SNAP HIGH-DENSITY DIGITAL MODULE USER'S GUIDE
Contents
1. Harness Pin Pin Harness Wire Color Number Signal Signal Number Wire Color Gray 40 A0 O0 O _ __ A4 39 White Bue 38 AT o O A5 37 Voet Yellow 36 A2 O O A6 35 Green Red 34 A3 O O A7 33 Orange Black 32 ACOM O O ACOM 31 Brown Gray 30 BO O O B4 29 White Blue 28 2xBij o O B5 27 WVoe et Yellow 26 B2 oO O B6 25 Green Red 2 Bol o O IB 7 23 Orang Black 22 BCOM O O BCOM 21 Brown Gray 20 co o0 O _ C4 19 White Blue 18 C1 o O C5 17 Violet Yellow 16 c2 o O C6 15 Green Red 14 c3 o O C7 13 Orange Black 12 CCOM O _ O CCOM 11 Brown Gray 10 D0 O O D4 9 White Blue 8 D1 O O D5 7 Violet Yellow 6 D2 O O D6 5 Green Red 4 D3 O O D7 3 Orange Black 2 DCOM O O DCOM 1 Brown Connector wiring for SNAP ODC 32 SNK SNAP ODC 32 SRC and SNAP IDC 32 high density digital modules top view of module SNAP High Density Digital Module User s Guide INSTALLING MODULES Module Connector Pinouts Pinouts 16 Channel Digital Input Modules The following pintout diagram applies to2. Maximum Load per Point 0 25A 0 25A Forward Drop 0 15 VDC 0 25 A 0 15 VDC 0 25 A Maximum Off State Voltage 60 VDC 60 VDC Reverse Voltage 0 6 VDC 0 6 VDC Surge 1 sec 1A 1A 1 Affects turn on and turn off determination 2 Time varies based on the SNAP PAC I O processor brain or on the rack controller processor configuration and Ethernet host communication activity SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Breakout Racks Used with SNAP IDC 32 40 pin header connects to SNAP IDC 32 module using SNAP HD BF6 header cable Connectors 32 signal input connectors each signal connector has a corresponding common connector For each zone of 8 signal inputs 1 connection for either module common or field common indicators 1 LED for each signal input 32 signal LEDs total 1 power status LED for each zone of 8 signal inputs 4 power LEDs total Fusin 1 A fuses 2 fuses for each zone of 8 signal inputs 8 fuses total g Replace with Pudenz 1 A automobile mini fuse or equivalent Jumpers For each zone of 8 signal inputs 1 jumper controls whether module common or field common is used SNAP ODC 32 SRC Used with SNAP ODC 32 SNK 40 pin header connects to SNAP ODC 32 SRC or SNAP ODC 32 SNK module using SNAP HD BF6 header cable Connectors 32 signal output connectors each signal connect
3. 00 0 0 c cece eee e ce ee eens eens 30 SNAP High Density Digital Module User s Guide SNAP High Density Digital Module User s Guide Introduction SNAP high density digital modules from Opto 22 provide 16 or 32 channels also referred to as points on one compact SNAP input or output module These modules are ideal for OEMs and others who have applications with high point counts or for any application requiring a large number of digital points on one SNAP I O rack gt The following high density digital modules are 2 available pt Wa Seen gis BNP p06 od e The SNAP IDC 32 digital input module NAi oe with 32 input points can be used to sense h Cpe Woe c on off status for 10 32 VDC inputs from Z sources such as proximity switches limit lt switches push buttons and pilot switches SNAP IDC 16 e The SNAP IDC 16 digital input module offers 16 points with channel to channel isolation It can sense on off status for10 32 VDC VAC loads SNAP IAC 16 and SNAP IAC A 16 digital input modules each have 16 points with channel to channel isolation These modules sense on off status for aN as 90 140 VAC SNAP IAC 16 aa AP ONS ve 0180 280 VAC SNAP IAC A 16 ton tng 582 SNAP ODC 32 SRC and ot Seta SNAP ODC 32 SNK digital output i modules have 32 points and can switch on s and off 5 60 VDC loads either sourcing or sinking SNAP ODC 32 SNK SNAP High Density Digital Modul
4. Configuring Breakout Racks This section describes how to configure a SNAP IDC HDB input breakout rack below or a SNAP ODC HDB breakout rack see page 12 Configuring a SNAP IDC HDB Input Breakout Rack To use a SNAP IDC HDB breakout rack with a SNAP IDC 32 input module connect the rack to the module using the SNAP HD BF6 header cable Set the jumpers and wire the field devices and the power supply as described below There are four identical zones on the rack labeled A through D Setting the SNAP IDC HDB Jumpers Set the LED jumpers for the SNAP IDC HDB breakout rack to the X position when using the SNAP IDC 32 input module JP D JP C JP B JP A Set jumpers to the X position aao rormdowm pe MOCLAETYPE 0 0 coe meo BL cours reo ou om co ZONE BFIELD COM ZONE AFIELD COM SNAP High Density Digital Module User s Guide 11 CONFIGURING BREAKOUT RACKS Wiring the SNAP IDC HDB Connect the field devices and power supply to the SNAP IDC HDB input breakout board as shown here IMPORTANT See module technical specifications for signal voltage range FC FELD COM or ort TTE ae ZONED COM oC ZONE A COM TYPICAL TYPICAL TYPICAL Configuring a SNAP ODC HDB Output Breakout Rack To use a SNAP ODC HDB breakout rack with a SNAP ODC 32 SRC or SNAP ODC 32 SNK output module conne
