HD3SS460EVM-SRC User's Guide (Rev. A)
Contents
1. ML Lanes 0 ML Lanes 1 ML Lanes 2 DP ML Lanes 3 Connector SBU1 ee Type C Connector SBU2 HD3SS460 SS TX RX SBU1 SBU2 EN Daughtercard POL Conn AMSEL DP DM DP DM CC1 CC2 CC1 CC2 VBUS IA Y C SS TX RX USB micro B Connector EN Power vus vsus Switch PES VBUS Power barrel 5 to 3 3V Figure 8 Schematic Page 1 of 3 SLLU214A February 2015 Revised March 2014 HD3SS460EVM SRC 7 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated I TEXAS INSTRUMENTS HD3SS460EVM SRC Schematics www ti com USB Host Connection 1 i i sruscuzen srusen ce options shown here are for eval i T2 purpose to support the i i A Rippability using the EVM i R172 i f p oo p B o DOE Rz ey OE RANA Eris dope per deb aye C si i 2 APUDP AUXP TEST POINT Spee definition NC 10K 1M i A 10K h 1 1 a cc2 cct R7 0 POLR 1 Mes ves E some an P coeun ow Pli o BE csmu2 z CSB2. SSTXP2 F3 CON at EH RAN APU DP OP n 7 AUXP SBU1 s s cc2 Soue 58 ere io waapa fy AUXN EN ten me patti ssopi 8 oRXIP bd ME i e En e bd Apu pe Tap Co i VBUS as 4 VBUS 22 Shields SSRXN1 bd u2 LNDN XRAPU DP DGN I mie NC 0_ APU DP_AUXP i MLON SSRXN2 SSIXN2 MLIN 211 Sheda coe Hy it zinci pr H eer CSBU1 R160 D CS8U1 R es u o E AA T 1 Jaro 23 Shield GND1 p M NC2 D1 z ossz Po CSBUZ RIEM VO 1 ICSBUZ R CSBU1 BUI e APU DP AUXP Rpg3 MEN SSRXN SSIXNT ML2N HE T it iw os H dsens pcm AA inc n End Buz IRA ANGE AAA MA hedi GNDS Net Da x T T l i 3 APU DP AUXN i MESB SSBXE u SSX MLIB Usa Type Racsplaci 6d EJ SND enD 3 cea amp share pad UNAN NOP j Hnes na esir HDSSS4SU R183 and RI64 i 1 GND z GND i ot NCB D3 E at REDS 1 bd bd poi E VBUS_micB 14 TEST POINT i i DisplayPort Source Connection T i moriam i J3 DP SINK SIDE CONNECTOR i Push button reset o2 APU DP TXON 4 2 I to HD3SS460 RiG2 a APT MLNS GND Hj APU DP TX2N i Nesta E XE LED Green 0805 i UD MLLANERo ML LAN
3. Jumper Configuration Following JMPs are provided for mux board configuration purposes Reference Designator JMP Control Config JMP1 POL SHUNT on pin 2 4 JMP2 AMSEL See table below JMP3 EN SHUNT on pin 2 3 J5 3 3V SHUNT on pin 1 2 JMP2 is provided to configure the HD3SS460 for 4 lanes of DisplayPort or 2 lanes of DisplayPort SS TX RX Make sure JMP2 is configured to match the configuration of the connected Type C device The JMP2 configuration must match between two nodes for correct operation ML 2 lane USB SS ML 4 lane USB HS only Pin Assignment C Pin Assignment D JMP2 SHUNT on pin 1 2 SHUNT on pin 2 3 Power The EVM is designed to operate off of the VBUS from a USB host connected via USB micro connector J2 No external power to be via J6 unless standalone operation is desired External PD CC Controller Connection Headers J11 and J12 are provided in case there is a need for external PD CC controller connection Refer to the EVM schematics for the pinout of the headers HD3SS460EVM SRC SLLU214A February 2015 Revised March 2014 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS www ti com HD3SS460 AC Coupling Cap Placement Recommendation 3 HD3SS460 AC Coupling Cap Placement Recommendation The EVM does not have AC capacitors as the EVM is intended to be used with systems that have capacitors placed per
4. with respect to EVMs Also do not transfer EVMs unless User gives the same notice above to the transferee Please note that if User does not follow the instructions above User will be subject to penalties of Radio Law of Japan RRER AES ORMORKRTY LESREVCSOROERSE BHT v LOPCERMSRBATHeSTT UVEWVEOPHWET KABA SH CUSVEOOCPAIRL CIE BRABTOLO ALFOUTHAD PEER TWEE BEPHWETNCCER lt K EE 1 er ea TONNEN Eme CEPR OMISIT REC 2 SERIO SER EH C SHU EE 3 fx EXE38 C EEB EREKTA ZA Bolt LEO TEACO TOE CRE ESSCLOBAUEUIRU RE i c sxUtocussd ERUOG STIBU ZR UUESIQ BRAN RAIMBAE NSRP HOCCeCHB lt KEEW ARTETA 4 YAYINLA YARNS Raw ie Raa 6 TA 24815 PERTH FEIL 3 3 3 Notice for EVMs for Power Line Communication Please see http www tij co jp Isds ti ja general eStore notice 02 page SRA BIO COMBA v LEB EUICSSRORBSRICIUTHH RNECZECKE lt KEKEE Uo http www tij co jp Isds ti_ja general eStore notice_02 page 4 EVM Use Restrictions and Warnings 4 1 EVMS ARE NOT FOR USE IN FUNCTIONAL SAFETY AND OR SAFETY CRITICAL EVALUATIONS INCLUDING BUT NOT LIMITED TO EVALUATIONS OF LIFE SUPPORT APPLICATIONS 4 2 User must read and apply the user guide and other available documentation provided by TI regarding the EVM prior to handling or using the EVM including without limitation any warning or restriction notices The notices contain important safety information related to for example temperatures and voltages 4 3 Safety Related Warnings and
5. CLAIMS ARISING OUT OF OR IN CONNECTION WITH ANY HANDLING OR USE OF THE EVM THAT IS NOT IN ACCORDANCE WITH THESE TERMS AND CONDITIONS THIS OBLIGATION SHALL APPLY WHETHER CLAIMS ARISE UNDER STATUTE REGULATION OR THE LAW OF TORT CONTRACT OR ANY OTHER LEGAL THEORY AND EVEN IF THE EVM FAILS TO PERFORM AS DESCRIBED OR EXPECTED Limitations on Damages and Liability 8 1 General Limitations IN NO EVENT SHALL TI BE LIABLE FOR ANY SPECIAL COLLATERAL INDIRECT PUNITIVE INCIDENTAL CONSEQUENTIAL OR EXEMPLARY DAMAGES IN CONNECTION WITH OR ARISING OUT OF THESE TERMS ANDCONDITIONS OR THE USE OF THE EVMS PROVIDED HEREUNDER REGARDLESS OF WHETHER TI HAS BEEN ADVISED OF THE POSSIBILITY OF SUCH DAMAGES EXCLUDED DAMAGES INCLUDE BUT ARE NOT LIMITED TO COST OF REMOVAL OR REINSTALLATION ANCILLARY COSTS TO THE PROCUREMENT OF SUBSTITUTE GOODS OR SERVICES RETESTING OUTSIDE COMPUTER TIME LABOR COSTS LOSS OF GOODWILL LOSS OF PROFITS LOSS OF SAVINGS LOSS OF USE LOSS OF DATA OR BUSINESS INTERRUPTION NO CLAIM SUIT OR ACTION SHALL BE BROUGHT AGAINST TI MORE THAN ONE YEAR AFTER THE RELATED CAUSE OF ACTION HAS OCCURRED 8 2 Specific Limitations IN NO EVENT SHALL TI S AGGREGATE LIABILITY FROM ANY WARRANTY OR OTHER OBLIGATION ARISING OUT OF OR IN CONNECTION WITH THESE TERMS AND CONDITIONS OR ANY USE OF ANY TI EVM PROVIDED HEREUNDER EXCEED THE TOTAL AMOUNT PAID TO TI FOR THE PARTICULAR UNITS SOLD UNDER THESE TERMS AND CONDITIONS WITH RESPECT TO WHICH LOSSES OR
