CBC050 - Micross
Contents
1. CYMBET CORPORATION EnerChip CBC0O50 Rechargeable Solid State Energy Storage 50uAh 3 8V Features e All Solid State Construction e SMT Package and Process e Lead Free Reflow Tolerant e Thousands of Recharge Cycles e Low Self Discharge e Eco Friendly ROHS Compliant Electrical Properties Output voltage 3 8V Capacity typical 50uAh Charging source 4 00V to 4 15V Recharge time to 80 20 minutes Charge Discharge cycles gt 5000 to 10 DOD Physical Properties Package size Operating temperature Storage temperature 8 mm x 8 mm 20 C to 70 C 40 C to 125 C AppucATONS Standby supply for non volatile SRAM real time clocks controllers supply supervisors and other system critical components e Wireless sensors and RFID tags and other powered low duty cycle applications e Localized power source to keep microcontrollers and other devices alert in standby mode e Power bridging to provide backup power to system during exchange of main batteries e Energy Harvesting by coupling the EnerChip with energy transducers such as solar panels e Embedded Energy where bare die can be embedded into modules or co packaged with other ICs TS Note NIC No Internal Connection ic CYMBET ENERCHIP CBC050 M8C 200940 5 7 7 mm x 6 1 mm Bare Die 8 mm x 8 mm QFN SMT Package The EnerChip CBCO5O is a surface mount solid state rechargeable energy storage device rated for 52. CBC0O50 Solid State Energy Storage Package Dimensions 16 pin QFN package code M8 SIDE WEW 3 CHAMFERED CORNER FOR PIN 1 IDENTIFICATION 0 016x0 016 0 40x0 40 DS 72 01 Rev B PIN INDICATOR 0 035 0 004 0 90 0 10 f fe oe O a Or SIDE VIEW 1 0 315 0 004 8 002010 7 0 315 0 004 8 00 0 10 TOP VIEW SIDE VIEW 4 0 008 REF 0 20 REF SEATING rs 2 SIDE VIEW 2 0 000 0 002 0 00 0 05 0 250 0 003 6 35 0 08 16x 0 009 0 002 0 23 0 05 EXPOSED PAD 0 020 0 003 16x 0 50 0 08 i i NOTES 0 079 TYP o mm 0 079 TYP 1 PACKAGE DIMENSION DOES NOT INCLUDE MOLD 2 00 TYP FLASH PROTRUSIONS BURRS OR METAL SMEARING 2 COPLANARITY APPLIES TO THE EXPOSED PAD AS WELL AS THE EXPOSED TERMINALS 1 50 TYP MAXIMUM COPLANARITY SHALL BE 0 003 0 08 3 WARPAGE SHALL NOT EXCEED 0 004 0 10 4 CUSTOM PACKAGE BOTTOM VIEW Dimensions in inches mm 2009 2010 Cymbet Corporation Tel 1 763 633 1780 www cymbet com Page 3 of 4 EnerChip CBC050 Solid State Energy Storage Printed Circuit Board PCB Layout Guidelines and Recommendations Electrical resistance of solder flux residue on PCBs can be low enough to partially or fully discharge the backup energy cell and in some cases can be comparable to the load typically imposed on the cell when delivering power to an integrated circuit in low power mode Therefore solder flux must be thoroughly w
3. 0uAh at 3 8V It is ideal as a localized on board power source for SRAMS real time clocks and microcontrollers which require standby power to retain time or data It is also suitable for RFID tags smart sensors and remote applications which require a miniature low cost and rugged power source For many applications the CBCO50 is a Superior alternative to coin cell batteries and Supercapacitors Because of their solid state design EnerChip storage devices are able to withstand solder reflow temperatures and can be processed in high volume manufacturing lines similar to conventional semiconductor devices There are no harmful gases liquids or special handling procedures in contrast to traditional rechargeable batteries The EnerChip recharge is fast and simple with a direct connection to a 4 1V voltage source and no current limiting components Recharge time is 20 minutes to 80 capacity Robust design offers thousands of charge discharge cycles The CBCO50 is packaged in an 8 mm x 8 mm quad flat package It is available in reels for use with automatic insertion equipment 16 15 14 13 11 2 5 6 7 8 CBCO50 Schematic Top View 2009 2010 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 01 Rev B Page 1 of 4 EnerChip CBC0O50 Solid State Energy Storage Operating Characteristics Parameter Condition Min Typical Max Units Discharge covor r om o o P
4. Chip product in any products or applications in which the Cymbet EnerChip product is adopted for use and are solely responsible for all legal regulatory and safety related requirements concerning their products and applications and any use of the Cymbet EnerChip product described herein in any such product or applications Cymbet the Cymbet Logo and EnerChip are trademarks of Cymbet Corporation All Rights Reserved 2009 2010 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 01 Rev B Page 4 of 4
