Philips TDA8001 User's Manual
Contents
1. 10 LA Reset output to the card RST VIDLE output voltage in IDLE 0 4 V VoL LOW level output voltage lo 200 uA 0 45 V VoH HIGH level output voltage lon 200 uA 4 3 Voc V lou 10 LA Voc 0 7 Voc V trast delay between RSTIN and RST RST enabled see Fig 7 2 us Clock output to the card CLK VIDLE output voltage in IDLE 0 4 V VoL LOW level output voltage lo 200 uA 0 4 V VoH HIGH level output voltage lou 200 uA 2 4 Voc V lou 20 LA 0 7Vcc Voc V lou 10 LA Voc 0 7 Voc V t rise time C 30 pF note 2 14 ns tr fall time CL 30 pF note 2 14 ns duty factor C 30 pF note 2 45 55 Card programming voltage Vpp Vpp output voltage idle mode 0 4 V read mode Vcc 4 Vcc 4 V write mode Ipp lt 50 mA P 2 5 8 P 2 5 8 V Alpp At lt 40 mA 100 ns P 2 5 3 P 2 5 8 V note 4 lpp output current active from 0 to P 3 50 mA Vpp shorted to GND 100 mA SR slew rate up or down 0 3 0 4 0 5 V us High voltage input Vy Vu input voltage 30 V ly input current at Vu idle mode active mode 4 6 mA unloaded P 5V 5 9 mA P 125V 6 5 10 5 mA P 15V 7 11 mA P 21V 12 mA Vu Vpp voltage drop 2 2 V 1996 Dec 12 15 Philips Semiconductors Product specification Smart2. and ALARM become active and an automatic deactivation of the contacts is performed Clock circuitry see Fig 5 The clock signal CLK can be applied to the card in two different methods 1 Generation by a crystal oscillator the crystal or the ceramic resonator 4 to 16 MHz is connected to the XTAL pin 2 Use of asignal frequency up to 20 MHz already present in the system and connected to the XTAL pin via a 10 nF capacitor see Fig 14 In both cases the frequency is first divided by two If CMD7 respectively CMD3 5 is LOW the clock signal its frequency again divided by two is enabled and buffered before being fed to the CLK pin 1996 Dec 12 Product specification TDA8001 CMD3 5 and internal ENRST are sampled in order to give the first clock pulse the correct width and to avoid false pulses during frequency change The CLKOUT2 pins may be used to clock a microcontroller or an other TDA8001 The signal Vo fxtal is available when the circuit is powered up State diagram Once activated the circuit has six possible modes of operation e idle e Activation e Read e Write e Deactivation e Fault Figure 6 shows the way these modes are accessible IDLE MODE After reset the circuit enters the IDLE state A minimum number of circuits are active while waiting for the microcontroller to start a session e All card contacts are inactive e l O uC is high impedance e Voltage generators
3. Ltd Shivsagar Estate A Block Dr Annie Besant Rd Worli MUMBAI 400 018 Tel 91 22 4938 541 Fax 91 22 4938 722 Indonesia see Singapore Ireland Newstead Clonskeagh DUBLIN 14 Tel 353 1 7640 000 Fax 353 1 7640 200 Israel RAPAC Electronics 7 Kehilat Saloniki St TEL AVIV 61180 Tel 972 3 645 0444 Fax 972 3 649 1007 Italy PHILIPS SEMICONDUCTORS Piazza IV Novembre 3 20124 MILANO Tel 39 2 6752 2531 Fax 39 2 6752 2557 Japan Philips Bldg 13 37 Kohnan 2 chome Minato ku TOKYO 108 Tel 81 3 3740 5130 Fax 81 3 3740 5077 Korea Philips House 260 199 Itaewon dong Yongsan ku SEOUL Tel 82 2 709 1412 Fax 82 2 709 1415 Malaysia No 76 Jalan Universiti 46200 PETALING JAYA SELANGOR Tel 60 3 750 5214 Fax 60 3 757 4880 Mexico 5900 Gateway East Suite 200 EL PASO TEXAS 79905 Tel 9 5 800 234 7381 Middle East see Italy For all other countries apply to Philips Semiconductors Marketing amp Sales Communications a worldwide company Netherlands Postbus 90050 5600 PB EINDHOVEN Bldg VB Tel 31 40 27 82785 Fax 31 40 27 88399 New Zealand 2 Wagener Place C P O Box 1041 AUCKLAND Tel 64 9 849 4160 Fax 64 9 849 7811 Norway Box 1 Manglerud 0612 OSLO Tel 47 22 74 8000 Fax 47 22 74 8341 Philippines Philips Semiconductors Philippines Inc 106 Valero St Salcedo Village P O Box 2108 MCC MAKATI Metro MANILA Tel 63 2 816 6380 Fax 63 2 817 3474 Pola
