Eon-LT™ Controller Manual 3.0.11
Contents
1. Festart and select a comeet COM port appears Layer completes Thickness is etto 0 M__ Enter a value other than immedatey the ayer forth ayer Mt program sta a Wrong Fimware notification appears ayon though the firmware is Noise in ina R5232 ina Make sure ine RS232 lineis connected and secure Separate the E232 ne and any high current power ines Crys warnings aiio appear Sensor Ners abled Go to Setings screen and enabie Sensor Alert for sensors in use Specifications 13 Device Parameters IIT Coating 0 10 1 06 009 gemi CIELI EDIDIT ET ETE DITTO CTTO 0 100 0 Pa CE CT goto 100 0 Pa TY IT Chapt Sonet E Measurement CE TOK o Tx per second Ir Process Display je Bang Depot LET 00010 aa SKAT 0016 00 000 Ha PETITES mani soo Td Communications pd 2 p Inputs and Outputs ET IT E Type K Comers Phoenix Eon LT System A H i Phoenix Eon LT System Configuration Rendering states asi connections of PhosnixEan LT system event Phoen beni Bytom Quick Info i Screen Selection Tool Bar The Screen Selection Tool Bar the collection of butions used to access the various Screens in which the user wil be working The buttons consist of Status Graph Program Settings Adding a process 1 Press the Program button to enter the programming screen Press the New2. Settings foreach sensor are identical WARNING Fang 1 zero a sensor before each layer er PID can produce flawed data Selecting Before Layer or Before PID wil ensure aly zeroing Before Log Pressing Log button zeros the sensor Start Pressed Pressing Start button zeros the sensor Before Layer Starting a new layer zeros the sensor Before PID Starting PID zeros the sensor Auto Abort on Max Power The Auto Abort on Max Power feature provides the user with the opton of aborting a process ifthe Max Power percentage specificed in the Program settings i reached and sustained for a periodi that exceeds the time set i the Abort Delay Time contral KI ul Rate MaxiMin Auto Abort During a process unexpected occurences crystal sata faled crystal can cause sudden spikes or dips in deposition rates n such instances undesieable resus may occur To prevent this from occuring Eon has the bill to abort the process when rate uchustions devel Ihe curent rate of the deposition goes above the maximum threshold or below the minimum threshold for anger than tne specie delay times the Process wil automatically bort so that if your preset rate is 25 As your Max Threshold rate is 6 As and your Min Threshold rate 1s 4 Als hon the pr abo at above 31 A s or at below 21 As mmm ErabeMer Mar Taha Desg Tan nn ka SE en nato bin Min Tro AI Dwy Te ka Eom Manual Mode Manual Control Manual Mode is an altemative operating env
3. bution located beneath the Process List Enter the desired name for he process Select the process type Sequential or Codeposiion Cix OK This process is now selectable through the Proses List or the Remote Process Control panel on the Green Status bar Note in order for the program to update the source power the user must entar a new valu and then cick away fram the Source Power indicator Renaming a process 1 Press the Program button on the Screen Selection tool bar 2 Double click the procoss you wish to rename 3 In the new window enter the new name for the process Field must not be left blank Name must not already exist 4 Ciek OK Deleting a Process 1 Press the Program button in tha horizontal oo bar 2 On the Process List select the Process to be delete 3 Press the delete kay rec beneath he Process List Edit the namelratelthickness of a process 1 lick the Program button to enter the Program screen 2 Cick he process that has the layer to adit 3 Double cick he layer to be ediad 4 Modify the name rata andor thickness 5 Click OK to save changes Adding a layer to a process 1 Pres the Program button to access the Program screen 2 Select he process from the process list This wil open the Process Layers ist 2 Press the New buton under the Process Layers st 4 Enter a new name to create a new layer or select a layer that has already baen created by clicking the arrow on right of tne Na
4. predeposiion processes as the user has taken ful contro over the source Chapt Marssi ose Vertical Tool Bar Using the Vertical Tool Bar Like the Screen Scion toi bar the vertical oo bar is always avaiable Use the vertical tol bar to start a deposition abort a process record a log zero the sensor activate the relays enter Manual Moda or ext Eon LT software Starting a Deposition A deposiion process can be started from any screen Te process selected in the Process List o the Program Control screen or through the Remote Process Control panal is the process that wil run Press the Start bution A to begin the process When the process is complete a Process Complete notification wil appear Tip To create a new process navigate to the Program sereen and select New under the Process List Aborting a Process A process can be aborted fam any screen Pressing the Abort buton BA anas an atve process Abot is also used to ext Manual Made Resume or Restart an Aborted Process Aprocess can be resumed or restarted from any screen Pres the Start button window wth the option ta Resume or Restart wil appear Make a section Logging Eon LT Status Eon LT status can be logged to a mono log fom any screen Pressing the Log Ett buton Saves a monitor log to the monitor log save flder PuBICEON_LOGSIMONITORING When a process is initiated Eon LT software wal automaticaly begin recording the realtime sta
