COLOR MONITOR SERVICE MANUAL
Contents
1. 10026WR 06500 R1 16K AN Re 16K NAN R5 41 8K R6 2 2K 4 NAN ANN POWER UP FUN SW 4 SWe SW3 2 2 2 5 SS h 7 PASOS 3 9 4 3 9 4 3 e 14 EL T LC E C1 L eas 1 IC R4 i AS SS LW Q38G Q2R2 3KBL 1 5 6V MEN USE DOWN 6 6 SW6 SW5 SWA 2 2 _ 3 4 3 4 3 4 AN SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES CIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION S AE AND ELECTRICAL SHOCK HAZARDS SERVICING IF IS SECRET LG ELECTRONICS MUDEL was DATE AUS CRITICAL COMPONENTS IN THE N SYMBOL MARK OF THE SCHEMETIC LG Blectronics BLOCK CON TROL SHEET 1 1 Jan 2010 P NO MFL61926869 Printed in China2. PEO 1 o 1ur O 4uF o 1uF E J 5V MOD a L a R G E LRT T Ge H ee io Y A RIL A 3 ay d y N 0 0 wm Nn Y o QO U Oo A A 4 D lt O q O lt QoS ans inns 5 Y s Y ON IN IN 5 7 B GNDR 9 n gt RED A 1 2 GNDG d O Y3P A 1 2 3814 u NAN o D SDAA 1 2 6 TIMEA 1 2 gt GNDB ii SENA L se CLKOUTP A 4 2 pat o ELKOUTM A 4 2 9 AN 6 O HSYNC 1 2 O YEP A L 2 TDDBLU A 1 2 o Y2M A 4 2 e 9612 EB 0 AW V DD VSYNC 1 2 EA 1 2 0 Y 1M A 1 2 T 3813 g 1 YOP A 1 2 N s p scLa t 2 6 KNA 1t 2 0 A ID ST DET 1 2 L 6 a es Gia DD lO D 0 a UD TN IN in 0 de FO TE TS en g 0 O Ow 3 W 9 a P605 SMW200 11 kd IP4223CZ6_07_06_26 1 2 5VS O 5vS 1 2 IC1 BRAS APESBB3DMP ANN 1 LIPS_OFC 4 2 A604 Pr INVON 1 2 OD 3 3VA PL 1 2 2887 1 AN DIMADJ 4 2 5VS 1 2 Y gt 3 ND L 2 Boe8 it s NA AMPADJ 1 2 C604 R502 iur 4888F 5 1 C617 C618 0619 T ow e O 1UF 1UF 100pF 5601 L L READY 1 BVD 1 2 Use multi op
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4. CAUTION Please use only a plastic screwdriver to protect yourself from shock hazard during service operation Copyright 2 2007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only SERVICING PRECAUTIONS CAUTION Before servicing receivers covered by this service manual and its supplements and addenda read and follow the SAFETY PRECAUTIONS on page 3 of this publication NOTE If unforeseen circumstances create conflict between the following servicing precautions and any of the safety precautions on page 3 of this publication always follow the safety precautions Remember Safety First General Servicing Precautions 1 Always unplug the receiver AC power cord from the AC power source before a Removing or reinstalling any component circuit board module or any other receiver assembly Disconnecting or reconnecting any receiver electrical plug or other electrical connection Connecting a test substitute in parallel with an electrolytic capacitor in the receiver CAUTION A wrong part substitution or incorrect polarity installation of electrolytic capacitors may result in an explosion hazard d Discharging the picture tube anode Test high voltage only by measuring it with an appropriate high voltage meter or other voltage measuring device DVM FETVOM etc equipped with a suitable high voltage probe Do not test high voltage by drawing an arc Discharge the
5. q DIN N 0 BS ST DET 1 2 6 MAN N NINININ au CU WO LO a a 3 3VA PU A 2 Q c514 ee L olololololololo o n Sl e S ABV l OMAN aaa 2 AJA A AQ IQ LU L L L gt gt O SO O O OOOO OI LI gt gt gt L Ai DD N W alo D IO U DAN y a masa T t gij 4g LVB OW x501 TRsoessrga gt Y1M A 4 2 al anadacdacsana BSG Tra seme 5 PEE REEEEEE 7 VB1P BH 5 5 5 5 5 5 5 8 5 58 er Y APA 4 2 3883888588 VB2 3 4 46 DD YEM A 4 2 2 J 3 BVA PLI 4 2 1 9 A 2 AS VBe gt Y2P A 4 2 5 TSUM PFA R52 5 5 u201 x1 14 VBCKM 4 E T 7 TSUM1PFR CLKOUTM A 4 2 A VBCKP ie 6 eo 4 43 N 158 0502 7 42 LVBS i MN T EPS gt Y3M A 1 2 LAMPADU 1 2 REO C503 V SE e BLU A 4 2 l WV Ih DANG 9 5 41 Y3PA 1 2 hang 0501 ROS ae gan VAO ar KST3904 208 C504 e a aaa 40 L 4 7K E T we lHo 0270F Smp alale E ne IRIS SARE z gt VAOP a BB C505 slag BEN SEE See GAN A A 2 WV losa SEA 35588 2 S pe jag 338 S Been 1000pF 35 N N oa AA VA Tage DO 37 O 047UF R509 jee 36 LVWA2 RED A 4 2 0 WN 56 O 047UE 19 Wide 20 22 Wide Ges it f By 1440x900 By 1680x1050 era 35 LVAcP SYSTEM PROM TSUMAPFR TSUM18ER gt esos TSUM1B8ER 1 a gt TEN 34 LVA3 6 O a B U201 2 33 LVA3P x EEE HSYNC 4 2 L PEN Q 1 2 READY 4 IC503 0519 m 8 M24COBWMNET L P Yed CU Ox xl ol olni x olul o vololu Ck a LG UD G DO Z LO eee zZ ZEZ IDODIO NO O Q
