BEKO SERVIS MANUAL PDP PANEL SAMSUNG SDI 42 SD V3
Contents
1. B FRONT PAT TOP SPS42 F X3 SeDit FED DUT D 7 DATA D 5 1 e nura 7 Memory 7 aypa Con TEC ELX EU OUT O TI spaig 12 WIO 13 Tey Interface by 1 F10 8 gt FET signal Cont rol nn 3 3 function of Each Assembly X main board The X main board generate a drive signal by switching the FET in synchronization with logic main board timing and supplies the X electrode of the panel with the drive signal through the connector 1 Maintain voltage waveforms including ERC 2 Generate X rising ramp signal 3 Maintain Ve bias between Scan intervals m Y main board The Y main board generate a drive signal by switching the FET in synchronization with the logic Main Board timing and sequentially supplies the Y electrode of the panel with the drive signal through the scan driver IC on the Y buffer board This board connected to the panel s Y terminal has the following main functions 1 Maintain voltage waveforms including ERC 2 Generate Y rising Falling Ramp 3 Maintain V scan bias m Logic main board The logic main board generates and outputs the address drive output signal and the X drive signal by processing the video signals This Board buffers the address dirve output Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 signal and feeds it to the address drive IC COF module video signal X Y drive signal generation frame2. TCP and so on This page shows you how to check the boards and the following pages show you how to find the defective board amp Line Open amp Data Block Open COF Block Open Logic Buffer Logic Main FFC Changing necessary parts EVP Cri Changing some parts 1 line or Halt Blo ere I block HALF OF SCREEN Heplace lace Logic Main PDP Address Buffer E or 4 1 7 Address Short some vertical lines appear to be linked screen gt Address Short is related with Logic Main Logic Buffer FFC and so on This page shows you how to check the boards and the following pages show you how to find the defective board Address Short gt Line short gt Data Block short Logic Buffer Logic Main FFC Logic Changing necessary parts Changing some parts EFG Wha is the satus of short 1 line or 1 block Half block HALF OF SCREEN Feplace Replace Logic Main PDP Address Buffer or or 9 FFC 4 2 DEFECTS SYMPTONS AND DETECTIVE PARTS Condition Name Description Related Board No Voltage Output Operating Voltages don t exist PSU Operating Voltages exist but an Image OE Y MAIN X MAIN Logic Main Cables doesn t exist on screen No Display Abnormal Image not open or short is on screen Abnormal Display Y MAIN X MAIN Logic Main some horizontal lines don t
3. C BOP 3 DPAZSDOBC PANEL Z SYMMETRY SINGLE 365x 3865x 355 882x582 NN Direm Lo 14 TORSASSKSSMMJO2SPITGH STVIB20M SKPRODLUPILECS s ia 1 LIB 0DISSB ALSOSASBRSBATAN ___ Times 1 acariens cover twm Owe 1 amaan mwanza s oeme 1 4250 VaL SEGLE SATIS Lek l em 1 Saouier sensen spiv BUFFER UP 59MSTLBVS 347 En NN CNN 3 WA Ya 10 LUS Buffer Lower 11 LJ92 006174 Logic Butfer E 12 32 0081 24 Logic BuffenF 13 132 0081 35 Logic Buffen gt 3 0 1141 020593 5D1 Y BUFFER LO 2558457 1 6 3 o ooon se OO CE se CE OOOO eones se LO m emen see ET screw 3 OOOO E 3 i 14 i 1 Dri pri F 1 1 1 10 15 7 5 3 Disassembling amp Re assembling 5 3 1 Disassembling amp Re assembling of FPC Flexible Printed Circuit and Y Buffer Upper and Lower 1 Removal procedures 1 Full out the FPC from Connector by holding the lead of the FPC with hands 34 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 2 Assembling Procedures 1 Push the lead of FPC with same strength until to be connected completely Notice careful do not get a damage on the connector pin during connecting by mistake 5 3 2 Assem
