Thermal Test Board Design
Contents
1. 8 Figure 5 Heater Layout on the Test 9 Figure 6 Electrical Connections to Power the Heater on the Test Chip While Monitoring Voltade tona Posir eR Spo xA dU MEE DIES RETE 10 Figure 7 Schematic of Temperature Sensor 11 Figure 8 Example of Electrical Connections of Die Center Temperature Sensor for 4 Point Medasurerielib P RICO NT COD TaN nTa 12 Figure 9 Example of Four Wire Resistance Measurement Setup 13 Figure 10 Example of Thermal Die Sensor TS DC Characteristics Using a Four wire Resistance CallbEablOE uaa tik JR d ox ew c Ipae a x CC XA EU a aa 14 Figure 11 Temperature Measurement Setup 2 12 4 15 Figure 12 Thermal Solution and Still Air Chamber for Temperature Measurement 15 Figure 13 Mechanical Dimensions and Enabling Holes Location 19 Figure 14 Edge Fingers and Through hole Pin Headers 20 Figure 15 Constant Current Measurement Wiring 22 Tables Table 1 Heater Connectivity the Thermal Test 9 Table 2 Electrical Connections of the Temperature Sensor for 4 Po2. p Intel Atom Processor Series Thermal Test Board User Guide September 2010 Document Number 324473 001 ntel INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL PRODUCTS NO LICENSE EXPRESS OR IMPLIED BY ESTOPPEL OR OTHERWISE TO ANY INTELLECTUAL PROPERTY RIGHTS IS GRANTED BY THIS DOCUMENT EXCEPT AS PROVIDED IN INTEL S TERMS AND CONDITIONS OF SALE FOR SUCH PRODUCTS INTEL ASSUMES NO LIABILITY WHATSOEVER AND INTEL DISCLAIMS ANY EXPRESS OR IMPLIED WARRANTY RELATING TO SALE AND OR USE OF INTEL PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT NLESS OTHERWISE AGREED IN WRITING BY INTEL THE INTEL PRODUCTS ARE NOT DESIGNED NOR INTENDED FOR ANY APPLICATION IN WHICH THE FAILURE OF THE INTEL PRODUCT COULD CREATE A SITUATION WHERE PERSONAL INJURY OR DEATH MAY OCCUR Intel may make changes to specifications and product descriptions at any time without notice Designers must not rely on the absence or characteristics of any features or instructions marked reserved or undefined Intel reserves these for future definition and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to them The information here is subject to change without notice Do not finalize a design with this information The products described in this do
3. may result in inaccurate temperature measurements For more details on the differences between a two wire and four wire measurement refer to Appendix D Thermal Test Board User Guide E Intel Atom Processor E6xx Series Thermal Test Vehicle tel Figure 9 Example of Four Wire Resistance Measurement Setup Thermal Test Board Data Acquisition Unit The calibration procedure is as follows 1 e Connect the temperature sensor to a multi meter or a data acquisition unit that is capable of taking four wire resistance measurements Refer to the example shown in Figure 9 Place the thermal vehicle in a constant temperature bath using 0 C as the initial temperature setting Soak the unit for a sufficient amount of time in order to allow the thermal vehicle to reach thermal equilibrium with the bath Measure the resistance of the temperature sensor and record the thermal bath temperature Reset the temperature of the thermal bath to 309 C and continuously monitor the bath temperature and temperature sensor resistance Wait for a sufficient amount of time until the bath and thermal vehicle reach thermal equilibrium At thermal equilibrium the bath temperature and temperature sensor resistance will not change Record the bath temperature and temperature sensor resistance Repeat step 4 for 509 C and 70 C Perform a linear regression analysis on the measured data to determine a linear calibration curve Sensor Temp
4. to ensure that any added resistances in the sensor circuit are excluded from the sensor resistance measurement Four wires are provided for each sensor Two of the wires are used to provide a constant current through the temperature sensor to induce a voltage potential across the sensor The current supplied is 1mA The second pair of wires is used to measure the voltage drop across the temperature sensor This voltage drop is measured at the appropriate point on the ETB board and is equivalent to the voltage drop across the sensor The resistance in the sensor wiring will not affect the voltage measurement at the point on the ETB board The true resistance of the sensor can be calculated by applying the following expression Sensor Resistance Voltage Current In the example figure shown below the measured voltage is 0 195 V and the calculated sensor resistance is 195 0 195 V 0 001 A 1 The current supplied is 1 mA and it is maintained at a small amount to avoid heating up of the temperature sensor elements Recall that the power dissipated through a resistive element is calculated by Power Current x Resistance So for a sensor resistance of 195 2 and a measuring current of 0 001 Amps total power dissipated through the sensor 0 0002 Watts This power level is small and does not significantly affect the temperature of the sensor Thermal Test Board User Guide 21 m amp tel Appendix D 4 wire Constant Current M
