 30 sec Ramp up rate TL to Tp 3 C sec max Ramp down rate Tp to TL 6 C sec max Liquidous temperature TL 217 C o Time tL maintained above TL 60 150 sec He AO PEACE AE eae m June 1 2015 Page 7 14 Document Ref isp_ble_Catalog_R2 3 docx aa ate Trd Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ee j5 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Frya E without written permission Specification subject to change without notice ops Insight SiP BLE MODULE It s all in the package ISPOO 71 2071 7 Quality amp User information Certifications 4 FCC Limited Modular Certification 15 212 FCC 2AAQS ISP091201 CE Complies with Directive 1999 5 EC statement N 13214144 AA 00 Canada IC 11306A ISP091201 Bluetooth SIG certified B017595 RoHS compliant FCC grant conditions ISP091201 is certified under FCC part 15 212 with Limited Modular Approval This approval is limited to hosts that use the additional metal shield ISP091205 that is delivered with ISP091201 since certification has been carried out in this way This ensures that the radio portion of the circuit is fully shielded on all sides with the exception of the antenna access The module itself contains the lower ground plane so it is not necessary to have a
185. ment is the property of Insight SiP and should not be disclosed to any third party ker rpi without written permission Specification subject to change without notice Insight SiP It s all in the package BLE MODULE ISPO091201 ISP091201 Bluetooth Low Energy Module with Integrated Antenna Key Features Single Mode BLE v4 0 Slave 4 Nordic Semiconductor uBlue products based Includes transceiver baseband software stack 4 Ultra Low Power Consumption Single 1 9 to 3 6 V supply Very small size 8 0 x 12 0 x 1 5mm Temperature 40 to 85 C Fully integrated RF matching and Antenna Integrated 16 MHz Crystal Clock Certifications 4 FCC Limited Modular Certification Complies with CE Complies with IC Bluetooth SIG certified RoHS compliant Ultra Configurable delat RF I O pin Matching 2 4 GHz system Network Transceiver Custom Low Power Micro controller Antenna Flash 32 kHz XO Memory Advanced Power Power Supply Management decoupling 16 MHz XO Applications Space constrained BLE Slave Devices Sport and fitness sensors Health care sensors Out of Range OOR sensors Personal User Interface Devices PUID Remote controls General Description This module is based on Nordic Semiconductor nRF8001 uBlue Bluetooth Low Energy Platform The nRF8001 is a single chip transceiver with an embedded baseband protocol engine suitable for
186. mper connect to OFF and then Enable after supplying 5V from DC power supply provided in the Development kit June 1 2015 Page 5 8 Document Ref isp_ble_ Catalog R2 3 docx cre i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package ISP 1 303071 5 Start nRFgo Studio 6 Select nRF51 Programming 7 Click Erase all nRFgo Studio File View Features 2 4 GHz SEGGER to use 518004330 Y E Front End Tests TX carrier wave output RX constant carrier LO leakage TXIRX channel sweep nRFS1822 RX sensitivity CE44DA40 0x0047 Bluetooth nRF8001 Configuration Region 1 Dispatcher Trace Translator T Programming of SoftDevice on nRF51 device nRF8002 File to program 51822_6 0 0_softdevice hex C Lock SoftDevice From readback SoftDevice size kB 80 Program SoftDevice Program Application lI Program Bootloader d Size 256 kB Device Manager Motherboards nRFS1 development dongles Segger 480103054 nRF51 Programming nRFS1 Bootloader nRF24LU1 Bootloaders c Nordic Semiconductor 454 2008 2013 Erase completed Fy pea June
187. mples nRF2741 nRF8001 module with SMA connector patch cable nRF2735 Carrier board with an nRF8200 application processor E Bluetooth low energy master 5nRF8001 samples nRF2740 nRF8001 module with PCB antenna Software and Documentation Components The SDK Software Development Kit can be downloaded from a Nordic MyPage account at www nordicsemi com In order to access the download page the requested Product Key is written on the nRF8001 DK package Then download and install latest version of nRF8001 SDK Installer Installation will set up the software and will give access to Nordic Semiconductor user guide document R2 see 1 a as eo al June 1 2015 Page 9 3 Document Ref isp_ble_Catalog_R2 3 docx amz p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fz ri without written permission Specification subject to change without notice x Insight SP APPLICATION NOTE It s all in the package i S PO9 4 2 O 4 4 ISP091201 Development Kit ISPO091201 DK1 Hardware Components The Insight SiP ISP091201 Development Kit consists of the following hardware components 5 sample units ISP091201 BLE Module ISP110701 Test board CD Rom with Data Sheet and Application Note ISP091201 is the B
188. mption of temperature sensor node The specifications of each subset for one measurement per second are described below BLE module nRF8001 1 connection per second 2 bytes data size Average consumption 33 48 uA Microprocessor LPC1114FHI33 302 1 connection per second 2 bytes data size Average consumption 15 84 uA o Temperature sensing device TMP112 Measurement time 26 ms Average consumption 2 99 uA The total average consumption is around 52 30 uA which makes an autonomy of 0 31 year using a coin cell battery CR1632 that has a capacity of 140 mAh el Gd June 1 2015 Page 21 25 Document Ref isp_ble_Catalog_R2 3 docx HE a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party jc Sere without written permission Specification subject to change without notice of apt Insight SP APPLICATION NOTE It s all in the package AN 14 3050171 nRF8001 BLE urrent Notes mcu_ll Needed for Xtal Startup Tpost processing Radio 1920 Tpre processing Radio Assumes 1 packet with payload of 2 bytes 8 2 bytes 700 100 us interframe space ssumes 1 packet with payload of 2 bytes mcu_host SiTstop S 18200 Needed to transmit bits to Host processor house keeping otal Charge for
189. n CharacteristicConfigurationBits Indication 00002 PrimaryService 0x955A1523 0FE2 F5AA A0S4 84B8D4F3E8AD G CharacteristicDeclaration h apaia Pad Witte Characteristic UUID Ox955A1 526 DFE2 F5AA A094 84B8C b CharadteristicDeclaration Pipal Read Write Geena UUID 0x955A1525 DFE2 F5AA A094 84B8C L UUID 955A1525 0FE2 F5AA A094 84B8D4F3E8AD Value BB Characteristic Declaration Properties Read Write Characteristic UUID 0x95541524 DFE2 F54A A094 84B8C i UUID 955A1524 0FE2 F5AA A094 84B8D4F3E8AD Value 01 12 23 34 45 56 67 78 89 9A AB BC CD D Attribute value UUID G0 1526 Handle Ox 000E Display as UTF8 Value hex tet 0001 00F5 15 37 48 1 Disable Services Ox lt D00B 2 15 37 48 2 Updated handle 0008 with value 0 0 15 37 48 2 Successfully updated the store value of CCCD 15 37 49 7 EnableServices Qx000B 2 15 37 49 7 Updated handle 0008 with value 2 0 15 37 49 7 Successfully updated the store value of CCCD 15 37 59 3 Received Connection Parameter Update Request E at 53 5 lili aliak i ee sent with ACCEPTED response Connection Parameters Update sent Con Ims SlaveLatency 0 Supervision Timeout 4 8 You can note data that transit between the ISP140501 and the Master Emulator via the Bluetooth link 9 To switch off 1SP140501 remove the CR2450 battery June 1 2015 Page 12 3 Document Ref isp_ble_Catalog_R2 3 docx pF Insight SiP Green Side 400 av
