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1. Figure 28 Standard design positioning Click Next to continue B Substrate Loading 1 Make sure the cover lid 1 is closed interlock lamp 12 off and the compressed air is present Click on the button Load Substrate The stage moves to the loading position at the front of the machine and the Loading Status window opens on the User PC Wait until all movement has finished Open the cover lid On the chuck mount the alignment pins masks three wafers two in the appropriate positions for the plate size to be used see left part of Figure 28 on next page Switch off all light except safe light Take a substrate out of its storage container Check substrate quality e Make sure the substrates comply with the specifications of the uPG 101 Size between 2 and 5 max thickness 6mm flatness tolerance lt 20um e Never use out of date substrates e Do not use substrates with scratches on top or bottom visible contaminations in the resist or non uniform resist distribution in the area to be exposed 34 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Alignment Pins Vacuum Setting plate wafer no plate dD a l d Le sl oe dS oo s ge oS 5 He oo Figure 29 A
2. influence the amount of energy that is deposited ees m on the resist surface On the one hand the Design Options output power of the laser in mW Milliwatt can ES be regulated left value on the other hand the power can be reduced further in finer steps by setting the pixel pulse duration in percent right value In general it is recommendable to avoid very low laser output power as the relative noise Figure 38 Exposure settings increases towards low output power levels If window Wizard advanced very low energy is needed as can happen e g in vector mode exposures the power can be further reduced by use of a filter with 10 transmission to keep the laser power level in a resonable region The filter can be added by turning the filter knob at the side of the system to the ON position The output power needed for a certain exposure depends on the type and thickness of the photoresist used For a resist with spectral sensitivity of 70mJ cm a laser output power of 8 mW in conjunction with a 50 pixel pulse length is needed to expose the resist To find the right energy for a certain type 40 HEIDELBERG INSTRUMENTS PG 101 User Manual of substrates several exposures have to be done at different energy levels until the energy is found that gives the best result in structure size and quality Note If good edge quality of the exposed structures is important it is recommendable to decreas
3. u a Figure 48 Manual alignment during advanced alignment sequence Wizard Click on Select POI A cross hair appears in the camera window With the mouse drag the crosshair center to the position in the camera image where the alignment mark coordinates should be set e g on the structure center Push the middle mouse button mouse wheel to confirm Template detection During each template en Soss Wizard tum Mode detection the Registration window shows the current status and results In the camera window a representation of the selection box blinks up when 2 GEES the system has detected a matching structure r t Watch these to be sure the correct structure was mane dete cted Press Cancel to stop Failure If automatic detection fails two times the vycwarna panel changes to alignment error handling state This panel gives the option to open the Control ae Retry Search Panel with Show Control Panel move the structure Cancel into better view or improve camera settings and Retry Search afterwards or directly without modifications Alternatively the alignment seguence can be stopped by clicking Cancel Upon return to the Setup Automatic Alignment panel the fit level can be adjusted to a lower value for another try However the lower the fit level the higher the probability that the structure is detected in a wrong position If alignment still does not work properly remove the
4. 3 Open the lid switch off the vacuum with the vacuum turn knob 5 and carefully lift the substrate off the chuck 4 Process the substrate according to the substrate type and manufacturers recommendation Note If more plates with exactly the same setup should be exposed loading of the next plate can be done directly from this window using the Load Substrate button Afterwards with the Expose button an identical exposure can be started It is not necessary to repeat the complete wizard setup STEPS OF AN ADVANCED EXPOSURE A Design preparation 1 Prepare the design in the required format as described in the previous section Make sure the design complies with all design rules given above the general as well as the specific 2 If the design is not accessible via network from the Menu PC transfer it to the uPG 101 PC e g using a memory stick or CD Any freely accessible directory can be used 3 Start the PG 101 Exposure Wizard using the eem tose ward eege link icon on the desktop S a ae Note At least 5 minutes must have passed Heidelberg Instruments since power up or reset of the main system Mikrotechnik GmbH c 2006 before the Exposure Wizard may be started Version 3 9 4 Otherwise communication errors will occur making a reboot of the Menu PC neccessary ee E A expose a design on your uPG The Welcome Screen opens showing the seen progress of the connection and initialization mW er sequence
5. 3 Click on Select Offset A cross hair appears in the camera window With the mouse drag the crosshair center to the position in the camera image where the origin should be set e g on the structure center Push the middle mouse button mouse wheel to confirm he selected coordinates are automatically transferred to the Offsets and Rotation frame of the Manual Alignment panel 4 If a coordinate point different from the origin of the design should be exposed on the inidcated point the reguired offset can be added by entering modified numbers via the Manual Offsets control before continuing to the exposure panel SHIFT ACCORDING TO MEASURED PLATE POSITION lf the design should be exposed at the center of a structureless plate but with a higher precision than the mechanical alignment pins allow the Find Plate Center function can be used When it is started the positions of all four edges are detected with the autofocus system From these the position of the center of the plate is calculated All measurement results are shown and if they are accepted by clicking OK the plate center coordinates are transferred as offset to the Offsets and Rotation frame Here an additional design offset can be added by entering modified numbers via the Manual Offsets control before continuing to the exposure panel ADVANCED ALIGNMENT TO CAMERA IMAGE SEMI AUTOMATIC 2 POINT The Advanced Alignment option gives acces to tools that can be used to run
6. HEIDELBERG INSTRUMENTS wuPG 101 User Manual In the following window click on Load Design 96101 Exposure Wizard tum Mode M Navigate to the directory on the PC or the network that contains the design file select it and click OK For some design formats a dialog 24 Load Design window requests now the size that was defined m for one drawing unit during design creation Only e BE integer values may be entered for dxf and bmp designs Enter the number and click OK He HINTS The design will be transferred to the lithography T unit and converted into the machine data format some design parameters are listed and a n preview appears in the preview window Clicking on the preview window will open the design in the standard viewing application set in the operating Figure 27 Design n da system Wizard Note No changes to the design itself can be affected here Also the positioning of the design on the substrate can not be influenced in standard exposure mode The design will be exposed so that the center not the origin if this is not in the center of the design will match the center of the stage not necessarily the center of the plate Alignment accuracy depends mainly on the repeatability of loading against the alignment pins If precise alignment of the exposed design on the plate is an issue an exposure with advanced options is required
7. autofocus system autofocus stage pressure pressure Figure 13 Pressure manometers at supply unit front HEIDELBERG INSTRUMENTS PG 101 User Manual System Startup and Shutdown STARTUP kb At the System Supply Unit switch on the uPG 101 with the On Off switch 19 The switch should light up Make sure that air pressure for the stage is applied and the lid is closed The Safety Interlock lamp 12 should be off Power up the Menu PC according to the manufacturers instructions It is required to wait for at least 5 minutes for the internal controller of the system to finish booting before starting the Exposure Wizard see below in instructions on exposing With the wizard the camera software HI Vision starts and creates a minimized window Do not close the camera window while the wizard is running otherwise the wizard may crash lt is recommended to wait for at least 20 minutes for the system to warm up and stabilize before doing an exposure SHUTDOWN 1 In the Tools Menu select Shutdown and confirm the operation The Wizard shuts down the operating system of the uPG system When this is finished click OK in the dialog window The wizard will close Switch off the uPG system using the On Off switch on the supply unit 19 Power down the Menu PC according to the manufacturer s instructions RESTART 4 u DO In the Tools Menu select Shutdown and confirm the selection The Wizard shuts down the oper
8. Adjust stage until mark1 or mark2 is in camera viewer completely and press Continue to continue the alignment sequence o Accept the reported offset and rotation Proceed through the wizard to the final step and expose the design CamOffset2 6 After exposure is finished develop the plate Inspect the overlay structures be m 7 If overlap is not satisfying re adjust Camera Calibration and or Laser Offset Parameter and repeat exposure 59 HEIDELBERG INSTRUMENTS wuPG 101 User Manual CAMERA CALIBRATION The camera calibration enables the system to accurately calculate the position of any structure found in the camera image It measures the correlation between stage movement units so called encoder tics or only tics and the pixels of the camera image This is done by measuring the position of a specific structure in the camera image at different stage positions and comparing both Steps ofa Camera Calibration procedure P an 7 Expose Focus Series j 1 Select Camera Calibration from Advanced menu bar l inoa 2 The wizard switches to the Stage Control set and the k camera window opens If no substrate is loaded yet click ON semenu Data the Load Substrate button to start the standard loading aen Coen procedure and follow the instructions given by the wizard Load a sample with an unambiguous and clearly distinguishable structure using alignment pins if required 3 Move the structure th
9. This takes approximately two Show Advanced plnz minutes Once the startup sequence is finished click on the Show Advanced Options checkbox to ae a activate the advanced exposure branch of the Wizard P wizard Click Next to continue 38 HEIDELBERG INSTRUMENTS wuPG 101 User Manual 4 In the following window click on Load Design a sposurewizaa m Made Navigate to the directory on the PC or the network that contains the design file select it and click OK For some design formats a dialog window requests now the size that was defined for one drawing unit during design creation Only 5 integer values may be entered for dxf and bmp E Ze designs Enter the number and click OK ER The design will be transferred to the lithography unit and converted into the machine data format Some design parameters are listed and a preview appears in the preview window Clicking on the preview window will open the design in the standard viewing application set in the amp operating system Here the viewer tools can be Figure 36 Design window used to e g zoom into the design Wizard Note No changes to the design itself can be affected here Click on Next to continue B Substrate Loading 1 Make sure the cover lid 1 is closed interlock lamp 12 off and the compressed air is present Click on the button Show Control Panel The Control Panel opens offering a variety of direct controls E Contr
10. To get correct exposure results certain rules have to be followed when creating a design In the following these rules are explained and information about design creation is given General design rules In standard mode the uPG 101 exposes all areas enclosed within structures defined by the design If inverted exposure mode is selected everything exept the defined areas is exposed The modes can not be mixed This has to be kept in mind when setting up a design Origin For simple and fast exposure the design coordinate origin should be located in that point of the design that should be exposed in the center of the substrate Areas Use only polygons and circles to define exposure areas Lines and polylines can not be used to define an area only the outlines will be exposed Combination of structures Overlapping structures will be combined with an OR function This means also that any structures that lie completely within bigger structures are covered by these Exposure Figure 14 Combination of layers Layers If possible create the whole design in only one layer If several layers are used they will also be merged using an OR function see above Lines Lines have to be defined with a fixed positive line width Lines with width zero are ignored as well as any linewidth changes within a line HEIDELBERG INSTRUMENTS wuPG 101 User Manual Polygons Do not cross polygon lines or create doubled vertices vertices with
