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SNAP HIGH-DENSITY DIGITAL MODULE USER'S GUIDE

1. _ CCOM 11 Brown o __ D4 9 White o D5 7 Violet o _ D6 5 Green o D7 3 Orange O DTOM 1 Brown CHAPTER 1 INSTALLATION AND TESTING Pinouts 32 Channel Input Modules IMPORTANT SNAP IDC 32 modules are polarity specific and must be wired as shown Polarity for Polarity for SNAP IDC 32N SNAP IDC 32 SNAP IDC 32 FM AO A4 A1 A5 A2 A6 A3 10 32 VDC 5 bt 10 32 VDC ACOM 10 32 VDC r 4 10 32 VDC co C4 C1 C5 C2 C6 10 3200 c3 C7 i 10 32 VDC p O 10 32 VDC l T 10 32 VDC DCOM SNAP High Density Digital Module User s Guide Ea WIRING THE MODULE Pinouts 32 Channel Digital Output Modules SNAP ODC 32 SRC SNAP ODC 32 SRC FM SNAP ODC 32 SNK and SNAP ODC 32 SNK FM FUSING For both sourcing and sinking modules either fuse each point as shown in the first and third groups below or fuse each group of points as shown in the second and fourth groups All groups must be fused 12 24 VDC Nominal 12 24 VDC Nominal SNAP ODC 32 SRC SNAP ODC 32 SNK Load Sourcing Module Load Sinking Module Top view of module Top view of module SNAP High Density Digital Module User s Guide CHAPTER 1 INSTALLATION AND TESTING Testing Field Connections The OptoTerminal G20 sold separately is recommended for testing field wiring locally For input and output modules you can use it to read point states
2. Pin 13 Yellow Pin 4 Black Pin 12 Blue Pin 3 Black Pin 11 Green Pin 2 Black Pin 10 White Pin 1 Black Pin 9 Red Port for OptoTerminal G20 To field devices CHO hemd CH1 CHI ot CH2 ca CH3 m I z CH4 CT a i a CH5 CH5 u F CH CHE u ay cH nt E CH8 a CH9 CH9 CH10 C CH11 CHIT u CH12 amnu cH13 a EI g cmi CH14 e a CHI as UT NOTE The connectors on these modules are not polarity specific You can connect the positive lead for each channel or point to either L1 or L2 and this can vary from point to point on the module SNAP High Density Digital Module User s Guide ea WIRING THE MODULE 32 Channel Modules Wiring and Pinouts The following table shows wiring from the SNAP HD CBF6 cable to 32 channel modules Wires from the cable are grouped into four sets Each set contains color coded wires Set A Set B Set C Set D Wires Point Wires Point Wires Point Wires Point AO Gray 0 BO Gray 8 co Gray 16 DO Gray 24 Al Blue 1 B1 Blue 9 C1 Blue 17 D1 Blue 25 A2 Yellow 2 B2 Yellow 10 C2 Yellow 18 D2 Yellow 26 A3 Red 3 B3 Red 11 C3 Red 19 D3 Red 27 A4 White 4 B4 White 12 C4 White 20 D4 White 28 A5 Violet 5 B5 Violet 13 C5 Violet 21 D5 Violet 29 A6 Green 6 B6 Green 14 C6 Green 22 D6 Green 30 A7 Orange 7 B7 Orange 15 C7 Orange 23 D
3. Output Arrangement each Points in each group share a each Points in each group share a common positive connection common negative connection Output Turn On Off Time 100 microseconds 100 microseconds DAE from VO processor to 2 30 ms typical 2 30 ms typical indi to s None use optional OptoTerminal G20 None use optional OptoTerminal G20 diagnostic display or breakout rack diagnostic display or breakout rack Maximum Number of HDD 16 16 Modules on One Mounting Rack 1 Affects turn on and turn off determination 2 Time varies based on the SNAP PAC I O processor brain or on the rack controller processor configuration and Ethernet host communication activity SNAP High Density Digital Module User s Guide SPECIFICATIONS Breakout Racks Used with SNAP IDC 32 SNAP IDC 32 FM and SNAP IDC 32N 40 pin header connects to SNAP IDC 32 module using SNAP HD BF6 header cable Connectors 32 signal input connectors each signal connector has a corresponding common connector For each zone of 8 signal inputs 1 connection for either module common or field common 1 LED for each signal input 32 signal LEDs total Indicators 1 power status LED for each zone of 8 signal inputs 4 power LEDs total Fusin 1 A fuses 2 fuses for each zone of 8 signal inputs 8 fuses total g Replace with Pudenz 1 A automobile mini fuse or equivalent jumpers For each zone of 8 signal inputs 1 jumper controls whether module common
4. OptoMMP Protocol Guide 1465 custom program you develop 16 SNAP High Density Digital Module User s Guide 2 Usage Notes and Specifications This chapter contains the following information Comparing High Density and 4 Channel Digital Modules page 17 Building Your Own Cables page 20 Notes on Legacy Hardware and Software page 21 Specifications page 23 Dimensional Drawings page 27 Comparing High Density and 4 Channel Digital Modules SNAP high density digital modules differ in several ways from 4 channel SNAP digital modules A few important differences are discussed below see the table on the next page for more Communication with the Processor One of the main differences between 4 channel and high density modules is in how the processor brain or on the rack controller communicates with them on the mounting rack Four channel SNAP digital modules communicate with the processor through direct wiring but SNAP high density modules communicate as analog and serial modules do over an internal bus built into the rack and using the processor s analog scanner This different communication method means that Communication with the processor update time is generally slower Communication speed is affected by how busy the processor is that is how many modules it talks to and how many Ethernet communications the processor is handling at the same time SNAP High Density Digital Module User s Guide COMPA