6. DAMAGES ARE CLAIMED THE EXISTENCE OF MORE THAN ONE CLAIM AGAINST THE PARTICULAR UNITS SOLD TO USER UNDER THESE TERMS AND CONDITIONS SHALL NOT ENLARGE OR EXTEND THIS LIMIT Return Policy Except as otherwise provided TI does not offer any refunds returns or exchanges Furthermore no return of EVM s will be accepted if the package has been opened and no return of the EVM s will be accepted if they are damaged or otherwise not in a resalable condition If User feels it has been incorrectly charged for the EVM s it ordered or that delivery violates the applicable order User should contact TI All refunds will be made in full within thirty 30 working days from the return of the components s excluding any postage or packaging costs Governing Law These terms and conditions shall be governed by and interpreted in accordance with the laws of the State of Texas without reference to conflict of laws principles User agrees that non exclusive jurisdiction for any dispute arising out of or relating to these terms and conditions lies within courts located in the State of Texas and consents to venue in Dallas County Texas Notwithstanding the foregoing any judgment may be enforced in any United States or foreign court and TI may seek injunctive relief in any United States or foreign court Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright O 2015 Texas Instruments Incorporated IMPORTANT NOTICE Texas Instru
7. Restrictions 4 3 1 User shall operate the EVM within Tl s recommended specifications and environmental considerations stated in the user guide other available documentation provided by TI and any other applicable requirements and employ reasonable and customary safeguards Exceeding the specified performance ratings and specifications including but not limited to input and output voltage current power and environmental ranges for the EVM may cause personal injury or death or property damage If there are questions concerning performance ratings and specifications User should contact a TI field representative prior to connecting interface electronics including input power and intended loads Any loads applied outside of the specified output range may also result in unintended and or inaccurate operation and or possible permanent damage to the EVM and or interface electronics Please consult the EVM user guide prior to connecting any load to the EVM output If there is uncertainty as to the load specification please contact a TI field representative During normal operation even with the inputs and outputs kept within the specified allowable ranges some circuit components may have elevated case temperatures These components include but are not limited to linear regulators switching transistors pass transistors current sense resistors and heat sinks which can be identified using the information in the associated documentation When working with
8. csauz ten is Nc 2M Rise i E a NC 2M MODE VOS c7 i 2 4 pull down so e ar resistor between ALL DIFF PAIRS 1 S Psszo82DSGT fon 1M 2M TO 90 OHMS i NTTAL AND 50 om i recommended Common MODE ALL OTHER 34 on SBUl and TRACES ARE 30 OM i SBU2 i Figure 9 Schematic Page 2 of 3 8 HD3SS460EVM SRC SLLU214A February 2015 Revised March 2014 Submit Documentation Feedback Copyright O 2015 2014 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS www ti com HD3SS460EVM SRC Schematics xw Daughtercard Connection ue i SILKSCREEN GND Even Pins J11 i o3 2 5 6 pg2 USB2 NO micB header g 1 22 E USB2 NO header pg2 pg2 seen eg mere S 1i OO 12 2 USB2 PO header pg2 4 2 HPD OUT pg2 APU DP AUXN R 2 88 E RQ CC1 pg2 i pg2 APU DP AUXP R S 1 20 B 1 CC2 pg2 fab ANSEL amp 2 29 33 VBUS_micB_EN gt gt EN pg HDR11x2 M 1 _ J Tm susce External Control Conn VBUS micB 3P3V 3P3V VBUS A A R186 C100 R87 NC 100K 0 1uF U13 10K 2 9 IN OUT i 3 in our 5 T T I VBUS_micB_EN ER FAULTS L0 FAULT 33 ILIM SEL 3 iM 4 ILIMO s RABS r GND ILIM1 100K C101 R88 TPS2555 33 2K L 01uF _ C102 1 TTD 150uF L 4 Figure 10 Schematic Page 3 of 3 SLLU214A February 2015 Revised March 2014 HD3SS460EVM
9. the EVM please be aware that the EVM may become very warm 4 3 2 EVMs are intended solely for use by technically qualified professional electronics experts who are familiar with the dangers and application risks associated with handling electrical mechanical components systems and subsystems User assumes all responsibility and liability for proper and safe handling and use of the EVM by User or its employees affiliates contractors or designees User assumes all responsibility and liability to ensure that any interfaces electronic and or mechanical between the EVM and any human body are designed with suitable isolation and means to safely limit accessible leakage currents to minimize the risk of electrical shock hazard User assumes all responsibility and liability for any improper or unsafe handling or use of the EVM by User or its employees affiliates contractors or designees 4 4 User assumes all responsibility and liability to determine whether the EVM is subject to any applicable international federal state or local laws and regulations related to User s handling and use of the EVM and if applicable User assumes all responsibility and liability for compliance in all respects with such laws and regulations User assumes all responsibility and liability for proper disposal and recycling of the EVM consistent with all applicable international federal state and local requirements 5 Accuracy of Information To the extent TI provides i
