BoosterPack Development Guide (Rev. A)
Contents
1. 15 U4Tx U1Tx MOPWM7 PhA1 WTOCCP1 U1CTS 4 06 PC6 CO 14 U3Rx PhB1 WT1CCPO USBOEPE N 4 07 PC7 co 13 U3Tx WT1CCP1 USBOPFLT 4 08 PD6 ai 53 U2Rx E PhAO WT5CCPO A 4 09 PD7 10 U2Tx PhBO WT5CCP1 NMI 4 10 PF4 USR_SW 5 s M1FAULTO IDXO T2CCPO USBOEPE 1 R13 N Not recommended for BoosterPack use This signal tied to on board function via 0 Q resistor SPMU288A August 2012 Revised April 2013 Tiva M C Series EK TM4C123GXL LaunchPad BoosterPack Development 5 Submit Documentation Feedback Guide Copyright 2012 2013 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS LaunchPad Power Interface www ti com 4 LaunchPad Power Interface The Tiva C Series LaunchPad has provisions to provide power to a BoosterPack through either the BoosterPack Interface or the BoosterPack XL Interface The configuration of power and ground pins on both of these interfaces must be consistent across LaunchPads from all TI microcontroller families The TM4C123G LaunchPad draws power from either of the on board USB interfaces as selected by the power switch in the top left corner of the board Typically the USB connection provides 500 mA at 5 V to the Tiva C Series LaunchPad The selected USB power source is made directly available to the BoosterPack XL Interface on the J3 01 pin This pin is2. Please note that if you could not follow the instructions above you will be subject to penalties of Radio Law of Japan Texas Instruments Japan Limited address 24 1 Nishi Shinjuku 6 chome Shinjuku ku Tokyo Japan http www tij co jp CPA SES TO FAREY d Bf E E SEE E 32 7 TB RE Ac FB a DI EARL TI ERR TOLS AFOWI NP DEEE TULE WEP 51 FI DTEZES lt LEE 1 BRAT A ROR AR S CET lt FR1SF3 AO AMBRE TRA1735 Ed Shi ERIE E E 0 MBM CE EREI lt e 2 RRRAO TFEMSRCHAUEEX 3 RN R RIENREMS RCHARUEEX ZB Ami Lito TEACO TOS REX BEAIBALZUR BE B T ESUEDELRKT Re FEU e USER BRAM RAAB RR E NSRP pa Ir E CBE ABFT VA II AIAX IRI SRR ARTE X PIE 6 IA 2 4 15 PETE HE http www tij co jp EVALUATION BOARD KIT MODULE EVM WARNINGS RESTRICTIONS AND DISCLAIMERS For Feasibility Evaluation Only in Laboratory Development Environments Unless otherwise indicated this EVM is not a finished electrical equipment and not intended for consumer use It is intended solely for use for preliminary feasibility evaluation in laboratory development environments by technically qualified electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components systems and subsystems It should not be used as all or part of a finished end product Your Sole Responsibility and Risk You acknowledge represent and agree that 1 You have unique knowledge concerning Federal State
3. 0 V 3 02 GND PDO AIN7 Connected 61 SSI3CIk SSI1Clk I2C3SCL MOPWM6 M1PWMO WT2CCPO for MSP430 3 03 PB6 Compatibilit 1 SSI2Rx MOPWMO TOCCPO iai a z y R9 PD1 AIN6 Connected 92 SSI3Fss SSI1Fss I2C3SDA MOPWM7 M1PWM1 WT2CCP1 iai for MSP430 3 04 PB7 Compatibilit 4 SSI2Tx MOPWM1 TOCCP1 y R10 3 05 PD2 AIN5 63 SSI3Rx SSI1Rx MOFAULTO WT3CCPO USBOEPE N 3 06 PD3 AIN4 S 64 SSI3Tx SSI1Tx s WT3CCP1 USBOPFLT E 3 07 PE1 AIN2 8 U7Tx 3 08 PE2 AIN1 7 3 09 PES AINO 6 3 10 PF1 29 U1CTS SSI1Tx S M1PWM5 TOCCP1 iai Cio TRD1 2 Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad Not recommended for BoosterPack use This signal tied to on board function via 0 Q resistor Table 5 J4 Connector Analog Tiva C i 7 Function On Sanes GPIOPCTL Register Setting GPIO board an GPIO Function MCU 1 2 3 4 5 6 7 8 9 14 15 AMSEL Pin 4 01 PF2 Blue LED 30 SSI1Clk MOFAULTO M1PWM6 T1CCPO Ur TRDO R11 4 02 PF3 Green 31 SSI1Fss CANOTx M1PWM7 T1CCP1 TRCLK LED R12 4 03 PB3 48 I2C0SDA T3CCP1 re 4 04 PC4 C1 16 U4Rx U1Rx MOPWM6 IDX1 WTOCCPO U1RTS 3 4 05 PC5 C1
4. Interface ICDI LCD VBU I DEBUG POTD ITARGETRST I a 143 3V REG LCD EBUG PCOICR SWCLKI ICDI JTAG R33 TEXAS INSTRUMENTS 8 PROJECT Tiva TM4C123G LaunchPad LA ot i ata A 108 WILD BASIN ROAD SUITE 350 DESCRIPTION AUSTIN TX 78746 In Circuit Debug Interface www ti com EVALUATION BOARD KIT MODULE EVM ADDITIONAL TERMS Texas Instruments Tl provides the enclosed Evaluation Board Kit Module EVM under the following conditions The user assumes all responsibility and liability for proper and safe handling of the goods Further the user indemnifies TI from all claims arising from the handling or use of the goods Should this evaluation board kit not meet the specifications indicated in the User s Guide the board kit may be returned within 30 days from the date of delivery for a full refund THE FOREGOING LIMITED WARRANTY IS THE EXCLUSIVE WARRANTY MADE BY SELLER TO BUYER AND IS IN LIEU OF ALL OTHER WARRANTIES EXPRESSED IMPLIED OR STATUTORY INCLUDING ANY WARRANTY OF MERCHANTABILITY OR FITNESS FOR ANY PARTICULAR PURPOSE EXCEPT TO THE EXTENT OF THE INDEMNITY SET FORTH ABOVE NEITHER PARTY SHALL BE LIABLE TO THE OTHER FOR ANY INDIRECT SPECIAL INCIDENTAL OR CONSEQUENTIAL DAMAGES Please read the User s Guide and specifically the Warnings and Restrictions notice in the User s Guide prior to handling the product This notice contains important safety information about