5. CHO m AUT Orange CH1 e Brown CH2 s ae Yellow CH3 5 i Blue CH4 TE Green CH5 E H6 Eoma on ns i Fis White CH8 Pin 7 Black H Pin 15 Orange CH9 ne rin Brown CH10 mi ae Yellow H CH11 GR Blue CH12 A Green 7 CH13 a LE White CH14 aan 5 6 SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE 32 Channel Module Connector Wiring for the SNAP HD CBF6 Harness The following table shows 32 channel module connector wiring for the SNAP HD CBF6 wiring harness Wires from the wiring harness are grouped into four sets Each set contains color coded wires Set A Set B Set C Set D Wires Ch Wires Point Wires Point Wires Ch AO Gray 0 BO Gray 8 co Gray 16 DO Gray 24 A1 Blue 1 B1 Blue 9 C1 Blue 17 D1 Blue 25 A2 Yellow 2 B2 Yellow 10 C2 Yellow 18 D2 Yellow 26 A3 Red 3 B3 Red 11 C3 Red 19 D3 Red 27 A4 White 4 B4 White 12 C4 White 20 D4 White 28 A5 Violet 5 B5 Violet 13 C5 Violet 21 D5 Violet 29 A6 Green 6 B6 Green 14 C6 Green 22 D6 Green 30 A7 Orange 7 B7 Orange 15 C7 Orange 23 D7 Orange 31 The four sets relate to point numbers on the module as shown below For a pinout diagram of the input modules see page 9 For output modules see page 10
6. Legacy Software 0 0 cece cece cece cece cee e ene eee en nes 19 Connecting to G4 Digital Q 5 lt vaanissanataeoswaereawig an aetinananae er aamdeeiadwateinns 20 Comparing High Density and 4 Channel Digital Modules 00 00 c ccc eee e cece e ees 20 Communication with the Processor cescccsenceeeenteeeeseeeeeteeenneeesenaes 20 COUMUNO Gs dette gaenind Oa nda haan eee Baaaa Gada wet atest se oueatntariiee Ratan maaan 21 Use ITAL COMO siesta Sncdtne natoncaike raneta atau EEEE EE TETEE Ei 21 High Density and 4 Channel Digital Module Comparison Chait is tate eats aah OM Sake ew a Cane d Ranaut eae eee newt eas 22 Specificatii asavnanwicnchesaeiyaiatcieas E E OERE OEE Ea TERE caren 23 Input Modules o nananana nunnana uaaa aaaeeeaa EEEE EEEE EEEE EEEE EEEE EEEE 23 ONO S er e e e a a a E S 24 Breakut RACKS cccaamteaduds ebudetotetoueud ate a O E E A ET E 25 Wiring Harnesses and Cables n nnn nunnan ene siesdeninaere neta eruiuniacnees 25 Dimensional Drawings sac dace nint eater poles ied cng EEEE 26 SNAP 16 Channel Digital Modules x14 car avenasasvidssd ners nener eeen 26 SNAPS 2 C Hanne Digital MOQUIES e i wsnsevaea Gxye i eesnakwa ven Uewe Seu bemnws den EEES ss 27 SNAP 32 Channel Digital Modules continued 0 00 0 ccc e cece cece eee cess een nes 28 SNAP 32 Channel Digital Modules continued 0 0 cece cece cece e eee e seen nes 29 Breakout Racks for 32 Channel Digital Modules
7. and Nokia 31 GSM Connectivity Terminal are trademarks or registered trademarks of Nokia Corporation Sony is a trademark of Sony Corporation Ericsson is a trademark of Telefonaktiebolaget LM Ericsson All other brand or product names are trademarks or registered trademarks of their respective companies or organizations SNAP High Density Digital Module User s Guide Table of Contents IOC 2 ctacaie aea aa ETE E AOTER E EOE EEIE tis 1 Hardware Compatibility ccscctscceecesdseapessbreaurensbsenpenebssapensebrecpenebesanes 2 Feld Winna serkania aera are e ea eae 2 Interface Terminal for HDD Modules s 2 cii52uiudeicteinnasheeeimawiciwaudarnndebedietarwtas 2 Whats IN tIS GUE natanoniustteute cue E r EEEE E ROSEE 2 5019 uo ee e a E E E E oe Rarer e 3 Installing GUNES 5 8 dalton drat teen haan Gnd ten aaier aai 3 Removing MOdUlES icicccsscuwenaiaaeeriwisa inal saeeneiwisacasaadansewawadines 4 Attaching the Wiring HOMNCS wicccsareystauecvencadarc urtnupceentadipesvrinweeeunecem 5 Building Your Own Wiring Harness 4 2issetvacutiagesaeinredvaciinaeisaqiouebiaenien 5 16 Channel Module Connector Wiring for the SNAP HD ACF6 harness 044 6 32 Channel Module Connector Wiring for the SNAP HD CBF6 Harness 05 7 Module Connector PinoutsS caus cie dncanes nas keae malta nears nang ereere eener 8 Pinouts 16 Channel Digital Input Modules 0 00 00 cece ee cece eee ee eens 8 Pinouts 3
8. follow instructions in the PAC Manager Users Guide Legacy Edition form 1714 Note that SNAP high density modules cannot be used with digital only processors because high density modules communicate with the processor as an analog or special purpose module communicates HDD modules can be placed anywhere on B series racks even in slots marked Analog Only Using HDD Modules with Legacy Software It is best to use PAC Control 8 0 or newer with HDD modules because you can configure them as you would other digital modules and read and write to them using standard digital point commands However you can use ioControl version 6 1 or newer with the SNAP IDC 32 SNAP ODC 32 SNK and SNAP ODC 32 SRC modules Use the separate HDD commands for reading and writing Similarly PAC Manager 8 0 is required for the best use of HDD modules but you can also use ioManager 6 1 or newer for one time reads and writes to the same three modules If you must read and write to these three modules using ioDisplay 6 0 not recommended upgrade to PAC Display or at least to ioDisplay 6 1 see Opto 22 form 1561 Using ioDisplay 6 0 with SNAP 32 channel Digital Modules Technical Note SNAP High Density Digital Module User s Guide 19 COMPARING HIGH DENSITY AND 4 CHANNEL DIGITAL MODULES Connecting to G4 Digital I O SNAP 32 point module G4PB16 mounting racks SNAP mounting rack SNAP high density digital output modules can connect to G4PB16 mo
