UM10757 OM13257 temperature sensor daughter card
Contents
1. No connect 2 No connect 3 SCL SCL Bus 1 to JP4 pin 3 4 SDA2 SDA Bus 2 JP3 pin 1 5 INT Interrupt to INT LED and U1 pin 3 6 RESET 7 5 JP1 pin 1 8 43 3 V JP2 pin 3 9 GND 10 GND 11 43 3 V JP2 pin 3 12 5V JP1 pin 1 13 RESET 14 INT Interrupt to INT LED and U1 pin 3 15 SDA SDA Bus 1 JP3 pin 3 16 SCL2 SCL Bus 2 JP4 pin 1 17 No connect 18 No connect 4 2 CN4 Tester connector Generation inspection and logging of l C bus data is easily achieved with third party development tools from Total Phase http nxp com redirect totalohase com There are two tools called Aardvark and Beagle that direct connect to this board through CN4 Remark Since SDA and SCL are both connected to the device under test the Aardvark and the Fm Development board cannot be used simultaneously The Beagle a bus sniffer does not have any issues All information provided in this document is subject to legal disclaimers NXP B V 2013 All rights reserved User manual Rev 1 31 October 2013 5 of 10 NXP Semiconductors U M1 0757 OM13257 temperature sensor daughter card Table 3 CN5 Tester connector pinout CN4 Pin Number Function Board Connection 1 SCL U1 pin 2 2 Ground 3 SDA U1 pin 1 4 45V JP1 pin 3 5 5 JP1 pin 3 6 5 V JP1 pin 3 T 8 9 10 Ground UM10757 All information provided in this document is subject to legal disclaimers NXP B V 2013 All rights reserved User manual Rev 1 31 O2. For sales office addresses please send an email to salesaddresses nxp com Date of release 31 October 2013 Document identifier UM10757
3. purposes only NXP Semiconductors its affiliates and their suppliers expressly disclaim all warranties whether express implied or statutory including but not limited to the implied warranties of non infringement merchantability and fitness for a particular purpose The entire risk as to the quality or arising out of the use or performance of this product remains with customer In no event shall NXP Semiconductors its affiliates or their suppliers be liable to customer for any special indirect consequential punitive or incidental damages including without limitation damages for loss of business business interruption loss of use loss of data or information and the like arising out the use of or inability to use the product whether or not based on tort including negligence strict liability breach of contract breach of warranty or any other theory even if advised of the possibility of such damages Notwithstanding any damages that customer might incur for any reason whatsoever including without limitation all damages referenced above and all direct or general damages the entire liability of NXP Semiconductors its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the greater of the amount actually paid by customer for the product or five dollars US 5 00 The foregoing limitations exclusions and d
4. UM10757 OM13257 temperature sensor daughter card Rev 1 31 October 2013 User manual Document information nfo Content Keywords Fm Development Kit OM13320 Temperature Sensor LM75 SE95 PCT2075 Abstract Installation guide and User Manual for the OM13257 Temperature Sensor Daughter Card that connects to OM13320 Fm Development Kit This board permits easy and simple evaluation of most of the NXP temperature sensor portfolio of products NXP Semiconductors U M1 0757 OM13257 temperature sensor daughter card Revision history Rev Date Description 1 20131031 nitial release Contact information For more information please Visit http www nxp com For sales office addresses please send an email to salesaddresses nxp com UM10757 All information provided in this document is subject to legal disclaimers NXP B V 2013 All rights reserved User manual Rev 1 31 October 2013 2 of 10 NXP Semiconductors U M1 0757 OM13257 temperature sensor daughter card 1 Introduction The OM13257 Temperature Sensor Daughter Card connects directly to the OM13320 Fm Development kit and permits easy evaluation of most of NXP s Temperature Sensor portfolio of products Table 1 lists the supported devices The OM13257 Temperature Sensor Daughter Card is shipped with no temperature sensor device soldered to the board The user must purchase the device he is interested in evaluating ina TSSOP8 packag
5. aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document including without limitation specifications and product descriptions at any time and without notice This document supersedes and replaces all information supplied prior to the publication hereof Suitability for use NXP Semiconductors products are not designed authorized or warranted to be suitable for use in life support life critical or safety critical systems or equipment nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Applications Applications that are described herein for any of these products are for illustrative purposes only NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification Customers are responsible for the design and operation of their applications and products using NXP Semic
6. and JP4 select either Bus 1 or Bus 2 as a source to the device under test Jumper between pins 1 and 2 to select Bus 2 as a source and jumper between pins 2 and 3 to select Bus 1 Remark SCL and SDA from CN4 Tester Connector are always connected to the device under test If two masters are used there may be contention CN4 EE D2 R2 INT PWR o o Fm BD Xa Uis Tegan 99 IC2 IC3 1 oo 96 000 2n 2352 0M13257 15 2 REU 1 0 ee om UNIU TEMP SENSOR TM CNS Fig 1 13257 jumper location and configuration UM10757 All information provided in this document is subject to legal disclaimers NXP B V 2013 All rights reserved User manual Rev 1 31 October 2013 4 of 10 NXP Semiconductors U M1 0757 OM13257 temperature sensor daughter card 4 Connector pinouts UM10757 4 1 CN5 Fm Development Board connector The OM13257 can connect directly to the OM13320 Fm Development kit via CN2 This connector provides power signals and other ancillary signals Remark The connector on the Fm board is a male shrouded 14 pin type while the connector on the GPIO board is female 18 pin The reason lies with the shroud around the 14 pin connector To ensure correct mating of the female with the male two pin positions on both of the female sides are unused Table 2 CN5 Fm Board connector pinout CN2 Pin Number Function Board Connection 1
7. ctober 2013 6 of 10 jenuew 105 2102 4940190 LE L SIOWIE OSIP eba o joefqns si jueuinoop siu U p piAold uomeuuojul y 01102 ZSLOLWN pamasa syu Iv 6102 NE dXN CNS B CNS 7 CNS 6 3115 CNS 5 us 4 PE ET ens 3 l T Fm BOARD Hi S IDUNT PRD ROUND3 2 Hz 0UNT PAD ROUND3 2 UDD m m LTST C150KGKTCGRN v z l 015 g k z 4 LIST C150KRKTCRED UDD N4 10 END CN4 9 CN4 8 lt CN4 7 CN4 6 CN4 5 CN4 4 CN4 3 4 IR CN4 2 4 AND CN4 1 SsCL I2C TESTER NXP SEMICONDUCTORS TITLE 0M13257 Thermal rev1 Document Number Date 7 9 2013 2 14 22 PM 1 0 Sheet 1 2 p129 19 46nep 10sues oJnjeueduioe 2676 LINO ZSZOLINN SJ0 onpuooiuleS dXN jenuew Jas 2102 4940190 LE L 8H SIOWIE OSIP eB o lqns si jueuinoop siu U pepr ojd uomeuuojul y 01108 ZSLOLWN pamasa syu 6102 NE dXN ADDR AG Q e 2 JP10 3 JPig 2 S GND ADDR AL a S JP11 3 JP11 2 RB1 JP11 1 GND 7 TSSOP REOR ME DEUICE TYPE 2 LH25B PTC1075 PTC2075 SE95 WLCSP6 DO NOT PLACE 9 GND QFN DO NOT PLACE BASE ADDRESS 0x90H 0x90H O0xDOH BxS80H OxDOH x9 H NXP SEMICONDUCTORS TITLE 0M13257 Thermal rev1 Document Number 1 0 Date 7 9 2013 2 14 22 PM She
8. e the ordering part number suffix should be DP and the package designation should be SOT505 1 These leaded packages should be relatively easy to solder to the board with a low wattage fine tipped soldering iron Remark The pin 1 orientation is down and to the right when the text on the board readable Usually you would expect pin 1 to be up and to the left There are two additional package footprints for an XSON8U package SOT996 2 This same footprint accepts an HWSONS package SOT1169 2 with the exposed center pad unconnected This configuration is acceptable for the temperature sensor devices There is also a WLCSP6 package footprint for the PCT2202 device In all cases the pin 1 orientation is down and to the left when the board text is readable Table 1 Devices supported by OM13257 Temperature Sensor Daughter Card Part Number Package Number Package Description LM75ADP SOT505 1 TSSOP8 LM75BDP SOT505 1 TSSOP8 SE95DP SOT505 1 TSSOP8 PCT2075DP SOT505 1 TSSOP8 LM75BGD SOT996 2 XSON8 LM75BTP SOT1069 2 HWSON8 PCT2075TP SOT1069 2 HWSON8 PCT2202UK WLCSP6 2 Features of the OM13257 Temperature Sensor Daughter Card UM10757 Direct connection to OM13320 Fm Development kit Footprint for a TSSOP8 package user solderable Flexible power supply configuration 3 3 V or 5 V Jumper configuration of device C address LED indicators for power and INT Scope ground connection loop All informati