5. r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Le pr sent metteur radio a t approuv par Industrie Canada pour fonctionner avec les types d antenne num r s dans le manuel d usage et ayant un gain admissible maximal et l impedance requise pour chaque type d antenne Les types d antenne non inclus dans cette liste ou dont le gain est sup rieur au gain maximal indiqu sont strictement interdits pour l exploitation de l metteur important Notice for Users of this Product in Japan This development kit is NOT certified as Confirming to Technical Regulations of Radio Law of Japan If you use this product in Japan you are required by Radio Law of Japan to follow the instructions below with respect to this product 1 Use this product in a shielded room or any other test facility as defined in the notification 4173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use this product only after you obtained the license of Test Radio Station as provided in Radio Law of Japan with respect to this product or 3 Use of this product only after you obtained the Technical Regulations Conformity Certification as provided in Radio Law of Japan with respect to this product Also please do not transfer this product unless you give the same notice above to the transferee
6. H Development Guide 13 TEXAS ere sans August 2012 Revised April 2013 INSTRUMENTS Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development Guide The Texas Instruments Tiva C Series TM4C123G LaunchPad concept is an extremely low cost expandable evaluation system for TI microcontrollers This concept began with the tremendously successful MSP430 LaunchPad which introduced a large number of engineers to the TI MSP430 family of microcontrollers MCUs The Tiva Series of 32 bit ARM Cortex M4 MCU family expands that success by introducing the Tiva C Series TM4C123G LaunchPad featuring the Tiva C Series TM4C123GH6PM microcontroller Build your own BoosterPack and take advantage of Texas Instruments website to help promote it From sharing a new idea or project to designing manufacturing and selling your own BoosterPack kit TI offers a variety of avenues for you to reach potential customers with your solutions This document briefly discusses the design and architecture of the LaunchPad platform and presents practical guidelines for application developers to build their own BoosterPacks for use with any of the available TI MCU LaunchPad kits For more information about the LaunchPad or about the BoosterPacks currently available for each LaunchPad kit visit the LaunchPad site at www ti com Contents 1 LaunchPad and BoosterPack Expansion Concept and Overview lt nenea eee eee eee eee nene een
7. O Removal of this jumper disconnects the functions All jumpers are installed by default A listing of these jumpers and the respective use of each is provided in Table 6 Special Consideration for Shared Pins Table 6 Tiva C Series LaunchPad Jumper List Resistor Primary Function Alternate Function Comments R1 Right User Switch J2 04 Test pin on MSP430 LaunchPad This connection along with R13 provides Hibernate wake to BoosterPack Interface R2 Red LED To PF1 and J3 10 If removed allows extra GPIO to the BoosterPack XL Interface If installed default allows BoosterPack to drive LED or sense LED state Also provides Embedded Trace signal TRD1 R8 Hibernate Wake To PFO and J2 04 via R1 Allows user switch 2 to wake device from hibernate Also ties wake to J2 04 to allow BoosterPack to wake Stellaris LaunchPad from Hibernate R9 PB6 SSI2 TX on J2 07 PDO I2C SCL on J2 07 Routes I2C from PDO to J2 07 for MSP430 Tiva C Series LaunchPad compatibility If using PDO or PB6 the unused GPIO must be configured as an input or R9 removed R10 PB7 SSI2 RX on J2 06 PD1 12C SDA on J2 06 Routes 1 C from PD1 to J2 06 for MSP430 Tiva C Series LaunchPad compatibility If using PD1 or PB7 the unused GPIO must be configured as an input or R9 removed R11 Blue LED To PF2 and J4 01 If removed allows extra GPIO to the BoosterPack XL Interface If installed defaul
