SB00004 - NXP Semiconductors
Contents
1. Ca K FLOK a31 LLH t La K FLOE 031 cH e S LOE 037 OLH t A S yL0 037 LH Vit O D 2 0 MS1LH IM Final version 1 0 2 December 2014 O gt Ze eb V Bn ul E O _ lt x wt re O N gt Z ul _ O O po Cc O Ki eb op A gt lt Z SB00004 Solution brief Component List SSL5031BTS driver and LED board Part ref Description Manutaeturer Partnumber_ Capacitor 100 nF 10 450 V X7T 1210 Any Manufacturer n a acitor 68 uF 20 100 V ALU THT 100ZLH68MEFC8X20 i 3 i E 80 GRM188R72A104KA35D MURS 160 E3 52T 1N4148W 7 F LL KGLCKU U44E4 T 1508060000 SSW 103 02 G D RA SDR1006 332KL Inductor 680 uH 10 1 A 5900 681 RC Cap 08055C105KAT2A D2 D3 L L L Q Inductor 680 uH 10 1 3 A SMD Coilcraft MSS1210 684KEB MOSFET N 650 V 1 8 A SPDO2N60C3 Kl K AT ple 3 Qro R2 Resistor 220 Q 1 125 mW 150 V 0805 RCO805FR 07220RL R3 Resistor 100 kQ 1 250 mW 1206 Vishay CRC W1206100KFKEA R4__ Resistor 100 kQ 1 250 mW 1206 Vishay CRCW1206100KFKEA R5 Resistor 3 6 Q 1 250 mW 1206 ERJ8RQF3R6V R6 Resistor 5 1 kQ 1 63 mW 0603 Multicomp MC0063W060315K1 Bi Resistor 110 kQ 1 250 mW 1206 Vishay CRCW1206110KFKEA R8 Resistor 110 KQ 1 250 mW 1206 CRCW1206110KFKEA R9 Resistor 150 kO 1 22. 50 mW 1206 CRCW1206150KFKEA Resistor 3 6 Q 1 250 mW 1206 Ut LED Driver SSL5031BTS NXP CSE SSLSOBIBTS Component List LED board 3x Part ref Description Manufacturer____ Partnumber ee LL Capacitor 68 uF 20 100 V ALU THT 100ZLH68MEFC8X20 Capacitor 100 nF 10 100 V X7R 0603 GRM188R72A104KA35D EI Fuse 1 A 250 V Slow Blow MCPMP 1A 250V 2 5 7 8 9 D2 D3 F1 Ki K2 2 3 R2 R3 R4 R5 R7 U1 Final version 1 0 2 December 2014 O NXP Semiconductors N V 2014 All rights reserved 5 SB00004 PCB rd ho Cu lt 4 ra Min E 31 HIE EL lt gt wer mr Sr mr SE me SE me ms Lee Ek ja e H H EH vH SH 9H LH BH 6H OTH TIH 21H EIH YIH Final version 1 0 2 December 2014 O NXP Semiconductors N V 2014 All rights reserved Solution brief 15W TLED SB00004 Solution brief Assembly SSL5031BTS driver and LED board 5515031BDB1270 15W TLED Serer oO U ges ASSEMBLY TOP H19 H18 H17 H16 H15 H14 H13 H12 H11 H10 H9 H8 H7 H6 H5 H4 H3 H2 H1 ASSEMBLY BOTTOM Assembly LED board 3x ASSEMBLY TOP H19 H18 H17 H16 H15 H14 H13 H12 H10 H9 Hs H7 HG HS H4 H3 H2 EIE ASSEMBLY BOTTOM Literature e SSL5031BTS Datasheet Compact high power factor low THD buck LED driver IC Final version 1 0 2 December 2014 NXP Semiconductors N V 2014 All rights reserved 7 SB00004 Appendix Solution brief Stat
3. SB00004 Solution brief Single panel driver and LED solution for non dimmable T5 applications based on SSL5031BTS Date 2 December 2014 Status Designidea Design Concept Mara Demo Board Reference Design See appendix for explanation Keywords SSL5031BTS Buck converter Low THD high PF high efficiency universal mains panel T5 LED SSL applications NXP device s SSL5031BTS Description of Application This document describes the operation of a 15 W non dimmable LED panel driver solution featuring the SSL5031BTS and using a non isolated buck topology The SSL5031BDB1269 board is intended for T5 panel LED Solid State Lighting SSL applications The solution is implemented on a single PCB containing both the driver and the LEDs The SSL5031BDB1269 board features the SSL LED driver SSL5031BTS in a 15 W non isolated and non dimmable application for universal mains designed for 60 V 225 mA LED string load The LED configuration is with four parallel LED strings see circuit diagram Each LED string has nineteen LEDs in series giving a total of 60 V The single PCB dimensions are L x W is 502 mm x 14mm intended for T5 panels used in SSL applications The board provides a simple and effective solution having high efficiency high power factor and low THD over the complete universal mains range Features e SL5031BTS LED driver and LED strings integrated on one double layer PCB e Non isolated buck converter e Power factor gr
4. ater of the amount actually paid by customer for the product or five dollars US 5 00 The foregoing limitations exclusions and disclaimers shall apply to the maximum extent permitted by applicable law even if any remedy fails of its essential purpose Safety of high voltage evaluation products The non insulated high voltages that are present when operating this product constitute a risk of electric shock personal injury death and or ignition of fire This product is intended for evaluation purposes Final version 1 0 2 December 2014 NXP Semiconductors N V 2014 All rights reserved 9 SB00004 Solution brief only It shall be operated in a designated test area by personnel that is qualified according to local requirements and labor laws to work with non insulated mains voltages and high voltage circuits The product does not comply with IEC 60950 based national or regional safety standards NXP Semiconductors does not accept any liability for damages incurred due to inappropriate use of this product or related to non insulated high voltages Any use of this product is at customer s own risk and liability The customer shall fully indemnify and hold harmless NXP Semiconductors from any liability damages and claims resulting from the use of the product Non automotive qualified products Unless this data sheet expressly states that this specific NXP Semiconductors product is automotive qualified the product is not suitable f
