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Interface Instrument Document - Part B SPIRE (IID-B

Contents

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3. ZONE DE MARQUAGE 305 0 125 0 Qe 12
4. 310 0 155 0 R _40 0_ 110 0 70 0 NOTES CONNECTORS CONTACT AREA MOUNTING 72 0 DENT YPE INTERFACE NAME IDEN TYPE INTERFACE NAME 0 1 PARTIELLE A A A REF HOLE 45 570 1 REF HOLE 95487 MATERIAL AL 6082 901 255 MAC M DPU M J21 DAMA 15S TEMP M FPU TS 1 M 20 2 _ 2 5 ae R4 2 7 TO REFERENCE 402 DBMA 255 MAC R DPU R 22 DAMA 15S EMP RZFPU TS 1 R lt he Cae San 2126 sem J03 DBMA 25S CCHK F M DPU M 425 DDMA 505 EMP M FPU TS 2 M MOMENTS OF INERTIA REFERRED TO CENTRE OF GRAVITY J04 DBMA 255 924 DDMA 505 P JX 0 338 Kg m2 JY 0 318 Kg m2 JZ 0 282 Kg m2 295 DEMA ENF EU deor DAMA 98 EMP M FPU MEC TS M CONTACT AREA MOUNTING FEET 51656mm2 JO6 DEMA SU R PCDU R J26 DAMA 155 EMP R FPU MEC TS R D THERMAL COATING AND BLACK ANODISING ESA PSS 703 JO DBMA 255 PSU M DCU 27 SURFACE EMISSIVITY 50 85 08 DBMA 255 PSU R DCU J28 e e m 506 TORQUE VALUE
5. 9 9 9 T 2 5 t 1 S 15 5 27 5 412 5 of REF HOLE CONNECTOR TYPE P FUNCTIONS FUNCTIONS M DPU M DMA 50P LIA P 7 FPU _ _ 50 LIA P 7 FPU DCU PSU M DMA 50P LIA P 8 FPU PSU_R A SOP LIA P A 50P LIA P 9 FPU LIA P 17FPU MA SOP LIA P 9 FPU
6. FOR BONDING STRAP Ch 0 5 45 422 0 REF HOLE 4 5 140 0 d SN f 1 9 I o o uo de o 00 CN CN CN CN cN II _20 0 rx Te J 402 0 442 0 454 0 490 0 N f n f aA tA ue of Ch 0 5x45 0 1 100 ALODINE 1200 12 prof 0 5 Ke Ket T K o9 a 406 249 0
7. PARYLENE C COATED FASTENERS 6 TYP 2 gt a 18 09 FOOT 16 NOMINAL MOMENTS OF INERTIA ITEM PART NO DESCRIPTION QTY MASS ITEM TOTAL MASS COMMENTS X TYPE CONNECTOR PLANE 4 POSITIONS CONNECTOR TABLE 23836 10209722 JFET MODULE 2 26000 520 00 JPL SUPPLY E 11 03 2 2JFET HARNESS BACKHARNESS 10209784 1 1216 95 216 95 JPL SUPPLY LABEL TYPE FUNCTION 94 03 3 HARNESS CLIP 2 9 TYP 2 JI 2 31e 03 4 KE 0104 354 STEPPED THERMAL STANDOFF 4 1 10 6 80 B 13 17 12 5 KE 0104 355 TOP THERMAL STANDOFF 4 10 87 3 41 NOTE THESE 782 SUB SYSTEM 6 0104 358 BOLT PARYLENE C COATED 26 5mm 2 4 10 9 39 AXES ARE NOT PARALLEL TO JA S ALL SIGNAL 7 0104 361 FRONT PLATE 2 JFET 48 01 48 01 SPACECRAFT AXES 1 15 FEEDS 8 0104 362 REAR FOOT BEAM 2 JFET 33 69 33 69 D 9 0104 363 REAR TOP BEAM 2 JFET 18 62 8 62 44 5 1 10 0104 365 4 STUD PARYLENE C COATED 2 5 08 10 16 8 0104 361 THERMAL STANDOFF WASHER 4 0 39 1 55 SEE NOTE 2 72 9 12 0104 368 THERMAL STRAP ASSY 2 JFET 123 28 23 28 MDM37S EROM CRYOHARNESS 13 KE 0104 386 M4 NUT 5mm LONG 2 2 62 L
8. Figure 5 3 1 The Herschel Focal Plane top view towards X 5 3 1 Instrument Location The locations of the Spire units are as listed in section 5 1 Spire has no units supported on the outside of the Herschel cryostat or on the Planck Module There are no critical alignment requirements on the Spire JFET boxes Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 5 5 3 1 1 Location of units on the SVM There are no specific requirements for the location of Spire units on the SVM except that the HSDCU and HSFCU need optimised harness routing towards the Spire quadrant of cryostat 128 way connectors The length of the instrument provided harness between the HSDCU and the HSFCU is critical As a goal the location of these two units on the SVM should enable this length to be kept below 0 8m The picture here under shows the Spire specific SVM panel Figure 5 3 2 SPIRE specific SVM panel picture 5 3 2 Instrument Alignment on the HOB Spire has no critical alignment and or alignment stability requirements except for those of the HSFPU The HSFPU has an externally viewable alignment cube as shown on its ICD Both the cube s angular alignment and the position of the HSFPU
9. 9 lt EVAPORATOR s PUMP 2K SPECTROMETER BOX CONNECT ON KO e a z 9 3 5 E GROUND ING STRAP m i xs N SQ gt o ol N N M Q e 5 A e 0 ojo o O Eran Zu 2 HOLES FOR SPIRE ASSEMBLY JIG SPIRE ASSEMBLY JIG 8 X 10 DEEP 0 0 0 5 SPIRE OF x CO ORDINATES 40 91 POSITION 10 0 731 34 DOWEL LOCATION FOR 19 19 02 04 SEE CHANGE SHEET N7 18 4 07 05 5 17 16 10 02 SEE CHANGE SHEET CHECKED 16 28 08 02 DRAWING UPDATED TO ISSUE 18 THEREON PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS DEPARTMENT SPACE AND CLIMATE PHYSICS yes aoza e a S tA SEE CHANCE SHEET FOR DETAYES OF OUNCES yee acted OTHERWISE STATED oul URI RSC TRACED 14 ADDED Sur vesien MADE FROM ISSUE ONWARDS ST STEEL PARTS LINEAR Z 1 0 MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY PBG UPDATED FILTER amp PHOT CONNECTORS ADDED FOCAL NATURAL ANGULAR 0 15 DORKING SURREY 3 19 11 01 BLANE amp FRAME MOUNT DIM ADDED SHEET 7 ADDED THLE DRAWN ISSUE DATE AMENDMENT SPIRE m ESTO Wi o Eg CUNT Sx e WNP AG
10. 1 ANNEX 3 SUMMARY OF SPIRE CRYOHARNESS WIRING 1 ANNEX 4 DESCRIPTION OF THE OPERATIONS OF THE SORPTION 1 ANNEX 5 SPIRE HDD 1 1 DELTAS 1 ANNEX 6 MAKING SPIRE ESD SAEE 1 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 0 7 LIST OF FIGURES AND TABLES Figure 4 1 Two halves of Spire photometer shown on left spectrometer on the right 4 1 Table 4 1 Assumptions for SPIRE Performance 1 1 4 9 Table 4 2 Background Power and Photon Noise 2 2 1 1 nennen 4 10 Table 3 SPIRE Eslimeled usuy uuu Me 4 11 Figure 21 Spire Block version 5 82 zu In ossia padedad dedi ded dade 5 3 Figure 5 3 1 Herschel Focal Plane top view towards X 1 110 5 4 Figure 5 3 2 SPIRE specific SVM panel
11. 8 HERSCHEL OPTICAL HERSCHEL OPTICAL BENCH Yu 75 m Q LEVEL 0 I FIXINGS x 15 00 18 75 ala HERSCHEL SPIRE 5 COLD STRAP INTERFACE RAE SEE DETAIL B 12 70 VIEW IN Z D CTION SYM CL PECI LEVEL 0 u ES Z39279 TEMP SENSOR 5 rA 1 POSITIONAL TOLERANCE BETWEEN CENTRES OF O FIXINGS x IN AN INDIVIDUAL PART OF SPIRE 5 IS 0 1 800 00 2 POSITIONAL TOLERANCE ON DIMENSIONS FROM CRYOSTAT CENTRE AND FIRST OPTICAL BENCH TO STRAP FIXING HOLES 15 61 00 DUE TO TOLERANCE BUILD UPS ON CASE AND COOLER 28 00 CORE PARTS SPACE CRAFT STRAPS SHOULD BE THIS uem E 22 50 118 00 8 4 07 05 SEE CHANGE 243 00 17 16 10 02 SEE CHANGE SHEET MODIFICATIONS AND CHANGE SHEET CREATED CHECKED 16 28 08 02 DRAWING UPDATED TO ISSUE 18 THERE ON NOTE PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS DEPARTMENT OF SPACE AND CLIMATE PHYSICS p MA CHANGE SHEET ROR DE TAILS OE CHANGES UD SOM EO TS OTHERWISE STATED UNIVERSITY COLLEGE LONDON TRACED CENTRE OF GRAVITY ADDED SHT 1 DESIGN MADE FROM ISSUE ONWARDS ST STEEL PARTS LINEAR _ 1 0 MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY 4 23 11 01 UPDATED STAY OUT HOLES REMOVED NO TE NATURAL DORKING SURREY PBG UPDATED FILTER amp PHOT CONNECTORS ADDED FOCAL ANGULA
12. ou AAD ON eue d 8 18 Arepuoses isn6bny uononpuoo reuna uonejos oqo 3JIN3HOS DNIGNNOYD 4 T13HOSH3H eui 18 181 ou 18 ou p ldnoo 1ouuogsuez SUAJ 19430 pue 2 6 Surso o os pue spuo s ous oeq saseo Jo po eos s10129uuo Aa 7919 JASU 18 81 ou 1 enu 1 Jjid 0 paurof o qvo p pl rus Jeuio gt 2 pumumamamai i 4 i il gt 2 Suruonrned 18 WO jou eus jun u Mq 811 ore pue SVHO sr 8 UMM 1 TANVd WAS II mum Wi im U
13. 5 26 SO Harmes and Connectors sarna TE acr 5 26 SUDO M A 5 28 dese d 5 30 5 104 Electrical Signal Infertaees sese 5 30 5 10 4 1 1955 Data BUSES 55 522 505 54 5 30 510342 Master Brera 5 31 SOAs Launch eases 5 31 JAE DATATIANDIE INC 5 32 SAM MMSIT I NM E 5 32 LT 5 32 SIE ade e RANA EE A 5 32 SARL Bald l u 5 33 5 33 5 11 3 Timing and synchronisation 5 4 2 2 000 0000000000000000000 2 5 33 u uuu 5 36 5 12 AND ORBIT CONTROLD POLNTIINGS L u im doin fnit unu 5 37 5 12 1 Attitude and orbit ases renes naue 5 37 M nina 5 37 5 1 219 ON NOG
14. uu up i IM PME uU M LM EE asua 5 42 INOZ 5 42 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART SPIRE SPIRE ISSUE 3 3 PAGE 0 5 5 eio 5 42 5 15 3 1 5 42 5152 Unpacking Procedure ESETA EEES ERNER EU IM S RUNE 5 42 detur 5 43 Rt 5 43 5 16 1 1 AVM The Avionics ain esu he 5 43 5 16 2 CQM Cryogenic Qualification Model 5 43 2106122 PFM Proto Flight MOGBls edt 5 45 3 6 133 TMdSU 5 46 5 16 1 5 Hardware deliverable 5 46 Ground 5 50 5 16 3 Mechanical Ground Support Equipment esses memes 5 50 5 164 Optical Ground Support Equipment 5 51 Svstenr i asss 5 51 5 16 6 Hardware the Observatory Ground Segment sess enne 5 5 Software tor the Observatory Groond Segmen 5 5 5 16 8 Instrument Software Simulator sse mto rel rtl c ci e a E Ko bd 5
15. MM NEN OQ 8 a n PSW AI3 P 3989 LA J 8 OSSD 2 e j emis 808 4 Fr swa E E ue 4 r m so EE EE fs 2 988 J 6 128925 J Ems n 93 p 9 ma EE E s 39883 J ue u ss J 8 J t Fw en E EE J H n pwei 22 _ 983 J 9 EE EE ay 1 39 403 J 29 R EE EE 5 J 16 5 P 4 3 woa bsi ams Astrium GmbH Project WERSCHEL Pin Allocation List Harness Doc No HP 2 ASED IC 0001 Date 20 09 2003 Sheet PAL 3 of 8 Issue 2 6 312100 P03 Item HSSVMCB1 EMC Category 25 519 fr SVMCB to W Units Connector Function SPIRE SVM CB1 SPIRE Bundle 04 Location 27 ab SVM Panel 7 SPI CCU Conn Type 527484 24 355 Pl Shl Backshell 380 FS 007 M24 05 Interface Code Grouping Pin Signal Designation Circuit Signal Pos
16. 4 00 220 2 1 0 6000000000000000000000000001 5 5 Roue n v Nai atu 5 6 Figure 5 4 2 SPIRE Spectrometer JFET rack external configurotion 5 7 Figure 5 4 3 SPIRE Photometer JFET rack external 5 7 Fig Ure u ISometnic VieWoOr the a 5 8 Figure 1 2185 2 FISDCU exernal COMmMGUratiOn 5 9 Figure 5 4 6 lt HSFGU edernal contigurali nidas uc ttt E t s iae tas t ve em 5 10 Table 5 5 17 SPIRE dimenslofis 5 11 Figure 5 6 1 SPIRE JFET L3 interface including electrical Iinsulqtion 5 13 Figure 5 212 SPIRE heat How ies ema mre a pae or 5 14 Table 9 7 154nsOrpirdaermalrequiFerHe ls csse em 5 16 Figure 5 7 2 Expected heat profiles on evaporator and Pump strap during recycling 5 16 Table 5 7 2 SPIRE FPU Non operating temperatures 740001 00 0 00 00 000000000000 enne 5 17 Table 5 7 3 SPIRE WU TeniperalUFeS sebum vasa Rin 5 17 Table 5 7 5 1 SPIRE Instrument Temperature Sensors
17. a M 4 9 5 INTERFACE WITH SATELLITE 455 5 1 5 1 CMM 5 1 Oe has 5 2 5 21 MECHANICAL COORDINATE SYSTEM 5 2 5 6 JLOCATION AND ALIGNMENT xsv u RAE REA eee 5 4 99 1 Instrument OCIO a au oe Nama 5 4 ulis e RE de tete da 5 5 5 3 2 Instrument Alignment the 2 0 000600000000000000000000 00 000 5 5 5 4 EXTERNAL CONFIGURATION DRAWINGS 5 6 5 4 1 M 5 6 32 MEE 5 DAS wc 5 add SVMMoon eT Uni 5 8 Subs p LEM m DM 5 8 53442 5 9 PAA TI TCR S 5 10 9 9 AND MASS PROPERTIE S S ai 0285920 6962 Soa eoa Sana data 5 11 IO MECHANICAL INTERFACES varaa I Cos dae uud 5 12 5 0 1 AASIDS CHVOSTOT yaaa etes
18. FFLESimusicr lt Support Integration Integration Ceintegration Cts Fannets Instrurment hechan Integration Conf 5 incomming Inspection Setup in Cleanmem of Instrument Inetrurrent Crosta final Closing HERSCHEL Evacuation and Alignment 100 Alignrrent A Integration Leak Check B Check x Cold Ali Witing of Panels External Harness Haz Production amp Intacyated with Integration amp Filling He 1 100 Conf Conf 5 mum H1 Warmup FPLI CONS Phase Conf 6 Figure 1 Annotated EQM AIT Flow chart Un marked up chart for reference only from Astrium HP 2 ASED PL 0021 Issue 2 Test tbc Making SPIRE ESD Safe Draft 0 2 for comment Page 3 3 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG 2 2 Annotated AIT Flow enoe FPU EGSE ACCS Simulator Setup Instrument SWM WU Electr PPU Simulator WU Pannels integration Integration WU Mechan integration Test PPL FPU Simulaltor Transport t Simulator wih Deintegralbian CR 100 Conf 5 Instrument T7 Gonf LOU Wave 5 Guides Ip PFM Cryostat From Test Refurteshrmnent FPU Instrument Integration of SVM Panels Integration of LOU Necessary Integration an
19. L Su 1 5 37 5 13 ON BOARD HARDWARE SOFTWARE AND AUTONOMY FUNCTIONS 5 38 TO OO 5 38 13 21 nn an an 5 38 Solon ADLIODOIY LUNCH ONS um 5 38 5 13 4 Instrument Autonomy Housekeeping Packet Definition 2 0 1101 10 5 38 513197 romeni Event Packer Delin u Fax Gud Diod iive ieu dies 5 38 m WE Qu 5 40 2944 1 Condocled PiissionrSusqephbiliyu u u u oto udo utto ot uuu utbs 5 40 2 EMISSION SUSCEDTIOUIY ucssensenvane se 5 40 PreqneneyPlqn u u mu m uu 200000 5 40 2 15 TRANSPORT AND HANDUNG PROVISIONS ua l l u 5 41 5 15 1 Focal 5 41 5 15 1 1 Odin 5 41 5 15 1 2 and Pumping 0 000000000 0 600000000000000000 5 41 55 13 Mechanism DOSHIOfIS E PM 5 4 D los Unpacking Procedure uoces ue quss ue pact t 5 4 ET da QT u tat dut de dido 5 42 9 19 21
20. 1 PSW JFETVA 2 PSW JFETV4 PSW JEETV Bshd J 24 4 PSW 60119 PSW B 29 PSW JFETV5 Bshid J 1 A PSW JEETV B M _ PSW JFETV6 B j 8014 PSW JFETV6 Bshd J 27 4 1 A32 PSWGRNDB PSW_BIASI2 B po l 11460 2 PSW 28 8 PSW BIASI2 Bshid 7 J 3 3 1 3 PSW BIASS4 BH J 3 18 PSW BIASSA B So S T o S 2 SO PSW_BIAS3 4 Bsd PSW_BIAS56 B J PSW BIASS 6 _ PSW BIASS 6 Bshd 3 3 1 PSW 2 PSW HEATER 2 PSW HEATER BI shd 16 B 1 5 5 PSW HEATER PSW HEATER B2 J 3 j 14250 PSW HEATER B2shd 36 B 1 5 5 PSW_HEATER 8 PSW HEATER B3 PSW HEATER B3 shd 36 B 1 5 B PMW JFETVI j 220 J 7 _ PMW JFETVI B 1141 22 A PMW JFETVI J J j I A 66 PMW JFETV2 B 0414 3 24 S PMW JFETV2 B 11414 22 AJ 35 PMW JFETV2 2640 6 PMW JFETV B P 23 J 23 PMW_JFETY3 Be 241 j 0 1j PMW JFETV3 Bshd J 4 604 PMW JFETV4 B 414 6 1 33 PMW PMW JFETV4 AS PMW B 5 4 1 1 5 PMW BIASU2 Bshld O 7 A 609 suwasa c PMW BIASSJA B 8 PMW B
21. dut 5 35 Table 5 40 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 0 8 Table 516 1 HSFPU Hardware MOLDE nemen mama 5 47 Table 5 16 2 HSJFP Hardware 5 48 Table 5 16 3 H5JFS Hardware 7 sce 5 48 Table 5 16 4 HSDCU Hardware Matrix 5 48 16 5 HHSFCU Hardware Mal 5 49 Table 5 16 6 HSDPU Hardware Molrix a 5 49 Table 5 16 7 HSWIH Hardware Mair 5 50 Table 7 2 14 SPIRE Instrbrrient TESTA uuu u u dram rimis va aa 7 2 Table SPIRE YS 9 3 Figure 14 SPIRE TMM OVERVIEW 1 Figore e COONEY osa UR SERE ERES 1 Figure 2 Evaporator temperature vs total 2 Figure 3 Cooler parasitic loads vs level 1 temperature 2 Figure 4 Heat switch switching temperature vs switch pump temperqlure
22. Ox CO The estimated sensitivity levels for SPIRE are summarised in Table 4 3 The figures quoted are the nominal values with an overall uncertaintyof around 50 to take into account uncertainties in instrument parameters particularly feedhorn efficiency detector DQE and overall transmission efficiency The pixel size will be increasingly mis matched to the diffraction spot size The trade off between wavelength coverage and sensitivity of the long wavelength FTS band must be studied in detail At the moment we estimate an effective loss of efficiency of a factor of two at 670mm and scale linearly for wavelengths between 400 and 670 mm Performance beyond 400 mm may have to be compromised to maintain the desired sensitivity below 400 mm Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE Dame 4000 ISSUE 3 3 PAGE 4 11 Point source 7 point ode 4 x 4 jiggle map Time days to map 1 deg to 3 mJy 1 1 x 1 scan map Line spectroscopy o 0 04 cm 7 35 Hh Wm 10 39 Low resolution spectrophotometry Ao 1 um AS 5 6 1 hr mJy Table 4 3 SPIRE Estimated Sensitivity Note For the FTS limiting flux density is inversely proportional to spectral resolution Ao Limiting line flux is independent of spectral resolution for an unresolved line These estimated sen
23. Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 10 Notes The telescope secondary mirror is the pupil stop for the system so that the outer edges of the primary mirror are not seen by the detectors This is important to make sure that radiation from highly emissive elements beyond the primary reflector does not contribute stray light 2 The bolometer DQE Detective Quantum Efficiency is defined as NEPph NEPTotal where NEPph 15 the photon noise NEP due to the absorbed radiant power and NEPTotal is the overall NEP including the contribution from the bolometer noise 3 This is the overall absorption efficiency of the combination of feed horn cavity and bolometer element 4 A fraction of the feedhorn throughput falls outside the solid angle defined by the photometer 2 K cold stop and is thus terminated on a cold non emitting surface rather than on the 4 emissive 80 K telescope This reduces the background power on the detector The background power levels on the SPIRE detectors dominated by the telescope emission and the corresponding photon noise limited NEP values are given in Table 4 2 n Background limited NEP W x 107 Total NEP mc detector W Hz7Z x 107 Table 4 2 Background Power and Photon Noise Levels
24. a 0 0104 350 PART DESCRIPTION QTY MASS ITEM TOTAL MASS COMMENTS WITH RESPECT TO C OF G 123836 10209722 JFET MODULE 6 1560 00 SUPPLY FASTENERS THRO 5 POSITIONS KE ES oh 5 HOLES 4 10 4 05 66e 04 0104 6 YY 0 03 4 13 03 4 0104 353 REAR TOP BEAM 6 JFET 32 56 9 TYP 5 0104 354 STEPPED THERMAL STANDOFF 5 8 50 3 l 6 0104 355 TOP THERMAL STANDOFF 5 4 34 7 20 9 7 110209785 1 BACKHARNESS 10209785_1 265 65 JPL SUPPLY i n E 8 0104 358 4 BOLT PARYLENE C COATED 26 5mm 4 18 78 219 9 0104 359 THERMAL STRAP ASSY 6 JFET 23 16 0 1 0104 367 THERMAL STANDOFF WASHER 5 94 TAD 8 977 27 M2 5 WASHER WASHER 24 S STEEL 5970 1501 3045 11 15 31 2 M2 5 X 8LG CPHD SKT SS FASTENER 36 20 19 S STEEL BS3506 1 1998 A2 10 T NUT 2 0 97 S STEEL 856105 A2 50 DIN 912 SEE NOTE 2 4 58 3205 BELLEVILLE WASHER 2 0 33 BELLEVILLE SPRINGS LTD BATCH 11415 c je 5 M3 X 20LG CPHD SKT SS FASTENER 2 2 52 S STEEL BS3506 1 1998 A2 10 c 6 2 M4x0 7 6H THRO 6 10209786_ BACKHARNESS 102097861 261 10 JPL SUPPLY 7 0104 393 L3 INTERFACE ASSY 64 18 64 18 i 8 0104 391 THERMAL STANDO
25. om m i mm Hp um ms LOAdS SPIRE Grounding scheme Figure 5 10 3 ALCATEL SPACE Company confidential Reproduction interdite REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 30 5 10 3 Bonding It is understood that Herschel bonding applies to harness shields used to maintain closed Faraday cages Bonded interfaces shall not be used as routine current return paths We note that presently all Warm Electronics units rely in conductivity via their mechanical mounting feet to S C The DRCU decreases interface inductance by using conductive interface gasket see Annex 1 bonding strap is connected to each SPIRE SVM mounted unit 5 10 4 Electrical Signal Interfaces 5 10 4 1 1553 Data Buses Reference HP SPIRE REQ 0070 The 4 interfaces to the two prime and redundant buses between the Spire instrument DPUs and the CDMU shall conform to MIL STD 1553B with the CDMU controlling the bus Reference HP SPIRE REQ 0080 The 4 Spire interfaces shall have unique bus addresses consistent with Herschel properly controlling the use of Prime and Redundant equipment Reference HP SPIRE REQ 0090 A long stub configuration shall be used for each of the 4 interfaces one transformer for each stub in the bus wiring and one in the instrument I F Reference HP SP
26. 02 0 00 000010 0000000000 een eerte 5 18 Table 5 7 5 2 SPIRE Satellite Temperature 5 41 40200 000000000000000000000000000 nennen ns 5 19 Figure 5 8 1 Spire optical beam envelope as it leaves the 5 20 Table 5 9 1 Power dissipation inside 1 5 21 Table 5 9 2 Power dissipation on 2 3d 5 21 Table 5 9 3 Power status versus instrument 5 22 Q 24 Power load om mair ee 5 23 Figure 5 9 1 HSDPU Power Input Circuit Configuration 5 25 Figure 5 9 2 HSFCU Power Input Circuit Configuration 2 1 2 1 0 00000000000000000000 00000400011 5 26 Figure o 195p SPIRE harness layout 5 27 Figure 5 10 2 SPIRE Simplified Grounding scheme 00000 0 0000000000000 000000000 5 28 Roure gsl 5 SPIRE Crouncing scheme ee d tr vrbes diee 5 29 Figure 5 10 4 DPU s 1553B interface to the Herschel 5 5 31 Table 5 11 1 Housekeeping and science data rqtes 5 32 Figure Ts Data IMINO
27. 05 SSF S011 022BS 38 11 Cable 5011 inner Shd daisy ch HSJFS HDD 1 2 to Pin 104 at CVV side B3 Cable S011 outer Shield Cable S011 outer Shd con to Busbar Faraday 103 SPIRE SLW JFETV 2 ve SSF 5012 022 5 38 12 HSJFS 76 121220 P09 008 113 SLW JFETV A2 ve SSF 5012 022 5 38 12 HSJFS 76 121220 P09 027 104 SPIRE SLW JFETV A2 SHD06 SSF 5012 022 5 38 12 Cable 5012 inner Shd ch HSJFS 76 121220 P09 026 to Pin 104 at CVV side B3 Cable S012 outer Shield Cable S012 outer Shd con to Busbar Faraday 090 SPIRE SSW Bias ve SSC S029 022 5 38 29 HSJFS 76 121220 P09 028 079 SPIRE SSW Bias ve 55 5029 022 5 38 29 HSJFS 76 121220 P09 010 093 SPIRE SSW Bias SHDO7 55 5029 022 5 38 29 Cable 5029 inner Shd ch HSJFS 76 121220 P09 009 to Pin 093 at CVV side C3 Cable S029 outer Shield Cable S029 outer Shd con to Busbar Faraday 068 SPIRE SSW A1 ve SSE S016 022BS 38 16 HSJFS 76 121220 P09 011 057 SPIRE SSW JFETV A1 ve 55 S016 022BS 38 16 HSJFS 76 121220 P09 030 Filter SICodel LIKE 211121 SConl LIKE J32 And ConWired 1 printed on 18 09 2003 09 25 2 Doc SPIRE RAL PR1 000608 SPIRE HARNESS DEFINITION uc 1 DOCUMENT Date 05 03 03 Page 157 0 228 4 4 10 C10 10 to HSFPU Overall Mechanical Drawing FPU P19 FA MDM 37 P Cooler Tail Prime
28. signals from PSW 61 72 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J7 MDM 25 P HSJFP P7 25S Bolometer signals from PSW 73 84 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J8 MDM 25 P HSJFP P8 25S signals from PSW 85 96 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 C9 CVV 9 HSJFP J1 MDM 25 P HSJFP P1 255 signals from PSW 97 108 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J2 MDM 25 P HSJFP P2 25S Bolometer signals from PSW 109 120 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J3 25 HSJFP P3 25S Bolometer signals from PSW 121 132 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J4
29. Line scan mode map large areas of the sky the telescope must be capable of being scanned up to 20 degrees at a constant rate in an arbitrary orientation with respect to the spacecraft axes The rate of scan must be variable between 0 1 arcsec sec and 60 arcsec per second It is expected that the will be maintained in the orthogonal direction during the scan The S C must be capable of reaching any scan speed up to the maximum within 20 seconds of the observation commencing Raster mode To finely sample the Spire FOV the instrument beam steering mirror will be used to step the FOV across the sky in an arbitrary direction The step size will be between 1 7 arcsec and 30 arcsec The beam steering mirror can also be used to chop a portion of the Spire FOV at a rate up to 2 Hz S C is specified as being able to perform its own raster mode i e stepping the FOV of the overall Herschel telescope view to follow predetermined patterns This is acknowledged to be much less efficient than using the internal Beam Steering Mirror BSM but is needed as a backup in the event of Spire BSM failure The spacecraft shall be capable of performing a rectangular raster with steps of between 2 and 30 arcsec in any arbitrary orientation with respect to the S C axes To map extended regions using the spectrometer the Spire instrument will use the Herschel telescope Normal Raster Mode The instrument may perform fine sampling of each
30. STATE OFF HS PUMP STATE QI801 0 0 QI802 jfet spec Spectrometer JFET QI805 mean phot bsm2 BSM QI806 q peak spec mech SMECm QI807 mean phot calib PCAL 61808 mean spec calib SCAL QI803 hold spec calib SCAL QI812 q pump add Additional Pump Power Dissipation QI817 pump nom PUMP QI818 0 0 SHUNT QI819 0 0D0 EVAP QI820 0 0D0 HS EVAP QI821 pump hs HS PUMP Spectrometer Mode 12 hrs in SMECm R 10 ELSE IF SPSUBMD EQ 8 THEN CALL STATST N819 B T819 0 29DO HS EVAP STATE OFF HS PUMP STATE ON QI801 0 0 Photometer JFET SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 Reproduction interdite ALCATEL SPACE Company confidential PAGE 2 46 REFERENCE INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE ISSUE QI802 q jfet spec Spectrometer JFET QI805 mean phot bsm2 5 QI806 min spec mech SMECm QI807 mean phot calib PCAL 61808 mean spec calib SCAL QI803 hold spec calib SCAL QI812 q pump add Additional Pump Power Dissipation QI817 q pump nom PUMP QI818 0 000 SHUNT 1819 0 000 QI820 0 000 HS EVAP 1821 pump hs HS PUMP SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 PAGE A2 47 Change of Operation Mode for Photometer Mode 11 5 hrs with BSM in chopping mode ELSE IF SPSUBMD EQ 9 THEN
31. postion ssorphoodiode 3 16 20 a SMEC position sensor photodiode 31 17 20 SMEC pos sensor photodiode feedback Shld 29 contacts used SMEC above based on Cryo harness 010906 screened twisted pair screened twisted pair screened twisted pair Insulated Te screened Insulated screened twisted pair Insulated screened twisted pair Insulated screened twisted pair Insulated screened twisted pair Insulated screened twisted pair Insulated screened twisted pair Insulated screened twisted pair Doc SPIRE RAL PRJ 001819 FPU Faraday Shield Link Pins C11 and S11 a7 6 3 9 10 mc Contact details 12 12 12 1 12 Channel 1 Channel 1 Channel 1gnd Channel 2 Channel 2 Channel 2gnd Channel 3 Channel 3 Channel 3gnd Channel 4 Channel 4 Channel 4gnd Channel 5 Channel 5 Channel 5gnd Channel 6 Channel 6 Channel 6gnd Channel 7 Channel 7 Channel 7gnd Channel 8 Channel 8 Channel Channel 9 Channel 9 Channel 9gnd Channel 10 Channel 10 Channel 10gnd shld Channel 11 Channel 11 Channel 11 gnd shld Channel 12 Channel 12 Channel 12gnd shld Channel 13 Channel 13 Channel 1gnd Channel 14 Channel 14 shld shld shld shld shld shld shld shld shld shld Doc SPIRE RAL PRJ 00
32. 25 HSJFP P4 25S Bolometer signals from PSW 133 144 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 Doc No SCI PT IIDB SPIRE 02124 Issue Rev 3 0 Date 15 9 2003 Page 3 Name 128 Way FPU JFS JFP Unit Harness Harness Description Number of Number of Implementation Max Impedance Max Current in A Av Currentin Max Volts Connector Connector Connector Connector Connector Conductors excl inner Shields R W C pF L uH perConductor Conductor Label Type Label Type shields C10 CVV 10 HSFPU 19 375 HSFPU P19 MDM 37P Sorption Pump Heater 4 0 TQ 10 2 5E 02 6 3E 03 Evaporator HS Heater 4 0 TQ 50 1 5E 03 3 8E 04 Aux P Sorption Pump HS heater 4 0 TQ 50 1 5E 03 3 8E 04 Various cooler thermistors 20 10 STQ 1000 1 0E 06 1 0E 06 HSFPU J21 37 HSFPU P21 MDM 37P 5 Stimulus Thermistors 12 6 STQ 1000 1 0E 06 1 0E 06 Spectrometer Stimulus Heater 4 4 0 TQ 30 9 0E 03 2 3E 03 Spectrometer Stimulus Heater 296 4 0 TQ 30 7 0E 03 1 8E 03 HSFPU J23 MDM 37 S HSFPU P23 MDM 37P FPU Thermometry 24 12 STQ 1000 1 0E 06 1 0E 06 300mK Thermal Control Heater 4 2 STQ 30 2 0E 03 5 0E 04 C11 CVV 11 HSFPU J25 MDM 37 S HSFPU P25 MDM 37 BSM Chopper Sensors 3 1 STT 1000 1 0E 06 1 0E 06 0 4 BSM Ch
33. 37 LIA_S_1 FPU 1 _ _2 57 A_S_1 FPU L _ _5 37P 1 _ _5 57 LIA S 2 FPU LIA 4 57 A 5 S FPU 2 _P_4 F PU A 37P LIA_S_3 FPU 3 1 _ _5 785 BIAS M FPU 4 E EA PO A 78S BIAS R FPU 5 A_P_6 F 575 5 M FPU 6 LIA 575 5 R FPU 608 GRAVITY REFERRED TO REFERENCE 132 4 7 157 9 INERTIA REFERRED TO CENTRE OF GRAV 0 471 Kg m2 0 250 Kg m2 JZp 0 444 Kg m EA MOUNTING FEET 28180mm2 COATING AND BLACK ANODISING ESA PSS EMISSIVITY gt 0 85 VALUE FOR CONNECTOR FIXATION SCREWS MALE 0 3mN FEMALE 0 45mN FAT 1170 J Kg K ED MASS 14442g LJ LJ Ch 0 5 45 2 N QUP ART ECHELLE 1 1 Mise jour 01 04 DHENAIN Ajout coupe A A 10 02 DHENAIN Mise jour 09 02 DHENAIN o CONNECTOR TYPE S Mise jour 06 02 DHENAIN 7 11 01 DHENAIN Modifications Date Dessin par V rifi par ifications particuli res COS Indice de rugosit g n ral SOUS TRAITANT 772 LEAKS tol ran g n rales 1 Casser les angles vifs Traitement thermique First angle Projection Echelle 1 2 Poids AL
34. 50ms Insulated SMEC launch latch 2 power return A 400 mA 50ms screened SMEC launch latch 2 power Shield A N A twisted pair N A 79 SMEC launch latch 2 power supply B S_LL 2 Coil P 400 mA 50ms Insulated SMEC launch latch 2 power return B S 82 Coil N 5 400 mA 50ms screened SMEC launch latch 42 power Shield B S LL 2 Col Shd 6 NA twisted pair SMEC LVDT primary coil power supply P PRIM P Insulated SMEC primary power supply N LVDT PRIM screened SMEC LVDT primary coil power supply Shld PRIM Shd Insulated screened id ad screened LVDT SECB Shd HamesOveshield Cd Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas JFP P02 JFP P03 JFP P04 128Way 9 Channel 6 Channel 6gnd Channel 7 Channel 7 PSW D15 Channel 7gnd 13 Al Channel 8 Channel 8 PSW B15 Channel 8gnd Channel 9 Channel 9 PSW C14 9 Channel 9gnd 13 Al Channel 10 Channel 10 PSW D14 10 Channel 10gnd 13 Al Channel 11 Channel 11 PSW A14 11 Channel 11gnd Dass 13 A1 13 36 36 A1 74 NO NO Cn Go 13 1 22 36 I oo Oo 72 36 36 Al x S 12 AD Chmnli0 85 Channel 10 10 Channel 10g BD
35. FilterTemp N V TT STA S253 04155 38 19 HSFPU 70 121100 P23 002 099 SPIRE Filterremp N V STA 5253 04155 38 19 HSFPU 70 121100 P23 003 088 SPIRE FiterTemp N I STA 253 04155 38 19 HSFPU 70 121100 P23 021 101 SPIRE FilterTemp N SHD06 STA 5253 04155 38 19 Cable 253 5258 Shd con HSFPU 70 121100 23 001 together 118 SPIRE SpsctDetBoxTemp N 1 i E STA 254 04155 38 14 HSFPU 70 121100 P23 004 125 SPIRE SpectDetBoxTemp N V STA 5254 04155 38 14 HSFPU 70 121100 23 023 126 SPIRE SpectDetBoxTemp N V STA 5254 04155 38 14 HSFPU 70 121100 23 024 118 SPIRE SpectDetBoxTemp N l p STA 5254 04155 38 14 HSFPU 70 121190 23 005 110 SPIRE SpectDetBoxTemp N SHDO1 STA 5254 04185 38 14 Cable 5253 to 5258 Shd con HSFPU 70 121100 P23 022 together 123 SPIRE PhotomDetBoxTmp N le mae STA 8255 04155 38 15 HSFPU 70 121100 P23 025 116 SPIRE PhotomDetBoxTmpl N V m mx STA 5255 04155 38 15 70 121100 23 007 117 SPIRE PhotomDetBoxTmptN V TT S255 04155 38 15 HSFPU 70 121100 P23 008 124 SPIRE PhotomDetBoxTmp N STA 5255 04155 38 15 HSFPU 70 121100 P23 026 108 SPIRE PhotomDetBoxTmp N SHD02 5255 04155 38 15 Cable 5253 to 5258 Shd con HSFPU 70 121100 P23 006 together 106 SPIRE OptSubbenchTmp N 1 E STA 5256 04155 38 16 HSFPU 70 121100 P23 009 107 SPIRE OptSubbench
36. PMW A PMW_JFETV4 Ashid y PMW BIASI2 A 1 HP J A 7 PMW PMW BIASI2 Ashid 2 64 2 o 5 1 9 PMW BIAS34 Ashld 642 PMWGNDWIREA 28 2 PMWHEATERAI J 29 qd 103 PMW BEATER Al PMW HEATER Al shd J 1 00 142 PMW HEATER A2 49 PMW HEATER A2 30 j HO PMWHEATER A2 shd J O C j 1142 PLWHEATERA J 1 3 y O PLWHEATERA 14 PLWHEATERAshld 14H 141 96 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas Name 37 way P25 37 way P27 37 Way P26 37 Way P28 128 Way 3 PSW Bias PMW PLW Bias A PSW Bias B PMW PLW Bias B JFETV A 1141 99 SO 101100201411 JFETVI Ashd J 1 11 M 3 dB _ PLW JFETV2 A PEWOFETVIA skid BIASI At PLW BIASI A 3 PLW 0 12 PLW _BIAS2 At 10927 2 J 1 8 10 PLW BIAS2 Ashid J 10 11 128 C2 PLWGROUNDWIREA 1282 PSW B PSW JFETVI B 2 O PSW JFETV2_ o PSW JFETV2 Bshid J PSW SO PSW JFETV B 10145041 30 2 PSW JFETV3 Bshd
37. 44 51 FOCAL PLANE ILE 7248 0 ET ENTRANCE BEAMS REMOVED FOR CLARITY 1 65 2 47 81 99 47 1 _ 1 01 1 842 2 Z OPIICAL BEAM DIMENSIONS lt ONLY DIMENSIONS DEFINING THE VOLUME FOR THE OPTICAL OPTICAL REFERENCE CUBE 3 BEAMS WHICH SHALL REMAIN FREE FROM OBSTRUCTION ARE 31 0 X 31 0 X 31 0 SHOWN LIGNMENT CHECK ON S C REFER TO FOR MORE DETAILED INFORMAI ION 50 49 14 17 Ry 205 PLANE 9242 R168 E CRYOQENIC TEMP 5 5 FOCAL PLANE HEIGHT 9 5 o gt lt 9 e gt O gt 2j o 25 O iana 5 HERSCHEL OPTICAL BENCH gt lt rae o Oo NO E 1 ALL DIMENSIONS ROOM TEMPERATURE UNLESS OTHERWISE SPECIFIED 18 4 07 03 SEE CHANGE SHEET 17 16 10 02 SEE CHANGE SHEET CHECKED 16 28 08 02 DRAWING UPDATED TO ISSUE 16 THERE ON NOTE PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS DEPARTMENT OF SPACE AND CLIMATE PHYSICS Ree DN RSS TA TERRACES MODI EIEN REVELL STRAPS CHANGE SHEET FOR DETALUS OF CHANGES eae OTHERWISE STATED GOL EG d TRACED dune dt ORMAR ST STEEL PARTS LINEAR 1 0 MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY UPDATED STAY OUT HOLES REMOVED NATURAL DORK SURRE Y PBG UPDATED FILTER amp PHOT CONNE
38. Alignment vs lo Support Structure Waveguides lower part O n f 4 Upper Shields Upper LOUFM LOU Wave Shields Bulkhead Guides up Extemal Cryo Hamess Crycstat Final LOU vs HIFI Closing Integration integration Alignment Cryastal Evacuation amp Transport to Leak Check 100 000 Figure 2 Annotated Flow chart Un marked up chart for reference only from Astrium HP 2 ASED PL 0031 Issue 1 Making SPIRE ESD Safe Draft 0 2 for comment Page 4 4 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG R PIRA T Cryo BOLA Preparation for Cool IEAI Il Down and Filling Cryasal HK PLM Extemal Alignment Check Alignment Measurement NASA Coodown amp He ll SFT He 1 Integrated Module Test Filling He Production cryostat inciuding operational program V NT PLM EMC Test Demating Support Malin Integration VJ SIC sunshiekl J a Telescope Telescope Cryastat Sunshield Solar Sunshade integration Alignment Array Integration Integration SC Completion S C Alignment MLI Measurement Figure 3 PFM AIT Flow for reference only from Astrium HP 2 ASED PL 0031 Issue 1 jose eose ovse GSE eet Up SIC EGSE p EGSE Set Up He Il Production IST 1 Conversion to Transpart to He top Up Alignment amp top up 5 5 IST SFPT Test Facility check D Ground Lifetime in parallel 3 Alignment Produ
39. BDA Obsolete harness feedthroughs deleted Addition of RF Filter connector numbers alan Go Go gt LL 2 RSCHE DRAWING No 5264 SUUS 343 00 301 00 288 0 0 0 5 Z u CO ORDINATES SEE SHEET 4 FOR POSITION RELATIVE TO SPIRE FPU CL THIRD ANGLE ROJ ES ail HON PACS OUTLINE 785 95 DO NOT SOALE NOTE CRYOSTAT WALL e SHEET 5 815 00 INNER RAD 100 00 149 00 FOCAL PLANE 0248 HIFI QUTLINE HOLES FOR SPIRE ASSEMBLY JIG M8 X 20 DEEP 4 POS 7 RIBS TO KEPT CLEAR OF HIFI MOMENTS OF INERTIA ABOUT 6 NOTE ALL MASS PROPERTIES EXCLUDE JFETS EXTERNAL FPU HARNESSES AND ASTRIUM SUPPLIED LEVEL O INTERFACE PARTS 3 056 kg m 2 lyy 3 008 kg 72 lyy 1 559 m 2 MASS 46 18 kg 97 56 5 00 O A 29 SPIRE C OF POSITION 10 0 LEVEL 0 STRAP FIXINGS GOLD SURFACES EE SHEE
40. PosPhDi 1 N l SMJ 5281 02155 38 27 HSSVMCB3 27 312300 J04 019 029 SPIRE SMEC PosPhDi 1 N SHD06 SMJ 5281 02155 38 27 Cable 5281 283 285 Shd HSSVMCB3 27 312300 J04 029 together 056 SPIRE SMEC PosPhDi 1FB N 5 5 282 02155 38 30 HSSVMCB3 27 312300 J04 056 055 SPIRE SMEC PosPhDi 1FB N R SMK 5282 02155 38 30 HSSVMCB3 27 312300 J04 055 044 SPIRE SMEC PosPhDi 1FB N 5 09 5 5282 02155 38 30 Cable 5282 284 286 Shd HSSVMCB3 27 312300 J04 044 together C 042 SPIRE SMEC PosPhDi 2 N 1 SMJ 5283 02155 38 28 HSSVMCB3 27 312300 J04 042 041 SPIRE SMEC PosPhDi 2 N l SMJ 5283 02155 38 28 HSSVMCB3 27 312300 J04 041 030 SPIRE SMEC PosPhDi 2 N SHDO7 SMJ 5283 02155 38 28 Cable 5281 283 285 Shd HSSVMCB3 27 312300 J04 030 together 034 SPIRE 5 PosPhDi 2FB N S SMK 5284 02155 38 31 HSSVMCB3 27 312300 J04 034 033 SPIRE SMEC PosPhDi 2FB N R SMK 5284 02155 38 31 HSSVMCB3 27 312300 J04 033 045 SPIRE SMEC PosPhDi 2FB N SHD10 5 5284 02155 38 31 Cable 5282 284 286 Shd HSSVMCB3 27 312300 J04 045 together 020 SPIRE SMEC PosPhDi 3 N 1 SMJ 5285 02155 38 29 HSSVMCB3 27 312300 J04 020 021 SPIRE SMEC PosPhDi 3 N l SMJ 5285 02155 38 29 HSSVMCB3 27 312300 J04 021 031 SPIRE SMEC PosPhDi 3 N SHD08 SMJ 5285 02155 38 29 Cable 5281 283 285 Shd HSSVMCB3 27 312300 J04 031 together 058 SPIRE PosPhDi
41. 06 PART B SPIRE SPIRE ISSUE 3 PAGE 2 2 RD 9 RD 10 RD 11 RD 12 RD 13 RD 14 RD 15 RD 16 RD 17 RD 18 RD 19 RD 20 RD 21 RD 22 RD 23 RD 24 RD 25 RD 26 RD 27 SPIRE product tree Instrument WBS inside RDA Instrument Science Implementation plan SPIRE Grounding and Screening Philosophy SPIRE RAL PRJ 000624 SPIRE CRYOGENIC INTERFACE THERMAL MATHEMATICAL MODEL SPIRE RAL PRJ 000728 Instrument reduced FRM Model Spire Straylight References SPIRE RAL NOT 001 124 Swinyard B Power profiles for SPIRE operating modes RAL NOT 000068 SPIRE Operating Modes SPIRE RAL PRJ 000320 SPIRE Thermal Configuration Control Document SPIRE RAL PRJ 000560 Herschel SPIRE Harness Definition SPIRE RAL PRJ 000608 Spire requirements on Cryostat Apertures SPIRE RAL NOT 01242 Matching SPIRE HOB Decentre and tilt amplitudes to the Photometer pupil alignment budget SPIRE RAL NOT 000754 The Instrument EGSE for Herschel Integrated System Tests SPIRE RAL NOT 001463 SPIRE FPU Handling and Integration Procedure SPIRE RAL PRC 001923 EQM test plan SPIRE RAL DOC 001905 SPIRE Instrument Qualification Requirements SPIRE RAL PRJ 000592 Calibration Requirements Document SPIRE RAL PRJ 001064 SPIRE CQM Instrument Level EMC Test Specification SPIRE RAL NOT 001 681 RD 28 SPIRE Warm electronic integration plan SPIRE RAL DOC 001 132 Reproduction interdite ALCATEL SPACE Company co
42. 1 Ca J C j j Zo BAD T T 3605 1 Channel 10 5 10 84 5 x DAD n 34 T F E EE BAD T 3 0 2 PLWAS 4 _ DAD T 3605 x d J 86 F nas i s x AS l T MB j U i 5 s 66 5 PLWCA 1 JJ 1409 _ d e PLWB3 BAS 18 pj O 5 ee 186022 1 11 j 6 F KISS E 34 5 x DG i m wa EE BAS 1022 x PLWA3 x BG 18 gt ee CCAD T T 18622 n j p wg maet ELE ils 5 i a 88 5 Erw x DG ERIT E a BAS j 18 T wi E E EE T E03 5 ee EL 5 403 i 9 9 mwe E EE EE T E03 x On ee 5 i S 5 PLWD2 s S A Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Del
43. 18 NC 19 NC 20 NC 21 NC 22 NC 23 24 25 PSW JFETV1 26 27 28 29 30 31 NC 32 NC 33 NC 34 35 PSW 36 PSW JFETV1 A 37 PSW JFETV2 38 39 NC 40 41 42 43 44 45 46 47 PSW JFETV3 48 PSW JFETV2 A 49 PSW JFETV5 50 PSW_JFETV6 51 52 53 NC 54 55 NC 56 NC 57 58 PSW_JFETV4_A 59 PSW JFETV3 A 60 PSW JFETV5 A 61 PSW JFETV6 62 PSW BIAS1 2 63 PMW GND WIRE 64 65 66 67 NC 68 69 70 PSW JFETV4 A 71 PSW 55 6 A 72 PSW 53 4 73 PSW 53 4 74 PSW BIAS1 2 75 PMW BIAS1 2 A 76 PMW BIAS1 2 A 77 78 NC 79 NC 80 NC 81 NC 82 NC PSW BIAS5 6 83 84 NC 85 PMW_JFETV1_A 86 PMW JFETV1 87 PMW 53 4 88 PMW 53 4 89 90 NC 91 NC 92 NC 93 NC 94 NC 95 NC 96 NC PMW JFETV2 A 97 PMW JFETV2 98 PLW JFETV1 PLW JFETV1 A 100 101 102 NC 103 NC 1 NC 105 106 107 PMW 108 PMW 109 PLW JFETV2 110 PLW JFETV2 A 111 PLW BI
44. 3 3 PAGE A2 3 type of analysis no need to select the analysis mode anymore 27 03 03 Issue 2 3 SCAL dissipation down to 2 mW busbar update BDA update vespel L1 foot supports for elec iso L1 additional IF node for double L1 strap 2 additional nodes for L3 strap attachment L3 JFETs isolation supports updated 07 04 03 Issue 2 4 Heat Switch Actuation Updated to account for a 30 sec delay error in model file 07 01 04 02 02 04 Issue 2 5 Cooler recycling profiles updated to obtain more accurate energy levels on Pump and Evaporator straps during recycling SCAL Power Dissipation changed back to 1 5mW Average case adjusted according to reflect the two first updates 300mK system Kelvar support cord diameter adjusted to 0 5mm diamter Detectors Harness adjsuted according JPL test data Evaporator Kevlar cord back to 0 29 mm diameter Level 1 and Level support conductance rduced by factor 4 F harnesses Length adjusted to FM hardware New Level straps and supports design New JFET supports design For transient runs the following capacities have been set to zero 800 830 831 832 805 806 807 808 811 812 813 814 815 816 818 820 821 VARIABLES1 timeline analysis selection of dissipation profiles done via control variable SPSUBMD no longer via TIMEN to have access from within HERSCHEL mainmodel dk 3k T
45. 316 41700 1 1D 7 52 736D0 1 95D 7 316 417D0 1 95D 7 52 736D0 7 54D 7 316 417D0 7 54D 7 52 736D0 3 0D0 10 38D 06 0 034600 11 10 sp CNDFNC 3 K MANGANIN 5 470 8 121 9300 1 37D 8 22 700 4 38D 7 121 9300 1 10 7 22 700 CNDFNC 3 K_SSTEEL 1 950 7 121 9300 1 95D 7 22 700 7 54D 7 121 9300 7 54D 7 22 700 Company confidential REFERENCE 3 SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE A2 9 Photometer 809 822 CNDFNC 3 K KEV29 0 00025 3 0 Ph BDA Supports 809 822 12 4 1 1 17 0 286D 06 LO to 300mK ph harness 1 PTC 809 822 CNDFNC 3 K KEV29 7 068D 06 0 02500 ph enclosure busbar feedthru Spectrometer 810 823 CNDFNC 3 K_KEV29 0 00025 2 0 Sp BDA Supports 810 823 3 0 1 17 0 286D 06 LO to 300mK sp harness 810 823 CNDFNC 3 K_KEV29 2 356D 06 0 02500 sp enclosure busbar feedthru 3He COOLER Shunt 817 818 818 819 818 820 819 803 parasitic 817 803 parasitic Evap 819 820 conducted parasitic 819 820 GR 819 820 820 803 support from L1 Pump CNDFNC 3 K_TI6AL4V 6 41D 06 0 038D0 pump shunt tube CNDFNC 3 K_TI6AL4V 6 41D 06 0 0600 shunt evap tube CNDFNC 3 K_HPC
46. 5 12 OO EM MM ME M LE 5 12 5 12 OU Ce Raro lem 5 13 SU MEE MH 5 13 563 TOS 5 13 5093 3COGIERVGIVES and OI OIG 5 13 Sc u RU 5 14 Sh ABSA fec 5 15 5 7 1 1 Description of the thermal interfaces 0 00 022 00 eee 5 15 5 7 1 2 Description of Operation and Interfaces for the He eee 5 15 MEM nale NSIS MES 5 15 Dele WV TEMA Er dlures ea ete mde Eos Pus RU 5 16 572 DUSIOS TAS Cry OST CPU ORO RE d D cO eo 5 17 OE SVN RR RT 5 17 bL Onthe Planck Payload Module scias dmi tua ai na L 5 17 57 5 5 18 instrumen temperature SensofS uu u u uy l u 5 18 5 7 9 2 Temperature Sens rs uiuere ite ha uae 5 18 SAI odlellile T raperat re Sensors w
47. 8 9303 N 11 2203 lt CO 8 18D 220 ES s t9 2 2 oh J pe 22 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas Name Pixel JFS P05 JFS P06 37 Way C 37 Way D CVV JFS P09 JFS P10 128 Way 1 SSW HEATER Ashld _ 41 103 2203 a JFET HEATER A 414 j 4 n JFET HEATER A ve 1 5 4 JFET HEATER shld Bias Bias B ve C JFETV Bias B PTCJFETV Bias B ve PTC JFETV Bias B Shield a BIAS 1 SLW BIAS Bl ve SLW BIAS shld s 0 d 15 j 2 SLW BIAS B2 shld 23 B4 32 B4 a SLW JFETV BI ve Eoo p 1 25 3 SLW JFETV ve 1 711 32 SLW JFETV shld x S O 6n8 3284 a SLW_JFETV_B2 ve 8 2 SLW_JFETV B2 ve d 4 j SLW_JFETV_B2 shld pH 3284 x S O 3284 12 40 4 a SSW BIASI ve 28 SSW BIASI SSW shid 41 94 46 a SSW JFETVI B H H n SSW B ve 4110 29 SSW JFETVI B shld drea a SSW BIAS2 B 44 y O SSW_BIAS2_B ve gt gt
48. 812 821 1 1 0 44 1 1 998D 3 LO_Cu 1 0 400D 340 Cu 1 4 0 4 1 4 4 5 3 4 0 025 10 pump 813 820 1 1 0 44 1 1 998D 3 LO_Cu 1 0 428D 3 LO_Cu 1 4 0 4 1 4 4 5 3 4 0 025 10 evaporator LO Strap Supports off SOB GL 811 803 CNDFNC 3 K TOR 2 0D0 2 0D0 0 006D0 0 006D0 0 03375D0 0 006D0 0 006D0 0 070D0 2 supports per strap 1 bipod and 1 tripod 812 803 CNDFNC 3 K_TOR 2 0D0 2 0D0 0 006D0 0 006D0 0 03375D0 0 00600 0 00600 0 07000 2 supports per strap 1 bipod and 1 tripod GL 813 803 CNDFNC 3 K TOR 2 0D0 2 0D0 0 006D0 0 006D0 0 03375D0 0 006D0 0 006D0 0 070D0 2 supports per strap 1 bipod and 1 tripod Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 11 SPIRE Internal LO Strap between the spectrometer and the photometer enclsoures Al Cu IF Strap eleciso 810 809 1 1 0 2 1 0D0 LO_Cu 9 0E 06 0 198D0 1 1 66 0 025 SPIRE Internal 300mK Straps to the cooler cold tip 822 819 U cooler ph detector strap effective A 823 819 U cooler sp detector strap effective SPIRE Level 1 Strap Interface Level 1 strap electrical insulation joint conductance Copper Epoxy Copper Joint with 13 cm2 contact area The 0 425 factor has been added to achieve a sensible
49. ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 2 9 PAGE 4 2 4 3 INSTRUMENT OVERVIEW SPIRE contains a three band imaging photometer and an imaging Fourier Transform Spectrometer FTS both of which use 0 3 K spider web germanium bolometers cooled a refrigerator The bolometers are coupled to the telescope by close packed single mode conical feedhorns The photometer and spectrometer are not designed to operate simultaneously The field of view of the photometer is 4 x 8 arcminute the largest that can be achieved given the location of the SPIRE field of view in the Herschel focal plane and the size of the telescope unvignetted field of view Three photometer arrays provide broad band photometry 3 in wavelength bands centred on 250 350 and 500 um The 250 350 and 500 um arrays have 149 88 and 43 detectors respectively making a total of 280 The field of view is observed simultaneously in all three bands through the use of fixed dichroic beam splitters Spatial modulation can be provided either by a Beam Steering Mirror BSM in the instrument or by drift scanning the telescope across the sky depending on the type of observation An internal thermal calibration source is available to provide a repeatable calibration signal for the detectors The FTS uses novel broadband intensity beam dividers and
50. CALL STATST N819 B 1819 0 29DO HS STATE OFF HS PUMP STATE QI801 phot Photometer JFET QI802 0 0 Spectrometer JFET QI805 q mean phot bsm BSM QI806 0 0 SMECm QI807 mean phot calib QI808 0 0 SCAL QI812 q pump add Additional Pump Power Dissipation QI817 q pump nom PUMP Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE 21 06 2004 PART SPIRE IID B SPIRE ISSUE 5 9 91818 0 0 SHUNT QI819 0 0 EVAP QI820 0 0 HS EVAP QI821 pump hs HS PUMP SPIRE Operation Photometer Mode 11 hrs with BSM in scanning mode ELSE IF SPSUBMD EQ 10 THEN CALL STATST N819 B T819 0 2900 HS STATE OFF HS PUMP STATE ON QI801 q jfet phot Photometer JFET QI802 0 0 Spectrometer JFET QI805 peak phot BSM QI806 0 0 SMECm QI807 mean phot calib PCAL QI808 0 0 SCAL 91812 pump add Additional Pump Power Dissipation QI817 pump nom PUMP QI818 0 0DO SHUNT QI819 0 0D0 EVAP QI820 0 0D0 HS EVAP QI821 2 q pump hs HS PUMP END IF ENDIF Reproduction interdite ALCATEL SPACE Company confidential PAGE 2 48 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A2 49 sw
51. Details of testing at EQM level can be found in RD24 EQM test plan and its associated applicable reference documents 7 2 2 PFM Testing The PFM system level test procedures for SPIRE will be based on those carried out on the EQM A separate It is expected that they will be for instrument and system verification and validation purposes only as the CQM testing will have addressed all fundamental operational issues The sequencing and test environment requirements for the PFM testing will be the same or very similar as for the testing Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 7 2 3 Thermal on ground Test See RD24 EQM test plan 7 2 4 EQM and PFM fests list The list of TRS test requirement sheets of table here after is extracted from applicable documents of IIDA AD 13 HP 2 ASED PL 0021 2 0 Instrument testing at HPLM level and AD 14 HP 2 ASED PL 0031 10 Instrument testing at HPLM FM level Instrument testing on PLM EQM Level Instrument testing on PLM PFM amp S C Level HP 2 ASED PL 0021 HP 2 ASED PL 0031 TRS ret TRS tie _ va SPIRE Short Functional Test Cold 2 8 7 3 SPIRE Short Functional Test Cold He 2 8 8 10 SPIRE Ambient Background 8 8 11 SPIRE Ambient Background Verification Verification 8 10 3 SPIRE Integ
52. E EE ue C j 128 A Loue 4 148977 P E EE ilt S 0 128 A n 14 111 i s S 12802 15 P 12 j Oe SE S BA 41 128 A2 wq 1 Jj j 9 FT i 479 124 12 O T FTP 4709 n s E ne ee 4A O FT i BAB 479 41 5 4 SB Fw ma 47 A3 oT n 4709 1 PSWEI3 ET 479 Channel 32 PSWJI2 J 21 S 270 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas Photometer Stimulus Heater P13 Function P13 Max Current Wire Lay up MaxOhms 128Way 11 Photometer Point Stim Heater 7 mA 10 48 Photometer Point Stim Heater I B 7 mA Screened twisted 10 71 Photometer Point Stim Heater I A 7 mA quad 10 60 Photometer Point Stim Heater I B 7 mA 10 59 Screen 36 Harness Overshield EMC Backshell 4 pins used SMEC Launch Tail Listing FCU P29 Wi ay up SMEC launch latch 41 power supply A S Coil P 1 400 mA 50ms SMEC launch latch 1 power return A S_LL 1 Coil NEN NN 400 mA 50ms SMEC launch latch 1 power Shield S 1141 Coil Shd SMEC launch latch 1 power supply 121 400mA 50ms Insulated SMEC launch latch 1 power return B 400 mA 50ms screened SMEC launch latch 1 power Shield B twisted pair N A 80 SMEC launch latch 2 power supply 4 400
53. FCU QMI Power supply bench power supply Fixings etc JFET fixation hardware Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 44 e Isolation washers special screws and studs Thermal strap fixation hardware 3 Pressure plates 2 off Screws and isolating bushes 8 2of A4off these screws will be prepared for wire locking Wire for locking above screws non isolating bushes for the vent line end of the strap 16 off Connector savers safe plugs covers etc Savers will not be supplied with the CQM Safe plugs will be supplied fitted to in the active connectors only A Aperture cover red tag item A Alignment cube The FPU will be as per the PFM with the following exceptions Only the PLW detector will be fitted all other detectors will be mass thermal dummies The SMEC spectrometer mechanism will be a non functioning structural thermal dummy The BSM beam steering mechanism will be a non functioning structural thermal dummy Only the PLW JFET will be fitted the other JFETs will be mass thermal dummies The thermal isolating supports on both the FPU and the detector boxes will be stainless steel whereas it is planned to fit CFRP supports for improved thermal isolation to
54. NC 111 NC 112 SLW JFETV A2 ve 113 SLW BIAS At ve 114 115 NC 116 NC 117 118 NC 119 NC 120 NC SLW BIAS 1 121 122 123 124 NC 125 126 127 128 128 Way plug for Spectrometer JFETs BDAs e 23x 1 Ohm resistors to chassis of connector ESA Industry provided Making SPIRE ESD Safe Draft 0 2 for comment Page 16 16 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG ESA Industry provided EMC Backshell providing a 360 electrically conductive barrier over the exposed contacts Type VIll e SMEC position sensor Led power return 2 SMEC position sensor Led power Shield 3 SMEC position sensor power return 4 7 8 NC SMEC position sensor Led power supply 9 59 k SMEC position sensor power Shield 10 2i 82 G 36 bw SMEC position sensor power supply M N 94 59 13 NC 71 48 25 14 Z 105 59 N Jiggle Position Sensor3 15 Pa VM 83 60 27 15 Position Sensor 5 16 lt gt gt gt A N Chop Position Sensor 4 5 X CA N SMEC position sensor photodiode 1 1 18 445 95 72 42 26 x d 8 SMEC position sensor photodiode 1 1 A gt 4 SMEC position sensor photodiode 3
55. Reference HP SPIRE REQ 0150 SPIRE requires an average of 126 kbps of TM data rate during operations and 2 0 kbps when in non prime mode 5 11 1 2 Data bus rate Reference HP SPIRE REQ 0160 For the purpose of possible up to 5 minutes higher instrument data rates the bus interconnecting the instrument and the HCDMU shall have the capability of handling a telemetry rate of gt 200 kbps This will allow for the rapid emptying of Spire on board data storage units at the end of each observation thus keeping overheads due to data transfer to a minimum Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 33 5 11 1 3 Data Packets Spire is capable of buffering 10 seconds of data at the maximum packet generation rate Reference HP SPIRE REQ 0170 In order to prevent data overflow in this Spire data storage the HCDMU shall request packets from Spire at least as frequently as once per second 5 11 2 5 housekeeping Reference HP SPIRE REQ 0180 The S C should be capable of collecting and range checking the following instrument parameters every minute lt shall provide a data packet to the ground that includes these housekeeping values together with any range violations and any actions taken thereon Voltages to instrument Currents to instrument Power
56. SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 2 4 PACS Photoconductor Array Camera and Spectrometer Herschel PFM Proto Flight Model QLA Quick Look Analysis software RAM Random Access Memory RD Reference Document RF Radio Frequency ROM Read Only Memory RTA Real Time Assessment software 5 Spacecraft SCOS Spacecraft Control and Operations System SIRD Science Operations Implementation Requirements Document SPIRE Spectral Photometer Imaging Receiver SPU Signal Processing Unit SRD Software Requirements Document SVM Service Module TBC To be confirmed TBD To be determined TBW To be written Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 3 KEY PERSONNEL AND RESPONSIBILITIES 3 1 KEY PERSONNEL 3 1 1 Principal Investigator Prof Matt Griffin Department of Physics and Astronomy University of Wales Cardiff Carditt CF24 3YB United Kingdom Telephone Institute 44 0 29 2087 4203 Telefax 44 0 29 2087 4056 E mail matt griffin astro cf ac uk 3 1 2 Co Principal Investigator Dr Laurent Vigroux CEA Service d Astrophysique CEA Saclay Bat 709 Orme des Merisiers 91191 Gif sur Yvette France Telephone Institute 33 1 69 08 3912 Telefax 33 1 69 08 6577 E mail lvigroux cea fr 3 1 3 Project Manager Dr Ken King Rutherford Appleton Laboratory Chil
57. Subsequent dimensions in X direction updated to new interface plane New parts added to Parts List 2 HOLES 4 0 7 1 5D LG HELICOIL FASTENER TO ENGAGE 1 5d Reflects new harness layout which simulates actual physical layout Micro D 15 way connector TORQUE NOT TO EXCEED 2 5Nm added to harness representation Micro D 37 way elliptical entry backshells replace standard circular entry versions Mass of harness increased from 110g to 205g L3 strap and interface assembly added Views updated to show interface details and L3 strap hole definition Mass of JFET modules reduced from 305g to 260g Kapton tape removed from fastener and stand off interfaces note 7 deleted Moments of inertia updated along with C of G position Kapton tape note removed from L3 interface area Incorrectly specified M2 5 x 8 long fasteners used to fasten JFET modules to front plate replaced with M3 x 8 long Temperature sensor interface shown on both sides of the L3 interface sub assembly 10 Distance between S C connector I F and rear of JFET harness increased due to addition of 15 way connectors to JFET harness 11 New dimensions applied to L3 interface area 12 Connector fasteners and nuts added to spacecraft connectors SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED KE 2952 KE 2952 SSTD Space Product Assurance Form Doc No 1509 006
58. drawings As the I F drawings are dated 2 02 04 and the comments HP ASED FX 0231 04 are dated 27 02 04 it is assumed that they have not been implemented yet Tilting of is required during the integration Therefore please upgrade MGSE to allow tilting of assembly by 3 to 10 degrees e g by including a turnbuckle self locking on the Z rope The wires holding the JFETs are not included but the bolt holes in the MGSE plate indicate a potential conflict with the ventline Please refer to HP ASED EM 0231 04 for details e Flexibility of FPU JFET harnesses Note that it will be required to move the Photometer JFET to y during the lowering of the FPU JFET assembly due to the conflict with the ventline on its y side Our initial estimates are that the Photometer JFET need to be moved by 10mm in y direction Please confirm that your internal harness can cope with move to Photo JFET by about 10mm for details please see HP ASED EM 0231 04 Removal of LO Detector Strap before FPU integration At least the front part of the Lower A frame of need to be removed before integration The top A frame and the flex link on top of the strap need to be removed completely Alternatively the top flex strap could stay but SPIRE need to confirm that it can be moved by 10 to 15mm to in 2 direction Please clarify your proposal for the partial or complete removal of the FPU LO detector strap see HP ASED EM 0231 04 for detai
59. 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J19 25 HSJFP J19 25S Bolometer signals from PMW 73 84 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP 920 25 HSJFP J20 25S signals from PMW 85 96 24 3 DS 12 500 1000 0 08 1 0 09 5 0 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 C6 CVV 6 HSJFP J13 MDM 25 P HSJFP P13 MDM 255 signals from PLW 1 12 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08uH 0 0E 00 0 0E 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J14 25 HSJFP P14 25S Bolometer signals from PLW 13 24 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP 915 MDM25P HSJFP P15 25S _ Bolometer signals from PLW 25 36 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP 916 MDM25P HSJFP P16 25S Bolometer signals from PLW 37 48 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1
60. 0 001900 4 000 0 004500 6 000 0 007500 8 000 0 010800 10 000 0 014200 20 000 0 033800 30 000 0 056200 40 000 0 080500 50 000 0 106400 60 000 0 133600 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 25 70 000 0 162000 80 000 0 191400 90 000 0 221800 102 500 0 2600 150 000 0 2600 200 000 0 2600 250 000 0 2600 300 000 0 2600 STAINLESS STEEL K SSTEEL 2 35 0 100 0 0100 0 200 0 0300 0 300 0 0400 0 500 0 0800 0 700 0 1100 1 000 0 0800 4 000 0 2400 5 000 0 3200 6 000 0 4000 7 000 0 4800 8 000 0 5800 9 000 0 6600 10 000 0 7700 15 000 1 3000 20 000 1 9000 30 000 3 2500 40 000 4 5000 50 000 5 7500 60 000 6 7500 70 000 80 000 90 000 7 5000 8 2500 9 0000 100 000 9 5000 110 000 10 0000 120 000 10 5000 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 26 130 000 10 7500 140 000 11 0000 150 000 11 5000 160 000 11 7500 170 000 12 0000 180 000 12 2500 190 000 12 5000 200 000 13 0000 250 000 14 0000 300 000 15 0000 2 8 0 100 0 00002D0 0 400 0 0004000
61. 1 0DO 0 0040000 2 000 0 0200000 4 000 0 0500000 10 000 0 1000000 40 000 0 2000000 400 000 0 26600 2 19 0 100 4 050050 06 2 000 0 00277783100 3 0DO 0 006723336D0 4 0DO 0 01258784100 5 0200 1 61D 02 7 0600 1 69D 02 10 1200 1 93D 02 15 2200 2 600 02 20 3200 3 630 02 24 9100 4 850 02 30 0100 6 530 02 Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 35 1100 8 57D 02 40 2100 1 100 01 44 800 1 340 01 49 900 1 650 01 55 000 0 1986D0 100 000 0 236700 200 000 0 321300 293 000 0 400000 Ti6AIAV 6 14 2 17 0 200 0 00600 0 300 0 00600 0 500 0 01400 1 000 0 04300 1 500 0 08200 2 000 0 13000 3 000 0 19700 4 000 0 25300 10 000 0 6800 20 000 1 3200 35 000 2 1200 50 000 2 7500 100 000 4 0000 150 000 5 0000 200 000 5 8000 250 000 6 6000 300 000 7 6000 K 5 2 15 0 120 0 000100 0 300 0 0004500 1 000 0 001800 2 000 0 004200 Reproduction interdite ALCATEL SPACE REFERENCE 5 02124 DATE 21 06 2004 ISSUE 3 3 PAGE A2 27 Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 4 000 0 009600 5 000 0 012600 8 000 0 022300 10 000 0 029200 15 000 0 047700 117 000 0 047500 144 000 0 0600 200 000 0 08
62. 1 1 0 00666 CNDFNC 3 SPIRE K T300 lsolating Supports GL SPIRE 801 9361 1 Harness to CVV GL SPIRE 831 581 1 2 0 4 4 1 0 0667D 3 CNDFNC 1 TLCU 1 13 strap 3k GL SPIRE 802 380 3 1 1 0 00666 CNDFNC 3 SPIRE K T300 solating Supports GL SPIRE 802 379 1 1 1 0 00666 CNDFNC 3 SPIRE K T300 lsolating Supports GL SPIRE 802 9381 1 Harness to CVV GL SPIRE 832 585 1 2 0 4 1 0 0667D 3 CNDFNC 1 TLCU 1 strap GL SPIRE 803 376 0 25 1 0 CNDFNC 3 SPIRE K_SSTEEL 1 5914D 3 1 0D0 604 0D 6 CNDFNC 3 SPIRE K_VES 0 001D0 L1 Cone Support effective xsect GL SPIRE 803 381 0 25 1 0 CNDFNC 3 SPIRE K_SSTEEL 1 6370D 3 2 0D0 604 0D 6 CNDFNC 3 SPIRE K_VES 0 001D0 11 A Frame Supports with correl factor GL SPIRE 804 9301 k_8 FCAB SP11SST SP11BRAS SP1 1PTFE SP11CCU SP11SIMO SP11CUBE SP11CUMN 5 1111 6 T SPIRE 804 19301 HERSCHEL RF Filter Harness GL SPIRE 804 9341 1 GL SPIRE 814 10 k_40 1 583 1 0 075 1 0 4 SPIRE enclosure LO Interface at Hell Tank 1 583 fac needed to reach the 0 1 W K GL SPIRE 815 10 k 40 2 25 1 0 05 1 0 4 SPIRE pump LO Interface at Hell Tank 2 25 fac needed to reach the 0 1 W K GL SPIRE 816 10 3 0 40 1 25 1 0 1 1 0 4 7 SPIRE evap LO Interface at Hell Tank 3 75 fac needed to reach the 0 3 W K GL SPIRE 800 537 1
63. 21 06 2004 ISSUE 3 3 PAGE 2 16 Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE SPECIFIC HEAT Silicon SHCSI1 2 10 2 0 200 0 000001D0 0 300 0 00000100 1 000 0 00006600 4 000 0 01700 10 000 0 2800 20 000 8 500 50 000 79 000 100 000 260 000 200 000 560 000 300 000 710 000 SPECIFIC HEAT Titanium SHCTI1 2 10 0 200 0 007100 0 300 0 007100 1 000 0 07100 4 000 0 31700 10 000 1 2600 20 000 7 000 50 000 99 200 100 000 300 000 200 000 465 000 300 000 522 000 SPECIFIC HEAT Stainless Steel SHCSS1 2 10 0 200 0 0200 0 300 0 02000 1 000 0 09000 4 000 0 38200 10 000 1 2400 20 000 4 500 Reproduction interdite ALCATEL SPACE REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 Company confidential PAGE 2 17 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 50 000 55 000 100 000 216 000 200 000 384 000 300 000 447 000 REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 PAGE 2 18 TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE SPIRE Material Thermal Conductivity W mK TE T
64. 4 49 J j X S6 STP K2 483 2 S6 STP K3 ews 4483 4 3 L9 S6 STP K4 443 4 LL S6 STP LI ewes j S6 STP L2 ewes 4483 4 LL S6 STP L3 x L 9 49 S6 STP L4 3 J r Overshield EMC Backshell Backshell EMC Backshell Backshell FPU Faraday Shield Link Pins l 2 1 3 35 517 3 34 385 2 51 51 9 SPIRE HARNESS DEFINITION DOCUMENT Deltas SMEC Control Tail Listing FPU J29 Function 37way Max Wire 128Way 11 J29 current lay up eaa SMEC Drive Coil I 1 100mA SMEC Drive Coil I A 100 SMEC Drive Coil shld 20 NA 20 SMEC Drive Coil Rob 1 100mA 100mA SMECDriveCoil Rob shld 3 NA Drive Coil Senset 4 SMEC Drive Coil Sense 5 position sensor Led powersupply 7 A SMEC position sensor Led power return SMEC position sensor Led power Shield NA 3s position sensor power supply 27 SMEC sensor power return 28 mA SMECpositionsensorpowerShield 9 NA SMEC position sensor photodiode 1 1 10 20 10 pA pos sensor photodiode 2 feedback
65. 4444444444 Temperature K PACS CQM Unit June 2003 HCR 2 Second recycling HSE 21 1 4 mA 300 mW input power to sorption pump Cryostat tilted to 60 degre 0 50 100 150 1000 PACS Thermal tests June 2003 HCR 2 Level 1 titanium frame 2 K Level 0 cryostat cold plate 1 62 K Second recycling 800 Cryostat tilted at 60 degree during condensation Right scale 600 Integrals give evaporator switch interface 205 J pump switch interface 340 J langer condensation to try to reduce the heat flow at the end of the condensation phase 400 uojis 14 mW heat flow 200 Heat flow at evaporator switch interface mW 0 20 40 60 80 100 120 Figure 6 Cooler Recycling Characteristics above and estimated heat flows below We see that during test and probably in flight also the cooler s titanium frame alters temperature during re cycling This is even with the cooler chassis fixed all along one side PACS style to the L1 test plate Generally the faster the whole regeneration process the better both in terms of the minimising the total single recycle energy and in terms of the fraction of time available for science By searching for efficient operation in Spire we have set the initial pump heater power to 300mW If the heat shunt and evaporator strap could take the load as a hig
66. CEA Service d Astrophysique CEA Saclay B t 709 Orme des Merisiers 91191 Gif sur Yvette France Institut d Astrophysique Spatiale B t 121 Universit Paris Sud 91405 Orsay Paris France Blackett Laboratory Imperial College Prince Consort Rd London SW7 2BZ England Inst di Fisica dello Spazio Interplanetario CNR Area di Ricerca Tor Vegata via Fosso del Cavaliere 00133 Italy Jet Propulsion Laboratory Pasadena CA 91109 USA Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 3 5 Dominique Tel 33 4 91 05 5949 Laboratoire Pouliquen Fax 33 4 91 05 6959 d Astrophysique de E mail Marseille Dominique pouliquen asirsp BP 8 13376 Marseille mrs fr Cedex 12 France MSSL Berend Winter Tel 44 1483 204 215 Mullard Space Science Fax 44 Laboratory E mail Holmbury St Mary bw mssl ucl ac uk Dorking Surrey RH5 6NT England University of Peter Hargrave Tel 44 29 2087 6067 Department of Physics and Wales Cardiff Fax 44 29 2087 6682 Astronomy E mail University of Wales p hargrave astro cf ac uk Cardiff Cardiff CF24 3YB United Kingdom LOCAL TELEPHONE FAX MANAGER EMAIL RAL Ken King 44 1235 44 6558 Rutherford Appleton Fax 44 1235 44 6667 Laboratory E mail Chilton Didcot k j king rl ac uk Oxfordshire OX11 England Stockholm H G Floren Tel 46 8 5537 8522 Stockh
67. IC BOX CTRON INT B E AI CE CONTROL DRAWING rmis d utiliser ce dessin qu avec lice nce sp ciale ou autorisation expresse loi du 11 mars 08 78 25 08 59 76 08 79 96 COMMISSARIAT A L ENERGIE ATOMIQUE C E N SACLAY 5 5100 000 Approuv par Niveau qualit 1200 D wa m EN EN __ Ly LE Ld LI LJ LI LJ e 9 e e o P5 P6 S 52 IF BIAS e e e Jp 6 ALL OTHER AREAS BLACK ANODISING 1200 12 5 220 5 220 5 6 962 3 S S e e e 1 fo T 2 Q 45 jo 18 jo 10 1 S A A 9 225 3 27 5 225 275 275 275 B 1 26 5 195 5 25 195 5 REF HOLE CONNECTORS odffactory htm DB DD E J23 1 a eprn WW 4521 CONNECTOR TYPE P CONNECTOR TYPE S 10 c 7 MATIERE PROTECTION Alu 2017A CEA SAP DESSINE SREE pate 02 12 02 TRAITEMENT 91191 GIF YVETTE Cedex Alodine 1200 CE DOCU
68. Internal to unit 300mKTSBis 20Hz Ret 1ms Highly sensitive signal Photo Stimulus 0 5 Red J J O DC DC switching 131 kHz Free runing 1090 internal to unit frequency TBC Table 5 14 1 SPIRE Frequency Plan Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 41 5 15 Transport and Handling Provisions 5 15 1 Focal Plane Unit The FPU is a delicate optical instrument and should be handled with extreme care at all time Contamination of the optical surfaces within the instrument is prevented by the aperture cover This cover should remain in place unless it is necessary to remove it The bipod legs on two corners of the instrument are very thin section and easily damaged Care must be taken at all times not to put side loads into these items These are at risk at all times when the FPU is not attached to rigid plate When it is attached to a rigid plate i e the or its transport plate then it is tolerant of loads from vibration lateral expansion thermal tests etc The SPIRE instrument contains very sensitive detectors that are susceptible to damage by Electro static discharge On delivery all connectors will be protected by covers or shorting plugs as appropriate When handling all personnel shall wear anti static protection w
69. Level cold strap interfaces modified Bolt types torques and Belleville types added 7 Beam clearance dimension 0 92 reviewed Note WRT clearance between FPU and Inner Shield Added Cryostat Inner shield updated 5 Stay Out zone around Level 0 straps added ISSUE 16 SHEET MODIFICATION JFET note modified Dimensions over Blade Mounts added Zu axis added Spacecraft co ordinates note added Optical Datum Pin note deleted Mounting referencing hole added fixed mounting Section description note changed 10 mm mechanical clearance zone deleted Shaded optical beams extended Note wrt Beam dimensions added Reference cube angular mounting ad absolute accuracy note added Floating details removed Alignment of HOB wrt Herschel to permit Spire to be aligned Unit axes added Cold Straps detail deleted saved on new drawing 1 5264 300 JFET thermal Interfaces note added External to MSSL note added HSFPU thermal finishes added Note wrt thermal interfaces added Electrical isolation note wrt Cold straps added Mass updated Moments of Inertia added FPU mounting cone interface holes modified Contact area of FPU interface Vespel insulators added Note wrt HOB flatness and tilt to Herschel X Axis added Detail of FPU internal Level 0 straps deleted Now on drawing A1 5264 300A JFET harness Stay Out zones added FPU cone to PACS clearance dimension added
70. TILT OF FROM HERSCHEL X AXIS BE 5 ARC MIN IO ENABLE SPIKE FPU TO BE MACHINED OR SHIMMED INTO ALIGNMENT IF REQUIRED 202 94 213 50 BLADE MOUNT FOOTPRINT 2 PLACES BLADE MOUNT 2 5264 302 1 8 50 RAD CONTACT AREA 151 50 PER INSULATOR M6 0 x 21 0 LONG BOLT TO HAVE PLAIN SHANK 6 0 TO 8 0 LONG ST STEEL A2 18 8 304 TORQUE TO 8 1Nm RUNNING TORQUE SPECIAL WASHER A3 5264 302 3 VESPEL INSULATORS A3 5264 302 2 FIXING COMPONENTS REPEATED 4 POSITIONS IN EACH MOUNT DETAIL OF BLADE MOUNT FIXINGS SCALE 1 1 8 1 25 4 SPIGOT THREAD FIT 2 OFF BELLVILLE WASHERS IN PARALLEL SPEC PT No 0625 047 5 TO GIVE 5 33KN CLAMPING FORCE TORQUE KAYLOCK NUT TO 8 25Nm RUNNING TORQUE 4 OFF INSULATED FIXING PARTS AS ON BLADE MOUNTS DE TALL OF PEXED MOUNTING SCALE 1 1 19 19 02 04 SEE CHANGE SHEET NOTE 18 4 07 03 SEE CHANGE SHEET 7 1 ALL DIMENSIONS TEMPERATURE 17 16 10 02 SEE CHANGE SHEET CHECKED 16 28 08 02 DRAWING UPDATED TO ISSUE 16 THEREON NOTE PROTECTIVE FINISH MATERIAL amp SPE OLERANCES UNLESS DEPARTMENT OF SPACE AND CLIM
71. _ __118 00 gt R 637 00 5 X O 11 PITCHES OF 17 0 SPIRE GROUNDING STRAP FIXING 1 HOLE TAPPED M4 X 8 0 DEEP 30 00 NOTE NO LOCKING INSERT FITTED 559 JFET HARNESS ZONE STAY OUT 165 00 Zu 468 JFET HARNESS ONE Z STAY OUT NOTE Pas VIEW ON UNDERSIDE OF SPIRE 1 ALL DIMENSIONS AT ROOM TEMPERATURE 19 19 02 04 SEE CHANGE SHEET 18 4 07 05 SEE CHANGE SHEET 17 16 10 02 SEE CHANGE SHEET CHECKED PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS DEPARTMENT OF SPACE AND CLIMATE PHYSICS 15 27 04 01 EIXING HOLES MovEn oc MODIFIED LEVEL 1 STRAP SEE CHANGE SHEET FOR DETAILS OF CHANGES OTHERWISE STATED UNIVERSITY COLLEGE LONDON ENTRE MADE FROM ISSUE 16 ONWARDS ALOCROM 1200 AS LISTED 4 TRACED ROLES NM OE SI EEL PARTS LINEAR Z 1 0 MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY PBG UPDATED FILTER amp PHOT CONNECTORS ADDED FOCAL NATURA
72. e FCU e Fixings etc JFET fixation hardware e Isolation washers special screws and studs Thermal strap fixation hardware e 13 Pressure plates 2 off e Screws and isolating bushes 8 2of Aoff these screws will be prepared for wire locking Wire for locking above screws M4 isolating bushes for the vent line end of the strap 16 off Connector savers safe plugs covers etc Savers will be supplied with the PFM for WU only Safe plugs will be supplied fitted to the PFM in the active connectors only Aperture cover red tag item Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 24000 ISSUE 3 3 PAGE 5 46 Alignment cube 5 16 1 4 FS Flight Spare The flight spare cold FPU will be made from the refurbished CQM The flight spare warm electronics will consist of spare electronics cards modules harness 5 16 1 5 Hardware deliverable matrix The SPIRE Hardware deliverable matrix is given by the following tables Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 47 Unit HSFPU AVM Subsystem component Structure baffles wiring none Flight Representative structural components Flight
73. printed on 21 04 2004 09 02 54 w wwwwwwwaw m RITE es T Pin Allocation List Harness Doc No HP 2 ASED 0016 Issue 1 0 Date 21 04 2004 Sheet PAL 3 of 5 Astrium GmbH Ai i ww T e AEN AAAA AI HT 1 Project HERSCHEL eR hl mimo vu wn NIV TAM MAMMA Function UFThr 318 1 SPIRE XS 10 FPU 19 21 23 Location 33 CVV I F CB Top CVVUCR Connector 211121 J34 CVVUCR EMC Category 2C Sig H in Cryostat Conn Type 197 011P24 35P Junct Backshell 128 175 176 01 Grouping Pin Signal Designation Circuit Signal Ch ID Wiring _ Shd Cable Twist Comment Target ltem Location Connector Pin New 023 SPIRE Spectr4 5Heater SCB _ 5245 04080 30 HSFPU 70 121100 P21 034 046 SPIRE Spectr2 Heater 7 4 SCB 246 04080 30 HSFPU 70 121100 P21 016 058 SPIRE Spectr2 Heater 1 SCB 5246 04080 30 70 121100 21 017 045 SPIRE Spectr2 Heater N SCB 246 040B0 30 70 121100 P24 035 057 SPIRE Spectr2 tHeater n 5246 04080 30 HSFPU 70 121100 P21 036 047 SPIRE FPU FSS Faraday 251 010B0 30 Cable P21 Faraday Shd con to HSFPU 70 121100 P21 CH 3 3 Busbar tbc 089 SPIRE FilterTemp N 1 STA 5253 04155 38 19 HSFPU 70 121100 23 020 100
74. 08 10 PSW Heater 6 6 STP 200 1500pF 0 08uH 3 85E 03 9 62 04 10 PMW JFET Bias 8 8 STP 100 1500pF 0 08uH 5 00E 03 1 20E 03 10 PMW Bolometer Bias 4 4 STP 100 1500pF 0 08uH 3 84E 07 9 60E 08 10 PMW Ground 1 0 9 50 1500pF 0 08uUH 0 0 10 PMW JFET Heater 4 4 STP 200 1500pF 0 08uUH 3 85E 03 9 62 04 10 PLW JFET Heater 2 e STP 200 1500pF 0 08 3 85E 03 9 62 04 10 PLW JFET Bias 4 4 STP 100 1500pF 0 08 5 00E 03 1 20E 03 10 PLW Bolometer Bias 4 4 STP 100 1500pF 0 08uH 1 92E 07 4 80E 08 10 PLW Ground 1 0 S 50 1500pF _0 08uH 0 0 10 DCU J30 DDMA 78S DCU P30 78 P PSW JFET Bias 12 12 5 00E 03 1 20E 03 PSW Ground PSW Bolometer Bias PSW Heater PMW JFET Bias PMW Bolometer Bias PMW Ground PMW JFET Heater PLW JFET Heater PLW JFET Bias PLW Bolometer Bias PLW Ground 1 6 6 8 4 1 4 e 4 4 1 e N O Q O O O 0 00E 00 0 0 3 85 03 5 00 03 3 84 07 0 3 85 03 3 85 03 5 00 03 1 92 07 0 0 00 00 0 0 9 62 04 1 20 03 9 60 08 0 9 62 04 9 62 04 1 20 03 4 80 08 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 5 Doc No SCI PT IIDB SPIRE 02124 le Issue Rev No 3 0 Date 15 9 2003 ZL Annex 3 Name 128 Way DRCU DRCU Harness Harness Description Number of Number of implementa Max Impedance Max Current Av Current Max Connector Con
75. 1 10 01 02 Section 4 6 7 first sentence changed by The cooler will be recycled every 48 hours Section 5 1 in last sentence SPIRE to provide TN replaced by see annex 6 of present added Section 5 2 1 Figure 5 2 1 Spire Block Diagram updated to version 5 8 Section 5 3 1 1 Spire specific SVM panel picture is named Figure 5 3 2 Section 5 4 2 Figure 5 4 3 changed and renamed 5 4 2 Section 5 4 3 Figure 5 4 4 changed and renamed 5 4 3 Section 5 4 4 1 Figure 5 4 6 is renamed 5 4 4 Section 5 4 4 2 Figure 5 4 7 is renamed 5 4 5 Section 5 5 table is named Table 5 5 1 SPIRE Units mass amp dimension dimensions values deleted only ref to annex 1 note added Concerning units nominal mass this table takes precedence to any mass value indicated in drawings of Annex 1 Section 5 6 1 2 updated as minutes H P ASP MN 5081 n electrical insulation remove and Kapton on the JFET rack I F The impact of the Kapton tape at the JFET I F belongs to the SPIRE thermal budget figure 5 6 1 replaced by figure in mail from J Delderfield 9 3 04 All text amp figure 5 6 2 below SPIRE level 1 electrical insulation is removed and replaced by SPIRE L1 Electrical insulation is done internal to the FPU See FPU ICD in Annex 1 Section 5 6 3 TBD devices replaced by Tie bases and wrap as defined in IIDA Annex 10 Section
76. 1 0E 05 0 5 Inner shields are joined to OV in the DRCU and are wired through these harnesses on pins although they are often commoned daisy chained TCable Level Shields are joined to FPU JFS JFP backshells are wired through the CVV wall connectors around their outer ring of pins and correspond to the 0 in the implementation cable types Annex 3 Doc No SCI PT IIDB SPIRE 02124 Issue Rev No 3 0 Date 15 9 2003 Annex 3 Page 4 esa Name 128 Way DRCU DRCU Harness Harness Description Number of Number of Implementa Max Impedance Max Currentin Av Current Max Connector Connector Connector Connector Connector Conductors inner tion C pF L uH A per in A per Volts Label Type Label Type excl shlds Shields W Conductor Conductor 11 51 CVV 1 DCU J27 DCMA37 P DCU P27 37S Bolometer sianals from JFS SLW 1 12 24 12 STP 500 1500pF 0 08uUH 1 00E 09 5 00E 10 0 1 SLW Ground 1 0 S 50 1500 0 08uH 0 0 0 1 SLW Ground 0 5 50 1500pF 0 08 0 0 0 1 DCU J31 375 DCU 1 37 2 0 08uH 3 20E 08 8 00E 09 0 PTC Ground wire 0 0 08uH 0 0 PTC JFET Bias 2 0 08uH 5 00E 03 2 00E 04 SLW Bolometer Bias 4 0 08uH 9 60E 08 2 40E 08 SLW JFET Bias 4 0 08uH 2 50E 03 6 00E 04 SLW Ground wire 0 0 08uH 0 0 SSW Bolometer Bias 4 0 08uH 1 20E 03 4 80E 08 SSW JFET Bias 4 0 08uH 5 00E 03 1 20E 03 SSW Ground Wire 0 0 08uH 0 0 PTC JFET Heater 2 0 08uH 1 92E 03 4 81E 04 SL
77. 2 43 0 4 1 k 41 0 0909D 3 CNDFNC 1 TLCU 1 SPIRE 20 x 1 0 x 220 mm SPIRE ECROO9 HERSCHEL L1 strap GL SPIRE 830 541 1 2 43 0 4 1 k 41 0 0909D 3 CNDFNC 1 TLCU 1 SPIRE 20 x 1 0 x 220 mm SPIRE ECROO9 HERSCHEL L1 strap2 The following files includes radiative couplings of SPIRE with HERSCHEL spire gr d Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 7 TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE E ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE SPIRE INTERNAL CONDUCTIVE COUPLINCS T
78. 3 Figure 5 Measurement of adsorption heat on pump vs heat applied on 4 Figure 6 Cooler Recycling Characteristics above and estimated heat flows below 5 Figure 7 Estimated Condensation efficiency 96 He liquefied vs evaporator temperqture 6 Figure 8 Cooler hold time ve evaporator temperature at end of condensation and average total load on uum Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 0 9 DISTRIBUTION LIST Distribution in electronic format Adobe PDF Qy Otrgamisdin 0 Herschel Planck Project Team Herschel SPIRE Univ Cardiff RAL ESA Project Scientist ESTEC Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 0 10 DOCUMENT CHANGE RECORD 2 0 31 07 2001 Issue for SRR Complete Revision Renaming of HERSCHEL by Herschel Changes maked by change bars including editorial changes According to SCI PT MM 11440 2 1 13 02 2001 Unpublished version Includes HP SP RAL ECR 005 06 07 12 14 ECR 9 and 10 not agreed According to agr
79. 44 Channel 10gnd shld 36 1 Channel 11 Channel 11 Channel 11gnd shld Channel 12 Channel 12 Channel 12gnd shld Channel 13 Channel 13 Channel 13gnd shld Channel 14 Channel 14 Channel 14gnd shld Channel 15 Channel 15 Channel 15gnd shld Channel 16 Channel 16 Channel 16gnd shld Channel 17 Channel 17 Channel 17gnd shld Channel 18 Channel 18 Channel 18gnd shld Channel 19 Channel 19 Channel 19gnd shld Channel 20 Channel 20 Channel 20gnd shld Channel 21 Channel 21 Channel 21 gnd shld Channel 22 S6 STP C3 PLWB6 85 12 J J 2 2 S6 STP C4 PLW AS 17 8574 2 S6 STP DI S6 STP D2 PLW B4 8 15 S6 STP D3 19 GS S6 STP D4 PLW B3 17 17 C e S6 STP EI PLW C2 66 18 S6 STP E2 PLW B2 78 19 j 128 lt l 76 _ 1 701024 DQ8 AD 36 _ 88 4 89 2 _ D8 AD 37 __ ee PLW A4 10 2 DQ8 AD 3 10116 S6 STP E3 PLW Bl 56 5 4 S6 STP FI N S6 STP F2 Channel 22 PLW A1 Hii 1232 Channel 22gnd shld 128 A2 19 Channel 23 56 Channel 23 PLWDKI 19 12 4 4 Channel 23gnd shld D8 AD Channel 24 l GENE S6 STP F4 Channel 24 PLWA2 20 2 Channel 24gnd shld _ DQ8 AD 4l G
80. 5 SET Bis m m 5 51 5 16 10 Instrument Characterisation Data 5 5 lell Technical 5 51 6 GROUND SUPPORT EQUIPMENTI 6 1 6 1 MECHANICAL GROUND SUPPORT EQUIPMENT 0 00 0 00 6 1 6 2 ELECTRICAL GROUND SUPPORT hs ases 6 1 pee eu 6 1 OM M 6 1 NC EMEN aromen GING Mandin m 6 2 D j 6 2 7 INTEGRATION TESTING AND 65 7 1 7 1 INTEGRATION EM 7 1 FPEM IOO 7 1 ns 7 Files 7 1 7 1 4 Herschel Planck 20 0 00 00000000000000000000 e 7 1 Su u x 7 1 7 2 1 Testing SPIRE 10000000060000000000000000000000 00 7 1 72 2 PEA T S 7 1 6222 onr Gr des arcane nde ca cee sacs cae Fase vars 7
81. Anti cross talk ground wires 12 NA 500 1000 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 C7 CVV 7 HSJFP J9 MDM 25 P HSJFP P9 MDM 25S signals from PSW 1 12 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08uH 0 0E 00 0 0E 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J10 25 P HSJFP P10 255 signals from PSW 13 24 24 3 DS 12 500 1000 0 08uH 1 0 09 5 0 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J11 25 HSJFP P11 25S Bolometer signals from PSW 25 36 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J12 25 HSJFP P12 255 signals from PSW 37 48 24 3 DS 12 500 1000 0 08uH 1 0 09 5 0 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 C8 8 HSJFP J5 MDM 25 P HSJFP P5 25S signals from PSW 49 60 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J6 25 HSJFP P6 25S
82. C 0 000 assumption 0832 SP L3 IF 10 000 C 0 000 assumption CONDUCTORS TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE SPIRE Interface Definition with HERSCHEL TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE ETE TE TE TEE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE SE Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A2 6 The following conductive links need to be integrated into HERSCHEL with the appropriate node numbers SPIRE HERSCHEL MATERIAL X SECTION LENGTH GL SPIRE 801 378 4 1 1 0 00666 CNDFNC 3 SPIRE K T300 Zsolating Supports GL SPIRE 801 379 1
83. Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 078 SPIRE PMW Ch17 to 19 18 SPB 5 S073 021CC 28 5 HSDCU 17 122300 P20 016 128 SPIRE PMW Ch17 to 19 18gnd SPB 5 S073 021CC 28 5 Daisy ch to Pin 128 A3 HSDCU 17 122300 P20 049 076 SPIRE PMW Ch17 to 19 19 SPB 5 S073 021CC 28 5 PMW E9 HSDCU 17 122300 P20 033 077 PIRE PMW Ch17 to 19 19 SPB 5 S073 021 28 5 HSDCU 17 122300 P20 017 128 BPIRE PMW Ch17 to 19 19gnd SPB 5 S073 021 28 5 Daisy ch to Pin 128 A3 HSDCU 17 122300 P20 050 P20 Cable Faradayshd These two corrections are as Cable P20 Faraday Shd con to Busbar SPIRE HDD 1 2 P20 Insulating Jacket Cable P20 Insulating Jacket tbd P20 Cable Overall Shd Cable P20 Overall Shd not forseen may be added later 088 SPIRE PMW Ch 20 20 SPB 3 S73A 021CC 28 5 PMW G9 HSDCU 17 122300 P21 001 089 SPIRE PMW Ch 20 20 SPB 3 S73A 021 28 5 HSDCU 17 122300 P21 018 128 SPIRE PMW Ch 20 20gnd SPB 3 S73A 021CC 28 5 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 034 099 SPIRE PMW Ch21 to 24 21 SPB S S074 021CC 28 6 PMW D9 HSDCU 17 122300 P21 002 100 SPIRE PMW Ch21 to 24 21 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 019 128 SPIRE PMW Ch21 to 24 21gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 035 110 SPIRE PMW Ch21 to 24 22 SPB S S074 021CC 28 6 PMW F9 HSDCU 17 122300 P21 003 111 SPIRE PMW 21 to 24 22 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 020 128 SPIRE PMW Ch21 to 2
84. Contractor Each IID B is the result of a specific instrument s design activity In its interface section chapter 5 are defined the requirements of the instrument and the resources to be provided by the spacecraft In its performance section last section of chapter 4 it defines the scientific performance requirements of the instrument as part of the scientific mission requirements and as agreed between the Principal Investigators and ESA After issue 2 0 by ESA the Contractor will be responsible for maintenance and configuration control of the IIDs in agreement with and after approval by the Instruments Principal Investigators and ESA In case of conflict between the contents of the IID A and the IID Bs the agreement or definition in the IID B shall take precedence The 1105 will not cover any of the interfaces of the Instrument Control Centres ICCs for Herschel the Data Processing Centres DPCs for Planck or the Herschel Science Centre HSC Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 3 SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE ISSUE 2 9 2 APPLICABLE REFERENCE DOCUMENTS 2 1 APPLICABLE DOCUMENTS All Applicable Documents hereafter are available with on ASP ftp site DATE 21 06 2004 PAGE 2 1 ftp ftp hp instruments as b2b com industry to instruments IIDs IID A Applicable and Reference documents AD Herschel P
85. Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 116 SPIRE PW Ch 13 to 16 16 SPB S072 12AXD 38 4 D PMW E8 HSJFP 75 121210 23 004 117 SPIRE PMW Ch 13 to 16 16 SPB S072 12AXD 38 4 D HSJFP 75 121210 23 017 128 SPIRE PMW Ch 13 to 16 16gnd SPB 5072 12AXD 38 4 D Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 128 SPIRE PMW Ch 13 to 16 SHD01 SPB 5072 12AXD 38 4 D Cable S072 inner Shd daisy ch HSJFP 75 121210 P23 013 to Pin 128 A2 Cable 5072 12 Outer Shield Cable S072 outer Shd to Busbar Faraday No worries compliant with SPIRE HDD 1 2 055 SPIRE PMW Ch17 to 19 17 S SPB S073 12AXD 38 5 E PMW G8 HSJFP 75 121210 23 005 ICON SPIRE PMW Ch17 to 19 17 SPB S073 12AXD 38 5 E HSJFP 75 121210 23 018 SPIRE PMW Ch17 to 19 17gnd SPB S073 12AXD 38 5 E Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 06 SPIRE PMW Ch17 to 19 18 SPB S073 12AXD 38 5 PMW F8 HSJFP 75 121210 23 006 078 SPIRE PMW 17 to 19 18 SPB S073 12AXD 38 5 E HSJFP 75 121210 P23 019 128 SPIRE PMW Ch17 to 19 18gnd SPB S073 12AXD 38 5 E Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 076 SPIRE PMW Ch17 to 19 19 SPB 5073 12AXD 38 5 PMW E9 HSJFP 75 121210 23 020 077 SPIRE PMW Ch17 to 19 19 SPB 5073 12AXD 38 5 HSJFP 75 121210 23 007 128 SPIRE PMW Ch17 to 19 19gnd SPB S073 12AXD 38 5 E Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 088 SPIRE PMW Ch 20 20 SPB S73A 12AXD 38 5 E PMW
86. E Sawyer input 04 06 04 Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE Annex 1 Annex 2 Annex 3 Annex 4 Annex 5 J Annex 6 june 04 REFERENCE SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 32 PAGE 0 14 New front page configuration and comments and new ICD pack 11 CR 68v1 included New SPIRE RTMM v2 5 included with new diagram on front page no changes Some typos are corrected and uW new issue 4 dated 08 07 04 of document HDD 1 1 Deltas SPIRE RAL NOT 001819 new annex with document Making SPIRE ESD Safe SPIRE RAL NOT 002028 draft 02 18 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 2 9 PAGE 1 1 1 INTRODUCTION The purpose of the Instrument Interface Documents IIDs is to define and control the overall interface between each of the Herschel Planck scientific instruments and the Herschel Planck spacecraft The IIDs consist of two parts and IID B There is one part covering the interfaces to all Herschel and Planck instruments and one per instrument IID A describes the implementation of the instrument requirements in the design of the spacecraft and will be a result of the spacecraft design activities performed by the
87. E Sawyer input 85 15 11 06 04 Section 5 15 2 1 reduced new section E Sawyer input 85 15 11 06 04 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 0 13 Section 5 15 2 2 TBW replaced RD 23 E Sawyer input 85 15 11 06 04 Section 5 15 3 1 reduced new section E Sawyer input 55 15 11 06 04 Section 5 15 3 2 are given in document TBW is replaced by will be supplied with the instrument EIDP E Sawyer input 85 15 11 06 04 Section 5 16 Notes 1 2 deleted Section 5 16 1 full new section with new sub sections 5 16 1 1 to 5 16 1 4 and new 5 16 1 5 Hardware matrix with tables 5 16 1 to 5 16 7 E Sawyer input 04 06 04 note and as Comments on IID B 3 3 draft1 E Sawyer 13 7 04 Section 5 16 2 partially new section E Sawyer input 04 06 04 Section 5 16 3 partially new section E Sawyer input 04 06 04 Section 5 16 4 full new section E Sawyer input 04 06 04 Section 5 16 6 full reduced new section E Sawyer input 04 06 04 Section 5 16 7 full reduced new section E Sawyer input 04 06 04 Section 5 16 8 full reduced new section E Sawyer input 04 06 04 Section 5 16 9 is removed E Sawyer input 04 06 04 Section 5 16 10 is removed E Sawyer input 04 06 04 Section 5 16 11 ar