4. TDA8001 5 V to 8805 micro controller alee nF pp RS LARM ALARM Vsup CVNC Vpp T A OFF TDA8001 12 V 25 V CONTROLLER GND DELAY GND1 12V 25vVy 2 14 MHz A 2 47 nF 1 The capacitor should be placed as close as possible to the IC 2 If pin Vy is not connected to 25 V it should be connected to Vpp Fig 14 Application in a pay TV decoder MGG831 1996 Dec 12 19 Philips Semiconductors Smart card interface PACKAGE OUTLINES DIP28 plastic dual in line package 28 leads 600 mil g plane I seatin fas 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions Product specification TDA8001 OT117 1 A UNIT max Ai min A2 max b c bp EM 5 1 0 51 4 0 36 0 35 0 14 1 13 7 inches 0 16 1 41 1 34 0 56 0 54 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not included OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT117 1 051G05 MO 015AH 419 92 44 47 95 01 14 1996 Dec 12 20 Philips Semiconductors Smart card interface Product specification TDA8001 S028 plastic small outline
5. and discharging an internal capacitor The voltage on this capacitor is then amplified by a power stage gain of 5 powered via an external supply pin Vy 30 V max DEACTIVATION SEQUENCE see Fig 8 When the session is completed the microcontroller sets the CMDVCC line to its HIGH state The circuit then executes an automatic deactivation sequence by counting the sequencer back e RST falls to LOW and CLK is stopped e l O uC becomes high impedance and Vpp falls to 0 V Vcc falls to 0 V Product specification TDA8001 The circuit returns to the IDLE mode on the next rising edge of the clock PROTECTIONS Main fault conditions are monitored by the circuit e Short circuit or overcurrent on Vec e Short circuit or overcurrent on Vpp e Card extraction during transaction e Overheating problem e Vsup drop out e Vpp drop out When one of these fault conditions is detected the circuit pulls the interrupt line OFF to its active LOW state and returns to the FAULT mode The current on I O is internally limited to 5 mA FAULT MODE see Fig 9 When a fault condition is written to the microcontroller via the OFF line the circuit initiates a deactivation sequence After the deactivation sequence has been completed the OFF line is reset to its HIGH state after the microcontroller has reset the CMDVCC line HIGH Vina Vhys2 Vin2 Vsup v th3 VDELAY o e l MGG818
6. card interface TDA8001 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Card supply voltage Vcc Voc output voltage idle mode active mode 0 4 V Icc lt 100 mA 4 75 5 25 V Alpp At lt 100 mA 100 ns 4 75 5 25 V note 4 loc output current Vec from O to 5 V 100 mA Vcc shorted to GND 200 mA SR slew rate up or down 0 3 0 4 0 5 V us 5 V reference output voltage CVNC Vovne output voltage at pin CVNC 4 5 5 0 5 5 V Icvnc output current at pin CVNC 50 mA Crystal connection XTAL Rxtal neg negative resistance at pin XTAL 2 MHz lt fi lt 16 MHz 300 Q note 5 V tal DC voltage at pin XTAL 3 0 4 0 V xtal resonant frequency 4 16 MHz external frequency 0 20 MHz Clock output CLKOUT2 foLKoUT2 frequency on CLKOUT2 1 8 MHz VoL LOW level output voltage lo 2 mA 0 4 V VoH HIGH level output voltage loH 200 LA 3 0 V loH 10 HA 4 0 V tr tr rise and fall times CL 15 pF note 2 25 ns duty factor C 15 pF note 2 40 60 Data line I O l O uC Vou HIGH level output voltage on 4 5 V lt Vsup lt 5 5 V 4 0 Vcc 0 1 V pin I O 4 5 V lt Vioc lt 5 5 V loH 20 HA 45 V lt Vsup lt 5 5 V 2 4 V 45V lt Vyoqc lt 5 5 V lon 200 uA VoL LOW level output voltage on lo 1 mA 100 mV pin I O 1 O uC grounded lit LOW level input current on l O uC grounded 500 LA pin l O uC Vou HIGH level output voltage on 4 5 V lt Vo l
