Engineering User`s Manual
Contents
1. DISABLE_SITE 2 DISABLE_SITE 3 XMIN YMIN XSIZE YSIZE XMUL YMUL XOFS_1 YOFS_1 remove for Master_Slave operation XOFS_2 YOFS_2 XOFS_3 YOFS_3 XOFS_4 YOFS_4 RETEST_BINS 351 Spe VL 12 13 RE_TEST 1000 RE_TEST 1000 Retest bin RE_TEST 1000 definitions RE_TEST 10 1000 RE_TEST 11 1000 RE_TEST 12 1000 RE_TEST 13 1000 RE_TEST_LIMITS 100 5 Processing Retest Information The new Die Retest software uses the lowest bin number for retested die i e After moving to the new touch down and retest a new set of test results will be available The results having the lower non zero bin numbers will be used for each die An exception to this logic is NOT_OVER_TURNABLE_BINS The plan file test_switches entry NOT_OVER_TURNABLE_BINS 5 6 7 means that anytime these bincodes are detected on a die they stay and are not replaced with any other bincode even another from this same list if it comes along later as the result of a retest 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering Three Touchdowns Maximum Die retesting can touch down on a single die three times maximum under certain retest scenarios For example 3 touchdowns on these two die J quad fead touchdown 4 DN quad head touchdown 3 Z N quad head touchddwn 2 J quad head touchdown 1 If the head is scanning from left to right and encounters the left retest die it will shift one die to the right to put a different sit2. t 1OPRC_MAIL NAME mailbox D_IGINIT command completed Ready for new command 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 16 A new screen will appear on the VT monitor Enter Option 1 corresponding to 1 Test Plan and press ENTER pata log 3 File type A Device Type B Test Pou C Option File B Froder File Ladd Wafer H lesert Wafer K Mext Usfer T feeove Last Ufer Delete Wafer Prev Weler z frase Seqecece A tor PTION A popup asking you which directory listing you want will appear For production use the up and down arrows to choose Production and then press the lt Enter gt key 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 17 A listbox with the plan files will appear on the screen Use the lt next page gt option to page through the entries then arrow to the program that you entered in the program section of the Sort Versatest Traveler This information can be obtained from 001 02963 S23_F_A When you have selected the correct program press ENTER PRODUCTION lt previous page gt ft32c64f ft363220 ft363720 ft36c302 ft36c302 4s ft36c320 ft36c320 4s ft36c341 ft36c341 4s ft36c370 lt next page gt Selecting a plan file will clear all of the wafers To enter a new set of wafer numbers to run select option E Add Wafer by typing in E and pressing lt Enter gt For each wafer two popups will appear T
3. 24 Type 010 0 016 U52 048 HeadLoc lt 10 14 gt The wafer number shown on the V1000 Monitor screen is NOT valid e Since the new Die Retest software cannot write to this area of the screen the Wafer number displayed here is NOT Valid e Use the Wafer number at the top of the wafer map display instead DATA Bins Lot 2 Wafer 24 Tvpe 010 0 032 048 HeadLoc lt 10 14 gt To remove a wafer for inspection follow instructions in OPL 001 02633 S03_5 DO NOT remove the cassette while the lot is in process If the 5 wafer fails inspection inspect all wafers back to the last know good wafer determine the cause of the failure and take the appropriate action make adjustments to the setup pull the probe card and restart the setup put the VT down to maintenance etc NOTE Any time adjustments are made to the set up set the KLA to unload after the wafer and do not continue probing until the wafer has been inspected and the set up has been verified NOTE All wafers that fail inspection must be noted on the Sort Versatest Traveler Contact LPO Supervisor for assistance with completing 001 02669 SO1_O_A FAB2 Probe Damage OCAP If the 5 wafer passes inspection the next 5 wafers may be processed 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 27 Continue this procedure processing 5 wafers and inspecting every 5 until all wafers in the lot have been processed
4. 4 One can plot the Number of Die Recovered which are the number of die turned into bin 1 s vs DateTime in Excel to determine probe card performance for a series of wafers 12 16 12 17 VT15 No of Die Recovered TAPAUS AZANUS TAROS AARIS ALAIS 27 ts 0s 9 36 14 24 19 12 0 00 4 48 9 36 14 24 19 12 0 00 DateTime As presented in PCR4 memo KXF 154 CTI Die Retest 13Jan06 PCR4 and resulting ARs die recovered is only minimally related to either tester or device It is strongly related to probe card longetivity as demonstrated in the above graph 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 13 Operator Instructions Spec Updates The Die Retest updates to spec 001 02682 Fab2 Versatest V210X Operations Procedure via ECN 417142 are summarized for convenience 8 2 6 LOADING THE PROGRAM INTO THE VERSATEST Switching between sessions is done via the Alt key which brings up the following popup DESQview Onen Window 0 Switch Window S Close Window C Rearrange Toom Mark Transfer Sissors Help F1 Quit DESQview Q Tab to Switch Window S in inverse video above and press the lt enter gt key This brings up the next window which permits you to move between the sessions V1000 Monitor Is the main menu function The F1 key brings up the main menu 1000 Moni clases lias V1000 RDP IO Process V1000 RDP IO Process Displays the wafer map dpr