9. of a high density digital module s points on a two line LCD display and can also be used to turn output points on and off What s in this Guide This guide includes the following sections e Installation and testing e Comparison with 4 channel SNAP digital modules Specifications and dimensions SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE For Help If you have problems and cannot find the help you need in this guide or on our website contact Opto 22 Product Support Phone 800 TEK OPTO 835 6786 951 695 3080 NOTE Email messages and Hours are Monday through Friday phone calls to Opto 22 7 a m to 5 p m Pacific Time Product Support are grouped together and Fax 951 695 3017 answered in the order Email support opto22 com Renee Opto 22 website www opto22 com When calling for technical support be prepared to provide the following information about your system to the Product Support engineer Software and version being used PC configuration type of processor speed memory and operating system A complete description of your hardware and operating systems including loader and firmware versions for the processor available through PAC Manager IP addresses and subnet masks for devices on the system type of power supply third party devices installed for example barcode readers Specific error messages seen Installing Modules As shown be
10. you want to use a point as a counter configure it as a counter and use the standard PAC Control commands for counters such as Start Counter and Get and Clear Counter However because counting is automatic and continuous on the high density module be sure you clear the counter each time before starting to use it so you know it s starting from zero SNAP High Density Digital Module User s Guide COMPARING HIGH DENSITY AND 4 CHANNEL DIGITAL MODULES High Density and 4 Channel Digital Module Comparison Chart The following chart summarizes differences between high density and 4 channel SNAP digital modules Number of points on module 16 or 32 depending on module 4 Isolation and fusing Status LEDs 16 point input modules Each point is optically isolated from other points on the module 32 point input and output modules The module is divided into four groups of eight points Groups are isolated from each other but points within a group are not isolated from each other Groups must be externally fused None use the handheld OptoTerminal G20 for module diagnostics and commissioning or for 32 point modules connect to an optional breakout rack Input modules Each point is optically isolated from other points on the module Most output modules Points are not isolated from each other Points share a common fuse See the SNAP Digital Ouput Modules Data Sheet form 1144 for isolated modules One for each
11. 1700 Reading and writing to high density modules using PAC Control strategies PAC Control Command Reference 1701 PAC Control Commands Quick Reference 1703 One time reads and writes to high density modules PAC Manager User s Guide 1704 Reading and writing to high density modules using a OptoMMP Protocol Guide 1465 custom program you develop 18 SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Notes on Legacy Hardware and Software For important information on mixing current and legacy products see Opto 22 form 1688 the SNAP PAC System Migration Technical Note Using HDD Modules with Legacy Hardware Most high density digital modules can be used only with SNAP PAC brains and R series controllers However the following table lists some HDD modules that can be installed on I O units using legacy I O processors and racks SNAP UP1 M64 SNAP M16 SNAP M48 SNAP ENET S64 SNAP M32 SNAP M64 SNAP IDC 32 SNAP B4M SNAP B12MC SNAP ODC 32 SNK SNAP UP1 ADS SNAP B8M SNAP B12MC P SNAP ODC 32 SRC SNAP B3000 ENET SNAP B8MC SNAP B16M SNAP ENET RTC SNAP B8MC P SNAP B16MC SNAP B12M SNAP B16MC P Processors must have firmware 6 1 or higher Support for these HDD modules on legacy hardware is limited See form 1688 the SNAP PAC System Migration Technical Note for more information To check processor firmware and load new firmware if required
12. 2 Channel Digital Input Modules ics avaereadevageneeirvaekenadevadnncens 9 Pinouts 32 Channel Digital Output Modules 0 0 cece cece e eee eee ees 10 Configuring Breakout Racks sss a1d vindddqnde hod ddat sea Pinan neha datela teaaaidobadadate 11 Configuring a SNAP IDC HDB Input Breakout Rack 0 0 ccc cee eece cece eens 11 Setting the SNAP IDC HDB Jumpers 0cceecceeeceeceeeneeneeeeueeeeeeneanes 1 Wiring the SNAP IDC HDB 4 3 cssneregeanihabanarmeesienncwiadancamnaheetmadnaes 12 Configuring a SNAP ODC HDB Output Breakout Rack nunnur 12 Setting the SNAP ODC HDB Jumpers cus vtec ate vce aiden atl euudienstleirch aeallet 13 Connecting Power to the SNAP ODC HDB cece eee eeee eens enee eee eens 13 Connecting Field Devices to the SNAP ODC HDB 0 0 0 cece cece eee ee eee ees 14 Testing Field Connections 52 2cesc sce kann hang oum inate weaKadiuc geek ion ken aawahanphumineten 14 Reading Point States lt 5 lt crcedeireieieivedidatine padeatednaetsiuehwiaastabinanes 14 Writing tO Output PONS inea waned eae stew be cian nsw svau sue sees new ei OEEC 16 Whats NO arete na seen EE Uany eves E OO 8 SNAP High Density Digital Module User s Guide itt Notes on Legacy Hardware and Software 0 0 ccc ccc cece eect eee e teense teen eee ees 19 Using HDD Modules with Legacy Hardware 0 0 cccc cece ee cce cece eee ee eee eens 19 Using HDD Modules with