88. FPU Chassis to Optical Bench One MDM51P safeing plug SPIRE Type IV protecting Photometer BDAs One MDM51P plug SPIRE Type IV protecting Spectrometer BDAs Exposed un terminated MDM51 connectors stowed inside Lumalloy bags Making SPIRE ESD Safe Draft 0 2 for comment Page 9 9 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Instrument Location State of Instrument ESD Protection Details Configuration Config 5 Covers ON BDA JFETs harnesses connected JFET backharnesses pre installed on JFETs SPIRE Type lll JFET Modules mounted on racks HOB HOB Simulator Red Tag grounding strap connecting FPU Chassis to Optical Bench Four 375 safeing plugs SPIRE Type V on Photometer Bias connectors JFP J25 J26 J27 J28 Two 375 safeing plugs SPIRE Type V on Spectrometer Bias connectors JFS J09 and J10 Lumalloy bag covering exposed MDM25P connectors Comments This is the configuration used for transport of the cold plane units Making SPIRE ESD Safe Draft 0 2 for comment Page 10 10 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Instrument Location State of Instrument ESD Protection Details Configuration Config 6 Covers ON BDA JFETs harnesses connected JFET backharnesses pre installed on JFETs e Internal SIH installed i e Cryoharness Cryostat closed and therefore no further access to focal plane untis possible not connecting WE to cold plane uni
89. FPU P21 FA MDM37P Spect Stim Prime E gt FPU P23 MDM 37 P Thermometry Prime SPIRE C10 7 Connector Backshell Details Prime side harness MDM 37 Glenair507 T 139 M 37 to FPUJ19 Cooler P MDM 37 P Glenair507 T 139 M 37 FPUJ21 FA Spect Stim P 37 Glenair507 T 139 M 37 to FPUJ23 Them P Harness Layu Layup 63h eve 5 SHD Cooler Tail 19 P iius bor 2 2 i a physical Q 20 Sorption Cooler 9r 142 d d cip ai UH j I N Sorption Pump FPU P1 9 P20 p ar 2 a 6 5 Insulated STOs 3 GH Evaporator Se 3 insulated TQs w EB IARE x cy 1 See Section 4 4 for details regarding the peer Sorption Pump Heat implementation of the shields Switch P gt x Le 49 The dotted lines indicate insulation jacket vw Bm covering the overshield Only required at Pu eS Evaporator clamp points but could cover entire length S gt OL Heat Sw 5 of harness de LM RD Can Harness connector is a Plug Drawin Shunt 9 9 ae indicates pin allocation as seen from the Eye TE 0 n rear non engaging face of the
90. FROM THE TOP OF PARTS SHOWN AS i PLANE TO THE TAIL END FACE OF PARTS 2 NOTING THE SIX VALUES TOLERANCES UNLESS STATED FINISH ORIGINAL SCALE 126 45 MACHINE RAISED PADS ON PART 3 TO REMOVE VALUE 87 7 PADS ON ITEM 4 WILL ALSO CLEAN TYP 12 NEED MACHINING IF TRIAL ASSEMBLY OF RACK ON FLAT SURFACE SHOWS GAPS BEFORE REMOVE ALL BURRS DO NOT SCALE s FASTENERS ARE TIGHTENED MATERIAL amp SPEC SURFACE TEXTURE jM T 3 ITEMS 22 AND 8 TO BE TORQUED TO 2 1 Nm ABOVE LOCKING INSERT RUNNING TORQUE SPIRE SEE DETAILS n MASTER DRAWING ERE D 4 UNIT SHOWN FITTED WITH BACK HARNESS MATING J25 28 amp 41 52 BECAUSE THIS PROJECT MEMBER APPROVED USED ON CLRC 2004 WILL BE FITTED BEFORE ITEM IS INTEGRATED PROJECT MANAGER CENTRAL LABORATORY OF THE RESEARCH COUNCILS 5 HEAT CAPACITY AT 2100 JOULES KELVIN SYSTEM ENG o ELECTRONICS ENG o 6 FITTED BACKHARNESS TO AFFORD OPEN ACCESS TO 51 WAYS AS SHOWN PA GROUP o JFET RACK 6 EQUISPACED AT 40 5 202 5 TOTAL 1 AFFIX ONE SENSOR WITH LONG BOLTS AND THEN THE OTHER STRESS ENG INTERFACE DRAWING ON THE REVERSE WITH NUTS OPTICAL ENG gt THERMAL ENG 8 ONLY 3mm JACSCREW LENGTH GUARANTEED BELOW MOUNTING PLANE MECHANICAL ENG O0O KE 0104 350 H 009 1551 5510 0 THIRD ANGLE PROJECT ION DO SCA
91. G9 HSJFP 75 121210 23 021 089 SPIRE PMW Ch 20 20 SPB S73A 12AXD 38 5 E HSJFP 75 121210 23 008 128 SPIRE PMW Ch 20 20gnd SPB S73A 12AXD 38 5 E Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 128 SPIRE PMW Ch17 to 19 SHD02 SPB S073 12AXD 38 5 E Cable S073 inner Shd daisy ch HSJFP 75 121210 P23 013 to Pin 128 A2 Cable S073 12 Outer Shield Cable S063 outer Shd con to Busbar Faraday 099 SPIRE PMW Ch21 to 24 21 SPB S074 12AXD 38 6 F PMW D9 HSJFP 75 121210 23 022 100 SPIRE PMW Ch21 to 24 21 SPB S074 12AXD 38 6 F HSJFP 75 121210 P23 009 128 SPIRE PMW Ch21 to 24 21gnd SPB S074 12AXD 38 6 F Daisy ch to Pin 128 A2 HSJFP 75 121210 23 013 110 SPIRE PMW Ch21 to 24 22 SPB S074 12AXD 38 6 F PMW F9 HSJFP 75 121210 23 023 Filter 5 LIKE 211121 And SConl LIKE 22 And ConWired 1 printed on 18 09 2003 10 14 17 Astrium GmbH Pin Allocation List Doc No HP 2 ASED IC 0001 Issue 2 6 Date 20 09 2003 Project Harness HERSCHEL Sheet PAL 2 of 8 Connector 312300 4 Function SPIRE SVM CB3 SPIRE Bundle 11 MS27484T24F 35S Pl Shl Item HSSVMCB3 Location 27 CB ab SVM Panel 7 SPI CCU CB Backshell 390 FS 007 M24 05 EMC Category 25 519 H fr SVMCB to W Units Interface Code Grouping Pin Signal Designation Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connec
92. I GO 106 lt 84 eS 61 2 38 16 59 23 SMEC position sensor photodiode 3 2 KCN x Z JE N r 194 59 GQ 23 NC 122 lt gt 96 gt 73 50 lt 27 A 1 X 24 NC 7 KA KA LA x A N Jiggle Position 4 25 107 QS 85 62 39 17 N Jiggle Position Sensor shld2 29 lt RK lt x Chop Position Sensor shld2 OQ 2 Chop Position Sensor3 28 123 16 lt 2 97 74 d 51 bos 28 TUM m position sensor photodiode Shield 29 59 5 9 6 2 48 72 gt SMEC position sensor photodiode Shield e lt 108 z 86 63 A A Z SMEC position sensor photodiode Shield lt gt lt gt X 32 124 117 98 X 2 10 3 SMEC pos sensor photodiode 2 feedback 33 EN 75 u 52 40 29 SMEC pos sensor photodiode 2 feedback 34 59 lt o 2 QD 35 lt gt 22 109 eO 87 64 29 41 KA 19 A 22 36 NC 2 gt I gt Jiggle Position Sensor5 37 118 P 99 x 76 30 Q 11 Jiggle Position Sensor m 35 EN 22 4 E p op Position Sensor s 09 C9 2 5 2 5 gt lt 2 gt lt 460 di d 10 lt gt 55 54 2 4 KCN KA gt SMEC position sensor photodiode 2 1 42 ne C9 O gt 2 126 lt lt 54 12 5 SMEC pos sensor photodiode feedback Shld 4
93. K 1 2 10 0 2DO 100 000 0 300 100 000 1 000 400 000 4 000 1500 000 10 000 3600 000 20 000 4400 000 50 000 1300 000 100 000 550 000 200 000 420 000 300 000 420 000 Helium 3 He3 2 24 0 3D0 0 003D0 1 000 0 007500 2 0D0 0 011700 3 0D0 0 012800 Reproduction interdite ALCATEL SPACE REFERENCE SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 PAGE 2 21 Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 4 000 0 013500 5 000 0 01613218800 10 000 0 02280149100 15 000 0 02833164700 20 000 0 03327247400 25 000 0 03782352800 30 000 0 042087113D0 35 000 0 046125065D0 40 000 0 04997860400 45 000 0 05367705700 50 000 0 057242285D0 55 000 0 06069116800 60 000 0 06403710100 65 000 0 06729095100 70 000 0 07046169600 75 000 0 07355686400 80 000 0 07658285400 100 000 0 08809475400 200 000 0 13667046100 300 000 0 17690847600 K KAPT 2 9 0 3000 0 0003700 1 000 0 0011000 4 000 0 004700 10 000 0 01500 20 000 0 03100 50 000 0 06400 100 000 0 10000 200 000 0 15000 300 000 0 17000 KEVLAR 29 THREAD KEV29 2 40 Reproduction interdite ALCATEL SPACE REFERENCE 5 02124 DATE 21 06 2004 ISSUE 3 3 Company confidential PAGE 2 22 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 0 10
94. O9 110 88 65 Za oS 20 09 i PTC JFETV Bias_A ve 36 NC 126 119 100 54 4 31 x pr 38 445 09 43 n lt CS e p gt lt gt ims 127 120 5 101 S Zm 99 99 0 13 N 2 aoa 29 112 0 9 er 29 22 25 JFETV Bias A Shield i8 lt N E met e 79 oS 88 eS 33 22 7 N 113 91 68 2 23 y 50 yp 52 51 NC lt 108 N 80 E 34 ga pe 2 JA 114 AUN fp 24 SSW JFETV1 A ve 35 N 2 9 m 2 L B I KON E 62 NC 99 63 NC 70 64 NC 65 NC 66 NC 67 NC SSW 68 SSW BIAS2 A ve 69 SSW JFETV2 A ve 70 71 NC 72 NC 73 NC 74 75 NC 76 77 78 SSW BIAS1 79 SSW BIAS2 80 SSW JFETV2 A ve 81 82 83 NC 84 NC 85 NC 86 NC 87 NC 88 89 SSW_BIAS1_A ve 90 SLW JFETV A1 ve 91 SLW JFETV ve 92 SSW GND WIRE A 93 94 NC 95 NC 96 97 NC 98 NC 99 NC 100 SLW A2 ve 101 SLW BIAS A2 102 SLW A2 ve 103 SLW GND WIRE A 104 105 106 107 108 109 110
95. PERMIT ITEMS 13 TO BE TORQUED TO 2 1 Nm WITH STUD SET TO DEPTH SHOWN IN HOB LOCKING INSERT VIEW OF BUSHES UNIT SHOWN FITTED WITH BACK HARNESS MATING TO J9 JIO amp JI5 JI8 BECAUSE THIS um ge ae WILL BE FITTED BEFORE ITEM 15 INTEGRATED TO 10 Mar 04 2852 D SMART ise 02 TOLERANCES UNLESS STATED FINISH ORIGINAL SCALE FITTED BACKHARNESS TO AFFORD OPEN ACCESS TO 51 WAYS AS SHOWN CLEAN REMOVE ALL BURRS DO NOT SCALE AFFIX ONE SENSOR WITH LONG BOLTS AND THEN THE OTHER MATERIAL amp SPEC SURFACE TEXTURE pM ON THE REVERSE WITH NUTS SPIRE SEE DETAILS SEE DETAILS 0 50mm V UNLESS STATED ITEMS 6 AND 11 TO BE PRE FITTED BEFORE MASTER DRAWING ITEM 2 1S FITTED PROJECT MEMBER APPROVED USED ON OCLRC 2004 ONLY 3mm JACKSCREW LENGTH GUARANTEED BELOW CENTRAL LABORATORY OF THE RESEARCH COUNCILS THE MATING PLANE SYSTEM ENG 0 4 NSULATED SURFACE OVER SHADED AREA 23 5 ELECTRONICS ENG 2 JFET RACK 177 0 005 pA ROU 56 STRESS ENG INTERFACE DRAWING OPTICAL ENG 22 I co co I c lt I Lu NT I MECHANICAL 0 0104 360 009 1551 5510 0 SSTD Space Product Assurance Form DocNo 1509 006 SSTD Space Product Assurance Form Doc No 150
96. PSW 2 4 PSW JFETVI A shld IAD 36 AD LE 7398 Jj PSW JFETV2 A 2 722 PSW JFETV2 2 24 EE 3 PSW JFETV2 Ashid 2 360 103 1411 y PSWJFETV3 A 1005 j C 1 146 PSW JFETV3 A shld 4 A1 36 A1 PSW_JFETV4 A 6 j 1411 9 2 PSW A 258 1414 PSW JFETV4 Ashid 24 AD 144 360 PSW 2 Z j JPAn 80 PSW 5 8 PSW JEETVS 1141 36 A PSWJFETV6 A 9 1164 PSW_JFETV6 A 28 144 PSW JFETV6 Ashid 1 27 AD 360 PSWGRNDA 1 oad 141 36 A y 5 7 PSW BIASI2 Ashid 30 AD j 1141 360 _ PSW BIAS34 A 30 J J y O 44 1 PSW 5 4 Ashid BAD 141 3640 _ 1 PSW_BIAS5 6_A 8 PSW_BIASS 6_Ashid 33 AD 111 360 _ PSW HEATER Al 34 C j J0 l JJ J 95 PSW HEATER Al PSW HEATER Alshid 15080 PSW HEATER 2 107 1 10 5741 PSW HEATER A2shid 109 PSW HEATER A3 C 1061 x PSW HEATER 36 BD OBD PMWJFETVLA C 2 J 8 PMW JFETVI CEC A 6442 y PMW JFETV2 A FE 3 j S 97 PMW JFETV2 A 232 j L0 98 y PMW Ashid 21 2 141 642 y PMWJFETV2 A 233 J JA 108 PMWJFETV3 A 5011 j 19 PMW JFETV3 2 4 2 A A CE
97. Project WERSCHEL Pin Allocation List Harness Doc No HP 2 ASED IC 0001 Date 20 09 2003 Sheet PAL 5 of 10 Issue 2 6 211121 J32 CVVUCR Connector Item EMC Category 2C Sig H in Cryostat Function UFThr 305 77 SPIRE XS 01 JFS 5 6 9 10 Location 33 CVV CB Top PFM CVVUCR Conn Type 197 011P24 35P Junct Backshell HERSKT 58 0050 Interface Code Grouping Pin Signal Designation Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 104 SPIRE SLW Bias SHD03 SSD S025 022BS 38 25 Cable S025 inner Shd daisy ch HSJFS 76 121220 P09 006 to Pin 104 at CVV side B3 Cable S025 outer Shield Cable 5025 outer Shd con to Busbar Faraday 102 SPIRE SLW Bias 2 ve SSD 5026 022 5 38 26 HSJFS 76 121220 P09 005 101 SPIRE SLW Bias A2 ve SSD 5026 022 5 38 26 HSJFS 76 121220 P09 024 104 SPIRE SLW Bias 2 SHD04 SSD S026 022BS 38 26 Cable S026 inner Shd daisy ch HSJFS 76 121220 P09 023 to Pin 104 at CVV side B3 Cable S026 outer Shield Cable 5026 outer Shd con to Busbar Faraday 104 SPIRE SLW GND WIRE 55 5405 010 0 38 SLW GND Wire B3 con to HSJFS 76 121220 P09 006 cable 25 26 11 12 Shd 092 SPIRE SLW SSF 5011 022BS 38 11 HSJFS 091 SPIRE SLW JFETV A1 SSF S011 022BS 38 11 HsJrs This is compliant with SPIRE 104 SPIRE SLW JFETV
98. S will be transported in the same container as the FPU 5 15 22 Unpacking Procedure The procedure for removing and installing the HSFTP S from its transport container is given in document RD 23 5 15 3 Electronics Units Transport Container The Spire warm electronics units HSDPU HSFCU HSDCU HSWIH will be transported in a purpose built container that provides environmental protection Containers to be opened only in class 100 000 clean conditions The transport containers are fitted with shock recorders 5 15 3 2 Unpacking Procedure The procedures for removing and installing the Spire from warm electronics units their transport containers will be supplied with the instrument EIDP Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 43 5 16 DELIVERABLE ITEMS 5 16 1 Instrument Models The following model philosophy will to be adopted for the AIV of the Herschel Spire instrument Only deliverable models are identified here models internal to the SPIRE programme are not described Full details of the build standard of all models can be found in RD6 5 16 1 1 AVM The Avionics Model This is an electrical model of the SPIRE instrument and will allow the electrical and software interfaces between the SPIRE instrument and the spacecraft to be validated This wil
99. SOB mean Temperature 803 800 0 425 0 107 803 830 0 425 0 107 CONSTANTS CHARACTER GPLTO O initialize switch for phase to be run global constant For integratin within Herschel indicates the phase to be run initialisation only is read from control file control ctl Ground life time Ground Testing steady state venting from HOT HTT closed Z P Precooling ground autonomy launch autonomy Launch Transfer O Orbit Reproduction interdite ALCATEL SPACE Company confidential REFERENCE INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE ISSUE MODE SWITCH OFF HS EVAP STATE HS PUMP STATE OFF SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 PAGE 2 12 IMODE 0 initialize switch for dissipation mode global constant For integration within Herschel IMODE is read from control file control ctl 2 1 no dissipation 0 Orbit average steady state Orbit Mode 1 steady state 2 Orbit Mode 2 steady state 3 Orbit Mode 3 steady state 4 Orbit Mode 4 steady state 5 Orbit Mode 5 steady state 6 Orbit Mode steady state PACS Spec PACS Phot SPIRE Phot SPIRE Spec HIFI On me lt lt lt lt MM PACS Phot amp SPIRE Phot SPSUBMD 0 kw initialize switch for dissipation sub mode for SPIRE timeline REAL To Be Selected by the user before pre processing
100. Spire Digital Processing Unit More detailed drawings can be found in Annex 1 Figure 5 4 4 Isometric view of the DPU Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT r ATE 06 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 5 9 5 4 4 2 HSDCU The figure here after shows an isometric view of the Spire Detector Control Unit More detailed drawings can be found in Annex 1 Figure 5 4 5 HSDCU external configuration Reproduction interdite ALCATEL SPACE Company confidential SCI PT IIDB SPIRE 02124 REFERENCE INTERFACE INSTRUMENT DOCUMENT PAGE 5 10 21 06 2004 3 3 DATE ISSUE PART B SPIRE IID B SPIRE HSFCU 5 4 4 3 The figure here after shows isometric view of the Spire FPU Control Unit Figure 5 4 6 HSFCU external configuration ALCATEL SPACE Company confidential Reproduction interdite REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 11 5 5 SIZES AND MASS PROPERTIES Project Dimenions mm including feet Nominal Allocated Code Mass without Mass kg margins kg HS Focal Plane Non rectangular See Annex 1 44 81 47 2 Unit HS JFET Rack See Annex 1 2 51 2 8 Photometer HS JFET Rack See Annex 1 0 89 1 0
101. T809 0 048D0 D810 SP_DETECTOR ENCLOSURE T 1 800 C SHCAL T810 1 468D0 SHCSS T810 0 076 SHCINV T810 0 128D0 SHCSI T810 0 032D0 0811 10 Enclosure Flexible Strap T 1 800 C SHCCU T811 164 D 3 0812 LO Pump Flexible Strap 1 800 C SHCCU T812 159 D 3 0813 LO Evap Flexible Strap 1 800 C SHCCU T813 152 D 3 0814 10 Enclosure External Strap 1 800 C SHCCU T814 462 D 3 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 2 5 0815 LO Pump External Strap 1 800 C SHCCU T815 516 D 3 0816 LO Evaporator External Strap 1 800 C SHCCU T816 701 D 3 D817 COOLER PUMP T 128003 C 0 150D0 SHCTI T817 SHCHAR T817 0 00081D0 3000 0D0 D818 COOLER SHUNT T 1 800 C SHCTI T818 0 01D0 B819 COOLER T 0 2900 SHCTI T819 0 084D0 D820 COOLER 5 T 1 800 SHCTI T820 0 074D0 0821 COOLER PUMP_HS T 1 800 SHCTI T821 0 074D0 300 mK Level D822 DETECTORS T 0 3D0 C SHCINV T822 0 435D0 SHCCU T822 0 709D0 0823 SP DETECTORS T 0 300 SHCINV T823 0 281D0 SHCCU T823 0 254D0 New L1 and interface nodes D830 11 Strap IF2 5 5 000 C 0 000 assumption 0831 L3 IF 10 000
102. TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE SUBROUTINES DOUBLE PRECISION FUNCTION SHCAL X DOUBLE PRECISION X SHCAL INTRP1 5 11 1 RETURN END DOUBLE PRECISION FUNCTION SHCHAR X Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DOUBLE PRECISION X SHCHAR X SHCHARI 1 RETURN END DOUBLE PRECISION FUNCTION SHCCU X DOUBLE PRECISION X SHCCU X SHCCUT 1 RETURN END DOUBLE PRECISION FUNCTION SHCINV X DOUBLE PRECISION X SHCINV INTRP1 X SHCIN1 1 RETURN END DOUBLE PRECISION FUNCTION SHCSI X DOUBLE PRECISION X SHCSI X SHCSI1 1 RETURN END DOUBLE PRECISION FUNCTION SHCTI X DOUBLE PRECISION X SHCTI X SHCTI1 1 RETURN END DOUBLE PRECISION FUNCTION SHCSS X DOUBLE PRECISION X SHCSS X SHCSS1 1 RETURN END SUBROUTINE SSOPMD ISWITCH LANG MORTRAN Reproduction interdite ALCATEL SPACE REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 Company confidential PAGE 2 31 REFERENCE INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE ISSUE INTEGER ISWITCH SELECT CASE ISWITCH CASE 1 PACS Off SPIRE and HIFI off MODE SWITCH OFF QI801 0 0 Photometer JFET 91802 0 0 Spectrometer JFET QI805 0 0 BSM QI806
103. be addressed by working groups set up as and when necessary These may cover Follow up on Herschel Common Science System data archive activities common approach to IA QLA systems Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 7 1 7 INTEGRATION TESTING AND OPERATIONS Information in this chapter covers all instrument related activities after the acceptance of SPIRE by ESA and its handover to the Contractor 7 1 Integration Procedures detailing the individual integration steps will be prepared and reviewed in due time 7 1 1 HPLM Integration Integration of the SPIRE FPU onto the HPLM is described in RD23 7 1 2 PPLM Integration NA 7 1 3 SVM Integration The SVM warm units shall be first integrated as panels and the SPIRE units linked by warm Spire warm harness See RD 28 7 1 4 Herschel Planck Integration Precautions listed in RD23 to be taken into account during all activities 7 2 Testing After completion of the integration be it at the level of the FPLM PPLM SVM or Herschel Planck a series of veritication tests will be carried out Each test will be defined in detail in a test procedure to be written by the Contractor based on instrument group inputs It will be reviewed and approved by the Herschel Planck project group 7 2 1 EQM Testing SPIRE CQM
104. box feet w r t its internal optics will have been established at instrument level to a defined tolerance before delivery to ESA The mechanical process of mounting Spire on the HOB so that it is aligned to the Herschel telescope when both are at operating temperature is worked through in AD7 This defines an error budget for how well the alignment has to be achieved as well as how stable it then has to remain Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 5 6 5 4 EXTERNAL CONFIGURATION DRAWINGS These are included for readability only The fully configured detailed interface drawings are provided in Annex 1 5 4 1 HSFPU An overview of the HSFPU is provided below in Figure 5 4 1 More detailed drawings of the SPIRE focal plane and JFET units showing their relationship to the Herschel focal plane the cryostat radiation shield and the diameter of the HOB can be found in Annex 1 NOTE OPTICAL REFERENCE CUBE 31 0 x 31 0 x 31 0 REMOVE AFTER FINAL ALIGNMENT CHECK ON S C 1 ALL DIMENSIONS AT ROOM TEMPERATURE 2 J FET BOXES NOT SHOWN ON THIS SHEET 5 LEVEL 41 STRAP SPIRE OPTICAL BENCH ATTACHMENT POINTS SEE SHEET 5 150 VIEW SCALE 145 SPIRE GROUNDING STRAP ATTACHES HERE SEE SHEET 6 RF FILTERS SEE SHEET 6 FOR DETAILS OF CONNECTOR POSITIONS NOTE LEVE
105. confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 19 5 7 5 3 Satellite Temperature sensors In addition to the Spire conditioned temperature channels Spire requires that Herschel itself shall monitor the temperatures of certain locations on the cryostat and SVM These are given in the table below Meesurement EGSE Measurement Position Type 1 Name 1 Accuracy Accuracy e L3 on Ventline to JFET Phot TM 3 0K 20 0K OK 20 0K 0K 200K OK 20 0K 01K L3 on Ventline to JFET Spec 3 0K 20 0K 3 0K 20 0K L1 on L1 Strap 4 on SPIRE FPU side SPIRE FPU L1 Strap 4 on SPIRE FPU side coo m8 20K 100K 10 0K 00K 20K 100K OK Spire JFET Spec E ns cce pee T250 3 0K 20 0K 0 1K 3 0K 20 0K 0 1K Pos on Structure or L3 strap On Spire JFET Phot PT1000 1251 13K 370K 1K Pos on Structure or L3 strap 1252 3 0K 20 0K 0 1 3 0K 20 0K 0 1 Pos Structure L3 strap OB Plate near SPIRE foot center PT1000 13K 370K Ee mor ns Table 5 7 5 2 SPIRE Satellite Temperature Sensors 1 Type and name for information only Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 021
106. is 1 0 arcsecond Requirement SRD R 16 The spectrometer design shall be optimised for optimum sensitivity to point sources but shall have an imaging capability with the largest possible field of view that can be accommodated Requirement SRD R 17 The sensitivity of the FTS at any spectral resolution up to the goal value shall be limited by the photon noise from the Herschel telescope within the chosen passband Requirement SRD R 18 The spectrometer dynamic range for astronomical signals shall be 12 bits or higher Requirement SRD R 19 The FTS absolute accuracy shall be 1596 or better at all wavelengths with a goal of 1096 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 9 Requirement SRD R 20 The FTS shall be capable of making spectrophotometric measurements with a resolution of 2 with a goal of 4 Requirement SRD R 21 The width of the FTS instrument response function shall be uniform to within 10 across the field of view Requirement SRD R 22 The maximum spectral resolution of the FTS shall be at least 0 4 with a goal of 0 04 Requirement SRD R 23 The SPIRE photometer shall have an observing mode capable of implementing a 64 point jiggle map to produce a fully sampled image of a 4 x 4 arcminute region Requirement SRD R 24 The photometer ob
107. is largely unexplored The thermal emission from many astrophysical sources peaks in this part of the spectrum including comets planets star forming molecular cloud cores and starburst galaxies The short submillimetre region is also rich in atomic and molecular transitions which can be used to probe the chemistry and physical conditions in these sources Wavelengths between 200 and 350 jum are not observable from the ground and have not be observed ISO Between 350 um and 700 um some low transparency submillimetre windows allow some observations to be made with difficulty from the ground but with far lower sensitivity than can be achieved from space One of the most important scientific projects for the Herschel mission is to investigate the statistics and physics of galaxy formation at high redshift This requires the ability to carry out deep photometric imaging at far infrared and submillimetre wavelengths to discover objects and the ability to follow up the survey observations with spectroscopy of selected sources The Herschel SPIRE instrument is essential for this programme and is being designed so as to be optimised for these extragalactic imaging and spectral surveys Another key scientific project for SPIRE is a sensitive unbiased search for proto stellar objects within our own galaxy This will also be followed up by spectral observations using SPIRE other Herschel instruments and ground based facilities Reproduction interdite
108. lll used to protect drain and sources of JFETs Comments The outputs of the JFETs are left open JAA JBB JAA and a discharge to these could damage the devices Making SPIRE ESD Safe Draft 0 2 for comment Page 7 7 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Instrument Location State of Instrument ESD Protection Details Configuration Config 3 During integration Covers off JFETs not connected BDA Harnesses not connected Detector Box Subsystems HOB HOB Simulator Red Tag grounding strap connecting the Photometer Detector Box to FPU Chassis Red Tag grounding strap connecting the Spectrometer Detector Box to FPU Chassis Red Tag grounding strap connecting FPU Chassis to Optical Bench Lumalloy film covering exposed BDA connectors No safeing plugs on the subsystem connectors Comments e Adischarge to the BDA connector pins could damage the detectors and or the bias resistors The subsystem are left unprotected except for the protection afforded by the Cristek filters Making SPIRE ESD Safe Draft 0 2 for comment Page 8 8 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Configuration Config 4 During integration Covers off JFETs not connected BDA Harnesses connected SPIRE Type IV HOB HOB Simulator Red Tag grounding strap connecting the Photometer Detector Box to FPU Chassis Red Tag grounding strap connecting the Spectrometer Detector Box to FPU Chassis Red Tag grounding strap connecting
109. of SPIRE Stora and send SPIRE data folded commands in with packets from other sources HCDMU send single DPU commands at HCDMU th 1 ta n eir tagged time Relay SPIRE data time sync every second Observation Sequences 4555 Bus Packet Transfers Commands Settings etc 1553 Decode Pairs included in DRCU reset times S C time value housekeeping data housekeeping data sync pulse each sec Data pair of S time and 1 sec pulse jitter errors compared to 108 cycles Spire DPU command to reset DRCL clocks Counter value Decode attached to data as label MCU decides DGU to timetag Counter an ewent Counter Spire Spire Figure 5 11 1 SPIRE Data Timings Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 36 5 11 4 Telecommand It is assumed that the observation schedule for each 24 hour period will be uplinked during the data transfer and commanding phase It is further assumed that the correct receipt of all Spire commands is verified by the S C during the DTCP Reference HP SPIRE REQ 0210 The maximum rate of sending command packets from the CDMS to the Spire instrument is less than 10 per second Reference HP SPIRE REQ 0220 The maximum telecommand packe
110. photometer internal calibrator is energised with a pre determined sequence and the corresponding detector signals are recorded POF9 Special engineering commissioning modes TBD 4 7 2 Spectrometer Observing Modes There are two kinds of spectrometer observation point source and fully sampled map The latter is carried out by repeating the former at a number of separate pointing using the SPIRE BSM or alternatively the spacecraft in RASTER Pointing mode These are implemented as two Spectrometer Observatory Functions SOFs SOF 1 Point source spectrum SOF2 Fully sampled spectral map Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 7 In all cases the telescope pointing and or Beam Steering Mirror position are kept fixed while the FTS mirror is scanned a predetermined number of times to generate interferograms from which the source spectrum can be derived 4 7 3 Other Modes 4 7 3 1 Photometer Serendipity During spacecraft slews scientifically useful information can be obtained without the necessity of using the focal plane chopper essentially these are rapid scan maps The chopper and spectrometer mechanisms will be switched off in this mode Accurate pointing information will be required from the AOCS to reconstruct the slew path in the data analysis on the ground 4 7 3 2
111. standoffs etc LO straps none Detector boxes protoflight design Flight Cooler protoflight design All mirrors fied protofight design High Filters none CFIL 1 flight representative Flight PFIL 2 flight representative PFIL 3 flight representative PDIC 1 flight representative PDIC 2 flight representative SFIL 2 flight representative SBS 1 not fitted SBS 2 mass dummy SFIL 3 S flight representative SFIL 3 L flight representative 300 mK thermal straps and none Flight representative with 0 29 mm Kevlar on in line Flight supports mounts 300 mK Thermal control none Not fitted Flight system Photometer LW array Flight representative CQM Flight Photometer MW array none Unsuspended STM Flight Photometer SW array Unsuspended STM Flight Spectrometer SW array Unsuspended STM M Spectrometer Calibrator M Flight FPU RF Filters Flight representative box and connectors Fli FPU internal harnesses Flight representative Flight Table 5 16 1 HSFPU Hardware Matrix Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 48 Unit HSJFP AVM Subsystem component JFET Structure Flight representative Flight JFET Modules none One 48 channel module flight representative Flight Rest STMs JFET Backharness Flight representative Flight JFET FPU Harness
112. the PFM The DPU will have the full functionality of the flight version but it will be built with commercial grade parts and will not have redundant systems fitted It will be identical in external form and fit to the flight unit The DCU and FCU which together form the DRCU will not be form and fit compatible with the PFM They will be built using commercial or MIL spec components and will have the functionality of the PFM but no redundancy will be incorporated The power supply is required to power the FCU as no DC DC converter will be available for this model This power supply is a mains powered 220 240 50 Hz and its approximate dimensions are 550x550x350 mm LWH its mass is 45Kg Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 45 5 16 1 3 PFM Proto Flight Model This will be the model that is intended for flight built to full flight standards Initially it will be delivered with the QM2 FCU and DCU These units will be fully functional be form and fit compatible but will not contain full flight standard HI REL components The FCU will be delivered with the PFM power supply fitted The PFM FCU and DCU will be delivered later and the power supply will be transferred from the QM2 to the PFM This model comprises the following units e FPU DPU e DCU
113. the model Margin factor applied on the SPIRE Mechanisms Internal dissipation margin fac 1 000 3 14159265400 LO 2000 000 Baseline For Copper Thermal Conductivity W mK Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART SPIRE IID B SPIRE ISSUE 3 3 PAGE A2 13 POWERS phot 0 0420D0 spec 0 0141D0 peak phot calib 0 00400 mean phot calib 0 000033D0 q peak spec calib 0 0072D0 q mean spec calib 0 00525D0 q hold spec calib 0 0015D0 q peak phot bsm 0 003D0 mean phot bsm 0 001900 q peak phot bsm2 0 0002D0 q mean phot bsm2 0 0002D0 q peak spec mech 0 0032D0 q mean spec mech 0 00205D0 min spec mech 0 000900 q pump nom 0 0014D0 nominal value q pump add 0 0D0 low temp phase cooler average thermodynamic loads for 30microW load 50xQevap ref LD at IBDR pumpO 0 300D0 heat pump initially 300mW for 5 mins to 16K then desorption pump 0 130D0 heat pump 150mW for 35 mins to 45K pump2 0 025D0 then 25mW for 30 mins to maintain at 45K ref thermal summit LD evap 0 05500 q evap rec2 0 010D0 q evap hs 0 0008D0 Z ref LD at Thermal Summit plus mail 27 9 00 q pump hs 0 0004D0 LD at Thermal Summit plus mail 27 9 00 Reproduction interdite ALCATEL SPACE Company confident
114. to Bus A Red J06 DEMA 9S From DPU Red to Bus B Red 7 4 07 DBMA e5P From DPU Prime Xo DCE Prime J10 DBMA eSP From DPU Red to DCE Red J08 DBMA 25P From DPU Prime to MCE Prime J11 DBMA 25P From DPU Red to MCE Red ref hole e J09 DBMA 25P From DPU Prime to SCE Prime Rg WY J12 DBMA 25P From Red to SCE Red Y r UPDATED 23 02 0003 Boldettl rev 4 X o o UPDATED 10 02 2002 B Boldett Gey 3 A0 UPDATED 16 01 2002 P Baldetti UPDATED 29 01 2002 P Baldetti YEE data 5 04 2001 prog Boldetti 258 7 ZA N AES 22 aee ISTITUT ello LANETARIO AD a toll rogetta HERSCHEL HSDPU th 06 7995 foo CO VGISISES titilo HSDPU HER ES List of changes DAPNIA SPIR MX 5100 000 SAp SPIRE QA 0153 04 Rev Dto RevE Date 14 01 2004 Page 1 1 List of changes Document identification Document n SPIR MX 5100 000 SPIRE DCU Electronic box mechanical i f drawing Rev D 10 2002 Rev E 01 2004 Change of units for MOI Change of estimated mass Position s Name Signature 14 Or I 2 s e Approved by PA P Dupont 1 E iSfarloy Approved by Project manager J L Augu res V
115. which are then sent with appropriate timings to the HSDCU and or the HSFCU A detailed description of the on board software will be given in Chapter 5 4 6 MODES This section gives a brief description of the operating modes for the SPIRE instrument For latest information refer to RD 17 4 6 1 OFF Mode All instrument sub systems will be switched off including the DPU and there will be no instrument telemetry 4 6 2 Initialise INIT Mode This is an intermediate mode between OFF and ON This will be the mode the instrument enters after a power on or re boot In this mode only a limited sub set of commands may be executed This mode allows updates of DPU on board software and or tables to be carried out safely before they are used for instrument control 4 6 3 ON Mode The DPU will be switched on and can receive and interpret all instrument commands but no other sub systems will be switched on including the DRCU For engineering purposes it will be possible to command the instrument to switch individual sub systems from this mode Full housekeeping data will be telemetered Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 5 4 6 4 Ready REDY Mode The DPU and DRCU are powered on and the on board software is ready to receive commands No other sub s
116. with LCL switching limiters Instrument power circuits are shown in sections 5 9 6 4 amp 2 Reference HP SPIRE REQ 0040 The HPCDU shall telemeter the Spacecrafi s LCL current to a resolution of better than 25mA or 1 256 of trip x 1 5 whichever is the larger The stated resolution to be provided by the current telemetry does imply any particular level of current measurement accuracy 5 9 6 4 LCL fault conditions Reference HP SPIRE REQ 0050 The S C shall not allow simultaneous powering of both FCUs even in the event of a single point LCL failure Reference HP SPIRE REQ 0060 Both DPUs may be powered but only under LCL fault conditions To permit this other design features must be present The unwanted although powered DPU shall be kept in active by not commanding the inactive unit and neither HCDMU shall turn on the corresponding HSFCU To permit commanding the DPUs to work like this each HSDPU uses a different 1553 bus address Herschel platform shall monitor that LCL s are behaving correctly With certain timing restrictions it shall regularly check that an off LCL is passing less than a minimum current and that an on LCL is passing a current between a minimum and a maximum that depends on circuit It shall re check this before and after implementing a command to change an LCL s state The formal status of the functionality of LCLs working Reproduction interdite ALCATEL SPACE Company conf
117. 0 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFS 93 25 HSJFS P3 25S Bolometer signals from JFS SSW 25 36 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFS J4 MDM 25 P HSJFS P4 25S signals from JFS SSW 37 42 16 2 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 8 NA 500 1000pF 0 08uH 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 2 gt 80 HSJFP 425 37 25 37 PSW JFET Bias 12 6 DSTP 100 1000pF 0 08uH 5 0E 03 1 2E 03 10 PSW Ground 1 0 S 50 1000 0 08uH 0 0 10 PSW Bolometer Bias 6 3 DSTP 200 1000pF 0 08uH 3 8E 07 9 6E 08 10 PSW Heater 6 3 DSTP 200 1000 0 08uH 3 8E 03 9 6E 04 10 Cable Level Shieldst 0 12 gt 80 HSJFP 427 37 P27 37 PMW JFET Bias 8 4 DSTP 100 1000 0 08uH 5 0E 03 1 2E 03 10 PMW Bolometer Bias 4 2 DSTP 200 1000pF 0 08uH 3 8E 07 9 6E 08 10 PMW Ground 1 0 S 50 1000pF 0 08uH 0 0 10 PMW JFET Heater 4 2 DSTP 200 1000 0 08uH 3 8E 03 9 6E 04 10 PLW JFET Heater 2 1 DSTP 200 1000 0 08uH 3 8E 03 9 6E 04 10 PLW JFET Bias 4 2 DSTP 100 1000 0 08uH 5 0E 03 1 2 03 10 PLW Bolometer Bias 4 2 DSTP 200 1000pF 0 08 1 9E 07 4 8E 08 10 PLW Ground 1 0 S 50 1000 0 08uH 0 0 10 Cable L
118. 0 0 200 0 300 0 400 0 500 0 600 0 700 0 800 0 900 1 000 1 100 1 200 1 300 1 400 1 500 1 600 1 700 1 800 1 900 2 000 3 000 3 500 4 000 4 500 5 000 6 000 7 000 8 000 9 000 10 000 15 000 20 000 30 000 40 000 50 000 60 000 70 000 0 000076000 0 00024900 0 00049800 0 00081400 0 0011900 0 00163D0 0 0021200 0 0026600 0 0032600 0 00390D0 0 0045900 0 0053300 0 0061100 0 0069300 0 0078000 0 0087100 0 00966D0 0 010700 0 011700 0 012800 0 016500 0 020900 0 025600 0 030700 0 036100 0 047800 0 060700 0 074500 0 089300 0 105100 0 196200 0 305500 0 4500 0 6000 0 7200 0 8000 1 0000 Reproduction interdite ALCATEL SPACE REFERENCE DATE ISSUE SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 Company confidential PAGE 2 23 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 24 100 000 1 2000 200 000 3 5000 300 00 10 0000 K MANGANIN 2 16 0 1D0 0 00143D0 0 4D0 0 0122D0 0D0 0 050300 2 0D0 0 147D0 3 000 0 27500 4 000 0 42900 6 000 0 80300 8 000 1 25300 9 300 1 56800 10 000 1 72700 20 000 3 7100 40 000 7 0200 50 000 8 3900 100 000 13 1800 200 000 17 8100 300 000 22 1300 AL to AL CONTACT MACOND up 2 19 0 000 0 000 2 000
119. 0 0 SMECm QI807 0 0 QI808 0 0 SCAL 91817 0 0 PUMP QI818 0 0 SHUNT 91819 0 0 EVAP 91820 0 0 HS EVAP QI821 0 0 HS PUMP CASE Average Power dissipation for Steady State MODE SWITCH QI801 avr 1802 avr 1805 bsm 1806 smecm 1807 Photometer JFET Spectrometer JFET BSM SMECm PCAL SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 PAGE A2 32 Please note that due to instability problem the power dissipation has been applied to SOB 803 instead of the Spectrometer Calibration Source 808 QI808 0 0 QI803 Reproduction interdite Heat dissipation applied to SOB instead ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE QI817 q pump avr PUMP QI820 q evap hs avr HS EVAP 1821 pump hs avr HS PUMP QI813 q evap avr EVAP CASE 1 MODE SWITCH OFF PACS in Spectrometer Mode SPIRE and HIFI off REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 PAGE A2 33 q evap hs avr removed as Evap HS assumed closed for avr case QI801 0 0 Photometer JFET QI802 0 0 Spectrometer JFET QI805 0 0 BSM QI806 0 0 SMECm QI807 0 0 PCAL QI808 0 0 SCAL 91817 0 0 PUMP QI818 0 0 SHUNT 91819 0 0 EVAP 91820 0 0 HS EVAP QI821 0 0
120. 0 025D0 amp 1 0DO0 CNDFN3 T822 T819 K Cooler IF 823 819 1 0DO 1 000 CNDFN3 T823 T819 K HPCUT1 0 003 0 003 0 22D0 amp 1 0D0 CNDFN3 T823 T819 K Cu Cu IF amp 1 0DO0 CNDFNS3 T823 T819 K Cooler IF Cooler instrument loads in microwatts 7 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 2 38 Photo load 6L 822 819 T822 T819 1000000 0D0 Spectro load 6L 823 819 T823 T819 1000000 0D0 Parasitic load GL 803 819 T803 T819 GL 820 819 T820 T819 GL 818 819 T818 T819 1000000 0D0 Tot Cooler load Photo load Spectro load Parasitic load Missing Pump Internal Power Dissipation pump add 50 0DO Tot Cooler load 1000000 000 q pump nom Update the Heat Switches and Evaporator Status according to SPIRE Mode ON or OFF IF MODULE EQ SOLVIT OR MODULE EQ SOLVT2 MODULE EQ SOLVSM MODULE EQ SOLVFM THEN IF MODE EQ SWITCH THEN During SPIRE Operation The evaporator node 819 is always a boundary node at 0 29K The pump HS is ON The evaporator HS is OFF CALL STATST N819 B 1819 0 29D0 HS EVAP STATE OFF HS PUMP STATE ON No power dissipation is currently defined for the node 812 within the ISWITCH Function because this node
121. 00 180 000 4 230000 190 000 4 460000 200 000 4 590000 250 000 5 000000 300 000 5 500000 Constantan 60 Cu 40 Ni amp 55 Cu 45 K CONSTANTAN 2 26 0 120 0 00600 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 20 0 400 0 0200 1 000 0 100 4 000 0 800 5 000 1 200 6 000 1 600 7 000 2 000 8 000 2 500 9 000 3 000 10 000 3 500 15 000 6 300 20 000 8 500 30 000 12 000 40 000 14 000 50 000 15 000 60 000 16 000 70 000 16 500 80 000 17 000 140 000 17 500 150 000 17 800 160 000 18 000 180 000 18 200 190 000 18 500 200 000 19 000 250 000 21 000 300 000 22 500 Applicable range 2 300K OFHC 2 22 0 000 0 000 0 320 16 700 1 000 55 700 2 000 111 600 3 000 168 200 4 000 225 800 6 000 344 400 Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 8 000 10 000 12 000 14 000 15 000 16 000 17 000 20 000 30 000 40 000 467 700 593 400 716 700 832 000 884 900 934 100 979 200 1088 300 1189 000 1030 600 50 000 801 100 75 000 475 300 100 000 431 100 200 000 430 800 300 000 430 900 Copper CG OFC ultra high purity
122. 001 Faraday Pins x Connected to Busbar ECROO39tbc 002 Faraday Pins Connected Busbar ECRO039tbc 003 Faraday Pins Connected to Busbar ECROO39tbc 004 Faraday Pins Connected to Busbar 3 ECROO3Otbc 007 Faraday Pins ras Connected to Busbar ECR0039tbc 009 Farday J U uU UU U uU u u La Connected to Busbar ECR0039tbc 014 Faraday Pins Connected to Busbar 0039 015 Faraday PINS Connected to Busbar ECRO039tbe uva va a v www www e I L n NRI vv ENR MERE RARE RII www Filter ISICode LIKE 2434244 And ISCon LIKE J34 And IConWiredl 1 nY n a 444 AMMAR i 500700 a YA f w printed on 21 04 2004 09 02 55 Ye 4 ee m m Connector 211121 J34 item CVVUCR EMC Category 2C Sig H in Cryostat Pin Signal Designation lt Circuit Signal 025 Faraday Pins 036 Faraday Pins 047 Faraday Pins 059 Faraday Pins sess 070 FaradayPins 4 082 Faraday Pins 2 094 Faraday Pins M 127 Faraday Pins u CH Connector Housing rer e A PETI A TT a Fitter ISICodel LIKE 2111215 And SCont LIKE J34 And IConWired 1 n T
123. 02 803 CNDFNC 3 K 7 54D 7 55 72600 7 54D 7 9 87200 Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 PAGE 2 8 Level 1 D TNCS 803 804 6 0DO CNDFNC 3 MACOND Mechanisms and Calib sources to Level 1 SOB 803 805 A 0DO CNDFNC 3 MACOND 803 806 A 0DO CNDFNC 3 MACOND GL 803 808 CNDFNC 3 K TOR 5 30D 06 0 0200 single SCAL source 805 807 A 0DO CNDFNC 3 MA4COND Level 1 to Level 0 Photometer 803 809 0 25 CNDFNC 3 K_SSTEEL enclosure Cone supports effective A 803 809 0 25 CNDFNC 3 K_SSTEEL enclosure A Frame supports 12 axs 803 809 803 809 CNDFNC 3 K 803 809 CNDFNC 3 K_SSTEEL 803 809 CNDFNC 3 K Spectrometer 803 810 0 25 CNDFNC 3 K SSTEEL enclosure supports effective A L 12 axs 803 810 803 810 CNDFNC 3 K 803 810 803 810 CNDFNC 3 K_TEF Reproduction interdite ALCATEL SPACE 45 960 06 0 034600 L1 LO ph 2 000 25 00 06 0 036200 L1 LO ph CNDFNC 3 K MANGANIN 5 47D 8 316 417D0 1 370 8 52 736D0 4 38D 7
124. 04 DKG 4 Specification of safeing connectors Name Details Gate jumper Typical Circuit 30x mi Gate jumper Type l used on JFET inputs JCC and JCC Type ll used on JFET bias input JDD and JDD e SPIRE Provided Making SPIRE ESD Safe Draft 0 2 for comment Page 13 13 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG SPIRE L MDM 375 37 x 1Meg Ohm resistors to chassis of connector Mates with Phot JFET Backharness JFP J25 J26 J27 and J28 Four required Mates with Spect JFET Backharness JFS J09 and J10 SPIRE Provided SPIRE Type IV 515 51 x 1Meg Ohm resistors to chassis of connector Solder tab to connect backshell to chassis of FPU Detector box approximately 400mm long One required for photometer side of instrument One required for spectrometer side of instrument SPIRE Provided Making SPIRE ESD Safe SPIRE RAL NOT 002028 Draft 0 2 for comment Friday 18 June 2004 1 NC 2 NC 3 NC 4 NC 5 NC 6 NC 7 NC 8 NC 9 10 NC 11 12 NC 13 14 15 NC 16 NC 17
