Navman JUPITER LA000267 User's Manual
Contents
1. F4 WAKEUP l Push to Fix wake up active high F5 N_WAKEUP O low output indicates baseband is powered up DO NOT CONNECT F6 TXB O CMOS level asynchronous output for UART B F7 ECLK l external clock input not used Table 2 1 Jupiter 32 Module pad functions LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 14 0 0 05 16 0 0 05 34 PADS 1 0mm DIA SHIELD CENTRED ON PCB ON GRID 1 8 CENTRES CENTRED WITHIN PCB All dimensions in mm 0 30 2 7 0 20 Figure 2 1 Jupiter 32 mechanical layout 2 2 Typical application circuit The schematic in Figure 2 2 next page represents a very basic application circuit with simple interfaces to the module It is subject to variations depending on application requirements 2 2 1 Power for receiver and active antenna The receiver power connection requires a clean 3 3 VDC Noise on this line may affect the performance of the GPS receiver When an active antenna is used the DC power is fed to it through the antenna coax This requires the user to apply the antenna DC voltage to pad A4 of the module A 2 85V 30mA supply is made available on pad F3 if the chosen antenna can accept that voltage This supply is under the command of the TricklePower energy control The source impedance of the power supply must be kept sufficiently low The capacit2. JN NAVMAN Jupiter 32 Miniature 20 channel GPS receiver module Integrator s Manual ON Related documents e Jupiter 32 Product Brief LA000268 e Jupiter 32 Data Sheet LAQ00267 e Jupiter Development Kit Guide LA000645 e Low Power Operating Modes Application Note LA000513 e Jupiter 32 30 Saving and retrieving configuration data to Flash and Selectable user profiles Application Note LA000266 e Navman NMEA Reference Manual MN000315 e SIRF Binary Protocol Reference Manual MN000314 LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice Contents 1 0 IMtHOGUCTION ciiiniisesacevsiessedssscsdeasees jetancontesancdeaccueueeuadeetacesdieonsleadedaabestveteesesocescacs 1 2 0 Hardware application information ccccccceecceeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeeees 1 2 1 Electrical connections SMT pad interface ccccceeeceeeeeeeeeeeeeeeeeeeeseceeeeneeeetsnaeenenes 2 2 2 Typical Application CCUM eessen a O 3 2 2 1 Power for receiver and active Antenna ccccecceeeeeeeeeteeeeeeeeeeeeeeeeneeeeeeeeaeeees 3 2 2 2 GlOUNGING PEE E E E E A E E E ee ana 3 222 BAD SCOUPIMNG ia oa A O O sd auadieaiiviae 5 2 2 4 Serial RS232 data level Shifter 0 cccccccceccceeeececeeeeeeeseeeeceneeeeseaeeeeeeeesseeeesaaees 5 2 3 PCB design recommendations jeter A aa E TA 5 2 9 1 Choice of PCB Stack UD visvesseatedscaseveunsbot
3. cycles are performed and that the maximum reflow temperature recommended by the solder paste manufacturer is not exceeded The maximum ramp up rate of 3 C sec for leaded solder or 4 C sec for lead free solder should not be exceeded Navman recommends that rework and repair is carried out in accordance with the following guidelines e IPC 7711 Rework of Electronic Assemblies e IPC 7721 Repair and Modification of Printed Boards and Electronic Assemblies For proper removal of the part special nozzles should be used for local heating of the part to avoid reflow of adjacent parts The PCB assembly should be preheated to about 75 C from the bottom using convective pre heaters and the preheated nozzle should be lowered LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 16 on the part The proper nozzle should also heat the component leads by either hot gas or hot bar The ideal reflow profile should be the same as the one used for mounting the part and depends upon the paste used The reflow zone can be shortened as long as the reflow is complete The part should then be lifted off automatically during the transition from reflow to cool down cycles using a vacuum 4 1 9 Site Redress and Cleaning Once the part is removed the site needs to be cleaned for attachment of a new package This may be done by vacuum de soldering or wick Low temperature blad
4. in the antenna For example this can happen if its cable gets crushed in a car door Warning The Jupiter 32 module antenna power feed does not have internal current limiting Damage can occur if unlimited current is permitted to flow through the module antenna power feed components The circuit shown in Figure 2 8 next page will provide over current protection LAO00605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 10 70 mA Antenna supply current limit L3 SUPPLY_INPUT 120R 100 MHz ANTENNA_SUPPLY 3 5VDC C C v_ANT Figure 2 8 Simple current limiter circuit NOTE Ensure that the In rush current of your active antenna does not cause it to approach the current limit Transistor Q1 serves as a series pass transistor Q2 is used to sense the current in the antenna circuit turning off Q1 if the voltage across the current sense resistor R1 exceeds 0 6V This circuit does not turn off the supply to the antenna but merely limits it to a safe value With the components shown the supply will be limited to approximately 70 mA Other options are available to provide this function MAXIM can supply a current trip IC that will turn off the load if a preset supply current is exceeded The part number for this is MAX4785 The circuit is shown in Figure 2 9 Antenna current limit using an IC antenna short circuit sense signal L2 120
5. 0 when read at 23 5 C b condition 3a or 3b not met 5 If baking is required devices may be baked for 48 hours at 125 5 C Note If device containers cannot be subjected to high temperature or shorter bake times are desired reference IPC JEDEC J STD 033 for bake procedure Bag seal date __L__ If blank see adjacent bar code label Note Level and body temperature defined by IPC JEDEC J STD 020 Figure 3 1 Moisture Barrier Bag Label All dimensions in mm 100 0 2 rrr Figure 3 2 Reel dimensions LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 13 250 per reel g A 2 S Q COoOCCHEECSCSCSOCSOSOOSOCHOOSOOHO GOGO EO OF Tt Direction of Feed 3 2 0 10 0 35 0 05 13 30 0 10 All Dim in mm mi 17 3 0 10 Figure 3 3 Jupiter 32 Packaging LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 4 0 Manufacturing process recommendations The Jupiter 32 uses the latest Land Grid Array LGA technology Solder interconnect is formed solely by solder paste applied to the board assembly This results in a low stand off height depending on solder paste volume and Printed Circuit Board PCB geometry This makes LGA ideal for small form factor applications Solder joint reliability studies indicate that LGA greatly exceed t
