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Protomat C100/HF (K045)

1. 26 04 MILLING TOP SOLDER MASK a Select gt CuttingSoldStopTop from List Box Selects first milling task gt Al1 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET b Select gt Goto gt Pause Positions Head allowing room to remove Solder Mask Foil Cx gt Carefully remove Solder Mask Foil and place in safe location 26 05 BOTTOM SOLDER MASK a Do you require a Bottom Solder Mask No gt GOTO SECTION 26 09 gt Yes gt CONTINUE gt 26 06 PREPARE UNDERLAY a Place an extra sheet of Underlay Material EEL Part 16 00 11 on top of the original Underlay and clean with an isowipe ALWAYS USE NEW MATERIAL IF SOLDER MASK FOIL IS TO BE MILLED If less than A4 cut the material to match the size of existing Underlay Fixing holes should be drilled in the Underlay Material using a 3 05mm dia drill in conjunction with the special Protomat Drilling Template EEL Part K075 provided In order to maintain accurate registration do not increase holes to 3 10mm 26 07 PREPARE SOLDER MASK FOIL a Carefully cut the Solder Mask Foil EEL Part 71 02 01 to size The material should be cut at least 28mm larger than the PCB layout on all sides to allow for milling head clearance and fixing requirements b Gently warm the adhesive side of the Solder Mask material using a hot air gun c Carefully place the Solder Mask Foil matt side down on the Underlay Mat
2. gt REMOVE PCB FLIP OVER AND SECURE AS PER REQUIREMENTS OF SECTION 18 c gt Thoroughly clean surface of PCB using Isowipe before proceeding d Select gt MillingTop from List Box Selects next milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET EL Standard Procedure 002 gt Page 17 of 26 T 24 13 SOLDER MASK a gt Yes gt gt gt No gt DOES THIS PCB REQUIRE A SOLDER MASK GOTO SECTION 26 gt Prepare for machining as per requirements of Section 18 GOTO SECTION 24 14 gt CONTINUE gt 24 14 CUTTING OUTSIDE a Select gt gt gt gt gt b gt Cs gt CuttingOutside from List Box Selects next task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET Machining should now be complete and the PCB ready to break out GOTO SECTION 27 gt EL Standard Procedure 002 gt Page 18 of 26 T 25 SIX LAYER PCB MANUFACTURING PROCESS 25 01 INTERNAL PAIR LAYERS 3 amp 4 a gt DO YOU WISH TO DRILL THE PCB AT THIS STAGE Answer Yes if Layers 3 amp 4 contain buried vias No gt GOTO SECTION 25 04 gt Yes gt CONTINUE gt 25 02 MARKING DRILLS a gt Ensure Head Auto Control button is active b Select gt MarkingDrills from List Box Selects first drilling task gt All gt Start gt Follow prompts 25
3. 03 DRILLING a Select gt DrillingPlated from List Box Selects next drilling task gt Al1 gt Start gt Follow prompts bs gt EXIT HERE AND PROCEED WITH PLATING PROCESS See EEL Stan Proc 005 Cs gt Prepare for machining as per requirements of Section 18 gt CONTINUE gt 25 04 MILLING LAYER 4 a Select gt MillingLayer4Pos for BM4 Only from List Box First milling task Select gt MillingLayer3Pos for BM5 Only from List Box First milling task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET VVVYV 25 05 IDENT LAYER a Select gt Goto gt Pause Positions Head allowing room to ident the PCB b gt IDENT PCB WITH 4 CLOSE TO L H LOCATION PIN Use scriber or similar 25 06 MILLING LAYER 3 a gt REMOVE PCB FLIP OVER AND SECURE AS PER REQUIREMENTS OF SECTION 18 b gt Thoroughly clean surface of PCB using Isowipe before proceeding c Select gt MillingLayer3Pos for BM4 Only from List Box First milling task Select gt MillingLayer4Pos for BM5 Only from List Box First milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET T EL Standard Procedure 002 gt Page 19 of 26 25 07 LAMINATION PROCESS a gt EXIT HERE AND PROCEED WITH LAMINATION PROCESS See EEL Stan Proc 014 gt CONTINUE gt 25 08 INT
