Philips TDA1015 User's Manual
Contents
1. Total quiescent current at Vp 12 V liot a a lt 25 mA A C CHARACTERISTICS Tamb 25 C Vp 12 V RL 4 Q f 1 kHz unless otherwise specified see also Fig 3 output power at dio 10 note 1 with bootstrap Vp 12V RL 4Q Po typ 4 2 W Vp 9V RL 4Q Po typ 2 3 W Vp 6V RL 4Q Po typ 1 0 W without bootstrap Vp 12V 240 Po typ 3 0 Voltage gain preamplifier note 2 typ 23 dB power amplifier Gye typ 29 dB total amplifier Gy tot typ 52 dB 49 to 55 dB Total harmonic distortion at 1 5 W typ 0 3 lt 1 0 Frequency response 3 dB note 3 B 60 Hz to 15 kHz Input impedance 2 gt 100 kQ preamplifier note 4 71 Bis 200 k power amplifier 742 typ 20 Output impedance preamplifier 7011 typ 1 kQ Output voltage preamplifier r m s value dig lt 1 note 2 typ 0 8 V Noise output voltage r m s value note 5 Rg 02 Vn rms typ 0 2 mV Rs 10 Vn rms typ 0 5 mV Noise output voltage at f 500 kHz r m s value B 5 kHz Rs 2 0 Q typ 8 uV Ripple rejection note 6 f 100 Hz RR typ 38 dB November 1982 5 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Notes 1 Measured with an ideal coupling capacitor to the speaker load 2 Measured with a load resistor of 20 3 Measured at P 1 W the frequency response is mainly determined by C1 and for the low frequencies and by C4 for the2. Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig 1 Circuit diagram November 1982 3 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 RATINGS Limiting values in accordance with Absolute Maximum System IEC 134 Supply voltage Vp max 18 V Peak output current lom max 25 A Total power dissipation see derating curve Fig 2 Storage temperature Tstg 55 to 150 C Operating ambient temperature Tamb 25 to 150 C A C short circuit duration of load during sine wave drive Vp 12 V tsc max 100 hours 7 5 7278628 2 Prot iwi HI oy 0 infinite TT N heatsink RII Caner DN aoc 25 ANNL withour TT AT heatsink E Ede aes e ur eee rq hehe EIE EE eg Bee 25 0 50 100 150 Tamb C Fig 2 Power derating curve HEATSINK DESIGN Assume Vp 12 V RL 4 Q Tamb 45 C maximum The maximum sine wave dissipation is 1 8 W 150 45 Rin ja Rth j tab Rth tab h Rth h a 58 K W Where Rihj a of the package is 45 K W so no external heatsink is required November 1982 4 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 D C CHARACTERISTICS Supply voltage range Vp 3 6 to 18 V Repetitive peak output current lt 2
3. ELE OSEE PEt Tt HHH p RE ERE Eu EE T ye 4 Er 8 eee ee lLiLLlL remm EREERE E ss 0 EEEEEBEEFEEFLEEEEEEELEEEEEEEEREBRDERSELEEEEET T 5 10 15 Vp 20 Fig 7 Output power across as function of supply voltage with bootstrap dig 10 typical values The available output power is 5 higher when measured at pin 2 due to series resistance of C10 November 1982 8 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 Fig 8 Voltage gain as a function of frequency Po relative to 0 dB 1 W 12 V 40 1 102 103 104 f Hz 105 72786371 LLILZ LTILLI Ht 4 7278636 1 Fig 9 Total harmonic distortion as a function of frequency P 1 W 12 V 40 November 1982 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 7278635 1 0 SE 1 10 R2 kQ 10 Fig 10 Ripple rejection as a function of R2 see Fig 4 Rs 0 typical values 7278633 1 600 pem PI IEEIBEE EE Eo ee ee i oo e ER ee el 08 00 n nV 400 200 1 10 R2 kQ 10
4. high frequencies Independent of load impedance of preamplifier Unweighted r m s noise voltage measured at a bandwidth of 60 Hz to 15 kHz 12 dB octave Ripple rejection measured with a source impedance between 0 and 2 maximum ripple amplitude 2 V The tab must be electrically floating or connected to the substrate pin 9 OD OU 2 T C2 C6 f ripple voltage 1uF R1 100 7289094 Fig 3 Test circuit November 1982 6 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 APPLICATION INFORMATION 2289095 Fig 4 Circuit diagram of a 1 to 4 W amplifier 7289097 0 10 20 Vp V 30 Fig 5 Total quiescent current as a function of supply voltage November 1982 7 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 HEE a a ae Fig 6 Total harmonic distortion as a function of output power across with bootstrap without bootstrap f 1 kHz typical values The available output power is 5 higher when measured at pin 2 due to series resistance of C10 7289096 Pt Eee ee a Ae Hun ncaa ttre 11 4 L