11. around a center point at a relative position of 2 5mm in X and 5mm in Y During movement the shutter is open D01 so the arc is exposed The following commands GOIX1500Y1250D0O1 line G03X1250Y1500T 500J 250D01 ccw arc GO1X750Y1500D01 line G03X500Y125010J 250D01 CCW arc GO1xX500Y 5UD0L line G03X750Y5001250J0D01 ccw arc draw the rest of the frame G01X1250Y900D02 Movement to the start of the next structure without writing upper right corner of the lowest structure GO1X750Y600D01 line GO SK 7501900 1 5000150D01 CCW arc GOILXIZ50Yo600D01 line GUZXIZSUYI0CIS00TLS ODO CW arc Exposure of the bow tie with inward curvature G01X1250Y1400D02 Movement to start point of upper structure GOLX750YILLOCDOL line G02X750Y14001I1250J150D01 CW arc G01X1250Y1100D01 line G03X1250Y14001 250J150D01 CCW arc Exposure of the bow tie with outward curvature GOLX750Y1000D02 Movement to the start point of the center structure CO L2125071050D0T Exposure of the first straight line of the center structure Gia Change to single quadrant mode for circular interpolation meaning that no signs are required for the center coordinate GO2X1250Y9501400J50D01 Clockwise arc G5 Switch back to multi quadrant mode for circular interpolation G01X750Y1000D01 Exposure of closing straight line 29 HEIDELBERG INSTRUMENTS PG 101 User Manual MO2 M miscellaneous code i
12. shutter open or if it is just a stage movement 02 shutter closed Subsequent D02 coordinates are combined by the conversion software to just one movement statement In this case the stage moves in a straight line G01 to the start point of the frame around the structure X750Y500 gt X 7 5mm Y 5 0mm without writing X1250D01 This is the command for the first written line bottom line of the frame The G01 code is still active so linear interpolation is used again It does not have to be repeated Only the X coordinate changes so only this has to be mentioned The D01 sets the system to writing mode open shutter for this movement The stage moves from X 7 5mm Y 5 0mm to X 12 5mm Y 5 0mm with open shutter exposing a straight line on the way GUSXIS00Y 7501 25070500D01 Command sequence for an arc e G02 G03 a G code denoting that movement should be done in an arc The number denotes the direction of the bow 02 clockwise movement 03 counterclockwise movement e X lt x gt Y lt y gt target coordinates for the movement Only the coordinates that change have to be listed e l lt x gt J lt y gt coordinates of the arc center relative to the starting point defining the curvature of the arc e D01 D02 Shutter code 24 HEIDELBERG INSTRUMENTS PG 101 User Manual Here he stage moves in a counterclockwise arc from the previous position X 12 5mm Y 5 0mm to the new one X 15 0mm Y 7 5mm
13. 2500 000C gt pixelsimm Background color Comment Created with GIMP Figure 19 BMP image setup GIMP Rectangle Select a Mode 22 bw Ki la Feather edges Rounded comers Expand from center Fixed Aspect ratio v arm 18 Position e 3 8 Size 3 mo 1000S Highlight Hei OB C Shrink merged Figure 20 Rectangle tool settings GIMP Figure 22 Gray tone adjustment GIMP 28 HEIDELBERG INSTRUMENTS wuPG 101 User Manual r 9 Select the Bucket Fill Tool Ne and click into the drawn rectangle in the image editor window The rectangle will now be filled with grayvalue 20 10 Repeat step 4 to 9 but this time use Position 100 100 and Size 800 800 as rectangle properties and grayvalue 40 as Foreground R G and B color settings 11 Image should now look like this File Edit Select View Image Layer Colors Tools Filters Windows Help Dr BE si Background 7 2 MB Figure 23 Second pyramid gray level GIMP 12 Again repeat steps 4 to 9 with following rectangle properties and color settings e Position 200 200 Size 600 600 RGB 60 e Position 300 300 Size 400 400 RGB 80 e Position 400 400 Size 200 200 RGB 100 29 HEIDELBERG INSTRUMENTS uPG 101 User Manual 13 In the end image should look like this W lle Eile Edit Select View Image Layer Colors Tools Fi
14. EXAMPLE Example for a CIF design A CIF sample smiley file DS 10 10 1 I CM eye circle R 4 0 0 DES DS 100 100 13 C 10 T 1 0 DF DS 200 10 1 L GCM nose box Bi 4 0 0 DF Figure 16 Sample CIF Design DS 300 40 1 L CM mouth triangle P 2 0 2 0 0 1 DE gt DS 400 Ts CM wire frame positive quadrant W 1 200 0 200 40 170 113 113 170 40 200 0 200 DE De 1009 200 A PUTTING Together the parts C dG T O T3 C 100 T O 1 MX C 200 C 200 R 0 1 C 300 T 0 1 C 42005 C 400 RO 1 C 400 MY C 400 RO 1 MX DF E Figure 17 Exposed CIF design 20 HEIDELBERG INSTRUMENTS PG 101 User Manual Creating Gerber Designs The Gerber format is used for vector mode exposures his exposure mode is recommendable for designs with only a few line structures where a scanning of the full area would take longer than a direct writing of the structures In Gerber format structures are described via apertures and a trajectory across the design field The opening and closing of the aperture along the trajectory and the selection of aperture types create the final structure The vector mode conversion program of the uPG 101 supports only a limited subset of Gerber statements and definitions The most important limitation is that aperture size and shape is restricted to the writing beam size and shape Each trajectory path that is defined in the design file is
15. Fax 1 310 212 5254 You can also reach Heidelberg Instruments via e mail service himt de or visit our site on the Internet http www himt de HEIDELBERG INSTRUMENTS PG 101 User Manual System Description The uPG 101 lithography system consists of two units the lithography unit comprising optics stage write head and electronics and the supply unit which contains the power supplies as well as the compressed air conditioning It is controlled via a standard PC that is part of the system package LITHOGRAPHY UNIT Figure 1 Lithography System Front Side 1 Cover lid with interlock circuit 2 System base 3 Stage 4 Vacuum field adjustment screws 5 Vacuum switch 6 Writehead 7 Vacuum and compressed air supply lines 8 Optics cover 9 Ventilation slits HEIDELBERG INSTRUMENTS PG 101 User Manual Figure 2 Lithography System Back Side System power connector Service key switch Safety interlock lamp Stage vacuum connector 6mm inner hose diameter Compressed air connector autofocus 4mm inner hose diameter Compressed air connector stage air bearings 3mm inner hose diameter Network connector for camera Network connector for LAN HEIDELBERG INSTRUMENTS PG 101 User Manual SUPPLY UNIT Figure 3 Supply Unit Main power connector with voltage switch and fuse Main power switch Power connector to lithography system Compressed air inlet Particle filter and manometer for compressed air st
16. and data is written during each pass In unidirectional mode only during forward movement data is written This leads to a better stability which is especially interesting for critical structures close to the resolution limit and 3D exposures Unidirectional mode results in a longer exposure time exact increase depends on design size Expose Options Auto Unload after Exposure Uni Directional Mode Figure 34 Expose window Wizard Once all options are selected check again if air pressure is OK the lid is closed and no alignment pins have been left in the stage chuck Click Expose to start the exposure During an exposure the exposure status is shown online in the window Make sure that during the complete exposure time the cover lid stays closed and no white light is switched on In addition to get best results avoid vibrations caused by people passing by or heavy loads being moved on the floor close to the system To interrupt an exposure click on the red BREAK label in the Expose Design window 3 HEIDELBERG INSTRUMENTS PG 101 User Manual D Unloading 1 If the option Auto Unload after Exposure was selected after the exposure is finished the write lens is automatically retracted to the upper position and the stage moves to the unloading position Otherwise a dialog window opens asking if the substrate should be unloaded Click Yes to unload 2 Wait until all movement has stopped
17. develop the plate no etching no stripping and inspect the structures at position 0 2000 14 Examine the offset at the nonius scales close to the alignment mark The pitch difference between the two rulers of each nonius is 1um meaning that each division by which the match of lines is shifted from the origin means 1um offset error In the example shown below the X offset is approx 4 5 divisions Y offset is slighty above 2 divisions but not yet 2 5 So the Laser Offset Calibration parameters should be adjusted to X 4500nm and Y 2250nm EetEEEEEEEREEEEEKEEKEKEEEEEEKEKKLKEEEULEEERKER OUR Tann 15 Again select Laser Offset Calibration from Tools and enter the new offset parameters in nm 16 Repeat aligned exposure of design CamOffset2 This time use position 0 4000 or any unused position after alignment fails at position 0 0 17 If overlap is not satisfying adjust Laser Offset Calibration parameters again and repeat exposure until the center lines in each nonius match eee a le 63 HEIDELBERG INSTRUMENTS wuPG 101 User Manual System Utilities and Tools Further elements of the main menu allow to run maintenance and troubleshooting tasks or to directly address certain system components e g to change the system state after an error has occurred MENU UTILITIES Standard Mode e Adjust menu default values Akanesi Expose Focus Series d Tools gt Menu defaults saves the current settings chosen in
18. four feet Check with a spirit level if it is leveled If adjustment is necessary release the countering bolt of the system foot that has to be adjusted with a 19 wrench Using a 10 wrench adjust then the height of the foot according to the spirit level Figure 4 Lithography Unit leveling HEIDELBERG INSTRUMENTS PG 101 User Manual 4 With a 2 5 Allen key and the provided screws mount the bottom cover plates 5 Set up the Menu PC within 3m of the lithography unit Please refer to the PC manufacturers manual for details on the setup 6 Position the supply unit within 1 5 m of the lithography unit Make sure the unit is set to the correct voltage rotary knob below the power plug on the back side of the power supply Otherwise the system can be damaged 7 Install the connections between the lithography unit and the supply unit using the 1 5 m power cable and the two 1 5m hoses see following pictures Note All hose connectors allow fast and simple connecting Just push the hose into the connector To remove a hose push back the blue ring to release it and at the same time pull out the hose Figure 5 Voltage selection knob a System power connection Figure 6 System power connection from supply unit left to lithography system right b Compressed air for autofocus system 4 mm inner diameter hose i j Figure 7 Compressed air autofocus supply unit front left to lithography unit back right H
19. origin should be defined and or if two marks should be used to detect not only the position but also the rotation of the previously exposed pattern in this way Find Plate Center Here an automatic routine measures plate position and rotation by detecting the edge positions with the autofocus system Manual Offsets Manual Rotation Via these controls values can be entered to shift and rotate the design with respect to the plate center and orientation The details of each method and how it is used are explained in the Alignment Methods section After alignment has been executed the results are shown in the Offsets and Rotation frame If a new method is used the previous result is dismissed automatically To combine two methods of alignment like manually adding a shift after a Find Plate Center routine it is therefore necessary to note down the previous result and add it to the next modification that is required 1 In the Manual Alignment window select the method that should be used for alignment 2 The following panel within the window is exclusive the particular alignment method Follow the instructions as given on screen or in the following section Confirm the alignment result to return to the alignment method selection panel If required modify the alignment results Click Next to continue So eS The Expose Design window opens Here all PG101 Exposure Wizard tum Mode options and parameters are displayed for F
20. point accept the new values with OK or discard them with Cancel Standard calibration values um per pixel m 1 um Mode 3 um Mode 0 3 0 03 0 8 0 05 0 3 0 03 0 8 0 05 60 HEIDELBERG INSTRUMENTS PG 101 User Manual LASER OFFSET CALIBRATION lf exposures should be done relative to existing structures it is necessary to know the position of the laser beam relative to the center of the camera image which is the reference point for the alignment measurements If this calibration is not valid it will lead to a systematical shift in the overlay X 520um Y 520um 1 a 4 a ul ui ulu vu Tu cial Y Be X E 1 a L a i fu ul ui ul vu Tu ul ui lu um lu III II 11 II II II II II UI HI IP HI HI FEJEI UI DI TUNY Steps of a Laser Offset Calibration procedure TEBE Advanced Expose Focus Series i 1 Execute a Camera Calibration l Expose Energy Series Camera Calibration 2 Select Laser Offset Calibration from Tools of menu bar k Enter O um for both Laser Offsets Sa Show Camera 3 Expose Design CamOffset1_x6 cif scale 1 in standard mode In this design above shown structure is exposed six times in y direction at x 0um y 6000 4000 and 2000 Position x 0 y 0 is intentionally left blank 4 Develop substrate and replace on stage as good as possible Use stage pins 5 Load overlay design CamOffset2 cif sca
21. templates from the routine by error handling Wizard 51 HEIDELBERG INSTRUMENTS PG 101 User Manual clicking Clear under each thumbnail or click on Back and select a different alignment method lf an automatic alignment routine has given good results it can be saved using the Save button and reloaded during another job run with the Load button However especially if substrates have a thick resist coating it is not sure that the routine will work as well on the next plate Once an alignment sequence has run succesfully the results for shift and rotation are shown in a dialog window Click OK to confirm The Setup Automatic Alignment panel closes and the wizard returns to the Manual Alignment window 92 HEIDELBERG INSTRUMENTS PG 101 User Manual Grayscale exposures on uPG101 Grayscale exposures can only be done with BMP format designs When preparing such exposures keep in mind that the data conversion rotates BMP designs by 90 degree clockwise e CIF amp DXF loading side Data View Stage View e BMP loading side Data View Stage View In principle gray scale exposures can be done in the same way as usual exposures However due to the limits in positioning accuracy especially stripe connections might exhibit increased surface roughness Each design is written stripewise putting together stripes of 8 pixel width each If between one stripe and the next position coordinates have drifted slightly