9. et 2 2 pied 19 46nep 10sues oJnjeueduioe 7S2 LINO ZSZOLINN SIOJONPUODIWIS dXN NXP Semiconductors UM10757 5 Legal information OM13257 temperature sensor daughter card 5 1 Definitions Draft The document is a draft version only The content is still under internal review and subject to formal approval which may result in modifications or additions NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information 5 2 Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable However NXP Semiconductors does not give any representations or warranties expressed or implied as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information In no event shall NXP Semiconductors be liable for any indirect incidental punitive special or consequential damages including without limitation lost profits lost savings business interruption costs related to the removal or replacement of any products or rework charges whether or not such damages are based on tort including negligence warranty breach of contract or any other legal theory Notwithstanding any damages that customer might incur for any reason whatsoever NXP Semiconductors
10. isclaimers shall apply to the maximum extent permitted by applicable law even if any remedy fails of its essential purpose 5 3 Trademarks Notice All referenced brands product names service names and trademarks are property of their respective owners 1 C bus Logo is a trademark of NXP B V NXP B V 2013 All rights reserved User manual Rev 1 31 October 2013 9 of 10 NXP Semiconductors U M1 0757 OM13257 temperature sensor daughter card 6 Contents 1 IntrOdUction eene Ere 3 2 Features of the OM13257 Temperature Sensor Dau hterCard eee 3 3 Board jumper setup 4 3 1 Power 2 2 4 3 2 10065 Ie eee ce eno E 4 3 3 SCL and SDA 50 6 4 4 Connector pinouts cernere 5 4 1 CN5 Fm Development Board connector 5 4 2 4 Tester connector 5 5 Legal information 55 9 5 1 Definitions 9 5 2 Disclalmers iiec 9 5 8 9 6 OC M M 10 Please be aware that important notices concerning this document and the product s described herein have been included in the section Legal information NXP B V 2013 All rights reserved For more information please visit http www nxp com
11. on provided in this document is subject to legal disclaimers NXP B V 2013 All rights reserved User manual Rev 1 31 October 2013 3 of 10 NXP Semiconductors U M1 0757 OM13257 temperature sensor daughter card 3 Board jumper setup 3 1 3 2 3 3 Power Supply The power supply selection for the OM13257 is very flexible and allows for detailed analysis and evaluation of all the NXP temperature sensor devices JP1 labeled PWR selects between 5 V supplied from the tester connector CN4 jumper between pin 2 and 3 and the Fm board connector CN5 jumper between pin 1 and 2 If 3 3 V is desired no jumper is required JP2 labeled VDD selects between 5 V and 3 3 V for the main power supply on pin 8 of the device under test Add a jumper between pins 2 amp 3 for 3 3 V supplied by the Fm board or 1 amp 2 for 5 V selected by JP1 See the schematic section at the end of this document for more details I C Address The I C address of the slave temperature sensor device is selected via JP10 JP11 and JP12 connected to pin 5 6 and 7 of the device under test respectively Pin 1 of the jumpers is connected to 0 V while pin 3 is connected to VDD selected above Consult the datasheet for the I C addresses corresponding to the logic levels on each pin See the schematic section at the end of this document for more details SCL and SDA source There are two I C busses implemented on the Fm board and JP3
12. onductors products and NXP Semiconductors accepts no liability for any assistance with applications or customer product design It is customer s sole responsibility to determine UM10757 All information provided in this document is subject to legal disclaimers whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned as well as for the planned application and use of customer s third party customer s Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products NXP Semiconductors does not accept any liability related to any default damage costs or problem which is based on any weakness or default in the customer s applications or products or the application or use by customer s third party customer s Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer s NXP does not accept any liability in this respect Export control This document as well as the item s described herein may be subject to export control regulations Export might require a prior authorization from competent authorities Evaluation products This product is provided on an as is and with all faults basis for evaluation
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