10. the corresponding interface specification This section describes guidelines for placing the components including AC coupling caps in a system implementation with the HD3SS460 Figure 4 and Figure 5 depict the AC coupling cap placement examples TI recommends placing the capacitors as shown in the illustrations for the backward compatibility and interoperability purposes as some of the existing USB systems may present Vcm exceeding the typical range of 0 2 V on SS differential pairs USB3 Host mm No AC Coupling Caps 0 1 uF SSTX SSRX MLO RX1 MLO RX1 ML1 m TX1 0 1 uF ML1 E TX1 oY oO g ML2 E 2 HD3SS460 TX2 0 1 uF g 2 ML2 29 TX2 es 0 1 pF S o ML3 sy a RX2 ML3 RX2 VS Figure 4 HD3SS460 USB Host DP Source Implementation Example With SSTX RX Vem lt 2 V USB3 Upstream Port nmm No AC Coupling Caps SSRX SSTX Y RX14 MLO RX1 MLO OLUF qa ML1 TX1 ML1 M DP Sink v m O1uF r2 HD3SS460 ML2 Ss TX2 ML2 6 O Kr ML3 RX2 ML3 lt Figure 5 HD3SS460 USB Upstream DP Sink Implementation Example With SSTX RX Vem lt 2 V SLLU214A February 2015 Revised March 2014 HD3SS460EVM SRC 5 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated HD3SS460 AC Coupling Cap Placement Recommendation J TEX
11. 010000Z0ED R178 R187 11074 M 20 Corner 1 5 0 0 0 Q R7 R153 R163 R175 0402 16W Resistors 311 0 0JRTR ND Yageo RC0402JR 070RL INTEL 5 R176 11074 M 20 Corner 1 1 0 0 0 Q R163 0402 16W Resistors 311 0 0JRTR ND Yageo RC0402JR 070RL INTEL 5 11481 M4 1 1 00M R4 0402 16W Resistors 541 1 00MLTR ND Vishay Dale CRCW04021M00FKED 14220 M 14 9 10 0K R1 R2 R5 R6 R8 0402 10W Resistors P10 0KLTR ND Panasonic Electronic ERJ 2RKF1002 INTEL 6 R10 R12 R87 Components 11016 M1 1 100K R186 0402 16W 1 10W Resistors 311 100KLRTR ND Yageo RC0402FR 07100KL INTEL 13 26416 M31 1 178K R18 0402 10W Resistors P178KLTR ND Panasonic Electronic ERJ 2RKF1783X Components 11322 M4 1 33 2K R88 0402 16W 50V Resistors P33 2KLTR ND Panasonic Electronic ERJ 2RKF3322X Components 21035 M 24 1 330 R17 0402 100ppm C 1 10W Resistors P330LTR ND Panasonic Electronic ERJ 2RKF3300X Components 34546 Q1 1 0 0 R170 1210 2W 1 2W Resistors RMCF1210ZTOROOCT ND Stackpole RMCF1210ZTOROO 31419 U 260 U 233 1 TPD6E05UO6RVZR U12 14 UFDFN 14V Circuit Protection TPD6E05U06RVZR Tl TPD6E05UO6RVZR 23970 Y 51 1 1pH L1 SMDV 24A nductors Coils 587 1647 1 ND Taiyo Yuden NR3015T1RON 3 0X3 0X1 5mm Chokes 11522 ZA 1 LED Green Diffused D2 0805 20mA 2V Optoelectronics 67 1553 2 ND Lumex Opto SML LXT0805GW TR Components Inc 28591 AE 42 2 Single Schottky D1 D3 SOD 123F 1A 20V Discrete RB161M 20CT ND Rohm RB161M 20TR Semiconductor Semiconductor Usa Products Llc 28387 U 174 1 TPS25
12. 55DRC U13 10 SON 14V Integrated Circuits TPS2555DRCT Tl TPS2555DRC 34379 U 286 1 HD3SS460 U2 28 QFN Integrated Circuits HD3SS460 Tl HD3SS460 26427 U 228 1 TPS62082DSGT U7 8 WSON Integrated Circuits TPS62082DSGT Tl TPS62082DSGT 33617 U 279 2 TPD4E05U06DQAR U8 U9 SON 10 Integrated Circuits TPD4E05U06DQAR Tl TPD4E05U06DQA 10 HD3SS460EVM SRC Copyright 2015 2014 Texas Instruments Incorporated SLLU214A February 2015 Revised March 2014 Submit Documentation Feedback 1 TEXAS INSTRUMENTS www ti com Bill of Materials Table 1 HD3SS460 Bill of Materials continued Part T COEFF Volt Qty Value Designators PKG Case z Description Dist P N MFG MFG Part KS Customer i 2 PWR Rated E 20654 AF 18 1 PB SPST NO Off Mom SW2 6 50mm x 6 00mm Switches SW261CT ND Omron Electronics B3SN 3012P Inc Emc Div 2926 AH 4 3 Test Loop Red LP1 LP2 LP3 0 040 14V Test Equipment 5000 Keystone Electronics 5000 1087 4 AM 2 Corner 3 1 1x4 JMP1 0 1 High Temp Connectors HTSW 150 07 G S Samtec Inc HTSW 150 07 G S 1087 3 AM 2 Corner 3 2 1x3 JMP2 JMP3 0 1 High Temp Connectors HTSW 150 07 G S Samtec Inc HTSW 150 07 G S 1087 1 AM 2 Corner 3 4 1x1 TP2 TP3 TP4 TP5 0 1 High Temp Connectors HTSW 150 07 G S Samtec Inc HTSW 150 07 G S 1087 2 AM 2 Corner 3 1 1x2 J5 0 1 High Temp Connectors HTSW 150 07 G S Samtec In
13. AS INSTRUMENTS www ti com Figure 6 and Figure 7 depict the AC coupling cap recommendations in case the upstream or downstream port connected internally to the HD3SS460 presents Vem greater than 2 V N Vcm gt 2 0 V 500 gels iL pF 100 kQ we 100 p sm KQ 100 kQ SSTX SSRX MLO 0 1 pF RX1 MLO RX1 ML1 TX1 0 1 uF DP Source MEL TX1 6 O o ML2 HD3SS460 TX2 O1igF 9 D ML2 TX2 S LEO o ML3 0 1 pF RX2 ML3 RX2 WM Figure 6 HD3SS460 USB Host DP Source with SS USB Vcm P ri Vem gt 2 0 V 500 pF 500 pF e e 5 100 kQ gt ce ka HOC KG kO ZEE RX1 SD aar MLO RX1 MLO Od IF T414 ML1 TX1 ML1 O 2 DP Sink vo TX2 HD3SS460 ML2 gt TX2 ML2 Lo o xa e ML3 RX2 ML3 P a Figure 7 HD3SS460 USB Upstream DP Sink Implementation Example 6 HD3SS460EVM SRC Copyright 2015 2014 Texas Instruments Incorporated SLLU214A February 2015 Revised March 2014 Submit Documentation Feedback 1 TEXAS INSTRUMENTS www ti com HD3SS460EVM SRC Schematics 4 HD3SS460EVM SRC Schematics Figure 8 through Figure 10 illustrate the HD3SS460EVM SRC schematics
