特点: - stacje lutownicze do BGA
Contents
1. nozzle 38 x32 2 42 5 45 r4 dd 3 00 3 00 cfs 3 00 c z 3 00 1 Related information 1 How to deal with the Voids produced by the lead in lead free soldering As the development of the lead free technology more and more SMT processing enterprises come across the problem of Voids in production Many companies try to avoid using lead BGA in lead free soldering technology Because the melting point of lead soldering balls is lower than lead free tin paste The tin balls melt first and surround the tin paste so that the flux in the paste can t volatilize and form bubbles inside If there is via on the soldering pad there may be more bubbles Temp hot soldering 250 C 230 C cold soldering Time small heat capacity spot big heat capacity spot heat capacity spot E 4 Steps of desoldering and replacing BGA CSP with lead free desoldering materials Set the temperature curve Desoldering the broken parts Clean and preparation for the repair work Remount the reworked parts with flux paste Detection of reflow soldering a Requirement of devices in reworking Repairing method of BGA CSP is convection not radiation so soldering iron is not the ideal choice In normal reworking of BGA it is difficult to use IR because the ceramic heater can t cool down very quickly thus it is difficult to control the time of higher reflow temperature However the convecti2. Compared with reflow temperature curve the control of temperature in rework process is more strict because in normal reflow oven the temperature loss id nearly zero But in the rework process the PCB is usually exposed in the air we heat the components respectively In this way there is much loss of temperature But we loss can t be made up only by heating The reasons are as follows one is that over heating will damage the components The other is that the uneven heating will lead to deformation of PCB Therefore choosing a right temperature curve is the key to BGA rework What s more different PCB has different material thickness and heat dispersion The corresponding BGA also has different sensitivity to temperature To achieve the best rework effect we should set a special curve for each component on PCB To get a more precise temperature curve it is necessary to use a sensor Generally we put the sensor on the center of the BGA pad But it is hard for the sensor to go through the space between balls and reach the center part What s more nobody can ensure that the data is from the balls or the space Another method is to dig a hole at the center of the BGA pad from the back of PCB Extend the sensor into the hole and fix it to the back of the PCB then the sensor can touch the pad and the thermal conductivity can be ensured Nowadays most manufacturers adopt this method 3 Use of flux paste Generally before mounting a new BGA
3. After it is started the high temperature area should not touch any objects or it will lead to a fire or explosion The PCB and other parts should be put on the PCB bracket 3 No vibration Handle it gently 4 Don t touch the heaters with your hands when it is working or you will get hurt 5 Don t use combustible spray liquefied and flammable gas near the rework station after it is started 6 Don t try to re equip the machine or there may be a fire or an electric shock 7 There are high pressure parts in the circuit box Don t disassemble it 8 If some metals fall in the rework station when it is working turn off the power immediately After it is cooled down get the metal out and clean the machine If not there may a smell when the machine starts working next time 9 When the rework station s temperature rises abnormally or smokes turn off the power and inform the service technicians to repair it Turn off the power of the circuit box and the the machine while moving the rework station Hold the plug when we remove the wire or it will lead to a poor contact then the machine can t work very well 10 Turn off the power when stop using it 11 Don t put the rework station on the wires or there may be a failure a fire or an electric shock 12 Before you use the machine you must read the instructions attentively Note when the machine works it will produce some smell So ensure the comfortable healthy and safe operation env
4. the paste should be laid on the pad with a special micro mesh But for those common devices such as PBGA or MBGA the paste can be laid on the pad directly and the soldering can be finished by the melting of soldering balls Of course for CBGA a mesh and soldering paste are necessary because the melting point of soldering balls on CBGA is much higher than common paste such as Sn63 and pb27 4 Removal of residual soldering tin and mounting of BGA Besides the temperature curve the removal of remained soldering tin and mounting of are of great importance in rework Generally people don t realize it But in practice it often leads to failure in BGA rework We usually use copper tin absorption line to remove the residual tin In the rework process the pad is likely to be destroyed by the wrong operation of the technician thus the total process of BGA rework becomes a failure Therefore we should pay more attention Here are 2 tips one is to remove the residual tin within a short time after desoldering BGA Because at that time PCB has not cooled down completely and the temperature difference cause less damage to the pad the other tip is to use some flux when removing the residual soldering tin which can improve the activity of tin Never move the copper tin absorption line under the great pressure of soldering iron The remounting of BGA calls for the fine finish of tin removal Thus it ought to be operated by some experienc