4. PDP module use a fine pitch connector which is only working by exactly connecting with flat cable O perator must pay attention to a complete connection when connector is reconnected after repairing The capacitor s remaining voltage in the PDP module s circuit board temporarily remains after power is off Operator must waitfor discharging of remaining voltage during at least 1 minute 2 2 Safety Precautions for Service Handling prevention of a electrical shock measure against power outage etc Safety Precautions n Before replacing a board discharge forcibly The remaining electricity from board n When connecting FFC and to the module recheck that they are perfectly connected n To prevent electrical shock be careful not to touch leads during circuit operations n To prevent the Logic circuit from being damaged due to wrong working do not connect disconnect signal cables during circuit operations Do thoroughly adjustment of a voltage label and voltage insulation n Before reinstalling the chassis and the chassis assembly be sure to use all protective stuffs including a nonmetal controlling handle and the covering of partitioning type n Caution for design change Do not install any additional devices to the module and do not change the electrical circuit design n For example Do not insert a subsidiary audio or video connector If you insert It It cause danger on safety An
5. condition Drive board Securely connected or Modul e Y BUFFER ti ght ened assenbl ogi ogi C Buf f er Harness Securel connected Material M xing No material m xino 6 2 Check Procedure 1 Visual check as following a Assembling condition of module b No problem on the connection of module c The grounding and easily short circuited parts are not damaged 2 Check the Dip Switch is located module inside 3 Turn on the power to PDP module and then check that LED lights up and the SET is working well 4 Check the power voltage after turn on the power and then check the Display condition by tapping slightly the Y FPC 2 or 3 times 5 Check whether something wrong during Full White Pattern period 6 If something wrong each voltage should be set to the standard voltage by using Multi Tester and adjusting tools 7 Adjust the waveform using Oscilloscope for the waveform adjusting point 8 Check the discharge of front panel by changing the image for each pattern 9 Check the Low discharge Over discharge and panel condition by adjusting the Pattern Generator Level 7 Operation Check 7 1 Adjustment Specification Checking Position etc V3 1 TCP Ramp Waveform Inclination Adjustment Y Board Adjust VR 5002 to set the time of Vset Adjust VR5002 to set the time of Adjust VR 5001 to set 3SF Falling Vset 10 5 time in 30 Dip Switch Mode lt Internal gt lt
6. exist on m Sustain Open Scan Buffer FPC of X Y some horizontal lines appear to be m Sustain Short linked screen Scan Buffer FPC of X Y m Address Open some vertical lines don t exist on screen Logic Main Logic Buffer FFC TCP some vertical lines appear to be linked on screen m Address Short Logic Main Logic Buffer FFC TCP Defect Address vertical stripe Open Defect Address vertical stripe S hort Symptom A line or block does not light up in address electrode Symptom Another color simultaneously appears because adjacent direction 1 line block open data recognizes the single pattern signal aCause D manufacturing Panel electrode single line mCause foreign material electrostatic D manufacturing Panel electrode short Foreign material TCP defect conductive foreign object inside TCP 2 Parts Board connection defect 2 Part TCP buffer defect lighting electrode cutting Operation Assembly error Film damage defect Defect Address output error Defect Sustain horizontal stripe Open Symptom A defect other than address open Symptom One or more line do not light up in Sustain direction and short Data printout signal error occurring at certain Gradation or pattern Cause manufacturing Panel bus electrode single line FPC pressure defect Parts FPC board connection disconnection operation assembl