5. 06 2 MATERIAL i amp mm THICK TYPE COPPER CLAD BOTH SEES 1 02 POR SOE COLOR HATURAL 3 PLATED THRU HOLES SMALL HAVE A WALL TWCKMESS OF 0 00 COPPER 4 SOLDERMASK BOTH SIDES USE LP OR EQUIVALENT COLOS GREEN 5 SIKSCREEN AS INDICATED USING WHITE NON CONDUCTIVE CAT L LIM amp OR B ALL HOLE SITES ARE FINISHED DIAMETER LOCATE HOLES WTHH 2 003 CENTER DF PADS 7 2 LAYERS BOARD FLL M WLS HOLE SITE WAS WITHM FRM TOP SIDE WAKE SUSE TEE SURFACE 5 FLAT AWD SAME WITH TEE REST OF THE BOA PADA All 2 az Creek Temi Board 2 Thermal Test Board User Guide 55496589 i 19 Ei tel Appendix Thermal Test Board Photos Appendix C Thermal Test Board Photos Figure 14 Edge Fingers and Through hole Pin Headers Top Edge Finger 1 Edge Finger 36 Bottom Edge Finger 1 Bottom Edge Finger 36 TI J PANEER ERED i uil nimiam miezh T through hole pin headers for temperature measurement and heater connections 20 Thermal Test Board User Guide B Appendix D 4 wire Constant Current Measurement Procedure tel Appendix D 4 wire Constant Current Measurement Procedure D 1 Constant Current Measurement Theory A four wire constant current temperature calibration and measurement method is recommended to obtain accurate temperature sensor resistance measurements This is a good way
6. CBGA thermal test vehicle to facilitate proper connections to the various heaters and temperature sensor structures Test vehicle structures are accessible through TTB as per information given in Appendix A Additionally a Gerber file for the TTB can also be available from your Intel representative This Gerber file can be modified to resemble a notebook planar board Please contact your Intel representative for obtaining any TTB boards or its Gerber file To use an FCBGA thermal test vehicle it must be surface mounted onto a test board The test vehicle structures can be accessed as per the pin ball map as shown in Appendix A Thermal Test Board User Guide E Intel Atom Processor Series Thermal Test Board tel 2 Intel Atom Processor Series Thermal Test Board The enabling thermal test board TTB designed for FCBGA type packages is 5 5 inches long and 4 inches wide Figure 3 shows the layout for the PCB designed by Intel to power and read temperature from the Intel Atom Processor E6xx Series thermal test vehicle through edge connector from 1 to 36 The connections are also designed for through hole pin headers temperature measurement from D1 to D9 for both A and B where A is the set of top tabs and B are connected to the tabs on the lower side of board The through via pairs are separately routed and are distinguished as x and y x being the on the higher tab number or placed to the le
7. brating this sensor voltage drop with respect to temperature one can determine the device temperature from voltage measurements Note Both measurement methods constant current and 4 wire resistance measurement produce comparable accuracy The choice of measurement method can be decided by the user depending upon the available instrumentation There are a total of 6 temperature sensors on the test chip TS_DC is recommended to mimic hot spots location on the actual processor silicon Table 2 Electrical Connections of the Temperature Sensor for 4 Point Measurement Test Test Type Name Measur Force Measure e High Low Low a TS_BL ON BL FH Dr BL FL V7 7 1 RES TS BR BR TS BR FH BR FH BR FL BR FL Al 1145 A ALR46 AL ALN45 Al ALM46 i DC F DC_F 1 DC Al BD17 Al ETUS Al PRES TS_RE RE TS RE _ TS FL RE_FL Al 1 45 ALAH4A AH44 ALAFA44 AF44 Al ALAG4S NA TS TL TS TL FH TS TL FL A1 AY6 A1 BB6 A1 AW7 A1 BA7 TS TR TS TR FH TS TR FL A1 AW45 A1 BB46 A1 AY46 A1 BA45 Thermal Test Board User Guide Intel Atom Processor E6xx Series Thermal Test Vehicle intel An example of the electrical connection schematic for the temperature sensors is illustrated in Figure 8 Here for 4 wire measurement a 1 mA constant current source is applied to the temperature sensor while a multi meter i