8. Pack XL Interface Figure 1 shows a photo of the Tiva C Series LaunchPad Figure 1 Tiva C Series TM4C123G LaunchPad Evaluation Board Power Select USB Connector Switch Power ICDI Green Power LED Tiva TM4C123GH6PMI Microcontroller eee LL R63 USB Micro A B Reset Switch Connector Device DBG a www ti com launchpad RGB User LED z a NOM of Lo w RS E E PPR pi EK TMACI23GXL REV A Tiva C Series lis set gy E Pau RIGA pas LaunchPad ira ad mel sus gt vonc Pro el a 7A BoosterPack XL Tiva C Series A ai m fe PF3 PB2 JR Interface J1 J2 J3 LaunchPad g P0 Poo 141 SN wees Pio SB and J4 Connectors BoosterPack XL ae 4 pce po lt A ay Interface J1 J2 J3 gt an Tiva and J4 Connectors PERII BR F lt TMACTASGHGPMI 7 Pee P87 lt A SA Microcontroller PC7 PUG gt Y PDS A4 Al d 2 PAT PFS MSP430 y ss TEXAS INSTRUMENTS MSP430 LaunchPad Compatible i RI3 my LaunchPad Compatible BoosterPack Interface JE Dr mo i BoosterPack Interface Tiva C Series aj ar mg AaunchPad User Switch 1 User Switch 2 SPMU288A August 2012 Revised April 2013 Tiva M C Series EK TM4C123GXL LaunchPad BoosterPack Development 3 Submit Documentation Feedback Guide Copyright 2012 2013 Texas Instruments Incorporated I TEXAS INSTRUMENTS BoosterPack Functional Interface www ti com 2 BoosterPack Functional Interface The Tiva C Series LaunchPad BoosterPack Interface provides compatibility with t
9. USB Expansion Buttons and LED Power Management In Circuit Debug Interface SPMU288A August 2012 Revised April 2013 Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development 9 Submit Documentation Feedback Guide Copyright 2012 2013 Texas Instruments Incorporated J1 and J2 provide compatability with Booster Packs designed for MSP430 Launchpad J3 and J4 sit 100 mils inside J1 and J2 to provide extended functions specific to this board See the board user manual for complete table of pin mux functions GPIOI TEI Louer SHEER LUSR Swi I RGB_LED_0404_ COMA a DESIGNER REVISION DATE TEXAS INSTRUMENTS DGT 0 3 2 20 2013 PROJECT TVA MICROCONTROLLERS Tiva TM4C 123G LaunchPad 108 WILD BASIN ROAD SUITE 350 DESCRIPTION AUSTIN TX 78746 www ti com Microcontroller USB Expansion Buttons and LED FILENAME PART NO EK TM4C123GXL Rev A sch EK TM4C123GXL ME 1 OF3 3 3V 400mA Regulator Fes CDI ASTI OMIT this SVS Section for Tiva Errata Fixed RESET ix I RESET __ H24 and H25 installed as a single 1x2 header on 100 mil center with jumper MGU PWR I 4 I 143 3 DESIGNER REVISION DATE DGT 0 3 2 20 2013 PROJECT Tiva Launchpad DESCRIPTION Power Management TEXAS INSTRUMENTS e TIVA MICROCONTROLLERS 108 WILD BASIN ROAD SUITE 350 AUSTIN TX 78746 www ti com In Circuit Debug
10. a direct connection with only small decoupling Capacitors provided on the Tiva C Series LaunchPad All LaunchPads including the TM4C123G LaunchPad also provide a 3 3 V supply on pin J1 01 of the BoosterPack Interface On the Tiva C Series LaunchPad this supply is sourced by a TPS73633 LDO voltage regulator which converts the selected 5 V USB power to 3 3 V The regulator is capable of sourcing 400 mA at 3 3 V This 3 3 V supply is shared between the BoosterPack Interface the in circuit debug interface ICDI and the target microcontroller Therefore under normal circumstances approximately 300 mA to 350 mA are available to the BoosterPack Interface Detailed power management is the responsibility of the BoosterPack developer who must also manage the application to be run on the target microcontroller The TM4C123G LaunchPad can be powered through an external supply on a BoosterPack If providing power to the Tiva C Series LaunchPad from a BoosterPack move the power select switch to select an unused USB connection to prevent power bus contention between the BoosterPack and the USB connection Power may be supplied to either the 3 3 V or the 5 0 V system but not both Providing external power to both 5 V and 3 3 V would result in a contention between the external power supplies and the TM4C123G LaunchPad voltage regulator Providing only 3 3 V results in some lost functionality for example the on board LEDs may not illuminate It may also resu
11. ademark of ARM Limited All other trademarks are the property of their respective owners SPMU288A August 2012 Revised April 2013 Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development 1 Submit Documentation Feedback Guide Copyright 2012 2013 Texas Instruments Incorporated LaunchPad and BoosterPack Expansion Concept and Overview 1 I TEXAS INSTRUMENTS www ti com LaunchPad and BoosterPack Expansion Concept and Overview The Texas Instruments Tiva C Series TM4C123G LaunchPad concept is an extremely low cost expandable evaluation system for TI s Tiva C Series of ARM microcontrollers This concept began with the tremendously successful MSP430 LaunchPad which introduced a large number of engineers to the TI MSP430 family of microcontrollers The TI Stellaris LM4F120 LaunchPad expanded on that success Now the LaunchPad evaluation kit platform introduces the Tiva C Series EK TM4C123GXL LaunchPad featuring the Tiva C Series TM4C123GH6PM MCU A Tiva C Series LaunchPad consists of a target microcontroller an in circuit debug interface ICDI such as JTAG a regulated power supply a minimal microcontroller support circuit a user interface and a set of expansion headers These expansion headers are referred to as the BoosterPack Interface A BoosterPack is an expansion card designed for this interface The BoosterPack interface provides a mechanism for developers to easily extend the Tiva C Series LaunchPad with appl
