HP-200 - Oltec
Contents
1. eee 7 Related documents Hot plate HP 150 250 BT bench top version Electric diagrams for the device Maintenance guideline List of spare parts and wear parts www sawatec com 3 MA HP 150 250 BM en v1 0 2013 03 06 Hotplate 150 250 BM SnUulnrCC Product description The Hotplate 150 250 BM is designed for temperature processes in the semiconductor industry This includes lacquering and baking of silicon wafers Main features Substrate loading hight up to 5 mm Substrate size up to 150 x 150 mm Digital setting and display of top plate temperature Wide temperature range 25 C to 150 C or 250 C Main parts The figure below shows the main parts of the Hotplate 150 250 BM 1 Frame to be mounted into housing 2 Hotplate with levelling screws 2a 3 Mains connection 4 Control panel with main switch 4a temperature controller 4b and vacuum switch 4c UI Connection between plate unit and controller 6 Connection between plate unit and main switch 4a com Lr t ER 9 Connectors The connections one the rear are labelled Y S Ec o BP P P u 6 gt www sawatec com 4 MA HP 150 250 BM en v1 0 2013 03 06 gt LUMUS Hotplate 150 250 BM SAWATCC Technical data Operational characteristics Aluminium alloy ano Hotplate 164 x 164 mm dised Temperature range 25 C to 150 C 0 1 C display resolu Option2. Pin circel diameter 45mm Protection glass without pins Protection glass with proximity pins snunTcc d 200 27 For further information please contact our sales department sales sawatec com Pictures may show standards with options Uuuuuuu uul Temperature range 25 250 C Accuracy of temperature 1 C per 100 C Substrate loading manual Substrat fixation via vacuum manual controlled Max substrate size 200mm Internal height max 23mm max substrate thickness 18mm 240 VAC 50 60Hz 1200 W Technical vacuum tube 26 4mm Exhaust connector 032mm Compressed air 4 bar tube 6 4mm For further information please contact our sales department sales sawatec com Pictures may show standards with options PERFORMANCE REQUIRED MEDIA Tel 41 81 750 44 00 Fax 41 81 750 44 01 info sawatec com WWW Sawatec com SAWATEC AG Eschagger 2 9468 Sax DIMENSIONS DESIGN u u u front view side view gemi a TS Size 400x380x190mm LxBxH Hotplate size 210x210mm Weight approx 20kg Housing Anodised aluminium Hotplate material Anodised aluminium For further information please contact our sales department sales sawatec com Pictures may show standards with options Tel 41 81 750 44 00 Fax 41 81 750 44 01 info sawatec com SAWATEC AG Eschagger 2 9468 Sax Swiss WWW Sawatec com WOI S9JEMES MMM xes g9r6 Ho UJO2 29 eMPeS95 0 JUI IO vv OSZ 18 Tv XVJ c Jobb6eu s3 OO
3. before a process can be continued Touch this button to see the Alarm list see Alarm handling on page 12 www sawatec com 20 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SRWARTCC Setting parameters How to come here In the Stand by panel touch the Setting button 21 09 2006 16 37 47 Parameters Counter Number of cycles run so far oo wi with the currently active recipe Enter Password asa Enter password Touch the password field An alphanumeric key pad appears to enter the desired password You confirm with the ENTER button seeSet passwords on page 29 Note A valid password lasts for 15 minutes After this time it must be re entered to access the parameter functions again To block access immediately against unauthorised use enter an invalid password Wrong password If the password is wrong then all option buttons become inactive Enter Password Possible actions Function Reset counter of current process Set system parameters see System settings on page 28 Can not be set with the User password button inac tive Set machine parameters see Machine parameters on page 22 Set process recipe parameters see Process recipe parameters on page 25 Drive parameters for the pins see Heating Autotuning on page 22 Leave panel Touch the Exit button to go back to Standby mode www sawatec com 21 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Sf
4. Come in Bod o Go out nen 18 09 02 10 29 11 Quit Alarm history The alarm history contains all confirmed and not confirmed alarms It is entered from the Alarm display with the history button ilii Alarm texts depend on the device This is only an example display 18 03 05 10 27 10 27 59Emergency stop 18 03 05 10 33 10 33 30Lid open Error Alarmhistory 21 09 2006 Possible actions Delete the complete history Attention You are not prompted to confirm the action lt W Filter display of messages a popup window will ap Y pear u EN Sort messages a popup window will appear A Filter alarm display Alarmfilter All alarms Only activ alarms Mot receipted alarms Activ not receipted alarms To select the desired filter touch To sort according to your desire the appropriate button touch the appropriate button ii www sawatec com 3 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Processing Switching on and off Switching on www sawatec com How to come here Possible actions 1 Assure proper function of electricity compressed air N5 vacuum and exhaust 2 Check for vacuum to hold the substrates 3 Adjust the pressure of compressed air to the minimum If compressed air is switched ON without any pressure control then the cover will be lifted suddenly with great force This is dangerous for the operator 4 Switch on th
5. SAWATCC Hotplate HP 200 The SAWATEC HP 200 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications The temperature range is de Signed as standard up to 250 C The HP 200 offers high uniformity and process repe atability and can be used for substrates up to 200mm Outstanding features of the hotplate are its robust design and ease of operation The hotplate s modular design means that it can be used in a wide range of applications with high optional expandability wet bench integration TH LESS yp 200 BF FEATURES gt Digital temperature controller with actual and nominal value ee gt Max substrate size 200mm gt Substrate loading manual EE ih oo 88 c Substrat fixation via vacuum DIN G G c Accuracy of temperature 1 C per 100 C 58 gt Pneumatic lift of the lid z gt Internal height max 23mm max substrat thickness 18mm z gt Heating ramp up possible with 20 program steps I 5 For further information please contact our sales department sales sawatec com SAWATEC AG Eschagger 2 9468 Sax Swiss Pictures may show standards with options u u Nitrogen flush controlled N2 lid made of anodised aluminium N2 solenoid valve Proximity as well as loading pins Pneumatic driven pins stroke 8mm Manual adjustable proximity pins between 0 1mm 0 1mm increments Pin made of Inconell with Ceramicball