5. DSmall package area 2 Greater functions and more pins Self centerize while PCB puddle welding easy to put on tin reliable 5 Good conductivity and low overall cost Memory which applies BGA can enlarge the memory capacity by 2 to 3 times while the volume of memory remains the same Compared with TSOP BGA is much smaller and better at radiating and conducting electricity 2 Types and Features of BGA a Types According to the encapsulation material BGA can be classified into the following types 1 PBGA Plastic 2 CBGA Ceramic 3 CCBGA Ceramic Column BGA 4 TBGA Tape BGA 5 CSP Chip Scale Package or MBGA b Features Compared with QFP BGA has the following features 1 terminal space is big eg 1 0mm 1 27mm 1 5mm and it can accommodate more I O 2 More reliable package low rate of welding defects and welding spot durable 3 Paraposition of QFP is usually observed with naked eyes When the pin space is smaller than 0 4mm it is hard to paraposition and weld While the pin space of BGA is bigger by applying the paraposition amplification device it is easy to paraposition and weld 4 The welding coplanarity of BGA is better than QFP because solder can make up the flat error between BGA and PCB after melting 5 Good electrical property The pins are small the selfinductance and mutualinductance Em of the conductivity is low and the freguency characteristic is good 6 The t
6. blinks 10 1 STEP window shows the No of the running curve When running on the slopes of the increase the indicator is on When running on the platform indicator 15 on While running on the slope of decline indicator 15 on When the meter is set to constant temperature controller the two display windows PTN and STEP PROFILE RUN these four lights were off OUTI is used to indicate the working state of output 1 It is on when there is output OUT is used to indicate the working state of output 2 It is on when there is output SV lights when the lower screen shows setting value SV is on MV lights when the lower screen shows the output value MV is on TIME lights the lower screen shows the remained time of the operating procedures TIME is on ALI is used to indicate the working state of emergency When the ALI is in the state of alarm the lights lit MAN is used to indicate the state of manual work When working in manually state MAN is on COM is used to indicate the state of communication When the meter sends data COM is on AT 1 used to indicate the PID state When the meter is in the state of PID 15 on OP3 is used to indicate the state of output 3 or used as special indicator in certain model c Button operation The meter have eight buttons in which PTN RUN PROG and SET PROG these three buttons are dedicated to a number of the setting of curve program parameters When the meter is set to curve p
7. one After soldering check the appearance one by one again If there is some problem stop assembling and check the temperature Continue after adjust it well Or the BGA and PCB may be destroyed 6 Clean the surface of the machine regularly especially the infrared heating board Don t leave dirt plot on the board to prevent it from radiating or the soldering may be a failure and the life of infrared heater will be significantly shortened If the infrared heater is destroyed due to this reason our company will not change it for free 7 When we use the optical place system we must turn the self lock heating head and nozzle switch to auto or the heating head and nozzle can not rotate freely Those who are not trained by our company mustn t modify the parameters or disassembly the control box Conclusion In the productive area of electronic products especially the computer and communicative electronics areas the components to miniaturization multifuctionize and greenize Different kinds of packaging technology emerge while BGA CSP is the mainstream To meet the fast increasing demand of BGA circuit assembly the manufacture companies need to choose safer faster and more convenient assembly and rework technology 208 5 Appendix packing list Order Name Specification Unit Note 1 Rework ZM R380C Set electric cabinet Station 3 Install program Software Set 5 Vacuum sucker PCS 6 Hot air n
8. sensor breaks or the input signals exceed the max range the upper screen will show the fault code snb when the sensor short circuits or the input signals is less than the min range the upper screen will show the fault code ur In general the meter works in the state of auto control When the meter shows Snb or ur it shifts to start working very soon outputting powers Then the power can be controlled by button A and V at the same time the MAN lamp flickers Once the problem is solved the meter will return to the state of auto control Order Parameter parameter Adjustment range Note code 1 Measurement Celsius or Fahrenheit unit 2 Prog Curve procedure IdLE Run Hold Stop Start Pause control 3 SP Basic settings SPH SPL 4 TunE PID self setting OFF Stop PID ON Start PID 5 AU First alarming Input signal range value 6 AL2 Second alarming Input signal range value 7 1 First alarming 1 300 C Optional function D value 8 HyS2 Second alarming 1 300 C Optional function D value 9 ProP Heating 1 2000 C proposition area 10 Intt Integral time OFF 1 8000s display when Ctrl is set at ON OFF 11 dEr Differential time OFF 1 999 s No display when Ctrl is set at ON OFF 12 rEle Cooling coefi 0 1 10 0 Display when heating cooling 13 Db Static area 0 1 10 0 Display when heating cooling coefficient 14 He amp Heating period 0 1
9. welding should be no more than 20 of the solder ball s diameter with no single poor welding on the surface if many poor welding may exist the total should be no more than 20 of the solder ball s diameter 2 Desoldering spots No desoldering spots 3 Bridging and short circuit When there is extra solder or the solder is not put on the right place bridging and short circuit may happen So no bridging or short circuit 4 None paraposition The X ray image will show very clearly whether the BGA solder ball is aimed at the welding pad on PCB 5 Broken circuit and cold welding When solder don t touch the relevant pad or the solder doesn t flow very well there will be broken circuit or cold welding It is absolutely not allowed 4 BGA rework process Most of the semiconductor device s heat resistant temperatures are between 240 and 600 Therefore the control of the temperature and uniformity are very important to BGA rework systems BGA rework process as follows a Printed Circuit Board and BGA preheating Printed Circuit Board and BGA s preheating is meant to wipe off the moisture If the moisture was little this step can be omitted b Remove BGA If the BGA will not be reused and the PCB can endure high temperature we can use high temperature shorter heating period to remove it c Clean the pad Pad cleaning is mainly clearing the solder paste and scaling powder remained on the surface of PCB after BGA removal For