8. cument may contain design defects or errors known as errata which may cause the product to deviate from published specifications Current characterized errata are available on request Contact your local Intel sales office or your distributor to obtain the latest specifications and before placing your product order Copies of documents which have an order number and are referenced in this document or other Intel literature may be obtained by calling 1 800 548 4725 or by visiting Intel s Web Site Intel processor numbers are not a measure of performance Processor numbers differentiate features within each processor family not across different processor families See http www intel com products processor number for details Code Names are for use by Intel to identify products platforms programs services etc products in development by Intel that have not been made commercially available to the public i e launched or shipped They are never to be used as commercial names for products or intended to function as trademarks a Hyper Threading Technology requires a computer system with a processor supporting HT Technology and an HT Technology enabled chipset BIOS and operating system Performance will vary depending on the specific hardware and software you use For more information including details on which processors support HT Technology see http www intel com products ht hyperthreading more htm Intel High Definition Audi
9. e 6 nn 10 322 Temperature Sensor USdOdG PE DU 12 3 2 1 Temperature Sensor 12 3 2 1 1 Four Wire Resistance 12 3 2 2 Temperature Measurements 14 3 2 3 Thermal Solution and Still Air 15 TUNA E TT 16 Appendix A Thermal Test Board Design 1 17 Appendix B Thermal Test Board Dimensions 19 Appendix C Thermal Test Board PhotoS EE UP S cT I 20 Appendix D 4 wire Constant Current Measurement Procedure 21 D 1 Constant Current Measurement Theory 21 Thermal Test Board User Guide ntel Figures Figure 1 Side View of Thermal Test Vehicle Package 6 Figure 2 Top and Bottom View of Thermal Test Vehicle Package 6 Figure 3 Thermal Test Board Designed for the Intel Atom Processor E6xx Series TI UU TALI 7 Figure 4 Heater Dimension on the Test
10. easurement Procedure 22 Figure 15 Constant Current Measurement Wiring Diagram Temperature Sensor Constant Current Source Thermal Test Board User Guide
11. erature Sensor Resistance SLOPE INTERCEPT Refer to Figure 10 for the temperature sensor TS_DC calibration plot for the four wire measurement method Y 0 4787 241 04 Each sensor will vary from this performance curve and thus the example plot must not be used to determine temperature on any other sensors Thermal Test Board User Guide 13 tel Intel Atom Processor Series Thermal Test Vehicle 14 Figure 10 Example of Thermal Die Sensor TS_ DC Characteristics Using a Four wire Resistance Calibration 0 4787 241 04 R 0 9444 4 Wire Resistance Calibration for TS DC v gt 2 4M gt u E Lr 300 400 Resistance Ohm 3 2 2 Temperature Measurements After the temperature sensors are calibrated they can be used to determine sensor temperatures during thermal testing with the following procedure 1 Place the test vehicle in the system or thermal solution to be tested 2 Fora constant current method connect the temperature sensors of the test vehicle to a 1 mA constant current source and a voltage meter as shown in Figure 9 and Figure 12 For a 4 wire measurement use a setup similar to Figure 10 3 Power up the heaters in the test vehicle to the desired power level 4 Wait for the system to reach thermal equilibrium Record the sensor voltage drop or resistance for each of the temperature sensors Calcula
12. f the I2C bus protocol may require licenses from various entities including Philips Electronics N V and North American Philips Corporation BunnyPeople Celeron Celeron Inside Centrino Centrino Inside Core Inside FlashFile i960 InstantIP Intel Intel logo Intel386 Intel486 IntelDX2 IntelDX4 IntelSX2 Intel Atom Intel Atom Inside Intel Core Intel Inside Intel Inside logo Intel NetBurst Intel NetMerge Intel NetStructure Intel SingleDriver Intel SpeedStep Intel StrataFlash Intel Viiv Intel vPro Intel XScale Itanium Itanium Inside MCS MMX Oplus PDCharm Pentium Pentium Inside skoool Sound Mark The Journey Inside Viiv Inside vPro Inside VTune Xeon and Xeon Inside are trademarks of Intel Corporation in the U S and other countries Other names and brands may be claimed as the property of others Copyright 2010 Intel Corporation All rights reserved Thermal Test Board User Guide Contents M 6 2 Intel Atom Processor E6xx Series Thermal Test Board 7 3 Intel Atom Processor E6xx Series Thermal Test Vehicle 1 8 3 1 Thermal and Electrical Vehicle Characteristics 8 Jall CENT TTL T ETE T T 8 21 51 1 EEN DE Er PIU 8 3 1 1 2 Heater Connectivity and 8 3 1 2 Temperatur
