開発・設計 - CASIO
Contents
1.2.
3. 5
4. 2008
5. G SHOCK G SHOCK CAD G SHOCK
6. 2 inn XD GF SFE 2008 2008 11 20
7. 2007 2008 EICMUIKGUAegS ll 0 NEDO 2008 9 CEATEC JAPAN CASIO CORPORATE REPORT 2009 16 5 CASIO CORPORATE REPORT 2009 lt L
8. 2 2 Me BN INCOMING CALL ISO13407 HCD
9. DT X7 3 2 7 3 3 3 0 06 08 3 0 94 96 97 99 00 02 CASIO CORPORATE REPORT 2009 18
10. 2007 5 14
11. em cAsio CORPORATE REPORT 2009
12. EWLP mmy A i a Na NR 1 WLP Wafer Level Package LSI 2 EWLP Embedded Wafer Level Package WLP
13. rl 1 5 25 G SHOCK WLP 1 EWLP 2
14. 2 CS CSMkW CS 1 9 CASIO CORPORATE REPORT 2009
15. EXILIM 4 0 2 CPU CPU New CPU 5 30 Memory CASIO 9 5
16. 2007 CASIO CORPORATE REPORT 2009 0
17. DNA CMOS LSI CMOS 1 000 1 9
18. 4 1
19. 2001 C G P 2008 80 2008 2009 2012 30
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