14. EZ n Fe ee i 4 l APU_DP_TXIN NDA ML LANE2 p Fg py 1 USB2_NO_micB wus i i APU DP TXTP g M LANET n GND1 15 Y APU DP TXON H BN B RIT 1 3i MLLANEt p ML LANEO n T APU DP TXO i i EN 4 5 330 1 vaus aeu crm SNDS MELANEO p Hig PU EFON veus n 410 to APU DP AUXP 3 CONFIG CONFIG 9 1 Ta NC 0 HP OUT Cate our pgs i uses RON TSSM oy i i APU DP AUXN T7 AUX CH p Es Ri UEM x Q Hep HPD OUT pg i al w USB3 RXOP T Mee SST 5 1 1 RF PPR RINIS F rg AUX CH n HPD 75 2 BER 1 e B3SN 4012 g MicB_SSTX i i d T RTN_DP_PWR DP_PWR 1 USB3_TXON tT 8 SGND H NC OR L 2232 NC OR d id USB3 TXOP q0 MicB_SSRX i Share Pads 2 F Razo 8555 RIT R155 to be populated i JT MicB_SSRX 1 1 R174 and ROWS oR s NOM for DockPort POWER ONLY i C219 47 Shield 1 sk R163 uF 38 Shield i i Te Shed Share pads i i 76 Shield R15 R175 and R179 1 Shield R16 R176 and RIBD i i 1 USB3 micB Recpt USB2 PO header pgi USB2 PO micB header pg i l 1 5V COM aPav 7 USB2 NO micB header poi USB2 NO header pg3 i i Share Pads i NOTE POPULATE JUMPER BY DEFAULT spay v RIJG and Rie2 Pi apav Instal R175 and R176 for standalone default operation 1 me I Install RIS and RIE for proprietary operation to enable u3 PG sA R157 i IOAN NC 100k pist Eoun tie header Connection ea pages s VA i v DOS D MN E oem cU d EET Ed nr cu calc a quM RNMDIS i ur o u em i 5V DC Input Si g sw HH pi
15. I8 TEXAS INSTRUMENTS User s Guide SLLU214A February 2015 Revised March 2014 HD3SS460EVM SRC The HD3SS460 is a high speed passive crosspoint switch designed to support low and high speed signal switching required for Type C with Alternate mode applications This guide describes how to bring up the EVM and includes schematics that can be used as reference design for the Alternate mode implementations of the host systems with the HD3SS460 device Contents 1 HDSSS460EVM SRG snes nE E NE a Ee cA MEE DDMc aD UTelDN cus Re DNE EUN NTi M EE UM M TRE 2 2 LBD3SS460EVM SHO ConftigutratiOhi s uus eaoeu iege neenon tia citati n oetueienis edicta eto Gi anii E US MUN UNUS 4 2 1 J mper COMTI GU ATION D 4 2 2 IM RETI TITIITIM em 4 2 3 External PD CC Controller Connection cceeee cece eee e eee eens enna enna eee aea aaa 4 3 HD3SS460 AC Coupling Cap Placement Recommendation scceeeeeeeeeeeee ence eeeee eens eeeeeeeaeeeneeeees 5 4 HD8SS460EVM SRG ScChEMAatiCS sicicicnscecscicdceecmcstascetiaasnaecacteepardnescuadecieaatanebedsabevacammasibecaiadeuas 7 5 Sl Ke EC L 10 List of Figures 1 g peis iT omis Eccle mm 2 2 Id IoEsI jep D S 2 3 Alternate Mode Over Type C Specification cccceeceeeeee eee eeeeeeeeee eee eeeeeeeeeeenaseeeeeeeeeenaeeeeeeeneeenats 3 4 HD3SS460 USB Host DP Source Implementation Example With SSTX RX Vom lt 2
16. SRC 9 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated I TEXAS INSTRUMENTS Bill of Materials www ti com 5 Bill of Materials Table 1 lists the HD3SS460EVM SRC bill of materials BOM Table 1 HD3SS460 Bill of Materials Part T COEFF Volt Qty Value Designators PKG Case Description Dist P N MFG MFG Part KS Customer y i PWR Rated ly 8461 A1 1 0 1uF c3 0201 X5R 10V Capacitors 587 2241 2 ND Taiyo Yuden LMK063BJ104KP F 1320 A1 1 10000pF C4 0201 X7R 10V Capacitors 490 3194 2 ND Murata Electronics GRM033R71A103KA01D North America 9293 B5 Corner 1 2 0 1uF C100 C101 0402 X5R 25V Capacitors GRM188R71E474KA12D TDK Corporation C1005X5R1E104K 2900 B 6 INTEL 4 1 1 0uF C1 0402 X5R 10V Capacitors 587 1454 2 ND Taiyo Yuden LMK105BJ105KV F 1068 C1 1 1 0uF C219 0603 X7R 16V Capacitors 445 1604 2 ND TDK Corporation C1608X7R1C105K 1013 D6 2 10yF C2 C6 0805 X5R 16V Capacitors 478 5165 2 ND Taiyo Yuden EMK212BJ106KG T 1013 D6 2 10uF C5 C8 0805 X5R 16V Capacitors 478 5165 2 ND Taiyo Yuden EMK212BJ106KG T 12360 D7 1 22uF C7 0805 X5R 6 3V Capacitors 445 1422 2 ND TDK Corporation C2012X5R0J226M 1 25 29503 K4 1 150uF C102 P2 5 D6 3 H16 55 C 16V Capacitors 493 5014 1 ND Nichicon UPJ1C151MED1TD 05 C 11539 L1 6 0 0 0 Q R13 R160 R161 R165 0201 20W 50V Resistors PO 0AGTR ND Vishay Dale CRCW02
17. TX1 LnB ML1 LnC ML2 A2 3 CTX1 LnB MLO LnC ML3 B11 10 CRX1 LnA MLO LnD ML3 B11 10 CRX1 LnA ML1 LnD ML2 B2 3 CTX2 LnC ML2 LnB ML1 B2 3 CTX2 LnC ML3 LnB MLO A8 CSBU1 SBU2 AUXN SBU1 AUXP A8 CSBU1 SBU2 AUXP SBU1 AUXN B8 CSBU2 SBU1 AUXP SBU2 AUXN B8 CSBU2 SBU1 AUXN SBU2 AUXP SOURCE Pin Assignment Option D F SINK Pin Assignment Option D POL H POL L POL H POL L AMSEL L AMSEL L AMSEL L AMSEL L EN H EN H EN H EN H 460 Pin 460 Pin 460 Pin 460 Pin mapping to mapping to mapping to mapping to 460 Pin 460 Pin Receptacle Type C DP DP Receptacle Type C mapping to mapping to Pin Number Connector Source GPU Source GPU Pin Number Connector DP Sink DP Sink A11 10 CRX2 SSRX LnA MLO A11 10 CRX2 SSRX LnA ML1 A2 3 CTX1 LnB ML1 SSTX A2 3 CTX1 LnB MLO SSTX B11 10 CRX1 LnA MLO SSRX B11 10 CRX1 LnA ML1 SSRX B2 3 CTX2 SSTX LnB ML1 B2 3 CTX2 SSTX LnB MLO A8 CSBU1 SBU2 AUXN SBU1 AUXP A8 CSBU1 SBU2 AUXP SBU1 AUXN B8 CSBU2 SBU1 AUXP SBU2 AUXN B8 CSBU2 SBU1 AUXN SBU2 AUXP SLLU214A February 2015 Revised March 2014 HD3SS460EVM SRC Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated I TEXAS INSTRUMENTS HD3SS460EVM SRC Configuration www ti com 2 2 1 2 2 2 3 4 HD3SS460EVM SRC Configuration This section provides the configuration options available in the HD3SS460EVM SRC