6. document K Electric and pneumatic schemes Maintenance plan List of spare parts and wear parts 2 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Content Processing Maintenance and repair Options www sawatec com SAWATCC Product description OOK ODE EWS s 3 3 3 43 4 Kap las OA PPP 5 MALES eige nie o u 08 cued eee eeas doe a Phas uba Boa eee eee ee ee a 6 Not installed optionS e s ea os 6 CODIGC EOFS aaa aries aer em ir X339 a Xe h OS Rog N a om gd 6 Safety guidelines lee rr 7 DeTINEOM OMUSElS x ccu s dcus kantte soe one ACER A wh md der d Xe 7 Defined purpose and known misuses 000 eee eee eens 7 eic warden 45d a eo ee eee 8 Residual dangerS e DROSS Mers E EER oes 8 Protection against overheating ee 8 Setting up the device I e 9 Level the plate eee 9 Controlling the process 0 ce eas 10 Controller interface 10 Alim Handing ET 12 Switching on andoff n 14 WI HDO OM an rennen aren ete Q SUQ SR a 14 Screen DIOCKOT wu c ass a aus wq wa blh w P e ph u Ww S See ee SQ qan h N 15 S OO aa 4444 starre oe ha ee ee ee Se ea aes 15 Adjust proximity pins oaaae RR Re 16 PROCES ING saan cand es Rua ede eee E kS RQ QQ ee gg a ee Q a 17 Automatic mo e rs 17 Manual OQ s uci uuo ador xs kc qae wk Dw Ow Ried de ow w GW W a 19 General functions 20
7. WATCC Machine parameters Note How to come here Possible settings General parameters Special parameters Shutter HMDS Klixon Housing Vacuum 1 Product N2 Vacuum Chamber Vacuum Protection Plate Pin Pneumatic Pin Electrical H20 CDA Sensor N2 Sensor These parameters can only be set with the Setup password In the Parameter panel touch the Machine button I Machine Parameters Heating Max Power Buzzer Time Availability of settings depend on installed option These are defined in the panel which You get with the Options button Options Buzzer time s 0 30 2 Prot Plate Thickness mm 0 0 99 9 5 Screen Saver Off Time s 0 300 10 Delay of Input Blocking 0 no blocking Some options are connected to specific machine parameters Activate program controlled shutter Programmable shutter on page 35 Filling the chamber with HMDS See HMDS priming on page 34 Watch the temperature of the Inner housing of the heating device Tis is only relevant for Hot Plates Vacuum to hold the substrates in place N flushing See Nitrogen flushing on page 34 Vacuum for the process chamber Vacuum to hold the protective glass Pin movement by pneumatic piston Pin movement by stepper motor 999 9 10 999 9 1 99 9 8 0 Pin Process Speed mm s 0 0 Pin Process Acc Dec mm s 0 0 Pin Start Position mm 0 0 Cooling water for forced co
8. Exit button 30 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Program recipe examples Example with constant temperature This process cycle remains at 150 C ttarget150 ttarget23 lid YP wn EI I MN SEEMEMEMZMMfI vacuum 11 Pins a MEE QN su X X lt X lt X buzzer 1 Segment KI 2 8 4 ls Target temp C 150 150 150 150 150 Seg Duration hms 0 00 05 0 15 00 0 00 05 0 01 00 Vacuum Off On On On Off Off Pins and lid cap Up Up Down Down Up Up Buzzer Off Off Off Off On Off N2 flush option Off Off Off Off Off Off Note The natural heating rate s approx 10 C min see Technical data on page 5 www sawatec com 31 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Example with ramps This process cycle has a ramp up to 120 C which is held for 15 minutes Then it cools down naturally to 25 C no water cooling assumed in this example ttarget1 20 ttarget29 lid down vacuum _J _ Pins I x IZZ buzzer E 1 qH 2 3 i A4 145 6 77 Segment 1 2 3 4 5 6 7 Target C 25 120 120 25 25 25 25 Seg Duration hms 0 00 05 0 20 00 0 15 00 0 20 00 0 00 05 0 01 00 Vacuum Off On On On On On Off Off Pins and lid cap Up Down Down Down Down Down Up Up Buzzer Off Off Off Off Off Off On Off N2 flush Off Off Off Off Off Off O
9. Setting parameters er 21 Machine parameters s s ns 22 Drive parameters ns 24 Process recipe parameters cc es 25 Save load parameter files _ r 21 System settingS gi a ccs enn ti ROS Ee Keds oe eae A 28 Set passwords 0 ees 29 Set display characteristics aaa a 29 Set date andtime eee 30 Set LAN parameters es 30 Program recipe examples 31 Example with constant temperature 31 Example with rampS I I 32 SC zee ern a den ran bees Ge eee oe 2 2 Sa 33 Exchange the sealing in the lid 0 0 ee 33 Media monitoring iie ees 34 Proximity PINS rere 4 4 3 4 5 sere s a en Hed ken Q ea 34 Nitrogen flushing 0 eee RII I ees 34 Nitrogen flushing and HMDS priming 00 eee eee eee 35 Programmable shutter leen 35 3 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Sh UJ TCC Product description The Hotplate HP 200 BM is designed for constant temperature pro cesses in the semiconductor industry This includes priming and baking of silicon wafers and glass masks Note This manual describes an integrated version not a bench mounted stand alone version Hence no information is given concerning installation dimensions piping etc Main features Wide temperature range 25 C to 250 C for substrate sizes up to 8 x 8 200x200mm Loading proximity pins can be adjusted
10. atmosphere avoiding any oxidation The lid gets an additional cover with an N2 inlet A solenoid valve for N2 is provided n the control program the necessary functions are activated www sawatec com 34 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWARTEC Nitrogen flushing and HMDS priming This replaces the option Nitrogen flushing The lid for Nitrogen flushing has an additional inlet Both a solenoid valve for N2 and for HMDS is provided In the control program the handling of the HMDS is added to the N2 handling Programmable shutter This option is required for processing with HMDS The manually operated shutter A for the exhaust of a hotplate defines the suction rate An optional electro pneumatic shutter B can open and close the flow by program control This controllable shutter is an addition to the manual shutter Ta a gt cm ea UV a E au The shutter can be opened and closed during a process step WWW Sawatec com 35 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAW ATCC www sawatec com 36 MA HP 200 BM en v2 0 2013 11 12