5. channel isolation o 1o fo orar 96 Med 19 Sere Z SNAP IDC 16 Ur F SNAR SNA 22 O VV Se Cham C ao Pero Do SN Manne Sura Soyat C SNAP ODC 32 SNK SNAP High Density Digital Module User s Guide EE INTRODUCTION These modules sense on off status for 90 140 VAC SNAP IAC 16 180 280 VAC SNAP IAC A 16 or 70 130 VAC SNAP IAC K 16 SNAP ODC 32 SRC SNAP ODC 32 SRC FM SNAP ODC 32 SNK and SNAP ODC 32 SNK FM digital output modules have 32 points and can switch on and off 5 60 VDC loads either sourcing or sinking Module part numbers ending in FM are Factory Mutual approved Hardware Compatibility SNAP high density digital HDD modules are part of the SNAP PAC System They are designed to mount on a SNAP PAC rack with a SNAP PAC brain or R series controller either a standard wired controller or a Wired Wireless model Analog serial and 4 channel digital modules can be mounted on the same rack to provide the mix of signals and density needed at any distributed location For information on using HDD modules with older processors or racks see Notes on Legacy Hardware and Software on page 21 Interface Terminal for HDD Modules The optional OptoTerminal G20 operator interface terminal available separately is recommended for commissioning and troubleshooting It plugs into a connector on the top of the module The OptoTerminal G20 displays the status of a high density digital mod
6. for output modules you can also use it to write to individual output points CAUTION The OptoTerminal G20 is for use with SNAP high density modules only and is the only display device intended for use with these modules Any use of the display device on other equipment or the use of another display device with a high density digital module may damage your equipment Reading Point States 1 2 Turn on power to the rack Use the correct cable to connect the Opto Terminal G20 to the RJ 45 connector on a 32 channel module or the 6 pin connector on a 16 channel module match up the keying dots As shown in the diagram below the OptoTerminal G20 displays the current state of all points on the module Wiring harness not shown Point states are displayed as a bitmask Each binary digit represents the state of one point either on 1 or off o The top row shows points 31 16 and the bottom row shows points 15 0 In the following example points 0 2 4 5 9 12 13 15 17 18 19 22 23 26 28 and 30 are on and the remaining points are off The terminal displays the bitmask in binary format the hexadecimal equivalent of the bitmask is shown for reference only SNAP High Density Digital Module User s Guide TESTING FIELD CONNECTIONS AO Os OPTO 22 31 1 29 27 25 1 22 20 18 I 16 Re ae ae aia La Ly er LA L i 0101010011001110 10110010 00110101 hexadecimal number Writing to
7. for sourcing hil MODULE TYPE J SNAP OOC22 SRC J stap coc 32 sux J SNAPIOC 32 SOLENOID SOLENOID SOLENOID Wiring to Field Devices For 16 channel modules see page 9 For 32 channel modules see page 10 CAUTION For output modules you must install fuses between the wiring harness and field devices If you use a fused breakout rack such as SNAP ODC HDB or SNAP TEX FB16 H fusing is already done for you If not follow the diagram on page 12 to either fuse the common for each set of wires or fuse individual pinouts for each point Ei SNAP High Density Digital Module User s Guide CHAPTER 1 INSTALLATION AND TESTING 16 Channel Modules Wiring and Pinouts The following diagrams show wiring from the SNAP HD ACF6 cable to a 16 channel module left and pinouts to field devices right The small six pin connector on the top of the module connects to the optional OptoTerminal G20 using a special adapter cable included with the OptoTerminal From SNAP HD ACF6 cable First connector with 8 twisted pairs Second connector with 8 twisted pairs Pin 8 Red Pin 16 White Pin 7 Black Pin 15 Orange Pin 6 Black Pin 14 Brown Pin 5 Black Pin 13 Yellow Pin 4 Black Pin 12 Blue Pin 3 Black Pin 11 Green Pin 2 Black Pin 10 White Pin 1 Black Pin 9 Red Pin 8 Red Pin 16 White Pin 7 Black Pin 15 Orange Pin 6 Black Pin 14 Brown Pin 5 Black
8. of the cable Setting Up the Breakout Board For ease in wiring the module to field devices we recommend you use a breakout board or install a barrier strip in a convenient location If you re not using a breakout board skip to Wiring to Field Devices on page 8 SNAP IDC HDB or SNAP IDC HDB FM for Input Modules 1 Set the LED jumpers for the SNAP IDC HDB or FM breakout board to the X position SNAP High Density Digital Module User s Guide WIRING THE MODULE Set jumpers to the X position Peo OY opro22 Y0 ve ae Qf SNAP IDC HDB Bg PLPPPPPE POLPLPLE PLES EPP 2 e ou no w so 6 4G 0 0 0 0 0 0 0 ZONE DFIELD COM ZONE C FIELD COM ZONE BFIELD COM ZONE AFIELD COM 2 Connect the SNAP HD BF6 cable to the board following wiring diagrams starting on page 10 There are four identical zones on the rack labeled A through D 3 Connect field devices and power supply to the breakout board as shown below IMPORTANT See module technical specifications for signal voltage range MOOULE FIELD FCFELOCOM MODULE FIELD CO MC MOOULE eee Seeel MODULE FIELD COM COM E E E E 8208 TYPICAL TYPICAL TYPICAL 6 SNAP High Density Digital Module User s Guide CHAPTER 1 INSTALLATION AND TESTING SNAP ODC HDB or SNA
9. the wiring connector s on the top of the module and have flying leads that can go directly to field devices or connect through breakout boards or a barrier strip Breakout boards provide fusing and convenience The following table shows the available options for wiring field devices to HDD modules Look in the left column for the module you have Breakout boards for the module are listed in the right column headings Compatible cables are shown in the center table cells The last column shows the appropriate cable if you are not using a breakout board 4 SNAP High Density Digital Module User s Guide CHAPTER 1 INSTALLATION AND TESTING SNAP HD ACF6 2 modules board SNAP HD ACF6 SNAP HD ACF6 SNAP HD CBF6 SNAP HD CBF6 2 boards module SNAP HD BF6 SNAP HD CBF6 J SNAP HD CBF6 Do not use SNAP HD CBF6 2 boards module SNAP HD BF6 SNAP HD CBF6 SNAP HD CBF6 Specifications for cables and breakout boards are in Opto 22 form 1756 the SNAP TEX Cables and Breakout Boards Data Sheet available on our website www opto22 com Attaching the Cable Cables wiring harness assemblies are sold separately You need one cable per module If you are making your own cables see page 20 1 Plug the cable into the wiring connector s on the top of the module 2 Secure the harness cable so that its weight is supported The connector plug is not designed to support the weight