4. 15 of 26 T 24 FOUR LAYER PCB MANUFACTURING PROCESS 24 01 INTERNAL PAIR LAYERS 2 amp 3 a gt DO YOU WISH TO DRILL THE PCB AT THIS STAGE Answer Yes if Layers 2 amp 3 contain buried vias No gt GOTO SECTION 24 04 gt Yes gt CONTINUE gt 24 02 MARKING DRILLS a gt Ensure Head Auto Control button is active b Select gt MarkingDrills from List Box Selects first drilling task gt All gt Start gt Follow prompts 24 03 DRILLING a Select gt DrillingPlated from List Box Selects next drilling task gt A11 gt Start gt Follow prompts b gt EXIT HERE AND PROCEED WITH PLATING PROCESS See EEL Stan Proc 005 C gt Prepare for machining as per requirements of Section 18 gt CONTINUE gt 24 04 MILLING LAYER 3 a Select MillingLayer3Pos from List Box Selects first milling task gt gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET 24 05 IDENT LAYER a Select gt Goto gt Pause Positions Head allowing room to ident the PCB b gt IDENT PCB WITH 3 CLOSE TO L H LOCATION PIN Use scriber or similar 24 06 MILLING LAYER 2 a gt REMOVE PCB FLIP OVER AND SECURE AS PER REQUIREMENTS OF SECTION 18 b gt Thoroughly clean surface of PCB using Isowipe before proceeding c Select gt MillingLayer2
5. Log Sheet is situated next to the Protomat and shall be updated to provide a maintenance record c Switch on computer RPFOO SEE GPO s MARKED PC MONITOR and SPEAKERS d Switch on Compressor and Vacuum SEE GPO s MARKED COMPRESSOR and VACUUM e Switch on Protomat and Enable Air SEE GPO s MARKED PROTOMAT and ENABLE AIR Switch on the Calibratiion Camera SEE GPO MARKED CAMERA K081 Q Ensure Compressor regulator is set to not less than 8 Bars See Indicator PI 00 tez Ensure Protomat regulator is set to 7 Bars See Indicator PI 01 i CAUTION This manual has been written assuming Protel 99 SE to be the preferred CAD package If working with Altium Designer files please refer to the appropriate user manual for further information j CAUTION This manual has been written assuming Boardmaster 4 to be the preferred software package for operating the Protomat Boardmaster 5 has minor variations T EL Standard Procedure 002 gt Page 1 of 26 1 01 TOOL SETTINGS a Until a much greater understanding of the milling process is acquired it is suggested the following standard tool parameters shall apply to all tasks UniCutter gt Set depth of cut for 08 Mil Insulation Channel MicroCutter gt Set depth of cut for 04 Mil Insulation Channel All End Mills gt Set depth of cut to remove copper as required 1 02 FILE NAMING PROTOCOL a b All EXTERNAL CLIENT
6. Place MidLayer n Polygon Plane on over entire PCB and connect to the appropriate net IMPORTANT Ensure all pads and vias sharing the selected Net Label hav been connected to the resulting Polygon Plane Repeat until all Power Planes have been replaced with Polygon Planes 2 05 NON CONNECTED INT PADS a DO NOT COMPLETELY REMOVE NON CONNECTED SOLDER PADS ON INNER LAYERS CHOOSE ISOLATION MILLING AS PRESSING WILL NOT BE EVEN AND SHORT CIRCUITS MAY OCCUR Short ee ee ee eee SSS A E E 3 1 A A E E A _ ee SEE UNSUITABLE METHOD SATISFACTORY METHOD See KO61A MN1 Pages 29 and 30 for further information T EL Standard Procedure 002 gt Page 3 of 26 CREATE GERBER FILES Start Protel and load the PCB file to be produced Select gt gt Click gt Select VV Click v Click v Select or VvV Select VVVVVVVVV VV Select VVYV Select Select Select Click gt File CAM Manager Opens CAM Wizard Next To begin process Gerber Selects type of output Gerber Selected Next Next Leave default name as Gerber Output 1 Next Leav mbedded apertures RS274X Units Inches Format 2 5 If PCB is in Imperial Units Units Millimeters Format 4 4 If PCB is in Metric Units Next Top Layer v Selection depends upon the PCB design the Bot Layer v ex
7. from List Box Selects next milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET T EL Standard Procedure 002 gt Page 16 of 26 24 07 LAMINATION PROCESS a gt EXIT HERE AND PROCEED WITH LAMINATION PROCESS See EEL Stan Proc 014 gt CONTINUE gt 24 08 EXTERNAL LAYERS TOP amp BOT a gt Prepare for machining as per requirements of Section 18 NOTE The PCB should be placed with the ident 3 facing up 24 09 MARKING DRILLS a gt Ensure Head Auto Control button is active b Select gt MarkingDrills from List Box Selects first drilling task gt A11 gt Start gt Follow prompts 24 10 DRILLING a Select gt DrillingPlated from List Box Selects next drilling task gt A11 gt Start gt Follow prompts b gt DOES THIS PCB REQUIRE PLATED THRU HOLES Yes gt EXIT HERE AND PROCEED WITH PLATING PROCESS See EEL Stan Proc 005 gt Prepare for machining as per requirements of Section 18 GOTO SECTION 24 11 gt v No gt REFER TO SECTION 20 AND CONTINUE gt 24 11 MILLING BOTTOM MillingBottom from List Box Selects first milling task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET a Select VVVVYV 24 12 MILLING TOP a Select gt Goto gt Pause Positions Head allowing room to flip PCB material b