6. 00 and 255 inclusive Note In each case CS represents an NMEA checksum This checksum is detailed in the Navman NMEA reference manual MN000315 Acknowledgements All input commands other than the standard SiRF commands will be acknowledged with a sentence of the form PTTK CS Where the arguments provided to a command are invalid the response will be the message PTTK NACK CS Checksums All input commands are accepted whether or not they include a checksum however if a checksum is included it must be correct in order for the message to be accepted Incorrect checksums will result in the response PTTK CHECKSUM CS Unused messages Input messages where the message ID is not between 100 and 255 or where the message ID does not correspond to a specified function result in the response PTTK INVALID CS LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 18 Errors Errors in message receipt other than checksum errors result in the response PTTK ERROR xx CS where xx is a hexadecimal error code Magnetic Variation Declination The Jupiter 32 module does not calculate the magnetic variation 5 4 Navman proprietary NMEA low power mode messages Navman has added a number of proprietary NMEA input messages to configure the TricklePower and Push To Fix modes 5 4 1 Low power configuration The following message sets the receiver
7. Active GPS antenna connecting coax carrying GPS signals and DC gt power for amplification Application PCB Jupiter module coaxial connector fitted to application PCB Figure 2 5 Arrangement of active antenna and application board LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 6 The modules can be used with a passive patch antenna if the connection to the antenna input is very short It is possible to mount the patch antenna on the same PCB as the module but to reduce the possibility of digital noise it is recommended that the antenna be mounted on the opposite side of the board to the module Figure 2 6 shows an example of a PCB design integrating a passive patch antenna FR4 Ground fibreglass plane Ground via PCB Passive patch antenna Jupiter32 module 50 ohm microstrip Figure 2 6 Cross section of application board with passive patch antenna 2 3 5 Design of 50 ohm microstrip antenna connection When designing the signal track from the antenna connection to the antenna input on the module a controlled impedance microstrip with a characteristic impedance of 50 ohms at 1 5GHz must be used The PCB parameters that affect impedance are as follows 1 Track width W 2 PCB substrate thickness H 3 PCB substrate permittivity 4 To a lesser extent PCB copper thickness T and proxim
8. GPS product is that the antenna is a stable electrical centre which is coincident with the geometric centre and insensitive to the rotation and inclination of the antenna The main parts of the construction of the antenna consists of a the omnidirectional antenna element b the antenna preamplifier electronics and c a ground plane though not always present The industry has widely adopted the patch antenna as the most common and practical design There are two major types of GPS antenna patch antennas passive and active The active antenna has a built in LNA Low Noise Amplifier to increase the strength of the signal and to compensate for the signal loss in a long cable connection LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 8 The features of each type of antenna are shown in Table 2 4 comparing an externally mounted active antenna with a passive patch antenna mounted on the same PCB as the module antenna requires close proximity to receiver yes no consumes power can be mounted remote from receiver gives good performance in poor signal situations has built in additional filtering low cost requires a coaxial connector Table 2 4 Passive and active Patch antenna features 2 4 2 Active antenna An active antenna comprises a passive antenna with a built in LNA that requires a power supply Active an
9. IATION sessies dened atenneeiiee diene eenendneaceieeceaiese 19 5 4 2 Low power acquisition Configuration cccccccececeececeeeeeeeeeteneeeeeeeeeseneeeeeeeees 19 5 5 Save and Retrieve Configuration Data to Flash ce eceeeeeeeteeeeeeeeeteeeeeeenteeeeeeeaas 20 92001 Writing to Flas Avice ccistttecceeviiecdiestiatcneneivdans n E TE 20 5 5 2 Retrieving from Flash 0 cece eeeeeee eee inania a aA aE 20 5 5 3 Reverting to default SettingS c ccccesceeeecceeseeeeeeeeeeeeeaeeeseeeeeeaeseeeneeeseueeeseaeees 20 5 6 Selectable User Profiles drins eieaa aeii a iaa 21 5 7 GPSI ODU eea E ie ENEA E E a ENEE 21 5 8 Custom application SoftWare cccceeceecceececeeeeceecececeeeseaaeseceeeeseaeesseseesecieeeeeneeeeas 21 6 0 Glossary and aCronyMS isis ascites ienaa inanuia nanana aaae iaaa ii 22 LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice Figures Figure 2 1 Jupiter 32 mechanical IAyoUt sssrecsnriernsn 3 Figure 2 2 Basic Jupiter 32 application CirCuit eee ee cence eeeecteeeeeeetteeeeeeenteeeeeeenaees 4 Figure 2 3 Example PCB layout for external active antenna ccccecceeeeteteteeeeeteees 4 Figure 2 4 Decoupling Capacitor Placement ccccecceceeceeceeeeeeeeeeeeeeeeaeeeeseeeetseeeeeaeees 5 Figure 2 5 Arrangement of active antenna and application board cceeeeeeees 6 Figure 2 6 Cross s
10. R 100 MHz c4 ce JN NAVMAN 100 nF 18 pF ii Jupiter 32 GND antenna power enable _ PWR_IN Jupiter GPS Module Figure 2 9 External Active Antenna Control and Current Limit circuit Electro resistive fuses can be used to protect the supply over current These are available from Bourns Vitromon and other manufacturers 2 5 Jupiter adapter printed circuit board The Jupiter 32 module supplied in the Development Kit is mounted on a carrier PCB in a method typical of a customer application This carrier PCB illustrates and implements many of the design considerations discussed in this integrator s manual The module is interfaced through a downward facing 20 pin data connector The RTC Real Time Clock backup supply voltage can be provided by an on board lithium cell or from the Development unit backup supply The adapter board carries a switch debounce IC to provide reliable reset action from the Development unit Figure 2 10 next page shows the adapter board with the positions of the connectors and indicators LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 11 J2 J1 on bottom side not loaded Figure 2 10 Jupiter 32 adapter board Refer to Table 2 6 for a description of the connector interfaces Jupiter function J2 2 54 mm pitch header pin no
