BLE MODULE ISP130301 ISP130301 Bluetooth Low Energy
Contents
1. DISTRIBUTED BY TEXIM EUROPE June 1 2015 Insight SiP BLE MODULE It s all in the package ISP 41 30301 Antenna Keep Out Zone Recommended metal keep out areas for optimal antenna performance no metal no traces and no components on any layer except mechanical LGA pads 18 0 mm min Metal E YY zone to eage of board no metal on any A layer except mechanical LGA pads Gre E F board E E wu GGL6 GS TOP VIEW Page 3 12 Die i Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 41 303071 5 Packaging Markin a R 001 A03467 IC 11306A ISP130301 FCC ID 2AAQS ISP130301 Model ISP130301C YYWW A S P 1 3 0 3 0 1 C Yiyiwiw CITT Prototype Packaging For engineering samples and prototype quantities up to 99 units deliveries are provided in thermoformed trays Trays For higher quantities and volume production ISP130301 are available in Jedec trays They are delivered in sealed pack with desiccant pack and humidity sensors These Jedec trays are also suitable for further baking Please see section2. E i E E Im Sdr Jagtvej 12 DK 2970 H rsholm T 45 88 20 26 30 F 45 88 20 26 39 E nordic texim europe com Zuiderlaan 14 bus 10 B 1731 Zellik T 32 0 2 462 01 00 F 32 0 2 462 01 25 E belgium texim europe com Germany South Martin Kollar Strasse 9 D 81829 M nchen T 49 0 89 436 086 0 F 49 0 89 436 086 19 E germany texim europe com UK amp Ireland ee BR VAIN St Mary s House Church Lane Carlton Le Moorland Lincoln LN5 9HS T 44 0 1522 789 555 F 44 0 845 299 22 26 E uk texim europe com Warwitzstrasse 9 A 5020 Salzburg T 448 0 662 216 026 F 43 0 662 216 026 66 E austria texim europe com General information Bn Gur info texim europe com www texim europe com 2015 version 2 0 TA TKH Group
3. 330mm 15 reel only Please refer to tape size below Complete information is available on request Po Pa 2 0 0 1 I TT 4 040 1 Il fe 0 3040 05 1 55 0 05 gt 1 75 0 1 z g 0 1 R QJ Typical Jo 820 0 1 Bo 11 60 01 Ko 2 50 0 1 OF Pi 12 A Ao Ko F 11 50 0 1 kk Di 24 00 0 3 elle June 1 2015 Page 3 14 Document Ref isp ble Catalog R2 3 docx sh Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party eh without written permission Specification subject to change without notice m 3 DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 30301 6 Storage amp Soldering information Moisture Sensitivity All plastic packages absorb moisture During typical solder reflow operations when SMDs are mounted onto a PCB the entire PCB and device population are exposed to a rapid change in ambient temperature Any absorbed moisture is quickly turned into superheated steam This sudden change in vapor pressure can cause the package to swell If the pressure exerted exceeds the flexural strength of the plastic mold compound then it is possible to crack the package Even if the package does not crack interfacial delamination can
4. The ANT protocol can be handled on request RoHS compliant Eo Eo ADC xB The module is specifically designed for both PC SE peripherals and ultra low power applications such sl as sports and wellness sensors Ultra low power GC x2 2c dh GPIO consumption and advanced power management E enables battery lifetimes up to several years on a 16MHz g coin cell battery Even though its very small size 8x11x1 2mm the module integrates decoupling abt capacitors 16 MHz and 32 kHz crystals load capacitors DC DC converter RF matching circuit Ce and antenna in addition to the wireless SoC Cortex nRF51XXX The module forms a standalone BLE node for which only the addition of a suitable DC power source is necessary for proximity or Out of Range applications Sensor applications require only the further addition of the appropriate sensors As the module has several end applications the antenna was designed to be compatible with several ground plane sizes such as USB dongle or cell phone ojapo June 1 2015 Page 3 1 Document Ref isp_ble_Catalog_R2 3 docx p EN SEK Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com G SI sr The information contained in this document is the property of Insight SiP and should not be disclosed to any third party ae without written permission Specification subject to change without notice DIST