7. depending on heating method Typical reflow temperatures range from 215 to 250 C Preheating is necessary to dry the paste and evaporate the binding agent Preheating duration 45 minutes at 45 C WAVE SOLDERING Wave soldering techniques can be used for all SO packages if the following conditions are observed e A double wave a turbulent wave with high upward pressure followed by a smooth laminar wave soldering technique should be used e The longitudinal axis of the package footprint must be parallel to the solder flow e The package footprint must incorporate solder thieves at the downstream end During placement and before soldering the package must be fixed with a droplet of adhesive The adhesive can be applied by screen printing pin transfer or syringe dispensing The package can be soldered after the adhesive is cured Maximum permissible solder temperature is 260 C and maximum duration of package immersion in solder is 10 seconds if cooled to less than 150 C within 6 seconds Typical dwell time is 4 seconds at 250 C A mildly activated flux will eliminate the need for removal of corrosive residues in most applications REPAIRING SOLDERED JOINTS Fix the component by first soldering two diagonally opposite end leads Use only a low voltage soldering iron less than 24 V applied to the flat part of the lead Contact time must be limited to 10 seconds at up to 300 C When using a dedicated tool
8. on Vcc and Vpp maximum load capacitor 150 nF 0 38 V us rise and fall tde deactivation cycle duration 75 100 125 us folk clock frequency 0 8 MHz Prot continuous total power TDA8001 Tamb 70 C 0 92 W dissipation see Fig 10 TDA8001T Tamb 70 C 2 W see Fig 11 Tamb operating ambient 0 70 C temperature 1996 Dec 12 Philips Semiconductors Smart card interface Product specification TDA8001 BLOCK DIAGRAM Vsup DELAY VDD GND1 ALARM VOLTAGE MAIN ee ALARN SUPERVISOR SUPPLY O uC VO RSTIN RST TDA8001 PRES OFF PRES DETECT __ PROTECTIONS CMDVCC Voc CMD7 GND2 CLOCK E TE CIRCUITRY CLKOUT2 VPP12 5 V VPP15 BE VPP21 MBH813 XTAL Vy Fig 1 Block diagram 1996 Dec 12 4 Philips Semiconductors Smart card interface Product specification TDA8001 PINNING PIN SYMBOL TDA8001 TDA8001A DESCRIPTION TDA8001T TDA8001AT XTAL 1 1 crystal connection DETECT 2 2 card extraction open collector output active LOW I O 3 3 data line to from the card RST 4 4 card reset output CLK 5 5 clock output to the card VPP12 5 6 control input for applying the 12 5 V programming voltage active LOW n c 6 not connected VPP15 7 control input for applying the 15 V programming voltage active LOW n c 7 not con
9. package 28 leads body width 7 5 mm Z 28 pin 1 index SOT136 1 e f nae a detail X 5 scale DIMENSIONS inch dimensions are derived from the original mm dimensions UNIT A max A1 A2 A3 bp c p EM e HE 2 65 18 1 17 7 7 6 74 inches 0 10 0 71 0 69 0 30 0 29 Note 1 Plastic or metal protrusions of 0 15 mm maximum per side are not included OUTLINE VERSION REFERENCES IEC JEDEC EIAJ EUROPEAN PROJECTION ISSUE DATE SOT136 1 075E06 MS 013AE EO 1996 Dec 12 21 Philips Semiconductors Smart card interface SOLDERING Introduction There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mounted components are mixed on one printed circuit board However wave soldering is not always suitable for surface mounted ICs or for printed circuits with high population densities In these situations reflow soldering is often used This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our IC Package Databook order code 9398 652 90011