11. com There is a Clixon switch in the housing of the hotplate which switches off mains in case of overheating The Hotplate 150 250 BM will not function until this thermal relay has cooled down and closed the circuit again 7 MA HP 150 250 BM en v1 0 2013 03 06 Hotplate 150 250 BM Sh UJ nTCC www sawatec com 8 MA HP 150 250 BM en v1 0 2013 03 06 SAWATCC Hotplate HP 150 The SAWATEC HP 150 hotplate has been developed for standard soft bake and hard bake processes in lithography and similar applications The temperature range is de Signed as standard up to 250 C The HP 150 offers high uniformity and process re peatability and can be used for substrates up to 150mm Outstanding features of the hotplate are its robust design and ease of operation The hotplate s modular design means that it can be used in a wide range of applications with optional expandability wet bench integration FEATURES e gt Digital temperature controller with actual and nominal value II gg c Max substrate size 150mm 2288 gt Substrate loading manual p 99 c Substrat fixation via vacuum manual controlled o co Z gt Accuracy of temperature 1 C per 100 C Y Y p SEDE ups For further information please contact our sales department sales sawatec com SAWATEC AG Eschagger 2 9468 Sax Swiss Pictures may show standards with options Lid manual handling made by anodised aluminium incl hinge and mounting parts Int
12. inactive Depending on installed options some buttons may change their cap tion e g Cooling On Off gt Heating On Off Connectors 1 Vacuum entry connection holding protective glass and substrate 2 Compressed air to move the lid hood Pressure con trolled 4bar 3 Exhaust A heat resistant hose is fixed by a clamp 4 Check valves to adjust the speed of the lid movement 5 Connection of electric cables from controller via solid state relays Depending on installed options more connections may be available e g for HMDS flushing www sawatec com 6 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Safety guidelines Definition of users Operator The operator of the Hotplate HP 200 BM is the person who per forms all tasks related to the intended use of the product In par ticular this is handling and cleaning Note The Hotplate must be operated only by educated instructed personnel Defined purpose and known misuses Defined purpose of the The Hotplate HP 200 BM is designed and built for the sole purpose product of heating flat substrates in the semiconductor industry Operating conditions The Hotplate HP 200 BM must be operated only under environmen tal conditions as specified in the technical data for the ambient The exhaust must always be in operation The temperature range may need to be reduced depending on the medium to be dried e g lacquer creating dangerous fumes Prope
13. vy OSZ I8 Iv ll OV O31VANS SAWATCC Hotplate 150 250 BM IPnupiAi j sn c o a o LA o LA 3 D lt Hotplate 150 250 BM Title Manual Revision History Date of print Products Copyright Trademarks Audience Manufacturer OEM Customer service information www sawatec com SAWATCC Hotplate 150 250 BM User Manual MA HP 150 250 BM en March 2013 v1 0 First issue of manual 2013 03 2013 03 06 Hotplate 150 250 BM 2002 2013 SAWATEC AG CH 9468 Sax This manual contains proprietary information All rights are reserved Trademarks appearing in this document are acknowledged as the trademarks of their respective owners This description of the Hotplate 150 250 BM is primarily intended for system integrators SAWATEC AG Eschagger 2 CH 9468 Sax Phone 41 81 750 44 00 Fax 41 81 750 44 01 E mail _info sawatec com Web www sawatec com Write down the contact details phone fax etc for your System integrator or local distributor 2 MA HP 150 250 BM en v1 0 2013 03 06 Hotplate 150 250 BM SAWATCC Contents Related documentS 0 00 eee rrr 3 Product description oie cv 31a ne een be eda EO EU CR PE I 363 4 technical HALA rn varanen kus kp rn VOR Eo RR EROR kuk Q wad s 5 Installation s se oie us out bene areca EDE edn W ws ae w a 3 6 Salely GUIGEIINGS ressa xo acad Han ue OE FCRC E er Ud ERR Y aed dodo oe ee 3 p Y 7 Protection against overheating
14. www sawatec com Sf WATEC Use this button to delete or insert a segment Warning Delete Segment Parameter file will be i Insert x Touch the Files button The current segment is delete Segments with a higher number than the current one sill in The current segment is pushed up and the inserted segment becomes the current one This opens the Parameter files panel see Save load parameter files on page 27 After entering a name and description touch the Save button Touch the Files button and select an appropriate process recipe With the Load button you read the parameters Leaving the panel without saving the process recipe parameters keeps them only available for the current processing Leave any panel with the Exit button 26 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Sf Uf TCC Save load parameter files How to come here These are just examples and may be irrelevant for the current device Output display Select a process Save new or modified parameters Use a sample process Sort the list Clean out the list Leave panel www sawatec com In the Parameters panel touch the Files button Parameter files Test 01 Test 02 See protocol See protocol Name Description List of defined stored processes recipes The active process Is highlighted n columns in the display are in the following order Name from field File Name Des
15. 0 A fuse Cable without plug Compressed air for 4 bar clean dry air pneumatic functions CDA Fitting 6 4 mm Exhaust 3 10 m h Fitting 32 mm for heat resistant hose Vacuum to hold the Technical vacuum 0 5 substrate in place bar Fitting 6 4 mm Ambient 21 C humidity 45 The Hotplate HP 200 BM must be set up on a clean plain levelled surface in proper distance to any flammable material 260 The Hotplate HP 200 BM uses only DIN CE certified elements or DIN CE certified materials www sawatec com 5 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Integration A sample integration is the SAWATEC HP 200 depicted to the left A stand alone version of the Hotplate HP 200 BM comprises the fol lowing ancillary components Hotplate with frame plate Controller with touch screen Electric panel main switch start stop buttons solid state relays Pneumatic panel solenoid valves pressure control pressure and vacuum gauges manual flap to control exhaust suction rate When integrating into a table the installation dimensions and the additional documentation must be observed Electric diagram Pneumatic diagram Not installed options Installed options are activated in the control program see Machine parameters on page 22 Not installed options render the corresponding buttons and entry fields light grey These elements are