11. VANT 1 no connection 2 VBATT 3 VDD 4 N_RESET 5 reserved 6 reserved 7 BOOT 8 reserved 9 RF_ON 10 TXA 11 RXA 12 reserved 13 TXB 14 RXB 15 WAKEUP 16 GND 17 reserved 18 1PPS N_GPS_FIX Table 2 6 Connector configuration LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 12 3 0 Packaging and delivery Jupiter 32 modules are shipped in Tape and Reel form The reeled modules are shipped with 250 units per reel Each reel is dry packaged and vacuum sealed in an Moisture Barrier Bag MBB with two silica gel packs and placed in a carton All packaging is ESD protective lined The Jupiter 32 GPS receiver is a Moisture Sensitive Device MSD level 3 Please follow the MSD and ESD handling instructions on the labels of the MBB and exterior carton See Figures 3 1 3 2 and 3 3 CAUTION This bag contains MOISTURE SENSITIVE DEVICES 1 Calculated shelf life in sealed bag 12 months at lt 40 C and 90 relative humidity RH 240 If blank see adjacent bar code label 2 Peak package body temperature 3 After bag is opened devices that will be subject to reflow solder or other high temperature process must be a mounted within hours at factory conditions If blank see adjacent bar code label lt 30 C 60 RH or b stored at lt 10 RH 4 Devices require baking before mounting if a humidity indicator card is gt 1
12. X3232 Note It is highly recommended to provide test points on the serial data lines and BOOT signal pad C4 even if the application circuit does not use these signals This will allow the user to connect to these signals if a firmware upload or new configuration is required These test points can take the form of an unfitted through hole connector Refer to Figure 2 2 2 3 PCB design recommendations The modules are surface mounted devices hence the layout of the application PCB plays an integral part in the overall performance of the finished system It is not difficult to design such a PCB despite the presence of high frequency low level radio signals The following recommendations have been offered to allow the designer to create a design that will meet the requirements of this product Figure 2 1 shows the copper pad dimensions and layout 2 3 1 Choice of PCB stack up In general a two layer PCB substrate can be used with all the RF signals on one side Multi layer boards can also be used The design recommendations here only address the microstrip style of RF connection Stripline designs can also be accommodated however long lengths of stripline can cause excessive signal loss and vias in the signal track should be avoided 2 3 2 Ground plane design A complete ground plane should be used under the PCB with signal tracks on the same layer as the module The ground return for any signal should ideally have a cl
13. aaadeacestaraeesasanguassuhede ee 15 41 2 Solder paste Mask SZE noaei E eatin lane eae nee 15 41 3 Solder paste Stent Senenin ina E tn aaa 15 4 1 4 Reflow profile recommendations c cccceececeeceeececeeeeeeeeeceaeeeseeeeseeneeeseeeeeas 15 AAS COAING on na AEN AAO a 16 41 6 POstireflow Wa SMAG acct csteaceiees etches andeebatenu aaa TE a EEE 16 ATOPE Da N secon a O eedeaebandiaas 16 ALO ROWO Kaoa a hagerydid Mhdagdanvsdadaadit viadatelsiadaadientaadaaetaiddeneetid 16 4 1 9 Site Redress and Cleaning cscnonecrornn enon R A R 17 4 1 10 Application of Solder Paste nesnresscicnncionni aion a a a 17 4 1 11 Placement and Attachment of the New Component ccceceeeeteseeeerteees 17 5 0 Software application information ccccceessseseeceeeeeeeeeeseeeeeeeeeeeeeeeeeenes 17 5 1 Normal Mode Operation sanina a anaa EAEE 17 5 2 Power management ccceeceesecceceteeecteeeecseeceeeeeneneceaeenseecaaeunesesaeqeeseneceaeenseeeeeeneanees 17 5 2 1 Adaptive TricklePower mode ecccceceeeeeeeeeceeeeeeneeaeeeeeeeeeeeeeseeceeneaceeeeeeenes 17 9 2 2 PuSh tO FIXIMOGG aicseivscdcenesveecenteiy ten aceesstecncutenvecanedeay R 18 5 3 Seral N O meeer i a aA A EE C viene 18 5 31 Default S ttingS sariren eenst ainar E aE TEES AAO n AELOD ASNE 18 5 3 2 NMEA input command S arimia N A N NEn 18 5 4 Navman proprietary NMEA low power mode messages ccceeeeeeeeeeeeeeeeeeeeeeeeeees 19 94 1 Low power CONMQU
14. ance of the power supply and PCB track width determine the overall source impedance If a passive antenna is used the supply must be able to provide a minimum of 100mA continuously with minimal ripple as measured at the power input pin This ripple requirement must be adhered to for a larger current flow when an active antenna is used In rush current for some active antennas have been measured as high as 70mA and may cause a dip in voltage or ripple Therefore a low source impedance is important since the power to the Jupiter 32 must be able to accommodate instantaneous currents in excess of 200mA 2 2 2 Grounding Separate analogue and digital grounds are not used However the antenna signal ground uses a particular layout for optimum results See Figure 2 3 next page and Section 2 3 5 for ground plane recommendations and for design considerations involving the antenna input and the 50 ohm microstrip connection LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 3 Jupiter 32 Reference Design 3 0 3 6V a 1uF 10nF Battery nF 1uF LNVA tY du 90A 4 Nld Md 1 4 LIVdA zd Coaxial Connector 50 ohm Microstrip N_GPS_FIX D4 r See Section 2 5 TXA D7 JN NAVMAN Jupiter 32 O C4 BOOT 1PPS E7 Figure 2 2 Basic Jupiter 32 application circuit Pads of J32 module lt Edge of Jupiter32 module Through hole vias Anten
15. ated by reference Reader response Navman strives to produce quality documentation and welcomes your feedback Please send comments and suggestions to tech pubs navman com For technical questions contact your local Navman sales office or field applications engineer LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 23
16. ation position fix It will stay in sleep mode until woken by wakeup input and compute a fresh position If the ephemeris data become invalid or new satellites come into view the RTC has the ability to self activate and refresh the data thus keeping the restart TTFF very short This mode yields the lowest power consumption of the module and is ideal where a battery powered application requires very few position fixes For further information on the TricklePower and Push To Fix modes refer to the Low Power Operating Modes application note LA000513 5 3 Serial I O The module can output serial data in the NMEA format or SiRF Binary format The serial I O protocols are defined in the Navman NMEA reference manual MN000315 and the SiRF Binary Protocol reference manual These describe the format of the serial data from the module as well as the structure of the commands Navman has provided additional functionality to the NMEA protocol as detailed in the following sections 5 3 1 Default settings The default protocol is NMEA at a baud rate of 9600bps The frame format is 8 data bits no parity bit and 1 stop bit The following messages are output by default at a rate of once per second each GPGGA GPGLL GPGSA GPGSV GPRMC GPVTG GPZDA All output messages have checksums by default 5 3 2 NMEA input commands All NMEA input commands are in the form PSRFxxx CS lt cr gt lt lf gt where xxx is a decimal number between 1