22. test sample and examine the exposures to determine the best energy When the test is finished click on Exit to close the window 56 HEIDELBERG INSTRUMENTS PG 101 User Manual The uPG performance pattern resolution pattern circles 9um block grid 1 10um Siemens stars o wi mn Sm um SOOM Spam gum Hemoa pattern FOCUS SERIES o Tools Advanced 2 e In a similar way as for the energy the best position of the write spot focus can be determined by executing an exposure series only camera Calibration useful in 1 um mode systems A procedure for this IS Laser Offset Calibration hr preprogrammed in the wizard ee 7 j Show Camera H wg Open the Tools menu and select Expose Focus Series A window similar to the one for energy series opens Enter the usual exposure energy used for that kind of substrate into the top part of the window Execute Focus Series Next choose which type of series should be run A Coarse e e i Please adjust energy focus series will run an exposure series through the full 3 au nergy Factor x1 e value range of 0 40 with a change of focus value of 4 ose mm 7 between the steps Please choose type of focus series Coarse foc 4 increments If Fine is selected a starting value has to be entered into Fine se tinemens staring attec 20 the input box and 11 fields will be exposed with a change Please load stage with test sample
23. the wizard as default settings checkboxes energy Camera Calibration jE values i Laser Offset Calibration T e Show camera window Set Menu Defaults Expose Energy Series Show Camera Tools gt Show Camera opens the camera window same m function as Show Camera in the Control Panel e Shutdown uPG 101 Tools Advanced Exit gt Shutdown uPG 101 completely shuts down the ae uPG 101 system Shutdown uPG101 Advanced Mode e Open Control Panel m 7 Show Control Panel i Advanced gt Show Control Panel Opens the Control E Panel that gives access to numerous direct system Reset System controls regarding stage write head and camera system Make System Backup See below for a description of the panel en e Test Alignment Accuracy Advanced gt Test Alignment Accuracy runs a test on positioning stability The camera window opens and the wizard changes to the stage control interface Use the Load Substrate button to start a standard loading procedure and load a substrate with a clear structure same rules as for the camera calibration procedure Once loading is finished move that structure into the image field of the camera using the Move To X Y function if the position coordinates relative to the stage center are known and the square buttons around that for fine positioning or if the structure has to be searched Position the structure in the center of the image field and start the test by clicking
24. this may already be visible in gray value exposures although it does not show in 2D To overcome this limitation and also in general if the structure surfaces are not sufficiently smooth the following procedure is recommended where the exposure is done four times with shifted stripe connection positions 53 HEIDELBERG INSTRUMENTS uPG 101 User Manual RECOMMENDED GRAYSCALE EXPOSURE PROCEDURE 1 Prepare your BMP design taking into account the clockwise rotation that will happen during conversion In this instruction a AAHH BMP design of the character F with an original size of 10x16 pixel Erre 2 stripes is used as an example OEE 2 Based on this design prepare a set of 4 BMP files with additional epenmegp pixel rows grayvalue 0 at top and bottom according to the TT following table and illustration Additional rows for example Bmp No 1 Orowsatbottom 8 rows at top Bmp No 2 2 rows at bottom 6 rows at top Bmp No 3 4 rows at bottom 4rows at top Bmp No 4 6 rows at bottom 2 rows at top ARE u n ji ji Bmp No 1 Bmp No 2 Bmp No 3 Bmp No4 white area grayvalue 0 blue area value required by design any value from 1 to 100 The final size of our example design is now 10x24 pixel 3stripes While the rows at the bottom serve to shift the design in steps of 2 pixels through the stripe the additional pixels at the top of each design are required because all designs have to have the same size and the height s
25. 1X500Y7 50D01 G03X 30Y5001250T0DO1 GBIXT2907900D02 G0O1X750Y600D01 GUSxX7007Y 2007 50001 5S0D01 COX 125076 00D0T SO2ZX1250290 0150 0 I 150 BR T gt GO LX 1250 EAU 0DU2 GOLX750Y1 100D01 G02X750Y1400I250J150D01 GOLXI 2507 110001 GOSXZI2502714209 7 2503150D01 G01X73071000D02 GOIX1250Y1050D01 G2 E 950 L200J50D0L Ga G01X750Y1000D01 MO2 Some of the commands in this example are added only for Viewer compatibility and are ignored by the uPG 101 These are marked in red and will not be explained Each Gerber design starts with some general statements about number formats and scaling Within the commands only integer numbers are allowed as parameters To get the correct results the position of the decimal point has to be defined as well as the scaling between design units and the system unit 1mm in uPG101 After these initial settings the trajectory is defined path by path 22 HEIDELBERG INSTRUMENTS PG 101 User Manual Detailed command explanations SF SLAX32Y32 is a format statement FS The following characters and numbers denote the options that are defined in this statement and give the definition parameters e L following the FS characters indicates skipping of leading zeros Skipping trailing zeros T is not Supported e A following the L statement tells the conversion if coordinates are given in absolute A or relative values e X lt n gt lt m gt and Y lt n gt lt m gt gives th
26. EIDELBERG INSTRUMENTS PG 101 User Manual c Compressed air for stage air bearings 3mm inner diameter hose n d j 3 i Figure 8 Compressed air stage system supply unit front left to lithography unit back right 8 Connect the supply unit to the facility supplies using the supplied standard cable for the power and the 5 m braided hose for the compressed air nur KS 240V 120V d ON OFF POWER ON Figure 10 Main power line connection supply unit back Figure 9 compressed air inlet supply unit front 9 Hook up the facility vacuum to the lithography unit back side using the 5 m long 6 mm inner diameter hose Figure 11 Vacuum connection lithography unit back 11 HEIDELBERG INSTRUMENTS wuPG 101 User Manual 10 Establish network line connections LAN camera between the lithography unit back side and the Menu PC No hub is required Figure 12 Connectors for network and camera 11 Make sure the compressed air pressure at the facility outlet is 5 5 bar Connect the compressed air to the Supply Unit and check the values on the stage pressure regulator around 2 3 bar last used working point is written on the label and the autofocus pressure regulator around 1 5 bar Note down the exact values for future reference CAUTION Never touch the regulator for the autofocus pressure If the setting is changed a system service is necessary for readjustment of the
27. EXPOSURES E 32 EE EE 32 EDO SUNS POC COUE RVP PRA KVARNER ee 33 Steps Of a Standard Fx 00 SUNS PRE P EE 33 A Design Preparation ccccsssceccsssececeeeseecceeseeecseeeecseeeeessegeeessageeeesanseeessageeeess 33 B SUID SI ae ell e POOR O O O nee 34 G OINI ene ee E ea O eee 36 O le E te ne POMO PPR E E O T 38 Steps of an advanced evposure 2 22 4400 00 00000 nene anna anna R RR Annan nn nn 38 A Design preparation sa aids do o o a kA p lka hd 38 B Substrate LO ell e nennen aa Eii 39 Exposure Le E 40 D ee TT PAPO een O P rer 42 OAC DE 44 Substrate Processing EE 44 ALIGNMENT ME HODS een een set aaa east 47 MANUAL SO zes E hend 47 Shift according to Camera Selection pomt 47 SHIFt according to measured plate posmton 48 Advanced alignment to camera image Semi automatic 2 poiNt nee 48 HEIDELBERG INSTRUMENTS PG 101 User Manual GRAYSCALE EXPOSURES ON UPG101 0 n nenene SSS SEEK KA 53 Recommended grayscale exposure procedure 4000000000000 en nene 54 EXPOSURE OPTIMIZATION UTILITIES 222222220002020202000000nn2222nnnnnnnnnnnnnnnnnnnnnnnnnn nun nnnnn 56 Since VE 56 Se 57 CALIBRATION PROCEDURES sen 58 Alignment quality check procedure 0000000000000 e n nen O han Annan nn 58 ENEE 60 Laser Offset Calibration E 61 SYSTEM UTILITIES AND te e 64 EVER UE 64 O76 01000 Rn WEE 65 o EE 66 TROUBLESHOOTING AND MAINTENANCE ooo eee eee
28. HEIDELBERG INSTRUMENTS User Manual PG 101 HEIDELBERG INSTRUMENTS PG 101 User Manual Table of Contents PREFACE eege 4 GOYEN USC asien ee ee ee nohou oba na 4 SEO MAN OM A ION PRO SE E R O A ne ee ee ee er RE 4 Related BR eet anne een 4 EE 5 SYSTEM DESCRIPTION eege 6 OO DAY a La 6 sijaa e Be KPO ste O PEP DOE EO O OVP E E E T CO LE 8 UNPACKING AND INSTALLATION 222222220202020200000000000000000000n0nnnnnnnnnnnnnnnnnnnnnnnnnnnnnn EEN 9 System Installati n INStIrUCHON ae ee ee 9 SYSTEM STARTUP AND SHUTDOWN 22222222222222200000nnnn2nnnnnnnnnnnnnnnnnnnnnnnnnnnn nn nn nnnnnnnnnnnnnnnnnn 13 SEENEN eeheeg 13 CICLO VWI WR EEE EG EINEN abeced NER P HEN E EES E E 13 Brea 13 DESIGN DATA ose ne nee ee 14 General design rules cceeceecccceccseseeeceeeeeeeaaeeeeceeeeescseeesseceeeeeeseeaeaeceeeessseeeaeeeeeeesssaaaeeeeeeess 14 Creating DXF ID SSIGINS aoc anne sense ne een er een 16 DXF Specific Additional Design Rules nenn 16 Creating CIF Designs E 17 CIF Specific Additional Design Rules 2 00 0000000000000 nan nana nn nn 17 Setting up a CIF Design for PG 101 17 Se 17 SIELLA EE 18 Eed 20 Creating Gerber Designs 0000020000000 R ana RR A Pana KK KK RKK PAKA K a KKK KRK RASA nn 21 Setting up a Gerber Design for PG 21071 21 Checking and previewing Gerber code near nenene 26 Creating REESEN eisen 27 BMP Specific Additional Design Rules nen 27 Creating a BMP Desian E 27
29. NSTRUMENTS PG 101 User Manual Exposure Optimization Utilities This chapter introduces features for the advanced user that help to find optimum exposure conditions It assumes a good knowledge of the instructions on exposures ENERGY SERIES For optimum exposure results the correct energy for a substrate has to be determined To avoid having to do many single exposures with manually changed energies the Expose Energy Series procedure was introduced Necessary exposure energies depend on type and thickness of the photosensitive coating reflectivity of the substrate and the developing process All these parameters have to be determined according to the intended application For more information on choice of substrate types and processing please refer to the corresponding publications on photolithography The energy series function is located in the Tools menu Tools gt Expose Energy Series Upon selection a window opens where Expose Focus Series the series can be configured Spore FnerayS i Camera RS k First select the basic energy settings The laser power range that 1355r Offset Calibration i can be used is noted below the input field In addition the lowest ws Show Camera pixel energy used in a fine series can be selected Next choose whether to expose a wide range energy Eer series ora small one Please adjust energy i E 5 mW 65 Energy Factorf 1 The coarse series exposes 10 fields f
30. P crosscheck In addition options for the exposure itself can be chosen upg_acc cif Energy 20 of 10 mW x1 Auto Unload after Exposure Once the exposure has finished the system automatically Rotation 0 322 moves into the position for unloading Show Control Panel Uni Directional mode Generally the uPG 101 exposes in bidirectional mode which means that m the stage travels back and forth and data is ee written during each pass In unidirectional mode only during forward movement data is written lt Back Net This leads to a better stability which is especially interesting for critical structures close to the Figure 41 Expose window resolution limit and 3D exposures Unidirectional Wizard advanced mode mode results in a longer exposure time exact increase depends on design size Y 432 um Expose Once all options are selected check again if air pressure is OK the lid is closed and no alignment pins have been left in the stage chuck Click Expose to start the exposure 43 HEIDELBERG INSTRUMENTS wuPG 101 User Manual During an exposure the exposure status is shown online in the window Make sure that during the complete exposure time the cover lid stays closed and no white light is switched on In addition to get best results avoid vibrations caused by people passing by or heavy loads being moved on the floor close to the system To interrupt an expos
31. Routines and subroutines consist of statements Each of these statements can be combined with parameters and is closed with a semicolon Start and end of a routine is denoted by the statements Definition Start DS and Definition Finish DF With the Start of a definition the scaling has to be defined The basic unit of the CIF format is centimicrons 10nm As only integers are allowed a scaling factor has to be used to define structures in smaller increments than this unit At the same time for large structures the scaling can be used to avoid large numbers Two reach both aims a multiplier and a divider have to be introduced by which the basic scaling unti aof 10nm is modified The general subroutine structure looks like this DS lt definition name gt lt scale divider gt lt scale multiplier gt lt statements gt DE In the example DS 10 I 10 lt statements gt DF all coordinates and sizes within routine 10 have the unit 100nm instead of 10nm allowing to drop one zero from all numbers Anywhere within a CIF design file comment lines may be added by putting the text within brackets this is a comment STATEMENTS All statements have necessary parameters and optional parameters Necessary parameters are listed between curly brackets optional parameters between square brackets The statement that interlinks routines is the CALL or just C statement C routine identification number
