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1. Writer Resistance Measurement Accuracy 5 feature for Diagnostic purposes only Write Head Turning On Off Transient 2mA 0 Pk Writer Reader Crosstalk 0 5mA 100mA 5Mhz Writer gt Adjacent Reader Crosstalk lt 0 2mA 100mA 5Mhz Maximum Pin Voltage when write is 20mV turned off Page 4 of 47 Integral Solutions Int l 12 Hardware Components QST Tester QST 2002 E is responsible for testing MR heads It is located above the computer and includes two boards on top of the BlazerX5 QPS provides DC power for the QST Tester and magnet It is located below the computer Magnet air core magnet surrounds the probe cards and is located on both sides of the arm Stepper Motor Drivers take off left panel to access Z Y Stages Heater Arm top arm is a placeholder for bars Cleaner Arm bottom arm for scrubbing probe cards Temperature Controller located on the right side of the tester connected to PC serial port USB Stress Boards Computer and Monitor Alignment Camera Page 5 of 47 Integral Solutions Int l 13 Tester Installation BlazerX5L is shipped in reusable ISI crate it is highly recommended to keep the crate and use it if necessary to ship the tester for repairs To unpack the tester remove the two screws holding the front wall on the crate Remove all clamps holding the front cover Remove the front cover and unscrew the loading ramps that are mounted on the inner
2. Blazer AS Bar Level Analyzer Lifecycle Tester User Manual JL Integral Solutions Int l December 7 2007 Copyright 2003 2007 Integral Solutions Int l rights reserved Integral Solutions Int l 3000 Olcott Street Santa Clara 95054 Phone 408 653 0300 Web http www us isi com Fax 408 653 0309 E mail isi us isi com While every effort has been made to verify the accuracy of the information contained in this publication this publication may contain technical and or typographical errors Please contact Integral Solutions Int l to report any errors in this publication 1 aon Integral Solutions Int l Contents INTRODUCTION 1 1 SPECIFICATIONS INE RI NERONE EN ANNE 1 2 HARDWARE COMPONENTS ssssssseeeeeseseseseseseseseseseseseseseseseseseseseseseseseseseseseseeeseseseeeseseeeseeeeees 1 3 TESTER INSTALLATION it os se avs eet eee sds eoe eoe dun Ei e ey EN ons Noe bes eo Ege ee eee ee seve 1 4 INSTALLING SOFTWARE c cccccsseeesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesesens LIFECYCLE TEST OVERVIEW sssssssssssssssssssssssessssessssessersesessessesessessesessessesessessesessessesess 2 1 GENERAL SETTINGS caves E 22 AC DENMN IC 23 WRITES TRESS t
3. Enter Alignment mode select your enabled bar and slider type in the main menu Click Heating Arm then Test and bring the bar up to the probes Verify that the MR element is facing heater block and that the probes are directly over the bar pads if not adjust the bar using in and out movement buttons then click of the cell in the bar length grid for either up down offset and click Calculate 1 slider offset Go to the last slider and make sure that slider pitch is correct Click Unload then Heater Arm and Test to verify that the first slider position is correct Click Save Setup and do steps 6 through 10 for the other type of slider If you want a Pin Layer Reversal result to be added make select normal slopes for your bars If you use a special convention for the name of sliders or you have dummy sliders on that bar select a bar length and click Rename Sliders Do not forget to save changes in your bar setup Page 34 of 47 Integral Solutions Int l 3 5 2 Aligning Test Probe Cards right side Run Barheater from Quasi97 for the ability to measure resistance Your bar and tray configurations should already be set Prior to Probe Card Alignment you need to preheat the arm to operating temperature usually 100 C and let it stabilize for at least two hours Enter the setpoint manually on the lakeshore and turn on the heater After preheating enter current temperature in the main menu so that bar heater can adjust the bar posi
4. Test Card Cleaning Zheight 26 Stress Test Probe Card Cleaning Frequency 26 Stress Module sess 21 Stress Probe Cards sssseee 25 Stress Probe Height sess 33 T Test Stress Station sss 22 Test Interval 9 Test Probe Cards s t 25 Test Probe Height eee 33 Tests Fail On 9 Total Test Time cn am neret ne teciee t 9 Integral Solutions Int l U Unlo d achte onis 19 Up Down Offset essere 30 Up Down Slider 22 V Valid Head 23 Video Driver ais 21 Video 19 21 nece 11 Write Frequency Mhz sss 11 Y Y Cleaning Stroke Y LE ocationz z sitet er eter pire Y Stress Test Cleaning Position 26 Y Stress Location 33 Y Test 32 Z Z Find Home Offset eese 32 Zero Pt Offset esse 23 23 Page 47 of 47
5. List preamp chips Page 11 of 47 2 4 Pretest Integral Solutions Int l Pretest can run before the Lifecycle test and at the end If enabled this test will run at the beginning of Lifecycle test and test the head at several or one different temperatures All data from selected tests will be logged and will be available on Pretest summary form If Manual Head Disable option is selected the test will show Pretest summary form where operator can see the distribution of any result across the head population and disable heads as necessary The test also has Fail On Parameters feature that helps operator to disable heads automatically Note that even if Fail On Parameter disables a head user can still enable that head when reviewing Pretest summary in Manual Head Disable mode In Automatic Head Disable the pretest form will not be shown and heads will be disabled only using Fail On Parameters Read Stress Write Stress General Setup Temperatures Test Enable Transverse Setupl C Auto Head Disable Manual Head Disable Transverse Setup Resistance Ohr Add Remove Fail On Params Figure 6 LifeCycle Pretest Run Sequence Tests Fail On Params Determines at which temperatures heads will be tested Temperatures below 35 C will be considered room temperature and software will wait only till 35 C was reached Determines the test to run at each temperature Note that al
6. W W or W W R R then set bias direction to be positive on the other hand if you bar is R R W W or W W R R then invert bias current Reader Location The side where the reader is located Right equates to the pair of pads closer to the back of the tester Left is the pair of pads closer to the operator If you select Right the reader stress board should be connected to the connector closest to the probes If you select Left the reader stress board should be connected to the probe card connector closest to the stress board Page 28 of 47 3 3 2 Bar Configuration Reference Integral Solutions Int l Actual Slider Layout Test Reader Stress 2xBar Test Bias Stress Bias Position Reader Interface Selection Cable Board Rev Right U A A F NORMAL NORMAL Right U A E H NORMAL NORMAL Right U A A F INVERT INVERT Right U A E H INVERT INVERT Left D B A F NORMAL INVERT Left D B E H INVERT INVERT Left D B A F INVERT NORMAL Left D B E H NORMAL NORMAL settings shown here apply if the MR element is facing the bar heater Test Reader Position is either Left ISI Down or Right ISI Up and the cables to the probe card should be connected accordingly Stress Reader Cable connector A is closest to the probes and B is farthest from the probes 2xBar interface board revision E H equates to Fab Rev E E or higher Test bias inversion should be
7. both channels then up 10um and make sure resistance is valid on both Your left probe card is now aligned you do not need to reset Probe Height and Y Location because it was already done for the probe card on the right side Page 36 of 47 Integral Solutions Int l 3 5 4 Aligning Stress Probe Cards The system must preheat to operating temperature usually 100 C for at least 2 hours if it was not preheated turn manually set the operating temperature on the lakeshore and turn on the heater Click Load Stress Module from the Barheater Main form 1 Move to the Heating Arm Stress position If right probe card is aligned skip to step 10 otherwise proceed to align right probe card Move the left device 2 probe card up or out of the way You can do it by rotating the screw counter clockwise in the center of left probe card base Focus on the probes and move the bar up until you can distinguish pads on the bar Align the probe card to the pads you will have to move the alignment camera from the first to the last slider to make sure the probe card is aligned evenly on all of them If necessary move the bar in out Open Probe Card Alignment menu and click Calculate Y Location Select Stress Station in Probe Card Alignment menu Set up resistance measurement parameters in and for detecting first contact Click Find 1st Contact button Repeat until the point of first contact is found Click Calculate Probe Height to set new probing