5. substrate and the posiioning of ha sensor Max Power Y4 Represents the maximum power ave Eor LT wil deliver to the hentar rom 0 100 Proportional The Proportional coeficient that controis the material deposition ata during the PID phase Integral The integral me constant that controls the material deposition rate during PID phase Derivative The derivative time constant nat controls the matera deposition ata during tha PID phase Duell Time The ime specified that alaws th completion of the predeposition process and the activation of ihe PID This delay prevents the PID from engaging the source power prematurely allowing the material to reach the Sensor No material is appled to the sensor doct after the predisposition process finishes for the brief ime it takes cr the material to initially tansion rom the source to the crystal in the evant that a shutter is present Rise to Soak Time The tme epscfing how long it takes Eor LT to raise isourco power rom 0 to desired soak power Soak Time Once the soak powers reached this is the time specifying how Jong Eon LT sits at soak power before continuing t Rise to Predaposi Soak Power The power percentage that the source wil achieve during soak process Rise to Predeposit The time speciyng how long it takes Eon to change the current source power ta the power percentage sel for Predeposit Predoposit Time The time specifying how long Eon LT wil maintain the set
6. 0 200 VAC SOISOHz 2A Output 24V 3 75 A GT External oscillator Optional Replaces tha Eon LT intemal oscilator Phoonit Eor LT quick reference guide Instructs user in quicky assembling and integrating Eor LT into existing system Chapter Cant ata ance Getting Started 2 Eon LT System Assembly The folowing guide wil describe in deta how to integrate the Eon LT monitor into a basic GCM configuration The QCM depicted below is the Colnatec Phoenie sensor haad featuring temperature monitoring technology See Appendix for connection mag o a fly assembled Phosni EanT system 1 Connecting to OCM Connect SMA Coaxial Cable to ocu Spin cable in pace using cable ahah unti resistance is fat Twisting cable shat past point of resistance may damage catis Rod fingertip ver connector to tighten 2 Connecting to Eon T Connect QCM to Eon LT Connect BNC extension cable ta SMA which tn connects to the BNC adapter cable using the provided BNC unin Then connect the other end ofthe BNC extension cable to the Eon LT conia input either sensor 1 or 2 Chapar Seting Ste n Connecting Eon LT to PC 4 Install Eon LT Software anto PC Insert he accompanying i EOLT software CD into disc dive Folow prompts 1o insta sofware onto PC 2 RS232 o Eon T Plug RS 232 connector into female serai prt on panal Tighten integrated 9 RS 232 cable to USB Adapter Plu
7. EON LT pc based controller user guide for vers 3 0 13 software KICOLNA 15 15 E 7 18 a 2 a a 2 a A 25 25 26 2 Contents Chapter 1 Eon4T at a Glance Eon LT Connectors Accessories Chapter 2 Getting Started Eon LT System Assembly Chapter 3 Program Control Program Control Sereen Process List Layer List Layer Properties List Layer Properbes Defined Chapter 4 Settings Setings Screen Backup amp Restore Sensor Alerts kog Restore Defaults Period Cont Relay Contro Sensor Zeroing Auto Abort on Max Power Rate MaxMin Auto Abort Chapter 5 Manual Mode Manual Control Adjusting Source amp Heater Power xing Manual Mode n za pi 2 2 m pi a a 2 2 2 2 2 SERE e8248 Contents Chapter 6 Vertical Tool Bar Using the Vertical Tool Bar Staring a Daposton Aborting a Process Resume or Restart an Aborted Process Logging EonAT Status Zeroing the Sensors Activating Relay 1 and Relay 2 Exiting EonLT Sofware Chapter T Status Status Seren Heh Layer Material Frequency Rate and Thickness Zero Sensor Percentage Complete Source Power Temperatures MarualyZeroing Individual Sensors Chapter 8 Green Status Status Indicators and Remote Process Control Chapter 9 Graphs Graph Screen Adjusting Y Values Graphs Color Key Chapter 10 Screen Lock Password Protect Eon LT Screens Screen Lock Button Locking a