32. S PG 101 User Manual Start GIMP Select File New to start creating a new image You have to select certain properties for the new image Edit image size to 1000 x 1000 pixel Open Advanced Options by clicking on the button Select Color space Grayscale Optional To get real dimension information edit X Y resolution to 2500 pixel mm at 1um mode systems and 1000 pixel mm at 3um mode systems Click OK The editor frame opens where the setup of the design takes place In the top part of the Toolbox window select Rectangle Tool checkbox settings e g de select Rounded Corners Draw an arbitrary rectangle into editor frame Again in the toolbox frame edit rectangle Position to 0 0 and Size to 1000 1000 Now the rectangle fills the complete editor frame In the Foreground amp Background Colors icon click on the black rectangle The editor frame for Foreground color will open Fertannle Select Lal Figure 21 Color settings GIMP At R G and B enter value 20 O9O000 ID jj Im Kn UE HTML notation 141414 a m i LLC In the lower part you will now find a listing of properties for the rectangle you are about to draw Adjust the Create a New Image Template Image Size Width 1000 er Height 1000 pixels v r Gi 1000 x 640 pixels 63500 ppi Grayscale Advanced Options X resolution 2500 000c gt Y resolution
33. T XT YT R XR YR MX MY e T If no options are used the structures of the subroutine will be arranged around the origin of the routine from which the call is made Alternatively the subroutine structures can be shifted with the T ranslation option combined with a set of offest coordinates XT YT written with just a space in between e R With the Rotation option the structure set of a subroutine can be rotated The coordinates define a vector with origin at 0 0 The x axis of the routine will be rotated until it is parallel to this vector and points in the same direction A rotation R 0 1 is therefore a clockwise rotation by 90 while R 2 1 will lead to a ccw rotation of 30 The coordinate set 1 0 is without effect vector along x axis Note that the turning point for rotation is not the origin of the subroutine but that of the routine in which the call is issued e MX MY These are options for mirroring at the x or y axis The mirroring is done with respect to the coordinate system of the calling routine not the internal axis of the called subroutine 18 HEIDELBERG INSTRUMENTS PG 101 User Manual In subroutines containing geometrical statements a definition is usually required to which layer these structures belong This is defined with the LAYER L statement Although the uPG 101 ignores layer information and merges all layers using an OR operation for viewer compatibility the information has to be given before a
34. age air bearings line Compressed air circuit for autofocus Manometer and connector for autofocus compressed air line Connector for stage air bearings compressed air line Ventilator Ventilation slits HEIDELBERG INSTRUMENTS PG 101 User Manual Unpacking and Installation The uPG 101 comes in one wooden crate Please open the container only in an indoor location and with utmost care During unpacking please check the contents 1 Lithography unit 1 Supply unit 4 Cover plates with screws 1 European or optionally US type main power cable 2 m 1 System power connection cable 25 Pins 1 5 m 1 3 4 inner diameter braided hose 5 m 1 compressed air connection adapter 1 8 mm outer 6 mm inner diameter hose 5 m 1 6mm outer 4 mm inner diameter hose 1 5 m 1 4 mm outer 3 mm inner diameter hose 1 5 m 2 Network cables 5 m 6 Alignment pins 2 sets 1 Windows PC with accessoires keyboard mouse PC manuals software 1 Monitor SYSTEM INSTALLATION INSTRUCTION 1 Garefully lift the lithography unit out of the crate WARNING Weight of main system is 120 kg We recommend that the unit ist lifted by four people To make uncrating easier the sides of the wooden box can be dismanteled and the system is packed without the lower cover plates 2 Place the lithography unit on the underconstruction Make sure the system is stable in Its position and can not be moved accidentally 3 Check if the lithography unit stands firmly on all
35. an alignment seguence for manual or semi automatic detection of one or two alignment structures on the plate he offset and if 2 point alignment is used rotation required to match the design to the real plate position and orientation are then calculated from the results and transferred Semi automatic detection of alignment structures is done via comparison of the contents of the camera image field with a predefined sample image of the structure alignment mark template It gives a more precise and repeatable result than manual detection For this image detection to work properly each stucture used as alignment mark has to fulfill certain properties e The structure should be simple recommended cross L shape or square e The structure size has to be at least 20um e No similar structures may be within or close to the image field 200x200um e f two structures are used they should be as far apart from each other as possible to increase accuracy of the angular error detection 48 HEIDELBERG INSTRUMENTS PG 101 User Manual e Exact coordinates have to be known for a point of the structure that can be precisely marked with a crosshair e g center of a cross with narrow lines corner of an L shape or sauare Different structures can be used for the two marks 1 In the Manual Alignment window click on Advanced Alignment The Setup Automatic Alignment window opens Set the checkbox for Mark 1 to selected Click on P
36. and of focus value between the exposures of 1 This series should be run if a coarse test has already been done and a structures trom toon0 to 40 step foc 4 rough value is known It test in a smaller range but with more precision Load Sample Execute Series press execute to start eady The chosen settings are displayed and a substrate for the exposure can be loaded Click on the Load Sample button to start the standard loading procedure as explained in the section on exposures and follow the instructions in the wizard Once the loading process is finished click on Execute Series to start the exposure series Now the standard uPG performance test pattern is exposed in a column of 11 fields Each of these fields is exposed with a different focus the highest one being at the top right in stage coordinate system the lowest at the bottom left in stage coordinate system Once the series has been finished unload the test sample and examine the exposures to determine the best focus value When the test is finished click on Exit to close the window o HEIDELBERG INSTRUMENTS uPG 101 User Manual Calibration Procedures For optimum exposure results it is recommendable to repeat certain calibrations occasionally especially before critical exposures All instructions in this chapter assume that the operator is well aquainted with standard and advanced exposure procedures ALIGNMENT QUALITY CHECK PROCEDURE Desig
37. at should be used for calibration into the center of camera image No Execute Camera Calibration other similar structure should be within the image A EC field even if the structure is at the very edges Of peaseagust Mrs PE sum the field Use Move To X Y if the coordinates ee EE relative to the stage center are known and use Calibrate the square buttons around this for fine zu eg a positioning or to search for the structure if the A position coordinates are not known Venten Fees Press Calibrate to execute Camera Calibration S EaR 4 In the next step a template is created estResut Tags umn automatically from the structure positioned at the center 5 The stage will move the center structure to the corners of the camera image and try to detect it with the help of the created template For each stage position the position in the camera field is noted where the template was found Finally a X and Y Camera Calibration factor will be calculated from this and displayed in a dialog box Click OK to accept the new calibration parameters or Cancel to auit the procedure without updating the parameters 6 If calibration fails it can be repeated in Manual mode Select the checkbox manual In each stage position you will now be reguested to manually move the crosshair in the camera image to the position of the structure Confirm each point with middle mouse click After the last
38. ating system of the uPG system When this is finished click OK in the dialog window The wizard will close Switch off the uPG system using the On Off switch on the supply unit 19 Wait 20 seconds Switch on the uPG system lf required eg because of communication problems reboot the User PC according to the manufacturer s instructions It is required to wait for at least 5 minutes before opening the Exposure Wizard With the wizard the camera software HI Vision starts and creates a minimized window Do not close the camera window while the wizard is running otherwise the wizard may crash lt is recommended to wait for at least 20 minutes for the system to warm up and stabilize before doing an exposure HEIDELBERG INSTRUMENTS PG 101 User Manual Design Data The uPG 101 can expose designs defined in several different formats Each of these formats is implemented for different purposes o DXF GDSII Standard formats for dense binary 2 dimensional designs o CIF Caltech Intermediate Form easy to use language for direct definition of binary 2D structures in a text file Good for fast definition of simple test structures without use of a special design program o BMP Standard MS Windows Bitmap format This is the only format useable for grayscale exposures 3D resist structuring o Gerber only with vector mode option A common format in lithography Required for vector mode exposures Not usable for scanning exposures
39. cal during etching where air might be caught in small structures or round holes in the resist preventing them from being etched into the layer beneath 46 HEIDELBERG INSTRUMENTS PG 101 User Manual Alignment Methods By default the uPG 101 exposes designs such that the center of the design usually coincident with the design origin is exposed to the position where the center of the plate should be if loading was done properly with respect to the alignment pins If a different positioning on the plate is required or the plate is not positioned well enough the design can be shifted by adding or substracting an offset in x and y respectively and or a rotation angle if required In the Manual Alignment window several functions are offered to set shifts and rotation angles for the design either manually or according to measuremenis Note Alignment methods can not be combined Whenever a new method is started the previous result is discarded Note For a precise positioning of a design with respect to existing structures camera related methods it is important that the Laser Offset Calibration and the Camera Calibration are correct If you encounter a systematic shift in exposures with automatic alignment to existing structures perform the calibrations as explained in the chapter on Calibration Procedures MANUAL SETTING With the controls Manual Offsets and Manual Rotation it is possible to directly enter values by which the desig
40. ch a cover while the system is energized RELATED DOCUMENTATION Heidelberg Instruments offers further manuals related to the machine and its operation lf you did not get one of these or need an update please contact Heidelberg Instruments Mikrotechnik Germany e Preinstallation Guide Environmental and electrical requirements sizes and weights of components etc HEIDELBERG INSTRUMENTS uPG 101 User Manual CONTACT should you need assistance please call Heidelberg Instruments during normal business hours CET Phone 49 6221 3430 0 Fax 49 6221 3430 30 or contact your local service office China Heidelberg Instruments Service China Rm 101 Block 1 Animation Park Yuehai Street Nanhai Road Nanshan Distr Shenzhen 518045 China Phone 86 755 8301599 1 2 7 Fax 86 755 8301599 4 Taiwan Heidelberg Instruments Service Taiwan 5F No 174 Chung Yang Road Hsinchu City Taiwan Phone 886 35311 304 284 Fax 886 35311 243 Korea Heidelberg Instruments Service Korea 316 Expo Officetel 381 Mannyeon dong Seo gu Deajeon 302 834 South Korea Phone 82 42 482 1668 Fax 82 42 482 1669 Japan Heidelberg Instruments Service Japan Germany Center for Industry amp Trade 1 18 2 Hakusan Midori ku Yokohama 226 0006 Japan Phone 81 45 938 5250 Fax 81 45 938 5251 USA Heidelberg Instruments Inc USA 2807 Oregon Court Unit E2 Torrance CA 90503 USA Phone 1 310 212 5071
41. dentifying the end of the file M01 MO2 or MO3 may be used without difference In the uPG 101 any statement containing the letter M will terminate the parsing of a Gerber file CHECKING AND PREVIEWING GERBER CODE In order to check a Gerber design file in principle any Gerber viewer can be used as long as above mentioned compatibility additions have been made Still some viewers might still have difficulties with the restricted file format the uPG 101 requires Best results were achieved using LinkCAD or the Online Gerber Viewer http www gerber viewer com 26 HEIDELBERG INSTRUMENTS PG 101 User Manual Creating BMP designs 3D exposures require a file format where for each pixel within the design area a depth can be defined in the form of a grey value This is given in the bitmap format The uPG 101 offers 100 different intensity levels that can be addressed by the grey values 0 100 in an 8 bit greyscale format The bitmap format also has some specific rules that have to be taken into account in addition to the general ones when setting up a design BMP SPECIFIC ADDITIONAL DESIGN RULES e Greyscale Format For grayscale exposures use 8 bit greyscale format and only values 0 100 All values above 100 will be interpreted as 100 O has to be used for areas with no exposure 100 means maximum exposure dose and thus maximum depth For designs that reguire only 16 or less grey values also 4 bit grey value can be used This has th
42. e ADVANCED TROUBLESHOOTING When informing a service office about a problem with the uPG 101 please incude the following Information on status of backplane power LEDs on top of system Information on settings of compressed air regulators Any error numbers and error descriptions provided by the wizard hs oh If available screenshots pictures of the problem or descriptive Se LEDs scetches e Run Advanced gt Make System Backup and send the folder C HIMT or at least the subfolder C HIMT Exposure Wizard System in archived form zip rar During consultation the following procedure may be recommended by the service office for further troubleshooting 1 Power down the system 2 Open the dark electronics cover at the back side 3 standing in front of the system the system mainboard is located at the left side Connect a monitor a keyboard and a mouse to the designated connectors of the integrated mainboard 4 Switch on the uPG 101 and follow the instructions of the service office Figure 51 Location of system main board WARNING Wrong use of this instruction may damage the system Do only do this at EXPLICIT request from your service office Figure 52 main board connectors 70 HEIDELBERG INSTRUMENTS wuPG 101 User Manual FUSES Types and locations of fuses used in the uPG 101 Below main power line 10A fast Figure 53 10A fast fuse at Supply Unit back MAINTENANCE Cleaning The s