10. resulting from such improper use or sale 1996 Dec 12 23 Philips Semiconductors Argentina see South America Australia 34 Waterloo Road NORTH RYDE NSW 2113 Tel 61 2 9805 4455 Fax 61 2 9805 4466 Austria Computerstr 6 A 1101 WIEN P O Box 213 Tel 43 1 60 101 Fax 43 1 60 101 1210 Belarus Hotel Minsk Business Center Bld 3 r 1211 Volodarski Str 6 220050 MINSK Tel 375 172 200 733 Fax 375 172 200 773 Belgium see The Netherlands Brazil see South America Bulgaria Philips Bulgaria Ltd Energoproject 15th floor 51 James Bourchier Blvd 1407 SOFIA Tel 359 2 689 211 Fax 359 2 689 102 Canada PHILIPS SEMICONDUCTORS COMPONENTS Tel 1 800 234 7381 China Hong Kong 501 Hong Kong Industrial Technology Centre 72 Tat Chee Avenue Kowloon Tong HONG KONG Tel 852 2319 7888 Fax 852 2319 7700 Colombia see South America Czech Republic see Austria Denmark Prags Boulevard 80 PB 1919 DK 2300 COPENHAGEN S Tel 45 32 88 2636 Fax 45 31 57 1949 Finland Sinikalliontie 3 FIN O2630 ESPOO Tel 358 9 615800 Fax 358 9 61580 xxx France 4 Rue du Port aux Vins BP317 92156 SURESNES Cedex Tel 33 1 40 99 6161 Fax 33 1 40 99 6427 Germany HammerbrookstraBe 69 D 20097 HAMBURG Tel 49 40 23 53 60 Fax 49 40 23 536 300 Greece No 15 25th March Street GR 17778 TAVROS ATHENS Tel 30 1 4894 339 239 Fax 30 1 4814 240 Hungary see Austria India Philips INDIA
11. specification TDA8001 VO uC CMD7 or CDMS RSTIN GND2 CLKOUT2 CMD3 5 or CDMTC CVNC VPP21 CMDVCC OFF ALARM ALARM DELAY VsuP MBH811 Fig 2 Pin configuration 20 CMDVCC 19 OFF 18 ALARM ALARM 16 DELAY Vsup MBH812 Fig 3 Pin configuration 1996 Dec 12 Philips Semiconductors Smart card interface FUNCTIONAL DESCRIPTION Power supply The circuit operates within a supply voltage range of 6 7 to 18 V Vpp and GND are the supply pins All card contacts remain inactive during power up or down POWER UP The logic part is powered first and is in the reset condition until Vpp reaches Vi The sequencer is blocked until Vpp reaches Vina Vhysa POWER DOWN When Vpn falls below Vina an automatic deactivation of the contacts is performed Voltage supervisor This block surveys the 5 V supply of the microcontroller Vsup in order to deliver a defined reset pulse and to avoid any transients on card contacts during power up or down of Vsup The voltage supervisor remains active even if Vpp is powered down POWER ON As long as Vsup is below Vin2 Vnys2 the capacitor CpeL connected to pin DELAY will be discharged When Vsup rises to the threshold level Cpe will be recharged ALARM and ALARM remain active and the sequencer is blocked until the voltage on the DELAY line reaches Vins POWER DOWN see Fig 4 If Vsup falls below Vine Cpe will be discharged ALARM
12. DIP SOLDERING BY DIPPING OR BY WAVE The maximum permissible temperature of the solder is 260 C solder at this temperature must not be in contact with the joint for more than 5 seconds The total contact time of successive solder waves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature Tsig max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit REPAIRING SOLDERED JOINTS Apply a low voltage soldering iron less than 24 V to the lead s of the package below the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds so REFLOW SOLDERING Reflow soldering techniques are suitable for all SO packages Reflow soldering requires solder paste a suspension of fine solder particles flux and binding agent to be applied to the printed circuit board by screen printing stencilling or pressure syringe dispensing before package placement 1996 Dec 12 Product specification TDA8001 Several techniques exist for reflowing for example thermal conduction by heated belt Dwell times vary between 50 and 300 seconds