5. NOTE EVERY 5 WAFER IN THE LOT MUST PASS THE MICROSCOPE INSPECTION PER THE CRITERIA IN SPEC 001 03021 S01 BEFORE THE NEXT 5 WAFERS CAN BE PROCESSED During processing wafer data will be displayed on the VT monitor in the form of a line summary The line summary will automatically appear when a wafer is processed and unloaded If the line summary does not appear on the monitor press the ALT and 4 on the VT keyboard Wafer maps should be viewed during processing The wafer map provides a real time display of bins for the current wafer being processed The wafer map will alert the operator to any site to site issues before the wafer is finished testing To view the wafer maps do the following If necessary switch to the V1000 Monitor screen by pressing the lt alt gt key then using the Switch Windows option DESOQview Oven Window 0 Switch Window S Switch Windows Close Window Cc pa nose mncow aA V1000 Monitor 1 Rearrange V1NNON RDP TO Process 2 dprc cti build 3 Mark LotList 4 Transfer Sissors Help F1 Quit DESQview Q Once in the V1000 Monitor session press lt F1 gt to bring up the main menu bar at the top of the screen if necessary and arrow to Utilities and press lt Enter gt The arrow down and select Wafer display and press lt Enter gt f V2102 i tilities Run Program window Position test Site pArtial Summary Clear Summary Displ
6. gt field Press lt Enter gt Verify lot number is correct and wafers are in numerical order A new window will open Type in the first wafer number and press lt Enter gt Wafer number A second window will open We do not usually enter a Wafer Type so just press lt Enter gt to close the window and proceed Wafer type 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 23 Continue to use the ADD WAFER command to until the wafer numbers for every wafer to be tested has been entered When all wafer numbers have been entered select G gt gt SAVE lt lt by entering the letter G and press lt Enter gt 8 4 3 PROCESSING THE LOT Refer to OPL 001 02698 S03_3 FAB2 How to remove wafer from KLA prober for inspection Load the cassette of wafers to be tested into the KLA prober and press the START button The prober will prealign load and test the wafer automatically If the wafer does not start testing automatically do the following If necessary switch to the V1000 Monitor screen by pressing the lt alt gt key then using the Switch Windows option DESOview Onen Window 0 Switch Window S Switch Windows Close Window C oy V1000 Monitor 1 Rearrange VINNA RNP IO Procese 2 7oom dprc cti build 3 Mark LotList 4 Transfer Sissors Help F1 Quit DESQview Q Once in the V1000 Monitor session press lt F1 gt to bring up the main menu bar at the top of t
7. state was lowered bincodes bincodes bincodes bincodes shifts and upon retesting lowered upon lowered upon lowered upon lowered upon retests with a different retesting with retesting with retesting with retesting with test head site another test another test another test another test head site head site head site head site 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 30 Sample Bad Test Head Site A bad site will be accompanied by i a yield that is lower than the other test head sites and ii a count of bincodes lowered upon retesting with another test head site that is lower than the others For example Yield 84 86 87 70 80 Tested 550 Passed 472 DieLowered 15 0 2 12 1 Retests 30 r shows that site 3 is marking die falsely defective due to i a yield that is lower than the other sites and ii a high number of die that test good when tested with another test site Document Modification Log When Who What 18Jan06 kxf initial version 28Apr06 kxf new RE_TEST_LIMIT global retest limit description
8. 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering CTI VT2100 KLA1007 Die Retest Software Notes for Engineering Version 28 Apr 06 Ken Freed kxf Cypress Semiconductor Texas Inc Contents INTRODUCTION RETEST ENTRIES IN THE PLAN FILE PROCESSING RETEST INFORMATION NOT_OVER_TURNABLE_BINS THREE TOUCHDOWNS MAXIMUM CHANGING BETWEEN OLD AND NEW SOFTWARE 1 NETWORK CARD CABLE 2 HARD DRIVE CABLES GETTING AND ANALYZING DATA LOG FILES HOLDING ERROR AND WARNING INFORMATION Software Version Information Contained in the Logfile Logfile Information about Bin Zeros used if Retest Move Error OPERATOR INSTRUCTIONS SPEC UPDATES 8 4 PRODUCTION 8 4 1 EDITING WAFER SEQUENCE 8 4 3 PROCESSING THE LOT W AFERMAP SCREEN YIELD AND SITE INFORMATION Sample Bad Test Head Site 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering Introduction The Die Retest software retests bincodes defined in the planfile by shifting the test head over by one die in order to re test with another test site This document describes information about the new VT2100 KLA Die Retest code which is of use to a process engineer It is mostly a collection of information from various requirements and status memos gathered into this single document for easier reference Previous documentation describing the project project management and technical information can be found under the KXF series of memos Simply look for any memo