5. and should not be disclosed to any third party f without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SIP BLE MODULE It s all in the package ISP 41 30301 Electrical Schematic Electrical schematic showing ISP130301 module connections antenna Ant1 OUT MOD OUT ANT ke te io PO_14 SWDCLK SWDIO PO_16 PO_15 nRF51822 CEAA 0_06 AIN7 AREF 1 0_00 AREFO 0 01 AIN2 0_03 AIN4 0_04 AINS 0_05 AIN6 P0_02 AIN3 Pl PO_08 PO_09 D s PO_O6 AIN7 AREF1 G8 Sal Pl C9jp VCC_nRF c9 beo Gorn VCC_nRF C12 L5 AVDD E L C7 June 1 2015 Page 3 5 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com s The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 41 303071 2 RF Performances RF Specifications according to standards BT V4 D Parameter Value Std limit Condition Channels Output Power 20 to 4 20 to 10 Dod RF Frequency tolerance Better than 50 Channels 20 Rx sensitivity Level for BER lt 0 1 ideal Tx G a Typical Antenna Return Loss Module mounted on a US
6. occur Since the device package is sensitive to moisture absorption it is recommended to bake the product before assembly The baking process for dry packing is 24 hours at 125 C ISP130301 has been tested MSL 5 according to standards After baking modules can be exposed to ambient room conditions approximately 30 C 60 RH during 48 hours before assembly on the PCB Soldering information Recommendation for ROHS reflow process is according to Jedec J STD 020 and 033 standard profiles T DA l tare 2 Max Ramp Up Rate 3 C s Max Ramp Down Rate 6 C s N Temperature gt Time 25 C to Peak Time lt gt Preheat Soak Peak package body temperature Tp 260 C Temperature Min Tsmin 150 C 0 5 C Temperature Max Tsmax 200 C Classification Temperature Tc 260 C Time ts from Tsmin to Tsmax 60 120 sec Time tp maintained above Tc 5 C 30 sec Ramp up rate Tx to Tp Ramp down rate Tp to TL 6 Cisec max 6 Cisec max max Liquidous temperature TL 217 C Time tL maintained above TL 60 150 sec MSE 27 O Peamlampotaiiie nme OPO beck der Ae C June 1 2015 Page 3 15 Document Ref isp_ble_Catalog_R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com S 3 The information contained in this document is the property of Insight SiP and should not be disclosed to any third party GE without wri
7. 6 for more information on moisture sensitivity Jedec trays are proposed in standard quantities of 100 units 200 units and multiples of 200 units only Please refer to tray sizes and module positioning below Complete information on Jedec trays Is available on request ele June 1 2015 Page 3 13 Document Ref isp_ble_Catalog_R2 3 docx p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party eh without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 303071 322 6 2 54 R 315 0 4 PLACES VACUUM PICKUP CELLS CLOSED CELLS SEE DETAIL D 11 PLACES BUMPS 9 CENTER CELLS 2 SIDE CELLS fo Y 2 PLACES 10 PLACES SEE DETAIL EI SEE SHT 2 gt B 10 45 SEE DETAIL G SEE DETAIL ste SEE DETAIL H SEE DETAIL C CSEE SHT 2 CHAMFER CSEE SHT 2 L6 R 3 0X45 3 PLACES 290 040 25 E0761 SEE DETAIL HP 8XR2 54 MAX EA p Ba T 2 94 SEE DETAIL I 253 3 25 4 34 3 Tape and Reel ISP130301 are also available in Tape amp Reel They are delivered in sealed pack with desiccant pack and humidity sensors Reels are proposed in standard quantities of 500 units 180mm 7 reel or 2000 units
8. B dongle ground plane dB S 1 1 20 21 22 23 24 25 26 27 28 29 3 0 freq GHz June 1 2015 Page 3 6 Document Ref isp_ble_Catalog_R2 3 docx p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fs without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 41 30301 Radiation Pattern in 3 planes Module mounted on a USB dongle ground plane gain dBi 2 45GHz gain dBi 2 45GHz Ground Plane Effect Simulation e yo A USB dongle Cell phone config 1 Cell phone config 1 with ground plane ground plane side ground plane size 18 x 30 mm size 40 x 100 mm size 40 x 100 mm ele June 1 2015 Page 3 7 Document Ref isp_ble_Catalog_R2 3 docx SE p Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com TE AEN sat st The information contained in this document is the property of Insight SiP and should not be disclosed to any third party eh withou
9. DISTRIBUTED BY TEXIM EUROPE d zl AP m F Insight SiP BLE MODULE It s all in the package ISP 41 30301 4 Mechanical Outlines Mechanical Dimensions Dimensional drawing for 8 x 11 x 1 2 mm 57 Pad LGA Package June 1 2015 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com e The information contained in this document is the property of Insight SiP and should not be disclosed to any third party without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 41 30301 SMT Assembly Guidelines Recommended PCB Land Pattern and Solder Mask layout Complete information is available on request gS d 1875 mm T v 3 udis Hu H A Fd P e e e e e ae e SE b ee 0 45 ems 9 9 D P Li H L Jg r na gt b O 5 D eee i N a 4 so Ss amp H Oost a VE H e i i j June 1 2015 Page 3 11 Document Ref isp_ble_Catalog_R2 3 docx p CR Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party fe without written permission Specification subject to change without notice