7. memory circuit address data rearrangement m Logic buffer E F The logic buffer transmits data signal and control signal Y buffer board Upper Lower The Y buffer board consisting of the upper and lower boards supplies the Y terminal with scan waveforms The board comprises 8 scan driver IC s ST microelectronics STV 7617 64 or 65 output pins but 4 ICs for the SD class AC Noise Filter The AC Noise filter has function for removing noise low Frequency and blocking surge It effects Safety standards EMC EMI Tape Carrier Package The TCP applies Va pulse to the address electrode and constitutes address discharge by the potential difference between the Va pulse and the pulse applied to the Y electrode The TCP comprise 4 data driver Ics STV7610A 96 pins output pins 7 TCPs are required for signal scan 3 4 PRODUCT SERIAL LABEL LOCATION Voltage label Serial No Panel module label p m E 1 i 4 Xx 4 OPERATION CHECKING AFTER RECTIFICATION 15 44 4 1 Flow chart A S Check Point 1 Checking the voltage for each assembly 2 J udging the Logic board working or not 3 Adjusting the output signal through test points 4 Checking the panel s crack HH 4 1 1 No voltage output Check CNS001 2pin Connector 220Vac Replace PSU and cM check driver B D in advance F 8003 Hefer to 2 2 No display ON OFF R
8. 0861 FFC CABLE FLAT LOGIC YBOARD 3809 001397 60V 105C 105MM 40P 0 5MM UL20861 i X51 120 CABLE L BUFFER L BUFFER LJ39 00109A X51 120 CABLE L BUFFER L BUFFER LJ39 00109A
9. 65 mm x 1 110 V mm 4 Cell Pitch G 0 365 mm x 1 110 V mm B 0 365 H mm x 1 110 V mm 5 Display size 932 940 H mm x 532 800 V mm 36 73 inch x 20 98 inch 6 Screen size Diagonal 42 Color Plasma Display Module 1 Screen aspect 16 9 8 Display color 16 77 million colors Over 160 9 Viewing angle Angle with 50 and greater brightness perpendicular to module 10 Dimensions 982 W x 582 H x 52 9 D mm 11 W eight Module 1 About 16 6 kg 240kg 5kg including modules 12 Packing weight Module 1 iOpcs BOX 13 Packing size L 1175 W 1140 H 970 mm 10pcs BOX 14 PL42SD003C 60Hz 50Hz LVDS Broadcasting reception Vertical frequency and Video Logic Interface 2 PRECAUTIONS To prevent the risks of unit damage electrical shock and radiation take the following safety service and ESD precautions 2 1 Handling Precautions for Plasma Display module use high voltage that is dangerous to human Before operating PDP always check the dust to prevent circuit short Be careful touching the circuit device when power is on n PDP module is sensitive to dust and humidity Therefore assembling and disassembling must be done in no dust place n module has a lot of electric devices Service engineer must wear equipment for example earth ring to prevent electric shock and working clothes to prevent electrostatic
10. DATE July 15 2004 Beko SERVICE MANUAL 107cm 42 Inch Wide Plasma Display Module MODEL 42 S3 1 PDP CONTENTS 1 Overview 1 1 Model Name of plasma Display 1 2 External View 1 3 Specifications 2 Precaution 2 1 Handling Precaution for Plasna Display 2 2 Safety Precautions for Service Handling prevention of a electrical shock measure against power outage etc 3 Name amp Function 3 1 Layout of Assemblies 3 2 Block Diagram 3 3 Main function of Each Assembly 3 4 Product Serial Label Location 4 Operation checking after rectification 4 1 Flow chart 4 2 Defects Symptoms and Detective Parts 5 Disassembling Assembling 5 1 Tools and measurement equipment 5 2 Exploded View 5 3 Disassembling amp Re assembling 6 Operation Check after Repair Service 6 1 Check Item 6 2 Check Procedure 7 Operation Check 7 1 Adjustment Specification Checking Position etc 7 2 Adjusting procedure 8 Spare part list for the panel Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 1 Overview 1 1 Model Name of Plasma Display MODEL 42 3 1 PDP S42SD YD05 1 2 External View M1 X Board Y Board Logic Board 3 44 1 3 Specifications No Item S pecification 1 Pixel 852 H x 480 V pixels 1 pixel 2 1 R G B cells 2 Number of Cells 2556 H x 480 V 3 Pixel Pitch 1 095 H mm x 1 110 V mm R 0 3
11. External gt 7 2 Adjusting procedure 1 Get Pattern to be Full White 2 Adjust Vsch to 40V by using VR5004 Vsch should be connected to unit of Multimeter Vsch is over 95V than Vsc I 3 Check the waveform using Oscilloscope Triggering through V TOGG of LOGIC Board Connect the OUT 4 Test Point at the center of Y buffer to other channel and then check the first SF operating waveform of 1TV Field Check the waveform as before by adjusting Horizontal Division Check the Reset waveform when the V_TOGG Level is changed Setthe Vsetto 10us by adjusting VR5002 GND maintenance section should be checked after the Vertical Division is readjusted to 2V or 5V Setthe Falling maintenance time to 30us by adjusting R5003 Change the waveform