125. 09 02 DHENA 0 5 m E 1 ise jour 06 02 DHENA ms 2 6 2ec 5 0 J B ise o jour 05 02 DHENAIN 12 0 4 u Origine 12 01 DHENAIN BN FR an indi lodifications ate Dessin par V rifi Approuv par Sano 10 0 7 CONNECTOR TYPE 6 Po T A mL N N ds 4 opec ions particu s epe MU OTT 22 E 72 7 Indice de rugosit g n ral SOUS TRAITANT So PIS PEE Casser es an es vifs 19 Mati re Protection Echelle Poids Niveau qualit Traitement thermique 1 2 51 0 _ 105 5 SPIRE PA S 133 5 FCU ELECTRONIC BOX MECHANICHAL INTERFACE CONTROL DRAWING 194 5 222 0 n est permis d utiliser ce dessin qu avec licence sp ciale ou autorisation expresse loi du 11 mars 1957 COMMISSARIAT 249 5 SAP GERES 11 Sa Ee 277 0 Tel 01 69 08 78 25 1 69 08 59 76 6908396 SP 5200 000 J Alodine 1200 39 123 84 5 124 2 22 NJ Alodine 1200 ALL OTHER AREAS BLACK ANODISING 14 303 5 EUN MNT 1 D 1 R E CONNECTORS 21 odffactory htm ww gs2Lfr meprn A 2 note do not intend to incorrectly transpose J18
126. 1 Channel 39 GND Channel 40 57 S4 STP J4 Channel 40 441112247 Channel 40 GND Channel 41 Channel 41 Channel 41 Channel 42 Channel 42 Channel 42 GND Channel 43 Channel 43 Channel 43 GND Signal Ground Channel 44 Channel 44 PMW D6 Channel 44 GND Channel 45 Channel 45 Channel 45 GND Channel 46 Channel 46 Channel 46 GND Channel 47 Channel 47 Channel 47 GND Channel 48 Channel 48 Channel 48 GND PTC Channel 1 S4 STP PTCI PTC 1 S4 STP PTC2 7 EN posue p LONE j 1 2 4 2 3 jO 54 5 PMW A5 PMW B5 4 A2 54 5 PMW C6 4 2 4 A2 54 5 4 4 2 S4 STP L1 PMW B4 4 2 54 5 12 PMW C5 4 A2 S4 STP L3 PMW D4 4 2 S4 STP L4 PMW A4 4 2 gt gt S eo gt gt 48 2 UO wi O S N gt l 4 Channel 3 NOS Jj C 3 Channel 3gnd 45 8 Backshell Backshell Backshell Backshell EMC Backshell FPU Faraday Shield Link Pins 3 5 6 7 8 4 i 24 5 35 82 3 3 93 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT deltas 4 2 06 50 SVM CB 6 DRCU Type 1 Overall Mechanical Drawi
127. 1 SPIRE 5 PosPhDi 3 N l SMJ 5285 02155 38 29 HSFPU 70 121100 29 017 031 SPIRE SMEC PosPhDi 3 N SHD08 SMJ 5285 02155 38 29 Cable 5281 283 285 Shd con HSFPU 70 121100 29 035 together B Pin 29 30 31 058 SPIRE SMEC PosPhDi 3FB N S SMK 5286 02155 38 32 HSFPU 70 121100 29 036 057 SPIRE SMEC PosPhDi 3FB N SMK 5286 02155 38 32 HSFPU 70 121100 29 037 Filter ISICodel LIKE 211121 And SConl LIKE J30 And ConWired 1 printed on 18 09 2003 11 20 32 Astrium GmbH Project WERSCHEL Pin Allocation List Harness Doc No HP 2 ASED IC 0001 Date 20 09 2003 Sheet PAL 5 of 7 Issue 2 6 Connector 211121 P30 Function UFThr 283 0 SPIRE XS 11 FPU 25 27 29 Conn Type 197 012 24 355 Plug Item CVVUCR Location 33 CVV CB CVVUCR Backshell 9254 F 24 M EMC Category 2l Sig H fr CVVFT to SVMCB Interface Code Grouping Pin Signal Designation Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 011 SPIRE SMEC PosSensPwr N S SMH 5280 021 5 38 26 HSSVMCB3 27 312300 J04 011 004 PIRE SMEC PosSensPwr N R SMH 5280 021 5 38 26 HSSVMCB3 27 312300 J04 004 010 PIRE SMEC PosSensPwr N 5 05 SMH 5280 021 5 38 26 Cable 5280 Shd HSSVMCB3 27 312300 J04 010 018 SPIRE PosPhDi 1 N 1 SMJ 5281 02155 38 27 HSSVMCB3 27 312300 J04 018 019 SPIRE
128. 17 122300 P20 016 28 SPIRE PMW Ch17 to 19 18gnd SPB 5 S073 021 28 5 Daisy ch to Pin 128 A3 HSDCU 17 122300 P20 049 076 SPIRE PMW Ch17 to 19 19 SPB 5 S073 021CC 28 5 PMW E9 HSDCU 17 122300 P20 033 077 SPIRE PMW Ch17 to 19 19 SPB 5 S073 021 28 5 HSDCU 17 122300 P20 017 8 SPIRE PMW Ch17 to 19 19gnd SPB 5 S073 021 28 5 Daisy ch to Pin 128 A3 HSDCU 17 122300 P20 050 20 Cable Faraday shd Cable P20 Faraday Shd con to Compliant with P20 Insulating Jacket SPIRE HDD 1 2 Cable P20 Insulating Jacket tbd P20 Cable Overall Shd Cable P20 Overall Shd not forseen may be added later 088 SPIRE PMW Ch 20 20 SPB 3 S73A 021CC 28 5 PMW G9 HSDCU 17 122300 P21 001 089 SPIRE PMW Ch 20 20 SPB 3 S73A 021CC 28 5 HSDCU 17 122300 P21 018 128 SPIRE PMW Ch 20 20gnd SPB 3 S73A 021CC 28 5 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 034 099 SPIRE PMW Ch21 to 24 21 SPB S S074 021CC 28 6 PMW D9 HSDCU 17 122300 P21 002 100 SPIRE PMW Ch21 to 24 21 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 019 128 SPIRE PMW Ch21 to 24 21gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 035 110 SPIRE PMW Ch21 to 24 22 SPB S S074 021CC 28 6 PMW F9 HSDCU 17 122300 P21 003 111 SPIRE PMW 21 to 24 22 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 020 128 SPIRE PMW Ch21 to 24 22gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 036 118 SPIRE PMW Ch21 to 24 23 SPB S S074 021CC 28 6 PMW E10 HSDCU 17 122300 P
129. 1819 SPIRE HARNESS DEFINITION DOCUMENT Deltas 4 SSW JFETV B1 SSW BIAS B2 PICJFEIVB SSW BIAS B1 SS 7 N SSW JFETV B2 4 SLW JFETV B1 SLW BIAS B2 SLW B1 Bias Tail B JFS P10 37 Way JFS P09 SS SLW RI 4 jJ BA E Judo Lg qp Fe o L 909 j 11 9 0 7 p SLW BI 13 SLW DI 13 A J 7 Coa SLW AI 2 SLW C2 _ SLW B2 2 s SLW E2 1 SLW A2 emp ER j 18 1 2 SLW D2 4 5 2 SLW C3 115 37 Way D JFS P10 26 LA _ pS CVV 128 Way 1 pS AD o 50 IIS AD 12242 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas Name Pixel JFS P05 JFS P06 37 Way 37 Way D CVV JFS P09 JFS P10 128 Way 1 242 Channel 14gnd shld Channel 15 140230414 121 Channel 15 L 6 4 19 Channel 15gnd shld BAYA Channel 16 4 Channel 16 Channel 16gnd shld BAYA Channel 17 Channel 17 Channel 17gnd shld Channel 18 Eoo p 08 j pp 1 122 2 11 Channel 18 amp Channel 18gnd shld 14 1 12 A2 D Channel 19 Channel 19 C Channel 19 gnd shld po BAYA Cha
130. 2 103 04 05 06 07 08 09 10 NC 11 112 NC 13 NC 14 rT NC 15 L NC 16 17 NC 18 L NC 19 rT NC 120 NC 21 NC 122 123 24 25 26 27 28 128 Way plug for SMEC and BSM cryogenic electronics 38x 1Meg Ohm resistors to chassis of connector ESA Industry provided Making SPIRE ESD Safe Draft 0 2 for comment Page 17 17 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG 5 Comments on the integration procedure racks Integration of BDAs into FPU 3 Integration of JFET BDA harnesses to To be written BDAs Integration of FPU and JFETs into cryostat To be written 6 Integration of cryohamess to De integration of cryoharness to DRCU 8 De integration of and JFETs De into To be written cryostat De integration of JFET BDA harnesses to To be written JFET racks BDAs racks De integration of BDAs De into 12 De integration of JFET modules De into To be written JFET racks Making SPIRE ESD Safe Draft 0 2 for comment Page 18 18 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Appendix One Location of Safeing Plugs in Config 6 Instrument Spacec CVV C B to SVM SPIRE Safeing raft Model SIH SPIRE S S S C Connector Plug Phot Bias CVV CB P26 opect
131. 2 OIG 7 2 7 2 c op E E E EE E E EEAS S E E E AE EE E EEE 7 3 8 PRODUCT ARSSURANCE 54 EEEE 8 1 9 DEVELOPMENT AND VERIFICATIONN 9 1 pc 9 1 MM NEMINEM NNNM NM UM NM NM UR 9 1 ce eM idee m 9 2 29 THERMAL VERIFICATION 9 2 99 VERIFICATION OF SCIENTIFIC PERFORMANCE 55 555 55 55 53 5 ec 9 2 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 0 6 96 ELECTRICAL 5 0 6 00000000 se esse sese essere suo 9 2 ONE ING 9 2 98 VERFICAMON MATRIK u LL u uuu 9 3 10 MANAGEMENT PROGRAMME 5 10 1 ANNEX 1 SPIRE UNITS ICD 1 ANNEX 2 SPIRE REDUCED TNN
132. 21 0 Start Transient Analysis with 48 hrs of PACS Operation SPIRE in OFF Mode IF SPSUBMD EQ 1 THEN CALL STATST N819 D HS STATE OFF HS PUMP STATE OFF QI801 0 000 91802 0 000 QI805 0 000 QI806 0 000 QI808 0 000 91812 0 000 91817 0 000 Photometer JFET Spectrometer JFET BSM SMECm QI807 0 0D0 PCAL SCAL Additional Pump Power Dissipation PUMP Reproduction interdite ALCATEL SPACE Company confidential PAGE A2 40 REFERENCE INTERFACE INSTRUMENT DOCUMENT TR ATE 06 PART B SPIRE IID B SPIRE ISSUE 3 3 QI818 0 000 SHUNT QI819 0 0D0 EVAP QI820 0 0D0 HS EVAP 91821 0 000 HS PUMP SPIRE in Average Mode ELSE IF SPSUBMD EQ 0 THEN CALL STATST N819 B T819 0 29D0 HS EVAP STATE OFF HS PUMP STATE QI812 pump add CALL SSOPMD 0 Start SPIRE Recycling after 48 hrs of PACS Operation ELSE IF SPSUBMD EQ 1 THEN Z CALL STATST N819 D isn t this needed HS EVAP STATE ON HS PUMP STATE OFF QI801 0 000 Photometer JFET QI802 0 0DO Spectrometer JFET QI805 0 000 BSM 1806 0 000 SMECm 807 0 0DO PCAL 1808 0 000 SCAL 91812 0 000 Additional Pump Power Dissipation QI817 0 000 PUMP QI818 0 000 SHUNT QI819 0 0D0 EVAP Reproduction interdite ALCATEL SPACE Company confidential SCI PT IIDB SPIRE 02 124 PAGE A2 41 REFEREN
133. 21 004 119 SPIRE PMW 21 to 24 23 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 021 128 SPIRE PMW Ch21 to 24 23gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 037 112 SPIRE PMW 21 to 24 24 SPB S S074 021CC 28 6 PMW G10 HSDCU 17 122300 P21 005 120 SPIRE PMW 21 to 24 24 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 022 128 SPIRE PMW Ch21 to 24 24gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 038 090 SPIRE PMW 25 to 28 25 SPB S S076 021CC 28 8 PMW C4 HSDCU 17 122300 P21 006 Filter SICodel LIKE 312100 And 5 LIKE P03 And ConWired 1 printed 18 09 2003 12 45 26 Astrium GmbH Project WERSCHEL Pin Allocation List Harness Doc No HP 2 ASED IC 0001 Date 20 09 2003 Sheet PAL 3 of 8 Issue 2 6 211121 J22 Item CVVUCR EMC Category 2C Sig H in Cryostat Connector Function UFThr 193 0 SPIRE XS 04JFP21 22 23 24 Location 33 CVV CB CVVUCR Conn Type 197 011P24 35P Junct Backshell HERSKT 58 0050 Interface Code Grouping Pin Signal Designation Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 108 SPIRE PW 13 to 16 15 SPB S072 12AXD 38 4 D PMW F7 HSJFP 15 121210 P23 003 109 SPIRE PMW Ch 13 to 16 15 SPB 5072 12AXD 38 4 D HSJFP 75 121210 23 016 128 SPIRE PMW Ch 13 to 16 15gnd SPB S072 12AXD 38 4 D
134. 24 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 20 5 8 OPTICAL INTERFACES The cryostat and baffle structures shall be compatible with the SPIRE beam 5 8 1 Straylight The instrument straylight model and its conclusions related to alignment etc are described in RD 15 The dimensions of the Spire optical beam stayout envelopes are defined in the HSFPU ICD annexed to the IID B These are simplified inclusive shapes detailed ones can be found in RD 20 For information Figure 5 8 1 illustrates the SPIRE optical beam envelope viewed as it passes out of the HSFPU showing the contributions from the photometer and the spectrometer The differing beams result from the extremes of the BSM s jiggle and chop displacements The beam envelope formed is the geometric optical beam passing through the Spire cold stop The mm clearance around the beam is the allowance required for beam diffraction The figure 5 8 1 here under takes into account the removing of SPIRE shutter P Photometer U 3 4 e Spire alignment cube Clearance all around beam pp Photometer cover outer we Spire cold fieldstop yellow CF Spire input baffle box E one surface as shaded cut away Composite input beam from Photometer and Spectrometer as scanned bv Beam Steering Mirror Figure 5 8 1 Spire optical beam envelope
135. 3 INTERFACE ASSY BIETEN 14 KE 0104 393 64 18 64 18 2 SIGNALS IN 5 0104 397 THERMAL STANDOFF BUSH 4 0 94 3 16 FASTENERS THRO 73 E 6 0104 398 FOOT UPPER WASHER 4 10 14 0 55 4 HOLES 4 125 JI4 17 KE 0104 399 LOWER WASHER 4 10 34 1 35 10 03 ux 18 L3 STRAP A L3 STRAP N A HERSCHEL SUPPLY REFERENCE HOLE 716 pie Tei 9 M2 5_WASHER WASHER 8 10 11 0 86 S STEEL BS970 1501 3045 11 15 31 INTO MODULES 20 M2 5_X_8LG_CPHD_SKT_SS FASTENER 2 0 58 6 93 S STEEL 53506 1 1998 2 10 21 M3_X_8LG_CPHD_SKT__SS FASTENER 8 10 74 5 95 S STEEL 53506 1 1998 A2 10 ASSEMBLY MASS 968 13 GRAMS THESE TWO WASHERS TO BE RELIEVED IN ORDER TO AVOID CLASH WITH FOOT BEAM RADIUS 13 N Z 56 48 50 13 2 TYP 2 92 9 86 62 TYP 2 2 Cb GD Eu lt Up 65 T IN SS d 2254 IN SY N qy lt S IN SY Y R T _ ZA A A A 45 AK P A PARTIALLY EXPLODED 3D VIEW N N N N N N SHOWING THERMAL STRAP INTERFACE lt 1 N N N S VIEW SHOWN WITH L3 CLAMPS REMOVED TEMPERATURE SENSOR INTERFACE SHOWN ON BOTH SIDES 5 1 N N S 5 THERMAL CONTACT SURFACE DEFINED BY 5 S S 5 S N 4 PLACES S S S MB LL CO
136. 3FB N S 5 5286 02155 38 32 HSSVMCB3 27 312300 J04 058 057 SPIRE SMEC PosPhDIZ3FB N R SMK 5286 02155 38 32 HSSVMCB3 27 312300 J04 057 Filter ISICodel LIKE 211121 And 5 LIKE P30 And ConWired 1 printed 18 09 2003 12 29 28 Astrium GmbH Pin Allocation List Doc No HP 2 ASED IC 0001 Issue 2 6 Date 20 09 2003 Project Harness HERSCHEL Sheet PAL 5 of 7 Connector 312300 J04 Function SPIRE SVM CB3 SPIRE Bundle 11 Conn Type MS27497T24 35P Jun Sh Item HSSVMCB3 Location 27 CB ab SVM Panel 7 SPI CCU CB Backshell 440 FS 110 M 24 03 EMC Category 2l Sig H fr CVVFT to SVMCB Interface Code Grouping Pin Signal Designation Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 0115 SPIRE SMEC PosSensPwr N S SMH S280 021BS 38 26 CVVUCR 33 211121 P30 01 004 SPIRE 5 PosSensPwr N SMH 5280 021 5 38 26 CVVUCR 33 211121 P30 004 010 SPIRE SMEC PosSensPwr N 5 05 SMH 5280 021 5 38 26 Cable 5280 Shd CVVUCR 33 211121 P30 010 018 SPIRE PosPhDi 1 N 1 SMJ 5281 02155 38 27 CVVUCR 33 211121 P30 018 019 SPIRE SMEC PosPhDi 1 N l SMJ 5281 02155 38 27 CVVUCR 33 211121 P30 019 029 SPIRE SMEC PosPhDi 1 N SHD06 SMJ 5281 02155 38 27 Cable 5281 283 285 Shd con CVVUCR 33 211121 P30 029 together B 056 SPIRE SMEC PosPhDi 1FB N 5 52
137. 4 22gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 036 118 SPIRE PMW Ch21 to 24 23 SPB S S074 021CC 28 6 PMW E10 HSDCU 17 122300 P21 004 119 SPIRE PMW 21 to 24 23 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 021 128 SPIRE PMW Ch21 to 24 23gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 037 112 SPIRE PMW 21 to 24 24 SPB S S074 021CC 28 6 PMW G10 HSDCU 17 122300 P21 005 120 SPIRE PMW 21 to 24 24 SPB S S074 021CC 28 6 HSDCU 17 122300 P21 022 128 SPIRE PMW Ch21 to 24 24gnd SPB S S074 021CC 28 6 Daisy ch to Pin 128 A3 HSDCU 17 122300 P21 038 090 SPIRE PMW Ch25 to 28 25 SPB S S076 021CC 28 8 PMW C4 HSDCU 17 122300 P21 006 Filter SICodel LIKE 312100 And 5 LIKE P03 And ConWired 1 printed 18 09 2003 12 45 26 Doc No HP 2 ASED IC 0001 Astrium GmbH Pin Allocation List Date 20 09 2003 Sheet PAL 3 of 8 Issue 2 6 Harness Project WERSCHEL 312100 P03 Item HSSVMCB1 EMC Category 25 519 H fr SVMCB to W Units Function SPIRE SVM CB1 SPIRE Bundle 04 Location 27 ab SVM Panel 7 SPI CCU Connector Conn Type 527484 24 355 Pl Shl Backshell 380 FS 007 M24 05 Interface Code Grouping Pin Signal Designation Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 7 8 PIRE PMW Ch17 to 19 18 SPB 5 S073 021CC 28 5 HSDCU
138. 4 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 52 Instrument User Manual following the requirements laid down in the OIRD Instrument database this will be delivered in the form generated during instrument and system level testing Each instrument model will be delivered with an End Data Package in accordance with RD 7 SPIRE PA Plan Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 6 1 6 GROUND SUPPORT EQUIPMENT 6 1 MECHANICAL GROUND SUPPORT EQUIPMENT MGSE is required to ensure safe handling of all instrument components during assembly integration and test procedures Further details can be found in RD 23 SPIRE FPU Handling and Integration Procedure A list of MGSE supplied equipment can be found in section 5 16 3 of present IIDB 6 2 ELECTRICAL GROUND SUPPORT EQUIPMENT After delivery of the Herschel instruments to industry they will be integrated on to the payload spacecraft and tested as part of the verification activities of the integrated system Instrument testing requires the participation of the instrument teams order to verify the correct operation of their instrument and to do this they will use a set of equipment delivered and integrated into the system level test system This equi
139. 4 ix OS OC G 5 SMEC pos sensor photodiode feedback Shld 45 MIN 111 89 2 66 43 21 SMEC pos sensor photodiode feedback Shld 22 MG 127 120 101 26 78 QQ 32 13 48 Position Sensor 1 49 112 po T T Oe Jiggle Position Sensor 2 30 Chop Position Sensor 1 44 128 A 02 OS 79 QS 56 33 gt gt lt gt 54 NC N WY Ox GY 2 OQ SMEC pos sensor photodiode 1 feedback 55 N 25 113 29 91 68 2 45 23 eS SMEC pos sensor photodiode 1 feedback 56 N KA KA lt 7 SMEC pos sensor photodiode 3 feedback 57 3 KO 103 VN 80 57 2 34 lt gt pos sensor photodiode 3 feedback 58 N 121 VY 69 Z 46 14 61 NC 52 lt lt Z lt 62 NC VS gj GO T Q amp 63 NC 114 gt AC 24 64 2 a 99 i 68 NC 104 520 lt lt 66 NC 93 69 N 70 70 71 MN 72 NC 73 NC 74 75 76 77 78 79 80 81 NC 82 83 84 85 86 NC 87 88 NC 89 NC 90 91 NC 92 93 94 95 NC 96 97 NC 98 99 NC 00 01 NC 0
140. 5 0 FCU J17 DCMA 37 S FCU P17 37 P SMEC Drive Coil 2 1 5 0 SMEC Drive Coil Rob 2 1 b 0 SMEC Drive coil voltage sensor 2 1 0 00001 SMEC Position sensor supplies 4 2 0 001 SMEC Position sensor photodiodes 6 3 0 00002 SMEC Position sensor photodiodes FB 6 3 0 00001 JB 11 35 FCUJI3 _DEMA9S Shield joined to all backshells RF Overshield gt 80 0 01uH 112 512 12 FCU J12 DBMA 25 S FCU P12 DBMA 25 P Sorption Pump Heater 4 0 TQ 10 2 50E 02 0 00 00 Aux R Heat switch heaters 8 0 TQ 50 1 50E 03 0 00 00 300mK Thermal Control Heater 4 1 STO 100 2 00E 03 0 00 00 Spectrometer Stimulus Heater 4 4 0 TQ 30 9 00E 03 0 00 00 Spectrometer Stimulus Heater 2 4 0 TQ 30 7 00E 03 0 00 00 FCUJ24 DDMA 50 S FCU P24 DDMA 50 P FPU Thermometry A 44 11 STQ 1000 1 00E 06 0 00 00 FCUJ26 _ DAMA 15 S Shield joined to all backshells RF Overshield gt 80 0 01uH 113 513 13 FCU J22 15 22 DAMA 15 P FPU Thermometry C 12 3 STQ 1000 1 00E 06 0 Drive R FCU J20 DCMA 37 S FCU P20 37 P BSM Chop Jiggle Sensors 4 2 1 00E 06 0 00 00 0 4 BSM Chop Jiggle Sensors 6 2 1 00E 06 0 00 00 BSM Launch latch sense 2 1 0 001 0 BSM Launch latch solenoid 2 1 0 0 5 0 BSM Chop motor drive 4 1 0 BSM Jiggle motor drive 4 1 0 FCU J30 37 P FCU P30 DCMA 37 S SMEC LVDT Primary 2 1 0 SMEC LVDT Secondary 4 2 0 SMEC Launch Latch1 4 2 0 SMEC Launch Latch1 Confirm 2 1 0 SMEC Launch Latch2 4 2 0 SMEC Launch Latch2 Confirm 2 1 0 FCU J1
141. 5 00 mm confirmed by e mail from John Coker Sheet 5 Separate telecon held on L1 interface change ECR 073 issued Sheet 6 ok Note an updated ICD issue 20 is not planned for 1st July for next issue the FPU ICD of last SPIRE pack v11 CR 68 v1 will be used with the list of agreed missing changes included in front page of IIDB Annex 1 FPU JFET MGSE is not possible to integrate the JFETS before the FPU the connectors are not accessible The concept of lifting the FPU and JFETS has been tried successfully e g at CSL on the shaker Of course the extra equipment like vent lines and other instruments were not present is planned to incorporate all Astrium comments Aturn buckle will be implemented Potential conflict with the vent lines will be evaluated The position of the JFET support wire is not critical so modification of the MGSE if required is not thought to be a problem e Flexibility of the JFET harness The JFETs when supported are flexible and repositioning by 10mm or so is not a problem e Removal of LO detector strap for integration The detector strap can be partially or completely removed for integration It may be best to asses this when we do the first integration We can baseline complete removal this is what have put in the integration procedure Fixation of SPIRE LO Flex link to H PLM rigid pod SPIRE sees no problem with the removal of the lower A frame for fixation of
142. 5 7 issue 2 3 removed from reference to reduced TMM Section 5 7 1 note removed Section 5 7 1 3 Table 5 7 2 On ground temperatures amp heat flows is removed only the 2 last column non operating temperatures kept as table moved in 5 7 1 4 Section 5 7 1 4 note added baking of 80 C for 72 h plus the ramp up and ramp down and Section 5 4 4 3 Figure 5 4 8 changed renamed 5 4 6 Note under figure is removed table Table 5 7 2 SPIRE FPU Non operating temperatures added Section 5 7 3 table named Table 5 7 3 SPIRE WU temperatures Section 5 7 3 note under table all 4 bullet Spire units will be for such systems TBC is removed Section 5 7 5 1 table named Table 5 7 5 1 SPIRE Instrument Temperature Sensors Section 5 7 5 3 table named Table 5 7 5 2 SPIRE Satellite Temperature Sensors Section 5 7 5 3 table 2d row T225 Accuracy 0 001K is changed by 0 008K Section 5 7 5 3 all notes under table after information only are removed Section 5 9 1 table named Table 5 9 1 Power dissipation inside cryostat Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 0 12 Section 5 9 1 note under table changed by for information only refer to SPIRE RTMM in Annex 2 Section 5 9 3 table nam
143. 5 P HSJFP P21 255 signals from PMW 1 12 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J22 25 HSJFP P22 25S signals from PMW 13 24 24 3 DS 12 500 1000 0 08uH 1 0 09 5 0 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J23 MDM25P HSJFP P23 25S Bolometer signals from PMW 25 36 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP 924 25 HSJFP 24 25S Bolometer signals from PMW 37 48 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 C5 CVV5 HSJFP J17 MDM 25 P HSJFP P17 255 signals from PMW 49 60 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0E 00 0 0E 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFP J18 25 HSJFP P18 25S Bolometer signals from PMW 61 72 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08
144. 50 88 1 Channel 19 GND 1 S4 STP E4 PMW G9 89 B p 4 8 A 124 7 _ 2 J PMW D9 S4 STP Fl Channel 21 _ 10 1759 1 7 28 A 8S C y O ee ee S4 STP F2 PMW F9 x 2 36 C S4 STP F3 PMW E10 7 L S8 j d S4 STP F4 PMW G10 120 21171 128 3 38 44 j 54 5 1 PMW C4 79 F Jd 1 128 A3 10 7 102 54 5 2 101 128 PMW C3 91 128 PT Sia Ground men 103 113 128 3 S4 STP G4 S4 STP HI S4 STP H2 S4 STP H3 S4 STP H4 54 8 128 3 128 3 128 3 128 3 iN L AJIN AJIN RIT BLO AD W WO MIN Ble OI a mein gt gt U N 1 NO Go lt gt J ON NO 4 A2 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT deltas PE J22 Link Cable ID Pixel 128 4 DCU P20 DCU P21 DCU P22 VF 82 64 Channel 34 jJ 3 92 j S4 STP I2 Channel 34 PMW A 45 FG Channel 34 GND Channel 35 54 5 13 Channel 35 PMW DKI 3 r S4 STP I4 3 m 3M 1 2 2 S4 STP J1 402 8K S4 STP J2 6 Ss 4 S4 STP J3 Channel 39 2
145. 500 255 000 0 1100 297 000 0 12900 311 000 0 13600 REFERENCE 5 02124 DATE 21 06 2004 ISSUE 3 3 PAGE 2 28 TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE 3E TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E Interfaces Conductance Arrays W K TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE 3E TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E BDA IF 2 9 0 200 0 0261282100 0 300 0 04400 0 400 0 07253152900 0 500 0 10075701300 0 600 0 13179813300 0 700 0 16539481100 0 800 0 20134646900 0 900 0 23949237100 1 000 0 279700 Note no electrical isolation included K Cooler 1 2 11 0 300 0 04000 0 3500 0 05050180400 0 400 0 06554011100 0 4500 0 08248156500 0 500 0 10131541200 5 000 0 400 Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 6 0D0 0 500 10 000 0 80 15 000 1 000 50 000 1 000 300 000 1 000 K RCl
146. 7 011P24 35P Junct Backshell 128 175_176_01_0 wp na w ae v www MAAA messes oto u v ver e Pin Allocation List 2 wanna i SA TN FUTT MRA TAAN FUR Verre TIT nns ntm na nma Connector 211121 J34 CVVUCR EMC Category 2C Sig in Cryostat Function UF Thr 318 1 SPIRE XS 10 FPU 19 21 23 Location 33 CVV I F CB Top CVVUCR 077 066 076 054 053 _ 064 052 075 050 062 051 061 039 011 019 018 010 020 006 013 005 042 SPIRE SorptPumpTemp N 1 S3E SPIRE SorptPumpTemp N V S3E SPIRE SorptPumpTemp N V 53 SPIRE SorptPumpTemp N 1 SaE SPIRE SorptPumpTemp N SHDO1 53 SPIRE EvaporatorTemp N 1 ET S3E SPIRE EvaporatorTemp N V S3E SPIRE EvaporatorTemp N V 77 S3E SPIRE vaporatorTemp N t Y S3E SPIRE EvaporatorTemp N SHD02 S3E SPIRE SorptPurmpSwTemp N 1 mu S3E _ SPIRE SorptPumpSwTemp N V EN S3E SPIRE SorptPumpSwTemp N V S3E SPIRE SorptPumpSwTemp N l 457 S3E SPIRE SorptPumpSwTemp N SHD03 bu S3E SPIRE EvaporSwTemp N 1 rr S3E SPIRE EvaporSwTemptN V T S3E SPIRE EvaporSwTemp N V TT S3E SPIRE EvaporSwTemp N S3E SPIRE EvaporSwTemp N SHD04 S3E SPIRE Th
147. 76 01 EMC Category 2C Sig H in Cryostat ce _ nterface Code rouping Pin Signal Designation _ Circuit Signal Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector 022 SPIRE SorptPumpSwHtr N S3F 5240 04080 30 HSFPU 70 121100 19 016 033 SPIRE SorptPumpSwHtr N 1 8 S3F 5240 04080 30 HSFPU 70 121100 P19 034 021 SPIRE SorptPumpSwHtr H 1 A S3F 5240 040 0 30 HSFPU 70 121100 P19 017 032 SPIRE SorptPumpSwHtr H I B S3F S240 040B0 30 HSFPU 70 121100 P19 035 055 SPIRE EvaporSwHtr N A S3F 82441 04080 30 HSFPU 70 121100 P19 018 056 SPIRE EvaporSwHIr N B S3F 5241 04080 30 HSFPU 70 121100 P19 036 043 SPIRE EvaporSwHtr N I A S3F 5241 04080 30 HSFPU 70 121100 P19 019 044 SPIRE EvaporSwHtr N H B S3F 5241 04080 30 HSFPU 70 121100 19 037 004 SPIRE FPU FC Faraday SFF SFF 5249 01980 30 Cable P19 Faraday Shd conto HSFPU 70 121100 P19 CH 3 3 3 Busbar tbc 111 SPIRE 8 4 m GN SCA 242 04155 38 9 HSFPU 70 121100 P21 005 120 Spectr4 Temp V T SCA S242 04155 38 9 HSFPU 70 121100 P21 006 128 SPIRE Spectr4 Temp V BH ET SCA 8242 04155 38 9 HSFPU 70 121100 P21 024 112 SPIRE 4 SCA 242 04155 38 9 HSFPU 70 121100 P21 4025 121 SPIRE 4 SHD01 1 SCA S242 04155 38 9 Cable 8242 to S244 Shd con HSFPU 70 121100 P21 023 together 091 Spectr2 T
148. 8 SPECTROMETER SIDE VIEWED IN Yu DIRECTION 374 78 270 50 E 380 78 x 59 6 59 28 PHOTOMETER J FETS ONLY CVV INSTRUMENT SHIELD SECTIONED ON CL SIDE AND END uw THIS DRAWING REFERENCES THE JFET UNIT MOUNTINGS CO ORDINATES sd HE JFETS HAVE SEPARATE DETAILED NT INTERFACE DRAWINGS 9 o FOCAL PLANE 9 Hy 3 O e N 19 19 02 04 SEE CHANGE SHEET 18 4 07 03 CHANGE SHEET 17 16 10 02 SEE CHANGE SHEET PROTOME TER CHECKED 16 28 08 02 DRAWING UPDATED TO ISSUE 16 THERE ON NOTE PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS DEPARTMENT OF SPACE AND CLIMATE PHYSICS E HOLES MOVED BENE ee OS EE CHANGE SHEET FOR DETAILS OF CHANCES MOERS M OTHERWISE STATED UNIVERSITY COLLEGE LONDON TRACED 14 2 a GRAVY ADDED vesien FROM 5505 ONWARDS ST STEEL PARTS LINEAR 1 0 MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY Sra NATURAL DORKING SURREY PBG TD UPDATED FILTER amp PHOT CONNECTORS ADDED FOCAL ANGULAR 0215 711 01 pL amp FRAME MOUNT DIM ADDED SHEET 7 ADDED TITLE DRAWING No DRAWN ISSUE DATE AMENDMENT SPIRE Flight ESTO Whee ne CON SARE INTERFACE AJC 12 24 11 01 COMPUTER FILE ACTL WT DIMENSIONS IN mm SCALES ca POST TRONS Al 5264 300sht2 SH
149. 8 DCMA 37 S FCU P18 DCMA 37 P SMEC Drive Coil 2 1 SIP 0 SMEC Drive Coil Rob 2 1 STP 0 SMEC Drive coil voltage sensor 2 1 500 0 SMEC Position sensor supplies 4 2 STP 100 0 SMEC Position sensor photodiodes 6 3 STP 1000 0 SMEC Position sensor photodiodes FB 6 3 STP 1000 0 00001 0 JD 11 35 FCUJi4 95 Shield joined to all backshells HF Overshield gt 80 0 01uH Inner shields are joined to OV in the DRCU and are wired through these harnesses on pins although they are often commoned daisy chained REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A4 1 ANNEX 4 DESCRIPTION OF THE OPERATIONS OF THE HE SORPTION COOLER Description of the Operation of the He Sorption Cooler The He cooler is produced for Spire and PACS by SBT CEA Grenoble who own the intellectual information in this The cooler is specified SBT documents HSO SBT SP 001 3 3 and HSO SBT TNS 2 its interfaces internal to Spire are controlled via HSO SBT ICD 012 1 3 The cooler s internal thermal configuration is as follows Cooler mounting frame heat sink 4K Herschel Optical bench Titanium tube Kevlar suspension Kevlar suspension Heat switch Sorption pump Figure 1 SPIRE Sorption cooler The cooler is hermetically closed and does not have a lifetime limited by its cryogen boil off However it cannot cool continuously but rat
150. 801 0 0DO Photometer JFET QI802 0 0DO Spectrometer JFET QI805 0 000 BSM 1806 0 000 SMECm QI807 0 000 PCAL 1808 0 000 SCAL 91812 0 000 Additional Pump Power Dissipation QI817 pump2 PUMP QI818 0 9D0 q evap rec2 SHUNT QI819 0 1D0 q evap rec2 EVAP 91820 q evap hs QI821 0 0D0 HS EVAP HS PUMP Set all dissipations to OFF ELSE IF SPSUBMD EQ 4 THEN HS STATE ON HS PUMP STATE OFF QI801 0 000 Photometer JFET QI802 0 0DO Spectrometer JFET QI805 0 000 BSM 1806 0 000 SMECm QI807 0 000 PCAL Reproduction interdite ALCATEL SPACE Company confidential SCI PT IIDB SPIRE 02 124 PAGE 2 43 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE REFERENCE DATE 21 06 2004 ISSUE 3 3 QI808 0 0DO SCAL QI812 0 000 Additional Pump Power Dissipation QI817 0 000 PUMP QI818 0 000 SHUNT 91819 0 000 EVAP 91820 evap hs 5 91821 0 0000 HS PUMP Switch evap OFF and pump ON ELSE IF SPSUBMD EQ 5 THEN HS EVAP STATE OFF HS PUMP STATE ON QI801 0 000 Photometer JFET QI802 0 0DO Spectrometer JFET QI805 0 000 BSM 1806 0 000 SMECm QI807 0 000 PCAL 1808 0 000 SCAL 91812 0 000 Additional Pump Power Dissipation QI817 0 000 PUMP 1818 0 000 SHUNT QI819 0 0D0 EVAP QI820 0 0000 HS EVAP QI821 evap h
151. 82 02155 38 30 CVVUCR 33 211121 P30 056 055 SPIRE SMEC PosPhDi 1FB N R SMK 5282 02155 38 30 CVVUCR 33 211121 P30 055 044 SPIRE SMEC PosPhDi 1FB N SHD09 SMK 5282 02155 38 30 Cable 5282 284 286 Shd con CVVUCR 33 211121 P30 044 together C 042 SPIRE SMEC PosPhDi 2 N 1 SMJ 5283 02155 38 28 CVVUCR 33 211121 P30 042 041 SPIRE SMEC PosPhDi 2 N l SMJ 5283 02155 38 28 CVVUCR 33 211121 P30 041 030 SPIRE SMEC PosPhDi 2 N SHD07 SMJ 5283 02155 38 28 Cable 5281 283 285 Shd con CVVUCR 33 211121 P30 030 together B 034 SPIRE SMEC PosPhDi 2FB N S SMK 5284 02155 38 31 CVVUCR 33 211121 P30 034 033 SPIRE SMEC PosPhDi 2FB N R SMK 5284 02155 38 31 CVVUCR 33 211121 P30 033 045 SPIRE SMEC PosPhDiZ2FB N SHD10 SMK 5284 02155 38 31 Cable 5282 284 286 Shd con CVVUCR 33 211121 P30 045 together C 020 SPIRE SMEC PosPhDi 3 N 1 SMJ 5285 02155 38 29 CVVUCR 33 211121 P30 020 021 SPIRE SMEC PosPhDi 3 N l SMJ 5285 02155 38 29 CVVUCR 33 211121 P30 021 031 SPIRE SMEC PosPhDi 3 N SHD08 SMJ 5285 02155 38 29 Cable 5281 283 285 Shd con CVVUCR 33 211121 P30 031 together B 058 SPIRE SMEC PosPhDi 3FB N S SMK 5286 02155 38 32 CVVUCR 33 211121 P30 058 057 SPIRE SMEC PosPhDIZ3FB N R SMK 5286 02155 38 32 CVVUCR 33 211121 P30 057 Filter SICodel LIKE 312300 And SConl LIKE 4 And ConWired 1 printed on 18 09 2003 12 34 02 Astrium GmbH
152. 9 FORM MECH 006 Rutherford Appleton Isue 2 Rutherford Appleton Issue 2 Laboratory Mechanical Design Office Date 21 12 2001 Laboron Mechanical Design Office Date 21 12 2001 Page 3of6 Page 4of6 MODIFICATION SHEET MODIFICATION SHEET DRAWING NUMBER 0104 350 DRAWING NUMBER 0104 350 DRAWING TITLE 6 JEET RACK INTERFACE DRAWING DRAWING TITLE 6 JEET RACK INTERFACE DRAWING Date 12 2003 Date 20 May 2003 NCR ECR NCR ECR Modification Description Modification Description Thermal standoff positional dimensions changed to basic dimensions 1 Note Associated with tapped holes in the Thermal Strap Interface first line modified for clarity to read 2 HOLES 4 0 7 1 5D LG HELICOIL Thermal strap interface dimensions added Note 8 added regarding the protrusion and trimming of the parylene coating Typos fixed 2 off thermal strap standard washers replaced with Belleville washers BOM updated to this effect Unit mounting hole size and positional accuracy added SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED KE 2953 KE 2953 SSTD Space Product Assurance Form Doc No 1509 006 SSTD Space Product Assurance Form Doc No 1509 006 Rutherford Appleton Issue 2 Rutherford Appleton Issue 2 Laborsiory Mechanical Design Office Date 21 12 2001 Laboialory Mechanical D
153. AJC 1 24 11 01 COMPUTER FILE ACTL WT IMENSIONS IN mm SCALE 1 4 DIMENSIONS A1 orap A E58 SHEET Z DRAWING No ANGLE PON Dee ING SCALE 52641 300sht2 Hon USED ON HERSCHEI 552 79 535 46 gt gt 484 55 gt NO SHOWN NOTE 1 ALL DIMENSIONS ROOM TEMPERATURE SPECTROMETER JFET SY OR AN Yu A CRYOSTAT WALL 815 0 INNER RAD N S M S 3 g S Z 5 5 CL CRYOSTAT S d g Y gt 611 28 a CRYOSTAT HOLE gt 510 03 d 5 408 7
154. AS2 112 113 NC 114 115 116 PMW JFETVA 117 51 118 PLW BIAS1 A 119 PLW BIAS2 A 120 121 122 123 NC 124 NC 125 NC 126 NC 127 NC PLW GROUND WIRE A 128 For cryoharness C3 41 x 1Meg Ohm resistors to chassis of connector ESA Industry Provided 20 n J lt 8 lt 21 QNO IN Page 14 14 DKG A gt Making SPIRE ESD Safe Draft 0 2 for comment Page 15 15 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Name Details 11 0 0 1 10 0 0 0 O SPIRE Type VI EN l 6 Dm 09 z gt s Bias A ve 7 f lt gt S 9 Q9 2 5 09 2 5 59 CO he 95 RS 12 26 N 13 NC d 4 gt lt lt a E PTC Bias 14 C 855 BAO 21 E NC RI 97 N 74 51 CS xa S 9 2 ato 00 eS 99 86 09 C9 JFETV Bias A ve 24 28 lt gt 2 C t 175 09 2 lt 09 2 5 092 99 99 2 3 A N lt xK KA lt Y 28 A Dro 2g amp 246 09 2 6 amp G9 62 29 NC Fa dn 64 19 NC _ 69 2 5 09 2 5 09 09 s
155. ATE PHYSICS MOVED eee SEE CHANGE SHEET TOR DETAILS OF CHANGES nm OTHERWISE STATED UNIVERSITY COLLEGE LONDON TRACED 23 11 01 CENTRE OF GRAVITY ADDED TO SHT 1 J FET DESIGN MADE FROM ISSUE T6 ONWARDS ST STEEL PARTS LINEAR Z 1 0 MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY PBG 13 UPDATED RFI FILTER amp PHOT CONNECTORS ADDED FOCAL NATURAL ANGULAR 7 20915 DORKING SURREY PLANE amp A FRAME MOUNT DIM ADDED SHEET 7 ADDED TITLE DRAWING No DRAWN ISSUE DATE AMENDMENT Ps Wa s n np 1 24 11 01 COMPUTER FILE ACTL WT DIMENSIONS IN mm SCALE SCALE 1 2 amp 1 1 INTERFACE F XING DETALLES 270 2005814 SHEET A Eu RSCHE DRAWIN No 2264 9220054 SENSORS THIR ANGLE 15 00 12 70 i TEMPERATURE SENSORS SUPPLIED BY ASTRIUM EADS DO SCALE PRESSURE PLATES SUPPLIED BY ASTRIUM EADS HSFPU EXTERNAL FINISHES INSTRUMEN CASE AND EXTERNAL COVERS BLADE AND FIXED MOUNT
156. Bias CVV CB P32 Type VI Active Detector CVV CB P24 Type VIl Signals CVV CB P31 CVV CB P22 CVV CB P23 CVV CB P25 Remaining CVV CB P27 Connectors CVV CB P28 CVV CB P34 CVV CB P30 CVV CB P33 CVV CB P29 Phot Bias SVM I F CB 312100 P04 Type V Spect Bias SVM I F CB 312200 P06 Detector Signals SVM 312200 Type VIl SVM I F CB 312200 P05 SVM I F CB 312100 SVM I F CB 312100 P02 SVM I F CB 312200 P04 SVM 312200 P01 Nil SVM I F CB 312200 P02 SVM I F CB 312300 P06 SVM I F CB 312300 P05 SVM I F CB 312300 CVV CB P31 CVV CB P22 CVV CB P23 Detector Signals CVV CB P24 not present CVV CB P25 CVV CB P27 CVV CB P28 CVV CB P30 PEM Connectors CVV CB P33 not present Nil EQM present Remaining Connectors Phot Bias SVM I F CB 312100 P04 Spect Bias SVM 312200 P06 SVM 312200 05 SVM 312100 SVM 312100 2 Detector Signals SVM 312200 Type VIl present SVM 312200 P04 SVM 312200 P01 SVM 312200 P02 SVM I F CB 312300 P04 ele SVM 312300 pp Remaining SVM I F CB 312300 P06 Tvpe VII Connectors I F CB 312300 P05 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE END OF DOCUMENT Reproduction inter
157. CE INTERFACE INSTRUMENT DOCUMENT ATE PART B SPIRE IID B SPIRE ISSUE QI820 q evap hs QI821 0 000 HS EVAP HS PUMP First Phase of Condensation Period SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 ELSE IF SPSUBMD EQ 2 THEN HS EVAP STATE HS PUMP STATE OFF QI801 0 000 QI802 0 000 QI805 0 000 QI806 0 000 QI807 0 000 QI808 0 000 91812 0 000 91817 pumpO 1818 0 9D0 q evap rec QI819 0 1D0 q evap rec 91820 q evap hs 91821 0 000 Photometer JFET Spectrometer JFET BSM SMECm PCAL SCAL Additional Pump Power Dissipation PUMP SHUNT EVAP HS EVAP HS PUMP First Phase of Condensation Period ELSE IF SPSUBMD EQ 22 THEN HS EVAP STATE HS PUMP STATE OFF QI801 0 000 1802 0 000 1805 0 000 QI806 0 000 QI807 0 000 QI808 0 000 91812 0 000 Photometer JFET Spectrometer JFET BSM SMECm PCAL SCAL Additional Pump Power Dissipation Reproduction interdite ALCATEL SPACE Company confidential PAGE A2 42 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE REFERENCE DATE 21 06 2004 ISSUE 3 3 QI817 q pumpl PUMP QI818 0 9D0 q evap recl SHUNT QI819 0 1D0 q evap recl 7 EVAP QI820 evap hs HS EVAP 91821 0 000 HS PUMP Second Phase of Condensation Period ELSE IF SPSUBMD EQ 3 THEN HS EVAP STATE ON HS PUMP STATE OFF QI
158. CTORS ADDED FOCAL ANGULAR 0215 renes 3 19 11 01 PLANE amp A FRAME MOUNT DIM ADDED SHEET 7 ADDED THE DRAWING No DRAWN ISSUE DATE AMENDMENT RRE m ESI o s ouvre PNTE FACE AJC 1 24 11 01 COMPUTER FILE ACTL WT DIMENSIONS IN mm SCALE 1 1 OPTICAL DETALLES Al RI WA HERSCHEI DRAWING No gt 2264 300sht4 50 9 PACS OUTLINE 2 23 THIRD ANGLE PROJ CL CRYOSTAT Zu SPIRE MOUNTING REFERENCE HOLE 118 00 50 00 HERSCHEL OPTICAL DATUM tl 15 4 TS 28 86 S N EN 669 45 646 27 EN S M CL CRYOSTAT t 4 OFF M6 0 THREADED HOLES EQUISPACED ON 75 00 PCD LEVEL STRAP INTERFACES SEE SHEET 5 FOR DIMENSIONS 20 08 FOOTPRINT OF MOUNTING CONE 60 08 BT SHOWING POSITION CENTRE OF CONE CL OF CRYOSTAT DO NOI SCALE 4 OFF M6 0 THREADED HOLES 2 PLACES 50 08 341 85 403 04 HI FI 195 00 OUTL INE 689 58 666 92 _ 12 4 NOTE FLATNESS OF HOB OVER FOOTPRINT OF SPIRE BLADE OR FIXED MOUNT TO 0 1 OR BETTER MAX
159. Document will be carried out on the flight model 9 6 Electrical Testing Electrical functional and performance testing will be carried out on units at subsystem and instrument levels All interfaces will be verified at subsystem and instrument level 9 7 Testing Details of EMC testing can be found in RD27 CQM Instrument Level EMC Test Specification Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 9 8 Verification matrix The SPIRE Verification matrix Is given by the table here after Ambient yes cold Qual Ambient and yes cold Qual acceptance TV acceptance TV erem i acceptance TV Performance Warm and cold alignment verification Yes limited to PLW detector channel Yes limited to PLW detector channel REFERENCE DATE ISSUE Table 9 8 1 SPIRE Verification matrix Reproduction interdite ALCATEL SPACE SCI PT IIDB SPIRE 02124 21 06 2004 3 3 PAGE 9 3 Limited radiated susceptibility testing with FPU in the test cryostat Limited radiated susceptibility testing with FPU in the test cryostat Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 10 1 10 MANAGEMENT PROGRAMME SCHEDULE All relevant information can be found i
160. E TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE High Purity Aluminium 99 999 un annealed Curve fitted to SRON measurments 159 2 7 1 000 3802 000 2 000 5319 000 3 0DO 6836 0D0 4 000 8353 0D0 5 000 9870 000 6 000 11387 000 7 000 12904 000 Brass K BRASS 2 15 0 100 0 06500 0 200 0 1300 0 300 0 2000 0 400 0 2800 0 500 0 3200 0 600 0 3900 0 700 0 4300 0 800 0 5000 1 000 0 700 4 000 3 000 10 000 10 000 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A2 19 40 000 37 000 80 000 65 000 150 000 85 000 300 000 120 000 T300 Tensile Parallel Unidirectional CFRP 1300 2 23 7 000 0 035000 10 000 0 045100 20 000 0 098200 30 000 0 182000 40 000 0 273000 50 000 0 400000 60 000 0 564000 70 000 0 757000 80 000 1 020000 90 000 1 300000 100 000 1 610000 110 000 1 940000 120 000 2 280000 130 000 2 610000 140 000 2 980000 150 000 3 150000 160 000 3 600000 170 000 3 9000
161. E TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE This file has NOT been formatted as a deliverable for Astrium TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE SMODEL SPIRNTRM Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 2 4 NODES Level 2 D801 JFET ENCLOSURE 10 000 C SHCAL T801 2 348D0 0802 JFET ENCLOSURE 10 000 C SHCAL T802 0 81342D0 Level 1 0800 11 Strap SOB 5 000 C SHCCU T800 1 0D 3 assumption 0803 OPTICAL BENCH 4 000 C SHCAL T803 26 75D0 0804 FILTER BOXES 4 000 C SHCAL T804 1 465D0 0805 BSM 4 000 C SHCAL T805 1 1D0 0806 SMECm 4 000 C SHCAL T806 1 043D0 0807 CALIB 4 000 SHCAL T807 0 03D0 0808 5 CALIB 4 000 SHCAL T808 0 0002041D0 Level 0 D809 DETECTOR ENCLOSURE 1 800 SHCAL T809 3 56D0 SHCSS T809 0 114 SHCINV T809 0 192D0 SHCSI
162. E TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE 3E TE TE TE TE TE TE TE TE TE TE TE TE TE SE SPIRE Level 3 Strap Interface GL 801 831 0 138 Electrical Isolation 802 832 0 138 Electrical Isolation Level 2 to 1 Harness T MOT RENI Photometer 12 axs STT RF screen 801 803 CNDFNC 3 K MANGANIN 5 47D 8 320 33D0 1 37D 8 53 388D0 801 803 4 38D 7 320 3300 1 1D 7 53 388D0 801 803 CNDFNC 3 K SSTEEL 1 95D 7 320 3300 1 95D 7 53 388D0 192 000 5 027D 9 53 388D0 801 803 CNDFNC 3 K 7 54D 7 320 3300 7 54D 7 53 388D0 Spectrometer 12 axs STT RF screen 802 803 CNDFNC 3 K 5 47D 8 55 726D0 1 37D 8 9 872D0 802 803 CNDFNC 3 K_TEF 4 38D 7 55 72600 1 1D 7 9 87200 802 803 CNDFNC 3 K SSTEEL 1 95D 7 55 72600 1 95D 7 9 87200 192 0D0 5 027D 9 9 87200 8
163. EET 2 Or ow 5 DRAWING No ANGL 2264 DUDAS E ke ON DO SCALE ENTRANCE BEAMS 40 91 5 ANGULAR ACCURACY OF OPTICAL CUBE POSITION 0 05 3 ARC MIN ANGULAR ACCURACY TO Xu Yu Zu CO ORDINATES 0 05 OPTICAL CUBE ANGULAR TOL OF 50 ARC SEC 5 REFER TO OPTICAL CUBE DRAWING 3 5264 305 16 FIRST CRYOSTAT APERTURE 2 O 2 5 4 m Q lt o Zz 1 i T bl bl d Q NI d 7 m FIRST OPTICAL DATUM
164. FE SPIRE RAL NOT 002028 draft 02 18 june 04 Reproduction interdite ALCATEL SPACE Company confidential Making SPIRE ESD Safe Draft 0 2 for comment Page 1 1 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG SPIRE RAL NOT 002028 Issue 0 2 Draft for comment Douglas Griffin Friday 11 June 2004 J Ke pO S M BIO eI 04 1 Doctimihent RECO w una w Sama pL UM 1 ha 1 2 39pacecralt XLI EOW u u ua nisa 2 Zeke AMOET EOM AL NOW Le 2 Dede dab 3 3 ESD Protected Instrument Configurations uuu u a E E E A 5 SPECION Orsaf Ino COMNECIOIS q Sas 12 5 Comments integration procedure 1 1202020000245000 17 Appendix One Location of Safeing Plugs in Config 6 18 Reference Documents RD 1 HP 2 ASED PL 0021 Issue 2 RD 2 Astrium HP 2 ASED PL 0031 Issue 1 Document Issue Record 0 1 Draft Friday 11 June 2004 Initial release for comment Tuesday 15 June 2004 Added safeing plugs for the SMEC and BSM 0 2 Draft Friday 18 June 2004 Revise and update 1 Introduction This note outlines the precautions to be taken to protect the focal plane units of SPIRE from ESD damage during AIT wh
165. FF BUSH 5 0 94 4 10 L i OY FA waq SETA 0 9 0104 398 FOOT UPPER WASHER 5 10 14 0 69 B E SCALE 1 1 20 0104 399 FOOT LOWER WASHER 5 10 34 69 a 127 21 L3 STRAP B L3 STRAP N A HERSCHEL SUPPLY 77 6 T Y 22 _ M3_X_8LG_CPHD_SKT__SS FASTENER 24 0 14 17 86 S STEEL BS3506 1 1998 A2 10 X3 VAN 23 M4_X_45LG_CPHD_SKT_SS FASTENER 5 15 5 15 S STEEL BS3506 1 1998 2 10 TA ASSEMBLY MASS 2502 88 GRAMS 5 POSITIONS 49 MOUNTING FASTENERS CONNECTOR TABLE 7 0 1 28 01 25 101 25 4 NOTE ITEM 23 15 NOT PARYLENE COATED LABEL TYPE FUNCTION lt 258 5 gt 17 86 20 83 6 1 1 4 PLACES 53 d J 50 13 Ma of Lol ol lalla alf Iss gt 2 EIS Jet 2 22 TO CRYOHARNESS 122 t e UE Lr 86 62 lt 75 TES ON 22 Y G 4 92 12 e 2 G G TYP 6 E p rN lt ALL SIGNAL Sog e 2 FEEDS 7 2 J gt CRYOHARNESS 41 5 THERMAL STRAP INTERFACE eo ZZ ZJ A JI5 VIEW SHOWN WITH L3 CLAMPS REMOVED nm IS VA RTT JH A To P a 5 119 4 AN Y A MAR m 2 HOLES M4x0 7 1 50 LG HELICOIL 8 FASTENER TO ENGAGE 1 50 N h N N N 7 TORQUE NOT TO EXCEED 2 5Nm 7 p f 7 7 F J A f f J26 q
