Fujitsu LQFP-52P User's Manual
Contents
1. NQPACK index mark Header board index mark Figure 4 Index Position 2 Insert each screw for securing the header board into each of the four tapped holes on the header board and then tighten the screws diagonally The center screw hole is not used To tighten the screws use the special screwdriver supplied with the NQPACK to equally tighten the four screws in sequence Tightening the screws too tight might result in a defective contact Connect the MCU board to the header board while being careful not to excessively force the NQ PACK The MCU board can be connected to the header board only in the correct orientation as they have an incorrect insertion prevention header socket to prevent a reverse connection Figure 5 illustrates how the MCU board header board NQPACK and user system are connected togeth er E Disconnection MCU board MCU board ZNA Screws for securing IL we header board Header board ag Connected at shipment YQPACK _ mmm lt NQPACK oe R WNA User system 1 Figure 5 Connecting MCU Board Header Board to User System Remove the MCU board from the header board Detach the four corners slowly in sequence not excessively forcing the junction with the NQPACK Remove all of the four screws from the header board Pull ou2. FUJITSU SEMICONDUCTOR SUPPORT SYSTEM SS01 26015 1E F2MC 8FX Family LQFP 52P 0 65 mm pitch HEADER BOARD MB2146 261 OPERATION MANUAL co FUJITSU PREFACE Thank you for purchasing the LQFP 52P 0 65 mm pitch header board model number MB2146 261 for the FMC 8FX family MB2146 261 is a header board used to connect the MCU board model number MB2146 301 MB2146 303 which mounts the FFMC 8FX family evaluation MCU to a user system This manual explains the handling of the MB2146 261 Before using MB2146 261 be sure to read this manual Consult the Sales representatives or the Support representatives of Fujitsu Limited for mass pro duced MCUs and evaluation MCUs which correspond on MB2146 261 MB2146 261 is an object about MCU with a built in LCD controller The lead pitch of package FPT 52P MO1 is 0 65 mm and the body size is 10 mm x 10 mm 2 FMC is the abbreviation used for FUJITSU Flexible Microcontroller EM Caution of the products described in this document The following precautions apply to the product described in this manual The wrong use of a device will give an injury and may cause malfunction on cus AN CAUTION tomers system Cuts This product has parts with sharp points that are exposed Do not touch an edge of the product with your bare hands When connecting the header board to the user system correctly position the index Damage mark A on the NQPACK mounted on
3. a vacuum pick up tool special for removing IC Do not attempt to remove the mass production MCU forcibly for example using a screwdriver to do so can bend the pins of the mass production MCU or break the NQPACK 7 Product Specifications E General specifications Table 3 lists the general specifications of the header board Table 3 General Specifications Item Description Operating temperature and storage temperature 5 C to 35 C operation 0 C to 40 C storage Operating humidity and storage humidity 20 to 80 operation 20 to 80 storage Approximately 40 mm x 40 mm x 16 mm Dimensions Height contains that of YQPACK and NQPACK E Main part The main part of a header board is shown in Table 4 Table 4 Main Part Name Description 120 pin 0 5 mm pitch 2 piece connector straight x 2 Model number WR 120SB VF N1 from Japan Aviation Electronics Industry Limited MCU board I F connector 2 pin 2 54 mm pitch 1 piece socket Incorrect insertion prevention socket Straight Model number PCW 1 1 1PW from MAC EIGHT Socket User target system I F connector 52 pin 0 65 mm pitch Model number YQPACK052SB from Tokyo Eletech Corporation E Functional block diagram A header board performs socket conversion between the MCU board I F connector and YQPACK The header board does not contain any component such as an IC internally Figure 7 shows the block diagram MC