8. Material row 3 Inthe new window select a new material 4 Clek OK Note When editing Density or Z Factor the material value defaults to Custom to prevent contradictions fram occurring between the mataria and the material values Selecting sensor and source of layer Co Deposiion 1 Inte Program screen select the layer to which a sensaricurce wil be added 2 Click on the SenscriSource section animation ta change the senacrisnurcs combination Sequential Deposiion 1 Inthe Program screen select the layer to which a sensorsourca wil be added In the Layer Properties ist scroll down to the Sensor or Source row and double cc 3 Inthe new window ck the animation unt the desired sensorlsource setup is displayed 4 Click OK Aopend 8 ck Commons a Vertical tool bar Starting a deposition 1 A deposition can be started from any seren 2 Ensure that the desired process ta run is selected in the Remote Process Control panel on the Green Status bar 3 To start the process press the Start button on the vertical tool bar 4 Wait for the Procass Complete notification to appear Abort button to end a process or exit Manual Mode 1 From any screen press the Abort bution to end a process ar et Manual Mode Resuming an Aborted Process Fa process has been aborted before it has been completed and a naw process has not been selected the original process can be resumed 1 To resume a process press the Start buton from any screen 2 W
9. Predeposit Power before moving ima del Predoposit Power Te power percentage that the source wil achieve during ha Predepost process Source The source Eon LT uses to control the selected layerimaterial The Eor LT has two sources Source 1 and Source 2 Sensor Determines which sensor should be used to control the source selected tor the current layerimatehal Removing a Layer 3 Press th Program button in the Sereen Selection tool br From the process ist select he Process wih he layer that needs to be removed 3 Inthe Process Layers ist select the layer that needs to be removed 4 Press Remove direct beneath the Process Layers il Note Removing the layer only removas the layer ftom the Process Layers list The layar can be read ta the list by pressing New and selecting the layar from the dropdown menu See Adding a process on the frst page of this appendix Deleting a Layer 1 Press the Program button on Sereen Selection tooi bar to enter the Program 2 Select process that contains the layer to be deleted 2 Afer selecting the Layer from the Process Layers list press Permanenty Delete Layar to delete the layar Warning This action wil permanenti delete the layar rom ALL processes The layer wil also be deleted rom te is of layers There is no way to recover ti deleted Changing the material for a layer 1 th Program screen select the layer with the material to be changed 2 Doublecick on the
10. Sereen Seting a New Password Resetting the Password ai a a a a Contents Chapter 11 Troubleshooting Chapter 12 Specifications Device Parameters Coating Measurement Inputs and Outputs p as a as a a a a a a a aa a aa E EI sa s E s s Appendices Appendix A Eon LT System Eon LT System Configuration Appendix B Quick info Screen Selection Tool Bar Adding a Process Renaming a Process Deleting a Process Edit the Namo Rate and Thickness of a Process Adding a Layer to a Process Copy a Layer Recordeing the Layers Changing Properties ofa Layer Layer Properties List Removing a Layer Deleting a Layer Changing the Material fora Layer Selecting Sensor Vertical Too Bar Settings Appendix C About Eon LT LabVIEW Interlace Software Updates Inspection amp Ina Setup Warranty Appendix D Toning Factor Miscellaneous 57 Index Eon LT at a Glance 1 This guide dascribas Eon LT controler with temperature control 3rd generation and Eon LT software version 30 11 Eon LT Connectors Eon LT Front Eon LT Back WARNNG te re ere tad an UN tse outputa Se proper tab psa D manual ana in tonic kee pa WARNING Orly te poed power supp shuld be used wth Eon LTN Bg age pd ann any a ome puo Chapters ant ta ance Accessories Eon LT controler ships wih th folowing accessories Power supply and cable Input 10
11. al of Coinatec Cohataz gives no condition or waranty expressed or implied atout the finess of this technical manual or accompanying hardware product Conatec reserves the ight to make changes to this technical manual or accompanying hardware or design without notice to any Person or company Caiatac shall not be labie for any Indirect special consequential or incidental damages rasuting rom the use ofthis technical manual or he accompanying hardware or design whether caused tough December 2014 Colnatec s negligence or otherwise Ver 3 0 11