10. values Update time varies based on number of modules and Ethernet communication demands 4 Including FM Factory Mutual approved and W Wired Wireless models SNAP High Density Digital Module User s Guide 19 BUILDING YOUR OWN CABLES Building Your Own Cables Header Cable If you want to build your own SNAP HD BF6 header cable for use with either breakout rack you will need the parts listed below Both ends of the cable use the same connectors Connector Molex 15 04 5401 Pin housing Molex 50 57 9320 Pins Molex p n 16 02 0103 Cable Alpha 5020C or Manhattan M38910 24 AWG 10 conductor 4x length needed or equivalent UL type CM Wiring Harness If you want to build your own wiring harness you will need the parts listed below For SNAP HD ACF6 Connector Molex 39 01 2165 Pins Molex 39 00 0214 Cable Belden 8308 22 AWG 16 conductor shielded or equivalent UL AWM style 2464 For SNAP HD CBF6 Connector Molex 15 04 5401 Pin housing Molex 50 57 9320 Pins Molex p n 16 02 0103 Cable Alpha 5020 40c 24 AWG 40 conductor or equivalent UL type CM Also see 32 Channel Modules Wiring and Pinouts on page 10 SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS Notes on Legacy Hardware and Software For important information on mixing current and legacy products see Opto 22 form 1688 the SNAP PAC System Migration Technical Note Using HDD Modul
11. 030 NO REFERENCE ONLY IMPORTANT The mounting rack connector has 24 pins the module connector has 20 pins The extra pins on the mounting rack connector prevent misalignment of the module during installation SNAP High Density Digital Module User s Guide DIMENSIONAL DRAWINGS SNAP 32 Channel Digital Modules continued NOTE CONSIDER NECESSARY DIMENSIONS m FOR WIRING HARNESS SNAP PAC BRAIN Wy a 2 SNAP 1 0 MODULE es 30g MODULE RETENTION 82 80mm 3 70 SNAP 93 98mm I O RACK BOARD ae 06 TO OVERALL HEIGHT SNAP PAC RACK DIN RAIL CLIP MOUNTING OPTION 4 SNAP RACK BASE EXTRUSION CUSTOMER SUPPLIED TER TUE N RACK BASE EXTRUSION aU CAP h 010 NOTE BE SURE TO CONSIDER a 22 te h 020 DIN RAIL DIMENSIONS ree 030 DIN RAIL MUST BE MOUNTED 7 tee He 060 HORIZONTALLY TO USE SNAP 1 0 NO REFERENCE ONLY WITHOUT MODULE HOLD DOWN SCREWS am SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS Breakout Racks for 32 Channel Digital Modules 6 50 165 1mm 3 85 97 80mm SNAP IDC HDB breakout rack 10 245mm lars Fone ae 2 ore A ee E p Da je oos e2 o s z e ZONI BOAR 3 94 jaj 3 85 100mm 97 80mm SNAP ODC HDB breakout rack SNAP High Density Digital Module User s Guide DIMENSIONAL DRAWINGS SNAP High Densit
12. 7 Orange 31 The four sets relate to point numbers on the module as shown below Pinouts for input modules are shown on page 11 Pinouts for output modules are on page 12 Connector wiring for SNAP ODC 32 SNK SNAP ODC 32 SRC SNAP IDC 32 FM versions and SNAP IDC 32N top view of module 10 SNAP High Density Digital Module User s Guide Harness Pin Wire Color Number Signal Gray 40 A0 0o Blue 38 A1 O Yellow 36 A2 O Red 34 A3 O Black 32 ACOM o Gray 30 Bo O Blue 28 B1 O Yellow 26 B2 o Red 24 B3 O Black 22 BCOM o Gray 20 co o Blue 18 c1 o Yellow 16 Cc2 o Red 14 c3 0o Black 12 CCOM O Gray 10 DOo _ O Blue 8 D1 O Yellow 6 D2 O Red 4 D3 O Black 2 DCOM O Pin Harness Signal Number Wire Color o A4 39 White o A5 37 Violet o A 35 Gren o _ __ A7 33 Orange o ACOM 31 Brown o B4 29 White Oo _ B5 27 Violet o B8 235 Gren o B7 23 Orange Oo _ __ BCOM 21 Brown o _ C4 19 White O _ _ C5 17 Violet o _ C6 15 Green o __ C7 13 Orange Oo
13. D G4F6 SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS Dimensional Drawings SNAP 16 Channel Digital Modules TOP VIEW OF MODULE 3 25 8255mm KEYING DOT m 3 36 85 32mm 3 06 SIDE VIEW 77 70mm OF MODULE a 74a 18 69mm SNAP LATCH MODULE BASE CONTROL CONNECTOR TOLERANCES LEGEND i 010 020 eae j 030 060 NO REFERENCE ONLY SNAP High Density Digital Module User s Guide DIMENSIONAL DRAWINGS SNAP 32 Channel Digital Modules TOP VIEW OF MODULE 3 25 82 55mm 3 26 3 05 8280mm 77 47mm SIDE VIEW OF MODULE ae Al 18 29mm SNAP LATCH MODULE BASE CONTROL CONNECTOR TOLERANCES LEGEND j 010 l 020 wae th 030 dene 060 NO REFERENCE ONLY SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS SNAP 32 Channel Digital Modules continued BOTTOM VIEW OF MODULE RELEASE m SNAP LATCH NOTE CONNECTOR IS CENTERED WITH SCREW HOLE CENTERLINE 0 75 MIN TO NEXT MODULE LOCATION TWO MOUNTING HOLES I AVAILABLE FOR TYPICAL MODULE HOLD DOWN T 7 SCREWS USE Cf ti Ute 4 40 SCREWS 3D CO WITH LENGTH OF PIN 1 0 05 20 PIN BOX HEADER 0 100 CTR CTR 0 15 TYP 2 95 74 93mm 3 81mm 0 45 11 43mm 3 25 OA 82 55mm TOLERANCES 0 010 4 0 020 HL 0
