AE Series Convection Reflow Ovens
Contents
1.2. Width 300mm Height 880 20mm Moving direction left right left right can be ordered Pass through time 3 5 5 5 minutes Speed 200 800mm Heating zones 1 Top preheat zone digital control 2Kw 4 Bottom preheat zone digital control IKw 2 Top drying zone digital control IKw 3 Top reflow zone digital control 2Kw 5 Bottom reflow zone digital control 1Kw e Default setting Solder Paste Glue 1 Top preheat zone 200 15 C 210 5 C 2 Top drying zone 195 10 C 150 5 C 3 Top reflow zone 235 15 C 150 5 C 4 Bottom preheat zone 200 15 C 150 5 C 5 Bottom reflow zone 200 10 C 200 5 C 4 AE F830 e This is floor model IR and hot air convection reflow oven with eight heating zones tow preheating zones top bottom two drying zones top and bottom and four reflow zones top and bottom e Dimensions Outside 2700 L x612 W x1220 H mm Heating chamber length 1300mm Weight 200Kg Max power warm up 8Kw Regular working power 3Kw Power supply 3 phase 220V 50 60Hz 35A e Conveyor Width 300mm Height 880 t20mm Moving direction left right left right can be ordered Pass through time 3 5 5 5 minutes Speed 200 800mm Heating zones 1 Top preheat zone digital control 2Kw 5 Bottom preheat zone digital control 1Kw 2 Top drying zone digital control IKw 3 Top drying zone digital control IKw 4 Top reflow zone digital control 2Kw 6 Bottom reflow zone digital control 1Kw 7 Bottom reflow zone digi
3. AE Series Convection Reflow Ovens User s Manual Madell Technology Corporation http www madelltech com Copyright 2005 1 Introduction AE series reflow ovens include bench top infrared convection ovens full scaled floor models and lead free models They are either controlled by the integrated microcontrollers or computers Multiple heating zones from 3 and up are available on different models Customer modifications are accepted The AE series reflow ovens can be used on all SMT components SMT resistors capacitors LED PLCC SOP QFP CSP and BGA SMT diodes and transistors SMT inductors crystals connectors transformers and others 2 Installation 1 Installation Site e Indoor e Avoid high temperature and moisture e Keep away from high energy magnetic field sources e Do not let the reflow oven s air inlet and outlet directly face other fans or an open window 2 Safety e Donotlet items other than the circuit boards get into the oven e Beextremely careful about the high temperature to prevent human injury e Do not open the oven while it is operating or is still hot e Maintenance should be performed when the oven has cooled down enough and power cable is unplugged 3 Working Environment e Room temperature 5 40 C e Humidity 20 95 e Transportation 25 55 C It can sustain up to 65 C in transportation for less than 24 hours 4 Power Supply 220V 3 phase good ground connection Power supply installation
4. Paste not reflow Solder balls Flux carbonized Parts shift Possible Reasons Remedies I Temperature low a Reduce belt speed or raise temperature 2 PCB is shaded large parts a Increase bottom heating temperature 3 Copper ground layer a Increase heating zones a Reduce the top and bottom zone Overheat temperature difference b Increase belt speed a Increase belt speed b decrease preheat temperature a Decrease belt speed 1 Preheat temperature too high a Reduce top preheat temperature or add 1 Temperature too high 2 Temperature rises too fast 2 Solder paste too thin or stencil bottom heating too thick a check paste replace stencil a Reduce belt speed and drying zone temperature a Improve paste printing a Use new paste a Keep working area humidity low a Use less paste I Temperature too high aI speed b Decrease preheat temperature 1 Parts not placed correctly a Check placing accuracy 2 Paste not even on pads a Check paste shape and thickness 3 Drying too fast a reduce belt speed and drying temperature 1 Drying too fast 2 Bad paste printing 3 Old paste 4 Moisture in paste 5 Too much paste Solder bridge 1 Paste not printed on the right place 2 Paste not good 3 Temperature rises too fast 1 Paste too thin working area temperature too high 2 Bad paste 1 Temperature rises too fast 2 Bad components 3 Bad paste 1 Not enough paste 2 Paste not even 3 Dir