12. aphs screen features line graphs for frequency temperature rate power and thickness Unika real ia data daa in graph orm can provide the user with a comprehensive historical perspective on a developing deposition process Adjusting Min Max Range of Graphs Ckckanywhro on a graph to produce the range adjustment window Graphs The graphs provide a visual representation of data gathered by Eon LT Th flowing data is presented by the graphs Frequency Displays frequency over tim in Hz Rate Displays the rate ofthe material application overtime in A s lt Thickn Displays the thickness of material application over time in IKA Temperature Displays the temperature ovr time in CI Power Displays the power of the sources and heater aver ime in percentages in c Color Key The Color Kay displays the color values representing the various devices being depicad on each graph Screen Lock 1 1 Password Protect Eon LT Screens The Eon L Screen Lock enables the user ta lack any scan tat appears on the Screen Selecton tool bar Locking a screen helps ensure that the contrals and setings an each screen remain secure and under password protection Screen Lock Button 8 To access tne Screen Lock controls cick on the Screen Lock button IB r a password Is already in place the password prompt appears Entering the correct password wil est to the Screen Lock screen Ifa password is NOT already in plac
13. at a end of each material Predspost The relay wil activate during the predeposit phase ofthe deposition process for sach layerimaterial The relay wis then shutoff at the and af the depositon process Auto Dapositon The relay wil activate during the dwell phase just before the PID activation This allows te dwell me to occur between shutters Teicasa and PID activation Setting when Eon LT automatically zeros sensor thickness 1 Press the Settings bution on the Screen Selection tool bar 2 In the Sensor Zeroing menu checkmark each seting associated withthe sensor hat is to have its thickness automaticaly zeroed Before Log Eor LT zeros thickness when Log buton is pressed 7o Start Pressed Eo LT zeros thickness when Star buto la pressed to start new deposito Before Layer Eon LT zeros thickness each time a naw layermateria engages during the process Before PID Eon LT zaros thickness each tima a new layerimaterial actvates the PID Safety Handling amp Support C i WARNING AI elocrcal components ara lo ba considered extremely dangerous tampered with in any way Cohatec is no ible for any injury sulting rom product misuse modification or disassembly WARRANTY LABEL ifthe warranty label has boon tampered wih VOID wil appear where the warranty label was originally placed If tis is visible tthe me of aval tis important that you contact Conatec immediately ater receiving the product App
14. cking on the appropriate buto Note The restoration process wil overwrite any of ne current settings you restore Sensor Alerts M The Sensor Alerts A seting providas the opton of enabling or disabling the crystal failure alerts which occu when the crystal frequency dis out ofthe 5 MHz 6 MHz range Although itis recommended that the sensor alerts generally remain enabled the user can disable the notifications in the instanoe that the covata is being used In a testing rj pe tothe end of the logs recorded by Eor LT sofware specialized name Note if a log recording is already underway he logging must be reslanied forthe new name to taka fact Note Naming restrictions bust into Microsoft Windows wil prevent log recording ifthe folowing characters ara used 1 gt Eon LT software raises a prompt to wam the user hat the name is invalid Log fs wi incorect characters in the name wil not Ee Opening saved log les Selecting the Open Log Folder THE opens the oder to whieh the logs are curre being saved By defaut location ie Public Documents EON_LOGS Restore Defaults The Restore Defaults bution HAs reinstates all of the setings to defaut values This command is often usad te curent settings are producing undesired Period Control The Period control tuner s used to adjust data collection frequency in increments of 0 1 seconds The penod range is 100 milseconde to 1 second For precision ad
15. e he Screen Lock screen appears Use these controls to lock and unlock screens and change the Screen Lock password 9 Somme Locking a Screen On the Screen Lock screen select the screens to be locked Selecting a screen ight SoS T ick OK to engage Screen Lock protection When clicked on the protected screen e wal now generate a password prompt Setting a New Password The user may keep an existing password or entar a now password using the password controls In order for a new password to be accepted the Password and Re Type Password Fea must contain the same password ick OK to save new Sereen Le screen settings or Cancel to retum t original IMPORTANT Leaving password folds empty DOES NOT disable the Screen Lock Attempting i access a locked screen wil continue to produce a passport prompt Leave feld blank and cick OK to proceed to the Screen Lack menu Ta disable the Screen Lock unclick any locked screens IU Clicking OK saves screen lack and pasawor settings Resetting Password TO reset the Screen Lock controls password click on the Screen Lock button IB and enter he folowing code into password prompt 45647kyawx94272ysha When the Screen Lock screen appears enter a new password into the password fields Troubleshooting Symptom Cause Frequency rends 20 el Sensor not detected Gould not connect ta Eom LT afer 3 seconds message Wrong COM port selected