10. Distributed by Insight SP Gan BLE MODULE It s all in the package xre i S P 4 3 O 3 O 4 ISP130301 Bluetooth Low Energy Module with Integrated Antenna Key Features Applications d Single Mode BLE v4 1 Slave or Master d Space constrained BLE Slave Devices d Based on Nordic Semiconductor nRF51 family d Sport and fitness sensors d 2 4GHz low energy RF Transceiver Health care sensors d 32bit ARM Cortex MO CPU d Out of Range OOR sensors 4 256kB Flash and 16 kB SRAM d Personal User Interface Devices PUID d Analog and Digital peripherals Remote controls d Ultra Low Power Consumption Single 1 8 to 3 6 V supply General Description d Very small size 8 0 x 11 0 x 1 2 mm Temperature 40 to 75 C This module is based on nRF51822 Nordic Fully integrated RF matching and Antenna Semiconductor 2 4GHz wireless System on Chip Integrated 16 MHz and 32 768 kHz Clocks SoC integrating a 2 4 GHz transceiver a 32 bit ARM Cortex MO CPU a flash memory and Certifications analog and digital peripherals It can support BLE e and a range of proprietary 2 4 GHz protocols such Complies with FCC as Gazell from Nordic Semiconductor d Complies with CE e Fully qualified BLE stacks for nRF51822 are So E wc ue implemented in the S100 series of SoftDevices 4 Sg SIG certified which can be freely downloaded 1SP130301 can then be used in Master and Slave modes for BLE and for both ends of other proprietary protocols
11. RIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 303071 Contents eelere e EE Page 3 2 2 Eeer Page 3 6 Sit FOGUCE DEVEIODIMGIL Lee E Page 3 9 4 Mechanical Outlines ccccccccsececseceseeeteneeceeeeeeeeteneeceeeesuceteueesseeesuceteueeseeteueetueeseeetaneensees Page 3 10 Os ACK AGING danacccntentioustchudseatateacencenttamud edcenitinniacedanhecunesiret came hledesd teucamedsehesanidandcusdebeatentsnedaanteke Page 3 13 6 Storage A Soldering Information ccccseeececseeeeeseeeeeeseeeeeeseueeseeeeessaeeeeseeeeeseneeesaeeeesseeeeeas Page 3 15 He UNNI KEE EE Page 3 16 1 Electrical Specifications Electrical Performance The specifications of the module follow those of the nRF51822 The following high level parameters are given for the module The operating temperature range is 40 to 75 C with the following performances Parameter Value Unit Peak current receiver active supply at 2 1V Peak current transmitter active 4 dBm Output Power Peak current l 10 5 mA transmitter active 0 dBm Output Power Current drain connection less state no RAM retention a ye en Current drain between connection events Crystal stability 32 768 kHz 20 ppm E Pin Assignment The module uses an LGA format with a double row of pads on a 0 65 mm pitch The pad layout follows the QFN Jedec standard for 2 row LGA parts Pads 1 thru 56 are signal pins 0 4 x 0 4 mm Pad 57 is
12. an exposed metal pad that is connected to ground The NC pads are 0 8 x 0 8 or 0 4 x 0 4 mm and are to be connected to isolated metal pads on the application PCB for mechanical stability and reliability drop test June 1 2015 Page 3 2 Document Ref isp_ble_Catalog_R2 3 docx E SS Es Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ei s t ja The information contained in this document is the property of Insight SiP and should not be disclosed to any third party WER without written permission Specification subject to change without notice Da OG SCH DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 303071 Pin Name Pin function Description 6 NC Not Connected _ _ Isolated pad on application PCB for mechanical stability 8 ING NotConnected Isolated pad on application PCB for mechanical stability 9 PO17 Digitali O General purpose I O pin S O 24 OUT_MOD Module UC This pin is the RF I O pin of the BLE module It should be connected TI to Pin 26 OUT_ANT for normal operation During certification the pin may be connected via to an RF connector for module measurement using a Bluetooth test setup 26 OUT_ANT Antenna LUC This pin is connected to the internal antenna It should be connected to Pin 24 OUT MOD for normal operation During II certification the pin may be connected to an RF connecto