16. 0 BM en v2 0 2013 11 12 Hotplate HP 200 BM Sh UJ TCC Processing Automatic mode How to come here Display while running a process recipe Set temperature Possible actions Functions in stopped mode Panel Automatic is the standard display during normal operation In this mode the process recipe is started either by a handling device or the integrated Start Stop buttons From any Stand by panel with the Automatic button Remain Time Ol Pin Position 0 0 mm Temperature C Start 200 Act 0 0 Heating Reset OnJOTff Temp The parameters of the process recipe are continually displayed For example the Segment number loops through the recipe steps STOP This can be set by Process recipe parameters on page 25 This tem perature is kept outside a recipe program that is in Stand By mode See button Reset Temp below For buttons not explained here see Genera buttons and controls on page ll Select a process recipe to be run Touch the field See Se ect process recipe on page 18 Recipe Touch the field Set the start base temperature Set Tempera ture Start the selected process recipe Stop current process STOP The following settings overrun those from a current process recipe Heating On Off Switch heating Reset the temperature to the Start temperature This Is necessary to start a process with lower temperature Reset Temp after a process wi
17. BM UIUOO S9JEMES MMM WoD SAJEMES OJUI LO vv OSZ I8 Lv XVJd OO tt OSZ I8 Iv IL xes g9v6 HO c Jobbeu s4 OV DALVMVS Hotplate HP 200 BM Title Manual Revision History Date of print Products Copyright Disclaimer Trademarks Audience Manufacturer Customer service information Set up password see page 29 Customer set password SAWATCC Hotplate HP 200 BM User Manuall This manual describes an integrated version not a bench mounted stand alone version MA HP 200 BM en November 2013 v2 0 Larger plate small touch panel generalised software v1 0 First issue of manual 2010 06 2013 11 12 Hotplate HP 200 BM 1999 2013 SAWATEC AG CH 9468 Sax This manual contains proprietary information All rights are reserved Changes within the meaning of technical progress are reserved Trademarks appearing in this document are acknowledged as the trademarks of their respective owners This description of the Hotplate HP 200 BM is intended for end users SAWATEC AG Eschagger 2 CH 9468 Sax Phone 41 81 750 44 00 Fax 41 81 750 44 01 E mail info sawatec com Web www sawatec com Write down the contact details phone fax etc for your System integrator or local distributor Factory setting Is twice the installation number ANO on the name plate for example 706706 Ancillary documentation www sawatec com The following documents are part of the delivery but not of this
18. Speed mm s Os 2 7 2 5 Max Acc Dec mm s 0 1 100 0 80 0 Home Offset mm 0 0 99 9 8 Home Speed mm s 0 1 999 9 5 0 Home Acc Dec mm s 0 1 999 9 50 0 Motor Direction POS NEG POS PIN Process Acc mm s 0 0 999 9 5 0 PIN Process Speed mm s 0 0 999 9 50 0 Current in of 7 5 A 1 20 2 Max Input Distance Offset PIN 0 0 99 9 0 00 below Plate mm Max Temperature 50 0 300 0 150 0 Heating Control P D 0 65535 Pin Slope mm Revol 0 1 50 0 1 0 Heating Offset 50 0 50 0 0 0 Save Saves the current settings to a parameter file Load Loads settings from a parameter file The Heating Autotuning function defines the characteristic of the heating device ActT C Path P Path Tg Path Tu This function is used only by the Service Technician and hence not explained any further www sawatec com 24 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Process recipe parameters How to come here Output display Set up a process recipe Recipe parameters Note Store segment data www sawatec com In Standby touch the Settings button in Parameters touch the Process button amp Setup password is required a EI Note segment 1 oora 2 zu Buttons for not installed functions look transparent Ti BEE cn ps u and are inactive Current segment number For each segment of the process recipe specify the necessary ingre dients No settings are automatica
19. ally to 250 C tion Temperature accuracy 1 C per 100 C Substrates size 150 x 150 mm Substrate fixation vacuum FED on Me plate manual switch Physical properties and environment Length width height 36 33 13 cm See details below Weight 7 kg Electrical power 240 VAC 350 W vn a cuum technical vacuum Fitting for hose controllable 6 4 mm G The Hotplate 150 250 BM must be set up on a clean plain levelled surface in proper distance to any flammable material Standards The Hotplate 150 250 BM uses only DIN CE certified elements or DIN CE certified materials Overall dimensions www sawatec com 5 MA HP 150 250 BM en v1 0 2013 03 06 Hotplate 150 250 BM Sf ATEC Installation Plate unit 3100 1 for M5 x Control panel 180 7 800 1 for M4 4x 1900 1 Integration The system integrator must observe the following rules considerations Malfunction of the exhaust must switch off the device There is however a protective switch against overheating built in Levelling is essential to avoid intrusion of liquids flowing off the hot plate This may block the vacuum bores and the exhaust slits www sawatec com 6 MA HP 150 250 BM en v1 0 2013 03 06 Hotplate 150 250 BM SAWATCC Safety guidelines Defined purpose of the product Operating conditions Proper use Improper use Nameplate The Hotplate 150 250 BM is designed an
20. asswords Keys JN Set display contrast Screen L Set date and time Clock Set LAN connection LAN Za x Leave panel Leave any panel with the Exit button www sawatec com 28 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Set passwords Display if logged in with Setup password E 24 09 2006 Password Definition 14 33 34 Master Password Setup Password User Password Display fields Passwords of a higher level as your current one display as asterisks Automatic operation does not require entry of a password Setting machine parameters and Master Not disclosed passwords Setup Set up passwords 2X Don number User Setting process recipe parameters 1 a The installation number ANO is on the name plate If ANO is 476 then the Setup password set in the factory is 476476 Set new values To change a password Touch the appropriate field Setup or User The numeric key pad will pop up to enter a new value See Numeric data entry on page 10 The new value is displayed Set display characteristics Contrast amp Backlight pois For B W touch panels only two levels of brightness can be set 10096 Full brightness 10096 Lower brightness Q O spe m Display fields Contrast value Brightness value Set new values To change a value use the Up or Down arrow buttons You may also touch on one of the displayed values for example the contrast The n