5. ashed from the board following soldering The PCB layout can make this problem worse if the cell s positive and negative terminals are routed near each other and under the package where it is difficult to wash the flux residue away To avoid this situation make sure positive and negative traces are routed outside of the package footprint to ensure that flux residue will not cause a discharge path between the positive and negative pads Similarly a leakage current path can exist from the package lead solder pads to the exposed die pad on the underside of the package as well as any solder pad on the PCB that would be connected to that exposed die pad during the reflow solder process Therefore it is strongly recommended that the PCB layout not include a solder pad in the region where the exposed die pad of the package will land It is sufficient to place PCB solder pads only where the package leads will be That region of the PCB where the exposed die pad will land must not have any solder pads traces or vias When placing a silk screen on the PCB around the perimeter of the package place the silk screen outside of the package and all metal pads Failure to observe this precaution can result in package cracking during solder reflow due to the silk screen material interfering with the solder solidification process during cooling A recommended CBCO50 PCB layout is shown in Figure 1 below Notice that there should not be a center pad on the PCB to ma
6. te with the exposed die pad on the CBCO50 package Again this is to reduce the possible number and severity of leakage paths between the EnerChip terminals pg eat O02 g Ma 0 234005 h 16 15 140 13 i y F u 1 pera _ e412 C 020 0 003 0 5 0 08 160 0 5020 4 10 oor TP nor TYP aa Tey CT T 2 00 TP D059 TIF ee iSo THR Dimensions in inches mm Figure 1 Recommended PCB layout for the CBCO50 package Do not route signal traces under the EnerChip as they could become shorted to the die pad as shown by the dotted lines on the package underside Soldering Rework and Electrical Test Refer to the Cymbet User Manual for soldering rework and replacement of the EnerChip on printed circuit boards and for instructions on in circuit electrical testing of the EnerChip Disclaimer of Warranties As Is The information provided in this data sheet is provided As Is and Cymbet Corporation disclaims all representations or warranties of any kind express or implied relating to this data sheet and the Cymbet EnerChip product described herein including without limitation the implied warranties of merchantability fitness for a particular purpose non infringement title or any warranties arising out of course of dealing course of performance or usage of trade Cymbet EnerChip products are not approved for use in life critical applications Users Shall confirm suitability of the Cymbet Ener
7. ulse Discharge Curent o fw Cell Resistance 25 C Chargecycle2 750 2000 Self Discharge 5yr average 25 C Non recoverable 2 5 Recharge Cycles 25 C capacity 4 1V charge n 40 C 50 depth of discharge Recharge Time to 80 of rated capacity Chargecycle2 4 1V charge voltage Chargecycle1000 Failure to cutoff the discharge voltage at 3 0V will result in EnerChip performance degradation cycles cycles cycles cycles 70 35 minutes 95 2 Charging at 4 0V will charge the cell to approximately 70 of its rated capacity 3 Typical pulse duration 20 milliseconds First month recoverable self discharge is 5 average Storage temperature is for uncharged EnerChip Note All specifications contained within this document are subject to change without notice EnerChip Discharge Characteristics Discharge Rate Performance 70 65 4 60 4 I 0 10 20 30 40 50 60 70 80 1 10 10 Discharge Capacity Ah Discharge Current pA Typical Discharge Characteristics Cell Voltage V Discharge Capacity Ah a el 0 Ordering Information Enercnip Part Number Description Notes CBCO50 M8C WP 5QOuAN in 16 pin M8 QFN Package waffle pack CBCO50 BDC WP 5OuAN Bare Die Contact Cymbet CBCO50 BUC WP 50uAh Bumped Bare Die Contact Cymbet 2009 2010 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 01 Rev B Page 2 of 4 EnerChip
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