13. eparately Development Tools and Software The following development tools and software are recommended for using and testing 1SP130301 module Nordic Semiconductor nRFgo Studio downloadable from www nordicsemi com after purchasing ISP130301 DK1 d Nordic Semiconductor Master Control Panel downloadable from www nordicsemi com after purchasing ISP130301 DK1 Keil MDK ARM Lite downloadable from https www keil com demo eval arm htm d Segger J Link Lite downloadable from http www segger com jlink software html d S100 nRF51822 SoftDevice fully qualified Bluetooth low energy stacks for nRF51822 integrated in ISP130301 module The S100 series of SoftDevices object code no source can be downloaded from www nordicsemi com after purchasing ISP130301 DK1 d nRF51 Software Development Kit SDK nRF51 SDK can be downloaded from www nordicsemi com after purchasing ISP130301 DK1 It contains example of source codes applications C language Precompiled HEX files Source code Keil ARM project files IAR project files GCC project files FE June 1 2015 Page 3 9 Document Ref ep bie Catalog _R2 3 docx Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com The information contained in this document is the property of Insight SiP and should not be disclosed to any third party CS without written permission Specification subject to change without notice
14. for compliance could void the user s authority to operate the equipment CANADA User information This intends to inform how to specify the IC ID of our module ISP130301 on the product According to Canadian standards RSS 210 and RSS Gen the host device should have a label which indicates that it contains our module The label should use wording such as Contains IC 11306A ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below IC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Le present appareil est conforme aux CNR d industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible den compromettre le fonctionnement June 1 2015 Page 3 16 Document Ref isp_ble_Catalog_R2 3 docx pass SE e Insight SiP Green Side 400 avenue R
15. od that don t deteriorate reliability ii to minimize any mechanical vibration shock exposure to any static electricity lil not to overstress the product during and after the soldering process The products are not designed for use in any application which requires especially high reliability where malfunction of these products can reasonably be expected to result in personal injury or damage to the third party s life body or property including and not limited to i aircraft equipment ii aerospace equipment ili undersea equipment iv power plant control equipment v medical equipment vi transportation equipment vii traffic signal equipment viii disaster prevention crime prevention equipment June 1 2015 Page 3 17 Document Ref isp_ble_Catalog_R2 3 docx o Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com e The information contained in this document is the property of Insight SiP and should not be disclosed to any third party 3 without written permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE The Netherlands Elektrostraat 17 NL 7483 PG Haaksbergen T 3i 0535733333 F 31 0 53 573 33 30 E nl texim europe com Germany North Bahnhofstrasse 92 D 25451 Quickborn T 449 0 4106 627 07 0 F 49 0 4106 627 07 20 E germany texim europe com Nordic region
16. oumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com H The information contained in this document is the property of Insight SiP and should not be disclosed to any third party LE without written permission Specification subject to change without notice SCH ate DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 303071 Discontinuity Normally a product will continue to be manufactured as long as all of the following are true The manufacturing method is still available There are no replacement products There is demand for it in the market In case of obsolescence Insight SiP will follow Jedec Standard JSD 48 A Product Discontinuation Notice PDN will be sent to all distributors and made available on our website After this the procedure goes as follows Last Order Date will be 6 months after the PDN was published Last Shipment Date will be 6 months after Last Order Date i e 12 months after PDN Disclaimer Insight SiP s products are designed and manufactured for general consumer applications so testing and use of the product shall be conducted at customer s own risk and responsibility Please conduct validation and verification and sufficient reliability evaluation of the products in actual condition of mounting and operating environment before commercial shipment of the equipment Please also pay attention i to apply soldering meth