13. 2 channel output modules follow wiring and fusing diagrams in 32 Channel Module Connector Wiring for the SNAP HD CBF6 Harness on page 7 and Pinouts 32 Channel Digital Output Modules on page 10 CAUTION For output modules you must install fuses between the wiring harness and field devices If you use a fused breakout rack part number SNAP ODC HDB fusing is already done for you If not follow the diagram on page 10 to either fuse the common for each set of wires or fuse individual pinouts for each point Building Your Own Wiring Harness If you want to build your own wiring harness you will need the parts listed below For SNAP HD ACF6 Connector Molex 39 01 2165 Pins Molex 39 00 0214 Cable Belden 8308 22 AWG 16 conductor shielded or equivalent UL AWM style 2464 For SNAP HD CBF6 Connector Molex 15 04 5401 Pin housing Molex 50 57 9320 Pins Molex p n 16 02 0103 Cable Alpha 5020 40c 24 AWG 40 conductor or equivalent UL type CM SNAP High Density Digital Module User s Guide INSTALLING MODULES 16 Channel Module Connector Wiring for the SNAP HD ACF6 harness The following diagram shows16 channel module connector wiring for the SNAP HD ACF6 wiring harness Note that the small four pin connector on the top of the 16 channel module connects to the optional Opto Terminal G20 using a special adapter cable included with the Opto Terminal Port for OptoTerminal G20 Pin 8 Red Pin 16 White
14. DIGITAL MODULE USER S GUIDE SNAP 32 Channel Digital Modules TOP VIEW OF MODULE 3 25 82 55mm 3 26 3 05 82 80mm 77 47mm SIDE VIEW OF MODULE ag qo SNAP LATCH MODULE BASE CONTROL CONNECTOR 18 26mm TOLERANCES LEGEND j 010 l 020 eae th 030 x 060 NO REFERENCE ONLY SNAP High Density Digital Module User s Guide DIMENSIONAL DRAWINGS SNAP 32 Channel Digital Modules continued BOTTOM VIEW OF MODULE RELEASE 7 SNAP LATCH NOTE CONNECTOR IS CENTERED WITH SCREW HOLE CENTERLINE 0 75 MIN TO NEXT MODULE 4 40 THRU HOLE LOCATION 2 EACH AVAILABLE TYPICAL HOLDDOWN FOR i ee 7 3a 716 or 12 S es 0 eee LENGTH 440 THREAD M CS SCREW FASTENER PIN 1 0 05 PIN PIN SPACING 1 27mm 20 PIN BOX HEADER 0 100 CTR CTR et 2 95 74 93mm 0 45 11 43mm ed 3 25 OA 82 55mm _ _t TOLERANCES 0 010 41 0 020 4 0 030 NO REFERENCE ONLY IMPORTANT The mounting rack connector has 24 pins the module connector has 20 pins The extra pins on the mounting rack connector prevent misalignment of the module during installation SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE SNAP 32 Channel Digital Modules continued NOTE CONSIDER SNAP PAC BRAIN Lu 2 z MODULE a 3 06 MODULE RETENTION RAIL 82 80mm 3 70 SNAP 93 98mm I O RACK BOA
15. O processor to module Input Turn On Off Time 2 30 ms typical 6 ms 2 30 ms typical 15 ms turn on time 20 ms turn off time 2 30 ms typical 15 ms turn on time 20 ms turn off time 2 30 ms typical 15 ms turn on time 20 ms turn off time Counting Frequency DC input 0 50 Hz 50 duty cycle 0 25 Hz 50 duty cycle 0 25 Hz 50 duty cycle 0 25 Hz 50 duty cycle 1 Affects turn on and turn off determination 2 Time varies based on the SNAP PAC I O processor brain or on the rack controller processor configuration and Ethernet host communication activity SNAP High Density Digital Module User s Guide SPECIFICATIONS Output Modules Line Voltage 4 24 VDC 4 24 VDC Logic Voltage and Current 5 VDC 0 1 150 mA 5 VDC 0 1 150 mA Output Arrangement 32 output channels 4 groups of 8 outputs each Points in each group share a common positive connection 32 output channels 4 groups of 8 outputs each Points in each group share a common negative connection Maximum Number of HDD Modules on One Mounting Rack 16 16 Indicators None use optional OptoTerminal G20 diagnostic display or breakout rack None use optional OptoTerminal G20 diagnostic display or breakout rack Polling time from I O processor to module 2 30 ms typical 2 30 ms typical Output Turn On Off Time 100 microseconds 100 microseconds
16. RD FOR DIN CLIP ADD on 06 TO OVERALL HEIGHT SNAP RACK SNAP RACK DIN RAIL ADAPTER CUSTOMER SUPPLIED BASE EXTRUSION TOLERANCE LEGEND 35mm DIN RAIL k 4010 NOTE BE SURE TO CONSIDER ee te 000 DIN RAIL DIMENSIONS aad DIN RAIL MUST BE MOUNTED EE AERO HORIZONTALLY TO USE SNAP 1 0 weak 060 WITHOUT MODULE HOLD DOWN SCREWS NO REFERENCE ONLY SNAP High Density Digital Module User s Guide DIMENSIONAL DRAWINGS Breakout Racks for 32 Channel Digital Modules 29999999 OP 2999 2999009 39 22 38s w 2 w 6 a SOOO 000 0 0 00 0 6 6 6 0 OO OOS CMS CPSC 97 80mm a SNAP IDC HDB breakout rack 10 245mm 3 85 100mm 97 80mm SNAP ODC HDB breakout rack SNAP High Density Digital Module User s Guide
17. SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE SNAP IAC 16 SNAP IAC A 16 SNAP IDC 16 SNAP IDC 32 SNAP ODC 32 SRC SNAP ODC 32 SNK Form 1547 070720 July 2007 OPTO 22 43044 Business Park Drive Temecula CA 92590 3614 Phone 800 321 OPTO 6786 or 951 695 3000 Fax 800 832 OPTO 6786 or 951 695 2712 www opto22 com Product Support Services 800 TEK OPTO 835 6786 or 951 695 3080 Fax 951 695 3017 Email support opto22 com Web support opto22 com SNAP Hi gh Density Digital Module User s Guide Form 1547 070720 July 2007 Copyright 2003 2007 Opto 22 Allright Printed i s reserved n the United States of America The information in this manual has been checked carefully and is respons Opto 22 ibility for possible inaccuracies or omissions Specification warrants all of its products to be free from defects in ma manufacturing date code This warranty is limited to the original ther contingent costs Opto 22 1 0 modules and solid state relays with date codes of 1 96 or later are guaranteed for or any 0 life This contain Opto 22 lifetime warranty excludes reed relay SNAP serial comm mechanical contacts or switches Opto 22 does not warra for these items the warranty from the original manufac believed to be accurate however Opto 22 assumes no s are Subject to change without notice erial or workmanship for 30 months from the cost of the unit only and does not cover install
18. ation labor unication modules SNAP PID modules and modules that nt any product components or parts not manufactured by urer applies These products include but are not limited to OptoTerminal G70 OptoTerminal G75 and Sony Ericsson GT 48 see the product data sheet for specific warranty information Refer to Opto 22 form number 1042 for complete warranty information Cyrano Opto 22 FactoryFloor Optomux and Pamux are registered trademarks of Opto 22 Generation 4 ioControl ioDisplay ioManager ioProject ioUtilities mistic Nvio Nvio net Web Portal OptoConnect OptoControl OptoDataLink OptoDisplay OptoOPCServer OptoScript OptoServer OptoTerminal OptoUtilities PAC Control PAC Display PAC Manager PAC Project SNAP Ethernet 1 0 SNAP 1 0 SNAP OEM 1 0 SNAP PAC System SNAP Simple 1 0 SNAP Ultimate 1 0 and SNAP Wireless LAN I O are trademarks of Opto 22 ActiveX JScript Microsoft MS DOS VBScript Visual Basic Visual C and Windows are either registered trademarks or trademarks of Microsoft Corporation in the United States and other countries Linux is a registered trademark of Linus Torvalds Unicenter is a registered trademark of Computer Associates International Inc ARCNET is a registered trademark of Datapoint Corporation Modbus is a registered trademark of Schneider Electric Wiegand is a registered trademark of Sensor Engineering Corporation Nokia Nokia M2M Platform Nokia M2M Gateway Software
19. ct the rack to the module using the SNAP HD BF6 header cable Set the jumpers and wire the power supply and the field devices as described below There are four identical zones on the rack labeled A through D SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Setting the SNAP ODC HDB Jumpers Set the LED jumpers for the SNAP ODC HDB breakout rack to the Z position when using either the SNAP ODC 32 SRC or SNAP ODC 32 SNK output module JP D JP C JP B 5 ven QO aie Q Ly 7 i Set jumpers to the Z position J H OPTO 22 H apas saben aio Sea mounn i nal soed fizan ZONE D ZONE C ZONE B zc as A TELLIK TEE EETTITEIITTITT C4 C4 7 t c c C C 5 gt 4 9 2 1 at 7 Secs 2 st7Se 555 352 1 Connecting Power to the SNAP ODC HDB Connect the power supply to the SNAP ODC HDB output breakout board as shown here SNAP ODC 32 SRC Connect the positive lead from the power supply to one Module COM terminal Connect the negative lead to one Field COM terminal Module Field COM COM SNAP ODC 32 SNK Connect the negative lead from the power supply to one Module COM terminal Connect the positive lead to one Field COM terminal 1a O PT L Lt Module Field COM COM SNAP High Density Digital Module User
20. e User s Guide EE INTRODUCTION Hardware Compatibility SNAP high density digital HDD modules are part of the SNAP PAC System They are designed to mount on a SNAP PAC rack with a SNAP PAC brain or R series controller Analog serial special purpose and 4 channel digital modules can be mounted on the same rack to provide the mix of signals and density needed at any distributed location For information on using HDD modules with older processors or racks see Notes on Legacy Hardware and Software on page 19 Field Wiring Two options are available separately for connecting field wiring to the module e Wiring harness assembly with flying leads 32 and 16 channel modules Use the SNAP HD CBF6 for 32 channel modules and the SNAP HD ACF6 for 16 channel modules The wiring harness plugs into connectors on the module s top Use one wiring harness per module e Breakout racks and cables 32 channel modules only Fused breakout racks are also available separately to make wiring easier SNAP IDC HDB is for input modules and SNAP ODC HDB is for output modules Use one rack per module Connect the 32 channel module to either breakout rack using the SNAP HD BF6 header cable Interface Terminal for HDD Modules The optional OptoTerminal G20 operator interface terminal available separately is recommended for commissioning and troubleshooting It plugs into a connector on the top of the module The OptoTerminal G20 displays the status