21. cription from filed Description Date and Time when saved Move the selection highlighted line with the slider bar or the up and down buttons to the right Enter a name by touching the Name field At most 8 characters can be given In the pop up alphanumeric key pad type the name Operate similarly for a meaningful description up to 16 characters of the process recipe Then touch the Save button To modify an existing process recipe or use it as a starting point for a new process use the Load button You are prompted to allow overwriting the current parameter settings After changing the name of an existing process recipe you may wish to sort the list with the Sort button In a pop up display you can select the sort criterion in a popup screen Filename Descrip tion or Time You delete the process recipe data of the selected process recipe with the Delete button You will get a confirmation pop up for this action You are prompted to allow the deletion Attention Leaving the panel with the Exit button without previously saving the parameters keep the parameters in storage only until switching off the machine 27 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC System settings How to come here _ In the Stand by panel touch the Settings button You are requested to provide the Setup password 21 03 2006 16 39 23 System Settings Output display No display just buttons Possible actions Set p
22. d built for the sole purpose of heating flat substrates in the semiconductor industry The Hotplate 150 250 BM must be operated only under environ mental conditions as specified in the technical data for the ambient The exhaust must always be in operation The temperature range may need to be reduced depending on the medium to be dried e g lacquer creating dangerous fumes This must be observed strictly to avoid dangerous situations such as the escape of aerosols or gas particles generating explosive gas mix tures Proper use of the product includes obeying of these operating instructions using qualified personnel The Hotplate 150 250 BM is not intended to be used for Applying any additional heating devices e g to get higher tem perature than specified in the technical data Heating liquids other than lacquers with relatively high viscosity Low viscosity liquids may run off the substrate and or create dangerous fumes Heating other objects than thin substrates The Hotplate 150 250 BM is not a general purpose heating device The above list is not exhaustive The nameplate on the rear of the device summarizes the technical data and states CE conformity ride Sawatzki echnology schagger 2 CH 9468 Sax nin com Model Hotplate Type HP 200 250 BM ANO XXX Year 2010 Temp 250 Voltage 240 at 50 60 Hz Power 1200W 10 A MADE IN SWITZERLAND Protection against overheating www sawatec
23. e device with the main switch on gt the control ini tialises 5 After about 10 sec the Stand by panel displays 0511 2013 Current date 12 32 10 and time Stand by Manual mode Automatic mode Heati sasn This panel can be reached from any process recipe panel with the Exit button For buttons not explained here see General buttons and controls on page 11 Function Display alarm alarm button is red See A arm handling on page 12 Switch to automatic mode See Automatic mode on page 17 Switch to manual mode See Manual mode on page 19 eame Set process parameters and system parameters See Setting parameters on page 21 Sheath pw Heating Switch heating individually On Off Switch vacuum to hold the protective glass in place Kl 9 P On Off 14 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Screen blocker Switching off End of process Termination www sawatec com SAWATCC To avoid unintentionally entry on the touch screen a special panel protects the automatic mode 05 11 2013 114954 Screen blocker x SI Remain Time Os Pin Position 0 0 mm Temperature C 0 To get access to the blocked panel touch button 1 and then button 2 The time delay for blocking the touch panel is set in the Machine parameters on page 22 value Screen Saver Off Time Normally a program provides these functions Vacuum is switched
24. ernal height max 6mm Max substrat thickness 5mm Nitrogen flush manual controlled N2 lid made or anodised aluminium Manual switch for N 2 control Protection glass without pins snunTee For further information please contact our sales department sales sawatec com Pictures may show standards with options co Temperature range 25 250 C PERFORMANCE gt Accuracy of temperature 1 C bei 100 C gt Substrate loading manual gt Substrat fixation via vacuum manual controlled gt Max substrate size 150mm c 240 VAC 50 60Hz 350 W REQUIRED MEDIA gt Technical vacuum tube 6 4mm gt Internal ventilator em E oOo SF SF SF Ske LO LO Mm np T rd oO cO zs s lt UO 5 LLL ere gg gg o S 2 es cs For further information please contact our sales department sales sawatec com SAWATEC AG Eschagger 2 9468 Sax Pictures may show standards with options front view Bu zh Yeh c Size gt Hotplate size gt Weight DESIGN Housing gt Hotplate material E 300x250x120mm LxBxH 164X164mm approx 7kg Anodised aluminium Anodised aluminium side view For further information please contact our sales department sales sawatec com Pictures may show standards with options 108 Tel 41 81 750 44 00 Fax 41 81 750 44 01 info sawatec com SAWATEC AG Eschagger 2 9468 Sax Swiss WWW Sawatec com SAWATCC Hotplate HP 200
25. es a colour screen or a black and white b w screen This document referes to the colour screen The mentioned colours red green appear as darker gray on the b w screen You may need to adjust brightness contrast for best view System parameters alarms pending red M Black and Segment 0 0 values in fields blue White p Remain Time Gu Interface STOP Temperatur C Set 0 0 Act oo fo button activated green Base 0 0 The user interface may contain inactive buttons for options or func tions which are not implemented in the particular device Such but tons look transparent inactive active active inactive Pin ise down iskias Passwords define three levels of users User Can run processes both manually and automatically Setup Can define processes recipes and perform all User actions Master Can set passwords machine parameters and perform all Setup actions Of course all User actions can also be performed 10 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Popup boxes General buttons and controls Numeric data entry www sawatec com SAWATCC Depending on selected functions pop up boxes are displayed which are smaller than the entire screen These popup boxes disappear after 5 seconds if no input Is pro vided or no button touched The following buttons and controls are used in various dialogues Function Exit any display with this button In a menu hierarchy you wa
