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DRAM Control - Renesas Electronics
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1. Section Start Address PResetPRG 0x000400 PintPRG P 0x000800 C DSEC C BSEC D B OxFF6000 R S OxFFBDFO REJ06B0489 0200 Rev 2 00 June 2007 Page 8 of 12 tENESAS H8S Family DRAM Control 6 Flowchart Set interrupt mask set_imask_ccr 1 Initialize sections Initialize the uninitialized data area area B Copy initialization data area area D from the ROM to RAM area R INITSCT Provide initial settings to internal registers for SDRAM For the setting values refer to section 4 1 Initialization Processing Clear interrupt mask set_imask_ccr 0 DRAM 0x400000 lt 0x12345678 read_data Contents of 0x400000 in the DRAM DRAM write DRAM read REJ06B0489 0200 Rev 2 00 June 2007 Page 9 of 12 QEN ESAS H8S Family DRAM Control References Document Name How to Get the Document H8S 2378 H8S 2378R Group Hardware Download from the website of Renesas Technology Corp Manual REJ06B0489 0200 Rev 2 00 June 2007 Page 10 of 12 Website and Support Renesas Technology Website http www renesas com Inquiries http www renesas com inquiry csc renesas com Revision Record Description Rev Date Page Summary 1 00 Mar 09 05 First edition issued 2 00 Jun 15 07 Page 2 Correction to the DRAM refresh cycle in table 1 Page 2 Addition of three components to table 1 Page 2 Correction to the
2. Renesas makes no representations warranties or guaranties regarding the suitability of its products for any particular application and specifically disclaims any liability arising out of the application and use of the information in this document or Renesas products 7 With the exception of products specified by Renesas as suitable for automobile applications Renesas products are not designed manufactured or tested for applications or otherwise in systems the failure or malfunction of which may cause a direct threat to human life or create a risk of human injury or which require especially high quality and reliability such as safety systems or equipment or systems for transportation and traffic healthcare combustion control aerospace and aeronautics nuclear power or undersea communication transmission If you are considering the use of our products for such purposes please contact a Renesas sales office beforehand Renesas shall have no liability for damages arising out of the uses set forth above 8 Notwithstanding the preceding paragraph you should not use Renesas products for the purposes listed below 1 artificial life support devices or systems 2 surgical implantations 3 healthcare intervention e g excision administration of medication etc 4 any other purposes that pose a direct threat to human life Renesas shall have no liability for damages arising out of the uses set forth in the above and purchasers who elect to us
3. For details refer to the hardware manual REJ06B0489 0200 Rev 2 00 June 2007 Page 6 of 12 RENESAS DRAM Control 7 Burst Access Mode Setting A burst access mode can be set when connecting DRAM that supports the burst mode The burst mode refers to a mode that permits high speed access when identical row addresses are encountered in succession by simply changing column addresses after the row address is output In the RAS up mode bust operations are performed only when the DRAM space is contiguous such that if access to another external space occurs in the midst of access to the DRAM space the burst operations cease In the RAS down mode burst operations continue even if access to another external space occurs in the midst of access to the DRAM space The figure below illustrates examples of burst mode operation timing Because DRAM with a fast page mode feature is used in this application note a RAS up mode with a burst mode will be set b FEI LILI LI L Address bus Rowaddress Column address 1 Column address 2 RASn CSn UCAS LCAS WE HWR High level For reading OE RD i i i For writing A A ows SSES Figure 3 Burst Mode Operation Timing 8 Refresh Control Setting In accordance with DRAM specifications a CBR refresh can be issued at fixed intervals The refresh interval is set to 15 563 us in this application note Refreshing of DRAM 16 ms 1024 cycles 1
4. vocabulary used as product code to Part no in table 1 Page 2 Correction to the pin name in figure 1 from CS2 to RAS2 Page 3 Correction on the data size unsigned int to unsigned long in the table Pages 3 Correction on the fixed value of address 0x400000 to 7 9 Ox12345678 and an access unit to 4 bytes Page 4 Correction on the content in 1 Initial Values Page 7 Correction on the content in 8 Refresh Control Setting Page 8 Deletion of URL under table 2 Page 8 Correction on the text of 5 1 File Configuration Page 9 Correction on the content in 6 Flowchart REJ06B0489 0200 Rev 2 00 June 2007 Page 11 of 12 tENESAS DRAM Control Notes regarding these materials 1 This document is provided for reference purposes only so that Renesas customers may select the appropriate Renesas products for their use Renesas neither makes warranties or representations with respect to the accuracy or completeness of the information contained in this document nor grants any license to any intellectual property rights or any other rights of Renesas or any third party with respect to the information in this document 2 Renesas shall have no liability for damages or infringement of any intellectual property or other rights arising out of the use of any information in this document including but not limited to product data diagrams charts programs algorithms and application circui