12. and local regulatory requirements including but not limited to Food and Drug Administration regulations if applicable which relate to your products and which relate to your use and or that of your employees affiliates contractors or designees of the EVM for evaluation testing and other purposes 2 You have full and exclusive responsibility to assure the safety and compliance of your products with all such laws and other applicable regulatory requirements and also to assure the safety of any activities to be conducted by you and or your employees affiliates contractors or designees using the EVM Further you are responsible to assure that any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard 3 You will employ reasonable safeguards to ensure that your use of the EVM will not result in any property damage injury or death even if the EVM should fail to perform as described or expected 4 You will take care of proper disposal and recycling of the EVM s electronic components and packing materials Certain Instructions It is important to operate this EVM within TI s recommended specifications and environmental considerations per the user guidelines Exceeding the specified EVM ratings including but not limited to input and output voltage current power and environmental rang
13. ded cells indicate configuration for compatibility with the MSP430 LaunchPad Table 3 J2 Connector Analog Tiva C GPIOPCTL Regi i i gister Setting J2 GPIO Function On board Series Pin GPIO Function MCU AMSEL Pin 1 2 3 4 5 6 7 8 9 14 15 2 01 GND 2 02 PB2 47 I2COSCL T3CCPO _ 2 03 PEO AIN3 9 U7Rx 2 04 PFO USR_SW2 28 U1RTS SSI1Rx CANORx M1PWM4 PhAO TOCCPO NMI Coo WAKE R1 2 05 RESET PB7 Connected 4 SSI2Tx iai MOPWM1 TOCCP1 for MSP430 2 06 PD1 AIN6 Compatibility 62 SSI3Fss SSI1Fss I2C3SDA MOPWM7 MIPWMI WT2CCP1 R10 PB6 Connected 1 SSI2Rx MOPWMO TOCCPO 2 07 PDO AIN7 Tor sea 61 SSI3CIk SSI1Clk I2C3SCL MOPWM6 M1PWMO WT2CCPO Compatibility R9 2 08 PA4 21 SSIORx zi 2 09 PA3 20 SSIOFss 2 10 PA2 19 SSIOCIk i 0 Shaded cells indicate configuration for compatibility with the MSP430 LaunchPad Not recommended for BoosterPack use J2 04 is a TEST pin on the MSP430 LaunchPad This signal tied to on board function via 0 Q resistor Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development SPMU288A August 2012 Revised April 2013 Guide Submit Documentation Feedback Copyright 2012 2013 Texas Instruments Incorp
14. e user at his own expense will be required to take whatever measures may be required to correct this interference General Statement for EVMs including a radio User Power Frequency Use Obligations This radio is intended for development professional use only in legally allocated frequency and power limits Any use of radio frequencies and or power availability of this EVM and its development application s must comply with local laws governing radio spectrum allocation and power limits for this evaluation module It is the user s sole responsibility to only operate this radio in legally acceptable frequency space and within legally mandated power limitations Any exceptions to this are strictly prohibited and unauthorized by Texas Instruments unless user has obtained appropriate experimental development licenses from local regulatory authorities which is responsibility of user including its acceptable authorization For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant Caution This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any interference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment FCC Interference Statement f
15. eeeaenee 2 2 BoosterPack Functional Interface ia asanarea ata ata stearat iata aaa a atata EEEE A E S 4 3 BoosterPack XL Functional Interface nn ui aia anina aia a e ti taina noa ii iii iai ia int a a a 5 4 LaunchPad Power Interface issues a aaa aaa a ae atace ea ca cect ta aia atata ata a aaa alatala aa aa at i act aaa la aaa ata 6 5 Special Consideration for Shared Pins ssis sgrnan eee e en eea eee eee aG 7 6 Tiva C Series LaunchPad Dimensions and Mating sssssssssssnnrrnnnnnnnnnnnnrnnnnnnnnnnnnnnnnnnnnnnnnnnnnnn 7 7 BoosterPack Design Guidelines 52225485 iai a ic iati i ai i i i ati wats 8 8 References and Schematics 232sisemcsodeseniuenmeemedeneneonmninennenenenegeninennemenenennuedteninaninnananes 9 List of Tables 1 LaunchPad BoosterPack Compatibility Summary lt lt eee eee eee eee eee eee amana ema eeeaenea 2 2 Ji CONNECION n css arta vai oa ai aid il ana al a daia a aa a aa apa it 4 3 J2 Connector na aseza a area i atatia DD ar aa Ea p aa a a ee a ba a Pa Sint i tan E aa 4 4 Ja Connector cc se ai i apara aa i i i ata a i ja it a e cu God wa at ta a a i 5 5 JA CONNECTOR assistant meat ina a a it i tt little aa nee osseuse 5 6 Tiva C Series LaunchPad Jumper List eee eee eee eee eee emma a eee nene emana ae eame nenea aeeauneanaaee 7 Tiva MSP430 are trademarks of Texas Instruments Stellaris is a registered trademark of Texas Instruments Cortex is a trademark of ARM Limited ARM is a registered tr
16. eproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices TI is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice TI is not responsible or liable for any such statements Buyer acknowledges and agrees that it is solely responsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buyer represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures monitor failures and their consequences lessen the likelihood of failures that might cause harm and take appropriate remedial actions Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety critical applications In some cases TI components may be promo
17. es may cause property damage personal injury or death If there are questions concerning these ratings please contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM User s Guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation some circuit components may have case temperatures greater than 60 C as long as the input and output are maintained at a normal ambient operating temperature These components include but are not limited to linear regulators switching transistors pass transistors and current sense resistors which can be identified using the EVM schematic located in the EVM User s Guide When placing measurement probes near these devices during normal operation please be aware that these devices may be very warm to the touch As with all electronic evaluation tools only qualified personnel knowledgeable in electronic measurement and diagnostics normally found in development environments should use these EVMs Agreement to Defend Indemnify and Hold Harmless You agree to defend indemnify and hold TI its licensors and their representatives harmless from and against an
18. he original MSP430 LaunchPad BoosterPack interface This interface consists of the outer 10 pin headers The pins are spaced 0 10 in 2 54 mm apart with the two headers located 1 8 in 4 572 cm apart Table 2 and Table 3 both provide information about which Tiva C Series MCU peripherals are routed to each of the interface pins The J1 connector is located on the far left side of the Tiva C Series LaunchPad The J2 connector is located on the far right side of the TM4C123G LaunchPad Software is used to configure the TM4C123GH6PM pin for one of the functions found in the tables Highlighted functions indicate configuration for compatibility with the MSP430 LaunchPad Table 2 J1 Connector Analog Tiva C i A Function On Soes GPIOPCTL Register Setting J1 Pin GPIO GPIO board MCU Function E AMSEL Pin 1 2 3 4 5 6 7 8 9 14 15 1 01 3 3 V 1 02 PB5 AIN11 57 a SSI2Fss MOPWM3 T1CCP1 CANOTx 1 03 PBO USBOID 45 U1Rx T2CCPO 1 04 PB1 USBOVBUS 46 U1Tx T2CCP1 1 05 PE4 AIN9 59 U5Rx I2C2SCL MOPWM4 M1PWM2 CANORx 1 06 PES AIN8 60 U5Tx I2C2SDA MOPWM5 M1PWM3 CANOTx 1 07 PB4 AIN10 58 SSI2CIk MOPWM2 zi T1CCPO CANORx 1 08 PA5 22 SSIOTx a 1 09 PA6 23 12C1SCL M1PWM2 5 1 10 PA7 24 12C1SDA M1PWM3 Sha
19. ication and user specific functions The EK TM4C123GXL LaunchPad provides a BoosterPack interface that is compatible with the MSP430 LaunchPad In addition the TM4C123 LaunchPad provides access to additional Tiva C Series functionality through an extended BoosterPack interface called the BoosterPack XL Interface BoosterPack interfaces with highly similar functionality for expansion will be available for the Tiva C Series LaunchPad in addition to microcontroller family specific functionality available on a BoosterPack XL Interface for additional options Table 1 provides a summary of current BoosterPack interface compatibility Table 1 LaunchPad BoosterPack Compatibility Summary Compatible with LaunchPad Kit BoosterPack Interface BoosterPack XL Interface Stellaris LaunchPad Yes Yes MSP430 LaunchPads Yes No Tiva C Series LaunchPad Yes Yes Other TI LaunchPads Yes No Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development Guide Copyright 2012 2013 Texas Instruments Incorporated SPMU288A August 2012 Revised April 2013 Submit Documentation Feedback 13 TEXAS INSTRUMENTS www ti com LaunchPad and BoosterPack Expansion Concept and Overview This development guide provides necessary design information for developers who want to create BoosterPacks that extend the functionality of the Tiva C Series or Stellaris LaunchPads using either the original BoosterPack Interface or the Booster