13. Fig 4 Alarm and delay as a function of Vsup Cpe_ fixes the pulse width 1996 Dec 12 Philips Semiconductors Product specification Smart card interface TDA8001 ENCLK QH cos DD S CDMTC S SD S D QB CK Q D Q Qc CLK GA CK Q JOGA Ay QBA CMD7 or CDMS ZZ1100 CMD3 5 or CDMTC 101010 L CLK 240424 1 2 CLKOUT QB QC QD ENCLK QF CLK J l J LSFTLSIFLSILSF USF US LUI LI Lois L MGG827 Fig 5 Clock circuitry 1996 Dec 12 9 Philips Semiconductors Product specification Smart card interface TDA8001 ACTIVATION Lo res IDLE FAULT WRITE neo DEACTIVATION MGG820 Fig 6 State diagram OFF PRES DETECT CMDVCC VEILLE INTERNAL INTERNAL CLOCK Voc I O Vpp CMD3 5 CLK ENRST INTERNAL RSTIN RST ss ss PETER EDS SS Ta MGG828 tact Fig 7 Activation sequence 1996 Dec 12 10 Philips Semiconductors Product specification Smart card interface TDA8001 CMDVCC J VEILLE At to ea INTERNAL INTERNAL e Se Voc VO A RE N CMD3 5 Ca A NI ae S232 SE m E CLK l f E ENRST INTERNAL i RSTIN l RST l MGG829 lt tde Fig 8 Deactivation sequence PRES DETECT CMDVCC VEILLE INTERNAL INTERNAL CLOCK Voc VO Vpp CMD3 5 CLK ENRST INTERNAL RSTI
14. INTEGRATED CIRCUITS DATA SHEET TDA8001 Smart card interface Product specification 1996 Dec 12 Supersedes data of 1995 Feb 01 File under Integrated Circuits ICO2 Philips PHILIP Ss Semiconductors PH LI p Philips Semiconductors Smart card interface FEATURES Protected I O line rise and fall times Vpp generation 12 5 15 or 21 V 2 5 50 mA max APPLICATIONS Product specification TDA8001 e Pay TV multistandards conditional access system Vcc regulation 5 V 5 100 mA max with controlled videoguard newscript e Multi application smart card readers banking vending machine electronic payment identification with controlled rise and fall times only at TDA8001 and TDA8001T Clock generation up to 10 MHz with synchronous frequency doubling Overload thermal and card extraction protections Current limitation in case of short circuit Idle mode and special circuitry for spikes killing during powering on and off Two voltage supervisors digital and analog supplies Automatic activation and deactivation sequences GENERAL DESCRIPTION through an independent internal clock ORDERING INFORMATION Enhanced ESD protections on card side 4 kV min Easy chaining for multiple card readers ISO 7816 compatibility The TDA8001 is a complete low cost analog interface which can be positioned between an asynchronous smart card ISO 7816 and a microcontroller It is directly compatibl
15. N RST a gt gt gt dis SS MGG830 tde Fig 9 Deactivation after a card extraction during write mode 1996 Dec 12 11 Philips Semiconductors Product specification Smart card interface TDA8001 LIMITING VALUES In accordance with the Absolute Maximum Rating System IEC 134 SYMBOL PARAMETER CONDITIONS MIN MAX UNIT Vpo supply voltage 0 3 18 V Vw voltage on pins VPP21 VPP15 VPP12 5 PRES 0 Vpp V PRES CMDVCC OFF ALARM DETECT and RSTIN VH voltage on pin Vy 0 30 V Vpp voltage on pin Vpp 0 Vu V Vsup voltage on pin Vsyp 0 12 V Vo voltage on pins ALARM and DELAY 0 Vsup V Vig voltage on pins XTAL l O uC CLKOUT2 CMD7 0 6 0 V CMD3 5 and CVNC Vy4 voltage on pins I O RST CLK and Vcc duration lt 1 ms 0 7 0 V Prot continuous total power dissipation TDA8001 W Tamb 70 C note 1 see Fig 10 TDA8001T 0 92 W Tamb 70 C note 1 see Fig 11 Tstg storage temperature 55 150 C Ves electrostatic voltage on pins I O Vcc Vpp RST CLK 6 6 kV PRES and PRES electrostatic voltage on other pins 2 2 kV Note 1 Prot VD X IDp unloaded LI signals Icc X Vo Voc max VH Vpp x Ipp reaa VH VPP x IpP write VHX IH unloaded Vsup X Isyp Vpop CVNC x Iovnc where signals means all signal pins except supply pins 1996 Dec 12 12 Philips Semico
16. all other leads can be soldered in one operation within 2 to 5 seconds between 270 and 320 C Philips Semiconductors Product specification Smart card interface TDA8001 DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages
17. are stopped e Oscillator or XTAL input is running delivering CLKOUT2 e Voltage supervisors are active The DETECT line is HIGH if a card is present PRES and PRES active and LOW if a card is not present The OFF line is HIGH if no hardware problem is detected ACTIVATION SEQUENCE From the IDLE mode the circuit enters the ACTIVATION mode when the microcontroller sets the CMDVCC line active LOW The I O uC signal must not be LOW The internal circuitry is activated the internal clock starts and the sequence according to SO7816 is performed e Vcc rises from O to 5 V e Vpp rises from O to 5 V and I O is enabled e CLK and RST are enabled The time interval between steps 1 and 2 is 16 us and 64 us between steps 2 and 3 see Fig 7 Philips Semiconductors Smart card interface READ MODE When the activation sequence is completed and after the card has replied its Answer to Reset the TDA8001 will be in the READ mode Data is exchanged between the card and the microcontroller via the I O line WRITE MODE Cards with EPROM memory need a programming voltage Vpp When it is required to write to the internal memory of the card the microcontroller sets one of the VPP12 5 VPP15 and VPP21 lines LOW according to the programming value given in the Answer to Reset Vpp rises from 5 V to the selected value with a typical slew rate of 0 38 V us In order to respect the ISO 7816 slopes the circuit generates Vpp by charging
18. e with the new Datacom chip verifier The complete supply protection and control functions are realized with only a few external components making this product very attractive for consumer applications see Chapter Application information TYPE PACKAGE NUMBER NAME DESCRIPTION VERSION TDA8001 DIP28 plastic dual in line package 28 leads 600 mil SOT117 1 TDA8001A TDA8001T S028 plastic small outline package 28 leads body width 7 5 mm SOT136 1 TDA8001AT 1996 Dec 12 Philips Semiconductors Product specification Smart card interface TDA8001 QUICK REFERENCE DATA SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT VDD supply voltage 6 7 18 V IDD supply current idle mode Vpp 12 V 32 mA active modes unloaded 45 mA Vine threshold voltage on Vsyp 4 5 4 72 V Vina threshold voltage on Vpp 6 6 5 V Voc card supply voltage including static and dynamic 4 75 5 0 5 25 V loads on 100 nF capacitor loc card supply current operating 100 mA detection 150 mA limitation 200 mA VH high voltage supply for 30 V Vpp Vpp card programming including static and dynamic P 2 5 P 2 5 V voltage only at TDA8001 loads on 100 nF capacitor and TDA8001T P 5 12 5 15 and 21 V Ipp programming current operating 50 mA read or write mode detection 2 _75 mA limitation 100 mA SR slew rate
19. m Philips Semiconductors Ltd 276 Bath Road Hayes MIDDLESEX UB3 5BX Tel 44 181 730 5000 Fax 44 181 754 8421 United States 811 East Arques Avenue SUNNYVALE CA 94088 3409 Tel 1 800 234 7381 Uruguay see South America Vietnam see Singapore Yugoslavia PHILIPS Trg N Pasica 5 v 11000 BEOGRAD Tel 381 11 625 344 Fax 381 11 635 777 Internet http www semiconductors philips com Building BE p P O Box 218 5600 MD EINDHOVEN The Netherlands Fax 31 40 27 24825 Philips Electronics N V 1996 SCA52 All rights are reserved Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner The information presented in this document does not form part of any quotation or contract is believed to be accurate and reliable and may be changed without notice No liability will be accepted by the publisher for any consequence of its use Publication thereof does not convey nor imply any license under patent or other industrial or intellectual property rights Printed in The Netherlands 537021 1200 02 pp24 Philips Semiconductors Date of release 1996 Dec 12 Document order number 9397 750 01384 Lets make things beter S PHILIPS