4. in the header board is shown in Table 7 Table 7 Pin Assignment of the User System I F YQPACK in Header Board Connector Pin Number Signal name P61 S09 PPG11 Connector Pin Number Signal name P62 S10 TO10 P63 S11 TO11 P64 S12 EC1 P65 S13 SCK RSTX P66 S14 SOT P90 V3 NC NC P67 S15 SIN P91 V2 o oo NT DY NN BY WwW N P14 PPGO P92 V1 P13 TRGO ADTG P93 V0 P12 UCKO P94 C0 N P11 U00 P95 C1 W P10 UIO PAO COM0 tos rz PO7 INT0O7 ANO7 PAL COMI u POG INT06 AN06 PA2 COM2 a POS INTO5 AN05 PA3 COM3 PO4 INT04 AN04 PBO S00 Co PO3 INT03 AN03 PB1 SO1 O P02 INT02 AN02 PB2 S02 N NC NC N POL INTOI ANO1 PB3 S03 PPG00 N N POO INT00 AN00 PB4 S04 PPG01 N W MO PB5 S05 TO00 N a X0 PB6 S06 TO01 N u XI PB7 S07 ECO N oj Vss P60 S08 PPG10 11 S01 26015 1E FUJITSU SEMICONDUCTOR e SUPPORT SYSTEM F2MC 8FX Family LQFP 52P 0 65 mm pitch HEADER BOARD MB2146 261 OPERATION MANUAL April 2006 the first edition Published FUJITSU LIMITED Electronic Devices Edited Business Promotion Dept co FUJITSU
5. the intellectual property rights or other rights of third parties which would result from the use of information contained herein e The products described in this document are designed developed and manufactured as contemplated for general use including without limitation ordinary industrial use general office use personal use and household use but are not designed developed and manufactured as contemplated 1 for use accompanying fatal risks or dangers that unless extremely high safety is secured could have a serious effect to the public and could lead directly to death personal injury severe physical damage or other loss i e nuclear reaction control in nuclear facility aircraft flight control air traffic control mass transport control medical life support system missile launch control in weapon system or 2 for use requiring extremely high reliability i e submersible repeater and artificial satellite Please note that FUJITSU will not be liable against you and or any third party for any claims or damages arising in connection with above mentioned uses of the products Any semiconductor devices have an inherent chance of failure You must protect against injury damage or loss from such failures by incorporating safety design measures into your facility and equipment such as redundancy fire pro tection and prevention of over current levels and other abnormal operating conditions If any products described in this document r
6. 052SB Used when mounting mass production MCU EITE Tokyo Eletech Corporation to NQPACK sory Table 2 Options Description Remarks BGM adapter j Model number MB2146 09 Ke Eat tor EMC SRX MCU board Built in MB95FV100B 101 A P Mode number MB2146 301 MB2146 303 MB95FV100B 103 Built m PMC SEX evaluation MCU Multiple types of evaluation MCUs are available depending on their applications Purchase the one that satisfies the service conditions 2 Checking the Delivered Product Before using the MB2146 261 confirm that the following components are included in the box e LQFP 52P 0 65 mm pitch header board e Screws for securing header board M2 x 10 mm 0 4 mm pitch e NQPACK052SB e HQPACK052SB e Operation manual English version this manual eS A e Header board manufactured by Tokyo Eletech Corporation referred to as YQPACK mounts YQPACK052SB 2 IC socket manufactured by Tokyo Eletech Coporation referred to as NQPACK is supplied with a special screwdriver and 2 guide pins A socket offering higher reliability NQPACKO052SB SL manufactured by Tokyo Eletech Corporation and sold separately can be used by making an IC socket mounting hole on the user system board For more information contact Tokyo Eletech Corporation 3 IC socket cover manufactured by Tokyo Eletech Corporation referred to as HQPACK is supplied with 4 screws for securing HQPACK M2 x 6 mm 0 4 m