190. n be separated in two phases Phase 1 phase of slave master communication or connection phase in this phase the BLE module communicates with the master to send the measurements read by the sensing devices and sent to BLE module by the microprocessor Thus the BLE module the microprocessor and sensing device are active and consume the maximum of current e Phase 2 Standby Sleep phase in this phase there is no communication between the BLE module and the master Thus the BLE module and the microprocessor are in Standby mode Figure 2 illustrates the two functioning phases of the Bluetooth Smart temperature node The measurements presented in Figure 2 are realized by the oscilloscope A Oe a June 1 2015 Page 21 3 Document Ref isp ble Catalog R2 3 docx tie vee i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ie EA as The information contained in this document is the property of Insight SiP and should not be disclosed to any third party i Lee without written permission Specification subject to change without notice ee L Insight SP APPLICATION NOTE It s all in the package AN 4 30501 Tek ne Trig d M Pos 1 000rn TRIGGER Type Source CH1 slope elit 1 Mode UL Se Auto Coupling CH1 200m M 25 0ms CHI 14d 26 Apr 13 21 57 10 0015Hz Figure 2 Functioning phases of the Bluetooth Smart sensor no
191. n contained in this document is the property of Insight SiP and should not be disclosed to any third party Fes without written permission Specification subject to change without notice Insight Si ANT BLE MODULE It s all in the package ISP 1 303071 ANT Electrical Schematic Electrical schematic showing ISP130301 module connections antenna Ant1 OUT_ANT OUT_MOD R n 88222 pat ee Ty Dy Hy oe E X z q essal g p W 7 N N Lf La c TEETE ess SSK 9933995 g V 8588388 O 8 8 ba ba ba ba EREL EE y 21212121212 8121312 21213 Bf Z 2 ve i 5 WwW x o lt wl S 2 3 2 2 2 43 3133 4 3 i Sal S 5 S 3 5 jasses y 8 O a 5 2 9 Z 2 gt S D N i o O O 2 o R z 2f Si c7 June 1 2015 Page 6 5 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Fee without written permission Specification subject to change without notice Insight SP ANT BLE MODULE It s all in the package ISP 1 303071 ANT 2 RF Performances RF Specifications according to standards Parameter Value Unit Condition Channels Output Power 20 to 4 0 to 39 RF Frequency tolerance Better than Channels quency 20 0 to 39
192. n on handle OOOE with value F4FFICFBFO20E8018C01F500 17 29 51 0 Received a HandleValueNotification on handle 000E with value E4FFICFBFC20E 4018001FD00 17 30 44 4 Received a HandleValueNotification on handle OOOE with value FSFF18FBF420EE018201F800 17 23 51 0 Received a HandleValueNotification on handle OO0E with value ESFFO4FBF420E 301 7401D800 17 30 44 5 Received a HandleValueNotification on handle DODE with value 04001 4FB0821ED017D01EF00 17 23 51 0 Received a HandleValueNotification on handle 0012 with value E2E6E 301B3E93D00 17 30 44 5 Received a HandleValueNotification on handle 0012 with value 45E8ED0124E43D00 17 29 51 1 Received a HandleValueNatification on handle OO0E with value F8FF28FBFC20E 201 7401EE 00 17 30 44 5 Received a HandleValueNotification on handle 000E with value 000024FBE 420F0019701FCO0 17 29 51 1 Received a HandleValueNotification on handle OO0E with value FOFF14FBEC20DB017701D600 17 30 44 5 Received a HandleValueNotification on handle 000E with value F8FF24FBEC20EC018501FB00 17 23 51 1 Received a HandleValueNotification on handle OO0E with value 00001 4FBDC20ED017301EE00 17 30 44 6 Received a HandleValueNotification on handle OO0E with value 08001 8FB0021F3018701DF00 17 23 51 1 Received a HandleValueNotification on handle 0012 with value DEEGEDO1BBE93D00 17 30 44 6 Received a HandleValueNotification on handle 0012 with value 44E 8F301 48E 93D00 17 23 51 1 Received a HandleValueNotification on handle OODE with v
193. nd small primary button cell battery CR2450 Overall size of the device IS comments 33x33 x 8 7 mm GPIO lt has been developed to explore the full range of EENE development possibilities for beacons using 2 Buttons Bluetooth Smart technology They allow indoor positioning letting your phone know that you are in range of a beacon As the beacon name suggests they transmit packets of data in regular intervals and this data can be then picked up by devices like isP140501 smartphones CR2450 nRF51xXX Ultra low power consumption and advanced power management enables battery lifetimes up to several years on a coin cell battery Even though its very small size 8 x 11 x 1 2mm the ISP130301 SiP module integrates decoupling capacitors 16 MHz and 32 kHz crystals load capacitors DC DC converter RF matching circuit and antenna in addition to the wireless SoC The host processor that handles the autonomous sensor application the high level portion of the BLE protocol stack and communication with the RGB LED is a low power 32 bit MCU ARM Cortex M0 based integrating 256kB flash memory and 8kB SRAM The two buttons can be programmed to enable easy switching between modes and or functionality As well an RGB LED can be configured to indicate different events An interface board ISP130603 is available from Insight SIP development kit and allows for easy flash programming the application processor via the 10 pin FPC connector
194. nected oO a OJE r m June 1 2015 Page 16 6 Document Ref isp_ble_Catalog_R2 3 docx jm a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Do eee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party tare without written permission Specification subject to change without notice m T 5 Insight SP APPLICATION NOTE It s all in the package H S P 4 209 O 4 Reset Accelerometer with small reset button On Panel Perform Device Discovery ES Proximity Accelero Demo k Efx i OOSZWXON m Open Proximity Accelero App Immediate alert level Off Low High Set Link loss level Off Low High Set InteryvalMs aa Latency soo o Set 75 4000 ms 3000 32000 ms 0 500 Range g_X g_Y g_4 ABE MOD oy te Rot Y Rot Z Ferom device discovery Setup assigned pipenumber 3 type TRANSMIT Setup add service 021803 store REMOTE_STORE Setup add char def 042406 Setup assigned pipenumber 4 type TRANSMIT WITH_ACK Setup add service 0217802 store LOCAL STORE Setup add char def 2406 Setup assigned pipenumber 5 type RECEIVE Aun Connected O SSS Ea ae r m June 1 2015 Page 16 7 Document Ref isp_ble_Catalog_R2 3 docx jm Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ar ah
195. niversal Host Controller 2728 Digital Signer Not digitally signed InteR 828016 ICH Family USB Universal Host Controller 2729 gt Intel R 828016 ICH Family USB Universal Host Controller 272A z Intel R 828016 ICH Family USE Universal Host Controller 27CB To view details about the driver files Intel R 626016 ICH Family USB2 Enhanced Host Controller 2720 USB Composite Device USE Mass Storage Device USB Root Hub USB Root Hub Bement If the device fails after updating the driwer roll gt USB Foot Hub 7 back to the previously installed driver USB Root Hub LSB Root Hub Uninstall USB Serial Converter 4 USB Serial Converter B Tag a ial x Update Driver To update the driver for this device To uninstall the diver Advanced Device Manager Sle USB Serial Converter B Properties x File Action view Hel General Advanced Driver Details e gt H f8 e m zRg fap USB Serial Converter B SB Processors amp SCSI and RAID controllers Sound video and game controllers S Storage volumes System devices Universal Serial Bus controllers Generic USB Hub Intel R 828016 ICH Family USB Universal Host Controller 27C8 Intel R 82801G ICH Family USB Universal Host Controller 27C9 Intel R 828016 ICH Family USB Universal Host Controller 27C Intel R 828016 ICH Family USB Universal Host Controller 27CB Intel R 82801G ICH Family USB2 En
