CBC34123 EnerChip™ RTC
Contents
1. CYMBET CORPORATION Preliminary CBC34123 EnerChip RTC SPI Real Time Clock Calendar with Integrated Backup Power Features e Integrated rechargeable solid state battery with power fail detect and automatic switchover pro viding greater than 30 hours of RTC backup e Smallest commercially available RTC with inte grated backup power in compact 5mm x 5mm 1 4mm QFN package e Temperature compensated charge control e Integrated EnerChip recharged at VDD gt 2 5V e SMT assembly lead free reflow solder tolerant e Real time clock provides year month day week day hours minutes and seconds based on a 32 68 kHz quartz crystal e Resolution seconds to years e Watchdog functionality e Freely programmable timer and alarm with inter rupt capability e 3 line SPl bus with separate but combinable data input and output e Integrated oscillator load capacitors for C 7 pF e Internal Power On Reset POR e Open drain interrupt and clock output pins e Programmable offset register for frequency adjustment e Eco friendly ROHS compliant tested Applications e Wireless sensors and RFID tags and other powered low duty cycle applications e Power bridging to provide uninterruptible RTC function during exchange of main batteries e Consumer appliances that have real time clocks provides switchover power from main supply to backup battery e Business and industrial systems such as network routers point of s2. Voo Rising RESET Hysteresis Voltage VHYST VmMopeE GND 45 15 mV Voo to RESET 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 5 of 14 Preliminary CBC34123 EnerChip RTC CHARGE PUMP CHARACTERISTICS PERTAINS TO INTEGRATED CBC910 POWER MANAGEMENT CIRCUIT Vpop 2 5V to 5 5V Ta 20 C to 70 C CHARACTERISTIC SYMBOL CONDITION MIN MAX UNITS pieter em pee Lo Pump Active pulse Vop 3 3V a wr fo as EEE TA Pump Inactive pa e Charge Pump Frequency Pump Frequency fee Charge Pum Delta Vear n lBar charging nN e RER i current of 1A to 100pA 150 300 Q Crry O 1 uF Caat 1 0UF Criy 0 1uF Caat 1 0uF VcHe Output Voltage per lour 1A Temp 25 C 4 065 4 150 VcHe Temp Coefficient lout 1yA Temp 25 C Charge Pump Current ies IBaT 1mA Drive Criy 0 1uF Caat 1 0UF Charge Pump on Voltage ENABLE Vop D fop I tCPPER ADDITIONAL CHARACTERISTICS Ta 20 C to 70 C Vear from 40mV above to Vat Cutoff Delay Time tCOOFF 20mV below VeatTco louT 1yA Note All specifications contained within this document are subject to change without notice 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 6 of 14 Preliminary CBC34123 EnerChip RTC Important Reference Documents For complete specifications of the integrated PCF2123 Real Time Clock see here http www cymbet com pdfs NXP RTC PCF2
3. it is permissible to verify connection to the EnerChip battery and 4 1V output of the charge pump at the VCHG pin by forcing the CBC34123 VDD and EN pins high for NO MORE THAN 3 SECONDS Activating the charge pump for longer than 3 seconds will put sufficient charge into the EnerChip that board level rework is no longer permitted without destroying the EnerChip Factory In Circuit EnerChip Post Assembly Test Steps CBC34123 In Circuit Test Procedure 1 In order to keep the CBC34123 battery from charging during testing apply GND using an in circuit test bed pin or other shorting method to the VCHG and VEC pins 6 and 7 respectively that are normally tied to gether on the PCB Alternatively the EN pin on the CBC34123 can be forced to a logic low before perform ing board level testing as this will also prevent charge from accumulating in the battery WARNING If the enable pin is asserted for more than 3 seconds with VDD 2 5 volts the CBC34123 may not be reflowed again Enable power domains under test with VCHG VEC net shorted to GND or EN forced to a logic low level Run all vectors to ensure proper functionality of all semiconductor devices After all other circuits are functional and boards have been reworked if needed Apply voltage to VIN that is in the range of 2 5V to 5 5V Note VIN VDD Verify that the VCHG VEC net is 4 1 volts 0 025 volts Allow the battery to charge a very small amount by leaving the device in the above noted co