6. picture tube anode only by a first connecting one end of an insulated clip lead to the degaussing or kine aquadag grounding system shield at the point where the picture tube socket ground lead is connected and then b touch the other end of the insulated clip lead to the picture tube anode button using an insulating handle to avoid personal contact with high voltage Do not spray chemicals on or near this receiver or any of its assemblies Unless specified otherwise in this service manual clean electrical contacts only by applying the following mixture to the contacts with a pipe cleaner cotton tipped stick or comparable non abrasive applicator 10 by volume Acetone and 90 by volume isopropyl alcohol 90 99 strength CAUTION This is a flammable mixture Unless specified otherwise in this service manual lubrication of contacts in not required Do not defeat any plug socket B voltage interlocks with which receivers covered by this service manual might be equipped Do not apply AC power to this instrument and or any of its electrical assemblies unless all solid state device heat sinks are correctly installed Always connect the test receiver ground lead to the receiver chassis ground before connecting the test receiver positive lead Always remove the test receiver ground lead last b Copyright 0712007 LG Electronics Inc All right reserved Only for training and service purposes 9 Use with this rece
7. propelled chemicals These can generate electrical charges sufficient to damage ES devices Do not remove a replacement ES device from its protective package until immediately before you are ready to install it Most replacement ES devices are packaged with leads electrically shorted together by conductive foam aluminum foil or comparable conductive material Immediately before removing the protective material from the leads of a replacement ES device touch the protective material to the chassis or circuit assembly into which the device will be installed CAUTION Be sure no power is applied to the chassis or circuit and observe all other safety precautions Minimize bodily motions when handling unpackaged replacement ES devices Otherwise harmless motion such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can generate static electricity sufficient to damage an ES device LGE Internal Use Only General Soldering Guidelines 1 Use a grounded tip low wattage soldering iron and appropriate tip size and shape that will maintain tip temperature within the range or 500 F to 600 F Use an appropriate gauge of RMA resin core solder composed of 60 parts tin 40 parts lead Keep the soldering iron tip clean and well tinned Thoroughly clean the surfaces to be soldered Use a mall wire bristle 0 5 inch or 1 25cm brush with a metal handle Do not use freon propelled spr
8. 0 LGE Internal Use Only LIPS Board Block Diagram EMI INPUT RECTIFIER ENERGY OUTPUT RECTIFIER COMPONENTS AND FILTER TRANSFER AND FILTER LINE 100 240V CONTROL COUPLER COLLENT CIRCUIT ISOLATION ION PRIMARY SECONDARY Operation description_Power 1 EMI components This part contains of EMI components to comply with global marketing EMI standards like FCC VCCI CISPR the circuit included a line filter across line capacitor and of course the primary protection fuse 2 Input rectifier and filter This part function is for transfer the input AC voltage to a DC voltage through a bridge rectifier and a bulk capacitor 3 Energy Transfer This part function is for transfer the primary energy to secondary through a power transformer 4 Output rectifier and filter This part function is to make a pulse width modulation control and to provide the driver signal to power switch to adjust the duty cycle during different AC input and output loading condition to achieve the dc output stabilized and also the over power protection is also monitor by this part 5 Photo Coupler isolation This part function is to feed back the DC output changing status through a photo transistor to primary controller to achieve the stabilized DC output voltage 6 Signal collection This part function is to collect the any change from the DC output and feed back to the primary through photo transistor Copyright 2007 LG Electronics Inc All right r