196. not be disclosed to any third party he without written permission Specification subject to change without notice Insight SiP BEACON DEV KIT It s all in the package i S P 4 405 O 4 HOME _ lt lt June 1 2015 Page 11 2 Document Ref isp_ble_Catalog_R2 3 docx p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 75O fF The information contained in this document is the property of Insight SiP and should not be disclosed to any third party H es without written permission Specification subject to change without notice Insight Si iP APPLICATION NOTE It s all in the package ISP 1 405011 HOME lt lt AN140801 lt a Use of ISP140501 DK1 a ot cLK io Op Ro etic r o Zo R3 RS poa A PaP Introduction This application note describes how to set up a Beacon application with ISP140501 that will send data via the Bluetooth link to the Master Emulator or to a device iPhone or Android device Two types of demonstration are presented The first one is directly executable with hardware and software provided in the Development Kit using Master Control Panel application The second demonstration requires the use of an iPhone 4S or higher or an Android device 4 3 or higher Contents 1 Demonstration with Master Control Panel ccccceecceseeeeeeeeeeeeeeeseeeeseeeeeseeeeseeeeeseeeesseeeees Page
197. ntation Motion sensor node Microprocessor LPC1114 Consumption Symbol Time Voltage Current Charge ms mV mA MC lon Data send oo 24 OT 34 8 amp i6 sowan o o o ooo o oS S 2 o oo S MCC 3 4 Total L r 56 Table 9 Orientation Motion sensor node current and charge consumption measurements of microprocessor as measured by oscilloscope method Similarly to measure the BLE module current consumption in orientation motion sensor node we have 6 consumption segments These 6 segments correspond to events presented in Table 2 Table 10 presents the corresponding current and charge consumption values of BLE module as measured by oscilloscope method Orientation Motion sensor node BLE module Consumption Current mA a Table10 Orientation Motion sensor node current and charge consumption measurements of BLE module as measured by oscilloscope method According to Table 7 and Table 8 for temperature sensor node and comparing to Table 5 and Table 6 for light sensor node or Table 9 and Table 10 for orientation motion sensor node we find that the current consumption of light or orientation motion sensor nodes is more important than the current consumption of the temperature sensor node especially the consumption of BLE module In fact this increase in current consumption of BLE module is mainly related to the consumption time of Imcu_Host which is longer in the case of light or orientation motion sensor nod
198. o g_y Value update notification 0 421875 Sa N r AJ Received Accelero g_z Value update notification 0 84375 DRC ISP090401_ Tech SELECT Received AttHandleValueN tification on pipe number 2 with value 053712 Report_Insi 5 0 Received Accelero q_x Value update notification 0 234375 Received Accelero g_y Value update notification 0 421875 gt a EI Received Accelero g_z Value update notification 0 84375 us Received AttHandleValueNotification on pipe number 2 with value 033513 Dropbox Passeport_ Top_Pour dsn i sa mies p Connected E June 1 2015 Page 16 9 Document Ref isp_ble_Catalog_R2 3 docx jm Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ar ie The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ar es without written permission Specification subject to change without notice m ie Insight SiP APPLICATION NOTE It s all in the package S P 4 2 o9 O 4 Stop Software To switch off PC program click on top Right Corner of both windows To switch off accelerometer remove battery as shown June 1 2015 Page 16 10 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E The information contained in this document is the
199. ode ececseeeeeeeeeeeeeeeeaeees Page 21 25 4 2 Consumption Calculating model of Light Sensor node cceceeeeeeeeeeeeeeeeeeeeeeeeeeeeeees Page 21 26 4 3 Consumption Calculating model of Orientation Motion Sensor NOde cccceeeeeeeeeees Page 21 27 4 4 Model MeasureMmentS COMPALISON ccccccccsececeeceaeeeceeeeseeeceeceseueeseeeeeueeseeeeseeesueeseeesaes Page 21 29 ors June 1 2015 Page 21 1 Document Ref isp_ble_Catalog_R2 3 docx tie ah i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ie sight a i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party i Lee without written permission Specification subject to change without notice abt Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 1 Introduction 1 1 Scope This application note describes the performance of three different Bluetooth Smart sensor nodes especially the low power hardware software platform design The design of these sensor nodes contain a low power System in Package SiP module ISP091201 which integrates both a miniature Antenna in Package AIP and all the electronic components transceiver quartz SMT components to ensure RF communication at 2 4 GHz The node also contains a low power sensing device and the low power host microprocessor LPC
200. of Insight SiP and should not be disclosed to any third party ete E without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 405 O 4 8 Goto Beacons windows and see the notification about the Beacon detection on your device nRF Beacon PGND cy 9 To switch off 1SP140501 Beacon remove battery 3 Demonstration with iPhone Device 4S amp higher The free beacon application developed by Nordic Semiconducior is available on the App Store Make sure the Bluetooth is activated on your device go to wireless device settings Download and install the nRF Beacons app on the App Store You should see the following screen on your device a a te ee Ta T l pho Safari Musique June 1 2015 Page 12 6 Document Ref isp ble Catalog R2 3 docx ae Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party AE without written permission Specification subject to change without notice kes L Insight SP APPLICATION NOTE It s all in the package i S P 4 4050 4 Then you will be able to set up the application demonstration as follows 1 Place the CR2450 battery into the Beacon ISP140501 2 Start nRF Beacon application on your iPhon
201. oller In the following the microcontroller is referred to as the application controller June 1 2015 Page 7 8 Document Ref isp_ble_Catalog_R2 3 docx ai Petr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ah ey i The information contained in this document is the property of Insight SiP and should not be disclosed to any third party r at L without written permission Specification subject to change without notice ale ua Insight SIP BLE MODULE It s all in the package ISPOO 1 207 4 Mechanical Outlines Mechanical Dimensions Dimensional drawing for 8 x 12 x 1 5 mm 36 Pad LGA Package 1 50 mm 0 1 mm Ee 5 a ee Bi ISP091201 TOP VIEW SIDE VIEW June 1 2015 Page 7 9 Document Ref isp ble Catalog R2 3 docx a a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com En z The information contained in this document is the property of Insight SiP and should not be disclosed to any third party F icky without written permission Specification subject to change without notice Insight SIP BLE MODULE It s all in the package ISPOO 1 2071 SMT Assembly Guidelines Recommended PCB Land Pattern and Solder Mask layout mS TEDA Sa Poa Solder Mask eal eral meal eea teed tered eed ered ead ese eee te Perera tees
202. omo yos a Loa ez PAVD FAZELD LOW 0 Old H ZLWW OBZELO LNOWID OO d axt oz ad Ob su ISO zoa pz OLYWTLIZELO ZOY L Old y m 0 00ld L3S3u TSS TH NOY aLOZL6OdSI sga D tN eoa pz HAV HAZEL GV lOd O YLO O0 Zola OSIN aN9 J z auina 80N9 1 ONO 5 WwyO OOL 4 doy ONSON EZ fis ri 5 5 Ly z g 0aN9 NAQG amp 0 am 3 3 ro 2 L Lozo o9 Jequinu peg o BNO 1353 pi W a 43d01 9 eon on Y 8 7 Ps E Szo N IN T 3 x 3 1 40z09 zon sci p wou ON aSa 393 oaToon g a 3 FE pLONo O o L SA 5 5 5 9 GND AJAA at T z i z6 T WS SOND ano GEIN PEIN STIN SEIN LEIN PEIN GEIN 4 T ddi DNS D S ONO ELON9 en am 30g GNO 0q GNO de 3 o1ams Oxi now a U Q soa on ia i UOHISUUOD LYYN POWN IS E9 Edl m 90 2 OND wwy quod jse 4N0L 0 4 OL u z ae S19 HO Swi oO irand 1 10z09 a s0809 0809 N Q scono 0 Zdl tdl 7 Ka LSGN9 win juod 531 ww uid yse r O F GANS P o a dp du 0l 9 ddy 30A axl Oxy 740 T OdT DOA 7 ho a Document Ref isp_ble_ Catalog R2 3 docx Page 19 3 without written permission Specification subject to change without notice Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party June 1 2015 Insight SiP BLE SENSOR It s all in the package ISP 41 20971 4 2 RF P
203. oumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E Qe The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fs 4 without written permission Specification subject to change without notice ae Insight SiP BLE MODULE It s all in the package ISP 1 30301 3 Product Development Tools Interface ISP130301 integrates a full microprocessor interface with up to 32 General Purpose I O pins GPIO and several functions 2 x SPI 2 x 12C UART 8 x ADC SWDIO interface Hardware The following development kit is recommended for using and testing ISP130301 module Insight SiP Development Kit ISP130301 DK1 need to be purchased separately Development Tools and Software The following development tools and software are recommended for using and testing 1SP130301 module Nordic Semiconductor nRFgo Studio downloadable from www nordicsemi com after purchasing ISP130301 DK1 Nordic Semiconductor Master Control Panel downloadable from www nordicsemi com after purchasing ISP130301 DK1 Keil MDK ARM Lite downloadable from https www keil com demo eval arm htm Segger J Link Lite downloadable from http www segger com jlink software html S100 nRF51822 SoftDevice fully qualified Bluetooth low energy stacks for nRF51822 integrated in ISP130301 module The S100 series of SoftDevices object code no source can be downloade
204. out written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 41 303071 5 Packaging Markin a R 001 A03467 IC 11306A ISP130301 FCC ID 2AAQS ISP130301 Model ISP130301C YYWW A S P 1 3 0 3 0 1 C Yiyiwiw i Prototype Packaging For engineering samples and prototype quantities up to 99 units deliveries are provided in thermoformed trays Trays For higher quantities and volume production ISP130301 are available in Jedec trays They are delivered in sealed pack with desiccant pack and humidity sensors These Jedec trays are also suitable for further baking Please see section 6 for more information on moisture sensitivity Jedec trays are proposed in standard quantities of 100 units 200 units and multiples of 200 units only Please refer to tray sizes and module positioning below Complete information on Jedec trays is available on request a g June 1 2015 Page 3 13 Document Ref isp_ble_Catalog_R2 3 docx p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party rs without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 1 303071 322 6 2 54
205. owing address _hitp www microsoft com en us download details aspx id 17718 To install this package follow the instructions on the Microsoft website Microsoft XNA Framework Re distribuable 4 0 This can be downloaded from Microsoft at the following address _hitp www microsoft com en us download details aspx id 20914 To install this package follow the instructions on the Microsoft website This is necessary since the visual representation of the orientation of the accelerometer uses Microsoft Game studio Nordic Semiconductor nRF8001 SDK v1 7 Run the nRF8001 SDK so as to be able to use the Master Emulator USB drivers June 1 2015 Page 16 1 Document Ref isp_ble_Catalog_R2 3 docx mi che Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 76 PE m E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insisht SP APPLICATION NOTE LB BAL o4 ISP120901 It s all in the package Accelerometer Demo Folder The Accelero _Demo_EXE zip file should be un zipped at any suitable location on the PC This contains the executable file and all the dll files necessary for the demonstration to run The directory should be as shown below Mame Size Type Date Modified B accelera exe 236 K6 Appl
206. party f Soa E without written permission Specification subject to change without notice mee Insight SiP BLE MODULE It s all in the package ISP 41 30301 Pin NEG Pin function Description 41 PO_06 AIN7 Digital I O General purpose I O pin Maree Analog input ADC input 7 Analog input ADC Reference voltage Analog input ADC input 4 Analog input ADC input 5 Analog input ADC input 2 PO 31 Digital I O General purpose I O pin Analog input ADC input 3 AREFO Analog input ADC Reference voltage GND_EP Exposed metal pad Should be connected to ground plane on application PCB ISP130301pad placement and pin assignment for the LGA QFN package TOP VIEW June 1 2015 Page 3 4 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com tE The information contained in this document is the property of Insight SiP and should not be disclosed to any third party f without written permission Specification subject to change without notice Insight SiP BLE MODULE It s all in the package ISP 41 30301 Electrical Schematic Electrical schematic showing ISP130301 module connections antenna Ant1 OUT_ANT OUT_MOD R PO_14 SWDCLK SWDIO PO_16 PO_15 nRF51822 CEAA 0_06 AIN7 AREF 1 0_00 AREFO 0 01 AIN2 0_03 AIN4 0_04 AINS 0_05 AIN6 P0_02 AIN3 F9 PO_08 PO_09 H9 p PO_O6 AIN7 AREF1 G8 E9
207. phia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP It s all in the package EUROPE AMERICA AUSTRIA GERMANY SWITZERLAND TEKMODUL Willibaldstrasse 14a 80687 Munchen Germany Phone 49 89 51 39 96 24 Email info tekmodul de Web www tekmodul de BELGIUM DENMARK GERMANY NETHERLAND TEXIM EUROPE Elektrostraat 17 Postbus 23 7480 AA Haaksbergen The Netherlands Phone 31 53 573 32 01 Email info texim europe com Web www texim europe com FRANCE ACAL BFI 4 All e du Cantal Z La Petite Montagne Sud CE1834 Lisses 91018 EVRY Cedex France Phone 33 0 1 60 79 59 00 Email sales fr acalbfi fr Web www acalbfi com fr IRELAND UK IO Components Units 3 4 amp 5 Holes Bay Park Sterte Avenue West Poole BH15 2AA Dorset United Kingdom Phone 44 0 1202 440422 Email enquiries io components com Web www io components com CANADA MOTION MICRO 300 March Road Kanata K2K 2E2 Ontario Canada Phone 1 613 667 9157 Email sales motionmicro com Web www motionmicro com USA INSIGHT SIP C O EHS amp H Suite 400 7979 East Tufts Avenue Denver CQ80237 USA Phone 33 0 6 07 77 14 74 Email contactus insightsip com Web www insightsip com SA
208. polis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice bEZELO SOv b LOld OdVO OSZELO SLY S 1Old E O 7 T x 9 S wo g 5 E OdT IDA 2 Q 5 3 ZLY LEZELO POW E LOld OlGMS vLOND ESIN PEIN GEIN EON LEON BEIN GEIN TENN doy GND oe dNSayVM ELVIN SLOND GN LONO OIGMS axl no 30g GND 10g GND uooauuop 1YYN epow jso soav axy NOW Edl 400 ONS OND GND Ww juiod ysay 0N9 doy GN du 0L 9 ezo 1 10Z09 aN OL 9 y SEGN9D SLO 0 AND s0809 ZSQN9 0 AND Zdl ww julod ysay kdl wwp julod sal a t Hr It s all in the package A coheed WN A 4u 0L 9 _ v9 1 40z09 Od7 SDA Electrical Schematic June 1 2015 Insight Si Insight SiP BLE SENSOR It s all in the package ISP 41 20901 2 RF Performances RF Specifications according to standards The performance of the Bluetooth Low Energy Radio link is that obtained by the ISP091201 module Temperature range 40 C to 85 C BT V4 Parameter Value Std limit Unit Condition 09 20 to 10 dBm Channels 0 to 39 Better than 50 Hz Channel 0 to 39 20 Level for BER 70 gsm lt 0 1 ideal Tx p Open field at 1m height dBm 3 Mechanical Outlines 18 0 nm 6 0 nmm Dimensional drawing z