4. 14 Preliminary CBC34123 EnerChip RTC The test engineer has the freedom to choose a point on the discharge curve that falls within the parameters of test throughput and equipment measurement capability In order for the EnerChip to be considered as meeting the gross functional test specification the voltage on the VCHG VEC pin must be above the value indicated by whichever line is chosen as the reference line Data at two temperatures is shown in order to encompass the range of anticipated factory test floors Note the influence of temperature on the EnerChip test discharge voltage when setting the test specification pass fail limits EnerChip Charge Discharge Profiles for Setting Post Assembly Test Limits 4 5 75K Ohm Load 20 Degrees C 75K Ohm Load 30 Degrees C 4 0 806K Ohm Load 30 Degrees C 806K Ohm Load 20 Degrees C 3 5 3 0 EnerChip Voltage VDC 2 5 2 0 0 0 0 5 1 0 1 5 2 0 2 5 3 0 Charge Discharge Time seconds Figure 7 Voltage Determination on the VCHG VEC Pin CBC34123 Internal Battery Backup Verification Optional Board System Level Test Warning Board level reflow rework is not permitted if the following procedure is used The following test is normally used in the prototype testing phase as this test may take 10 15 minutes to perform which is typically unsuitable for high speed in circuit testing 1 Power up board or system 2 Ensure that CBC34123 EN pin 15 is asserted a
5. dealing course of performance or usage of trade Cymbet EnerChip products are not authorized for use in life critical applications Users shall confirm suitability of the Cymbet EnerChip product in any products or applications in which the Cymbet EnerChip product is adopted for use and are solely responsible for all legal regulatory and safety related requirements concerning their products and applications and any use of the Cymbet EnerChip product described herein in any such product or applications Cymbet the Cymbet Logo and EnerChip are Cymbet Corporation Trademarks 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 14 of 14
6. i i l i l Discharge Capacity Ah Figure 5 Typical Discharge Characteristics of the CBCO0O5 EnerChip Within the CBC34123 Note All specifications contained within this document are subject to change without notice 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 4 of 14 Preliminary CBC34123 EnerChip RTC POWER SUPPLY CURRENT CHARACTERISTICS OF INTEGRATED CBC910 POWER MANAGEMENT CIRCUIT ONLY Ta 20 C to 70 C CHARACTERISTIC SYMBOL CONDITION _ Quiescent Current management circuit only Vpop gt VReset RTC ce a A a a ENABLE Vppb current not included wre oo o pay EnerChip Cutoff Current Osor Vat lt VBATCO ERE loBaron adds to RTC Vout 0 current when in backup Vat gt VBATCO mode QBATON re INTERFACE LOGIC SIGNAL CHARACTERISTICS Vpop 2 5V to 5 5V Ta 20 C to 70 C CHARACTERISTIC SYMBOL CONDITION MIN MAX UNITS High Level Input Voltage vw ss 0 5 vots Low Level Input Voltage wi S o5 Yis Vpp gt VtH see Figures 4 VDD D a wah and 5 IL 10pA 0 04V oo us RESET tracks VDD RESET Voo IourTx ROUT RESET SIGNAL AC DC CHARACTERISTICS Vpop 2 5V to 5 5V Ta 20 C to 70 C CHARACTERISTIC SYMBOL CONDITION MIN MAX UNITS VoD Rising to RESET en VoD rising from 2 8V TO 3 1V 200 oe Rising in lt 10us Voo Falling to RESET fe VoD falling from 3 1V to 2 8V 05 2 i Falling in lt 100ns
7. not user accessible connect to VSS or leave floating internally TEST pulled down ooa INT Interrupt output open drain active LOW A cE Chip enable input active HIGH with internal pull down O 5 ys y lt 4 1V typical charging source connect to VEC and or optional EnerChip s for extended backup time Positive terminal of integrated thin film battery connect only to VCHG via PCB trace Serial data output push pull high impedance when not driving can be con nected to SDI for single wire data line 9 spr Serial data input may float when CE is inactive Serial clock input may float when CE is inactive CLKOE CLKOUT enable or disable pin enable is active HIGH connect to VSS for low power operation CLKOUT Clock output open drain Supply voltage positive or negative steps in VDD can affect oscillator perfor 13 VDD i mance recommend 100nF decoupling close to the device RESET Output signal indicating RTC is operating in backup power mode 45 EN Charge pump enable activates VCHG 4 1V typ charging source 16 Oscillator input high impedance node minimize wire length between quartz and package OSCI EN RESET VDD OSCO CLKOUT TEST CLKOE t _ 4 40 5 00 j INT SCL A 0 40 ed CE SDI f Package Dimensions VSS VCHG VEC SDO k 50 mm Figure 4 CBC34123 Package left top view looking through package right pad dimensions EnerChip Properties Energy capacity typi