21. e the module tool against the module to open the release latch and pull straight up on the module to remove it 4 SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Attaching the Wiring Harness A wiring harness assembly SNAP HD ACF6 for 16 channel modules or SNAP HD CBF6 for 32 channel modules is sold separately and used to wire field devices to the module One wiring harness assembly is needed per module NOTE Opto 22 also offers SNAP IDC HDB and SNAP ODC HDB fused breakout racks for 32 channel digital modules If you are using a breakout rack see Configuring Breakout Racks on page 11 for installation instructions 1 Plug the wiring harness into the wiring connector s on the top of the module Secure the harness cable so that its weight is supported The connector plug is not designed to support the weight of the cable 2 Recommended Install a barrier strip in a convenient location for ease in wiring the connector to field devices 3 To wire field devices to the module do the following For 16 channel modules follow 16 Channel Module Connector Wiring for the SNAP HD ACF6 harness on page 6 and Pinouts 16 Channel Digital Input Modules on page 8 For 32 channel input modules follow 32 Channel Module Connector Wiring for the SNAP HD CBF6 Harness on page 7 and Pinouts 32 Channel Digital Input Modules on page 9 For 3
22. for On and Off A zero is displayed when the value of zero is selected to be written to a point 8 Press ENT to send the Turn On or Turn Off command If you don t press ENT the unfinished command is cancelled after 10 seconds and the display is reset 16 SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE 9 Watch the output device to make sure it responds Output devices connected to points 0 4 Brain removed The wiring between the module and field devices is not shown i g 41210 LBA Div PR oat Ts I 1 fer Ld After the command is sent the display shows the changed value SNAP High Density Digital Module User s Guide WHAT S NEXT What s Next Once you have installed and tested the high density digital module it is ready for use Configuration reading and writing using PAC Project are similar to 4 channel modules For differences see Comparing High Density and 4 Channel Digital Modules on page 20 You ll find the following guides useful for the information listed All guides are available on the Opto 22 website www opto22 com The easiest way to locate one is to search on its form number Installing and using the I O processors brains and SNAP PAC Brain User s Guide 1590 rack mounted controllers that support high density modules SNAP PAC R Series Controller User s Guide 1595 PAC Control User s Guide
23. low high density digital HDD modules can be mixed with other modules and placed in any position on a SNAP PAC rack For information on using HDD modules with other Opto 22 mounting racks see Notes on Legacy Hardware and Software on page 19 SNAP high density digital modules can be mixed on the rack with SNAP 4 channel digital analog and serial mie o o oe s me He Ko SNAP High Density Digital Module User s Guide INSTALLING MODULES Follow these steps to install modules 1 Turn off power to the rack 2 Remove the module from its packaging 3 Position the module over the connector on the rack aligning the small slot at the base of the module with the retention bar on the rack If it is next to another module make sure the male and female module keys are aligned as shown at right 4 Push straight down on the module to snap it into position The module snaps securely into place and requires a special tool provided to remove it To remove a module see below 5 Optional As shown at right use standard 4 40 x 1 4 truss head Phillips hold down screws to secure both sides of each module CAUTION Do not over tighten screws 6 Continue with Attaching the Wiring Harness on page 5 Removing Modules 1 Ifthe modules are held in place with screws remove them 2 Asshown in the illustration insert the SNAP module tool provided into the notch at the base of the module 3 Squeez