8. button then type the 0 Based slider number to which this SN corresponds and click test A new window will be open with Part IDs Page 31 of 47 Integral Solutions Int l 3 4 Diagnostics Integral Solutions Int l mostly uses this menu to align and troubleshoot systems User should not attempt to modify parameters here unless specifically requested by ISI Parameters from this menu are saved into SETUP BCT file and EEPROM Print Preview Print Motion Distribution Board x Motion Contral Digital 10 Forward Limit Heverse Limit en e gese ag ome eo Q si sr LimitPolarity HEX Meas Units Reserved 0 0 Y Test Location 0 Z Park 0 Z Find Home Offset 1990 Y Stress Location 115000 Stress Probe Height 30000 Test Probe Height 3000 Cleaner Arm Height 0 Heater Arm Height 3000 Reserved 5000 Reserved 60 CRC 0 Last User BarCont FeatureVector 0 jj Motors WZYX amp H 05 Copy Read to Write Read EEPROM Write EEPROM Figure 23 Barheater Diagnostics LM Mil Selector Y Test Location Allows user to use micrometers or mils When changed to a different format all positions and distances will be changed to appropriate units The units will be saved
9. good contact Zheight is dependent on Test Stress selection The factory recommended Zheight values are Heater Arm Test Probe Card Zheight 75um Heater Arm Dual Side Stress Probe Card ZHeight 150um Heater Arm Single Side Stress Probe Card Zheight 100um I Slider on Stress CH This parameter should be utilized to better match the test head number with the stress channel For example if stress probe card CHO does not have probes and CH1 on stress is connected to the very first head on the bar then set this parameter to 1 Y Location Y location of the probe card Equals 1 slider position 1 slider offset as defined in bar setup Use calculate probe location button to set it Parameter is dependent on Test Stress selection Calculate Probe Height Calculates the probe height based on current position and Test Stress station selection Sets probes height parameter Use this function after Find 1 Contact routine was successful Warning Bar height in bar setup must be set prior to setting probe height Failure to set up the bar prior to calculating probe height will result in probe card damage Page 23 of 47 Integral Solutions Int l Calc ulate Probe Calculates and sets probe card location based on current position Location and 1 slider offset as defined in bar setup Bar setup must be set up already before calculating probe location Enable Reprobing Enables reprobing feature The feature will
10. of the bar on the right side If Reverse Slider Order in Bar Setup is disabled then head will be on farthest from the operator If slider order is reversed Head 0 will be closest to the operator The first slider offset from this bar length will be used to calculate positions for all sliders on the bar 3 L6 Miscellaneous Controls Load Stress Module Loads stress application specified in tester specific menu It is necessary for reading resistance in Probe Card Menu Get Resistance button Load Temp Module Loads temperature controller driver This is necessary to read temperature and compensate slider position when running in standalone mode Note that during Lifecycle test this option is not necessary because Lifecycle test will update Barheater on current temperature automatically Read Temperature C If temperature controller driver is loaded will read the temperature into the textbox and Barheater will compensate slider position based on that temperature User can change set temperature himself without loading temperature module by changing the value in that text box Page 20 of 47 Integral Solutions Int l 3 2 Tester Configuration Tester configuration file contains all of environment parameters specific to each individual tester and also some of Probe Card Cleaning and Alignment parameters Fi Tester Specific Parameters x Video Driver isisimplevideo driver Show Control Window Default Setup
11. position To align left stress probe card move the arm down to clear both probe cards Then focus on the probes of the left probe card and move up until you can distinguish pads on the bar Align probes to the pads on the bar You will have to move the camera to first and last slider and correct probe card angle to make sure that all probes are aligned with the pads on the bar Measure resistance through Get Resistance function If resistance is not valid move the bar up and re measure resistance until you can find valid resistance on either device If Device 1 right probe card touches the bar first then lower the probe card on the left by turning the pivot screw clockwise and re measure resistance until the two probe cards are leveled If Device 2 left probe card touches the bar first then raise it by turning the pivot screw counter clockwise Move the bar up and re measure resistance repeat this step until can read resistance on both probe cards Note that first contact is defined where at least one head is making contact with the probe card Verify that if the bar is 10m lower you get no resistance on either device then move 10m back up and make sure both devices show valid resistance on at least on of heads on each bar Page 37 of 47 Integral Solutions Int l 3 5 5 Setting Up Cleaning Cleaning should be performed fairly often to prevent bad results caused by miscontact We recommend cleaning every 24 hours during the Lifecycle t
12. preamp chips If Write Data Enable is not on then will enable DC Write Write Frequency Mhz Write frequency common to all preamp chips on the same board Write Data Enable Enables AC Write All When measuring writer resistance instead of 8 heads will measure all 48 head resistances selecting heads 0 to 7 on each preamp chip Page 42 of 47 Integral Solutions Int l 6 Troubleshooting Problems 6 1 Error Messages Error 70125 NIMC wrong Model Error occurred in Load Acceleration Deceleration in RPS sec flex load rpsps in Axis 0x03 The function was not executed because it was attempted and illegal time Blazer cannot find home axis 3 Restart the computer and release emergency stop button If an error persists check the power supply for motion distribution board is plugged in and the cables to and from motion distribution board are connected properly Many sliders show resistance smaller than 2 ohms or larger than 150 ohms 1 Those bars are damaged To make sure compare the results from both bars and make sure that different heads are failing on different bars For example Head 12 failed on Barl but was good on Bar2 2 Pads are not clean or the probe card itself is not clean Try to clean those bars and probe card for the probe card use compressed air 3 The Slider Pitch for those bars is wrong Please look through the alignment camera and go from slider to slider Make sure that probes are always aligned with slider