5. 5 625 us Refresh timing in this application note Operating frequency 19 6608 MHz 50 86 ns Counting at 0 2 15 625 us 50 86 ns x 2 153 cycles 50 86 ns x 2 x 153 15 563 us Since 15 563 us lt 15 625 us set the RTCOR register to 152 153 1 4 2 DRAM Access The above settings enable access to the DRAM For this application the DRAM space is 0x400000 to OxXSFFFFF with an access unit of 4 bytes REJ06B0489 0200 Rev 2 00 June 2007 Page 7 of 12 l H8S Family E E N ESAS DRAM Control 5 Description of Sample Program 5 1 File Configuration Table 2 shows file configuration of this sample task Table 2 Description of Functions File Name Specification resetprg c Executed from reset vector address 0 if the MCU is reset intprg c Executed if an interrupt other than a reset occurs dbsct c Sets start and end addresses of the section used by _INITSCT function in resetprg c to section initialization table For details refer to sections 9 and 10 in the H8S H8 300H Series C C Compiler Assembler and Optimization Linkage Editor User s Manual H8S_2377_1 c Main routine of this sample task lodefine h Configuration definition file of internal registers stacksct h Defines stack size 5 2 Linkage The linkage addresses of each section are as follows In the HEW project files the linkage addresses can be referenced and set by Category section of Link librarq tab in option Standard Toolchain
6. Renesas Electronics does not warrant that such information is error free Renesas Electronics assumes no liability whatsoever for any damages incurred by you resulting from errors in or omissions from the information included herein Renesas Electronics products are classified according to the following three quality grades Standard High Quality and Specific The recommended applications for each Renesas Electronics product depends on the product s quality grade as indicated below You must check the quality grade of each Renesas Electronics product before using it in a particular application You may not use any Renesas Electronics product for any application categorized as Specific without the prior written consent of Renesas Electronics Further you may not use any Renesas Electronics product for any application for which it is not intended without the prior written consent of Renesas Electronics Renesas Electronics shall not be in any way liable for any damages or losses incurred by you or third parties arising from the use of any Renesas Electronics product for an application categorized as Specific or for which the product is not intended where you have failed to obtain the prior written consent of Renesas Electronics The quality grade of each Renesas Electronics product is Standard unless otherwise expressly specified in a Renesas Electronics data sheets or data books etc Standard Computers office
7. To our customers Old Company Name in Catalogs and Other Documents On April 1 2010 NEC Electronics Corporation merged with Renesas Technology Corporation and Renesas Electronics Corporation took over all the business of both companies Therefore although the old company name remains in this document it is a valid Renesas Electronics document We appreciate your understanding Renesas Electronics website http www renesas com April 1 2010 Renesas Electronics Corporation Issued by Renesas Electronics Corporation http www renesas com Send any inquiries to http www renesas com inquiry CENESAS 8 10 11 12 Notice All information included in this document is current as of the date this document is issued Such information however is subject to change without any prior notice Before purchasing or using any Renesas Electronics products listed herein please confirm the latest product information with a Renesas Electronics sales office Also please pay regular and careful attention to additional and different information to be disclosed by Renesas Electronics such as that disclosed through our website Renesas Electronics does not assume any liability for infringement of patents copyrights or other intellectual property rights of third parties by or arising from the use of Renesas Electronics products or technical information described in this document No license express implied or otherwise is grant