8. gt Phases gt Load Select gt PHASES4 PHS Lookin C LPKF40 BMaster File type PHS gt Open gt OK Configures BoardMaster with the 4 Layer Template gt GOTO SECTION 9 gt d 6LAYER gt Select gt Configuration gt Phases gt Load Select gt PHASES6 PHS Lookin C LPKF40 BMaster File type PHS gt Open gt OK Configures BoardMaster with the 6 Layer Template gt GOTO SECTION 9 gt r EL Standard Procedure 002 gt Page 6 of 26 9 IMPORT FILES 1 BUTTON a Goto CircuitCAM b ENSURE THE INSULATE SETTINGS COMPLY WITH THE FOLLOWING PARAMETERS Select gt Edit gt Insulate gt Main Select gt Job gt Insulate Default Bottom Select Required Layer gt Tools gt Small Micro Cutter 0 1mm 4mil Max size gt Standard Universal Cutter 0 2mm 8mil Max size gt Big End Mill 1 00mm 39mil Max size gt Bigger End Mill 2 00mm 79mil Max size gt Width gt Base A11 0 2mm Auto set by Uni Cutter IMPORTANT gt Special Pads 0 2mm Recommended for INNER layers IMPORTANT gt Special Pads 0 3mm Recommended for OUTER layer gt Save gt REPEAT 9b FOR ALL LAYERS CONTAINED IN THIS TEMPLATE gt OK c Select gt Import Button gt Look in D RPFUser00 Protel Output Files d Select gt CAM for 6x 00000a Sample Folder Only gt Open e Selec
9. ATING PROCESS See EEL Stan Proc 005 Prepare for machining as per requirements of Section 18 GOTO SECTION 22 03 gt REFER TO SECTION 20 AND CONTINUE gt 23 03 MILLING BOTTOM a Select gt gt gt gt gt MillingBottom from List Box Selects first milling task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET 23 04 MILLING TOP a Select gt gt b gt c gt d Select gt gt gt gt gt Goto Pause Positions Head allowing room to flip PCB material REMOVE PCB FLIP OVER AND SECURE AS PER REQUIREMENTS OF SECTION 18 Thoroughly clean surface of PCB using Isowipe before proceeding MillingTop from List Box Selects next milling task Al1 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET T EL Standard Procedure 002 gt Page 14 of 26 23 05 SOLDER MASK a gt Yes gt gt gt No gt DOES THIS PCB REQUIRE A SOLDER MASK GOTO SECTION 26 gt Prepare for machining as per requirements of Section 18 GOTO SECTION 23 06 gt CONTINUE gt 23 06 CUTTING OUTSIDE a Select gt gt gt gt gt b gt Cs gt CuttingOutside from List Box Selects next task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET Machining should now be complete and the PCB ready to break out GOTO SECTION 27 gt EL Standard Procedure 002 gt Page
10. B material using an Isowipe Ensure PCB material is thoroughly dry then secure in position ready for machining T EL Standard Procedure 002 gt Page 10 of 26 19 POSITIONING THE PROJECT WITHIN THE WORK SPACE a gt In BoardMaster move the project to the required position in the workspace allowing for clearances required by the Protomat Tool Head and take into account available free space on the PCB material gt Multiple copies of project may be placed if required 20 IMPORTANT MANUFACTURING INFORMATION IT HAS BEEN ESTABLISHED THAT DRILLING CAN CAUSE A BUILD UP OF DEBRIS BETWEEN THE PCB AND THE UNDERLAY MATERIAL THIS IS ESPECIALLY NOTICEABLE IF LARGER HOLES APPROX 3mm ARE PRODUCED BY CONTOUR ROUTERS IN THIN OR FLEXIBLE PCB TYPES FAILURE TO REMOVE THIS DEBRIS WILL RESULT IN UNEVEN MILLING AND POSSIBLE DAMAGE TO TOOLS This situation is of no concern for boards which are to be plated through as they are removed from the Protomat after the drilling phase is completed However jobs which are to be immediately milled may need to be cleaned first Note The default order of the manufacturing process may be changed as a production easement ie Shift drilling to the final phase if the situation permits 21 MANUFACTURING PROCESS 21 01 TOOL CALIBRATION a Micocutter gt Calibration required upon each tool or material change Unicutter gt Calibra