9. 3 3V ON OFF PORT 1 CONFIRM BRIGHTNESS OSD CONTRL STATUS 2 CHECK MICOM DIM ADJ PORT CHECK P605 PIN10 CHECK PULSE AS CONTACTING PROBE TO THE LAMP POWER BOARD LIPS WIRE OF THE LCD MODULE REPLACE LCD MODULE Waveforms Cee Ac NS at CH 18 Nep 3006 aT N MELON Copyright 072007 LG Electronics Inc All right reserved Only for training and service purposes 15 LGE Internal Use Only 3 NO RASTER OSD IS NOT DISPLAYED MAIN NO RASTER OSD IS NOT DISPLAYED CHECK U201 CHECK IC1 3 3V PIN51 3 3V IC1 1 8V PIN30 1 8V 1 CHECKPIN 1 2 SOLDERING CONDITION 2 CHECK X501 3 TROUBLE IN U201 U201 PIN 1 2 14 3MHZ CHECK U201 PIN16 H SYNC AND nr CHECK CONNECTION LINE IS PULSE APPEARED AT FROM D SUB TO U201 SIGNAL PINS YES TROUBLE IN CABLE OR LCD MODULE Waveforms Copyright 232007 LG Electronics Inc All right reserved Only for training and service purposes 16 LGE Internal Use Only 4 TROUBLE IN DPM TROUBLE IN DPM CHECK P611 AND CHECK PC R612 SYNC PC IS GOING APPEARED INTO DPM MODE YES CHECK U201 PIN 16 17 SYNC PULSE NO A CHECK H V SYNC LINE JE YES TROUBLE IN U201 Waveforms Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 18 LGE Internal Use Only EXPLODED VIEW
10. LG Website http biz LGservice com COLOR MONITOR CHASSIS NO LM84K MODEL FLATRON W19465 W1946S BFW Same model for Service CAUTION BEFORE SERVICING THE UNIT READ THE SAFETY PRECAUTIONS IN THIS MANUAL CONTENTS SPP IPIE ATIOND use se een 2 ADJUSTMENT use ea aaa aka a a ag aa dana ied 13 PRECAUTIONS PA RER ROBERT aaa el a E e e 4 TROUBLESHOOTING GUIDE a 15 TIMING CHART este einer an ag aaa aa dadan ers 6 EXPLODED VIEW ross 19 Bn I TT 9 BLOCK DIAGRAM niiin 190 SCHEMATIC DIAGRAM nennen 20 DESCRIPTION OF BLOCK DIAGRAM 11 SPECIFICATIONS 1 LCD CHARACTERISTICS 4 MAX RESOLUTION Type TFT Color LCD Module 1360 x 768 60Hz Active Display Area 18 5 inch diagonal Pixel Pitch 0 30 H x 0 30 V 5 POWER SUPPLY Size 430 3 H x 254 6 V x 16 5 D 5 1 Power Adaptor Built in Power Color Depth 16 7M colors Input AC 100 240V 50 60Hz 0 8A Electrical Interface LVDS AG Haze 25 Hard Coating 3H Normally White 2 CCFL Surface Treatment Operating Mode Backlight Unit 2 OPTICAL CHARACTERISTICS 2 1 Viewing Angle by Contrast Ratio gt Left 75 min 85 Typ Right 75 min 85 Typ Top 70 min 80 Typ Bottom 70 min 80 Typ 180 Typ Typ 10 SRGB 220 min 300 Typ 6500K 150 min 9300K 2 2 Luminance 2 3 Contrast Ratio 700 min 1000 Typ DFC gt 30000 1 Typ 3 SIGNAL Refer to the Timing Chart 3 1 Sync Signal e Ty
11. Q lt lt O O O gt CU Cs a QA IAQ gt gt SDATA Ww MI MIN OJOINS N VSYNC 1 2 1 MINA SILO NINA LT U UT NY T LCT LT LU olodo NIN NIN 14 8VD 1 2 7 lt I JJOO OIO OIO L LT l LT 1 0 a a g CS IOIO lt lt GIRS E 3 3VA PL 1 2 PGR D OU CU tyyty IC502 svsli 2 AWW an NG ral ey 20 52 no W25X20AVSNIG na rn D CSZI 755 GS ee e MAN 4 2 3 3VA PI so 0 HOLD 10K SCK aR Flashn _wPo A ae Nerv R527 eur u E Ll WU WU a loudly L Jem x Y H Y Q p C516 Z 3 zg B 6 068 R 30 0 1UF a O Q 5 0 0 oo 6 A O Q 2 3 gt E IN SY BOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES PECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION S FILRE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR LG ELECTRONICS E CRITICAL COMPONENTS IN THE i SYMBOL MARK OF THE SCHEMETIC LGElectronics MODEL Mstar 64pin Scaler Pcal DATE 9008 11 24 BLOCK scaer SHEET 1 42 J707 Fw10039 30 SVS 1 2 5vs l 2 c612 C613 C614