43. e advantage that a bigger area can be covered as the file size is smaller e File size The maximum possible image file size in BMP is 4 GB In the above recommended setting for uPG 101 designs 8 bit greyscale this corresponds to 4 billion pixels or a size of e g 2000 x 2000 pixels The physical size of such a design depends on the configuration of the uPG 101 Note In 32 bit systems the maximum BMP file size that can be viewed is 3GB You can create bigger files if you have the necessary tools but you will not be able to load them into any viewer However the uPG 101 does not have this limitation and will expose the design e Orientation The design has to be created in a 90 counter clockwise rotated version as the design will be rotated 90 clockwise during data processing This is due to the fact that in the BMP format a design is described in rows while the uPG 101 writes in columns To save conversion time and memory BMP designs are therefore exposed in rotated orientation CREATING A BMP DESIGN There are numerous different programs available for BMP design creation However most options required for creation of BMP design files for the uPG 101 are similar in all programs As an example the setup of a BMP greyscale design with GIMP is explained in the following GIMP is a freeware software available at http www gimp org The example shows the design of a 5 step pyramid using GIMP 2 6 8 27 HEIDELBERG INSTRUMENT
44. e number of digits in front of and after the decimal point for the X or Y coordinate respectively Since skipping trailing zeros is not supported the lt n gt value has no effect at all In the given example leading zeros are skipped and absolute coordinates are used The decimal point has to be set between the 2 and the 3 character from the end of a number e g 1250 gt 12 5 750 gt 7 5 SMOIN is a mode statement MO It defines the scaling between Gerber units the base unit within the design file and metric units e MOIN sets the scaling factor to 25 4 from Gerber to metric units inch units are used for coordinates e MOMM sets the scaling factor to 1 0 from Gerber to metric units metric units are used for coordinates SIPPOS added for viewer compatibility only G71 This is a G code the so called preparatory function code which are the codes that are used to select modes of writing for the following coordinate set s They specify how the coordinate data should be interpolated shape of the path in between and set various options concerning the interpretation of the given coordinates In this case the code selects the size of the unit value used from this command on e G70 Specify inches All coordinates following this statement are read as inch values e G71 Specify millimeters All coordinates following this statement are read as millimeter values Other G code types will be explained further dow
45. e specification range of the uPG 101 Standard substrates e for mask making to use e g in a stepper o soda lime or quartz plates depending on the requirements concerning temperature stability size between 2 and 5 maximum thickness 6mm flatness lt 20um chromium coating with anti reflection layer e g chromium oxide O O O e for direct writing on wafers o silicium wafers for other wafer types please contact the Heidelberg Instruments Customer Support on information if they are usable at all and recommendations on exposure and processing o size between 2 and 5 o maximum thickness 6mm o flatness lt 20um Recommended photoresist coatings e for binary exposures 2D on thin resists 5000 o S18XX A standard Shipley resist 51805 is a resist of this family that is well tested on Heidelberg Instruments lithography systems It can be spin coated to 0 5 um thickness o AZ15XX Clariant resists which are comparable to the S18XX Shipley family Recommended type is AZ1505 for 0 5 um resist thickness e for 3D resist structuring o AZ45XX A Clariant resist family for standard resolution quality AZ4562 can be coated to thicknesses of 6 um exact number depends on coating process other resists of this family are available for other thicknesses o AZ92XX Another Clariant resist family with higher resolution quality usable also with higher thicknesses 10 um For high resolution 3D exposu
46. e the design structure sizes by 1 2 um and increase the laser power until the exposed structure sizes reach the reguired size Energy Factor For some applications the energy of the installed laser might not be sufficient or the energy should be deposited in a more smooth way e g to improve edge quality For these cases there is the possibility of reducing the speed at which the system exposes In this way the same area is exposed over a longer time allowing to deposit more energy or to deposit the same amount of energy more slowly Available are a speed reduction factor of 2 x2 or 4 x4 Exposure time increases accordingly In addition in advanced mode a few Design Options are offered Inverted advanced only Per default the structures that were defined in the design are exposed on the substrate If the checkbox option nverted is selected all areas with no structure defined are exposed instead The limits of the exposure field are defined by the outmost structures plus what is given as frame Maximum value for the frame is 10mm Automatic Centering advanced only If the origin of the design is not located in the center of the structures an additional checkbox for the option Automatic Centering will appear Usually the wizard automatically shifts any design so that the geometrical center is exposed on the center of the substrate regardless of where the origin is located Automatic Centering selected Ifthe Automatic Centerin
47. esign rules and lens resolution try higher energies use fresh developer Problem Plate is completely exposed Possible causes stray light old materials Remedies check for possible stray light sources and eliminate them use fresh batch of plates Problem Some structures are missing Possible causes structures do not comply with design rules or are too small chrome etch old air bubbles in structures during etching Remedies check design against design rules and lens resolution use fresh chrome etch avoid drying of the substrate between developing and etching or water the plate thoroughly before etching Problem Design is shifted Possible causes wrong selection of design origin plate not pushed properly against alignment pins wrong entry of design shift in manual alignment wrong camera calibration automatic alignment and manual alignment to structure only wrong laser offset calibration automatic alignment only Remedies check design check wizard entries do camera calibration and laser offset calibration 69 HEIDELBERG INSTRUMENTS PG 101 User Manual Problem Design looks completely mixed up Possible causes vacuum off Remedies check vacuum pump and vacuum on stage Problem Design stretched or shrunk compared to previous layer Possible causes previous layer not exposed with uPG coordinate system untis do not match Remedies shrink or stretch design to compensat
48. fined set aa awa meas the checkbox Mark 2 to selected Click on Pos to enter the position of the second alignment mark with respect to the plate center zI 7 Mark 1 W i i 45 If a template should be use for detection of this 29 mn structure follow the instructions given in step 4 also EE for this mark lt 2 e z m c aan Pos Click on Execute Alignment The alignment T procedure runs in the predefined way either ail Save prompting the operator to manually point to each W execute Fiteve mark or detecting the marks using the predefined m templates m za Manual Detection The panel changes to show the controls necessary for manual marking of the point Figure 47 Advanced alignment of interest setup example Wizard 90 HEIDELBERG INSTRUMENTS PG 101 User Manual If the reference structure is not within the field of view or the image in the camera does not have a good contrast use the Show Control Panel button to open the Control Panel and move to the structure adjust camera settings For a description of the functions of the Control Panel see the corresponding section in the chapter on System Utilities and Tools uPG101 Exposure Wizard lum Mode ST Heidelberg Instruments Mikrotechnik GmbH HIVision Version 2 1 180 Adjust Cross to POI and press center button s SLNAWOYLSNI qh DY34140I3H Cancel lt Back Exit
49. g option is deselected the design will be positioned so that the origin is exposed on the center of the substrate Note Take care that no part of the design is shifted out of the write area Click on Show Control Panel if the Control Panel is not open In addition to the standard and advanced options in the wizard panel advanced options regarding focussing can be selected here Piezo setpoint adjustment defocus With the arrows labeled Piezo in the Writehead frame the position of the writehead objective can be slightly adjusted by influencing the signal to the piezo that holds it at constant distance from the substrate surface This adjustment leads to a change of focal point position It can be necessary e g to compensate effects of resist thickness back reflections or system focus drifts To find the best focus value for a substrate type it is recommended to run a Focus Series first Please refer to the chapter on Exposure Optimization Utilities for instructions on this The number between the arrows shows the current set position change in arbitrary numbers value range is O 40 Selecting or deselecting the fine checkbox toggles between change in single steps or steps of five Manual Focus The automatic focusing system does not work for substrates smaller than 1 For exposures on such substrates focusing can be done manually according to the camera image CAUTION Use this option carefully Never let the write head touch t
50. he substrate Wrong usage may result in severe damage to the eguipment 41 HEIDELBERG INSTRUMENTS PG 101 User Manual Once the Manual Focus checkbox is activated the Wehead Steppermotor functions are replaced by arrows for manual control of the write head stepper motor and the autofocus system is fixed From the Camera frame use Show Camera to open the camera window and watch how the substrate comes into focus while moving down in coarse steps 300 Change to fine steps 30 as soon as the image starts to change Figure 39 Write CAUTION Using the coarse movement option to long head movement increases the risk of hitting the substrate and damaging Controls the eguipment severely Use the Piezo defocussing arrows for fine tuning when a position close to the focus is reached Fix Piezo Usually a piezo controls the objective position at all times during an exposure to keep the distance to the substrate surface and thus the focal point position constant at all times autofocus However the distance measurement does not work close to regions with sudden changes in height herefore if the exposure area comes close to substrate edges anywhere be it because of the design or because the substrate is small results might be improved by freezing the objective position after initial focussing in an unaffected area his can be achieved by activating the Fix Piezo checkbox This option can not be used in conjunction with the Manua
51. hould be a multiple of 8 pixels stripe width 3 Expose all four designs one after the other with exposure offsets compensating the file to file shift of the design position Depending on system pixel size 1um mode or 3um mode system the required exposure offset is different System 1 um mode 1 pixel 0 4 um gt shift size 0 8 um 3 um mode 1 pixel 1 0 um gt shift size 2 0 um 54 HEIDELBERG INSTRUMENTS PG 101 User Manual The exposure offsets have to be set to compensate the shifts with respect to the first design so the design is exposed always in the same position Exposure offsets in micrometer System BMP 1 de at 0 0 um no offset BMP 2 HU 370 i um at 2 0 um 2 Pixel offset in x BMP 3 1 6 0 um at 4 0 um 4 Pixel offset in x BMP 4 2 4 0 um at 6 0 um 6 Pixel offset in x Because the F structure is x shifted inside data the stripe edge locations relative to the F structure is different in each exposure Bmp No 1 Bmp No 2 Bmp No 3 Bmp No 4 Combined with the different exposure offsets of all 4 exposures all 4 F structures will again match in position The final distribution of all stripe edges after 4 overlapping exposures is In this way every position where a stripe connection is written in one exposure will be covered by three more stripes that are continuous at this point evening out the typical stripe connection roughness 99 HEIDELBERG I
52. ikrotechnik GmbH HIVision Version 2 1 180 Adjust box size and position and press mouse center button to accept Show Control Panel ee 49 HEIDELBERG INSTRUMENTS PG 101 User Manual When the mark is in good view click on Snap Image A box with a red cross in the center appears in the Camera Window Drag the red cross to the location of the alingment structure Resize the box by dragging the small blue squares so that the part of the structure that is inside is well recognizable Note The box should be as small as possible If the structure is bigger than 1 3 of the image field in any dimension only a characteristic and singular part of it should be selected Now drag the red center cross as precisely as possible to that point of the structure that corresponds to the previously entered coordinates The position of this small cross defines the later alignment position Therefore it is important that it is well positioned on that point within the structure of which the coordinates are known Figure 46 Examples for alignment of the alignment mark definition box to a structure left good alignment right bad alignment Confirm the position with a click on the middle mouse button mouse wheel The panel returns to the main panel of the Setup Automatic Alignment window and a thumbnail of the selected image is now visible in the template frame of Mark 1 If a second alignment mark should be de