11. EEL Standard Procedure 002 DOCUMENT NUMBER Esp002c docx DOCUMENT EDITOR Office 2007 AUTHOR K Bell DATE 27 March 2012 PROTOMAT C100 HF K045 PCB PRODUCTION 1 INITIAL REQUIREMENTS a Ensure the Compressor Log Sheet is up to date and all Moisture Traps are dry The compressor shall be drained at regular intervals of no more than 7 days and the Compressor Log Sheet updated to provide a maintenance record The Log Sheet is situated next to the compressor enclosure b Ensure the Protomat Maintenance Log Sheet is up to date Depending upon the type of materials being milled the Collet 1 Scanning Ring 2 and the Internal Thread 3 of the High Speed Spindle will require regular cleaning as per the following table MATERIAL CLEANING REQUIREMENTS DUROID Upon Completion of Each Job FR4 Intervals of no more than 14 days 1 The Collet shall be immersed and thoroughly cleaned using SafeWash Finally degrease with Isopropyl Alcohol 2 The Scanning Ring should be thoroughly cleaned using an Isowipe Pay particular attention to the underside of this assembly 3 The Internal Thread of the High Speed Spindle shall be thoroughly cleaned with Isopropyl Alcohol only A brush is provided specifically for this purpose Ensure all parts are thoroughly clean and dry then align the keyway and carefully insert the Collet into the High Speed Spindle The
12. ERNAL PAIR LAYERS 2 amp 5 a gt Prepare for machining as per requirements of Section 18 b gt DO YOU WISH TO DRILL THE PCB AT THIS STAGE Answer Yes if Layers 2 thru to 5 contain buried vias No gt GOTO SECTION 25 11 gt Yes gt CONTINUE gt 25 09 MARKING DRILLS a gt Ensure Head Auto Control button is active b Select gt MarkingDrills from List Box Selects first drilling task gt All gt Start gt Follow prompts 25 10 DRILLING a Select gt DrillingPlated from List Box Selects next drilling task gt A11 gt Start gt Follow prompts Bs gt EXIT HERE AND PROCEED WITH PLATING PROCESS See EEL Stan Proc 005 Gs gt Prepare for machining as per requirements of Section 18 gt CONTINUE gt 25 11 MILLING LAYER 5 a Select MillingLayer5Pos from List Box Selects first milling task gt gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET 25 12 IDENT LAYER a Select gt Goto gt Pause Positions Head allowing room to ident the PCB b gt IDENT PCB WITH 5 NEAR L H LOCATION PIN Use scriber or similar 25 13 MILLING LAYER 2 a gt REMOVE PCB FLIP OVER AND SECURE AS PER REQUIREMENTS OF SECTION 18 b gt Thoroughly clean surface of PCB using Isowipe before proceeding c Select gt MillingLayer2 from List Box Selects nex
13. Protel Files shall be named to reflect their EEL Job EXAMPLES 1 The DDB file shall have the following format 63 499 DDB 2 PCB files shall have the following format 63 49901la pcb Where 63 499 is the Job 01 is the pcb and a is the version All ETSG PROJECT Protel Files shall be named to reflect their EEL Project EXAMPLES 1 The DDB file shall have the following format A1l23a DDB 2 PCB files shall have the following format Al2301la pcb Where A123 is the Project 01 is the pcb and a is the version 1 03 LOCATION OF WORKING FILES a Before starting a job place the Protel File in G RPFUser00 Protel DDB Files It is assumed that files placed in this folder are correct and need no modification If however changes are required and these files are modified please ensure they transferred to your original Client Files Folder for archiving Data files placed on RPFOO have temporary status and will eventually be deleted 2 IMPORTANT DESIGN REQUIREMENTS 2 01 STANDARD PCB DIMENSIONS a MAX SIZE x y A4 297 x 210 gt Max Milling Area Finished PCB 230 x 150 mm MID SIZE x y A5 210 x 148 gt Max Milling Area Finished PCB 143 x 88 mm MIN SIZE x y A6 148 x 105 gt Max Milling Area Finished PCB 81x 45 mm The Maximum Milling Area is calculated by allowing X Axis gt 25mm Head Clearance Y Axis gt 25mm Head Clearance ri T i T 5 0mm Fixing
14. TO SECTION 26 05 gt Yes gt CONTINUE gt 26 02 PREPARE UNDERLAY Place an extra sheet of Underlay Material EEL Part 16 00 11 on top of the original Underlay and clean with an isowipe ALWAYS USE NEW MATERIAL IF SOLDER MASK FOIL IS TO BE MILLED If less than A4 cut the material to match the size of existing Underlay Fixing holes should be drilled in the Underlay Material using a 3 05mm dia drill in conjunction with the special Protomat Drilling Template EEL Part K075 provided In order to maintain accurate registration do not increase holes to 3 10mm 26 03 PREPARE SOLDER MASK FOIL Carefully cut the Solder Mask Foil EEL Part 71 02 01 to size The material should be cut at least 28mm larger than the PCB layout on all sides to allow for milling head clearance and fixing requirements Gently warm the adhesive side of the Solder Mask material using a hot air gun Carefully place the Solder Mask Foil matt side down on the Underlay Material ensuring the material is flat and completely free from trapped air bubbles Being careful not to scratch the Solder Mask use a soft cloth or tissue to gently tease out trapped air Secure the Solder Mask material on all sides using adhesive tape In order to allow for sufficient milling head clearance the adhesive tape should overlap the solder mask material by no more than 3mm T EL Standard Procedure 002 gt Page 23 of 26