17. r for antenna measurement VCC_nRF System reset active low Also HW debug and flash nRESET programming I O 40 PO_05 AIN6 Digital I O General purpose UO pin Analog input ADC input 6 June 1 2015 Page 3 3 Document Ref isp_ble_Catalog_R2 3 docx 3 Epi Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com ei Zb ee The information contained in this document is the property of Insight SiP and should not be disclosed to any third party Log without written permission Specification subject to change without notice elt DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 41 30301 Pin Name Pin function Description 41 PO_06 AIN7 Digital I O General purpose I O pin Maree Analog input ADC input 7 Analog input ADC Reference voltage Analog input ADC input 4 Analog input ADC input 5 Analog input ADC input 2 PO 31 Digital I O General purpose I O pin Analog input ADC input 3 AREFO Analog input ADC Reference voltage GND_EP Exposed metal pad Should be connected to ground plane on application PCB ISP130301pad placement and pin assignment for the LGA QFN package TOP VIEW June 1 2015 Page 3 4 Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com tE The information contained in this document is the property of Insight SiP
18. t written permission Specification subject to change without notice Be DISTRIBUTED BY TEXIM EUROPE Insight SIP BLE MODULE It s all in the package ISP 1 303071 Cell phone config 2 with Cell phone config 3 with side ground plane side ground plane size 40 x 100 mm size 40 x 100 mm Cell phone config 1 with side ground plane Return loss dB Cell phone config 1 ground plane Cell phone config 2 with side ground plane Cell phone config 3 with side ground plane USB dongle ground plane es Tel June 1 2015 Page 3 8 Document Ref isp_ble_Catalog_R2 3 docx p Ee a Insight SiP Green Side 400 avenue Roumanille BP 309 06906 Sophia Antipolis Cedex France www insightsip com te d Es The information contained in this document is the property of Insight SiP and should not be disclosed to any third party eh Tau without written permission Specification subject to change without notice GE DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 30301 3 Product Development Tools Interface ISP130301 integrates a full microprocessor interface with up to 32 General Purpose I O pins GPIO and several functions 2 x SPI 2 x 12C UART 8 x ADC SWDIO interface Hardware The following development kit is recommended for using and testing ISP130301 module Insight SiP Development Kit ISP130301 DK1 need to be purchased s
19. tten permission Specification subject to change without notice DISTRIBUTED BY TEXIM EUROPE Insight SiP BLE MODULE It s all in the package ISP 1 303071 7 Quality amp User information Certifications FCC Identifier 2AAQS ISP130301 Certificate N 142180643 AA 00 CE Complies with 1999 5 EC EN300328 V1 8 1 Statement N 142140199 AA 00 IC Certification N 11306A ISP130301 Telefication N 142170180 AA 00 TELEC certification N 001 A03467 Bluetooth SIG certified N D024444 ROHS compliant USA User information This intends to inform how to specify the FCC ID of our module ISP130301 on the product Based on the Public Notice from FCC the host device should have a label which indicates that it contains our module The label should use wording such as Contains FCC ID 2AAQS ISP130301 Any similar wording that expresses the same meaning may be used The label of the host device should also include the below FCC Statement When it is not possible this information should be included in the User Manual of the host device This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 This device may not cause harmful interference 2 This device must accept any interference received including interference that may cause undesired operation Caution Any Changes or modifications not expressly approved by the party responsible
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