12. ay on cleaners Use the following unsoldering technique a Allow the soldering iron tip to reach normal temperature 500 F to 600 F Heat the component lead until the solder melts Quickly draw the melted solder with an anti static suction type solder removal device or with solder braid CAUTION Work quickly to avoid overheating the circuitboard printed foil Use the following soldering technique a Allow the soldering iron tip to reach a normal temperature 500 F to 600 F First hold the soldering iron tip and solder the strand against the component lead until the solder melts b Quickly move the soldering iron tip to the junction of the component lead and the printed circuit foil and hold it there only until the solder flows onto and around both the component lead and the foil CAUTION Work quickly to avoid overheating the circuit board printed foil Closely inspect the solder area and remove any excess or splashed solder with a small wire bristle brush IC Remove Replacement Some chassis circuit boards have slotted holes oblong through which the IC leads are inserted and then bent flat against the circuit foil When holes are the slotted type the following technique should be used to remove and replace the IC When working with boards using the familiar round hole use the standard technique as outlined in paragraphs 5 and 6 above Removal 1 Desolder and straighten each IC lead in one operatio
13. ead 6 Replace heat sink 2 3 Diode Removal Replacement 1 Remove defective diode by clipping its leads as close as possible to diode body Bend the two remaining leads perpendicular y to the circuit board Observing diode polarity wrap each lead of the new diode around the corresponding lead on the circuit board Securely crimp each connection and solder it Inspect on the circuit board copper side the solder joints of the two original leads lf they are not shiny reheat them and if necessary apply additional solder 2 3 o e Fuse and Conventional Resistor Removal Replacement 1 Clip each fuse or resistor lead at top of the circuit board hollow stake Securely crimp the leads of replacement component around notch at stake top Solder the connections CAUTION Maintain original spacing between the replaced component and adjacent components and the circuit board to prevent excessive component temperatures 2 3 LGE Internal Use Only Circuit Board Foil Repair Excessive heat applied to the copper foil of any printed circuit board will weaken the adhesive that bonds the foil to the circuit board causing the foil to separate from or lift off the board The following guidelines and procedures should be followed whenever this condition is encountered At IC Connections To repair a defective copper pattern at IC connections use the following procedure to install a jumper wire on the copper patte
14. eserved Only for training and service purposes ES LGE Internal Use Only ADJUSTMENT Windows EDID V1 0 User Manual 2 EDID Read amp Write 1 Run WinEDID exe Operating System MS Windows 98 2000 XP WinEDID V 1 Port Setup Windows 98 gt Doesn t need setup Windows 2000 XP gt Need to Port Setup This program is available for LCD Monitor only 1 Port Setup a Copy UserPort sys file to CAWINNTisystem32 drivers folder b Run Userport exe REMOVE Remove 2 Edit Week of Manufacture Year of Manufacture Serial Number a Input User Info Data b Click Update button c Click Write button c Remove all default number d Add 300 3FF UserPort Tomas Franzon c 2000 300 3FF 300 3FF al MEME e Click Start button f Click Exit button Copyright 2 2007 LG Electronics Inc All right reserved 12 LGE Internal Use Onl Only for training and service purposes een y SERVICE OSD 1 Turn off the power switch at the right side of the display 2 Wait for about 5 seconds and press MENU POWER switch for 1 second interval 3 The SVC OSD menu contains additional menus that the User OSD menu as described below a CLEAR ETI To initialize using time c Auto Color W B balance and Automatically sets the gain and offset value press key for over 3 sec d AGING Select Agi