8. 123 pdf For complete specifications of the Cymbet 5uAh EnerChip and integrated power management circuit see here http www cymbet com pdfs DS 72 41 pdf For guidelines regarding crystal selection and other important information pertaining to the PCF2123 see UM10301 User Manual for NXP Real Time Clocks located here http 7 www nxp com documents user_manual UM10301 pdf Functional Description of Integrated CBC34123 Real Time Clock The CBC34123 contains 16 8 bit registers with an auto incrementing address counter an on chip 32 768 kHz oscillator with two integrated load capacitors a frequency divider which provides the source clock for the Real Time Clock RTC a programmable clock output and a 6 25 Mbit s SPl bus An offset register allows fine tuning of the clock All 16 registers are designed as addressable 8 bit parallel registers although not all bits are implemented e The first two registers memory address OOh and Oth are used as control registers e The memory addresses O2h through O8h are used as counters for the clock function Seconds up to years The registers Seconds Minutes Hours Days Weekdays Months and Years are all coded in Binary Coded Decimal BCD format When one of the RTC registers is written or read the contents of all counters are frozen Therefore faulty writing or reading of the clock and calendar during a carry condition is prevented e Addresses O9h through OCh define the alarm condition e Ad
9. ad Bit positions labeled with N should always be written with logic O Address Register name Bit 7 6 5 4 3 2 1 0 Control and status registers OOh Control_ 1 EXT TEST N STOP SR N 12 24 CIE N 01h Control_2 MI SI MSF TI_TP AF TF AIE TIE Time and date registers 02h Seconds OS SECONDS 0 to 59 03h Minutes MINUTES 0 to 59 04h Hours AMPM HOURS 1 to 12 in 12 h mode HOURS 0 to 23 in 24 h mode O5h Days DAYS 1 to 31 06h Weekdays WEEKDAYS 0 to 6 07h Months MONTHS 1 to 12 08h Years YEARS 0 to 99 Alarm registers 09h Minute _alarm AE_M MINUTE ALARM 0 to 59 OAh Hour_alarm AE_H AMPM HOUR_ALARM 1 to 12 in 12 h mode HOUR_ALARM 0 to 23 in 24 h mode OBh Day_alarm AE_D DAY ALARM 1 to 31 OCh Weekday_alarm AE _W WEEKDAY_ALARM 0 to 6 Offset register ODh Offset_register MODE OFFSET 6 0 Timer registers OEh Timer_clkout COF 2 0 TE CTD 1 0 OFh Countdown_timer COUNTDOWN_TIMER 7 0 1 Except in the case of software reset see Section 8 3 1 1 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 8 of 14 Preliminary Typical CBC34123 EnerChip RTC Connection to Microcontroller Figure 5 illustrates how the CBC34123 is typically connected to a microcontroller MCU in a system For simplicity only the MCU lines routed to from the CBC34123 are shown The I O line from the MCU to the EN pin of the CBC34123 is optional for reducing p
10. ale terminals single board computers test equipment multi function printers industrial controllers and utility meters e Time keeping application e Battery powered devices e Metering e High duration timers e Daily alarms e Low standby power applications ONDE CORP yp RIC ERC N c3a123 M5C 5mm x 5mm x 1 4mm 16 QFN Package General Description The EnerChip RTC CBC34123 M5C combines a Real Time Clock RTC and calendar optimized for low power applications with an integrated rechargeable solid state backup battery and all power management functions The EnerChip RTC ensures a seamless transition from main power to backup power in the event of power loss The integrated power management circuit ensures thousands of charge discharge cycles from the integrated EnerChip and manages battery charging discharge cutoff power switchover and temperature compensation to maximize the service life of the device The CBC34123 provides greater than 30 hours of backup time in the event main power is interrupted Typical blackout times are less than 4 hours Longer backup time can be achieved by adding an external EnerChip to the VCHG pin The EnerChip has extremely low self discharge recharges quickly is non flammable and RoHS compliant The EnerChip is charged automatically anytime VDD is above 2 5V Data is transferred serially via a Serial Peripheral Interface SPl bus with a maximum data rate of 6 25 Mbit s Alarm and tim