13. probe cards Heating Arm Height Position of the heater arm lower than both stress and test probe cards Last User Last application to write to the EEPROM Should always be Barheater Feature Vector TBD Page 33 of 47 Integral Solutions Int l 3 5 Alignment and Calibration 3 5 1 Changing Bar Type You can do basic file operations with bar setup file such as New Open and Save As from bar setup form File menu Set slider pitch from drawing of the bar This is the distance from Pad1 on slider to Pad1 on slider2 Slider pitch should be set at room temperature 20 C Set the bar height from the bar layout Bar height is the distance from the backside of the bar to the pads Set 1 slider offset for the bar lengths you are going to use Slider offset is the distance from the edge of the bar to the center of the first pad of the first slider Set the reader location for up and down bar types Set the direction of bias current for your bar BlazerX5 internal definition is that is always on the outside of the slider If it is different on your product then you need to invert bias current Set a label for the operator number of sliders and enable one bar length Make sure that slider 0 matches channel 0 on your Stress Board If not then increase number of sliders by 1 and disable slider 0 If you plan to use the same bar length on both right and left sides then the head enable lists should be symmetrical
14. reprobe the same slider several times if contact resistance is bad The feature is required by scheduled maintenance so the checkbox is disabled if Schedule Maintenance feature is enabled Miscontact Criteria Allowed range for contact resistance Use Probe Contact test in Quasi97 Static test to find out contact resistance limits of your probe cards Of Retries on the same Slider Maximum number of reprobes Barheater will attempt before continuing test 3 Elapsed Counter Displays duration of probe card use since the last maintenance All counters are independent so if it displays 1 day and 25 hours it means that probe card was used for 1 Day or 24 1 Hours Reset Zeroes out the counters Schedule Maintenance TBD Page 24 of 47 Integral Solutions Int l 3 2 3 Probe Card Cleaning 015 Cleaning Arm Offset Y Cleaning Stroke Number of Strokes Stroke Delay ms Stress Probe Cards 30000 Calculate Cleaning Arm Offset 100 5 Clean Now 9 Test Probe Cards Iv Stress Probe Card Cleaning Zheight 50 Test Probe Card Cleaning Zheight 50 Y Stress Card Cleaning Pos Max Writer Resistance Delta Stress Probes Cleaning Frequenc j Interval h Repetiions 24 10 32000 Y Test Card Cleaning Pos 11955 15 Miscontact Failure Threshold sliders 20 Test Probes Cleaning Frequenc _ Interval h D Clean S
15. right side eese 3 5 3 Aligning Test Probe Cards left side eee 3 5 4 Aligning Stress Probe Cards sees ener eene 3 5 5 Setting Up Cleaning s sie roa re e PEE EE ERA REESE Er 3 6 OPERATING PROCEDURE eiae tet e Or REVO GRE RENEW ERE SET TERRE CER NEUEN ER ERR ENTE 3 6 1 Making asetup file RR e RU 3 6 2 Engineering Moders nanara re eee tree re e sre Tee Eee Ter Seer rte LER ISISIMPLE VIDE O RP STRESS APPLICATION USB seseseesesesssssesssesesosesesesososesosesosesosesesesososesesesosesososesesesesosesesesessse TROUBLESHOOTING PROBLEMS eere ee eee teen eene estan atas nets then ets th 6 1 ERROR MESSAGES hoe Pre et ee e ER SER EY a Ege re RENE E t x eee Eat CONTACT INFORMATION eere esent tata enata ta sna entia tasses tasses tasses tasses TABLE OF D OdU iq Deer Page 2 of 47 Integral Solutions Int l 1 Introduction 11 Specifications Lifecycle tester consists of two parts testing and stressing Testing part is connected to QST 2002E and conforms to all QST 2002 specifications set forth in Quasi97 User s Manual When examining these acknowledge that all the measurements are performed on the test station and some test parameters may not be applicable to stress Bias range is common to all heads The software will automatically
16. 50 Close Figure 25 Stress Application Board N Selects the board for operation Board 1 is on the right Board 2 is on the left Voltage Current Selects bias driver voltage or current Current driver is limited to 20mA voltage to 1000 mV Read Head Bias List Head Number Bias Head Enable for all 48 channels on Stress Board Use Fill button to substitute bias for all heads with bias in currently selected cell Fill Fill out bias current on Read Head Bias List Measure R Resistance Measures resistance on all 48 heads and shows the result in Measurements grid Bias ON Turns ON Bias on the selected stress board Bias value for each channel is defined in Read Head Bias List Will only turn bias on to the enabled channels in Read Head Bias List Bias OFF Turns OFF Bias on the selected stress board on all heads Ground MR Grounds MR heads It is not recommended to ground heads while the bias is still on especially in Voltage bias mode Page 41 of 47 Integral Solutions Int l Write Head List Preamp Head Select Write current and Enable for writing Each of 8 Preamp chips can only write on 1 head simultaneously but all preamps can write simultaneously Measure W Resistance Measures resistance on all 8 preamp chips using write channel and shows the result in Measurements grid Note that Write must be on to measure valid resistance Write Turns on Writing to all enabled
17. CB Then screw it down partially allowing it to move Slowly move the probe card forward until you see it on the Alignment camera Make sure that the probe card is connected to Bar Interface board Focus on the probes and move the bar up in 50um increments until you can distinguish the pads on the bar Use Get Resistance function to read resistance of the slider as you go up Slowly move up 50um at a time and measure resistance Align the probe card to the bar pads as they become more visible Stop when you read a valid resistance on either CHO or CHI Release the lock lever on the back of the left probe card by setting it vertically If you found that CHO touches the probe card first then go down 10um increments until you measured resistance on CHO is invalid and then 10um up You will be at the point of first contact Turn the adjustment screw on the back of the probe card base counter clockwise and measure resistance If necessary lower the probe card more and measure resistance again until you can measure resistance on both channels simultaneously You may need to lock the probe card in between the steps to align it with the pads If you found that CH1 touches the probes first then release the lock and turn the adjustment screw clockwise then move 10um up and measure resistance Keep raising the probe card and the bar up until you can read resistance on both channels simultaneously Verify by going 10um down that resistance is invalid on
18. Directory C Documents Stress Module Stress Application Show Control Window Video On F5 Video Off perator Form F7 dii Close fx Figure 17 Barheater Tester Configuration 3 2 1 General Settings Video Driver Video Application to be loaded on software start up Default value is ISISimpleV ideo Driver Show Control Window Shows main form of video application It can be used to store images in BMP format Default Setup Directory Location for bar setup files On software start up Barheater looks in that location for STP file and prompts the user to select on of those files Stress Module Stress Application The only valid setting is Stress Application Show Control Window Shows main form of Stress application It can be used turn bias on and off and other miscellaneous tasks Video ON OFF Click on the button to set shortcuts and use them in Quasi97 Operator Form production test Video can also be turned on in Main Form which can be is available under Barheater icon in system tray Page 21 of 47 Integral Solutions Int l 3 2 2 Probe Card Maintenance 1 POWER GN 2 Point Meas Valid Head Resistance Ohm Maximum Distance Step Size 10 E 80 100 10 Probes Height Offset ZHeight Y Location ER E EER alculate Probe Hei 00000 E 50 75 E 50000 1st Slider on Stress CH fi Calculate Probe Y Location v Enable Reprabing Miscontact Cr
19. Side Stress Probe Card Zheight 40um Y Stress Test Cleaning Positions where the probe cards are going to be cleaned Position Miscontact Failure Threshold Software will automatically clean if N consecutive sliders showed miscontact and then retest those sliders This cleaning will be done only once per interval 10 Max Writer Resistance A If writer resistance changes more than specified here will clean stress probe cards 100 Stress Test Probe Card Cleaning Frequency Interval 24 Repetitions Total TestTime 24 Clean Probe Cards Before Next Cycle Will force cleaning Stress Test probe cards after the next test cycle FALSE Page 26 of 47 Integral Solutions Int l Bar Setup 2 GED Type Parameters D 1 stp PII TUI TP Figure 20 Barheatar Bar Setup Bar setup purpose is to accommodate different lengths of bar One bar setup can serve several bar lengths and UP DOWN configurations All parameters set are relative which means that the file can be copied to other systems without changing any of the parameters Page 27 of 47 Integral Solutions Int l 3 3 1 Slider Setup The following parameters are used to define the sliders You can change the bias current direction reader location and slider pitch Slider Pitch The distance to move from one slider to the next one Bar Height Distance from the backside of the bar to t