16. e user in order to prevent mismatch Density The density of the selected material being applied Factor Acoustic impedance factor which is used to compensate for dense matris and is predefined based on he selected matera Tooling 4 Tho geometric relationship between the substrat Max Power P6 Represent the maximum power leval Eor LT wil deliver to the source from 0 100 Proportional The proportional coeficient hat controis he material depositon rat during th PID phase Integral The integral me constant that controls he material depositan rate during PID phase Derivative The derivative tma constant that controls the material deposition rate dung the PID phase Dwell Time The time specified that follows the completion the predegositon process before activation of the PID This delay prevents the PID from engaging ha source power prematurely giving the material a chance to reach the sensor No material is applied to the sensor directly afier the predeposiion process fishes for the be time it takes for the material to andthe positioning of The time specifying how long it takes Eon LT to raise source power from 0s to desired soak power Pre Deo Process Tine Soak Time Once the soak powers reached this is the time specifying how ang Eon LT sits at soak power before continuing to Rise ta Predeposit Soak Power The power percentage that the source wil achieve during soak
17. end Say Handing A Support s EXAMINE YOUR NEW EON LT FOR ANY SIGNS OF PHYSICAL DAMAGE ALSO ENSURE THAT THE TAMPER EVIDENT LABELS ARE INTACT Balore shipping your Eon LT was calibrated and tested by Colnatec to meet the highest quality standard Itis important that yeu tako a few minutes to inspect the product to ensure that your equipment was not damaged or otherwise tampered w n during trans About Eon LT VW the acil to sense daposion and temperature with high precision he Emi thin fim controller s one of ne newest advancements in Thin Film position controll Tha Eon LT provides fres hat help improve measurement accuracy for better process control LabVIEWS Interface The Eor LT offers simple LabVIEW interface that provides an operating envionment that is intuitive fent and impressive The Eon LT is easy to set up right out ofthe box Software Updates The Eor LT interface sofware can be upgraded on site to provide software improvements There wil be natfcation when these updates Become avalabie inspection and inat Setup Examine Eon UT for any signs of physical damage Also make sure thatthe tamper avident labels aro intact In order to ensure sale corect operation of your EoniT please follow the step by step instructions presented in ne Eon LT Quick Star guide included wih your product Warranty Eor LT is warranted to the original purchaser to be fee of any manufacturing related defects for
18. epiri Program cent Layers List Open the Layers List Cick a process name Layers List displays the curent layers associated with a process Set the rate thickness name and order cf he layers Add a layer Cick a process name Selecta layer Sngle cick Edit layer name rate and thickness Double cic a layar Mody the nama rate andar thickness Cick OK Copy Layer Select an existing layer and press Copy o produce a copy in the list Change order of layers On the Layers List cick and hold a layer drag the layer up or down the lat and release the layer where desired Remove Layer On the Layers List ick and hold a layer drag the layer up or down the lst and release the layer where desired Chapir3 Prog Conve e Create new layer Select New button located below the Layers List You can also use an existing layer by typing inthe layer name or pressing the dropdown araw to reves ist of cumenty available layers Layer Properties List Enter ar change values for layers Te Layer Property Vale window allows you to enter or change the valu of a layer property Note Material Source and Sensor operate dieron than the other tems sed on the Layer Properties Lis Open Layer Property Value window Double click a layer property at any time even during a process run Enter a value and cick OK or Cance Permanently remove layer Use the Permanently Remove Layer button to delete a selected layer A deleted layer is rem
