Standard Operating Manual
Contents
1. If the equipment alarms during operation do not try to fix the problem by yourself and should report to NFF staff immediately Do not operate the equipment unless you are properly trained and approved by NFF staff Do not leave an on going experiment unattended Do not run the process for more than 999 seconds Do not start the process while the door 1s still open Do not open the door while processing Except main menu and Process for Engineering menu do not click into other menus such as Maintenance menu Do not stop the process by improper ways during normal operation For example turn off the power suddenly to stop the process Do not change the machine settings without permission of NFF staff Apart from photoresist it is not allowed to spin coat the other unapproved materials 4 4 Initial System Checks Make sure the equipment is ready Pass initial system checks To dispense photoresist with the automatic resist dispense switch in the OFF position controller front panel proceed as follows After completing the start up procedure and with the power and vacuum on place a substrate on the chuck centering it as best as possible Select spin chuck for your sample e g 2 4 wafers or specimens Fig 4 Press the VACUUM button to apply vacuum to the chuck Version TO ea Ee o _ _ ______a_ Page 11 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST 6 S2. NANOELECTRONICS FABRICATION FACILITY NFF HKUST standard Operating Manual SOLITEC 5110 C PD Manual Single Head Coater Ve etsloh TO ma Page 1 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST Contents 1 Picture and Location 2 Process Capabilities 2 1 Cleanliness Standard 2 2 Recipes 2 3 Performance of SOLITEC 5110 C PD Manual Single Head Coater 3 Contact List and How to Become a Qualified User 3 Emergency Responses and Communications 3 2 Training to Become a Qualified User 4 Operating Procedures 4 1 System Description 4 2 Safety Warnings 4 3 X Operation Rules 4 4 Initial System Checks 4 5 Status Checks 4 6 Steps to operate the equipment 4 6 1 Manual Resist Dispense 4 6 2 Clean up the equipment after use Ve tsloh TO N Page 2 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST 1 Picture and Location Exhaust Pipe Vacuum Switch l Vacuum Swich 2 4 and specimen spin chucks SOLITEC Controller Front Panel Spin Coating Chamber with lid SOLITEC 5110 C PD Manual single Head Coater Fig 1 SOLITEC 5110 C PD Manual Single Head Coater This tool 1s located at NFF Enterprise Center Cleanroom Room 4162 2 Process Capabilities 2 1 Cleanliness Standard SOLITEC 5110 C PD Manual Single Head Coater is a Non Standard equipment for photoresist coating process Ve etsloh TO gt PB BES _ _ Page 3 of 14 NANOELECTRONIC
3. NOELECTRONICS FABRICATION FACILITY NFF HKUST 4 6 2 Clean up the equipment after use 1 When finish your spin coating process and sample unloading close the lid for the exhaust pipeline to absorb the smell of photoresist 2 Keep the spin coater spinner chuck and the desk clean by using Acetone or IPA and cleanroom wipers 3 Clean up the area and return items to their proper locations 4 Fill in the record or any problems in the logbook Vetsloh lL m rw Page 14 of 14
4. S FABRICATION FACILITY NFF HKUST 2 2 Recipes The standard recipes for this equipment are shown at the NFF official webpage https www nff ust hk mffdoc Labprocessdata project5 docs default htm Users can edit recipes based on the thickness and resist type which the process requires For any enquires of recipe editing please contact NFF EC staff 2 3 Performance of SOLITEC Manual Resist Coater Spin Speed Range 0 5000 RPM Spin Timing Range 1 999 seconds Substrate size 2 amp 4 or specimens 3 Contact List and How to Become a Qualified User 3 1 Emergency Responses and Communications e Security Control Center 2358 8999 24hr amp 2358 6565 24hr e Safety Officer Mr Wing Leong CHUNG 2358 7211 amp 64406238 e Deputy Safety Officer Mr Man Wai LEE 2358 7900 amp 9621 7708 e NFF EC Technician Mr Peter Yiu Cheong PUN 2358 7225 amp 2358 7218 e NFF Phase 2 Technician Mr Wilson Pui Keung YIP 2358 7894 Version LO SS Pea Page 4 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST 3 2 Training to Become a Qualified User Please follow the procedure below to become a qualified user 1 Read the operation manual of SOLITEC 5110 C PD Manual Single Head Coater which can be found in NFF web site 2 Send an e mail to NFF requesting SOLITEC 5110 C PD Manual Single Head Coater operation training Scheduling can take up to several weeks due to the many requests coming in for this tool 4 Oper
5. ating Procedures 4 1 System Description Fig 2a SOLITEC 5110 C PD Controller Front Panel Ve etsloh TU m Page 5 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST SS c 2222 m TEES RCN oS ee ees a AES N KA SERA CYCLE TIME Fig 2b SOLITEC 5110 C PD Controller Front Panel A Process System Power Vacuum Start Stop Switches with Vacuum and Motor Purge Interlock Indicators B Digital Readout Actual Speed is RPM x 1000 C Servo Motor Ramp Setting Dial Indicator 000 Fast 999 Slow D Process Function Cycle Timer Time Length Select Total Time MAX of 99 9 or 990 seconds depending on cycle function E Resist Select Switch Up to five different sources can be selected F Dispense Select Switch Auto Process Run Liquid Dispense Off Process Run No Liquid Dispense G Process Head Position Select Switch Down Process Head in the Down Vetsloh TO Sa UU UU TR Page 6 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST position Up Process Head in the Up position Auto Process Head will automatically move to the Up or Down position according to the process functions selected H Process Function Select Switch Selects Either Coat or Develop I Spindle Speed Control 0 999 setting equivalent to 0 9999 RPM Please Limit Speed to below 5000 RPM for Safety J Process Fu