5. ation or warranty that such applications will be suitable for the specified use without further testing or modification Customers are responsible for the design and operation of their applications and products using NXP Semiconductors products and NXP Semiconductors accepts no liability for any assistance with applications or customer product design It is customer s sole responsibility to determine whether the NXP Semiconductors product is suitable and fit for the customer s applications and products planned as well as for the planned application and use of customer s third party customer s Customers should provide appropriate design and operating safeguards to minimize the risks associated with their applications and products NXP Semiconductors does not accept any liability related to any default damage costs or problem which is based on any weakness or default in the customer s applications or products or the application or use by customer s third party customer s Customer is responsible for doing all necessary testing for the customer s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer s third party customer s NXP does not accept any liability in this respect Export control This document as well as the item s described herein may be subject to export control regulations Export might require a prior authorization fr
6. e addresses please send an email to salesaddresses nxp com Final version 1 0 2 December 2014 O NXP Semiconductors N V 2014 All rights reserved 10
7. eater than 0 9 and THD lt 25 over the complete universal mains e Efficiency ranging from 88 to 90 across the universal mains 90 V to 305 V AC e Open LED and short circuit LED string protection e Over current protection OCP and Over temperature protection OTP Final version 1 0 2 December 2014 O NXP Semiconductors N V 2014 All rights reserved 1 SB00004 Solution brief Performance Symbol Parameter Value VMAINS AC mains supply voltage 90 V 305 V AC Pin Input power 15W Pout Output power 13 4 W VLeD Output voltage LED voltage 58 V ILED Output current LED current 230 mA IRIPPLE Output ripple current 25 Alen AVains Line regulation 1 75 for AVmains 100 V to 277 V Alen AVLED Load regulation 0 5 mA V n Efficiency 100 load 88 to 90 PF Power Factor gt 0 91 THD Total harmonic distortion lt 25 for AVuains 100 V to 277 V fsw Switching frequency 45 kHz to 80 kHz for AVmans 100 V to 277 V PCB dimensions LxW 502 mm x 14mm PCB thickness CEM 3 1 2 mm Cu 35 um Cu thickness of 70 um or 105 um should be used with CEM 3 for better thermal performance Vmains V Imains mA Pin W Vieo V ILeo mA Den PF THD n W 100 145 14 57 5 220 12 7 0 96 25 90 120 121 14 2 57 8 222 12 8 0 97 19 91 230 67 14 6 57 5 226 13 0 95 18 89 277 59 15 57 4 228 13 2 0 91 22 88 Final version 1 0 2 December 2014 NXP Semiconductors N V 2014 All rights reserved 2 Solution bri
8. ef SB00004 C d LED board Iver an t Diagram SSL5031BTS dr IrcCul OT Veo 20 201 MSS dra3s x p Org dta3g S 0d3T 6T A000 vu 09 sdqaTi A 09 GITA 091 SENA za amoo ONS dAOW3AG GIL du EDOSNZOOdS A tO 08 IMo ads UT DPAOLZ dn 3 9 3 ne3 q 06 weg tLOE 037 7 BiH Wz ON ONS A OS Ju 001 19 vL0 OI BLH AN vLOE OI LOE G31 AT vLOE G31 AT GLIH AN vL0 G31 AT FLOE 0 AT WWZXS peg WLWWZXS ped FLOU 0371 7 IH Wz vL0 0371 etze 3H Vs FLOU 0371 7 5H Wz tLOE 0371 xiy tLOE 031 lt p LIH Wz FLOU 03 ZIH Wz SHIM eZ 13 SLIMY L BLOMYV 3 FLDE OR 3H Zo rLOe 31s sq 4p PL0 037 Ace Go vLE OS EH 4p FU OI zH 4 vL0 OI KACHS L ul Suen 0000908051 LN Final version 1 0 2 December 2014 O cb gt Ze V Bn ul lt O _ lt x wt re O N gt Z ul _ O O po Cc O Ki op A gt lt Z Solution brief SB00004 Circuit diagram LED board 3x Vy4 0 7 2020 MSS CH 4 e K LOE 031 DIR 44 a K tLOE 0737 8tH A LOE 031 StH tt Ca vi LOE 031 9H A S FL 031 PIH t E vLOE 031 SH ad SY tLOE 031 EIH t A vi FLOE 031 Pi a Y vL0 G31 ZIH tt A SJ vLo 031 EH
9. ges whether or not such damages are based on tort including negligence warranty breach of contract or any other legal theory Notwithstanding any damages that customer might incur for any reason whatsoever NXP Semiconductors aggregate and cumulative liability towards customer for the products described herein shall be limited in accordance with the Terms and conditions of commercial sale of NXP Semiconductors Right to make changes NXP Semiconductors reserves the right to make changes to information published in this document including without limitation specifications and product descriptions at any time and without notice This document supersedes and replaces all information supplied prior to the publication hereof Suitability for use NXP Semiconductors products are not designed authorized or warranted to be suitable for use in life support life critical or safety critical systems or equipment nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury death or severe property or environmental damage NXP Semiconductors accepts no liability for inclusion and or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and or use is at the customer s own risk Applications Applications that are described herein for any of these products are for illustrative purposes only NXP Semiconductors makes no represent