14. E Ea 3 Removing Modules ere sa cos hts acetic an are hte SRR Ran aes nme ewe Leena Ne rnrn 4 Wiringthe Modules sscesricerssosniiosi ioiaren rakes REOOO 4 Attaching th COON ines aie so aicosace eoumeeee aeeti e En a REE RA A NeR 5 Setting Upithe Breakout Board caeul y cca eatdick nett irid ened aei at ts 5 SNAP IDC HDB or SNAP IDC HDB FM for Input Modules 0 00 eeee ees 5 SNAP ODC HDB or SNAP ODC HDB FM for Output Modules 00000 eee 7 Wiring to Field DEVICES vite vtuktnsanaetatedeaarddhenetoranndakancendakennetentanosderdaees 8 16 Channel Modules Wiring and Pinouts 0 2 0 0 cece cee eee tenet eee e ees 9 32 Channel Modules Wiring and Pinouts 00ccccscecseeveseeeeeneseeees 10 Testing Field Connections brecenceahond sous bore meyeade mame ecimnaonateenebnens 13 Readingi ROINE SAES ocd Wea catuh a ember de a ar 13 Waiting OULU POWYS Sick cardatine niita E E E EE 14 Wats NON Eaa a E E N E TEEN E A O E E A E EE 6 Chapter 2 Usage Notes and Specifications sesesssnssesesoseses 17 Comparing High Density and 4 Channel Digital Modules n nnns iP Communication with the Processor ccc yc candeavak ous mexencondawnatenenernadondanba denen 7 COMO aaae ccna and vae pamalnena tenet iansaten a a ea andy nea seats 18 Use NPAC COMO cicecses nnn gebts aide gendeaiacai acide AA TREA 18 High Density and 4 Channel Digital Module COMPANION gilt recede ictus eei kara enaa RE a EAR ENO a
15. Output Points 1 Turn off power to the rack 2 Remove the SNAP brain or controller from the rack to prevent it from overwriting commands from the OptoTerminal G20 Commands from the display device have the lowest priority 3 Turn on power to the rack 4 Plug the OptoTerminal G20 into the RJ 45 connector on top of the output module The terminal shows the current state of output points In this example all points are off aO Os OPTO 22 311 29 1 27 1 251 1 221 201 181 16 ooooo0o00000000000 ooooo0oo00000000000 EE La x E LD 5 Press the arrow keys to select the point you want to turn on or off a v Kil gt Up and down arrows move the cursor between rows A LZ 4 gt Left and right arrows move the cursor to select a point 6 When you have selected the point press ENT SNAP High Density Digital Module User s Guide CHAPTER 1 INSTALLATION AND TESTING 7 To turn a point on press the up or down arrow to select a 1 To turn a point off press the up or down arrow to select a 0 NOTE The OptoTerminal G20 displays 1 and o for On and Off A zero is displayed when the value of zero is selected to be written to a point 8 Press ENT to send the Turn On or Turn Off command If you don t press ENT the unfinished command is cancelled after 10 seconds and the display is reset 9 Watch the output device to make sure it responds Output devices connected to points 0 4 Brain rem
16. P ODC HDB FM for Output Modules 1 Set the LED jumpers for the SNAP ODC HDB or FM breakout board to the Z position when using any SNAP ODC 32 output module sourcing or sinking Set jumpers to the Z position OPTO 22 H apas SNAP ODC HDB Ieeoo Teas pm D ZONE C ZONE B TELLIK ececerecieeerereeieeeeeeeg DOA anr ganana OR C c c 8 7 6 5 4 2 Connect the SNAP HD BF6 cable to the board following wiring diagrams starting on page 10 There are four identical zones on the rack labeled A through D 3 Connect the power supply to the SNAP ODC HDB output breakout board as shown here SNAP ODC 32 SRC or FM Connect the positive lead from the power supply to one Module COM terminal Connect the negative lead to one Field COM terminal la DOE PTE L Ld Module Field COM COM ZONE A ee ibe ee eee SNAP ODC 32 SNK or FM Connect the negative lead from the power supply to one Module COM terminal Connect the positive lead to one gt 66C55463626 Field COM terminal Module Field COM COM SNAP High Density Digital Module User s Guide WIRING THE MODULE 4 Connect field devices to the breakout board as shown below IMPORTANT See module technical specifications for signal voltage range Maximum 32 VDC Nominal 12 24 VDC Typical for sinking Ji Typical
17. R NA 19 SNAP High Density Digital Module User s Guide ii Building TOMO MCABIES lt lt 4 ceradeonehondsuveakendaousheueneess ecnapmncdoes pereakentanunt 20 Peat dO ce cath anton dite caden un cun oni ieaeadeniieanaan atu hementnn A 20 MVE MIMICS Shi aa E E E A E AT EI 20 Notes on Legacy Hardware and Software 00 cece cece cece eee e nee ee sents eeee ens 21 Using HDD Modules with Legacy Hardware nsnavervencevorsnediaworerreavertersteyeners 21 Using HDD Modules with Legacy Software 0 0 c cece cece cece cece ee reene 21 Connecting to G4 Digital WO 155 cjane Gea nanan set inant eee aeiadeaantecaeinwsadsiakes 22 SPEC CatIONS esau ierit caw ae E aE N EEEE E EREE EE EE 23 Input Modules 1 sascy canes endnvatceu netnnnsonadavn Cans eovasdenusounacreinate sapunena Ge 23 UOC Modules mae aar een Mbt reat etd a 25 Breakout Racks amousso teienei iiaeia E EE ARE ETERNE ERE 26 Wiring Harnesses and Cables cscscecescceenesesverevenneceesnatecenteestnaeees 26 Dimensional Drawings usc cenanseee puwnacetheaacinngeue ereere EEEE EEEE EEEE 27 SWAP 16 Channel Digital Modules lt 5 ces sciotinepanaps Glaeed pends aaapa Gia r rererere 27 SNAP 32 Chanrel Digital Modules s ci02v ss xvi vw ethwioasethwaeev etivea av peaewhokw sannda 28 SNAP 32 Channel Digital Modules continued 0 0 0 cece cece cece cece cease eens 29 SNAP 32 Channel Digital Modules continued 0 0 0 cece cece cece cece eect
18. RING HIGH DENSITY AND 4 CHANNEL DIGITAL MODULES Counting Another difference between 4 channel and high density digital modules is in counting For 4 channel SNAP digital input modules counting is done on the processor We refer to it as high speed counting because it can be up to 20 KHz depending on the speed of the module For high density SNAP digital modules however the module itself does the counting The module uses a 16 bit counter which goes up to 65 535 but the processor used with the module accumulates counts to 32 bits 4 294 967 295 by periodically getting and clearing the module s counts and adding each new count to what it already has for each point Update time varies based on the number of modules on the rack and Ethernet communication demands placed on the processor Counting speed for high density digital modules is up to 50 Hz at a 50 duty cycle This rate is useful for applications that require counting at lower speeds for example rotating shafts flow meters that generate pulses and electrical meters tuned to slower speeds Because counting is done in the module rather than in the processor you can get counts for HDD modules used with SNAP PAC R2 controllers and SNAP PAC EB2 and SNAP PAC SB2 brains processors that don t have high speed counting capability Counters must be started Counters are always counting Counters can be Counters can be e Started e Read e Stopped e Read amp Clea
19. SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE SNAP IAC 16 SNAP IAC A 16 SNAP IAC K 16 SNAP IDC 16 SNAP IDC HT 16 SNAP IDC 32 SNAP IDC 32 FM SNAP IDC 32N SNAP ODC 32 SRC SNAP ODC 32 SRC FM SNAP ODC 32 SNK SNAP ODC 32 SNK FM Form 1547 100303 March 2010 OPTO 2 2 43044 Business Park Drive Temecula CA 92590 3614 Phone 800 321 OPTO 6786 or 951 695 3000 Fax 800 832 OPTO 6786 or 951 695 2712 www opto22 com Product Support Services 800 TEK OPTO 835 6786 or 951 695 3080 Fax 951 695 3017 Email support opto22 com Web support opto22 com SNAP High D ensity Digital Module User s Guide Form 1547 100303 March 2010 Copyright 2005 2010 Opto 22 All rights reserved Printed in the United States of America The informati responsibility on in this manual has been checked carefully and is believed to be accurate however Opto 22 assumes no for possible inaccuracies or omissions Specifications are subject to change without notice Opto 22 warrants all of its products to be free from defects in material or workmanship for 30 months from the manufacturin any other con g date code This warranty is limited to the original cost of the unit only and does not cover installation labor or tingent costs Opto 22 1 0 modules and solid state relays with date codes of 1 96 or later are guaranteed for life This lifetime warranty excludes reed relay SNAP serial communication modules SNAP PID modules and module
20. VDC 0 05 mA 9 VDC 2 0 mA 0 135 mA 0 043 mA 0 135 mA Polling time from I O processor to module 2 30 ms typical 2 30 ms typical 2 30 ms typical 2 30 ms typical 2 30 ms typical Input Turn On Off Time 15 ms turn on time 20 ms turn off time 20 ms turn on time 25 ms turn off time 15 ms turn on time 20 ms turn off time 15 ms turn on time 20 ms turn off time 15 ms turn on time 20 ms turn off time Counting Frequency DC input 0 25 Hz 50 duty cycle 0 15 Hz 50 duty cycle 0 25 Hz 50 duty cycle 0 25 Hz 50 duty cycle 0 25 Hz 50 duty cycle 1 Affects turn on and turn off determination 2 Time varies based on the SNAP PAC I O processor brain or on the rack controller processor configuration and Ethernet host communication activity SNAP High Density Digital Module User s Guide SPECIFICATIONS Input Range 10 to 32 VDC 10 to 32 VDC Nominal Voltage Range 24 VDC 24 VDC Input Resistance 20 K ohms 20 K ohms Logic Voltage and Current 5 VDC 0 1 150 mA 5 VDC 0 1 150 mA Input Arrangement 32 input channels 4 groups of 8 inputs each Points in each group share a common negative connection 32 input channels 4 groups of 8 inputs each Points in each group share a common positive connection Channel to Channel Isolation No channel to channel isolation 100 V group to group isolation No chan
21. atching Yes Yes Counting on digital input modules Counting occurs on the module Counting is available with SNAP PAC R14 Counting speeds On 32 point modules 0 50 Hz 50 duty cycle On 16 point modules 0 25 Hz 50 duty cycle Speed depends on module see specifications for each part number SNAP PAC EB14 and SNAP PAC SB1 processors High speed counting occurs on the I O processor brain or on the rack controller and can be configured for any point High speed counting is available on SNAP PAC R14 SNAP PAC EB14 and SNAP PAC SB1 processors Counting speed varies based on the processor and the speed of the module Example SNAP PAC EB1 brain with SNAP IDC5 FAST up to 20 KHz Firmware 8 1 and higher yes Firmware 8 0 and lower no Watchdog timer Firmware 8 0 and lower no Yes Pulse generation Yes Yes On pulse off pulse and No Yes Period measurement Frequency No Yes Totalizer No Yes Digital events Firmware 8 1 and higher yes Yes 1 Actual turn on and turn off times equal the polling time plus the module time 2 Polling time varies based on the SNAP I O processor brain or on the rack controller processor configuration and Ethernet host communication activity 3 The high density digital module uses a 16 bit counter but the processor used with the module accumulates counts to 32 bits by periodically getting and clearing the module s counts and adding to current
22. crosoft Corporation in the United States and other countries Linux is a registered trademark of Linus Torvalds Unicenter is a registered trademark of Computer Associates International Inc ARCNET is a registered trademark of Datapoint Corporation Modbus is a registered trademark of Schneider Electric Wiegand is a registered trademark of Sensor Engineering Corporation Nokia Nokia M2M Platform Nokia M2M Gateway Software and Nokia 31 GSM Connectivity Terminal are trademarks or registered trademarks of Nokia Corporation Sony is a trademark of Sony Corporation Ericsson is a trademark of Telefonaktiebolaget LM Ericsson CompactLogix and RSLogix are trademarks of Rockwell Automation Allen Bradley and ControlLogix are a registered trademarks of Rockwell Automation CIP and EtherNet IP are trademarks o f ODVA All other bran d or product names are trademarks or registered trademarks of their respective companies or organizations E SNAP High Density Digital Module User s Guide Table of Contents Chapter 1 Installation and Testing c cece eee eee e cece ee eeeees 1 POC ee hun ee aed aceon Geonames va enaueines ken eairaee Grime begun 1 Hardware Compatibilty seskan tds coud korai Wesco ea ar e aree 2 Interface Terminal for HDD Modules 02 0 acraedsecarieisa aeprediecimrreiia aerandaseioae 2 FOUN 0 acts atecrstasnen aa despre Se dept a E E AT a e EE 2 stalling OCUICS ie cocunotedsinadiundpentatameewn a EEEE
