Serial-to-Wi-Fi b/g/n intelligent modules
Contents
1. Profile feature PB free assembly Average ramp up rate Tsmax to Tp 3 C sec max Preheat Temperature min T min 150 C Temperature max T max 200 C Time T min to T max ts 60 100 sec scare 217 emp L 60 70 sec Time TL Peak temperature Tp 240 0 C Time within 5 C of actual peak temperature Tp 10 20 sec Ramp down rate 6 C sec Time from 25 C to peak temperature 8 minutes max Figure 2 Soldering profile P 5 Critical Zone T toT LoT Temperature gt mM _ 25 C to Peak Time gt AM17477v1 DoclD025635 Rev 6 ky SPWF01SA SPWF01SC Regulatory compliance 7 Regulatory compliance RF compliance The RF certifications obtained are described in Table 7 below Table 7 RF certification summary Comment FCC ID VRA SG9011203 On board antenna and external SG901 1066 with connector version IC ID 7420A SG9011203 On board antenna and external SG901 1066 with connector version ETSI Compliant Approved with on board antenna and connector version Note The SG901 1066 from Sagrad Inc is the only approved antenna using the u fl connector version FCC and IC This module has been tested and complies with the FCC part 15 and IC RSS 210 regulations These limits are designed to provide reasonable protection against harmful interference in approved installations This equipment generates uses and can radiate radio frequency en2. life augmented SPWF01SA SPWF01SC Serial to Wi Fi b g n intelligent modules Features November 2015 2 4 GHz IEEE 802 11 b g n transceiver STM32 ARM Cortex M3 with 64 KB RAM and 512KB Flash memory 1MByte Extended Flash for FW update Over The Air FOTA only on SPWF01Sx 1y Integrated TCP IP protocol stack 8 Simultaneous TCP or UDP clients and 1 Socket server 1 TLS SSL Socket client supporting up to TLS 1 2 including common encryption algorithms AES 128 256 hash MD5 SHA 1 SHA 256 and public key algorithms RSA ECC Web Server supporting dynamic web pages RESTful API to get amp post web content WEP WPA WPA2 Personal Security System Modes Station IBSS and miniAP miniAP easily provisioned SSID PWD Fast Wi Fi reconnect after reset TX Power 18 3dBm 1 Mbps DSSS Datasheet production data 13 7 dBm 5 4Mbps OFDM e RX Sensitivity 96 0 dBm 1 Mbps DSSS 74 5 dBm 54 Mbps OFDM e 16 configurable GPIOs available e UART interface to host system e Advanced low power modes Stand by with RTC 43 pA Sleep connected DTIM 1 15 mA RX Traffic 105 mA Typical TX Traffic 243 mA Typical 10 dBm e Simple AT command set host interface through UART e Small form factor 26 92 x 15 24 x 2 35 mm e Single voltage supply 3 3 V typical e Multiple antenna options Integrated antenna SPWF01SA xy versions Integr
3. 0 1 0 20 13 General purpose input output General purpose input output STA Mini AP switch 4 GPIO 8 1 0 General purpose input output ADC GPIO 9 GPIO 11 GPIO 12 1 0 1 0 1 0 12 General purpose input output General purpose input output GPIO 15 1 0 21 General purpose input output DAC Monitoring purpose with no alternate function GPIO 10 1 0 5 LED Drive Blinking while run GPIO 13 1 0 15 LED Drive WiFi Link up 6 16 DocID025635 Rev 6 4 SPWF01SA SPWF01SC Pinout description Table 5 Pinout description continued s Alternate Signal Name Type PIN Number Main function functions Notes GPIO 14 o 44 LED Drive Power Up UART Pins RXD1 8 VANTI Receive 5V tolerant data input TXD1 O 6 VARTI Transmit 5V Tolerant data output CTS1_DN 9 UART1 Clear To Active Low 5V Send input Tolerant RTS1_DP o 10 UART1 Request to Active Low 5V send output tolerant Reset Active low for 5 ms with pull up to RESETn l 3 Reset input 2 5VDC Not 5V tolerant Supply pins and paddle Decouple with 10uF 3 3 V 24 Voltage Supply capacitor Ground 23 Ground Add plenty of ground vias for thermal Ground Paddle 25 Ground dissipation and ground return Boot loader BOOTO 2 Boot loader 1 The activation of ALT function depends