7. INT1 PCLK TCLK PADDRO LVCC PACTIVE LVDIN PLOCK Cpin PWRITE Vec51 PADDRI LVDENX2 PADDR2 LVR4 PADDR3 TESTO LVDOUT PADDR4 PADDRS5 LVR2 PADDR7 BGOENX PRDATAO LVRI PADDR6 LVRO PRDATA1 Connector Pin Number Table 6 Pin Assignment of the MCU Board I F Connector CN2 Evaluation MCU Pin Number Signal name Connector Pin Number Evaluation MCU Pin Number Signal name Connector Pin Number Evaluation MCU Pin Number Signal name P34 P35 P44 P36 P31 AVcc3 P40 P32 WO COL yI A al BI WwW NV AVss AVR Ji P33 N P30 W AVR3 a rz P15 u AVcc a DAO GND ji o0 GND so P14 N P10 N P16 N N DAI N W P13 N R PWDATA7 N Nn Pil N G P12 N M NC3 N 00 PWDATA3 N so PWDATAS Ow PWDATA6 W PWDATA4 Ow N PRDATA7 W W PWDATAO w R PWDATAI W u PWDATA2 Ww oj PRDATA6 W N PRDATA3 W Co PRDATA4 W O PRDATA5 A PRDATA2 EM User system I F YQPACK U1 The pin assignment of user system I F YQPACK
8. U board I F connector User target system I F connector Socket for package Figure 7 Functional Block Diagram E MCU board I F connector CN1 CN2 and CN3 CN1 and CN2 are MCU board I F connectors CN3 is the incorrect insertion prevention socket of a MCU board The pin assignment of the MCU board I F connector CN1 is shown in Table 5 and the Connector Pin Number pin assignment of the MCU board I F connector CN2 is shown in Table 6 Table 5 Pin Assignment of the MCU Board I F Connector CN1 Evaluation MCU Pin Number Connector Pin Number Evaluation MCU Pin Number LVR3 Connector Pin Number Evaluation MCU Pin Number a R LVSS w N LVDREXT LVDBGR nn R B8 PB4 46 LVDENX 86 R4 C8 PB5 47 87 Tl D8 PB6 48 88 T2 o o A DD A7 PB7 49 89 T3 B7 PB2 50 90 T4 C7 PBO 51 91 Ul 12 D7 PB1 52 92 U2 13 MOD 14 P25A PF2 15 P26A XIA 16 A6 PB3 53 H4 B6 PA2 54 H3 C6 P95 55 H2 D6 PAO 56 H1 P27A 93 U3 94 U4 95 VI 96 v2 Vcc53 1 P24B 97 8 9 P23B 99 PINTO 7 AS PA3 57 J4 GND 18 B5 P94 58 J3 P50 GND 19 CS P90 59 J2 V3 20 D5 P91 60 J1 P51 100 v4 PSEL_EXT 22 A3 P93 62 K2 P55 102 TS PFO 24 GND 64 K4 P53 104 v5 PENABLE 25 A2 CSVENX Vss 65 L1 P70 105 R6 APBENX P
9. d Figure 2 Header Board Dimensions E MCU footprint design notes Figure 3 shows the recommended footprint dimensions of the NQPACK mounted on the printed cir cuit board for the user system Take the footprint in Figure 3 into consideration as well as the foot print of the mass production MCU when designing the printed circuit board for the user system To follow the most updated information be sure to contact Tokyo Eletech Corporation whenever de signing the printed circuit board 0 65 mm 0 4 mm E E N No 1 Pin gt E i Cc CE gt E g E Cc 8 8 CEC Figure 3 Recommended Footprint Dimensions for Mounting the NQPACK 5 Connecting to the User System E Connecting Mount the supplied NQPACK on the user system before using the MB2146 261 1 To connect the header board to the user system match pin 1 indicated by the index mark A on the NQPACK mounted on the user system with pin indicated by the index mark an angle cut linearly at one place only in silk screen on the header board and then insert it see Figure 4 The pins of YQPACK are thin and easy to bend Insert NQPACK after confirming that the pins of YQPACK are not bent OO
10. epresent goods or technologies subject to certain restrictions on export un der the Foreign Exchange and Foreign Trade Law of Japan the prior authorization by Japanese government will be required for export of those products from Japan Copyright 2006 FUJITSU LIMITED All rights reserved 1 Product Outline E Product outline MB2146 261 is a header board referred to as header board used to connect the MCU board model number MB2146 301 MB2146 303 which mounts an evaluation MCU in the FFMC 8FX family of Fujitsu 8 bit microcontrollers to a user system To build an FFMC 8FX evaluation environment combine the three products as shown in Figure 1 the header board a MCU board and a BGM adapt er model number MB2146 09 MCU board MB2146 09 BGM adapter Header board Figure 1 System Configuration E Product configuration Table 1 lists the product configuration in the header board and Table 2 lists options Table 1 Product Cofiguration Description Remarks F MC 8FX LQFP 52P 0 65 mm pitch Connector LQFP52pin header board 0 65 mm pitch Package conversion Model number MB2146 261 Model number YQPACK052SB Tokyo Eletech Corporation I F between header board and NQPACK Accessory connected Model number NQPACK052SB Tokyo Fletech Corporation For mounted on user system Accessory Model number HQPACK