20. lace the antenna to the left or right of the Tiva C Series LaunchPad for minimal interference and signal attenuation The BoosterPack interface does not provide any means of keying or alignment guidance It is recommended that visual cues be provided on the BoosterPack to assist user in proper orientation of the BoosterPack If possible design the BoosterPack so that incorrect mating to a Tiva C Series LaunchPad does not damage the BoosterPack Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development SPMU288A August 2012 Revised April 2013 Guide Submit Documentation Feedback Copyright 2012 2013 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS www ti com References and Schematics 8 References and Schematics 8 1 References In addition to this document the following references are available for download at www ti com Tiva C Series TM4C123GH6PM Microcontroller Data Sheet literature number SPMS376 Tiva C Series LaunchPad EK TM4C123GXL User Guide Available for download at www ti com tool ek tm4c123gxl TivaWare for C Series Driver Library Available for download at www ti com tool sw tm4c drl TivaWare for C Series Driver Library User s Manual literature number SPMU298 TPS73633 Low Dropout Regulator with Reverse Current Protection Data Sheet literature number SBVS038 8 2 Schematics This section contains the complete schematics for the Tiva C Series LaunchPad board Microcontroller
21. ld subject to Tl s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its components to the specifications applicable at the time of sale in accordance with the warranty in Tl s terms and conditions of sale of semiconductor products Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty Except where mandated by applicable law testing of all parameters of each component is not necessarily performed TI assumes no liability for applications assistance or the design of Buyers products Buyers are responsible for their products and applications using TI components To minimize the risks associated with Buyers products and applications Buyers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any patent right copyright mask work right or other intellectual property right relating to any combination machine or process in which TI components or services are used Information published by TI regarding third party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from TI under the patents or other intellectual property of TI R
22. lt in reverse current leakage through the on board voltage regulator Therefore if providing power externally it is recommended to use either the existing USB connections or an external 5 V supply from a BoosterPack Ground connections are available on pins J2 01 and J3 02 These pins provide a ground connection for both the BoosterPack Interface and the BoosterPack XL Interface respectively Additional power and ground pins are available through labeled pins located in the extreme lower corners of the Tiva C Series LaunchPad These pins are connected to the same 3 3 V 5 V and ground connections as the pins on the BoosterPack Interface and the BoosterPack XL Interface Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development SPMU288A August 2012 Revised April 2013 Guide Submit Documentation Feedback Copyright 2012 2013 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS www ti com 5 Special Consideration for Shared Pins To provide compatibility with the MSP430 LaunchPad s BoosterPack interface as well as to provide a maximum number of signals to the BoosterPack Interface and BoosterPack XL Interface it was necessary to route some signals to more than one pin In addition certain on board functions such as the button and LED signals are available on the BoosterPack Interface and BoosterPack XL Interface A 0 O jumper resistor was installed for signals that are used for more than one purpose or routed to more than one GPI
23. ntrollers RFID OMAP Applications Processors Wireless Connectivity dataconverter ti com www dlp com www ti com clocks interface ti com logic ti com microcontroller ti com www ti rfid com www ti com omap Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space Avionics and Defense Video and Imaging TI E2E Community www ti com wirelessconnectivity www ti com computers www ti com consumer apps www ti com energy www ti com industrial www ti com medical www ti com security www ti com space avionics defense www ti com video Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2013 Texas Instruments Incorporated