19. g the other end o he REZ22 cable into the USB 10 RS 232 adapter Tighten Integrated screws Chapt Seting sissa 4 Plug USBo RS 232 Adapter into PC Plug USE end o tha USB Ie RS 232 adapter into PC 5 Connect Power to Eon i Plug Eon LT power adapter nto AC outlet Then Bug DO connector nto the Eon LT Start Eon LT Software manson gen han once i CU de ere a mp e e ir nen instaling sofware Use only the provided USB cable Ensure thatthe software has bean ful installed before connecting Eon LT to your PC Reboot PC folowing Eor LT software instalation Program Control Program Control Screen ick the Program button in the Control Menu to access the Program screen With this screen you wil be able to create a new process edit or delete an existing process as well as add or remove layers and layer properties lant cc gym sanan bal asian E Sta ian Process List Cresta a naw process or edit or dela an existing process The et contains all of the available processes Creato a new process Selecting the New buton located below the Process List lows you to create and name a new process Choose either Sequential or Co Deposition enter name and press OK The process now appears onthe Process Delete a process Pressing delete wil permanently delete a process Once deleted a process is only recoverable ifi was backed up prior Ch
20. hen prompted to Resume or Restart press Resume Logging the status of the Eon LT 1 Press the Log button on he vertical tool bar Note Eon LT status can be logged to a monitor log from any screen Pressing the Log buton saves a monitor log to the monitor og save folder MyDocumentsleen_logs monitoring When a proces is inated Eon software wil automaticaly begin recoring the esime status of the process to the process og feider MyDocumentsieon logs processes ia process is started while an Eon LT monitor og recording in process EonLT wil automaticaly stop recording to the monitor lg and begin cording to the process log Zeroing Both Sensors Manually 1 Press the Zero AI Thickness bution on the Screen Selection tol bar Activating Relays Manually d The relays can be activated from any screen 2 On the Screen Selection ool bar toggie the Relay button to activate he lays Settings Note Al setings are automaticaly updated and saved as soon as they are changed Adjusting Eon LT period readings 1 Pros the Settings button on the Screen Selection tool bar 2 Select General iab 3 Click and drag the marker on te Period control to adjust the period time in increments of 100m Changing Thickness Units IKA AJ 1 Press he Setings button on Screen Selection tool bar 2 Select General tab 2 Select the desired thickness measurement units DisablefEnable Sensor Failure Alerts 1 Press the Satings bu
21. ironment in which he user can exercise manual control over the sources Source and 2 Ta access manual mode simply cick fon the Manual Mode buton from any sereen ors Adjusting Source Using the folowing steps the source and heater power can be manualy adusted bythe user trough the Manual Mode operating environment 1 Press Manual Mode from any screen 2 Gick on the Source Selection Contro ta seect the source that needs to be manualy controllo n m 3 Clckng on the Source Selection control produces a dropdown list rm which the user can select from available sources Source 1 Source 2 4 Use the Source Power adjustment buttons t increase or decrease the power ofthe selected source in increments of 1 OR cick directly eno the Source Power indicator and enter a specife power percentage Then press Enter Note in order far tha program to update the source power the usar must enter a new value and then clk in an ares other than the Source Power indicator or press Exiting Manual Mode Click the Abort buton BUS to ext Manual Mode and return to the standard operating envionment Note Pressing the Abort button returns both source to 0 power IMPORTANT When tne user manually adjusts the value of the source power output the source wil no longer be control by the PID Tagardess ofthe curent process Fa source is adjusted during a degositon the Eon LT wil no longer control the source controling the PID or the
22. justment moving the slider produces an indicator showing the Log fles wil stil be recording in kl angstroms Relay Control The Relay Control panel features two relays with independent settings Applies during deposition only automatic control Start Shutof When enabled with a check mark B the Start Shutof command opens turns of th relay each me a process is started When the relay is used for a shutter Star Shuto ensures that the shutter is always shut before the depostion process begins 1 Start Shuto is disabled the relay remains in its prasent state when a deposiion process begins Manual When Manual is selected the relay remains in its present stata The user can close um on ar open um of he relay at wil Start Relay is closed umed on as soon as the process starts Predeposit Relay is closed tured an at the beginning of the predeposit phase during ha pradepositon process Auto Deposition Relay i closed turned on just before the PID starts activating as oan as Dwl Time preset is initiated Once Dwal Time concludes Auto Dapostion begins This process is designed to prevent the Automatic Depositon rom engaging prematurely providing a window of me between the shutter opening andthe material reaching the substrate This selection is specially designed for shutters Sensor Zeroing With the Sensor Zeroing panel tha user can select when to zero Sensor 1 or Sensor 2