9. ay Bins Edit Setup seNd IO Command Power off Reset head Summary w Clear Wafer display eXit Program 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 28 A popup will show you which session to go to via the lt alt gt key then the Switch Window option Press lt Enter gt to clear this popup 5 rdpio command rdpiocmd bat As per the previous popup s instructions use the lt alt gt key and switch to the V1000 RDP IO Process DESOview Oven Window 0 Switch Window S Close Window Switch Windows V1000 Monitor 1 Rearrange Zoom V100N RDP TO Pracess dprc cti build 3 Mark Transfer LotList 4 Sissors Help Quit DESQview Arrow to DATA and press ENTER Data 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 29 A real time wafer map will be displayed on the screen with bin information for the wafer being tested Pressing lt F3 gt will display the map in a more compressed and easier to read form e g Wafer number Location of site 1 of the test head Wafer map Yield and site information Misc status information Wafermap Screen Yield and Site Information Total Total Die Total Die Yield Tested Passed Yield 84 86 87 83 80 Tested 550 Passed 472 DieLowered 5 0 2 2 1 Retests 10 POST_RETEST_MOVE Count of die Site1 Site2 Site3 Site4 Number Retest whose bincode count of count of count of count of of head
10. c cti build Interfaces with the prober LotList dprc cti build Displays plan file etc selection Transfers data to the server LotList Displays a summary of wafers processed 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 14 From the V1000 Monitor session Press F1 on the VT keyboard to bring up the main menu at the top of the screen Main Menu in V1000 Monitor VT24 TX MAN F gt MENU Init Lot Utilities Run Program window Position test Site A submenu will appear Select ENTER LOT INFORMATION and press ENTER Custom load path i Load neu wafer Restore sorted wafer 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 15 A popup will appear telling you to switch to the dprc cti build session Press lt enter gt to get rid of this popup JT24 TX HAN then press the lt alt gt key and change to the dprc cti build session DESQview Oven Window Switch Window S Switch Windows Close Window C N V1000 Monitor Rearrange V1000 RDP TO Process Zanmi dprc cti build Mark LotList Transfer Sissors Help F1 Quit DESQview Q The first time after rebooting or restarting the software that this screen is called up it will first ask you where the present plan file came from i aay U GJ taS Got D_IOINIT command Where did the present plan file cowe fronti PRODUCTION j DPRC noti
11. containing the words Die Retest 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering Retest Entries in the Plan File Retesting is controlled via the planfile test_switches entries RE_TEST lt bin gt lt turn_on_consec gt lt cum_confirm_turn_off gt Where lt bin gt lt turn_on_consec gt lt cum_confirm_turn_off gt Is the bin number that kicks off a retest Is the number of times that this bin has appeared on the same site consecutively Once this limit is reached re test keeps reoccurring The number of times retesting with a different tester site confirms the failing bin has really failed When this retest and it really was a failing bin limit is reached retesting is turned off for the this bin for the rest of the wafer RE_TEST_LIMITS lt no_of_retests gt lt min_percent_lowered gt Where lt no_of_retests gt lt min_percent_lowered gt Note that if if lt no_of_retests gt 0 After this number of retests we should have at least this integer percentage of die bincodes lowered due to retesting if not turn off ALL retesting for the rest of this wafer since retesting is wasting test time then this limit check is disabled lt min_percent_lowered gt 0_ then we turn off retesting after lt no_of_retests gt 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 4 Example interface_switches RDPIO_PROBER_SITES 4 DISABLE_SITE 1