18. UZ a i 10K Ro i HDR3KI RS i of St TEST POINT i NC 1M R10 Ne 10K ct T i 10K tur LE aii i 1 I 10K m i i i i i ree em i i i l TEST POINT H i ist purpose only Dd TypeC Connector and Source Pin Mapping veus ESD Components i 2 M i aPav ann 1 VBUS1 a i SEE a d S3 pud i GND a zz GND re 5d u k 1 oo e LI cc ne cct 1 EDON ul Di NC10 1 our Taau i ML2P SSTXP1 x SSRXP1 ML3P GEL pBS Qoa Ra CTXiP Z Bie NOU Lu u2 i MCIP TXP2 SSRXP2 ML P A zu pom Ilen eno S t 8 i seu Ag oau o o a bor NT S po i MI2N SSTXN1 x a0 SSRXNI ML3N seu pee e 1 CREF Elbe Now me AMSEL po Sentiguracion t MEIN SSTXN2 SSRXNI ML N up Note reds 1 Vie EN i biit T recommended to l AS USB2 PU EPAR T PETER WEUS a VBUS opt TET 5d ORKIN cmo SED sno 1 circuit i ges LEE 71 i cct a SBU2 AUXN bez Fer Ericos aboye 1i HM crap 1 E a SEN usea REN gt ny AUXN ov Wistebe 0 CUR ee Now Ly cman on ce os rm resent on an g a ama star 4 ERR ofthe t os F No GND Fy ae orxin ne 4 and m3 if i i DPA x DN2 SERES ERN of the r 6g cmap GND GND Fy mIENUTES RIS and R13 it gro ds i an owa Hpsssaeo 5d E Plor nce eae e h j DN1 s as DP2 SSRXP2 a0 COON device is off PDAEUSUDE a m Era EN APU DP TXIP m spei Ries and m3 or g264 and z TE open omae ENB AUD Ey SSS
19. V cessere 5 5 HD3SS460 USB Upstream DP Sink Implementation Example With SSTX RX Vem lt 2 V 5 6 HD3SS460 USB Host DP Source with SS USB VCM cceeeeeeeee eee eee eee eee eee eee ee ene nene nnne 6 7 HD3SS460 USB Upstream DP Sink Implementation Example cceceeeeeeeeee eee cese 6 8 Sehematic Page o ec Eee DE 7 9 Sehematic PAGS 2 OFS REDE 8 10 Schematic Page 3 Of 3 sssssxtuxsch caisraicajenitice cinitercianncieiesedis nis n EEEE E S a EEE 9 SLLU214A February 2015 Revised March 2014 HD3SS460EVM SRC 1 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated I TEXAS INSTRUMENTS HD3SS460EVM SRC www ti com 1 HD3SS460EVM SRC USB3 DisplayPort 5 V Power micro B Input HD3SS460 o o 2 a o USB3 Type C Figure 1 HD388460EVM SRC The HD3SS460EVM SRC can be used with a legacy DP Source and or USB Host system to evaluate the Type C implementation Figure 2 is a typical test set up USB Hub Device DP Brancl Sink The EVM comes with a legacy USB receptacle to connect to legacy USB systems and a DisplayPort receptacle to connect to DisplayPort capable source There is no on board CC PD controller The board has test headers that can be used to connect CC and other necessary signals to an external Type C controller to evaluate the Type C implementation The EVM schematics shown in this document are based upon the pin assignment define
20. ada pour fonctionner avec les types d antenne num r s dans le manuel d usage et ayant un gain admissible maximal et l iImp dance requise pour chaque type d antenne Les types d antenne non inclus dans cette liste ou dont le gain est sup rieur au gain maximal indiqu sont strictement interdits pour l exploitation de l metteur Japan 3 8 1 Notice for EVMs delivered in Japan Please see http www tij co jp Isds ti ja general eStore notice 01 page HABA Ic HANDRA h R RICOIWUTE ROECSZECHRKEEW http www tij co jp Isds ti_ja general eStore notice_01 page 3 3 2 Notice for Users of EVMs Considered Radio Frequency Products in Japan EVMs entering Japan may not be certified by TI as conforming to Technical Regulations of Radio Law of Japan If User uses EVMs in Japan not certified to Technical Regulations of Radio Law of Japan User is required by Radio Law of Japan to follow the instructions below with respect to EVMs 1 Use EVMs in a shielded room or any other test facility as defined in the notification 173 issued by Ministry of Internal Affairs and Communications on March 28 2006 based on Sub section 1 1 of Article 6 of the Ministry s Rule for Enforcement of Radio Law of Japan 2 Use EVMs only after User obtains the license of Test Radio Station as provided in Radio Law of Japan with respect to EVMs or 3 Use of EVMs only after User obtains the Technical Regulations Conformity Certification as provided in Radio Law of Japan
21. asonable time to repair such EVM or provide replacements Repaired EVMs shall be warranted for the remainder of the original warranty period Replaced EVMs shall be warranted for a new full ninety 90 day warranty period Regulatory Notices 3 4 United States 3 1 1 Notice applicable to EVMs not FCC Approved This kit is designed to allow product developers to evaluate electronic components circuitry or software associated with the kit to determine whether to incorporate such items in a finished product and software developers to write software applications for use with the end product This kit is not a finished product and when assembled may not be resold or otherwise marketed unless all required FCC equipment authorizations are first obtained Operation is subject to the condition that this product not cause harmful interference to licensed radio stations and that this product accept harmful interference Unless the assembled kit is designed to operate under part 15 part 18 or part 95 of this chapter the operator of the kit must operate under the authority of an FCC license holder or must secure an experimental authorization under part 5 of this chapter 3 1 2 For EVMs annotated as FCC FEDERAL COMMUNICATIONS COMMISSION Part 15 Compliant CAUTION This device complies with part 15 of the FCC Rules Operation is subject to the following two conditions 1 This device may not cause harmful interference and 2 this device must accept any in
