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COLOR MONITOR SERVICE MANUAL

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1. 300 3FF 300 3FF e Click Start button f Click Exit button Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 13 LGE Internal Use Only SERVICE OSD 1 Turn off the power switch at the right side of the display 2 Wait for about 5 seconds and press MENU POWER switch for 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a CLEAR To initialize using time c Auto Color W B balance and Automatically sets the gain and offset value press key for over 3 sec d AGING Select Aging mode on off b Module To select applied module d NVRAM INIT EEPROM initialize 24C16 press key for over 3 sec e R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually g R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B Gain value manually Analog Only Video Signal Generator Power inlet required Control Line Power Select Switch 110V 220V V Sync On Off Switch Switch must be ON Figure 1 Cable Connection Copyright 2007 LG Electronics Inc All right reserved Only for training and service purp
2. 2250556 9 RX2 1 I i go 1 e qu Ax2 1 gt ath 2 inn I 28 mus 5 e 0738 0739 740 us na 1 ae Loz dica I 48 RX 1 100uF gt MF Or AL DON i er 770 871 1 DOWN 4 AXO 1 I we PXO 1 aed NODON Wy I gi leno e 1 4 n 521 l A709 33 u 3 D SDAB 4 I 1 5 1 1 a gu So 1 P702 5 62 i SMi00 06 22 RXC 1 AK Be E mo 0706 jT m TUE 1 1 SVHPD 4 id 000500 a 270 o 703 _ gt 7 EE 20 Lm Tas NI abe g 1 st s x TI 1EEPRON 4 752 OQ Meo 4 yar d A00 dii 1D 8CLB 1 KEYL 4 re KST3908 MIF 10 8048 0737 0707 0 O1UF LED AM 4 optinl READY C736 QO Z Syg ul 4 LGE Internal Use Only 24 Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes 3 CONTROL Pi 12505WH OS5AO0 J5VS R2 12505WA 04A00 _ gt LED_BL 8comoc MAIN BOARD L __ gt IKEYO C1 1uF 10V READY BVS R1 js E E Sw4 18K iek 1
3. 150 min 9300K 2 3 Contrast Ratio 500 1000 DFC gt 10000 1 Typ SIGNAL Refer to the Timing Chart 3 1 Sync Signal Type Separate Sync SOG Digital 3 2 Video Input Signal 1 Type Analog 2 Voltage Level 0 0 7 V 3 Input Impedance 750 3 3 Operating Frequency Horizontal 28 83kHz Vertical 56 75Hz Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 5 2 Power Consumption MODE HN SYNC VIDEO POWER CONSUMPTION LED COLOR STAND BY OFF ON OFF less than 1 W AMBER SUSPEND ON OFF OFF less than 1 W AMBER DPMS OFF OFF OFF OFF less than 1 W AMBER less than 39 W max POWER ON NORMAL ON ON ACTIVE BLUE less than 36 W typ F Prowenswore OFF ENVIRONMENT 6 1 Operating Temperature 10 C 35 C 50 F 95 F 6 2 Relative Humidity 1026 8096 Non condensing 6 3 MTBF 50 000 HRS with 9096 Confidence level Lamp Life 40 000 Hours Min 7 DIMENSIONS with TILT SWIVEL Width 451 5 mm 17 78 Depth 386 mm 15 2 Height 220 mm 8 66 8 WEIGHT with TILT SWIVEL Net Weight 3 9 kg 8 6 Ibs Gross Weight 5 02 kg 11 07 1 5 LGE Internal Use Only Signal Connector Pin Assignment e DVI D Connector Digital Pin Signal DVI D Pin Signal DVI D VLELETLT D4 IO cO 10 11 12 13 14 15 T D S D
4. Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Metal Oxide Film RSDO2F4J3R30 3 Resistor Chip MCR10EZHJ103 10KOHM Resistor Chip MCRO3EZPJ202 2KOHM 5 Resistor Chip MCRO3EZPJ271 2700HM Resistor Chip MCRO3EZPJ271 2700HM Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ000 5 Resistor Chip MCRO3EZPJ102 1KOHM 5 Resistor Chip MCRO3EZPJ472 4 7KOHM 0RJ4701D677 0RJ2001D677 0RJ4701D677 0RJ4701D677 0RJ1002D677 0RJ1001D677 0RJ1000D677 0RJ0000D677 0RJ2001D677 0RJ2701D677 6602T12005E 6602T12005C 6602T12005C 6630TGA005B 66306100316 6630V90220E 6630V90220K EAG37060101 EBF37991 701 EBF37991 701 EBF37991 701 EBF37991 701 EBF37991 701 EBF37991 701 6600R000133 ODLGP0128AA 6212AA2001G LOC NO PART NO DESCRIPTION SPECIFICATON Resistor Chip MCROSEZPJ472 4 7KOHM Resistor Chip MCROSEZPJ202 2KOHM 5 Resistor Chip MCROSEZPJ472 4 7KOHM Resistor Chip MCROSEZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ103 10KOHM Resistor Chip MCROSEZPJ102 1KOHM 5 Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCROSEZPJ000 5 Resistor Chip MCROSEZPJ202 2KOHM 5 Resistor Chip MCROSEZPJ272 2 7 Connector Wafer 12505WR 06A00 1 2 Connector Wafer 12505WR 04A00 1 2 Connector Wafer 12505WR 04A00 1 2 Connector DSUB QH11121 DNO D DVI 2
5. LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE f unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly b Disconnecting or reconnecting any receiver electrical plug or other electrical connection c Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode 2 Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc 3 Discharge the picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and
6. Capacitor Ceramic Chip 0603B104K500CT 100nF Capacitor Ceramic Chip C1608C0G1H680JT 68pF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip C1608COG1H680JT 68pF Capacitor Ceramic Chip C1608COG1H680JT Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip C1608Y5V0J475ZT 4 7u Capacitor Ceramic Chip 0603B103K500CT 10nF Capacitor AL Radial KMG16VB100M 100uF 20 Capacitor AL Radial KMG16VB100M 100uF 20 OCE107EF610 OCE107EF610 0CK105CD56A 0CK105CD56A 0CK105CD56A 0CK102CK56A 0CK102CK56A 0CK102CK56A OCE107EF610 OCK104CF56A 0CK105CD56A 0CC101CK41A 0 106 638 00 1 00018 00 1 00018 00 1 00018 00 1 00018 00 1 00018 00 1 00018 00 1 00018 00 1 00018 00 1 00018 00 1 00018 0DSIH00018A 0DSONO00138A 0DD184009AA 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ560009GB 0DZ5
7. or electric shock as this will result in damage to the Screen Do not scratch or press on the panel with any sharp objects such as pencil or pen as this may result in damage to the panel e Protect the module from the ESD as it may damage the electronic circuit C MOS e Make certain that treatment person s body are grounded through wrist band Do not leave the module in high temperature and in areas of high humidity for a long time e he module not be exposed to the direct sunlight e Avoid contact with water as it may a short circuit within the module e f the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation Copyright 022007 LG Electronics Inc All right reserved Only for training and service purposes A WARNING BE CAREFUL ELECTRIC SHOCK f you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms e Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE To Instrument s CONDUIT etc exposed METALLIC PARTS 1 5 Kohm 10W
8. solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test 2 After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly 3 Use only a grounded tip soldering iron to solder or unsolder ES devices 4 Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ES devices 6 Do not remove a replacement ES device from its protective package until immediately before you are ready to inst
9. GNDB BH 8 I 12703 o 21117 3 3 ih BLU D FW10038 30 9 1 1700 9718 6B PEAY MLB 201209 0420P N2 gt VSYNC 17 9 3 3V PL t opg 1on REALY HH TYPE 11 i np die LQ 7 m J zz ffir 1000pF CLKDUTP A du anne 33 lt D KDUTM A 10 0 T 0 89 p O Y2P A O ST OET L704 L Y2M 201209 0420 Ne 3 3VD Ul HH TYPE 1 1 702 0726 L72 Lo I 9 Y1M A uc as kB zz 1000pF amp a S mix 734 als 89 INPUT DUTPUT us 1 3 JX e B I lt 2 1 O Y A eerakers s i i mam 5 5 B 55 9 NLB 201209 0120P N2 i n 4 4 Lot t LOD 1 9 ne Ll alt mE aL RE TIME lt cours 6727 6730 50734 j zi I C731 400uF JP750 2 CLKOUTM B 1000pF IEN 1 us 9 OS s C705 0 4uF u SS See E Yop 8 5 e I 9 8 v T cw vw T sys P C708 121 co cog S Wiis Wea vine aS as Visa YES C710 LEX l Len m 2700 EX RH Z lt Hz Hv B Ev CM 0 tur tone ou T H F GQH11121 DNO D 0 1 TNVON 0 L P706