24. n the following example points 0 2 4 5 9 12 13 15 17 18 19 22 23 26 28 and 30 are on and the remaining points are off The terminal displays the bitmask in binary format the hexadecimal equivalent of the bitmask is shown for reference only aO Os OPTO 22 H I 291 27 25 1 22 20 48 I 16 7 A JUFA ARETA La Ly e A e SNAP High Density Digital Module User s Guide CONFIGURING BREAKOUT RACKS Writing to Output Points 1 Turn off power to the rack 2 Remove the SNAP brain or controller from the rack to prevent it from overwriting commands from the OptoTerminal G20 Commands from the display device have the lowest priority 3 Turn on power to the rack 4 Plug the OptoTerminal G20 into the RJ 45 connector on top of the output module The terminal shows the current state of output points In this example all points are off a O Os OPTO 22 311 29 1 27 1 25 1 1 22 1 20 1 18 1 16 ooooo0oo00000000000 ooooo0oo0o0000000000 ASEAS AET Shee a a 2 10 Laj Ly fe Le Lb 5 Press the arrow keys to select the point you want to turn on or off a v Up and down arrows move the cursor between rows lt 4 gt Left and right arrows move the cursor to select a point 6 When you have selected the point press ENT 7 To turn a point on press the up or down arrow to select a 1 To turn a point off press the up or down arrow to select a 0 NOTE The OptoTerminal G20 displays 1 and o
25. or has a corresponding common connector For each zone of 8 signal outputs 1 connection for either module common or field common lndigaters 1 LED for each signal output 32 signal LEDs total 1 power status LED for each zone of 8 signal outputs 4 power LEDs total Fusin 1 A fuses 1 fuse for each signal output 32 signal fuses total g Replace with Pudenz 1 A automobile mini fuse or equivalent Jumpers For each zone of 8 signal inputs 1 jumper controls whether module common or field common is used Wiring Harnesses and Cables SNAP HD ACF6 6 ft 1 8 m wiring harness assembly for SNAP 16 point digital modules SNAP HD CBF6 6 ft 1 8 m wiring harness for SNAP 32 point digital modules SNAP HD BF6 6 ft 1 8 m header cable for SNAP 32 point digital modules and breakout racks SNAP HD G4F6 6 ft 1 8 m header cable for SNAP 32 point digital modules and G4PB16 mounting racks SNAP High Density Digital Module User s Guide DIMENSIONAL DRAWINGS Dimensional Drawings SNAP 16 Channel Digital Modules TOP VIEW OF MODULE 3 25 82 55mm OOOOOOOO jOOoOooOoOoOo OOOOOOOO yOOoOoOoOoOoOo OO 3 36 85 32mm 3 06 SIDE VIEW 77 70mm OF MODULE at 18 69mm SNAP LATCH MODULE BASE CONTROL CONNECTOR TOLERANCES LEGEND ti 010 020 eee tl 030 zz 060 NO REFERENCE ONLY SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY
26. point located on top of module Polling time from I O processor to module 2 30 ms typical 0 5 2 ms typical Module turn on off time 16 point input modules 15 20 ms 32 point input modules 6 ms Output modules 100 microseconds Varies by module Examples e SNAP IDC5 FAST 25 microseconds e SNAP IDC5 5 ms turn on 15 ms turn off Latching Yes Yes Counting on digital input modules Counting occurs on the module Counting is available with any compatible I O processor including SNAP PAC R2 and SNAP PAC EB2 Counting speeds On 32 point modules 0 50 Hz 50 duty cycle On 16 point modules 0 25 Hz 50 duty cycle High speed counting occurs on the I O processor brain or on the rack controller and can be configured for any point High speed counting is available on SNAP PAC R1 and SNAP PAC EB1 processors Counting speed varies based on the processor and the speed of the module Example SNAP PAC EB1 brain with SNAP IDC5 FAST up to 20 KHz 1 Actual turn on and turn off times equal the polling time plus the module time 2 Polling time varies based on the SNAP I O processor brain or on the rack controller processor configuration and Ethernet host communication activity 3 The high density digital module uses a 16 bit counter but the processor used with the module accumulates counts to 32 bits by periodically getting and clearing the module s counts and adding to current value
27. r difference between 4 channel and high density digital modules is in counting For 4 channel SNAP digital input modules counting is done on the processor We refer to it as high speed counting because it can be up to 20 KHz depending on the speed of the module For high density SNAP digital modules however the module itself does the counting The module uses a 16 bit counter which goes up to 65 535 but the processor used with the module accumulates counts to 32 bits 4 294 967 295 by periodically getting and clearing the module s counts and adding each new count to what it already has for each point Update time varies based on the number of modules on the rack and Ethernet communication demands placed on the processor Counting speed for high density digital modules is up to 50 Hz at a 50 duty cycle This rate is useful for applications that require counting at lower speeds for example rotating shafts flow meters that generate pulses and electrical meters tuned to slower speeds Because counting is done in the module rather than in the processor you can get counts for HDD modules used with SNAP PAC R2 controllers and SNAP PAC EB2 brains processors that don t have high speed counting capability Use in PAC Control SNAP high density modules are configured and used in PAC Control just like 4 channel digital modules Exception if you are using older hardware see Using HDD Modules with Legacy Hardware on page 19 If