26. ff Off www sawatec com 32 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Maintenance and repair Note Cleaning The Hotplate HP 200 BM does not need specific maintenance how ever it is recommended that The device is cleaned in intervals determined by the use The sealing in the cover is exchanged if it is damaged and the cover does not close properly any more No other maintenance actions must be carried out by the user When cleaning the Hotplate HP 200 BM Do not disassemble the device for any cleaning purpose This may render the device inoperable Use any standard industrial cleaner for the outer surfaces except the control elements with the keys lean the control elements keys display only using a cloth with cleaning solvents recommended for screens and keyboards Exchange the sealing in the lid To exchange the sealing Note www sawatec com The sealing is available on the roll from the manufacturer in lengths of about 0 8 m fitting one hotplate 1 Switch on the Hotplate Hotplate HP 200 BM to raise the lid 2 Set the temperature as low as possible to avoid heating 3 In the groove of the sealing find the place where the sealing is connected and lift one end gently from the groove Avoid any damage to the groove the lid is made of aluminium by sharp instruments 4 Remove the sealing without tearing it too much to get an indica tion of the desired
27. in increments of 0 1 mm With closed cover the hotplate creates a sealed chamber Bake out under air or nitrogen option Dehydration and flush with nitrogen option Controller can store 50 process programs with 24 segments each Main parts The exploded view below shows the main parts of the Hotplate HP 200 BM control equipment is not depicted Base plate 2 to be mounted in a housing Lid hood 1 is lifted pneumatically Loading proximity pins 5 are moved by the mechanism 6 Levelling screws 3 balance the main plate within the frame plate which is integrated to the housing The protective glass 4 supports keeping clean the Hotplate www sawatec com 4 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SR UJ TCC Technical data Operational characteristics Physical properties and environment Dimensions Standards Hotplate dimensions 250 x 250 mm Material Aluminium alloy 8 200mm diameter Substrate size max 8 200mm square Temperature range 25 C to 250 C 0 1 C display resolu tion Temperaturne 0 5 C at 100 C uniformity Process control up to 50 programs with 24 segments Substrate lifting 0 to 15 mm process controlled Proximity adjustment 0 1 1mm Width depth height 32 40 18 cm See details in diagram below Weight 25 kg Including ancillary components 230 VAC LNPE 50 Electrical power 60Hz 1
28. lay Note Sf WATEC To change the text in a field such as the name of a process Touch the field on the display n the appearing pop up enter the desired text and leave the pop up with the Exit button Entered text Act fells ta w e n r z v i oje alslo r e u vs k r aan the input value with es u eve this leaves the pop up Remove the last entered char BL C Ne we ec When touching a password entry field a pop up similar to the numeric data entry appears The entered data is displayed as aster isks The password can not be longer than 8 figures Password Confirm the data entry with the button OK wf panel with button Exit During a process the central area of the display shows status mes sages These do not require any user action then leave the If user intervention becomes necessary the alarm button ry flashes The alarm message is displayed after touching the alarm button 21 02 2006 Alarms 14 50 10 CAN Module I O error Emergency Stop active Press button to clear details about 2 seconds To get the details of the alarm select it and touch button Q A pop up window appears Each alarm must be acknowledged before the machine can con tinue 12 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Alarm texts depend on the device This is only an example display Alarmdetails Alarmnumber IM Alarmtext Emergency stop active
29. length for the replacement 5 You may wish to clean the groove with cleaning solvent and small swabs 6 Insert the new sealing carefully without tearing the sealing avoid incorrect length 7 The ends should touch with a little pressure 33 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SR UJ TCC Media monitoring Proximity pins Pin movement Nitrogen flushing Options All options are reflected in the controller software and must be switched into operation by the Machine parameters on page 22 The input media compressed air N2 HMDS and vacuum can be monitored by individual sensors Proximity and loading pins are an option They are moved by pro gram control The 3 loading pins are arranged on a reference circle of 60 mm diameter Hence they fit for substrates of diameters 75 mm 3 to 150 mm 6 Smaller substrates can be placed directly on the hot plate or stacked on larger supporting substrates Optionally other diameters of the reference circle are possible If pins are desired two options for their movement and control are available Electric pin movement by a stepper motor This allows to control the proximity in the control program Pneumatic pin movement by a piston In this case the top posi tion of the pins is set mechanically with a turning wheel behind the plate Control program can move the pins only between their end positions This option allows to process in an inert