22. c HTSW 150 07 G S 9280 11 AM 68 1 2x11 J11 0 1x0 1 High Temp Connectors HTSW 150 14 G D Samtec Inc HTSW 150 14 G D 9280 14 AM 68 1 2x14 J12 0 1x0 1 High Temp Connectors HTSW 150 14 G D Samtec Inc HTSW 150 14 G D 9004 AM 126 6 50 pin J1 J7 J10 1 27MM High Temp Connectors S9014E 50 ND Sullins Connector GRPB501VWVN RC Solutions 24057 AM 105 1 R A J6 2 1mm ID 25 C 5A Connectors CP 202AH ND Cui PJ 202AH 5 5mm OD 85 C 2502 AM 20 BB 1 1 Display Port J3 20 Pin Connectors 47272 0001 Molex Waldom 47272 0001 Electronics Corporation 34373 1 USB TYPE C J2 SMT Connectors UT12123 1A501 7H Foxconn UT12123 1A501 7H 31416 AM 31 1 USB microUSB 3 J4 SMT T H version Connectors 798 ZX360D B 10P Hirose ZX360D B 10P Type B 14560 HW Corner 2 3 Shunt Note 0 1 SP High Temp Hardware 151 8000 E Kobiconn 151 8000 e DNI 25 DNI R3 R162 R172 R173 DNI DNI DNI Undefined Category DNI DNI R9 R14 R164 R171 R188 R179 R180 R182 R182 R155 R174 R15 R16 R155 R174 R156 R157 R158 R159 R185 R177 SLLU214A February 2015 Revised March 2014 HD3SSA460EVM SRC 11 Submit Documentation Feedback Copyright O 2015 2014 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS Revision History www ti com Revision History Changes from Original February 2015 to A Revision Page Changed HD3SS460 EVM to HD3SS460EVM SRC globally in document eese 1 Added HD3SS460 AC Coupling Cap Placement Recommendation section 20
23. cceeeeeeeee cece eee eeeeeeeeeeeeeeeeeeeeeaeees 5 NOTE Page numbers for previous revisions may differ from page numbers in the current version 12 Revision History SLLU214A February 2015 Revised March 2014 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated STANDARD TERMS AND CONDITIONS FOR EVALUATION MODULES Delivery Tl delivers TI evaluation boards kits or modules including any accompanying demonstration software components or documentation collectively an EVM or EVMs to the User User in accordance with the terms and conditions set forth herein Acceptance of the EVM is expressly subject to the following terms and conditions 1 1 EVMs are intended solely for product or software developers for use in a research and development setting to facilitate feasibility evaluation experimentation or scientific analysis of Tl semiconductors products EVMs have no direct function and are not finished products EVMs shall not be directly or indirectly assembled as a part or subassembly in any finished product For clarification any software or software tools provided with the EVM Software shall not be subject to the terms and conditions set forth herein but rather shall be subject to the applicable terms and conditions that accompany such Software 1 2 EVMs are not intended for consumer or household use EVMs may not be sold sublicensed leased rented loaned assigned or otherwise distributed
24. d in the Alternate mode over Type C specification as shown in Figure 3 DP Source USB Host Figure 2 Test Board Setup 2 HD3SS460EVM SRC SLLU214A February 2015 Revised March 2014 Submit Documentation Feedback Copyright 2015 2014 Texas Instruments Incorporated 1 TEXAS INSTRUMENTS www ti com HD3SS460EVM SRC Sink Assignment C D USB C to USB C Receptacle Interface Front View Source Assignment C D E F USB C to USB C Receptacle Interface Front View B12 A1 B12 A1 B11 RX1 TX1 A2 B11 RX1 TX1 A2 B10 RX1 TX1 A3 B10 RX1 TX1 A3 B9 veus a4 B9 VBUS a4 B8 CC1 A5 B8 CC1 A5 B7 A6 A6 B6 A7 A7 B5 A8 A8 B4 A9 A9 B3 A10 A10 B2 A11 A11 B1 A12 A12 Figure 3 Alternate Mode Over Type C Specification The following tables represent the example pin mapping to the HD3SS460 for the DP Source pin assignments C D E and F and DP Sink pin assignments C and D SOURCE Pin Assignment Option C E SINK Pin Assignment Option C POL H POL L POL H POL L AMSEL H AMSEL H AMSEL H AMSEL H EN H EN H EN H EN H 460 Pin 460 Pin 460 Pin 460 Pin mapping to mapping to mapping to mapping to 460 Pin 460 Pin Receptacle Type C DP DP Receptacle Type C mapping to mapping to Pin Number Connector Source GPU Source GPU Pin Number Connector DP Sink DP Sink A11 10 CRX2 LnD ML3 LnA MLO A11 10 CRX2 LnD ML2 LnA ML1 A2 3 C
25. ed certain components as meeting ISO TS16949 requirements mainly for automotive use In any case of use of non designated products TI will not be responsible for any failure to meet ISO TS16949 Products Applications Audio www ti com audio Automotive and Transportation www ti com automotive Amplifiers amplifier ti com Communications and Telecom www ti com communications Data Converters DLP Products DSP Clocks and Timers Interface Logic Power Mgmt Microcontrollers RFID OMAP Applications Processors Wireless Connectivity dataconverter ti com www dlp com www ti com clocks interface ti com logic ti com microcontroller ti com www ti rfid com www ti com omap Computers and Peripherals Consumer Electronics Energy and Lighting Industrial Medical Security Space Avionics and Defense Video and Imaging TI E2E Community www ti com wirelessconnectivity www ti com computers www ti com consumer apps www ti com energy www ti com industrial www ti com medical www ti com security www ti com space avionics defense www ti com video Mailing Address Texas Instruments Post Office Box 655303 Dallas Texas 75265 Copyright 2015 Texas Instruments Incorporated