8. age 3 of 12 f 2 H8S Family E N ESAS DRAM Control 4 Description of Operation 4 1 Initialization Processing Before the DRAM can be accessed appropriate settings must be performed in order to connect the DRAM 1 Initial Values Register Reference Name Bit Name Value Description Section DRAMCR 10to8 RMTS2to 001 DRAM Space Setting 4 1 2 RMTSO Areas 3 to 5 Regular space Area 2 DRAM space DRAMCR 2to0 MXC2to 010 Address Multiplexing Setting 4 1 3 MXCO Sets the amount of row address shift Sets to 10 bits PBDDR 7to0 0x07 Address Bus Setting 4 1 4 PCDDR 7toO0 OxFF Sets address output for A10 to AO ABWCR 2 ABW2 0 Data Bus Width Setting 4 1 5 Sets to 16 bits PFCRO 2 CS2E 1 RAS2 Pin Setting Sets the PG2 pin as the RAS2 pin PFCR2 1 OES 1 OE Pin Setting DRAMCR 15 OEE 1 Sets the PH3 pin as the OE pin DRAMCR 12 CAST 0 Column Address Output Setting 4 1 6 Sets to 2 states DRAMCR 14 RAST 0 Row Address Output State Setting Sets the RAS assertion timing Asserts the signal at the falling edge of dina Tr cycle DRACCR 9 8 RCD1 00 Row Address Output State Setting RCDO Controls wait between RAS and CAS Sets to no wait DRACCR 13 12 TPC1 TPCO 00 Precharge State Count Setting Sets to 1 state ASTCR 2 AST2 0 Wait Control Setting Sets area 2 to 2 state access space with no wait DRAMCR 7 BE 1 Burst Access Mode Setting 4 1 7 DRAMCR 6 RCDM 0 Enables burst m
9. e Renesas products in any of the foregoing applications shall indemnify and hold harmless Renesas Technology Corp its affiliated companies and their officers directors and employees against any and all damages arising out of such applications 9 You should use the products described herein within the range specified by Renesas especially with respect to the maximum rating operating supply voltage range movement power voltage range heat radiation characteristics installation and other product characteristics Renesas shall have no liability for malfunctions or damages arising out of the use of Renesas products beyond such specified ranges 10 Although Renesas endeavors to improve the quality and reliability of its products IC products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under certain use conditions Please be sure to implement safety measures to guard against the possibility of physical injury and injury or damage caused by fire in the event of the failure of a Renesas product such as safety design for hardware and software including but not limited to redundancy fire control and malfunction prevention appropriate treatment for aging degradation or any other applicable measures Among others since the evaluation of microcomputer software alone is very difficult please evaluate the safety of the final products or system manufactured by you 11 In case Renesas products listed in th
10. ed hereby under any patents copyrights or other intellectual property rights of Renesas Electronics or others You should not alter modify copy or otherwise misappropriate any Renesas Electronics product whether in whole or in part Descriptions of circuits software and other related information in this document are provided only to illustrate the operation of semiconductor products and application examples You are fully responsible for the incorporation of these circuits software and information in the design of your equipment Renesas Electronics assumes no responsibility for any losses incurred by you or third parties arising from the use of these circuits software or information When exporting the products or technology described in this document you should comply with the applicable export control laws and regulations and follow the procedures required by such laws and regulations You should not use Renesas Electronics products or the technology described in this document for any purpose relating to military applications or use by the military including but not limited to the development of weapons of mass destruction Renesas Electronics products and technology may not be used for or incorporated into any products or systems whose manufacture use or sale is prohibited under any applicable domestic or foreign laws or regulations Renesas Electronics has used reasonable care in preparing the information included in this document but
11. equipment communications equipment test and measurement equipment audio and visual equipment home electronic appliances machine tools personal electronic equipment and industrial robots High Quality Transportation equipment automobiles trains ships etc traffic control systems anti disaster systems anti crime systems safety equipment and medical equipment not specifically designed for life support Specific Aircraft aerospace equipment submersible repeaters nuclear reactor control systems medical equipment or systems for life support e g artificial life support devices or systems surgical implantations or healthcare intervention e g excision etc and any other applications or purposes that pose a direct threat to human life You should use the Renesas Electronics products described in this document within the range specified by Renesas Electronics especially with respect to the maximum rating operating supply voltage range movement power voltage range heat radiation characteristics installation and other product characteristics Renesas Electronics shall have no liability for malfunctions or damages arising out of the use of Renesas Electronics products beyond such specified ranges Although Renesas Electronics endeavors to improve the quality and reliability of its products semiconductor products have specific characteristics such as the occurrence of failure at a certain rate and malfunctions under ce