10. circuit board Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board Securely crimp each connection and solder it Inspect on the circuit board copper side the solder joints of the two original leads If they are not shiny reheat them and if necessary apply additional solder 2 3 Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake Securely crimp the leads of replacement component around notch at stake top Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures 2 3 LGE Internal Use Only Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper pattern side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefull
11. for training and service purposes ee BLOCK DIAGRAM AC ZHNSIt VL preis WOU US T4 SO TO SeJ1 qur 3u u SueuumT ZUNS9TI ZH0900S80TX089I A u qas s mos VIS ad D a I bursseooud DHMO8 SOWNS L LGE Internal Use Only 10 Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is 136MHz In W1952TQ This part consists of the Scaler ADC convertor TMDS receiver and LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1440X900 W1952TQ resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V and one 1 8V regulators to convert power which is provided 5V in Power board 15V is provided for inverter in W1952TQ Also 5V is converted 3 3V and 1 8V by regulator Converted power is provided for IC in the m
12. source D IC gate D IC TLI T con 160 160 LG PHILIPS LCD LCD Module TF T M190A1 L07 Non ZBD WXGA 19INCH 1440X900 380CD COLOR 72 16 10 1000 1 EAJ42097502 WXGA Non ZBD Non Glare TN 16 7M Response time dms Viewing angle 170 EAJ32175201 DH NON ZED AU OPTRONICS CORE OLOR 125 19 10 800 1 SMS EAJ38022802 16 2M TN 80 16 Ch 0 For Only China domestic market SVA MTO oco 127 110 800 1 Sms EAJ41390301 COLOR 722 19 809 1 SVANEC 19 ABJ35702302 Cabinet Assembly W1952 S 19 CABINET ASSY FOR LPL CMO MTD ABJ35702304 Cabinet Assembly W1952 19 CABINET ASSY 02 CKD ABJ36830002 Cabinet Assembly W1952 CABINET ASSY FOR AUO BOE NEC CMO ACQ35704405 Cover Assembly Rear W1952 S 19 W1952 BACKCOVER 200 300 400 ACQ35704407 Cover Assembly Rear W1952 S 19 W1952 BACKCOVER 410 AGF35751203 Package Assembly MAIN W52 series ODC Mstar MGJ41193201 Plate Shield PRESS SPTE 0 3 SHIELD SPTE 0 3T Lamp Shield L1755 W1952 W2252 420 MGJ41193202 Plate Shield PRESS SPTE 0 3 SHIELD SPTE 0 3T Lamp Shield L1755 W1952 W2252 MGJ41204901 Plate Metal PRESS SBHG 0 8T SUPPORTER W1952 METAL SUPPORT 0 8T 430 MGJ41204902 Plate Metal PRESS SBHG 0 8T SUPPORTER W1952 METAL SUPPORT 0 8T MGJ41204903 Plate Metal PRESS SBHG 0 8T SUPPORTER W1952 METAL SUPPORT 0 8T EBR42021801 PCB Assembly LED amp P SW LM84 W52 series EBR416841
13. 01 PCB Assembly CONTROL T T LM84A W52 series RD ACQ33707101 Cover Assembly L1954T LM57B 19 Cover Hinge Assy Normal Stand L1954T ACQ33707107 Cover Assembly L1954T L207W LM57B 20 Cover Hinge Assy Normal Stand 01 CKD MCK41193001 Cover MOLD ABS L1755 WX52 ABS HF 350 Stand Body L1755 WX52 MCK41193003 Cover MOLD ABS L1755 WX52 ABS HF 350 Stand Body L1755 WX52 BLACK CKD MCK41193101 Cover MOLD ABS L1755 WX52 ABS HF 350 Cover Cable MCK41193103 Cover MOLD ABS L1755 WX52 ABS HF 350 Cover Cable Black CKD AAN35706801 Base Assembly STAND W1952 W2252 W1952 W2252 stand base assy AAN35706802 Base Assembly STAND W1952 W2252 W1952 W2252 stand base assy Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 20 LGE Internal Use Only REPLACEMENT PARTS LIST DATE 2007 11 20 LOC NO PART NO DESCRIPTION SPECIFICATON LOC NO PART NO DESCRIPTION SPECIFICATON APACITORs C501 C502 C503 C504 C505 C506 C507 C508 C509 C510 C511 C512 C513 C514 C515 C516 C517 C518 C519 C520 C521 C522 C523 C524 C525 C526 C527 C528 C529 C530 C531 C532 C533 C534 C535 C536 C537 C538 C539 C540 C541 C700 C701 C702 C703 C704 C705 C706 C707 C708 C709 C710 C711 C712 C713 C714 C715 C716 C717 C719 C720 C722 C723 C725 0CK104CF56A 0CK473CH56A 0CK473CH56A 0CK473CH56A 0CK473CH56A 0CC102CK41A 0CK473CH56A 0CK473CH56A 0CC270CK41