10. 240 0 s No display when Ctrl is set at ON OFF 15 cc Cooling period 0 1 249 0 s Display when heating cooling 16 Loc Configuration 0 9999 password f Software configuration code and meaning of function parameters Set the configuration password as 808 the parameter code Loc when the meter shows PV press button PAR and for 3 seconds to enter the menu of software configuration The upper screen shows code ofthe first parameter and then we can modify the parameter value in the state of IdLE After the modification press PAR again then the code and value of the next parameter In the meantime the modified data is saved in the memory If no operation within 16 seconds after display of the last parameter the meter returns to the state of PV After the configuration we should set the password as some other numbers besides 808 to protect the data from unconsciously modification of the operator g Code and meaning of function parameters Order Code Parameter Range of Note adjustment 1 SPH Measuring range 350 of input signals 2 SPL MIN Measuring range 0 of input signals 3 HPL Mazimum output 0 0 100 0 100 4 Snbp Breakdown output 0 0 100 0 0 5 DFS Input error 19 99 99 09 correction 6 C F Measuring unit c Celsius No display when Sn is of F Fahrenheit liner input 7 Sn Output signals J Sensor Sensor e R Sensor stc S Sens
11. AFA BGA Rework Station ZM R380C HUONAO 5 ELI Contents A Company Profile B BGA Rework Station C Installation D Safety Cautions E Introduction of Structure F Operation Steps G PLC Programmable logic Controller H Curve Program Controller Related information J Tips for operation Appendix Packing list A Company Profile Shenzhen Zhuomao Machine Co Ltd is located in one of the most prosperous parts Xixiang with Shenzhen International Airpot to its south and State Hwy 107 as well as Shenzhen Guangzhou Superhighway to its north enjoying convenient transportation It is a science amp technology enterprise which holds research production and sale in one The main products are BGA Rework Station BGA Reball kit BGA FCT Jig and so on Since it is established Shenzhen Zhuomao Machine Co Ltd expands the market with advanced thinking and pioneering philosophy seizes the market with strong technical expertise ensures the high quality of the products with modern scientific management and mature advanced technology and offers our clients the best service with perfect sales network and high quality staff We sincerely hope that our products will bring you more and more profits and wealth B BGA Rework Station 1 Knowledge about BGA BGA is short for Ball Grid Array It is a kind of package method which use organic carrier in IC It has the following features
12. AL Max range of linear 1999 9999 Only when the input signal is linear input input it will display L1n or PrE 20 LOL Min range of linear 1999 9999 input 21 FIL Digital filtering P1 16 syatem 22 Proc linear input P2 progamming check h Program configuration notes Basic parameters Sn Ctrl OP1 OP2 Sn Ctrl OP1 OP2 are the basic four parameters They have great impact on other parameters Therefore we should set these four basic parameters first according to the specific requirements Output parameters OP2 Hct Cct When setting OP1 and OP2 be sure to choose the right output module If the output module is a relay logic level module or SCR zero module then OP1 should be set at Time proportion output If we choose circuit output module the should be set at 4 20mA or 4 20mA output When we choose time proportion output we should set Hc t cc t If we choose SSR solid state relay or SCR zero module the action period can be set at 2s if we choose relay to output the action period should be no less than 20s Regulation parameter ProP In dEr rEL C ProP In dEr rEL C are the four regulation parameters directly affecting control precision Only if the system is heating or cooling rEL C displays In the process of PID self setting the system can only set ProP In and dEr The cooling parameter rEL C should be set by hand If the adjust method is set
13. at positioning adjustment ProP is the difference of positioning adjustment When Pbd is set at C F the unit of ProP is Celsius or Fahrenheit when Phd is set at Pct the unit of ProP is Yo and then the heating area equals ProP multiplied by the heating proportion coefficient PH L The greater the cooling coefficient the greater the cooling output power The cooling output power equals the temperature difference divided by heating proportion then mutiplied by cooling coefficient Control mode parameter Re lt When Rc amp is set at rEu the control mode is reverse acting control It means that as the input signal of the meter increases the adjustment output decreases For example in heating control system when the temperature rises the output heating power should decrease so we choose reverse acting control When amp 15 set at rEu the control mode is positive acting control It means that as the input signal of the meter increases the adjustment output increases For example in heating control system when the temperature rises the output heating power should increase so we choose positive acting control 2 Lower Thermostat a panel introduction model REX CIO Segmental Temperature Controller 2172 1 PV The actual temperature 2 SV setting temperature Switching positions H M S time rannge 1M 99H99M 1S 99M99S 0 01S 99 99S 3 Setting figures increase 4 Setting figures decrease 5 Se