23. lso displayed Frequency Sensor frequency Fate Rate of deposition Thickness Thickness of deposition applied to sensor Zero Sensor x x The Zero Sensor buttons aisa Sener zero comesponding sensor thickness to Percentage Complete The Percentage Complete indicators corresponding sensor thickness to Source Power The Source Power indicators display the current power being applied to Source 1 51 Power a Source 2 82 Power Y Temperatures TC2 Axillary thermocouple connection Manually Zeroing Individual Sensors Clck the Zero Sensor button hat corresponds to the sensor to be zeroed Char sine Green Status Bar Status Indicators and Remote Process Control Afizd menu avaiable rom any seren he Green Status bar servas a vanely of display ang control functions Status Indicator Displays process Eon LT is curently performing Information updates in reakima as Eor LT performs each task Time Indicator Displays the runtime of the curent active process The Time Indicator also retains the rn ime of the last completed or aborted process Remote Process Control When a process is selected the Status screen wil display tha frst material to run on each sensor if no materials ara selected to ba measured by ne of the sensors the sensor wil display None in the Layer and Material indicator man a Graphs 10 Graph Screen To view he Graphs screen cick on Graphs in the Screen Selection tol bar The Gr
24. me and selecting it from the ist of layers 5 Enter the desired Rate in s and the Thickness in PA Cick OK Note The name cannot be left blank Typing the name of a layer that is already created wil use that layer settings Copy Layer 1 Click the Program button to enter the Program sereen 2 Select an existing layer and press Copy to produce a copy in the is Re Ordering the layers 1 lick and drag the layer to the desired location in iho ist 2 Layers are executed in numerical order from top to bottom Changing properties of a layer Press the Program buton on tha bottom ofthe screen Select the process in the Process List containing the layer that requires eating From the Process Layers list select the layar to be edie Double click on the Property to be edited In the naw window that opens enter the new value for the property Press OK Note fan incorrect value is entered for the property selected ntficaton window wil appear displaying the acceptable values for that propery spend uch Commendo a Layer property list Materials The material being applied during the deposition process This entry tums to Custom i the Density ar Z Factor is moded by the user Density gfem 3 The density of the selected matrial being appe Z Factor Acoustic impedance factor which is used to compensate for dense materials and is predefined based on the selected mater Tooling 4 The geometric relationship between the
25. one year rom the dat of purchase Colnalec reserve the right o repair or replace th unit afiar inspection spend faring amp Super Contact Colnatec Support 511 W Guadalupe Road Sule 23 Gibert AZ 85233 480 638 1440 supporcolnalec com spend fa Handling Super Tooling Factor D Source Index pnl tang Retay and Roy 29 Adi Y Vues 38 pe por pu Dating Layer 48 pore ning Gon LT See 30 ning Mar Med 27 pL p Index ent ayer Me Frequency Ral and Teas 2 Irian pte 43 Layer YS 1172025 3 32 40 8 47 48 48 52 Layer Perit end 19 Layer rer Lt 15 17 18 49 Log 23 25 29 80 51 52 Leg Fee 20 51 Logg Eom Sa 29 58 atr 18 18 20 26 3 3234 98 4 62 Pererisgs ogle 31 32 Presa Pretec 24 27 Process Di 42 Pragam 116 17 18 1828 28 48 44848 Pragam Canal 15 141 181 20 28 Index r Feming a Layer 48 Ssey ss mg Senge 21 2222 24 25 48 62 Score Upi t Str 9 202 27 31 32 48 47 48 Saree Poner 26 14 32 45 Suns 23 28 11 12 Y 34 48 60 pr Index Tempe 3i Trees 16 2 1238 30a 51 52 Tie 1176 20 342 31 438 30 47 5 59 52 53 per Waray 52 58 Copyright 2014 Coinatec AN information contained within is Technical manual and accompanying pages are copyright of Contee All rights reserved Itis a breach of copyright if this echnical manual is copied distribute or reproduced n whole or part using any means whatsoever wihout the pror weiten approv
26. oved from ALL processes including those not selected Once deleted a layer is oniy recoverable if was backed up prior hepar Program cent Select a material Scroll down and click onthe Material ow to open the Materials List Seloc the applicable material and double lick a material or eck OK The correct density and 2 Factor is automaticaly set sir Foie Maia Nie srr Onide m arene Toe Ifthe material being applied in your process is unlisted select Custom and cick OK You can then manualy enter your custom Density and Z Factor settings in be Layer Properties List Note also that whenever you manuali change Density and Factor setings 0 an unisied material the sofware wil automatically class the material as Gusto Selecting Sources and Sensors In the Layer Properties List dick on ether Source ar Sensor to open the Scurce Sensor configuration window ck the image to configure which sensors and sources wil be used during deposition Select one of four configurations Source 1 gt Sensor Source 2 gt Sensor 1 Source 1 gt Sensor 2 lt Source 2 gt Sensor 2 Chapir3 Prego Conve Layer Properties Defined The following isa list of settings that defines the parameters of he deposition AN sating must be set corocty for the sofware to funcion property pana Materiais The material being applied during the deposition process This entry ums 1o Custom ifthe Density or Z Factor is modified by th