166. FOR CONNECTOR FIXATION SCREWS 409 DBMA 255 PSU M MCU M BEME Qa SMEC M FPU SMECm 2 M M 2 j MALE 0 3m 10 DBMA 255 PSU R MCU R JOU DCMA 37 SMEC R FPU SMECm 2 R 0 45 J11 DBMA 255 CCHK J31 DE 25P CU M PSU M ESTIMATED MASS 16254g J12 DBMA 25S CCHK IF R FPU COOL CAL R 932 DBMA 25 CU R PSU R JS D 3C CP 1170j kg K 413 DEMA 95 CCHK F M F PU STIM M 35 DAMA 155 SU M SCU M J1 DEMA 9S CCHK F R FPU PH STIM R J34 DAMA 15S SU R SCU R J15 A NA J35 DAMA 15P SCU M PSU M J16 56 15 SCU R PSU R J17 DCMA 37S SMEC M FPU SMECm 1 M J37 NA NA A o J18 37S SMEC R FPU SMECm 1 R 38 NA NA 282 0 2 30 0 J19 DCMA 37S BSM M FPU BSM M 39 DEMA 9S MAC H JTAG 370 0 420 375 BSM R FPU BSM R J40 DEMA 9S MAC R JTAG 290 0 _ 370 0 ZONE DE MARQUAGE LIMITES DE ZONE DES HARNAIS _ 60 0 J 53 x 1 S C 2 Ra3 2 CH 0 5x45 e I CH 0 5 45 PONE CH 0 5x45 ALODINE 1200 Do 132 0 M4 STUD FOR BONDING STRAP lomages 013 profr 0 5 334 0 330 b 20 0 ma S J Vise 4 jour 01 04 DHENA 2 odif position CdG 42 03 DHENA v aba H Mise a jour 11 03 DHENA 1 ise jour 04 03 DHENA Due 1 Mise jour 10 02 DHENA ni Mise jour connecteurs
167. Flight representative Flight Table 5 16 2 HSJFP Hardware Matrix Unit HSJFS Subsystem component JFET Modules Both STM Flight JFET Backharness Flight representative Flight JFET FPU Harness Flight representative Flight Table 5 16 3 HSJFS Hardware Matrix Unit HSDCU AVM Subsystem component DCU Structure Simulator Non Flight representative Flight representative JFET Structure Flight representative x only Electrical Interfaces Flight representative Flight representative Flight only Functionality Simulator 48 LIA P channels functional Flight representative only DPU interface functional no redundancy Electrical Component Level Commercial industrial MIL spec Flight Table 5 16 4 HSDCU Hardware Matrix Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 49 Unit HSFCU Subsystem component FCU Structure Non Flight Flight Flight representative representative Electrical Interfaces Simulator Flight representative Flight Flight only representative Functionality Simulator Flight representative no Flight Flight only redundancy representative Electrical Component Level N SC QMI Fitted Flight Flight representative Commercial industrial MIL spec Flight i U Electrical Interfaces Simulator Flight representative Fli
168. HS PUMP CASE 2 PACS in Photometer mode HIFI and SPIRE off MODE SWITCH OFF QI801 0 0 QI802 0 0 QI805 0 0 QI806 0 0 QI807 0 0 QI808 0 0 QI817 0 0 QI818 0 0 QI819 0 0 Photometer JFET Spectrometer JFET BSM SMECm PCAL SCAL PUMP SHUNT EVAP Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE QI820 0 0 HS EVAP QI821 0 0 HS PUMP CASE 3 PACS off SPIRE Photometer mode HIFI off MODE SWITCH ON QI801 q jfet phot Photometer JFET 91802 0 0 Spectrometer JFET QI805 peak phot bsm BSM QI806 0 0 SMECm QI807 mean phot calib PCAL QI808 0 0 SCAL QI817 q pump nom PUMP QI818 0 0 SHUNT QI819 0 0 EVAP 91820 0 0 HS EVAP QI821 pump hs HS PUMP CASE 4 PACS off SPIRE Spectrometer mode HIFI off MODE SWITCH ON QI801 0 0 Photometer JFET QI802 spec Spectrometer JFET QI805 mean phot 2 BSM QI806 q peak spec mech 5 QI807 mean phot calib PCAL QI808 hold spec calib SCAL QI803 hold spec calib SCAL QI817 pump nom PUMP QI818 0 0 SHUNT QI819 0 0 EVAP 91820 0 0 HS EVAP Reproduction interdite ALCATEL SPACE REFERENCE SCI PT IIDB SPIRE 02124 DATE 21 06 2004 ISSUE 3 3 Company confidential PAGE 2 34 INTERFACE INSTRUMENT DOCUMENT PART B S
169. IAS34 J 1121 28 A 6 A PMWGNDWIRE B 2804 6 PMW HEATERBI 17 P 29 5 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas Name 37 way P25 37 way P27 37 Way P26 37 Way P28 128 Way 3 PSW Bias PMW PLW Bias A PSW Bias PMW PLW Bias PMWHEATERBI J b 10 6 PMWHEATERBIshd 1 11I B 65 B amp PMWHEATERB2 12 1D 6 PMWHEATERB2 1 J 30 78 PMW HEATER B2 shld 11 B4 65 B4 PLWHEATERB 90 PLWHEATERB 1 3l J 79 PLWHEATERBshd 65 B PPLWIFETVE BS 70 PLW IFETVI 32 8 JFETVI 3369 99 PPLWIFETV2 B 34 69 JFETV2 JFETV2 166 PLW BIASI B PT PLW BIASI B 1 35 57 PLW BIASI B shld 36 C4 91 PLW_BIAS2 B 397 j 5 SO BIAS2 B 2 18 6 BIAS2 Bshid 12 1960 PLW GROUND WIREB m c 9 Harness Over shield EMC EMC Backshell EMC EMC Backshell EMC Backshell Backshell Backshell FPU Faraday Shield Link Pins Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas x Nam JFPPI3 4 5 JFPPI6 128Way 6 Z o se E 8 j Channel 8gnd 13 A1 36
170. ING EXTERNAL FIXINGS COLD SIRAFS ALOCROM 1200 NATURAL ST STEEL 4 CARBON FIBRE NATURAL ST STEEL GOLD PLATED N e sr S N me DRE ANY THERMAL INTERFACE PROVISIONS NEEDED FOR THE JFE UNITS ARE SHOWN ON INTERFACE DRAWINGS RELATING TO THOSE UNITS AT ALL LEVEL 0 INTERFACES SUPPLIED BY ASTRIUM EADS ALL CLEARANCE HOLES TORQUE AS SPECIFIED BY ASTRIUM EADS FLEXIBLE STRAPS 04 5 LEVEL 14 STRAP FIXING HOLES IN 2 2 43 MODETA OF LEVEL O TO SZC INTERFACE POSITIONS EACH POSITION CONSISTS OF HERSCHEL OPTICAL BENGH 1 OFF HOLE TAFPED M8x1 25 6H x 14 5 SCALE 2 1 gt MIN FULL THREAD FIT BELLVILLE WASHER TYP 3 PLACES 15 00 SYM SPEC PT No 0750 056 5 GIVING 3759 s00 CLAMPING FORCE UNDER EACH BOLT HEAD gt TORQUE BOLTS TO 10 5 MAX 2 HOLES FITTED WITH M4x0 7
171. IRE REQ 0100 Connector use is as follows DPU Connector Redundant Bus Prime DPU Redundant DPU DPU s 1553B interface to the Herschel 5 is configured as follows inside each SPIRE HSDPU Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 31 J3 5 BU 61580V1 300 Figure 5 10 4 DPU s 1553B interface to the Herschel S C 5 10 4 2 Master Clock NA no more Master Clock 5 10 4 3 Launch Latch confirmation Spire has one cryogenic mechanism the SMEC which is fitted with launch lock device to retain the mechanism during launch and ground handling This launch lock should be maintained in the locked position except during specific on ground test sequences and once in orbit The latching of this mechanism will need to be confirmed after launch stack integration All functions are Prim and Redundant After transportation to Kourou and the last operation of SPIRE prior to launch hand held Spire provided EGSE will require cable access to the two connectors JA and JB shown in the Harness configuration drawing This EGSE will be small and light and require no external power supply A detailed procedure will be supplied by SPIRE If the latch is found to be un latched the instrument shall be powered up and the latch re latched by command Connector blanking pl
172. IUNII Pp 4 5 47 1 1 Point Source i etes usan uqa q PEDE Ee dug HEY DS 4 5 4 7 1 2 Observation Jiggle Map 2 0 0000000000000000000000000000000 nee nee hse ese ese ese sre rese rese nis 4 6 AT Nes Observation SCOR 4 6 WARE MEG M 4 6 4 7 2 Spectrometer Observing 2 60 000000000000000000000000200000000 4 6 u 4 7 PholomelerSerendipilyy u uuu 4 7 SCI PT IIDB SPIRE 02124 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 0 3 d 02 4 7 qz suce n Id 4 7 AID Conmmissionmg call bFatondMVIOde a tuu 4 7 476 FPU Operations ar Ambient 4 7 XP RN 4 7 48 INSTRUMENT REQUIREMENTS AND PERFORMANCE SPECIFICATION 4 8 u M M 4 8 4 0 2 Pertormance EsSTmalfes uuu uu u u u u uu 4 9 2 0 Ze ASSN
173. L ANGULAR Q 15 DORKING SURREY 5 19 11 01 PLANE amp A FRAME MOUNT DIM ADDED SHEET 7 ADDED VE DRAWN ISSUE DATE AMENDMENT Sd M ESTO ee ee SEIRE INTERFACE AJC COMPUTER FILE ACTL WT DIMENSIONS IN SCALE 1 4 ELECTRICAL 5264 500 sht6 ODE fF THIRD ANGLE PROJECT ION 20 NOT SCALE 2254 300sht7 IL HERSCHE 50 9 2 23 PACS FOCAL PLANE 0248 00 uu 15 P RHET _ 1 is O O OOOO O BEAMS O 0 92 SEE DETAIL DE TA L H J LL LLI T L E n T zu 19 19 02 04 SEE CHANGE SHEET 18 4 07 03 SEE CHANGE SHEET 17 16 10 02 SEE CHANGE SHEET CHECKED 16 28 08 02 DRAWING UPDATED TO ISSUE 16 THERE ON NOTE PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS DEPARTMENT OF SPACE AND CLIMA
174. L 0 STRAP FIXINGS SPIRE AXES COINCIDE WITH SEE SHEET 5 FOR S C AXES NG DETAILS SEE SHEET 4 FOR DETAILS OF INTERFACE FIXINGS Note figure extracted from Interface Drawing Issue 17 Sheet Figure 5 4 1 HSFPU overall view Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT r ATE 06 PART SPIRE IID B SPIRE ISSUE 3 3 PAGE 5 7 5 4 2 HSJFS The figure here after provides an isometric view of the Spire Spectrometer JFET rack More detailed drawings can be found in Annex 1 Figure 5 4 2 SPIRE Spectrometer JFET rack external configuration 5 4 3 HSJFP The figure here after provides an isometric view of the Spire Photometer JFET rack More detailed drawings can be found in Annex 1 T x s 2 toni V m m Figure 5 4 3 SPIRE Photometer JFET rack external configuration Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 8 5 4 4 SVM Mounted Units Drawings of the layout of the SPIRE Warm Units on the SVM are provided in the corresponding section of the IIDA The following sub sections provide an overview of the warm units whereas detailed interface drawings can be found in Annex 1 5 4 4 1 HSDPU The figure here after shows an isometric view of the
175. LE REMOVE ALL BURRS amp SHARP EDGES NOTES USED ON 1 DIMENSIONS ARE NOMINAL AND MAY VARY DUE TO MANUFACTURING TOLERANCES SPIRE MGSE NOTE 1 SEE SHEET 7 FOR SPIRE INSTALLATION LIFTING REFERENCE DIMENSIONS OR STORED ANY MEANS TH THE PRIOR 0 it REI 1 i 9 oewos ser st ste rep wewrwrrui sisti s WANOLING worst came 3 camer 3 estais ww 3 1 FRONT LIFT 1 SSS REMARKS VIEW SCALE 0 25 VIEW SCALE 0 25 Y BE REPRODUCED IN WHOLE OR IN OR TRANSMITTED IN ANY FORM MECHANTCAL PHOTOCOPYING OR OTHERWISE RETRIEVAL SYS TRONIC RMISSION OF UNIVERSITY COLLEGE LONDON e wu gt gt gt Lu D e LL e gt a THIS DOCUMENT MAY O H IN A ELEC ERM SUPPORT PLATE FOR JFET CHECKED EN 2 2 04 BOXES ADDED ASSEMBLY 11 PARTS 28 1 0 REMOVED DUE TO SPACE LIMITATIONS FRONT LIFT BRACKET REPLACED TRACED 8 8 03 witH FRONT LIFT STRAP ES 28 3 03 DEPARTMENT OF SPACE AND CLIMATE PHYSICS UNIVERSITY COLLEGE LONDON PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS OTHERWISE STATED MULLARD SPACE SCIENCE LABORATORY HO
176. LMBURY ST MARY DORKING SURREY LINEAR 0 10 ANGULAR 0715 TITLE DRAWING No COMPUTER F SPIRE LIFTING FOR DRAWING No isk 2 H DIMENSIONS IN mm SCALE SEE VIEWS 15264 feos 87 6 2 10 02 1 526 0 5 6 and 7 dwg ACTL WT DIMENSIONS IN mm SCALE SEE VIEWS OF 7 SHT 7 1 5264 404 af USED ON SPIRE MGSE OR STORED ANY MEANS H THE PRIOR UR OTHERWISE BE REPRODUCED WHOLE IN PA OR TRANSMITTED IN ANY FORM PHOTOCOPYING Y MELHANTCAL PERMISSION OF UNIVERSITY COLLEGE LONDON e e uu gt gt 2 gt LLI LJ e LL gt a Lu THIS DOCUMENT MAY 0 IN RETRIEVAL SYS ELECTRONIC CHECKED 5 1727270 T REAT FOR RET ASSEMBLY JIG PARTS 28 1 04 REMDVED DUE TO SPACE LIMITATIONS FRONT LIFT BRACKET REPLACED TRACED 8 8 03 with FRONT LIFT STRAP 28 3 03 ISSUE DATE AMENDMENT we _ IC THIRD ANGLE PROJECTION N VIEW SCALE 0 25 1 COMPUTER FILE SPIRE LI CONFIG1 ASSEMB SPIRE LIFT A1 5264 404 SHT 6 and 7 dwg ESTD WT ACTL WT DIMENSIONS SCALE SEE VIEWS DO NOT SCALE REMOVE ALL BURRS amp SHARP EDGES NOTES 1 DIMENSIONS ARE NOMINAL AND MAY VARY DUE
177. MENT EST LA PROPRIETE DE LA SOCIETE C E A ET NE PEUT ETRE REPRODUIT OU COMMUNIQUE SANS AUTORISATION ECRITE Ra1 6 DESIGNATION Eg ICD HS DCU QM1 SRIR MX 5101 000 Arar 2 PDF avec verspn dessaiF neP rntpdfFactory List of changes SPIR MX 5200 000 SAp SPIRE QA 0152 04 Rev F to Rev J Date 14 01 2004 Page 1 1 List of changes Document identification SPIR MX 5200 000 Title of document SPIRE FCU Electronic box mechanical i f drawing Rev F 10 2002 Rev 1 01 2004 Detail of changes Associated RFD ECR if any Change of base plate with cross section view RFD CEA SPIRE FCU n9 Change of hole size for fixing screws to SVM RED CEA SPIRE FCU 10 position z axis for connectors ECR ref SAp SPIRE JF 0151 04 Change of position y axis for bonding stud SAp SPIRE JF 0151 04 Refined values for refined position for we Change of estimated mass I EI Project manager J L Augu res gt 3
178. ND RESPONSIBILITIES 3 1 ONNE nette 3 1 P 3 1 3 1 plo SC MONI mM 3 1 O MO S oom 3 1 92 FE POR IBILTE RR AR A AA 3 3 4 INSTRUMENT DESCRIPTIONN 4 1 TNPTRODUCHIOPEE L u u ua unan masan nan 4 1 52 4 1 AS INSTRUMENT OVERVIEU Y a 4 2 44 HFIARDWAERE DESCRIPTION uu u u anaes 4 3 A5 SOPPVAREIDESCRIPTICON UID Ond indidem 4 4 AO COPIA MODE 4 4 m 4 4 462 Initialise INIT Mode 4 4 LE RC MEME C Wi 4 4 4 6 4 Ready REDY Mode HI Rn Hnh hehehe hee hse nee nee renes nnns 4 5 46 5 Standby STBY Mode Rm Em 4 5 400 4 5 4 6 7 Cooler Recycle CREC Mode a 4 5 S Mon RITTER 4 5 OBSERVING MODES cocco 4 5 JI _ Photometer Observing Modes
179. ND WIRE 128 A Ss Channel 25 O w 612 56 1 Channel 25 PLW El x O y Channel 25gnd shld _ DQ8 AD 48 j Channel 26 12 2 S6 STP G2 Channel 26 10 Channel 26gnd shld Channel 27 Channel 27 Channel 27gnd shld Channel 28 Channel 28 Channel 28gnd shld Channel 29 Channel 29 Channel 29gnd shld DQ8 AD 44 4 O R2 S m ou 9 2 PLW E4 S6 STP G3 S6 STP G4 S6 STP H1 PLW D1 128 A2 gt 9 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas 128 6 DCUJ DCUJIS DCUJI6 Channel 30 68 31 S6 STP H2 Channel 30 r Oo j D8 A2 69 8 S6 STP H3 850121614 8 49 J S6 STP H4 S6 STP I Channel 34 S6 STP I2 PLW C3 45 C j 19 __ 4 A3 C 1 3 44114 3 2 S6 STP I3 56 C 20 x 4 A9 3 22 11 4 S6 STP I4 PLW T2 221 11 414 2 S6 STP J1 PLWES O G Jo j C j 2 __ 4 8 es 6 S6 STP J2 PLW C6 20 j 23 J 4 C C 39 x 31 C 7 S6 STP J3 PLWC8 43 C j C j 24 4 j C 4 x 4 j C B O S6 STP J4 PLWD5 54 C J 25 49 GND WIRED 4 43 J 9 2 S6 STP K1 483
180. NNECTOR PLANE ZR g x 2 2 2 ii A 2 2 1 1 e SECTION B B SECTION c Ed SHOWING INSULATION AND SHOWING INSULATION AND FIXING DETAIL FIXING DETAIL SCALE 5 1 SCALE 5 1 x 84 02 ill Ji 42 3 HARNESS TIE DOWN PARTS BONDED oe ON OUTER SIDE OF EACH JFET NOTES 1 Ad HARNESS SHOWN IN WIREFRAME IN THIS VIEW TO SHOW TIE DOWN PART BOND ITEM 15 TO 4 PRIOR TO ASSEMBLY TO HSFPU V n BOND ITEMS 16 amp 14 TO 3 PRIOR TO ASSEMBLY SL THERMAL STRAP INTERFACE 108 5 I Wi S FEUDVED T PLANE C 2 TO ATTAIN THE CORRECT MOUNTING INTERFACE DIMENSION AND TO COMPENSATE FOR ACTUAL _ B JFET MODULE SIZES THE FOLLOWING PROCEDURE MUST BE FOLLOWED PARTS ARE TO MOUNTED PART 6 MEASURE FROM THE TOP OF PARTS SHOWN AS AER To PCIE a PLANE C TO THE TAIL END FACE OF PARTS 6 NOTING THE TWO VALUES NOP MACHINE RAISED PADS ON PART 7 TO REMOVE VALUE 87 7 PADS ON ITEM 8 WILL ALSO NEED MACHINING IF TRIAL ASSEMBLY OF RACK ON FLAT SURFACE SHOWS GAPS BEFORE i FASTENERS ARE TIGHTENED L3 STRAP 2 x 26 HOLES THRO 4mm STRAP TO SUIT BUSHES SUB ASSEMBLY 13 ITEMS 6 TO BE TORQUED TO 2 1 Nm ABOVE LOCKING INSERT RUNNING TORQUE BLOCK SHOWN IN WIREFRAME TO
181. NT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 40 5 14 EMC 5 14 1 Conducted Emission Susceptibility None to be found under required test conditions 5 14 2 Radiated Emission Susceptibility None to be found under required test conditions 5 14 3 Frequency Plan The Spire frequencies are arranged to minimise noise problems in the bolometer sub system s highly sensitive analogue sections and are provided in the following table p Ead UT Clock 1 gt 2 5 Red 0 5V Differential 85422 Master Clock 10MHz 5V Crystal Oscillator Internal to unt Bolometer Bias 50Hz 300Hz Sine O 100mV Differential Highly sensitive signal 50 300Hz Sine O 500mV Differential Highly sensitive signal MCU Ces Gack 0 Data IF Clock Differential R5422 Mese cek UNE DSP Clock 20MHz Red 5V Mosterclock 2 Internal to LVDTexcitation 2505 Sie 3V Differential 20 DAC change 30kHz 10 gt Rand 10V jlntemdltount Position encoder 2 5 kHz Sine 3 mV Differential 250 Hz at nominal speed Cmd IF Clock 312 kHz Red O 5V Differential R 422 Continuous Data IF Clock 2 5 s C mem eq sy Differential RS422 Master Clock 1OMHz Red 5 Crystal Oscillator
182. P 500 1500pF 0 08uH 1 00E 09 5E 10 0 1 Ground Wire 1 0 5 50 1500pF 0 08 0 0 0 1 412 DDMA50P 16 PSW 17 32 0 08uH 1 00E 09 Ground Wire 0 0 DCU J13 50 16 ch PSW 33 48 1500pF 0 08uH 1 00E 09 Ground Wire 1500pF 0 08uH 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 18 68 8 DCU J8 50 DCU P8 50 S 16 ch PSW 49 64 32 16 STP 500 1500pF 0 08uH 1 00E 09 5E 10 0 1 1 Ground Wire 1 0 5 50 1500pF 0 08 0 0 0 1 DCU J9 50 16 PSW 65 80 0 08uH 1 00E 09 Ground Wire 0 0 DCU J10 50 16 ch PSW 81 96 1500pF 0 08uH 1 00 09 Ground Wire 1500pF 0 08uH 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 19 69 9 DCU 5 50 DCU P5 50 S 16 PMW 97 112 32 16 STP 500 1500pF 0 08uH 1 00E 09 5E 10 0 1 1 Ground Wire 1 0 S 50 1500pF 0 08 0 0 0 1 DCU J6 DDMA 50 P DCU P6 50 S 16 ch PMW 113 128 0 08uH 1 00E 09 Ground Wire 0 0 DCU J7 50 16 ch PMW 129 144 1500pF 0 08uH 1 00 09 Ground Wire 1500pF 0 08uH 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 110 510 10 FCU J11 25 FCU P11 DBMA 25 P Sorption Pump Heater 4 0 TQ 10 2 50E 02 6 25E 03 Aux P Evaporator HS Heater 4 0 TQ 50 1 50E 03 3 75E 04 Sorption Pump HS heater 4 0 TQ 50 1 50E 03 3 75E 04 300mK Thermal Control Heater 4 1 STQ 100 2 00E 03 5 00E 04 Spectrometer S
183. P RAL ECR 052 ref HR SP RAL NCR 034 The sheets that follow show the pinout amp wire name changes compared to the Spire Harness Definition Document version 1 1 that are needed to build the harness They will be issued within HDD version 1 2 Douglas PREPARED BY rified APPROVED BY J DELDERFIELD Digitally signed by Douglas Griffin eee 2003 09 24 11 36 45 Z 2003 09 23 2 mus from HDD 1 1 1 Page 58 60 S4 Corrected assignment of Channel numbers in No hardware column 2 to pixels column 3 implications Nomenclature only pin assignments doc 3 Pages 67 69 S6 Corrected sequence of Pixel names No hardware Nomenclature only m PET he 15 After telecon clarification cennectersinthe HDD 47 1s eppesite te that Pin 11 on the 128 way 6 This i is to be positive and Pin 4 is to be negative as per Astrium EICD Issue 2 6 See pages 25 26 27 and 28 of this document 4 Page 172 11 Polarity error on 128 way SMEC Position Sensor Power Supply and Return 5 Page 118 120 C1 Channel 1 gnd shld should be Channel 14 gnd shld in column 2 row 2 page 119 Page 119 C1 SLW JFETV A2 shld should go to pin 26 not Pins 26 and 6 are both 6 on a busbar and therefore this is an academic correction 131 Reference to D2 04 removed Changed to EADS implementation not as SPIRE intended B2 B4 however the EADS design is compliant with SPIRE requirem
184. P Unit Harness Harness Description Number of Number of Implementation Max Impedance Max Current in A Av Currentin Max Volts Connector Connector Connector Connector Connector Conductors excl inner Shields W C pF Conductor Conductor Label Type Label Type shields C1 CVV 1 HSJFS J5 MDM 25 P HSJFS P5 25 Bolometer signals from JFS SLW 1 12 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Type 3 Anti cross talk ground wires 12 NA 500 1000pF 0 08uH 0 0E 00 0 0E 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFS J6 MDM 25 P HSJFS P6 25S Bolometer signals from JFS SLW 13 24 24 3 DS 12 ax 500 1000 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFS 99 37 HSJFS P9 MDM 37P Bias 2 1 DSTP 200 1000pF 0 08 3 2E 08 8 0E 09 10 PTC Ground wire 1 0 S 50 1000pF 0 08uH 0 0 10 PTC JFET Bias 2 1 DSTP 100 1000 0 08uH 5 0E 03 2 0E 04 10 SLW Bolometer Bias 4 2 DSTP 200 1000 0 08uH 9 6E 08 2 4E 08 10 SLW JFET Bias 4 2 DSTP 100 1000pF 0 08uH 2 5E 03 6 0E 04 10 SLW Ground wire 1 0 S 50 1000 0 08uH 0 0 10 SSW Bolometer Bias 4 2 DSTP 200 1000pF 0 08uH 1 2E 03 4 8E 08 10 SSW JFET Bias 4 2 DSTP 100 1000pF 0 08uH 5 0E 03 1 2E 03 10 SSW Ground Wire 1 0 S 50 1000pF 0 08uH 0 0 10 PTC JFET Heater 2 1 DSTP 200 1000 0 08uH 1 9E 03 4 8E 04 10 SLW JFET Heater 2 1 DSTP 200 1000 0 08uH 3 3E 03 8 3E 04 10 SSW JFE
185. PIRE IID B SPIRE QI821 pump hs HS PUMP CASE 5 PACS off SPIRE off HIFI on MODE SWITCH OFF REFERENCE DATE ISSUE SCI PT IIDB SPIRE 02124 21 06 2004 3 3 PAGE 2 35 QI801 0 0 Photometer JFET QI802 0 0 Spectrometer JFET QI805 0 0 BSM QI806 0 0 SMECm QI807 0 0 PCAL QI808 0 0 SCAL 91817 0 0 PUMP QI818 0 0 SHUNT QI819 0 0 EVAP QI820 0 0 HS QI821 0 0 HS PUMP CASE PACS in Photometer mode SPIRE in Photometer Mode HIFI off MODE SWITCH ON QI801 q jfet phot Photometer JFET QI802 0 0 Spectrometer JFET QI805 peak phot bsm BSM QI806 0 0 SMECm QI807 mean phot calib PCAL QI808 0 0 SCAL QI817 q pump nom PUMP QI818 0 0 SHUNT QI819 0 0 EVAP 91820 0 0 HS EVAP QI821 pump hs HS PUMP Reproduction interdite ALCATEL SPACE Company confidential REFERENCE INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE ISSUE CASE ELSE WRITE Illegal dissipation mode ISWITCH STOP END SELECT SINITIAL Joonan Apply margin factor to internal mechanism dissipation q_ifet_phot fet phot margin fac spec spec margin fac peak phot peak phot calib margin fac mean phot calib mean phot calib margin fac q peak spec calib q peak spec calib margin fac q mean spe
186. PU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSEPU HSFPU HSFPU 70 70 70 70 70 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121400 P 19 121100 P19 121100 19 121100 P19 121100 P49 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121100 P19 121100 19 121100 19 121100 P19 121100 19 121100 P19 121100 19 121100 P19 121100 P19 121100 P19 022 004 005 023 024 030 011 012 031 014 032 015 033 Comment Location Connector Pin New VA V di Doc No HP 2 ASED C 0016 Issue 1 0 Date 21 04 2004 Sheet PAL 2 of 5 ndis p D n nun ua A Pin Allocation List Harness Mem prn eee ae m e a AAA i MA a Mtem NANNY AP HEEB AN NA FAR a r w m u TEEN PA MA Connector 211121 J34 Function UFThr 318 1 SPIRE 5 10 19 24 23 197 011P24 35P Junct Item CVVUCR Location 33 CVV Top CVVUCR Backshell 128 175 1
187. Photometer Parallel When observations are being made with PACS scientifically useful data may be obtainable from the photometer albeit with degraded sensitivity and spatial resolution In this mode a science data packet will be telemetered alongside the standard housekeeping data The chopper and spectrometer mechanisms will be switched off in this mode The feasibility and scientific desirability of this mode is TBD 4 7 4 Real Time Commanding During ground contact it may be necessary to command the instrument in real time and analyse the resultant data on the ground in near real time for instrument testing and debugging purposes n this case the full telemetry bandwidth will be required for the duration of the instrument test in question It is not anticipated that this will occur frequently 4 7 5 Commissioning calibration Mode During the commissioning and performance verification phases of mission operations many housekeeping and other health check parameters will be unknown or poorly defined This mode allows the limits on selected health check parameters to be ignored by whatever real time monitoring systems are place on the spacecraft instrument 4 7 6 FPU operations at Ambient Temperature TBD It is anticipated that functional checks will be possible for mechanisms and housekeeping lines The detectors will not function at ambient temperature Limited verification of the readout electronics may possible 4 7 7 Or
188. Pwr N SMH 280 021BS 38 26 HSFPU 70 121100 P2 028 SPIKE SMEC PosSensPwr N SHD05 SMH 5280 021 5 38 26 Cable 5280 Shd HSFPU 70 121100 29 009 The pin allocations on the seine 128 way connectors SMJ S281 02155 38 27 HSFPU 70 can mac 019 SPIRE match SMJ S281 02155 38 27 HSFPU 70 This matches to the 029 SPIRE SMJ 5281 02155 38 27 Cable 5281 283 285 Shd con HSFPU 70 together B Pin 29 30 31 056 SPIRE SMEC PosPhDi 1FB N S SMK 5282 02155 38 30 HSFPU 70 121100 29 030 055 SPIRE SMEC PosPhDi 1FB N R SMK 5282 02155 38 30 HSFPU TO 121100 P29 031 044 SPIRE SMEC PosPhDi 1FB N SHD09 SMK 5282 02155 38 30 Cable 5282 284 286 Shd con HSFPU 70 121100 29 012 together Pin 44 45 46 042 SPIRE 5 PosPhDi 2 N I SMJ 283 021SS 38 28 HSFPU 70 121100 P29 013 041 SPIRE 5 PosPhDi 2 N l SMJ 283 02155 38 28 HSFPU 70 121100 P29 014 030 SPIRE 5 PosPhDi 2 N SHDO7 SMJ 283 02155 38 28 Cable S281 283 285 Shd con HSFPU 70 121100 P29 032 together B Pin 29 30 31 034 SPIRE SMEC PosPhDi 2FB N S SMK 284 02155 38 31 HSFPU 70 121100 29 033 033 SPIRE SMEC PosPhDi 2FB N R SMK 5284 02155 38 31 HSFPU 70 121100 29 034 045 SPIRE 5 PosPhDi 2FB N 5 10 SMK 5284 02155 38 31 Cable 5282 284 286 Shd con HSFPU 70 121100 29 015 together C Pin 44 45 46 020 SPIRE SMEC PosPhDi 3 N 1 SMJ 5285 02155 38 29 HSFPU 70 121100 29 016 02
189. R 0215 RREY 3 19 11 01 PLANE amp A FRAME MOUNT DIM ADDED SHEET 7 ADDED TRE DRAWING N DRAWN ISSUE DATE AMENDMENT SPIRE Flight ALL DIMENSIONS AT ROOM TEMPERATURE ESTD Wr 29 6 CONT COUPES TiN TER er 9 1 24 11 01 COMPUTER FILE ACTL WT DIMENSIONS IN mm SCALE 1 2 amp 1 1 THERMAL STRAP CONNECTIONS 52641 3005 5 DIE 2 THIRD ANGLE PROJECTION DO SCALE 637 HERSCHE ALL COLD STRAPS ELECTRICALLY ISOLATED FROM HSFPU AT THIS 373 00 oiu ED 298 00 PHOTOMETER SENSOR E CONNECTOR 3 POSITIONS SPECTROMETER SENSOR CONNECTOR 2 POSITIONS JFET HARNESS ZONE a STAY OUT lt 10 ic A h ss JFET HARNESS ZON L STAY OUT 9 5 0 8 T E 172 Ht 5 Em T MI i 9 e N Ww 00 N a x o o ojo o B SS onr 8 HERSCHEL OPTICAL 9 ee IT BENCH HERSCHEL OPTICAL HERSCHEL OPTICAL
190. RAL Oxfordshire Project management and Project Office System and Thermal Engineering AIV and ground calibration facilities ICC Operations Centre stockholm Instrument simulator DRCU Simulator Observatory University of Provision of ICC Operations Staff Padua University of OGSE Fourier Spectrometer Science Support Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 5 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 Phil Parr Burman Lionel Duband CEA Grenoble CEA SAp Jean Louis Augueres Francois Pajot l IFSI Riccardo Cerulli Irelli Reproduction interdite ISSUE Tel 44 131 668 8260 Fax 44 131 668 8382 E mail ppb roe ac uk 33 4 38 78 41 34 Fax 33 4 38 78 51 71 E mail Duband drfmc ceng cea fr Tel 33 1 6908 3058 Fax 33 1 69 08 6577 E mail augueres cea fr Tel 33 1 69 85 8567 Fax 33 1 69 85 8675 E mail Francois Pajot Q ias fr Tel 44 207 594 7552 Fax 44 207 594 3465 E mail t sumner ic ac uk Tel 39 6 4993 4377 Fax 39 6 4993 4383 E mail Cerulli ifsi rm cnr it Tel 1 818 354 8541 Fax 1 818 393 6984 E mail Martin E Herman jpl nasa gov ALCATEL SPACE 3 3 PAGE 3 4 Royal Observatory Blackford Hill Edinburgh EH9 Scotland CEA Grenoble Service des Basses Temperatures 17 av des Martyrs 38054 Grenoble Cedex France
191. SDCU and the HDFCU both have command input buffers that handle the Slow Speed Interface a single command at a time Each interface receives a 312 5KHz clock from the DPU as part of the Slow Speed electrical protocol and this is used to increment DRCU internal counters the values of which are then routinely used in the DRCU to label the science data sent to the DPU Each counter will be reset to zero within usec TBC of the end of the receipt of a counter reset command and then immediately starts incrementing again on the next edge of the 312 5KHz clock It is the responsibility of the SPIRE command timeline to reset the DRCU counters sufficiently frequently that they do not overflow i e at least every 229 minutes Note It has to be ensured that the DPU sends commands to the DRCU sufficiently timespaced that each can be fully obeyed before the next is sent Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 35 SPIRE DATA TIMINGS HSC Take scientists wishes mission profile and generate Time tagged HSC Associate SPIRE data with sequences carried out and Observation Command Packet sequence Build an up to 48 hour detailed timings with file instument state viewed vector HCDMU clock setup S C uplink TEE Herschel Spacecraft HCDMS Receive and store up to 48Hours
192. SN Function UFThr 318 1 SPIRE 5 10 19 21 23 Location 33 CVV I F CB CVVUCR Interface Code Pos Pin Allocation List Harness Grouping Wiring Shd Cable Twist An LLULLU m me m gm pt e on Ch lD Comment ECROO39tbc Connected to Busbar 9 Connected to Busbar ECROO039tbc Connected to Busbar ECRO039tbe Connected to Busbar B ECRO039tbc Connected to Busbar _ ECR0039tbc Connected to Busbar ECROO39tbe Connected to Busbar ECROO39tbc CH isolated from Farady Shds No Overall Shd at junction side wni ii YAT r _ u JJ w BAN Vit Da Connected to Busbar Le EE a IN A uv w Y _ U L a MPa T n I K _ j ah nF sO 2 e e Doc No HP 2 ASED IC 0016 Issue 1 0 Date 21 04 2004 Sheet PAL 5 of 5 U NIAE 197 011P24 35P Junct Backshell 128 175 176 01 Target item Location Connector Pin E DATE TEADAANNE A T BANE Yin ite Sete cu sees arr printed on 24 04 2004 09 02 55 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 6 1 ANNEX 6 SPIRE ESD SA
193. SPIRE ESA DOC 00275 REFERENCE SCI PT IIDB SPIRE 02124 DATE 21 06 2004 v SPACE ISSUE 3 3 PAGE 0 1 Interface Instrument Document Part B SPIRE IID B SPIRE SCI PT IIDB SPIRE 02124 Product Code 112 000 Approved by M Griffin Principal Investigator University of Wales Cardiff Project Manager ESA ESTEC SCI PT Data management Christiane GIACOMETTI Entit Emettrice Alcatel Space Cannes d tentrice de l original Reproduction interdite ALCATEL SPACE Company confidential REFERENCE INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 0 2 TABLE OF CONTENTS TABLE OF CONTENTS AEE 2 LIST OF FIGURES AND IABLES lt i ONES S Ox Ve FERRE E exea PIA 7 DISTRIBUTION LIST u s SEE FEN E Ua E ONE YR 9 DOCUMENT CHANGE RECORD 10 Te INTRODUCTION u svo oe eR GUTEN PS REO a 1 1 2 APPLICABLE REFERENCE DOCUMENTS 2 1 Pike UNG Ee DOCUMENT 2 1 22 A 2 1 M MENS Xe v 2 3 3 KEY PERSONNEL A
194. SSTD Space Product Assurance Form Doc No 1509 006 Rutherford Appleton Issue 2 Rutherford Appleton Issue 2 Laborsiory Mechanical Design Office Date 21 12 2001 Laboialory Mechanical Design Office Date 21 12 2001 Page 6of7 Page 7of7 MODIFICATION SHEET MODIFICATION SHEET DRAWING NUMBER KE 0104 360 DRAWING NUMBER KE 0104 360 DRAWING TITLE 2 JFET RACK INTERFACE DRAWING DRAWING TITLE 2 JFET RACK INTERFACE DRAWING Date 12 Nov 2003 Date 10 Mar 2004 NCR ECR NCR ECR Modification Description Modification Description Harness re routed to show clearance required to access connectors on the rear of the JFETS 1 Note 9 and leaders added indicating 3mm jackscrew length below the mating plane Reference to note 6 added 2 Label added to Part 23836 10209722 JFET to indicate orientation Harness tie down parts added SPIRE Note 8 added concerning the pre fitting of the 4 fasteners prior to the assembly of the 10209750 harness JFET MODULE JPL NOTE 10209750 15 the JPL part number 10209722 15 the JPL ICD drawing number JD wishes to leave the ProE part name as 23836 10209722 SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED KE 2952 KE 2952 C 1 n m9 p 3 C Ci C o 0 KE 0104 360 K PROJECTION Ge lt s THIS DRAWING CONFORMS TO B 5 308
195. SSW 1 52 shid 3 40064 a SSW JFETV2 B pese SSW JFETV2 B ve 111 d SSW JFETV2 B shld 14 30 a SLW HEATER B ve 441 1 j H O SLW HEATER ve 2 SLW_HEATER_B shld x 8 39D a SSW HEATER ve 1 1 SSW HEATER ve 151 3 SSW HEATER B shld x j HD 304 PTC JFET HEATER ve 1 164 j PTC JFET HEATER A ve 1 15 22 JFET HEATER shld 39D Backshell Backshell Backshell Backshell FPU Faraday Shield Link Pins S1 I1 C1 6 15 2 3 3 3 7 35 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas PMW JFETV 2A PMW JFETV PMW JFETV 4 9g i v JFETV 1 PLW Bias 1A PLW JFETV 2A PLW Heater A PMW PLW Biases A JFP P27 PMW Heater 1B SA o9 o 93 28 PMW Bias 1B 2B gt 7 PLW Heater B PMW JFETV1B lt lt 69 39 PLW Bias 1B PMW JFETV3B BSS SN N x SN PLW JFETV 2B PMW JFETV 2B SZ NS PMW JFETV 4B POS PLW JFETV 1B PLW Bias 2B PMW PLW Biases B JFP P28 Redundant Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas Contact Details Name 37 way P25 37 way P27 37 Way P26 37 Way P28 128 Way 3 PSW Bias PMW PLW Bias A PSW Bias B PMW PLW Bias PSW JFETVI A 20 o 2
196. Spectrometer HS FPU Control See Annex 1 15 28 15 0 Unit HS Detector See Annex 1 15 68 15 5 Control Unit HS Digital See Annex 1 7 18 7 0 Processing Unit HS Warm Inter unit WIH layout is described in Annex 8 1 5 1 5 Harness HSFPU includes attached flying leads and any FPU thermal strap supports includes 32 07Kg Nominal and 34 77Kg Allocation for Structure mass elements see Iss 1 4 of as DDR The ICD drawings with all dimensions for all these items are in Annex 1 in SPIRE RAL DWG 001 409 Note Concerning units nominal mass this table takes precedence to any mass value indicated in drawings of Annex 1 Table 5 5 1 SPIRE Units mass amp dimension Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 12 5 6 MECHANICAL INTERFACES Note Electrical and thermal characteristics conferred by these mechanical interfaces are covered in the appropriate sections not here 5 6 1 Inside cryostat The Focal Plane Unit the HSFPU has 3 supporting feet to the Optical Bench The details of this mechanical interface will be such as to allow the unit alignment and alignment stability requirements to be fulfilled The Spire JFET racks will also mechanically interface directly to the Optical Bench 5 6 1 1 Microvibrations Spire s mechanisms SMEC and BSM are sen
197. T 5 FO S C LEVEL 1 STRAP TO SPIRE OPTICAL BENCH ATTACHMENT POINTS ALOCROM 1200 SURFACE SPIRE GROUNDING STRAP ATTACHES ALOCROM 1200 SURFACE EE SHEET 6 FIXING DETAILS 716 28 505 13 IMPORTANT 1 ALL DIMENSIONS AT ROOM TEMPERATURE 2 J FET BOXES NOT SHOWN ON THIS SHEET MINIMUM CLEARANCE BETWEEN ANY PART OF SPIRE FPU AND CRYOSTAT SHIELD TO BE 10mm 8 9MM ACCEPTED AT 2 FPU CORNER ONLY INNER ONLY CRYOSTAT SECTIONED ON SIDE AND END VIEWS APERTURE COVER PLATE REMOVE BEFORE FLIGHT OF INTERFACE FIXINGS CL CRYOSTAT 118 00 SEE SHEET 4 FOR DETAILS OPTICAL REFERENCE CUBE 31 0 51 0 31 0 REMOVE AFTER FINAL LIGNMENT CHECK ON S C NOTE ISO VI EW SCALE RF FILTERS SEE SHEET 6 FOR DETAILS OF CONNECTOR POSITIONS SPIRE AXES DIRECTIONS COINCIDE WITH S C AXES
198. T Heater 2 1 DSTP 200 1000 0 08uH 6 7E 03 1 7E 03 10 Cable Level Shieldst 0 13 gt 80 HSJFS J10 37 HSJFS P10 MDM 37 Bias 2 1 DSTP 200 1000pF 0 08 3 2E 08 8 0E 09 10 PTC Ground wire 1 0 S 50 1000pF 0 08uH 0 0 10 PTC JFET Bias 2 1 DSTP 100 1000 0 08uH 5 0E 03 2 0E 04 10 SLW Bolometer Bias 4 2 DSTP 200 1000 0 08uH 9 6E 08 2 4E 08 10 SLW JFET Bias 4 2 DSTP 100 1000 0 08uH 2 5E 03 6 0E 04 10 SLW Ground wire 1 0 S 50 1000 0 08uH 0 0 10 SSW Bolometer Bias 4 2 DSTP 200 1000pF 0 08uH 1 2E 03 4 8E 08 10 SSW JFET Bias 4 2 DSTP 100 1000 0 08uH 5 0E 03 1 2E 03 10 SSW Ground Wire 1 0 S 50 1000pF 0 08uH 0 0 10 PTC JFET Heater 2 1 DSTP 200 1000pF 0 08uH 1 9E 03 4 8E 04 10 SLW JFET Heater 2 1 DSTP 200 1000pF 0 08uH 3 3E 03 8 3E 04 10 SSW JFET Heater 2 1 DSTP 200 1000 0 08uH 6 7E 03 1 7 03 10 Cable Level Shieldst 0 13 gt 80 2 2 HSJFS J7 MDM 25 P HSJFS P7 25S Bolometer signals from JFS 300 mK 1 3 8 1 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 4 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 4 Cable Level Shieldst 0 1 gt 80 HSJFS J1 MDM 25 P HSJFS P1 25S Bolometer signals from JFS SSW 1 12 24 3 DS 12 ax 500 1000pF 0 08uH 1 0E 09 5 0E 10 0 1 Anti cross talk ground wires 12 NA 500 1000pF 0 08 0 0 00 0 0 00 0 1 Cable Level Shieldst 0 3 gt 80 HSJFS J2 MDM 25 P HSJFS P2 25S Bolometer signals from JFS SSW 13 24 24 3 DS 12 ax 500 100
199. TE PHYSICS 5 LEVEL T STRE SEE CHANGE SHEET FOR DETAILS OF CHANGES NOM M m ss OTHERWISE STATED UNIVERSITY COLLEGE LONDON TRACED 14 23 11 01 CENTRE OF GRAVITY ADDED TO SHT 1 J FET DESIGN MADE FROM ISSUE 16 ONWARDS ST STEEL PARTS LINEAR BPS MULLARD SPACE SCIENCE LABORATORY HOLMBURY SI MARY UPDATED STAY OUT HOLES REMOVED NATURAL DORKING SURREY PBG 4 UPDATED FILTER amp PHOT CONNECTORS ADDED FOCAL ANGULAR 0215 3 19 11 01 PLANE amp A FRAME MOUNT DIM ADDED SHEET 7 ADDED TITLE DRAWING No DRAWN ISSUE DATE AMENDMENT RRE m ESD Wine ER SEIRE SUPE Mid AJC 1 24 11 01 COMPUTER FILE ACTL WT DIMENSIONS IN mm SCALE PACS AND HIFI OPTICAL amp CLEARANCES SSTD Space Product Assurance Form DocNo 1509 006 SSTD Space Product Assurance Form Doc No 1509 FORM MECH 006 Rutherford Appleton Isue 2 Rutherford Appleton Issue 2 Laboratory Mechanical Design Office Date 21 12 2001 Laboratory Mechanical Design Office Date 21 12 2001 Page 4of7 Page 50f7 Date 13 Oct 2003 Date 20 May 2003 NCR ECR NCR ECR Modification Description Modification Description 1 Reflects new thermal standoff design with additional bush and upper and lower feet washers Added note to size of tapped holes for attachment of cooling strap L 1 2
200. TO MANUFACTURING TOLERANCES 1020 RE 00 1512 226 VIEW SCALE 29 72 56 DEPARTMENT OF SPACE AND CLIMATE PHYSICS UNIVERSITY COLLEGE LONDON PROTECTIVE FINISH MATERIAL amp SPEC TOLERANCES UNLESS OTHERWISE STATED MULLARD SPACE SCIENCE LABORATORY HOLMBURY ST MARY DORKING SURREY LINEAR 0 10 ANGULAR 0715 TITLE REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 1 ANNEX 2 SPIRE REDUCED SPIRE Reduced TMM Issue 2 5 The SPIRE reduced TMM Issue 2 5 diagram is given by the figure here under EE n S Isolating Support mE Jt Situ EN Structure Strap 537 SPIRE Links HERSCHEL Links Ts SEE HERSCHEL Optical Bench 376 378 379 380 381 Figure 1 SPIRE ITMM OVERVIEW The SPIRE reduced TMM Issue 2 5 is given by the pages here after Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 2 SPIRE Interface Thermal Model Filename spirntrm25 d Author AS Goizel Email a goizel rl ac uk Issue 2 5 Created 02 02 2004 Esatan Version 8 7 3k o Gk o Gk o Gk o Gk G
201. Tmp N V TT STA 256 04155 38 16 HSFPU 70 121100 P23 028 122 SPIRE OpiSubbenchTmp N V MN STA 5256 04155 38 16 HSFPU 70 121100 23 029 115 SPIRE OptSubbenchTmp N 1 Ne STA 5256 04155 38 16 HSFPU 70 121100 P23 010 105 SPIRE OptSubbenchTmp N STA 256 04155 38 16 Cable 253 to 5258 Shd con HSFPU 70 121100 P23 027 together 097 SPIRE FPUInpBaffleTmp N 1 STA 5257 04188 38 17 HSFPU 70 121100 P23 030 nnd TT Filter fSlCodel LIKE 211121 And SConl LIKE 934 And ConWiredl 1 asr aytma m AYR I u a printed on 24 04 2004 09 02 54 t M p r si g kau Y i aan 4 4RR ANAM dom enn Ne Ve WW Vig pr o Doc No HP 2 ASED IC 0016 Fin Allocation List issue 1 0 Date 21 04 2004 Project HERSCHEL Harness Sheet 4 of 5 Connector 211121 J34 Function UFThr 318 1 SPIRE 5 10 19 21 23 Conn Type 197 011P24 35P Junct Item CVVUCR Location 33 CVV CB CVVUCR Backshell 128 175 176 01 0A EMC Category 2C Sig H in Cryostat interface Code Grouping Signa Designation f Circuit Signal Pos Ch ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New 086 SPIRE FPUI
202. U 17 122200 P17 014 030 SPIRE SMEC PosPhDi 2 N SHDO7 SMJ S 5283 021 28 28 Cable 5283 Shd HSFCU 17 122200 P17 032 034 SPIRE SMEC PosPhDi 2FB N S SMK S 5284 021 28 31 HSFCU 17 122200 P17 033 033 SPIRE SMEC PosPhDi 2FB N R SMK S 5284 021 28 31 HSFCU 17 122200 P17 034 045 SPIRE SMEC PosPhDi 2FB N SHD10 SMK S 5284 021 28 31 Cable 5284 Shd HSFCU 17 122200 P17 015 020 SPIRE SMEC PosPhDi 3 N 1 SMJ S 5285 021 28 29 HSFCU 17 122200 P17 016 021 SPIRE 5 PosPhDi 3 N l SMJ S 5285 021 28 29 HSFCU 17 122200 P17 017 031 SPIRE SMEC PosPhDi 3 N SHD08 SMJ S 5285 021 28 29 Cable 5285 Shd HSFCU 17 122200 P17 035 Filter SICodel LIKE 312300 And SConl LIKE 04 And ConWired 1 printed on 18 09 2003 12 53 03 Astrium GmbH Pin Allocation List Doc No HP 2 ASED IC 0001 Issue 2 6 Date 20 09 2003 Project Harness HERSCHEL Sheet PAL 5 of 7 Connector 211121 J30 Function UFThr 283 0 SPIRE XS 11 FPU 25 27 29 Conn Type 197 011P24 35P Junct Item CVVUCR Location 33 CVV CB CVVUCR Backshell HERSKT 58 0050 EMC Category 2C Sig H in Cryostat Interface Code Grouping Pin Signal Designation Circuit Signal Pos ID Wiring Shd Cable Twist Comment Target Item Location Connector Pin New SPIRE SMEC PosSensPwr N S SMH 5280 021 5 38 26 HSFPU 70 121100 29 027 004 SPIRE SMEC PosSens
203. U1 5 00D 06 0 0500 shunt strap CNDFNC 3 K_KEV29 16 6 6050 08 0 031D0 evap conducted CNDFNC 3 K_KEV29 16 1 9630 07 0 037D0 pump conducted CNDFNC 3 K_TI6AL4V 2 2305D 06 0 0500 evap heat switch HS EVAP GAS heat switch He cond 0 1DO 0 6619D 03 HS radiation parasitic CNDFNC 3 K_TI6AL4V 1 16D 05 0 02700 evap heat switch Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART SPIRE IID B SPIRE ISSUE 3 3 PAGE A2 10 821 817 CNDFNC S3 K TIGALAV 2 2305D 06 0 0500 pump heat switch conducted parasitic 821 817 HS PUMP GAS pump heat switch cond 821 817 0 100 0 66190 03 pump HS radiation parasitic 821 803 CNDFNC S3 K TIGALAV 1 160 05 0 027D0 pump heat switch support from L1 SPIRE Level Straps Architecture e e Main Strap Bottom Flex 814 811 1 1 1 48760 3410 1 0 3800 340 Cu SPIRE LO enclosure strap 815 812 1 1 1 16130 340 Cu 1 0 390D 3 LO Cu 4 SPIRE LO pump strap 816 813 1J 1 0 7347D 3 LO Cu 1 0 332D 3 LO Cu SPIRE LO evap strap SPIRE Internal LO Flexible Straps IF Adaptor Bolted IF elec iso GL 811 810 1 1 0 24 1 1 998D 3 LO_Cu 1 0 375D 3410 1 4 0 4 1 4 4 5 3 4 0 025 10 enclosure
204. W JFET Heater 2 0 08uH 3 33E 03 8 33E 04 SSW JFET Heater 2 0 08uH 6 67E 03 1 67E 03 DCU J32 DCMA 37S DCU P32 DCMA 37 P PTC Bias 2 1500pF 0 08uH 3 20 08 8 00 09 Ground wire 0 1500pF 0 08uUH 0 0 PTC JFET Bias 2 1500pF 0 08 5 00E 03 2 00E 04 SLW Bolometer Bias 4 1500pF 0 08uH 9 60E 08 2 40E 08 SLW JFET Bias 4 1500pF 0 08uH 2 50E 03 6 00E 04 SLW Ground wire 0 1500pF 0 08 0 0 SSW Bolometer Bias 4 1500pF 0 08uH 1 20E 03 4 80E 08 SSW JFET Bias 4 1500pF 0 08uH 5 00E 03 1 20E 03 SSW Ground Wire 0 1500pF 0 08 0 0 PTC JFET Heater 2 1500pF 0 08 1 92E 03 4 81E 04 SLW JFET Heater 2 1500pF 0 08 3 33E 03 8 33E 04 SSW JFET Heater 2 1500 0 08uH 6 67E 03 1 67E 03 hield joined to all backshe Overshield 80 0 01uH 12 52 2 DCU 023 7 DCU P23 DCMA 37 S Bolometer signals from JFS SSW 1 12 24 12 STP 500 1500pF 0 08 1 00E 09 5 00E 10 0 1 DCU J24 DCMA37 P DCU P24 DCMA 37 S Bolometer signals from JFS SSW 13 24 24 12 STP 5 00E 10 SSW Ground Wire 0 Single 0 0 0 0 DCUJ25 DCU J26 DCMA37 P Bolometer signals from JFS SSW 37 42 6 STP 1500pF 0 08uH 1 00E 09 5 00E 10 SSW Ground Wire 0 Single 50 1500pF 0 08uUH 0 0 0 0 Shield joined to all backshells HF Overshield gt 80 0 01uH I3 S3 CVV 3 DCU J29 DDMA 78S DCU P29 DDMA 78 P PSW JFET Bias 12 12 STP 100 1500pF 0 08uH 5 00E 03 1 20E 03 10 Tvpe2 PSW Ground 1 0 5 50 1500pF 0 08uUH 0 0 10 PSW Bolometer Bias 6 6 STP 100 1500pF 0 08uH 3 84E 07 9 60E
205. al planes shown by dashed blue lines the categories between each line being labelled along the top This diagram is for information only and shall not represent any requirement on the spacecraft Note that to be precise electrical interfaces are at the connector planes 5 2 1 MECHANICAL COORDINATE SYSTEM The unit specific x y z origin definitions are shown in the External Configuration Drawings see section 5 4 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 5 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 5 3 X 3 e HERSCHEL SPIRE HS IEGSE HERSCHEL SPIRE HS TS 4 emperature Sensors P on thermal ue 4 I I de HSFPU 1 2 it Tempers igno BP an herus 1 1 HERSCHEL OPTICAL Redundant 1 i B t E T was Tanet D i i A 1 1 a 1 aJ m i 19 active Pixels 2 dark pixels iar IM LWBDA ta SM Ole um Wiz 9 i KARTS 3 s TT NTD Bolometers for temp I lt HSPTC Ix d 1 y L Sorption Cooler 2222