14. can modify the value of manual dynamic output The maximum value of power output is the limit value for the output power code for HPL If we set AUTO HAND switch parameter code for AH at Auto AUTO HAND switch 1s forbidden ll No parameter code Parameter name adjusting range explanation If we set AUTO HAND switch parameter code for AH as Hand AUTO HAND can be switched without interference 3 Adjusting parameters and modifying When the meter is in a state of measurement PV display pressing PAR button for three seconds the meter will enter the state of parameters modifying the upper screen shows the first parameter code the lower screen shows the value of the parameters Then press Aor W button to modify the value of the parameter When finished press the button PAR meters will show next code and the value of the parameters in order Revised data will be saved in the memory of the instrument After showing the last parameter or no operation in 16 seconds the instrument will return to the measured value PV display state 4 Code and meaning of regulation parameter d PID self setting Before the meter starts working the best PID adjust parameters should be set then the control precision can be ensured Theoretically systems on different settings have different ideal PID parameters Therefore before start the PID self setting you should set the SV to the exact parameter that the user needs Whe
15. e interval between them causing short circuit Poor welding should be evaluated objectively it is not so terrible the key point is that the welding spots can still be welded on the pad The ideal situation is no poor sas welding Poor welding may be caused by pollution or the uneven distribution of flux paste What s more warped PCB may also lead to poor welding Open circuit welding spot may exist too The quantity and size of poor welding are the key factors to decide whether it will be accepted Generally the size of single poor welding should be less than 50 of the solder ball s diameter If the ball is surrounded by reflow solder BGA is able to work It is a very critical standard The electrical properties may meet the requirements but the mechanical strength will be affected PCB with BGA must use X ray evaluation systems that can decern holes of less than 100 um diameter The X ray must be able to observe from top down and tilt X rays is a reliable guarantee of successful BGA welding b Proposed inspection criteria The inspection criteria will help X ray inspection system confirm some typical welding problems which is related with the use of BGA device It includes the following factors 1 Poor welding Poor welding results from the expansion of compounds in solder during the heating of BGA BGA with poor welding may cause some problems such as ineffectiveness The inspection criterias are as follows the size of single poor
16. ed at any moment Din reflow soldering process we must choose the right heating temperature and time of different zones at the same time we should notice the heating speed Commonly the maximal heating rate is not more than 6 C s before 100 C and the maximal heating rate is not more than 3 C s after 100 C In the cooling zone the maximal cooling rate is not more than 6 C s because both of the exorbitant heating rate and cooling rate may cause damage to PCB and BGA which sometimes cannot be observed by unaided eyes For different BGA and different solder pastes we should choose different heating temperature and time For example reflux temperature of CBGA should be higher than that of PBGA choose the higher reflux temperature For no clean solder paste its activity is lower than non no clean solder paste so the soldering temperature should not be too high and the soldering time should not be too long so as to prevent the oxidation of solder particle hot air reflow soldering the bottom of PCB board should be heated There are two purposes for this kind of heating First avoid the warping and deformation in one side heated PCB board second shorten the time of the solder paste melting For the dimension pad of BGA rework this kind of heating on the bottom of PCB is especially important There are two ways of heating on the bottom of BGA rework equipment One of them is hot air heating and the other is infrared ray heatin
17. ed technicians 5 Use of nozzle Every hot air heating rework station need a suitable nozzle It is better to use a nozzle which is 2 5mm bigger than the component then the component is entirely 295 2 covered by the nozzle and BGA can be heated evenly hot air nozzle a gt 26 J Tips for operation 1 After turn on the head power switch check whether the upper hot air nozzle gives out cool breeze If not never start the machine or the upper heater may be burnt 2 Set different temperature curves for different BGA The temperature should not be higher than 250 C In lead free soldering it can be set according to the soldering temperature curve of BGA soldering balls 3 When desoldering BGA turn the cooling fan to auto After the temperature curve goes over the buzzer alarms automatically Then remove form PCB quickly with a vacuum suction pen and take PCB away from the positioning bracket 4 When desoldering BGA turn the cooling fan to auto After the temperature curve goes over the buzzer alarms automatically The cooling fan begins to cool BGA and the lower heating area The hot air nozzle gives out cold breeze at the same time The upper main heater arises to 8 10mm from the surface of BGA and pauses for 30 40s Or after the working light is off move the main heater away and take PCB away from the positioning bracket 5 Before soldering BGA check the PCB pad and BGA balls one by
18. ension between solder points produces good self centration effect in solder reflow allowing 5 error of patch precision 7 Compatible with original SMT mount technology and machines The original screen printer machine mounter and solder reflow machine all can be used The comparison between BGA and QFP is shown in Table 1 The main defect of BGA is the necessity of X ray detection after welding c Welding of BGA The success of welding BGA is affected by the assembly of PCB So 3 key factors must be considered in the layout of PCB Features BGA QFP Package size S m 525 1600 Pin space L mm 1 27 0 50 fault rate x10 9 2 0 60 100 1 Thermal management Thermal management must be considered when we design the assembly of PCB If many pieces of BGA gather on a small area of PCB it will cause the imbalance of PCB in the reflow oven If many big pieces of BGA gather on a certain area of PCB longer heating period will damage some of the BGA The areas with fewer components have reached the welding temperature while those areas with BGA are still in low temperature So the welding period is over before the flux paste withdraws from the welding spots thus there may be poor soldering or no melting of welding balls 2 Rabbet The design of rabbet on PCB should stick to relevant standards strictly Any rabbet near BGA welding pad must cover the solder mask very well If not the extra welding paste will flow from the we