30. lk one step up back Alarm is active Touch the button to open the Alarm display Cancel Leave the current dialogue without setting any values OK Accept the provided changed input values of the current dialogue Acknowledge Confirm a message with this button Help Display help about the controller menus This function is currently supported only rudimentary Increment upper button or decrement lower button the value displayed between the two buttons The increment normally is 1 but not necessarily sis SR e Bd Scroll bars to the right of lists Touch the lower button to scroll forward in the list Touch the upper button to scroll backward in the list For a quick location you may drag the slider button touch and move the button ia To change the value in a field such as a temperature or speed Touch the field on the display n the appearing pop up enter the desired value and leave the pop up with the Exit button The maximum and minimum value which may be entered is displayed on top The middle line dis plays the current entry Remove the last entered figure Reset value to 0 clear the entry Accept the input value The panel is not left ll MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Alphanumeric data entry Password entry Status Messages Alarm handling Alarm texts depend on the device This is only an www sawatec com example disp
31. lly copied from a previous seg ment See a Program recipe examples on page 31 Grey buttons are in state Off down closed If a button is touched it becomes green to indicate the status On up open End Seg Press this button for the last segment in a rec ipe only The button will become green Start Temp This temperature is kept outside of a process Hence in Stand By the Hotplate will not cool down to ambient temperature but only to this temperature Time Total time of this segment in seconds Temp End temperature in this segment Time and Temperature depend on the machine parameter Temp Range Pin Pos For electric pins Pin position above protective glass or plate VAC Vacuum to hold the substrates in place N2 N flushing during this segment HMDS Filling of process chamber with HMDS N2 and HMDS are interlocked within a segment Pin down For pneumatic pins Move pins down during segment If button is pressed move them up Shut close Position of the electro pneumatic shutter If button is touched it becomes green and dis plays Shut open Vac Chamber Vacuum in the process chamber The values of all segments are kept in storage and hence You may freely change between the segments Next segment Touch a Previous segment Touch gt 25 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Insert Delete button Store current process recipe Start work with a sample process recipe Leave panel
32. off Cover lid is lifted Signal sounds 3 sec 1 Leave all menus by pressing the Exit button repeatedly until the Stand by panel appears 2 Switch off the unit with the main switch Location and appear ance of the main switch depend on the integration 15 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Adjust proximity pins Proximity pins define the distance between substrate and the heated plate This distance Is defined tin the Process Recipe param eters see Process recipe parameters on page 25 If the working method is switched between using a protecting glass and not using it then the proximity pins must be adjusted Electric pins Set the value Prot Plate Thickness in the Machine parameters on page 22 The upper most position of the pins is defined by Home The cor responding value in the machine parameters is Pin Startposition During a process the proximity pins are moved between these end points Pneumatic pins Note Adjust the proximity value only in lower position of the pins 1 Set the pin wheel to a value of 0 5 mm 2 Check the height of the loading pins with a dial gauge Dial gauge Pin wheel 3 If the measurement of the pins differs from the setting of the pin wheel you need to adjust the pins with a 5mm Allen key For access to the adjustment screws in bench top versions BT there are three holes in the bottom plate www sawatec com 16 MA HP 20
33. oling Monitoring compressed air Media monitoring on page 34 Monitoring N2 Media monitoring on page 34 www sawatec com 22 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Vacuum Sensor www sawatec com Hot Plate Cool Plate Monitoring Vacuum Media monitoring on page 34 This button allow to switch to a cool plate SAWATCC Heating Max Power 1 100 100 Max Heating C min 0 0 99 9 0 1 Temp range start C 0 1 99 9 15 Temp range start The device starts a process only if the target temperature has been reached within this margin If the process temperature is set to 100 C and the margin is set to 15 C then the process starts when 85 C when the plate was cooler before or at 115 C if the plate was hotter before Device is cool plate default hot plate Max Cooling C min 0 0 99 9 0 1 CP ON Level High 0 1 100 0 20 CP ON Level Low 0 1 100 0 20 The CP ON levels define the upper and lower temperatures for the con trol of a chiller of the cooling water 23 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Drive parameters Note How to come here Possible settings Heating button These parameters can only be set with the Master password In the Parameter panel touch the drive button tal Max Speed Max Acc Dec Home Offset Max
34. r use Proper use of the product includes obeying of these operating instructions by qualified personnel Improper use The Hotplate HP 200 BM is not intended to be used for list is not exhaustive Applying any additional heating devices e g to get higher tem perature than specified in the technical data Heating liquids with low viscosity These may run off the sub strate produce dangerous fumes or block the vacuum system Heating of materials with a melting point lt 300 C Heating other objects than thin substrates The Hotplate HP 200 BM is not a general purpose heating device K Drying or heating of flammable material or material which may inflame itself at the process temperature Nameplate The nameplate is located at the rear of the housing when inte grated and states CE conformity SG UUGICC pawal a eon nology Es chagger z WWW sawate om mE Hotplate Type Pas pt Temperature Installation No ANO eer Year 2014 Voltage 240 VAC LNPE 50 60 HZ Power 10A MADE IN SWITZERLAND www sawatec com 7 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAUWATCC Basic danger A heating device becomes hot by definition Burning of live tissue may result if the plate and heated objects are touched without appropriate aids Residual dangers Proper functioning exhaust Is essential for control of the tempera ture in the device The device must be operated only with a functioning e