position of Oscilloscope to 3SF and then set the Falling maintenance time to 30us by adjusting the VR5001 GND maintenance section should be checked after the Vertical Division is readjusted to 2V or 5V x Special Notice When you adjust the inclination of waveform do check and adjustment being based on the Reset waveform of 1st Sub field of 1st Frame and then move to 3 Sub field for adjusting 8 SPARE PART LIST THE PANEL E X53 104 PCB ASSY LOGIC BUFFER E SDI 42V3 LJ92 00813A X53 105 PCB ASSY Y BUFFER UP SDI 42V3 LJ92 00796A FPC 58x61mm H V 86LINES 0 6PITCH 80P LJ94 00002A CABLE FLAT LOGIC XBOARD 3809 001396 60V 105C 210MM 30P 0 5MM UL2
12. TCP is wrong 5 Assembling amp Disassembling of FFC 37 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 This is the photo of the assembling of FFC The procedure of assembling and disassembling of FFC 1 the same as 5 3 4 Exchange of LBE LBF LBG board Photo 1 38 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 LO J 9 9 od Lo LT D ad 6 1 L ol o I a El 3 e x z Photo 2 1 Remove the screws in order of 2 3 5 7 1 4 from heat sink and then get rid of heat sink Photo 1 2 Remove the TPC FFC and power cable from th
13. bling amp Disassembling of Flat Cable Connector of X Main Board 1 Disassembling Procedure 1 Pull out the clamp of 2 Pull Flat cable out 3 Turn the Flat connector press down lightly cable reversely 2 Assembling Procedure 35 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 1 Putthe Flat cable into the connector press down lightly until locking sound Dack comes out 5 3 3 Assembling amp Disassembling the FFC and TCP from Connector 1 Disassembling of TCP Ln bre ar 1 Open the clamp carefully 2 Pull the out from Connector 2 Assembling of TCP 1 Putthe into the Connector carefully 2 Close the clamp completely The sound Dack comes out Notice TCP and Connector was connected surely Notice 1 Checking whether the foreign material is on the Connector inside before assembling of TCP 36 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 2 Be careful do not get a damage on the board by ESD during handling of TCP 3 Misassembling of TCP 1 The misassembling of TCP is the cause of defect 4 Checking method of misassembling of TCP 1 Disconnecting H3 from 2 Whether H8 and H9 are 3 Checking the resistance CN8006 of LBE connected between Pin 1 and 5 Resistance gt a few Ohm Resistance lt 20 Ohm At least more than 1 of
14. creen except abnormality in Sustain Address gt Abnormal Display is related with Y MAIN X MAIN Logic Main and so on This page shows you how to check the boards and the following pages show you how to find the defective board Ahnormal Display Logic Main Y Main X Main Obsevation of abnormal display Check necessary points Check necessary points YAE Check DE GI poma F5003 for vs orem FSO0R for YEE ee Replace the board 5001 for vdd 05009 05010 M EHO HT 05012 05015 SEIN 95017 95024 _ Y MAIB Side F4003 for YE F4001 for YEE Lac Replace the board 4002 for wdd 24009 04016 Ge El Replace the board A MAIN Een Check Logic raka Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 Login Man 1 LEW LD 000 Hinks anton of VEgmo Logic Main Normal State Heplace FDP board 4 1 4 Sustain Open some horizontal lines don t exist on screen FPC Sustain Open Henlace the panel There s defect on FPC Defect is from buffer 21 44 4 1 5 Sustain Short some horizontal lines appear to linked Video FPC Gustain Open Piter Changing Replace the panel buffer echeck There en FPC Bre Sa ect on Defect is from buffer 4 1 6 Address Open some vertical lines don t exist on screen gt Address Open is related with Logic Main Logic Buffer FFC