19. etting displays under the SP parameter code When the meter is in the state of IdIE the lower screen displays the basic setting 2 Modification of parameters when the curve procedure runs a When the meter runs we can t modify the curve program parameter LC rl L1 dl 12 2 02 But other parameters can be modified and saved b When the meter pauses the modification of LC rl L1 d1 12 L2 d2 is valid only in this running and not saved Other parameters all can the modified and saved c When the meter stops LC rl L1 dl r2 L2 d2 and other parameters can be modified and saved d What to do if there is a power off while the meter is working At this moment the meter will record and save the current parameter and running state Once the power is on the meter will continue the program from this point instead of restart from the beginning e What to do when the curve program is over Then the meter will deal with it according to the settings of P End When P End is set at OFF the meter stops outputting and the programme is OVer The following chart only for reference 29102 se settings nozzle 13 13 r2 42 r3 43 rd d4 3 00 c s 3 00 cfs 4 00 cfs 4 00 settings nozzle 31 x31 235 L4 225 L3 195 L 165 Li d r2 42 r3 r4 d4 3 00 cfs 3 00 ofs 3 00 c s 3 00 cfs big nozzle 12 12 215 1 185 L3 150 L2 100 L1 r2 42 3 45 rd dd 3 00 c s 3 00 c s 3 00 c s 3 00
20. g The advantage of hot air heating is the homogeneous heating which common Rework Techniques suggest to adopt this way of heating What opposite with it is the disadvantage of infrared ray s inhomogeneous heating We should choose the right hot air reflux suction nozzle The hot air reflux nozzle is non contact heating which depend on the high temperature air current make every solder of joint on BGA melt synchronously For that reason it ensures the steady temperature circumstance in the whole of reflux process and it protects the adjacent parts from damaging by the convective hot air s regeneration C Installation 1 Place In order to ensure the validity of BGA Rework Station the installation should meet the following requirements a Away from inflammable and explosives b Away from water and other liquids c Ventilated dry place d Stable and flat free from tremor e Less dust f No heavy objects on the controlling box g Not affected by airflow of air conditioner heater or ventilator h Leave a space of 30cm or more behind the rework station for the upper part to move and rotate 2 Power supply a Use a power supply with little fluctuations in voltage b Fluctuation 220V 10 c Frequency fluctuation 50Hz 3 D Safety Cautions 1 Don t blow to the rework station directly when it is working or there will be a negative difference from the surface of the heating board thus some parts will be burnt out 2
21. hat time AT is on In a working state of PID press SAT button the system will get into setting state form PID state If you want to return to PID state set AT to 1 again then press SET button 5 seconds To protect the parameters from being revised you can set the value of LOK to 01 or 02 then get out H Curve Program Controller 1 Parameter set of curve program 19 E time Start value time Start value measured value measured value Pn0 saved curve program 0 4groups rl the slope of Curve 1 End StEP 0 01 99 9 C min Set the slope at End When the curve program goes to this section it stops Set the slope at StEP when the curve program goes to this section the program skip this section and goes to next flat section L1 the aim of the flat section Range the entire measuring range of input signals limited by SPH and SPL The procedure will skip this section One curve has several slops and flat sections So we should set every parameter correctly according to specific requirements b Adjustment the parameter code is Ctrl When the meter shows PV SV press PAR and for 3s the meter can enter the menu of curve program menu the upper screen display the code of the first parameter and the bottom one display the value of parameter Then we can change the value by fand After the modification press PAR again and the next parameter and its value display At the mean time the modified data ha
22. heating area of BGA Rework Station and solder the balls on the pad 6 Lay on Flux paste Lay the BGA Flux Paste on the BGA pad evenly with a brush no more no less 7 Mounting Mount the BGA on the right place of PCB When we place in by hand we can make use of the silk screen borders We can touch the surface of the pad and the balls to know whether it is placed in the right area 8 Soldering Put PCB with new mounted BGA on the positioning bracket move the hot air nozzle to the right place choose the appropriate hot air reflow nozzle set the right soldering temperature curve and press the START button After the procedure is over turn on the cooling fan to cool down BGA for 30 40 seconds and elevate the upper hot air nozzle to be 8 10mm away from the surface of BGA Or move away the hot air nozzle after the START light is off then remove PCB from the heating area G PLC Programmable Logic Controller 1 Top bottom PLC a Panel introduction Model 410 sectional type temperature controller PAR SET switch AUTO HAND switch number increase RUN Running show mmm ii MAN Man control show NN Communicating show number decrease P AE Group number increase RUN STOP SET STOP 1 Display Select ce mum Output 1 Output 2 N Step number 1 state of profile SV 0 Er b Panel display When we turn on the meter the upper scree