5. Moisture evaporates at this time Reflow zones Solder paste melts and reflows in these zones under hot air or IR heating The top reflow zone temperature should be set higher than the bottom reflow zone 8 Reflow Oven Settings 1 Start the oven with the default settings 2 Warm up the oven for 20 30 minutes 3 Run some testing PCB boards If the boards do not reflow go to step 4 If the temperature is too high reduce zone temperatures or increase conveyor moving speed Run the testing boards again until satisfactory results achieved 4 If no reflow occurs e Reduce the conveyor speed 5 10 For example reduce the conveyor speed from 500mm min to 460mm min e Or raise zones temperatures gradually at 5 C every time Do not exceed the PCB and components specified temperatures 5 Run the PCB s under the new conveyor speed or zone temperatures Repeat step 4 and 5 until a satisfactory profile is achieved 6 Keep in mind that the PCB temperature will be reduced if the conveyor speed is increased and the opposite is true if the speed is decreased 7 The zone temperatures should be adjusted from low to high during profile setting 8 Most circuit boards can go through the reflow oven a second time during profile adjustments Components will not get damaged in most situations 9 Start the Reflow Oven 1 Turn the oven power switch on press the green button 2 Turn the conveyor switch from STOP to RUN Check the heating
6. should be performed by a certified electrician 5 Height and Level Adjustment The oven height can be adjusted by the four legs under each oven Please note the oven level should be checked and maintained every time the height is adjusted 6 Notices e The oven should be installed in a very clean site for high quality PCB boards assembling e Do not use or store the oven in an outside site at high temperature or humidity e Do not install the oven in an area with strong electronic or magnetic interferences e Unplug the power cable every time the oven is under maintenance e The oven should be checked thoroughly every time it is moved Make sure the conveyor or screen chain does not fall off is not blocked and no foreign objects inside the oven chamber e The oven should be kept at a perfect horizontal level Otherwise the PCB boards may shift e The oven is at high temperature while it is running Do not touch the heating areas e Make sure the conveyor is on the tension roller all the time 3 Features of AE Reflow Ovens 1 High Heat Efficiency e Optimized heating chambers e Hot air circulation e Multi layers of insulation 2 Compact Design e AF R330 14000 L x612 DU lt 650 H mm e AE RF430 2000 LO x612 DO x12200 HE mm e AE RF530 2000 LO x612 DO x12200 HE mm e AE RF630 2500 LO x612 DO x12200 HE mm e AE RF830 5200 LO x1200 DE x14700 HE mm 3 Long Life Heating zones are made of stai
7. through the oven a second time Use only top heating at this time Since the solvent in the paste on the first side has evaporated and the solder melt point 260 C is higher than the paste melt temperature 183 C components on the first side will not fall off Circuits with glue on one side can be processed similarly while low temperatures need to be used to reflow the glue side To make sure the circuit boards are flat on the belt it may be necessary to use PCB fixtures to support them for double side boards 12 Heating Zone Settings for Some Models 1 AE R330 This is a table top IR convection reflow oven with three top heating zones one preheating zone one drying zone and one reflow zone Dimensions Outside 1400 L x612 W x650 H mm Heating chamber length 860mm Weight 50Kg Max power warm up 5Kw Regular working power 1 8Kw Power supply 2 phase or 3 phase 220V 50 60Hz 11A Conveyor Width 300mm Height 420 20mm Moving direction left right left right can be ordered Pass through time 4 5 minutes Speed relative dial mark 0 10 Actual moving speed 200 800mm Usable speed marks 0 5 3 Heating zones 1 Preheat zone digital control 1 0Kw 2 Drying zone digital control 2 0Kw 3 Reflow zone digital control 2 0Kw e Default setting Solder Paste Glue 1 Preheat zone 210 15 C 200 5 C 2 Drying zone 200 10 C 150 5 C 3 Reflow zone 235 15 C 150 5 C 2 AE RF430 This is a floor model IR and hot
8. It should be able to be pressed downward without too much effort Appendix 1 About Solder Paste Solder paste contains lead and other chemical elements which are poisonous Do not touch the solder paste directly Reflow oven exhaust should be properly conducted to outside Prevent direct skin contact with solder paste Please refer to solder paste manufacturer s directions Cautions e Ifsolder paste is accidentally fall on skin or cloth clean it as soon as possible with alcohol e Wear protection glasses and gloves e Wash hands after work e Clean solder paste residues on the working table and tools It is difficult to clean once it is dry e Do not use solvents other than special solder thinner Storage and use e Solder paste should be stored inside the refrigerator at 0 to 10 C Also the solder paste container should be kept in horizontal position Otherwise solder and flux may separate e The solder paste can only be used after 1 to 2 hours till it reaches the room temperature after it is outside of the refrigerator Clean the condensed water drops outside the container to prevent it gets into the paste e Open the container and stir the solder paste with a tool for 20 to 30 times Smear certain amount of paste on the stencil press and move it with a squeegee for a few times to increase its softness The container should be closed as soon as possible e Do not let anything get into the solder e The top layer will be har