206. amp 1 2 11 0 300 0 04549902700 0 3500 0 05423604D0 0 400 0 06314948300 0 4500 0 07222010200 0 500 0 08143268600 5 000 0 400 6 000 0 500 10 000 0 800 15 000 1 000 50 000 1 000 300 000 1 000 IF 2 11 0 300 0 025800 0 3500 0 030256894D0 0 400 0 03565541100 0 4500 0 04121141D0 0 500 0 04691117400 5 000 0 400 6 000 0 500 10 000 0 800 15 000 1 000 50 000 1 000 300 000 1 000 K CuCu_IF 2 14 0 000 0 000 1 000 0 0800 2 000 0 1600 3 000 0 2400 Reproduction interdite ALCATEL SPACE REFERENCE DATE 21 06 2004 ISSUE 3 3 Company confidential SCI PT IIDB SPIRE 02 124 PAGE 2 29 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 30 4 0DO 0 3200 5 000 0 4000 000 0 4800 7 000 0 5600 8 000 0 6400 9 000 0 7200 10 000 0 800 15 000 1 000 50 000 1 000 300 000 1 000 K Cu Sty Cu IF 2 5 0 300 0 00205171200 0 3500 0 00291978500 0 400 0 00396358900 0 4500 0 00519005100 0 500 0 00660550400 Cu E Cu 2 3 1 500 0 004500 2 000 0 005500 4 000 0 00900 TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TEE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE
207. and J30 just because J17 and J39 are swapped Blue signifies connectors fitted but without redundant side electronics behind them MATIERE Alu 2017 PROTECTION CEA SAP TRAITEMENT DESSINE SREE 91191 GIF YVETTE Cedex ALODINE 1200 08 09 03 VERIFIE VISA CE DOCUMENT EST L PROPRIETE DE L SOCIETE ET NE PEUT ETRE REPRODUIT OU COMMUNIQUE SANS AUTORISATION ECRITE oe eee DESIGNATION ICD HS FCU QM1 SPIR MX 5201 000 PDF avec verspn dessaiF nePrntpdfFactory http UCL MSSL Drawing A1 5264 300 Change List ISSUE 19 SHEET MODIFICATION All Sheets Level 0 Cold Straps and relevant Dimensions updated All Sheets JFETS and relevant dimensions updated Torques for Level 0 straps deleted note TORQUE AS SPECIFIED BY ASTRIUM added 7 SSUE 18 SHEET All Sheets All Sheets SHEET MODIFICATION Mass properties updated to the latest sub system estimates measured masses No mass received for the harnesses guess in the model No weighed masses for Busbar Supports Light traps SCAL Cardiff SMEC LAM and SOB Harness Photo BDA Spectro BDA Techdata Notes Work in Progress referring to BDA connector panels deleted Note WRT Aperture cover added Notes WRT surface finish at LO and L1 interfaces added Aperture cover added BDA connector
208. ane u Do ERU EDO POUR E 5 19 0 9 OQPUCAL zd dir 5 20 M d M M M I 5 20 of MER 5 21 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 0 4 POWER inside He t t a ak E NEA RA BR AEN RR EE ARA REA A A A RA REM TuS ta 5 21 5 92 Poweroutsidedhe 5 21 HOW EI 5 21 5 94 iPoWero ndiancePaylodd Modu eI e G He in Hii t E Q e I ih 5 22 5 9 5 Power versus Instrument Operating 2 1 000601 006000000000 5 22 324 0 SUPPI vVollagesSu u L L u L u u L A b EON ES LOS ih NM eh 5 22 EGG ontan bush luu pa su 5 22 990 2 Power Nominal 2 uu u ua bebe 5 23 oll de u u T nt 5 24 9 9 O24 DEL Tault conadillofiSs 5 24 592772 Keep Alive u Q 5 26 5 10 CONNECTORS HARNESS GROUNDING BONDING
209. as it leaves the HSFPU The spectrometer s almost circular used beams are the farther from HERSCHEL field centre and lie to the side of the semi rectangular beams of the photometer FOV switching is not used within SPIRE to boresight the photometer and the spectrometer both are illuminated simultaneously by the HERSCHEL telescope Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 21 5 9 POWER The thermal design and thermal model is still under evaluation at system level with industry and ESA project The values given in 5 9 1 reflect the current known status 5 9 1 Power inside the cryostat The SPIRE components which dissipate power inside the cryostat are described in the Table below It should be noted that the individual component dissipations vary according to the operational mode of the instrument as described in section 5 9 5 Component SMEC Photometry 0 Recycling is special case see section 5 7 and Annex 4 Table 5 9 1 Power dissipation inside cryostat Note dissipation values of this table are for information only refer to SPIRE RTMM in Annex 2 of present 5 9 2 Power outside the Cryostat NA 5 9 3 Power on the SVM The following table shows the heat dissipation in Watts of the warm electronic units mounted on the SVM Note that the power pa
210. at will be followed in constructing the instrument AIV programme 9 2 The instrument will be fully tested in compliance with the satellite level AIV plans as set out in the IID part A and reference documents therein The AIV flow will be designed to allow the experience gained on each model to be fed into both the design and construction of the next model and into the AIV procedures to be followed for the next model A cold test facility to house the instrument will be constructed that will represent as nearly as possible the conditions and interfaces within the Herschel cryostat The instrument Quick Look Facility and commanding environment will be the same or accurately simulate the in flight environment to facilitate the re use of test command scripts and data analysis tools during in flight operations The EGSE and instrument Quick Look Facility will interface to HCSS Personnel from the ICC will be used to conduct the instrument functional checkout to allow an early experience of the instrument operations and to facilitate the transfer of expertise from the ground test team to the in flight operations team A more detailed description of the system level AIV sequence is given in reference document RDA This document will form the basis of the Herschel SPIRE Instrument Test Plan which will provide the baseline instrument test plans and detailed procedures and will be submitted to ESA for approval Detailed procedures for the sub syste
211. c calib q mean spec calib margin fac hold spec calib hold spec calib margin fac peak phot bsm peak phot bsm margin fac mean phot bsm mean phot bsm margin fac peak phot 2 peak phot bsm2 margin fac q mean phot bsm2 mean phot bsm2 margin fac peak spec mech peak spec mech margin fac mean spec mech q mean spec mech margin fac SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 Reproduction interdite ALCATEL SPACE Company confidential PAGE 2 36 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 37 min spec mech q min spec mech margin fac q evap hs q evap hs margin fac q pump hs q pump hs margin fac q pump avr q pump avr margin fac q evap avr q evap avr margin fac evap hs avr hs avr margin fac pump hs avr pump hs avr margin fac pcal margin fac q bsm q bsm margin fac q smecm q smecm margin fac q scal margin fac q pifet avr avr margin fac avr avr margin fac 1 kw GLs defined here because of PC ESATAN restrictions for long lines in CONDUCTORS 822 819 1 0DO 1 000 CNDFN3 T822 T819 K HPCUT1 0 003 0 003 0 10D0 amp 1 0D0 CNDFN3 T822 T819 K HPCUT 0 0132 0 003
212. ch will be refined after vibration tests on the SM and CQM models The FPU will be verified by a combination of analysis and test Vibration testing will be carried out on the structural model SM at ambient temperature at RAL and on the cryogenic temperature in the dedicated facility at CSL The PFM FPU will also be subjected to a cold vibration test Test levels will be agreed between the SPIRE project and ESA before the test Warm electronics boxes will be vibrated at ambient temperature only as specified in AD 1 IIDA 9 4 Thermal Verification FPU An extensive programme of thermal analysis will be performed at FPU level and combined with the Herschel cryostat model The thermal design will be validated by testing in a purpose built test cryostat at RAL This facility will be able to simulate an environment close to that of the spacecraft in orbit Warm units These will be subjected to a traditional thermal vacuum test programme using qualification temperatures on the qualification models and acceptance temperatures on the flight models as specified in AD 1 IIDA 9 5 Verification of Scientific Performance Extensive testing and calibration will be carried out in the test facility Each model will be subjected to a set of tests as described in that model test specification This will result in all criteria as specified in the RD2 being verified Full calibration as described in RD26 Calibration Requirements
213. chops and also executes a seven point map around the nominal position Nodding is optional 4 7 1 2 Observation Jiggle Map POF3 n point jiggle map This mode is designed for mapping of extended sources It is similar to POF2 except that the nominal value of n is 64 rather than 7 It produces a fully sampled map of a 4 x 4 arcminute area POFA Raster map This is the same as POF3 except that maps of large regions can be built up by using the telescope rastering capability 4 7 1 3 Observation Scan Map POF5 Scan map without chopping This mode is used for mapping areas much larger than the SPIRE field of view The SPIRE BSM is inactive and the spacecraft is scanned continuously across the sky to modulate the detector signals POF6 Scan map with chopping This mode is the same as POF5 except that the SPIRE BSM implements chopping It allows for the possibility of excess 1 f noise by permitting signal modulation at frequencies higher that POF5 4 7 1 4 Others POF7 Photometer peak up TBD This mode allows the necessary pointing offsets be determined in order to allow implementation of rather than POF2 The observation itself is the same as POF3 On completion the SPIRE DPU computes the offsets between the telescope pointed position and the source peak emission and sends this information to the spacecraft which can then implement the necessary pointing corrections POF8 Operate photometer calibrator The SPIRE
214. combines high efficiency with spatially separated input ports One input port covers a 2 6 arcminute diameter field of view on the sky and the other is fed by an on board calibration source which serves to null the thermal background from the telescope and to provide absolute calibration Two bolometer arrays are located at the output ports one covering 200 300 um and the other 300 670 The FTS will be operated in continuous scan mode with the path difference between the two arms of the interferometer being changed by a constant speed mirror drive mechanism The spectral resolution as determined by the maximum optical path difference will be adjustable between 0 04 and 2 corresponding to 1000 20 at 250 um wavelength The focal plane unit has three separate temperature stages at nominal temperatures of 4 K 2 K provided by the Herschel cryostat and 300 mK provided by SPIRE s internal cooler The main 4 structural element of the FPU is an optical bench panel which is supported from the cryostat optical bench by stainless steel blade mounts The photometer and spectrometer are located on either side of this panel The majority of the optics are at 4 but the detector arrays and final optics are contained within 2 K enclosures The refrigerator cools all of the five detector arrays to 0 3 K Two JFET preamplifier modules one for the photometer an one for the FTS are attached to the optical bench close to the 4 K encl
215. connector Ww ena e a Sorption Pump Heater ox Q mr gt e 6 I Sorption Pump Sw Heater i Fn AW Y U H Evaporator Sw Heater ce 32 pins sional shield perge 1 hamess shield at 128 way ose Last printed 05 03 2003 16 43 Cryogenic C iO Harness Aaner 4 2 Doc SPIRE RAL PRJ 000608 SPIRE HARNESS DEFINITION Issue 1 1 DOCUMENT Date 05 03 03 Page 159 of 228 Cooler FPU P19 240 bi victual Contacte green pernts Spect Stim FPU P21 Signal Supply Pin Signal Return Pin Signal Ground Pin FPU Faraday Shield Link Pin No Connection eoo oO i Harness Tails Connector Chassis isolated from FPU Faraday Shield oman Faraday Shield i e Harness overshield isolated from S C structure Ground Plane Interconnection furth er jakrconanechons gt e fhe ia hj v f on eee Signaal grodud pias are Last printed 05 03 2003 16 43 Cryogenic C10 Harness 159 n iaa aai LLL RII mmm iwa e m mm mem w Doc No HP 2 ASED IC 0016 Issue 1 0 Date 21 04 2004 Sheet PAL 1 of 5 s Save Conn Type 19
216. cope with the 2 hour recycling heat mode This is in many respects is more demanding than the 46hour hold time During the first phase of recycling i e condensation the evaporator heat switch is closed and the pump s switch opened The evaporator strap needs extremely low thermal impedance and 800W heat switch sieve power is baselined The cooler s sorption pump is heated to 40 45K and a lower power is then used to keep it hot Condensation occurs in the evaporator Almost all the cooler s charge needs to be condensed so Spire can meet the hold time for its subsequent 46 hours at 300mK The temperature of the evaporator itself at the end of condensation is critical This is a parameter internal to Spire even being internal to one of its subsystems and it needs to be lt 2K for the last few minutes of this phase We may need to apply 1 mW to the evaporator s heat switch sieve the end of the condensation phase to help to achieve this lt 2 During this condensation phase the shunt has to extract nearly all the heat from the hot gas travelling from the pump to the evaporator it should typically stay below 6K More than gt 80 of the enthalpy of the hot gas should be thus removed throughout the condensation phase The overall shunt strap actually needs a tuned conductance because during the condensation phase its temperature needs go and stay above Tevap to avoid condensing on it instead of in the evaporator At the end of the conden
217. ction Sine Vibration check amp top up Preparation Alignment p ps check Launch IST 2 Conversion Acoustic Autonomy S S IST SFPT to He Noise Alignment SFT cold Mechanical properties Delivery to Prime check mass only at ESTEC Making SPIRE ESD Safe Draft 0 2 for comment Page 5 5 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG 3 ESD Protected Instrument Configurations Instrument Location State of Instrument ESD Protection Details Configuration Config 1 JFET modules as delivered and not integrated into JFET SPIRE racks ue Of JFET Module SPIRE safeing plugs used to protect gates of JFETs SPIRE safeing plugs Type ll used to protect drain and sources of JFETs Comments The outputs of the JFETs are left open JAA JBB JAA and a discharge to these could damage the devices Making SPIRE ESD Safe Draft 0 2 for comment Page 6 6 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Instrument Location State of Instrument ESD Protection Details Configuration Config 2 JFET Modules integrated into JFET racks SPIRE 1 JFET Backharnesses installed No external harness connected to JFETS JFET Backharness Module Module Module Module SPIRE Type IlI SPIRE safeing plugs used to protect gates of JFETs SPIRE safeing plugs Type
218. d Table 5 11 1 Housekeeping and science data rates Sections 5 11 1 1 text changed and added values in table text and notes changed as Comments on 3 3 draft E Sawyer 13 7 04 Section 5 11 1 2 TBC is removed after 200 kbps Section 5 11 1 3 100kbps is replaced the maximum packet generation rate and TBC is removed after once per second as Comments on IID B 3 3 draft E Sawyer 13 7 04 Section 5 11 3 req 0190 changed text added and figure changed amp named Figure 5 11 1 SPIRE CR 72v2 Section 5 12 2 after 1 5 arcsec r m s TBC is changed by goal Section 5 12 3 after 0 1 second TBC is changed by TBC to be relaxed Section 5 13 3 full new section req 0240 deleted req 0250 amp 0260 changed E Sawyer input 85 9 6 2 amp 85 13 3 5 11 06 04 Section 5 13 5 full new section E Sawyer input 85 9 6 2 amp 5 13 3 to 5 11 06 04 Section 5 14 3 table named Table 5 14 1 SPIRE Frequency Plan Section 5 15 1 full new section E Sawyer input 85 15 11 06 04 Section 5 15 1 1 full new section E Sawyer input 85 15 11 06 04 Section 5 15 1 2 Above 50 K changed by 100K and TBC removed Below 100 K req added 50 mBar hour TBC changed by 50 mBar min last sentence As a goal 100 mbar h is deleted E Sawyer input 85 15 11 06 04 Section 5 15 1 3 partially new section E Sawyer input 85 15 11 06 04 Section 5 15 1 4 TBW replaced by RD 23
219. da 815 Cooler Evaporator strap node 816 L1 SPIRE store iwo hode BOO SPIRE 12 Optical bench FPU legs SPIRE L3 HSJFP HSJFS Table 5 7 2 SPIRE FPU Non operqting temperqtures 5 7 2 Outside the Cryostat NA 5 7 3 On the SVM The table below shows the required operating temperatures at the interface of the instrument unit with a mounting platform or parts thereof BN S a NE NN 50 15 50 Table 5 7 3 SPIRE WU temperatures Acceptance temperature range is from 5 C below min to 5 C above max operating temp A Qualification temperature range is from 10 C below min to 10 C above max operating temp During nominal operation in flight the SVM units will not move at more than 3K hour 5 7 4 On the Planck Payload Module NA Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 18 5 7 5 Temperature channels 9 7 5 1 Instrument Temperature Sensors For information the table below shows the measurement of instrument cryogenic temperatures These data are available in DPU science packets unless otherwise indicated via whichever is powered of the prime and redundant sides of the Spire electronics They may also be included in some housekeeping packets Each Prime Redundant
220. dite ALCATEL SPACE Company confidential
221. e 2 Evaporator temperature vs total load Load microWatt 28 26 24 22 20 18 16 14 12 10 2 5 3 9 4 5 5 5 5 6 L1 Temperature Kelvin Figure 3 Cooler parasitic loads vs level 1 temperature Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A4 3 The baseline parasitic of 280mK shown in figure 2 of 12microwatts for L1 2K is indirectly derived but the data plotted in figure 3 are the shifts needed to superimpose the curves at different L1 in 2a They suggest a stronger dependence of cooler parasitics on L1 temperature than is often assumed Contributions to the cooler s internal evaporator parasitics are heat switch off state leakage to LO tube conduction to the thermal shunt wiring conduction and Kevlar suspension leakage to L1 presuming the lack of unwanted effects inside the cooler For details see Annex 3 In the 46hr operating observing mode only the sorption pump sieve heat switch heater is on The following confirms a sieve switch over temperature of 12 13K 70 60 50 40 Thermal interface 4 2 K 30 25 mW applied on switch hot side Switch hot side temperature 10 12 14 16 18 20 Miniature sorption pump Figure 4 Heat switch switching te
222. e removed RD 7 added E Sawyer input 04 06 04 Section 1 full new section E Sawyer input 04 06 04 Section6 2 full reduced new section previous description is deleted E Sawyer input 04 06 04 Section 7 Note deleted Section 7 1 1 full reduced new section E Sawyer input 04 06 04 Section 7 1 3 full reduced new section E Sawyer input 04 06 04 see RD 28 added Section 7 1 4 full new section E Sawyer input 04 06 04 Section 7 2 1 new title full reduced new section with all tables 7 2 1 deleted E Sawyer input 04 06 04 Section 7 2 2 partially new section E Sawyer input 04 06 04 Section 7 2 3 only ref to RD 24 E Sawyer input 04 06 04 Section 7 2 4 added new section 7 2 4 EQM and tests list with new table 7 2 1 Section 9 1 First sentence Further details can be found in RD25 SPIRE Instrument Qualification Requirements is added E Sawyer input 04 06 04 Section 9 2 partially new section E Sawyer input 04 06 04 Section 9 3 full new section E Sawyer input 04 06 04 but with added text Section 9 4 full new section E Sawyer input 04 06 04 Section 9 5 full new section E Sawyer input 04 06 04 Section 9 6 full new section E Sawyer input 04 06 04 Section 9 7 full new section E Sawyer input 04 06 04 Section 9 8 added new section 9 8 with new Table 9 8 1 SPIRE Verification matrix
223. e the data that these produce Control and monitor the instrument mechanisms and internal calibration sources Carry out pre defined observing sequences Implement pre defined procedures on detection of instrument anomalies The on board software OBS will be written in C language and will be designed to allow the instrument to operate an autonomous fashion for 48 hours as required in the basic implication of this requirement is that there must be the facility to store enough commands for a 48 observing programme and enough mass memory on the satellite to store 48 hours of instrument telemetry More sophisticated autonomy functions may include the on board analysis of scientific or housekeeping data and the ability to react on the basis of that analysis The type of automatic operation undertaken following such an analysis may range from the raising of a warning flag to the switching over to a redundant sub system or the switching off of a defective sub system All autonomy functions will require extensive evaluation and test before they are implemented to avoid the possibility of instrument failure No instrument autonomy mode will be implemented that will affect the satellite operation Commands defined in RD5 and conforming to AD5 will be sent via a HERSCHEL 1553 bus to the active HSDPU The Spire OBS in the HSDPU will verify and then interpret these commands Many will result in a sequence of internal digital commands
224. ed Table 5 9 2 Power dissipation on the SVM and When operating in spectrometry losses in the HSFCU are TBD is removed under table Section 5 9 3 under table note added This table takes precedence to any power dissipation value indicated in drawings of Annex 1 Section 5 9 5 table named Table 5 9 3 Power status versus instrument modes Section 5 9 6 1 table named Table 5 9 4 Power load on main bus and note added SPIRE to update the tables Section 5 9 6 2 full new section E Sawyer input 85 9 6 2 amp 65 13 3 5 11 06 04 Section 5 9 6 4 1 figure named Figure 5 9 1 HSDPU Power Input Circuit Configuration and added Note Power Input Circuit Configuration is given for information only Section 5 9 6 4 2 full new section text and figure 5 9 2 SPIRE CR 74v1 and added Note Power Input Circuit Configuration is given for information only Section 5 10 after last sentence All relevant details of the termination connectors given in Annex Making SPIRE ESD Safe SPIRE RAL NOT 002028 is added Section 5 10 1 issue and date after HDD 1 1 Delta ref SPIRE RAL NOT 001819 are deleted Section 5 10 4 2 figure named Figure 5 10 4 DPU s 1553B interface to the Herschel S C Section 5 10 4 2 full section and all requirements deleted no more Master Clock SPIRE CR 72v2 Section 5 10 4 3 text added and changed as Comments on IID B 3 3 draft E Sawyer 13 7 04 Section 5 11 1 1 table name
225. eed changes published in Minutes According to changes by SPIRE CR amp all comments amp changes as here under and minutes of IF amp P 23 09 2003 Not signed issue IDB Meetings H P ASP MN 3513 and H P ASP MN 3668 According to comments amp changes H P ASP Man MN 3923 HP ASE MN 396 New Issue for ESA According ASP CCB 41 CCB Not signed issue New Issue tor PLM CDR version According ESA CCB SCI PT MM 024070 Signed issue According ESA CCB SCI PT MM 024070 several SPIRE IIDB 3 3 inputs H P MN 5081 and Sections amp pages as here under CDR version New Issue for System Issue 3 3 changes versus issue 3 2 This Section 0 General in all sections 1 to 10 All figures and tables previously with no name and number are named and some tables and figures have new numbers Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 0 11 notes or comment asking for update highlighted in yellow when still not fixed Changes in pages format and number but not highlighted Changes versus issue 3 2 are only highlighted coloured text and or change bar Section 2 2 RD 22 to 27 added input ESawyer 4 6 04 Section 2 2 added RD 28 SPIRE Warm electronic integration plan SPIRERAL DOC 001132 Issue 0
226. emp 1 T SCA 5243 04159 38 10 HSFPU 70 121100 P21 007 092 SPIRE Spectr2 Temp V SCA 5243 04155 38 10 HSFPU 70 121100 P21 008 081 SPIRE Spectr2 Temp V 7 SCA 5243 04155 38 10 HSFPU 70 121100 P21 026 SPIRE Spectr2 Temp l SCA S243 041SS 38 40 HSFPU 70 121100 P21 027 093 SPIRE Spectr2 Temp SHD02 SCA 5243 04155 38 10 Cable 5242 to 5244 Shd con HSFPU 70 121100 P21 009 together 114 SPIRE SpStimFlanTemp N me SCA S244 04155 38 11 HSFPU 70 121100 P21 010 113 SPIRE SpStimFlanTemp N V SCA S244 04155 38 11 HSFPU 70 121100 P21 011 103 SPIRE SpStimFlanTemp N V TT SCA S244 04155 38 11 HSFPU 70 121100 P21 028 104 SPIRE SpStimFlanTemp N I SCA 5244 04155 38 11 HSFPU 70 121100 P21 029 102 SPIRE SpStimFlanTemp N SHDO3 SCA 5244 04155 38 11 Cable 5242 to 8244 Shd con HSFPU 70 121100 P21 030 together O35 SPIRE Spectr496Heater de SCB 245 040B0 30 HSFPU 70 121100 P21 014 024 SPIRE Spectr4 c Heater 1 8 anni SCB 245 040B0 30 HSFPU 70 121100 P21 015 034 SPIRE Spectr4 o Heater po SCB 245 040B0 30 HSFPU 70 121100 P21 033 HIE IY EVIE A a u ww RTT Fitter SICodel LIKE 241121 And LIKE 34 And ConWired A A M el Oe tT A a U a M D dE LR
227. en they are not connected to the DRCU Particular attention 15 paid to the spacecraft EQM and PFM AIT phases Section 2 of this note outlines the AIT sequence of the Spacecraft for both the EQM and PFM AIT programmes The AIT flow charts are taken from RD 1 and RD 2 and are included for information only The flowcharts are annotated to indicate the particular configuration of ESD protection hardware required at different stages of the EQM and PFM programmes Section 3 specifies the configuration that the instrument will be in to keep the focal plane units from being damaged by ESD events These instrument configurations have been annotated on the flow charts in section 2 Section 4 specifies the main details of the hardware identified in section 3 As some new hardware has been specified in this document various procedures will need to be revised and possibly updated to reflect this new information Comments on the existing procedures are included in section 5 Making SPIRE ESD Safe Draft 0 2 for comment Page 2 2 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG 2 Spacecraft AIT Flow 2 1 Annotated EQM flow 150 Cryo Control OB CM Science Instrum Cryostat Harness CCHI Hames SIH Incoming Ceintegration hodification Cryostat 5 Preparation for Transport to zene BE Iretrurrent gt esee eon amp OCS Light Smuda Saup WU
228. ents 8 Page 132 Reference to D2 changed to B2 idem 9 134 References to D4 changed to B4 shld in column 2 row 24 page 146 T meme mmu eme not J05 J06 407 and 408 Channel 1 gnd shld should be Channel 14 gnd shld in column 2 row 19 page 152 Channel 1 gnd shld should be Channel 14 gnd shld in column 2 row 27 page 155 14 Page 95 Second table should be labelled with FCU P29 not FCU P27 Compliant See page 29 of this document This page was in Isssue 1 0 of this doc but no mention of it was made in this table Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT deltas PMW Bol Ch 43 PMW Bol Ch 42 PMW Bol Ch 4 PMW Bol Ch 45 PMW Bol Ch 39 PMW Bol Ch 38 PMWBol Ch 41 PMW Bol Ch 40 PMW Bol Ch 37 PMW Bol Ch 36 PMW Bol Ch 33 lt PMW Bol Ch 35 DCU P22 Contact Details Notes e The shields of the STP cables carrying the ground wires GND WIRE and Pins 36 A1 4 A2 128 A3 and 47 A4 of the 128 way connector are all joined to form a ground reference plane Pin numbers for connector PE assume the use of a DEMA 9 connector Refer to Annex 7 Cryo harnessing that indicates graphically the means by which these signals are wired PE J22 Link Cmm Piel 128 Way 4 DCUP20 DCUP21 DCUP22 ar B S4 STP A1 Chan
229. ermShuntFemp N T S3E SPIRE ThermShuntTemp N E S3E SPIRE ThermShuntTemp N V A M S3E SPIRE ThermShuntT emp N 1 S3E SPIRE ThermShuntTemp N 5 005 SPIRE SorptPumpHtr N 1 S3F SPIRE SorptPumpHtr N 1 8 S3F SPIRE SorptPumpHtr N I A S3F SPIRE SorptPumpHtr N S3F mn H n Filter SlCode LIKE 211121 SCon LIKE 34 And ConWired 1 1 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04155 38 04158 38 04155 38 04155 38 04155 38 04159 38 04155 38 04080 30 04080 30 04080 30 04080 30 P 4 4 03 lt C2 gt min ct rer aAA AA VOX NAT MASA NN aa ww L L u w printed 21 04 2004 09 02 54 54 Interface Code Grouping Pin Signal Designation _ LLL Circuit Signal Ch ID Wiring Shd Cable Twist T _ TS M AMRA together together together together together Cable 5234 to 5238 Shd Cable 5234 to 5238 Shd Cable 234 to 5238 Shd con Cable S234 to 238 Shd con Cable 5234 to 5238 Shd con HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSFPU HSF
230. esign Office Date 21 12 2001 Page 5of6 Page 6of6 Date 13 Oct 2003 Date 10 Mar 2004 NCR ECR NCR ECR Modification Description Modification Description 1 Reflects new thermal standoff design with additional bush and upper and lower feet washers Subsequent 1 Note 8 and leaders added indicating 3mm jackscrew length below the mating plane dimensions in X direction updated to new interface plane New parts added to Parts List 2 Label added to Part 23836 10209722 JFET to indicate orientation Reflects new harness layout which simulates actual physical layout Micro D 15 way connector added to harness representation Micro D 37 way elliptical entry backshells replace standard circular entry versions SPIRE Mass of harnesses increased from 165g to 270g 10209750 L3 strap and interface assembly added Views updated and added to show interface details and L3 strap hole definition JFET MODULE Mass of JFET modules reduced from 305g to 260g JPL Kapton tape removed from fastener and stand off interfaces note 7 deleted NOTE 10209750 15 the JPL part number 10209722 15 the JPL ICD drawing number JD wishes to leave the ProE part name as 23836 10209722 Moments of inertia updated along with C of G position Fastener for thermal strap assembly changed to non parylene coated M4 x 45mm long Kapton tape note removed from L3 interface area Incorrectly specified M2 5 x 8 long fasteners used to fasten JFET modules to fr
231. eter Stimulus Thermistors 12 6 STQ 1000 1 0E 06 0 Spectrometer Stimulus Heater 4 4 0 TQ 30 9 0E 03 0 Spectrometer Stimulus Heater 2 4 0 TQ 30 7 0E 03 0 HSFPU J24 MDM 37 HSFPU P24 MDM 37P FPU Thermometry 24 12 STQ 1000 1 0E 06 0 300mK Thermal Control Heater 4 2 STQ 30 2 0E 03 0 C13 CVV13 HSFPU J26 MDM 375 HSFPU P26 37 BSM Chopper Sensors 3 1 SIT 1000 1 0E 06 0 0 4 BSM Chopper Sensors 2 1 STP 1000 1 0E 06 0 Drive R BSM Jiggle Sensors 3 1 STT 1000 1 0E 06 0 BSM Jiggle Sensors 2 1 STP 1000 1 0E 06 0 BSM Temperature 4 2 STQ 1000 1 0E 06 0 Photometer Stimulus Heater 4 2 STQ 10 7 0E 03 0 BSM Launch latch sense 2 1 STP 1000 1 00E 03 0 BSM Launch latch solenoid 2 1 STP 10 3 5E 02 0 BSM Chop motor drive 4 2 STQ 10 4 0E 02 0 BSM Jiggle motor drive 4 2 STQ 10 4 0E 02 0 HSFPU J28 MDM 37S HSFPU P28 MDM 37 5 Thermometry 8 4 STQ 1000 1 0E 06 0 SMEC LVDT Primary 2 1 STP 5 5 0E 03 0 5 SMEC LVDT Secondary 4 2 STP 50 5 0E 05 0 15 SMEC Launch Latch 4 2 STP 5 4 0E 01 0 15 SMEC Launch Latch Rob 4 2 STP 5 4 0E 01 0 15 SMEC Launch Latch Confirm 4 2 STP 5 1 0E 03 0 15 HSFPU J30 MDM 37 HSFPU P30 MDM 7 Drive Coil 2 1 STP 5 1 0E 01 0 15 SMEC Drive Rob 2 1 STP 5 1 0E 01 0 15 SMEC Drive coil voltage sensor 2 1 STP 500 1 0E 05 0 15 SMEC Position sensor supplies 2 1 STP 100 1 0E 03 0 5 SMEC LED Power 2 1 STP 100 1 0E 03 0 5 SMEC Position sensor photodiodes 6 3 STP 1000 2 0E 05 0 5 SMEC Position sensor photodiodes FB 6 3 STP 1000
232. evel Shieldst 0 13 gt 80 HSJFP 926 37 26 37 PSW JFET Bias 12 6 DSTP 100 1000 0 08uH 5 0E 03 1 2E 03 10 PSW Ground 1 0 S 50 1000pF 0 08uH 0 0 00 10 PSW Bolometer Bias 6 3 DSTP 200 1000pF 0 08uH 3 8E 07 9 6E 08 10 PSW Heater 6 3 DSTP 200 1000pF 0 08uH 3 8E 03 9 6E 04 10 Cable Level Shieldst 0 12 gt 80 HSJFP 428 37 28 37 PMW JFET Bias 8 4 DSTP 100 1000 0 08uH 5 0E 03 1 2E 03 10 PMW Bolometer Bias 4 2 DSTP 200 1000pF 0 08uH 3 8E 07 9 6E 08 10 PMW Ground 1 0 S 50 1000 0 08uH 0 0 00 0 0 00 10 PMW JFET Heater 4 2 DSTP 200 1000pF 0 08uH 3 8E 03 9 6E 04 10 PLW JFET Heater 2 1 DSTP 200 1000pF 0 08uH 3 8E 03 9 6E 04 10 PLW JFET Bias 4 2 DSTP 100 1000pF 0 08uH 5 0E 03 1 2 03 10 PLW Bolometer Bias 4 2 DSTP 200 1000pF 0 08 1 9E 07 4 8E 08 10 PLW Ground 1 0 S 50 1000 0 08uH 0 00 0 00 10 Cable Level Shieldst 0 13 gt 80 2 Doc No SCI PT IIDB SPIRE 02124 Issue Rev No 3 0 Date 15 9 2003 Annex 3 Name 128 Way FPU JFS JFP Unit Harness Harness Description Number of Number of Implementation Max Impedance Max Current in A Av Currentin Max Volts Connector Connector Connector Connector Connector Conductors excl inner Shields W C pF Conductor Label Type Label Type shields C4 CVV 4 HSJFP J21 MDM 2
233. flanges updated Pictorial changes WRT BDA connector flanges ad aperture cover to reflect sheet 1 Pictorial changes WRT BDA connector flanges ad aperture cover to reflect sheet 1 Pictorial changes WRT BDA connector flanges ad aperture cover to reflect sheet 1 Surface roughness on LO straps added with BY VISUAL INSPECTION ONLY note Gold finish on LO straps surface roughness and Alochrom 1200 finish note added for L1 straps 4 Torques were 1 26 Nm Work in progress notes wrt BDA connector panels deleted Note reminding that 4 grounding hole does not have a locking insert fitted added Dims to BDA connectors added Pictorial changes WRT BDA connector flanges ad aperture cover to reflect sheet 1 6 5 DENEN ISSUE 17 1 Dimension to A Frame top pin centre added E Level 1 grounding strap positions moved and applicable note modified lt 2 Beamsremovedbotom LH view 3 Optical reference cube note modified reference to A3 5264 305 6 added 3 Beam angle added Bottom LH view 1 3 Cryogenic added to two dimensions UNLESS OTHERWISE SPECIFIED added to note wrt ALL DIMENSIONS AT ROOM TEMPERATURE 3 Dimension to top of reference cube added 3 7 Notestating U S of SOB is Yu amp Zu Optical Datum Deleted 4 Front mounting cone centre positional tolerances added 4 interface bolt material and torques added 5
234. ght Flight only representative Functionality Simulator Flight representative no Flight Flight only redundancy representative i U Electrical Component Level Commercial industrial MIL spec Flight PS Not fitted replaced Flight Flight EGSE Power Bench Electrical Interfaces Simulator N A Flight Flight only Functionality Simulator N A Flight Flight only Electrical Component Level N Flight Flight Table 5 16 5 HSFCU Hardware Matrix Unit HSDPU AVM AVM1 Subsystem component DPU Structure Flight representative Flight representative Electrical Interfaces Flight representative Flight representative Flight Functionality Flight representative Flight representative no redundancy No redundancy Electrical Component Level Commercial industrial Commercial industrial Flight Table 5 16 6 HSDPU Hardware Matrix Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 50 Unit HSWIH Warm interconnect harness Subsystem component WIH Mechanical form Test leads to connect DPU to simulators required Table 5 16 7 HSWIH Hardware Matrix x Flight representative no redundancy 5 16 2 Electrical Ground Support Equipment EGSE Electrical Ground Support Equipment EGSE will be needed to provide Spire instrument level monitoring during i
235. gs added red lined with NCR information 2Module JFET updated but changes are all internal to unit Incorporate updated FM FCU and DCU drawings including their change control sheets DRCU drawings amended to be like the hardware Version 19 of Cryogenic unit I F drawing inserted implementing latest LO straps For detailed change control see drawing s change list included herein Omitted connectors and unit ref holes clarified in DRCU ICDs JFET unit drawing minor corrections see drawings change lists included herein Append SPIRE cryogenic integration MGSE drawing sheets JUU 9 GENERAL 1mm WEIGHT 7177 Kg t2009 DIMENSION 274 X 258 X 194mms Wwe ee ee ee x o oO 45 5 74 5 74 5 45 5 CENTRE GRAVITY CE X 120 4 136 2 e 2 77 4 MOMENT OF INERTIA E Jx 6 23X10 e 5 73 10 Kgme Jz 7 0X10 e Kome CASING MATERIAL ANTICORODAL 6082 SURFACE TREATMENT ALODINE 1200 I alfa solar 0 604 R solar 0 396 epsilon IR 0 172 THERMAL CAPACITANCE 7 1774 pos 04 5 six holes e CONTACT AREA BASEPLATE PLUS FEET64428mne SZ FLATNESS MOUNTING AREA 0 1mm 100mm CONNECTORS 01 DEMA 9P From Prime to PDU Prime J02 DEMA 9P From DPU Red to PDU Red J03 DEMA 9S From DPU Prime to Bus A Prime J04 DEMA 9S From Prime to Bus Prime 4 05 95 From DPU Red
236. h flow rate of warm He leaves the pump we could heat the pump with some 600mW to 40K very quickly keep it there for just a few minutes turn off and let everything cool down again which would achieve a very energy efficient regeneration In practise strap impedance both limits the initial power that can Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A4 6 be applied and causes us to need to wait an appreciable time before the evaporator comes back down to lt 2K the point at which cool down can be commenced The time taken for the 6 litre flight cooler s sorption pump to be heated up to 40 45K is expected to be 30minutes SBT CEA have put considerable effort into developing the heat straps inside the cooler to cut down the wait time for evaporator itself to get back down to lt 2K at the end of the condensation phase The shunt and the evaporator share an LO strap the latter via a heat switch The energy to be transported during recycling from the evaporator itself is expected to be 50 Joules with the profile shown peaking at a power of 45mW However the total energy through this strap per cycle is 205 Joules when the shunt s contribution is also added in peaking at 75mW Although evaporator power may drop to 2mW at the end of the condensation phase there is still 13mW from the
237. her it needs to be re generated regularly This regeneration energy cycle is a small but significant contribution to the total dissipation within the Herschel cryostat When operational Spire runs a 48 hour He cooler cycle 46 hours with Spire s detectors cooled to 300 and 2 hours recycling This fits in with Herschel ground commanding periods When at 00 the temperature at the cooler s evaporator is to a very good approximation a single valued function of gross applied load on its evaporator i e available net cooling power PLUS the cooler s internal parasitics The cooling is simply due to the physical process of evaporation along the cooler s pumping line geometry see above figure The function is shown below in figure 2 which is derived by offsetting curves of tip temperature v load that have been measured at different L1 and hence parasistics puzzling factor is that the TRP 4 litre contract showed this characteristic to be independent of attitude but under test the function for the 6 litre units shows some dependency on attitude Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT REFERENCE SCI PT IIDB SPIRE 02124 DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 3 3 PAGE 4 2 320 215 310 305 300 295 a 290 285 280 275 10 20 30 40 50 60 70 Gross load microWatts Figur
238. i E T i R 8 as 9 4 i TL muB act 6 hill I 21m 1 LP 7 RC POLI Oe He rer x i 2 M E ou 123 P 2 4 7 TE lt 7 7 BOB ah ret A i I 1 h 1 NW IDA n HSDRCU collective of warm a 5 electronics excluding HSDPUs I AUTION 1 ock diagram shows how 5 2 units relate unctionally it is not a harness specification The i connectors happen to be labelled with the names of the fixed Hems on the units not the mating hamess parts KEY Herschel to Herschel Flight Bundled together not Prime harness Spire L F lines drawn Harness simplilied L Fs are all Identity an electrical screen Redund harness at HS connector p Figure 5 2 1 Spire Block Diagram version 5 8 Reproduction interdite ALCATEL SPACE Company confidential S8 on Eth May 2004 EM REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 2 5 PAGE 5 4 5 3 LOCATION AND ALIGNMENT Figure 5 3 1 shows the concept of the location of the three Herschel Focal Plane Units FPUs for HIFI PACS and Spire on the Optical Bench OB inside the cryostat The Spire FPU has two nearby JFET racks
239. ial INTERFACE INSTRUMENT DOCUMENT REFERENCE SCI PT IIDB SPIRE 02124 PART B SPIRE IID B SPIRE ISSUE 5 9 Average Load Definition pump 0 00044800 evap avr 0 0003247D0 pump hs avr 0 00012900 5 0 00000000 0 00001100 bsm 0 00042400 5 0 00032800 0 000240D0 avr 0 006722D0 sjfet avr 0 002257D0 Switch Gas Conductance Calculated VARIABLES1 HS PUMP GAS 0 0D0 HS EVAP GAS 0 0D0 Cooler Heat Loads Calculated in VARIABLES1 Photo load 0 0D0 in microwatts Spectro load 0 000 microwatts Parasitic load 0 000 microwatts Evap only Tot Cooler load 0 000 in microwatts CONTROL RELXCA 0 000 NLOOP 20 TABS 0 000 OUTINT 0 000 TIMEND 0 000 Reproduction interdite ALCATEL SPACE Company confidential PAGE 2 14 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 15 DTIMEI 0 000 REAL TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE ETE TE TE TE TE TE ETE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE SPIRE Mater
240. ial Specific Heat J kg K TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE SPECIFIC HEAT Aluminium SHCAL1 2 19 1 1 0 1332 2 000 0 1148 4 000 0 2830 10 00 1 4000 15 00 3 8400 18 00 6 4900 19 00 7 6200 20 00 8 9000 21 00 10 3000 22 00 11 9000 23 00 13 7000 24 00 15 7000 25 00 17 8000 27 00 22 6000 30 00 31 5000 50 00 142 0000 100 00 481 0000 200 00 797 0000 Reproduction interdite ALCATEL SPACE Company confidential INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE 300 00 902 00D0 1 2 5 20 000 0 921800 30 000 1 273800 40 000 1 603800 50 000 1 916200 60 000 2 217600 SPECIFIC HEAT Copper SHCCU1 2 10 0 200 0 000600 0 300 0 000600 1 000 0 01200 4 000 0 09100 10 000 0 8600 20 000 7 700 20 000 99 000 100 000 250 000 200 000 360 000 300 000 390 000 SPECIFIC HEAT Invar SHCIN1 2 10 0 220 0 09600 0 320 0 09600 1 000 0 2400 4 000 0 5700 10 000 3 100 20 000 12 000 50 000 120 000 100 000 310 000 200 000 440 000 300 000 470 000 Reproduction interdite ALCATEL SPACE REFERENCE 3 SCI PT IIDB SPIRE 02124 DATE
241. idential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 25 stuck on stuck open circuit dubious etc shall be stored somewhere in the Herschel commanding system probably on the ground to stop any attempt to switch a failed LCL without specific over ride An open circuit LCL is not a particularly difficult case to consider as it would just preclude the use of one side of Spire 5 9 6 4 1 HSDPU Power Input Circuit Configuration Figure 5 9 1 HSDPU Power Input Circuit Configuration Note This HSDPU Power Input Circuit Configuration is given for information only 5 9 6 4 2 HSFCU Power Input Circuit Configuration Dispatched PWR 28V x Ll L2 to the 5 CV N InF type 1 T 1 1 40hm 30u F Ceram type 1 i Zr InF type 1 type 2 V 258uF Tantal RTN PWR x SOnF type 95 200nF type 2 Unit Chassis On the schematic x signifies P for nominal Board J05 R for redundant 106 L common mode inductance the value is 210 WH L2 differential mode inductance the value is 170 no load 150 for nominal current 2 8 A 140 uH Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 26 for maximum c