5. 2 Fig 11 Noise output voltage as a function of R2 see Fig 4 measured according to A curve capacitor C5 is adapted for obtaining a constant bandwidth November 1982 10 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 7278632 1 Vols SELLE N AE 10 Hep 111 Ss me SR SB a H e HHE E ETE f MHz Fig 12 Noise output voltage as a function of frequency curve a total amplifier curve b power amplifier B 5 kHz Rs 0 typical values 7278634 1 eer ups sp 1 pz p 98 0 SS ee IE 1 10 R2 9 102 Fig 13 Voltage gain as a function of R2 see Fig 4 November 1982 11 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 PACKAGE OUTLINE SIL9MPF plastic single in line medium power package with fin 9 leads SOT110 1 o c 5 E o eo DIMENSIONS mm are the original dimensions A2 max UNIT A3 A4 b by bo 37 8 7 40 e 8 0 14 1 1 Note 1 Plastic or metal protrusions of 0 25 mm maximum per side are not i
6. INTEGRATED CIRCUITS DATA SHEET TDA1015 1 to 4 W audio power amplifier Product specification November 1982 File under Integrated Circuits 01 Philips PHILIPS Semiconductors D L Philips Semiconductors 1 to 4 W audio power amplifier The TDA1015 is a monolithic integrated audio amplifier circuit in a 9 lead single in line SIL plastic package The device is especially designed for portable radio and recorder applications and delivers up to 4 W in a 4 load impedance very low applicable supply voltage of 3 6 V permits 6 V applications Special features are single in line SIL construction for easy mounting separated preamplifier and power amplifier high output power thermal protection high input impedance low current drain limited noise behaviour at radio frequencies QUICK REFERENCE DATA TDA1015 Product specification Supply voltage range Peak output current Output power at dio 10 Vp 12V RL 42 Vp 9V RL 4Q Vp 6V RL 4Q Total harmonic distortion at P 1 W RL 4 O Input impedance preamplifier pin 8 power amplifier pin 6 Total quiescent current Operating ambient temperature Storage temperature 121 121 ltot Tamb 3 6 to 18 max 2 5 typ 4 2 typ 2 3 typ 1 0 typ 0 3 gt 100 typ 20 typ 14 25 to 150 55 to 150 SSS 25 PACKAGE OUTLINE 9 lead SIL plastic SOT110B SOT110 1 1996 August 13 November 1982 2
7. ncluded OUTLINE REFERENCES EUROPEAN VERSION JEDEC EIAJ PROJECTION SOT110 1 E Q 95 02 25 ISSUE DATE November 1982 12 Philips Semiconductors Product specification 1 to 4 W audio power amplifier TDA1015 SOLDERING Introduction There is no soldering method that is ideal for all IC packages Wave soldering is often preferred when through hole and surface mounted components are mixed on one printed circuit board However wave soldering is not always suitable for surface mounted ICs or for printed circuits with high population densities In these situations reflow soldering is often used This text gives a very brief insight to a complex technology A more in depth account of soldering ICs can be found in our IC Package Databook order code 9398 652 90011 Soldering by dipping or by wave The maximum permissible temperature of the solder is 260 C solder at this temperature must not be in contact with the joint for more than 5 seconds The total contact time of successive solder waves must not exceed 5 seconds The device may be mounted up to the seating plane but the temperature of the plastic body must not exceed the specified maximum storage temperature max If the printed circuit board has been pre heated forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit Repairing soldered joints Apply a low voltage soldering i
8. r selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips for any damages resulting from such improper use or sale November 1982 13
9. ron less than 24 V to the lead s of the package below the seating plane or not more than 2 mm above it If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds If the bit temperature is between 300 and 400 C contact may be up to 5 seconds DEFINITIONS Data sheet status Objective specification This data sheet contains target or goal specifications for product development Preliminary specification This data sheet contains preliminary data supplementary data may be published later Product specification This data sheet contains final product specifications Limiting values Limiting values given are in accordance with the Absolute Maximum Rating System IEC 134 Stress above one or more of the limiting values may cause permanent damage to the device These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied Exposure to limiting values for extended periods may affect device reliability Application information Where application information is given it is advisory and does not form part of the specification LIFE SUPPORT APPLICATIONS These products are not designed for use in life support appliances devices or systems where malfunction of these products can reasonably be expected to result in personal injury Philips customers using o
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