9. adjust the zone temperatures or conveyor speed until they match It is recommended to adjust the temperature 5 C at a time 8 Please note at the beginning of the production when PCB boards just start to get into the oven the oven temperature will change a little bit It will take about 5 to 10 minutes for the oven to get stabilized 9 The PCB boards should be placed on the conveyor in regular intervals 10 Stop the Reflow Oven 1 Normal stop 1 Make sure there is no remain circuit boards inside the oven 2 Turn off all the zone temperature switches 3 Let the conveyor run for 10 15 minutes to cool down 4 Turn off the conveyor switch 5 Turn off the hot and cool air switches if equipped 6 Turn off the oven power switch 2 Emergency stop Press the red EMERGENCY STOP button This will cut off the power supply to the conveyor and heating zones Turn off the oven power switch if needed Please do not use the emergency stop in normal situations It may reduce the life of the power supply relays inside the oven 11 Considerations for Double Side Boards Double side circuit boards have components on both sides Both the IR and hot air reflow ovens can be used for double side boards Here are the general procedures to work with double side boards e First finish one side as described in previous sections both top and bottom heating can be used e Place the circuit board one side finished on the conveyor upside down and let it go
10. air convection reflow oven with four heating zones one top preheating zone two drying zones top and bottom and one top reflow zone IR heating is used in preheat and reflow zones while hot air is used in the drying zones Dimensions Outside 2000 L x612 W x1220 H mm Heating chamber length 1000mm Weight 150Kg Max power warm up 6Kw Regular working power 2 2Kw Power supply 3 phase 220V 50 60Hz 15A Conveyor Width 300mm Height 8804 20mm Moving direction left right left right can be ordered Pass through time 3 5 minutes Speed 200 800mm Heating zones 1 Top preheat zone digital control 2Kw 2 Top drying zone digital control IKw 3 Top reflow zone digital control IKw 4 Bottom drying zone digital control 2Kw e Default setting Solder Paste Glue 1 Top preheat zone 190 15 C 170 5 C 2 Top drying zone 180 10 C 160 5 C 3 Top reflow zone 235 15 C 160 5 C 4 Bottom preheat zone 180 15 C 160 5 C 3 AE F530 C AE F530 d This is a computer controlled floor model IR and hot air convection reflow oven with five heating zones two preheating zones top bottom one drying zone top and two reflow zones top bottom Preheating and reflow zones use hot air while the drying zone uses hot air Dimensions Outside 2000 L x612 W x1220 H mm Heating chamber length 1000mm Weight 180Kg Max power warm up 7Kw Regular working power 2 5Kw Power supply 3 phase 220V 50 60Hz 25A Conveyor
11. d if the solder paste has been in storage for a long time This layer is not usable and should be taken out Also the remain solder should be tested to decide it is still good for production e Do not put left over solder paste into the original container It may be kept in a different container and should be tested before it is used next time Thinning of the solder paste e Thinner solvent can be used to reduce the thickness of the solder paste Please consult solder paste manufacturers for this issue It is impossible to increase its thickness Also too much thinner may degrade solder paste quality e An automatic solder paste mixer may be used to reduce the thickness of solder paste Mixing time should be kept at 5 to 10 minutes Solder paste temperature will rise to cause degradation if mixed to long Environment e Temperature and humidity both affect the solder paste Best working temperature is at 23 C to 25 C 6 humidity To high temperature will reduce the stickiness of the solder paste while too low will make the solder paste hard and difficult to print Solder paste may absorb water particles and cause solder balls and residues at high room temperature and humidity e Solder solvent will evaporator if exposed under moving air Do not blow it directly with fan or air conditioner e Solder paste should be reflowed within 4 hours Solder solvent will evaporator and cause bad connections solder balls etc Expiration date So