26. ent Concerning EVMs Including Detachable Antennas Under Industry Canada regulations this radio transmitter may only operate using an antenna of a type and maximum or lesser gain approved for the transmitter by Industry Canada To reduce potential radio interference to other users the antenna type and its gain should be so chosen that the equivalent isotropically radiated power e i r p is not more than that necessary for successful communication This radio transmitter has been approved by Industry Canada to operate with the antenna types listed in the user guide with the maximum permissible gain and required antenna impedance for each antenna type indicated Antenna types not included in this list having a gain greater than the maximum gain indicated for that type are strictly prohibited for use with this device Concernant les EVMs avec antennes d tachables Conform ment la r glementation d Industrie Canada le pr sent metteur radio peut fonctionner avec une antenne d un type et d un gain maximal ou inf rieur approuv pour l metteur par Industrie Canada Dans le but de r duire les risques de brouillage radio lectrique l intention des autres utilisateurs il faut choisir le type d antenne et son gain de sorte que la puissance isotrope rayonn e quivalente p i r e ne d passe pas l intensit n cessaire l tablissement d une communication satisfaisante Le pr sent metteur radio a t approuv par Industrie Can
27. ere is no guarantee that interference will not occur in a particular installation If this equipment does cause harmful interference to radio or television reception which can be determined by turning the equipment off and on the user is encouraged to try to correct the interference by one or more of the following measures Heorient or relocate the receiving antenna Increase the separation between the equipment and receiver Connect the equipment into an outlet on a circuit different from that to which the receiver is connected Consult the dealer or an experienced radio TV technician for help Canada 3 2 4 For EVMs issued with an Industry Canada Certificate of Conformance to RSS 210 Concerning EVMs Including Radio Transmitters This device complies with Industry Canada license exempt RSS standard s Operation is subject to the following two conditions 1 this device may not cause interference and 2 this device must accept any interference including interference that may cause undesired operation of the device Concernant les EVMs avec appareils radio Le pr sent appareil est conforme aux CNR d Industrie Canada applicables aux appareils radio exempts de licence L exploitation est autoris e aux deux conditions suivantes 1 l appareil ne doit pas produire de brouillage et 2 l utilisateur de l appareil doit accepter tout brouillage radio lectrique subi m me si le brouillage est susceptible d en compromettre le fonctionnem
28. for commercial purposes by Users in whole or in part or used in any finished product or production system Limited Warranty and Related Remedies Disclaimers 2 1 These terms and conditions do not apply to Software The warranty if any for Software is covered in the applicable Software License Agreement 2 2 Tl warrants that the TI EVM will conform to TI s published specifications for ninety 90 days after the date TI delivers such EVM to User Notwithstanding the foregoing TI shall not be liable for any defects that are caused by neglect misuse or mistreatment by an entity other than TI including improper installation or testing or for any EVMs that have been altered or modified in any way by an entity other than TI Moreover TI shall not be liable for any defects that result from User s design specifications or instructions for such EVMs Testing and other quality control techniques are used to the extent TI deems necessary or as mandated by government requirements TI does not test all parameters of each EVM 2 3 If any EVM fails to conform to the warranty set forth above TI s sole liability shall be at its option to repair or replace such EVM or credit User s account for such EVM TI s liability under this warranty shall be limited to EVMs that are returned during the warranty period to the address designated by TI and that are determined by TI not to conform to such warranty If TI elects to repair or replace such EVM TI shall have a re
29. ments Incorporated and its subsidiaries Tl reserve the right to make corrections enhancements improvements and other changes to its semiconductor products and services per JESD46 latest issue and to discontinue any product or service per JESD48 latest issue Buyers should obtain the latest relevant information before placing orders and should verify that such information is current and complete All semiconductor products also referred to herein as components are sold subject to Tl s terms and conditions of sale supplied at the time of order acknowledgment TI warrants performance of its components to the specifications applicable at the time of sale in accordance with the warranty in Tl s terms and conditions of sale of semiconductor products Testing and other quality control techniques are used to the extent TI deems necessary to support this warranty Except where mandated by applicable law testing of all parameters of each component is not necessarily performed TI assumes no liability for applications assistance or the design of Buyers products Buyers are responsible for their products and applications using Tl components To minimize the risks associated with Buyers products and applications Buyers should provide adequate design and operating safeguards TI does not warrant or represent that any license either express or implied is granted under any patent right copyright mask work right or other intellectual property righ