11. and surface resistivity Cymbet Part Package Reel Size Tape Width W W1 Meters per Pockets Length Depth Type of Outside Cavity Pitch P1 Reel Reel BO KO Devices Diameter A TAPE AND REEL INFORMATION REEL DIMENSIONS TAPE DIMENSIONS Feed Direction CBC34123 Pin1 Location Top side up Damension designed to accommodate the component width Drrenson designed to accommodabe Ihe component langih Lammengean designed lo accommodate ihe component heckress lj ow Overall width of the carer tage Pi Pitch between successive cavity centers TAPE AND REEL INFORMATION Ordering Information EnerChip RTC in 5mm x 5mm x l CBC34123 M5C 1 4mm 16 QFN Land Grid Array Shipped in Tube CBC34123 M5C TR1 EnerChip RTC in 5mm x 5mm x Tape and Reel 1000 pcs TR1 or CBC34123 M5C TR5 1 4mm 16 QFN Land Grid Array 5000 pcs TR5 per reel USB based Eval Kit with CBC EVAL12 EnerChip RTC Evaluation Kit CBC34123 tab board U S Patent No 8 144 508 Additional U S and Foreign Patents Pending Disclaimer of Warranties As Is The information provided in this data sheet is provided As Is and Cymbet Corporation disclaims all representations or warranties of any kind express or implied relating to this data sheet and the Cymbet EnerChip product described herein including without limitation the implied warranties of merchantability fitness for a particular purpose non infringement title or any warranties arising out of course of
12. cal 5uAh Recharge time to 80 10 minutes Charge discharge cycles gt 5000 to 10 depth of discharge Operating temperature 30 C to 70 C Storage temperature 40 C to 125 C Minimum VDD to charge EnerChip 2 5V 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 3 of 14 Preliminary CBC34123 EnerChip RTC Absolute Maximum Ratings _PARAMETER PIN CONDITION MIN TYPICAL MAX unns Voowin respetos 2e annos so v ENABLE Input vonage 250 enoos voros v wooo f e i o o aa voso ee o as yi RESET Output Voltage enb 0 3 27 v INT CE TEST OSCI OSCO SDO SDI SCL CLKOE CLKOUT See NXP PCF2123 Data Sheet D No external connections to these pins are allowed except parallel EnerChips for extended backup time Integrated EnerChip Thin Film Battery Operating Characteristics PARAMETER CONDITION MIN Self Discharge 5 yr average a recoverable to 80 of rated 40 C 3 Recharge Time to 80 of rated _ Chargecycle2 capacity capacity 4 1V charge 25 C Capacity See Figure 5 4OnA discharge 25 C D First month recoverable self discharge is 5 average Storage temperature is for uncharged EnerChip CC device GB EnerChip charging time increases approximately 2x per 10 C decrease in temperature Typical CBC005 EnerChip Discharge Characteristics Cell Voltage V l I i 1 i i i l i
13. dress ODh defines the offset calibration e Address OEh defines the clock out and timer mode e Address registers OEh and OFh are used for the countdown timer function The countdown timer has four selectable source clocks allowing for countdown periods in the range from 244 ms up to four hours There are also two pre defined timers which can be used to generate an interrupt once per Second or once per minute These are defined in register Control_2 Oth Low Power Operation Minimum power operation will be achieved by reducing the number and frequency of switching signals inside the IC i e low frequency timer clocks and a low frequency CLKOUT will result in lower operating power A second prime consideration is the series resistance R of the quartz used Power Consumption with Respect to Quartz Series Resistance The series resistance acts as a loss element Low R will reduce current consumption further 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 7 of 14 Preliminary CBC34123 EnerChip RTC CBC34123 Register Overview 16 registers are available The time registers are encoded in the Binary Coded Decimal BCD format to simplify application use Other registers are either bit wise or standard binary Bit positions labeled as are not implemented and will return a O when read The bit position labeled as is not implemented and will return a O or 1 when re
14. er functions provide the option to generate a wake up signal on an interrupt pin An offset register allows fine tuning of the clock E i gt cKouT System power 7 gt osco CLKOUT 2 TEST CLKOE M sa 0 nt Figure 1 CBC34123 Pin out Diagram 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 1 of 14 Preliminary CBC34123 EnerChip RTC CLKOE 11 16 OSCI OSCILLATOR P DIVIDER CLOCKOUT a_i CLKOUT 12 32 768 kHz MONITOR 1 OSCO OFFSET FUNCTION Offset_register 6 VCHG TIMER FUNCTION 7 VEC aie Timer_clkout 14 RESET CHARGER Countdown_timer 15 EN CONTROL 00h Control_1 2 TEST 01h Control _2 13 VDD TIME 5 vss oni Seconde o o C Minutes osoo 06h Weekdays 8 SDO 9 spl a 10 SCL d oE ALARM FUNCTION pene INT 3 a 0Ch Weekday_alarm So Figure 2 CBC34123 Block Diagram with Registers OSCI EN RESET VDD D U1 cCBcoo CLKOUT RESET L VD EN GND VCHG TEST CLKOE INT CE VSS VCHG VEC SDO Figure 3 Internal Schematic of CBC34123 EnerChip RTC 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 2 of 14 Preliminary CBC34123 EnerChip RTC CBC34123 Input Output Descriptions Pin Number Label Deseription Oscillator output high impedance node minimize wire length between quartz and package 1 Test pin