11. m pitch 3 Handling Precautions The header board is precision manufactured to improve the dimensional accuracy and to ensure a reliable contact The header board is therefore sensitive to mechanical shocks To ensure a correct use of the header board in the proper environment observe the following e Avoid placing a stress on the NQPACK mounted on the user system board when connecting the header board 4 Notes on Designing E Notes on designing printed circuit board for the user system When the header board is connected to the user system some part mounted around the NQPACK in the user system may be contacting the header board if the height of the part is tall To prevent this design the printed circuit board for the user system so that the components do not exceed the height shown in Figure 2 Figure 2 shows the dimension figure of the header board 40 0 mm PCW 1 1 1PW MAC EIGHT WR 120SB VF N1 JAE WR 120SB VF N1 JAE 2 2 me YQPACKOS2SB a E Tokyo Eletech Corporation So NQPACK052SB Q BE Tokyo Eletech Corporation lt i 1 U1 User system I F connector CN3 Incorrect insertion prevention socket CN1 CN2 MCU board I F connector 1 The height differs slightly depending on how the YQPACK and NQPACK are engaged 2 Japan Aviation Electronics Industry Limite
12. t the header board vertically from the NQPACK Remove the header board slowly not excessively forcing the junction with the NQPACK 6 Mounting Mass Production MCUs E Mounting To mount a mass production MCU on the user system use the supplied HQPACK IC socket cover see Figure 6 1 To mount a mass production MCU on the user system match the index mark A on the NQ PACK mounted on the user system with the index mark on the mass production MCU 2 Confirm that the mass production MCU is correctly mounted on the NQPACK Next match the index mark of HQPACK with the index mark of NQPACK and insert it angle cut linearly at one place only The pins of HQPACK are thin and easy to bend Insert NQPACK after confirming that pins of HQPACK are not bent 3 Insert each screw for securing HQPACK in each of four tapped holes on the HQPACK and then tighten the screws diagonally To tighten the screws use the special screwdriver supplied with the NQPACK to finally tighten the four screws in sequence Tightening the screws too tight might result in a defective contact Screws for securing HQPACK a HoPACK Mass production MCU eont i NQPACK s OO User system E Disconnection Figure 6 Mounting a Mass Production MCU To remove the HQPACK remove all of the four screws and pull out the HQPACK vertically from the NQPACK When taking out the mass production MCU absorb the mass production MCU using
13. the user system with the 1 pin direction 1 g on the header board otherwise the MCU board and user system might be dam aged Damage When mounting a mass production MCU correctly position pin 1 otherwise the mass production MCU and user system might be damaged e The contents of this document are subject to change without notice Customers are advised to consult with FUJITSU sales representatives before ordering e The information such as descriptions of function and application circuit examples in this document are presented sole ly for the purpose of reference to show examples of operations and uses of FUJITSU semiconductor device FUJITSU does not warrant proper operation of the device with respect to use based on such information When you develop equipment incorporating the device based on such information you must assume any responsibility arising out of such use of the information FUJITSU assumes no liability for any damages whatsoever arising out of the use of the infor mation e Any information in this document including descriptions of function and schematic diagrams shall not be construed as license of the use or exercise of any intellectual property right such as patent right or copyright or any other right of FUJITSU or any third party or does FUJITSU warrant non infringement of any third party s intellectual property right or other right by using such information FUJITSU assumes no liability for any infringement of
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