15. iver only the test fixtures specified in this service manual CAUTION Do not connect the test fixture ground strap to any heat sink in this receiver Electrostatically Sensitive ES Devices Some semiconductor solid state devices can be damaged easily by static electricity Such components commonly are called Electrostatically Sensitive ES Devices Examples of typical ES devices are integrated circuits and some field effect transistors and semiconductor chip components The following techniques should be used to help reduce the incidence of component damage caused by static by static electricity 1 Immediately before handling any semiconductor component or semiconductor equipped assembly drain off any electrostatic charge on your body by touching a known earth ground Alternatively obtain and wear a commercially available discharging wrist strap device which should be removed to prevent potential shock reasons prior to applying power to the unit under test After removing an electrical assembly equipped with ES devices place the assembly on a conductive surface such as aluminum foil to prevent electrostatic charge buildup or exposure of the assembly Use only a grounded tip soldering iron to solder or unsolder ES devices Use only an anti static type solder removal device Some solder removal devices not classified as anti static can generate electrical charges sufficient to damage ES devices Do not use freon
16. n by gently prying up on the lead with the soldering iron tip as the solder melts Draw away the melted solder with an anti static suction type solder removal device or with solder braid before removing the IC Copyright 0712007 LG Electronics Inc All right reserved Only for training and service purposes Replacement 1 Carefully insert the replacement IC in the circuit board 2 Carefully bend each IC lead against the circuit foil pad and solder it Clean the soldered areas with a small wire bristle brush It is not necessary to reapply acrylic coating to the areas 3 Small Signal Discrete Transistor Removal Replacement 1 Remove the defective transistor by clipping its leads as close as possible to the component body Bend into a U shape the end of each of three leads remaining on the circuit board Bend into a U shape the replacement transistor leads Connect the replacement transistor leads to the corresponding leads extending from the circuit board and crimp the U with long nose pliers to insure metal to metal contact then solder each connection 2 3 4 Power Output Transistor Device Removal Replacement 1 Heat and remove all solder from around the transistor leads Remove the heat sink mounting screw if so equipped Carefully remove the transistor from the heat sink of the circuit board 4 Insert new transistor in the circuit board 5 Solder each transistor lead and clip off excess l
17. ng mode on off b Module To select applied module d NVRAM INIT EEPROM initialize 24C16 press key for over 3 sec e R G B 9300K Allows you to set the R G B 9300K value manually f R G B 6500K Allows you to set the R G B 6500K value manually 9 R G B Offset Allows you to set the R G B Offset value manually Analog Only h R G B Gain Allows you to set the R G B Gain value manually Analog Only Video Signal Generator Control Line Power inlet required Power Select Switch 110V 220V F V Sync On Off Switch Switch must be ON Figure 1 Cable Connection Copyright 2 2007 LG Electronics Inc All right reserved Only for training and service purposes edos LGE Internal Use Only TROUBLESHOOTING GUIDE 1 NO POWER NO POWER POWER INDICATOR OFF CHECK POWER BOARD AND FIND OUT A SHORT CHECK P605 VOLTAGE PIN5 PING 5V POINT AS OPENING EACH POWER LINE IS IC1 PIN1 3 3V CHECK IC1 3 3V IC1 PIN4 1 8V IC 1 1 8V LINE CHECK U201 PIN CHECK CRYSTAL X501 PULSE CHECK U201 Waveforms Copyright 072007 LG Electronics Inc All right reserved Only for training and service purposes a LGE Internal Use Only 2 NO RASTER OSD IS NOT DISPLAYED LIPS NO RASTER OSD IS NOT DISPLAYED CHECK P605 CHECK POWER BOARD VOLTAGE PIN5 6 LIPS 5V CHECK U501 INVERTER P605 PIN9