53. l Focus procedure 3 After all parameters and options have been set close the Control Panel and click on Next D Alignment and Exposure By default No Alignment selected the origin Of the Leem Bposure Wizard ium Mode design which according to the design rules should coincide with the design center will be exposed in the plate center The accuracy of positioning is in 2 Camera this method given by the repeatability of loading against the alignment pins O The advanced exposure mode offers several Manual Manual methods of placing the design more freely and with higher accuracy on the plate These methods are BET Offsets and Rotation N called Alignment Methods On the one hand they Se ri ri give the possibility to change the theoretical position of the design on the plate On the other hand they can be used to measure plate position and rotation and adjust the exposure position of the design to it Figure 40 Manual Alignment The available methods are window Wizard advanced mode Camera Using the camera a specific point on the plate e g a feature on an existing layer can be selected as origin for the exposure coordinate system 42 HEIDELBERG INSTRUMENTS PG 101 User Manual Advanced Alignment Like the Camera method the Advanced Alignment method is useful to align to pre exposed structures It can be used if the structure that should be used is not in the position where the
54. le 1 activate Advanced Options and select Automatic Alignment 61 HEIDELBERG INSTRUMENTS PG 101 User Manual 6 Create a template of the center mark of the design at position x 0 y 2000 see section on Alignment for details on how to set up an advanced alignment data set center of the alignment mark Otherwise an undefined exposure offset will occur 7 Create a one point alignment procedure with this template and enter the position coordinates 0 0 See section on Automatic Alignment for details on how to setup an alignment procedure 8 Save alignment procedure 9 Proceed to final step and expose design CamOffset2 with alignment option activated 10 The system starts the alignment procedure at position 0 0 and will fail as required as position 0 0 of the substrate is blank A dialog will request to move stage camera view to the position of the mark Click on the Move To button and enter position x 0 y 2000 Fine position the stage until the center mark is in completely in the camera viewer field and press Continue 1 h Now alignment is repeated at the new position and the mark is should be found A report shows the offset parameters calculated from the measurement that will be used for following exposure As it is a single point alignment rotation is zero 12 Accept the reported offset The exposure will start 62 PG 101 User Manual 13 After the exposure is finished
55. lignment pins placement 4 Make sure the resist coated side of the substrate Is HEIDELBERG INSTRUMENTS PG 101 User Manual turned up and position it against the alignment pins lf the substrate bears alignment marks that should be used for exposure note that the coordinate system of the stage is oriented such that the x axis corresponds to a backward forward movement while the y axis corresponds to a left right movement when standing in front of the machine see Figure 29 If a vacuum region bigger than 2 is required activate the required vacuum region extensions using the vacuum field loading side adjustment screws 4 see right part of Figure 28 Figure 30 Stage coordinate and Figure 30 Switch on the vacuum with the system vacuum turn knob 5 Check whether the plate is really held tight by trying to move it slightly sideways If plate is not held switch off the vacuum and clean plate backside and chuck before trying again If problems persist use a different subtrate 5 Remove all alignment pins Close the cover lid and selected deselected make sure the interlock lamp is off O D CAUTION If the alignment pins are left on the stage a during exposure of a thin substrate the system can SITT 21 vacuum region selection take serious damage 6 Click OK in the Loading Status window The stage moves to the center position and the write head moves down until the focal point is on the substrate surface
56. lters Windows Help FLE pow 56 7 W Background 8 7 MB Figure 24 BMP gray level pyramid GIMP 30 HEIDELBERG INSTRUMENTS uPG 101 User Manual 14 Select File Save As enter name and choose place where file should be saved Expand frame at File Type and choose Windows BMP image Click Save In the following dialog window do NOT activate Run Length Encoded compression Simply click Save again Save Image D level pyramid bmp Browse For other folders 5 upgidt My Documents Create Folder Places Mame Modified Recently Used PS upg101 E Desktop H 31 Floppy o w Local Disk CH 2 DYD RAM Driv voll on DATA systems on C 5 My Pictures PS My Documents ove JAll images L E Select File Type Windows BMP image File Type Extensions Tara image tga TIFF image tif tiFf TIFF image Windows BMP image bmp x BitMap image bm icon bitmap A PixMap image xpm window dump xd z5oft PCs image pex pec Figure 25 Saving BMP file GIMP 15 A green status bar below will inform about saving progress 16 Quit GIMP by choosing File gt Exit 31 HEIDELBERG INSTRUMENTS PG 101 User Manual Exposures CHOICE OF SUBSTRATE To do lithographic exposures subtrates and especially the photosensitive coating of the substrates have to be chosen according to the intended application In addition the specifications have to fall into th
57. ly one text font is provided Courier like typewriter font This will replace any other font used in the design creation The only supported text attributes are rotated mirrored and scaled Lines Lines with width must not change their linewidth tapered lines not allowed Linewidth changes within a line will be at best ignored at worst they can cause conversion errors Polygons Polygons have to be defined as closed Open polygons will be ignored Blocks o When inserting blocks the same scaling has to be used for x and y o External blocks are not supported HEIDELBERG INSTRUMENTS PG 101 User Manual Creating CIF Designs The Caltech Intermediate Format CIF is a design format for direct creation of designs in a text editor For complex structures it is more recommendable to use a professional CAD software that can create AutoCAD compatible DXF design files but if only small test structures should be set up they can be easily defined and varied in a CIF design file There are a few rules that have to be taken into account in addition to the general rules when setting up a CIF design for a uPG 1010 CIF SPECIFIC ADDITIONAL DESIGN RULES e Layers Use only one layer If several layers exist in a design file only the layer with the maximum number of structures will be written e Calls Maximum reference depth is 50 meaning that not more than 50 subroutine calls may be nested into each other e Main structure definiti
58. ment an adjustment of the focus position or other manual modifications STEPS OF A STANDARD EXPOSURE A Design Preparation Prepare the design in the required format as described in the previous section Make sure the design complies with all design rules given above the general as 1 well as the specific If the design is not accessible via network from the Menu PC transfer it to the uPG 101 PC e g using a memory stick or CD Any freely accessible directory can be used Start the uPG 101 Exposure Wizard using the link icon on the desktop D Note At least 5 minutes must have passed since power up or reset of the main system before the Exposure Wizard may be started Otherwise communication errors will occur making a reboot of the Menu PC neccessary The Welcome Screen opens showing the progress of the connection and initialization sequence This takes approximately two minutes Once the startup sequence is finished you can select between a standard and an advanced exposure process with a checkbox For standard exposures just click on Next r uPG101 Exposure Wizard lum Mode Heidelberg Instruments Mikrotechnik GmbH c 2006 Version 3 9 3 Cd ICH Z 7 ei X lt m Ve eh Eu This Wizard will guide you to expose a design on your PG Please press NEXT to continue press BACK to return to the previous step Figure 26 Startup window Wizard 33 4
59. n EE er 0 00 G54D10 Aperture definition code and preparatory function code for the aperture definition added for viewer compatibility only As the uPG 101 has only one writing beam any aperture codes are ignored when a Gerber design is translated into the machine code However Gerber viewers need at least one aperture definition at design start 23 HEIDELBERG INSTRUMENTS PG 101 User Manual From this point on the structures are defined G75 G code for setting of the interpolation mode used in circular interpolation definition of curves e G74 Disable 360 circular interpolation single quadrant mode e G75 Enable 360 circular interpolation multi quadrant mode In this case the multi quadrant mode is defined This means a circle can be drawn in one stroke Single quadrant mode is required for systems that can not handle signed coordinates for the circle center definition The uPG 101 however can handle these so there is usually no reason to use a different interpolation mode than multi quadrant mode G75 GOTX750Y500D02 This command is a standard command sequence for a straight line e G01 a G code denoting that movement should be done in a straight line linear interpolation between current position and target coordinate e X lt x gt Y lt y gt target coordinates for the movement Only the coordinates that change have to be listed e D01 D02 A code which denotes if the path should be exposed 01
60. n should be shifted rotated during exposure preparation SHIFT ACCORDING TO CAMERA SELECTION 1 POINT 1 Inthe Wanual Alignment window click on Camera uPG101 Exposure Wizard 3um Mode Heidelberg Instruments Mikrotechnik GmbH HIVision Adjust cursor to offset position and press mouse center button to accept Select ffset Cancel lt Back Next gt Exit i PRTTTTTTITITTIITIIr r Figure 42 Manual alignment via camera The Camera Window HiVision opens and the panel changes to show the controls necessary to find and mark the point where the design origin should be exposed 47 HEIDELBERG INSTRUMENTS wuPG 101 User Manual 2 If the coordinates of the reference structure relative to the stage center are known use the Move To X Y button to bring it into the image field of the camera For fine positioning or if the coordinates are not known use the square of buttons around Move To X Y to move the camera until the reference structure is well in the camera field Stage movement happens stepwise and the step size is selected in the list to the right of the button square When moving the stage keep in mind that the x axis buttons move the stage from back to front while the y axis runs parallel to the loading edge right to left In the camera image on the other hand the x axis is horizontal and the y axis vertical Tan um 300 um 1000 um Figure 43 Stage Control buttons
61. nana a K nene nen 68 F NCHONAL deier aus ee ee ee 68 Exposure Wizard error messages 68 Exposure result problemS en nnnnnnnnnnnnnnnnnnnnnnennnnnnnnnennnnnnnnnennnnnnnnnennn 69 Advanced Troubleshooting ern ee een 70 FUG EE 71 Male Tue 71 Doc No DWL HI 021 Revision 4 July 2011 Copyright 2011 by Heidelberg Instruments HEIDELBERG INSTRUMENTS PG 101 User Manual Preface CONVENTIONS USED Throughout this manual there are safety warnings To classify the degree of danger in each of these situations the following notation is used WARNING Advises that you risk danger to personal health if you do not follow instructions carefully CAUTION Advises that you risk damaging your equipment if you do not heed instructions SAFETY INFORMATION The uPG 101 is a class 1 laser product Opening of the optics cover turns it into a class 3B laser product WARNING The optics cover may only be opened by Heidelberg Instruments service engineers or trained personnel Unauthorized opening of the optics cover leads to immediate loss of warranty The uPG 101 is fused for 10A Electrical voltages of up to 230VAC and 120V DC are present within the system when it is connected and turned on WARNING Removing any cover of the uPG 101 apart from those explicitly stated in this manual can make lethal voltages accessible Only Heidelberg Instruments service engineers or trained personnel should perform any tasks that include the removal of su
62. ne movement activate via checkbox this is reduced to 30 Used to focus on small substrates where the autofocus does not measure correctly any more e Fix Piezo checkbox Activating this checkbox disables the autofocus Focussing is not possible with this option active he piezo arrows defocus setting still work Reguired for exposures close to substrate edges or on small substrates If Manual Focus is selected this option is automatically selected and can not be deselected CAMERA e Show Camera Opens the Camera Window HIVision e Gain adjustment arrows lf contrast is bad in the camera image it may be improved by adjusting the gain e Exposure time adjustment arrows By adjusting the exposure time over which the incident light is integrated before an image is created the camera gets slower and image intensity goes up Use this together with the gain adjustment to optimize contrast To close the Control Panel click on the X in the upper right corner 67 HEIDELBERG INSTRUMENTS PG 101 User Manual Troubleshooting and Maintenance This section contains advice on some possible problems that might be encountered during operation of the uPG 101 If you encounter a problem that can not be solved in this way please contact your Heidelberg Instruments service office see section Contact in the preface FUNCTIONAL PROBLEMS Problem System does not start at all all LEDs off Possible causes facility power down fuse