30. nformation on the availability and function of EVMs TI attempts to be as accurate as possible However TI does not warrant the accuracy of EVM descriptions EVM availability or other information on its websites as accurate complete reliable current or error free 10 Disclaimers 6 1 EXCEPT AS SET FORTH ABOVE EVMS AND ANY WRITTEN DESIGN MATERIALS PROVIDED WITH THE EVM AND THE DESIGN OF THE EVM ITSELF ARE PROVIDED AS IS AND WITH ALL FAULTS TI DISCLAIMS ALL OTHER WARRANTIES EXPRESS OR IMPLIED REGARDING SUCH ITEMS INCLUDING BUT NOT LIMITED TO ANY IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE OR NON INFRINGEMENT OF ANY THIRD PARTY PATENTS COPYRIGHTS TRADE SECRETS OR OTHER INTELLECTUAL PROPERTY RIGHTS 6 2 EXCEPT FOR THE LIMITED RIGHT TO USE THE EVM SET FORTH HEREIN NOTHING IN THESE TERMS AND CONDITIONS SHALL BE CONSTRUED AS GRANTING OR CONFERRING ANY RIGHTS BY LICENSE PATENT OR ANY OTHER INDUSTRIAL OR INTELLECTUAL PROPERTY RIGHT OF TI ITS SUPPLIERS LICENSORS OR ANY OTHER THIRD PARTY TO USE THE EVM IN ANY FINISHED END USER OR READY TO USE FINAL PRODUCT OR FOR ANY INVENTION DISCOVERY OR IMPROVEMENT MADE CONCEIVED OR ACQUIRED PRIOR TO OR AFTER DELIVERY OF THE EVM USER S INDEMNITY OBLIGATIONS AND REPRESENTATIONS USER WILL DEFEND INDEMNIFY AND HOLD TI ITS LICENSORS AND THEIR REPRESENTATIVES HARMLESS FROM AND AGAINST ANY AND ALL CLAIMS DAMAGES LOSSES EXPENSES COSTS AND LIABILITIES COLLECTIVELY
31. r represents and agrees that it has all the necessary expertise to create and implement safeguards which anticipate dangerous consequences of failures monitor failures and their consequences lessen the likelihood of failures that might cause harm and take appropriate remedial actions Buyer will fully indemnify TI and its representatives against any damages arising out of the use of any TI components in safety critical applications In some cases TI components may be promoted specifically to facilitate safety related applications With such components TI s goal is to help enable customers to design and create their own end product solutions that meet applicable functional safety standards and requirements Nonetheless such components are subject to these terms No TI components are authorized for use in FDA Class III or similar life critical medical equipment unless authorized officers of the parties have executed a special agreement specifically governing such use Only those TI components which TI has specifically designated as military grade or enhanced plastic are designed and intended for use in military aerospace applications or environments Buyer acknowledges and agrees that any military or aerospace use of Tl components which have not been so designated is solely at the Buyer s risk and that Buyer is solely responsible for compliance with all legal and regulatory requirements in connection with such use TI has specifically designat
32. t relating to any combination machine or process in which TI components or services are used Information published by TI regarding third party products or services does not constitute a license to use such products or services or a warranty or endorsement thereof Use of such information may require a license from a third party under the patents or other intellectual property of the third party or a license from TI under the patents or other intellectual property of TI Reproduction of significant portions of TI information in TI data books or data sheets is permissible only if reproduction is without alteration and is accompanied by all associated warranties conditions limitations and notices TI is not responsible or liable for such altered documentation Information of third parties may be subject to additional restrictions Resale of TI components or services with statements different from or beyond the parameters stated by TI for that component or service voids all express and any implied warranties for the associated TI component or service and is an unfair and deceptive business practice Tl is not responsible or liable for any such statements Buyer acknowledges and agrees that it is solely responsible for compliance with all legal regulatory and safety related requirements concerning its products and any use of TI components in its applications notwithstanding any applications related information or support that may be provided by TI Buye
33. terference received including interference that may cause undesired operation Changes or modifications not expressly approved by the party responsible for compliance could void the user s authority to operate the equipment FCC Interference Statement for Class A EVM devices NOTE This equipment has been tested and found to comply with the limits for a Class A digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference when the equipment is operated in a commercial environment This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instruction manual may cause harmful interference to radio communications Operation of this equipment in a residential area is likely to cause harmful interference in which case the user will be required to correct the interference at his own expense 3 2 3 3 FCC Interference Statement for Class B EVM devices NOTE This equipment has been tested and found to comply with the limits for a Class B digital device pursuant to part 15 of the FCC Rules These limits are designed to provide reasonable protection against harmful interference in a residential installation This equipment generates uses and can radiate radio frequency energy and if not installed and used in accordance with the instructions may cause harmful interference to radio communications However th
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