6. elect the SPREAD cycle by pressing the SPREAD function button should illuminate the button 7 Setthe desired time and speeds for the SPREAD and SPIN cycles 8 Low speed spin spread of photoresist chemical SPREAD 9 High speed spin dry SPIN 10 Apply the desired amount of photoresist you should use the rubber bulb and pipette to drop the photoresist Do not pour the photoresist through the bottle 11 Press the START button 12 After the SPREAD and SPIN cycles have been completed and the spindle is stopped release the VACUUM button and remove the substrate Remark A completed check list of SOLITEC 5110 C PD Manual Single Head Coater 1s provided User must follow the procedures and fill in the list before operation 4 5 Status Checks Reservation is needed for this equipment Please book and check in the equipment before operation 4 6 Steps to Operate the Equipment 4 6 1 Manual Resist Dispense 1 Make sure the equipment power is ON 2 The dispense mode 1s OFF 3 Process Function Select Switch is switched to Develop position 4 Make sure that the SPREAD and SPIN cycles buttons on the control panel are pressed Vetsloh TO r axysssssssssssIIIr c r m rra Page 12 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST 5 Select a spinner chuck according to the size of your substrate 6 Make sure the spinner chuck and the surrounding is clean and free
7. he substrate from the Vetsloh TU m mm w a Page 9 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST process spin chuck 4 2 Safety Warnings Users can cause injury by this equipment if it is not being used under a cautious manner 1 When using O ring chuck the area of the chuck inside the O ring should be as large as the substrate Since this area increases as the square of the diameter the largest practical diameter chick should be used To keep the coefficient of friction high O ring clean and elastic Check the O ring contact with the substrate by placing a piece of flat glass on the chuck and verifying that the O ring flattens against the glass 2 If the substrate 1s heavy such as thick glass or ceramic it must be accurately centered on the chuck The spin speed should be as low as the process will allow 3 With an irregular shaped wafer such as gallium arsenide the user must develop the skill of judging where the center of gravity is and positioning it in the center of the chuck 4 If there is a leak on the face of the chuck while holding a wafer it is probably due to an improper contact between the chuck and the wafer Flat chucks may leak if substrates are rough or bowed Check the following items a Burrs or cuts on the chuck b Warped substrate and c Thin chuck O ring Version TO N Page 10 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST 4 3 Operation Rules 10
8. nction Select Switches When press the function key the pushbutton will illuminate Then the process will start indicated from the left to the right side shown on the front panel successively Fig 3 Controller Front Panel and Spin Coating Chamber with Lid Ve etsloh TO N Page 7 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST Fig 4 Spinner Chucks 2 4 and specimens Fig 5 Spinner Chuck Spindle Motor Coating Chamber with Lid and Heavy Duty Aluminum Foil covering to maintain a clean around the coater Veron TU DhM BR m m m Page 8 of 14 NANOELECTRONICS FABRICATION FACILITY NFF HKUST Fig 6 Vacuum Ball Valve for applying vacuum to the chuck With SOLITEC 5110 C PD Manual Single Head Coater substrates are manually loaded onto the process spin chuck Press VACUUM button on the front panel of the system controller vacuum is applied to hold the substrate on the chuck during processing Press START button to initiate the selectable process function Coat for application of photoresist liquids typically positive type The Coat program includes the following general process steps Resist Dispense of photoresist Spread Low to medium speed spin to spread the dispensed photoresist across the substrate Spin Medium to high speed spin to create the proper thickness of photoresist across the substrate and to dry the photoresist prior to removal of t
9. of any residual resist or polymer Clean with Acetone or IPA and cleanroom wipes if necessary 7 Gently press down the spinner chuck onto the spindle 8 Try to use a tweezer to place your substrate on the spinner chuck and center it Make sure your substrate covers the spinner chuck completely otherwise the film you are planning on coating will cover the chuck and contaminate the backside of your substrate It may even result in the loss of vacuum and ejection of your sample during the spinning process 9 Press the vacuum button on the deck to hold down your substrate 10 Locate the Time knob directly underneath the SPREAD and SPIN cycle buttons and Spindle Speed knobs Set the knob to 30 seconds and 60 seconds respectively 11 Press the Start button on the deck and coater will follow your SPREAD and SPIN spindle speed to finish your coating process 12 Watch your wafer substrate to ensure that it 1s properly centered and situated on the spinner chuck If it is not centered release the vacuum by depressing the Vacuum button on the deck and center your substrate again Repeat until your substrate 1s centered precisely Centering becomes more critical at higher spin rates 13 For a 2 step spin process depress the SPREAD button and make sure it 1s lit Then the operation will proceed according to the setting of the Spindle Speed and Timer knobs which located directly below the SPREAD and SPIN buttons Version TU N Page 13 of 14 NA
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