209. pplication on nRF51 device File to program farm _build ble_app_proximity hex E Lock entire chip from readback Address 0x14000 Region 0 SoftDevice Size 80 kB Firmware 110_nRF51822_6 0 0 Id 0x0049 Device Manager X Motherboards nRF51 Program nRF51 Bootloader nRF24LU1 Boo Browse to SoftDevice hex file and click Program The file project is located for example C Keil_v5 ARM Device Nordic nrf51_sdk_v6_0_0_43681 nrf51822 Boarad nrf6310 s110 ble_app_pr oximity arm _ build June 1 2015 Page 5 12 Document Ref isp ble Catalog R2 3 docx ae l Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 1 op The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ha without written permission Specification subject to change without notice one Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 Master Emulator and Proximity Application Connect Development Dongle PCA10000 Master Emulator into a USB port on your computer 2 Start Master Control Panel 3 Click Start Discovery Master Control Panel File Help Master emulator COME 480703054 490103054 connected Scan for devices Stop discovery Discovered devices Nordic_Prox OxD 5260 85026 24 54dEm Select device Delete bond info Log
210. r Connection Interval Tpberioa 1s as presented in Figure 15 is of the order of QpPhase 1 Phase 2 C x AV 530uF x 0 104V 55 12 uC Figure 16 presents the measurements of total consumption of temperature sensor node during the communication phase Phase 1 We observe a voltage drop of 88 mV during this phase so the total charge consumption in the communication phase is of the order of Qpnase1 C X AV 5304F x 0 088V 46 64 uC This is consistent with measurements made for the BLE module and the microprocessor by the oscilloscope method presented in the previous paragraph Table 5 and Table 6 where Qeie 34 36 uC and Qp 9 86 uC The difference between the two measurements is the consumption of the sensing device during the communication phase Phase 1 so Qsensor 46 64 34 36 9 86 2 42 UC OR June 1 2015 Page 21 17 Document Ref isp_ble_Catalog_R2 3 docx es Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com 418 0 s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Lie e without written permission Specification subject to change without notice a Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 Tek AME Acq Complete M Pos 692 0ms CURSOR fr Type Oem a 0y CH2 100m M 10 0rns CH2 2 78 16 May 13 23 24 lt 1
211. re 40 to 75 C This module is based on nRF51822 Nordic Fully integrated RF matching and Antenna Semiconductor 2 4GHz wireless System on Chip Integrated 16 MHz and 32 768 kHz Clocks SoC integrating a 2 4 GHz transceiver a 32 bit ARM Cortex MO CPU a flash memory and Certifications analog and digital peripherals It can support BLE _ _ _ _ _ _ _ _ _ and a range of proprietary 2 4 GHz protocols such Complies with FCC as Gazell from Nordic Semiconductor Complies with CE Fully qualified BLE stacks for nRF51822 are So E a E implemented in the S100 series of SoftDevices 4 ao SIG certified which can be freely downloaded ISP130301 can then be used in Master and Slave modes for BLE and for both ends of other proprietary protocols The ANT protocol can be handled on request RoHS compliant Eo Eo ADC xB The module is specifically designed for both PC peripherals and ultra low power applications such sl as sports and wellness sensors Ultra low power I2C x2 2c dh GPIO consumption and advanced power management E enables battery lifetimes up to several years on a 16MHz g coin cell battery Even though its very small size 8x11x1 2mm the module integrates decoupling abt capacitors 16 MHz and 32 kHz crystals load capacitors DC DC converter RF matching circuit TEES and antenna in addition to the wireless SoC Cortex nRF51XXX The module forms a standalon
212. re the voltage and duration of each segment of consumption displayed on the oscilloscope as presented in Figure 6 June 1 2015 Page 21 8 Document Ref isp_ble_Catalog_R2 3 docx ex Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party t without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 Tek ne Trig d M Pos 1 800rms CH1 Coupling BLE B Limit 200MHz volts Dy 4 7 Probe O 10 lt gt PE Sensor Voltage 0 7ms 1 7ms 1 2ms 1 nt CH1 200m CH2 200m MM 1 00ms CH4 J 720m CH4 200m 24 Apr 13 00 03 10 0007H2 Figure 6 Temperature sensor node current consumption measurements of BLE module microprocessor and sensing device as measured by oscilloscope method For the microprocessor current consumption measurements in temperature sensor node we have three consumption segments 0 7 ms 1 ms and 1 2 ms as presented in Figure 6 The corresponding current and charge consumption values in these three segments is presented in Table 5 These three segments correspond to events presented in Table 3 The current and charge consumption calculations associated with each segment are based on the following two equat
213. re sensor TMP112 light sensor APDS 9300 and orientation motion sensor MMA 660FC The values of current consumption of these three sensing devices in each connection event are defined in Table 4 Temp sensor TMP112 Symbol Nom Unit Light sensor APDS Symbol Nom Unit Orientation Motion sensor MMA7660FC Symbol Nom Unit lon 0 047 to 0 294 Depending on Sampling Rate Table 4 Current consumption values of temperature light and orientation motion sensors ors June 1 2015 Page 21 6 Document Ref isp ble Catalog R2 3 docx tie eats ri Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com Er esi The information contained in this document is the property of Insight SiP and should not be disclosed to any third party jd a a without written permission Specification subject to change without notice ra tess 4 Insight SP APPLICATION NOTE It s all in the package AN 14 3050171 2 1 2 Power management and optimization of current consumption The power management consists to minimize the current consumption of the three subsets BLE microprocessor and sensor in the two phases of operation For the first phase where the BLE microprocessor and sensing device are active we must choose the operation parameters of the three subsets that reduce the current consumption to the minimum We must therefore manage the time and the level of cu
214. responding current and charge consumption values in these two segments are presented in Table 7 The third segment Isieep IS Not used in light sensor node lsieep_time 0 because the Read operation 12C communication between the sensing device and the microprocessor is done after Radio activities to minimize the current consumption of the sensing device In fact the light sensing device has a relatively high current consumption when it is active 0 24 mA cf Table 4 and it hasn t Shut_Down option after its conversion time as in temperature sensing device case The power management we have proposed is to turn on the sensing device during the first microprocessor activity waiting its conversion time min_time gt 13 7ms using Deep Sleep mode then read sensing device measurements and turn it off Light sensor node Microprocessor LPC1114 Consumption Time Voltage Current Charge Symbol ms mV mA uC lon Data send Isep Wait 000 f 10 lon Read Total Table 7 Light sensor node current and charge consumption measurements of microprocessor as measured by oscilloscope method Similarly to measure the BLE module current consumption in light sensor node we have 6 consumption segments These 6 segments correspond to events presented in Table 2 Table 8 presents the corresponding current and charge consumption values of BLE module as measured by oscilloscope method Light sensor node BLE module Consumption 2 Si