63. ng it On the down side it can round sharp resist edges and lead to rifts in the resist layer Again it depends on application and resist if a hardbake is required and recommendable and how it should be done Please refer to the resist manufacturers documentation concerning this e Etching In 2D masks the next step is to etch away the metal layer wherever it is accessible This copies the design from the resist layer into the metal layer creating a mask for further copies of the design onto other substrates with the help of e g flashes from a mercury vapor lamp There are different methods of etching The most common one is wet etching where the developed substrate after thorough rinsing is put into a bath of etch Etching time depends on the metal layer thickness and the etchant age etch usually can be reused many times until it is saturated If etching is done too short small structures are not opened or have irregular edges If the substrate stays in the etcher too long the so called under etching can happen where the etch reaches under the resist Causing irregular edges and bad linewidth stability e Stripping After etching and rinsing the remaining resist is removed This can be done by use of a solvent or stripper or by exposing the resist with a UV lamp for thin layers e g a facial tanner can be used for 10 minutes 12 hour and using the undiluted developer on it afterwards To remove any residual resist lsopro
64. no distance between them This will create data errors J re 10 7 P3 22 5 P1 0 0 P4 26 1 Figure 15 Polygon drawing rules Naming o Do not use special characters spaces punctuation marks umlauts in the design name o Do not use main as name for a layer cell or any structure General size limits Note There might be limits below these for specific formats o maximum design size 100mm x 100mm o 1 000 000 vertices polygon vertex defined point o maximum definition or reference depth 16 o maximum number of definitions or references 100 000 HEIDELBERG INSTRUMENTS PG 101 User Manual Creating DXF Designs DXF is a common graphics design format used by the well known AutoCAD software There is also other design software available that can export into DXF format and software that can translate between different design formats e g LinkCAD However whichever product you use make sure the resulting file format is 100 AutoCAD compatible Create designs according to the software manufacturers instructions taking into account the general plus the following additional rules DXF SPECIFIC ADDITIONAL DESIGN RULES Units he design has to be created in metrical units Structures Apart from the above listed structure types for DXF also text is supported Any other advanced structure types may not be supported It is recommended to only use circles polylines and text Text formatting On
65. ns are prepared on each uPG 101 that can be used to check the quality of pattern overlay when using the automatic alignment procedure and measure a systematical offset if there is one Steps of the Alignment Quality Check procedure 1 In standard mode expose the design CamOffset1 cif scale 1 mm A m X 520um Y 520um Be X E 1 a L a i fu ul vir lu vu Tu ul mit le ui N 1 a 4 a ul ut ulu ut DETE TEN Y III 11 II II II III COII II II IL EUF II 1 II 11 II Il 2 Develop substrate no etching no stripping and put it back on the stage Substrate can be placed intentionally with an offset and rotation to really test alignment auality 3 Load overlay design CamOffset2 cif scale 1 activate Advanced Options and select Advanced Alignment 4 Set up a 2 point alignment with two of the marks at the corners of the design selecting the center of each mark as reference In the example we use 520 520 for Mark 1 and 520 520 for Mark2 Use templates for position detection Note Watch carefully that center of the template definition box is in the center of the mark the position of the coordinate given Otherwise an undefined exposure offset will occur 58 HEIDELBERG INSTRUMENTS PG 101 User Manual If both marks are found the system will report the measured offset and rotation of the design Otherwise the position of the mark s has to be found manually
66. ny geometrical statements L layer name Layer names are generic denoting technology and layer e g CM for CMOS Metal The geometrical statements available for design structure definition are BOX B WIRE W ROUNDFLASH R and POLYGON P B XSize YSize XPos YPos XRot YRot defines a filled square e XSize YSize Defines the box size width in X height in Y e XPos YPos Defines the position of the box center within the current routine e XRot YRot he mechanism of defining a rotation for the box is the same as in the CALL command A vector with origin at 0 0 is defined by the coordinates of the end point and the structure will be rotated around 0 0 until the x axis is parallel to the vector and points in the same direction W Width X1 Y1 X2 Y2 X3 Y3 defines a polyline of fixed width e Width Defines the width of the line Lines with width O are ignored Generally lines should be larger than the spot size to make sure they are really drawn e X Y Coordinate sets defining the path drawn Lines between coordinates are always straight R Diameter XPos YPos defines a filled circle e Diameter Sets the circle diameter e XPos YPos Defines the position of the circle center P X1 Yl X2 Y2 X3 Y3 X4 Y4 defines a filled polygon e X Y At least three coordinate sets are required to define a polygon The polygon will be closed automatically HEIDELBERG INSTRUMENTS PG 101 User Manual
67. ols stage r Whitehead Camera SE rehen up Dam E upl ime on s fine Move Stage I ManualFocus I Fix Piezo Manual Focus Fix Piezo J L I L Figure 37 System control panel Wizard advanced mode From these controls choose To Load The stage moves to the loading position at the front of the machine 2 Wait until all movement has finished Open the cover lid On the chuck mount the alignment pins masks three wafers two in the appropriate positions for the plate size to be used see left part of Figure 28 3 Switch off all light except safe light Take a substrate out of its storage container Check substrate quality e Make sure the substrates comply with the specifications of the uPG 101 Size between 2 and 5 max thickness 6mm flatness tolerance lt 20um e Never use out of date substrates 39 HEIDELBERG INSTRUMENTS PG 101 User Manual e Do not use substrates with scratches on top or bottom visible contaminations in the resist or non uniform resist distribution in the area to be exposed 4 Make sure the resist coated side of the substrate is turned up and position it against the alignment pins If the substrate bears alignment marks that should be used for exposure note tha
68. on The subroutine with the highest number routine name will be taken as main routine SETTING UP A CIF DESIGN FOR PG 101 CIF designs are composed of several routines and subroutines The lowest subroutines contain the geometrical shapes to be used which can then be combined and multiplied in higher routines that call these initial subroutines and combine them with position information Several routines may call the same subroutines and subroutines may be called several times in the same routine and subroutine calls may be combined with definitions of geometrical structures in the same routine STRUCTURES This is an example for the structure of a CIF file lt Routine 1000 gt lt Call of Subroutine 100 gt lt all of Subroutine 200 in Position X1 Y1 gt lt call Of Subroutine 200 im Position X27Y2 with mirroring on y axis gt lt S broutine 100 gt lt Call of Subroutine 10 in Position X4 Y4 gt lt Call of Subroutine 10 in Position X5 Y5 with rotation gt lt Description of geometrical structure at X6 Y6 gt lt Subroutine 200 gt lt Description of geometrical structure at X7 Y7 gt lt Description of geometrical structure at X8 Y8 gt lt Subroutine 10 gt lt Description of geometrical structure at X9 Y9 gt E HEIDELBERG INSTRUMENTS PG 101 User Manual Here the uPG 101 will handle 1000 as the main routine as it is the routine with the highest name definition The final E denotes the end of the file
69. on Test Alignment Accuracy First a template of the center structure will be created Next the stage will move the structure away and back into the camera field several times and measure each time where the template can be found From the results the accuracy with which the structure returns to the point where it was is calculated standard deviation value Typical values are BEE 1 um Mode 3 um Mode Alignment Accuracy 64 HEIDELBERG INSTRUMENTS wuPG 101 User Manual A Heidelberg Instruments Mikrotechnik GmbH HiVisic Test Alignment Accu Please adjust structure to camera center and press Test Alignment Accuracy Template Reset system Advanced gt Reset System allows to reinitialize the menu and the stage if for any reason the motors were disabled or the coordinate system is mixed up Create a backup of the system software Advanced gt Make System Backup creates a backup of the software installed on the system itself not the User PC The backup is stored under C HIMT Exposure Wizard System Install a software upgrade package Advanced gt Update Software unpacks a software package that was copied to the User PC or is available via network Should only be used with HIMT support and after explicit instruction CONTROL PANEL The Control Panel is accessible from several points when working with Advanced Options Visible selected in the Welcome Screen At several poin
70. on supply unit blown see section fuses Remedies check facility power check fuse Problem Exposure does not start Possible causes air pressure low lid not closed properly software hangup Remedies check air pressure see system installation instructions on required values check on interlock lamp before starting a new exposure reboot system Problem Exposure was interrupted stage motors are disabled Possible causes air pressure low lid was opened motor capability to maintain stage speed against vibration shock was exceeded system is not well leveled Remedies check air pressure see system installation instructions on required values check on interlock lamp before starting a new exposure reset stage menu Tools gt Reset System check and improve leveling as described in the system setup section EXPOSURE WIZARD ERROR MESSAGES All errors messages of the exposure wizard include tips on how to find and solve the possible cause of the problem If these don t help shut down the system restart it and try again If the problem persists please contact your service office See above for contact addresses and phone numbers 68 HEIDELBERG INSTRUMENTS PG 101 User Manual EXPOSURE RESULT PROBLEMS Problem Plate is blank Possible causes structures too small energy too low developer too old wrong type wrong mixture laser off or damaged Remedies check design against d
71. oper chemicals If the energy dose was sufficient to enable the reaction through the complete layer after developing the surface of the coated substrate is accessible wherever the resist was exposed with full intensity In regions where the energy dose was below the limit only a part of the layer is removed thus allowing for three dimensional structuring of sufficiently thick resist layers Note In negative resist such as SU8 the developer removes the parts which were not exposed Developing times depend on resist type resist thickness and developer type as well as the energy dose used during exposure Typical developing times are 1 1 5 minutes for thin resists and around 0 5 minutes um for thick resists The combination of energy and developing technique can influence the quality of an exposure result strongly Using too high energy during exposure or using too strong developer makes the developing time very critical leading to plate to plate structure size variations On the other hand too low energy or too diluted developer can lead to angled and irregular resist walls causing bad linewidth stability and rough pattern edges The best combination of exposure parameters 44 HEIDELBERG INSTRUMENTS uPG 101 User Manual and processing procedure for a specific application has to be found by series of test exposures e Hardbake A hardbake can serve to better prepare the remaining resist layer for the next processing step by hardeni
72. os to enter the position of the first alignment mark with respect to the plate center lf no template was created the template image frame shows only the word manual In this state the position of the alignment structure has to be marked manually once the alignment routine is run With just one mark this corresponds to the previously explained Camera rountine If this manual detection should be used proceed to step 5 If the position of the structure should be detected by template detection click on Create below the template image window V Mark 1 Pos Create Clear M Mark 2 E Tr MM z uPG101 Exposure Wizard lum Mode mn manual manual 1 a Execute Fitlevel Alignment 70 lt Back E Exit Figure 44 Advanced alignment setup window Wizard The stage moves to the mark position the Camera Window HIVision opens and the panel changes to show the controls necessary to mark the region of the image that should be used as template If the reference structure is not within the field of view or the image in the camera does not have a good contrast use the Show Control Panel button to open the Control Panel and move to the structure adjust camera settings For a description of the functions of the Control Panel see the corresponding section in the chapter on System Utilities and Tools uPG101 Exposure Wizard lum Mode E Heidelberg Instruments M
73. ow opens The image is frozen and a green target cross appears Move the cross to the point of interest POI in the image field then middle click to confirm The selected point is moved to the center of the image field StagePos Shows the coordinates of the current stage position Stop Immediately interrupts any stage movement Reset Runs a stage reset and initialization routine WRITEHEAD Writehead up Moves the write head into the upper end position Focus Moves the write head down towards the substrate until the focal point is on the substrate and the piezo for autofocus adjustment is in center position Piezo adjustment arrows defocus Changes the objective position around which the piezo regulates Used to put the focal point into some different position than the resist coating surface or to compensate for drifts Range of values is 0 40 coarse movement step is 5 fine 1 66 HEIDELBERG INSTRUMENTS wuPG 101 User Manual e Manual Focus checkbox and arrows Writehead CAUTION Use this option carefully Never let the write head touch the substrate Wrong usage may result in severe damage to the equipment Activating the checkbox replaces the autofocus functions with arrows for direct control of stepper head movement Autofocus is ss 1 frozen the piezo stays in center position plus any adjustments done via the defocus arrows While coarse movement is active the write head moves in steps of 300 During fi
