Cooler Master TPC 800
Contents
1. TPC 800 RR T800 FLNN R1 TPC 800 is the Cooler Master Reference Cooler for optimal Performance and is a high end cooling system E with perfect performance for overclocking TPC 800 is iT HLL ALL i N Tis iets fm SIR the first ever CPU heatsink to use vertical vapor UL ALLLLI ALLL I4 ii N I WU chamber technology and combine it with heatpipe sii i ml technology the synergy of both technologies working in tandem delivers the top cooling performance The TPC 800 uses 2 separate cooling technologies to Intel LGA 2011 1366 1156 1155 775 CPU Socket transfer heat heat pipes and vertical vapor AMD FM1 AM3 AM3 AM2 AM2 chambers Dimensions 134 x 74 x 158 mm 5 3 x 2 9 x 6 2 in The first ever CPU heatsink to use vertical vapor Copper Base 2 Vapor Chambers Heat Sink Material chamber technology 6 Heatpipes Aluminum Fins 100 pure polished copper base combined with Heat Sink Weight 826g 1 83 Ib improved soldering technologies for the best Heat Pipe Dimensions 6mm thermal transfer Special fin design heatsink receives concentrated cold airflow Improved air pressure design and fan mounting system 2 years Package Information EAN Code 4719512037706 UPC Code 884102017209 Package Dimensions 182 x 118 x 192 mm 7 17 x 4 65 x 7 56 in Carton Dimensions 485 x 377 x 216 mm 19 09 x 14 84 x 8 50 in Unit Ca2. rton 8 Carton Pallet 48 2012 Cooler Master Co Ltd All Rights Reserved All trademarks are registered to their respective owners Appendix Photo taken Mar 20 2012 WW GSS Gam CE C CES 0 i lt R o L N SS Ear k TJA E7 innamen Synergy cooling Vertical vapor chamber Vapor chamber Heatpipe mm a aa a e Pure polished copper base Special fin design Note Photos may differ slightly from the final product 2012 Cooler Master Co Ltd All Rights Reserved All trademarks are registered to their respective owners
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