4. be used This module complies with the following European EMI EMC and safety directives and standards ETSI EN 300 328 V1 8 1 2012 EN 301 489 1 V1 9 2 2011 EN 301 489 17 V2 2 1 2009 EN 60950 1 2006 A11 2009 A1 2010 A12 2011 A2 2013 EN 62479 2010 Figure 3 CE certified 4 DoclD025635 Rev 6 SPWF01SA SPWF01SC Package mechanical data 8 Package mechanical data In order to meet environmental requirements ST offers these devices in different grades of ECOPACK packages depending on their level of environmental compliance ECOPACK specifications grade definitions and product status are available at www st com ECOPACK is an ST trademark Figure 4 Top view of the module shield Shield OOD OG OOO o les CE Logo O O DD A O000O ky DoclD025635 Rev 6 11 16 Package mechanical data SPWF01SA SPWF01SC 12 16 Figure 5 Bottom view of the module Data Matrix Model Series Name Board Design Reference FCC and IC IDs Figure 6 Wi Fi dimensions TOP VIEW F 3 cope lE Scale 10 1 IS BOTTOM VIEW ae 5 24 BOTTOM VIEW for PAD 25 DoclD025635 Rev 6 f 1651 pitch 1524mm 26 924 Tolerances 0 025mm TOP VIEW SPWF01SA SPWF01SC Package mechanical data Note An antenna area of 217 x 520 mils must be free of any ground metalization or tra
5. upon the firmware version or upon the variable configuration 2 To perform the factory reset of the variables pin GPIOO must be high during powerup 3 GPIO function running when low power mode variable is enabled 4 Introduced with the release 3 0 of AT Full stack To enable the STAToMiniAP switch the GPIO 7 needs to be put low together with the HW reset 5 To enable the firmware download pin BOOTO needs to be high during power up RESETn need to be pulled low at least 5 ms to initiate the firmware download sequence PIN 26 to PIN 30 are Reserved and they can be left floating in the final design Application tip As a general rule when commutation issues occur a level translator should be used to match the I O pins voltage of the connected device The HOST processor should control the RESETn pin of the module in order to recover unexpected behaviors using the HW reset ky DoclD025635 Rev 6 7 16 Module reflow SPWF01SA SPWF01SC 6 8 16 Module reflow The SPWF01SA and SPWF01SC are surface mount modules with a 6 layer PCB The recommended final assembly reflow profiles are indicated below The soldering phase must be executed with care in order to prevent an undesired melting phenomenon particular attention must be paid to the setup of the peak temperature The following are some suggestions for the temperature profile based on the IPC JEDEC J STD 020C July 2004 recommendations Table 6 Soldering values
6. 71 dBm Paok CH1 to 14 11g 54 Mbps 10 PER 1 dB Maximum input signal CH7 11g 54 Mbps 20 dBm 11Mbps 38 dBc 9 Mbps 20 dBc Adjacent channel rejection 54 Mbps 4 dBc MCS1 24 dBc MCS7 3 dBc 11b 1 Mbps 18 3 dBm jib 11 Mbps 802 11b spectral mask aa ce euiguesewer 11g 9 Mbps 802 11g spectral mask 18 3 dBm 11g 54Mbps EVM 27caB 4 5 13 7 dBm 11in MCS1 802 11n spectral mask 18 3 dBm 11n MCS7 EVM 27 dB 13 5 dBm On board antenna gain Average 1 2 dBi External antenna gain a 2 8 dBi 1 Output power and sensitivities are measured with a 50 Q connection at the antenna port DoclID025635 Rev 6 5 16 Pinout description SPWF01SA SPWF01SC 5 Pinout description Table 5 Pinout description Signal Name Type PIN Number Main function Alternate functions GPIO general purpose input output Notes GPIO 0 1 0 16 General purpose input output Restore to factory settings Input pull down and 5V tolerant GPIO 1 1 0 17 General purpose input output PWM Input pull down and 5V tolerant GPIO 2 1 0 19 General purpose input output Floating and 5V tolerant GPIO 3 GPIO 6 GPIO 4 1 0 1 0 1 0 22 18 General purpose input output General purpose input output Wake Up Sleep Inhibit General purpose input output Input pull down and 5V tolerant Input pull down and 5V tolerant GPIO 5 GPIO 7 1