15. Tape TOP amp BOTTOM 8 5mm Registration Pin Clearance LEFT amp RIGHT 2 02 BORDERS a PCB DESIGNS DO NOT REQUIRE ELECTRICAL LAYER BORDERS May cause excessive milling 2 03 POLYGON PLANES a POLYGON PLANES SHOULD BE FILLED NOT HATCHED To avoid excessive milling E EL Standard Procedure 002 gt Page 2 of 26 2 04 POWER PLANES a PCB DESIGNS WHICH INCORPORATE POWER PLANES ARE NOT COMPATIBLE WITH THE CURRENT PROCESS AND SHOULD BE REPLACED WITH POLYGON PLANES Edit Protel file as follow Select Select Select Select gt gt gt Vv Vv VVVYV v Design Main Menu Bar Layer Stack Manager InternalPlanel Select Power Plane to be removed InternalPlane2 Properties Netname No Net Disconnects Power Plane from Net this is Delete required before deletion can occur Yes OK Removes Power Plane TopLayer BotLayer AddLayer Mid Layer n should appear OK Escape Layer Stack Manager Place Main Menu Bar Polygon Plane Net Options Select as reqd Define net Pour Over Same Net v Required to connect vias to plane Remove Dead Copper V Plane Settings Grid Size 10mil Nominal Selection Track Size 1l1lmil Nominal Selection Layer Select as reqd OK
16. ample in Bold Text assumes a standard Mid Layer 1 v double sided PCB without Top amp Bottom Mid Layer 2 v Solder Mask Mid Layer 3 v Mid Layer 4 v Top Solder Mask Vv Bot Solder Mask VY Keep Out Layer v Always required for Cutting Outside Mid layer pad option VY Important See note below Next For boards of 4 layers or more checking this option ensures that non connected pads which may appear on any of the inner layers will be retained during manufacture This requirement is critical with regard to the lamination process It is suggested that this option remains checked for all boards unless technical requirements dictate otherwise See Section 2c for graphical explanation Generate Drill Drawing Plots Generate Drill Guide Plots UNCHECKED Nominal setting UNCHECKED Nominal setting Next Plot used drill drawing pairs UNCHECKED This menu only active Mirror Plots UNCHECKED if above is checked Graphics Symbols indicated settings are nominal Symbol Size 50mils Next Plot used drill guide layer pairs UNCHECKED This menu only active Mirror Plots UNCHECKED if above is checked Next indicated settings are nominal Mechanicalx UNCHECKED Mechanical Layer Options Next Finish Gerber Output 1 should now appear in window zr EL Standa
17. ces of swarf and grease are removed before securing the Underlay and PCB materials in place Failure to comply may result in inconsistent and poor quality results 18 01 UNDERLAY MATERIALS a No Yes gt IS THE MATERIAL TO BE MACHINED LESS THAN 1mm THICK GOTO 18 01b gt Clean the Underlay Support EEL Part K088 with an Isowipe Ensure the Underlay Support is dry then place in position This item was manufactured from Underlay Material 81 01 02 and is designed to raise the normal Underlay sheet by approx 0 6mm Clean the Underlay Material EEL Part 16 00 11 with an Isowipe Ensure the Underlay Material is dry then place in position ALWAYS USE NEW MATERIAL IF BOARD IS TO BE DRILLED PRIOR TO PLATING Fixing holes should be drilled in the Underlay Material using a 3 05mm dia drill in conjunction with the special Protomat Drilling Template EEL Part K075 provided Open holes up to 3 10mm before fitting NEVER ATTEMPT TO USE A 3 10mm DRILL WITH THE DRILLING TEMPLATE K075 18 02 PCB MATERIALS a gt Select the appropriate PCB material for the project See EEL Data Sheet 7 for 2Layer PCB options See EEL Data Sheet 5 for 4Layer PCB options See EEL Data Sheet 6 for 6Layer PCB options Fixing holes should be drilled in the PCB Material using a 3 05mm dia drill in conjunction with the special Protomat Drilling Template EEL Part K075 provided Thoroughly clean the selected PC