20. TRESS Probes Before Next Stress Cycle Clean TEST Probes Before Next Stress Cycle Close tx Figure 19 Barheater Probe Cleaning Cleaning Arm Offset Fixed offset between the cleaning and heating arm It will be used to calculate probe height in cleaning arm position Reset this parameter only when the arm was changed or the thickness of cleaning plate was changed Calculate Cleaning Use this function to set cleaning arm offset after finding point of Arm Offset first contact for cleaning arm Clean Now Cleans selected probe cards based on parameters set in this menu Y Cleaning Stroke When cleaning software will move the arm to cleaning position Y Cleaning Stroke 100 Number Of Strokes When cleaning software will move arm from Y Cleaning Stroke to Y Cleaning Stroke this many times 10 Stoke Delay Delay between each stroke in ms 100 Stress Probe Cards Enables cleaning of stress probe cards during the test TRUE Test Probe Cards Enables cleaning of test probe cards during the test TRUE Page 25 of 47 Integral Solutions Int l Stress Test Card When cleaning stress probe cards software will move arm to Cleaning Zheight Heater Arm Height Cleaning Arm Offset Zheight Factory recommended Zheight values for the cleaning arm are Cleaning Arm Test Probe Card Zheight 30um Cleaning Arm Dual Side Stress Probe Card ZHeight 40um Cleaning Arm Single
21. WRITE STRESS RE 6 LIFECYCLE PRETEST RE 7 PRETEST RESULTS RE 8 LIFECYCLE DATA RE 9 LIFECYCLE PLOT RE 10 BARHEATER MAIN MENU RE 11 BARHEATER SYSTRAY ICON RE 12 BARHEATER MOVEMENT RE 13 BARHEATER COORDINATES RE 14 BARHEATER STATUS INDICATORS RE 15 BARHEATER NAVIGATION RE 16 BARHEATER SLIDER TYPE SELECTION RE 17 BARHEATER TESTER CONFIGURATION RE 18 BARHEATER PROBE CARD MAINTENANCE RE 19 BARHEATER PROBE CLEANING RE 20 BARHEATAR BAR SETUP RE 21 BARHEATER BARLENGTHS RE 22 BARHEATER SLIDER SERIAL NUMBER RE 23 BARHEATER DIAGNOSTICS RE 24 ISISIMPLE VIDEO RE 25 STRESS APPLICATION Page 45 of 47 Integral Solutions Int l 9 Index uM Mil Selector esses 32 A Absolute Position 17 Action if Selected Reader Channel Failed 11 Add Pin Reverse Result sesss 28 Auto Manual Head Disable 12 B Height 28 Bar Length neo 30 Bar Length 1 20 Bar Type iia aca eite 20 Bras Get i EE E ers 22 Bias Direction eect ates an ei aa eh 28 Bias Per Head 10 C Calculate Cleaning Arm Offset 25 Calculate Probe 1 23 Calculate Probe Location 24 Clean NOW eet 25 Clean Probe Cards Before Next Cy
22. at need to be set to use Barheater loading mechanism Select Bar2x tester configuration in Quasi97 System menu then go to Add Ins Available Modules and add Barheater Driver Go to Add Ins Selected Modules and enable it to load Barheater e Do not set number of sliders head labels or part ids for each slider because those parameters will be overwritten Set default bias current or voltage in Quasi97 System menu For consistency use only positive bias current in Quasi97 setup and invert bias current direction in the Bar setup in Barheater 3 6 2 Engineering Mode In general testing bars is not different from testing 2x HGAs Here are some of the differences Start loads bars goes to the selected head in Quasi97 probes and turns bias on Stop turns bias off and unload the bar Run Test in production test Quasi97 will test starting from current head to the end of the bar Quasi97 will then return to the previously selected slider Abort will stop the test and return to the original head in production test Page 39 of 47 4 ISISimpleVideo Integral Solutions Int l This purpose of this application is to display video from one of the 3 channels for alignment operation Add ISISimpleVideo Driver to Barheater s Tester Configuration menu and you will be able to invoke the video screen using Video button in Main Menu Video Display Grab x Y 195 0 Size X Y Figure 24 ISISimple Video Grab Con
23. avi cetero aver ve ue ui lan dee py ee RE Pede a ee eR TS 24 Senece tice SEEE estetica Pe e eee ev gor eee e e Aene vade 2 5 RESULTS AND DATA hZWGUOno 3 1 MAIN FORM 3 1 1 Movement B ttOris in een de e a a E e ipa 3 4 2 Cootdiriate Plane ve Ret er ier spere ene eR IRE 3 1 3 NYrrri ou Tor ert ira At ES 3 1 4 DN ADETHITTIOBH THIS KEHRT EE 3 1 5 Bar Type Selection o rri tee iar e 3 1 6 Miscellaneous COonttols ua rtr AR Er Eben OO ERE Re rented eed 3 2 gt TESTER CONRBIGURATION nebst hte EO ELDER Epi sie or Ete 3 2 1 General Settings use age ebria re 3 2 2 Probe Card Maintenance esee eene enne ener nennen 3 2 3 Probe Card Cleaning iii eeu e da Ae eee dires 31394 IBARISETUP neenon me Den ROO ELA FUP tte ore Eres 3 3 1 Slider Setup ie ct epe e EO e ree E tres pratis 3 3 2 Bar Configuration Reference eese eene nennen eene nennen 3 3 3 Bar Lengths ise e ai 3 3 4 Serial Number Setup 39 4 DIAGNOSTICS t aq ei ie Ue UNE IS VIUERE IEEE 3 5 ALIGNMENT AND CALIBRATION nennen 3 5 1 Changing Bar Ty pe s ie oe c TEE I RENE AEE US E ETERNI Rr e 3 5 2 Aligning Test Probe Cards
24. channel number on the stress board So if channel 0 is not connected on the stress board head 0 should be disabled on in the bar length definition as well Page 30 of 47 Integral Solutions Int l 3 3 4 Serial Number Setup This allows you to set up different serial number scheme specific to each bar of Symbols to Read 1 0 veo LSB ABCDEFGHIJKLMNDPORSTUMVWXYZ 101 M E ABCDEFGHIJKLMNOPORSTUVWXYZ 0 ABCDEFGHIJKLMNOPORSTUVWAYZ O ms ABCDEFGHIJKLMNOPQRS TUVWxyz 0 te ABCDEFGHIJKLMNOPORSTUMWAYZ 0 ABCDEFGHIJKLMNOPORSTUMWAYZ 0 8 ABCDEFGHIKLMNOPQRSTUVWXYZ 0 s ABCDEFGHIJKLMNOPORSTUVWXYZ O Test 10 ABCDEFGHIJKLMNOPORSTUVWAYZ 0 Figure 22 Barheater Slider Serial Number Of Symbols To Read The size of your serial number in characters Values from 1 to 12 Numbering Array Blazer can read only a small fraction of total sliders and must calculate the numbers for the rest of the bar Here you can set how the serial numbers will be incremented All the character rows are located in the ascending order from least significant bit to most significant top to bottom Position From Right sets the placement of the characters in the string Increment sets if that placement position can be changed from bar to bar Test Verifies serial numbering across all sliders of your bar To use it type a valid serial number into the textbox above Test
25. cle 26 Cleaning Arm seen 19 Cleaning Arm Height sss 33 Cleaning Arm Offset sss 25 Cool Down Time S essere 9 Current Voltage esee 10 D Default Setup 21 Default Stress Bias sess 10 Duration of Stress 11 Elapsed Counter eese 24 Elapsed Stress Time sees 9 Enable Reprobing sees 24 Encoder Distance seen 17 EncoderS eI 17 Est Completion esee 9 F Feature Vector 33 Find Point Of First 23 Maximum Distance 23 Step Sue iitegsbuatbiaameldn 23 G Get R sistance son e eiae Saher 23 Go To Slider reri eH 19 Integral Solutions Int l H Heating Arm 19 Heating Arm Height ses 33 Hold A EE T ES 19 1 Individual Sliders esses 30 L Last Sep le a Umso 33 Load Stress 20 Load Temp Module sese 20 Low Power Mode eere 18 M Max Write Duration m eee 11 Max Writer Resistance 26 Measure Bar Height 28 Misc