24. or Class A EVM devices This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense FCC Interference Statement for Class B EVM devices This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference b
25. orated 1 TEXAS INSTRUMENTS www ti com BoosterPack XL Functional Interface 3 BoosterPack XL Functional Interface The BoosterPack XL Interface consists of the J1 and J2 connectors as well as the inner 10 pin headers spaced 1 6 in 4 064 cm apart directly inside of the MSP430 LaunchPad compatible BoosterPack interface headers The pins are spaced on 0 10 inch 2 54 mm centers These inner 10 pin headers connectors J3 and J4 are not intended to be compatible with other TI LaunchPads or LaunchPad XL kits This feature is a Tiva C Series only interface TI recommends that LaunchPads provide analog functions on the left side of the BoosterPack XL interface and timer or PWM functions on the right side of the BoosterPack XL interface The Tiva C Series board conforms to these recommendations No effort has been made to make this interface compatible with any other LaunchPad Table 4 and Table 5 show the Tiva C Series peripherals that are routed to each pin of the Tiva C Series only BoosterPack XL Interface pins J3 is the inner left BoosterPack XL Interface header J4 is the inner right BoosterPack XL Interface header Software is used to configure the TM4C123GH6PM pin for one of the functions found in the tables Table 4 J3 Connector Analog Tiva C GPIOPCTL Regi i m gister Setting J3 GPIO Function On board Series Pin GPIO Function MCU AMSEL Pin 1 2 3 4 5 6 7 8 9 14 15 3 01 5
26. struments Incorporated BoosterPack Design Guidelines I TEXAS INSTRUMENTS www ti com Figure 2 Tiva C Series LaunchPad Dimensions Ez 300mil 1 ee 79 ee u R27 R19 RM RESET 1100mil 500mil ADR 400mil a i bs eoo 700mil ee RS n Pa m 345mil i 100 i i me a a i mi ee b o be ee js ee amp 6 o i ee 2600mil pape td ee ee ee e o 1400mil ee ee Sd R9 RIO e e e o 2 6 o 200mil 43 TEXAS INSTRUMENTS w e ai Ly e A Le sr YZ Tiva C Series k e y aunch d 500mil 1100mil gt 900mil 1600mil 1800mil 2000mil NOTE Units are in mils one thousandth of an inch 1 mil 0 001 inch 0 0254 mm BoosterPack Design Guidelines Follow these guidelines when designing your BoosterPack BoosterPacks should not extend more than 0 350 in 8 89 mm above the center of the top BoosterPack Interface pin BoosterPacks should not extend more than 0 150 in 3 81 mm below the center of the bottom pin of the BoosterPack Interface NOTE BoosterPacks that extend more than 0 150 in 3 81 mm below the center of the bottom pin will partially cover the Tiva C Series LaunchPad user switches which can result in lost user access to those user inputs BoosterPacks are not restricted in width and may extend as much as desired left and right of the Tiva C Series LaunchPad For BoosterPacks with RF antennas p
27. t allows BoosterPack to drive LED or sense LED state Also provides Embedded Trace signal TRDO R12 Green LED To PF3 and J4 02 If removed allows extra GPIO to the BoosterPack XL Interface If installed default allows BoosterPack to drive LED or sense LED state Also provides Embedded Trace signal TRDCLK R13 Left User Switch To PF4 and J4 10 If removed allows extra GPIO to the BoosterPack XL Interface If installed default allows BoosterPack to simulate switch press or sense switch state 6 Tiva C Series LaunchPad Dimensions and Mating See Figure 2 for a dimensional drawing of the Stellaris LaunchPad J1 and J2 are 1 8 in 4 572 cm apart and constitute the BoosterPack interface J3 and J4 are 1 6 in 4 064 cm apart and constitute the BoosterPack XL Interface Other major board signals are available on unpopulated headers on a 0 1 in 2 54 mm grid Dimensions to these signals are provided for convenience These signals are subject to change or move across revisions of the Tiva C Series LaunchPad or future LaunchPads It is recommended that BoosterPacks use only the BoosterPack Interface and BoosterPack XL Interface Use of other pins and signals is acceptable but these pins and signals can change at any time SPMUZ288A August 2012 Revised April 2013 Submit Documentation Feedback Tiva C Series EK TM4C123GXL LaunchPad BoosterPack Development Guide Copyright 2012 2013 Texas In