242. ientation During ground tests the FTS mechanism can only operate when the is on its side In addition there is a restriction on the orientation of the cooler during recycling Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 8 4 8 INSTRUMENT REQUIREMENTS AND PERFORMANCE SPECIFICATION 4 8 1 Scientific Requirements The scientific performance requirements for SPIRE are summarised in the SPIRE Scientific Requirements Document as follows Requirement SRD R 1 The photometer should be capable of diffraction limited extragalactic blind surveys of at least 60 sq deg of the sky to 1 detection limit of 3 mJy in all bands with an observing time of six months or less Requirement SRD R 2 The photometer should be capable of a galactic survey covering 1 deg sq to a 1 depth of 3 mJy at 250 um within an observing time of one month or less Requirement SRD R 3 Maximising the mapping speed at which confusion limit is reached over a large area of sky is the primary science driver This means maximising sensitivity and field of view FOV but NOT at the expense of spatial resolution Requirement SRD R 4 The photometer observing modes should provide a mechanism for telemetering undifferenced samples to the ground Requirement SRD R 5 The photometer should have an observing m
243. included in FPU ICD in Annex 1 5 16 5 System Test Software Will be based on the Quick Look Facility computers and software that allow the monitoring in near real time of the instrument housekeeping parameters and instrument data This is the basic facility to be used for the ICC operations monitoring for the monitoring of the instrument in orbit The same facility with enhanced capabilities will be used for the ground tests and in orbit check out of the instrument 5 16 6 Hardware for the Observatory Ground Segment Quick Look Facility for the Mission Operations Centre for instrument in flight commissioning This will consist of an identical system to that used for instrument system level testing 5 16 7 Software for the Observatory Ground Segment The software for the Quick Look Facility will be delivered to the MOC for instrument in flight commissioning 5 16 8 Instrument Software Simulator An instrument software simulator will be produced 5 16 9 Test Reference Data The Spire instrument test reference data will be delivered in the form generated during instrument and system level testing 5 16 10 Instrument Characterisation Data The Spire instrument characterisation data will be delivered in the form generated during instrument and system level testing 5 16 11 Technical Documentation The following documents will be delivered Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 0212
244. ing power up but some additional software may be required TBD to be unlinked before observations commence either patches or whole modules objects No single instrument command nor any sequence of instrument commands will constitute a hazard for the instrument so the HSDPU is required to trap out any such situations For the same reason the HSDPU shall ensure its own correct function at least as far as checking memory function in the background check summed read only areas and an inhibitable SEU safing capability 5 13 3 Aufonomy functions All S C Autonomy functions are defined in the SPIRE FDIR SPIRE RAL PRJ 001978 They are used either following detection of a problem with the instrument by the S C see the SOFDIR H P 1 ASPI SP 0209 following receipt of an event packet from the SPIRE instrument Reference HP SPIRE REQ 0250 The S C must be capable of taking predefined action when a particular event packet is received from the SPIRE instrument Examples of the action to be taken are Switching off the power to the SPIRE instrument HPFCU and or HSDPU Stopping restarting the current instrument sub schedule Inhibiting commands to the instrument Sending fixed command sequences to the instrument Reference HP SPIRE REQ 0260 The S C must be capable of receiving and identifying SPIRE Event Reports PUS Service Type 5 Subtypes 1 2 and 4 that will alert the S C of anomalies detected by the SPIRE DPU auton
245. ion interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 1 2 1 ASED comments Extract from fax ASED HP ASED FX 0316 04 dated 10 05 04 Fast Loop Assessment HP SP RAL ECR 068 IID B SPIRE Mechanical Interface Drawings SPIRE RAL DWG 001409 Update to Issue 11 SPIRE FPU Sheet 1 Mass properties mass CoG and MOI updated Updates acceptable but note that update of the FPU MTD design is considered to be not necessary The SPIRE FPU MTD will be provided with mass properties as in Issue 18 Sheet 5 LO thermal strap interfaces updated as agreed with one exception LO flexstrap clearance holes shall be 5 0mm and not 4 5mm See also ASED comments in HP ASED EM 0740 03 dated 28 11 03 Sheet 5 L1 thermal strap interfaces Agreed interface may be changed to implement electrical insulation at FPU side Updated IF drawings are urgently awaited by ASED Sheet 6 Harness stay out areas updated Updates acceptable to ASED FPU JFET MGSE e shall be noted that the proposed is a deviation from the current baseline which assumed that the SPIRE FPU and the JFETs are integrated independently EADS Astrium reserves the right to raise ECP if the detailed analysis revealed an increased required effort The assumptions and comments made HP ASED EM 0231 04 are still valid concerning the provided
246. is is no longer a single unit and the term refers collectively to the HSDCU plus the HSFCU There are four groups of harnesses at instrument interface level HSW xx 5 55 HSOx where xx represents a number The HSWxx are Warm harnesses between Warm HS units on the SVM HSSxx are the SVM cryoharnesses between the SVM connector brackets and the HS Warm Units HSlxx are intermediate cryoharnesses which are external to the cryostat and are situated between the vacuum connectors and the connector bracket on the SVM The HSCxx are cryogenic cryoharnesses located inside the cryostat between the vacuum connectors and the HS Cryogenic units The HSlxx 55 HSCxx are all considered to be Cryoharness and are not provided by the Spire instrument The two F harnesses FPU sub system F harness between JFETs and FPU HSFPU HSJFP and HSFPU HSJFS are provided by SPIRE with the instrument units ESA s contractor will also provide any safing plugs needed see annex 6 of present for the cryoharness Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 2 5 2 INTERFACE LOCATIONS All of the above may be visualised by means of the block diagram shown in figure 5 2 1 see RD 8 Herschel to Herschel Spire electrical interfaces are in sever
247. is understood to be the mean value above X 1 20 i e 18 5 W The maximum associated Long Peak load on this LCL is understood to be the mean value above X 1 20 i e 96 W Table 5 9 4 Power load on main bus 5 9 6 2 Power Nominal Turn on This sequence takes the SPIRE instrument from its OFF configuration to the REDY configuration In this final configuration the instrument is ready to be switched into either operational mode Photometry or Spectrometry or to perform a cooler recycle OFF to INIT Having checked that SPIRE is all unpowered the spacecraft shall power on HSDPU Prime The DPU will check its health and if its status is OK shall issue a TM 5 2 event packet indicating its readiness to accept commands In the event that an anomaly is found the shall issue TM 5 4 event packets indicating the problem INIT to DPU ON TC 8 4 command Force is sent to the DPU to load the On Board Software from EEPROM and start its execution The result of this is the generation of TM 3 25 Nominal and Critical Housekeeping reports which indicate that the OBS is configured to MODE 0x0000 this time 3 TM 5 1 event packets will also be generated indicating that the SPIRE DRCU subsystems are not responding to commands from the DPU this is normal as the DRCU is not yet powered on DPU ON to DRCU ON Telecommands are sent to the DPU to stop collection of housekeeping data from the DRCU subsystems duri
248. is used as an arithmetic node to compensate for the missing power dissipation of the pump Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A2 39 QI812 is updated at each iteration according to the current total cooler load ie only when SPIRE is operation The nex two lines used to update QI8012 during the Steady State Analysis but a similar approach is used in Transient Analysis QI812 pump IF IMODE EQ 0 THEN QI812 0 33D0 0 041 0 047 0 33D0 0 96875 pump add ELSE ENDIF ELSE SPIRE in OFF Mode The evaporator node 819 is always a diffuse node The pump HS is OFF The evaporator HS is OFF CALL STATST N819 D HS EVAP STATE OFF HS PUMP STATE QI812 0 0 ENDIF ELSE IF MODULE EQ SLFWBK MODULE EQ SLFRWD MODULE EQ SLGEAR MODULE EQ SLGRDJ THEN Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 3 SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 Set the following Heat capacitance to zero C800 O C830 O C831 O C832 805 0 806 0 807 0 808 0 C811 0 C812 O C813 O C814 0 C815 C816 0 C818 0 820 C8
249. itch temp dependant couplings due Helium when or OW K when OFF IF HS PUMP STATE EQ ON THEN HS PUMP GAS 1 1 0 00061 DO INTRP1 T821 1817 2 0D0 He3 1 0 0001D0 1 0 1 6265D 5 INTRP1 T821 T817 2 0D0 K OFHC 1 0 048D0 IF HS PUMP GAS GT 0 04 THEN HS PUMP GAS 0 04 ELSE ENDIF ELSE IF H5 PUMP 5 THEN HS PUMP GAS 0 0DO ENDIF IF HS EVAP STATE EQ ON THEN HS EVAP GAS 1 1 0 00061D0 INTRP1 T819 T820 2 0D0 He3 1 0 0001D0 1 0 1 6265D 5 INTRP1 TB19 T820 2 0D0 K OFHC 1 0 048D0 IF HS GAS GT 0 04 THEN HS EVAP GAS 0 04 ELSE ENDIF ELSE IF HS STATE EQ OFF THEN HS EVAP GAS 0 000 ENDIF SVARIABLES2 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 2 50 OUTPUTS Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 1 ANNEX 3 SUMMARY SPIRE CRYOHARNESS WIRING FUNCTIONS Reproduction interdite ALCATEL SPACE Company confidential 1 Doc No SCI PT IIDB SPIRE 02124 Issue Rev No 3 0 Date 15 9 2003 Annex 3 Name 128 Way FPU JFS JF
250. k TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TEE TE TE TE TE TE TE ETE TE TE TE TE TE ETE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE E TE TE TE TE TE TE TE TE TE TE TE TE TE Before pre processing the SPIRE ITMM select the following options Select the level of margin to be applied the mechanisms internal dissipation with the variable margin fac in the CONSTANTS Block 1 0 default value TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE ETE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TE TEE TE TE TE TE TE TE TE TE TE TE TE TE TE List of Changes 06 12 02 Issue 2 Baseline SPIRE 20 01 03 Issue 2 1 Change SPIRE external and flexible LO Strap Dimensions Overall condutance of LO straps changed from 200 mW K to 150 mW K 03 03 03 Issue 2 2 SCAL node 808 dissipation applied to FPU node 803 for average mode Few GL links declared in VARS1 rather than in GL Block to allow for esatan Sun PC platforms compatibility Changes in VARS to allow better setup of the evaporator Gk node 819 and heat switches status according to Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE
251. l include the capability of testing the SPIRE autonomy functions and any exchange of information required between the spacecraft and SPIRE for any SPIRE operational mode This model comprises the following units DPU AVMI DRCU simulator Test harness The DPU will have the full functionality of the flight version but it will be built with commercial grade parts and will not have redundant systems fitted It will be identical in external form and fit to the flight unit The DRCU simulator will be a computer with interface cards to the DPU that is capable of receiving commands from the DPU and returning realistic data to mimic the operation of the DCU FCU cold FPU and JFET boxes A test harness will be supplied by SPIRE to connect the DPU and DRCU simulator NOTE The DPU is the same unit as used the 5 16 1 2 CQM Cryogenic Qualification Model This is model of the instrument that will be used to characterise and verify the instrument scientific performance with functionally representative cold sub systems and warm electronics units Not all the cold FPU units will be functional see below The purpose of the 15 to verify that the design of the will be capable of meeting the instrument level performance requirements and that the instrument is compatible with integration into the Herschel satellite This model comprises the following units FPU AVM1 DCU 1
252. lanck Instrument Interface Document Part A SCI PT IIDA 04624 2 Product Assurance Requirements for Herschel Planck Scientific Instruments SCI PT RQ 04410 AD3 Herschel Planck Operations Interface Requirements Document OIRD SCI PT RS 07360 4 Herschel Science operations Implementation Requirements Document SIRD SCI PT 03646 AD 5 Herschel Planck Packet Structure Interface Control Document PSICD SCI PT ICD 07527 AD 6 Telescope specification Herschel SCI PT RS 04671 0 7 Alignment Plan Concept Herschel HP 2 ASED TN 0002 Annex of AD1 AD 8 Software standard ECSS E 40 B 2 2 REFERENCE DOCUMENTS Reference Documents hereafter are available on ESA livelink http www rssd esa int llink livelink func ll amp objld 226764 amp objAction 2 browse amp sort SPIRE Instrument Design Description SPIRE RAL PRJ 000620 RD2 SPIRE Instrument Requirements Document IRD SPIRE RAL PRJ 000034 SPIRE Data ICD SPIRE RAL PRJ 001078 covers both telemetry and command data RD 4 SPIRE Management Plan SPIRE RAL PRJ 000029 RD5 SPIRE Science Requirements Document SRD SPIRE UCF PRJ 000064 RD 6 SPIRE Instrument AIV Plan SPIRE RAL DOC 000410 RD7 SPIRE Product Assurance Plan SPIRE RAL PRJ 000017 RD8 SPIRE Block Diagram SPIRE RAL DWG 000646 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02 124 INTERFACE INSTRUMENT DOCUMENT ATE
253. ls e Fixation of SPIRE LO pump flex link to H EPLM rigid pod There may be not sufficient clearance for the fixation of all 6 interface bolt at the LO pump rigid pod with the torque wrench Please check provision of tool or removal of LO pump strap lower A frame for the fixation of all interface bolts see HP ASED EM 0231 04 for details e Furthermore the following additional comments shall be considered Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A1 3 Provision of a fixation of the MGSE JFET Lifting plate to FPU Optical Bench Please confirm that the JFET lifting plate is stiff enough to reduce the potential vibrations of the JFET units during the lowering to the Herschel Optical Bench It is assumed that the plate has a thickness of 2 3mm not provided in the drawing In summary the SPIRE change request HP SP RAL ECR 068 is technically acceptable assuming the implementation of the comments in this fax 2 SPIRE answer to ASED comments Extract from Mail from Eric Sawyer dated 27 05 04 Objet Response to fast loop assessment Hi Horst Here is our response to your fax HP ASED FX 0316 04 Dated 10 5 04 HP SP RAL ECR 068 IID B SPIRE mechanical interface drawings update 11 SPIRE FPU Sheet 1 mass properties ok Sheet 5 agreed that LO strap clearance holes shall be
254. m level AIV will be produced by all sub system responsible groups Sub systems will undergo individual qualification or acceptance programmes before integration into the instrument Sub systems will be operationally and functionally checked at the appropriate level before integration into the instrument Model Philosophy The model philosophy to be adopted bythe SPIRE instrument will as described in 6 SPIRE AIV Plan The instrument models to be produced are Avionics Model SM Structural Model AM Alignment Model CQM Cryogenic Qualification Model PFM 1 Proto Flight Model build 1 PFM 2 Proto Flight Model build 2 FS Flight Spare See section 5 16 1 for more details Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 9 2 Only models marked are delivered to ESA or their contractor 9 3 Mechanical Verification Subsystems will be mechanically verified by a combination of analysis and test Qualification model subsystems will be subjected to vibration tests at ambient and cold temperatures qualification levels and durations cold testing in all three axis may not be possible in that case the most sensitive axis or the axis with the highest input will be used Subsystem test levels will be derived from analysis of the FPU whi
255. mperature vs switch pump temperature The power needed to raise the switch s sieve to 14K is 200 uW To have margin 400 uW has been demonstrated to run the pump switch and to speed up switch over phase the sieve is heated at 800 uW for an initial limited time As helium evaporates heat is pumped There is an amplification factor between the heat load at the evaporator and the resulting adsorption heat load on the pump which is sunk down the turned on pump switch and its strap The following curves are from an experiment to measure this Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 4 Applied load at evap mW Applied load at pump mW 0 60672 16 051x R 0 99902 y 0 0096872 0 32761x R 0 99845 PACS Thermal tests 2003 HCR 1 Level 0 cryostat cold plate 1 6 K Amplification factor analysis heat of adsorption Result ratio of slopes 49 0 2 05 0 41 0 15 02 0 25 03 0 35 0 4 Figure 5 Measurement of adsorption heat on pump vs heat applied evaporator A ratio between these heat loads of 46 49 is typical for coolers and such a test result shows that the cooler is pumping properly according to the expected thermodynamics In practise the whole system must be able to
256. n open Isolation T Figure 5 7 1 SPIRE flow diagram Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 15 5 7 1 Inside the cryostat 5 7 1 1 Description of the thermal interfaces Spire uses 4 thermal stages to run 300mK detectors inside a cryostat These link into levels provided by the Herschel cryostat An overview of the Spire system is as follows drawn with the heat switches associated with its 300mK cooler set as for an observing mode Electrical insulation is not shown here for electrical purposes but rather because where high thermal conduction is needed it adds to the design challenge The radiative loads on Spire shown in green potentially come from warm baffles seen off axis up the optical beam aperture The arrow for external harness loads the JFETs is not joined to anything specific as this depends on design decisions taken by Astrium Spire has two detector optical box structures one housing the photometer detectors and one the spectrometer s They mount on thermally isolating mounts inside the HSFPU and to minimise the heat leak to the 300mK detectors themselves link to the lowest available temperature the LO cryostat liquid sink The spectrometer box has an external LO interface and the photometer is then linked from it internall
257. n the SPIRE Management Plan 4 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 1 1 ANNEX 1 SPIRE ICD ICD issue 11 drawings configuration and Industry comments amp SPIRE RAL DWD 001409 Issue 11 April 2004 Annex 1 1 ICD pack issue 11 drawings configuration and Industry comments 040 v2 HER 5005 03 23 02 03 change versus 3 2 Idem 068v1 since ICD pack issue 8 SPIR MX 5100 000 01 2004 meme O68v1 SPIR MX 5101 000 02 12 02 Warning New version versus 3 2 annotations connectors but With new annotations still same issue and date indicated on drawing O68v1 SPIR MX 5201 000 C 108 09 03 Warning New version versus Wi 3 2 annotations connectors but ith new annotations still same issue and date indicated on drawing FPU O68v1 1 5264 300 sheets 1 to 7 19 19 02 04 ICD Issue 19 SPIRE IF ICD to be updated by SPIRE 0104 360 10 03 04 Joneoroeaso 068 1 1 5264 404 SHT 02 02 04 SPIRE FPU JFET lifting for E installation ICD to be updated by SPIRE FPU and MGSE ICD s and drawings listed in this table and included in this annex 1 shall be updated by SPIRE according here under ASED comments and SPIRE answer and agreement here after Reproduct
258. nector Connector Connector Connector Conductors inner tion C pF L uH A per in A per Volts Label Type Label Type excl shlds Shields W Conductor Conductor 14 54 4 DCU J20 50 DCU P20 DDMA 50 16 ch PMW 1 16 32 16 STP 500 1500pF 0 08uH 1 00E 09 5E 10 0 1 1 Ground Wire 1 0 S 50 1500pF 0 08 0 0 0 1 DCU J21 DDMA 50 P 16 ch PMW 17 32 0 08uH 1 00E 09 Ground Wire 0 0 DCUJ22 50 16 ch PMW 33 48 1500pF 0 08uH 1 00 09 Ground Wire 1500pF 0 08uH 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 15 55 5 DCU J17 50 DCU P17 DDMA 505 16 ch 49 64 32 16 STP 500 1500pF 0 08uH 1 00E 09 5E 10 0 1 1 Ground Wire 1 0 5 50 1500pF 0 08 0 0 0 1 DCUJ18 5 16 ch PMW 65 80 0 08uH 1 00E 09 Ground Wire 0 0 19 DDMA50P 16 ch PMW 81 96 1500pF 0 08 1 00 09 Ground Wire 1500pF 0 08 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 16 56 CVV 6 DCU J14 DDMA 50 P DCU P14 DDMA 505 16 ch PLW 1 16 32 16 STP 500 1500pF 0 08uH 1 00E 09 5E 10 0 1 1 Ground Wire 1 0 5 50 1500pF 0 08 0 0 0 1 15 DDMA50P 16 PLW 17 32 0 08uH 1 00E 09 Ground Wire 0 0 416 DDMA50P 16 PLW 33 48 1500pF 0 08uH 1 00 09 Ground Wire 1500pF 0 08uH 0 Shield joined to all backshells HF Overshield gt 80 0 01uH 17 57 7 DCU J11 50 DCU 11 50 S 16 PSW 1 16 32 16 ST
259. nel l 1 PMW F10 Channel 1 GND 1 GND 38 2 j 54 5 2 Channel2 2 PMW E11 ee EDO 2 GND 48 3 54 5 Channel3 PMW Gl 60 20 Channel 3 GND 3 GND 54 5 4 Channel4 4 PMW F11 ee a 4 GND S4 STP B1 Channel5 5 PMW E12 Channel 5 GND Channel 5 GND GND EE SEN 84 5 2 Channel6 PMW G12 Lii E 6 GND 36 AD 3 C 7 x 63 7 j 4 S4 STP B3 Channel 7 PMW F12 75 24 j Channel 7 GND 011414 54 5 4 Channel 8 4 8 Chamel8 OB 2 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT deltas PE J22 Link Cable ID Pixel 128 Way 4 DCU P20 DCU P21 DCU P22 I F 52 54 x Chand8GND 1 SignatGrount _ 9 83 SA STP CI Channel 9 72 10 6 4 1414 x 27 C C S4 STP D1 Channel 13 PMW E7 87 j Channel 13 GND 4 _ 9 2 C _ S4 STP D2 E 6 45 4 qos 9 2 7 S4 STP D3 x jO 13 e e 4611414 S4 STP D4 Channel 16 GND Channel 17 R 55 SA STP El Channel 17 PMW G8 66 15 Q y Channel 17 GND 128 A3 8 y Channel 18 3 S4 STP E2 Channel 18 Channel 18 GND 128 A3 9 Lu qo p S4 STP E3 Kim mm IN 12843
260. nfidential REFERENCE INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE ISSUE 2 3 LIST OF ACRONYMS AD AO AVM BSM CCE CDMS CQM DPU DRCU EGSE EMC ESA Herschel FM FOV FTS GSE HIFI HSC IA ICC ICD IID ISO JFET KAL LOU MGSE MOC NEP OBS OGSE OIRD OTF Applicable Document Announcement of Opportunity Avionics Verification Model Beam Steering Mechanism Central Check Out Equipment Command and Data Management Subsystem Cryogenic Qualification Model Cryostat Vacuum Vessel Digital Processing Unit Detector Readout and Control Unit Electrical Ground Support Equipment Electro Magnetic Compatibility European Space Agency Far InfraRed and Submillimetre Telescope FIRST Flight Model Field Of View Fourier Transform Spectrometer Ground Support Equipment Heterodyne Instrument for the Far Infrared Herschel Science Centre Interactive Analysis Instrument Control Centre Interface Control Document Instrument Interface Document Infrared Space Observatory Junction Field Effect Transistor Keep Alive Line Local Oscillator Unit Mechanical Ground Support Equipment Mission Operations Centre Noise Equivalent Power On Board Software Optical Ground Support Equipment Operations Interface Requirements Document On Target Flag SCI PT IIDB SPIRE 02 124 21 06 2004 3 3 Reproduction interdite ALCATEL SPACE Company confidential PAGE 2 3 REFERENCE
261. ng DCU P14 505 PLW Signals Type 1 DCU P15 DDMA 50S PLW Signals DCU 16 505 PLW Signals SVM CB P6 SPIRE 56 Connector Backshell Details DDMA50S Glenair557 B 357 M 5 TBD toDCUJ14 DCU JFP DDMA50S Glenair557 E 359 M 5 TBD toDCUJ15 DCU JFP DDMA50S Glenair557 B 357 M 5 TBD toDCUJ16 DCU JFP Harness Layup As 55 except Tail HSDCU P14 Tail HSDCU P15 Tail C HSDCU P16 details details BE s s MEE 56 5 1 Chamnell i 1 Channel lgndshld ces ed shld S6 STP A2 8 Channel2gndshld 000 shld Channel 3 S6 STP A3 Channel 3 Channel 3gnd shld shld EE 5 shld Channel6 6 S6 STP B2 FERT 6 Channel 6gnd shld 00 Channel 6gnd shld 00 shld Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT deltas x Name 128 6 DCUJ DCUJIS DCUJI6 Channel 7 63 7 S6 STP B3 Channel 7 L um d 24 Channel 7gnd shld 2364 OT Channel 8 x 74 8 S6 STP B4 PLW B7 7 25 j d C y 9 4 2 x 8 26 C y 56 5 1 Channel 9 72 10 Channel 9gnd shld x 36 AD 321 14 Channel 10 j S6 STP C2 Channel 10 2114
262. ng power on The stream of Nominal and Critical housekeeping TM packets will be interrupted at this time The spacecraft is commanded to power on the HSFCU Prime Telecommands are sent to the DPU to restart collection of housekeeping data from the DRCU The stream of Nominal and Critical housekeeping TM packets will be restarted at this time Additional TM 5 1 event packets Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 24 will be generated indicating that the DRCU subsystems are now responding to commands from the DPU and the Nominal and Critical Housekeeping telemetry will indicate nominal operation The configuration MODE parameter is set by telecommand to 0 0100 DRCU ON to REDY Telecommands are sent to the instrument to Switch on the DC and Sub K temperature channels Power on the Cooler Sorption Pump Heat Switch Boot up the MCU DSP Set the MODE parameter to 0x0200 The affect of these commands is reflected in the housekeeping data 5 9 6 3 Interface circuits Reference HP SPIRE REQ 0030 The HSDPU and the HSFCU receive both primary and redundant 28V feeds The configuration is shown in figure 5 2 1 and the connectors are HSDPU J1 2 and HSFCU J5 6 Their S C power interfaces circuits shall be designed not to generate unwanted interactions
263. nnel 20 21 88 C j 12200 ___ 92 j 1 1 99 SLW CS 9 j 10 BAYA p SLW B4 JJ 210 JJ P l 4 1 82 A S SLW A3 Hi _ BWA 5012 SLW T2 C 12 C F PTC Bias ve Bias Bias A Shield PTC Ground A JFETV Bias JFETV Bias A ve PTC JFETV Bias A Shield SLW BIAS Al ve SLW BIAS Al ve SLW BIAS AI shld SLW BIAS A2 SLW BIAS 2 ve SLW BIAS 2 shld SLW JFETV SLW JFETV AI ve SLW JFETV AI shld SLW JFETV A2 SLW JFETV A2 ve SLW JFETV 2 shld SLW GND WIRE A SSW A SSW ve SSW BIASI A shld SSW_JFETV1 A ve SSW_JFETV1 A ve SSW A shld SSW GND WIRE A SSW BIAS2 SSW BIAS2 A ve SSW BIAS2 A shld SSW JFETV2 SSW JFETV2 A ve SSW JFETV2 A shld S HEATER GROUND A SLW JFET HEATER A ve SLW JFET HEATER A ve SLW JFET HEATER A shld SSW JFET HEATER A ve SSW JFET HEATER A ve 24 46 A3 __ 1 P 7 C l 14 42 60 11 1003 EE ae poh 28 4008 25 1 92 47 9l 6011 100 LU qu J j QUE EN 1 6464011 148 90 93 po 23 933 9 41 3 3
264. npBaffle Tmp N 4 gt 5257 04155 38 HSFPU 70 121100 P23 012 087 SPIRE FPUInpBaffleTmp N V TTT STA 5257 04155 38 HSFPU 70 121100 23 043 098 SPIRE FPU npBaffteTmp N l STA S257 04158 38 17 HSFPU 70 121100 P23 031 409 SPIRE FPUtnpBaffleTmp N SHD04 Les STA 5257 04155 38 17 Cable 5253 to 5258 Shd con HSFPU 70 121100 P23 011 together 073 SPIRE BSM SOB WFTmp N 71 STA 258 04155 38 18 HSFPU 70 121100 P23 014 074 SPIRE BSM SOB V TT STA 5258 04158 38 18 HSFPU 70 121100 P23 033 085 SPIRE BSM SOB I FTmp N V PTT STA 5258 04155 38 18 HSFPU 70 121100 P23 034 084 SPIRE BSM SOB 1 5258 04155 38 18 HSFPU 70 121100 P23 015 096 BSM SOB I FTmp N 5 005 ii STA 5258 04155 38 18 Cable 5253 to 5258 Shd con HSFPU 70 121100 P23 032 together 079 SPIRE PTC Htr N TT STB 5259 041BS 30 20 HSFPU 70 121100 P23 017 078 SPIRE PTC Htr N 1 8 TI T STB S259 04185 30 20 HSFPU 70 121100 P23 018 068 SPIRE PTC CUT STB 8259 04185 30 20 HSFPU 70 121100 P23 036 067 SPIRE PTC Htr N B STB 5259 041BS 30 20 70 121100 P23 037 090 SPIRE SHDC7 STB 259 041BS 30 20 Cable 5259514 HSFPU 70 121100 23 035 004 SPIRE FPU TP Faraday SFF 5250 010B0 30 Cable P23 Faraday Shd conto HSFPU 70 121100 P23 CH 3 Busbar tbc
265. nstrument integration with the S C and system level testing A full description of EGSE can be found in RD22 The Instrument EGSE for Herschel Integrated System Tests Deliverables FPU electrical simulator including simulation of the HSFTP S JFET Filter Boxes to enable integration of the HSDCU HSDPU HSFCFU and HSWIH Quick Look Facility to enable testing of the instrument at system level This will interface to the S C test environment Common instrument 5 16 3 Mechanical Ground Support Equipment MGSE MGSE is required to ensure safe handling of all instrument components during assembly integration and test procedures Further details can be found in RD 23 SPIRE FPU Handling and Integration Procedure MGSE ICD is given in annex 1 Deliverables Transport containers FPU and JFETs e DPU e DCU FPU handling lifting frames e FPU on transportation baseplate its own Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 51 5 16 4 Optical Ground Support Equipment OGSE The SPIRE FPU will be supplied with an alignment cube to allow an alignment check on the HOB to be carried out This SPIRE alignment cube can be removed and replaced such that the alignment is still valid Deliverables A Alignment cube
266. ode that permits accurate measurement of the point spread function Requirement SRD R 6 Optical field distortion should be less than 1096 across the photometer field of view Requirement SRD R 7 The photometer field of view shall be at least 4 x 4 arcminutes with a goal of 4 x 8 arcminutes Requirement SRD R 8 For 2FA feedhorns crosstalk shall be less than 1 goal 0 5 for adjacent detectors and 0 1 or less goal 0 05 for all non adjacent detectors in the same array for 0 5F pixels the requirement is 596 goal 296 to adjacent detectors and 0 1 goal 0 0596 to all others Requirement SRD R 9 The maximum available chop throw shall be at least 4 arcminutes the minimum shall 10 arcseconds or less Requirement SRD R 10 The rms detector NEP variation across any photometer array should be less than 2096 Requirement SRD R 11 The photometer dynamic range for astronomical signals shall be 12 bits or higher Requirement SRD R 12 SPIRE absolute photometric accuracy shall be 1596 or better at all wavelengths with a goal of 1096 Requirement SRD R 13 The relative photometric accuracy should be 1096 or better with a goal or 596 Requirement SRD R 14 SPIRE photometric measurements shall be linear to 596 over a dynamic range of 4000 for astronomical signals Requirement SRD R 15 For feedhorn detectors the overlapping sets of three detectors at the three wavelengths should be co aligned to within 2 0 arcseconds on the sky goal
267. olm Observatory Obs Fax 46 8 5537 8510 5 133 36 Saltsj baden E mail Sweden tloren astro su se University of Paola Andreani Tel 39 49 829 TBD Dipartimento di Padua Fax 39 49 875 9840 Astronomia di Padova E mail vicolo Osservatorio 5 andreani asirpd pd astro it 35122 Padova Italy Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 5 5 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 1 4 INSTRUMENT DESCRIPTION 4 1 INTRODUCTION For low background direct detection at wavelengths longer than around 200 jum the most sensitive detectors are cryogenic bolometers operating at temperatures in the 0 1 0 3 range SPIRE Spectral amp Photometric Imaging REceiver is a bolometer instrument comprising a three band imaging photometer covering the 200 500 um range and an imaging Fourier Transform Spectrometer FTS with a spectral resolution of at least 0 4 corresponding to A AA 100 at 250 um covering wavelengths between 200 and 670 um The detectors are bolometer arrays cooled to 300 mK using a refrigerator The photometer is optimised for deep photometric surveys and can observe simultaneously the same field of view of 4 x 8 arcminutes in all three bands Figure 4 1 Two halves of Spire photometer shown on left spectrometer on the right 4 2 SCIENTIFIC RATIONALE The wavelength range 200 700 um
268. omy monitoring software PER 5 13 4 Instrument Autonomy Housekeeping Packet Definition 5 13 5 Instrument Event Packet Definition All event packets are described in the SPIRE Data ICD SPIRE RAL PRJ 001078 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 39 This section details only those instrument event packets which have been identified as requiring action by the S C All events are sent as TM 5 2 Exception Reports See PS_ICD with 0 0500 ID 0x0520 Parameters A contains the Observation ID and Building Block ID Parameters B is not used The event packets therefore have the following format 000011 0 500 Length 25 00101010101110101010101010100 Event Sequence Counter Event IDs The following event IDs have been identified 000 DRCU Anomaly The DPU has detected an unrecoverable anomaly in the DRCU OxCO1O Anomaly The DPU has detected an unrecoverable anomaly in the DPU OxC100 Observation Anomaly The DPU has detected a problem during an observation 110 Observation Corrected The DPU has corrected an observation anomaly Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUME
269. on interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 34 1 The DPU has an internal free running 1MHz crystal clock that runs continuously from when its power quality becomes correct at power turn on This drives a counter that continuously synchronously increments and rolls over every 71 6 minutes The CDMU sends an asynchronous spacecraft time value message every second across the1553 S C bus followed by a seconds marker message at that spacecraft time At this time the DPU stores the spacecraft time and the current value of its internal counter For approximately the next second i e until it has determined the next spacecraft time and counter value pair the DPU determine times to label Spire data as the stored time incremented by the delta between the value of its counter corresponding to this time and the value of its counter when the data were sampled The DPU controls the Spire DRCU by passing commands across the Spire internal Slow Speed Interface sending all commands simultaneously to all three DRCU command interfaces At appropriate intervals it sends a DRCU counter reset command At the time of the end of the transmission of each such command the DPU assigns a time to this event as described and puts the result in Spire s housekeeping telemetry 2 The DRCU s two units the H
270. ont plate replaced with M3 x 8 long Temperature sensor interface shown on both sides of the L3 interface sub assembly Distance between S C connector I F and rear of JFET harness increased due to addition of 15 way connectors to JFET harness Dimension between S C connector plane and rear face of JFET module added New dimensions applied to L3 interface area Connector fasteners and nuts added to spacecraft connectors SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED SUPERSEDED ISSUES OF ALL DRAWING HARD COPIES TO BE DESTROYED KE 2953 KE 2953
271. opper Sensors 2 1 STP 1000 1 0E 06 1 0E 06 Drive P BSM Jiggle Sensors 3 1 STT 1000 1 0E 06 1 0E 06 BSM Jiggle Sensors 2 1 STP 1000 1 0 06 1 0 06 4 2 STQ 1000 1 0E 06 1 0E 06 Photometer Stimulus Heater 4 2 STQ 10 7 0E 03 1 8E 03 BSM Launch latch sense 2 1 STP 1000 1 00E 03 0 BSM Launch latch solenoid 2 1 STP 10 3 5E 02 0 BSM Chop motor drive 4 2 STQ 10 4 0E 02 2 0E 02 BSM Jiggle motor drive 4 2 STQ 10 4 0E 02 5 0E 03 HSFPU J27 MDM 37 HSFPU P27 37 SMEC Thermometry 8 4 STQ 1000 1 0E 06 1 0E 06 SMEC LVDT Primary 2 1 STP 5 5 0E 03 2 5E 03 5 SMEC LVDT Secondary 4 2 STP 50 5 0E 05 5 0E 02 15 SMEC Launch Latch 4 2 STP 5 4 0E 01 0 00 15 Launch Latch Rob 4 2 STP 5 4 0E 01 0 00 15 SMEC Launch Latch Confirm 4 2 STP 5 1 0E 03 0 0E 00 15 HSFPU J29 MDM 37 HSFPU P29 MDM 7 Drive Coil 2 1 STP 5 1 0E 01 8 0E 02 15 SMEC Drive Rob 2 1 STP 5 1 0E 01 0 0E 00 15 SMEC Drive coil voltage sensor 2 1 STP 500 1 0E 05 1 0E 05 15 SMEC Position sensor supplies 2 1 STP 100 1 0E 03 1 0E 03 5 SMEC LED Power 2 1 STP 100 1 0E 03 8 0E 04 5 SMEC Position sensor photodiodes 6 3 STP 1000 2 0E 05 2 0E 05 5 SMEC Position sensor photodiodes FB 6 3 STP 1000 1 0E 05 1 0E 05 5 C12 CVV 12 HSFPU J20 MDM 375 HSFPU P20 MDM 37P Sorption Pump Heater 4 0 TQ 10 2 5E 02 0 Aux R Heat switch heaters 8 0 TQ 50 1 5E 03 0 Various cooler thermistors 20 10 STQ 1000 1 0E 06 0 HSFPU J22 MDM 37 HSFPU P22 MDM 37P Spectrom
272. osure with the JFETs heated internally to their optimum operating temperature of 120 K The SPIRE warm electronics consist of two boxes with direct connection to the FPU the Detector Control Unit DCU and the Focal Plane Control Unit FCU together these boxes are termed the Detector Readout and Control Unit DRCU plus a Digital Processing Unit DPU with interfaces to the other two boxes and the spacecraft data handling system The DCU provides bias and signal conditioning for the detector arrays and cold readout electronics and reads out the detector signals The FCU controls the FPU mechanisms and the He cooler and handles housekeeping measurements The DPU acts as the interface to the spacecraft including instrument commanding and formats science and housekeeping data for telemetry to the ground Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 3 4 4 HARDWARE DESCRIPTION The SPIRE instrument consists of Focal Plane Unit FPU This interfaces to the cryostat optical bench and the 4 K and 2 K temperature stages provided by the cryostat Within the unit further cooling of the detector arrays to a temperature of around 300 mK is provided by refrigerator which is part of the instrument JFET box for the photometer detectors This box is mounted on the optical bench ne
273. pment has been labelled the Instrument Station in earlier documentation even though it will consist of several workstations and associated peripherals To clarify this situation the equipment is now called the Instrument EGSE IEGSE The SPIRE EGSE is fully described in RD 22 The Instrument EGSE for Herschel Integrated System Tests A list of EGSE supplied equipment can be found in section 5 16 2 of present IIDB 6 3 COMMONALITY Taking into account that it is a fundamental design goal of the Herschel Planck mission that commonality should be pursued to the maximum extent possible the Herschel instrument teams have been actively engaged in investigating such possibilities 6 3 1 EGSE A common EGSE system has been developed as a collaborative effort between instrument groups In addition it has been agreed that this system would be applicable at various times during all the phases of the mission listed below Subsystem Level Testing Instrument Level Testing Module and System Level Testing n orbit instrument commissioning Performance Verification Routine operations In the interests of minimising the cost and maximising the reliability of such a system through the different phases the EGSE will based on SCOS 2000 this system will be used in the ground segment by the MOC for controlling the satellite The cost of the system essentially free its proven use in similar situations for other
274. r 6 litre Charge 55 7 50 Total Internal External cooler 45 Load 26 microWatts 40 l 28 microWatts A 30 microWatts 35 5 32 microWatts 30 25 1 9 2 1 23 25 27 29 Evaporator Tempearture at end of Condensation Kelvin Figure 8 Cooler hold time ve evaporator temperature at end of condensation and average total load on evaporator Figure 8 is the same as one from the IHDR but with the above condensation efficiencies also included These curves are an approximation in that they ignore the small extra demands on the cooler from all loads during the 2K to 300mK cooldown and the heat capacity during this period of all 300mK components besides that of the helium itself However these effects are small and the approximation is good Note There is one cooler variation still under consideration by Spire The requirement that the evaporator itself be 2K at the end of the condensation phase typically 1 85K at the cooler s heat switch interface inside the instrument is sufficiently challenging to achieve that we were considering putting the shunt on the pump s strap rather than on the evaporator s see thermal overview drawing at the start of this section This would avoid 15mWatts from the shunt travelling down the evaporator strap at this stage in the recycling thus avoiding its contribution to the temperature drop along the strap Ca
275. r cable shield is connected to the connector back shells For the non bolometer harnesses C10 C13 these links are discrete wires rather than a closed shield This implementation is consistent with the grounding drawing figure 5 10 2 All relevant details of the termination connectors not included in the SPIRE HDD are given in Annex 6 Making SPIRE ESD Safe SPIRE RAL NOT 002028 5 10 1 Harness and Connectors The cryoharness interface pinout shall be compliant with RD 19 SPIRE RAL PRJ 000608 Issue 1 1 and updated pages for harness bundles 4 and 6 identified by SPIRE HDD 1 1 Deltas ref SPIRE RAL NOT 001819 given in Annex 5 The Spire harnesses shall be compliant with the requirements specified in Annex 3 Summary of SPIRE cryoharness wiring functions Figure 5 10 1 below gives an overview of the Spire harness layout Note that the Cryo harness i e series C and S are ESA provided and not Spire flight H W whilst the series apply only for instrument test and are not Spire flight items The two F harnesses FPU sub system F harness between JFETs and FPU HSFPU HSJFP and HSFPU HSJFS are provided by SPIRE with the instrument units Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 27 E TT 1 C13 wa detail FPU sub ss eem F ha
276. raster pointing using its internal BSM 5 12 2 Pointing The Spire instrument requires an absolute pointing error of better than 1 5 arcsec r m s goal and a relative pointing error of better than 0 3 arcsec r m s per minute This is achieved by the peak up mode in case the pointing goal values are not fully achieved by the S C Spire requires to be able to deduce where Herschel is pointing to 0 1 of its smallest pixel IFOV 5 12 3 On Target Flag OTF For pointed observations SPIRE requires an On Target Flag It will be provided in the spacecraft telemetry and will specify the acquisition time to a precision of better than 0 1 second TBC to be relaxed This is required for the correct processing of the Spire data on the ground it is not required for Spire operations Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 38 5 13 ON BOARD HARDWARE SOFTWARE AND AUTONOMY FUNCTIONS 5 13 1 On board hardware There is a single on board computer in each of the prime and redundant SPIRE HSDPUs Each HSDPU shall have a different 1553 address The HSDPUs have the only non hard coded on board software used in SPIRE 5 13 2 On board software is assumed that the Spire warm electronics will remain powered during all operational phases DPU will download baseline software from ROM dur