23. e ioControl version 6 1 or newer with the SNAP IDC 32 SNAP ODC 32 SNK and SNAP ODC 32 SRC modules Use the separate HDD commands for reading and writing Similarly PAC Manager 8 0 is required for the best use of HDD modules but you can also use ioManager 6 1 or newer for one time reads and writes to the same three modules If you must read and write to these three modules using ioDisplay 6 0 not recommended upgrade to PAC Display or at least to ioDisplay 6 1 see Opto 22 form 1561 Using ioDisplay 6 0 with SNAP 32 channel Digital Modules Technical Note For all other HDD modules you cannot use legacy software or hardware You must use SNAP PAC controllers and brains with the version of PAC Control that supports the specific modules SNAP High Density Digital Module User s Guide NOTES ON LEGACY HARDWARE AND SOFTWARE Connecting to G4 Digital I O SNAP HD G4F6 header cable SNAP ODC 32 SNK module G4PB16 mounting racks SNAP mounting rack SNAP ODC 32 SNK digital output modules and SNAP IDC 32N digital input modules can connect to G4PB16 mounting racks using the SNAP HD G4F6 header cable This cable allows older G4 or even G1 digital I O systems to take advantage of modern Opto 22 products like SNAP PAC controllers SNAP PAC brains and PAC Project software For details on compatible racks see form 1756 the SNAP TEX Cables and Breakout Boards Data Sheet NOTE This cable does not work with SNAP ODC 32 SRC module
24. eens 30 Breakout Racks for 32 Channel Digital Modules 00 0c ccc eee e cece eee eee teen ees 31 SNAP High Density Digital Module User s Guide 1 Installation and Testing Introduction SNAP high density digital modules from Opto 22 provide 16 or 32 channels also referred to as points on one compact SNAP input or output module These modules are ideal for OEMs and others who have applications with high point counts or for any application requiring a large number of digital points on one SNAP 1 0 rack Several high density digital modules are available SNAP IDC 32 and SNAP IDC 32 FM digital input modules with 32 input points can be used to sense on off status for 10 32 VDC inputs from sources such as proximity switches limit switches push buttons and pilot switches PNP or sourcing type The SNAP IDC 32N is similar but its input range s 10 to 32 VDC and its common connections are positive rather than negative making it ideal for NPN or sinking type inputs The SNAP IDC 16 digital input module offers 16 points with channel to channel isolation It can sense on off status for 10 32 VDC VAC loads The SNAP IDC HT 16 leakage tolerant digital input module is used with proximity switches It offers channel to channel isolation for 16 points and senses on off status for loads of 15 28 VDC VAC SNAP IAC 16 SNAP IAC A 16 and SNAP IAC K 16 digital input modules each have 16 points with channel to
25. es with Legacy Hardware Most high density digital modules can be used only with SNAP PAC brains and R series controllers However the following table lists some HDD modules that can be installed on I O units using legacy I O processors and racks SNAP UP1 M64 SNAP M16 SNAP M48 SNAP ENET S64 SNAP M32 SNAP M64 SNAP IDC 32 SNAP B4M SNAP B12MC SNAP ODC 32 SNK SNAP UP1 ADS SNAP B8M SNAP B12MC P SNAP ODC 32 SRC SNAP B3000 ENET SNAP B8MC SNAP B16M SNAP ENET RTC SNAP B8MC P SNAP B16MC SNAP B12M SNAP B16MC P Processors must have firmware 6 1 or higher Support for these HDD modules on legacy hardware is limited See form 1688 the SNAP PAC System Migration Technical Note for more information To check processor firmware and load new firmware if required follow instructions in the PAC Manager User s Guide Legacy Edition form 1714 Note that SNAP high density modules cannot be used with digital only processors because high density modules communicate with the processor as an analog module communicates HDD modules can be placed anywhere on B series racks even in slots marked Analog Only Using HDD Modules with Legacy Software For SNAP IDC 32 SNAP ODC 32 SNK and SNAP ODC 32 SRC modules it is best to use PAC Control 8 0 or newer If you do follow steps in form 1688 the SNAP PAC System Migration Technical Note to enable deprecated HDD commands and use these instead of standard digital commands You can also us
26. ing HDD Modules with Legacy Hardware on page 21 18 SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS High Density and 4 Channel Digital Module Comparison Chart Number of points on module 16 or 32 depending on module 4 Isolation and fusing 16 point input modules Each point is optically isolated from other points on the module 32 point input and output modules The module is divided into four groups of eight points Groups are isolated from each other but points within a group are not isolated from each other Groups must be externally fused Input modules Each point is optically isolated from other points on the module Most output modules Points are not isolated from each other Points share a common fuse For isolated modules see the SNAP Digital Ouput Modules Data Sheet form 1144 Status LEDs None use the handheld OptoTerminal G20 for module diagnostics and commissioning or for 32 point modules connect to an optional breakout rack One for each point located on top of module Polling time from I O processor to module 2 30 ms typical 0 5 2 ms typical Module turn on off time 16 point input modules 15 20 ms 32 point input modules 6 ms Output modules 100 microseconds Varies by module Examples e SNAP IDC5 FAST 25 microseconds e SNAP IDC5 5 ms turn on 15 ms turn off On off status Yes Yes Input l