27. process Rise to Predeposit The time specifying how long it takes Eon to change the current source power to the power percentage set for Predenostt Predeposit Time The time specifying how long Eon LT wil maintain the set Prodeposit Power before moving into cel Predeposit Power The power percentage that the source wil achieve during the Predeposit process Source The source Eor LT uses to contro the selected layermataral The EorLT has two sources Source 1 and Source 2 Sensor Determines which sensor should be used to control the source selected for the currant layerimaterial Chapt Program cent E Settings Settings Screen Ck the Settings button inthe Sereen Selection tool bar to access the Setings screen Use tabs to select settings operations The Settings screen enables user ta perform numerous tasks such as backing up and restoring settings opening the log folder adjusting period and managing relays and sensor zeroing setings CLICK HERE TO ADJUST Backup amp Restore Tha Backup and Restore commands enable the usar to sa heating cycles and general setings n Eon LT sofware deposition processes Selecting Backup EMOS brings up the Backup seren On the Backup screen clk on the item you wish to save Restoring backed up settings Selecting tho Restore buton 99 apens the Restore screen The user can now restore depositon processes heating cycles and general settings by cli
28. tion on the Screen Selection tool bar 2 Select Alerts tab 3 Check or uncheck the checkmark box of the corresponding sensor to enable or disable failure alerts Checked Shows sensor failure alerts Unchecked Hides sensor faure alerts ind a Log Name to Log files Press the Settings bution on the Screen Selection tol bar Select Logs tab Entar text to append a og filename erep Note Using the characters 5 wil cause the fename ta be inva and can prevent logs rom being recorded Restore Default Settings 1 Press the Setings bution on the Screen Selection tol bar 2 Press the Restore Defaults buton on the settings screen 3 A prompt wil appear warning th user that selecting OK wil ratum al settings 10 2 defaut state Force Relays to shutoff when a process is started 1 Press the Selings button on the Screen Selection tol bar 2 Inthe Relay Control section check Start Shut for the desired relay you wish to shutoff on process star Set when relays activate during deposition process 1 Pres the Settings bution on the Screen Selection tol bar 2 Inthe Relay Control section select the round radio button associated wih the tap during the deposition process when the relay shouid activate 7 Manual The relays wil not activate during the depostion process automatically but can il be controlled by the Relay button Start At the start of each layermateralin the process the relay wil activate and wili deactivate
29. tus of the process to the process log folder PubcEON LOGS PROCESSES ia process is started while an Eon LT monitor log recording isin process Eo LT wil automaticaly stop recording to the monitor log and begin recording to the process log Zeroing the Sensors E The sensors can be zeroed fom any screen Pressing the Zero Al Thickness button tes zeros Sensor 1 and Sensor 2 at once Activating Relay 1 and Relay 2 The Relay 1 and Relay 2 butons 1368 GA permit manual conti ofthe relays Chaptar7 Veni Ton Bar Exiting Eon LT Softwar Eon LT software can be exited from any screen Simply press the Ext ut Land when prompted press Exit again Chapter Vers oo nar Status 8 Status Screen Navigate to the Status screen by selecting the Status button n the Screen Selection tol bar The Status screen displays reaime information on the progress of the process Data for each sensor is represented heath layer frequency material rate fckness and percentage complete Important infomation such as source power and temperature is also displayed e o Health Layer Material Frequency Rate and Thickness Layer Te nama ofthe layer being applied Material When the sensor is bing used during a deposition to apply material tho indicator wil fash rod informing the user that the sensor is being used to contro the selected source for the material being applied During tis process the material bing appied is a
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