17. cover close to the antenna called the superstrate will cause the resonant frequency and efficiency of the antenna to drop It is therefore recommended to keep any distance to the superstrate to a minimum of 3mm from the top surface of the patch See Table 2 5 for recommended characteristics of both passive patch and active antennas for use with the Jupiter receiver LAO00605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 9 polarisation receive frequency L1 right hand circular polarised 1 57542 GHz 1 023 MHz Characteristic Active antenna Passive antenna right hand circular polarised 1 57542 GHz gt 1 023 MHz power supply 3V typ 5V max lt 10mA at 3VDC 7 2 to 5dBi with 1dB loss max in connections DC current antenna gain total gain includes Z lt 26 dBi Jupiter 20 antenna gain LNA lt 18 dBi Jupiter 32 gain and cable loss axial ratio lt 3dB output VSWR lt 2 5 Table 2 5 Recommended antenna characteristics Note GPS active and passive antenna selection must include practical TTFF tests in weak and strong outdoor environments noting peak and average signal strength measurements This must be done in comparison with the antenna supplied in the Development kit Performance results and signal strength measurements must be comparable to the reference anten
18. e style conductive tools in conjunction with de soldering braids can also be used Once all residual solder is removed the site should be cleaned with appropriate solvent such as alcohol and a lint free swab 4 1 10 Application of Solder Paste For a precise and uniform solder paste deposition on the redressed site it is recommended that a miniaturized stencil for the individual component be used The stencil should be aligned under 50x to 100x magnification depending on the part After precise alignment the stencil should be lowered onto the PCB and the paste should be applied in one pass 4 1 11 Placement and Attachment of the New Component The new part should be placed on the site using a split beam alignment where a dual image of the part leads and the land pattern on the PCB can be viewed on a high resolution monitor Once aligned the part should be placed on the site and attached to the board using the reflow profile used for the part removal 5 0 Software application information 5 1 Normal mode operation In normal mode of operation the baseband processor software runs continuously providing a navigation solution at the maximum rate of once per second No power saving functions are applied If the power to the module is disrupted the restart time can be shortened to a warm or hot start by keeping the RTC and SRAM contents valid with a backup battery on the VBATT input If the module has been turned off for longer than 2 hou
19. ear path back to its source and should not mix with other signal s ground return paths For this reason RF signal ground underneath the microstrip antenna connection should not be shared with any digital signal or power supply return paths Pads A2 and B1 are the RF signal ground return connections LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 5 2 3 3 Decoupling components The recommended values for power and signal decoupling are shown in Table 2 2 The placement of these components must ensure that the low value capacitors have very short connections to the module pad and to the ground plane 1 uF 10 nF 27 pF 27 pF 27 pF 27 pF 27 pF 27 pF 1nF 1 UF 1 nF 10nF 27 pF N_GPS_FIX D4 GPIO ALL WAKEUP F4 LNA_EN C5 1PPS E7 Note represents a parallel connection Table 2 2 Decoupling recommendations 2 3 4 Antenna connection The PCB layout design of the antenna input connection requires the appropriate selection of PCB track width substrate material and careful attention to the layout geometry If this overall system is not implemented correctly the module will receive poor GPS signals and therefore provide inferior navigation data Figure 2 5 shows an example of a PCB design integrating an external active antenna connected via an MCX or SMA coaxial connector
20. eceeesenseeneas 12 Table 5 1 Low power modes message values eeecceeeeeeeeeeeeeeeeeteteeeeeettteeeeeetnneeeeerene 19 Table 5 2 Low power acquisition input VAlUCS ee eceeeeceeeeeeeeeeeteneeeeeeetteeeeeetnaeeeeeeens 19 Table 5 3 Actions based on Signal State cece eeeeeeeeeeeeeneeeeseeeeeeeeseeeaeeeeeseaaeeees 20 LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 1 0 Introduction The Navman Jupiter 32 module is a complete GPS receiver designed for surface mount assembly integration The Jupiter 32 provides a simple cost effective GPS solution for application designers Application integration will vary primarily with respect to antenna system design and EMI protective circuitry The Jupiter 32 is the successor to the established Jupiter 30 being electrically compatible and having a very small form factor The provides an easy migration path for existing users requiring very small packaging low cost high volume greater sensitivity lower power consumption and a faster fix Basic operation requires a power supply GPS antenna system interface relevant EMI protection and the design and layout of a custom PCB This document outlines the following design considerations and provides recommended solutions Hardware application information This section introduces the system interface and provides the following physical speci
21. ection of application board with passive patch antenna 06 7 Figure 2 7 PCB microstrip dimensions ccccceeeeeeeeeeseeeeeeeeeeeeeeeceneeteseaeeeeseeeesnaneeenaeees 7 Figure 2 8 Simple current limiter CirCuit 0 cccccccccceeesceeeeeeeeeeeeeeeeeeeeeaaeeseeeeeeseaeeesenes 11 Figure 2 9 External Active Antenna Control and Current Limit circuit 0000 cceeeeeee 11 Figure 2 10 Jupiter 32 adapter board essosscnicrirsorrenri Grinn nE 12 Figure 3 1 Moisture Barrier Bag Label ccecceeeeeeeeeeeeeeeneeeeeeenaeeeeeeenaeeeeeeeenieeeeeneaas 13 Figure 3 2 Reel GIMGNSIONS ee visssieeterscteseens O O 13 Fig re 3 3 J piter 32 PaCkaQing isseviccccevecsewecediteviadesceesvedessceteteeedeectedsaseceeteneventeaneneeente 14 Figure 4 1 Sample Lead and Lead free reflow profile c cccecceeeceeeeeeeeseeeeeteeeeeenees 16 Tables Table 2 1 Jupiter 32 Module pad fUNC ONS siisii aaa 2 Table 2 2 Decoupling recommendations ccccceceeeeeeeeeeeeeeeeeeetiteeeeeetiteeeeeeeneeeeeeeeaa 6 Table 2 3 PCB substrate thicknesses v track width cccccceeeeeceeeeeeeseeeeeeeeeeetnteeeeaes 7 Table 2 4 Passive and active Patch antenna features cc ccccceeeeeeceeeeeeeeeeeeeetteeetenes 9 Table 2 5 Recommended antenna characteristics cc ccceeeeeeeeeeeeeeeeeeeeeeeeeeetteeeeeeene 10 Table 2 6 Connector Configuration cccccccccceeeeeeeeceeeeceeeesesaeeeseneeseaeeesesees