215. rom device discovery Disconnect Received AtH andev alue otiication on pipe number 2 with value 100E 2 04 Receved Luminosity Sensor Value update notification 1674 4 Received AttHandeValueN otfication on pipe number 2 with value 120E 2804 Receved Luminosity Sensor Value update notification 1815 408 Receved AttHandeValueN otfication on pipe number 2 with value 130E 2804 Recerved Luminosity Sensor Value update notification 1815 912 Receved AHH andle alue otfication on pipe number 2 with value 180E 2404 Recerved Luminosity Sensor Value update notification 1818 432 Connected E June 1 2015 Page 20 10 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package ISP 41 20971 4 Stop Software To switch off PC program click on top Right Corner of the window To switch off Luminosity Sensor remove battery as shown below June 1 2015 Page 20 11 Document Ref isp_ble_ Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in thi
216. rrent consumption while maintaining the proper functioning according to the intended application For the second phase where the subsets are in Standby Sleep mode it is to operate the BLE and the microprocessor in Sleep mode and deactivate the sensing device The goal is to reduce the total current consumption during this long phase to near zero It is important to know that the total current consumption depend on the data size to be read by the sensing device and to be send by the microprocessor after 12C communication to BLE module using SPI interface then the BLE module will send these data to Master using BLE wireless connection In fact the total current consumption depends on the type and the number of used services defined in Bluetooth Low Energy protocol for a given application The transmitted data between the microprocessor and the BLE module are managed by these services Thus the number of defined services and the data size of each service will define Data Layer post processing period together with the TX time and consequently the level of current consumption For example for the temperature node we have defined just one service with data size of 2 bytes which are the temperature measurements While for the light node we have defined just one service with data size of 4 bytes which will lead to more current consumption Clearly larger the data size to be transmitted greater Data Layer post processing period and the lon tim
217. rsion mefw_nf51822_0 9 0 10022 15 32 08 8 Ready 15 32 08 9 SERVER Server has started 10 0 Device discovery started June 1 2015 Page 12 2 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package K S p 4 405 O 4 7 On the following display click successively on Bond Service Discovery and Enable Services File Help Master emulator 480106451 comectd Device info Device address CBIDFD2C8C2A Bonded True Actions Sa Co Service Discovery E PrimaryService Generic Access 01800 CharacteristicDeclaration Properties Read Write Characteristic UUID 0x2A00 i DeviceName DeviceName Beacon Config i 5 pains R Properties Read Characteristic UUID x2A01 i i Appearance Appearance 01234 S Characteristic Declaration Properties Read Characteristic UUID 2A04 i i SlavePreferedConnectionParameters MinConninterval 00190 MaxConninterval 0x0320 SlaveLatency PrimaryService Generic Attribute x1801 _ E Characteristic Declaration Properties Indicate Characteristic UUID 0x2A05 i ServiceChanged No values read i ClientCharacteristicConfiguratio
218. rty without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 Direct Test Mode Testing 1 Start nRFgo Studio 2 Select Direct Test Mode nRFgo Studio Direct Test Mode UART interface File view nRFS001 Setup Help Direct Test Mode UART interface Front End Tests Set up on v TX carrier wave output RX constant carrier LO leakage v TXIRX channel sweep Com port COM10 Refresh list of com ports RX sensitivity E Bluetooth Mi nRF8001 Configuration Transmit O Receive Dispatcher Trace Translator Direct Test Mode Channel bea Single Sweep Channel 19 Payload model Constant carrier J Device Manager Payload length Motherboards z t nRFS1 Programming Packets received NJA nRFS1 Bootloader nRF24LU1 Bootloaders c Nordic Semiconductor 454 2008 2013 3 For details on how to use the Direct Test Mode press F1 to open the nRFgo Studio help Important notification Erase all before loading the ble_app dtm The SoftDevice must not be loaded only the ble_app_ dtm with uvision or with nRFgo studio in Program Application load the ble _app_dtm hex SSS en ns ate June 1 2015 Page 5 19 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insi
219. s which can be freely downloaded nRF51 platform also provides extensive software support for ANT pa applications with S210 SoftDevices and dual Caps a YRAN ANT BLE stack S310 SoftDevices ISP130301 SWD Interface ANT can then be used for ANT applications as well _ as Master and Slave modes for BLE or proprietary piez protocols on request 16Mhz iz mo The module is designed for ultra low power Caps applications such as sports and wellness sensors a a hereon Advanced power management enables battery al lifetimes up to several years on a coin cell battery eroi sch Even though its very small size 8 x 11 x 1 2 mm ISP130301 ANT the module integrates the wireless SoC load and decoupling capacitors 16 MHz and 32 kHz crystals DC DC converter RF matching circuit and antenna The module forms a standalone ANT ANT BLE_ node for which only the addition of a suitable DC power source and appropriate sensor is necessary for sensor applications As the module has several end applications the antenna was designed to be compatible with several ground plane sizes such as USB dongle or cell phone June 1 2015 Page 6 1 Document Ref isp_ble_Catalog_R2 3 docx a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com age The information contained in this document is the property of Insight SiP and should not be disclosed to any third party her dian
220. s document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package ISP 41 20971 4 June 1 2015 Page 20 12 Document Ref isp ble Catalog R2 3 docx ma ArT Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package AN 4 30501 AN130501 Power Optimization Bluetooth Sensors Contents 1 introd cese E E E Page 21 2 A E 6 6 E EE E E E E E E O A E E E A E E E E E E E E Page 21 2 1 2 Bluetooth Low Energy Wireless sensor NOCES ccccceeceeeeeceeeeseeecaeeseeeeeeeeseeeeseeesaeeess Page 21 2 2 Current Consumption MethodS cccccccccccccccccecssessseeeeeeeeesessssseeeeeeeeeeeeeseeaaes Page 21 3 21 mes 61 lt 1 2 o ai A E E ee ene er ee eee eee eee eee Page 21 3 2 1 1 BLE module Microprocessor and Sensing device current consumption Page 21 4 2 1 2 Power management and optimization of current CONSUMPTION cccceeeeeeeeeeeees Page 21 7 2 2 Oscilloscope measurement MEthOA cccc
221. s or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment CANADA User information This intends to inform how to specify the IC ID of our module ISP091201 on the product According to Canadian standards RSS 210 and RSS Gen the host device should have a label which indicates that it contains our module The label should use wording such as Contains IC 11306A ISP091201 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below IC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le pr sent appareil est conforme aux CNR d industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement June 1 2015 Page 7 17 Document Ref isp_ble_Catalog_R2 3 do