15. flow Profile and Specification Table 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 11 of 14 Preliminary CBC34123 EnerChip RTC GUIDELINES FOR IN CIRCUIT TESTING OF THE INTERNAL ENERCHIP BATTERY It is very important to verify EnerChip device connectivity after reflow solder process It is important to read and understand the proper test flow for the EnerChip devices Following the proper test method will ensure reworkability of boards Precautions and Important Processes After assembly on a printed circuit board the CBC34123 integrated solid state battery is in an uncharged state It is important that the CBC34123 battery remain untested and uncharged until the last step of an in circuit system test so that if other components fail test and need to be replaced the CBC34123 will still be in a reflow solderable state The crystal and RTC in the CBC34123 can be tested independently from the battery at the same time the other system elements are being tested There are two considerations when doing post assembly testing of the user s circuit board 1 When performing circuit testing short the internal EnerChip battery to GND by forcing the VCHG VEC pins to ground potential during testing of the EnerChip RTC and other circuit functions This will prevent the integrated EnerChip from accumulating charge while the CBC34123 VDD and EN pins are active 2 When the overall circuit testing is complete
16. nd VDD is gt 2 5 volts 3 Allow battery to charge for several minutes 4 Program device to be battery backed 5 Remove power for at least several seconds to one minute 6 Power up board or system 7 Read device formerly under battery backed operation 8 Verify device contents Notes This test does not verify the actual capacity of the integrated battery In order to verify actual capacity the device must be charged for at least one hour and then provide RTC power holdover until battery cut off occurs 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 13 of 14 Preliminary CBC34123 EnerChip RTC CBC34123 Packaging EnerChip CBC34123 devices are packaging in tubes or reels The following specifications are for the 1000 and 5000 part reel packaging configurations CBC34123 Q5C TR1 is a 7 inch reel with 1000 parts Cymbet uses the Advantek LOKREEL Mini RJ7xx packaging reel that has an outside diameter of 7 inches 180mm and 1 2 inch 13mm diameter arbor hole Reel hubs measure 2 36 inches 60mm The 7 inch reel is compliant with EIAJ standards for dimension and surface resistivity CBC34123 Q5C TR5 is a 13 inch reel with 5000 parts Cymbet uses the Advantek 13 LOKREEL packaging reel that has an outside diameter of 13 inches 330mm and 1 2 inch 13mm diameter arbor hole Reel hubs measure 4 inches 102mm The 13 inch reel is compliant with EIAJ standards for dimension
17. nfiguration for one second The chart in Figure 7 should be referenced to determine the voltage on the VCHG VEC pin to be expected after driving the ENABLE pin high for one second The decay curves in the chart represent specific load impedances as might be encountered with Automated Test Equipment ATE Additionally the decay curves represent the span of EnerChip cell impedances as specified in the respective data sheets Note If not using ATE with the ability to add a load impedance it will be necessary to add resistance in parallel with the voltage measurement device so the readings will match the graph of Figure 7 Any measurement equipment and associated impedance circuits must only be temporally tied to the VCHG VEC node for the time needed to make the measurement Seconds and no longer as the measurement impedance will cause the battery to become discharged below 2 5V at which time the cell will become permanently damaged 9 The graph in Figure 7 depicts the time dependent and temperature dependent voltage of the EnerChip RTC after applying a 4 1VDC charging voltage for approximately one second followed by a brief discharge at a specific load resistance Using this graph as a guide the test engineer can develop a simple test that is feasible with the available test equipment and fixtures and meets the production throughput needs NOORWN 00 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 12 of