15. d If you change the design or insert Manufactor guarantee Will be not effect If any parts of wire is overheats of damaged replace it with a new specified one immediately and identify the cause of the problem and remove the possible dangerous factors Examine carefully the cable status if it is twisted or damaged or displaced Do not change the space between parts and circuit board Check the cord of AC power preparing damage Product Safety Mark Some of electric or implement material have special characteristics invisible that was related on safety In case of the parts are changed with new one even though the Voltage and Watt is higher than before the Safety and Protection function will be lost The AC power always should be turned off before next repair Check assembly condition of screw parts and wire arrangement after repairing Check whether the material around the parts get damaged Precaution when repairing ESD There is ESD which is easily damaged by electrostatics for example Integrated circuit FET Electrostatic damage rate of product will be reduced by the following technics Before handling semiconductor parts assembly must remove positive electric by ground connection or must wear the antistatic wrist belt and ring It must be operated after removing dust on it It comes under precaution of electric shock After removing ESD assembly put on it with aluminum stuff o
16. e connectors 3 Remove all of the screws from defected board 4 Remove the defected board 5 Replace the new board and then screw tightly 6 Get rid of the foreign material from the connector 7 Connect the TCP FFC and power cable to the connector 8 Reassemble the TCP heat sink 9 Screw in order of 4 1 7 6 5 3 2 Photo 2 If you screw too tightly it is possible to get damage on the Driver IC of TCP Logic 5 3 5 Exchange YBU YBL and YM board 1 Separate all ofthe FPC connector of YBU Y Buffer upper and YBL Lower Photo 1 2 Separate all of the connector of CN5001 and CN5008 from Y Main 3 Loosen all of the screws of YBU YBL and YM 5 Remove the connector of CN5006 and CN5007 among YBU and YM 4 Remove the board from chassis 6 Remove the YBL and YBU from Y main 7 Replace the defected board 39 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 Reassemble the YBU and YBL to the Y Main 9 Connect the connector of CN5006 and CN5007 among YBU YBL and YM 0 10 Arrange the board on the chassis and then screw to fix 4 11 Connect the FPC and YM of panel to the connector 2 Supply the electric power to the module and then check the vvaveform of board 3 13 Turn off the povver after the vvaveform is adjusted 40 44 6 Operation Check after Repair Service 6 1 Check Item TCP Assenbli ng
17. elax LED Green RLY8001 80025 lt 8001 800 Feplace FU acts Check Open CN8001 LEDGOOMRED is OFF until LED8004 OFF Then Restart PSU S Tum off Relay pen these connector JOOS CN 0066pini C Nana Spin voltage checking repeat 5 Check output voltage Replace PSU CMN6003 10pin Vs Va et Scan vb Hestart Replace Psu Check VS on in LNG Goto 22 No Display If LEDSO04 15 ON under Check output voltage Vs Va Veet Vecan Ve Are there capi Go to 2 2 No Display 4 1 2 NO display operating Voltage but an image doesn t exist on Screen gt No Display is related with Y MAIN X MAIN Logic Main and so on This page shows you how to check the boards and the following pages show you how to find the defective board No Display Logic Main Y Main X Main LED LD 20005 blinks Check necessary points Check necessary points 5005 for vs F5002 for voc r Replace the board F5001 for wdd GS 00 usu U EHO AT 1901 29015 Replace the board 1901 i 29024 Y HAN Hide X MAN Check polis F4003 for ve F4001 for voc Replace the board F400 for vod BHOAT 24009 24016 Ce En Replace the board A HAN Logio Main LEC LCE 000 binkie 7 lachon of Werne Replace the board 4 1 3 Abnormal Display Abnormal Image is S
18. l MgO source dielectric thickness D Panel deposition count and thinckness cell pitch phosphor aging condition 2 Circuit drive waveform voltage condition 2 Circuit drive waveform voltage condition 30 44 Defect panel damage Defect Exhaust pipe damage m Symptom Panel crack or break No image appears in some Symptom Crack in break if exhaust pipe Cause depending on the damaged parts and an image is partially lacking or the panel damage level noise occurs depending on the damaged parts and with the passage of time Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 m Cause Careless panel handling Cause D Manufacturing Flatness palette pin interruption 2 Operation overload of panel corner careless handling 3 Panel Flatness assembly error 5 Disassembling Assembling 5 1 Tools and measurement equipment 5 1 1 Tools 1 type Screw Drivers to screw the screws Air Blower Earth Ring C Small Driver to adjust potentiometer 5 Dummy Discharge Resistor 2 4ROhm 1 OVV 5 1 2 Measuring Equipment 1 Oscilloscope 500MHz sampling 2 Probe 10 1 32 44 Digital Multi meter 3 Signal Generator 4 5 2 Exploded View Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 1 94 00002 FPL 4250 58x61 mm H B6LINE 5 0 BF MEH GOF AX 425D S 2 0 80 1 GOLD FPC x COMMON FP