23. ironment please keep the air in circulation E Introduction of Structure NX NN gy A Ww Introduction of host labels 1 Top heater temp control 2 Bottom heater temp control 3 Top breeze adjust 4 Start 5 Running show 6 Stop 7 Cooling AUTO HAND 8 Power 9 Heat box 10 PCB fixer 11 Heater Specification 1 Total power 3 2 KW 2 Top heater 0 8 KW 3 Bottom heater 2 4KW 4 Power supply 220V 10 50Hz 3 5 Dimension 450 X 400 X 580mm 6 Temperature control sensor 7 Positioning V groove for PCB positioning PCB size 280 X 320mm mm 8 Weight 20kg Features 1 Choose imported high precision materials temperature sensor PLC heater to control BGA desoldering amp soldering procedures precisely 2 Top amp bottom temperature areas heat independently And it can set up 8 rising temperature segments and 8 constant temperature segments to control It can save 10 groups of temperature curves at the same time 3 Choose imported high precision thermocouple to detect the top bottom temperature precisely 4 Top amp bottom heating can be controlled independently by the temperature graphs A cross flow fan cools rapidly to protect the PCB from deformation when welding 5 This machine can be connected to a computer to be controlled more conveniently with a built in PC serial port and a proprietary software attached to it 6 After finishing desoldering amp soldering there is an alar
24. lding pad to the rabbet then leads to short circuit between welding pad and rabbets nearby The geometric shape and diameter of welding pad The compactness of pins has immediate impact on the geometric shape and diameter of welding pad Similarly BGA has different sizes shapes and complexity As the package size decreases the geometric shape and diameter of the welding pad calls for higher precision in detection 3 Inspection standards of BGA For BGA assembled on PCB inspection standard is a very important issue Before is applied to the PCB most manufacturers don t use X ray in process of inspection Instead they employ some traditional methods to test PCB such as automatic optical inspection man eye inspection or on line function test However these methods can t detect the invisible problems very exactly such as poor soldering cold welding and bridging The X ray can discover these problems very efficiently At the same time it can do live monitoring guarantee the quality and realize the in time feedback of the process control a Evaluation of X ray When is first used on X ray can evaluate the solder reflow according to the situation of un solder area or areas around it Open circuit non touching and other similar situations show the solder paste has not reflow enough Bridging may result from the fact that the temperature is too high for the solder to liquefy So the solder flows from the pad to th
25. ming The machine is equipped with a vacuum suction pen to facilitate the removing of BGA after desoldering 7 For large thermal capacity of PCB or other high temperature and lead free welding requirements all can be handled easily F Operation Steps 1 Preheating Preheat the BGA and PCB before repairing The temperature in thermostat is usually set at 80 C 100 C time 12 24 hours to remove the moisture in PCB and BGA and prevent burst when heating 2 Desoldering Put PCB on the positioning bracket choose the appropriate hot air reflow nozzle set the right soldering temperature curve and press the START button After the procedure is over move the hot air nozzle away by hand and use the vacuum suction pen to remove BGA 3 Clean the soldering pad There are mainly 2 ways one is use suction line to make it flat the other is use the soldering iron to remove the dregs directly It is better to remove the dregs soon after the desoldering of BGA for the has not cooled down and the damage caused by temperature difference 1 less To use some flux paste when cleaning the pad can increase the solder activity and achieve better cleaning effect Be careful to not to destroy PCB pad Try to use some volatile solvents 4 Reballing Lay the BGA Flux Paste on the BGA pad evenly with a brush Choose corresponding steel net and plant the soldering ball on the BGA pad with a BGA Reball Kit 5 Soldering Put the BGA on the bottom
26. n displays the basic model the lower shows the version of the software for the customized meter the customer should pay special attention to the software version to facilitate future order Three seconds after the upper screen displays measurements PV the lower screen displays settings SV The meter has two rows of LED the upper one is used to display the measurements PV and various codes of parameters the lower one is mainly used to display setting value SV the output value MV or the remained time of running TIME and various parameters When press the DISP SELECT button the lower screen will show the items in the SV MV TIME order When the meter is set as curve process controller ctrl set to prog TIME shows the remaining time of certain period of procedures While the meter 1 set to constant temperature controller TIME shows cent code In some special type of instrument TIME shows the second group measured value or special meaning of input signals On the panel of the meter there are two digital tubes display window PTN and STEP and four indicative lights PROFILE RUN etc These two digital tubes and four indicative lights are used to indicate the operation states of these curves When the meter is set to curve procedures controller ctrl set to prog PTN is the display window of the No of curve procedure By pressing PTN button we can select the curve which needs to run or be modified When the curve is running RUN