27. nel to channel isolation 100 V group to group isolation Maximum Number of HDD Modules on One Mounting Rack 16 16 None use optional None use optional Indicators OptoTerminal G20 diagnostic OptoTerminal G20 diagnostic display or breakout rack display or breakout rack ON Voltage 10 VDC 0 5 mA 10 VDC 0 5 mA OFF Voltage 3 VDC 0 1 mA 3 VDC 0 1 mA Polling time from I O processor to module 2 30 ms typical 2 30 ms typical Input Turn On Off Time 6ms 6ms Counting Frequency DC input 0 50 Hz 50 duty cycle 0 50 Hz 50 duty cycle 1 Affects turn on and turn off determination 2 Time varies based on the SNAP PAC I O processor brain or on the rack controller processor configuration and Ethernet host communication activity SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS Output Modules Switching Voltage 5 60 VDC 5 60 VDC Nominal Switching Voltage 12 24 VDC 12 24 VDC Logic Voltage and Current 5 VDC 0 1 150 mA 5 VDC 0 1 150 mA Maximum Off State Voltage 60 VDC 60 VDC Output Leakage Typical lt 10 microamps per channel 60 V 70 C lt 10 microamps per channel 60 V 70 C Maximum Load per Point 0 25A 0 25A Voltage Drop 0 15 VDC 0 25 A 0 15 VDC 0 25 A Surge 1 sec 1A 1A 32 output channels 4 groups of 8 outputs 32 output channels 4 groups of 8 outputs
28. or field common P is used Voltage 32 VDC maximum 12 24 VDC nominal SNAP ODC 32 SRC SNAP ODC 32 SRC FM Used with SNAP ODC 32 SNK and SNAP ODC 32 SNK FM 40 pin header connects to 32 channel sourcing or sinking module using SNAP HD BF6 header cable Connectors 32 signal output connectors each signal connector has a corresponding common connector For each zone of 8 signal outputs 1 connection for either module common or field common indicators 1 LED for each signal output 32 signal LEDs total 1 power status LED for each zone of 8 signal outputs 4 power LEDs total Fusin 1 A fuses 1 fuse for each signal output 32 signal fuses total g Replace with Pudenz 1 A automobile mini fuse or equivalent J For each zone of 8 signal inputs 1 jumper controls whether module common or field common umpers is used Voltage 32 VDC maximum 12 24 VDC nominal Wiring Harnesses and Cables SNAP HD ACF6 6 ft 1 8 m wiring harness assembly for SNAP 16 point digital modules SNAP HD CBF6 6 ft 1 8 m wiring harness for SNAP 32 point digital modules SNAP HD BF6 6 ft 1 8 m header cable for SNAP 32 point digital modules and breakout racks 6 ft 1 8 m header cable for SNAP ODC 32 SNK or SNAP IDC 32N modules and G4PB16 mounting racks See form 1756 the SNAP TEX Cables amp Breakout Boards Data Sheet for complete information NOTE This cable does not work with SNAP ODC 32 SRC modules SNAP H
29. oved The wiring between the module and field devices is not shown OPTO 2 2 M1291 27 1 261 22 20 T After the command is sent the display shows the changed value SNAP High Density Digital Module User s Guide WHAT S NEXT What s Next Once you have installed and tested the high density digital HDD module it is ready for use Configuration reading and writing using PAC Project are similar to 4 channel modules For differences see Comparing High Density and 4 Channel Digital Modules on page 17 Youll find the following guides useful for the information listed All guides are available on the Opto 22 website www opto22 com The easiest way to locate one is to search on its form number Installing and using the I O processors brains and SNAP PAC Brain User s Guide 1590 rack mounted controllers that support high density modules SNAP PAC R Series Controller User s Guide 1595 PAC Control User s Guide 1700 Reading and writing to HDD modules using PAC PAC Control Command Reference 1701 Control strategies PAC Control Commands Quick Reference 1703 One time reads and writes to high density modules PAC Manager User s Guide 1704 Reading and Writing to HDD modules Troman EtherNet IP for SNAP PAC Protocol Guide 1770 Allen Bradley Logix PLC system Reading and writing to HDD modules from a P Modbus TCP system Modbus TCP Protocol Guide 1678 Reading and writing to HDD modules using a
30. red e Read Counters cannot be started or stopped e Read amp Cleared Counting is done on the module Counting is supported on 1 series processors only HDD input counting is supported on all processors R1 EB1 SB1 R1 R2 EB1 EB2 SB1 SB2 Use in PAC Control In PAC Control 1 series processors SNAP PAC R1 SNAP PAC EB1 and SNAP PAC SB1 including FM and W models configure and use high density digital modules much like 4 channel digital modules However because of the differences in counters shown in the table above only the commands Get Counter Get amp Clear Counter and Clear Counter will have an effect Since counting is automatic and continuous on the high density module be sure you clear the counter each time before starting to use it so you know it s starting from zero Because PAC Control does not allow counting on 2 series processors SNAP PAC R2 SNAP PAC EB2 and SNAP PAC SB2 plus their FM and W models you cannot configure points on HDD modules as counters However you can work around this limitation by simply enabling and using the legacy HDD module commands Get HDD Module Counters Get amp Clear HDD Module Counter and Get amp Clear HDD Module Counters See the PAC Control Users Guide for instructions to enable legacy commands Remember to clear the counter each time before starting to use it since counting is continuous If you not using SNAP PAC brains and controllers but are using older hardware see Us