19. n the conductive surface to prevent charging Do not use chemical stuff using Freon It generates positive electric that can damage ESD Must use a soldering device for ground tip when soldering or de soldering ESD Must use anti static solder removal device Most removal device do not have antistatic which can charge a enough positive electric enough damaging ESD Before removeing the protective material from the lead of a new ESD bring the protective material into contact with the chassis or assembly that the ESD is to be installed on When handing an unpacked ESD for replacement do not move around too much Moving legs on the carpet for example generates enough electrostatic to damage the ESD Do not take a new ESD from the protective case until the ESD is ready to be installed Most ESD have a lead which is easily short circuited by conductive materials such as conductive foam and aluminum Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 3 NAME amp FUNCTION 3 1 Layout of Assemblies 8 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 Logic Wain Main 61092 08 Logic Buffer Logic F Buffer Logic G Buf fer 9 LJ92 007964 V Buffer upper But fer lower Logic Y Wain Logic XWain Logio Logic Logic Logie 6 Loge But Logio Bul TF Logic But FY Logic 80779 SIPS Vide
20. o SIPS SMPS Logic But fer E SPS Logic Wain SMES Y air 2 SUPS Mair 3809 00 1414 Logic Logic Buf F FFC CABLE FLAT 1 L Main 7 F Buffer 9 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 10 44 Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 10 Logic X Main 11 12 13 Logic Logic 14 15 Logic Buffer 3 2 BLOCK DIAGRAM 3 2 1 BLOCK DIAGRAM FOR DRIVE CIRCUIT OPERATION 11 44 Signal input Section Ysc SIA SIB CLK LE STB Power Supply Input 5Vd 17Vcc 75Vsc 165Vs 220Vset Logic signal buffer gt buffer Fet fet cate prven Driver 165v 220V 75v Recovery Main Vset Vscan Switching Switching Switching Switching Recovery circuit Recovery Cap lt DRIVE Y Board gt Signal input section Xr Xf XS Xog Power supply input 5Vd 17Vcc 195Ve 165Vs Logic signal buffer Fet Gate Driver 17V 165V 195V Recovery Main Ve Sw itching Switching Switching Recovery circuit Recovery Cap lt DRIVE X Board gt Vset Vsc_h Vs Ysc_h Yset e 7 ES Panel Ypp T R5124 1k Yfr RAMP Yer RAMP Ysc R5118 R5117 Vibe HIA lt et Vs lt Drive waveforms gt 3 2 2 Block Diagram for Logic circuit Logic Block Diagram mm RR Rs
21. y error Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 Defect Sustain horizontal stripe Short Defect Dielectric material layer damage a S ymptom Combined or adjacent lines are short in m Symptom Burn caused by the damage of address bus dielectric sustain direction The line appear brighter layer appears in the panel discharge non discharge than other at Ramp gradation pattern or low area sustain also open short occurs by the damage gradation patter of address sustain printout Add Block and Line Open 28 44 RAKA F C M FAN M Arv a IVi Aar 1m DE k UL le KU ONIK A J service Manua r lars YA en EY J M f el C amS Une J 2 JISPIaV MO quie Samsul 10 V 5 lt Add and Sustain gt mCause mCause layer uneven abnormal voltage foreign material D manufacturing Panel electrode short F oreign repair failed material 2 Parts Board connector pin error 3 Operation connector assembling error Beko Elektronik A S Service Manual Plasma Display Module Samsung V3 Defext F White low discharge e Defect Weak discharge mSymptom Low discharge caused by unstable cells mSymptom Normal discharge but cells appear darker due to occurring at full white pattern if high weak light emission occurring mainly at low 60 degree or normal temparature 5 degree Full white R ed Green Blue pattern or gradation pattern D Pane
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