26. ent mode In alignment mode all the speeds and accelerations are 0 reduced Also the Navigation buttons will prompt the user to confirm each simple move prior to executing it telling operator 0 the distance and direction of the move Figure 12 Barheater Movement For Y stage the direction is In 7 and Out 4 For Z stage the direction is Up 7 and Down 4 Keep in mind that even though you are in alignment mode the movement buttons themselves are not going to confirm each move To execute a move enter the distance in Y or Z step text box and press one of the movement buttons Distance is either in um or in mils depending on the selection in Diagnostics menu Arrow on each button corresponds to a direction of the movement Y Stage moves Bar Lifter in and out of the magnet Z Stage moves Bar Lifter up and down To exit alignment mode click on the upper left corner checkbox again You will be prompted that all speeds are restored back to normal If you at any time hit the limit sensor the software will ask you to find home on that stage It is recommended to find home otherwise the counter on that stage could be off by up to 500um Page 16 of 47 Integral Solutions Int l 3 L2 Coordinate Plane When you start Barheater it finds home sensor and resets the counter of steps After that software keeps track of the current Relative position on all stages You can find out the current position b
27. est The cleaning arm can either be sandpaper or a metal strip Sandpaper should be replaced approximately every month or in case of metal strip it should be cleaned or replaced monthly as well Cleaning is done using a fixed offset from the probe height on both Test and Stress stations Therefore cleaning offset can only be defined after the probe height was set Cleaning offset does not need to be changed unless the thickness of the cleaning plate is changed or the cleaning arm itself is replaced changed Use the following procedure to define cleaning arm offset Go to Cleaning Arm Stress Position Load Stress Module from Main form Set 100mV bias voltage and measure resistance it should be 100000 Move up until you measure anything different on any of the heads Move up 50um from that point and scrub move on Y 100 and 100 10 times Move down 300um and measure resistance again It should be 100000 everywhere if not then move down more until you see 100000 on all heads Move up in 10um steps and find the first position where resistance is less than 100000 This is your initial contact position Go to Probe Card 2 Cleaning menu and click Calculate Cleaning Arm Offset Set Cleaning Zheight for both test and stress probe cards Page 38 of 47 Integral Solutions Int l 3 6 Operating Procedure 3 6 1 Making a setup file Creating a Quasi97 setup file is described in more detail in Quasi97 User s Manual However there are a few things th
28. ested After that fixed sequence the heads will be tested with both read and write stress if enabled at user defined intervals Since this test can take weeks it is recommended to clean the probe cards during the test using Barheater automatic cleaning routine If cleaning is enabled Barheater will clean probe cards after Test cycle and return heads to the Stress station without interrupting the test To enable Lifecycle test add Lifecycle Application in the Quasi97 Add Ins gt Available Modules and enable it in Selected Modules Page 8 of 47 Integral Solutions Int l 2 1 General Settings General Settings tab on the Stress menu serves for both setting parameters and displaying information during the test General Setup Total Test Time 750 Elapsed Stress Time 49 7 24 Cool Down Time s 0 Est Completion 18 09 51 May 01 2003 Nest test 0 11 46 M 9 Test Interval Interval Repetitions Temperature C HD 1 46 ca 1 100 3 1 100 1 100 Tests Fail Params Test Result Stat Plot Fail Check Delta Min 4 Static Tests I l Ohm AVG v 30 0 100 1 Transverse Setup Amp u AVG v 30 0 100C Transverse Setup Pk Pk Asym AVG 30 0 1000 v 4 1 a tare firadaec Figure 3 LifeCycle General Setup Reculte T nare Total Test Time Total stress time in hours This time does not include time to test heads be
29. for every individual setup file Bar Tray and Tester separately If you try to use micrometer bar setup on mil BlazerXS it will convert all the length and distances to mils automatically during opening of the file If you then save that bar setup it will be converted to mils before saving and saved as mil setup Position of test probe cards At this position the first pin on the probe card will hit the edge of the heater arm Z Find Home Offset On Barheater startup program will move down this amount to avoid damaging the probe cards then will find home on Y axis then it will find home on Z axis There are 2 limiting factors for it If Barheater is in Cleaner Stress Probing position it has to move down this amount to avoid damaging test probe card with cleaner arm If Barheater is in Cleaner Unload Position it has to move down this amount and avoid damaging stress probe cards with Heater Arm 3500 Page 32 of 47 Integral Solutions Int l Y Stress Location Position where the first pin of the stress probe card is touching the bar heater arm edge To stress software will move to this position 1 slider offset as defined in bar setup 119000 Test Probe Height Position where the heater arm touches the test probe card Stress Probe Height Position where the heater arm touches the stress probe card Cleaner Arm Height Position of the cleaning arm lower than both stress and test
30. he pads Measure Bar Height If probes heights were set before for a different bar this button can be used to determine the bar height Detect the point of 1 contact using probe card alignment menu and then run this function Offset Thermal Adjust Offset to be added to each slider 0 100 Pitch Thermal Adjust 100 C Normal Slope Slider pitch adjustment based on temperature 0 5 Defines normal sign of the slope in transfer curve test for particular type of sliders Up Down This parameter is used in the Transfer Function Test to detect Pin Layer Reversal If measured slope has a different sign from normal slope then pin layer reversal is detected Add Pin Reverse Result Allows adding pin reverse result to Transverse and Longitudinal Tests The calculation of the result takes approximately 100ms per test Reverse Slider Order Changes the direction of movement from N to N 1 slider Normally the first slider is the farthest from the operator on right side If you reverse slider order then the first slider will actually be the closest to the operator Bias Direction The direction of bias current it can either be normal or inverted If normal the bias current sign will be preserved for all tests If inverted then positive bias current will be negative and negative will become positive By default RD is either the last or the first pad depending on the reader location For example if your product is R R
31. is detected click on calculate probes height to set it Click Save On the main menu go to alignment mode and click Probe The tester should confirm a small move up equals Zheight Go to the first slider on the test probe card and click Calculate Y Location to set new probe card Y position Verify the setting by going to the beginning of the bar through Slider Selection combo box click touch and measure resistance Check it on both reader and writer and make sure that I I resistance is fairly close to Page 35 of 47 Integral Solutions Int l 3 5 3 Aligning Test Probe Cards left side To install the probe card on the left or to realign it after installing probe card on the right put on a good bar on the left and go to heating arm test position Select Test station in Probe Card gt Alignment menu and enable main bias switch power on Set bias current slider type and type of resistance to measure We recommend detecting holding height on the writers using MR MR resistance measurement Set sufficient bias current 5mA 10mA for writers or 1 2mA on readers If the heater arm is not selected or arm is not in test position go to heater arm test position If heater arm was selected and it was in test position then move down to heater arm height heater arm height can be found in Diagnostics menu Gently insert left side probe card in the magnet until you see the first screw holes in the holding block under probe card P