28. s Update time varies based on number of modules and Ethernet communication demands SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Specifications Input Modules Input Range 10 32 VDC 10 32 VDC VAC 90 140 VAC VDC 180 280 VAC VDC Input Resistance 20 K ohms 44 K ohms 300 K ohms 940 K ohms Logie Volt ge and 5VDC 0 1 150mA 5VDC 0 1 150 mA 5 VDC 0 1 150 ma 5 VPC 0 1 Current 150 mA Input Arrangement 32 input channels 4 groups of 8 inputs each Points in each group share a common negative connection 16 isolated input channels 16 isolated input channels 16 isolated input channels Channel to Channel No channel to channel isolation 100 V 250 V working 1500 V 250 V working 1500 V 250 V working Isolation transient transient 1500 V transient group to group isolation Maximum Number of HDD Modules on One 16 16 16 16 Mounting Rack None use optional OptoTerminal G20 None use optional None use optional None use optional Indicators f a he OptoTerminal G20 OptoTerminal G20 OptoTerminal G20 diagnosticdisplay or diagnostic displa diagnostic displa diagnostic displa breakout rack g p ay 9 p ay 9 p ay ON Voltage 10 VDC 0 5 mA 10 VDC 0 230 mA 90 VDC 0 3 mA 180 VDC 0 191 mA OFF Voltage 3 VDC 0 1 mA 3 VDC 0 05 mA 40 VDC 0 135 mA 40 VDC 0 043 mA Polling time from I
29. s Guide CONFIGURING BREAKOUT RACKS Connecting Field Devices to the SNAP ODC HDB Connect the field devices to the SNAP ODC HDB output breakout board as shown here IMPORTANT See module technical specifications for signal voltage range J MODULE TYPE J SNAP OOC 22 SRC Testing Field Connections The OptoTerminal G20 sold separately is recommended for testing field wiring locally For input and output modules you can use it to read point states for output modules you can also use it to write to individual output points CAUTION The OptoTerminal G20 is for use with SNAP high density modules only and is the only display device intended for use with these modules Any use of the display device on other equipment or the use of another display device with a high density digital module may damage your equipment Reading Point States 1 Turn on power to the rack 2 Use the correct cable to connect the OptoTerminal G20 to the RJ 45 connector on a 32 channel module or the 4 pin connector on a 16 channel module 14 SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE As shown in the diagram below the OptoTerminal G20 displays the current state of all points on the module Point states are displayed as a bitmask Each binary digit represents the state of one point either on 1 or off o The top row shows points 31 16 and the bottom row shows points 15 0 I
30. the SNAP IDC 16 SNAP IAC 16 and SNAP IAC A 16 modules NOTE The connectors on these modules are not polarity specific You can connect the positive lead for each channel or point to either L1 or L2 and this can vary from point to point on the module Ei SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Pinouts 32 Channel Digital Input Modules The following pintout diagram applies to the SNAP IDC 32 module IMPORTANT The SNAP IDC 32 module is polarity specific and must be wired in source configuration as shown Do not wire the SNAP IDC 32 module in sinking configuration AAAAAAALA p J Ji CUE EA Ce CL eC LC CeCe eC eC KEKE G 10 32 VDC J t d s tee E 10 32 VDC mm 10 32 VDC 10 32 VDC SNAP High Density Digital Module User s Guide E INSTALLING MODULES Pinouts 32 Channel Digital Output Modules The 32 channel digital output modules include the SNAP ODC 32 SRC and SNAP ODC 32 SNK FUSING For both sourcing and sinking modules use one of the two fusing options shown in the first two output groups below All groups must be fused 12 24 VDC 12 24 VDC SNAP ODC 32 SRC SNAP ODC 32 SNK Load Sourcing Module Load Sinking Module 10 SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE
31. unting racks using the SNAP HD G4F6 header cable This cable allows older G4 digital output I O systems to take advantage of modern Opto 22 products like SNAP PAC controllers SNAP PAC brains and PAC Project software The header cable connects two G4PB16 G4PB16H or G4PB16HC mounting racks to one high density digital output module Comparing High Density and 4 Channel Digital Modules SNAP high density digital modules differ in several ways from 4 channel SNAP digital modules A few important differences are discussed below see the table on the next page for more Communication with the Processor One of the main differences between 4 channel and high density modules is in how the processor brain or on the rack controller communicates with them on the mounting rack Four channel SNAP digital modules communicate with the processor through direct wiring but SNAP high density modules communicate as analog and serial modules do over an internal bus built into the rack and using the processor s analog scanner This different communication method means that e Communication with the processor update time is generally slower Communication speed is affected by how busy the processor is that is how many modules it talks to and how many Ethernet communications the processor is handling at the same time SNAP High Density Digital Module User s Guide CHAPTER 2 SNAP HIGH DENSITY DIGITAL MODULE USER S GUIDE Counting Anothe
Download Pdf Manuals
Related Search