31. s SNAP High Density Digital Module User s Guide CHAPTER 2 USAGE NOTES AND SPECIFICATIONS Specifications Input Modules Input Range 10 32 VDC VAC 15 28 VDC VAC 90 140 VAC VDC_ 180 280 VAC VDC 70 130 VAC VDC Nominal Voltage Range 24 VDC 24 VDC 120 VAC 240 VAC 100 VAC Input Resistance 44 K ohms 4 K ohms 300 K ohms 940 K ohms 220 K ohms Logic Voltage and 5 VDC 0 1 5 VDC 0 1 5 VDC 0 1 5 VDC 0 1 5 VDC 0 1 Current 150 mA 150 mA 150 mA 150 mA 150 mA Input Arrangement 16 isolated input channels 16 isolated input channels 16 isolated input channels 16 isolated input channels 16 isolated input channels Channel to Channel 250 V steady state 250 V steady state 250 V steady state 250 V steady state 250 V steady state Isolation 1500 V transient 1500 V transient 1500 V transient 1500 V transient 1500 V transient Maximum Number of HDD Modules on One 16 16 16 16 16 Mounting Rack None use optional None use optional None use optional None use optional None use optional Indicators OptoTerminal G20 OptoTerminal G20 OptoTerminal G20 OptoTerminal G20 OptoTerminal G20 diagnostic display diagnostic display diagnostic display diagnostic display diagnostic display ON Voltage 10 VDC 15 VDC 90 VAC VDC 180 VAC VDC 70 VAC VDC g 0 230 mA 3 50 mA 0 3 mA 0 191 mA 0 3 mA 40 VAC VDC 40 VAC VDC 30 VAC VDC OFF Voltage 3
32. s that contain mech anical contacts or switches Opto 22 does not warrant any product components or parts not manufactured by Opto 22 for these items the warranty from the original manufacturer applies These products include but are not limited to OptoTerminal G 0 OptoTerminal G75 and Sony Ericsson GT 48 see the product data sheet for specific warranty information Refer to Opto 22 form number 1042 for complete warranty information Wired Wireless controllers and brains and N TRON wireless access points are licensed under one or more of the following patents U S Patent No s 5282222 RE37802 6963617 Canadian Patent No 2064975 European Patent No 1142245 French Patent No 1142245 British Patent No 1142245 Japanese Patent No 2002535925A German Patent No 60011224 Opto 22 FactoryFloor Optomux and Pamux are registered trademarks of Opto 22 Generation 4 ioControl ioDisplay ioManager ioProject ioUtilities mistic Nvio Nvio net Web Portal OptoConnect OptoControl OptoDataLink OptoDisplay OptoOPCServer OptoScript OptoServer OptoTerminal OptoUtilities PAC Control PAC Display PAC Manager PAC Project SNAP Ethernet 1 0 SNAP 1 0 SNAP OEM 1 0 SNAP PAC System SNAP Simple 1 0 SNAP Ultimate 1 0 and Wired Wireless are trademarks of Opto 22 ActiveX JScript Microsoft MS DOS VBScript Visual Basic Visual C Windows and Windows Vista are either registered trademarks or trademarks of Mi
33. ule s points on a two line LCD display and can also be used to turn output points on and off For Help If you have problems and cannot find the help you need in this guide or on our website contact Opto 22 Product Support Phone 800 TEK OPTO 835 6786 951 695 3080 NOTE Email messages and Hours are Monday through Friday phone calls to Opto 22 7 a m to 5 p m Pacific Time Product Support are grouped together and Fax 951 695 3017 answered in the order Email Support opto22 com ane Opto 22 website www opto22 com When calling for technical support be prepared to provide the following information about your system to the Product Support engineer Software and version being used e PC configuration type of processor speed memory and operating system e A complete description of your hardware and operating systems including SNAP High Density Digital Module User s Guide CHAPTER 1 INSTALLATION AND TESTING loader and firmware versions for the processor available through PAC Manager P addresses and subnet masks for devices on the system type of power supply third party devices installed for example barcode readers e Specific error messages seen Installing Modules As shown below high density digital HDD modules can be mixed with other modules and placed in any position on a SNAP PAC rack For information on using HDD modules with other Opto 22 mounting racks see Notes on Legac
34. y Digital Module User s Guide
35. y Hardware and Software on page 21 SNAP high density digital modules can be mixed on the rack with SNAP 4 channel digital analog and serial modules Follow these steps to install modules 1 Turn off power to the rack 2 Remove the module from its packaging 3 Position the module over the connector on the rack aligning the small slot at the base of the module with the retention bar on the rack If it is next to another module make sure the male and female module keys are aligned as shown at right 4 Push straight down on the module to snap it into position The module snaps securely into place and requires a special tool provided to remove it To remove a module see below SNAP High Density Digital Module User s Guide WIRING THE MODULE 5 6 Removing Modules 1 Optional As shown at right use standard 4 40 x 1 4 truss head Phillips hold down screws to secure both sides of each module CAUTION Do not over tighten screws Continue with Attaching the Cable on page 5 If the modules are held in place with screws remove them As shown in the illustration insert the SNAP module tool provided into the notch at the base of the module Squeeze the module tool against the module to open the release latch and pull straight up on the module to remove it Wiring the Module Cables and breakout boards are available separately to make field wiring easier Cables plug into

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