27. n the meter stay in the state of auto control set the PID self setting the code is tunE to ON then the PID self setting works and AT lamp is on In the PID self setting process when the self setting is set to OFF the process will stop At the same time the top heater s position is being adjusted so the measured value is not vibrating After 1 5 periods of vibration the PID self setting is completed Then the AT lamp is off The meter can calculate the best PID parameter and save it in the meter according to the vibration period and amplitude If the system can t give vibrate response during the PID self setting the PID self setting can t finish successfully As different systems have different response periods the time of PID self setting ranges from several seconds to several hours The time is affected by the system not the meter Don t change the settings during PID self setting because one change leads to one restart then PID time is prolonged When we use meters with the function of curve procedure control we should stop the curve procedures first set the PID self setting according to the above steps then start the curve procedure control If we only choose PID self setting please set the differential time to OFF so that it is not changed when the meter is in the process of PID self setting In the system that doesn t allow output signals change frequently we should choose PID self setting e Problems display When the input
28. ntrol setting time varies according to different objects PID is over go out P I D parameters which have been set before will be kept in the meter automatically we need to examine P I D parameters after setting we can do it in the second setting area the process of PID keeping the continuity of power is necessary We should minimize interference otherwise restart PID A There may be some differences between two parameters of PID starting in the process of warming and starting on control point Generally we choose the latter 5 On some great interference occasion repeatedly setting may be used to exam the rationality of parameters Then we can define choose and revise Notes a state of setting PV window shows setting character SV window shows current settings we want to get into the second setting area from normal control state press SET button for more than 5 seconds If we want to get out of the second setting area to normal control state there are two ways to choose First press SET button for 5 second or more second press any functional button of the meter at least 30 seconds There are a little bit differences between these two ways the parameters you set or corrected with the first method is inefficient in the second setting area 4 In the second setting state when AT 1 press SET button 5 seconds or more the system will get out of the second state and get into PID state automatically At t
29. on can control strictly and it is conductive to a better amp repeatable temperature curve and the components will not be over heated and the time of higher reflow temperature will not prolong too much The standard reflow consists of 3 temperature areas preheating area insulation area and reflow area After reflow it is the process that PCB cools down to less than 100 C The soldering process is more important in lead free assembly Lead free process calls for temperature as high as 235 C but BGA CSP is sensitive to high temperature Then the wrong temperature rising will burn the components Semi auto reflow retrieval system can save many temperature curves It is important to know 23 the use of temperature curves An precise temperature is the key point in the production which can ensure that all the welding points heat and reach the peak temperature together The starting point of the production parameter is the actual temperature of PCB The technician can adjust the heating area parameter of the machine to achieve the expected temperature curve of PCB through the analysis of material temperature The convection rework station which can save many temperature curves is directed by the approximate situation of PCB heating The more precise method is to connect a K sensor to the PCB to detect the temperature What s more the final form of process control is to detect the welding points in the process or to detect the reflow points Look a
30. or Sensor tke T Sensor red Pt100 platinum resistor cu Pt100 platinum resistor with cu decimal Lin Cu50 copper resistor Lim Cu50 copper resistor with PrE decimal PrE Linear input Linear input with decimal Distant transmission pressure resistance signal Distant transmission pressure resistance signal with decimal 8 Rddr Local address 0 99 9 bRud Communication 600 1200 baud rate 2400 4800 9600 19 2KB 10 Ctrl Regulation On of Switch ON OFF PLd PID rSP Heating speed control Prog Curve procedure control 11 SPH Heating speed 0 01 99 99 When the screen shows C min 12 Opl Main output EP Output of time proportion 0 20 0 20mA output 4 20 4 20mA output 13 OPI Second output FRn Wind cooling cooling olL Oil cooling H20 Water cooling 0 05 Compressor cooling RL02 Second alarming output on Action suction 14 RLOI First alarming LoRL Under When the OP2 is the ALI HdR bottom line second alarming AL02 LdR alarming display on the screen 15 RL02 Second alarming HOO Ove eke big 12 Pout deviation line alarming Under bottom deviation line alarming Within deviation alarming Out of deviation alarming Curve procedure over alarming 16 R H Automatic Manual Auto No auto hand shift Hand Auto allowed hand shift 17 Prt Time unit of curve Nin Min procedures Sec Sec 18 Ret Way of control rEu Positive control Dir Negative control 19 H
31. ozzle PCS 7 Temperature PCS sensor 8 Data access 9 Power cable 10 Instruction ZM R380C copy book 28
32. rocess controller ctrl set to prog PTN is used to set the number of curve program SET PROG is used to set operating parameters RUN PROG is used to start the program When the equipment is set to constant temperature controller RUN PROG SET PROG are not working DISP SELECT is the switch button When we press DISP SELECT button the lower screen shows settings value the output value or the remained time of operation the corresponding indicator SV MV TIME are on AUTO HAND is the automatic manual switch button When switch to manual output MAN is on PAR is parameters setting button means value increase W means value decrease settings modifying When the meter is in a state of display the upper screen shows actual measured value When you use DISP SELECT button to select the setting value of the lower screen SV light is on by pressing A or V you can modify settings The scope of setting value is from the minimum settings code for the SPL to the maximum settings code for the SPH When the equipment is set to curve program controller ctrl set to prog for example in running state settings can not be modified 2 AUTO HAND switch without interference Press the AUTO HAND button then it can realize two way switch without interference When working in manual control the manual control indicator MAN is on When we use DISP SELECT button to select output power value in lower screen MV is on by pressing Aor V you