13. ft side of the y P1 to P3 are designed for heater connection There are a total of 4 holes provided in the TTB for heat sink thermal solution attachment refer to Figure 13 Figure 3 Thermal Test Board Designed for the Intel Atom Processor E6xx Series Thermal Vehicle D7 I BE OO E e oO m T j Oo LE lo D6 DS D4 38358 24 33 32 31 3023 28 27 26 25 24 23 22 21 2019 18 17 16 15 14 13 12 11108 87 54 3 21 Thermal Test Board User Guide 7 m amp tel Intel Atom Processor Series Thermal Test Vehicle 3 Intel Atom Processor Series Thermal Test Vehicle 3 1 Thermal and Electrical Vehicle Characteristics This section describes the thermal attributes of the thermal test vehicle TTV electrical connections of the heater and temperature sensors temperature measurements and test vehicle specifications The thermal test vehicle includes heaters to simulate component power levels and temperature sensors to monitor the component temperatures 3 1 1 Heaters 3 1 1 1 Heater Dimension Figure 4 Heater Dimension on the Test Chip Heater Dimension 9250 x 9250 um gt 90 die area M9 width 33 um Min spacing 13 um M9 length approximately 911 um 2 v8 per M8 1 4 um x 10 um 8 width 2 5 um Pitch 8 41 um 8 length 9250
14. int Measurement 10 Table 3 Temperature Sensors and Heaters Connectivity 17 Thermal Test Board User Guide Revision History Initial Release June 2010 First SKU launch September 2010 Thermal Test Board User Guide 5 1 Introduction Introduction A thermal test board is provided by Intel to aid in embedded system thermal designs for the latest Intel embedded processor product Intel Atom Processor E6xx Series Figure 1 and Figure 2 show a side and top bottom view of the Intel Atom Processor E6xx Series thermal test vehicle FCBGA package Figure 1 Side View of Thermal Test Vehicle Package Figure 2 Top and Bottom View of Thermal Test Vehicle Package cA o oo Oo On x XUI OOOO OO o 0 00 8 ooo oc o 6666006001 ooo ooo D D D D D 0 D CO D OD 0 I oOo o i e ooo 34 o0 o 5050 rd o f LJ 5 e GO DO OOo Oi 5 e e 2070 oo UO Te eee o no OOO ot o o o oo ooo Ue G D Qo 505001 55 gt 0 x x T F 9 9 Y x T 5 The thermal test board TTB is designed to be used with F
15. ion or with any questions related to the usage of this product Thermal Test Board User Guide Appendix A Thermal Test Board Design tel Appendix A Thermal Test Board Design Table 3 Temperature Sensors and Heaters Connectivity Package TS i Side of Edge Pin Heater Board Finger Number Polarity CO ee ec maus _ s Measure nigh o mnm wm rem _ gt emm 8 m meme Teese non Peotone 7 ema uwe _ Peotone Ten meos _ mex as _ Cd ERE LT A ov emo measure nih men _ Thermal Test Board User Guide 17 tel Appendix A Thermal Test Board Design Package TS Side of Edge Pin Heater Board Finger Number Polarity P2 HTR_MH 1 15 Measure High 9 29 30 29 HTR Silicon HTR Half Silicon HTR Whole Silicon 18 Thermal Test Board User Guide Appendix B Thermal Test Board Dimensions ntel Appendix B Thermal Test Board Dimensions Figure 13 Mechanical Dimensions and Enabling Holes Location UNLESS OTHERWISE SPECIFIED T FABRICATE BOARD POR 0
16. o requires a system with an appropriate Intel chipset and a motherboard with an appropriate CODEC and the necessary drivers installed System sound quality will vary depending on actual implementation controller CODEC drivers and speakers For more information about Intel amp HD audio refer to http www intel com 64 bit computing on Intel architecture requires a computer system with a processor chipset BIOS operating system device drivers and applications enabled for Intel amp 64 architecture Performance will vary depending on your hardware and software configurations Consult with your system vendor for more information o Intel Virtualization Technology requires a computer system with an enabled Intel processor BIOS virtual machine monitor VMM and for some uses certain computer system software enabled for it Functionality performance or other benefits will vary depending on hardware and software configurations and may require a BIOS update Software applications may not be compatible with all operating systems Please check with your application vendor The original equipment manufacturer must provide Trusted Platform Module TPM functionality which requires a TPM supported BIOS TPM functionality must be initialized and may not be available in all countries I2C is a two wire communications bus protocol developed by Philips SMBus is a subset of the I2C bus protocol and was developed by Intel Implementations o