22. er velocities TricklePower Power saving mode for battery applications See Low Power Operating Modes Application Note LA000513 Push to Fix Only performs a fix when requested For use in special applications See Low Power Operating Modes Application Note LA000513 Command The profiles will be selected by an NMEA command PSRF197 n lt cr gt lt lf gt where n is the profile number 1 Automotive 2 Pedestrian 3 TricklePower 4 Push to Fix Refer to Application Note LA000266 5 7 GPS fix output The GPS fix output is an active low output on pin 23 of the module Whenever the unit has either a 2D or a 3D fix this output will be low When the unit has no fix the output will be high 5 8 Custom application software The module provides custom modification of the firmware to use available CPU processing capacities and I O capabilities The custom application software can be invoked internally or externally providing the ability to dedicate the module as the host application or an external processor as the host The module also provides the ability to communicate externally with standard or customer specific communication protocols The custom application software has access to the flash memory navigation data from the GPS Navigation software and access to various I O lines used on the module This can be developed using the SIRF SDK The SDK provides all the tools and resources necessary for custom software development Refe
23. ew type coupling mechanism The connector has a 50 Q impedance SRAM Static Random Access Memory SMT Surface mount technology SMT is a method for constructing electronic circuits in which the components are mounted directly onto the surface of printed circuit boards TTFF Time To First Fix The actual time required by a GPS receiver to achieve a position solution This specification will vary with the operating state of the receiver the length of time since the last position fix the location of the last position fix and the specific receiver design LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 22 Push To Fix and TricklePower are registered trademarks of SiRF Technologies 2007 Navman New Zealand All Rights Reserved Information in this document is provided in connection with Navman New Zealand Navman products These materials are provided by Navman as a service to its customers and may be used for informational purposes only Navman assumes no responsibility for errors or omissions in these materials Navman may make changes to specifications and product descriptions at any time without notice Navman makes no commitment to update the information and shall have no responsibility whatsoever for conflicts or incompatibilities arising from future changes to its specifications and product descriptions No license express or implied b
24. fications a electrical connections SMT pad interface b mounting PCB pad layout dimensions c manufacturing recommendations d application circuit interface It also discusses fundamental considerations when designing for RF and presents the antenna system design overview This covers the following topics a PCB layout b antenna system design choices A sample solution is presented and discussed Due to the nature and complexity of GPS signals it is recommended that application integrators adhere to the design considerations and criteria described in this document Software application information This section provides answers to some common questions that might not have been covered in the above topics 2 0 Hardware application information The Jupiter 32 module provide 34 Land Grid Array LGA pads for electrical connections The sections that follow introduce the physical and relative functional specifications for application integration Note The electrical connections can carry very low level GPS signals at 1 57542 GHz The layout must be designed appropriately with consideration of the frequencies involved LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 1 2 1 Electrical connections SMT pad interface The round hole on the front label side of the chip locates pad A1 The pads are designated A F and 1 7 Details of the pad layo
25. ity of same layer ground plane Figure 2 7 shows a representation of the PCB microstrip and its parameters W 4 H Ei Figure 2 7 PCB microstrip dimensions T Table 2 3 shows typical track widths for an FR4 material PCB substrate permittivity of 4 3 at 1 5 GHz and different PCB thickness The effect of track thickness T can be ignored for the short track lengths associated with this design a a k H mm 1 6 2 0 1 2 1 8 1 0 1 6 FR4 4 3 0 8 1 4 0 6 1 2 0 4 0 7 0 2 0 4 Table 2 3 PCB substrate thicknesses v track width LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 7 Notes 1 If a multi layer PCB is used the thickness is the distance from signal track to nearest ground plane 2 If the antenna connection is routed under the module the track width should be approximately halved for that section only It is recommended that the antenna connection PCB track should be routed around the outside of the module outline kept on a single layer and have no bends greater than 45 degrees It is not recommended for production reasons to route track under the module but if track has to route under the module it should have a modified track width and solder mask to avoid short circuits to the underside of the module To minimise signal loss and reduce the requirement for vias it is recom
26. ld be optimised and proven out as part of an overall process development The following guidelines represent good soldering practices to help yield high quality assemblies with minimum rework It is important to provide a solder reflow profile that matches the solder paste supplier s recommendations Some fluxes need a long dwell time below the temperature of 180 C while others will be burned up in a long dwell Temperatures out of bounds of the solder paste flux recommendation could result in poor solderability of components on the board Solder paste suppliers can recommend an suitable reflow profile to give the best solderability The maximum reflow temperature is 260 C for 10 seconds The typical reflow profile consists of four sections In the preheat section the PCB assembly should be preheated at the maximum rate of 1 to 2 C sec to start the solvent evaporation and to avoid thermal shock The assembly can then be heated for 60 to 120 seconds to remove solder volatiles and activate the flux so the temperature of the package rises above 100 C The reflow section of the profile the time above liquidus approx 185 C can be between 45 to 60 seconds with a peak temperature in the range of 230 to 260 C This allows all solder joints on the assembly to fully reflow and a maximum peak temperature that is below the maximum that the devices or solder material can tolerate Finally the assembly can undergo cool down in the fourth sectio