12. ensity on the board sizes and shapes of solder areas solder paste specifications and print thickness on the circuit board The convection reflow ovens achieve the desired profile with heating zones and moving conveyor The solder paste on the PCB goes through the stages of preheat drying melting and reflowing in the convection reflow oven chamber The first heating zone preheat raises the PCB temperature rapidly the second heating zone maintains the PCB temperature and raises it slowly at the same time Moisture inside the solder evaporates at this stage the third stage causes the solder to melt and reflow solder cools down rapidly after the reflow stage This completes a reflow process Top heating zones are commonly used in reflow ovens The reflow time can be reduced by setting a higher temperature if the components are exposed directly under IR heat from top Heating time needs to be set longer if components are not directly under IR light Top mounted hot air heating zones can achieve more stable and evenly distributed heating effects on the circuit boards than mounted on other directions The conveyor moving speed is another key factor in profile design It controls how long the circuit boards go through the reflow process Also the more the PCB layers the longer or slower of the moving speed it takes to finish a reflow process Some reflow ovens are equipped with bottom heating zones Top or bottom heating zones can be used selectivel
13. lder paste normally expires in 3 months if it is stored in refrigerator It should be thrown away after 6 months Appendix 2 Stencil Printing e Solder paste can be printed on the circuit board directly with a stencil printer e Printing speed is very importing Too fast will cause skipping and missing Too slow will cause uneven paste or running away from circuit pads Generally speaking the squeegee should be moved at a speed of 10 25mm S Increase the speed if the circuit board does not have fine component pads decrease the speed if the stencil is thick or the paste is sticky Also BGA pads do not be covered completely by paste e Steel squeegee is recommended for fine pitch circuit boards and nylon squeegee is recommended for large pads e Recommended pressure on the squeegee is 0 03 0 05KG mm It should be adjusted according to circuit boards stencil thickness and solder paste thickness Appendix 3 Zone Temperature Controller Microcontroller based zone temperature controllers are used on some reflow ovens if not equipped with a computer like the AE R330 These controllers are standard modules The following is the front panel of the controllers Please note only limited keys are used for the oven operators These are SET A V lt Indicators relative to the reflow oven operation are PV and SV Other keys and LED s are used for factory programming and diagnostics Pv 8 8 8 8 sv 8 8 8 8 HHHH ee Temperature controlle
14. nless steel sustain high temperature and not rust 4 Digital Control Digital display and control of both the heating temperatures and conveyor speed 5 Simple Profiling Every heating zone can be adjusted independently 6 Hot air circulates within each heating zone 7 Smooth conveyor movement 4 AE Reflow Oven Heating Model 1 Heating Model The AE series reflow ovens combine hot air with infrared to achieve even heat distribution Hot air heating has the following advantages e No shadow areas or dead corners Heat energy is transferred directly onto solder paste and pads Prevent overheat of components Even heat distribution on components Even heat distribution on circuit boards Accommodate different PCB s including flex ones Infra red heating has the following advantages e Infra red waveform heats the chamber air directly reduces heat circulation volume e Reduce oxidization of the solder paste e Reduce the oven power consumption e Short warm up time e Infrared waveform keeps the heating chamber cleaning 2 Heating Zones 4 2 Number of heating zones on different models Model Zones Top Bottom Power AE R330 3 3 0 Skw AE RF430 4 3 1 6kw AE RF530 3 3 2 7kw AE RF630 6 4 2 8kw AE F440B 8 4 4 15kw AE F440C 8 4 4 18 5kw AE F540C 10 5 5 22kw AE F640C 12 6 6 25kw AE F740C 14 7 7 28kw AE F840C 16 8 8 32kw 4 2 2 Temperature sensors Ever