18. dy in Graphic Mode SELECT THE APPROPRIATE TEMPLATE TO SUIT THE CURRENT PCB DESIGN GOTO SECTION 8 gt CircuitCAM defaults to a 2 Layer Template Select gt File gt New gt 4Layer cat Configures CircuitCAM with the 4 Layer Template gt GOTO SECTION 8 gt Select gt File gt New gt 6Layer cat Configures CircuitCAM with the 6 Layer Template gt GOTO SECTION 8 gt r EL Standard Procedure 002 gt Page 5 of 26 8 BOARDMASTER Always restart the Protomat between jobs or before starting new job a Start BoardMaster program If present ignore FIFO message 8 01 TOOL LIBRARY SELECTION a gt ENSURE THE CORRECT TOOL LIBRARY IS SELECTED FOR THE INITIAL PHASE Select fr4 100 tol for standard FR4 PCB Material Select SolderMask tol for standard Solder Mask Material b Select gt Configuration gt Tool Library gt Mil1 Drill1 gt Load c gt IS THE CORRECT TOOL LIBRARY SELECTED See Mill Drill Tool Edit Menu for current library details Yes gt Select gt Cancel Then gt GOTO SECTION 8 02 gt No gt Select gt fr4 100 tol Example only see Section 8 0la gt open gt OK 8 02 TEMPLATE SELECTION a gt SELECT THE APPROPRIATE TEMPLATE TO SUIT THE CURRENT PCB DESIGN b 2LAYER gt GOTO SECTION 9 gt BoardMaster defaults to a 2 Layer Template c 4LAYER gt Select gt Configuration
19. erial ensuring the material is flat and completely free from trapped air bubbles Being careful not to scratch the Solder Mask use a soft cloth or tissue to gently tease out trapped air d Secure the Solder Mask material on all sides using adhesive tape In order to allow for sufficient milling head clearance the adhesive tape should overlap the solder mask material by no more than 3mm T EL Standard Procedure 002 gt Page 24 of 26 26 08 MILLING BOT SOLDER MASK b cC Select gt CuttingSoldStopBottom from List Box Selects first milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET Select gt Goto gt Pause Positions Head allowing room to remove Solder Mask Foil gt Carefully remove Solder Mask Foil and place in safe location 26 09 LAMINATION PROCESS gt EXIT HERE AND PROCEED WITH LAMINATION PROCESS See EEL Stan Proc 013 gt CONTINUE gt 26 10 CUTTING OUTSIDE gt Prepare for machining as per requirements of Section 18 Select gt fr4 100 tol FR4 PCB Tool Library see Section 8 01 gt Return to the appropriate PCB manufacturing process GOTO Section 22 05 gt GOTO Section 23 06 gt GOTO Section 24 14 gt GOTO Section 25 21 gt Lyr Lyr Lyr Lyr DA o D H VVVYV ZAI o FINAL PROTOMAT REQUIREMENTS Remove remaining PCB material from the Protomat If considered su
20. ip PCB material b gt REMOVE PCB FLIP OVER AND SECURE AS PER REQUIREMENTS OF SECTION 18 c gt Thoroughly clean surface of PCB using Isowipe before proceeding d Select gt MillingTop from List Box Selects next milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET EL Standard Procedure 002 gt Page 21 of 26 T 25 20 SOLDER MASK a gt Yes gt gt gt No gt DOES THIS PCB REQUIRE A SOLDER MASK GOTO SECTION 26 gt Prepare for machining as per requirements of Section 18 GOTO SECTION 25 21 gt CONTINUE gt 25 21 CUTTING OUTSIDE a Select gt gt gt gt gt b gt Cs gt CuttingOutside from List Box Selects next task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET Machining should now be complete and the PCB ready to break out GOTO SECTION 27 gt EL Standard Procedure 002 gt Page 22 of 26 T 26 SOLDER MASK PRODUCTION USING THE PROTOMAT a Select gt Goto gt Pause Positions Head allowing room to remove PCB and fix Solder Mask material Carefully remove PCB from Protomat bed leaving Underlay Material in place Thoroughly clean bed and Underlay Material Use Isowipes Select gt SolderMask tol Solder Mask Tool Library see Section 8 01 26 01 TOP SOLDER MASK a Do you require a Top Solder Mask No gt GO
21. itable for further PCB production ident the material with it s EEL Part and place in the CURRENT MATERIAL storage area Ident remaining PCB using permanent marker or similar THOROUGHLY CLEAN THE PROTOMAT AND SURROUNDING WORK AREA RETURN ALL TOOLS TO THEIR STORAGE AREAS 28 FINAL PCB REQUIREMENTS Does this PCB have a Solder Mask Yes gt GOTO SECTION 28 01 gt No gt GOTO SECTION 28 02 gt 28 01 PCB WITH SOLDER MASK a Either gt Spray PCB using Clear Printed Circuit Lacquer EEL Part 30 06 01 Will protect exposed copper pads from oxidisation Or gt Leave untreated Depends upon Technical Instructions T EL Standard Procedure 002 gt Page 25 of 26 28 02 PCB WITHOUT SOLDER MASK a Carefully clean the PCB using Scotchbright EEL Part 21 03 01 b Rinse with water c Thoroughly dry the PCB using clean compressed air e Using a magnifying glass check for cleanliness d Finally degrease using an isowipe e FROM NOW ON HANDLE THE PCB BY IT S EDGES ONLY f Either gt Spray PCB using Clear Printed Circuit Lacquer EEL Part 30 06 01 Or gt Leave untreated Depends upon Technical Instructions T EL Standard Procedure 002 gt Page 26 of 26