18. parts and labor guarantee TAKE CARE DURING HANDLING THE LCD MODULE WITH BACKLIGHT UNIT Must mount the module using mounting holes arranged in four corners Do not press on the panel edge of the frame strongly or electric shock as this will result in damage to the screen Do not scratch or press on the panel with any sharp A WARNING BE CAREFUL ELECTRIC SHOCK e If you want to replace with the new backlight CCFL or inverter circuit must disconnect the AC adapter because high voltage appears at inverter circuit about 650Vrms e Handle with care wires or connectors of the inverter circuit If the wires are pressed cause short and may burn or take fire Leakage Current Hot Check Circuit AC Volt meter Good Earth Ground such as WATER PIPE To Instrument s CONDUIT etc exposed METALLIC PARTS 1 5 Kohm 10W objects such as pencil or pen as this may result in damage to the panel e Protect the module from the ESD as it may damage the electronic circuit C MOS e Make certain that treatment person s body are grounded through wrist band e Do not leave the module in high temperature and in areas of high humidity for a long time e The module not be exposed to the direct sunlight e Avoid contact with water as it may a short circuit within the module e lf the surface of panel become dirty please wipe it off with a softmaterial Cleaning with a dirty or rough cloth may damage the panel
19. pe Separate Sync SOG Digital 3 2 Video Input Signal 1 Type R G B Analog 2 Voltage Level 0 0 7 V 3 Input Impedance 75Q 3 3 Operating Frequency Horizontal 28 61kHz Vertical 56 75Hz Copyright 2007 LG Electronics Inc All right reserved Only for training and service purposes 5 2 Power Consumption MODE H V SYNC VIDEO POWER CONSUMPTION LED COLOR less than 25 W max POWER ON NORMAL ON ON ACTIVE WHITE less than 22 W typ FF Frowensworr tessmanosw o 6 ENVIRONMENT 6 1 Operating Temperature 10 C0 35 C 50 F 95 F 6 2 Relative Humidity 10 80 Non condensing 6 3 MTBF 50 000 HRS with 90 Confidence level Lamp Life 50 000 Hours Min 7 DIMENSIONS with TILT SWIVEL 44 26cm 17 42 inches Width Depth 16 99 cm 6 68 inches Height 35 62 cm 14 02 inches 8 WEIGHT with TILT SWIVEL Net Weight 3 0 kg 6 66 lbs Saal 5 0 kg 11 11 lbs 2 LGE Internal Use Only PRECAUTION WARNING FOR THE SAFETY RELATED COMPONENT There are some special components used in LCD monitor that are important for safety These parts are marked on the schematic diagram and the replacement parts list lt is essential that these critical parts should be replaced with the manufacturer s specified parts to prevent electric shock fire or other hazard Do not modify original design without obtaining written permission from manufacturer or you will void the Original
20. pyright 072007 LG Electronics Inc All right reserved sge LGE Internal Use Only Only for training and service purposes DESCRIPTION OF BLOCK DIAGRAM 1 Video Controller Part This part amplifies the level of video signal for the digital conversion and converts from the analog video signal to the digital video signal using a pixel clock The pixel clock for each mode is generated by the PLL The range of the pixel clock is 85 5MHz In W1946S This part consists of the Scaler ADC convertor TMDS receiver and LVDS transmitter The Scaler gets the video signal converted analog to digital interpolates input to 1360X780 W1946S resolution signal and outputs 8 bit R G B signal to transmitter 2 Power Part This part consists of the one 3 3V and one 1 8V regulators to convert power which is provided 5V in Power board 12V is provided for inverter in W1946S Also 5V is converted 3 3V and 1 8V by regulator Converted power is provided for IC in the main board The inverter converts from DC 12V to AC 700Vrms and operates back light lamps of module in W1946S 3 MICOM Part This part is include video controller part And this part consists of FLASH ROM IC control data Reset IC and the Micom The Micom distinguishes polarity and frequency of the H V sync are supplied from signal cable The controlled data of each modes is stored in FLASH ROM Copyright 0712007 LG Electronics Inc All right reserved Only for training and service purposes 1