12. ics products or if you have any other inquiries Note 1 Renesas Electronics as used in this document means Renesas Electronics Corporation and also includes its majority owned subsidiaries Note 2 Renesas Electronics product s means any product developed or manufactured by or for Renesas Electronics RENESAS ___arucarionnore H8S Family DRAM Control Introduction This sample task connects the DRAM to the H8S microcomputer by using the DRAM control function of the bus controller Target Device H8S 2377R Contents Ti ASPSCIICATIONS isi cesec ces fhck ck teeta oe eea tee aa ene de dapat a de enes ethic ened ea aaiae 2 2 CONTIQUPALION ye iccinces eeesesccse scale cad ad e nseneediuees oats sed chdianthteach daa ed saben gadtad dba dhevaniaieesuiecsesagieenishineiiied 2 3 DESCrIPTION OL FUNCHONS iwessa ulsterin adinei adnata i adi etandan 3 4 Description Of Operation isisisi iin a aiaa aaea EEEE N AEREA aaa SEREA EE 4 5 Description of Sample Program ccccccceseeeeecececeeeeeaeeeeaeeceeeeceaeeeeaaeeecaeeeeaaesesaaeseeeeeseeeesaeeeeaeeeeaes 8 Gx Plowchalt 22 nesta dain hee tinh cei dae A ote ae bled Mane dlp eee ete 9 REJ06B0489 0200 Rev 2 00 June 2007 Page 1 of 12 tENESAS 1 Specifications H8S Family DRAM Control This sample task connects the DRAM to the H8S microcomputer by using the DRAM control function of the bus controller 2 Configuration Table 1 shows the configurati
13. is document are detached from the products to which the Renesas products are attached or affixed the risk of accident such as swallowing by infants and small children is very high You should implement safety measures so that Renesas products may not be easily detached from your products Renesas shall have no liability for damages arising out of such detachment 12 This document may not be reproduced or duplicated in any form in whole or in part without prior written approval from Renesas 13 Please contact a Renesas sales office if you have any questions regarding the information contained in this document Renesas semiconductor products or if you have any other inquiries 2007 Renesas Technology Corp All rights reserved REJ06B0489 0200 Rev 2 00 June 2007 Page 12 of 12
14. ode Sets to RAS up mode Refresh Control Setting 4 1 8 RTCNT 7to0 0x00 Resets the counter RTCOR 7to0 152 Sets the refresh interval to within 16 ms 1024 cycles REFCR 7 RFSHE 1 Enables refresh REFCR 10to8 RTCK2to 1 Counts on 6 2 RTCKO REJ06B0489 0200 Rev 2 00 June 2007 Page 4 of 12 tENESAS DRAM Control 2 DRAM Space Setting The address space for the H8S microcomputer is divided into eight areas in units of 2 Mbytes A bus can be set for each area The DRAM can be connected to Areas 2 to 5 The following areas can be assigned to the DRAM space Area 2 if the space is 2 Mbytes or less Areas 2 to 3 if the space if 4 Mbytes or less or Areas 2 to 5 if the space is more than 4 Mbytes and up to 8 Mbytes The sample task in this application note uses 2 Mbyte DRAM and assigns Area 2 to the DRAM space with an available address range of 0x400000 to OxSFFFFF 3 Address Multiplexing Setting The DRAM space is multiplexed in terms of row and column addresses Therefore the amount of a row address shift needs to be set according to the address width memory capacity of the DRAM to be used Because the DRAM used in this application note has an address width of 10 bits the row address shift amount is also set to 10 bits 4 Address Bus Setting To use as an address bus the output mode must be set using the DDR register of the I O port 5 Data Bus Setting The data width 16 bits for the DRAM used in the application note mu
15. on of this sample task Table 1 Component H8S 2377 CPU board Part no HSB8S2377F Manufactured by Hokuto Denshi Co Ltd Configuration of This Sample Task Specification Board power supply input 3 3 V DC Operating frequency 19 6608 MHz MCU operating mode 4 EDO DRAM Part no MT4LC1M16E5TG6 manufactured by Micron Technology Inc Debugger High performance Embedded Workshop Compiler H8S H8 300 C C compiler On chip debugging emulator E10A USB Part no HSOOO5KCU02H Power supply for operation 3 3 V DC Capacity 1 Mwords x 16 bits Refresh cycle 16 ms 1024 cycles Version 4 02 00 022 Version 6 01 02 H8S 2377R 0 15 00 O 15 00 1 Mword x 16 bits Note Connections of address pins H8S 2377R DRAM DRAM MT4LC1M16E5TG6 Voc Address space Area 2 0x400000 to OxSFFFFF Figure 1 Connections between H8S 2377R and DRAM REJ06B0489 0200 Rev 2 00 June 2007 Page 2 of 12 QEN ESANS H8S Family DRAM Control 3 Description of Functions By using the DRAM control function of the bus controller this sample task directly links the DRAM to the H8S microcomputer writes the fixed value 0x12345678 to address 0x400000 reads the address and store it in the on chip RAM area read_data On Chip RAM Area Name Data Size Function read_data unsigned long Area to store data read from the DRAM REJ06B0489 0200 Rev 2 00 June 2007 P