35. ring the heating process 1 Lift the lid manually and fix it in open position 2 Place a small level tool on the plate 3 Use an Allan key size 4 mm to adjust the three levelling screws M5 Do not turn the screws more than 1 5 turns www sawatec com 9 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Controlling the process Controller interface Content of screenshots on this page Is explanatory only Using the touch panel Note Display area Panel title with current date and time Information area with input and output fields Buttons to select functions Process parameters Buttons for options device dependent Colour and b w panel green red Base 0 0 Active and inactive buttons User types www sawatec com Recipe STAR Segment o i o Remain Time l Temperatur C STOP Set 0 0 Act 00 The user interface of the controller comprises a touch panel which both displays information and allows for user input Do not press on the touch panel just touch the surface gently with your finger or a soft pointing device lt is necessary to touch the panel for at least 1 second in order to let the program recognise your action The area of the display is divided into four sections 03 07 2008 Standby 15 20 09 Open list of alarms e i EI V acProt On Off Change language of interface Depending on the order the control panel provid
36. th higher temperature Keep the lid cap open On or closed Off Cap On Off www sawatec com 17 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Select process recipe How to come here From the Automatic panel touching the field Recipe Use the up and or down wass arrows to select the desired Baking at 250 process recipe in the list Drying at SU Heceipe Mame 1 Process Selection Accept the selection with the OK button y Withdraw the selection with the Cancel button x www sawatec com 18 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC Manual mode With panel Manual the user can control every sub device manu ally Note Both in Automatic mode and in Manual mode functions damaging the device are not possible How to come here From the Stand by panel or Automatic panel with the Manual button l 01 07 2006 Manual Heating OnfOff Possible actions You can set up the General Functions as well as switch the heating Individually Heating Switch the heating on or off On Off Perform pin functions see hereafter e General functions see General functions on page 20 Pin functions How to come here In Automatic panel touch button Es Sensor Status Power On must be used first to be able to move the pins Home moves the pins to their top most position Move moves the pins to the position defined in the field Posi
37. tion above protective glass plate Power must be switched off before leaving the panel www sawatec com 19 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM SAWATCC General functions How to come here Cap St Optional sensors OFF HMDS OFF H20 OFF The button captions show pd the current state The but N2 orr Shutter orr Vac Sub oFr ton changes to green if touched and the caption 1 Fin Dowr Buzzer orr Vac Prot orr l changes also Output display Status of the sensors for cap lid and media Possible actions Buttons except the Buzzer are switches Their On state is indi cated by a green button The Buzzer is only on as long at it is pressed Note Buttons for not installed functions look transparent and are inac tive Open close the lid cap Cap Vacuum Vacuum for the process chamber Chamber Switch HMDS application HMDS Switch cooling water H20 Switch the N gt flushing N2 Switch the programmable exhaust shutter Shutter Switch the vacuum to hold the substrates Vac Sub Move Pins Down gt Up Pin Switch the buzzer sounds as long as button pressed Buzzer Switch vacuum to hold the protective glass Vac Prot Perform pin functions see Pin functions on page 19 Es Leave panel Touch the Exit button to go back to Manual mode Alarms If one of the actions creates an alarm then the Alarm but ton becomes red Alarms must be acknowledged
38. umeric key pad will pop up to enter a new value See Numeric data entry on page 10 www sawatec com 29 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Set date and time Note Display fields Set new values Sf Uf TCC The operating system in the controller Windows CE can not automatically switch between standard time and daylight savings time Hence the operator must set the time manually after the time switches 24 09 2006 Date amp Time 46 40 08 jelle sj Itl OET lx v B Day month year Hour minute second To change date or time use the Up or Down arrow buttons You may also touch on one of the displayed values for example the day number The numeric key pad will pop up to enter a new value See Numeric data entry on page 10 To set the new values touch the OK button vs The new val ues will be displayed To withdraw the new values touch the Cancel button X The current values will be displayed again Set LAN parameters Factory settings Leave panel www sawatec com The communication with the control panel requires a special pro gram licensed from the manufacturer of the panel Connection to a Local Area Network is standard 16 02 2008 Change IP Address 44 34 40 IP Address Target IP Address Gatewa xv If values are displayed in these fields do not change them Chang ing the values may cause the controller to fail Leave any panel with the
39. xhaust If the exhaust is malfunctioning the device must be switched off Depending on the settings on the control panel the temperature of the heating plate may be very harmful to live tissue Do not touch the heating plate after operation of the Hotplate HP 200 BM Always use appropriate instruments to remove the processed substrates from the device When switching the device on with the mains switch the cover may be lifted suddenly Before switching on always reduce the pressure of the compressed air to a minimum and then regulate it up to the working pressure 4 0 bar The hinges of the cover can create a strong force which can crush fingers Keep off from the area of the hinges when the cover is open and is about to close Protection against overheating A Klixone switch in the housing of the device switches off mains in case of overheating This results in an alarm message which must be acknowledged to be able to start a program recipe again The Hotplate HP 200 BM will not function until this thermal relay has cooled down and closed the circuit again www sawatec com 8 MA HP 200 BM en v2 0 2013 11 12 Hotplate HP 200 BM Sf U ATEC Setting up the device Even if the device is implemented into a housing with levelling screws to balance uneven floor the heating plate must be levelled within its frame plate Level the plate The heating plate must be levelled to avoid unequal thicknesses of coating du
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