21. rn side of the circuit board Use this technique only on IC connections 1 Carefully remove the damaged copper pattern with a sharp knife Remove only as much copper as absolutely necessary 2 carefully scratch away the solder resist and acrylic coating if used from the end of the remaining copper pattern 3 Bend a small U in one end of a small gauge jumper wire and carefully crimp it around the IC pin Solder the IC connection 4 Route the jumper wire along the path of the out away copper pattern and let it overlap the previously scraped end of the good copper pattern Solder the overlapped area and clip off any excess jumper wire Copyright 0712007 LG Electronics Inc All right reserved Only for training and service purposes At Other Connections Use the following technique to repair the defective copper pattern at connections other than IC Pins This technique involves the installation of a jumper wire on the component side of the circuit board 1 Remove the defective copper pattern with a sharp knife Remove at least 1 4 inch of copper to ensure that a hazardous condition will not exist if the jumper wire opens 2 Trace along the copper pattern from both sides of the pattern break and locate the nearest component that is directly connected to the affected copper pattern 3 Connect insulated 20 gauge jumper wire from the lead of the nearest component on one side of the pattern break to the lead of the neares
22. t component on the other side Carefully crimp and solder the connections CAUTION Be sure the insulated jumper wire is dressed so the it does not touch components or sharp edges 6 LGE Internal Use Only TIMING CHART Frequency kHz Hz Back Resol Porch ution 400 Sync 08 1 640 480 gt em fe ree I 57 283 ress e er I e I S 800 600 160 800 600 gt 224 832 624 160 1024 768 176 1024 768 gt 256 1360 768 EICHE KAN KANA CN LEE LAN LAN LA LAN KA KANA LANA KANA LAB LAN LAN KA K N KANA KANA L eo CI KAN KA p pp ee epp er KA KA LEA KANA KANA LAA KAN KAN je pre mp aE Copyright 232007 LG Electronics Inc All right reserved Only for training and service purposes LGE Internal Use Only DISASSEMBLY Set 1 Change your lock on the product as it follows and turn it in the arrow direction 1 2 2 If you can t release the stand base even the locking knob is ata release position Please push the indicated knob down and retry it 3 Bad Position a Fasion Pushing the PUSH button Take the stand body from hinge body 4 1 Pull the front cover upward 2 Then let the all latches are separated 3 Putthe front face down Copyright 2007 LG Electronics Inc All right reserved un Only for training and service purposes LGE Internal Use Only BLOCK DIAGRAM Regulator x Y O gt 12V Ready AC input Co
23. tion 15601 A634 R626 W1941 W42 L42 1200hm 10V C602 ee US ILTER BEAD IF Necessary w53 54 Oohm gszo 18V 16V Wy READY TOUCH KEY READY TQ P603 2804 onm SMW200 06 are ES Era yang ED_GR 2 se 1 2 ah 1 2 5vs a502 ui en SVS 1 2 gy On gt 5v MOD ee 9 C608 N KEYO 1 al te Ye gt C A O O1UF er Os p Do Oo Do ii 100uF a N lt an KEY1 4 a LED_AM 4 a ES om on TRA gt KS S906 MTF ve TACT KEY G HG36 tA 2 B Q60 1 600 ohm 8532 SYS MODON vw pes SPATA A603 q READY TOUCH KEY 07 Te 3 5K F 4 gt Q 4 7uF 3933 C621 KAN gt LU A TUE SCLK READY TOUCH KEY Use multi option RGO7 W1941 W42 L42 Use i 7 54 All Read 10K Use multi option w53 y W1941 W42 L42 Use W53 54 All Ready THE ZN SYMBOL MARK OF THIS SCHEMETIC DIAGRAM INCORPORATES SPECIAL FEATURES IMPORTANT FOR PROTECTION FROM X RADIATION MODEL ATE FILAE AND ELECTRICAL SHOCK HAZARDS WHEN SERVICING IF IS SECRET MODEL star 64pin Scaler Pc DATE 2008 11 21 ESSENTIAL THAT ONLY MANUFATURES SPECFIED PARTS BE USED FOR LE ELELTRONILS THE CRITICAL COMPONENTS IN THE AN SYMBOL MARK OF THE SCHEMETIC GFlectronics BLULK POWER amp WA GHEET ey se Jt
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