14. 1 Nl lt 13 3V PL 2 USE M24C16 HMNGT 8526 3 9 9 w H527 38 LGE Internal Use Only 23 Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes 2 POWER amp WAFER T P a I I 25 561 25 Kosta I a MMBD304LT1G a I S D713 DDC5V P7014 u sys I I e 1 581 KCN DS 3 0062 0708 z a sls I Ay ay Br s L el el I 28 Yu T 1 N J 8 S E 1 555 l WC JEEPROM 1 GNDR SCL P 0 5 4 DA e LE 1D SDAA 1 FED A L bc READY IDSUB 24C02 R719 33 1 t D SDAA x x s s s s 49 BUZZER oO B 9 GRN A tia lt 5 00
15. 224 GPIIO_P22 PWM1 C_6 l2 H817 10K MODE VDDP_6 l T2C_MDA GPIO_P11 VDDP_5 4 3 7 paoa 9509 al 4 1K OIAIOGINI YI HIRO s im au lm s s CO P 10 olo Is LOO al rp ap od d P 1 EI YI O olo SDATA oan 66 H gt gt gt gt n hhh Qu E 5 5 90 4 m gt 4 lt gt 40 5 e m B x xe 5 8 4 2 3 31 800 lt C546 0 4uF Sek 1 J SDATAL 2 0 I C517 EE pe C518 C520 UF C522 LUF 3 lel 1 80 518 C501 0 0 R525 4 7K UF 1uF 5 5 LIPS PWM DIMMING Rage LAMP_ADU 2 LEK 35v3 2 LIPS DIN p533 l2l LIPS DIM A529 C oco LIPS DIM EST3904 LIPS DIN EE SCALER DIM 9523 100 0502 W25X20VSNIG R53 40K P524 10K WA lH 1 5 S lM T Ve 9531 Na 10K opt ipn READY
16. 2C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Diode Zener BZT52C5V6S F 5 6V Su IC EEPROM M24C02 RMN6TP 2KBIT IC LDO Voltage Regulator AZ1086S 1 8TRE1 3 2T IC LDO Voltage Regulator AZ1117H 3 3 4 75 010 IC Video Processors FE253MOH LF 300MVTO3 IC Serial Flash Memory W25X20VSNIG 2MBIT 25 IC EEPROM M24C16 WMN6TP 16KBIT Filter Bead MLB 201209 0120P N2 Filter Bead MLB 201209 0120P N2 Filter Bead MLB 201209 0120P N2 TR Bipolar 2N39048 NPN 6V 60V 4 TR Bipolar 2N39048 NPN 6V 60V 4 TR Bipolar K TA1241 PNP 8V 35V TR Bipolar 2N39048 NPN 6V 60V 4 TR Bipolar 2N3906S RTK PNP 5V TR Bipolar 2N3906S RTK PNP 5V TR Bipolar 2N3906S RTK PNP 5V TR Bipolar 2N39048 NPN 6V 60V 4 Resistor Chip MCRO3EZPJ163 16 Resistor Chip MCRO3EZPJ163 16 Resistor Chip MCROSEZPJ182 1 8KOHM 0818010677 0822010677 0810000677 0805620677 0810000677 0805620677 0847000677 0810000677 0805620677 0847010677 0847010677 0847010677 0847010677 0847000677 0847000677 0800000677 0839000677 0810020677 0810000677 0815020677 0800000677 080000067
17. 3 3V IC702 1 8V PIN21 1 8V 1 CHECK PIN 127 128 SOLDERING CONDITION 2 CHECK X501 3 TROUBLE IN U501 U501 PIN 127 128 14 3MHZ CHECK U501 PIN32 H SYNC AND CHECK CONNECTION LINE IS PULSE APPEARED AT FROM D SUB 0501 SIGNAL PINS YES TROUBLE IN CABLE OR LCD MODULE Waveforms 1 0501 4127 Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes aa LGE Internal Use Only 4 TROUBLE IN DPM TROUBLE IN DPM CHECK R717 AND CHECK PC R718 SYNC PC IS GOING APPEARED INTO DPM MODE CHECK U501 PIN 32 33 CHECK H V SYNC LINE SYNC PULSE YES TROUBLE IN U501 Waveforms 5 mi 1254 Lire IHi He 4 higar IEr OO a is Cd rm thay 5 11 14 Copyright 0 2007 LG Electronics Inc All right reserved Only for training and service purposes 18 LGE Internal Use Only EXPLODED VIEW Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 19 LGE Internal Use Only EXPLODED VIEW PARTS LIST Part No Description EAJ35661004 LCD Module TFT HT 190WG1 100 ZBD DRIVER 19 0INCH 1440X900 300CD COLOR 72 16 9 700 1 4CCFL 160 160 5 BOE HYDIS TECHNOLOGY EA J36290802 LCD Module TFT LM190WX1 TLC2 DRIVER 19INCH 1440X900 300CD COLOR 72 16 10 850 1 5ms Non ZBD MAGNA