16. rtain use conditions Further Renesas Electronics products are not subject to radiation resistance design Please be sure to implement safety measures to guard them against the possibility of physical injury and injury or damage caused by fire in the event of the failure of a Renesas Electronics product such as safety design for hardware and software including but not limited to redundancy fire control and malfunction prevention appropriate treatment for aging degradation or any other appropriate measures Because the evaluation of microcomputer software alone is very difficult please evaluate the safety of the final products or system manufactured by you Please contact a Renesas Electronics sales office for details as to environmental matters such as the environmental compatibility of each Renesas Electronics product Please use Renesas Electronics products in compliance with all applicable laws and regulations that regulate the inclusion or use of controlled substances including without limitation the EU RoHS Directive Renesas Electronics assumes no liability for damages or losses occurring as a result of your noncompliance with applicable laws and regulations This document may not be reproduced or duplicated in any form in whole or in part without prior written consent of Renesas Electronics Please contact a Renesas Electronics sales office if you have any questions regarding the information contained in this document or Renesas Electron
17. st be set Note that because access is made in units of 16 bits the least significant bit of an address is not connected and that connections are shifted by 1 bit See the connection diagram in section 2 Configuration 6 Signal Timing Adjustment Appropriate settings must be provided according to the AC characteristic of the DRAM to be connected and the operating frequency of the microcomputer The figure below shows fundamental access timing REJ06B0489 0200 Rev 2 00 June 2007 Page 5 of 12 H8S Family DRAM Control Address bus RASn CSn E HWR High level For reading OE RD Data bus WE HWR For writing OE RD High levei Data bus Note n 2to5 Figure 2 Fundamental Access Timing of DRAM Microcomputer Register to Adjust Symbol Description DRAM Specification AccessTiming Timing 0 Access cycle 19 6608 MHz 50 86 ns tRAH Row address hold time Min 10 ns 2 25 43 ns DRAMCR RAST tRCD Delay time between RAS Min 14 ns 1 56 76 29ns DRACCR RCD and CAS tCAS CAS pulse width Min 10 ns 50 86 ns DRAMCR CAST AST AST2 tDS Data in setup time Min 0 ns 50 86 ns AST AST2 Tp Precharge time Min 40 ns 50 86 ns DRACCR TPC As indicated in the above table the DRAM used in the application note can be accessed at fundamental access timing If a given access timing cannot meet the DRAM specifications it can be modified using the timing adjustment register
18. t examples 3 You should not use the products or the technology described in this document for the purpose of military applications such as the development of weapons of mass destruction or for the purpose of any other military use When exporting the products or technology described herein you should follow the applicable export control laws and regulations and procedures required by such laws and regulations 4 All information included in this document such as product data diagrams charts programs algorithms and application circuit examples is current as of the date this document is issued Such information however is subject to change without any prior notice Before purchasing or using any Renesas products listed in this document please confirm the latest product information with a Renesas sales office Also please pay regular and careful attention to additional and different information to be disclosed by Renesas such as that disclosed through our website http www renesas com 5 Renesas has used reasonable care in compiling the information included in this document but Renesas assumes no liability whatsoever for any damages incurred as a result of errors or omissions in the information included in this document 6 When using or otherwise relying on the information in this document you should evaluate the information in light of the total system before deciding about the applicability of such information to the intended application
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