12. e over the die for retesting When the head goes on to encounter the right retest die it will shift one die to the left for retesting hence the left retest die will experience the maximum of three touchdowns 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering Changing between Old and New Software Switching back and forth between old and new software consists of moving cables on 1 Network Card Cable it WHT FRONT of the tool new network card by convention this is always further towards the rear of the tool than the old network card old network card 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 7 2 Hard Drive Cables There is a second hard drive under the VT hood which holds the Die Retest retrofitted software It is next to the original non Die Retest hard drive Move the i power connector white on top of the drive il IDE cable from the old to new drive Pictures below show the power and IDE cable connected to the new drive which holds the Die Retest retrofitted software hard drive power connector old hard drive old hard drive hard drive IDE ribbon cable new hard drive 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 8 Getting and Analyzing Data 1 When a wafer finishes on the VT tester a logfile containing the run information we are interested in will be created For wafer e g 251234 01 the logfile i
13. for Engineering 21 A popup will appear telling you to switch to the dprc cti build session Press lt enter gt to get rid of this popup then press the lt alt gt key and change to the dprc cti build window DESQview Onen Window 0 Switch Window S Switch Windows Close Window V1000 Monitor 1 Rearrange V1000 RDP TO Process 2 Zoom dprc cti build NETYA LotList Transfer Sissors Help Quit DESQview 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 22 This should bring up a window similar to the following Ft36C370 2541234 kxf 10 36 12 14 oe Wafer 01 Type Wafer prober XY Capture test output make Local file copy 7C6370 QUAD Sort1 P VTONLINE LOADDIR 7C6370 cof NONE SPEFICIED NONE SPECIFIED In the upper right hand corner of the Test Station Setup window will be another window titled Wafer Sequence At the bottom of the Test Station Setup screen are the commands used to add wafer numbers to the system Although this section will cover how to use the E Add Wafer command the H Insert Wafer T Delete Wafer and F Remove Last Wfr commands work the same way If wafers are listed in the Wafer Sequence box and they are not correct select J Erase Sequence and press lt Enter gt To enter wafer numbers select E Add Wafer by entering the letter E The input should appear after the ENTER OPTION
14. he first on asks for the wafer number Valid wafer numbers are1 through 25 and 99 The popup will be initialized with the last wafer number entered 1 Wafer number The second popup asks for the type We typically leave this blank and just press the lt Enter gt key Wafer type Proceed as per the previous two examples selecting option numbers of letters and filling in the appropriate information 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 18 When finished select the G gt gt Save lt lt option The VT monitor screen will display a listbox with two choices YES overlay old stuff or NO keep what s there Select YES overlay old stuff and press lt Enter gt YES overlay old stuff NO keep what s there The system will fetch the appropriate files from the server unpack and copy them etc When the bottom of the screen displays Ready for new command i e PLEASE WAIT sending updates to VOS Ready for new command Got D_NEW_LOT command Ready for new command Use the lt alt gt key to go back to the V 1000 Monitor session DESOview Onen Window 0 Switch Window S Switch Windows Close Window V1000 Monitor 1 Rearrange V1NNO RDP TO Process 2 7oom dprc cti build 3 Mark Transfer LotList 4 Sissors Help F1 Quit DESQview Q 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineeri
15. he screen if necessary and arrow to Utilities and press lt Enter gt Init Lot Utilities Run Program window Position test Site 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 24 Arrow to seNd IO Command and press lt Enter gt tilities Run Program window Position test Site pArtial Summary Clear Summary Display Bins Edit Setup seNd IO Command Power off Reset head Summary w Clear Wafer display eXit Program A popup will show you which session to go to via the lt alt gt key then the Switch Window option Press lt Enter gt to clear this popup 5 rdpio command rdpiocmd bat 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 25 As per the previous popup s instructions use the lt alt gt key and switch to the V1000 RDP IO Process Arrow to Begin Wafer Probing and press lt Enter gt Begin Wafer Probing P Cc T U As the lot is testing every 5 wafer must receive and pass a microscope inspection before the next 5 wafers can be tested The purpose of the inspection is to insure that the setup is still good and that no drifting mis stepping or probe damage has occurred 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 26 The wafer number that the tool is on is shown at the top of the wafer map screen see section 8 4 3 Processing the Lot for displaying this screen OON DATA Bins Lot 2545614 Wafer