18. 4 Connector DSUB DZ11AA1 HVG PF D SUB Connector Wafer TJC2004 6A 6P 2 0MM Connector Wafer TJC2004 11A 2 0M Connector FFC FPC PIC 10031HR 30 1 00M Switch Tact KMB 903 TMB 901 1C1P Switch Tact KMB 903 TMB 901 1C1P Switch Tact KMB 903 TMB 901 1C1P Switch Tact KMB 903 TMB 901 1C1P Switch Tact KMB 903 TMB 901 1C1P Switch Tact KMB 903 TMB 901 1C1P Switch Tact JTP1280A6 1C1P 12VDC LED Chip GPTD1210YBC BLUE YEL Crystal HLX U F 14 31818M 18 SCHEMATIC DIAGRAM 1 SCALER 1 2l 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 2 p 1 15V8 dag 2 6509 27pF HEB T KEYO 2 X501 Im 8518 100 ate 0 m m ye INO 2 C540 i 10uF 16 0 SHORT CHK eO ie 21 3 310 5 C514 u mia o 15K 0 22 rr Per 2 t EVD t q 5 x gt O OoO oc wd V x w Fi tD D In II D ID N I Oeo Od l I J oe n Z o23 mi mHinmHimHiH
19. 60009GB 0DZ560009GB OIMMRO00014A 0IPMG78403A OIPMGA0010A OIPRP00784C EAN37157001 OIMMRSGO36B OLCMLO00003B OLCMLO00003B OLCMLO00003B OTRKE80046A OTRKE80046A EBK39150701 OTRKE80046A OTR390609DC OTR390609DC OTR390609DC OTRKE80046A 0RJ1602D677 0RJ1602D677 0RJ1801D677 Capacitor AL Radial KMG16VB100M 100uF 20 Capacitor AL Radial KMG16VB100M 100uF 20 Capacitor Ceramic Chip C1608X7R1A105KT 1uF Capacitor Ceramic Chip C1608X7R1A105KT 1uF Capacitor Ceramic Chip C1608X7R1A105KT 1uF Capacitor Ceramic Chip 0603B102K500CT 1nF 1 Capacitor Ceramic Chip 0603B102K500CT 1nF 1 Capacitor Ceramic Chip 0603B102K500CT 1nF 1 Capacitor AL Radial KMG16VB100M 100uF 20 Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip C1608X7R1A105KT 1uF Capacitor Ceramic Chip C1608C0G1H101 JT 100p Capacitor AL Radial SHL5 0TP 16VB10M 10uF Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Switching ENKMC2837 T112 1 2V Diode Schottky MMBD301LT1G 600MV 30 Diode Assembly KDS184 KDS184 TP Diode Zener BZT5
20. 7 0847010677 0810000677 0810020677 0847010677 0803320677 0803320677 0810020677 0822010677 0847010677 0847010677 0803320677 0801020677 0801020677 0801020677 0801020677 0801020677 0801020677 0803320677 0801020677 0801020677 0810010677 0803320677 0807520677 0806820677 0806820677 0803320677 0807520677 0807520677 0836010677 0810020677 0839000677 0810020677 0839000677 0847010677 0847010677 0847010677 0331 668 ORH1002D622 0RJ2001D677 0RJ2700D677 0RJ2700D677 0RJ1000D677 0RJ1000D677 0RJ0000D677 0RJ1001D677 0RJ4701D677 LOC NO PART NO DESCRIPTION SPECIFICATON Resistor Chip MCRO3EZPJ182 1 8 Resistor Chip MCRO3EZPJ222 2 2KOHM Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ560 56 5 Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ560 56 5 Resistor Chip MCRO3EZPJ471 4700HM Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ560 56 5 Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ471 4700HM Resistor Chip MCRO3EZPJ471 4700HM Resistor Chip MCRO3EZPJ000 0OHM 5 Resistor Chip MCROSEZPJ391 3900HM Resistor Chip MCRO3EZPJ103 10 Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ153 15KOHM Resistor Chip MCRO3EZPJ000 5 Res
21. A 0CC270CK41A OCK103CK51A 0CK103CK51A 0CK104CF56A 0CK224CF56A OCE106CF638 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CC080CK11A 0CC080CK11A 0CC080CK11A 0CC101CK41A 0CC101CK41A 0CC680CK41A 0CK104CK56A 0CC680CK41A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CC680CK41A 0CC680CK41A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK104CF56A 0CK475CC94A 0CK103CK51A 0CE107EF610 OCE107EF610 Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip C1608X7R1E473KT 47nF Capacitor Ceramic Chip C1608X7R1E473KT 47nF Capacitor Ceramic Chip C1608X7R1E473KT 47nF Capacitor Ceramic Chip C1608X7R1E473KT 47nF Capacitor Ceramic Chip C1608C0G1H102JT 1nF Capacitor Ceramic Chip C1608X7R1E473KT 47nF Capacitor Ceramic Chip C1608X7R1E473KT 47nF Capacitor Ceramic Chip C1608C0G1H270JT 27pF Capacitor Ceramic Chip C1608C0G1H270JT 27pF Capacitor Ceramic Chip 0603B103K500CT 10nF Capacitor Ceramic Chip 0603B103K500CT 10nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B224K160CT 220nF Capacitor AL Radial SHL5 0TP16VB10M 10uF
22. Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100 Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip 0603B104K160CT 100nF Capacitor Ceramic Chip C1608C0G1H080DT 8pF Capacitor Ceramic Chip C1608C0G1H080DT 8pF Capacitor Ceramic Chip C1608C0G1H080DT 8pF Capacitor Ceramic Chip C1608COG1H101JT 100p Capacitor Ceramic Chip C1608CO0G1H101JT 100p Capacitor Ceramic Chip C1608CO0G1H680JT
23. EK KMB 803 TMB 801 B94 KMB S03 TMB 90 4 KEYO e m ba m 1 C L lt 1 Lu al e Lil OF to ET Lr D A UME 1 FU Swe 5 6B Swi 9 901 4 SWS R5 RB KMB 9p3 1Mp 901 2 2 903 8 901 2 7K KMB S03 TMB 901 e E E g g 1 BK gt m tr a 10 Nw READY m 4 2 4 4 206 5 6 READY m a Fd 6B 5 READY SW7 SKHV 109 10B pit KEYO_PWA ao LEO_AM_PWA LED BL PWA LD3 LD v BL HKBB533B THB 4 Ti gt BL HKBB533B cs EN BL HKBB533B S AU DOWN compc BRIGHTNESS MUTE LED_BL_PWA C LED AM PWR C LGE Internal Use Only 25 Copyright c 2007 LG Electronics Inc All right reserved Only for training and service purposes Nov 2007 MFL30290856 Printed in China
24. H rtH OIGO OI DI F Y CSI TEL STI EI Olo 07 875 15 G gt C5 6 6 gt gt miu 15 mi GI Ts XB ELSE 520 C513 AK SSS GND 1 1 Hoo ov BYPASS e ru CPI P14 PWMO 5 GND 12 l p sa 9 EE 3 E E NETT DET bd i E HEB spem on D S0 B a 6 97 es Y1P 8 gt 3 30 PL 7 95 voca 5 pol 33 AVDD 33 1 gs LVB2P Y2P 8 2 E 2 g LVBCKM 1504 Be GND 2 44 ge LVB3 Y3i 8 2 Dp 42 gi EVE3 YPE 2 RX 4 3 90 C 11 TSUMOS8CWHU L ee 14 RXOP 15 GND 41 HXO VDDP 8 is GND_3 VAO 17 YON A 2 p x AXCKP 18 LVAQ AXCKN 19 LVA4 o LI 8504 100 oosa 20 EAT PA vr lm TE AVDD_18 24 E LVA2 E i 8502 55 0503 0 042 BINO LVAZP Y2P A T 2 BLUA II BINOP LVACKM 8503 100 C504 0 0470 CLKOUTM A 2 GINO H LVACKP Ipa i CLKOUTP A 2 8504 55 I cs 0 047uF GINOP E ul 1 2 t R505 470 C506 1000pF SOGINO LVAS3P ANY l E Y3P A 2 R505 100 C507 p0 MUF RINO z Ges Tf RINOP 2 C_8 2507 55 0 047uF RED A 11 GND_4 VDDC_2 GPIO P04 3 oar T REFP L197WT Scaler TSUMOSPPWHU GND_10 1 E w1952T W2x52T VSYNC ce m DDCA SDA RS232 TX LJSO 1 1 WHO GND_9 oT DICA_SOL RS232_AX GND_8
25. LG Website http biz LGservice com COLOR MONITOR CHASSIS NO LM84B MODEL FLATRON W1952TQ W1952TQ PFT K A Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL CONTENTS SPECIFICATIONS ee u ues 2 ADJUSTMENT 13 PRECAUTIONS RARRARARARRAHRSAEAREAHRARARARHARRAERARARRAHRAARRRRAEARRRRRAR 4 TROUBLESHOOTING GUIDE 15 TIMING CHAR 8 EXPLODED VIEW 19 9 BLOCK DIAGRAM een qo REPLACEMENT PARTS LIST esses 21 DESCRIPTION OF BLOCK DIAGRAM 11 SCHEMATIC 23 SPECIFICATIONS 1 LCD CHARACTERISTICS 4 MAX RESOLUTION Type TFT Color LCD Module Analog 1440 x 900 60Hz Active Display Area 19 inch diagonal Digital 1440 x 900 60Hz Pixel Pitch 0 285 H x 0 285 V Size 493 7 H x 320 1 V x 16 5 D 5 POWER SUPPLY Color Depth 16 7M colors 5 1 Power Adaptor Built in Power Electrical Interface LVDS Input AC 100 240V 50 60Hz 0 8 Surface Treatment Operating Mode Backlight Unit AG Haze 25 Hard Coating 3H Normally White 4 CCFL OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio 25 Left 80 min 88 Typ Right 80 min 88 Typ Top 80 min 85 Typ Bottom 80 min 85 Typ 2 2 Luminance 180 30 sRGB 210 300 6500
26. ain board The inverter converts from DC 15V to AC 700Vrms and operates back light lamps of module in W1952TQ 3 MICOM Part This part is include video controller part And this part consists of EEPROM IC control data Reset IC and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in EEPROM Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes sque LGE Internal Use Only LIPS Board Block Diagram EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER COMPONENTS AND FILTER TRANSFER AND FILTER LINE 100 240V CONTROL COUPLER COLLENT CIRCUIT ISOLATION ION PRIMARY SECONDARY Operation description Power 1 EMI components This part contains of EMI components to comply with global marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor and of course the primary protection fuse 2 Input rectifier and filter This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loadin
