Intel PRO/1000 GT Quad Port Server Adapter
Contents
1. A k Pb Hg Cd Cr VI PBB PBDE O SJ T 11363 2006 X SJ AT 11363 2006 pm Page 2 of 22. intel Material Declaration Data Sheet IntelI PRO 1000 GT Quad Port Server Adapter Product Weight grams 128 grams D30274 PWLA8494GT PWLA8494GTBLK PWLA8494GTG1P20 Manufacturer Intel Corporation any combination of alpha numeric characters Issue Date 2 7 2007 Pb Free Product SLI Restriction on Hazardous Substances RoHS Compliance RoHS Definition Quantity limit of 0 1 by mass 1000 PPM for Lead Pb Mercury Hexavalent Chromium Polybrominated Biphenyls PBB Polybrominated Diphenyl Ethers PBDE Quantity limit of 0 01 by mass 100 PPM for Cadmium Intel understands RoHS requires Lead and other materials banned in RoHS Directive are either 1 below all applicable substance thresholds as proposed by the EU or 2 an approved pending exemption applies Note ROHS implementing details are not fully defined and may change RoHS Declaration Select the appropriate ROHS Declaration s from below L The part does not contain RoHS restricted substances per the definition above The part does contain RoHS substances per the definition above and uses the following exemption Lead in solders to complete a viable electrical connection between semiconductor die and carrier within integrated circuit Flip Chip packages The part does contain RoHS substances per the definition above and uses the following exemption Lead in optical and filter glass O UO go The part does contain RoHS substances per the definition above and uses
3. the following exemption Lead in solders for servers storage and storage array systems network infrastructure equipment for switching signaling transmission as well as network management for telecommunications K The part does contain RoHS substances per the definition above and uses the following exemption Lead in high melting temperature type solders i e tin lead sloder alloys containing more than 85 lead K The part does contain RoHS substances per the definition above and uses the following exemption Lead in electronic ceramic parts The part does contain RoHS substances per the definition above and uses the following exemption Lead in glass of electronic components This part contains RoHS restricted materials lead above the threshold level Exemption status cannot be determined since this part may be used in exempt and or non exempt applications L Other Where the part is declared to meet ROHS requirements it has been verified to be in conformance with 2002 95 EC as we currently understand the requirements Intel has systems in place to verify conformance with all applicable environmental requirements and to the best of our knowledge the information is true and correct LEVEL A MATERIALS AND SUBSTANCES Materials from Annex A of the EIA EICTA JGPSSI Material Composition Declaration Guide and listed in the table below are not contained in this product in quantities above the threshold level for these materials a
4. owing product PWLA8494GT Individual unit test results may vary due to differences in production and or sensitivities of analytical testing methods Data shown on this MDDS reflect part level testing intended to validate Intel s ROHS compliance systems Intel s certification of ROHS compliance at the homogenous material level is based on Supplier Declarations of Conformance This data sheet is based on the product specified and other products within the family are similar Data in parts per million ppm can be used to estimate content for other products within this family Material mass can be estimated by multiplying concentration ppm by product weight The remainder of this package consists of non reportable metals e g tin iron etc epoxy resin and other non metal materials INTEL ACCEPTS NO DUTY TO UPDATE THIS MDDS OR TO NOTIFY USERS OF THIS MDDS OF UPDATES OR CHANGES TO THIS MDDS INTEL SHALL NOT BE LIABLE FOR ANY DAMAGES DIRECT OR INDIRECT CONSEQUENTIAL OR OTHERWISE SUFFERED BY USERS OR THIRD PARTIES AS A RESULT OF THE USERS RELIANCE ON INFORMATION IN THIS MDDS THAT HAS BEEN UPDATED OR CHANGED Page 1 of 2 intel Management Methods on Control of Pollution From Electronic Information Products China RoHS declaration Ate EW mC WK FA Z IRIKA BT
5. s stated in the EIA EICTA JGPSSI Material Composition Declaration Guide nor intentionally added to this product Asbestos Mercury Mercury Compounds Polychlorinated Naphthalenes Azo colorants Ozone Depleting Substances Radioactive Substances Cadmium Cadmium Compounds Polybrominated Biphenyls PBBs Shortchain Chlorinated Paraffins Hexavalent Chromium Polybrominated Diphenylethers PBDEs Tributyl Tin TBT and Triphenyl Tin TPT Hexavalent Chromium Compounds Polychlorinated Biphenyls PCBs Tributyl Tin Oxide TBTO This product contains lead lead compounds Description of Use Location in Product Material Concentration ppm Lead Lead Compounds glass in electronic components ceramic resistors capacitors 1020 first level interconnects magnetics LEVEL B MATERIALS AND SUBSTANCES Antimony Antimony Compounds Bismuth Bismuth Compounds Arsenic Arsenic Compounds Brominated Flame Retardants Beryllium Beryllium Compounds Nickel Nickel Compounds If this product contains materials listed in Annex B of the EIA EICTA JGPSSI Material Composition Declaration Guide above the threshold level of 1000 ppm those materials substances are listed below Material Substance Description of Use Material Concentration ppm Brominated Flame Flame Retardant TBBPA component packaging 31400 Retardant Printed wiring boards COMMENTS oF amp ND The data on Level A and B materials and substances are based on analytical testing of the foll
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