277. rated System Test eus 583 _ Table 7 2 1 SPIRE Instrument testing 7 3 Operations Covered in other applicable documentation as follows Herschel Planck Operations Interface Requirements Document OIRD AD 4 Herschel Science operations Implementation Requirements Document Herschel SIRD Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 7 3 7 4 Commondlity The SPIRE system level integration and test programme is compatible with that laid out in the IID A chapter 7 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT DATE 21 06 2004 PART B SPIRE IID B SPIRE ISSUE 5 9 8 1 8 PRODUCT ASSURANCE The instrument will comply with the Product Assurance Requirements for Herschel Planck Scientific Instruments AD2 Details are to be found in SPIRE Product Assurance Plan RD7 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 5 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 9 1 9 DEVELOPMENT AND VERIFICATION 9 1 General Further details can be found in RD25 SPIRE Instrument Qualification Requirements These are guidelines th
278. rist straps or other suitable method When the FPU is not connected electrically to the warm electronics the chassis is isolated from ground 5 15 1 1 Transport Container The Spire FPU HSFPU will be transported in a purpose built container that provides environmental protection the inner bagging or container shall be opened only in the Herschel cleanroom The transport container is fitted with shock recorders The HSFPU transport container is described in RD23 5 15 1 2 Cooling and Pumping restrictions During cryostat warm up or cool down phases Above 100 the rate of temperature change dT dt shall not exceed 20 K hour Below 100K the rate of temperature change dT dt shall not exceed 50 K hour The rate of depressurisation pressurisation dP dt shall not exceed 50 mBar min 5 15 1 3 Mechanism positions For reasons of possible damage caused by vibration during transport the spectrometer mechanism SMEC will be transported in its launch latched state There are no limitations on any other mechanism 5 15 1 4 Unpacking Procedure The procedure for removing and installing the HSFPU from its transport container is given in document RD 23 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 42 5 15 2 JFET Filter Boxes 5 15 2 1 Transport Container The Spire JFET Filter Boxes HSFTP
279. ronics amp ON OFF OFF ON N HSDCU mechanism drive electronics HSDPU Digital Processing Unt ON OFF ON ON ON ON Operational Inactive Either ON or OFF depending on instrument configuration Table 5 9 3 Power status versus instrument modes 5 9 6 Supply Voltages 5 9 6 1 Load on main bus The total power load Spire places on the 28V main bus is defined In the Spire Budgets Document The following is an extracted summary Reference HP SPIRE REQ 0020 The SVM shall provide the allocated power budget as defined hereafter The average and peak power values correspond to worst case conditions i e taking into account the specified supply bus voltage range 26V and 29V Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 23 Ave BOL TBD Of 0Ow ____ 0 Project Code Instrument Unit Mean load per LCL HSDPU HS Digital Processing Unit 15 3 W HSFCU HS FPU Control Unit 80 0 W The average and peak power values correspond to worst case conditions i e taking into account the specified supply bus voltage range 26V 29V The average with margin and peak with margin total power loads are also to be provided The maximum associated Long Peak load on this LCL
280. rresses e Launch tLatch nl heb EGSE EGSE 1032 F3 Fs POPS PD PD Pi Pe PD PN pa pr pa 08 ee SPIRE TEST FACILITY 158 OONTROLSYSTEM TFCS EGSE I SPIRE HSCDMU SPIRE HSCDU 1 SIMULATOR EGSH SIMULATOR EGSE means bundied w PA PH repisced by shorting plugs for Might ROUTER Figure 5 10 1 SPIRE harness layout Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 28 5 10 2 Grounding To fulfil Spire s grounding requirements the HSFPU and both of the JFET racks need to be electrically isolated from the Optical Bench at their mechanical mounting points The same applies to the bolometer system harness screens SPIRE grounding diagram provided in the figures 5 10 2 and 5 10 3 below is for information The mechanical implementation of thermal straps insulation is described in section 5 6 1 2 CVV HSFPU at 4K COLD WARM 300 BDAs two 2K boxes tied into analoque ground but otherwise isolated E Analogue Ground plane DCU Bias Gnd extended to cold end by harness inner shields lt Differential analog
281. s HS PUMP Wait for the cooler to reach 290 mK ELSE IF SPSUBMD EQ 6 THEN CALL STATST N819 B IF 7819 0 2900 THEN Reproduction interdite ALCATEL SPACE Company confidential SCI PT IIDB SPIRE 02 124 PAGE 2 44 REFERENCE INTERFACE INSTRUMENT DOCUMENT TR ATE 06 PART B SPIRE IID B SPIRE ISSUE 3 3 SCI PT IIDB SPIRE 02 124 PAGE 2 45 1819 T819 DTIMEU 0 00175D0 Z 0 00175K sec is the evaporator approximated cooldown rate during recycling QI812 2 q pump add QI812 0 000 Additional Pump Power Dissipation 91817 0 000 PUMP 1818 0 000 SHUNT 819 0 000 91821 evap hs HS PUMP ELSE T819 0 29DO Additional Pump Power Dissipation QI817 pump PUMP QI818 0 000 SHUNT 91819 0 000 91821 pump hs HS PUMP END IF HS EVAP STATE OFF HS PUMP STATE ON QI801 0 0DO Photometer JFET QI802 0 0DO Spectrometer JFET QI805 0 000 BSM 1806 0 000 SMECm QI807 0 000 PCAL 1808 0 000 SCAL QI820 0 000 HS EVAP End of SPIRE Recycling Evaporator Node is now a Boundary Node at 0 29K Start of SPIRE Operation in Spectrometer MODE 12 hrs in SMECm Rz 1000 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE INTERFACE INSTRUMENT DOCUMENT ATE PART B SPIRE IID B SPIRE ISSUE ELSE IF SPSUBMD EQ 7 THEN CALL STATST N819 B T819 0 2900 HS
282. sation phase there is a cooling phase when and the cooler heat switches are swapped over to their normal operating positions the pump switch is on and the evaporator s off Timings for this have to be optimised by test This cooler requires that its pump and evaporator have separate straps back to Herschell s main 4Hell because otherwise heat pulse that occurs at this switch over could heat the evaporator and waste much of the available liquid charge Recycling of a flight type 6 litre coolers is sdhown below but with a warning that it has been obtained at unit level with 200mW K conductances for both the straps from the cooler heatswitch interfaces which are not Spire Herschel Interfaces to 4Hell at 1 7K When later results with flight type conductances are available these results will need updating For instance when the cooler is accommodated inside Spire the 350 pump power spike is likely to peak at only 500mW and of course therefore to last longer Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A4 5 e Evaporator Thermal shunt e Sorption pump Cryostat cold plate Level 0 k Heat switch pump e Titanium frame Level 1 Heat switch evaporator right scale left scale M enyeueduuo
283. serving modes shall include provision for 5 point or 7 point jiggle maps for accurate point source photometry Requirement SRD R 25 photometer shall have peak up observing mode capable of implemented using the beam steering mirror 4 8 2 Instrument Performance Estimates 4 8 2 1 Assumptions The sensitivity of SPIRE has been estimated under the assumptions listed in Table 4 1 Telescope temperature K Telescope emissivity Telescope used diameter m No of observable hours per 24 hr period Photometer Bands um 250 350 500 Numbers of detectors 139 F Telescope emissivity 00004 No of observable hours per 24 hrperiod Beam FWHM arcsec 17 Bolometer DQE Throughput Bolometer yield 08 Feed horn cavity efficiency 0 7 Field of view arcmin Scan mapping 4x8 Field mapping 4 4 Overall instrument transmission 3 3 Filter widths A AA Observing efficiency slewing setting up etc Chopping efficiency factor Reduction in telescope background by cold stop 4 FTS spectrometer Bands um 200 300 300 670 9 Numbers of detectors Bolometer DQE Feed horn cavity efficiency Field of view diameter arcmin Max spectral resolution cm Overall instrument transmission Signal modulation efficiency Observing efficiency 0 8 Electrical filter efficiency 08 C Table 4 1 Assumptions for SPIRE Performance Estimation N
284. shunt added into the strap to give a total power along it of 15mW Achieving the 46 hours lifetime requires a minimised total load on the 300mK evaporator and also on the cooler achieving its full litre latent heat energy rating Spire should only place an external load on the cooler such that the total load remains below 29 Watts Not achieving an evaporator temperature of 2K at the end of the condensation phase would cause an unacceptable reduction in the amount of condensed helium in the evaporator available for next operation phase This is computed to be Typical Computed Condensation Efficiencies 2 5 2 7 2 9 Evaporator Temperature at end of Condensation Kelvin Figure 7 Estimated Condensation efficiency 96 He liquefied vs evaporator temperature A fraction of the He charge is expended cooling both itself and the evaporator detectors down to 300mkK which is taken as the end of recycling This leaves an amount of He available to keep the Spire 300mK section cooled for the next 46 hrs The evaporator temperature at the end of the previous phase is again critical to minimising He usage for this pre cooling process and 2K is required Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE A4 7 Typical Computed Holdtime fo
285. side uses different electrically isolated sensors and will therefore have subtlety differing electrical to temperature calibrations Note that the accuracy columns that follow refer to the performance of the complete system including cryoharness and electronics not the sensors alone Resolutions and Accuracy will need to be further defined as they are actually temperature dependant Cernox sensors type CX 1030 are used for all HSFPU SPIRE conditioned housekeeping temperatures The below table is consistent with RD19 Location IN HSFPU Acronym Sensor Type Temp Range Resol Acc SLW 1 T SIW 1 Ge Thermistor 0 2 gt 5 0 5 2mK SEW 2 i NTD Ge Thermistor 2 SLW BDA 2 NTD Ge Thermistor 0 2 K gt 5 K 2mK 0 2mK 0 2mK 50mK 2mK 2mK 5OmK 5mK 5m TOmK TOmK Sorption Pump Heat Switch 5 1030 1 gt 50 10mK 1030 0 2 gt 5 CEHS 10 ImK 5mK 5mK dL BSM BSMM 1030 3K gt 20K 10mK 10 5 5 CX 1030 3K gt 20K TOmK SMEC SOB I F _ 55 1030 3K gt 100K 50mK NTD Ge Thermistor is equivalent to a detector element but it is not mounted on an isolating web 5 Table 5 7 5 1 SPIRE Instrument Temperature Sensors 5 7 5 2 Shutter Temperature Sensors The SPIRE shutter has been removed Temperature sensors are therefore not required Reproduction interdite ALCATEL SPACE Company
286. sitive to microvibrations between 0 03 Hz and 300 Hz with the potential effect of displacing the SMEC suspended mirrors from their optical positions The bolometers as they are accommodated probably have a similar susceptibility to HOB driven microvibrations This is potentially due to harness flexure capacitance changes rather than to movements of the detector elements themselves Spire needs knowledge of the level of the microvibration induced forces on the HSFPU at its HOB interface in order to ensure they can be mitigated The expected levels of input acceleration are to be provided by ESA Alcatel over the frequency range between 30 Hz and 300 Hz 5 6 1 2 Thermal Straps SPIRE requires the following thermal straps 0 thermal straps 2 Level 1 thermal straps 2 Level 3 thermal straps The mechanical I F geometry fixing torque mechanical load cases etc for each of these straps is as baselined in the IID A See section 5 4 for positions on Spire and section 5 7 for more details The HERSCHEL to Spire interfaces for the LO straps are at three standardised points just above the HOB plate For information inside SPIRE these thermal straps will be steadied by non metallic supports on the outside of the FPU designed to minimise the forces the straps can apply to thermal lead throughs but not be Ohmic shorts Separate supports are needed to minimise cross coupling between the two sorption cooler straps SPIRE JFET L3 I F
287. sitivity levels are comparable to the figures in the SPIRE proposal Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 1 5 INTERFACE WITH SATELLITE 5 1 IDENTIFICATION AND LABELLING Each individual instrument unit is allocated two unique identification codes project code which is the normal reference used for routine identification in correspondence and technical descriptive material a spacecraft code finalised by the spacecraft contractor in accordance with the computerised configuration control system to be implemented and used in particular for connector and harness identification purposes All of these have now been given a working designation anyway as work has progressed The project code shall form part of the spacecraft code See IID A section 5 1 The project codes allocated to this instrument are Project code Instrumentunit Location Temperature HSJFP JFETs Photometer HSFPU Focal Plane Unit HSWIH See section 5 10 The HSFCU is a physical unit containing three functions the HSSCU and the HSMCU meaning the HS Sub System Control Unit and HS Mechanisms Control Unit respectively plus the HSPSU that provides secondary power to all parts of the Spire DRCU Documentation may refer to a DRCU or Detector Readout and Control Unit Th
288. space projects and the support provided by ESOC contribute to a cheaper and more reliable system use the same interfaces between the EGSE and other systems in order to improve reliability through reuse throughout the mission Reproduction interdite ALCATEL SPACE Company confidential REFERENCE 3 SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 6 2 Provide a constant implementation of the Man Machine Interfaces Data Archiving and Distribution facilities On board Software Management On board Maintenance e g Software Development Environment Software Validation Facility Common User Language for Test procedures and in orbit operations 6 3 2 Instrument Control and Data Handling three Herschel instruments are using the same supplier IFSI for their on board control and data handling hardware and software systems which interface to the spacecraft This has ensured commonality in the areas of on board microprocessors instrument internal interfaces On board Programming language Software Development Environments Software Validation Facilities In addition the on board software provides commonality in its non instrument specific functions A common instrument commanding scheme has also been agreed and will be implemented by the instrument teams 6 3 3 Other areas Other areas of possible commonality will
289. ssed through to the Cryoharness and the HSFPU is negligible such that the dissipation values given here are the same as those corresponding to the unit power loads on the bus Section 5 9 6 1 es Code HSDPU HS Digital Processing Unit 153W HSDCU HS Detector Control Unit 37 0 W Lower in spectrometer Mode HSWIR HS Warm Inter unit Harness Table 5 9 2 Power dissipation on the SVM Note This table takes precedence to any power dissipation value indicated in drawings of Annex 1 The above dissipations are essentially independent of observing mode with the exception that the baseline 15 to power EITHER the spectrometer OR the photometer bolometer systems at any one time The above figures are based on the higher dissipation values expected with photometer operation Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 22 The baseline is to empower either prime or redundant modules of Spire The instrument will therefore appear to the S C as simply cold redundant 5 9 4 Power on Planck Payload Module NA 5 9 5 Power versus Instrument Operating Modes The table below shows the status of the instrument subsystems in the various instrument modes Standby Parallel Detector Bias Photometer Cal Source Spect Cal Source Cooler BSM Mechanism HSFCU E out elect
290. status i e which Spire units are i e HSDPU and HSDRC Requested temperatures in Section 5 7 5 2 5 11 3 Timing and synchronisation signals Reference HP SPIRE REQ 0190 The S C shall provide Spire with a timing synchronisation typically every second to allow cross reference or synchronisation of the Spire clock to the spacecraft clock Reference HP SPIRE REQ 0200 So when using the telescope scan mode a start of scan indication will be sent be to the DPU to give a timing precision of better than 5 milliseconds although the actual UT of the pulse only needs to be within one second of its planned time This is required that the Spire data can be located time and correctly ground processed to link to Herschel attitude it is not required for the operation of the Spire instrument The Spire instrument typically works by its DPU unpacking S C commands to a lower level and sending those lower level commands to the DCU and FCU with timings that they can guarantee to keep up with There is a minimum of handshaking on internal interfaces and for instance the DPU has to be ready to receive science data packets from the DPU and FCU whenever they reasonably send them n these internal data packet headers are counter values permitting accurate datation of all values back to sequence start pulses sent from the DPU The scheme can be viewed on figure here after Considering Spire Data Timings figure Reproducti
291. t length is 256 octets Reference HP SPIRE REQ 0230 All Spire telecommands are defined in document RD3 Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 37 5 12 ATTITUDE AND ORBIT CONTROL POINTING 5 12 1 Attitude and orbit control For information Spire has the following instrument pointing modes Peak up mode The ACMS pointing ability quoted in the IID A 3 7 arcsec APE see also section 5 12 2 will not be good enough to prevent unacceptable signal loss when observing point sources with the photometer or spectrometer The Spire beam steering mirror will be used to perform a cruciform raster over the observation target and the offset between the required pointing and the actual pointing of the telescope will be provided via an ACMS Data Packet TM 5 1 from the Spire instrument to the S C The S C will then adjust the pointing accordingly Nodding mode If the telescope temperature stability time constant proves to be short compared with a typical pointed observation with Spire then the telescope must be capable of being pointed to another fixed position on the sky between 10 arcsec and 4 arcmin from the original pointing in an arbitrary direction with respect to the spacecraft axes The transition time between the 2 position for 4 arcmin apart shall be less than 32s
292. tas 448 C8 to HSJFP Overall Mechanical Drawing JFP 25 5 PSW JFP MDM 25 S PSW Type 1 JFP P06 MDM 25 5 PSW JFP P05 25 5 PSW SPIRE C8 Connector Backshell Details 255 07 139 37 to PSW Signals 255 07 139 37 to PSW Signals 255 07 139 37 to PSW Signals 255 07 139 37 to PSW Signals Harness Layup As C4 Name JFP 05 JFP P06 JFP P07 JFP P08 128Way 8 5 gt lt 8 12 Doc SPIRE RAL PRJ 001819 SPIRE HARNESS DEFINITION DOCUMENT Deltas O pe o mpm Dmm nr Dm __ 22 4 13 AD C C 360 95 2 1 2 1 13 AD 1441 3600 m Channel 11 24 96 p m E 241212 Channel 12 25 106 PSW C3 1 21 141421072 BAD 360 8 O sw E ETE a pT C 128 2 5 3 p Est E SEE Ed s 1 BAO 128 ob 1 M 4626 41 9 1 BAO 128 A C j 00800 ee ee Es 1 BAO 128 2 9 15 ONES E REESE E a pT 138602 puc x dcm BAO 128 2 O n 11 20 14 P 76 j Oe C A x BAO 128 A 21 7 8 EE EM NE a BAO 11 12842 S S 2 j 959 O wi
293. the Cooler The Sorption Cooler interfaces and operation are described in Annex 4 om M NS Thermal requirements Two major thermal requirements for SPIRE are its sorption minimum cooler cycle time of 48h and its detector temperature of lt 310 The table below shows the required operating temperatures and design heat flows at the thermal interfaces of the instrument unit with the cryostat or parts thereof In Orbit thermal requirements Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 16 SPIRE FPU thermal I F Max I F Temp Max Heat Load State Requirement Cooler Pump Operating 10 K 500 mW peak 10K 500 mW peak Ske sew arket rw pam vere ra ene HSJFS JFET Spectrometer 15 25 mW 15 25 mW Instrument shield eq Radiative temperature Notes e Assuming a He tank temperature of 1 7 K e Sorption Cooler Recycling phase is composed of 2 phases in sequence seeAnnex 4 for information Table 5 7 1 In Orbit thermal requirements Heschel Sorption cooler Straps expected heat flow profile amp associated Temperature Requirement at Interface during Cooler recycling Cooler recycling 7200s allocated 0 800 Pump cooling Phase 1560s 16 condensation Phase 3600s evaporator strap pump s
294. the interface bolts e Additional comments The JFET MGSE is rigidly attached to the FPU lifting plate they form one unit SPIRE confirms that the JFET lifting plate id thick enough to prevent vibrations proved by test Reproduction interdite ALCATEL SPACE Company confidential Doc Z SPIRE RAL DWG 001409 SPIRE Issue 11 INTERFACE DOCUMENT Date April 2004 Page 1 of 23 Forms Annex 1 to SCI PT IIDB SPIRE 02124 subject SPIRE MECHANICAL INTERFACE DRAWINGS 2004 04 21 PREPARED BY J DELDERFIELD 412 pud em 2 0100 Digitally signed APPROVED BY ERIC SAWYER M GRIFFIN eu Date 20040421 777 99 23 31 01 00 Issue 2 Issue 3 Issue 4 Issue 5 Issue 6 Issue 7 Issue 8 Issue 9 IssuelO Issue 11 Doc SPIRE RAL DWG 001409 SPIRE Issue 11 Date April 2004 INTERFACE DOCUMENT Page 2 of 23 Issue Drawing Change List The detailed changes for each drawing are shown just before the drawing Update to status as of 8th October 2002 Update to status as of 1st November 2002 FCU DCU amp Cryogenic ICDs changed see changelists where provided Update to status as of 24 2 03 JFET drawing versions raised Updated as to status of 27th March 2003 Non AVM DPU ICD included JFET ICDs updated small errors on JFET CDs fixed New versions of FPU and JFET ICDs see their individual changelists DRCU QM1 I F drawin
295. timulus Heater 496 4 0 TQ 30 9 00E 03 2 25E 03 Spectrometer Stimulus Heater 296 4 0 TQ 30 7 00E 03 1 75E 03 FCUJ23 DDMA 50 S FPU Thermometry A 44 11 STQ 1000 1 00E 06 1 00E 06 FCUJ25 DAMA 15 5 FCU P25 DAMA 15 P Thermometry 3 STQ 1000 1 00E 06 1 00E 06 Shield joined to all backshells Overshield gt 80 0 01uH 6 Doc No SCI PT IIDB SPIRE 02124 i Issue Rev No 3 0 Date 15 9 2003 Annex 3 Name 128 Way DRCU DRCU Harness Harness Description Number of Number of implementa Max Impedance Max Current Av Current Connector Connector Connector Connector Connector Conductors inner tion C pF L uH A per in A per Volts Label Type Label Type excl shlds Shields W Conductor Conductor 111 511 CVV 11 FCU J21 DAMA 15 S FCU P21 DAMA 15 P FPU Thermometry C 12 3 STQ 1000 1 00E 06 0 000001 Drive P FCU J19 DCMA 37 S FCU P19 37 BSM Chop Jiggle Sensors 4 2 STP 1000 1 00E 06 1 00E 06 0 4 BSM Chop Jiggle Sensors 6 2 STT 1000 1 00E 06 1 00E 06 BSM Launch latch sense 2 1 STP 1000 0 001 0 BSM Launch latch solenoid 2 1 STP 10 0 035 0 BSM Chop motor drive 4 1 STQ 10 0 04 0 02 BSM Jiggle motor drive 4 1 STQ 10 0 04 0 005 FCU J29 DCMA 37 P FCU P29 DCMA 37 S SMEC LVDT Primary 2 1 5 0 0025 0 SMEC LVDT Secondary 4 2 5 0 00005 0 SMEC Launch Latch1 4 2 5 0 SMEC Launch Latch1 Confirm 2 1 5 0 SMEC Launch Latch2 4 2 5 0 SMEC Launch Latch2 Confirm 2 1
296. to the FPU See FPU ICD in Annex 1 5 6 2 Outside Cryostat NA 5 6 3 On SVM The three units mounted on the SVM will each have attachment points for fixation to the equipment platform as shown in their External Configuration Drawings Interface flatnesses fasteners and tightening torques are alll defined on these drawings The Spire warm harness will be attached to the SVM via tie bases and wrap as defined in IIDA Annex 10and provided by Industry 5 6 4 On Planck Payload Module NA 5 6 5 Cooler valves and piping NA Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 14 5 7 THERMAL INTERFACES The cryogenic interfaces the most important category of interfaces for Spire s success and the most complicated They would provide the most gain to science performance from being improved The SPIRE reduced TMM is given in Annex 2 of present SPIRE heot flow diagram is given by the figure here under Three Photometer Detector Assemblies Cooler Evaporator lt 300 HELIUM TANK N a Spectrometer Detector Box ar mal ITE connections BOIL OFF COOLIN G Photometer BOIL OFF L2 BOIL OFF L3 Key Added Herschel Spire Heatswitch Electrical Structure Harness strap strap Radiatio
297. ton Didcot Oxfordshire OX11 England Telephone Institute 44 1235 446558 Telefax 44 1235 446667 E mail K J King rl ac uk Instrument Manager Reproduction interdite ALCATEL SPACE REFERENCE 5 02124 DATE 21 06 2004 ISSUE 3 3 Company confidential PAGE 3 1 REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 3 2 Dr Eric Sawyer Rutherford Appleton Laboratory Chilton Didcot Oxfordshire 11 England Telephone Institute 44 1235 44 6385 Teletax 44 1235 44 6667 E mail E C Sawyer rl ac uk Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 3 3 3 2 RESPONSIBILITIES INSTITUTE RESPONSIBILITIES ATC Edinburgh Edinburgh Beam mechanism CEA cooler Grenoble CEA SAp Paris Detector Readout and Control Unit ICC DAPSAS Centre Digital Processing Unit DPU and related On board S W JPL Caltech Na S Bolometer arrays and associated cold readout electronics California LAM Marseille Optics 5 mechanism MSSL Surrey Focal Plane Unit Structure University of Focal plane array testing filters dichroics beam dividers Wales Cardiff E y 9
298. tor Pin New 014 SPIRE SMEC Drv Sense Sen SMG S 5278 021 28 24 HSFCU 17 122200 P17 004 024 SPIRE 5 Drv Sense Sen SMG S 5278 021 28 24 HSFCU 17 122200 P17 005 023 SPIRE SMEC Drv Sense SHD03 SMG S 5278 021 28 24 Cable 5278 Shd HSFCU 17 122200 P17 023 009 SPIRE 5 PosSeLEDPwr N S SMH S 5279 021 28 25 HSFCU 17 122200 P17 007 002 SPIRE SMEC PosSeLEDPwr N SMH S 5279 021 28 25 HSFCU 17 122200 P17 008 003 SPIRE SMEC PosSeLEDPwr N SHD04 SMH S 5279 021 28 25 Cable 5279 Shd 026 011 SPIRE SMEC PosSensPwr N S SMH S 5280 021 28 26 027 004 SPIRE SMEC PosSensPwr N R SMH S 5280 021 28 26 HSFCU 17 122200 P17 028 010 SPIRE SMEC PosSensPwr N 5 05 SMH S 5280 021 28 26 Cable 5280 Shd HSFCU 17 122200 P17 009 The allocations on the 018 se S C 128 way connectors all SMJS 3281 021CC 28 27 HSFCU 17 122200 P17 010 019 SPlimatch SMJ S 281 021CC 28 27 HSFCU 17 122200 P17 011 029 SMJ S 281 021CC 28 27 Cable S281Shd HSFCU 17 122200 P17 029 056 SPIRE 5 PosPhDi 1FB N S SMK S 282 021CC 28 30 HSFCU 17 122200 P17 030 055 SPIRE SMEC PosPhDi 1FB N R SMK S 282 021CC 28 30 HSFCU 17 122200 P17 031 044 SPIRE SMEC PosPhDi 1FB N SHD09 SMK S 282 021CC 28 30 Cable S282 Shd HSFCU 17 122200 P17 012 042 SPIRE 5 PosPhDi 2 N I SMJ S 283 021 28 28 HSFCU 17 122200 P17 013 041 SPIRE SMEC PosPhDi 2 N l SMJ S 5283 021 28 28 HSFC
299. trap o 2 Strap Heat Flow W N Pump Strap Heat W Q W o lt T req Ei Evap Strap Temperature Requirement K 0 200 700s 4 ien s 350 J Pump Strap Temperature 0 100 2 p Requirement A ENEE AA EEEE EEEN EEEE 0 000 140 1 T T T T 0 0 1000 2000 3000 4000 5000 6000 7000 5 Figure 5 7 2 Expected heat profiles on evaporator and Pump strap during recycling 5 7 1 4 Worst case temperatures The cryogenic units must withstand the full thermal environment given in the IIDA including repeated max 72hr 80 bake outs and indefinite 60 C soak Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 17 The units must withstand a baking of 80 C for 72 h plus the ramp up and ramp down operations Taking into account the ramp up and ramp down operations between room temperature and 80 C the complete bake out duration will be about 2 weeks 5 15 2 5 SPIRE FPU Thermal I F Non operating temperatures SPIRE SM Detector enclosure 814 6 SPIRE Godler Pump ho
300. ts Config Six SPIRE Type V and N mounted on Tacks Type VIII SPIRE Type VI Comments Safeing plug SPIRE Type V on Photometer bias Safeing plug SPIRE Type VI on Spectrometer bias Safeing plug SPIRE on C11 and C13 Backshell SPIRE Type VIII on other active exposed harnesses See Appendix One for details of the applicability of safeing plugs in this configuration Making SPIRE ESD Safe Draft 0 2 for comment Page 11 11 SPIRE RAL NOT 002028 Friday 18 June 2004 DKG Instrument Location State of Instrument ESD Protection Details Configuration FPU JFETs integrated on optics bench Cryoharness fully integrated DRCU fully integrated Config 7 Comments For EQM Only Phot Bias C3 PLW Detector harness C6 and prime S S harnesses C10 C11 connected For PFM All detector and subsystem harnesses used Making SPIRE ESD Safe Draft 0 2 for comment Page 12 12 SPIRE RAL NOT 002028 Friday 18 June 20
301. ue signal feeds using analogue ground as screen but with this screen not low impedance connected at the warm end External S C level Faraday cage provided by main chssis CVV etc Spire specific low noise Faraday cage HSFPU HSJFS HSJFP chassis all linked with harness overshield to backshell joined back to DCU Ohmically isolated at the cold end and with a inner volume filtered at the JFET units Filter connectors T section with C to case A secondary power feed with extra filters so very quiet w r t bias analogue ground Figure 5 10 2 SPIRE Simplified Grounding scheme The Spire FCU itself and the DPU use a standard ESA type secondary power system whereas the DCU FPU and FCU supply sections shown above are an optimised system w r t minimising the overall bolometer analogue ground noise The FCU powers the DCU keeping the latter free of conditioning noise The FCU driven items in the FPU see figure 5 2 1 are considered less critical and will all be Ohmically grounded in the FCU Reproduction interdite ALCATEL SPACE Company confidential SCI PT IIDB SPIRE 02124 REFERENCE INTERFACE INSTRUMENT DOCUMENT PAGE 5 29 21 06 2004 3 3 DATE ISSUE PART B SPIRE IID B SPIRE Josuag JosuoSg gt lt Jod i pio Kepy r Udd19G YM GON 8 8 mmm
302. ugs PA PB that interconnect connector contacts as defined by Spire will be HERSCHEL provided and fitted whenever the EGSE is not connected which includes in flight Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 32 5 11 DATA HANDLING 5 11 1 5 11 1 1 Telemetry rate The table below gives the estimated telemetry rates in the different SPIRE modes excluding event packets For observing modes the Data Rate value gives the maximum continuous data rate during an observation the average data rate will be less due to the limited data rate used during configuration periods and the Packet Rate gives the number of telemetry packets generated by the instrument per second fractions indicate a packet Is generated at a frequency of less than one per second 1 2 3 indicates two packets are generated every 3 seconds The data rates include both instrument data and the TM packet overheads Science data rate Spectrometer only 12 3 1 16 1 3 Science data rate Parallel mode 10 1 11 Science data rate Serendipity mode 20 1 11 Table 5 11 1 Housekeeping and science data rates Notes e increase in telemetry rate would have science benefits total data rate allocation of 130Kbps is a limit the average including orbit recycling commanding periods
303. urrent 4 2 A D is composed of four 1N5811 rectifiers connected in series parallel Figure 5 9 2 HSFCU Power Input Circuit Configuration Note This HSFCU Power Input Circuit Configuration is given for information only 5 9 7 Keep Alive Line KAL Because Spire should not be switched on off frequently a KAL will not be implemented 5 10 CONNECTORS HARNESS GROUNDING BONDING Spire provides the SVM interconnect harnesses wired as per RD 19 and suitable for routing installation on the SVM as illustrated in the IID A as regards length connector back shells etc This is illustrated in figure 5 3 2 as in section 5 3 1 1 Herschel provides the cryoharness between the warm Spire units and the cryogenic ones on the HOB inside the CVV Figure 5 2 1illustrates how these are all in three sections 5 and The function pin allocations in the cryoharness has adopted 19 5 definitions up to issue 1 1 with corrections i e updated pages given in Annex 5 External to the CVV the harnesses are double isolated shielded with the outer shield linking the CVV connector bodies to the warm unit connector backshells and the inner one also linked to the warm unit connector backshells but passing through the CVV connectors on a ring of pins to join to the HSFPU JFET Faraday shield Internal to the CVV there are no harness overshields For the bolometer harnesses C1 C9 the Faraday shields are carried on internal cable when the second oute
304. uss BLAS WIRES Z f 2 21 FROM CRYOHARNESS L 128 129 1 e 12 1 2 J30 J SECTION B B SECTION 131 SCALE 5 1 SHOWING INSULATION 35 j 29 3 AND FIXING DETAIL LE J E SCALE 5 J 2 A FROM i A UA 41 26 Y o h 0 t OVER SHADED AREA REAR 131 al EE OF r 270 005 138 69 JFET y 39 T Cu ee H Hn JH HL m t 141 142 SEE NOTE gp s M T J43 REFERENCE HOLE re sl T PLANE C a 210 5 a 7 M5 amp 214 5 130 8 146 BIAS FEEDS INTO MODULES 48 1 L TEMPERATURE SENSOR INTERFACE SHOWN ON BOTH SIDES 4 L3 STRAP 2 x 6 HOLES THRO 4mm STRAP TO THERMAL CONTACT SURFACE DEFINED BY ENCLOSED AREA SEE NOTE 7 SUIT BUSHES IN SUB ASSEMBLY 17 149 77 0 005 NOTES BLOCK SHOWN IN WIREFRAME TO PERMIT J50 ITEM 19 TO BE BONDED TO ITEM 6 PRIOR TO ASSEMBLY VIEW OF BUSHES 151 v ITEMS 20 18 TO BE BONDED TO ITEM 5 PRIOR TO ASSEMBLY J 24 ITEMS 5 amp 6 TO BE PERMANENTLY GLUED TO MATING SURFACES 2 10 MAR 04 2953 UE 2 TO ATTAIN THE CORRECT MOUNTING INTERFACE DIMENSION AND TO COMPENSATE FOR ACTUAL een 5 JFET MODULE SIZES THE FOLLOWING PROCEDURE MUST BE FOLLOWED issue DATE No oew BY AD STATUS PARTS ARE TO BE MOUNTED TO PART 2 MEASURE
305. veat it s not clear yet if this alteration has other significant disadvantageous side effects and the project has seriously run out of time to put such a change into the programme Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 1 ANNEX 5 SPIRE HDD 1 1 DELTAS SPIRE RAL NOT 001819 Issue 4 08 07 2004 Reproduction interdite ALCATEL SPACE Company confidential SPIRE Doc Z SPIRE RAL NOT 001819 Issue 4 0 Date 08 07 04 HDD 1 1 Deltas Issue 2 0 of this document includes comments on the EADS 2 6 Harness Database Issue 3 0 of this document incorporates the decision reached on the polarity of the pins on the 128 way for the SMEC Position Sensor Power Spply Page of 36 Digitally signed by Douglas Griffin ougla cn Douglas Griffin o RAL SSTD 20 53 12 7 4 ou SET s Griffin F 2003 09 25 Signatur e Not Verified Subject HDD 1 1 DELTAS Issue 4 0 of this document incorporates the agreement reached between Astrium EADS and SPIRE regarding the ambiguity regarding shield config See pp30 36 of this doc The harness tables will be added incorporating the clarification in the average SMEC Drive Current Was 80mA Prime Robust not 40mA Prime 40mA Robust The DPU 28V S C I F will be updated according to HR S
306. with electrical insulation The SPIRE JFET L3 thermal strap interface shall be implemented as shown in the figure below The shape of the L3 thermal strap shall have a T shaped end bracket 40mm x 12mm The requirement for the two L3 straps are as follows Bolt hole tolerance 26 00 6 05mm Bolt spacing 25mm 0 1 according to AD3 1 Gold plated on both I F sides gt 10microns Flatness 0 05 roughness lt 0 4mircrons SPIRE will provide all needed clamping and fixation parts which will be equipped by SPIRE with an electrical insulation The H EPLM Contractor shall supply a T shaped end bracket of the flexible link for each JFET rack i e 2 JFET and 6 JFET as shown below SPIRE will provide the clamp block with insulated bushes The arrangement is shown in the figure 5 6 1 below Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 5 13 Saft Gadd EF ruri CLAMP BLOCK FASTENERS eto Spire puppligd argo ng een hata L3 STRAP Topper sah pold plated Temm maia 19 240mm ondglate with Z x mim holes Burr frec Horse el Supplied Figure 5 6 1 SPIRE JFET L3 interface including electrical insulation SPIRE L1 electrical insulation I F SPIRE L1 Electrical insulation is done internal
307. x 1 5D LONG Ra 0 4 MICRON OR BETTER E HELICOIL SCREWLOCK INSERTS FIT 2 OFF 757 79 3 POS BOTH SIDES 190 50 REF BELLVILLE WASHERS STACKED PARALLEL BY VISUAL INSPECTION ONLY OLD PLATED SURFACES UNDER EACH BOLT HEAD 65 50 36 00 SPEC PT No B0375 020 S GIVING 978N REF CLAMPING FORCE UNDER EACH BOLT HEAD LUBRICATE M4 BOLTS WITH MINIMAL AMMOUNT 15 00 38 50 OF APIEZON AP100 GREASE AND TORQUE DENOTES STAY OUT AREA BOLTS TO 2 2Nm RUNNING TORQUE TO PROTECT COLD STRAPS NOTE EVAPORATOR CONNECTION MAX TOTAL TORQUE 2 6Nm MEER OE Y ALL BOLTS ARE ST STEEL A2 18 8 304 USE MAX TORQUES FOR FLIGHT M8 amp e e m DIMENSIONED CENTRE Whee OA WO 5S SURFACE FINISH STRAP ATTACHMENT AREAS lt 0 4 MICRON OR BETTER BY D VISUAL INSPECTION ONLY WITH lt E ALOCROM 1200 SURFACE TREATMENT E 3 00 gt A 22 o ool EVAPORATOR COLD STRAP LEKE SUPPORT 6 POS Glo o O 7 DETECTOR o PUMP P BOXES LEVEL LEVEL 0 9 o Q 2 9 i 9 9 o 900 gt 9 606 Q 252 gt 9 o M o e m A DO 8 x x ml o N E e N 4 b O 9 N o
308. xt to the photometer side of the FPU and contains JFET preamplifiers for the detector signals The JFETs operate at around 120 K and are thermally isolated inside the enclosure JFET box for the spectrometer detectors This box is mounted on the optical bench next to the spectrometer side of the FPU and contains JFET preamplifiers for the detector signals The JFETs operate at around 120 K and are thermally isolated inside the enclosure Detector Control Unit on Herschel SVM A warm analogue electronics box for detector read out analogue signal processing multiplexing A D conversion and array sequencing Focal Plane Control Unit on Herschel SVM A warm analogue electronics box for mechanism control temperature sensing general housekeeping and He refrigerator operation It conditions secondary power both for itself and for the DCU Digital Processing Unit on Herschel SVM A warm digital electronics box for signal processing and instrument commanding and interfacing to the spacecraft telemetry Warm interconnect harness on Herschel SVM Harness making connections between SPIRE electronics boxes Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 4 4 5 SOFTWARE DESCRIPTION The SPIRE OBS will carry out the following functions Read and log housekeeping data and packetis
309. y meaningful data and use the full telemetry bandwidth It is assumed that any calibrations required will also be done in the observe mode TBC For latest information refer to RD 17 4 7 1 Photometer Observing Modes The photometer can carry out essentially three kinds of observation chopping jiggling and scanning and it is envisaged that these will form the basis of three Astronomical Observation Templates AOTs to allow astronomers to specify their observations The three kinds of observation are implemented as 6 TBC observing modes named POFs Photometer Observatory Functions which are briefly described below Provision is also made for additional POFs for peak up and special engineering modes 4 7 1 1 Observation Point Source Photometry POF1 Chop without jiggling Reproduction interdite ALCATEL SPACE Company confidential REFERENCE SCI PT IIDB SPIRE 02124 INTERFACE INSTRUMENT DOCUMENT PART B SPIRE IID B SPIRE DATE 21 06 2004 ISSUE 3 3 PAGE 4 6 This mode is for point source observations with reliable telescope pointing The SPIRE Beam Steering Mechanism is used to chop between two positions on the sky at a frequency of typically 2 Hz The telescope may optionally be nodded with a nod period of typically three minutes POF2 Seven point jiggle map This mode is for point source observations for which the telescope pointing or the source co ordinates are not deemed sufficiently accurate The SPIRE BSM
310. y to the HSFPU so together they only require one external I F strap to LO As shown above in figure 5 7 1 there are two other LO interfaces associated with the 300mK sorption cooler which is described below Not shown in the above overview are the small thermal loads on the Spire side of the I F on the three LO straps due to their necessary mechanical support to the FPU The main HSFPU mountings to the HOB are also designed to be thermally isolating so that the HSFPU can run at L1 whilst the HOB itself is at L2 HOB tends to warm the HSFPU which is why the structure and harness heat flow arrows are as shown When operational JFET racks have a comparatively high dissipation Fortunately within reason it is actually advantageous to run them a little warm They therefore attach further up the boil off line sequence to L3 Note that Spire plans to only power one rack at a time either spectrometer or photometer and depending on which is the more thermally demanding mode to operate in their order on the L3 pipe is significant Due to gas flow the earlier can heat the later with a heat path back into the FPU but not visa versa To provide the required overall thermal balance boundary the cryostat s inner instrument shield forms an enclosure at level 2 and the effective temperature seen from the surface of the HSFPU integrated over an outward hemisphere needs to be well specified Description of Operation and Interfaces for
311. ystems are switched on in this mode DRCU housekeeping data will be telemetered 4 6 5 Standby STBY Mode The spacecraft may be pointed in an arbitrary direction observing with another instrument for instance The instrument will telemeter only housekeeping information and perhaps some degraded science data see below at a rate very much lower than the full telemetry bandwidth This is presently baselined to be the photometer detectors on and at 300 mK i e the cooler will have been recycled previous to entering STANDBY All other sub systems will be switched off 4 6 6 Observe Mode OBSV Mode There are two basic sub modes for the observe mode Photometer and Spectrometer The details of the OBSERVATIONS to be carried out in OBSERVE mode are given in section 4 7 4 6 7 Cooler Recycle CREC Mode The He cooler will be recycled every 48 hours During this time the instrument will be switched off except for vital housekeeping and cooler functions TBC 4 6 8 SAFE Mode The instrument will be switched to SAFE mode in the event of any anomalous situation occurring whilst in autonomous operation This will be with the DPU on having been rebooted from a restricted set of software stored in ROM 4 7 OBSERVING MODES The spacecraft will be pointed in a specific direction or for mapping will either slew slowly over a given region of the sky or execute a raster pattern by movements of the telescope The instrument will take scientificall

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