17. s used to measure the voltage across the temperature sensor Figure 7 Schematic of Temperature Sensor Locations Ts Temp Sensor Thermal Test Board User Guide 11 12 tel Intel Atom Processor Series Thermal Test Vehicle Figure 8 Example of Electrical Connections of Die Center Temperature Sensor for 4 Point Measurement Digital Voltmeter v m Voltage Sense Measure H Temperature Sensor Force H Current Force 1 mA 3 2 Temperature Sensor Usage Measure L Force L This section describes temperature sensor calibration and measurements 3 2 1 Temperature Sensor Calibration Before the thermal vehicle can be used for system thermal characterization the temperature sensors must be calibrated in the manner described in one of the following sections The sensors should be calibrated preferably in a constant temperature chamber otherwise the sensor will require a larger amount of time to soak and reach steady state 3 2 1 1 Four Wire Resistance Calibration A four wire resistance calibration requires the use of a multi meter or a data acquisition unit that is designed to accept inputs for a four wire measurement Each of the sensors should be instrumented in a manner similar to the one shown in Figure 9 Warning Do not use a two wire resistance measurement for calibration or thermal testing because it
18. te the temperature being measured by using the sensor voltage drop or resistance and temperature calibration charts for each sensor Thermal Test Board User Guide Intel Atom Processor Series Thermal Test Vehicle tel Figure 11 Temperature Measurement Setup EYER Powersupply Unit IPG 5 CEP ar ix LT 1ft x 1ft Still Air Chamber 3 2 3 Thermal Solution and Still Air Chamber Characterization has to be done with thermal solution Attached the thermal solution on the thermal test vehicle and place the thermal test board into still air chamber dimension 1ft x 1ft see Figure 12 Do not power the heaters without a system thermal solution attached to the die Figure 12 Thermal Solution and Still Air Chamber for Temperature Measurement Thermal Solution 1ft x 1ft Still Air Chamber Thermal Test Board User Guide 15 16 4 Note Summary This document describes how to use the Intel Atom Processor E6xx Series thermal test vehicle provided by Intel to aid in the design of embedded system thermal solutions To use the FCBGA thermal test vehicles a test board and sensor calibration is required To use FCBGA test vehicles it must be directly attached to a test board and then calibrated The information in this document is preliminary and subject to change Please contact your Intel representative for the latest available informat
19. um 3 1 1 2 Heater Connectivity and Locations Each group of five FH five FL bumps are shorted together on substrate and connected to 3 BGA each e 5 uvias and PTH is required on each layer for each FH and FL pinouts e For whole die heating connect HTR_FH MH and HTR_FL ML Otherwise half die heating Thermal Test Board User Guide Intel Atom Processor Series Thermal Test Vehicle 3 Table 1 Heater Connectivity the Thermal Test Vehicle HTR_FH 1 613 1 12 1 13 HTR_MH A1 H15 A1 G25 1 24 1 25 anes A1 G39 1 40 1 739 THES Figure 5 Heater Layout on the Test Chip 2 anging 8 line to enab 455 5 911 Thermal Test Board User Guide 9 tel Intel Atom Processor Series Thermal Test Vehicle Figure 6 Electrical Connections to Power the Heater on the Test Chip While Monitoring Voltage and Current Digital Voltmeter Heater Resistor Digital Current Meter 3 1 2 Temperature Sensors Resistive Temperature Detector RTD type temperature sensors are used Here the temperature sensors measure the die temperature by using a linear relationship between either the sensor resistance or the voltage drop across the resistor and the sensor temperature For example as the temperature increases the measured voltage drop across the temperature sensor increased for a given constant current condition By cali
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