15. option Weight 300kg 1300kg 1900kg 2000kg 2200kg Dimension mm 2000X 1210x 147 400x 1210x 140 4340x 1410x 1470 4665x 1410X 1470 5315X 1410x 147 OPTIONS options can only be installed in factory Nitrogen system Low nitrogen consumption 20 30M7 h when the oxygen concentration is GS 800 N controlled within 400 1000ppm Inner circulation cooling Non filter design longer intervals between chamber cleaning system flux recycle system Dual rail conveyors system Two different PCB s can be processed at the same time Conveyors widths can be adjusted independently Retractable Central Support of multiple panels while temperatures of heating zones and PCB s not Support RCS affected The following models are also available AE 6600 LF N2 6 6 lead free hot air nitrogen reflow oven AE 7700 LF N2 7 7 lead free hot air nitrogen reflow oven AE 8800 LF N2 8 8 lead free hot air nitrogen reflow oven 13 Trouble Shooting Reflow Oven and Circuit Boards 1 Reflow oven problems Problem 1 check power supply 2 check fuse Reflow oven does not start ii 1 check SSR connection replace SSR i 2 Heating tube bad connection C dico 1 check if the belt is on the pullies pua eo 2 check if the motor is bad E i 1 check for bad fan connection EE 2 check for bad fan Overheat 1 bad fan 2 temperature controller module bad 3 SSR bad 2 Circuit board reflow problems Problems
16. r panel Press the SET key to get into programming mode One LED will blink in the SV window Use the A or V key to change it Use the lt key to move to the next digit No LABEL Description 1 PV Measured value 2 SV Set value 3 OUTI Output 1 LED 4 OUT2 Output 2 LED 5 AT PID on LED 6 ALI Warning 1 LED 7 AL2 Warning 2 LED 8 AL3 Warning 3 LED 9 A Increment 10 ad Decrement 11 lt Shift 12 SET Set 13 PRO Program on 14 MAN Auto manual indicator 15 LED Output power indicator BAR 16 AIM Auto manual selection Appendix 4 Computer Interface for models equipped with a computer Control panels AX Control Panet v8 D6 5er 18 Ee Qpetate Help lis e 8 8 d a v E E On Of Blower Corveyor Heat Hood Open Save Log TempSe Profile Overtemg Reset 02 04 29 Speed mimin sv BER 3 Be Domain Heb A Wa e da e a HH ge 00 8 e A On Of Blower Conveyor Heat Hood Open Log TempSe Profile Overtemp Reset Exit 02 04 29 Zones set up N 8 DH Tn Illi E N D Illi iili Control Panel v8 06 5cr 3 e Droge Hep E aa e v a Hs v A Blower Conveyor Heat Hood Open Log Bo Bk Overtemg Reset Exit D2 10 56 lt N UNET pe MON weo THU FRI sw Time1 Time2 Time3 Speed mimin ow HMH
17. tal control 1Kw 7 Bottom reflow zone digital control 2Kw e Default setting Solder Paste Glue 1 Top preheat zone 190 15 C 210 5 C 2 Top drying zone 180 10 C 150 5 C 3 Top drying zone 190 15 C 150 5 C 4 Top reflow zone 240 15 C 150 5 C 5 Bottom preheat zone 190 10 C 200 5 C 6 Bottom reflow zone 180 15 C 150 5 C 7 Bottom reflow zone 180 10 C 150 5 C 8 Bottom reflow zone 240 10 C 150 5 C 5 Additional Models MODEL AE 3300C AE 6600 AE 7700 AE 8800 AE 1010 Heating Top 3 Top 6 Top 7 Top 8 Top 10 Heating zones Bottom 3 Bottom 6 Bottom 7 Botton d Bottom 10 Heating Length 1200mm 2140mm 2390mm 2715mm 3365mm Cooling zones 1 2 Conveyor Max width of PCB 300mm 460mm Rail adjustment range 50 260mm 50 460mm Conveyor speed 0 2000mm min Conveyor direction L gt R R L option Rail mount front or rear Mesh height 900 20mm Conveyor type Chain mesh Power Power supply 3 phase 380V 100A 50 60Hz or 3 phase 220V 120A 50 60H Start up power 8KW 28KW 34KW 44KW 60KW Regular operation power Approx 3KW Approx 8KW Approx9KW Approx 12W Approx 15W Warm up time 20min Temperature range Room temperature 400 C Temperature control mode Closed loop PID SSR solid state relay drive Temperature control precision 1 C Temperature distribution ecc Alarm Multi alarms PCB fall down alarm
18. ty part a Check stencil position clean stencil and adjust printing pressure a Replace solder paste a Adjust profile a Adjust profile increase belt speed control working area temperature and moisture a Replace paste Adjust profile a Check circuit parts a Replace paste a Adjust stencil printing a Make sure paste is even a Check parts PCB overheat 1 Temperature increases too fast a Reduce belt speed and temperature 14 Basic Maintenance e Before turning the oven on make sure the power supply is within the correct range and stable also check if the settings are the same as the last time it is used The belt should not be stopped when it is still hot Otherwise its life will be reduced Check if there are items inside the heating chamber e Lubricate the belt at least once in two months with high temperature lubrication oil e Adjust the belt pressure whenever necessary e Keep the belt clean and parallel e Lubricate the belt motor with high temperature lubrication regularly at least twice a week if used everyday e Keep the fan clean e Make sure there is good ground connection Cautions during maintenance e When the oven is stopped with the emergency button the power is still on Unplug the power before working on the oven e The convey belt can be replaced easily by first finding the connection points The belt should be adjusted properly after replacement It should not be too loose or too tight