32. iteria E lt Contat Resistance 30 Of Retries on the same slider 2 v Schedule Maintenence Elapsed Verification Frequency Every 5 Slider Lens fo Of Sliders to Try Before Taking Action Bars Trays ZHeight Mi ZHeight M ZHeight t eight Min eight Max eight Incremen Minutes 5451145 sn 200 20 Hours ji 3524 Display a Warning Call Engineer Days 38063 Message ET Correct and Parameters Create File Name Close sZ Find Point of First Contact Figure 18 Barheater Probe Card Maintenance Test Stress Station Selector for the displayed parameters Determines which device will be used to get resistance and which Probes Height and Zheight to modify Power ON Turns On Off Main bias switch in Quasi97 when working with test probe cards Bias mA Bias current in mA will be used in Get Resistance and Detect 1 Contact functions Note that it has no effect when measuring writer resistances on the stress probe cards Reader Writer Selects the configuration to be used in Get Resistance and Detect 1 Up Down contact functions On the right side Up is the farthest two pads from the operator Page 22 of 47 Integral Solutions Int l MR MR I I Selects the pair of pins that will be used to measure resistance Note that I I are current source pins and will measure large resistance when probes are not touching the slider MR MR are voltage se
33. l 2 3 Write Stress This menu will be disabled if writer stress board is not present When using write stress keep in mind that there are only 8 preamp chips on each board so total of 8 writers can be enabled on each device m General Setup Read Stress Write Stress j Pre Post Stress M Write Frequency 100 Duration of Stress 21 100 Write Current m 20 Write Duration 5 Action if Selected Reader Failed No Action Mi Channel 2 Head Current m 4 20 Figure 5 LifeCycle Write Stress Write Frequency Mhz Writer stress board write frequency Setting is independent from Quasi97 write frequency 100 Write Current TBD Duration of Stress Since the test lasts weeks and the preamp chips may not have been designed to write for such a long time lifecycle test can limit the write time Duration of Stress limits the write time to some percentage of the stress interval After that write current will be shut off but head will still be under read bias stress Max Write Duration Maximum write duration limits write stress if stress interval get m really long hours This will override Duration of Stress 9c 5 Action if Selected No Action and Disable Write Head are currently supported No Reader Channel Failed Action P reamp Head Selection Defines which heads will be written to and write current for those
34. l results from those tests will be logged Add results that you want to validate before running Lifecycle Validation will occur in both Manual and Automatic Head Disable Modes Auto Manual Head Disable If Manual Head Disable option is selected then the software will show a map of all 96 heads and mark in red the heads that failed Operator can then go through the results and disable enable heads as he wishes Then he can continue the Lifecycle test Automatic Head Disable will check all the heads against fail on parameters and run lifecycle without operator confirmation Page 12 of 47 Integral Solutions Int l 2 5 Results and Data The first set of results will generally be from Pretest If you enable pretest and enable Manual Head Selection option then the following screenshot will appear and the software will wait until you click Continue JA Pre Post Life Stress Tests Main Title Apply Fail On Sub Title 8 m E Enable All n Enabled Heads Disabled Heads ISI IS IS Parameters __ Setup1 Resistance Ohms 2645 609 __ Setup1 Min pv Transvers 2192 771 _ Setupt Max uV Transver 2141 515 P Setupt Pk Pk Amp uv Tr 2743 26 _ Setupt Pk Pk Asym 2 Tr 2084 57 Setup
35. n Unload move to a different slider and probe again The buttons do not 3 turn Bias OFF and ON so Video avoid using them if Bias is ON in Quasi97 Figure 15 Barheater Navigation Probe Moves the bar up to touch the probes Probe height Bar height ZHeight See Probe Height definition later in the manual Hold Moves bar down Zero point offset away from the probes when Heating Arm is selected and down to heater arm height if tester is in Sress position Stress Test Moves the arm to Stress or Test position Note that when it test position software will move to the first enabled slider Unload Selects cleaning arm and moves to Y Stress position Video Shows or hides video screen Page 19 of 47 Integral Solutions Int l 3 15 Bar Type Selection You can have several bar lengths in the wafer That information has to be setup in bar menu before you can use it aep Bar Type Down Heads Load Stress Module Che Empty gt Chi Seagate Du Load Temp Module Read Temperature C o Figure 16 Barheater Slider Type Selection Bar Type Up or down type of bar By using that you can control the bias direction normal slope and the location of the reader on the bar See Bar setup menu for definition of UP and DOWN configuration In addition to selecting the configuration in this menu ensure that the cables going to the bar interface board and to the stress probe cards are connected to the right place Bar Length CH1 The length
36. nse and will measure 0 2 5Q if probes are not touching the slider Get Resistance Measures resistance on all available channels and displays it in a grid Valid Head Resistance The range of resistance when detecting 1 contact Maximum Distance Maximum distance to go when detect find 1 contact position Note that if find 1 contact was not successful it will stay at maximum distance from where you started after you press the command button Step Size Step size to be used during 1 contact detection Resistance will be measured after each step Find Point Of First Contact Goes up Step Size distance and measures resistance until it finds reads Valid Head Resistance or reaches Maximum Distance If the function is successful it will reprobe 5 times then show resistance at every reprobe and stay at first contact position Note that this function alone does not set any position Use calculate position buttons to set desired height Probes Height Probe Height parameter for test or stress probe cards depending on the Stress Test station selection Equals first contact height BarHeight Use Calculate Probe Height button to set it 0 Pt Offset Distance between the bar and probe cards when moving from slider to slider Note the same distance is used during detect 1 contact routine to remeasure resistance 5 times Zheight Distance barheater will move up from 1 contact position to ensure
37. ontact Criteria eee 24 Miscontact Failure Threshold 26 Motion FAILED eee 18 23 N Next Testa aie eaten 9 Normal Slope sssi 28 Number Of Retries On Same Slider 24 Number Of Sliders eee 30 Number Of Strokes seeeee 25 O Offset Thermal Adjust 100 28 OVerrlide a 18 Pitch Thermal Adjust 100 28 Power ON icut poni IE VARII 22 Preamp Head Selection 115 11 Pretest Fail On Paraims eee an 12 Run Sequence sse 12 12 Probe eet aide 19 Probes Height essen 23 R Read Temperature C 20 Reader Location eere 28 Relative Position 17 Reverse Slider Order 28 Page 46 of 47 S Schedule 24 Serial Numbers Constraints ico eiecti eee erectile 31 Number Of Symbols To Read 31 E E ES 31 Show Control Window 21 Slider Pitch uci eet 28 Stoke Delay oca dee 25 Stress Test Buttons sees 19 Stress
38. ory for automatic NI DAQ installation or alternatively run NI Setup exe installation file and select NI DAQ Device Drivers Visual Basic Component NI FLEX MOTION Run NI FLEX Motion setup and select Microsoft Visual Basic DLLs QUASI97 Run Setup Exe file from quasi97 directory Change installation type to Custom and enable Quasi97 Preamps External Tests Additional Hardware Temperature LIFECYCLE TEST Run Setup exe from Lifecycle directory on you backup CD Change installation type to Custom and enable all components ISISimpleVideo and Stress application are a part of this installation Page 7 of 47 Integral Solutions Int l 2 Lifecycle Test Overview Lifecycle test helps in studying lifetime of heads based on accelerated lifecycle A fairly large population of heads up to 96 is heated up and stressed with high bias and write current At user defined intervals stress bias and write current are turned off and heads are tested using any available QST tests Results are saved with the timestamp so that engineer can analyze head parameter degradation over time Bias currents can be defined individually for each head or group of heads Only 16 user defined heads can be written to during the test and write currents can be set independently for all 16 heads The test intervals are limited to whole numbers in minutes However when the test starts all heads will be tested then stressed with only read bias stress for 10 seconds and then ret
