Conductor Resistance Evaluation System
Contents
1. AMR UA can be precisely determined at the tip of a measuring cable using a four terminal sensing AMR We offer multi channel _ evaluations thus increasing time saving and test accuracy Channels can be added in 40 channel blocks from the standard 40 channels up to 280 channels optional depending on the tests and the number of chambers to be connected Measurement equipment Agilent Technologies Utility Multifunction rack that pursues ease of use improve the workability St Fi St Measurement cable Uninterruptible power supply System control PC art button Connection unit xable on both right and left sides Keyboard table ePlaced inside the cabinet when not in use Connection unit storage space orage Space System rack Connection unit Chamber sold separately Connection unit Installing the connection unit facilitates the measurement cable connection The connection unit can be installed in front of the rack or either on the left or right side of the rack according to the work environment Optimum characteristics cable The cable supplied is made from Teflon which guarantees an excellent resistance to noises as well as heat Moreover it enables an optimum accurate measurement of micro resistances The end of the cable is designed to facilitate the connection to a specimen Global environmental issues Components are fixed with lead free2. recognition using the absolute value The date obtained at measurement intervals are evaluated using the preset absolute value It will detect small changes of conductive resistance due to micro cracks and will do so until total opening of the crack Absolute value can be set in hot condition and cold condition to have separate identifications from both temperature ends The AMR will terminate the test once that failure is identified on the channel It can be set to resume the test too Failure recognition using the change rate This method can be used to detect small changes of conductive resistance in BGA and CSP It will compare the initial value at the starting point of the test with the actual one and will use the of difference to detect the failure It can be set on both ends of hot and cold conditions Evaluation with absolute value Upper absolute value Lower absolute value e Evaluation of the measured data using the absolute value E Absolute value setting Recognizes values as the lt test completion value Evaluation with the change rate Change rate at high temperature Change rate Seca ean SE at low temperature e Evaluation of the measured data using the change rate Recognizes the values as E Change rate setting the change rate reference values High temperature side Low temperature side Decision waiting perio
3. soldering Furthermore power consumption has been reduced by 24 compared to the previous model in consideration of global environmental protection except for purchased items such as PCs and measuring instruments Utility Tests simplified by the interaction of the measurement system with various environmental test chambers Interaction with the environmental test chamber The AMR can be connected to three environmental test chambers for testing Interaction with the environmental test chamber enables temperature and humidity monitoring management of the time schedule and it displays an alarm when a failure is detected Real time monitoring of temperature and humidity AMR monitors and records the temp and humid inside the environmental test chamber Data are recorded simultaneously with the measurement PNE Temperature Loads temperature data for each measurement are processed carried out by the AMR The statistics monitoring by the AMR Data are saved on a CSV format Example of AMR connected with a Thermal shock chamber Interaction with the thermal shock chamber TSA Series processing software displays the recorded data in synchronization with Cycle count the data of the resistance tests Analyzes the cycles performed by the chamber by counting and failure occurrences listing The AMR starts the test automatically AO as soon as the chamber parameters has been set 3 Safety design gu