27. mended the signal track not be placed on an inner layer of a multi layer PCB The PCB track connection to the RF antenna input must e have a characteristic impedance of 500hm e be as short as possible e be interfaced to a coaxial connector if an external antenna is used e have max clearance to ground on the same layer or at least be half the substrate thickness be routed away from noise sources such as switching power supplies digital signals oscillators and transmitters The PCB track connection to the RF antenna input must not have e vias e sharp bends components overlaying the track 2 4 Antenna system design choices 2 4 1 Antenna types The role of the antenna is to filter amplify and down convert the incoming GPS signals into an electric signal that can be processed by the receiver electronics within the RF section There are several designs of GPS antennas Monopole or dipole configurations Quadrifilar helices Spiral helices Microstrips active and passive Planar rings choke ring and other multipath resistant designs There are special considerations for GPS antennas They must be able to pick up and discriminate very weak signals GPS signals are circularly polarised so the GPS antenna must also be circularly polarised The antenna gain pattern design is intended to enhance the ability of the RF section to filter multipath and low elevation signals An essential requirement of any consumer
28. n of the liquidus point approx 185 C The actual profile parameters depends upon the recommendations of the solder paste supplier and other reflow requirements of the customer s PCB Refer to Figure 4 1 for sample lead and lead free reflow profiles LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 15 Temperature C _ gt 0 Time Sec __ 300 Figure 4 1 Sample Lead and Lead free reflow profile 4 1 5 Coating The final PCB may be selectively coated with an acrylic resin air oven cured conformal coating clear lacquer or corresponding method which gives electrical insulation and sufficient resistance to corrosion 4 1 6 Post reflow washing It is recommended that a low residue solder paste is used to prevent the need for post reflow washing If a washing process is used an aqueous wash is not recommended due to the long drying time required and danger of contaminating the fine pitch internal components 4 1 7 Pre baking The modules will be delivered on a tape and reel package and sealed in an airtight bag The MSR Moisture Sensitivity Rating is 3 therefore they should be loaded and reflowed within 168 hours 7 days If the modules are in ambient humidity for longer than this a pre baking drying process will be required 4 1 8 Rework It is recommended that no more than 2 reflow
29. na Connector Top Bottom Top Layer showing RF signal track and RF ground Second layer showing RF ground plane Figure 2 3 Example PCB layout for external active antenna LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 4 2 2 3 Decoupling The schematic in Figure 2 2 illustrates a suggested method of decoupling that may be followed Table 2 2 suggests decoupling values for all signals relative to the function required This level of decoupling may not be required in a particular application in which case these capacitors could be omitted As shown in Figure 2 2 only the signal lines used in the application require decoupling All capacitors are highly recommended if the module will experience substantial electromagnetic interference EMI All low value capacitors should be as close as possible to the module pad with a short connection to the ground plane see Figure 2 4 Any data lines that have not been properly shielded are susceptible to data corruption Decoupling Capacitors FR4 _ Ground fibreglass PCB Jupiter32 module Figure 2 4 Decoupling Capacitor Placement 2 2 4 Serial RS232 data level shifter To connect the module to a PC COM port the serial data signals must be level shifted to RS232 levels This has not been shown in the reference design but many single chip RS232 level shifters are available such as MA
30. na supplied Passive antenna signal strength measurements will be on average lower than an active antenna This depends on size of patch antenna ground plane distance from RF input gain of the element and noise in the application circuit However the TTFF should be comparable in open sky conditions An active antenna is recommended if peak performance is required in very weak or obscured conditions 2 4 4 Jupiter module used as a GPS sensor The adapter board reference design shows how a Jupiter 32 GPS receiver module can be used with an external active antenna via a coax connector See Figure 2 5 The same design can be used with a passive patch antenna on the same PCB The module is placed so the connection between the antenna and the antenna input pad is as short as possible Also note the PCB should have a complete ground plane on the patch side of the board which serves as the ground plane required by the antenna See Figure 2 6 The serial data from the module must be connected to a local host processor and care should be taken so noise from these devices cannot enter the signal path or GPS antenna It is recommended that all digital devices are placed on the opposite side of the board from the antenna 2 4 5 DC supply protection for an active antenna Antenna DC supply current limit When the Jupiter 32 receiver is used with an external active antenna the DC supply in the coax cable is vulnerable to over current if a fault occurs