7. ated u fl connector SPWF01SC xy versions e Industrial temperature range 40 C to 85 C e FCC CE IC certified e RoHS compliant e Surface mount PCB module Applications e Smart appliances e Industrial control and data acquisition e Home automation and security systems e Wireless sensors e Cable replacement e Medical equipment e Machine to machine communication DoclD025635 Rev 6 1 16 This is information on a product in full production www st com Description SPWF01SA SPWF01SC 1 Description The SPWF01SA and the SPWF01SC intelligent Wi Fi modules represent a plug and play and standalone 802 11 b g n solution for easy integration of wireless Internet connectivity features into existing or new products Configured around a single chip 802 11 transceiver with integrated PA and an STM32 microcontroller with an extensive GPIO suite the modules also incorporate timing clocks and voltage regulators Two different options exist based on the integrated Flash memory The SPWF01Sx 1y orderable parts integrate 1 5 MB of Flash while The SPWF01Sx 2y orderable parts integrate 512 kB of Flash The module is available either configured with an embedded micro 2 45 GHz ISM band antenna SPWF01SA or with an u fl connector for external antenna connection SPWF01SC With low power consumption and small form factor the modules are ideal for fixed and mobile wireless applications as well as challenging battery operated appli
8. by Both the STM32 and the radio 43 uA are in standby power states The STM32 is in stop power Sleep state and the radio is in sleep 15 mA power state Low power state The STM32 is active and the 26 mA radio is in sleep power state 3 3 V TX power 0 dBm 236 mA supply 802 11b TX power 10 dBm 250 TX power 18 dBm 344 TX TX power 0 dBm 210 802 11g TX power 10 dBm 243 TX power 18 dBm 338 802 11b 105 mA RX 802 119 105 mA 1 Typical results are at room temperature only ky DoclD025635 Rev 6 3 16 Digital interface specifications SPWF01SA SPWF01SC 3 4 16 Digital interface specifications Table 3 Digital interface specifications I O pins DoclD025635 Rev 6 Parameter Test condition comment Min VIH 1 6 Inputs VIL VOH IOH 4 mA 2 1 Outputs VOL IOL 4 mA Typ Max Unit 2 8 0 9 V 2 5 V 0 4 V ky SPWF01SA SPWF01SC RF characteristics 4 RF characteristics Table 4 RF characteristics Parameter Test condition comment Min Typ Max Unit 11b 1 Mbps 96 dBm 11b 2 Mbps 93 dBm 11b 5 5 Mbps 91 dBm 11b 11 Mbps 87 dBm 11g 9 Mbps 89 5 dBm 11g 18 Mbps 86 dBm RX Sensitivity 11g 36 Mbps 80 dBm 11g 54 Mbps 74 5 dBm 11n MCS1 13 Mbps 86 5 dBm 11n MCS3 26 Mbps 81 5 dBm 11n MCS5 52 Mbps 74 dBm 11n MCS7 65 Mbps
9. cations The SPWF01Sx y1 orderable parts are released with an integrated full featured TCP IP protocol stack with added web server and additional application service capabilities The SW package also includes an AT command layer interface for user friendly access to the stack functionalities via the UART serial port For details see the user manual UM1695 Figure 1 Block diagram 33V 33V Supply Supply STM32 cw1100 STM32 cw1100 j ji 1 ji f uart y F103 bigin Fat uart F103 b g n rit LA Integrated lan GPIOs lt ws C GPIOs lt ZZ ieee C 38 38 MHz MHz Flash 1MB SPWFO01Sx 1y SPWFO01Sx 2y 2 16 DoclD025635 Rev 6 ky SPWF01SA SPWF01SC General electrical specifications 2 General electrical specifications Table 1 Absolute maximum ratings Parameter Test condition comment Min Typ Max Unit Voltage supply 0 3 4 0 V Vin for 5 V tolerant pins 0 3 5 5 V Vin for all other pins i o3 28l v Storage temperature range 55 105 C Table 2 Operating conditions and input power specifications Parameter Test condition comment Min Typ Max Unit Operating temperature range Industrial 40 85 C Input supply voltage 3 3 V supply input 3 1 3 3 3 6 V Stand
10. ces under the unit The area extending away from the antenna should be free from metal on the PCB and housing to meet expected performance levels Pin 25 is the required paddle ground and is not shown in this diagram Figure 7 Wi Fi footprint 1524 24 13 CAMERA 7 8 max _ _ ie a a n 25 D l a 12 TE 4 CN 2 9 1x185 w T RECOMMENDED LAND PATTERN TOP VIEW PCB design requires a detailed review of the center exposed pad This pad requires good thermal conductivity Soldering coverage should be maximized and checked via x ray for proper design There is a trade off between providing enough soldering for conductivity and applying too much which allows the module to float on the paddle creating reliability issues ST recommends two approaches a large center via that allows excess solder to flow down into the host PCB with smaller vias around it or many smaller vias with just enough space for the viscosity of the chosen solder flux to allow some solder to flow into the smaller vias Either of these approaches must result in 60 or more full contact solder coverage on the paddle after reflow ST strongly encourages PCB layout teams to work with their EMS providers to ensure vias and solder