4. A 101L Lowtemp chamber 65t00C we50xH460xD370 TSA 301L W970XH460xD670 Thermal Shock Chamber TSD 100 TSD 100 is a thermal shock chamber with two zones that conforms to Japanese and international test standards such as MIL STD 883 JIS C 0025 and JASO D001 With excellent temperature distribution performance this chamber applies uniform temperature stress to specimens Furthermore by monitoring specimen temperature with the STT function this chamber starts counting exposure time and switches to the next step immediately after the specimen temperature reaches a preset value thus enabling highly accurate tests In the temperature range between 60 and 150 this chamber has a short return time of 15 minutes allowing a reduction of the total test time This chamber can be used in a variety of purposes from research and development to inspection and production Model Temperature range Inside dimensions mm 5 High temp chamber 60 to 200C ee eO a a tis W710XH345xD410 14 ESPEC CORP http www espec co jp english Head Office 3 5 6 Tenjinbashi Kita ku Osaka 530 8550 Japan Tel 81 6 6358 4741 Fax 81 6 6358 5500 ESPEC NORTH AMERICA INC Tel 1 616 896 6100 Fax 1 616 896 6150 ESPEC EUROPE GmbH Tel 49 89 1893 9630 Fax 49 89 1893 96379 ESPEC ENVIRONMENTAL EQUIPMENT SHANGHAI CO LTD Head Office Tel 86 21 51036677 Fax 86 21 63372237 BEIJING Branch Tel 86 10 64627025 Fax 86 10 64627036 TIANJIN Bran
5. Quality is more than a word CAT NO E08524 Continuous measurement of micro resistance in solder joint and connector contact areas Accurate evaluation of the reliability of connections The Conductor Resistance Evaluation System enables continuous measurement of resistance changes under high and low temperature cycles Automatic measurement data storage and processing are operated systematically with a PG The system realizes accurate and effective contact reliability evaluations Accurately detects minute cracks in semiconductor packages and electronic component junctions Automatic measurement and chamber integration allow improved efficiency in test schedule management Main features Unique multi scan and international standards compatible measurement equipment Both direct and alternating current application available Absolute value and changing rate evaluation available Real time measurement enabled using a personal computer Editing browsing of data available during the evaluation process Test efficiency dramatically improved by thermal shock chamber s interaction with the AMR Solder crack progression Normal state Cracking has started Complete fracture Evaluation targets e Printed circuit boards Semiconductor underfill Main applications e Through hole conductor evaluation Solder joint contact evaluation BGA CSP solder joint contact evaluation Connector contact r
6. aranteed by ao tha test The AMR automatically stops operations of both itself and the chamber after being exposed to high temperature abnormality detection 2e H Resumption of Automatically resumes the halted cycle of the test as it is If a failure occurs with the environmental the test The halt history is saved in the measurement data test equipment or the AMR the test will stop immediately Resetting will resume the test from where it stopped Completion of the test Test automatically ends when the test is completed Work temperature The AMR take temperature measures in the chamber randomly monitoring up to 16 channels Data are saved in CSV format Chamber failure When a failure occurs in the chamber or the measuring detection equipment fails to operate properly the test automatically stops Remote processing of Checks the obtained temperature data against the data of the test data optional BRUNE E Ng resistance values based on the number of cycles LAN compatible software enables remote test checking and data processing for example from a distant office Additionally we offer software licenses according to the number of users so that multiple PC monitoring is possible Network LAN compatible software optional Thermal Shock Chambers Thermal Shock Chambers Thermal Shock Chambers Evaluation DC or AC measurement can be selected according to your test requirements Example reliability
7. ble thanks to the cursor function displayed on the graphic Weibull Analysis Optional This data processing software with a statistic processing function enables a Weibull analysis of test data as well as regular probability plotting and logarithmic probability trend curves SYSTEM CONFIGURATION_DIAGRAM 2 D i SS a Chamber monitor mimes 7 l ped e System controller PC and LCD monitor for system control Measurement data processing chamber control e Chamber monitor Allows temperature control monitoring alarm control of the chamber from the system controller e Uninterruptible power supply e Micro resistance measurement unit Backup power supply for the system controller Precisely measures resistance by 4 wire resistance Automatically interrupts the test in case of power cut measurements When power recovers the test restarts from where it UD type Equipped with 34420A made by Agilent Technologies was stopped does not resume automatically UA type Equipped with 4338B made by Agilent Technologies e Scanner unit for minute resistance measurement 40 standard channels Optionally up to 280 channels can be added e Connection unit Relays the measurement cable 10 11 SPECIFICATIONS Current application DC application Channel configuration Control channel Software Measuring intervals ROE tonk 0 O 100p Q Resistance measurement range Minimum r
