取扱い説明書 INSTRUCTION MANUAL
Contents
1. The following is the stencil size The following dimensions will be stencil thickness dimension in the case of 100um If your stencil thickness is different please specify the stencil size with reference to the volume of solder paste are listed t 100 um The case of t 100um stencil thickness 0 2 The overall layout please refer PIE E ap to the drawings LOWER CONTACT 1 55 NUN 0 3 a o UPPER CONTACT 0 047 mm LOWER CONTACR 0 047 mm SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 211 106 03 004 PAGE 477 KYOCERA Connector Products Corporation 4 When the mounting condition differs from those of our profile in any way please make sure that you do not observe any deformity nor color change with the mounted connector before the mounted PCB is installed in the unit 250 230 180 30310 s 150 902 30 s TEMP ON THE PARTS C PRE HEAT2. The module board shall be fixed down screw down on to other mechanical parts board after being inserted SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 277 106 03 004 PAGE 6 7 KYOCERA Connector Products Corporation 3 3 ENGAGEMENT 1 PC SIG M 2 Module board please use the one that corresponds to the standard of the PCI SIG M 2 2 Module board please use something that imposition is always at the tip If the imposition is not going to use the thing there is a concern that the failure occurs when you insert a module substrate 8 0 08 J Module board taper 3 Before inserting the module board make sure that
3. If something touches the contact points or with some foreign object the spring could be deformed 2 The module board shall be inserted and separated correctly according to the direction and the process as shown below 0 15 The module board shall be inserted or separated with the right parallel to or inclined up to 15 against the mounted board D 2 The module board shall be inserted completely It shall be rotated eo Z 0 15 m Ln So that the module substrate and the connector is straight when viewed from the top and insert as far as it will go Proper Insertion Oblique Insertion Insufficient Insertion
4. 6411 PCI SIG M 2 0 5mm 6411 H2 3 Series 6411 connector is a card edge connector 0 5mm PITCH corresponding to the standard PCI SIG M 2 Please follow instructions and cautions hereunder 2 PARTNAMES AND MODEL NUMBERS 2 1 MODEL NUMBERS 2 6411 067 10 883 Packing NE L 0 Connector Assembly Variation 4 Emboss Assembly A Key A B Key B m No of No of pos C Key C PCI SIG Standard D Key D 1 H2 3 TYPE HEIGHT 2 25MAX E Key E F Key F Variation G Key G Boss ANCHOR H Key PLATE J Key J 1 e K Key K 3 x L Key L M Key M SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 277 106 03 004 PAGE 2 7 KYOCERA Connector Products Corporation 2 2 PART NAMES 1 Connector INSULATOR LOWER CONTACT UPPER CONTACT 2 Keying 6 125 KEY A 5 625 PE 5 125 KEY L KEY B 32 825 4 625 4 125 KEY K Md ro 3 125 KEY J keyp ET s ET 1 125 KEY G KEY F 1 x K
5. SPEC No 205 03 277 KCERd KYOCERA Connector Products Corporation INSTRUCTION MANUAL Series 6411 M 2 Connector H2 3 Type O EDN 091 2 5 13 H Tamai Y Okabe No EDN DON DATE PREPARED CHECKED APPROVED 106 03 003 KYOCERA Connector Products Corporation H TABLE OF CONTENTS N 2 1 MODEL NUMBERS n n AIR 2 2 PART NAMES Co 3 1 MOUNTING t t RR nnn 3 2 ENGAGEMENT sn m mmm e e e 3 3 CAUTIONS OF THE MODULE BOARD 4 STORAGE MANAGEMENT Cc I OUTLINE PART NAMES AND MODEL NUMBERS 5555 PRECAUTIONS IN HANDLING s OTHER CAUTIONS tt SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 211 106 03 004 PAGE 1 7 KYOCERA Connector Products Corporation 1 OUTLINE
6. TIME s Recommended Profile 5 N If you need to mount on the No reflow condition please make sure to conduct the reflow test in advance 6 Please do not apply flux onto the tail and PC board when it is soldered manually Splattered or migrated flux inside the connector or to the contact points may cause imperfect contact Also avoid giving any stress to the product with the soldering iron It could deform tail or melt insulator Soldering iron SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 277 106 03 004 PAGE 5 7 KYOCERA Connector Products Corporation 3 2 ENGAGEMENT 1
7. eying Layout SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 277 106 03 004 PAGE 3 7 KYOCERA Connector Products Corporation 3 PRECAUTIONS IN HANDLING 3 1 MOUNTING 1 Please make sure that the product is free from deformity caused by the unnecessary stress to the contacting points and the tails 2 Recommended Pad Size PCI SIG M 2 The recommended pad size shown below This dimension will be those corresponding to the standard of the PCI SIG M 2 Q UPPER CONTACT 1 55 LOWER CONTACT 1 55 A JE PR The overall layout please refer uec SE s pem to the drawings 0 3 zy 3 Recommended Stencil Size 100 tm
8. there is no dirt such as flux stuck on the contact pad of the module board in the mounting process 4 STORAGE MANAGEMENT Store connectors under normal temperature normal humidity and no dust condition When storing connectors out of the embossed tape do not apply any pressure to contact tails and anchor plates 5 OTHER CAUTIONS Do not throw products or apply large shock to them though contact tails and anchor plate are protected in the embossed tape when delivered SERIES 6411 H2 3 INSTRUCTION MANUAL No 205 03 277 106 03 004 PAGE 7 7
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