22. ngTop from List Box Depends on PCB design A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET 22 04 SOLDER MASK a gt Yes gt gt gt No gt DOES THIS PCB REQUIRE A SOLDER MASK GOTO SECTION 26 gt Prepare for machining as per requirements of Section 18 GOTO SECTION 22 05 gt CONTINUE gt 22 05 CUTTING OUTSIDE a Select gt gt gt gt gt b gt c gt CuttingOutside from List Box Selects next task A11 Start Follow prompts RECORD TOOL USAGE ON JOB SHEET Machining should now be complete and the PCB ready to break out GOTO SECTION 27 gt T EL Standard Procedure 002 gt Page 13 of 26 23 DOUBLE LAYER PCB MANUFACTURING PROCESS 23 01 MARKING DRILLS a gt No gt Yes gt b gt c Select gt gt gt gt DO YOU WISH TO DRILL THE PCB AT THIS STAGE Answer Yes if this project requires plated thru holes or will be populated with conventional components GOTO SECTION 22 03 gt CONTINUE gt Ensure Head Auto Control button is active MarkingDrills from List Box Selects first task A11 Start Follow prompts 23 02 DRILLING a Select gt gt gt gt Yes gt v No gt DrillingPlated from List Box Selects next task A11 Start Follow prompts DOES THIS PCB REQUIRE PLATED THRU HOLES EXIT HERE AND PROCEED WITH PL
23. rd Outline b Press gt to place cursor where 1 breakout tab is required Select gt Breakout Tab Button Gap should now appear on Board Outline OR Press gt Control amp G gt Repeat this process for each breakout tab required Press gt Escape To Exit this process WARNING Do not use the mouse to define breakout tabs The board outline may be shifted by any movement of the mouse in x or y directions 12 PLACE RUBOUT LAYER 4 BUTTON OPTIONAL a gt DO YOU WISH TO PLACE RUBOUT LAYERS No gt GOTO SECTION 14 gt Yes gt CONTINUE gt b Select gt Rubout All Layers Button Will default to All Layers c gt DO YOU WISH TO RUBOUT ALL LAYERS Yes gt GOTO 12e gt No gt CONTINUE gt d Select gt Rubout Layern Select Active Layer from List Box e gt SELECT RUBOUT SHAPE FROM GRAPHICS TOOLBAR AS REQD L Hand of screen f gt Left Click Mouse Start Block Define gt Define Rubout area Define Area gt Left Click Mouse Fix Block Define Press gt Escape Escape Exit this process g gt DO YOU WISH TO EDIT THE RUBOUT LAYER YOU HAVE JUST PLACED No gt GOTO SECTION 14 gt Yes gt CONTINUE gt 13 EDIT RUBOUT LAYER OPTIONAL a gt Place cursor just outside top L H corner of the Rubout to be edited gt Left Click Mouse Selects Defined Area b gt EDIT DEFINED AREA AS REQUIRED c Press gt Escape Escape To E
24. rd Procedure 002 gt Page 4 of 26 CREATE NC DRILL FILE AND SET PROPERTIES R Click gt Gerber Output 1 Select gt Insert NC Drill Select gt Options gt Units Inches Format 2 5 If PCB is in Imperial Units or gt Units Millimetres Format 4 4 If PCB is in Metric Units Select gt Advanced gt Keep leading and trailing zeroes gt Reference to relative origin gt Optimise change location commands Vv gt OK NC Drill Output 1 should now appear in window SET GERBER FILE PROPERTIES R Click gt Gerber Output 1 Select gt Properties gt Advanced gt Keep leading and trailing zeroes gt Reference to relative origin gt Separate file per layer gt Sorted vector gt G54 on aperture change Vv gt Use software arcs v gt Optimise change location commands VY gt Leave Film Size and Aperture Matching Tolerances gt OK Press gt F9 Generates Protel CAM Files EXPORT GERBER FILES R Click gt CAM Outputs for 00 00000a cam TAB Top of Current Window gt Close R Click gt CAM for 00 00000a FOLDER In Protel Explorer under Document Folder Select gt Export Path gt D RPFUser00 Protel Output Files Exported Protel CAM Files gt OK CIRCUITCAM Start CircuitCAM program Select gt gt 2LAYER gt 4LAYER gt 6LAYER gt Graphic Mode Button If not alrea