10. mented on a PCB that conforms to the requirements in the specific application segment form factor UL requirements manufacturability etc Operation and performance under all required conditions verified Optimal component dimensioning for operation under all required conditions Full documentation User Manual available The design and the PCB can be used as a blueprint for an end application or mass production SB00004 Solution brief Definitions Draft The document is a draft version only The content is still under internal review and subject to formal approval which may result in modifications or additions NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information Disclaimers Limited warranty and liability Information in this document is believed to be accurate and reliable However NXP Semiconductors does not give any representations or warranties expressed or implied as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information In no event shall NXP Semiconductors be liable for any indirect incidental punitive special or consequential damages including without limitation lost profits lost savings business interruption costs related to the removal or replacement of any products or rework char
11. om national authorities Evaluation products This product is provided on an as is and with all faults basis for evaluation purposes only NXP Semiconductors its affiliates and their suppliers expressly disclaim all warranties whether express implied or statutory including but not limited to the implied warranties of non infringement merchantability and fitness for a particular purpose The entire risk as to the quality or arising out of the use or performance of this product remains with customer In no event shall NXP Semiconductors its affiliates or their suppliers be liable to customer for any special indirect consequential punitive or incidental damages including without limitation damages for loss of business business interruption loss of use loss of data or information and the like arising out the use of or inability to use the product whether or not based on tort including negligence strict liability breach of contract breach of warranty or any other theory even if advised of the possibility of such damages Notwithstanding any damages that customer might incur for any reason whatsoever including without limitation all damages referenced above and all direct or general damages the entire liability of NXP Semiconductors its affiliates and their suppliers and customer s exclusive remedy for all of the foregoing shall be limited to actual damages incurred by customer based on reasonable reliance up to the gre
12. or automotive use It is neither qualified nor tested in accordance with automotive testing or application requirements NXP Semiconductors accepts no liability for inclusion and or use of non automotive qualified products in automotive equipment or applications In the event that customer uses the product for design in and use in automotive applications to automotive specifications and standards customer a shall use the product without NXP Semiconductors warranty of the product for such automotive applications use and specifications and b whenever customer uses the product for automotive applications beyond NXP Semiconductors specifications such use shall be solely at customer s own risk and c customer fully indemnifies NXP Semiconductors for any liability damages or failed product claims resulting from customer design and use of the product for automotive applications beyond NXP Semiconductors standard warranty and NXP Semiconductors product specifications Translations A non English translated version of a document is for reference only The English version shall prevail in case of any discrepancy between the translated and English versions Trademarks Notice All referenced brands product names service names and trademarks are the property of their respective owners GreenChip is a trademark of NXP Semiconductors N V Contact information For more information please visit http www nxp com For sales offic
13. us Description Design Idea Design Concept Design Prototype Demo Board Design Reference Design Final version 1 0 2 December 2014 O NXP Semiconductors N V 2014 All rights reserved 8 Principle application design Based upon native behavior of the constituting components and the elementary interactions No or only coarse dimensioning of components Not implemented and tested Principle application design Based upon building blocks that are known to operate correctly and that are known to interact without conflicts At least coarse dimensioning of components All individual building blocks were individually implemented and tested but not in the presented configuration Full implementation of an application principle Implemented on a breadboard or prototype PCB Basic operation verified and evaluated Proper dimensioning of components but not optimized Limited operational performance data available Full implementation of an application Implemented on a PCB Operation and performance under typical conditions verified Optimal component dimensioning for typical operation The demo board is intended for evaluation and offers the possibility to experiment with various implementation options the demo board can be a versatile starting point for developing an end application The design and the PCB are not meant as a blueprint for an end application or mass production Full implementation of an application Imple
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