74. panol can be used for most resist types General material recommendation e developer TMAH series metal ion free or 351B e rinsing all rinsing during processing should be done with DI water e stripper commercial stripper or concentrated NaOH solution e g undiluted developer after exposure of the remaining resist with an UV lamp e cleaning after the processing chrome plates can be cleaned using DI water and a mild detergent Standard materials used with the resists explicitly mentioned above BE binary 2D gray value 3D S1805 or AZ1550 positive AZ4562 or AZ9260 negative UV option only SU 8 Developer AZ351B MF351B in 1 4 dilution AZ resists AZ400K in a 1 3 5 1 part developer 4 parts DI 1 5 dilution depends on water alternatively MF319 application undiluted SU 8 SU 8 developer 45 HEIDELBERG INSTRUMENTS PG 101 User Manual General advice e Never use out of date chemicals e If a dilution is used as developer always shake well before use so the heavier parts are well distributed e Take care that all materials and tools involved in processing wipes trays sinks taps pincers etc are always clean e Take care that chemicals are not mixed Alwayse rinse well the substrate and any containers used before proceeding to the next step e For dilutions only use DI water e Take care that no air bubbles stay on the substrate when submerging it into a chemical This is especially criti
75. res into 6 um thick resist AZ9260 is recommended for thicker resist layers other members of this family o SU 8 negative photoresist requires UV option Apart from SU 8 all resists listed are positive resists i e exposed areas are developed during processing Please refer to resist documentation or contact resist manufacturer for more detailed data and recommendations on applications as well as details on coating and processing procedures e g spinning speed pre bake and post bake parameters recommended developer and developing time etc 32 HEIDELBERG INSTRUMENTS PG 101 User Manual General Advice e Take care to protect the substrates from light even safe light as far as possible and humidity at all times until developing is finished e Always wear lint free gloves e g Latex when handling the substrates e Protect the substrate from scratches whenever transporting it Use only designated transport boxes e Never use out of date batches e Carefully clean the back side of the substrate before use to make sure it gets good vacuum suction on the uPG 101 stage chuck e Don t expose substrates to water humidity solvents or solvent fumes EXPOSURE PROCEDURE For easy use the uPG 101 provides an Exposure Wizard that guides the operator through the steps of an exposure This Wizard offers two different paths one for simple standard exposures one for exposures that require advanced functions of the system like align
76. rom 10 until 100 iimm um pixel strength with steps of 10 It is recommended to Please choose type of energy series execute a coarse series first Coarse 10 increments C Fine 1 incremen ts At the fine series exposures start with the pixel energy pease toad stage with test sample and entered in the first step With increments of 1 11 prasa Dane do stan exposures will cover a smaller but finer area of exposure Coarse energy series will expose 10 test structures from 10 to 100 step 10 energy It is recommended to use this option if a coarse series was executed before and approximated energy was already determined Load Sample Execute Series Now the chosen energy series parameters are displayed Click on Load Sample to load a substrate on the stage The procedure is like the loading procedure in normal exposures and the wizard guides you through the steps Load a test sample in the center position of the stage using alignment pins if necessary The size of the test sample should be at least 1x1 inch When loading is finished click on Execute Series to start the test exposure Now the standard uPG performance test pattern is exposed in a column of 10 fields Each of these fields is exposed with a different energy the highest one being at the top right in stage coordinate system the lowest at the bottom left in stage coordinate system Once the series has been finished unload the
77. t the coordinate system of the stage is oriented such that the x axis corresponds to a backward forward movement while the y axis corresponds to a left right movement when standing in front of the machine see Figure 29 If a vacuum region bigger than 2 is required activate the required vacuum region extensions using the vacuum field adjustment screws 4 see right part of Figure 28 and Figure 30 Switch on the vacuum with the vacuum turn knob 5 Check whether the plate is really held tight by trying to move it slightly sideways If plate is not held switch off the vacuum and clean plate backside and chuck before trying again If problems persist use a different subtrate 5 Remove all alignment pins Close the cover lid and make sure the interlock lamp is off CAUTION If the alignment pins are left on the stage during exposure of a thin substrate the system can take serious damage 6 Click To Center in the Control Panel window The stage moves to the center position In the Writehea frame of the Control Panel click on Focus The write head moves down until the focal point is on the substrate surface C Exposure Settings f uPG101 Exposure Wizard lum Mode 1 Now options and parameters have to be set that depend on the substrate type that is used The wizard window offers the same Expose Options 22 Show Control Panel as for standard exposures H a 10 mW S 50 Exposure Power here are two parameters that
78. to be done at different energy levels until the energy is found that gives the best result in structure size and quality Note If good edge quality of the exposed structures is important it is recommendable to decrease the design structure sizes by 1 2 um and increase the laser power until the exposed structure sizes reach the required size Energy Factor For some applications the energy of the installed laser might not be sufficient or the energy should be deposited in a more smooth way e g to improve edge quality For these cases there is the possibility of reducing the speed at which the system exposes In this way the same area is exposed over a longer time allowing to deposit more energy or to deposit the same amount of energy more slowly Available are a speed reduction factor of 2 x2 or 4 x4 Exposure time increases accordingly Click Next to continue 8 uPG101 Exposure Wizard lum Mode The Expose Design window opens Here all options and parameters are displayed for crosscheck In addition options for the exposure itself can be chosen Auto Unload after Exposure Once the exposure has finished the system automatically moves into the position for unloading Design upg_acc cif Energy 50 of 10 mW x1 Parameter X 0 um Y 0 um Rotation 0 Load Substrate Uni Directional mode Generally the uPG 101 exposes in bidirectional mode which means that the stage travels back and forth
79. ts Show Control Panel buttons appear and parts of the panel are also integrated into alignment and calibration functions In addition the panel can be opened from the menu bar via Advanced gt Show Control Panel Whitehead Steppermobor Stage Pos 195250 209000 Stop Reset Manual Focus IT Fix Pieza 65 HEIDELBERG INSTRUMENTS wuPG 101 User Manual The Control Panel offers several possibilities of direct control of stage movement write head movement and camera control STAGE At the bottom of the Stage frame the curent position of the stage is shown at all times The stage can be moved around freely using the arrow buttons or directly towards specified positions with the other controls Arrow buttons and step size selector The arrow buttons move the stage so the camera view moves towards the indicated direction Stage movement happens stepwise and the step size is selected in the list beside the array of arrow buttons When moving the stage keep in mind that the x axis buttons move the stage from back to front while the y axis runs parallel to the loading edge right to left In the camera image on the other hand the x axis is horizontal and the y axis vertical To Center Moves the center of the stage below the write head To Load Moves the stage to the front into loading position ToXY A dialog window opens Enter a coordinate set to directly move to it To POI If not yet open the Camera Wind
80. uPG101 Exposure Wizard lum Mode C Exposing 1 Now options and parameters have to be set that 2 EEE depend on the substrate type that is used Expose Options To mw Tas Exposure Power There are two parameters that I influence the amount of energy that is deposited Feuer m JM on the resist surface On the one hand the output 7 power of the laser in mW Milliwatt can be regulated left value on the other hand the power can be reduced further in finer steps by setting the pixel pulse duration in percent right value In general it is recommendable to avoid very low laser output power as the relative noise increases towards low output power levels Wizard lf very low energy is needed as can happen e g in vector mode exposures the power can be further reduced by use of a filter with 10 transmission to keep the laser power level in a resonable region The filter can be added by l ON turning the filter knob at the side of the system to the ON position Figure 33 Exposure power reduction filter selection knob 36 HEIDELBERG INSTRUMENTS PG 101 User Manual The output power needed for a certain exposure depends on the type and thickness of the photoresist used For a resist with spectral sensitivity of 70mJ cm a laser output power of 8 mW in conjunction with a 50 pixel pulse length is needed to expose the resist To find the right energy for a certain type of substrates several exposures have
81. ure click on the red BREAK label in the Expose Design window E Unloading 1 If the option Auto Unload after Exposure was selected after the exposure is finished the write lens is automatically retracted to the upper position and the stage moves to the unloading position Otherwise click on Show Control Panel In the Control Panel click To Load 2 Walt until all movement has stopped 3 Open the lid switch off the vacuum with the vacuum turn knob 5 and carefully lift the substrate off the chuck Process the substrate according to the substrate type and manufacturers recommendation Note If more plates with exactly the same setup should be exposed loading of the next plate can be done directly from the Control Panel using the To Center and Focus buttons Afterwards with the Expose button an identical exposure can be Started It is not necessary to repeat the complete wizard setup SUBSTRATE PROCESSING The steps of processing of a substrate are Post exposure bake Depending on application and resist type a post exposure bake of the exposed substrate on a hot plate or in an oven may be required Refer to the resist manufacturers documentation for specific information on this The resists recommended here for standard purposes do not need a post exposure bake Developing The exposed parts of the resist have been chemically altered by the light and can now be washed out of the resist layer by use of specific devel
82. written once with the fixed spot diameter of the laser beam In order to achieve broad lines the path must be repeated several times using a specific displacement Keep in mind that the effective linewidth also depends on system parameters and processing SETTING UP A GERBER DESIGN FOR uPG 101 A Gerber design describes a continuous path on the substrate plus the information where on this path the beam should be on leading to a drawing of the path onto the substrate The file consists of a header with general format instructions and a body with the description of the path several different commands are required to define the path that is to be exposed Commands are written together with options and parameters in one uninterrupted string Not always a full set of parameters is required To mark the end of each Gerber command an asterisk is used All general format commands are in addition set between percentage signs For explanation of the setup of a Gerber design file as an example the drawing of the following structure is explained www gerber viewer com Figure 18 Sample Gerber File in Viewer 21 HEIDELBERG INSTRUMENTS wuPG 101 User Manual The full code for this design is SESLAX32Y32 MOIN cle Pls GILA S6ADDIOC 0 00 G54D10 Gio G01X750Y500D02 X1250D07 EOS 15007 7501 250J500D07 GOLXLSO00YIZ5S0D0 1 GOS XT Z50Y 15007 3005 250D0L7 G01X7 50Y1500D01 COUSX 50071250 10J 250D01 GO
83. ystem covers and internal surfaces should be cleaned occasionally to avoid transfer of particles onto the substrate e Use clean lint free cloth e Incase of stronger contamination wet the cloth slightly with a mild soap sud The base on which the stage air bearings are travelling is automatically cleaned from any dust particles due to the air pressure of the bearings If the air bearing base was accidentally contaminated with oil or fat e g due to touching with bare hands it has to be cleaned to prevent damage to the air bearings due to stuck particles e Use clean lint free cloth and isopropanol Data Backup To make sure that the system can be rebuilt as fast as possible in a fairly recent state the data should be saved occasionally to a backup data carrier e g CD floppy other PC on the network e Use the Make Backup Utility Tools gt Make Backup e Afterwards transfer the complete directory C HIMT to a backup device 71 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Notes 72 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Notes 73 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Notes 74 HEIDELBERG INSTRUMENTS wuPG 101 User Manual Notes 75

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