222. sion Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package ISP 1 209017 1 Luminosity_x should appear If this fails reset Luminosity Sensor to put into advertising mode and perform device discovery again Press on Connect Ea Proximity Temp Lumino Demo L OO6CKEY4 m Open i A Proximity App Luminosity 3 Immediate alert level Off Link loss level Off InteryalMs TimeoutMs Co Le 76 4000 ms S000 32000 ms Perfom device discovery Log Setup add service 021803 store REMOTE STORE Setup add char def Ux2406 Setup assigned pipenumber 4 type TRANSMIT WITH_Ace Setup add service Ox1602 store LOGAL_STORE Setup add char def 0x2406 Setup assigned pipenumber 5 type RECEIVE Run Device discovery Connected E June 1 2015 Page 20 8 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package ISP 41 20971 4 Display should change and be updated every Interval Connection IntervalMs Interval Connection is adjustable between 7 5 to 4000 ms Hereunder Interval Connection is confi
223. sor Value update notification 29 3125 Recerved AtH andeValueN otification on pipe number 2 with value 1050 Receved Temperature Sensor Value update notification 29 3125 Received AtH andleValueN otification on pipe number 2 with value 1050 Receved Temperature Sensor Value update notification 29 3125 Receved Att andeValueN otification on pipe number 2 with value 1050 Receved Temperature Sensor Value update notification 29 3125 Connected ml June 1 2015 Page 18 9 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE insight ai ISP120909 To change Interval Connection to 4000 ms for example write 4000 in tab IntervalMs step 1 then click on Set step 2 Then click successively on Disconnect and Connect step 3 Ea Proximity Temp Lumino Demo i oosoKey4d ggn Device name Temperature_3 Perform device discovery Disconnect Receiwed AHH andle alue otfication on pipe number 2 with value 1E80 Received Temperature Sensor Value update notification 30 5 Received AHH andle alue otfication on pipe number 2 with value 1CCU Received Temperature Sensor Value upda
224. sy srani at s Lie Lae 5 Once you receive an install email of available build open again your TestFlight app from your device It can take additional 24 48 hours to receive this email 6 Click on View All Apps and then click on Install Apps Compatible Apps InsightSIPDemo z A Version 1 0 1 0 INSTALL mem September 3 2014 Missing Apps June 1 2015 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com i Page 14 5 Document Ref isp_ble_Catalog_R2 3 docx The information contained in this document is the property of Insight SiP and should not be disclosed to any third part y without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package ISP 41 31 007 7 The lInsightSiPDemo application is downloaded and installed You should see the following screen on your iOS device eeeeo Bouygues 4G 18 40 InsightSIP a er T l phone Mail Safari Musique Then you will be able to set up the application demonstration as follows 8 Place the CR2082 lithium battery into the battery holder 9 Connect the battery holder to the Sensors Board ISP131001 10 Start InsightSiPDemo application on your iOS click Connect and select your Sensors Board name is InsightSiP_xxxxx eeeeo Bouygues 4G 18 40 eeeeo Bouygues 4G 18 52 _ Insight SI
225. t Data sampling rate is set to 50 samples second A development kit 1SP130301 DK1 is available from Insight SIP and allows for easy flash programming application processor via the 10 pin removable FPC connector During firmware modification and debug the ISP131001 device may be supplied via the DC voltage from the development kit interface board The ISP131001 sensor can be reprogram on the air with the bootloader interface ee A e June 1 2015 Page 13 1 Document Ref isp_ble_Catalog_R2 3 docx opera Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com P Oo The information contained in this document is the property of Insight SiP and should not be disclosed to any third party er at without written permission Specification subject to change without notice a a Insight SiP BLE SENSOR It s all in the package ISP 41 31 007 Contents T Elecrical Speca NON S eerren aaraa a ia aE i inate Page 13 2 Z RPP MIN SS eE E E E Page 13 4 3 Mechanical Outlines 1 Electrical Specifications Sensor Performance The performance of the motion sensor is that obtained by the Freescale FXOS8700CQ Key characteristics are shown below Parameter Value Unit Numeros O OO o e O i Number of bits for full range for each axis magnetometer Data sampling rate FIFO for acceleration only samples June 1 2015 Page 13 2 Document Ref isp_ble_Catalog_R2
226. tained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP BLE BEACON It s all in the package ISP 41 405071 2 RF Performances RF Specifications according to standards The performance of the Bluetooth Low Energy Radio link is that obtained by the ISP130301 module Temperature range 25 C to 75 C BT V4 pe Parameter Value Std limit Condition ar are Rees we e C mmm e oe Rx sensitivity 5 3 Mechanical Outlines Dimensional drawing June 1 2015 Page 10 4 Document Ref isp ble Catalog R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party E without written permission Specification subject to change without notice Insight SiP BEACON DEV KIT It s all in the package ISP lt 41 40501 ISP140501 DK1 Bluetooth Low Energy Wireless Beacon Development Kit General Description KORAM ee PGND 12 In order to assist clients in developing their Bluetooth Smart Beacon based on the ISP140501 Insight SIP offers a Sensor Development Kit This consists of the following Sensor Board containing One Interface Board J Link Lite CortexM 9 JTAG SWD Emu
227. te notification 26 75 Recerved AHH andle alue otfication on pipe number 2 with value TEAC Received Temperature Sensor Value update notification 30 625 Recerved AttHandevalueN otfication on pipe number 2 with value 1CE0 Received Temperature Sensor Value update notification 28 875 Connected O June 1 2015 Page 18 10 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package i S P 4 2 o9 o9 Stop Software To switch off PC program click on top Right Corner of the window To switch off Temperature Sensor remove battery as shown below June 1 2015 Page 18 11 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SiP APPLICATION NOTE It s all in the package i S pP 4 2 09 09 June 1 2015 Page 18 12 Document Ref isp_b
228. the communication phase Phase 1 is about Opnase 1 530uF x 0 104V 55 12 uC June 1 2015 Page 21 22 Document Ref isp ble Catalog R2 3 docx tr Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party j without written permission Specification subject to change without notice of Pas Insight SP APPLICATION NOTE It s all in the package AN 14 3050171 This is also consistent with measurements made for the BLE module and the microprocessor by the oscilloscope method Table 9 and Table 10 where Qgrg 39 88 uC and Q p 11 56 uC The difference between the two measurements is the consumption of the sensing device during the communication phase Phase 1 SO Qsensor 55 12 39 88 11 56 3 68 uC This difference is higher than that of the light sensor node because during Phase 1 the current consumption of orientation motion sensing device for maximum Sampling rate 120 Samples second is more than current consumption of light sensing device cf Table 4 Similarly according to Figure 23 the total charge consumption of the orientation motion sensor node in the Standby sleep phase Phase 2 is about Qphase2 DIOUF x 0 016V 8 48uC However during Phase 2 the current consumption of orientation motion