28. ted specifically to facilitate safety related applications With such components TI s goal is to help enable customers to design and create their own end product solutions that meet applicable functional safety standards and requirements Nonetheless such components are subject to these terms No Tl components are authorized for use in FDA Class III or similar life critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military aerospace applications or environments Buyer acknowledges and agrees that any military or aerospace use of TI components which have not been so designated is solely at the Buyer s risk and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use TI has specifically designated certain components as meeting ISO TS16949 requirements mainly for automotive use In any case of use of non designated products TI will not be responsible for any failure to meet ISO TS16949 Products Applications Audio www ti com audio Automotive and Transportation www ti com automotive Amplifiers amplifier ti com Communications and Telecom www ti com communications Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microco
29. temperatures and voltages For additional information on TI s environmental and or safety programs please visit www ti com esh or contact TI No license is granted under any patent right or other intellectual property right of TI covering or relating to any machine process or combination in which such TI products or services might be or are used TI currently deals with a variety of customers for products and therefore our arrangement with the user is not exclusive Tl assumes no liability for applications assistance customer product design software performance or infringement of patents or services described herein REGULATORY COMPLIANCE INFORMATION As noted in the EVM User s Guide and or EVM itself this EVM and or accompanying hardware may or may not be subject to the Federal Communications Commission FCC and Industry Canada IC rules For EVMs not subject to the above rules this evaluation board kit module is intended for use for ENGINEERING DEVELOPMENT DEMONSTRATION OR EVALUATION PURPOSES ONLY and is not considered by TI to be a finished end product fit for general consumer use It generates uses and can radiate radio frequency energy and has not been tested for compliance with the limits of computing devices pursuant to part 15 of FCC or ICES 003 rules which are designed to provide reasonable protection against radio frequency interference Operation of the equipment may cause interference with radio communications in which case th
30. the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Cet appareil num rique de la classe A ou B est conforme a la norme NMB 003 du Canada Les changements ou les modifications pas express ment approuv s par la partie responsable de la conformit ont pu vider l autorit de l utilisateur pour actionner l quipement Concernant les EVMs avec appareils radio Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnement Concernant les EVMs avec antennes d tachables Conform ment a la r glementation d Industrie Canada le present metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique a l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i
31. y and all claims damages losses expenses costs and liabilities collectively Claims arising out of or in connection with any use of the EVM that is not in accordance with the terms of the agreement This obligation shall apply whether Claims arise under law of tort or contract or any other legal theory and even if the EVM fails to perform as described or expected Safety Critical or Life Critical Applications If you intend to evaluate the components for possible use in safety critical applications such as life support where a failure of the TI product would reasonably be expected to cause severe personal injury or death such as devices which are classified as FDA Class III or similar classification then you must specifically notify TI of such intent and enter into a separate Assurance and Indemnity Agreement Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2013 Texas Instruments Incorporated IMPORTANT NOTICE Texas Instruments Incorporated and its subsidiaries Tl reserve the right to make corrections enhancements improvements and other changes to its semiconductor products and services per JESD46 latest issue and to discontinue any product or service per JESD48 latest issue Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All semiconductor products also referred to herein as components are so
32. y one or more of the following measures Reorient or relocate the receiving antenna e Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected e Consult the dealer or an experienced radio TV technician for help For EVMs annotated as IC INDUSTRY CANADA Compliant This Class A or B digital apparatus complies with Canadian ICES 003 Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment Concerning EVMs including radio transmitters This device complies with Industry Canada licence exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Concerning EVMs including detachable antennas Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with
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