31. r to http www sirf com for more information about the SDK LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 21 6 0 Glossary and acronyms Axial ratio For an electromagnetic wave having elliptical polarisation the ratio of the magnitudes of the major axis and the minor axis of the ellipse described by the electric field vector EMI Electromagnetic Interference ENIG Electroless Nickel Immersion Gold FR4 substrate Flame Retardant type 4 The usual base material from which plated through hole and multi layer printed circuit boards are constructed The type 4 indicates woven glass reinforced epoxy resin GPS Global Positioning System A space based radio positioning system that provides accurate position velocity and time data LGA Land Grid Array A physical interface for microprocessors There are no pins on the chip in place of the pins are pads of bare gold plated copper that touch pins on the motherboard LNA Low Noise Amplifier A special type of amplifier used to amplify weak signals captured by an antenna MCX A type of miniature coaxial RF connector NMEA National Marine Electronics Association PCB Printed Circuit Board RF Radio Frequency SDK Software Development Kit SMA SubMiniature version A connectors are coaxial RF connectors developed in the 1960 s as a minimal connector interface for coaxial cable with a scr
32. rs the unit will revert to a warm or cold start This is caused by the stored ephemeris data becoming invalid after 4 hours 5 2 Power management The TricklePower mode of operation can be enabled to reduce the average power consumption The main power is supplied to the module continuously An internal timer wakes the processor from sleep mode The module computes a navigation position fix after which the processor reverts to sleep mode The duty cycle is controlled by a user configurable parameter If ephemeris data becomes outdated the TricklePower mode will attempt to refresh the data set within every 30 minute period or for every new satellite that comes into view With TricklePower set to a 20 duty cycle a power saving of 50 can easily be achieved with minimal degradation in navigation performance 5 2 1 Adaptive TricklePower mode In Adaptive TricklePower mode the processor automatically returns to full power when signal levels are below the level at which they can be tracked in TricklePower mode This is the default behaviour when TricklePower is active Adaptive TricklePower is always enabled on the Jupiter 32 LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 17 5 2 2 Push to Fix mode Unlike TricklePower the operation in this mode is not cyclic This mode always forces the GPS software to revert to a continuous sleep mode after a navig
33. t be restored Settings stored in battery backed memory are not over written To prevent parameters from being restored drive the defaults pin GPIO Pad A5 to a logic low Logic State Power up Action high or floating retrieves stored parameters in Flash on power up if no data in battery backup RAM low grounded ignores parameters stored in flash Table 5 3 Actions based on signal state 5 5 3 Reverting to default settings To restore the default settings including deleting all parameters stored in Flash send a factory reset command in either the NMEA or SiRF Binary protocols LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 20 5 6 Selectable User Profiles The purpose of this feature is to provide some typical application profiles which users can select through a simple NMEA message These profiles are macro like commands that modify parameters used for common applications These profiles produce optimal navigation default settings which conform specifically to an application s requirements They can be then be saved using the Write to Flash feature The new profile will not be written to Flash automatically Available Profiles include Default A general profile that balances the needs of most applications Automotive Takes into consideration higher velocities with occasional stopping Pedestrian Takes into consideration slow
34. tennas are used when the antenna input is connected to the receiver through a coaxial cable usually longer than 3m or any high loss transmission path The GPS signals experience loss in the transmission path from the antenna The loss is overcome by the antenna s LNA which amplifies the signal before it enters the transmission path The amplification is also used to enhance the signal in areas of low signal If the coaxial cable is shorter than 3m it may experience too much gain at the receiver and degrade the performance There are some variations as to how the antenna will receive its power but it is usually supplied through the coaxial cable via the antenna input as shown in Figure 2 5 Refer to Table 2 5 for the recommended active antenna characteristics 2 4 3 Passive antenna A passive antenna does not require any power because it has no amplifier This is not the best choice if signal strength is a concern however it may be sufficient if the signal path is kept to a minimum usually below 300mm An advantage to using a passive antenna is the ability to mount directly onto the application For best performance a passive patch antenna should have a metal ground plane about 80 mm in diameter placed directly under the antenna and it is advisable to shield the module and application circuits from the antenna For this reason the antenna and Jupiter 32 module should not be mounted on the same side of the PCB see Figure 2 6 Any
35. the user Refer to Application Note LA000266 All parameters are written as a set The following parameters can be stored and retrieved Port A and B protocols Port A and B baud rates and frame formats NMEA per message output rates and checksums SIRF Binary debug and raw tracker data output Datum Altitude hold mode source and default Degraded mode and timeout DR timeout DOP mode and GDOP PDOP HDOP thresholds Elevation navigation mask Power navigation mask Static navigation mode Track smoothing mode TricklePower mode on time and interval Push to Fix mode period maximum off and acquisition times DGPS source SBAS default PRN 5 5 1 Writing to Flash The module accepts NMEA messaging or SiRF Binary messaging The protocols are defined in the Navman NMEA Reference Manual MN000315 and the SiRF Binary Protocol Reference Manual These documents describe the structure of the general commands NMEA Store to Flash Memory command To store all relevant parameters to Flash send the following NMEA sentence PSRF198 CS lt cr gt lt lf gt SIRF Binary Store to Flash Memory command To store all relevant parameters to Flash send a SiRF Binary message with Message ID 198 A payload of this message should have a length of 1 byte 5 5 2 Retrieving from Flash At power up the unit will retrieve any configuration parameters stored in Flash and restore them as a set Individual parameters can no