229. this statement The Bluetooth SIG Hereby Recognizes Produet description Bluetooth Low Energy Module with antenna Trademark insight SIP Insight sip Family name Member Company Type ps me a wP ISP130301 Hardware release No C Qualified Design Name n Manufacturer Insight SiP Declaration ID 0024444 pga cence la halte Qualified Design ID 55840 Country France Specification Name 4 0 Product Type End Product Model Number ISP130301 gsi Name insight SiP Listing Date 10 October 2014 Assessment Date 10 October 2014 Address 13 Chemin de la halte Hardware Version Number C Software Version Number City 06130 Grasse Country France This statement is granted to This certificate acknowledges the Bivetooth Specifications declared by the member were achieved in accordance with the Bivetooth Qualification Process as specified within the Bluetooth Specifications and as required within the current PRD This statement has THREE Annexes Zevenaar 29 August 2014 3 Bluetooth Tie crechad GIRT SROP t oy QN E PRODUCTS ae RvA 224 ERLIEFT AIT RAY hE telefication 51565536 LRH OR ER 3 a Certificate of Construction Type TECHNICAL ACCEPTANCE CERTIFICAT D ACCEPTABILITE TC B Ke TE HE ie AL fh AR aco RBIS 2 498 1 FE 1 9 ROR CERTIFICATE TECHNIQUE Classification of Specified oe 4 ts Radio Equipnent 2 AGH RHE MAS F MRD ATL CERTACATION Ne p gt 113064 1SP130301 TELEFICATION No TRER ka P
230. tion calculating model June 1 2015 Page 21 28 Document Ref isp ble Catalog _R2 3 docx tre Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com lt ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Die r i without written permission Specification subject to change without notice m apt Insight SiP APPLICATION NOTE It s all in the package AN 4 3050171 4 4 Model Measurements comparison Table 17 18 and 19 respectively presents model measurements comparison of the total current consumption and the autonomy of temperature light and orientation motion sensor nodes for different Connection intervals Temperature sensor node Connection i Total Consumption Autonom Autonom Interval EN t ae eee Model irr ene GS z uC year year 1000 0 29 2000 0 50 3000 7230 7208 066 0 67 4000 0 78 0 79 Table 17 Temperature sensor node Model measurements comparison Light sensor node Connection l Total Consumption Autonomy Autonomy Interval Total Consumption Measurements Model Measurements ms irin a uC year year 1000 0 24 2000 0 40 3000 0 51 4000 Table 18 Light sensor node Model measurements comparison Orientation motion sensor node Connection Total Consumption Autonom Autonom Interval Eo a a a Tae Arr enc E ms j uC
231. tion measurements as measured by capacitor method June 1 2015 Page 21 21 Document Ref isp_ble_Catalog_R2 3 docx F Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party jd fon without written permission Specification subject to change without notice ne rel Insight SP APPLICATION NOTE It s all in the package AN 4 3050171 The total charge consumption of the orientation motion sensor node for Connection Interval Tperioa 1S aS presented in Figure 21 is of the order of Qphase 14 Phase2 C X AV 5304F x 0 120V 63 6 uC Figure 22 and Figure 23 show the total consumption in Phase 1 and Phase 2 respectively Tek ANE Acq Complete M Pos 495 2ms CURSOR i Type CH oom M10 0ms CHD 2954 27 May 13 1837 lt 10Hz Cursor 2 505m 2 2 20 Figure 22 Orientation Motion sensor node total current consumption measurements during Phase 1 as measured by capacitor method Tek AM Acq Complete M Pos 2 700s CURSOR ah Type CH T m M250ms CH 2954 27 May 13 18 08 lt 10Hz Figure 23 Orientation Motion sensor node total current consumption measurements during Phase 2 as measured by capacitor method According to Figure 22 the total charge consumption of the orientation motion sensor node in
232. to inform how to specify the IC ID of our module ISP130301 on the product According to Canadian standards RSS 210 and RSS Gen the host device should have a label which indicates that it contains our module The label should use wording such as Contains IC 11306A ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below IC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le present appareil est conforme aux CNR d industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement June 1 2015 Page 6 14 Document Ref isp ble Catalog _R2 3 docx ee Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ee puns The information contained in this docu
233. tor USB drivers Temperature Demo folder from Insight SIP with executable file and dll files Microsoft NET framework 4 Re distribuable package This can be downloaded from Microsoft at the following address http www microsoft com en us download details aspx id 17718 To install this package follow the instructions on the Microsoft website Nordic Semiconductor nRF8001 SDK v1 7 Run the nRF8001 SDK so as to be able to use the Master Emulator USB drivers Temperature Demo Folder The Temp _Lum_Demo_EXE zip file should be unzipped at any suitable location on the PC This contains the executable file and all the dll files necessary for the demonstration to run ee a OT iia r m June 1 2015 Page 18 1 Document Ref isp_ble_Catalog_R2 3 docx apy hh Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com E A The information contained in this document is the property of Insight SiP and should not be disclosed to any third party 2 ariel without written permission Specification subject to change without notice a i r insight SP APPLICATION NOTE secteur ISP120909 It s all in the package The directory should be as shown below Mom Taille Type Date de modification Aci dll lizko Application Extension O9 26jz2012 2 31 PM emulatorlibs dll 2 179Ko Application Extension O9 8 2012 2 31 PM hei_ coder dll 45 ko Application Extension O9f 8 2
234. ue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice Insight SP APPLICATION NOTE It s all in the package i S P 4 3030 4 AN140101 Use of ISP130301 DK1 Introduction Scope This document gives details on hardware and software for using and testing Insight SiP Bluetooth Low Energy module ISP130301 Contents 1 Recommended Documentation ccccceccceeecceeeceececeeeccueeceueecuecsueessueeseeeceusesseesaueesuesneeesaas Page 5 2 2 1ISP130301 DK1 Hardware Conte nt cccccccccceecesseeeeeeceeeeeeeteneeseeeeseeeteusesseeeseeessueeseeetaneess Page 5 3 3 DOM Wal WSU AN Al OW eeeteaussavesnan sae torareiessaeieautnamieceeevias eenarpeecacer as teeasaee eigen eee neers Page 5 4 4 Hardware Description Meat ceectseatse a sesdatuese etal teise cette scanty Seg Dae alee dante dotepaglecetce costae aes gate anlocoianpablenelieeeise Page 5 5 5 Basic Application using ISP130601 Test Board ccceccceecccseeeeceeeeeeeeeeseeeeseeeesaeeeseeeesaeeeesaes Page 5 8 6 Basic Sensor Application with 1ISP131001 cc ecccceececeseeeceeeeseeeeeseeeseeeeeseeeesaeeessaeeesaeees Page 5 20 sith cari m June 1 2015 Page 5 1 Document Ref isp ble Catalog R2 3 docx Insight SiP Green
235. ve to moisture absorption it is recommended to bake the product before assembly The baking process for dry packing is 24 hours at 125 C ISP130301 has been tested MSL 5 according to standards After baking modules can be exposed to ambient room conditions approximately 30 C 60 RH during 48 hours before assembly on the PCB Soldering information Recommendation for ROHS reflow process is according to Jedec J STD 020 and 033 standard profiles Atay ie Max Ramp Up Rate 3 C s Max Ramp Down Rate 6 C s A Temperature gt Time gt 260 C 0 5 C Preheat Soak l Peak package body temperature Tp Temperature Min Tsmin 150 C Temperature Max Tsmax 200 C Classification Temperature Tc 260 C Time ts from Tsmin to Tsmax 60 120 sec Time tp maintained above Tc 5 C 30 sec Ramp up rate TL to Tp Ramp down rate Tp to TL 6 Cisec max 6 Cisec max max Liquidous temperature TL 217 C Time tL maintained above TL 60 150 sec MSE 27 O Peamlampotaiiie nme ofa June 1 2015 Page 6 13 Document Ref isp_ble_Catalog_R2 3 docx T Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Refs without written permission Specification subject to change without notice Insight SP ANT BLE MODULE

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