39. pads 4 The vacuum gripper is not horizontal That can happen if at some point it hit the tray 400 pounds force is enough to tilt it To verify that switch the Reader Side to opposite and run quasi static tests on both ends of the bar For example if Reader Location was Right then change it to Left so that you will be testing writer resistance Avoid the first two and the last two sliders because of possible problem described in step 2 Do not try to write in any test otherwise you will damage the reader The probes seem to align with slider pads but transfer curve results are out of order When running transfer curve what is measured resistance 1 It is in the range of 8 15Ohm reader location in bar setup should be on the opposite side 2 It is 0 2Ohms then you need to re detect holding height using probe card maintenance menu 3 It varies with each slider then check slider pitch Page 43 of 47 Integral Solutions Int l 7 Contact Information Integral Solutions Int l 2192 Bering Drive San Jose CA 95131 Phone 408 941 8300 Fax 408 941 8309 E mail isi us isi com Web http www us isi com Page 44 of 47 8 FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU FIGU Table of Figures RE 1 UNPACKING STEP 1 RE 2 UNPACKING STEPS 2 AND 3 RE 3 LIFECYCLE GENERAL SETUP RE 4 LIFECYCLE READ STRESS RE 5 LIFECYCLE
40. set in the bar setup Stress bias should be inverted in the lifecycle test setup Page 29 of 47 Integral Solutions Int l 3 3 3 Bar Lengths Each head type can have several bar lengths cut out from a wafer This menu allows you to set up 8 different bar lengths for up and down bars Bars Length Configuration Label Up Offset DownOffset Of Sliders Enable Bar A 1122 1122 44 Y EMPTY 1230 1230 I 2000 2000 50 5 2000 2000 50 2000 2000 50 2000 2000 50 O 2000 2000 50 0 2000 2000 50 Label Up Down Offset Figure 21 Barheater Barlengths Bar length identifier which the operator is going select Distance between the center of the pad on the first slider and the edge the bar This parameter must be taken from bar layout drawing or measured Of Sliders Make sure that it matches your stress probe card Remember that if slider 0 is disabled on the right side last slider should also be disabled for the same bar length to work on the left side Enable If disabled then this bar length selection will not be available Individual Sliders For each bar type you can have special naming convention that will be saved to a log file as Head ID Select a bar length and click on this button to modify slider names This will also allows to disable sliders and to exclude them from serial number calculations Slider number will always correspond
41. set optimal bias range for all bias currents on the head list Bias Current Range 1 5mA 5mA Bias Current Range 1 0 0025mA Minimum Resolution Bias Current Accuracy 0 010mA Bias Current Range 2 10mA 10mA Bias Current Range 2 0 005mA Minimum Resolution Bias Current Range 3 20mA 20mA Bias Current Range 3 0 010mA Minimum Resolution Bias Voltage Range 1 250mV 250mV Bias Voltage Range 1 Resolution Bias Voltage Accuracy 0 125mV 0 500 mV Bias Voltage Range 2 500mA 500mA Bias Voltage Range 2 Minimum Resolution 0 250mV Bias Voltage Range 3 1000mV 1000mV Bias Voltage Range 3 Minimum Resolution 0 500mV Stress Resistance Measurement Accuracy 5 feature for Diagnostic purposes only Stress Temperature Accuracy 3 Page 3 of 47 Sine Driver Board Specifications Integral Solutions Int l Maximum Number of heads that can be enabled for Writing Any 12 out of 48 Supported Writer Resistance 0 20 Ohms AC Write Current Range 20mA 100mA 0 Peak or DC 15mA 70mA RMS AC Write Current Resolution 0 4mA DC Write Current Range 20mA 100mA DC Write Current Resolution 0 4mA Write Current Accuracy 5 Write Frequency 0 000010 MHz 5 MHz Write Frequency Resolution 0 028 Hz Maximum Write Current Turn On Time 20uS ramping up Maximum Write Current Turn Off Time 35uS
42. side of it Remove the ropes holding the tester Unscrew the bar on the bottom that prevents the tester from rolling out Put the two ramps in and wheel the tester out of the crate Figure 2 Unpacking Steps 2 and 3 The monitor camera and lakeshore temperature controller should come in a separate box Unpack monitor and put it on the special stand on the left side of the tester connect the power and computer to it Install alignment camera on right stand plug 12pin round connector into the camera and plug in power to LED Install lakeshore on the right side and connect AC power heater block temperature sensor to terminal B and DB9 cable from the computer Make sure that both stress boards are connected through USB cables and RD WD cables are connected to the universal interface board on the back of the tester Once the tester is on site unscrew holding standoffs on the four corners for stability Page 6 of 47 Integral Solutions Int l 14 Installing Software software is installed during manufacturing of BlazerX5L Software installation is necessary when contents of hard drive were erased or after computer upgrade Software package contains following programs Matrox Image Library Lite NI DAQ Driver NI FlexMotion Driver Quasi97 Lifecycle Test Barheater Driver ISISimpleVideo Application USB Stress Board Driver NI DAQ DRIVER Warning Only Ni DAQ 6 8 1 Driver is supported Run ISIInstall bat file in NI DAQ direct
43. ss gt Holding Probing Cleaner gt Test Stress Unload gt Holding Probing Motion FAILED Indicates that hardware is not present No moves will be executed if hardware is not present Low Power Mode Shows that the drivers are in low power mode Whenever doing any move on Z stage the software exits low power mode Barheater only enters low power mode when going to Heater Stress Probing position Override In alignment mode the current status can be changed without moving the stages To do that change override text box to desired state in hex such as 1A and click override Use this mode only per request from ISI Page 18 of 47 3 14 Navigation Buttons Integral Solutions Int l Navigation buttons simulate the same commands that Quasi97 will give to the Barheater Use them to verify your alignment Heating Moves the arm down to the Havigator Arm heater position Heater Arm Height If Cleaning Arm is Heating Arm Cleaning Arm selected then moves bar lifter in to home sensor 0 and then Gee siden HD1 1 me down to heater position e Saisie Cleaning Moves the arm up to Cleaning Arm Arm Height If Cleaning Arm is Probe selected then moves bar lifter to home sensor 0 first and then to cleaning arm zl Stress Hold Test Go To When in Test position moves Slider to a different slider on the bar If probing Barheater will move down by 0 point offset the
44. t Barkh Jump 1 2664 875 Clear Results Plot Reset Plot Scales _ Setupt Barkh Jump 1 2270 791 Setup1 Barkh Jump At De 2036 342 Figure 7 Pretest Results There are a lot of pretest results that are impossible to depict on one plot So the test only shows distribution of a single result across all heads To select which result to plot first select the temperature in the combo box Then click on a row in the result grid and press Refresh to refresh the plot The plot shows all enabled heads in blue and disabled in red Zoom in and double click any column bar on the plot and the head to which this result belongs will be disabled Double click again to enable the head Page 13 of 47 Integral Solutions Int l It is recommended to log results in CSV mode since it is more stable over long period of time The data from each test cycle is appended to the log file after heads go to stress and stress bias is turned on Since the test lasts weeks the raw data logging is not available and furthermore only those results selected in Test Fail On Params on General Settings tab will be logged Results Parameters Grades Figure 8 Lifecycle Data Test results list is not limited however the number of results to plot is limited to 5 Any or all of those five can be changed during the Lifecycle test without interrupting it Unlike all the other QST tests Resul