18. ower consumption of the CBC34123 The EN pin can be forced low by the MCU when the integrated EnerChip does not need to be charged If EN is not connected to the MCU or otherwise controlled externally it must be tied to VDD to ensure the EnerChip is charged when VDD is valid VO mcu Pl CE SPI MISO SPI MOS SPI SCL VSS Figure 5 Typical Application Schematic Showing MCU Connections to CBC34123 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 VDD A C1 0 1uF OSCI EN RESET VDD CLKOUT CLKOE SCL SDI VCHG VEC SDO CBC34123 EnerChip RTC Page 9 of 14 Preliminary CBC34123 EnerChip RTC GUIDELINES FOR HANDLING ENERCHIP RTC DEVICES The EnerChip RTC with an integrated thin film solid state battery features all solid state construction are packaged in standard integrated circuit packages and can be reflow soldered for high volume PCB assembly The CBC34123 EnerChip RTC is considered an MSL 3 rated device for storage and handling purposes Device Handling amp Storage e EnerChip RTCs are packaged and shipped in tubes or reels in moisture barrier bags and are sensitive to moisture absorption They must be kept in the sealed bag until ready for board mounting and reflow soldering e If the EnerChip RTCs are removed from the sealed bag more than 168 hours prior to board mounting they must be baked at 125 C for a minimum of 24 hours prior to board mounting and reflo
19. remove a defective or misplaced EnerChip package If there are other EnerChips in the vicinity of the EnerChip being replaced use proper heat shielding to protect the adjacent EnerChip package from the heat source and turn off any heat source that would oth erwise be used to heat the bottom of the board during removal of the EnerChip This will prevent the adjacent EnerChip s from being damaged during the rework procedure 2013 2015 Cymbet Corporation Tel 1 763 633 1780 www cymbet com DS 72 31 V 13 Page 10 of 14 Preliminary CBC34123 EnerChip RTC SMT PROCESS The EnerChip RTCs are packaged in standard surface mount packages Refer to the solder paste material data sheets for attachment of the package to a PCB using solder reflow processes Ensure that the solder reflow oven is programmed to the correct temperature profile prior to assembling the EnerChip RTC on the PCB REFLOW SOLDERING e The maximum number of times an uncharged EnerChip RTC may be reflow soldered is three times e The surface temperature of the EnerChip RTC package must not exceed 240 C e The recommended solder reflow profile is shown in Figure 6 below refer to the table for time and temperature requirements Whenever possible use lower temperature solder reflow profiles TP Critical Zone j r Temperature Preheat N at t25 to Peak Time gt Liquidous temperature TL 183 C 217 C Figure 6 EnerChip RTC Solder Re
20. w soldering e Store the EnerChip RTCs in an environment where the temperature and humidity do not undergo large fluctuations Store at 10 C to 30 C and at less than 60 relative humidity Electrostatic Discharge ESD e The EnerChip RTCs are sensitive to ESD damage prior to receiving a battery charge cycle Therefore adherence to ESD prevention guidelines is required e Remove RIC devices from protective shipping and storage containers at approved ESD workstations only e All equipment used to process the devices must be configured to minimize the generation of static charges This includes soldering and de soldering equipment and tools pick and place equipment test equipment and all other tools and equipment used to handle or process the devices e Failure to observe these precautions can lead to premature failure and shall void product warranty Other Use Guidelines e Do not connect the EnerChip RTC to other types of batteries e To increase battery life avoid placing the EnerChip RTC near devices that would generate heat exceeding the 70 C operating limit DO NOT HAND SOLDER ENERCHIP RTC DEVICES When soldering an individual uncharged EnerChip RTC a QFN capable soldering station with temperature con trol should be used It is very important to be able to control the solder temperature and time when soldering an EnerChip RTC ENERCHIP ASSEMBLY REPAIR TECHNIQUES For the EnerChip RTC QFN package use a hot air rework station to
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