8. ch Tel 86 22 26210366 Fax 86 22 26282186 GUANGZHOU Branch Tel 86 20 83317826 Fax 86 20 83317825 SHENZHEN Branch Tel 86 755 83674422 Fax 86 755 83674228 SUZHOU Branch Tel 86 512 68028890 Fax 86 512 68028860 ESPEC TEST TECHNOLOGY SHANGHAI CO LTD Tel 86 21 68798008 Fax 86 21 68798088 ESPEC MALAYSIA SDN BHD Tel 60 3 8945 1377 Fax 60 3 8945 1287 W6E20C03 The contents of this catalog is as of June 2008 JIS Q 9001 JSAQ 004 ISO 9001 JIS Q 9001 Quality Management System Assessed and Registered ESPEC CORP has been assessed by and registered in the Quality Management System based on the International Standard ISO 9001 2008 JIS Q 9001 2008 through the Japanese Standards Association JSA S MWetyp ay EC99J2046 ISO 14001 JIS Q 14001 Environmental Management System Assessed and Registered ESPEC CORP Specifications are subject to change without notice due to design improvements Corporate names and trade names mentioned in this catalog are trademarks or registered trademarks
9. d Stabilization Stabilization Decision waiting period period period SOFTWARE Main window y e i a UTEN Setting of Duration nb of cycles of a test Duration of the measurement Voltage measurement Stress application voltage e Limit values These settings can be saved in a file that can be use subsequently numerous test conditions can be saved for different tests and specimens Graphic display MT rm 4 AWIE The graph can be arranged by selecting the channel displayed the settings and the cursor Graphs can be copied on a clipboard and opened in another software The sample graph displays a resistance value with the temperature in the thermal shock chamber at the same time 9 Tarpe aimp ee 4 Mest ram Parameters e Selection of a module ali e Test monitoring Real time display of the resistance value temperature inside the chamber channel on which a failure occurs e Auto link to the data processing software Control commands start stop pause and restart The picture shows AMR 280 UD e Specification of the data file name and the connected chamber Text documents output e Selection unselection of the leak touch action mode Comments input e Selection of the channel for the testing e Test conditions specifications Test conditions selected from a saved file e Cursor function Quick confirmation of measurement data and channel number is availa
10. esistance evaluation Fpc life evaluation Contact resistance evaluation of switches Relays etc Lead free solder joints evaluation Contact resistance evaluation of Connectors etc Conductive adhesives and anisotropic conductive films evaluation Other interconnection material contact evaluation Example of AMR connected with a Thermal shock chamber Models e With DC application AMR UD Resistance measurement range 110 to 110 Minimum resolution 100 With AC application AMR UA Resistance measurement range 110 to 110 Minimum resolution 10 Utility Using an international standard traceable precision instrument guarantees the most accurate and compatible measurement data We have always known how to earn our customers confidence AMR is equipped with highly reliable measurement equipment and an ammeter for micro electric current both designed to meet international standards This to obtain most reliable measurement data We offer a calibration service to maintain the equipment s accuracy ISO TEC 17025 compliant We offer two equipments allowing all possibillities We offer two micro electric current applications the DC AMR UD and the AC AMR UA which are used to flow current to specimens when measuring the conductor resistance We offer a wide range of resistance measurement From 10 3 to 106 Conductor resistance values ranging from 10 3 to 106Q AMR UD and from 10 3 to 104Q
11. esolution Measurement accuracy Measurement Measurement range 1MQ and AUTO Type Coated material cable Length Type Length Connection Measurement cable Connection unit Measurement equipment External dimension Power supply facility 1 Value guaranteed at end of measurement cable of a standard system AC application Standard 40ch max 280ch per rack A unit of 10 channels Windows 7 Minimum 3 seconds 10 channels Variable in 3 sec steps x I0 One Oe 10u40 10 mO Measured value of 5 or less 10 100 1000 1kQ 10kQ 100kQ 10mQ 100mQ 10 100 1000 1kQ 10kQ and AUTO Heat resistant flat cable Teflon Temperature for continuous duty 200 2 Beyond connection unit 1 5m Non heat resistant measurement cable Between scanner unit and connection unit 2 0m One connection unit has 40 channel connection Model 34420A Agilent Technologies 530W x 1750H x D940D mm Model 4338B Agilent Technologies 100V AC 1 10 0A 120V AC 1 8 3A 220V AC 1 4 5A 240V AC 1 4 2A 2 The solder used for connections has to be chosen by the customer regarding its temperature resistance AMR L UL Lo D DC application A AC application Number of channels 040 40 channels 080 80 channels 120 120 channels 160 160 channels 200 200 channels 240 240 channels 280 280 channels ACCESSORIES e Measurement cable e Communication cable RS 485 e Setup CD e Use