27. all it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material 7 Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions 8 Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device LGE Internal Use Only General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead Keep the soldering iron tip clean and well tinned Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spray on cleaners Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F Heat the component lead until the solder melts Quickly dra
28. ata2 T D S Data2 T M D S Data2 4 Shield T M D S Data4 T D S Data4 DDC Clock DDC Data Analog Vertical Sync T D S Datat T D S Data1 T M D S 1 3 Shield T D S Datas T D S Data3 5 Power Ground return for 5V H Sync and V Sync 16 17 18 19 20 21 22 23 24 Hot Plug Detect D S Data0 T D S DataO T D S Data0 5 Shield T M D S Data5 T D S Data5 T M D S Clock Shield T M D S Clock T M D S Clock T M D S Transition Minimized Differential Signaling Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT e There are some special components used in LCD monitor that are important for safety These parts are marked on the schematic diagram and the replacement parts list t is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the original parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly
29. g condition to achieve the dc output stabilized and also the over power protection is also monitor by this part 5 Photo Coupler isolation This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage 6 Signal collection This part function is to collect the any change from the DC output and feed back to the primary through photo transistor Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 12 LGE Internal Use Only ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP i Port Setup Windows 98 gt Doesn t need setup Windows 2000 XP gt Need to Port Setup This program is available for LCD Monitor only 1 Port Setup a Copy UserPort sys file to c WINNT system32 drivers folder b Run Userport exe UserPort Tomas Franzon c 2000 IPM xi Remove HEITIGVE 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button c Click Write button c Remove all default number 16 25 d Add 300 3FF 01101 8118 00 1 0 2A 00 98 51 30 70 00 FC 00 49 42 4D UserPort Tomas Franzon fc 2000 8 00 00 00 FE 00 39 0 3 00 oOo 00 FF 20 20 20 20 00 El
30. g the IC Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas 3 Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body Bend into a U shape the end of each of three leads remaining on the circuit board Bend into a U shape the replacement transistor leads Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection 2 3 4 Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads Remove the heat sink mounting screw if equipped Carefully remove the transistor from the heat sink of the Circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess lead 6 Replace heat sink 2 Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body Bend the two remaining leads perpendicular y to the