20. n VPP12 5 VPP15 or VPP21 The tests for dynamic response of both Vpp and Vcc are performed at 1 Hz 10 kHz 100 kHz and 1 MHz with a capacitive load of 100 nF This condition ensures proper starting of the oscillator with crystals having a series resistance up to 100 O VOH 1 5V VoL ty gt a to gt MBH856 Fig 12 Definition of transition times 1996 Dec 12 17 Philips Semiconductors Product specification Smart card interface TDA8001 INTERNAL PIN CONFIGURATION XTAL DETECT VO uC O as VPP12 5 CMD7 as VPP12 5 RSTIN RST GND2 CLKOUT2 TDA8001 as VPP12 5 CMD3 5 CLK CVNC as VPP12 5 VPP21 as VPP12 5 CMDVCC OFF VPP12 5 ALARM VPP15 as VPP12 5 ALARM PRES as VPP12 5 PRES as VPP12 5 DELAY Vpp VH GND1 Vsup VDD Vec as VPP12 5 MBE257 Fig 13 Internal pin configuration 1996 Dec 12 18 Philips Semiconductors Smart card interface APPLICATION INFORMATION Product specification
21. nd UI Lukiska 10 PL 04 123 WARSZAWA Tel 48 22 612 2831 Fax 48 22 612 2327 Portugal see Spain Romania see Italy Russia Philips Russia UI Usatcheva 35A 119048 MOSCOW Tel 7 095 247 9145 Fax 7 095 247 9144 Singapore Lorong 1 Toa Payoh SINGAPORE 1231 Tel 65 350 2538 Fax 65 251 6500 Slovakia see Austria Slovenia see Italy South Africa S A PHILIPS Pty Ltd 195 215 Main Road Martindale 2092 JOHANNESBURG P O Box 7430 Johannesburg 2000 Tel 27 11 470 5911 Fax 27 11 470 5494 South America Rua do Rocio 220 5th floor Suite 51 04552 903 S o Paulo SAO PAULO SP Brazil Tel 55 11 821 2333 Fax 55 11 829 1849 Spain Balmes 22 08007 BARCELONA Tel 34 3 301 6312 Fax 34 3 301 4107 Sweden Kottbygatan 7 Akalla S 16485 STOCKHOLM Tel 46 8 632 2000 Fax 46 8 632 2745 Switzerland Allmendstrasse 140 CH 8027 ZURICH Tel 41 1 488 2686 Fax 41 1 481 7730 Taiwan PHILIPS TAIWAN Ltd 23 30F 66 Chung Hsiao West Road Sec 1 P O Box 22978 TAIPEI 100 Tel 886 2 382 4443 Fax 886 2 382 4444 Thailand PHILIPS ELECTRONICS THAILAND Ltd 209 2 Sanpavuth Bangna Road Prakanong BANGKOK 10260 Tel 66 2 745 4090 Fax 66 2 398 0793 Turkey Talatpasa Cad No 5 80640 GULTEPE ISTANBUL Tel 90 212 279 2770 Fax 90 212 282 6707 Ukraine PHILIPS UKRAINE 4 Patrice Lumumba str Building B Floor 7 252042 KIEV Tel 380 44 264 2776 Fax 380 44 268 0461 United Kingdo
22. nductors Product specification Smart card interface TDA8001 MBE256 MBE255 4 3 P a Prot W 3 2 2 i 1 0 0 50 0 50 100 150 50 0 50 100 150 Tamb C Tamb C Fig 10 Power derating curve DIP28 Fig 11 Power derating curve SO28 HANDLING Every pin withstands the ESD test according to MIL STD 883C class 3 for card contacts class 2 for the remaining Method 3015 HBM 1500 Q 100 pF 3 pulses positive and 3 pulse negative on each pin referenced to ground THERMAL CHARACTERISTICS SYMBOL PARAMETER VALUE UNIT Rin j a thermal resistance from junction to ambient in free air SOT117 1 30 K W SOT136 1 70 K W 1996 Dec 12 13 Philips Semiconductors Product specification Smart card interface TDA8001 CHARACTERISTICS Voo 12 V Vy 25 V Vsup 5 V Tamb 25 C unless otherwise specified SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT Supply Vo supply voltage 6 7 18 V IDD supply current idle mode Vpp 8 V 20 30 38 mA idle mode Vpp 18 V 22 34 42 mA active mode unloaded 35 45 55 mA Vind threshold voltage for power on 3 0 4 0 V reset Vina threshold voltage on Vpp falling 6 0 6 5 V Vhys4 hysteresis on Ving 50 200 mV Voltage supervis