12. evaluation of BGA and CSP a Measurement AMR UD Using DC current resistance to measure solder ball connections Daisy chain evaluation small voltage change and detect up to ae and AC application evaluation IMQ of resistance It is suitable for the ase in which signals between measured channels do not interfere with each other communication between channels is independent from each other observ at Lon a f la how han poe of conductive resistance such as Daisy IC chip ew Solder chip Chain of BGA in semiconductor T applications 2ch AC Measurement AMR UA Using AC micro current to measure small voltage changes without being affected by thermal electromotive force It is suitable for the observation of changes in conductive resistance DC application only AMR UD only evaluations Case in which the measured signals interfere with each other between channels ich _6ch E EE Compatible model differs depending on the daisy chain design for BGA and CSP evaluations DC application AC application Evaluated item AMR UD AMR UA Lead free solder joints Reliability of BGA and CSP solder ball connections Contact resistance of connectors etc Contact resistance of switches relays etc OWE Cho COO Conductive adhesive and anisotropic conductive films Evaluation Two failure recognition methods can be performed to detect the failure in conductive resistance of the joint parts Failure
13. ollection and analysis over a wide range of evaluation conditions from reliability evaluations to test characteristic evaluations E Evaluation Targets e Semiconductor transistors e Low k materials e High k materials Electromigration Evaluation System A M Space saving all in one system the AEM is the only product of its kind in the industry to offer electromigration evaluation of 1uA at 400 C E Evaluation Targets e Semiconductor wiring patterns e Solder bumps Flash Memory Endurance Cycling System RB M A Monitored Burn in System for evaluation testing of non volatile memory such as Flash memory or FeRAM This testing evaluation equipment is suited to a variety of uses from R amp D to mass production E Evaluation Targets e Flash memory FeRAM and MRAM VARIOUS ENVIRONMENTAL TESTCGHAMBERS SOED SEPARATELY Thermal Shock Chamber TSA Series TSA series is the series that reduces the temperature recovery time temperature heat up time and temperature pull down time TSA series has HFC refrigerant and a touch panel that facilitates operation setting changes TSA Series is presented as environment friendly series Model Temperature range Inside dimensions mm TSA 71S W410 x H460 x D370 High temp chamber 60 to 200 C TSA 101S Low temp chamber 70 to 0 C W650 X H460 xX D370 TSA 201S W650 X H460 x D670 TSA 41L W240 x H460 x D370 TSA 71L High temp chamber 60 to 2000 W410xH460x D370 TS
14. r s manual OPTIONS Additional channel 40 channel basis Heat resistant measurement cable Identical to the heat resistant measurement Teflon cable included as a standard accessory 1 5m 2 5 m 3 5 m Can be extended in 1 meter increments upon request at the time of purchase Colored heat resistant cable Provides different colored cables for each channel 1 5m Can be extended in 1 meter increments upon request at time of purchase Non heat resistant measurement cable extension Specimen temperature monitor Specimen temperature monitor measures the surface temperature of the specimen and saves the specimen surface temperature and the measured data simultaneously The following two types are available 8 points measurement type 16 points measurement type LAN compatible software Data processing software with statistic processing software Emergency stop switch Stops the system immediately Communication cable 12 MEASUREMENT SYSTEMS lon Migration Evaluation System A MI Makes stress evaluations and insulation resistance evaluations by electrochemical migration efficient and easy and covers a broad spectrum from low voltage to high voltage tests E Evaluation Targets e Printed circuit boards e Insulation materials e Semiconductor materials Semiconductor Parametric Test System A M M Supports cutting edge device evaluation and offers highly reliable data acquisition c
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