11. ergy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However there is no guarantee that interference will not occur in a particular installation This device complies with part 15 of the FCC rules Operation is subject to the following two conditions 1 The device must not cause harmful interference and 2 The device must accept any interference received including interference that may cause undesired operation Modifications or changes to this equipment not expressly approved by the party responsible for compliance may render void the user s authority to operate this equipment Modular approval FCC and IC FCC ID VRA SG9011203 IC 7420A SG9011203 In accordance with FCC part 15 the modules SPWF01SA and SPWF01SC are listed above as a modular transmitter device DoclD025635 Rev 6 9 16 Regulatory compliance SPWF01SA SPWF01SC CE 10 16 Labeling instructions When integrating the SPWF01SA and SPWF01SC into the final product it must be ensured that the FCC labeling requirements specified below are satisfied Based on the Public Notice from FCC the product into which the ST transmitter module is installed must display a label referring to the enclosed module The label should use wording like the following Contains Transmitter Module FCC ID VRA SG90112013 IC 7420A SG9011203 Any similar wording that expresses the same meaning may also
12. nts to ST products and or to this document at any time without notice Purchasers should obtain the latest relevant information on ST products before placing orders ST products are sold pursuant to ST s terms and conditions of sale in place at the time of order acknowledgement Purchasers are solely responsible for the choice selection and use of ST products and ST assumes no liability for application assistance or the design of Purchasers products No license express or implied to any intellectual property right is granted by ST herein Resale of ST products with provisions different from the information set forth herein shall void any warranty granted by ST for such product ST and the ST logo are trademarks of ST All other product or service names are the property of their respective owners Information in this document supersedes and replaces information previously supplied in any prior versions of this document 2015 STMicroelectronics All rights reserved 16 16 DoclD025635 Rev 6 3
13. paste designs that will result in satisfactory performance DoclD025635 Rev 6 13 16 Ordering information SPWF01SA SPWF01SC 9 Note 14 16 Ordering information Table 8 Ordering information Order codes SPWF01SA 11 Description Wi Fi module with integrated antenna 1 5 MB of Flash and Wi Fi full stack SPWF01SC 11 Wi Fi module with integrated u fl connector 1 5 MB of Flash and Wi Fi full stack SPWF01SA 21 Wi Fi module with integrated antenna 512 kBytes of Flash and Wi Fi full stack SPWF01SC 21 Wi Fi module with integrated u fl connector 512 kBytes of Flash and Wi Fi full stack Refer to the user manual for a complete list of features and commands available in the Wi Fi full stack DoclD025635 Rev 6 4 SPWF01SA SPWF01SC Revision history 10 Revision history Table 9 Document revision history Date Revision Changes 05 Dec 2013 1 Initial release 22 Jan 2014 2 Figure 3 has been modified 16 Apr 2014 3 n with references to modules with reduced Flash 18 Sep 2014 4 Modified Figure 1 and Table 3 20 May 2015 5 Modified Features and Applications 11 Nov 2015 6 Update picture in first page DoclD025635 Rev 6 15 16 SPWF01SA SPWF01SC IMPORTANT NOTICE PLEASE READ CAREFULLY STMicroelectronics NV and its subsidiaries ST reserve the right to make changes corrections enhancements modifications and improveme
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