25. t gt DRR GKO TXT GBL or GTL GBS or GTS Files For 1 Layer Board or gt DRR GKO TXT GBL GTL GTS GBS Files For 2 Layer Board or gt DRR GKO TXT GBL GTL G1 G2 GTS GBS Files For 4 Layer Board or gt DRR GKO TXT GBL GTL G1 G2 G3 G4 GTS GBS Files For 6 Layer Board gt Open Only select GBS or GTS Files if Solder Mask is required IF A PROBLEM OCCURS AT THIS STAGE THEN ONE OF THE FOLLOWING SITUATIONS MAY APPLY 1 THE FILE IMPORT ASSIGNMENTS ARE INCORRECTLY SET SEE DOC K045A SM3 Page13 FOR FUTHER DETAILS 2 THE Aperture Tool Template IS INCORRECT FOR THE JOB SEE BELOW FOR DETAILS FOR IMPERIAL UNITS SELECT gt Protel x drr Exc mil Inch 23AbsLead txt NCDrill FOR METRIC UNITS SELECT gt Protel 4 0 drr Exc mm Inch 43AbsLead txt NCDrill May indicate error disregard this message 10 CONTOUR ROUTING 2 BUTTON n H Q ct v a Contour Routing Button Contour Routing Outside Source Layer amp Board Outline Destination Layer Cutting Outside List LpkfCuttingTools Tool Contour Router 1 0mm 39mil Gap Width 1 0mm Run Board Outline should appear around perimeter of PCB VVVVVVYV r EL Standard Procedure 002 gt Page 7 of 26 11 BREAKOUT TABS 3 BUTTON a gt Place cursor just outside top L H corner of the Board Outline gt Left Click Mouse Selects Boa
26. t milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET T EL Standard Procedure 002 gt Page 20 of 26 25 14 LAMINATION PROCESS a gt EXIT HERE AND PROCEED WITH LAMINATION PROCESS See EEL Stan Proc 014 gt Wait 24Hrs before continuing gt CONTINUE gt 25 15 EXTERNAL LAYERS TOP amp BOT a gt Prepare for machining as per requirements of Section 18 NOTE The PCB should be placed with the idents 3 amp 5 facing up 25 16 MARKING DRILLS a gt Ensure Head Auto Control button is active b Select gt MarkingDrills from List Box Selects first drilling task gt A11 gt Start gt Follow prompts 25 17 DRILLING a Select gt DrillingPlated from List Box Selects next drilling task gt A11 gt Start gt Follow prompts b gt DOES THIS PCB REQUIRE PLATED THRU HOLES Yes gt EXIT HERE AND PROCEED WITH PLATING PROCESS See EEL Stan Proc 005 gt Prepare for machining as per requirements of Section 18 gt GOTO SECTION 25 18 gt No gt REFER TO SECTION 20 AND CONTINUE gt 25 18 MILLING BOTTOM a Select gt MillingBottom from List Box Selects first milling task gt A11 gt Start gt Follow prompts gt RECORD TOOL USAGE ON JOB SHEET 25 19 MILLING TOP a Select gt Goto gt Pause Positions Head allowing room to fl
27. tion required upon each tool or material change End Mill gt Calibration required upon each tool or material change Cont Router gt Depth Setting as per Uni Microcutter Always Confirm Depth Drill gt Depth Setting as per Uni Microcutter Always Confirm Depth SEE STAN PROC 001 FOR CALIBRATION PROCEDURES T EL Standard Procedure 002 gt Page 11 of 26 21 02 SELECT PCB TYPE a 1 Layer gt b 2 Layer gt c 4 Layer gt d 6 Layer gt GOTO SECTION 22 GOTO SECTION 23 GOTO SECTION 24 GOTO SECTION 25 SINGLE LAYER MANUFACTURING PROCESS DOUBLE LAYER MANUFACTURING PROCESS FOUR LAYER MANUFACTURING PROCESS SIX LAYER MANUFACTURING PROCESS T EL Standard Procedure 002 gt Page 12 of 26 22 SINGLE LAYER PCB MANUFACTURING PROCESS 22 01 MARKING DRILLS a gt No gt Yes gt b gt c Select gt gt gt gt DO YOU WISH TO DRILL THE PCB AT THIS STAGE GOTO SECTION 22 03 gt CONTINUE gt Ensure Head Auto Control button is active MarkingDrills from List Box Selects first task A11 Start Follow prompts 22 02 DRILLING a Select gt gt gt gt b gt DrillingPlated from List Box Selects next task A11 Start Follow prompts REFER TO SECTION 20 gt 22 03 MILLING BOTTOM TOP a Select gt gt gt gt gt MillingBottom or Milli
28. xit this process d gt DO YOU WISH TO PLACE ANOTHER RUBOUT LAYER Yes gt GOTO SECTION 12 gt No gt CONTINUE gt EL Standard Procedure 002 gt Page 8 of 26 14 INSULATE MID LAYERS OPTIONAL gt DOES THIS PCB HAVE INTERNAL LAYERS No gt GOTO SECTION 15 gt Yes gt CONTINUE gt b Select gt Edit gt Insulate gt InsulateLayerx Select Inner Layer for insulation gt Run Calculate milling process for selected layer d gt ARE THERE MORE INTERNAL LAYERS TO INSULATE Yes gt GOTO SECTION 14b gt No gt CONTINUE gt 15 INSULATE ALL LAYERS 5 BUTTON a Select gt Insulate All Layers Button Calculate milling process for Top amp Bottom Layers only 16 EXPORT FILES TO BOARDMASTER 67 BUTTON Select gt Export Button SaveIn gt D RPFUser00 CircuitCam Output Files gt Open gt Save Files saved T EL Standard Procedure 002 gt Page 9 of 26 17 BOARDMASTER PROGRAM Please be aware of operational differences between BM4 amp BM5 gt Switch to BoardMaster exported PCB should be displayed 18 SECURING UNDERLAY AND PCB MATERIALS a Select gt gt Goto Pause Positions Head allowing room to secure PCB and Underlay material Ensure bed is thoroughly clean before proceeding Use Isowipes It is extremely important that the bed is dry and all tra

Protomat C100/HF (K045)

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