23. nected PRES 8 8 card presence contact input active LOW PRES 9 9 card presence contact input active HIGH Vpp 10 card programming voltage output n c 10 not connected Vu 11 11 HIGH voltage supply for Vpp generation GND1 12 12 ground 1 Vpo 13 13 positive supply voltage Vec 14 14 card supply output voltage Vsup 15 15 voltage supervisor input DELAY 16 16 external capacitor connection for delayed reset timing ALARM 17 17 open collector reset output for the microcontroller active HIGH ALARM 18 18 open collector reset output for the microcontroller active LOW OFF 19 19 open collector interrupt output to the microcontroller active LOW CMDVCC 20 20 control input for applying supply voltage to the card active LOW VPP21 21 control input for applying the 21 V programming voltage active LOW n c 21 not connected CVNC 22 22 internally generated 5 V reference present when Vpp is on to be decoupled externally 100 nF CMD3 5 23 23 control input for having the crystal frequency divided by 4 at pin CLK or CDMTC CLKOUT2 24 24 clock output to the microcontroller or any other R4590 crystal frequency divided by two GND2 25 25 ground 2 RSTIN 26 26 card reset input from the microcontroller active HIGH CMD7 27 27 control input for having the crystal frequency divided by 2 at pin CLK or CDMS l O uC 28 28 data line to from the microcontroller 1996 Dec 12 Philips Semiconductors Smart card interface Product
24. or Vsup voltage supply for the supervisor 5 0 V Isup input current at Vsup 1 8 2 4 mA Vin2 threshold voltage on Vsup falling 4 5 4 72 V Vhys2 hysteresis on Vino 10 80 mV Vins threshold voltage on DELAY 2 35 2 65 V IDEL output current at DELAY pin grounded charge 5 2 LA Vpe 4 V discharge 6 mA VDEL voltage on pin DELAY 3 5 V ALARM ALARM open collector outputs loH HIGH level output current on Von 5V 25 LA pin ALARM VoL LOW level output voltage on lo 2 mA 0 4 V pin ALARM lot LOW level output current on Vo 0V 25 LA pin ALARM VoH HIGH level output voltage on loH 2 mA Vsup 1 V pin ALARM tg delay between Vsup and ALARM Cpe 47 nF see Fig 4 10 us toulse ALARM pulse width Cpe 47 nF 15 50 ms Interrupt lines OFF and DETECT open collector loH HIGH level output current VoH 5V 25 LA VoL LOW level output voltage lo 1 mA 0 4 V Logic inputs CMDVCC VPP21 VPP15 VPP12 5 CMD7 CMD3 5 PRES PRES and RSTIN note 1 VL LOW level input voltage 0 8 V Vin HIGH level input voltage 1 5 V lit LOW level input current Vu 0V 10 uA 1996 Dec 12 14 Philips Semiconductors Product specification Smart card interface TDA8001 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT lin HIGH level input current Vu 5V
25. t 5 5 V 4 0 Vsup 0 2 V pin I O uC VoL LOW level output voltage on louc 1 MA 70 mV pin I O uC I O grounded liL LOW level input current on pin I O I O grounded 500 LA 1996 Dec 12 16 Philips Semiconductors Product specification Smart card interface TDA8001 SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNIT VIDLE voltage on pin I O outside a 0 4 V session ZIDLE impedance on pin I O uC 10 MQ outside a session Rou internal pull up resistance 8 10 12 kQ between pin I O and Vcc tr tr rise and fall times Ci Co 30 pF 0 5 us Protections Tsd shut down local temperature 135 C Icc sd shut down current at Vcc 150 mA IpP sd shut down current at Vpp 75 mA IyO lim current limitation on pin I O from I O to l O uC 3 5 mA Timing tact activation sequence duration see Fig 7 110 us tde deactivation sequence duration see Fig 8 100 us ts start of the window for sending 70 us CLK to the card t5 end of the window for sending 80 us CLK to the card tst maximum pulse width on 30 us CMDVCC before Vcc starts rising Notes 1 Pins CMDVCC VPP21 VPP15 VPP12 5 CMD7 CMD3 5 and PRES are active LOW pins RSTIN and PRES are active HIGH t The transition time and duty cycle definitions are shown in Fig 12 6 aan ji la P is the card programming voltage set by pi
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