45. t can terminate earlier if all heads failed before Total Test Time Next Test Time till the next test cycle It is recommended to browse results during stress cycle to avoid Application is Busy warning Page 9 of 47 Integral Solutions Int l 2 2 Read Stress This menu will be disabled if Read Stress Board is not found General Setup j Write Stress Pre Post Stress C Current Voltage Default Stress Bias fi 75 Add Remove Figure 4 LifeCycle Read Stress Current Voltage Global Parameter Sets current or voltage bias mode on two stress boards All bias values will be validated based on that Default Stress Bias In mA or mV depending on Current Voltage selection All heads that do not have special bias defined in the Bias Per Head Group Grid will be stressed at Default Stress Bias Bias Per Head Group Special bias can be applied to any head on right and left side This value will overwrite default value for that particular head or group of heads Head number in these grids is zero based and corresponds to the channel number on the stress board First Stress Interval s The first stress interval duration in seconds The first stress interval is read stress only and is applied before the intervals defined on the General Page To disable read only stress before the main stress sequence type in 0 for first stress interval Page 10 of 47 Integral Solutions Int
46. tinuously acquires the picture Uncheck it if you want to freeze the picture Video Channel Default channel is 1 Cameras can be connected to the channel 1 or 2 or through BNC connector on the video card on On Top Shows form on top of all other windows If ran in standalone mode it has the ability to save images in bmp format from ISISimpleVideo Main Form Page 40 of 47 Integral Solutions Int l 5 Stress Application USB Stress application is used only to troubleshoot problems with Stress Boards It is primarily a driver for the stress board used by Lifecycle application and Barheater Nevertheless it has some basic functions like Reading EEPROM Bias On and Off etc iBixi Diagnostics Board 1 x Voltage Fil C Current Read Head List Name VA Bias mA mv Value 4 Write Head List Measurements 100000 0 chi 100000 00 0102 ch2 100000 00 0102 ch3 100000 0 0 0 102 ch4 100000 00 0102 ch5 100000 00 0102 ch 10000 0 00 0 102 ch7 10000 0 00 0 102 ch8 100000 00 0 101 ch8 100000 00 0102 chi 100000 00 0102 chil 100000 00 0102 12_ 100000 00 0102 100000 00 0 101 s ISI IS IT T IST IT ST ST 1 4 8 fca fcs eS fc Write Bet Write Data Ena Ground MR Write Freq Mhz
47. tion Load Quasi97 first and enable Barheater Driver in Add Ins gt Selected Modules Open Probe Card gt Alignment window and set the probe height 500um lower then you expect it to be or add 500um to the value that was last time Close the menu Put on a good bar Go to Heating Arm gt Test position to bring up the bar to the probe card Go to a slider in the middle of the bar Gently insert right side probe card in the magnet until you see the first screw holes in the holding block under probe card PCB Then screw it down partially allowing it to move Slowly move the probe card forward until you see it on the Alignment camera Screw down the probe card more If left CH1 probe card is present move it Up or out all the way Select Test station in Probe Card Alignment menu and enable main bias switch Power On Set bias current slider type and type of resistance to measure We recommend detecting holding height on the writers using MR MR resistance measurement Set sufficient bias current 5mA 10mA for writers or 1 2mA on readers Make sure that the probe card is connected to Bar Interface board Set Valid Head Resistance range Maximum Distance and Step Size Click Find 1 Contact button Check the alignment camera and make sure that bar is directly under the probe card if not you can move the heating arm in to compensate If necessary click find 1 contact button repeatedly until you find valid resistance When valid head
48. ts tab only shows the result from the last run and Data tab displays results at any timestamp At any time during the test the operator can browse the heads and look at results of any one head by choosing the result on the info grid Grade Cycles Test Time Date Time __ jOpertorio Life Cy 4 272 12 27 Life Cycle el Ez Resstance Ohms Pk Pk Am Resistance Ohms Figure 9 Lifecycle Plot Page 14 of 47 Integral Solutions Int l 3 Barheater Driver 3 1 Main Form Main menu is used mainly during alignment of the tester It is also the place where you select Bar Type and Length for Lifecycle test Generally Barheater will be loaded through Quasi97 program as one of the Selected Modules Barheater Driver Main formcan then be invoked from Quasi97 System gt Setup or File Device Setup DownHeads E Seagate Du e E Sider 47 _ E pe Figure 10 Barheater Main Menu This form can be invoked at any time from the system tray by clicking Barheater icon Figure 11 Barheater Icon Page 15 of 47 Integral Solutions Int l 3 11 Movement Buttons Movement buttons are disabled by default to prevent user from accidentally going to wrong location Once you click on the Alignment Mode checkbox in the upper left corner of that frame you will be Move Y Move 7 notified that system has switched to alignm
49. tween stress cycles It can be modified during the test Cool Down Time s Minimum time in seconds bars will cool down from stress bias at holding height prior to probing and testing 10 s Read Write Pretest Enables Disables Read Write and Pretest tabs and their functions accordingly TRUE Test Interval Grid Interval in minutes number of repetitions for that interval and Temperature Interval 1 means that the software will test at this interval until Total Test Time is elapsed Test will terminate after Total Test Time even if Test Intervals are defined past it Interval 30m Repetitions 1 Temp 100 Tests Fail On Parameters Should include all results that user wants saved in the data log Up to 5 results can be displayed on the graph User can change which results are plotted any time during the test At the end of each interval the results with Fail Check enabled will be tested against Min Max and Delta parameters on all heads Any head with results exceeding those limits will be disabled for the rest of the lifecycle test Add Remove Click on the desired grid and then Add Remove buttons to manipulate items on that grid HD1 46 Displays head label of the selected head The label under it shows the Part ID for that head Elapsed Stress Time Shows elapsed stress time since the beginning of the test Est Completion Shows estimated date and time of test completion The tes
50. y clicking on the coordinate plane Z 23585 Combo Box allows you to select the type of counter to use P positions in Barheater are absolute therefore use absolute v 119085 counter when defining them Figure 13 Barheater Coordinates Absolute Counts distance from the home sensor Relative Not used Encoders Alternative independent counters count the actual physical movement of each stage This counter displays digitally read encoder counts Encoder Distance Position in um or mils from home derived from encoders Even though nothing requires you to use them software will use them for self diagnostics Click on coordinate plane to display the coordinates Coordinate plane does not get updated in real time so every time you need to find out current position click on it On Y stage Bar Lifter assembly positive direction is towards operator and negative toward the monitor On Z stage Bar Lifter Assembly positive direction is movement down and negative is up Page 17 of 47 Integral Solutions Int l 3 L3 Status Indicators In addition to the coordinate plane Barheater also has Status indicators Current Status Low Power Mode 14 heater stress probing Motion FAILED o Override Figure 14 Barheater Status Indicators For easier alignment and faster operation software identifies several states tester can be in You can see the current state on Current Status label Heater gt Test Stre

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