19. y heating zone has its own temperature sensor It is calibrated in the factory and should not be modified 4 2 3 Temperature controller Every heating zone has its own temperature controller It is a standard PID controller with fuzzy logic function and large driving power SSR solid state relay 5 Temperature Profile The reflow oven should achieve a temperature profile as shown below Suggested Temperature Profile Temp CO 250 210 C 230 C 200 150 120 C 150 C 100 Curve A for regular solder paste This profile will raise the PCB temperature to 120 150 C within 60 seconds temperature rising rate is lt 3 C S From 160S to 180S the PCB temperature rises slowly to 183 C the solder paste melting point This ensures the solder paste has an even heat distribution PCB temperature rises to 210 230 C and stays at that temperature for about 30 seconds for the solder paste to reflow Curve B for fine pitch IC s and other small components like 1005 PCB temperature rises slower than curve A This delays the melting time of the solder and prevents components shifting Curve C This curve is used for glues It is very important to design a proper profile for satisfactory PCB assembling 6 Profile Design Profile design includes selecting the proper zone temperatures and conveyor moving speed The following factors need to be considered when selecting a profile PCB material and thickness SMT components and d
20. y on these ovens Bottom heating is preferred if the circuit board has components which could be easily damaged by high temperature The PCB board absorbs heat evenly from the bottom side This reduces heat absorption by those heat sensitive components Top and bottom heating zones can also be used at the same time to achieve more even heat distribution and to dry the solder paste slower than only from the top side Top temperature can be set higher than the bottom temperature As an example the profile of a 4 stages 8 heating zones reflow oven can be set based on the following configuration Zone 1 top preheat zone Zone 2 top 1 drying zone Zone 3 top 2 drying zone Zone 4 top reflow zone Zone 5 bottom preheat zone Zone 6 bottom lower 1 drying zone Zone 7 bottom 2 drying zone Zone 8 bottom reflow zone If on a 4 stages 4 heating zones reflow oven all top mounted these functions can be divided into Zone 1 top heating zone Zone 2 top 1 drying zone Zone 3 top 2 drying zone Zone 4 top reflow zone 7 Heating Zones Preheat zones These zones raise the solder temperature rapidly prepare the solder for the drying zones It is necessary to keep the heating up rate under 3 C S Otherwise some heat sensitive components may be damaged Drying zones Solder temperature rises slowly in these zones Solder paste goes thorough chemical and physical changes under high temperature and prepares for the reflow zones
21. zone temperature settings and make sure they are the desired values 3 Turn on the hot air and cool air switches if they are equipped with the oven Turn the air volume gradually from low to high Do not use hot air or use low hot air when the circuit board is small or very thin Use IR only 4 Turn on the zone temperature switches press the SET key first and use the A or V keys to change the zone temperatures and press the SET to accept the change 5 After the oven is turned on for 20 30 minutes check if the actual zone temperatures match the set temperatures and if they are stable If the temperatures are not stable increase the temperature gate time as follows Press and hold the SET key for 10 seconds until the LED blinks release it and press again the ATU menu shows up Change it from 0000 to 0001 Press and hold the SET key again until the LED stops blinking Wait for 5 to 10 minutes and check the zone temperatures again 6 It may be necessary to check the oven performance and make sure they match the designed profile by using a profiling device A simple way to do this is to use a thermometer like our QK191 Tape the temperature probe on a sample circuit board and let it go through the reflow oven while recording the temperature changes at different time points AE series ovens equipped with computers have built in profiling software 7 The oven can be used for production if the actual profile matches the designed one Otherwise
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