33. s been saved in the memory If no operation within 16s after display of the last parameter the meter will return to PV SV c The working state of curve procedure working 1 idIE When the meter stops it is used as a thermostatic controller We can set is at SP which will display in the lower screen When the meter finishes the curve control procedure it will go into the stop state idIE 22 RUN When the meter runs it modifies SV according to the set curve to let PV change as the curve program goes on thus control the heating process 3 HOLD When the meter pauses the timer also stops SV remains the same then the time of curve program is prolonged d Display when during curve procedure 20 1 display of RAMP When the meter displays IdIE the RAMP is off When the meter displays RUN the RAMP is on When the meter displays HOLD or Hb the RAMP blinks Note When the CTrl is set at rSP and the curve goes through the slope the RAMP is on 2 display while running When the meter displays RUN Hb or HOLD press PAR The lower screen display the code rl d1 r2 d2 Hb and the code of display code 3 Display of remaining time When the meter is on flat section dlor d2 the value displayed under the parameter code is the remaining time not the total running time 4 display of setting When the meter is in the state of run Hold or Hb the lower screen shows the running setting instead of the basic setting The basic s
34. t the following picture Infrared reflow oven and repair sets are not new to the world However because the physical effect is limited infrared ray has lost some market When the heat radiation distribute evenly objects in different colors absorb and reflect heat radiation unevenly The purchase decision of Array Package Rework Station should start from the reliable technology It is important to control the process ZM R580B is easy to operate and very useful in the soldering of SMD TH and plastic It can make the most profit out of the least investment a Compatibility of components Lead free soldering is more and more popular Eutectic solder ball in still the standard choice in USA Components manufacturers consider the using of lead free balls as the standard b Setting of temperature difference The temperature difference on the surface of components is a must factor to be considered in quality rework and assembly Increment of 10 C can be accepted Temperature difference of component from top to bottom is another important factor c Control of temperature curve To avoid brittle rupture in welding points the temperature should be better controlled especially the heating of PCB bottom Heating board can t change the temperature in a short time so it can t be used in lead free solder process 2 Setting and adjustment of temperature curve Setting of temperature curve is the first and most important step of BGA rework 24
35. that process it must use standard cleaning agent To ensure the reliability of the BGA solders generally we cannot use the remained solder paste in the pad and we must clear away the used solder paste except that solder balls reform on the BGA Because of the small size of BGA especially CSP or uBGA smaller it is always 4 difficult to cleaning the pad so when reworking it needs to use Rinse free Flux if the space around CSP is very small d Lay on BGA Flux Paste Laying solder paste on the PCB has important influence on the result of BGA Rework It is convenient to lay solder paste on the PCB by selecting mould matched with BGA For CSP there are three solder pastes for choice including flux paste clean free and water soluble If we choose the flux paste the reflow time should be longer if choose the clean free solder paste reflux temperature should be lower 1 Mounting The main purpose of mounting to make every BGA solder align to the PCB pad with special equipment 2 Hot air reflow Hot air reflow soldering is the key to the whole BGA Rework The curve of reflow soldering of BGA Rework should be similar with the original soldering one Hot air reflow soldering curve can be divided into four zones including preheat zone heating zone recirculation zone and cooling area These four zones temperature and time parameter can be set respectively when it connects with the computer these programs can be saved and transferr
36. tting shift 6 SET process set Note DH48S showing time is the range of electrical continuing set by using the coding switch of panel b Explanation of the setting characters The following characters will show up one by one by pressing SET button every time According to different functions some characters in the instruments you choose may not exist c About PID 1 Why choose PDI instrument In most occasions when the request of temperature control is stricter we adopt PID process to control Different temperature control target have different best ratio P differential time I and integration time D parameters For traditional PID meters the identification of these parameters mentioned above is operated by experienced process control experts Otherwise it s likely that the entire system is out of control for the mismatch of the parameters which bring trouble to most users To this series of meter after starting the function can simulate experts to conduct a search then make the whole set the best parameters automatically according to control object then get to the best controlling effect 2 Usage of PID Press SET come to the second set area then get into the PID set conditions according to operational processes set AT at 01 Then press SET button for 5 seconds the 18 meter will ezit from set condition At that time AT indicator light blinks At the vicinity of setting point or after three periods of PID co
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