16. log mput multiple file puts mput rdpio log Yes No AII Quit a after all of the files have transferred ftp gt quit C gt del log to delete the logfiles C gt exit to exit the Desqview Dos window Note You might have to get ahold of MIS to setup your ftp username and password on your PC 3 Analyzing the logfile a To determine the total number of retests that were done on a wafer grep the log file for the statement Got RETEST results at The number of this times this message exists in the logfile corresponds to the total number of retests done on the wafer b To determine the number of bincodes which were lowered due to retesting grep the log file for the statement 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 12 RETEST_CHANGE at This will give every bincode lowered due to retesting e g lt 34 8 gt site 2 data bin 8 gt 1 for head move of lt 1 1 gt lt 30 12 gt site 2 data bin 8 gt 1 for head move of lt 1 1 gt lt 25 12 gt site 2 data bin 11 gt 8 for head move of lt 1 1 gt lt 20 12 gt site 2 data bin 7 gt 1 for head move of lt 1 1 gt lt 19 12 gt site 4 data bin 8 gt 1 for head move of lt 1 1 gt lt 12 12 gt site 2 data bin 7 gt 1 for head move of lt 1 1 gt lt 3 16 gt site 1 data bin 10 gt 1 for head move of lt 1 1 gt e g bincode 10 to 1 is represented by 10 gt 1
17. ng 19 In the Monitor session there will be a Test Site box at the bottom This box shown as Test Site 01 below will display information being loaded into the test board hardware When this box display right pointing chevrons 1 e gt gt the tester is ready to run indow Position test Site Test Head 1 TPG 8c29000a cof PLN F129000a Lot 2009006 Wafer O1 nits Tested 0 nits Passed 0 Yield 100 Status Started Test Site 01 done loading files gt gt On this same screen verify that the plan file i e PLN in the Test Head 1 box above is correct for the device being run 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 20 8 4 Production 8 4 1 EDITING WAFER SEQUENCE If necessary or if in doubt as to which Window you re in switch to the V1000 Monitor screen by pressing the lt alt gt key then using the Switch Windows option DESQview Onen Window 0 S Switch Window Switch Windows Close Window C V1000 Monitor 1 Rearrange V1NN0 RDP TO Process 2 7Toom dprc cti build 3 Mark LotList 4 Transfer Sissors Help F1 Quit DESQview Q Once in the V1000 Monitor session press lt F1 gt to bring up the main menu bar at the top of the screen if necessary and select INIT LOT Init Lot Utilities Run Program window Position test Site Custom load path Load new wafer Restore sorted wafer 28Apr06 CTI VT2100 KLA Die Retest Software Notes
18. s called c 41234 01 log Ifa previous copy of c 41234 01 log existed when wafer 2541234 01 finished e g a sort2 run the log information is appended onto the end of the existing file i e Log Files Holding Error and Warning Information Two new logfiles have been created for Die Retest corresponding to the two dprc exe data transfer rdpio exe prober interface programs which were changed Data Flow rdpio exe dprc exe prober interface program transfers data to and from the cti server during wafer running c 41234 01 log Note that these logfiles are not automatically deleted purged and will eventually fill up the hard drive if not manually deleted purged 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering Software Version Information Contained in the Logfile Programs dprc exe and rdpio exe log their software versions to their respective c dprc log c rdpio log logfiles every time they are started up e g xkkkkk starting DPRC EXE CTI Version 14Dec05 built Dec 14 2005 EREEEEE starting RDPIO EXE CTI 14Dec05 release built Dec 14 2005 Logfile Information about Bin Zeros used if Retest Move Error Retesting die conssists of 1 Shifting the test head 2 Touching down and getting another set of test results 3 Shifting the test head back to the original location 4 Telling the system what the bincodes are If an error occurs at step 3 above then a bincode of zero will be is
19. sued posted for all die in the original touchdown and the software will then issue commands to proceed onward with testing An accompanying message will appear in the logfile e g WARNING at lt 15 6 gt cannot move to pre retest loc lt 14 5 gt so zeroing test results 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 10 2 Getting the logfile s from the VT tester to your PC via ftp a Create some directory on your PC to receive the log data e g c WT15logs b Get the ip address of your PC by opening a Dos window and using the command ipconfig c When the VT is not running product i Press the lt alt gt key ii then select the Open Window ili then select the Dos Window option Oven Window 0 Switch Window S Close Window C Rearrange Zoom AETIA Transfer Sissors Help Quit DESQview Q 28Apr06 CTI VT2100 KLA Die Retest Software Notes for Engineering 11 d Within the Dos screen issue the follow commands c gt cd ncsaftp c gt ftp 157 95 4 178 use your PC s ip address here National Center for Supercomputing Applications NCSA FTP 2 3 08 Nov 94 220 FTP Server ready Username enter your PC s ftp server user name 331 Password required for Password enter your PC s ftp server password 230 User logged in ftp gt ed vt15logs cd change directory 250 CWD command successful ftp gt Iced Icd local change directory Local directory now C ftp gt mput
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