36. tiaeediuacteastesite eadteens ar a aiaa i 5 2 3 2 Ground plane CeSIQN ccceececceeeeeeeeeeeeeeeeeeeeeeseeeeeeeeeseeeeeeeeeeeeeeeeeseeaaeeeeteeaeeees 5 2 3 3 DECOUPLING COMPOMEMS sisng TAE ues lanes 6 2 3 4 Antenna CONNECTION ccccccccccccececcececeeaeeeeeeeeeeeeseeeceeeceeeeeeceeeeeeeseseeaeaeaeaeaeaasaeeensens 6 2 3 5 Design of 50 ohm microstrip antenna CONNECTION cceeeeteeeeeeeeteeeeeeeneeeees 7 2 4 Antenna system design CHOICES cece terre treet eee eetinneeeeeeeneeeeeetineeeeessnieeeeeeeeea 8 2 41 Antenna typo Seiras aaia E EA a Ea a daavaeeites ai 8 2 42 ACUVE antenna sencriin anan aAA A lie ieaaede 9 2 4 9 Passive ANCNNA wie evstives davveesviacaceevsvesadudenvendscteeevenedeeewevesaeeddivendeleevevaecdderneseieeivis 9 2 4 4 Jupiter module used as a GPS SENSOM cccceeceeeeeeceeeeeeeeeeeeeeeeaeeeeeeeeetseeeeenees 10 2 4 5 DC supply protection for an active antenna cccceecececeeeeeeeeeeeeeeeeeesseeeeeeees 10 2 5 Jupiter adapter printed circuit DOAMC cecececeeeeeee cece cette eeeeeeeeaeceeeeeeeeeeeetetennenaeees 11 3 0 Packaging and delivery scininiisscisnsiceniacennesaionsveanocinndaieniasinanccesanianaccinndiioneunmnen 13 4 0 Manufacturing process recommendations cccceesssseeeeeeeeeeeeeeeeseeees 15 AA Solder MOthOdS visas ccccsecceses cezesceaccceteqeucaceesdeassganeescetneay ATRUS 15 411 Solder paste Ly Pe sccacsevazcncesazeznassea sans casavacavaasesteassaeabandanssatua
37. to low power mode PSRF151 a bbbb cccc CS lt cr gt lt lf gt where Fes desertion _ a Push To Fix 1 on O off TricklePower duty cycle parts per b thousand c TricklePower on time milliseconds Note that Push To Fix does not require fields b and c so they may be left blank Table 5 1 Low power modes message values This message is the NMEA equivalent of the SIRF Binary input message ID 151 System response PTTK LPSET a bbbb cccc CS The updated values returned by the system are as described in Table 3 1 5 4 2 Low power acquisition configuration The following message sets the acquisition parameters of the low power mode PSRF167 aaaaaa bbbbbb cccc d CS lt cr gt lt lf gt where Croa vesce maximum off time milliseconds maximum search time milliseconds Cc Push To Fix period seconds d adaptive TricklePower 1 on O off Table 5 2 Low power acquisition input values This message is the NMEA equivalent of the SIRF Binary input message ID 167 System response PTTK LPACQ aaaaaa bbbbbb cccc d CS The updated values returned by the system are as described in Table 3 2 LA000605D 2007 Navman New Zealand All rights reserved Proprietary information and specifications subject to change without notice 19 5 5 Save and Retrieve Configuration Data to Flash The current settings of the Jupiter 32 will be stored in Flash memory upon a command from
38. ut and numbering are shown in Figure 2 1 l A1 RF_IN RF Input 50 ohm A2 GND P RF signal ground return A3 GND P ground A4 VANT P active antenna power input A5 GPIO15 I O reserved A6 GPIO14 I O reserved A7 RF_ON O output to indicate whether the RF section is enabled active high B1 GND P RF signal ground return B3 VDD_BB P baseband power supply input for external regulator build option DO NOT CONNECT B4 GPIO4 I O reserved B5 GPIO13 I O reserved B6 VDD_RTC P RTC power supply input for external regulator build option DO NOT CONNECT B7 GPIO1 I O reserved C1 GND P ground C2 TCXO_IN l TCXO input for external TCXO build option DO NOT CONNECT C4 BOOT l active high to download flash firmware C5 LNA _EN O external antenna enable active high D2 FACTORY USE ONLY reserved D4 N_GPS_FIX O active low when 2D or 3D fix data available D5 RXA l CMOS level asynchronous input for UARTA D7 TXA O CMOS level asynchronous output for UARTA E1 GND P ground E2 GND P ground E4 GPIO2 I O reserved E5 N_RESET l master reset active low E6 RXB l CMOS level asynchronous input for UART B E7 1PPS O 1 pulse per second output 1us wide F1 PWRIN P 3 0 3 6 V main power supply input F2 VBATT P 1 9 3 6V backup battery input F3 VCC_RF P RF power supply output for external regulator option Connect as per application circuit Figure 2 2
39. y estoppel or otherwise to any intellectual property rights is granted by this document Except as provided in Navman s Terms and Conditions of Sale for such products Navman assumes no liability whatsoever THESE MATERIALS ARE PROVIDED AS IS WITHOUT WARRANTY OF ANY KIND EITHER EXPRESSED OR IMPLIED RELATING TO SALE AND OR USE OF NAVMAN PRODUCTS INCLUDING LIABILITY OR WARRANTIES RELATING TO FITNESS FOR A PARTICULAR PURPOSE CONSEQUENTIAL OR INCIDENTAL DAMAGES MERCHANTABILITY OR INFRINGEMENT OF ANY PATENT COPYRIGHT OR OTHER INTELLECTUAL PROPERTY RIGHT NAVMAN FURTHER DOES NOT WARRANT THE ACCURACY OR COMPLETENESS OF THE INFORMATION TEXT GRAPHICS OR OTHER ITEMS CONTAINED WITHIN THESE MATERIALS NAVMAN SHALL NOT BE LIABLE FOR ANY SPECIAL INDIRECT INCIDENTAL OR CONSEQUENTIAL DAMAGES INCLUDING WITHOUT LIMITATION LOST REVENUES OR LOST PROFITS WHICH MAY RESULT FROM THE USE OF THESE MATERIALS Navman products are not intended for use in medical lifesaving or life sustaining applications Navman customers using or selling Navman products for use in such applications do so at their own risk and agree to fully indemnify Navman for any damages resulting from such improper use or sale Product names or services listed in this publication are for identification purposes only and may be trademarks of third parties Third party brands and names are the property of their respective owners Additional information posted at www navman com is incorpor
40. ypical industry reliability 4 1 Solder methods The Jupiter 32 has 34 surface mount connection pads that have a base metal of copper with an Electroless Nickel Immersion Gold ENIG finish This is suitable for a lead free manufacturing process Critical factors to ensure successful circuit board assembly with LGA devices include the design of the solder paste stencil the solder paste and reflow profile used Stencil attributes that have been shown to succeed in tests are solder stencil thickness aperture diameter paste release characteristics and practices to ensure consistent solder paste volumes that exceed recommended minimums 4 1 1 Solder paste type The module will accept all commonly used solder pastes The solder paste can be lead based or lead free In all processes factors such as circuit board thickness fabrication complexity assembly process compatibility and surface finish should be taken into consideration Also due to the low standoff height of LGA devices and difficulty cleaning a no clean paste is recommended 4 1 2 Solder paste mask size Solder paste mask size should be adjusted by experimentation according to the production process requirements As a starting point a 0 75 1 paste mask pad size ratio is recommended 4 1 3 Solder paste stencils A 0 125 mm 5 mil thick stencil is recommended with LGA 4 1 4 Reflow profile recommendations An optimal reflow profile depends on solder paste properties and shou
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