31. istor Chip MCRO3EZPJ000 0OHM 5 Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ101 1000HM Resistor Chip MCRO3EZPJ103 10 Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ330 33OHM 5 Resistor Chip MCRO3EZPJ330 5 Resistor Chip MCRO3EZPJ103 10 Resistor Chip MCRO3EZPJ222 2 2KOHM Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ330 33OHM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCRO3EZPJ330 33OHM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCROSEZPJ100 100HM 5 Resistor Chip MCRO3EZPJ102 1KOHM 5 Resistor Chip MCRO3EZPJ330 33OHM 5 Resistor Chip MCROSEZPJ750 75 5 Resistor Chip MCRO3EZPJ680 680HM 5 Resistor Chip MCRO3EZPJ680 680HM 5 Resistor Chip MCRO3EZPJ330 33OHM 5 Resistor Chip MCRO3EZPJ750 750HM 5 Resistor Chip MCRO3EZPJ750 750HM 5 Resistor Chip MCRO3EZPJ362 3 6 Resistor Chip MCRO3EZPJ103 10KOHM Resistor Chip MCROSEZPJ391 3900HM Resistor Chip MCRO3EZPJ103 10KOHM Resistor Chip MCROSEZPJ391 3900HM Resistor Chip MCRO3EZPJ472 4 7KOHM Resistor Chip MCRO3EZPJ472 4 7KOHM
32. oses zi LGE Internal Use Only TROUBLESHOOTING GUIDE 1 NO POWER NO POWER POWER INDICATOR OFF CHECK POWER BOARD AND FIND OUT A SHORT CHECK P704 VOLTAGE PIN5 PING 5V POINT AS OPENING EACH POWER LINE CHECK 1C703 3 3V IC702 1 8V LINE IS 1C703 PIN2 3 3V IC702 PIN2 1 8V CHECK U501 PIN127 CHECK CRYSTAL X501 PULSE CHECK U501 Waveforms IC703 2 IC702 2 Tek Fun 10 ikin amne m Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 15 LGE Internal Use Only 2 NO RASTER OSD IS DISPLAYED LIPS NO RASTER OSD IS NOT DISPLAYED CHECK P704 CHECK POWER BOARD VOLTAGE PIN5 6 LIPS bV CHECK U501 INVERTER P704 PIN9 3 3V ON OFF PORT 1 CONFIRM BRIGHTNESS OSD CONTRL STATUS 2 CHECK MICOM DIM ADJ PORT CHECK P704 PIN10 CHECK PULSE AS CONTACTING PROBE TO THE LAMP POWER BOARD LIPS WIRE OF THE LCD MODULE REPLACE LCD MODULE Waveforms 3 P704 10 Brightness 100 TU Tuc x Lov thz 4 ea 3c M Ch 5 1 Lad 4 E ne Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 16 LGE Internal Use Only 3 NO RASTER OSD IS NOT DISPLAYED MAIN NO RASTER OSD IS NOT DISPLAYED CHECK U501 CHECK 1 703 3 3 PIN114
33. then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage 4 Do not spray chemicals on or near this receiver or any of its assemblies 5 Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 9096 9995 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required 6 Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped 7 Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed 8 Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 9 Use with this receiver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor
34. w the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F First hold the soldering iron tip and solder the strand against the component lead until the solder melts b Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operation by gently prying up on the lead with the soldering iron tip as the solder melts Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removin
35. y TIMING CHART mode section oolarit drm MHz kHz Hz Period E Porch D ned Resolution H Pixels iiis 640 1 25 175 x x 2 HPxes 31468 looo 70 48 108 s4 720 x 400 V Lines Herei 155 mat ha La la ima soot 25 2 ss 480 120 640 Mus m am s omsl am a 800 V mes 75 625 es leo M dla im a ia m amp la 65 160 psi m 1 inn 4 tlam la i 200 65 96 937 900 2 4 31 eie D X mk l Inm IEEE 1440 a m lun vines sss la le 25 190 Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 8 LGE Internal Use Only DISASSEMBLY 1 Put a cushion or soft cloth on a flat surface 3 Slide the Cable Deco Cover out from the stand body 2 Place the monitor face down on the cushion or soft cloth 4 Press the hook Take off the stand base from stand body 5 Please pull the stand body lightly to separate it from the hinge body 7 Pull the front cover upward then separate all the latches 8 Place the monitor face down then disassemble back cover Copyright 2007 LG Electronics Inc All right reserved LGE Internal Use Only Only
36. y scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the nearest component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges LGE Internal Use Onl

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