1. DYNATRON NEW PRODUCT SPEC SHEET Model Number K618 e Recommend for Intel Xeon Processor E3 Family Socket LGA1155 Xeon Processor 3000 Sequence Socket LGA1156 e Passive Heat Sink for 2U Server Overall Specification e Dimension 90 0 x 90 0 x 66 0mm e Weight 490g e Copper Base with Aluminum Stacked Fin plus 3 Heat Pipes e Back Strip is Included e Thermal Grease Pre Printed with GE Toshiba TIG830SP e Support CPU Power up to 95 Watts Heatsink K618 Thermal Performance VS Wind Tunnel Airflow Dynatron K618 Thermal Performance 0 35 y 0 33 4 0 31 0 29 0 27 0 25 0 23 Thermal Resistance c w 0 21 4 0 19 0 18 21 24 2 30 Wind Tunnel Airflow Rate CFM